Presentation for NCCAVS â Plasma Applications Group (formerly ...

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Plasma Before Flip Chip Underfill (FCUF) • Plasma Treatment to: • Increase filet height • Increase filet uniformity • Improve adhesion • Minimize voiding • Increase wicking speed • Benefits • Increase underfill adhesion (both peel & shear strength) • Increase underfill yield (Cpk) • Increase underfill reliability • Reduce scrap/re-work • Reduce costs 36 | 08 October 2009 |
Flip Chip Underfill (FCUF) Issues • Small gap between die and substrate Slow flow • Trend is: Bigger (L x W) die, more bumps, smaller gaps • Multiple material interfaces Voids & cracks • Device passivation • Solder Balls/Bumps/Pillars • Substrate material • Filet Height Usually the higher, the better • Filet Uniformity Want uniform filets on all sides • Voids, gaps, cracks Need to eliminate • Thermal performance Delamination over time 37 | 08 October 2009 |
Page 1 and 2: Presentation for NCCAVS - Plasma Ap
Page 3 and 4: 4 Common Plasma Applications for AS
Page 5 and 6: 5 | 08 October 2009 | Plasma Before
Page 7 and 8: Die Attach Adhesion Experiment •
Page 9 and 10: Conclusions for Die Attach • Plas
Page 11 and 12: Plasma Before Wire Bonding • Plas
Page 13 and 14: Plasma Before Wire Bonding Let’s
Page 15 and 16: Epoxy Bleed - Plasma Cleaning Exper
Page 17 and 18: 17 | 08 October 2009 | • Optimize
Page 19 and 20: Conclusions for This Contamination
Page 21 and 22: Oxide on Pad - Cleaning Experiment
Page 23 and 24: Plasma Treatment to Remove Contamin
Page 25 and 26: Optimized Plasma Is Required Sample
Page 27 and 28: 27 | 08 October 2009 | Plasma Befor
Page 29 and 30: Mold & Encapsulation: Why Plasma
Page 31 and 32: Mold Adhesion Experiment • Evalua
Page 33 and 34: Mold Adhesion Results • Pull Test
Page 35: 35 | 08 October 2009 | Plasma Befor
Page 39 and 40: Flip Chip Underfill Experiment •
Page 41 and 42: FCUF Results - Wicking Speed • Ti
Page 43: Thank you! Q&A Session 43 | 08 Octo

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Presentation for NCCAVS â Plasma Applications Group (formerly ...