Franz Bechtold - VIA electronic
Franz Bechtold - VIA electronic
Franz Bechtold - VIA electronic
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… Outlook on the Future of Cera mics and Ceramic Microsyste ms:<br />
State of the art: Ceramic Technologies between PCB and Si<br />
Technical performance<br />
Life time<br />
Insulation resistivity<br />
High temperature resistivity<br />
Acceleration resistivity<br />
Thermal conductivity<br />
Electrical conductivity<br />
Integration density<br />
Integration of passive components<br />
Integration of fluidics<br />
Rf Stability<br />
µ-<strong>VIA</strong><br />
Technologie<br />
IMAPS/ACerS 2 nd International Conference on Ceramic Interconnect<br />
and Ceramic Microsystem Technologies, Denver, April 24 – 27, 2006<br />
<strong>Franz</strong> <strong>Bechtold</strong>, <strong>VIA</strong> <strong>electronic</strong> GmbH<br />
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Si<br />
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