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Welcome to Practical Components - Standard ICs

Welcome to Practical Components - Standard ICs

µBGA Test Boards TB-46

µBGA Test Boards TB-46 Test Board 13371T1A-1 dlg DCI-35 3697 10 2 11 124 12 13 23 14 22 15 21 16 17 18 19 20 94U-Ø ® 9 8 7 6 5 4 3 µBGA TEST BOARD 13371T1A-2 dlg DCI-35 3697 10 2 11 124 12 13 23 14 22 15 21 16 17 18 19 20 94U-Ø ® 9 8 7 6 5 4 3 TV46 TEST BOARD 7 – 16 – 96 µBGA TEST BOARD 13371T1A-3 dlg DCI-35 3697 10 2 11 124 12 13 23 14 22 15 21 16 17 18 19 20 94U-Ø ® 9 8 7 6 5 4 3 µBGA TEST BOARD 13371T1A-4 dlg DCI-35 3697 10 2 11 124 12 13 23 14 22 15 21 16 17 18 19 20 94U-Ø ® 9 8 7 6 5 4 3 µBGA TEST BOARD 13371T1A-5 dlg DCI-35 3697 10 2 11 124 12 13 23 14 22 15 21 16 17 18 19 20 94U-Ø ® 9 8 7 6 5 4 3 µBGA TEST BOARD µBGA TEST BOARD 9 8 7 6 5 4 3 2 124 µBGA TEST BOARD 9 8 7 6 5 4 3 2 124 94U-Ø 94U-Ø 16 17 18 19 20 23 22 21 13371T1A-6 dlg 16 17 18 19 20 23 22 21 13371T1A-7 dlg µBGA TEST BOARD 9 8 7 6 5 4 3 2 124 94U-Ø 16 17 18 19 20 23 22 21 13371T1A-8 dlg µBGA TEST BOARD 9 8 7 6 5 4 3 2 124 94U-Ø 16 17 18 19 20 23 22 21 13371T1A-9 dlg µBGA TEST BOARD 9 8 7 6 5 4 3 2 124 94U-Ø 16 17 18 19 20 23 22 21 13371T1A-10 dlg ® 10 11 12 13 14 15 ® 10 11 12 13 14 15 ® 10 11 12 13 14 15 ® 10 11 12 13 14 15 ® 10 11 12 13 14 15 DCI-35 3697 DCI-35 3697 Notes Test board has 10 daisy-chained chip sites per board. Board is made with nickel/gold solder-pad finish. Gerber data for solder stencil is supplied at no charge. ® DCI-35 3697 Tessera µBGA TB 13371T1A DCI-35 3697 Order Number: TB46 DCI-35 3697 Not to scale TB-74 Test Board Please call for details. TB-188 Test Board A1 19 20 21 22 23 24 TV-188M µBGA ® DAISY-CHAIN TEST SITE 18 17 16 15 14 13 12 11 10 9 8 7 A1 19 20 21 22 23 24 TV–188M DAISY CHAIN TEST BOARD TV-188M µBGA ® DAISY-CHAIN TEST SITE 18 17 16 15 14 13 12 11 10 9 8 7 A1 19 20 21 22 23 24 TV-188M µBGA ® DAISY-CHAIN TEST SITE 18 17 16 15 14 13 12 11 10 9 8 7 A1 19 20 21 22 23 24 TV-188M µBGA ® DAISY-CHAIN TEST SITE 18 17 16 15 14 13 12 11 10 9 8 7 A1 19 20 21 22 23 24 TV-188M µBGA ® DAISY-CHAIN TEST SITE 18 17 16 15 14 13 12 11 10 9 8 7 25 2 3 4 5 6 1 2 3 4 5 6 2 3 4 5 6 2 3 4 5 6 1 1 1 25 25 25 25 2 3 4 5 6 1 A1 TV-188M µBGA ® DAISY-CHAIN TEST SITE 18 17 16 15 14 13 A1 TV-188M µBGA ® DAISY-CHAIN TEST SITE 18 17 16 15 14 13 A1 TV-188M µBGA ® DAISY-CHAIN TEST SITE 18 17 16 15 14 13 A1 TV-188M µBGA ® DAISY-CHAIN TEST SITE 18 17 16 15 14 13 A1 TV-188M µBGA ® DAISY-CHAIN TEST SITE 18 17 16 15 14 13 19 20 21 22 12 11 10 9 19 20 21 22 12 11 10 9 19 20 21 22 12 11 10 9 19 20 21 22 12 11 10 9 19 20 21 22 12 11 10 9 23 8 23 8 23 8 23 8 23 8 24 7 24 7 24 7 24 7 24 7 25 2 3 4 5 6 1 25 2 3 4 5 6 1 25 2 3 4 5 6 1 25 2 3 4 5 6 1 25 2 3 4 5 6 1 Tessera ® µBGA ® PN 324—0168—REV00 TOP The TB–188 test board has 10 daisy-chain test sites on one side, and 10 bias/SIR test sites on the other, for use with the TV–188M µBGA daisy-chain test package on both sides. The two sides are laid out so as to use the same solder stencil aligned to three global fiducial. The test board is not perforated for snap-apart, but it is designed so it can be cut into testable 5–up or 1–up coupons. The drilled holes are for hard wiring with solder for in-situ testing at the panel or coupon level (no plated through-holes). ® Notes Board is made with nickel/gold solderpad finish. Actual size of board is 2.75" x 6.5". Order Number: TB188 Not to scale 14 Practical Components • Phone 1-714-899-8309 • Fax 1-714-899-8599 • klpci@worldnet.att.net • www.practicalcomponents.com

Flip Chip Epoxy Encapsulant Chip Substrate FB250 Flip Chip Bump Part Number FB250 FB500 FA10-200 or PB8-200 or FA10-400 PB8-400 x 600 PST2 Die Size 250 x 250 mils 500 x 500 mils 200 x 200 mils 200 x 200 mils 400 x 400 mils 400 x 600 mils 150 x 150 mils Bump Pitch 457 µm, 18 mil 457 µm, 18 mil 254 µm, 10 mil 203 µm, 8 mil 457 µm, 18 mil Passivation Via 102 µm 102 µm 80 µm 73 µm 102 µm UBM Diameter 152 µm 152 µm 102 µm 95 µm 152 µm Bump Height 140 µm 140 µm 110 µm 98 µm 130 µm Bump Diameter 190 µm 190 µm 135 µm 120 µm 160 µm No. of Bumps 48 96 317 88 21 Max. Bump Diagonal 7.7 mm 16.5 mm 7.9 mm — — Die Pad Size 193 x 193 µm 193 x 193 µm 127 x 127 µm 115 x 115 µm 165 x 165 µm Metal Thickness 12 kA 12 kA 12 kA 12 kA 40 kA Type 98/1/1 Al/Cu/Si 98/1/1 Al/Cu/Si 98/1/1 Al/Cu/Si 98/1/1 Al/Cu/Si 98/1/1 Al/Cu/Si Packaging Uncut Wafer* 5" Wafer 250 x 250 mils (243 Die) 5" Wafer 500 x 500 mils (48 Die) 5" Wafer 200 x 200 mils (379 Die) 400 x 400 mils (86 Die) 5" Wafer 200 x 200 mils (379 Die) 400 x 600 mils (50 Die) 5" Wafer 150 x 150 mils (682 Die) Tray Sawed 5" Wafer 25 per tray 2" sq Waffle Pack Sawed 5" Wafer 6pertray2"sq Waffle Pack Sawed 5" Wafer 36 per tray 200 x 200 9 per tray 400 x 400 Waffle Pack Sawed 5" Wafer 36 per tray 200 x 200 9pertray400x600 Waffle Pack Sawed 5" Wafer 25 per tray 2" sq Waffle Pack Tape and Reel .400 Pitch Tack Tape 12mm Width .600 Pitch Tack Tape 24mm Width .400 Pitch Tack Tape 12mm Width .400 Pitch Tack Tape 12mm Width Call For Availability *Note: Die count represents expected yield per wafer. Practical Components • Phone 1-714-899-8309 • Fax 1-714-899-8599 • klpci@worldnet.att.net • www.practicalcomponents.com 15

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