May 2013 - I-Micronews

M A Y 2 0 1 3 I S S U E N ° 2 7
E D I T O R I A L
An established platform rescues most
advanced silicon technologies
Dear 3D Packaging readers,
It’s my pleasure to share with you our outlook for the fantastic, long-lasting
potential of a proven Advanced Packaging technology: flip chip.
No doubt you’re wondering why the spotlight is now being shone on this
long-established technology. There are several reasons, two of which are
value and technology. Technology equates to the customer’s perception
of a product’s advantages, be they features, performance or reliability.
Of the three, performance has always been the key decision-making
parameter for consumers, because each new device generation brings
significant speed improvements like calculation, graphical display or data
transfer time. Performance improvement is the outcome of mainstream
semiconductor technology’s node change, and it always carries large
...the opening of
interconnection between
heterogeneous
chips in the same package,
flip chip is the ideal path...
investments. Of course, return on investment is the driving force for
most IC manufacturers -- but going from a 90nm technology node to 32
and beyond requires an increased interconnect need that wire-bonding
simply cannot match. So what could be the way out?
Enter flip chip, which has resurfaced to rescue designers and solve the
technological challenge of linking the sub-20 nanometer gate length to
the millimeter world. With copper pillar pitch reduction allowing for wider
I/O connectivity, and the opening of interconnection between heterogeneous
chips in the same package, flip chip is the ideal path. Moreover,
any Advanced Packaging scheme ends with bumping opening the
door to very large adoption.
Regarding value, flip chip offers the outstanding benefit of being realized
at wafer level, thus significantly reducing manufacturing cost compared
e v e n t s
• Electronic Components and Technology
Conference (ECTC)
May 28 to 31, 2013 - Las Vegas, NV
• SEMICON Russia
June 5 to 6, 2013 - Moscow, Russia
• SEMI Networking Day: Packaging - Key
Driver for System Integration
June 27, 2013 - Porto, Portugal
to single chip wire bonding.
I’m confident that by the end of this 3D Packaging issue, you’ll have a
much better understanding of Flip chip’s technology, market and potential.
Christophe Fitamant
Sales & Marketing Director
Yole Développement
fitamant@yole.fr
• SEMICON West
July 9 to 11, 2013 - San Francisco, CA
platinum partners:
3 D P a c k a g i n g 3
For more information, please contact S. Leroy (leroy@yole.fr)