Preliminary Program (PDF) - Semiconductor Wafer Test Workshop
Preliminary Program (PDF) - Semiconductor Wafer Test Workshop
Preliminary Program (PDF) - Semiconductor Wafer Test Workshop
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<strong>Program</strong> and Technical Agenda are<br />
subject to change without notice.<br />
June 9‐12, 2013<br />
Rancho Bernardo Inn<br />
San Diego, CA, USA<br />
http://www.swtest.org<br />
<strong>Preliminary</strong> <strong>Program</strong><br />
Sunday ‐‐ Monday ‐‐ Tuesday ‐‐ Wednesday<br />
June 9 , 2013 (Sunday)<br />
7‐:00 AM ‐ 1:00 PM 2nd Annual SWTW Golf Tournament<br />
7:00 ‐ 8:00 Box Breakfast<br />
8:00 Tee Off: Scramble, Reverse Shotgun Format<br />
2:00 PM ‐ 5:00 PM Tutorial<br />
Use of Resource Sharing Techniques to Increase Parallel <strong>Test</strong> and <strong>Test</strong><br />
Coverage in <strong>Wafer</strong> <strong>Test</strong><br />
Michael Huebner, Ph.D. (FormFactor)<br />
The tutorial will discuss methods being developed and used in HVM for DRAM and<br />
NAND testing to increase parallel testing on wafer level. Starting from straight<br />
forward driver sharing to the most advanced use of electronic switches to<br />
multiplex all kind of tester resources (AC, DC and Power). I t will be discussed as<br />
well how this methods can be used in other applications like SOC, Embedded<br />
Memory test etc. as well. On top of that other examples of using electronics to<br />
extend the testers capabilities will be shown, e.g. use of DC/DC converters to<br />
increase the current capability of tester power supplies.<br />
Methods of analyzing/predicting scrub margin for pads and bump<br />
applications<br />
Tom Watson and Amy Leong (FormFactor)<br />
The tutorial will discuss methods of specifying and measuring scrub capability of<br />
probe cards. The material will compare and contrast the commonly used scrub<br />
margin approach of establishing specifications for various probe card elements<br />
and worst‐case stack‐up of those probe card parameters with a more direct scrub<br />
mark measurement approach and quantification of scrub capability.
<strong>Program</strong> and Technical Agenda are<br />
subject to change without notice.<br />
June 10, 2013 (Monday)<br />
4:00 PM ‐ 6:00 PM REGISTRATION<br />
6:00 PM ‐ 7:00 PM WELCOME RECEPTION<br />
7:00 PM ‐ 8:15 PM BUFFET DINNER<br />
8:15 PM ‐ 9:45 PM Evening Session<br />
8:15 ‐ 8:30 Probe Year in Review<br />
Jerry Broz, Ph.D., General Chair<br />
8:30 ‐ 9:45 KEYNOTE<br />
Yervant Zorian, Ph.D.<br />
Fellow & Chief Architect, Synopsys, Inc.<br />
Speaker Biography<br />
Yervant Zorian is a Synopsys Fellow and Chief Architect in Mountain View,<br />
California. Previously he was the Vice President and Chief Scientist of<br />
Virage Logic Corp, a Distinguished Member of Technical Staff at AT&T Bell<br />
Laboratories and Chief Technology Advisor of LogicVision Inc.<br />
Dr. Zorian holds 32 US patents, edited 4 books, and authored +300<br />
refereed papers. He was selected by EE Times among the top 13<br />
influencers on the semiconductor industry, was the 2005 recipient of IEEE<br />
Industrial Pioneer Award for his contribution to BIST, and the 2006<br />
recipient of the IEEE Hans Karlsson Award for diplomacy.<br />
9:45 PM Networking
<strong>Program</strong> and Technical Agenda are<br />
subject to change without notice.<br />
June 10, 2013 (Monday)<br />
7:00 AM ‐ 8:00 AM REGISTRATION & CONTINENTAL BREAKFAST<br />
8:00 AM ‐ 8:30 AM Welcome<br />
8:00 ‐ 8:30 Welcome to SWTW‐2013<br />
Jerry Broz, Ph.D., General Chair<br />
8:30 AM ‐ 10:00 AM SESSION 1: Fine Pitch Bump and Pillar Probing<br />
Session Chair: Jerry Broz, Ph.D. (International <strong>Test</strong> Solutions)<br />
8:30 ‐ 9:00 Utilizing Advanced Modular Space Transformer & Enhanced Probes to<br />
Resolve Customer‐Specific Challenge<br />
Mohamed Eldessouki (SV Probe), Rehan Kazmi (SV Probe) and Mark Ojeda<br />
(Spansion)<br />
9:00 ‐ 9:30 Probing Study of Fine‐pitch Cu Pillars<br />
Amy Leong (FormFactor), Alexander Wittig (Globalfoundries), Tin Nguyen<br />
(Formfactor), Darko Hulic (Nikad), and Mike Slessor (FormFactor)<br />
9:30 ‐ 10:00 Very Small Pitch Micro Bump Array Probing<br />
Gunther Bohm (FEINMETALL), Dr. Samuel Kalt (Team Nanotech), Dr. Joerg<br />
Kiesewetter (CASCADE), Armin Klumpp (Fraunhofer‐EMFT), Erik Jan<br />
Marinissen (IMEC), Dr. Wolfgang Schäfer (FEINMETALL)<br />
10:00 AM ‐ 10:30 AM COFFEE BREAK<br />
10:30 AM ‐ 12:00 PM SESSION 2: Industry Trends and Advanced Packaging Challenges<br />
Session Chair: Darren James (Rudolph Technologies)<br />
10:30 ‐ 11:00 Consolidation at the Leading Edge ‐ Time to Review the Options<br />
John West (VLSI Research Europe)<br />
11:00 ‐ 11:30 Trends, Challenges, and Solutions in Advanced SoC <strong>Wafer</strong> Probe<br />
Mike Slessor (FormFactor), Jarek Kister (FormFactor), Ben Eldridge<br />
(FormFactor), Tin Nguyen (FormFactor), and Amy Leong (FormFactor)<br />
11:30 ‐ 12:00 Ideal 3D Stacked Die <strong>Test</strong><br />
Ira Feldman (Feldman Engineering Corp.)<br />
12:00 NOON ‐ 1:00 PM LUNCH
<strong>Program</strong> and Technical Agenda are<br />
subject to change without notice.<br />
June 10, 2013 (Monday)<br />
1:00 PM ‐ 2:30 PM SESSION 3: Productivity & Accuracy Challenges in Probing<br />
Session Chair: Patrick Mui (JEM America)<br />
1:00 ‐ 1:30 Accurate Probe Positioning by Using Low CTE Ceramic Substrate for 12 "<br />
<strong>Test</strong>ing<br />
Joonyeon Kim (Samsung Electronics), Jooyong Kim (Samsung Electro‐<br />
Mechanics Co.Ltd), and Yunhwi Park (Samsung Electro‐Mechanics Co.Ltd)<br />
1:30 ‐ 2:00 Probing@HOT Temperature ‐ New Approach to Accuracy<br />
Harald Berger (Robert‐Bosch GmbH) and Walter Seitz (Robert‐Bosch<br />
GmbH)<br />
2:00 ‐ 2:30 A New Probe Card Changer to Increase <strong>Test</strong>er Utilization and Improve Data<br />
Integrity<br />
Bryan Root (Celadon Systems, Inc.) and Bill Funk (Celadon Systems, Inc.)<br />
2:30 PM ‐ 3:00 PM COFFEE BREAK<br />
3:00 PM ‐ 4:30 PM SESSION 4: Probe Card Design and Repair<br />
Session Chair: Gunther Boehm (FeinMetall GmbH)<br />
3:00 ‐ 3:30 Key Design Practices of High Pincount Cobra Probecard<br />
Joey Wu (MPI Corp) and Tony Yu (MPI Corp.)<br />
3:30 ‐ 4:00 Automated Probe Card Repair Based on an Advanced Closed Loop<br />
Manufacturing Approach<br />
Stefan Scherer (Alicona Imaging GmbH), Mark Raleigh (Alicona<br />
Corporation) and Stefan Scherer (Alicona Corp)<br />
4:00 ‐ 4:30 When Brick Wall is Not the Best, PART II (A Touch Down Optimization<br />
Study)<br />
Alan Wegleitner (Texas Instruments) and Tommie Berry (FormFactor)<br />
5:00 PM ‐ 8:00 PM EXHIBITS OPEN – with CARVING STATION DINNER
<strong>Program</strong> and Technical Agenda are<br />
subject to change without notice.<br />
June 11 , 2013 (Tuesday)<br />
7:00 AM ‐ 8:00 AM CONTINENTAL BREAKFAST<br />
8:00 AM ‐ 10:00 AM SESSION 5: Power Delivery Challenges<br />
Session Chair: John Caldwell (Micron Technology)<br />
8:00 ‐ 8:30 Small Probes, High Currents, Short Pulses<br />
Gert Hohenwarter (GateWave Northern, Inc.)<br />
8:30 ‐ 9:00 What Burns My Probes<br />
Richard Studnicki (SanDisk)<br />
9:00 ‐ 9:30 "Sparking" Challenges: AC High Voltage <strong>Wafer</strong> <strong>Test</strong><br />
Georg Franz (T.I.P.S. Messtechnik GmbH) and Rainer Gaggl (T.I.P.S.<br />
Messtechnik GmbH)<br />
9:30 ‐ 10:00 Next Generation Probe Materials<br />
Edward Smith (Deringer Ney, Inc.), Jason Kumnick (Deringer Ney, Inc.), and<br />
Art Klein (Deringer Ney, Inc.)<br />
10:00 AM ‐ 10:30 AM COFFEE BREAK<br />
10:30 AM ‐ 12:00 PM SESSION 6: Taking Probing Into New Directions<br />
Session Chair: Mark Ojeda (Spansion)<br />
10:30 ‐ 11:00 Fine Pitch MEMS Probe Card with Built in Active Device for 3D IC <strong>Test</strong><br />
Greg Medrick (Advantest America, Inc.), Lakshmikanth Namburi (Advantest<br />
America, Inc.), and Gary Maier (IBM )<br />
11:00 ‐ 11:30 <strong>Wafer</strong> Translators: High Performance Full <strong>Wafer</strong> Contact<br />
Morgan Johnson (Advanced Inquiry Systems, Inc.) and Fred Weiss<br />
(Advanced Inquiry Systems, Inc.)<br />
11:30 ‐ 12:00 Novel Probe Card with High Count of Needles in Single Sheet for Universal<br />
<strong>Wafer</strong> <strong>Test</strong>ing<br />
Gunsei Kimoto (ProbeAce Co.,Ltd.)<br />
12:00 NOON ‐ 1:00 PM LUNCH
<strong>Program</strong> and Technical Agenda are<br />
subject to change without notice.<br />
June 11, 2013 (Tuesday)<br />
1:00 PM ‐ 2:30 PM SESSION 7: High Performance Probing in Volume Production<br />
Session Chair: Amy Leong (FormFactor Inc.)<br />
1:00 ‐ 1:30 LPDDR2 and LPDDR3 High Speed <strong>Wafer</strong> <strong>Test</strong> for KGD<br />
Yosuke Kawamata (TeraProbe), Takeshi Yanagisawa (ELPIDA Memory Inc.),<br />
and Marc Loranger (Form Factor Inc)<br />
1:30 ‐ 2:00 Full <strong>Wafer</strong> Probe Cards for Mixed Signal Products<br />
Jan Martens (NXP <strong>Semiconductor</strong>s GmbH), Thomas Dabelstein (NXP<br />
<strong>Semiconductor</strong>s GmbH), Marcel Bleyl (NXP <strong>Semiconductor</strong>s GmbH), and<br />
Simon Allgaier (Feinmetall GmbH)<br />
2:00 ‐ 2:30 The Cost of Quality – Challenges of High Volume Memory <strong>Wafer</strong> <strong>Test</strong><br />
John Caldwell (Micron Technology), Alistair Laing (Micron Technology),<br />
Aaron Woodard (Micron Technology), and Jarod Hunter (Micron<br />
Technology)<br />
2:30 ‐ 3:00 High Performance 0.35 mm Pitch Elastomeric Contact and Spring Probe<br />
Development by Stamping Process<br />
AJ Park (IWIN CO.,Ltd.) and Samuel Park (IWIN Co.,Ltd)<br />
2:30 PM ‐ 4:30 PM EXHIBITS OPEN with Refreshments Served<br />
2:30 ‐ 4:30 PM Break and Exhibits Open with Refreshments Served<br />
6:00 PM ‐ 9:00 PM SOCIAL: San Diego Heritage Celebration<br />
6:00 ‐ 9:00 Cocktail Reception, Dinner, and Live Entertainment
<strong>Program</strong> and Technical Agenda are<br />
subject to change without notice.<br />
June 12 , 2013 (Wednesday)<br />
7:00 AM ‐ 8:00 AM CONTINENTAL BREAKFAST<br />
8:00 AM ‐ 9:30 AM SESSION 8: Probe Potpourri<br />
Session Chair: Michael Huebner, Ph.D. (FormFactor Inc.)<br />
8:00 ‐ 8:30 Study of Cantilever Probes and Probe Marks<br />
Stevan Hunter (ON <strong>Semiconductor</strong>)<br />
8:30 ‐ 9:00 Probing of Bump <strong>Wafer</strong>: TPEG MEMS T3 versus Cobra‐like Technology<br />
Daniel Newman (STM Singapore), Mohammad Ridwan (STM Singapore),<br />
Severine Angles (STM Grenoble), Anne‐Laure Gunning (STM – Grenoble),<br />
Albert Lim (Technoprobe Asia, Raffaele Vallauri (Technoprobe SPA), and<br />
Marco Prea (Technoprobe SPA)<br />
9:00 ‐ 9:30 Beyond ISMI: Electric Current Capacity of Vertical Probes Under Pulsed and<br />
Transient Signals<br />
Kevin Hughes (Formfactor Inc.)<br />
9:30 AM ‐ 10:00 AM COFFEE BREAK<br />
10:00 AM ‐ 12:00 PM SESSION 9: Challenges of High Frequency <strong>Test</strong><br />
Session Chair: Rey Rincon (Freescale <strong>Semiconductor</strong>)<br />
10:00 ‐ 10:30 Effect of Wide Pitch at mmWave Frequencies and Design<br />
Recommendations<br />
Daniel Bock, Ph.D. (Cascade Microtech)<br />
10:30 ‐ 11:00 High Frequency PCB Material Analysis<br />
Jason Mroczkowski (Multitest)<br />
11:00 ‐ 11:30 Multi Wiring Board Technology for Next Generation High Speed Application<br />
Hiroyuki Yamaguchi (Hitachi Chemical Co.,Ltd.) and Takehisa Sakurai<br />
(Hitachi Chemical Co.America, Ltd.)<br />
11:30 ‐ 12:00 SW <strong>Test</strong> 2013 Awards Session<br />
Jerry Broz, Ph.D., General Chair<br />
12:00 NOON ‐ 1:00 PM LUNCH
<strong>Program</strong> and Technical Agenda are<br />
subject to change without notice.<br />
<strong>Workshop</strong> Registration & Hotel Reservations<br />
top<br />
Online Registration<br />
On‐line registration for the <strong>Semiconductor</strong> <strong>Wafer</strong> <strong>Test</strong> <strong>Workshop</strong> will be available through midnight Eastern Time on Friday, May 17,<br />
2013. To make your online reservation please go to:<br />
SWTW 2013 Online <strong>Workshop</strong> Registration<br />
SWTW 2013 Registration Rates<br />
Registration Type<br />
Member Registration<br />
Includes all <strong>Workshop</strong> activities to include: Technical Sessions, meals,<br />
receptions, Exhibit hours, and social event.<br />
(Member rates are available only to current members of IEEE/CPMT.<br />
Please enter your valid membership number in order to qualify!)<br />
Non‐Member Registration<br />
Includes all <strong>Workshop</strong> activities to include: Technical Sessions, meals,<br />
receptions, Exhibit hours, and social event.<br />
Student Member Registration<br />
Includes all <strong>Workshop</strong> activities to include: Technical Sessions, meals,<br />
receptions, Exhibit hours, and social event. (Valid student ID may be<br />
required at onsite registration check‐in. Please enter your valid<br />
membership number in order to qualify!)<br />
Student Non‐Member Registration Includes all <strong>Workshop</strong> activities to<br />
include: Technical Sessions, meals, receptions, Exhibit hours, and social<br />
event. (Valid student ID may be required at onsite registration check‐in.)<br />
Companion Registration<br />
Includes Sunday Reception & Dinner, Monday Reception in Exhibit Hall<br />
and Tuesday Social.<br />
(Companion rates are not available to people that are employed in the<br />
industry. They are provided for traveling companions only. You may<br />
select to add a Companion registration at the end of the registration<br />
process.)<br />
Advance Rate<br />
(Until May 17, 2013)<br />
Onsite Rate<br />
(After May 17, 2013)<br />
$600.00 $720.00<br />
$740.00 $850.00<br />
$250.00 $300.00<br />
$350.00 $400.00<br />
$310.00 $360.00<br />
Hotel Reservations<br />
Rancho Bernardo Inn Resort & Spa<br />
17550 Bernardo Oaks Dr<br />
San Diego, CA 92128<br />
Reservations: +1.877.517.9340<br />
Group Rate<br />
The group rate is $180 single/double per night, plus tax.<br />
Please be sure to mention IEEE‐SWTW 2013 when making reservations to ensure you receive our discounted group rate. Should you<br />
have any hotel reservation issues, please email expo@swtest.org for assistance. For more information, visit us on the web at:<br />
http://www.swtest.org.<br />
The <strong>Semiconductor</strong> <strong>Wafer</strong> <strong>Test</strong> <strong>Workshop</strong> is sponsored by the IEEE Components, Packaging, and Manufacturing Technology<br />
Society.(http://www.cpmt.org/).
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