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Automatic Print Offset Placement Compensation 01005 Components

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Surface Mount Technology System<br />

Rubber<br />

squeegee<br />

<strong>Print</strong>er<br />

KS-1710<br />

<strong>01005</strong> <strong>Placement</strong> Experiment Conditions<br />

Screen <strong>Print</strong>er<br />

<strong>Placement</strong><br />

KE-2060R<br />

Solder Type<br />

Solder Name: M705-330F-21-10.5<br />

Alloy: SN 96.5<br />

AG 3.0<br />

Cu 0.5<br />

Particle size: 15-25mm<br />

Flux percentage: 10.5%<br />

Manufacturer: Senju Metal<br />

Industry Co., Ltd.<br />

Laser recognition<br />

Mounting machine<br />

7 zone atmospheric air specification<br />

Reflow<br />

Reflow furnace<br />

TAP30-407<br />

Mar.2006<br />

Stencil Specifications<br />

Thickness: 70µm<br />

Production Method: Laser + electro<br />

polishing<br />

Mfg.: Sonocom Co., Ltd.<br />

PWB Specifications<br />

Thickness: 1.2mm<br />

Material: glass epoxy<br />

4/16

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