Franz Bechtold - VIA electronic
Franz Bechtold - VIA electronic
Franz Bechtold - VIA electronic
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… Outlook on the Future of Cera mics and Cera mic Microsyste ms:<br />
Perspective : Integrated Opto<strong>electronic</strong>s on LTCC<br />
Pressure assisted sintering Material DuPont 951<br />
Cavities, postfire laser cut<br />
IMAPS/ACerS 2 nd International Conference on Ceramic Interconnect<br />
and Ceramic Microsystem Technologies, Denver, April 24 – 27, 2006<br />
<strong>Franz</strong> <strong>Bechtold</strong>, <strong>VIA</strong> <strong>electronic</strong> GmbH<br />
Blind holes, postfire laser drilled +-25µ<br />
Vias 90µm, position +-50µm<br />
Application: CSP for Si optical bench<br />
CMOS<br />
Window<br />
Blind hole<br />
CMOS Bumps CMOS UBM<br />
CSP Bumps
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