Nano-3 - Zygo Corporation
Nano-3 - Zygo Corporation
Nano-3 - Zygo Corporation
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ZYGO CORPORATION’S<br />
The utmost precision<br />
3D/2D inspection<br />
system for singulated<br />
part, strip, panel,<br />
and wafer format<br />
inspection<br />
— Integrating ZYGO’s new FMI-3<br />
technology for best available<br />
accuracy<br />
— Complete 2D/3D bump metrology<br />
— Supports singulated part, strip,<br />
panel, and wafer formats<br />
— Flexible platform supports C4,<br />
BGA, LGA, SGA, QFN, QFP, SPI,<br />
CSP, and other types of bumps &<br />
pad inspection<br />
— All types of FMI sensors available<br />
<strong>Zygo</strong> <strong>Corporation</strong> introduces the next generation of<br />
semi-automatic vision system for inspection of all types of<br />
packages. Now with new FMI-3 technology, ZYGO’s <strong>Nano</strong>-3<br />
vision system is an industry leading precision inspection tool<br />
dedicated to meet inspection requirements for process<br />
monitoring, quality control, and new product development.<br />
With today’s ongoing trends in decreasing feature sizes and<br />
higher I/O requirements, the flip-chip substrate industry faces an<br />
important challenge of achieving greater quality through improved<br />
process control in substrate manufacturing production.<br />
ZYGO’s <strong>Nano</strong>-3 vision system is ready to meet that challenge<br />
with industry leading accuracy and repeatability, and flexibility<br />
supporting all types of package inspections. The <strong>Nano</strong>-3 vision<br />
system is designed for the inspection of packages on production<br />
tray, strip, panel, or wafer. This allows customers to have a<br />
multiple function tool for their process control and new product<br />
development at best cost of ownership.
<strong>Nano</strong>-3 Features<br />
SPECIFICATIONS<br />
System Dimension:<br />
Package Type:<br />
Package Size:<br />
Power Requirement:<br />
User Interface:<br />
Air Requirement:<br />
FMI-3 VISION SYSTEM<br />
FMI- 3 sensor family<br />
Ultra fast<br />
Superior performance<br />
1.2 m x 1.2 m x 2.3 m (DxWxH)<br />
All types<br />
Tray : Any JEDEC standard tray,<br />
custom tray up to 300x300 mm<br />
Strip: up to 300x300 mm<br />
Panel: up to 410x410mm<br />
220-240 Volts AC<br />
Single phase, 50/60 Hz<br />
Microsoft® Windows®<br />
90-140 psi, 20 CFM<br />
Various configurations available<br />
for adapted performance and<br />
best speed/accuracy<br />
compromise. Sensors are<br />
interchangeable or capable with<br />
motorized zooming<br />
Large field-of-view, fast<br />
camera, and advanced data<br />
acquisition mechanism ensure<br />
higher UPH<br />
Bump height:
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