Open Reference Integration Notes (RIN) - Bluetooth

X-GOLD 

Next Generation Mobile Phone Baseband Products 

X-GOLD 223, X-GOLD 225 

GSM/GPRS and EDGE-RX Single Chip with Integrated RF Transceiver, Power Management 

Unit, Bluetooth 4.0, Stereo FM RDS Receiver and Transmitter 

PMB 8818, PMB 8819 

Bluetooth* 4.0 + High Speed 

802.11 PAL 

X-GOLD 223 V2.x, X-GOLD 225 V1.x 


XMM2230, XMM2250 

Application Note 

Bluetooth High Speed RIN 

Revision 1.0, 2012-10-01 

Intel Mobile Communications

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is subject to change without notice. Do not finalize a design with this information. 

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processor families. Go to: http://www.intel.com/products/processor%5Fnumber/. 

Code Names are only for use by Intel to identify products, platforms, programs, services, etc. (“products”) in development by Intel that have not been 

made commercially available to the public, i.e., announced, launched or shipped. They are never to be used as “commercial” names for products. Also, 

they are not intended to function as trademarks. 

SMARTI, SMARTi & Device, BlueMoon, Comneon, Comneon & Device, M-GOLD, S-GOLD, E-GOLD, A-GOLD, X-GOLD, XMM, X-PMU, XPOSYS are 

trademarks of Intel Mobile Communications GmbH and related companies. 

Copyright © 2012, Intel Corporation. All rights reserved. 

*Other names and brands may be claimed as the property of others. 

The template (Word) of this document has been formally released by DOC department (IMC-DOC@intel.com). 

Template data: IMC_Template.dot, 01-Feb-2012


PMB 8818, PMB 8819 

Revision History 

Page or Item Subjects (major changes since previous revision) 

Revision 1.0, 2012-10-01 

Initial version 

Template: IMC_Template_2011-03-02.dot


PMB 8818, PMB 8819 

Table of Contents 

Table of Contents 

Introduction ............................................................................................................................................... 7 

1 Product Type Declaration.......................................................................................................... 8 

2 Hardware Overview .................................................................................................................. 8 

3 Standard Operating Conditions ................................................................................................. 8 

4 Application ............................................................................................................................... 8 

5 Block Diagram........................................................................................................................... 9 

6 Hardware Features ................................................................................................................... 9 

7 Radio Modules.......................................................................................................................... 9 

8 Interfaces ............................................................................................................................... 10 

9 Application Requirements....................................................................................................... 10 

10 Pin Description ....................................................................................................................... 10 

11 Bill of Material........................................................................................................................ 11 

12 Contact Information................................................................................................................ 11 

Application Note 4 Revision 1.0, 2012-10-01 

Bluetooth High Speed RIN


PMB 8818, PMB 8819 

List of Figures 

List of Figures 

Figure 1 Block Diagram of Bluetooth High Speed in XMM2230 .....................................................................9 




PMB 8818, PMB 8819 

List of Tables 

List of Tables 

Table 1 Design RIN Information........................................................................................................................7 

Table 2 Operating Range ..................................................................................................................................8 

Table 3 Pin Description for Bluetooth Block...................................................................................................10 




PMB 8818, PMB 8819 

Product Type Declaration 

Introduction 

This document forms the Reference Integration Note for the 802.11 PAL implementation in X-GOLD 223, a 

GSM/GPRS and EDGE-RX Single Chip with Integrated RF Transceiver, Power Management Unit, Stereo FM 

RDS Receiver and Transmitter. Anyone interested in designing a mobile phone with this component should read 

this guide. 

The 802.11PAL implementation is part of the SYNERGY stack 18.2.4 from Cambridge Silicon radio (CSR). 

Table 1 

Design RIN Information 

Product Name: X-GOLD 223, X-GOLD 225 

Bluetooth Qualified 

Design ID (QD ID): 

Bluetooth Product Type: 

B020098 

Component (only 802.11 PAL) 

Design Model number: PMB8818, PMB 8819 

Hardware Version: PMB 8818 2.3, PMB 8819 1.0 

Software Version: 18.2.4 

This guide is targeted to help a Bluetooth Member or their BQE understand the role of the Bluetooth Transceiver 

in X-GOLD 223 in a complete mobile phone. The Bluetooth Program Reference Document requires that all 

Bluetooth Components have a Reference Integration Note (RIN) as a pre-requisite for qualification. This RIN 

has been uploaded to the Bluetooth SIG Qualification Listing Interfaces for the Qualified Design ID B020098 

prior to qualification of this design and is available for Member use for their product implementation. 

Additionally refer to the Bluetooth Design Guide for X-GOLD 223 which provides more detailed information 

and which is available under NDA. 

The 802.11 PAL in X-GOLD 225 is identical to the one in X-GOLD 223. This document applies to both devices 

accordingly. The differences between both products concern other functions of the mobile phone. 




PMB 8818, PMB 8819 

Product Type Declaration 

1 Product Type Declaration 

This product is listed as Bluetooth Component Product. If you use this product to implement Bluetooth in your 

mobile phone, further qualification and listing is required in accordance with the Bluetooth Qualification Process 

(ref. PRD 2.0). To start the process for a new qualification, please visit https://bluetooth.org/TPG/. 

2 Hardware Overview 

X-GOLD TM 223 (PMB8818) is a GSM/GPRS and EDGE-RX Single Chip with Integrated RF Transceiver, Power 

Management Unit, Stereo FM RDS Receiver and Transmitter and embedded Bluetooth 4.0 controller. 

Intel’s mobile phone platform XMM2230 is using X-GOLD 223 together with the 802.11AMP CSR 6030 

and the SYNERGY stack from CSR to implement Bluetooth4.0+High Speed. 

3 Standard Operating Conditions 

Table 2 

Operating Range 

Parameter Symbol Min. Typ. Max. Unit 

Case temperature TC -25 - 85 °C 

Supply voltage on 

pins connected to 

battery under bias 

VBAT 3.05 - 5.1 V 

4 Application 

X-GOLD 223 is a GSM, GPRS and EDGE-RX (EDGE-TX with external TX transceiver) baseband 

controller. It has an integrated RF transceiver, Power Management Unit, Audio Front-End, Bluetooth 

and a FM Radio RX/TX with RDS. In addition to the modem functionality, X-GOLD 223 provides a 

rich set of multimedia extensions to enable todays and future Entry Phone applications. It is designed 

as a single chip solution, to meet the ever increasing demands of the GSM, GPRS and EDGE cellular 

subscriber market for Entry Phone and Ultra Low Cost terminals. 

A mobile phone reference design is available under the platform name XMM2231. 




PMB 8818, PMB 8819 

Block Diagram 

5 Block Diagram 

The following figure shows a block diagram of the Bluetooth High Speed Implementation in the XMM2230 

mobile phone platform: 

A Bluetooth 4.0+High Speed End Product Listing of a mobile phone with XMM 2230 will use the following 

elements: 

1. SYNERGY stack 18.2.x from CSR (QDID B018638) running on the main CPU of the X-GOLD 223 

2. The 802.11 PAL QDL for which this RIN was created (B020098) 

3. The integrated Bluetooth 4.0 controller in X-GOLD 223 (QDID B018991) 

4. The 802.11 AMP device CSR 6030 WiFi certification ID WFA16381 

Figure 1 

Block Diagram of Bluetooth High Speed in XMM2230 

6 Hardware Features 

For X-GOLD 223 

Technology: 

− SoC, Monolithic, 65 nm CMOS 

Package: 

− LF2BGA, 10 x 10 x 1.0 mm 

− 0.5 mm pitch 

− 235 placable balls 

− Low cost PCB technologies targeted 

7 Radio Modules 

For X-GOLD 223 

− GSM, GPRS and EDGE-RX (EDGE-TX with external TX transceiver) baseband controller 

− Integrated Bluetooth 4.0 controller (incl. LE) 

− FM Radio RX/TX with RDS 




PMB 8818, PMB 8819 

Interfaces 

8 Interfaces 

− 3-wire WLAN coexistence with Packet Type Arbitration 

− Virtual UART for HCI to internal Host, parallel interface for higher throughput 

(Can be routed to external UART for qualification and test) 

− I2S interface to internal Audio block 

(Can be routed to external I2S/PCM interface for test purposes) 

9 Application Requirements 

Bluetooth High Speed requirements: 

The implementation of Bluetooth High Speed in the mobile phone requires the use and licensing of the SW and 

HW elements of the platform described in chapter 5 Block Diagram. 

Bluetooth and WLAN share the same antenna through a BT/WLAN Front End Module. 

Bluetooth requirements: 

The Bluetooth host is implemented on the main CPU of X-GOLD 223. 

The host controls a WLAN device through an SPI interface. The WLAN coexistence interface allows for antenna 

arbitration by the WLAN device. This enables the implementation of Bluetooth “High Speed” applications. 

The Bluetooth controller is a BR/EDR and LE dual mode device, which enables implementation of “Bluetooth 

smart” applications. 

The BT RF interface is a single ended 50 Ohm input/output port. The use of a band pass filter for the ISM band 

is recommended. 

An external antenna is required. The BT component has been qualified for an antenna gain up to 2.5 dB. 

For more detailed implementation requirements, including layout recommendations, please refer to the 

Bluetooth Design Guide for X-GLD 223. 

10 Pin Description 

The following table explains the pins of the Bluetooth block only. 

Table 3 Pin Description for Bluetooth Block 

Name Pad Type Description Ball 

Functional Mode 

BT_RFIO ANA BT antenna 

BT_RFIOX2 ANA GND BT RF clean 

BT_RFIOX ANA GND BT RF clean 

VDD_BT_RF SUP BT RF LDO 

VSS_BT_RF SUP GND BT RF clean 

VDD_BT_1V8RF SUP BT RF 1.8 V clean (from PMU) 

VDD_BT_1V8DIG SUP BT RF 1.8 V dirty (from PMU) 

VSS_BT_DIG SUP GND BT RF dirty 

Note that clocks and power supplies are taken from the clock generation unit and power management unit of the 

mobile phone controller. Details on the complete mobile phone system can be found in the data sheet which is 

available under NDA. 

Details on the 802.11 AMP and the FEM are available from CSR. 




PMB 8818, PMB 8819 

Bill of Material 

11 Bill of Material 

The 802.11 AMP is implemented by a CSR 6030 component. 

For the BT / WLAN Front-End Module, SE2602T can be used. 

The BT RF interface is a single ended 50 Ohm input/output port. 

The use of a band pass filter for the ISM band is recommended. 

12 Contact Information 

Information on Intel Bluetooth products can be found on the Internet page of Intel Mobile Communications: 

http://www.intel.com/products/wireless/mobilecommunications/bluetooth/browsebyprods.htm. 

This page provides links to find a local distributor or point of contact to Intel Mobile Communications.

Open Reference Integration Notes (RIN) - Bluetooth

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