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Thermal SpecificationsTable 6-5.Intel ® Xeon ® Processor LC5528 Thermal SpecificationsCoreFrequencyThermal DesignPower(W)MinimumTCASE(°C)MaximumTCASE(°C)NotesLaunch to FMB 60 5 See Figure 6-3; Table 6-6 1, 2, 3, 4, 5Notes:1. These values are specified at V CC_MAX for all processor frequencies. Systems must be designed to ensurethe processor is not to be subjected to any static V CC and I CC combination wherein V CC exceeds V CC_MAX atspecified ICC. See the loadline specifications in the Datasheet.2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not themaximum power that the processor can dissipate. TDP is measured at maximum T CASE .3. These specifications are based on initial silicon characterization. These specifications may be furtherupdated as more characterization data becomes available.4. Power specifications are defined at all VIDs found in the Datasheet. The Intel ® Xeon ® processor C5500/C3500 series may be shipped under multiple VIDs for each frequency.5. FMB (Flexible Motherboard) guidelines provide a design target for meeting all planned processor frequencyrequirements.Figure 6-3.Intel ® Xeon ® Processor LC5528 Thermal ProfileNotes:1. Intel ® Xeon ® processor LC5528 Thermal Profile is representative of a volumetrically constrained platform.See Table 6-7 for discrete points that constitute the thermal profile.2. Implementation of Intel ® Xeon ® processor LC5528 nominal and short-term thermal profiles should resultin virtually no TCC activation. Furthermore, utilization of thermal solutions that do not meet this ThermalProfile will result in increased probability of TCC activation and may incur measurable performance loss.3. The Nominal Thermal Profile must be used for all normal operating conditions, or for products that do notrequire NEBS Level 3 compliance.4. The Short-Term Thermal Profile may only be used for short-term excursions to higher ambient operatingtemperatures, not to exceed 360 hours per year, as compliant with NEBS Level 3. Operation at the Short-Term Thermal Profile for durations exceeding 360 hours per year violate the processor thermalspecifications and may result in permanent damage to the processor.Intel ® Xeon ® Processor C5500/C3500 Series and LGA1366 SocketAugust 2010Thermal/Mechanical Design GuideOrder Number: 323107-002US 40