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GBS smartWLI prime

High Lateral Resolution

High Lateral Resolution – Structured Wafer (ASIC) Scanning of an structured wafer / ASIC using an 100x objective • FOV 180 x 110 µm² point density 0.09 µm can be used to analyze the fine structures • wall seize app. 1 µm

Fast Scanning of larger Objects – Insert app. 15 x 15 mm Scanning of an insert using an 5x objective • 5 min measuring time • xy-table used for stitching • data quality suitable for roughness and form measurement

Focus on modern frontiers of matter wave optics and interferometry
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