IV. Processes: Top-down and Bottom-up

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• Check http://www.mit.edu/tdp/www • Solid freeform fabrication, currently working only at sub-mm level, is amenable for nanoscale prototyping • Works by building parts in layers. Starts with a CAD model for the structure • Each layer begins with a thin distribution of powder spread over the surface of a powder bed • Technology similar to ink-jet printing • A binder material selectively joins particles where the object formation is desired • A piston is lowered that leads to spreading the next layer • Layer-by-layer process is repeated • Final heat treatment removes unbound powder • Allows control of composition, microstructure, surface structure
• Soft lithography uses transparent, elastomeric polydimethylsiloxane (PDMS) “stamps” with patterned relief on the surface to generate features. • The stamps can be prepared by casting prepolymers against masters patterned by conventional lithographic techniques. • Can generate patterns with critical dimensions as small as 30 nm. Image courtesy of: http://www.chem.ucsb.edu/~buratto_gro<strong>up</strong>/PorousSilicon_4.htm
Page 1 and 2: IV. Processes: Top-down and Bottom-
Page 3 and 4: • Top-down techniques take a bulk
Page 5 and 6: • Thermal evaporation - Old techn
Page 8 and 9: Plasma processes and basics
Page 10 and 11: • Discharges of gases are created
Page 12 and 13: • Thermodynamic nonequilibrium di
Page 14 and 15: Source: Plasma Etching, Manos, Flam
Page 17 and 18: * Classification is primarily based
Page 19 and 20: • Simple to construct • Ionizat
Page 22 and 23: • Versatile process for making ce
Page 26 and 27: • Ability to pattern non-planar/f
Page 28 and 29: • Broad nomenclature for processe

IV. Processes: Top-down and Bottom-up

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