0201 Chip Component Design and Assembly Issues

0201-01005 Chip Component Design
& Assembly
Bob Willis
ASKbobwillis.com

Edited by Bob Willis – 2002 for the Red Cross 9/11 Fund

0.010” (250um)
0.020” (500um)
0.010” (250um)

Component Placement 01005
Assembleon

Productronica 0201 Test Board
0.012” (0.30mm)
0.016” (0.42mm)
0.007” (0.18mm)

01005 Chip Component Assembly
0.007” (0.180mm)
0.011” (0.280mm)
0.006” (0.160mm)

Printed Board Layout
Standard pad and solder mask layout can be used

Printed Board Layout
Solder mask block aperture is recommended with no mask between pads. Some engineers
have suggested using mask defined pads which has not been found to be beneficial. Images
shows pads after printing and reflow

Solder Mask Defined Pads

Printed Board Layout
0.006”
0.150um
The component separation will decrease but will be limited by PCB fabrication issues rather
than placement or design layout

Printed Board Layout
Direction of component placement does not have an impact on reflow based
on trials with convection or vapour phase reflow

Printed Board Layout Via-in-Pad

LGA/QFN Via Hole Options

Printed Board Layout Via-in-Pad
Mobile phone application with blind, stacked vias with resist defined pads and fillet less joints the
photographs are taken from microsections as part of a product teardown

Printed Board Layout Via-in-Pad
Open via design which is poor practice when using via in pad the visible voids in the x-ray
are the result of the open vias

Component Lift & Tombstoning
Video simulation on NPI design trials and defect investigations

Solder Paste Stencil Design
Laser cut stencil
0.005”/125um stainless steel
0.006”/150um stainless steel
Electroform
0.004”/100um nickel provided the best
results with a type 4 powder
Stencil aperture size for size with pads with
rounded corners for better paste release

Printed Board Layout
If you still see solder beads after reflow you can change the stencils aperture width reducing
the paste under the body of the component, the main reason is poor pad design

Printed Board Layout
Although changing the stencil overcomes production problem its better to correct the
cause, otherwise the design defect then is recreated on future designs

Printing 0201 Solder Paste Video
Video shows paste being printed on to a
glass surface through stencil apertures

0201/01005 Component Placement Issues
Special pick up tools
Inconsistent packaging
Component size variation
Static electricity charges/cover tape
Component contingence requirements

0201 Component Placement
Assembleon

Chip Component Static Pick Up

Harting Fair Production Line
Example production line set up to demonstrate lead-free assembly with complete component range,
including 01005 and intrusive reflow connectors

PIHR Component Placement

PIH Component Placement

Printing PIHR Solder Paste Video

Printing Solder Paste

Printing Solder Paste Alignment Issues

Convection Reflow Soldering
Maximum Temperature Recorded 247 o C
Temperature Differential DT 17 o C

Lead-Free Vapour Phase Soldering
Maximum Temperature Recorded 233 o C
Temperature Differential DT 3 o C

Reflow Soldering 01005 with Lead-Free Paste
Chip Resistors
Chip Capacitors

X-Ray Images of 01005 Chip Joints
X-ray images of capacitors and a resistor after convection reflow in air

Process Defects - Billboards

01005 Chip Component Assembly

0201 Rework and Repair

01005 Rework and Repair
Video Clip showing rework of 01005

01005 Chip Component Tape
New Standards Required
B
D
A
F
H
A B D F H
Metric +/-0.0 +/-0.0 +/- 0.0 +/- 0.0 +/-0.0

01005 Filletless Assembly Design Size
0.004” (0.10mm)
0.005” (0.12mm)
0.009” (0.29mm) 0.007” (0.18mm)
0.006” (0.15mm) 0.008” (0.20mm)
New pad sizes, No real volume production trail results available yet!!
Actual pad size on manufactured panels as measured

0201 - 01005 Filletless Assembly Design
With this type of footprint there is no fillet and the resulting joint is more like a bulbous joint
one of the problems is paste contamination of the top surface of the component during
placement. This then results in paste in or on the nozzle causing blockage

Convection Reflow with Lead-Free
Poor coalescence of solder
paste particles due to flux
exhaustion on 0201 chip.
Poor coalescence of solder paste
particles due to flux exhaustion on
01005 chips in air reflow.

01005 Chip Component Joints
Tombstone only seen on reflow video
simulations not on production, so far!!

Throughput capability for the highest
thermal demand board. Fast cooling
capability with option of nitrogen
System needs positive board support,
measured down stop force and height
control vision/pressure check on part
pickup. Capability for small tape feed
AOI inspection with proven capability for
01005 placement, solder joint and QFN
termination joints
Stencil for 01005 & 0201 areas need to be 0.004”/100um.
Solder paste particle size 4 is necessary. Printer needs to
be capable of ultra fine pitch and repeatable with positive
board support 3D vision or separate AOI station

Package On Package Assembly

Package on Package Microsections
Microsections taken from a 14mm package

X-Ray Inspection of Joints
Images of a four high package POP with larger base balls and some evidence of solder balling
on the PCB. Evidence was also found on different layers of the component.
AXIOM Manufacturing PoP Workshop 24 th November

Interactive & Photo CD-ROMs
CDs released in 2004

Thank you!!!!
Any Questions

NPL Process Defect Database
http://defectsdatabase.npl.co.uk

NPL Process Defect Database

NPL Process Defect Database
http://defectsdatabase.npl.co.uk

NPL Process Defect Database
http://defectsdatabase.npl.co.uk

Any Questions
Bob Willis
ASKbobwillis.com