Sales Folder Adhesive Resins - Adhesives & Sealants by Evonik

Dynacoll® ACApplicationsDYNACOLL® AC grades are mainly used to modify reactive hot melts forflat lamination purposes.Typical areas of application are:• Sandwich compositesof aluminium, FRP panels, foam or wood-based substratese. g. for recreational vehicals• Honeycomb structurese.g. for door manufacturing• Foil laminated particleboarde.g. for furniture• Medium density fiberboard panelse.g. for furnitureFlat lamination applications require long open times to permit long handling timesneeded to bond huge panels or sandwich composites. On the other hand, initialstrength has to be very high to hold the bonded parts in place without any furthermechanical fixation.Preparation of Reactive Hot MeltsThese requirements can be fulfilled by reactive hot melts. Such moisture curinghot melt adhesives are typically prepared by reacting polymer mixture ofDYNACOLL® AC acrylics, DYNACOLL® 7000 polyester-polyols and polypropyleneglycols with excess diisocyanantes like MDI (Diphenylmethane diisoyanates) atelevated temperatures under exclusion of moisture.These reactive hot melts can be applied e.g. with roller coaters.39