kerf-free wafering - Avsusergroups.org

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Wafering: Multi-Wire SawingMeyer Burger DS 271 Wire Saw• Multiple parallel finesteel wires drawn acrossingot at high speed• SiC abrasive slurryentrained• Slowly abrades throughsiliconSource: Photon International©2011 Silicon Genesis Corporation. All rights reserved NCCAVS Joint User Group Meeting - On Photovoltaic Technologies
Limits of Wire-Saw Technology• Cost• Kerf-loss currently consumes > 50% of polysilicon• Silicon is turned into ‘sawdust’ mixed with abrasive slurry• Silicon recovery from slurry is costly, complex• Cost of wire, slurry and slurry production/recycle facility• Cost of ingot puller capacity to produce silicon lost to <strong>kerf</strong>• Cost of wafer washing and wet singulation• Wafer Thickness Reduction• Need thinner wafers & more efficient silicon usage• Sawing is a rough mechanical process• Obviously not well suited for micron scale layers of silicon• Industry encountering difficulty scaling down wire-sawn wafer thickness• Saw damage/micro-cracks increases probability of wafer breakage• Tradeoff: thinner = slower cutting speed• Thickness variation, wafer to wafer variability wafer binning• No roadmap to < 100 micron thicknesses©2011 Silicon Genesis Corporation. All rights reserved NCCAVS Joint User Group Meeting - On Photovoltaic Technologies
Page 1 and 2: KERF-FREE WAFERING: TECHNOLOGY OVER
Page 3 and 4: About Silicon Genesis• Founded in
Page 5: c-Si PV Value ChainPoly SiGluingIng
Page 9: Proton Range in Silicon• ‘Range
Page 12 and 13: PolyMax SEM & AFM ResultsX 5.00 μm
Page 14 and 15: Scalability to Thin WafersTV inTV o
Page 16 and 17: Brick Transport TraySilicon brickTr
Page 18 and 19: 2D Magnetically-Scanned Beam4x4 Bla
Page 20 and 21: PolyMax Manufacturing LayoutBRICK+P
Page 22 and 23: Effective Lifetime Recovery
Page 24 and 25: Cell Thickness and Cell Efficiency
Page 26 and 27: Controlled Initiation and Propagati
Page 28 and 29: Summary•Disruptive PolyMax waferi

kerf-free wafering - Avsusergroups.org

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