13.07.2015 Views

Flexible, Organic & Large Area Electronics FP7 Call 4 ... - RTD

Flexible, Organic & Large Area Electronics FP7 Call 4 ... - RTD

Flexible, Organic & Large Area Electronics FP7 Call 4 ... - RTD

SHOW MORE
SHOW LESS

You also want an ePaper? Increase the reach of your titles

YUMPU automatically turns print PDFs into web optimized ePapers that Google loves.

<strong>Call</strong> 1 & 2 Topicalcoveragefocus on large area electronics and OLEDs for flexible displays & lighting/signage(a):<strong>Organic</strong> & <strong>Large</strong> <strong>Area</strong> <strong>Electronics</strong>(b): Display Systems & VisualisationOLEDsBIND58 M€POLYNET (NoE)FACESSPRODI (CSA)OLATRONICS3PLASTPRIMEBITSPRINTBATOPERA (CSA)AEVIOMPOLYMAP (CSA)FLAMECOMBOLEDFAST2LIGHT (IP)OLED100 (IP)AMAZOLEDHYPOLEDIMVISMEMIHELIUM3DReal3DMAXIMUS20 M€Marc Boukerche – NCP meeting, Brussels 23 October 2008


<strong>FP7</strong> - FOLAE in Europe<strong>FP7</strong> represents a major step in <strong>Flexible</strong>, <strong>Organic</strong> and <strong>Large</strong> <strong>Area</strong><strong>Electronics</strong>, building on previous effortsStatus After <strong>FP7</strong> <strong>Call</strong> 1&2• Substantial efforts have been launched in OLEDs, printing, encapsulation,heterogenous integration, and community and R&D structuring activities. <strong>Call</strong> 4 is aunique opportunity to gather momentum• Some remarks on coverage till now: More effort are needed on pure electronic functionalities like logic, memory, RF,and compatible energy storage. Not yet covered: Power Transistors, CMOS, Bipolar.New process-tolerant device concepts are needed Thin film transistor performance is limited by materials and minimum feature size.To break the performance brickwall, consolidated R&D efforts in the EU amongmaterial scientists, device makers and process engineers are required The distinction between organic/inorganic is becoming irrelevant (except forOLEDs). What matters is efficient large-area in-line processes like solution and lowtemperature processing on flexible substrates implementing the best combinationsMarc Boukerche – NCP meeting, Brussels 23 October 2008


Time table (call 4)<strong>Flexible</strong>, <strong>Organic</strong> and <strong>Large</strong> <strong>Area</strong> <strong>Electronics</strong> (FOLAE)19 Nov ‘08 1 April ‘09 11 May ‘096 July ‘09Publicationof the callSubmissiondeadlineEvaluationstartsInvitation tonegotiateMarc Boukerche – NCP meeting, Brussels 23 October 2008


<strong>Call</strong> 4 Objective ICT-2009.3.3:“<strong>Flexible</strong>, <strong>Organic</strong> and <strong>Large</strong> <strong>Area</strong> <strong>Electronics</strong>”(a) Devices and building blocksR&D(b) <strong>Flexible</strong> or foil-based systemsR&D(c) Networks of Excellence(d) Support measuresR&D coordinationNon R&DMarc Boukerche – NCP meeting, Brussels 23 October 2008


(a) Devices and building blocks• Device concepts / manufacturingMaterials / Devices (organics/inorganics)<strong>Large</strong>-area in-line processes, manufacturingNew architectures, tolerant design• Building blocks / solid-state integrationD&A circuits,CMOSPower convertersEnergy scavengersEnergy storageMemoriesSensorsActive RFVisual interfaceMarc Boukerche – NCP meeting, Brussels 23 October 2008


(b) <strong>Flexible</strong> or foil-based systems• Integration in foils / heterogenous integration- <strong>Flexible</strong> / Stretchable substrates, textile.- Interconnects with discrete devices, functional foil lamination• systems applications- e-paper, e-card- OLED/PV based systems- Signage- Chemical/physical/bio sensors- Energy storage- Transparent electronicsMarc Boukerche – NCP meeting, Brussels 23 October 2008


(c) Networks of Excellence(d) Support measures(c) Networks of Excellence:- Structuring and integrating of the research capacities- Training and education- Coordination of R&D,- Link between R&D institutions’ activities and Industrial needs- Standardisation(d) Support measures- Promoting international collaboration- Coordination of national, regional and EU-wide R&D programmes- Access to prototyping and design competences- Training and education for SMEsMarc Boukerche – NCP meeting, Brussels 23 October 2008


Budget and “Instruments”Budget“Instrument”54.5 M€(a) Devices and building blocks(b) <strong>Flexible</strong> or foil-based systemsIP or STREP4 M€1.5 M€(c) Networks of Excellence(d) Support measuresNoECSAMarc Boukerche – NCP meeting, Brussels 23 October 2008


<strong>Call</strong> 4 Objective ICT-2009.3.8 a):“<strong>Organic</strong> Photonics – Disruptive PhotonicTechnologies”It includes:• OLEDs and lasers for lighting, illumination,projection, displays• <strong>Organic</strong> photovoltaicsMarc Boukerche – NCP meeting, Brussels 23 October 2008


More information ?• European research on the web:http://cordis.europa.eu/fp7/home_en.htmlhttp://ec.europa.eu/comm/research/future/• Information Society and Media:http://cordis.europa.eu/fp7/ict/programme/home_en.html• Directorate G:http://cordis.europa.eu/fp7/ict/programme/challenge3_en.html• Challenge ICT-2007.3.2:<strong>Organic</strong> and large-area electronics, visualisation & display systems :http://cordis.europa.eu/fp7/ict/organic-elec-visual-display/home_en.html• Contact: marc.boukerche@ec.europa.euthomas.reibe@ec.europa.euraquel.lopez-lozano@ec.europa.eupedro.pires@ec.europa.euMarc Boukerche – NCP meeting, Brussels 23 October 2008

Hooray! Your file is uploaded and ready to be published.

Saved successfully!

Ooh no, something went wrong!