GaAs-IR-Lumineszenzdiode GaAs Infrared Emitter LD 271, LD 271 ...
GaAs-IR-Lumineszenzdiode GaAs Infrared Emitter LD 271, LD 271 ...
GaAs-IR-Lumineszenzdiode GaAs Infrared Emitter LD 271, LD 271 ...
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<strong>GaAs</strong>-<strong>IR</strong>-<strong>Lumineszenzdiode</strong><strong>GaAs</strong> <strong>Infrared</strong> <strong>Emitter</strong><strong>LD</strong> <strong>271</strong>, <strong>LD</strong> <strong>271</strong> H<strong>LD</strong> <strong>271</strong> L, <strong>LD</strong> <strong>271</strong> HL2.54 mmspacing0.60.41.31.01.81.214.013.0Area not flat1.00.79.08.27.87.54.84.211.411.0ø5.1ø4.85.95.50.60.4Cathode Chip position GEX06239fex06628Approx. weight 0.5 gCathodespacing2.54mm1.81.20.40.62927Area not flatChip position0.40.89.08.27.87.54.84.2ø4.8ø5.15.95.50.60.4GEO06645Approx. weight 0.2 gMaße in mm, wenn nicht anders angegeben/Dimensions in mm, unless otherwise specified.Wesentliche Merkmale● <strong>GaAs</strong>-<strong>IR</strong>-LED, hergestellt imSchmelzepitaxieverfahren● Hohe Zuverlässigkeit● Hohe Impulsbelastbarkeit● Lange Anschlüsse● Gruppiert lieferbar● Gehäusegleich mit SFH 300, SFH 203Anwendungen● <strong>IR</strong>-Fernsteuerung von Fernseh- undRundfunkgeräten, Videorecordern,Lichtdimmern● Gerätefernsteuerungen● Lichtschranken für Gleich- undWechsellichtbetriebFeatures● <strong>GaAs</strong> infrared emitting diode, fabricated in aliquid phase epitaxy process● High reliability● High pulse handling capability● long leads● Available in groups● Same package as SFH 300, SFH 203Applications● <strong>IR</strong> remote control of hi-fi and TV-sets, videotape recorders, dimmers● Remote control of various equipment● PhotointerruptersSemiconductor Group 1 1997-11-01
<strong>LD</strong> <strong>271</strong>, <strong>LD</strong> <strong>271</strong> H<strong>LD</strong> <strong>271</strong> L, <strong>LD</strong> <strong>271</strong> HLTypTypeGrenzwerteMaximum RatingsBestellnummerOrdering CodeGehäusePackage<strong>LD</strong> <strong>271</strong> Q62703-Q148 5-mm-LED-Gehäuse (T 1 3 / 4 ), graugetöntes Epoxy-<strong>LD</strong> <strong>271</strong> LQ62703-Q833Gießharz, Lötspieße im 2.54-mm-Raster ( 1 / 10 ’’)5 mm LED package (T 1 3 / 4 ), grey colored epoxy resin<strong>LD</strong><strong>271</strong> HQ62703-Q256lens, solder tabs lead spacing 2.54 mm ( 1 / 10 ’’)<strong>LD</strong><strong>271</strong> HL Q62703-Q838BezeichnungDescriptionBetriebs- und LagertemperaturOperating and storage temperature rangeSperrschichttemperaturJunction temperatureSperrspannungReverse voltageDurchlaßstromForward currentStoßstrom, t p = 10 µs, D = 0Surge currentVerlustleistungPower dissipationWärmewiderstandThermal resistanceSymbolSymbolWertValueT op ; T stg – 55 ... + 100 °CT j100 °CV R5 VI F 130 mAI FSM 3.5 AEinheitUnitP tot 220 mWR thJA 330 K/WSemiconductor Group 2 1997-11-01
<strong>LD</strong> <strong>271</strong>, <strong>LD</strong> <strong>271</strong> H<strong>LD</strong> <strong>271</strong> L, <strong>LD</strong> <strong>271</strong> HLKennwerte (T A = 25 °C)CharacteristicsBezeichnungDescriptionWellenlänge der StrahlungWavelength at peak emissionI F = 100 mA, t p = 20 msSpektrale Bandbreite bei 50 % von I maxSpectral bandwidth at 50 % of I maxI F = 100 mAAbstrahlwinkelHalf angleAktive ChipflächeActive chip areaAbmessungen der aktive ChipflächeDimensions of the active chip areaAbstand Chipoberfläche bis LinsenscheitelDistance chip front to lens topSchaltzeiten, I e von 10 % auf 90 % und von90 % auf 10 %, bei I F = 100 mA, R L = 50 ΩSwitching times, I e from 10 % to 90 % andfrom 90 % to 10 %, I F = 100 mA, R L = 50 ΩKapazität, V R = 0 V, f = 1 MHzCapacitanceDurchlaßspannungForward voltageI F = 100 mA, t p = 20 msI F = 1 A, t p = 100 µsSperrstrom, V R = 5 VReverse currentGesamtstrahlungsflußTotal radiant fluxI F = 100 mA, t p = 20 msTemperaturkoeffizient von I e bzw. Φ e ,I F = 100 mATemperature coefficient of I e or Φ e ,I F = 100 mATemperaturkoeffizient von V F , I F = 100 mATemperature coefficient of V F , I F = 100 mATemperaturkoeffizient von λ, I F = 100 mATemperature coefficient of λ, I F = 100 mASymbolSymbolWertValueλ peak 950 nm∆λ 55 nmEinheitUnitϕ ± 25 Graddeg.A 0.25 mm 2L × B0.5 × 0.5 mmL × WH 4.0 ... 4.6 mmt r , t f 1 µsC o 40 pFV FV F1.30 (≤ 1.5)1.90 (≤ 2.5)VVI R 0.01 (≤ 1) µAΦ e 18 mWTC I – 0.55 %/KTC V – 1.5 mV/KTC λ 0.3 nm/KSemiconductor Group 3 1997-11-01
<strong>LD</strong> <strong>271</strong>, <strong>LD</strong> <strong>271</strong> H<strong>LD</strong> <strong>271</strong> L, <strong>LD</strong> <strong>271</strong> HLGruppierung der Strahlstärke I e in Achsrichtunggemessen bei einem Raumwinkel Ω = 0.01 srGrouping of radiant intensity I e in axial directionat a solid angle of Ω = 0.01 srBezeichnungDescriptionStrahlstärkeRadiant intensityI F = 100 mA, t p = 20 msI F = 1 A, t p = 100 µsSymbolSymbol<strong>LD</strong> <strong>271</strong><strong>LD</strong> <strong>271</strong> LI e15 (≥ 10)I e typ. 120WertValue<strong>LD</strong> <strong>271</strong> H<strong>LD</strong> <strong>271</strong> HLEinheitUnit> 16 mW/srmW/srRelative spectral emissionI rel = f (λ)100%OHRD1938<strong>IR</strong>adiant intensity eI e 100 mA = f (I F )Single pulse, t p = 20 µs210Ι eΙ e (100 mA)OHR01038Max. permissible forward currentI F = f (T A )ΙF200mAOHO00364Ι rel80160604011010 014012010080602040200880 920 960 1000 nm 1060λ-110-2 -110 10010 A 10 1ΙF00 20 40 60 80 C 100TASemiconductor Group 4 1997-11-01
<strong>LD</strong> <strong>271</strong>, <strong>LD</strong> <strong>271</strong> H<strong>LD</strong> <strong>271</strong> L, <strong>LD</strong> <strong>271</strong> HLForward currentI F = f (V F ), single pulse, t p = 20 µsΙ F110A010typ.max.OHR01041Permissible pulse handling capabilityI F = f (τ), T C = 25 °C,duty cycle D = parameter10 4mAΙ F510 30.050.10.2D = t pTt pD =0.0050.010.02TOHR00257Ι F-11050.5DC10 -211.5 2 2.5 3 3.5 4 V 4.5VF10 2 -4-310 -5 10 10 10 10 10 st-2-10P210Radiation characteristics I rel = f (ϕ)4030 20 1050ϕ01.00.8OHR01879600.6700.4800.29001001.00.80.60.40 20 40 60 80 100 120Semiconductor Group 5 1997-11-01