S-MIZE EM High Speed Camera - AOS Technologies AG

aostechnologies

S-MIZE EM High Speed Camera - AOS Technologies AG

PRODUCT LEAFLET TECHNICAL SPECS APPLICATION NOTE

Applications

The S-MIZE EM is particularly suited for all applications where a rugged,

shockproof and light sensitive yet compact camera is essential:

• Airborne applications

• Range and ballistic tests

• On-Board MIL vehicle tests

Harsh industrial and research environments where cameras are exposed

to vibration, impacts, dust, moisture and other challenging

conditions

Why the S-MIZE EM

• Robust design – designed for many years of industrial handling

and harsh environments (milled aluminum housing with heavy

duty connectors)

• Ultra-compact, fitting into tight spaces like camera pods on

aircrafts

S-MIZE EM High Speed Camera

Imaging for smart decisions

S-MIZE EM – the ruggedized, ultra compact high speed camera

for applications in the most demanding environmental conditions. More light sensitive, more

compact than ever.


Unique features

• Simple and easy to integrate – due to its built-in PowerPC,

the S-MIZE EM can duplicate the control- and status lines of a

film camera. This plus the range of available connectors make

the integration into a given environment, i.e. by replacing an

older film-based camera, a cinch. Modifications on the aircraft

as well as on the test routine are kept to a minimum.

High Sensitivity – the S-MIZE EM offers a high light sensitivity,

allowing to use high lens apperture numbers for an extended

depth of field resp. using short shutter times to minimize

motion blur of fast moving objects.

• In compliance with MIL standards – the S-MIZE EM is designed

and built to withstand extreme ambient conditions; it

complies with the relevant MIL standards (temperatures,

shocks, vibrations, altitudes etc.)

• Autonomous operation – the built-in battery allows you to

use the camera without external power cables and powersupplies.

No risk that the camera interferes with the aircrafts

power system.


S-MIZE EM 90 with data- and I/O-connectors mounted sidewise

(90 deg. off the standard model with connectors on the back plate)

S-MIZE EM positioned inside pod

Airborne housing for S-MIZE EM

Your local AOS partner:

Specifications are subject to change without prior notice – v07.2012

AOS Technologies AG, Taefernstrasse 20,

CH-5405 Baden-Daettwil

Tel. +41 (56) 483 3488, Fax + 41 (56) 483 3489

info@aostechnologies.com

www.aostechnologies.com

Technical key specifications

Image Sensor Progressive CMOS, 1280 x 1024 pixels, mono or color

Sensor size (@ full resolution) 17.82 x 14.33 mm, 14 µm pixel size

Light sensitivity ISO 3200 (monochrome), ISO 1600 (color)

Dynamic range 5-, 8- or 10 bit, adjustable by user

Gain control User selectable, High Dynamic Range (HDR) mode

Frame rate at full resolution 500 fps @ 1280 x 1024 pixels

Typical fps/resolution settings 1280 x 1024 @ up to 500fps

900 x 700 @ up to 1’000fps

800 x 600 @ up to 1’250fps

Max. frame rate 100’000 fps

Shutter type Global electronic shutter

Shutter exposure times 4 µsec to 1/frame rate

Image memory Built-in DRAM, circular buffer

Sequence length 2 sec @ 1280 x 1024 / 500fps (1.3 GB memory)

4 sec @ 1280 x 1024 / 500fps (2.6 GB memory)

8.1 sec @ 1280 x 1024 / 500fps (5.2 GB memory)

16.2 sec @ 1280 x 1024 / 500fps (10.4 GB memory)

Data Interface Gigabit Ethernet (1’000 Mb/s)

RJ45, other connectors on request

Frame synchronisation

Multi-camera operation

Sync in, Sync out (TTL)

Yes

Memory Interface Built-in CF interface (optional),

accepting CF cards for non-volatile data storage

Power supply Voltage range (24 – 36 V DC)

Power consumption 14 W (w/o data link), 18 W (with data link)

Battery Built-in, rechargeable NiMH battery

allowing 15 minutes camera operation.

Optional ‘extended battery pack’ available

Extended battery pack (optional) 2.5 hours battery capacity

Video Interface (optional) SDI (digital) or PAL/NTSC (analog)

IRIG B Interface IRIG B time stamping (requires external IRIG-B122,

amplitude modulated signal)

Ext. temp range, storage

Ext. temp range, operation

-51…+70 ºC (-60…158 ºF)

-51…+49 ºC (-60…120 ºF)

Shock resistance 100G for 15msec, 3 axis , up to 200G during short peaks

Size, weight (standard model) 74 x 71 x 80 mm, 700 gr

92 x 71 x 67mm, 700gr (model ‘90’)

I/O Connector

1 GND (-)

2 V In (In)

3 Remote On (In)

4 Sync In (In)

5 Sync Out (Out)

6 Set-to-Rec (In)

7 Trigger (In)

8 Strobe (Out)

9 Armed (Out)

10 Triggered (Out)

11 Status 1 (In/Out)

12 GND

13 GND

14 IRIG-B (In)

CE

MIL

LEMO Type: FGG.2B.314.CLAD82Z

ODU Type: S22LOC-P14MFGO-8200

10 1

9

11

2

8 14 12 3

7

13

4

6 5

different pinout configuration and connectors on request

In compliance with relevant standards

In compliance with MIL-STD-810 and MIL-STD-461

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