Access this Content

asq.org

Access this Content

AS6081

Appendix - C.1

Minimum Counterfeit

Part Detection Methods


AS6081

Appendix - C.1.1

Documentation and

Packaging Inspection

(100%)


Exterior

Packaging

Inspection


Counterfeit

factory box


Interior Packaging Inspection


Barcode DOES NOT

Match Human-

Readable Data


OCM Document Inspection


Counterfeit

C of C’s


Counterfeit

Labels


3 rd Party Reels – especially small

parts w/o markings


Counterfeit HID Card


AS6081

Appendix - C.1.2

Visual Inspection

(100%)


Different Date

Codes


Component Markings & Physical

Condition


Datasheet Comparison


Mechanical Verification


Microscopy

Microscopic Inspection

Inspection


Marks from Prior use or

3 rd Party Tampering


Rust Inside Terminal


Chip in Glass

Capacitor


Substandard Solder Balls


Visual Evidence of

Blacktopping


Blacktop in Dimple

Visual Evidence

of Blacktopping


Damaged Leads


AS6081

Appendix - C.1.3

Inspection for Evidence

of Remarking or

Resurfacing


AS6081

Appendix - C.1.3.1

Marking Permanency

Test

(Sampling)


Mineral Spirits/Alcohol Test


After Marking Permanency

Before Marking Permanency


AS6081

Appendix - C.1.3.2

Surface Finish

Permanency Test

(Sampling)


Acetone Test


Before

After


Laser-Etch Remarking Still

Visible After Black-Topping

Has Been Removed


Baked-On Black-Topping

Scraping

Required

to Remove

Baked-On

Finish


Example of a

Sandblasted

Component

Surface

Note there are

NO Sanding

Marks


Dynaloy Dynasolve 750

Heated

Solvent

Testing


Exposed Sanded Surface

Counterfeit Device


Sanding Marks Clearly Evident


AS6081

Appendix - C.1.4

X-Ray Inspection

(100%)


Exemplar

Suspect

Dual Screens allow for

Comparative Analysis


Match Pin-Out to Datasheet


Images Taken Through Tubes


X-Ray Image Seen Through

Mfg’s Tubes


Images Taken Through Sealed Bags


Components in Trays as

Seen Through Sealed Bags


AS6081

Appendix - C.1.5

X-Ray Fluorescence

(100%)


AS6081

Appendix - C.1.6

Decapsulation / Die

Inspection

(Sampling)


AS6081

Appendix - C.2

Additional Counterfeit

Part Detection Tests


AS6081

Appendix - C.2

• Scanning Acoustic Microscopy

• Destructive Physical Analysis

• Thermal Cycle Testing

• Electrical Testing

• Burn-In

• Hermeticity Verification


AS6081

Appendix - C.2.1

Scanning Acoustic

Microscopy Inspection

(Sampling)


Surface Image Scans

for Resurfacing

“Blacktop” Detection


Exemplar

Suspect


Exemplar

Suspect


Exemplar

Suspect


Exemplar

Suspect


Exemplar

Suspect


Exemplar

Suspect


Latent Defect Detection

(on same 6 parts)

• Cracks

• Voiding

• Delamination


Exemplar

Device

Internal

Image Scan

Suspect

Device


Exemplar

Device

Internal

Image Scan

Suspect

Device


Exemplar

Device

Internal

Image Scan

Suspect

Device


Exemplar

Device

Internal

Image Scan

Suspect

Device


Exemplar

Device

Internal

Image Scan

Suspect

Device


Exemplar

Device

Internal

Image Scan

Suspect

Device


Surface Layer Scan

Exemplar

Suspect


Surface Layer Scan

Exemplar

Suspect


Surface Layer Scan

Exemplar

Suspect


Surface Layer Scan

Exemplar

Suspect


Calculating Die Void %


Total % of Die Attach Void


MIL-STD-883G

Method 2030

“Ultrasonic Inspection”


MIL-STD-883G

Method 2030

“Ultrasonic Inspection”

“a. Contact area voids in excess of

50 percent of the total intended

contact area.”


Relative Standards

• MIL-STD-883G

• MIL-STD-1580B

•J-STD-035

• NASA PEM-INST-001

•ESA/SCC No. 25200


J-STD-035

Provides

C-SAM

inspection

process

roadmap


MIL-STD-1580B

“Acoustic Microscopy”


Dynasolve 750 Testing

Purpose: To determine suitable

conditions in which Dynasolve

750 will consistently remove the

new blacktopping from a

counterfeit device while not

damaging the factory top-coating

on an authentic component.


Dynaloy Dynasolve 750

Dynasolve 750 is used

for dissolving cured

urethanes, silicones,

anhydride-cure epoxies

and photo-resist films.


Parameters Tested

Samples of similar authentic and

counterfeit devices were soaked

in Dynasolve 750 at 5 degree

intervals between 80 – 180

degrees Celsius for a maximum

of one hour per temperature

setting.


Conclusion

Our results found that Dynasolve

750 pre-heated to 105 degrees

Celsius consistently removed the

new blacktopping from counterfeit

devices when soaked for 45

minutes.

When these same test conditions

were performed on exemplar

devices we saw no removal of the

factory topcoat.


Sample ½ soaked for 45 minutes in Dynasolve

750 @ 105 degrees Celsius – the new

blacktopping was completely removed to expose

the sanded surface

Counterfeit Device


Exposed Sanded Surface

Counterfeit Device


Treated Area

Untreated Area


Sanding Marks Clearly Evident


Damage was caused to a known good device

when ½ soaked for 45 minutes in Dynasolve 750

at a temperature of 140 degrees Celsius

Exemplar Device


After Dynasolve 750 Testing

Sample ½ soaked for 45 minutes in Dynasolve 750 @

105 degrees Celsius – No topcoat removed

Exemplar Device


After Dynasolve 750 Testing

Both Samples ½ soaked for 45 minutes

in Dynasolve 750 @ 105 degrees Celsius

Exemplar

Device

Counterfeit

Device


This test procedure

should be considered a

destructive test as

demonstrated by these

C-SAM images.


Before Dynasolve Soak


After Dynasolve Soak

More magazines by this user
Similar magazines