PERFECT MARKS – SHARP CUTS - Rofin
PERFECT MARKS – SHARP CUTS - Rofin
PERFECT MARKS – SHARP CUTS - Rofin
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<strong>PERFECT</strong> <strong>MARKS</strong> <strong>–</strong> <strong>SHARP</strong> <strong>CUTS</strong><br />
■ SEMICONDUCTOR INDUSTRY ■ LASER ■ ROFIN<br />
WE THINK L ASER
Marking solutions for mobile devices<br />
High-precision semicon<br />
applications<br />
High-speed marking on<br />
different compounds<br />
High-quality isolation cut<br />
on TFT<br />
L = 36,125 µm<br />
Leading Laser Solutions for the<br />
Semiconductor Industry<br />
Comprehensive Laser Selection<br />
Backed by many years of experience in laser material processing, ROFIN<br />
offers you a comprehensive product line for the semiconductor industry. Our<br />
portfolio ranges from laser sources to turn-key solutions for micro and<br />
marking applications such as LED processing, IC and wafer marking,<br />
leadframe marking, TFT cutting and IC decapping. Available laser technologies<br />
reach from efficient fiber lasers, to compact end-pumped and transversally<br />
pumped lasers with different wavelengths, to disc lasers. Working closely<br />
with our customers and partners, we have established considerable expertise in<br />
customer-specific solutions.<br />
Worldwide Customer Service<br />
ROFIN's first-class laser systems feature the company's own laser technology<br />
designed for low maintenance, cost-efficient and reliable operation. Whatever<br />
you require, whether beam sources or high-precision all-in-one solutions,<br />
you will find it at ROFIN. With worldwide sales and service network and<br />
experienced R&D, ROFIN has optimum, single-source solutions for a variety<br />
of semicon applications.
PCB marking<br />
LED production processes Hybrid cutting of QFN<br />
LCD Panel<br />
Diffusor<br />
LED Backlight<br />
Wafer ID Marking<br />
Best Solutions for Well-Established and<br />
Upcoming Markets<br />
A Standard in Semiconductor Manufacturing<br />
Laser marking and laser material processing are well established in various<br />
application fields in the semiconductor industry. In wafer production lasers<br />
are used for traceability marking and scribing. High-speed laser marking on<br />
mold compounds, metal housings or wafer backsides is an essential final<br />
production step for any semiconductor device. Applications besides marking<br />
include cutting of leadframes and deflashing as well as processing of<br />
compound materials, such as hybrid cutting of QFN packages and separation<br />
of irregular shaped multimedia cards.<br />
Indispensable for Efficient Production of LCD Panels<br />
Whether only a few centimeters big or screen sizes of over 50 inches <strong>–</strong> hardly<br />
any electronic device can do without an LCD display these days. For the efficient<br />
production of TFT-LCD panels, rows and columns of the matrix are initially<br />
connected. In a later production step this connection must be cut with the laser<br />
<strong>–</strong> accurately and absolutely reliably but with high speed as well.<br />
Reliable High Speed Marking <strong>–</strong> LED Processing with Lasers<br />
LEDs are developing to one of the predominant light sources over the coming<br />
decades. Among the most promising application areas are the LED display<br />
backlight technology and high-power LEDs in the automotive and mobile phone<br />
industry. Laser marking is an essential step in manufacturing high-power<br />
LEDs as well as LEDs used for LCD panel backlighting. ROFIN's strengths are<br />
the real-time compensation of position tolerances which is indispensable for<br />
a reliable production process.
Laser marker / double head configuration<br />
End-pumped<br />
Laser Beam Source<br />
Fiber Laser Marker<br />
Disc Laser<br />
Field-Tested Technology,<br />
Ready for 24/7 Production<br />
Tried and Tested Laser Sources for Any Type of Application<br />
All ROFIN lasers feature compact design, low operational cost, high availability<br />
with low maintenance and easy integration with virtually any handling<br />
configuration. They use state-of-the-art laser technology, comprising diode<br />
end-pumped and side-pumped rod lasers as well as fiber and disc lasers<br />
and are available with different output powers. Depending on laser power,<br />
the systems are completely air-cooled or use air-to-water cooling. With<br />
wavelengths of 1064 nm, 532 nm and 355 nm, virtually any material used<br />
in semiconductor manufacturing such as mold compounds, silicon, epoxy,<br />
ceramics, etc. can be processed efficiently.<br />
Comprehensive Application Knowledge<br />
ROFIN offers a comprehensively equipped laser application lab. Customer<br />
applications and lab studies can be carried out with the assistance of<br />
experienced engineers. Practically all of ROFIN's marking systems are<br />
available for application trials. Based on characteristic application data, the<br />
material to be processed, the desired marking geometry and constraints of<br />
the process environment, ROFIN presents all possible laser concepts for<br />
consideration, with benefits and implications.
Waferlase ID 200<br />
IC marking LED marking<br />
Traceability<br />
marking of wafers<br />
Marking Applications<br />
IC Marking<br />
ROFIN's laser markers generate characters at sizes precisely in accordance<br />
with the user's requirements. They still ensure best quality even at very small<br />
character sizes. Line widths are selectable with controlled material penetration<br />
depths. Integrated circuit packages <strong>–</strong> mold compound, epoxy or ceramics <strong>–</strong><br />
can be processed with reliable and predictable results. For marking directly on<br />
silicon or PCB, the use of 532 nm lasers is essential. These dedicated solutions<br />
archive high contrast with excellent performance at small character heights.<br />
LED Marking<br />
Not only the automotive industry asks for complete traceability of every<br />
single high-power LED today. Fequency-doubled PowerLine lasers mark<br />
leadframes during the LED production process with minuscule 2D matrix<br />
codes. They also mark white ceramics used as substrate for LEDs, with very<br />
small character heights and line widths.<br />
Traceability Marking of Wafers<br />
Our Waferlase systems produce traceability markings on transparent, semitransparent<br />
and opaque wafer materials used for IC and high-power LED<br />
production. Two methods are used which differ in terms of process, depth<br />
and location of the mark. With the "hard" marking method, which produces<br />
durable marking even after a large number of etching and polishing steps,<br />
the dots have a depth of up to 90 micrometers and are created through<br />
material ablation. Debris-free marking, which is set for clean-room<br />
environments, is just 2.5 µm deep, and is achieved solely by melting of<br />
the silicon.
Cutting of µSD cards<br />
Package decapping<br />
Laser deflashing<br />
End-pumped laser marker<br />
Cutting Applications<br />
TFT Cutting<br />
The columns and rows of a TFT pixel matrix are activated using transparent<br />
indium tin oxide (ITO) conductive paths. For efficient production of TFT displays,<br />
a conductive connection must be established between the columns and rows<br />
of the matrix. In a later production step, the lasers will cut the ITO conductive<br />
paths with a fine line and at high speed.<br />
Separation of QFN Packages<br />
Separation of QFN packages is a challenge in the production process so far<br />
due to the need to cut a combination of soft and hard material. A new<br />
hybrid cutting technology, using the disc laser StarDisc and mechanical<br />
sawing, increases the production output significantly. The process is twice as<br />
fast and saw blade lifetime is quintupled.<br />
Cutting of Multimedia Cards<br />
Laser technology used for isolating of MMC cards is in particular beneficial<br />
in its environmental and cost aspects. Water jet cutting, commonly used for<br />
cutting compound plastic materials, requires substantial ecological efforts of<br />
purifiying cutting water which is polluted with abrasive particles.<br />
Deflashing<br />
Excess encapsulation material on unmolded surfaces can have serious<br />
negative impact on proper contacting or optimum thermal conduction. Laser<br />
deflashing systems use integrated pattern recognition to identify crucial<br />
areas and remove excess mold with a diode pumped solid state laser.<br />
Decapping<br />
Decapping is a precisely-controlled laser process which ablates layers of the<br />
molding compound and reveals the inner structures for failure analysis.<br />
Compared to chemical cauterizing or other procedures, the laser allows<br />
selective ablation of certain areas and removing of the compound<br />
underneath the wiring.
Specially designed<br />
Semicon objects software<br />
Semicon Software<br />
Functions<br />
Integration in Factory<br />
Control Systems<br />
Powerful and Simple to Use Software<br />
Easy Operation<br />
Each laser marker comes with a powerful, entirely customizable software<br />
package based on Windows XP. Text, logos or graphics can be created with<br />
drag-and-drop functions or imported from existing files. VisualLaserMarker<br />
(VLM) is a sophisticated "what you see is what you get" type software and<br />
offers the flexibility to be simple to use and yet powerful. VLM handles a wide<br />
variety of marking content e.g. matrix-codes, barcodes and serial numbers.<br />
Extremely small marks can be realized depending on the material. The software<br />
controls marking on flat and curved surfaces and even marking-on-the-fly<br />
applications. A built-in wizard provides a variety of templates and assists in<br />
setting up marking layout quickly. A preview function helps to check programming<br />
at a glance.<br />
Easy Integration<br />
VLM is able to fully integrate into any production software and is configured<br />
to handle all common communication protocols from (TCP/IP) to SEMI standards<br />
(SECS/GEM). VisualLaserMarker functions can be controlled through ActiveX<br />
technology giving the user full control of the entire laser process.<br />
Semicon Key Features<br />
■ Matrix Object (for easy setup of Tray and Strip models)<br />
■ JEDEC Tray and Leadframe database<br />
■ Device ID and BinCode Mapping<br />
■ 2D codes like datamatrix, QR code and various barcodes<br />
■ SECS-GEM /Remote Control<br />
■ XML Layout Import / Recipe Up & Download<br />
■ Autoteach Interface for Vision Inspection<br />
■ Status /Data Logging and Unit-Level-Tracking
© ROFIN-SINAR/SEMICON/09.10/E/0.5/V2.0/ROBI-ORTMANN/LUXARTSILK200<br />
Medical Device<br />
Technology<br />
Flexible Packaging<br />
SOLUTIONS FROM A SINGLE SOURCE<br />
■ WWW.ROFIN.COM<br />
WE THINK L ASER<br />
Semiconductor Jewelry<br />
Solar Power<br />
LASER MICRO<br />
ROFIN-BAASEL Lasertech<br />
GmbH & Co. KG<br />
Petersbrunner Str. 1b<br />
82319 Starnberg<br />
Phone +49(0)8151-776-0<br />
Fax: +49(0)8151-776-4159<br />
Email: sales@baasel.de<br />
LASER MACRO<br />
ROFIN-SINAR Laser GmbH<br />
Berzeliusstraße 87<br />
22113 Hamburg<br />
Phone:+49(0)40-733 63-0<br />
Fax: +49(0)40-733 63-4100<br />
Email: info@rofin-ham.de<br />
LASER MARKING<br />
ROFIN-SINAR Laser GmbH<br />
Dieselstraße 15<br />
85232 Bergkirchen/Günding<br />
Phone:+49(0)8131-704-0<br />
Fax: +49(0)8131-704-4100<br />
Email: info@rofin-muc.de<br />
A: Phone: +49-(0)8151-776-0<br />
E-mail: sales@baasel.de<br />
Benelux: Phone: +31-(0)78-69310-37<br />
E-mail: info@rofin-baasel.nl<br />
CDN: Phone: +1-905-607-0400<br />
E-mail: info-canada@rofin-inc.com<br />
CH: Phone: +41-(0)32--3221010<br />
E-mail: info@rofin-baasel.ch<br />
DK: Phone: +45-6317-1797<br />
E-mail: avnmaskin@avnmaskin.dk<br />
E: Phone: +34-948-324-600<br />
E-mail: info@rofin-es.com<br />
F: Phone: +33-(0)-1-6911-3636<br />
E-mail: info@rofin.fr<br />
FIN: Phone: +358-(0)20-769-9900<br />
E-mail: info@corelase.fi<br />
GB: Phone: +44-(0)-1327-701-100<br />
E-mail: info@rofin-baasel.co.uk<br />
I: Phone: +39-039-2729-1<br />
E-mail: info@rofin.it<br />
J: Phone: +81-(0)46-229-8655<br />
E-mail: info@rofin-baasel.co.jp<br />
PRC: Phone: +86-21-68552216<br />
E-mail: info@rofin-baasel.com.cn<br />
RC: Phone: +886-2-2790-1300<br />
E-mail: info@rofin-baasel.com.tw<br />
ROK: Phone: +82-(0)2837-1750<br />
E-mail: info@rofin-baasel.co.kr<br />
SGP: Phone: +65-6482-1091<br />
E-mail: reception@rofin-baasel.com.sg<br />
USA: Phone: +1-734-455-5400<br />
E-mail: info@rofin-inc.com