Membrane Cards with Microscrub Technology

More documents

Recommendations

Info

Conventional Cantilever Probe Card Contact Resistance (@ 85 C) SEMATECH Applied Precision, Inc. Advanced Probing Systems, Inc. Sandia National Labs SWTW ‘98 Advanced Microelectronic Probing Solutions M TM CASCADE I C R O T E C H
Comparison of Cantilever (@ 30 C) vs. Pyramid (@ 85 C) 3 Lifetest at Sandia on a blank aluminum wafer (5 mil overtravel at 85 C) 2.5 Resistance (contact + signal line) (ohms) 2 1.5 1 0.5 0 440 430 420 410 400 390 380 370 360 350 340 330 320 280 270 260 250 240 230 220 210 200 190 180 170 160 120 110 100 90 80 70 60 50 40 30 20 10 0 Touchdowns (x 1000) (box plot <strong>with</strong>out tails comparative to data shown at SWTW '98 page 24) Advanced Microelectronic Probing Solutions M TM CASCADE I C R O T E C H
Page 1 and 2: Achieving Low Contact Resistance on
Page 3 and 4: Industry Requirements ● Contact r
Page 5 and 6: Microscrub Principles of Operation
Page 7 and 8: Typical Initial Contact Resistance
Page 9 and 10: Pyramid Probe Tips with MEMs Proces
Page 11: Pyramid Probe Contact Resistance fr
Page 15 and 16: Typical Pyramid Probe and Cantileve
Page 17 and 18: One Cantilever, Two Pyramid Scrub M
Page 19 and 20: Multi-DUT Testing of FlashRAM ●
Page 21 and 22: Acknowledgements ● ● ● NIST/A

Membrane Cards with Microscrub Technology

Create successful ePaper yourself

Delete template?

Save as template?