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PERFECT MARKS – SHARP CUTS - Rofin

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<strong>PERFECT</strong> <strong>MARKS</strong> <strong>–</strong> <strong>SHARP</strong> <strong>CUTS</strong><br />

■ SEMICONDUCTOR INDUSTRY ■ LASER ■ ROFIN<br />

WE THINK L ASER


Marking solutions for mobile devices<br />

High-precision semicon<br />

applications<br />

High-speed marking on<br />

different compounds<br />

High-quality isolation cut<br />

on TFT<br />

L = 36,125 µm<br />

Leading Laser Solutions for the<br />

Semiconductor Industry<br />

Comprehensive Laser Selection<br />

Backed by many years of experience in laser material processing, ROFIN<br />

offers you a comprehensive product line for the semiconductor industry. Our<br />

portfolio ranges from laser sources to turn-key solutions for micro and<br />

marking applications such as LED processing, IC and wafer marking,<br />

leadframe marking, TFT cutting and IC decapping. Available laser technologies<br />

reach from efficient fiber lasers, to compact end-pumped and transversally<br />

pumped lasers with different wavelengths, to disc lasers. Working closely<br />

with our customers and partners, we have established considerable expertise in<br />

customer-specific solutions.<br />

Worldwide Customer Service<br />

ROFIN's first-class laser systems feature the company's own laser technology<br />

designed for low maintenance, cost-efficient and reliable operation. Whatever<br />

you require, whether beam sources or high-precision all-in-one solutions,<br />

you will find it at ROFIN. With worldwide sales and service network and<br />

experienced R&D, ROFIN has optimum, single-source solutions for a variety<br />

of semicon applications.


PCB marking<br />

LED production processes Hybrid cutting of QFN<br />

LCD Panel<br />

Diffusor<br />

LED Backlight<br />

Wafer ID Marking<br />

Best Solutions for Well-Established and<br />

Upcoming Markets<br />

A Standard in Semiconductor Manufacturing<br />

Laser marking and laser material processing are well established in various<br />

application fields in the semiconductor industry. In wafer production lasers<br />

are used for traceability marking and scribing. High-speed laser marking on<br />

mold compounds, metal housings or wafer backsides is an essential final<br />

production step for any semiconductor device. Applications besides marking<br />

include cutting of leadframes and deflashing as well as processing of<br />

compound materials, such as hybrid cutting of QFN packages and separation<br />

of irregular shaped multimedia cards.<br />

Indispensable for Efficient Production of LCD Panels<br />

Whether only a few centimeters big or screen sizes of over 50 inches <strong>–</strong> hardly<br />

any electronic device can do without an LCD display these days. For the efficient<br />

production of TFT-LCD panels, rows and columns of the matrix are initially<br />

connected. In a later production step this connection must be cut with the laser<br />

<strong>–</strong> accurately and absolutely reliably but with high speed as well.<br />

Reliable High Speed Marking <strong>–</strong> LED Processing with Lasers<br />

LEDs are developing to one of the predominant light sources over the coming<br />

decades. Among the most promising application areas are the LED display<br />

backlight technology and high-power LEDs in the automotive and mobile phone<br />

industry. Laser marking is an essential step in manufacturing high-power<br />

LEDs as well as LEDs used for LCD panel backlighting. ROFIN's strengths are<br />

the real-time compensation of position tolerances which is indispensable for<br />

a reliable production process.


Laser marker / double head configuration<br />

End-pumped<br />

Laser Beam Source<br />

Fiber Laser Marker<br />

Disc Laser<br />

Field-Tested Technology,<br />

Ready for 24/7 Production<br />

Tried and Tested Laser Sources for Any Type of Application<br />

All ROFIN lasers feature compact design, low operational cost, high availability<br />

with low maintenance and easy integration with virtually any handling<br />

configuration. They use state-of-the-art laser technology, comprising diode<br />

end-pumped and side-pumped rod lasers as well as fiber and disc lasers<br />

and are available with different output powers. Depending on laser power,<br />

the systems are completely air-cooled or use air-to-water cooling. With<br />

wavelengths of 1064 nm, 532 nm and 355 nm, virtually any material used<br />

in semiconductor manufacturing such as mold compounds, silicon, epoxy,<br />

ceramics, etc. can be processed efficiently.<br />

Comprehensive Application Knowledge<br />

ROFIN offers a comprehensively equipped laser application lab. Customer<br />

applications and lab studies can be carried out with the assistance of<br />

experienced engineers. Practically all of ROFIN's marking systems are<br />

available for application trials. Based on characteristic application data, the<br />

material to be processed, the desired marking geometry and constraints of<br />

the process environment, ROFIN presents all possible laser concepts for<br />

consideration, with benefits and implications.


Waferlase ID 200<br />

IC marking LED marking<br />

Traceability<br />

marking of wafers<br />

Marking Applications<br />

IC Marking<br />

ROFIN's laser markers generate characters at sizes precisely in accordance<br />

with the user's requirements. They still ensure best quality even at very small<br />

character sizes. Line widths are selectable with controlled material penetration<br />

depths. Integrated circuit packages <strong>–</strong> mold compound, epoxy or ceramics <strong>–</strong><br />

can be processed with reliable and predictable results. For marking directly on<br />

silicon or PCB, the use of 532 nm lasers is essential. These dedicated solutions<br />

archive high contrast with excellent performance at small character heights.<br />

LED Marking<br />

Not only the automotive industry asks for complete traceability of every<br />

single high-power LED today. Fequency-doubled PowerLine lasers mark<br />

leadframes during the LED production process with minuscule 2D matrix<br />

codes. They also mark white ceramics used as substrate for LEDs, with very<br />

small character heights and line widths.<br />

Traceability Marking of Wafers<br />

Our Waferlase systems produce traceability markings on transparent, semitransparent<br />

and opaque wafer materials used for IC and high-power LED<br />

production. Two methods are used which differ in terms of process, depth<br />

and location of the mark. With the "hard" marking method, which produces<br />

durable marking even after a large number of etching and polishing steps,<br />

the dots have a depth of up to 90 micrometers and are created through<br />

material ablation. Debris-free marking, which is set for clean-room<br />

environments, is just 2.5 µm deep, and is achieved solely by melting of<br />

the silicon.


Cutting of µSD cards<br />

Package decapping<br />

Laser deflashing<br />

End-pumped laser marker<br />

Cutting Applications<br />

TFT Cutting<br />

The columns and rows of a TFT pixel matrix are activated using transparent<br />

indium tin oxide (ITO) conductive paths. For efficient production of TFT displays,<br />

a conductive connection must be established between the columns and rows<br />

of the matrix. In a later production step, the lasers will cut the ITO conductive<br />

paths with a fine line and at high speed.<br />

Separation of QFN Packages<br />

Separation of QFN packages is a challenge in the production process so far<br />

due to the need to cut a combination of soft and hard material. A new<br />

hybrid cutting technology, using the disc laser StarDisc and mechanical<br />

sawing, increases the production output significantly. The process is twice as<br />

fast and saw blade lifetime is quintupled.<br />

Cutting of Multimedia Cards<br />

Laser technology used for isolating of MMC cards is in particular beneficial<br />

in its environmental and cost aspects. Water jet cutting, commonly used for<br />

cutting compound plastic materials, requires substantial ecological efforts of<br />

purifiying cutting water which is polluted with abrasive particles.<br />

Deflashing<br />

Excess encapsulation material on unmolded surfaces can have serious<br />

negative impact on proper contacting or optimum thermal conduction. Laser<br />

deflashing systems use integrated pattern recognition to identify crucial<br />

areas and remove excess mold with a diode pumped solid state laser.<br />

Decapping<br />

Decapping is a precisely-controlled laser process which ablates layers of the<br />

molding compound and reveals the inner structures for failure analysis.<br />

Compared to chemical cauterizing or other procedures, the laser allows<br />

selective ablation of certain areas and removing of the compound<br />

underneath the wiring.


Specially designed<br />

Semicon objects software<br />

Semicon Software<br />

Functions<br />

Integration in Factory<br />

Control Systems<br />

Powerful and Simple to Use Software<br />

Easy Operation<br />

Each laser marker comes with a powerful, entirely customizable software<br />

package based on Windows XP. Text, logos or graphics can be created with<br />

drag-and-drop functions or imported from existing files. VisualLaserMarker<br />

(VLM) is a sophisticated "what you see is what you get" type software and<br />

offers the flexibility to be simple to use and yet powerful. VLM handles a wide<br />

variety of marking content e.g. matrix-codes, barcodes and serial numbers.<br />

Extremely small marks can be realized depending on the material. The software<br />

controls marking on flat and curved surfaces and even marking-on-the-fly<br />

applications. A built-in wizard provides a variety of templates and assists in<br />

setting up marking layout quickly. A preview function helps to check programming<br />

at a glance.<br />

Easy Integration<br />

VLM is able to fully integrate into any production software and is configured<br />

to handle all common communication protocols from (TCP/IP) to SEMI standards<br />

(SECS/GEM). VisualLaserMarker functions can be controlled through ActiveX<br />

technology giving the user full control of the entire laser process.<br />

Semicon Key Features<br />

■ Matrix Object (for easy setup of Tray and Strip models)<br />

■ JEDEC Tray and Leadframe database<br />

■ Device ID and BinCode Mapping<br />

■ 2D codes like datamatrix, QR code and various barcodes<br />

■ SECS-GEM /Remote Control<br />

■ XML Layout Import / Recipe Up & Download<br />

■ Autoteach Interface for Vision Inspection<br />

■ Status /Data Logging and Unit-Level-Tracking


© ROFIN-SINAR/SEMICON/09.10/E/0.5/V2.0/ROBI-ORTMANN/LUXARTSILK200<br />

Medical Device<br />

Technology<br />

Flexible Packaging<br />

SOLUTIONS FROM A SINGLE SOURCE<br />

■ WWW.ROFIN.COM<br />

WE THINK L ASER<br />

Semiconductor Jewelry<br />

Solar Power<br />

LASER MICRO<br />

ROFIN-BAASEL Lasertech<br />

GmbH & Co. KG<br />

Petersbrunner Str. 1b<br />

82319 Starnberg<br />

Phone +49(0)8151-776-0<br />

Fax: +49(0)8151-776-4159<br />

Email: sales@baasel.de<br />

LASER MACRO<br />

ROFIN-SINAR Laser GmbH<br />

Berzeliusstraße 87<br />

22113 Hamburg<br />

Phone:+49(0)40-733 63-0<br />

Fax: +49(0)40-733 63-4100<br />

Email: info@rofin-ham.de<br />

LASER MARKING<br />

ROFIN-SINAR Laser GmbH<br />

Dieselstraße 15<br />

85232 Bergkirchen/Günding<br />

Phone:+49(0)8131-704-0<br />

Fax: +49(0)8131-704-4100<br />

Email: info@rofin-muc.de<br />

A: Phone: +49-(0)8151-776-0<br />

E-mail: sales@baasel.de<br />

Benelux: Phone: +31-(0)78-69310-37<br />

E-mail: info@rofin-baasel.nl<br />

CDN: Phone: +1-905-607-0400<br />

E-mail: info-canada@rofin-inc.com<br />

CH: Phone: +41-(0)32--3221010<br />

E-mail: info@rofin-baasel.ch<br />

DK: Phone: +45-6317-1797<br />

E-mail: avnmaskin@avnmaskin.dk<br />

E: Phone: +34-948-324-600<br />

E-mail: info@rofin-es.com<br />

F: Phone: +33-(0)-1-6911-3636<br />

E-mail: info@rofin.fr<br />

FIN: Phone: +358-(0)20-769-9900<br />

E-mail: info@corelase.fi<br />

GB: Phone: +44-(0)-1327-701-100<br />

E-mail: info@rofin-baasel.co.uk<br />

I: Phone: +39-039-2729-1<br />

E-mail: info@rofin.it<br />

J: Phone: +81-(0)46-229-8655<br />

E-mail: info@rofin-baasel.co.jp<br />

PRC: Phone: +86-21-68552216<br />

E-mail: info@rofin-baasel.com.cn<br />

RC: Phone: +886-2-2790-1300<br />

E-mail: info@rofin-baasel.com.tw<br />

ROK: Phone: +82-(0)2837-1750<br />

E-mail: info@rofin-baasel.co.kr<br />

SGP: Phone: +65-6482-1091<br />

E-mail: reception@rofin-baasel.com.sg<br />

USA: Phone: +1-734-455-5400<br />

E-mail: info@rofin-inc.com

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