Multichip Modules
Multichip Modules
Creating customized vanishingly small electronic systems for sensors and
communications.
Multichip Modules
Draper Multichip Module (MCM) technology integrates electronic system functionality into a package nearly 1000
times smaller than a traditional circuit board for a wide range of applications, including processing platforms, custom
communications, and sensors.
Precision Grinding Facility
St. Petersburg Microelectronics Fabrication Center
Module Inspection
Rapidly and cost-effectively integrate
heterogeneous semiconductor devices into
a single module
• Integrate analog, digital, and RF integrated circuits
• Compatible with all varieties of interconnect
• Create modules fractions of millimeters thin
• Design custom assemblies to prototype your system
without spinning ASICs
• Can configure as ball grid array style chips for surface
mount technology integration
• Reuse existing technology designs with the latest
semiconductor devices
• Add integrated sensors, camera, antennas, and
custom IOs
• Shorten the development cycle
A full-spectrum engineering partner with
pilot-production capacity in St. Petersburg,
Florida
Draper partners with customers to invent, design,
prototype, produce, and deliver MCMs rapidly and cost
effectively.
• 7000 sq ft of clean room space in a 40,000 sq ft
building
• 100 mm and 200 mm wafer tool set
• Deep reactive ion etching
• Metalization, lamination, die recovery, and die
inspection
• Full metrology suite
• Photolithography capabilities
• MCM foundry services
CONTACT:
John Burns
MCM Facility Director
727-235-6565 | jburns@draper.com | www.draper.com
08/28/2012