2012 RECOMMENDED - NTE Electronics

2012 2011 RECOMMENDED 

Electronics Assembly Materials

Table of Contents 

Table of Contents 

Products 

Pages 

Solder Paste 3-7 

Fluxes 8-11 

Solder Wire 12-13 

Bar Solder 14-15 

Additional Flux Materials 16 

TSF Products 17 

Other products 18 

Helpful Information 19 

2 | 800 253 7837 | WWW.kester.com

Formula NXG3 NXG33 

Coming Soon: NXG3 Zero Halogen Solder Paste 

Application No-Clean Stencil Printing No-Clean Stencil Printing 

Alloy Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 

Product 

Characteristics 

Designed to exceed customers' expectations for high yield lea 

Zero halogen, lead-free, 

Formula 

no-clean solder paste. NXG3 is engineered 

NXG3 

for manufacturing. NXG33 is engineered for the high thermal de 

the high thermal demands of assembling with lead-free alloys. Joints are of assembling with lead-free alloys. Joints are cosmetically br 

cosmetically bright Application as SnPb joints. Prints down to 01005 pad sites. SnPb joints. No-Clean Prints Stencil down Printing to 01005 pad sites. Designed to be r 

Designed to be reflowable in air as well as nitrogen. 

able in air as well as nitrogen. Post soldering, the NXG33 offe 

Alloy 

Sn96.5Ag3.0Cu0.5 

mized defects, including head-in-pillow and QFN/BGA voiding 

Product 

Residue Characteristics Light colored Characteristics 

Zero halogen, Light lead-free, colored no-clean solder paste. NXG3 

is engineered for the high thermal demands of assembling 

Typical Metal Percentage and mesh size 88.5%, -400/+500 (Type 4) 

with 88.5%, lead-free -400/+500 alloys. (Type Joints 4) are cosmetically 

as bright as SnPb joints. Prints down to 01005 pad sites. 

Compliant Specifications 

Telcordia Issue 1 GR-78-CORE 

Designed to Telcordia be reflowable Issue 1 GR-78-CORE in air as well as nitrogen. 

IPC/J-STD-004B Flux Designator ROL0 


Residue Characteristics 

Light colored 

Suggested Packaging Style 500g jar; 600 or1400g Typical cartridges Metal Percentage and mesh size 88.5%, -400/+500 500g jar; 600 (Type or1400g 4) cartridges 


Telcordia Issue 1 GR-78-COREIPC/J-STD-004B Flux 

Designator ROL0 

Suggested Packaging Style 

500g jar or 600g cartridges 

STANDARD STANDARD SOLDER SOLDER PASTE REFLOW REFLOW PROFILE PROFILE 

FOR FOR KESTER PASTE CONTAINING 

ALLOYS: Sn96.5Ag3.0Cu0.5 

ALLOY: Sn96.5Ag3.0Cu0.5 

or Sn96.5Ag3.5 

Stage 1- Preheat Zone 

(Rapid Heating Stage) 

The purpose of this zone is to quickly bring the 

Stage 1- Preheat Zone 

assembly up to a temperature where solder pas 

(Rapid Heating Stage) 

can become highly chemically active. 

The purpose of this zone is to quickly bring the 

assembly up to a temperature where solder paste 

can become highly Stage chemically 2- Soak active. Zone 

(Temperature Equalization Stage) 

Stage 2- Soak The Zone purpose of this stage is for the thermal mas 

(Temperature the Equalization assembly to reach Stage) a uniform temperature 

The purpose of plateau this stage so that is for there is thermal a very mass small differentia 

of the assembly between to reach the a hottest uniform and temperature coldest soldering locatio 

plateau so that on there assembly. is a very small differential 

between the hottest and coldest soldering locations 

on the assembly. Stage 3- Reflow Zone 

(Rapid Heating and Cooling) 

Stage 3- Reflow The purpose Zone of this stage is to rapidly heat the 

(Rapid Heating 

assembly 

and Cooling) 

above the melting (liquidus) temperat 

The purpose of this stage is to rapidly heat the assembly 

above the melting (liquidus) temperature 

of the solder and subsequently cool the assemb 

down quickly to solidify the solder. Wetting of s 

of the solder and subsequently cool the assembly 

onto teh substrate and component metalizations 

down quickly to solidify the solder. Wetting of 

solder onto the 

occurs 

substrate 

in the 

and 

reflow 

component 

zone. 

metalizations 

occurs in the reflow zone. 

WWW.Kester.com | 800 253 7837 | 3

Kester Lead-Free, Halogen-Free 

Formula 

NXG33 

Application 

Alloy 

Product 


No-Clean Stencil Printing 

Sn96.5Ag3.0Cu0.5 

Designed to exceed customers’ expectations for high yield lead-free manufacturing. NXG33 is 

engineered for the high thermal demands of assembling with lead-free alloys. Joints are cosmetically 

as bright as SnPb joints. Prints down to 01005 pad sites. Designed to be reflow-able in air 

as well as nitrogen. Post soldering, the NXG33 offers minimized defects, including head-in-pillow 

and QFN/BGA voiding. 


Light colored 

Typical Metal Percentage and mesh size 88.5%, -400/+500 (Type 4) 


Telcordia Issue 1 GR-78-COREIPC/J-STD-004B Flux Designator ROL0 


500g jar or 600g cartridges 

4 | 800 253 7837 | WWW.kester.com

Kester Lead-Free 


Formula NXG1 EnviroMark 907 

Application No-Clean Stencil Printing Formula No-Clean Stencil Printing 

Alloy Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 

Product 


Designed to exceed customers’ expectations for high yield 

lead-free manufacturing. NXG1 is engineered for the high 

thermal demands of assembling with lead-free alloys. Joints 

are cosmetically as bright as SnPb joints. Prints down to 0201 

pad sites. Designed to be reflowable in air as well as nitrogen. 

EM907 is a first generation solder paste engineered for the high 

thermal demands of assembling with lead-free alloys. Joints are 

cosmetically as bright as SnPb joints. Prints down to 0201 pad 

sites. Designed to be reflowable in air as well as nitrogen. 

Residue Characteristics Light colored Light colored 

Typical Metal Percentage 88.5%, -325/+500 (Type 3) 88.5%, -325/+500 (Type 3) 






Suggested Packaging Style 500g jar or 600g cartridges 500g jar; 600 or 750g DEK cartridges 

NXG1 

Formula EnviroMark 828 

Application 

Alloy 

Product 


Water-Soluble Stencil Printing 

Sn96.5Ag3.0Cu0.5 

Kester EM828 provides excellent printability, activity, cleanability 

and low-voiding behavior. EM828 is very robust and can tolerate a 

wide variety of printing and reflow conditions. EM828 is a “state of 

the art” water-soluble lead-free paste that combines superior activity, 

cleanability and low-voiding. 

Formula EnviroMark 828 


Cleanable in warm water 

Typical Metal Percentage 89.5%, -325/+500 (Type 3) 


IPC/J-STD-004B Flux Designator ORH1 


500g jar; 600 or 1400g cartridges 

Kester Part # Description Alloy Packaging 

7032130810 NXG1 No-Clean, Type 3, 88.5% metalsl Sn96.5Ag3.0Cu0.5 500g jar 

7032130811 NXG1 No-Clean, Type 3, 88.5% metalsl Sn96.5Ag3.0Cu0.5 600g cartridge 

7006050810 EM907 No-Clean, Type 3, 88.5% metal Sn96.5Ag3.0Cu0.5 500g jar 

7006050811 EM907 No-Clean, Type 3, 88.5% metal Sn96.5Ag3.0Cu0.5 600g cartridge 

7006050819 EM907 No-Clean, Type 3, 88.5% metal Sn96.5Ag3.0Cu0.5 750g DEK 

cartridge 

7004030824 EM828 Water-Soluble, Type 3, 89.5% metal Sn96.5Ag3.0Cu0.5 700g DEK 

Cartridge 

7004030810 EM828 Water-Soluble, Type 3, 89.5% metal Sn96.5Ag3.0Cu0.5 500g jar 

7004030811 EM828 Water-Soluble, Type 3, 89.5% metal Sn96.5Ag3.0Cu0.5 600g cartridge 

7035050910 NXG-33 Type 4, 88.5% metal Sn96.5Ag3.0Cu0.5 500g jar 

7035050911 NXG-33 Type 4, 88.5% metal Sn96.5Ag3.0Cu0.5 600g cartridge 

WWW.Kester.com | 800 253 7837 | 5

Solder Paste for Tin-lead 

No-Clean 

Solder Paste for Stencil Printing Applications 

Water-Soluble 

Formula Type Easy Profile ® 256HA Easy Profile ® 256 HydroMark 531 R562 

Alloy Sn63Pb37 Sn62Pb36Ag2 Sn63Pb37 Sn62Pb36Ag2 Sn63Pb37 Sn62Pb36Ag2 Sn63Pb37 Sn62Pb36Ag2 

Product 


Residue 

Removal 

Compliant 

Specifications 

High activity no-clean paste specifically 

engineered to provide excellent 

solderability to lead free component 

and board finishes. 

Consistent print volume regardless of 

process parameters and 0201 application 

capable. Wide reflow process window. 

Compatible with enclosed print 

head systems. 

Not normally required. 

Telcordia Issue 1 GR-78-CORE, 

IPC/J-STD-004B 

Classification ROL0 

Standard no-clean paste for a wide 

variety of reflow profiles and printing 

conditions. Industry standard formula 

that performs well in a variety of 

applications. Compatible with enclosed 

print head systems. 

Not normally required. 



Classification ROL0 

This highly-active, anti-slump paste is 

produced consistently so that every batch 

results in high yield manufacturing. 

HydroMark 531 also offers extremely 

robust printing, even with idle time up to 

1 hour and print speeds of up to 6 in/sec. 

This very active formula is effective on a 

wide variety of metallizations, including 

palladium. Compatible with enclosed print 

head systems. 

Use de-ionized or soft tap water at 

120-140° 


Classification ORM0 

Designed for maximum environmental 

robustness and minimal void production, 

R562 has a stencil life of over 8 hours 

and may be used in a wide range 

of humidities (10 - 85% RH). 

Compatible with enclosed print 

head systems. 

Use de-ionized or soft tap water at 

120-140° 



Powder Mesh Size -325/+500 (Type 3) -325/+500 (Type 3) -325/+500 (Type 3) -325/+500 (Type 3) 

Metal % 90% 90% 90% 90% 

Suggested 

Packaging Style 

500g jar, 

600 or 750g DEK cartridges 

500g jar, 600g, 1400g or 

750g DEK cartridges 

500g jar, 

600g cartridges 

Solder Paste for Syringe Dispensing Applications 

Formula Type R276 R500 

Alloy Sn63Pb37 Sn63Pb37 

Product 


Provides optimal performance in all types of dispensing applications. R276 is packaged 

void-free to ensure consistent dispensing in high speed automated processes. 

Exhibits excellent dispensing characteristics with a wide range of needle diameters. 

500g jar, 600g, 1400g or 

750g DEK cartridges 

The activator package in this formula is aggressive enough to remove tenacious oxide 

layers or solder to OSP coated boards. R500 delivers excellent wetting characteristics. 

Residue Removal Not normally required. Use de-ionized or soft tap water at 49-60°C (120-140°F). 

Compliant 



IPC/J-STD-004B Classification ROL0 



Powder Mesh Size -325/+500 (Type 3) -325/+500 (Type 3) 

Metal % 87% 86% 

Suggested 

Packaging Style 

35g and 100g syringes 

*For lead based products, Kester produces solder powder in compliance 

to J-STD-006B for alloy purity and particle size distribution. 

35g syringes 

6 | 800 253 7837 | WWW.kester.com

Solder Paste for Tin-lead 


7002020510 Easy Profile ® 256HA No-Clean, Type 3, 90% metal Sn63Pb37 500g jar 


7002020310 Easy Profile ® 256HA No-Clean, Type 3, 90% metal Sn62Pb36Ag2 500g jar 

7002020510 Easy Profile ® 256HA No-Clean, Type 3, 90% metal Sn63Pb37 500g jar 

7002020511 Easy Profile ® 256HA No-Clean, Type 3, 90% metal Sn63Pb37 600g cartridge 

7002020310 Easy Profile 

7002020311 Easy Profile ® 256HA 256HA No-Clean, Type 3, 90% metal Sn62Pb36Ag2 500g jar 

No-Clean, Type 3, 90% metal Sn62Pb36Ag2 600g cartridge 

7002020511 Easy Profile ® 256HA No-Clean, Type 3, 90% metal Sn63Pb37 600g cartridge 

70010205107002020311 Easy Profile Easy ® Profile 256 No-Clean, 256HA No-Clean, Type 3, Type 90% 3, metal 90% metal Sn62Pb36Ag2 Sn63Pb37 600g cartridge 500g jar 

70010203107002020519 Easy Profile Easy ® Profile 256 No-Clean, 256HA No-Clean, Type 3, Type 90% 3, metal 90% metal Sn62Pb36Ag2 Sn63Pb37 750g DEK cartridge 500g jar 

7001020511 Easy Profile ® 256 No-Clean, Type 3, 90% metal Sn63Pb37 600g cartridge 

7001020510 Easy Profile 

7001020311 Easy Profile ® 256 No-Clean, 256 No-Clean, Type 3, 90% metal Sn63Pb37 500g jar 

Type 3, 90% metal Sn62Pb36Ag2 600g cartridge 

7001020310 Easy Profile ® 256 No-Clean, Type 3, 90% metal Sn62Pb36Ag2 500g jar 

70100205107001020511 HydroMark Easy 531 Profile Water 256 Soluble, No-Clean, Type Type 3, 90% 3, 90% metal Sn63Pb37 600g cartridge 500g jar 

70100203107001020311 HydroMark Easy 531 Profile Water 256 Soluble, No-Clean, Type Type 3, 90% 3, 90% metal Sn62Pb36Ag2 600g cartridge 500g jar 

70100205117001020518 HydroMark Easy 531 Profile Water 256 Soluble, No-Clean, Type Type 3, 90% 3, 90% metal Sn63Pb37 750g DEK 600g cartridge cartridge 

7010020311 

7010020510 

HydroMark 531 Water Soluble, Type 3, 90% metal 

HydroMark 531 Water Soluble, Type 3, 90% metal 

Sn62Pb36Ag2 

Sn63Pb37 

600g cartridge 

500g jar 

70210205107010020310 R562 HydroMark Water Soluble, 531 Water Type Soluble, 3, 90% Type metal 3, 90% metal Sn62Pb36Ag2 Sn63Pb37 500g jar500g jar 

70210203107010020511 R562 HydroMark Water Soluble, 531 Water Type Soluble, 3, 90% Type metal 3, 90% metal Sn62Pb36Ag2 Sn63Pb37 600g cartridge 500g jar 

70210205117010020311 R562 HydroMark Water Soluble, 531 Water Type Soluble, 3, 90% Type metal 3, 90% metal Sn62Pb36Ag2 Sn63Pb37 600g cartridge 600g cartridge 

7021020311 R562 Water Soluble, Type 3, 90% metal Sn62Pb36Ag2 600g cartridge 

7021020510 R562 Water Soluble, Type 3, 90% metal Sn63Pb37 500g jar 

70160705207021020310 R276 No-Clean, R562 Water Type Soluble, 3, 87% Type 3, metal 90% metal Sn62Pb36Ag2 Sn63Pb37 500g jar 35g syringe 

70160705047021020511 R276 No-Clean, R562 Water Type Soluble, 3, 87% Type 3, metal 90% metal Sn63Pb37 600g cartridge 100g syringe 

70170805207021020311 R500 Water R562 Soluble, Water Soluble, Type 3, Type 86% 3, 90% metal metal Sn62Pb36Ag2 Sn63Pb37 600g cartridge 35g syringe 

70170805047021020519 R500 Water R562 Soluble, Water Soluble, Type 3, Type 86% 3, 90% metal metal Sn63Pb37 750g DEK cartridge 100g syringe 

7016070520 R276 No-Clean, Type 3, 87% metal Sn63Pb37 35g syringe 

7016070504 R276 No-Clean, Type 3, 87% metal Sn63Pb37 100g syringe 

7017080520 R500 Water Soluble, Type 3, 86% metal Sn63Pb37 35g syringe 

WWW.Kester.com | 800 253 7837 | 7

Fluxes for Lead-Free 

Lead-free wave and selective soldering systems require exposing the flux to slightly higher soldering 

temperatures. Lead-free alloys traditionally wet metal surfaces more slowly than tin-lead. 

Kester liquid fluxes for lead-free assembly have new activator packages to enable rapid 

wetting and hole-filling, ensuring reliable product output. 

*Formula 985M 959T 2220-VF VOC-Free 2235 

No-Clean No-Clean Water-Soluble Water-Soluble 

Application Spray or Wave Fluxer Spray or Foam Spray, Wave or Foam Spray or Foam 

Halide Content % Halide - Free Halide - Free 1.6 1.6 

Specific Gravity 0.805 0.794 1.060 0.856 

Solids % 3.6 2.9 7 11 

Compliant 


Flux Designator ROL0 


Flux Designator ORL0 


Flux Designator ORH1 


Flux Designator ORH1 

Kester Part # Description Packaging 

63-0004-0985 985M No-Clean 1 gallon 


65-0004-0985 985M No-Clean 53 gallon drum 

63-0020-0959 959T No-Clean 1 gallon 


65-0020-0959 959T No-Clean 53 gallon drum 

63-0056-2220 2220-VF VOC-Free Water-Soluble 1 gallon 

64-0056-2220 2220-VF VOC-Free Water-Soluble 5 gallon 

65-0056-2220 2220-VF VOC-Free Water-Soluble 53 gallon drum 

63-0000-2235 2235 Water-Soluble 1 gallon 


65-0000-2235 2235 Water-Soluble 53 gallon drum 

*These products are designed specifically for high performance lead-free applications. 

8 | 800 253 7837 | WWW.kester.com

No-Clean Fluxes 

Alcohol Based 

No-Clean Fluxes 

VOC-Free 

Formula 985M 959T 951 979 977 

Flux Type 

Low Solids 

No-Clean 

Low Solids 

No-Clean 

Rosin-Free 

Low Solids, No Clean 

VOC-Free 

No-Clean 

VOC-Free 

No-Clean 

Percent Solids 3.6 2.9 2.0 4.2 3.25 

VOCs (g/liter) 776 770 792 0 0 

Specific Gravity 0.805 0.794 0.814 1.015 1.012 

Product 


Compliant 


Residue 

Removal 

(not normally 

required) 

Designed for the wave 

soldering applications 

and gives excellent 

hole fill on thick board 

assemblies. 

Telcordia Issue 1 

GR-78-CORE & 

IPC/J-STD-004B Flux 

designator ROL0 

Wash with Kester’s 

#5768 Bio-Kleen ® 

saponifier at 2% 

concentration. 

Designed for the 

wave soldering of 

conventional and SMT 

board assemblies. 

Developed to minimize 

the formation of microsolderballs. 


GR-78-CORE & 


designator ORL0 





Very low solids, 

rosin free, foam 

and spray application 

flux. Practically 

no residue after the 

soldering process. 


GR-78-CORE & 


designator ORL0 





Developed to reduce bottomside 

micro-solder balling and bridging 

on glossy laminates and between 

connector pins. Designed as a spray 

flux, 979’s activation system provides 

excellent wetting producing 

complete and consistent hole-fill. 


GR-78-CORE & 


Flux designator ORL0 

Wash with hot de-ionized water 

at 49-60°C (140-160°F) or use 

1% solution of Kester’s #5768 

Bio-Kleen ® 

Developed to reduce bottomside 

micro-solder balling and bridging. 

The wetting system is designed to allow 

for a larger process window and 

can survive the longer dwell times 

in extremely turbulent chip waves. 

Designed for spray applications. 


GR-78-CORE & 


Flux designator ORL0 

Wash with hot de-ionized water 

at 49-60°C (140-160°F) or use 

1% solution of Kester’s #5768 

Bio-Kleen ® 

Thinner 4662 4662 110 De-ionized Water De-ionized Water 

Flux Test Kit PS-20 PS-22 PS-22 PS-20 PS-20 


63-0000-0951 951 No-Clean 1 gallon 

64-0000-0951 951 No-Clean 5 gallon 

65-0000-0951 951 No-Clean 53 gallon drum 



65-0020-0959 985M No-Clean 53 gallon drum 



65-0020-0959 959T No-Clean 53 gallon drum 

63-0000-0977 977 VOC - Free No Clean 1 gallon 


65-0000-0977 977 VOC - Free No Clean 53 gallon drum 



65-0000-0979 979 VOC - Free No Clean 53 gallon drum 

WWW.Kester.com | 800 253 7837 | 9

Water-Soluble Fluxes 

Water-Soluble Fluxes 

Formula 2331-ZX 2235 2120 

Flux Type Neutral pH Organic Water-Soluble Organic Water-Soluble Organic Water-Soluble 

Percent Solids 33 11 24 

VOCs (g/liter) 729 763 670 

Specific Gravity 0.899 ± 0.005 0.856 ± 0.005 0.862 ± 0.005 

Percent Halides 2.2 1.5 Halide-Free 

Product 


Compliant 


Residue Removal 

Original pH neutral organic flux 

for automated wave and drag 

soldering processes. 

IPC/J-STD-004 

Flux designator ORH1 

Residue removal is required. Use soft 

or de-ionized water at temperatures of 

49-66°C (120-150°F). 

Highly active flux for surface mount 

assemblies designed to help reduce 

skips on bottom side surface 

mount pads. 

IPC/J-STD-004 


Residue removal is required. Use soft 

or de-ionized water at temperatures of 

49-66°C (120-150°F). 

Highly active, organic flux designed for automated 

wave soldering applications. This halide-free formula 

produces bright, shiny joints and high ionic cleanliness 

after water cleaning 

IPC/J-STD-004 


Residue removal is required. Use soft or 

de-ionized water at temperatures of 49-66°C (120- 

150°F). 

Thinner 4662 4662 4662 


63-0097-2331 2331-ZX Water-Soluble 1 gallon 

64-0097-2331 2331-ZX Water-Soluble 5 gallon 

65-0097-2331 2331-ZX Water-Soluble 53 gallon drum 






10 | 800 253 7837 | WWW.kester.com

Rosin Fluxes 

Rosin Based Fluxes 

Formula 186 1544 

Flux Type 

Rosin Mildly Activated 

(RMA) 

Activated Rosin 

(RA) 

Percent Solids 36 50 

Specific Gravity 0.879 ± 0.005 0.929 ± 0.005 

Rosin Based Fluxes 

Formula 186 

Percent Halides 0.02 

1544 

0.44 

Flux Type Rosin Mildly Activated (RMA) Activated Rosin (RA) 

Percent Solids Product 36 Designed for high thermal stability and 50Kester's active, Non-corrosive rosin type 


superior solderability. 

flux. Used on surfaces that are more 

Specific Gravity 0.879 ± 0.005 0.928 ± 0.005 difficult to solder. 

Percent Halides 0.02 0.44 

Compliant 

IPC/J-STD-004 

IPC/J-STD-004 

Product Designed Specifications for high thermal stability Flux and designator Kester’s ROL0 active, Non-corrosive Flux rosin designator type ROM1 


superior solderability. 

flux. Used on surfaces that are more 

Residue is non-corrosive, but may be 

difficult Residue to solder. is non-corrosive, but may be removed 

removed with solvent or with Kester’s 

Compliant 

with solvent or with Kester’s 5768 Bio-Kleen 

Residue Removal IPC/J-STD-004 

® 

5768 Bio-Kleen ® saponifier at 7-10% IPC/J-STD-004 


Flux designator 

saponifier at 7-10% solution in de-ionized or 

solution ROL0 in de-ionized or soft water Flux at designator ROM1 

soft water at temperatures of 49-60°C 

Residue is non-corrosive, but temperatures may be of 49-60°C Residue (120- is non-corrosive, but may (120-140°)F. be 

removed with solvent or with Kester’s 5768 removed with solvent or with Kester’s 5768 

Residue Removal 

Thinner Bio-Kleen ® saponifier at 120 Bio-Kleen ® saponifier at 104 

7-10% solution in de-ionized or 

7-10% solution in de-ionized or 

soft water at temperatures of 

soft water at temperatures of 

49-60°C (120-140°F). 

49-60°C (120-140°F). 

Thinner 120 104 


Kester Part # Description Packa 

63-0000-0186 186 RMA 1 gal 

64-0000-0186 186 RMA 5 gal 

65-0000-0186 186 RMA 53 gallon 

63-0000-0186 186 RMA 1 gallon 

64-0000-0186 186 RMA 63-0000-1544 5 gallon 1544 RA 1 gal 

65-0000-0186 186 RMA 64-0000-1544 53 gallon drum 1544 RA 5 gal 

65-0000-1544 1544 RA 53 gallon 

63-0000-1544 1544 RA 1 gallon 

64-0000-1544 1544 RA 5 gallon 

65-0000-1544 1544 RA 53 gallon drum 

Kester Flux-Pen 

Kester Flux-Pen ® 

® 

The Kester Flux-Pen ® is 

The 

a unique 

Kester Flux-Pen 

tool for ® rework 

is a unique 

and touch-up 

tool for rework 

soldering. 

and 

It 

touch-up 

allows controlled 

soldering. It allows 

controlled application of flux, eliminating the mess from flux bottles. Flux-Pens 

application of flux, eliminating the mess from flux bottles. Flux-Pens are ideally suited for 

are ideally suited for typical hand-soldering applications. The five available 

typical hand-soldering applications. The five available formulas are listed below. 

formulas are listed below. 

Kester Part # 

Description 

83-1004-0985 Kester Part # 985M Low Solids No-Clean (20 Description pens/carton) 

83-1000-0951 83-1004-0985951 Low 985M Solids Low No-Clean Solids No-Clean (20 pens/carton) (20 pens/carton) 

83-1018-0186 83-1000-0951 186-18951 RMA Low No-Clean Solids No-Clean (20 pens/carton) (20 pens/carton) 

83-1018-0186 186-18 RMA No-Clean (20 pens/carton) 

83-1000-0186 186 RMA No-Clean (20 pens/carton) 

83-1000-0186 186 RMA No-Clean (20 pens/carton) 

83-1097-2331 2331-ZX Neutral pH Water-Soluble (20 pens/carton) 

83-1097-2331 2331-ZX Neutral pH Water-Soluble (20pens/carton) 

83-1020-0959 959T Low Solids No-Clean (20 pens/carton) 

53-0000-0225 Flux-Pen ® Replacement Tips (25 tips/bag) 

83-1046-0952 952 D6 Low Solids No-Clean (20 pens/carton) 

WWW.Kester.com | 800 253 7837 | 11



TD-004 

L0 

Solder Wires for Lead-Free Assembly 

Formula 275 48 331 

No-Clean Activated Rosin Water-Soluble 

Halide Percentage

"245" No-Clean 

"245" is a halide-free; rosin based no-clean core flux that 

provides excellent wetting combined with optimal reliability 

and 

Solder 

cosmetics. "245" 

Wire 

is compliant to Bellcore GR-78-CORE 

and is classified as ROL0 per J-STD-004B. 

“245” No-Clean 

“245” No-Clean Core 1 lb. 

“245” Part is a # halide-free; Alloy rosin based Diameter no-clean core Core flux Size that 

provides 24-6337-8806 excellent wetting Sn63Pb37 combined .015 with optimal reliability 50 

and 24-6337-8807 cosmetics. “245” Sn63Pb37 is compliant to .020 Bellcore 50 

GR-78-CORE 24-6337-8834 and is classified Sn63Pb37 as ROL0 .020 per J-STD-004B. 58 

24-6337-8809 Sn63Pb37 .025 50 


24-6337-8800 Sn63Pb37 .031 50 

24-6337-8801 Part # Sn63Pb37 Alloy .031 Diameter Core 58 Size 

24-6337-8802 24-6337-8806Sn63Pb37 Sn63Pb37 .031.015 6650 

24-6337-8813 Sn63Pb37 .040 50 

24-6337-8807 Sn63Pb37 .020 50 

24-6337-8814 Sn63Pb37 .050 50 

24-6337-8834 Sn63Pb37 .020 58 

24-6337-8817 Sn63Pb37 .062 50 

24-6337-8809 Sn63Pb37 .025 50 

24-6337-8800 Sn63Pb37 .031 50 

24-6337-8801 Sn63Pb37 .031 58 

"331" 

24-6337-8802 

Water Soluble 

Sn63Pb37 .031 66 

"331" is a high-activity water-soluble core flux for soldering 

difficult 

24-6337-8813 

metals. "331" is 

Sn63Pb37 

designed for optimal 

.040 

cleanability, 

50 

along 24-6337-8814 with minimal smoke Sn63Pb37 and odor. The .050 residues from 50 

"331" 24-6337-8817 must be removed. Sn63Pb37 "331" is classified .062 as ORH150 

per J-STD-004B. 

“331” Water 

“331” 

Soluble 

Water-Soluble Core 1 lb. 

“331” is a high-activity water-soluble coreflux for 

Part # Alloy Diameter Core Size 

soldering difficult metals. “331” is designed for optimal 

24-6337-6422 Sn63Pb37 .015 66 

cleanability,along with minimal smoke and odor. 

24-6337-6401 Sn63Pb37 .020 66 

The residues from”331” must be removed. “331” is 

24-6337-6417 Sn63Pb37 .025 66 

classified as ORH1per J-STD-004B. 

24-6337-6403 Sn63Pb37 .031 66 

24-6337-6411 “331” Water-Soluble Sn63Pb37 .062 Core 1 lb. 66 


24-6337-6422 Sn63Pb37 .015 66 

"285" 24-6337-6401 RMA Sn63Pb37 .020 66 

"285" 24-6337-6417 is an RMA based Sn63Pb37 core flux that provides .025 wetting 66 

action 24-6337-6403 comparable to that Sn63Pb37 of typical RA .031 fluxes. Although 66 

"285" is an RMA-based material, the residues are noncorrosive 

24-6337-6411 

if not cleaned. 

Sn63Pb37 

"285" is categorized 

.062 

as ROL0 

66 

per J-STD-004B. 

“285” RMA 

“285” is an RMA based “285” core RMA flux Core that 1 provides lb. wetting action 

comparable Part # to that Alloy of typical RA Diameter fluxes. Although”285” 

Core Size 

is an RMA-based material, the residues are non-corrosive if 

24-6337-9703 Sn63Pb37 .015 66 

not cleaned. “285” is categorized as ROL0 per J-STD-004B. 

24-6337-9702 Sn63Pb37 .020 66 

“285” RMA Core 1 lb. 

24-6337-9718 Sn63Pb37 .025 66 

24-6337-9710 Sn63Pb37 .031 66 


24-6337-9713 Sn63Pb37 .031 58 

24-6337-9703 Sn63Pb37 .015 66 

24-6337-9702 Sn63Pb37 .020 66 

24-6337-9718 Sn63Pb37 .025 66 

24-6337-9710 Sn63Pb37 .031 66 

24-6337-9713 Sn63Pb37 .031 58 

"275" No-Clean 

"275" provides superior wetting performance leaving an 

extremely clear post-soldering residue. "275" is designed 

to be a low splattering core flux. "275" is classified as 

ROL0 per J-STD-004B. 



24-6337-7604 Sn63Pb37 .015 50 

24-6337-7602 Sn63Pb37 .020 50 

24-6337-7616 Sn63Pb37 .025 50 

24-6337-7600 Sn63Pb37 .031 50 

24-6337-7612 Sn63Pb37 .050 50 

24-6337-7614 Sn63Pb37 .062 50 

“275” No-Clean 

“275” provides superior 

Kester “44” ® wetting performance leaving an 

extremely clear post-soldering residue. “275” is designed 

Rosin “44” ® is a high activity RA core flux designed for 

to be a low splattering core flux. “275” is classified as 

excellent instant wetting action, even on Nickel surfaces. 

ROL0 per J-STD-004B. 

Although “44” ® is a RA-based material, the residues are 

non-corrosive “275” if not cleaned. No-Clean Per Core J-STD-004B, 1 lb. “44” ® is 

classified as ROM1 flux. 


“44” ® RA Core 1 lb. 

24-6337-7604 Sn63Pb37 .015 50 


24-6337-7602 Sn63Pb37 .020 50 

24-6337-0007 Sn63Pb37 .015 66 

24-6337-7616 24-6337-0010 Sn63Pb37 Sn63Pb37 .020 .025 66 50 

24-6337-7600 24-6337-0018 Sn63Pb37 .025 .031 66 50 

24-6337-0027 Sn63Pb37 .031 66 

24-6337-7612 Sn63Pb37 .050 50 

24-6337-0039 Sn63Pb37 .040 66 

24-6337-7614 24-6337-0053 Sn63Pb37 Sn63Pb37 .050 .062 66 50 

24-6337-0061 Sn63Pb37 .062 66 

Kester 24-6040-0010 “44” ® Sn60Pb40 .020 66 

Rosin 24-6040-0018 “44” ® is a high Sn60Pb40 activity RA core .025 flux designed 66 for 

excellent 24-6040-0027 instant wetting Sn60Pb40 action, even .031 on Nickel surfaces. 66 

Although 24-6040-0039 “44” ® is a RA-based Sn60Pb40 material, .040the residues 66 are 

Kester Solid Wire 

non-corrosive if not cleaned. Per J-STD-004B, “44” ® 

24-6040-0053 Sn60Pb40 .050 66 

Kester’s solid wire solder, without flux core, is classified as ROM1 flux. 

24-6040-0061 Sn60Pb40 .062 66 

is manufactured to strict quality control standards. 

Conforming to IPC/J-STD-006B 

“44” ® RA Core 1 lb. 

24-6040-0066 Sn60Pb40 .093 66 


Kester 

Solid 

Solid 

Wire 

Wire 

1 lb. 

Solid Wire 1 lb. 

24-6337-0007 Sn63Pb37 .015 66 

Kester's Part # solid wire solder, Alloy without Diameter flux core, is manufactured 

using virgin Sn63Pb37 metals and strict .015 quality control stan- 

24-6337-0010 Sn63Pb37 Part # .020 Alloy Diameter 66 

14-6337-0015 

14-6337-0015 Sn63Pb37 .015 

dards. Conforming to IPC/J-STD-006B 24-6337-0018 Sn63Pb37 .025 66 

14-6337-0031 Sn63Pb37 .031 

24-6337-0027 14-6337-0031 Sn63Pb37 Sn63Pb37 .031 66 .031 

14-6337-0062 Sn63Pb37 .062 

Solid Wire 5 lbs. 

24-6337-0039 14-6337-0062 Sn63Pb37 Sn63Pb37 .040 66 .062 

14-6337-0125 Part # Sn63Pb37 Alloy .125 Diameter 

14-6337-0125 Sn63Pb37 .125 

16-6337-0062 Sn63Pb37 24-6337-0053 .062 

Sn63Pb37 .050 66 

14-6040-0062 Sn60Pb40 .062 

16-6337-0125 Sn63Pb37 24-6337-0061 .125 

14-6040-0062 Sn63Pb37 Sn60Pb40 .062 66 .062 

14-6040-0125 Sn60Pb40 .125 

16-6040-0062 Sn60Pb40 24-6040-0010 .062 

14-6040-0125 Sn60Pb40 Sn60Pb40 .020 66 .125 

16-6040-0125 Sn60Pb40 .125 

Solid Wire 5 lbs. 

24-6040-0018 Sn60Pb40 .025 66 

Part # Alloy Diameter 24-6040-0027 Sn60Pb40 .031 66 

16-6337-0062 Sn63Pb37 .062 24-6040-0039 Sn60Pb40 .040 66 

16-6337-0125 Sn63Pb37 .125 24-6040-0053 Sn60Pb40 .050 66 

16-6040-0062 Sn60Pb40 .062 24-6040-0061 Sn60Pb40 .062 66 

16-6040-0125 Sn60Pb40 .125 24-6040-0066 Sn60Pb40 .093 66 

WWW.Kester.com | 800 253 7837 | 13

. 

Ultrapure ® K100LD Lead-Free Solder Bar 

K100LD is a new patent-pending low-cost lead-free solder alloy for use in 

wave soldering, selective soldering, and tip tinning operations. K100LD has 

the Lowest Copper Dissolution amongst all common solder alloys, including 

Ultrapure SN63, SAC305, ® K100LD and other lead-free Lead-Free options. Kester Solder K100LD Barprovides the 

K100LD lowest is cost a new for patent-pending wave soldering low-cost operations. lead-free It also solder provides alloy for solder use in joints wave with soldering, 

selective no shrinkage soldering, effects, and tip excellent tinning operations. through-hole K100LD penetration has the Lowest and topside Copper fillet, Dissolution 

amongst and provides all common a low solder dross alloys, rate. including SN63, SAC305, and other lead-free options. 

Kester K100LD provides the lowest cost for wave soldering operations. It also provides 

solder joints with no shrinkage effects, excellent through-hole penetration and topside 

fillet, and provides a low dross rate. 

14 | 800 253 7837 | WWW.kester.com 

Kester Part # Alloy Each Bar Sold As 

Kester Part # 

04-9574-0050 

Alloy 

K100LD 

Each Bar 

1 2/3 lbs. 

Sold As 

25 lbs. 

04-7068-0000 04-9574-0050 Sn96.5Ag3.0Cu0.5 K100LD 1 2/3 1 2/3 lbs. lbs. 25 25 lbs. lbs. 

04-7068-0000 Sn96.5Ag3.0Cu0.5 1 2/3 lbs. 25 lbs. 

Common Lead-Free Alloys 

*Alloys Melt Temperature Application 

K100LD ~227°C/441°F Common Lead-Free Alloys Wave/Hand Soldering 

*Alloys 

Sn96.5Ag3.0Cu0.5 

Melt Temperature 

217°C/423°F 

Application 

SMT/Hand/Wave 

K100LD 

Sn96.5Ag3.5 

~227°C/441°F 

221°C/430°F 

Wave/Hand Soldering 

SMT/Hand Soldering 

Sn96.5Ag3.0Cu0.5 217°C/423°F SMT/Hand/Wave 

* These are the most common lead-free alloys used in the industry. Kester can also produce a multitude of lead-free alloys as 

specified by individual Sn96.5Ag3.5 requirements. 221°C/430°F SMT/Hand Soldering 

* These are the most common lead-free alloys used in the industry. Kester can also produce a multitude of 

lead-free alloys as specified by individual requirements.

Bar Solder 

Kester ULTRAPURE ® 

Manufactured by a special process that controls the inclusions of oxides and metallic 

and non-metallic impurities, Kester Ultrapure ® is the industry standard bar solder for 

use in high tech electronic applications where lower surface tension and hole filling 

ability are essential. The purity of Kester Ultrapure ® meets the requirements of 

IPC/J-STD-006B. 


04-6337-0050 Sn63Pb37 1 2/3 lbs. 25 lbs. 

04-6040-0050 Sn60Pb40 1 2/3 lbs. 25 lbs. 

Kester Solder Analysis Program 

Kester’s Solder Analysis Program is a prepaid method for rapid response 

solder sample analysis. It allows customers to document solder pot impurities 

for conformance to Federal Specifications or ISO quality requirements. 

Option C: This option includes monitoring tin, antimony, copper, gold, 

lead,cadmium, aluminum, zinc, iron, arsenic, bismuth, silver, and nickel. 

Kester Part # 

Description 

53-0000-0041 Option C 

Kester Ultra Low Dross 

This bar solder is manufactured using the Ultrapure ® process and containing the same 

metal purity as Kester Ultrapure ® . Kester Ultra Low Dross is formulated with a special 

low dross additive that dramatically decreases dross formation on the solder pot. 


04-6337-0030 Sn63Pb37 1 2/3 lbs. 25 lbs. 

Kester Flo-Bar 

Flo-Bar is an extruded 8.5 or 10 lb. bar manufactured specifically for situations 

where a larger size is more conveniently managed on certain automatic solder feeding 

systems. Flo-Bar is available in Ultrapure ® and Ultra Low Dross grade solder. 


07-6337-0050 Ultrapure ® Sn63Pb37 10 lbs. 50 lbs. 

07-6337-1930 Ultra Low Dross Sn63Pb37 8.5 lbs. 42.5 lbs. 

07-6337-0030 Ultra Low Dross Sn63Pb37 10 lbs. 50 lbs. 

#5744 Solder Saver ® 

A chloride-free, inorganic white powder formulated to remove dross, 

which is the oxide of solder, from still solder pots and wave soldering 

machines. It does not decompose to sticky residues that are harder to 

remove than the original dross. The product is low fuming and is stable 

at molten solder temperatures. 

Kester Part # 

Description 

56-0005-5744 5744 Solder Saver 5 lb. 

56-0025-5744 5744 Solder Saver 25 lb. 

WWW.Kester.com | 800 253 7837 | 15

Additional Flux Materials 

Kester Rework Fluxes 

Kester’s two rework formulas are specifically formulated for PCB rework 

operations. Kester’s No-Clean RF-741 and Water Soluble RF-771 rework 

fluxes are all that’s needed to handle any surface mount or through-hole 

rework applications. Available only in 30 gram syringe packaging. 


7025010003 RF-741 No-Clean 30g syringe 

7026010003 RF-771 Water-Soluble 30g syringe 

Kester Flux Thinners 

Selecting the correct thinner for reducing solids or replacing evaporated 

solvent will result in maximum efficiency of the flux. To select at 

thinner,find the flux you are using from the chart below: 

Thinner Use with Soldering Flux 

104 1544 Activated Rosin Flux 

110 951 No-Clean Flux 

120 186 Series Rosin Mildly Activated Flux 

4662 

2331-ZX Organic Water-Soluble Flux 

2235 Organic Water-Soluble Flux 

2120 Organic Water-Soluble Flux 

959 No-Clean Flux 



63-0000-0104 104 Flux Thinner 1 gallon 

65-0000-0104 104 Flux Thinner 53 gallon drum 










Kester Flux Test Kits 

Control of the flux concentration in the flux becomes more critical when 

using a low solids flux. The accuracy problems encountered with automatic 

specific gravity controllers in conjunction with low-solids “no-clean” 

fluxes make the flux kit a better alternative for process control. Good 

control is necessary to assure a consistent amount of flux is applied to 

the circuit boards, consistent soldering results are obtained, and the least 

amount of flux residue remains after soldering. Kester PS-20 and PS-22 

flux kits provide a simple method for process control. 

Flux Test Kit 

PS-20 

PS-22 

Use with Soldering Flux 


985M No-Clean Flux 


979 VOC-Free No-Clean Flux 

977 VOC-Free No-Clean Flux 


959T No-Clean Flux 

Kester Part # 

Description 

53-0000-0200 PS-20 Flux Test Kit 

53-0000-0220 PS-22 Flux Test Kit 

16 | 800 253 7837 | WWW.kester.com

Tacky Soldering Fluxes 



Page 17 

Kester Tacky Soldering Fluxes 



Kester's TSFs are the industry standard for attachment of spheres to BGA and µ 

tions to solder flip chip components to PWB substrates. Kester's TSF portfolio i 

Kester’s TSFs are the industry standard for attachment of spheres to BGA and µBGA packages. The TSFs are also used in electronics assembly 

Kester's TSFs are the industry standard for attachment of spheres to BGA and µBGA packages. of The being TSFs screen are also and used stencil in electronics printed, dot assembly dispensed, operations 

or thin film transfer process 

operations to solder flip chip components to PWB substrates. Kester’s TSF portfolio includes a complete line of no clean and water-soluble products 

capable of being screen 

to solder 

and stencil 

flip chip 

printed, 

components 

dot dispensed, 

to PWB substrates. 

or thin film 

Kester's 

transfer 

TSF 

processed. 

portfolio includes a complete line of no clean and water-soluble products capable 

of being screen and stencil printed, dot dispensed, or thin film transfer processed. 

TSF-6592LV Lead-Free No-Clean 


(For Screen Printing/Stencil Printing/Pin Transfer) 

TSF-6592LV (For is Screen compatible Printing/Stencil with lead and lead-free Printing/Pin solder alloys Transfer) such as SnAg,SnCu, 

SnAgCu, TSF-6592LV SnAgBi, and is can compatible be reflowed with in lead nitrogen and lead-free or air with solder peak alloys temperatures such as SnAg, up 

to 270ºC. SnCu, The residues SnAgCu, are SnAgBi, clear, and non-conductive, can be reflowed and in non-corrosive. nitrogen or air with peak 

temperatures up to 270ºC. The residues are clear, non-conductive, and 

non-corrosive. 


300303 TSF-6592LV No-Clean 30g syringe 


300304 TSF-6592LV No-Clean 100g jar 


300305 TSF-6592LV No-Clean 150g cartridge 

300304 TSF-6592LV No-Clean 100g jar 

300305 TSF-6592LV No-Clean 150g cartridge 

TSF-6502 No-Clean 

TSF-6502 (Lower No-Clean Viscosity for Screen 

(Lower Printing/Thin Viscosity for Screen Film Deposition) 

Printing/Thin TSF-6502 Film is a no-clean Deposition) tacky soldering flux formula designed for 

TSF-6502 BGA/CSP/PGA is a no-clean tacky screen soldering printing, flux sphere/pin formula processing designed for BGA/CSP/PGA 

for repair and 

screen printing, reballing/repinning. sphere/pin processing It possesses or for a high repair activity and reballing/repinning. level, allowing it to solder It 

possesses nickel a high surfaces. activity level, The robust allowing wetting it to solder action nickel of the surfaces. TSF-6502 The will robust allow OSP wetting 

action of treated the TSF-6502 copper, will as allow well as OSP heavily treated oxidized copper, copper, as well surfaces as heavily to exhibit oxidized good 

copper, surfaces soldering to properties, exhibit good even soldering after 2 properties, or 3 thermal even cycles. after 2 TSF-6502 or 3 thermal is designed cycles. 

TSF-6502 for is designed a wide range for a of wide temperature range of temperature and humid conditions. and humidity conditions. 


300103 TSF-6502 No-Clean 30g syringe 

30010300104 TSF-6502 TSF-6502 No-Clean No-Clean 30g syringe 100g jar 

300104300105 TSF-6502 TSF-6502 No-Clean No-Clean 100g 150g jar cartridge 


300105 TSF-6502 No-Clean 150g cartridge 

TSF-6852 Lead-Free Water Soluble 


(For Screen or Stencil Printing) 

(For Screen Printing/Stencil Printing/Pin Transfer) 

TSF-6850 is an aggressive synthetic flux with residues that are easily and completely 

cleaned with TSF-6852 water 

TSF-6592LV 

temperatures Lead-Free is compatible 

ranging Water with 

from 

lead Soluble 20-65ºC 

and lead-free 

yielding 

solder 

bright, 

alloys 

shiny 

such 

joints. 

as SnAg, 

TSF-6852 (For is a SnCu, drop-in Screen SnAgCu, solution or Stencil SnAgBi, for solder Printing) and alloys can be that reflowed will have in nitrogen a liquidus or up air to with 300ºC. peak 

TSF-6852 TSF-6850 also temperatures has is a 6 an month aggressive up shelf to 270ºC. life synthetic when The flux residues stored with between are residues clear, 0-25ºC that non-conductive, are (refrigerated easily and and or 

room temperature). completely non-corrosive. cleaned with water temperatures ranging from 20-65ºC yielding 

bright, shiny joints. TSF-6852 is a drop-in solution for solder alloys that will 

have a liquidus up to 300ºC. TSF-6852 also has a 6 month shelf life when 

Kester stored Part between Kester # 0-25ºC Part #(refrigerated Description or room Description temperature). Packaging Packaging 


300203 TSF-6852 Water-Soluble 30g syringe 

Kester Part 300304 # Description TSF-6592LV No-Clean Packaging 100g jar 

300204 TSF-6852 Water-Soluble 100g jar 

30020300305 TSF-6852 TSF-6592LV Water-Soluble No-Clean 30g syringe 150g cartridge 

300206 TSF-6852 Water-Soluble 165g cartridge 

300204 TSF-6852 Water-Soluble 100g jar 

300206 TSF-6852 Water-Soluble 165g cartridge 

TSF-6502 No-Clean 

(Lower Viscosity for Screen 

Printing/Thin Film Deposition) 

TSF-6502 is a no-clean tacky soldering flux formula designed for 

BGA/CSP/PGA screen printing, sphere/pin processing or for repair and 

reballing/repinning. It possesses a high activity level, allowing it to solder 

nickel surfaces. The robust wetting action of the TSF-6502 will allow OSP 

treated copper, as well as heavily oxidized copper, surfaces to exhibit good 

soldering properties, even after 2 or 3 thermal cycles. TSF-6502 is designed 

for a wide range of temperature and humid conditions. 


300103 TSF-6502 No-Clean 30g syringe 

300104 TSF-6502 No-Clean 100g jar 

300105 TSF-6502 No-Clean 150g cartridge 

WWW.Kester.com | 800 253 7837 | 17

Kester Solderforms ® TC-533 Peelable Solder Mask 

This is a high-temperature flexible solder masking compound specially formulated 

of natural latex rubber. It is extremely versatile as it can be used as a 

temporary solder mask, conformal coating maskant, and a potting compound 

mold seal. 

Kester Solderforms ® 

Kester Solderforms ® are stamped, extruded, compacted 

or formed pieces of pure soft solder alloys manufactured 

with strict known tolerances to customer specifications. 

TC-527 Hi-Temp Flexible Solder Mask 

Solderforms ® may be produced as flux cored, solid metal, 

TC-527 is a high-temperature flexible solder masking compound formulated of and with or without a flux coating. 

natural latex rubber to protect delicate components. The latex is heat stable 

and tacky enough to be applied to those areas of circuit boards that require Fluxes available are no-clean, water soluble, RMA, and 

RA chemistries. External dyes are also available for 

masking during a wave soldering process. Can be applied by automatic dip, 

identification or to aid in determining the solder melt point. 

brush or flow methods, direct from applicator bottle or by automated dispensing 

machines. It can easily be peeled away without leaving a residue. 

Solderform ® Minimum (mm) Maximum (mm) 


53-4000-0533 TC-533 ½ pint 

53-4001-0533 TC-533 1 pint 

53-4003-0533 TC-533 1 gallon 

53-4000-0527 TC-527 ½ pint 

53-4001-0527 TC-527 1 pint 

53-4003-0527 TC-527 1 gallon 

Kester Solderforms ® 

Solderform ® Minimum (mm) Maximum (mm) 

Width 0.50 ± 0.13 76.20 ± 0.75 

Ribbons Width 0.50 ± 0.13 76.20 ± 0.75 

Ribbons 

Thickness 0.0762 ± 0.03 3.18 ± 0.13 

Thickness 0.0762 ± 0.03 3.18 ± 0.13 

Width 0.50 Width ± 0.13 76.200.50 ± 0.75 ± 0.13 76.20 ± 0.75 

Cut-Offs 

Cut-Offs Thickness 0.0762 Thickness ± 0.03 3.180.0762 ± 0.13± 0.03 3.18 ± 0.13 

Length 0.762 Length ± 0.25 5000.762 ± 1.25± 0.25 500 ± 1.25 

Outside Diameter Outside 0.889 Diameter ± 0.05 63.50.889 ± 0.13± 0.05 63.5 ± 0.13 

Washers Washers Inside Diameter Inside 0.38 Diameter ± 0.05 58.420.38 ± 0.13 ± 0.05 58.42 ± 0.13 

Thickness 0.0762 ± 0.03 

Thickness 

6.35 ± 0.25 

0.0762 ± 0.03 6.35 ± 0.25 

Outside Diameter 0.41 ± 0.05 65 ± 0.05 

Discs 

Outside Diameter 0.41 ± 0.05 65 ± 0.05 

Discs Thickness 0.0762 ± 0.03 6.35 ± 0.25 

Thickness 0.0762 ± 0.03 6.35 ± 0.25 

Diameter 0.254 ± 0.03 12.7 ± 0.13 

Pellets 

point. 

Length Diameter 0.50 ± 0.13 152.40.254 ± 0.76 ± 0.03 12.7 ± 0.13 

Pellets 

Length 0.50 ± 0.13 152.4 ± 0.76 

Description Stampings use special dies that are customer specific 

Stampings 

and require Description a customer’s engineering Stampings drawing use and special dies that are customer specific 

Stampings 

specification. 

and require a customer’s engineering drawing and 

specification. 

Kester Solderforms ® are stamped, extruded, compact 

formed pieces of pure soft solder alloys manufacture 

with strict known tolerances to customer specification 

Kester also creates other preforms such as collars, rib 

forms, rings, and wireforms. 

Solderforms ® may be produced as flux cored, solid m 

and with or without a flux coating. 

Fluxes available are no-clean, water soluble, RMA, a 

RA chemistries. External dyes are also available for 

identification or to aid in determining the solder mel 

18 | 800 253 7837 | WWW.kester.com

Technical Data 

Category 

If trying to solder to this 

metal surface: 

1 Platinum, Gold, Copper, Tin, 

Solder, Silver 

2 

Nickel, Cadmium, Brass, 

Lead, Bronze, Rhodium, 

Beryllium Copper, Palladium, 

Immersion Tin, Immersion Silver 

Table 1 

Metal Solderability Chart 

Solder Paste and Tacky 

Soldering Fluxes 

Technical Data 

All products can solder these metal 

surfaces. 

EniviroMark 907, EnviroMark 828 

Easy Profile ® 256 & 256HA 

HydroMark 531, TSF 6592LV, 

TSF 6800 Series 

Liquid Fluxes and Flux-Pen ® 

Formulas 


surfaces. 

Cored Wire 


surfaces. 

186, 1544, 2120, 

2331-ZX, 2235, 2224-25, 

44, 48, 331, OR-421 

2222, 2220-VF 

Table 1 

Metal Solderability Chart 

Call Kester’s Solder Customer Paste and Service 

Liquid Fluxes and 

48 

Tacky Department Soldering Fluxes 

Flux-Pen ® Formulas 

All products can solder these All products can solder these 

metal surfaces. 


3 Nickel-Iron, Kovar Base metal must be plated. 2222, 2220-VF 48, 331, OR-421 

Zinc, Mild Steel, Chromium, Inconel, Category If trying to solder to this 

4 

Base metal must be plated. 

Monel, Stainless Steel 

metal surface: 

EXAMPLE 1: When soldering Beryllium Copper to Tin, you could use any of Platinum, the products Gold, Copper, listed Tin, 

1 

Category 2, 3, or 4 since Beryllium Copper requires more active 

Solder, Silver 

products than Tin. 

EXAMPLE 2: If you were soldering Solder coated leads to a Copper surface, Nickel, you could Cadmium, use any Brass, of Kester’s EniviroMark products (Category 907, EnviroMark 1, 2, 3, 828 or 4). 186, 1544, 2120, 

2 

Lead, Bronze, Rhodium, 

Easy Profile ® 256 & 256HA 

2331-ZX, 2235, 2224-25, 

Beryllium Copper, Palladium, HydroMark 531, TSF 6592LV, 

2222, 2220-VF 

Immersion Tin, Immersion Silver 

TSF 6800 Series 

ALLOY TEMPERATURE CHART: SOLDER ALLOYS AND AVAILABLE FORMS 

Zinc, Mild Steel, Chromium, 

ALLOY: TIN-LEAD MELTING RANGE °F/°C WIRE 4 BAR SOLDERPASTE PREFORMS 

Inconel, Monel, Stainless Steel 

Sn63Pb37 361/183 X X X X 

Sn60Pb40 361-374/183-190 X requires X more active products than Tin. X 

Sn50Pb50 361-420/183-214 X X X 

Sn40Pb60 361-460/183-238 X X X 

Sn30Pb70 361-496/183-258 X X X 

No. 123 366-503/186-262 X X 

Sn05Pb95 574-597/301-314 X X 

LEAD-FREE MELTING RANGE °F/°C WIRE BAR SOLDERPASTE PREFORMS 

Sn96.5Ag3.5 430/221 X X X 

Sn96Ag04 430-444/221-229 WEIGHTS X AND XMEASURES 

X 

COMMON CONVERSIONS 

Sn96Ag05 430-473/221-245 X X X 

To Change To Multiply By: 

100%Sn 450/232 X X X 

Gallons (US) Liters 3.7853 

Sn95Sb05 450-464/232-240 Quarts (liquid) X LitersX 0.9463 

X 

Sn99.3Cu0.7 440/227 Pounds (avdp.) X GramsX 453.592 

X 

Sn96.5Ag3.0Cu0.5 422-428/217-220 Pounds (avdp.) X Kilograms X 0.4536 X X 

K100LD 440/227 Pounds (avdp.) X Ounce (troy) X 14.5833 

X 

Ounces (avdp.) Grams 28.3495 

SAF-A-LLOY 428-454/219-235 X X X 

Celsius = 5/9 (F-32) Fahrenheit = 9/5 (C) + 32 

OTHER ALLOYS MELTING RANGE °F/°C WIRE BAR SOLDERPASTE PREFORMS 

Sn62Pb36Ag02 354-372/179-189 X X X X 

Sn10Pb88Ag02 514-570/268-299 X X X 

Sn05Pb93.5Ag1.5 565-574/296-301 X X X 

WEIGHTS AND MEASURES 

COMMON Call Kester's CONVERSIONS 

Customer Service 

To Change 

Department 

To Multiply By: 

Gallons (US) Liters 3.7853 

Quarts (liquid) Liters 0.9463 

Pounds (avdp.) Grams 453.592 

Pounds (avdp.) Kilograms 0.4536 

Pounds (avdp.) Ounce (troy) 14.5833 

Ounces (avdp.) Grams 28.3495 

Celsius = 5/9 (F-32) Fahrenheit = 9/5 (C) + 32 

FORMULA FOR ADDING TIN TO 

FORMULA FOR ADDING TIN TO 

TIN-LEAD SOLDER POTS 

TIN-LEAD SOLDER POTS 

Tin can be added to solder to replace tin lost by oxidation. 

Tin can be added 

The 

to 

pot 

solder 

temperature 

to replace 

should 

tin lost 

beat 

by 

least 

oxidation. 

460°F. Tin 

The 

bars 

pot 

should 

temperature should be 

at least 460°F. be Tin added bars slowly should and be added the solder slowly should and be the mixed solder well. should be mixed well. 

T 

T 

= Pounds 

Pounds 

of 

of Tin 

Tin 

to 

to 

add 

add 

W = 

W 

Pounds 

= Pounds 

of solder 

of solder 

on pot 

on pot 

A Percentage of Tin desired B = Percentage of Tin in pot 

A = Percentage of Tin desired B = Percentage of Tin in pot 

Cored Wire 

All products can solder th 


44, 48, 331, OR-421 

3 Nickel-Iron, Kovar Base metal must be plated. 2222, 2220-VF 48, 331, OR-421 

Base metal must be plated. 

EXAMPLE 1: When soldering Beryllium Copper to Tin, you could use any of the products listed in Category 2, 3, or 4 since Beryllium Copper 

EXAMPLE 2: If you were soldering Solder coated leads to a Copper surface, you could use any of Kester's products (Category 1, 2, 3, or 4). 

W(A - B) T = (100 - A) 

EXAMPLE 

900 (63 - 61.6) = 1260 = 34 lbs. of 

(100 - 63) 37 Tin to add 

Please visit www.kester.com and click on 

Lead-Free Solutions for a worksheet to 

Please visit www.kester.com and click on Lead-Free Solutions 

balance Lead-Free alloy systems. 

for a worksheet to balance Lead-Free alloy systems. 

48 

WWW.Kester.com | 800 253 7837 | 19

GLOBAL 

HEADQUARTERS 

USA 

800 West Thorndale Avenue 

Itasca, IL 60143-1341 

Phone: (+1) 630-616-4000 

Fax: (+1) 630-616-4044 

Email: customerservice@kester.com 

Customer Service 

Phone: 800-2-KESTER 

Fax: (+1) 630-616-4044 

EUROPEAN 

HEADQUARTERS 

Germany 

Zum Plom 5 

08541 Neuensalz 

Germany 

Phone: (+49) 3741 4233-0 

Fax: (+49) 3741 4233-111 

Email: customerservice@kester-eu.com 

ASIA-PACIFIC 

HEADQUARTERS 

Singapore 

500 Chai Chee Lane 

Singapore 4690224 

Phone: (+65) 6 449-1133 

Fax: (+65) 6 242-9036 

Email: customerservice@kester.com.sg 

Mexico 

Carretera Internacional Km. 6.5 

Esquina Boulevard del Castillo 

Parque Industrial 

Nogales, Son. 84000 

Mexico 

For customer service call the 

Global Headquarters facility 

Taiwan 

4th Floor, No. 128 

Lane 235 

Pao-Chiao Road 

Hsien-Tien City 

Taipei Hsien, Taiwan 

Tel: (+886) 2-8912-1066 

Fax: (+886) 2-8912-1072 

Email: twsales@kester.com.tw 

Japan 

20-11 YokoKawa 2-Chome, 

Sumida-ku 

Tokyo 130, Japan 

Tel: (+81) 3-3624-5351 

Fax (+81) 3-3626-6253 

Email: jpsales@kester.com.sg 

JOHORBAHRU, MALAYSIA 

PLO 113, Fasa 3 

Kawasan Perindustria Senai 

81400 Senai, Johor, Malaysia 

Tel: (+60) 7-598-4113 

Fax: (+60) 7-598-3103 

Kester Vision Statement 

Smart Products. 

Great Service. 

No Boundaries. 

Kester will be the leading global supplier of high performance interconnecting materials and 

related services for the electronic assembly and component assembly markets. 

To achieve this we will focus on customer-driven innovation and exceptional service worldwide.

2012 RECOMMENDED - NTE Electronics

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