Presentation for NCCAVS â Plasma Applications Group (formerly ...
Presentation for NCCAVS â Plasma Applications Group (formerly ...
Presentation for NCCAVS â Plasma Applications Group (formerly ...
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Mold Adhesion Experiment<br />
• Objective: Maximize Mold Adhesion <strong>for</strong> Metal<br />
Leadframes<br />
• Test Set-up<br />
• QFN devices attached with silver-filled epoxy (oven cure)<br />
• Copper leadframes<br />
• EMC mold material<br />
• 10 leadframes plasma treated<br />
• 10 leadfames untreated (control)<br />
• Note 4 molded areas per leadframe<br />
• Considerations<br />
• Maximize cleaning & surface activation rates (<strong>for</strong> high throughput)<br />
• No damage to bonded die, wire bonds and leadframe<br />
30 | 08 October 2009 |
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