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Product catalogue

Product catalogue

Product

HyperGrid Series HyperGrid Fine Pitch Connectors • Solderless compression contacts; no elastomers or fuzz buttons • 37 GHz bandwidth capability • Tested to EIA standard 364 • 15g random vibration; 100g shock • Consistent resistance • Down to 0.5mm contact pitch • Completely scalable and customizable • Supports column or grid arrays • Adheres to any standard footprint Technical Characteristics Mechanical Specifications Pitch Test Height Full Travel Recommended Travel Overall Length Contact Force 0.5mm, 0.8mm, 1mm, 1.27 mm 0.81 - 2.28 mm 0.15 - 0.50 mm 0.10 - 0.38 mm 0.91 - 2.67 mm 10 - 45 grams Electrical Specifications Current Rating Self Inductance Characteristic Impedence Up to 2.5 amps Down to .5 nH 56 ohms < - 1 dB Bandwidth Up to 37 GHz DC Resistance < 50 milliohoms Contact Current Rating Pitch Co-Planarity Force Test Height Full Travel Recommended Travel Free Length 0.5mm 1.0 amp 0.5mm 0.003 - 0.006in 20 grams 0.032in (0.81mm) 0.006in (0.15mm) 0.004in (0.10mm) 0.036in (0.91mm) 0.8mm 1.5 amp 0.8mm 0.005 - 0.009in 25 grams 0.062in (1.65mm) 0.010in (0.25mm) 0.007in (0.18mm) 0.069in (1.75mm) 1.0mm 2.0 amp 1.0mm 0.008 - 0.12in 30 grams 0.080in (2.03mm) 0.015in (0.38mm) 0.010in (0.25mm) 0.090in (2.29mm) 1.27mm 2.5 amp 1.27mm 0.007 - 0.013in 35 grams 0.090in (2.28mm) 0.020in (0.51mm) 0.015in (0.38mm) 0.105in (2.67mm) Hypertronics’ recommendations for co-planarity varies by board thickness, pitch, array layout and mounting options. Larger co-planarity tolerances can be accomodated by increasing contact travel parameters. JULY 2007 121

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