EPP Europe P1.2019

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04 2019 www.epp-europe.eu<br />


Wolf Erdmann, IPTE<br />

Since we understand current<br />

trends, we can use them in<br />

different industry segments.<br />

COVER<br />

I 4.0 inspection<br />

for the industry<br />


Trade Shows + Events<br />

SMTconnect 2019<br />

PCB + Assembly<br />

Solder paste for SiP<br />

assembly<br />

Importance of drying in<br />

PCB cleaning<br />

Test + Quality Assurance<br />

THT component inspection<br />

in tight spaces


SMTconnect 2019<br />

As of this year, the well-established industry show, formerly<br />

known as SMT Hybrid Packaging, has received a new name,<br />

SMTconnect. It focuses on current challenges in the microelectronics<br />

industry and will for the first time target electronic<br />

manufacturing services, as well. The exhibition is set<br />

to take place in Nuremberg, Germany, from May 7–9, 2019.<br />

Stop by and visit our booth 4-140.<br />

A connected Smart Factory inspection<br />

Not all PCBA failures can be easily spotted, especially with increasing trends, including<br />

miniaturization, causing PCB density and complexity. Additional smart verification<br />

strategies should be added to AOI and AXI solutions, in order to increase production<br />

yield and reduce manufacturing costs.·To compensate for certain limitations, connecting<br />

an at-line X-ray system will create an additional high-end sensor.<br />

Combining brainpower and algorithms.<br />

Faster innovative line concept<br />

An EMS provider that is known for complex product designs has added<br />

an SMT production line, which consists of a stencil printer and three<br />

placement machines. This not only increased flexibility to their manufacturing,<br />

but also delivered high precision and reliability. Other benefits included<br />

simple programming capabilities with an easy user interface,<br />

high feeder capacity, as well as, an optimized printing quality.<br />

Meeting all needs for high-mix environment.<br />

Flexible and versatile dryers<br />

Complex electronic assemblies and connections are<br />

made reliable with innovative curing and drying processes.<br />

This is especially important for sensitive assemblies<br />

that are exposed to harsh environments. To<br />

increase quality, different drying systems can be<br />

used. For instance, a vertical system that requires<br />

minimum floor space, a meander system that enables<br />

long product dwell time, or a continuous dryer<br />

with a vertical looped transport system.<br />

Optimal drying and curing results.<br />

07. – 09.05.2019 | Hall 4 | Booth 111<br />

Ersa POWERFLOW-Series<br />

Best process reliability at highest<br />

throughput<br />

Cost-optimized wave soldering with<br />

near-time ROI<br />

Spray fluxer with intelligent spray pattern<br />

programming<br />

Modular preheating configuration for<br />

flexible and reproducible heat input<br />

Double solder module for different alloys<br />

Long-lasting cleanliness due to continuous<br />

process gas cleaning<br />

Intelligent nitrogen control guarantees<br />

optimized N2 consumption and cost<br />

efficiency<br />


with award-winning<br />

modern user interface<br />

Source: Carina Zarfelder<br />

Charlene Hesse<br />

Online Editor <strong>EPP</strong> E<br />

Ersa POWERFLOW N 2<br />

w w w . e r s a . c o m

Contents 04 2019<br />

<strong>Europe</strong>an Magazine for<br />

Production and Test in the<br />

Electronics Industry<br />

Cover<br />

Industry 4.0 for inspection<br />

Challenges with PCBA manufacturing include component warpage<br />

and HoP defects. AOI and AXI inspection solutions are used for<br />

these challenges, however this does not completely eliminate<br />

false failure calls. Which is why smart verification strategies<br />

should be implemented by using an at-line X-ray system that connects<br />

to a 3D AOI and AXI inspection in-line, becoming a smart<br />

verification tool.<br />

Added value of smart factory<br />

Source: ACC Electronix<br />

Source: Charlene Hesse<br />

06<br />

Making a strong educational push into the<br />

<strong>Europe</strong>an market to bring support in new areas.<br />

48<br />

Control with dual pot selective soldering machines allow<br />

for robust design and process repeatability.<br />

News + Highlights<br />

6 Removing siloed environments with IPC standards<br />

Increasing opportunities for <strong>Europe</strong><br />

10 Adapting towards the speed and trends of technology<br />

Interview with Managing Director of IPTE<br />

12 Industry 4.0 strategy for the Glass Factory<br />

All Circuits’ plan to a digital transformation<br />

14 Bringing a competent sales professional on board<br />

Koenen expands sales and customer divisions<br />

14 Expanding into the Irish market with partnership<br />

Super Dry Totech broadens reach for dry cabinets<br />

14 Central <strong>Europe</strong> distributor for global growth<br />

Speedprint enhances localized infrastructures<br />

15 25 years connected to air treatments<br />

Extraction. Filtration. Persistence<br />

16 Two reference guides for engineers<br />

Industry tips from experienced professionals<br />

17 Partnership for more control of reflow process<br />

Integration for connectivity and automation<br />

17 Manager for research and development<br />

Rehm appoints department head<br />

Source: F&S Bontec<br />

84<br />

Testing for quality assurance and simpler process<br />

optimization for thick wire bonds.<br />

Trade Shows + Events<br />

18 Undertaking challenges in microelectronics<br />

Creating lasting connections at SMTconnect<br />

20 The future of technology coming together<br />

Getting a first look at IPC Apex Expo 2019<br />

22 25 years of expertise in automation<br />

From engineers to one global partner (IPTE)<br />

24 The future of electronics is certain<br />

electronica 2018 exceeded all expectations<br />

26 LEDs in the electronic industry<br />

1. LED meets SMT forum<br />

27 Fast Forward 2019 platform for start-ups<br />

Bringing prototypes together at productronica<br />

27 2019 Innovation Awards at Apex<br />

Pushing boundaries of technology<br />

28 Shaping the future of stencil printing<br />

Christian Koenen Technology Day<br />

32 Hotbed for AIoT & IoT integration<br />

The future of electronics in Taiwan (Taitronics)<br />

4 <strong>EPP</strong> EUROPE April 2019

38<br />

Foto: Yxlon<br />

34 The digital age on all levels<br />

Fuji Innovation Days – All about Smart Factory<br />

PCB + Assembly Features<br />

44 EMS provider with innovative line concept<br />

Producing top quality with high precision (ASM)<br />

46 Product-Updates PCB + Assembly<br />

48 Quality with robust design and process repeatability<br />

Helping with continual path to improvement (Ersa)<br />

50 Solder paste attributes for SiP assembly<br />

Advantages of small form factor approach (Indium)<br />

55 Four steps to successfully clean PCBAs<br />

Tools and techniques for circuit drying (MicroCare)<br />

58 Product-Updates PCB + Assembly<br />

60 Process tracking and traceability across all lines<br />

Quality reflow and cost improvements (KIC)<br />

62 Product-Updates PCB + Assembly<br />

64 Providing turnkey sensors to increase market share<br />

Sensing the world’s needs (Essemtec)<br />

66 Product-Updates PCB + Assembly<br />

68 Offering flexible and versatile types of dryers<br />

Reliable protection for electronics (Rehm)<br />

72 Surface-mount line to fulfil emerging market demands<br />

Pick and place at the heart of production (Europlacer)<br />

74 Product-Updates PCB + Assembly<br />

76 Outlook on transparent resin choices and applications<br />

Encapsulation optimised for LEDs (Electrolube)<br />

79 Product-Updates PCB + Assembly<br />

IPTE is exhibiting at<br />

SMTconnect<br />

7 - 9 May 2019<br />

Hall 5<br />

Booth 434B<br />

Test + Quality Assurance Features<br />

82 Inspection system for THT component testing<br />

Timely fault detection in tight spaces (Göpel)<br />

84 Accelerated mechanical fatigue interconnect test<br />

Test for reliability of heavy wire bonds (F&S)<br />

87 Product-Updates Test + Quality Assurance<br />

Columns<br />

3 Editorial<br />

4 Contents<br />

90 Imprint/List of advertisers<br />

<strong>EPP</strong> EUROPE April 2019 5


Removing siloed environments<br />

with collective standards<br />

Sanjay Huprikar and Philippe<br />

Léonard discussed IPC’s efforts<br />

for this year and their influences<br />

in the <strong>Europe</strong>an industry, most<br />

specifically Eastern <strong>Europe</strong>.<br />

Source: Charlene Hesse<br />

Since 1957, IPC, an association representing the global electronics<br />

industry supply chain, has built a reputation of bringing the electronic<br />

industry together, by establishing opportunities for learning<br />

and networking. Not only do they provide standards for the industry,<br />

they also have experience with planning technical and certification<br />

programs, development courses, as well as competitions. As part of<br />

their efforts, they are responsible for the North American tradeshow,<br />

IPC Apex Expo. Every year, professionals, developers, and experts<br />

come together to discuss challenges and current trends.<br />

Throughout this year’s show, Sanjay Huprikar, Vice President,<br />

Solutions, and Philippe Léonard, <strong>Europe</strong> Director, spoke with<br />

Charlene Hesse, Online editor <strong>EPP</strong> <strong>Europe</strong>, about the efforts the<br />

company is making in 2019, current happenings with the tradeshow,<br />

as well as, their push into the <strong>Europe</strong>an market.<br />

Can you tell our readers about the company and<br />

the tradeshow Apex?<br />

Sanjay Huprikar: IPC Apex is not just a tradeshow, because we emphasize<br />

not only standards, which is already very present at this<br />

show, but also education, advocacy, in terms of global advocacy,<br />

and lastly solutions, where CFX is a great example.<br />

Philippe Léonard: What we should also not forget is the value of<br />

having a large portion of the industry coming together. People are<br />

happy to have a chance just to see each other, network, solve problems,<br />

deal with issues, and exchange ideas. This adds a lot of value<br />

especially at this scale, since everyone is in one location for a few<br />

days.<br />

Sanjay Huprikar: When most people ask what IPC is, the standard<br />

answer is our core competencies which is providing standards, educational<br />

opportunities, and certification programs. I like to answer<br />

differently in saying that our core competency is our ability to put<br />

people together to solve something. This is because of our uniqueness,<br />

we are a non-for-profit, global, industry driven, and member<br />

focused association. From a value standpoint, what we bring to the<br />

table every day is the ability to get people together.<br />

What was new and exciting at IPC Apex show this<br />

year?<br />

Sanjay Huprikar: It was a nice combination of bringing in new ideas<br />

into the mix of what we have historically been doing as well. If I had<br />

to rank order, the most exciting thing for this year was the CFX<br />

demo line. In under a year and a half, we went from the initial idea to<br />

the documentation. In general, if you think about standards, it<br />

usually takes about 3–5 years to develop and publish a standard.<br />

However, in this short time period, we got people to envision what a<br />

demo may look like, then established several demos at last year’s<br />

show, and this year we got an actual line running that processes a<br />

real board. It’s almost unheard of! The second important topic that<br />

occurred, again from an exciting point of view, is the fact that the<br />

hand soldering competition was back.<br />

Philippe Léonard: We had 13 certified winners. This means that each<br />

of these 13 people won a regional competition that took place all<br />

around the globe, including <strong>Europe</strong> and Asia. This is also exciting because<br />

it’s putting the knowledge and set of skills in the spotlight.<br />

6 <strong>EPP</strong> EUROPE April 2019

There are less and less people that are able to do this job, but here<br />

the certified winners are the experts. They have become sort of role<br />

models.<br />

Sanjay Huprikar: It’s a great story if you look at it from their perspective.<br />

Taking a skill, showing your region that you are the expert, and<br />

then being called to travel to be on an international stage, that’s exhilarating<br />

for them! But we love it because that’s the energy and excitement<br />

that we are trying to create for the industry.<br />

Philippe Léonard: It is also a great opportunity for the companies<br />

that send their operator here to show how skilled their employees<br />

are. Not only from an external perspective, but also internally to<br />

their own employees, they build momentum around this. Which<br />

shows that this is not just a marketing gimmick, but a useful tool.<br />

Sanjay Huprikar: Another exciting thing that occurred is that the<br />

CTO of Tesla delivered the keynote address. He has accomplished a<br />

lot, and yet at a very basic level, he explained their history, their<br />

story, and how they went about it. What they tried, what worked,<br />

what didn’t work, and it was inspiring.<br />

What has been the feedback for the IPC Connected<br />

Factory Exchange (CFX)?<br />

Sanjay Huprikar: Feedback has been great, to the point where the<br />

CFX standard passed the ballot stage and will soon be published. I<br />

think the demos that we did in 2017 were tremendous and brought<br />

us to this point of where the protocol is now realized so that data<br />

can be transferred from machine to machine, as boards are being<br />

processed. I think the other positive signal from this standard is that<br />

we collaborated with an organization called Hermes, which was at<br />

the time doing their own standard. Part of our mission is to collaborate<br />

with others to not have a duplication of effort, so it made more<br />

sense to work together.<br />

The Vice President,<br />

Solutions, Sanjay Huprikar,<br />

believes that<br />

standards are necessary<br />

for the industry,<br />

since there are unnecessary<br />

duplicate<br />

efforts happening<br />

throughout.<br />

With the year’s theme, ‘Technology’s future comes<br />

together’, is this significant for today’s market?<br />

Sanjay Huprikar: It speaks to what it is that we are trying to do. We<br />

are always looking for opportunities to bring innovation into our efforts,<br />

and what the industry has done. We are here to serve the industry,<br />

as well as, take cues from it. And that’s what a member<br />

driven organization should do. We’ve also been demonstrative<br />

about taking on initiatives, to help lead the industry in certain areas.<br />

Automotive is a good example of that as we have long participated<br />

in the creation of standards for aerospace military and defense. This<br />

helped the industry understand the potential pitfalls for not having<br />

standards and working in a siloed environment.<br />

Automotive has now transitioned, from mechanical parts to electronics.<br />

The studies that we’ve seen shows that by the year 2030,<br />

roughly 10 years from now, 50 % of the value of an automobile will<br />

be electronics. This includes safety, data, and parts in the electronics<br />

that need to withstand environmental rugged conditions. So<br />

as the shift has taken place, the need for reliability has increased<br />

tenfold. Since we played a role in helping aerospace figure that out,<br />

we think we’ve got the toolkit and experience to help the automotive<br />

industry. That’s what that technology statement means for us,<br />

innovating, working and taking cues from the industry, and not<br />

being shy to point out some things as well.<br />

IPC has recently made efforts to broaden their<br />

stance in the <strong>Europe</strong>an market. Has anything<br />

changed since this initiative?<br />

Philippe Léonard: A couple of things have changed actually. First,<br />

this effort resulted in significant presence of IPC everywhere in <strong>Europe</strong>,<br />

at a local and regional level. Over the past 5 years, it also resulted<br />

in significant increase in our membership. Which is one of<br />

our proxies to measure how the industry buys into what we do. It<br />

resulted as well in more activity development for <strong>Europe</strong>an<br />

members. We addressed new sectors and innovative initiatives. We<br />

also have more committees, including technical, standardization,<br />

and advocacy committees. All of this generates more engagement<br />

in the local industry. This is important to us because we want to do<br />

things that matter.<br />

We are doing more to bring opportunities to the industry, to learn,<br />

educate, train people, to network locally with people from the same<br />

local area, Germany, Italy, France, etc. As well as at a <strong>Europe</strong>an<br />

level, with people from all over gathering for a specific topic. Our<br />

plan for 2019 is to have 25+ <strong>Europe</strong>an events.<br />

Sanjay Huprikar: One of the themes for this year is also a strong<br />

push into Eastern <strong>Europe</strong>.<br />

Philippe Léonard: We are planning events in Hungary, Czech Republic,<br />

Poland, Romania.<br />

Sanjay Huprikar: The OEMs that are based in the western part of <strong>Europe</strong><br />

are moving their factories to Eastern <strong>Europe</strong> where the work<br />

force is. And this gives us a great opportunity to introduce our value<br />

proposition, especially the training and the education piece to that<br />

market.<br />

Philippe Léonard: It’s really the same story, we go where the industry<br />

is. We want to be close to the members and to the industry. We<br />

realized that a large portion of the manufacturing is there, so we<br />

also have to be more present there. Also in my opinion, many of our<br />

<strong>Europe</strong>an members take the standard as it is. But we want them to<br />

realize that they can also have a voice. They can be take part and revise,<br />

change, or adapt standards to their own needs. This is some-<br />

Source: Charlene Hesse<br />

<strong>EPP</strong> EUROPE April 2019 7


The <strong>Europe</strong> Director, Philippe<br />

Léonard, has been making a<br />

strong push for their presence<br />

in <strong>Europe</strong> by creating more<br />

technical and advocacy programs,<br />

at both a local and regional<br />

level.<br />

Source: Charlene Hesse<br />

thing that is very well routed in the US industry, but not yet in <strong>Europe</strong>.<br />

Are there any new initiatives planned for this year,<br />

especially in the <strong>Europe</strong>an market?<br />

Philippe Léonard: I would define our plans in two pillars. One pillar is<br />

exploring new territories, sectors, and areas where electronics is<br />

more present and where reliability is important. Our standards are<br />

made to do everything possible to avoid failures of the electronic<br />

system. There are now new areas in the industry where failure is<br />

not acceptable. An example of this would be in the automotive industry,<br />

more specifically autonomous vehicle or electric cars. We<br />

are also targeting a similar evolution that might take place, in the<br />

medical and e-Textile or smart wearable industries.<br />

Sanjay Huprikar: And I would say that over the last year and a half,<br />

we opened several doors. No one has slammed the door in our face<br />

yet!<br />

Philippe Léonard: Not yet.<br />

Sanjay Huprikar: I attribute that to people recognizing the credibility<br />

that we bring to the industry. The other piece of it is, people are recognizing<br />

that a siloed mentality is trouble. There are a lot of unnecessary<br />

duplicate efforts going on from company to company,<br />

and that’s starting to be recognized. For instance, we created a<br />

counsel last year called ITERC, the IPC Transportation Electronics<br />

Reliability Council. That was an important milestone for us because<br />

we were able to get large OEMs in the auto industry, Renault, Toyota,<br />

Volkswagen, and large tier-one suppliers, Continental and Bosch,<br />

to sit at the table together for an entire day. And talk about what we<br />

need to do in terms of circuit board standards for the future. Better<br />

to have the conversation now and come up with a plan on what the<br />

supply chain should be looking for. They bought into the idea that<br />

standardization in this area is important, making it more efficient<br />

and cost effective for their supply chain.<br />

Philippe Léonard: There are also some other things that we continue<br />

to push. For example, for the last 2 years, we’ve organized a conference<br />

on the wire harness, including cabling and connectors for the<br />

printed circuit board. And last but not least, we are looking at further<br />

developing and improving hand soldering competitions. We had a<br />

world championship at Apex, but there’s a program with 6 local regional<br />

qualification competitions in <strong>Europe</strong>.<br />

Sanjay Huprikar: And the 2019 World Championships will be held in<br />

Munich at productronica in November. So we’re excited to have it in<br />

<strong>Europe</strong> in 2019.<br />

Previously, locations for Apex were alternating between<br />

California and Nevada. Is there a reason for<br />

why this has changed?<br />

Sanjay Huprikar: We are a data driven organization and we take<br />

member input very seriously. We’ve done surveys on this, in terms<br />

of pros and cons of different venues and what the experience has<br />

been. And in general, it’s fair to say that most people find the experience<br />

in San Diego to be much better than Las Vegas. It was a combination<br />

of consistency of show and also making sure we had maximum<br />

participation in our standards development programs. So we<br />

made a decision in 2015 to stay the next 7 years in California. From<br />

2017–2025, we are in California. Now having said that, we will have<br />

to see what happens after 2025.<br />

The political stance of America has changed in the<br />

past few years. Has this affected the show and industry<br />

in any way?<br />

Sanjay Huprikar: I don’t know if that has made an impact on the<br />

show. There’s obviously been a shift that’s gone on over the last 2<br />

years, but what we are trying to do is recognize who we are. Historically,<br />

we’ve focused our advocacy efforts in the United States over<br />

the last 8–10 years, but IPC is a global association, representing the<br />

global electronics industry. So, we are beginning to show the value<br />

to our <strong>Europe</strong>an members in terms of our advocacy efforts, and well<br />

do more of that in Asia as well. There are issues that are local, there<br />

are issues that are global, both in advocacy and in standards. Our<br />

global team is looking at into those issues, all while listening to<br />

what our members are saying. We treat advocacy like we treat standards.<br />

We take the input of our members and develop programs to<br />

address their issues. That’s what we choose to focus on as an organization,<br />

what are issues are and how can we globally help from<br />

an advocacy standpoint.<br />

Thank you both for taking the time for this interview.<br />

www.ipc.org<br />

8 <strong>EPP</strong> EUROPE April 2019

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<strong>EPP</strong> EUROPE April 2019 9


Adapting towards the speed and<br />

trends of technology<br />

footprint enable us to be one of the key suppliers for electronic<br />

manufacturing and test, as well as turnkey solution provider to our<br />

customers.<br />

Wolf Erdmann discussed the company’s three business units, which includes test<br />

solutions, assembly technology, and systems.<br />

Founded in 1992, the Belgium company, IPTE Factory Automation,<br />

is now located worldwide, with offices throughout <strong>Europe</strong>, Americas,<br />

as well as Asia, with over 800 employees. With three main<br />

business units, the company focuses on the entire process, which<br />

includes systems, assembly, and test as the main points for a factory<br />

automation. Within this, quality, customer satisfaction, and ontime<br />

delivery are key factors that the company follows with a<br />

passion. Wolf Erdmann, Managing Director, spoke to Charlene<br />

Hesse, Online editor <strong>EPP</strong> <strong>Europe</strong>, about the company’s current<br />

stance in the market, as well as, their plans and aspirations. He<br />

emphasized how important it is for the company to build a rapport<br />

with customers to fully meet their requirements. This<br />

means to stay connected, not only throughout the process of the<br />

project, but afterwards as well. Current and future trends were also<br />

thoroughly discussed, which gave an insight to where the company<br />

stands and what they will be focusing on in the future.<br />

Mr. Erdmann, can you please introduce IPTE and<br />

explain key factors about the company?<br />

First, I would like to introduce our portfolio of products and competences,<br />

which is positioned within three main categories: Test solutions,<br />

assembly technology, and systems. In the field of test solutions,<br />

we are a key technology provider for customers test applications.<br />

Additionally, we include this competence in areas of other<br />

business units. Assembly technology is mainly based on customer<br />

specific projects, where we develop and provide complete turnkey<br />

solutions based on the request. The third business unit, systems, includes<br />

high tech standard processes for the electronic production,<br />

such as depaneling, high speed pressing, as well as flexible pressing<br />

applications. To round it up, we integrate the standard board<br />

handling equipment that is produced at the headquarters in Genk,<br />

together with our standard processes, such as laser marking, laser<br />

welding, just to mention a few. These competences and our global<br />

Source: Doris Jetter<br />

What are some of the company’s most recent projects?<br />

We recently finished off a big project for one of our key customers<br />

in the area of radar technology. On top of this, we are working with<br />

other customers on projects for the electrical test of batteries. A<br />

main driving factor besides the new technologies is the router business,<br />

where we have been able to win benchmarks on a global<br />

scale. Our state-of-the-art technology, which also includes solutions<br />

for Industry 4.0, is very successful and well accepted by our customers.<br />

Furthermore, we are driving internal improvement processes.<br />

These actions are targeting continuous improvements for<br />

efficiency, quality, and service to our customers. A good example is<br />

how we consolidated our three business units in one location here<br />

at IPTE Germany in Heroldsberg, in the region of Nuremberg. This<br />

offers us more flexibility in our daily operations, leading to optimized<br />

lead time to our customers.<br />

Being active in both <strong>Europe</strong>an and American markets,<br />

do you see any differences between the two?<br />

We have to say that on one hand each entity is acting independently.<br />

But on the operational side, we base our doing on sharing<br />

knowledge and capacity on a global scale. This offers us the opportunity<br />

to support our customers “local for local”, if this is requested.<br />

Each country is driven also by intercultural topics. Offering local support<br />

and on the other hand having the close internal network, we<br />

can work out the best solution for our customers wherever they are<br />

located.<br />

Customer service is important to IPTE, as you are<br />

available 24/7. Do you do this for all customers?<br />

Absolutely, we offer a hotline service to our customers. How we set<br />

He believes that with<br />

IPTE’s strong global<br />

presence, the company<br />

has a great overview<br />

of the important trends<br />

that are in each<br />

market.<br />

Source: Doris Jetter<br />

10 <strong>EPP</strong> EUROPE April 2019

up the service depends mainly on the location and the situation, to<br />

ensure the best possible support to our customers. For special machines,<br />

it does get a bit more complex to have the required knowledge<br />

at all locations. In such cases, we have service contracts with<br />

customers. Within these contracts, we define the best possible solution<br />

based on the requirements. It is not only important for us, but<br />

also for our clients, since they need to operate 24/7. A downtime on<br />

a production line or a machine is just not acceptable.<br />

He also explained<br />

the recent restructuring<br />

of IPTE Germany,<br />

in order to become<br />

even more efficient<br />

to best serve their<br />

customers.<br />

What is the company looking forward to in the<br />

next 3–5 years?<br />

In the last few months, we have finished the restructuring of IPTE<br />

Germany. Flexibility is driving our markets and due to this, it also<br />

needs to be reflected in our organization. The organization has been<br />

set up for further growth, as well as trends that are driving our business.<br />

Besides this, we are looking for the cooperation within the IPTE<br />

Group, to also ensure our global leadership in the future.<br />

Have trends, such as e-mobility, automation, Industry<br />

4.0, impacted the company?<br />

As pointed out already, it is definitely something our customers are<br />

requesting. On the other hand, we see it as a need in order to lead<br />

this industry. Our customers are as well very often market leaders.<br />

These trends are driving the market and offer a good opportunity to<br />

develop further.<br />

With the global presence, we are able to be involved in these trends<br />

in each location. Asia is key for e-mobility, as well as, they’ve set up<br />

the Chinese version of Industry 4.0 – China 2025. It is important to<br />

understand the trends on each end, analyze and lead them into our<br />

daily operations. We already offer products that include many functions,<br />

for example predictive maintenance, energy monitoring, selfteaching.<br />

E-Mobility is a very important topic to us, as the electronic,<br />

as well as, the battery are key for this business. Both include<br />

many processes and operations where the company offers products<br />

and complete solutions for the operation and test.<br />

In the future, I am personally convinced that the understanding of<br />

the trends and reflecting them in your business is key for a longterm<br />

success. Is it only Industry 4.0? I am not really sure since I<br />

have experienced a lot of different dynamics from the Asian market,<br />

including China 2025. But whatever it is, I would say it is already<br />

driving the technology today, as well as in the future.<br />

From left to right: Wolf Erdmann (Managing Director), Karl Schmaußer<br />

(Technical Managing Director), Rainer Krohmann (Sales Director).<br />

Source: Doris Jetter<br />

What trends do you see happening in the future,<br />

and how will it affect the industry?<br />

We already spoke about the key trends like Industry 4.0 and China<br />

2025. That also includes Big Data, for example. What can already be<br />

seen today, the key to our industry, is how you are able to handle<br />

the software. The proportion of software in our solutions and in the<br />

requests of our customers is constantly growing.<br />

Not only is the machine, service and support leading to decisions of<br />

our customer. The software solution, how fast we are able to integrate<br />

to other systems, MES for example, has also become a focus<br />

for our customers. Understanding this need, setting up the organization<br />

according to these requirements will affect our organizations<br />

at least as much as the recognition of good mechanical solutions.<br />

Are you following trends as a company? Can you<br />

see IPTE doing something more?<br />

As a company, we are part of setting these trends. But it’s also different,<br />

since some trends haven’t reached <strong>Europe</strong>, yet. For instance,<br />

if you look at electric vehicles, I would say there is much<br />

more that we can still do. IPTE is involved in projects for electric batteries.<br />

What is important though is since we are experts in the electronics,<br />

assembly, test, and manufacturing, these trends always<br />

come back to us. It’s directly affecting us and puts us in the middle<br />

of these trends. There are areas of these trends that we are still in<br />

the process of investigating, for example, how to be more prominent.<br />

This is something we definitely need to continue to look into,<br />

to best position ourselves for this future market.<br />

Not even 10 years ago, I was told that on average, a car has about<br />

90 electrical control units built into it, which included air bags, automatic<br />

windows, etc. Although I haven’t seen the latest statistics, if<br />

you add electric motors, automatic distance control or other state of<br />

the art functions on top of this, now a days, control units must have<br />

at least doubled. To sum it up, these trends are not only driving the<br />

automotive business sector. We are lucky to say that due to the fact<br />

that we understand these trends, we can use them in all different<br />

industry segments. We are working together with our customers on<br />

a global scale.<br />

Thank you very much Mr. Erdmann for taking the time for this interesting<br />

interview.<br />

www.ipte.com<br />

Source: Doris Jetter<br />

<strong>EPP</strong> EUROPE April 2019 11


First roadmap to a digital transformation<br />

Industry 4.0 strategy<br />

for “the Glass Factory”<br />

A digital revolution is under way that has changed lives in recent years. The development of the internet and smartphones<br />

has considerably changed the means of communication and the exchange of information. This revolution, which<br />

gradually and surreptitiously invades everyday life, is also taking place in industry. After the third industrial revolution<br />

marked by the automation of industrial processes, digitization is the fourth industrial revolution, also called Industry 4.0,<br />

heralding the age of data.<br />

Thomas Cocquempot, Chief Digital Officer, ALL Circuits<br />

The first axis of this roadmap was to provide the company with a<br />

common digital base, enabling the construction of a solid and sustainable<br />

digital transformation. This includes:<br />

• a common IT infrastructure,<br />

• new communication tools (video-conferencing, collaborative<br />

tools, digital telephony),<br />

• processes allowing more sharing between sites and facilitating innovation,<br />

• tools such as Digital Learning and Business Intelligence in all<br />

areas of the business,<br />

• a digital organization and resources for carrying out the projects.<br />

As the Chief Digital Officer for ALL Circuits, Thomas Cocquempot elaborates and<br />

implements digital strategies. He initiated the plan to digitally transform the<br />

company’s process.<br />

Technologies such as artificial intelligence (AI), augmented reality<br />

(AR) or collaborative robots (cobots) will change manufacturing<br />

in the factories of tomorrow. And it is an inevitable change. ALL Circuits<br />

did not stay idly by and watch this revolution, instead they<br />

chose to follow these trends with initiatives in each of its production<br />

sites. To accelerate this change and coordinate efforts on digital projects<br />

for all locations, the company chose to create a new role to<br />

manage the digital transformation and assigned Thomas Cocquempot<br />

to drive the initiative, after his eleven exciting years as the head<br />

of the Bayonne plant.<br />

The first digital roadmap<br />

His first mission was to make a diagnosis of the digital maturity of<br />

each site. This has allowed the identification of strengths and weaknesses<br />

in the integration of IT systems, the adoption of new digital<br />

technologies, and the maturity of the organization to accept and implement<br />

this transformation. It also made it possible to identify the<br />

achievements and projects of each of the sites. Based on this observation,<br />

a first digital roadmap, dubbed ‘Digit‘ALL’, was built to serve<br />

the company‘s strategy.<br />

Source: ALL Circuits<br />

The Glass Factory<br />

The company chose, as with all their initiatives, to put the customer<br />

at the center of the 2 nd axis entitled “the Glass Factory”.<br />

The idea was to push the principle of transparency to the extreme<br />

with each customer. Digital technology makes it possible to simplify<br />

and automate access or the exchange of information. “We are already<br />

exchanging digital data with our customers and suppliers via<br />

EDI (Electronic Data Interchange), but we have intensified this communication<br />

for logistical data (location of product in the factory, delivery<br />

forecasts, etc.), as well as for technical data (quality level, failure<br />

rate, productivity, etc.). This profound change in the relationship<br />

with our customers will drive us further towards excellence and reinforce<br />

the level of mutual trust, synonymous with sustainability in<br />

the relationship,” says Thomas Cocquempot.<br />

Digitizing the process<br />

The third axis concerned the continuation of digitization actions of<br />

their processes. Special attention was made to the pooling of solutions<br />

on all sites that work in order not to disperse the limited resources<br />

for development.<br />

To give some examples:<br />

• the deployment of I-pro solutions (real-time monitoring of the utilization<br />

rate of equipment) and Caper (digitization of production<br />

documentation),<br />

• the interconnection of equipment will continue and projects, such<br />

as digital QRQC (tool for solving field problems),<br />

• or remote maintenance (remote maintenance of production<br />

equipment) are being developed.<br />

“Particular attention has been made in recent years to the automation<br />

of production processes. This will, of course continue, but<br />

12 <strong>EPP</strong> EUROPE April 2019

Following Industry 4.0 trends, the company integrated digital technologies and<br />

automated their entire process in order to best serve their customers.<br />

Source: ALL Circuits<br />

The company increased digital communication with their customers to automate<br />

and easily exchange information.<br />

Source: ALL Circuits<br />

Industry 4.0 has allowed us to go further and accelerate the automation<br />

of indirect processes. It will support all sectors of the business,<br />

more specifically logistics, finance, trade, maintenance, industrialization,<br />

etc.,” he further concludes.<br />

Automation is key<br />

The 4 th axis of the roadmap deals with projects, such as the automation<br />

of goods receipt, the dematerialization of supplier invoices,<br />

and the development of a SMT line supervision tool to name just a<br />

few.<br />

The solutions brought by new digital technologies and the Industry<br />

4.0 are multiple and constantly evolving. This current revolution is a<br />

great opportunity to continue the quest for excellence to best serve<br />

customers‘ satisfaction. By catalyzing all the energy, creativity and<br />

ingenuity of the company‘s teams, the Digit‘ALL program has accelerated<br />

the digital transformation.<br />

www.allcircuits.com<br />

Musashi’s Innovative<br />

Technology for High Precision<br />

Micro-Dispensing<br />

Please contact us:<br />


Marcel-Breuer-Str. 15; 80807 Munich, Germany,<br />

Phone: +49(0) 89 32 19 96 - 06 E-mail: sales@musashi-engineering.de<br />

<strong>EPP</strong> EUROPE April 2019 13


Global sales director and director of customer service<br />

The Sales and Customer Service divisions<br />

will now be led by the Global Sales Director,<br />

as Torsten von Kamp takes on this role. Mr.<br />

Von Kamp will act as an interface between<br />

the Sales and Customer Service departments<br />

for SMD stencils and precision<br />

screens, to manage their increasingly crossdepartmental<br />

work in a more efficient and<br />

customer-focused way.<br />

Born in Coburg in 1973, he completed his degree<br />

in Business Administration at Friedrich<br />

Alexander University in Erlangen in 2003. He<br />

previously worked for Asteelflash in Bad<br />

Hersfeld, where he was responsible for key<br />

account management and business development,<br />

SRI Radio Systems in Kempten, again<br />

in key account management, and Siemens<br />

AG/Nokia, where he focused on supply chain<br />

management. His responsibilities at Christian<br />

Koenen include both sales (field sales) and<br />

customer service (in-house sales).<br />

“In Torsten von Kamp, we are bringing on<br />

board an exceptionally competent and experienced<br />

sales professional,” said Managing<br />

Director, Michael Brianda. “His many years of<br />

experience in the electronics industry, particularly<br />

in sales, purchasing and supply chain<br />

management, gives him an extremely good<br />

understanding of our international customers’<br />

requirements, making him an excellent<br />

addition to our leadership team.”<br />

SMTconnect, Booth 4A-316<br />

www.ck.de<br />

Torsten von Kamp is leading the Sales and<br />

Customer Service divisions.<br />

Source: Christian Koenen GmbH<br />

Ultra-low humidity dry cabinets with patented Zeolite technology<br />

Super Dry Totech has partnered<br />

with the distributor IPT for the Irish market.<br />

Super Dry Totech, manufacturer of storage<br />

and humidity control solutions, has announced<br />

an exciting partnership with Irish<br />

distributor IPT. They will be distributing the<br />

full range of dry cabinets and dry storage sol-<br />

Source: Super Dry Totech<br />

utions to the Irish market, strengthening<br />

their channel in Ireland.<br />

Super Dry Totech began nearly a decade ago<br />

as a distribution and technical support channel<br />

for ultra-low humidity dry cabinets with<br />

patented Zeolite technology. Rapid growth<br />

was fuelled by <strong>Europe</strong>an RoHS legislation<br />

that magnified the need to carefully control<br />

product failures caused by moisture sensitive<br />

devices (MSDs). Since then, the company<br />

has become an independent design<br />

and manufacturing organization serving global<br />

markets with MSD solutions.<br />

IPT is a technical distributor of equipment to<br />

the medical device and pharmaceutical<br />

manufacturing sectors, specialising in packaging<br />

equipment, packaging testing and inspection<br />

equipment, automation equipment,<br />

manufacturing equipment and serialisation<br />

equipment.<br />

Managing Director, Jack Daly, is pleased to<br />

partner with dry storage solutions manufacturer,<br />

a member of the Asys Group, “Having<br />

partnered with Asys for many years, we are<br />

delighted to grow our relationship and distribute<br />

the ultra-low humidity dry cabinets<br />

with patented Zeolite technology in Ireland.<br />

Managing Director, Jos Brehler, is excited to<br />

bring its dry cabinets to Ireland, “Our development<br />

efforts have produced new levels of<br />

drying performance as well as environmentally<br />

responsible, industry-leading solutions<br />

such as our XSD & XSDB series.”<br />

SMTconnect, Booth 4A-441<br />

www.superdry-totech.com<br />

Distributor for Mexico & Central <strong>Europe</strong><br />

Screen printing specialist, Speedprint Technology,<br />

has appointed Quiptech as its authorised<br />

distributor for the entire product range<br />

in Mexico and across most countries in Central<br />

and Eastern <strong>Europe</strong>. The agreement was<br />

sealed at the recent Apex expo in San Diego.<br />

For over 25 years, Quiptech has been a distributor<br />

of equipment and consumables in<br />

the electronics and medical device manufacturing<br />

sectors, with a geographical footprint<br />

that provides support in <strong>Europe</strong> and Mexico.<br />

Mark Brawley, President of Speedprint, sees<br />

this as a perfect fit for his company’s global<br />

growth plans.<br />

Source: Speedprint Technology<br />

“We are delighted to engage in this exciting<br />

new partnership,” says Brawley. “We are renowned<br />

for delivering the highest-quality<br />

products and award-winning premium support<br />

to customers across the globe. Quiptech’s<br />

industry expertise and service delivery<br />

parallel our own, while the organization’s<br />

unique geographical presence allows us to<br />

enhance our localized infrastructures to meet<br />

our global distribution needs.”<br />

The distributor will take on the product range<br />

and provide field support in Mexico, Central<br />

<strong>Europe</strong> and Eastern <strong>Europe</strong>.<br />

SMTconnect, Booth 4-251<br />

www.speedprint-tech.com<br />

Mark Brawley with members of the Quiptech<br />

team at the recent Apex Expo.<br />

14 <strong>EPP</strong> EUROPE April 2019

25 years connected to air treatment technologies<br />

What started on 25 January 1994 has developed<br />

into a true success story. On that date,<br />

Dr. Christian Jakschik founded the company,<br />

ULT Umwelt-Lufttechnik, which has successfully<br />

established its place into the market,<br />

and moreover, developed into a world-class<br />

vendor of air treatment technologies with<br />

more than 130 employees. In the early founding<br />

days, the company existed only formally –<br />

the first fume extraction systems were “designed<br />

in our flat and assembled in the garage”,<br />

tells Dr. Christian Jakschik. He has led<br />

the company through good times and hard<br />

times, always keeping his eyes towards to<br />

the vision to raise a small German start-up to<br />

an internationally successful enterprise. The<br />

current company status is a globally recognized<br />

provider of fume extraction and process<br />

air drying solutions proves that persistence<br />

and courage may lead to success.<br />

In 2004, ULT changed into a stock company.<br />

During that time, the team of employees developed<br />

and produced air treatment systems<br />

already at the current headquarters in Löbau/<br />

Germany. The headquarters has continued to<br />

grow: In 2018, additional production and office<br />

areas were taken into operation into<br />

what was now the sixth expansion step for<br />

the company. Dr. Christian Jakschik passed<br />

the baton of company management to his<br />

sons Stefan and Alexander in 2015, who<br />

forged their own goals and highlights.<br />

The company’s continuing success is based<br />

on several fundamentals: Turn-key and customized<br />

fume extraction solutions, systems<br />

for process air drying and conditioning, as<br />

well as, accessories, such as extraction arms<br />

and individual capturing solutions. Additionally,<br />

research and development are of special<br />

meaning within the company, demonstrated<br />

by close cooperation with universities, technical<br />

colleges and scientific institutes.<br />

“Our product range is that wide as to serve a<br />

variety of production methods in numerous<br />

industries and applications,” explains Dr. Stefan<br />

Jakschik, CEO. Today, they run a global<br />

sales and service network. Last year, the<br />

company opened a subsidiary in the US.<br />

Source: ULT AG<br />

Winner of the 2016 Saxony Business Award –<br />

Dr Christian Jakschik, Dr Stefan Jakschik and<br />

Alexander Jakschik (from left to right).<br />

“The founding of Wisconsin based ULT LLC<br />

has been a strategically important step for future<br />

success in one of the largest markets<br />

worldwide”, says Alexander Jakschik, CSO/<br />

CTO. “Extraction. Filtration. Persistence.” is<br />

their corporate slogan. “We see ourselves as<br />

partners of our customers”, say Dr. Stefan and<br />

Alexander Jakschik with one voice. This attitude<br />

underlines the company’s impressive<br />

success. Currently, several thousand systems<br />

are shipped each year – which is a rising trend.<br />

SMTconnect, Booth 5-214<br />

www.ult.de<br />

smtconnect<br />

07. – 09.05.2019<br />

Hall 4A, Booth 100<br />

Nuremberg<br />

Meticulous protective coating<br />

with Protecto!<br />

The use of protective coatings improves the quality<br />

and durability of your products. Our Protecto selective<br />

conformal coating system protects sensitive<br />

electronic assemblies from damage by corrosion or<br />

other environmental influences. The multifunctional<br />

lacquer applicator enables all standard protective<br />

lacquers to be precisely applied by dispensing,<br />

spraying, jet or curtain coating – with absolute precision<br />

and reliability! The system also is available as a<br />

production line design with lacquer dryer.<br />

ProtectoXP<br />

Coating<br />

www.rehm-group.com<br />

<strong>EPP</strong> EUROPE April 2019 15


Source: EMA Design Automation<br />

The hitchhiker‘s guide to PCB design book<br />

Now available in hardcopy, the eBook<br />

helps engineers to fully understand the<br />

design process of PCBs.<br />

EMA Design Automation, a provider of Electronic<br />

Design Automation (EDA) solutions,<br />

announced the availability of The Hitchhiker‘s<br />

Guide to PCB Design – a resource to empower<br />

engineers with the knowledge<br />

needed to understand the complexities of<br />

the PCB design process – in hardcopy.<br />

“We‘ve had a number of people request<br />

printed copies of the eBook, including educational<br />

institutions who want to use it as<br />

part of their classroom training,” said Manny<br />

Marcano, president and CEO. “The eBook<br />

was optimized to be read on electronic devices<br />

and has been extremely popular, and<br />

The book includes real actionable tips from industry professionals,<br />

detailed graphics, additional resources, and more.<br />

now by creating a printed version we are providing<br />

a professional piece of reference material<br />

that can be carried around and used<br />

anywhere.”<br />

The book is a play off the original Douglas<br />

Adams novel and offers a fun foray into the<br />

PCB design and manufacturing process. It<br />

takes the reader on the journey of Ian, a new<br />

EE getting his footing in PCB design. In his<br />

first project, he makes some major mistakes<br />

causing him to produce a design that cannot<br />

be manufactured. However, due to the input<br />

and advice of industry veterans, Ian is given a<br />

crash course on how to design a successful,<br />

Source: EMA Design Automation<br />

manufacturable board and assembly.<br />

With over 100 pages of actionable tips from<br />

experienced professionals and checklists, detailed<br />

graphics, and links to additional resources,<br />

engineers are provided with the<br />

knowledge needed for design success, no<br />

matter what CAD software they may use.<br />

It helps engineers learn how to identify and<br />

communicate effectively with key stakeholders,<br />

set up a successful design workflow,<br />

and avoid design missteps, including:<br />

• How to create a robust and manufacturable<br />

PCB layout beyond routing the rats<br />

• Who the project stakeholders are and why<br />

their involvement is essential<br />

• Why it‘s important to incorporate DFX (Design<br />

for Excellence) and all topics it covers<br />

• The need-to-know design best practices<br />

“I wish I had this book when I first started. I<br />

understood the tools, but in the end, I did not<br />

understand what I needed to do, in what<br />

order, or the proper flow. This book fills in the<br />

gaps, which I experienced at the start of my<br />

career,” said Theodor Iacob, schematic expert.<br />

The Hitchhiker‘s Guide to PCB Design is<br />

something every person interested in PCB<br />

design should have. The hardcover book is<br />

available via Amazon and Barnes and Noble.<br />

www.ema-eda.com<br />

PCB Jumpers and Spacers product guide<br />

TopLine announces the publishing of its PCB<br />

Jumpers and Spacers product guide 2019-A.<br />

Quick to navigate, comprehensive and well-illustrated,<br />

this easy-to-use guide of nearly 50<br />

pages is a complete reference tool for engineers<br />

seeking SMT-solderable PCB design solutions<br />

in Zero Ohm Jumpers, PCB Spacers,<br />

Space Fillers, and more. It is available online,<br />

in print, and as a downloadable PDF.<br />

“Find it Fast” quick-reference illustrated<br />

charts make finding different classifications<br />

of product a snap, for a range of product<br />

groups including PCB Spacers, Isolated<br />

Space Fillers, MELF Series PCB Jumpers,<br />

and more. Images and page references point<br />

the way to learning more, all completely and<br />

logically organized. The company’s Jumpers,<br />

Spacers and Space Fillers are SMT solderable<br />

just like regular components.<br />

The company has manufactured a wide<br />

range of Zero Ohm Jumpers, non-conductive<br />

spacers and PCB space fillers since 1989.<br />

Zero Ohm Jumpers conduct current above<br />

and around traces on the board. Jumpers can<br />

be used instead of regular components. They<br />

are available in a wide assortment of devices<br />

including SOD, SOT, QFN, QFP, and BGA.<br />

Custom configurations are available.<br />

Non-conductive Spacers are insulative and<br />

Source: TopLine<br />

The PCB Jumpers and Spacers product<br />

guide 2019-A is available online, in print,<br />

and as a downloadable PDF.<br />

prevent adjacent PC Boards from touching<br />

one other. They can also be used to prevent a<br />

heavy component from sagging. Spacers are<br />

SMT solderable.<br />

Space fillers are insulative and empty component<br />

packages that look like normal devices<br />

but solder to the PC board like normal components.<br />

They are electrically isolated without<br />

internal connects, and thus will not alter<br />

the current flow on the PCB. Use space fillers<br />

to cover an empty pad or spot on the<br />

PCB.<br />

Isolated Spacers and Space Fillers do not<br />

conduct current. They are electrically isolated<br />

and non-conductive. Jumpers, Spacers and<br />

Space Fillers are packaged like ordinary devices<br />

on tape and reel, in tubes or in trays.<br />

The product guide illustrations include schematics,<br />

package outlines with perspective<br />

views, PCB patterns, and more, including<br />

charts of the Part Numbering System(s).<br />

www.topline.tv<br />

16 <strong>EPP</strong> EUROPE April 2019

Data with MES i4.0 solution<br />

Manager for research and development<br />

KIC announces its partnership with iTAC Software<br />

AG. The integration of smart Reflow Process<br />

Inspection (RPI) data analytics into the<br />

iTAC.MES.Suite ensures process control and<br />

traceability of the thermal process in the oven,<br />

previously referred to as the “black box” machine<br />

in the production line. This partnership<br />

creates new customer value for the entire production<br />

line, by providing process transparency,<br />

traceability, consistent quality and reduced<br />

costs through a new level of connectivity and<br />

automation. With the connection to the RPI<br />

data analytics, real-time insight is provided<br />

into the reflow process to help factories run<br />

their production more effectively by reducing<br />

setup and changeover time, faster yield troubleshooting,<br />

and reduction in scrap and rework.<br />

“With KIC’s technology expertise, we have<br />

gained another market leader as a partner to<br />

more effectively assist our customers with<br />

implementation and offering future-proof solutions<br />

with high-added value,” said Peter Bollinger,<br />

CEO.<br />

KIC’s Global Products and Technologies Manager,<br />

Miles Moreau added, “Moving toward<br />

smart factory manufacturing requires that no<br />

area is skipped over, which has been the case<br />

for reflow in the past. Now, the highest level<br />

of equipment utilization, product quality, and<br />

profitability can be reached with the partnership,<br />

leveraging the best in MES solutions<br />

with smart oven technologies.”<br />

SMTconnect, Booth 4-230<br />

www.kicthermal.com, www.itacsoftware.com<br />

Since February 1, 2019, the research and development<br />

department at Rehm Thermal Systems,<br />

a manufacturer of thermal system solutions,<br />

has had a new manager: Dr. Paul<br />

Wild. He takes over as department head<br />

from Dr. Hans Bell, who has led the research<br />

and development department for nearly 20<br />

years and will retire in 2020. Dr. Wild has<br />

worked for the company since 2014.<br />

The previous deputy, Dr. Paul Wild, experienced<br />

and technologically well-versed, now<br />

takes over the management of the development<br />

department. „Over the last few years, I<br />

have been able to familiarize myself with<br />

many aspects of the R&D department and<br />

accumulate valuable experience. I quickly got<br />

involved in the existing development processes<br />

and worked with my scientific expertise<br />

to expand R&D,” he says. His predecessor’s<br />

three key pillars of research and development<br />

at the company will remain the<br />

focus for the future: Research projects with<br />

institutes and industrial project partners,<br />

technological cooperation with customers,<br />

but above all internal research and development<br />

projects.<br />

After nearly 20 years as head of the research<br />

and development department, Dr Hans Bell<br />

will continue to work in research and development<br />

until he retires in 2020, passing on<br />

his experience and know-how to assist the<br />

new manager in meeting challenges. „I have<br />

great confidence for the future, because the<br />

department is in very good hands,“ he says.<br />

“Paul Wild has a gift for talking with people,<br />

Dr. Paul Wild is now the new manager for the R&D<br />

department at Rehm.<br />

listening to them and leading creative conversations.”<br />

He has always felt comfortable „in<br />

and with the entire team,“ says Dr Bell. „It‘s<br />

a good relationship that is perfectly goaloriented.<br />

For that I’m very thankful.”<br />

To this day, Dr. Bell values the work with the<br />

customers and project partners of the company:<br />

„It is important to maintain a balance<br />

between our own development and technological<br />

know-how transfer in cooperation<br />

with partners.” There’s one thing that makes<br />

him prouder than any other: the integration<br />

of young people into the company. „Be it students<br />

or school pupils who completed internships<br />

or undertaking graduate study in development<br />

– many have stayed with Rehm to<br />

this day. It shows that the company has a<br />

really great appeal.”<br />

SMTconnect, Booth 4A-100<br />

www.rehm-group.com<br />

Source: Rehm Thermal Systems<br />

www.carat-conference.com<br />

19045 | werbersbuero.de | Photos: AdobeStock, sdecoret<br />

Find out more:<br />

www.carat-conference.com<br />

Discover and discuss exciting applications and<br />

future developments of x-ray technologies at the<br />

international conference CARAT.<br />

May 21 – 22, 2019 in Nuremberg<br />

Alternative Sources | Specialized Technologies<br />

<strong>EPP</strong> EUROPE April 2019 17<br />

Medical Applications | Non Destructive Testing


Source: Mesago Messe Frankfurt GmbH<br />

SMTconnect’s new name expresses the long-term connections that the show brings to the industry.<br />

Conveying the lasting connections<br />

Tackling the current challenges<br />

in microelectronics<br />

The well-established industry show, formerly known as SMT Hybrid Packaging, has received a new name.<br />

Starting in 2019, the event will be known as SMTconnect. The exhibition and Technology Days, set to take<br />

place at the Messe in Nuremberg, Germany, is scheduled from May 7–9, 2019.<br />

According to Mesago Messe Frankfurt GmbH, the name of any<br />

event is designed to immediately communicate the main subject,<br />

plus its unique features. At the same time, the needs of the<br />

community should be mirrored to maintain value over a longer period.<br />

When it comes to the former name of the show, these unique<br />

features include the bridges and connections built by the trade exhibition.<br />

Not only the connections between people and technology<br />

and the link between the varying technologies in the supply chain,<br />

but also the valuable networking that takes place between people<br />

attending the event. This event creates contacts and connections<br />

and, therefore, will be named SMTconnect.<br />

Creating more connections<br />

While the event’s name may have changed, the concepts and focus<br />

areas remain the same. The change of name expresses what makes<br />

the event unique: it fosters connections that are made to last. For<br />

the past 30 years, the event has done just that – the new name conveys<br />

the fact that the exhibition brings together the entire SMT<br />

community; this includes end-users, suppliers, service-providers<br />

and customers. With the goal of reaching new target groups and<br />

providing the community with even more opportunities to connect<br />

and master the challenges posed by the industry, SMTconnect will<br />

proactively address numerous topics. This will include the new staging<br />

of the electronic manufacturing services – in the special showcase<br />

area “EMS Park” as from 2019.<br />

Further elements of the event will also be adapted. The tagline has<br />

been updated to “Solutions for electronic assemblies and systems.”<br />

Additionally, changes have been made to the look of the event with<br />

new design language ensuring a fresher appearance.<br />

18 <strong>EPP</strong> EUROPE April 2019

Source: Doris Jetter<br />

The future packaging production line will also take place again this year, including<br />

guided tours to answer any questions regarding the line.<br />

Exciting events will occur this year, including the<br />

EMS Park and the hand soldering competition.<br />

Source: Doris Jetter<br />

As a solutions-oriented exhibition, the show<br />

seeks to bring the community together<br />

under one roof to tackle the current challenges<br />

in microelectronics. It also puts more<br />

of the focus on topics with development potential<br />

to facilitate valuable, applicationsbased<br />

connections among the right contacts<br />

in the industry. As of this year, it will also expand<br />

its coverage of electronic manufacturing<br />

services.<br />

“The event has been a constant on the market<br />

for 30 years,” commented Anthula Parashoudi,<br />

Vice President at Mesago. “With the<br />

further development of the name and look,<br />

as well as, the new staging of EMS, we do<br />

not only want to attract new target groups<br />

but also offer our existing exhibitors even<br />

more opportunities for high-caliber business<br />

relationships, as well as a solutions-oriented<br />

exchange.”<br />

Hundreds of people attend the show’s conference to learn about today’s<br />

most important topics in electronics production.<br />

Source: Mesago Messe Frankfurt GmbH<br />

Special events throughout<br />

The tradeshow offers a place for the expert community to gather<br />

and exchange ideas. It strives to be a meeting place for all the areas<br />

involved in microelectronic production, including electronic manufacturing<br />

services (EMS). In doing so, the exhibition and Technology<br />

Days focus on the following subjects: system development and production<br />

preparation; materials and components; processes and<br />

manufacturing; reliability and test; and software and production control.<br />

Along with Technology Days and special showcases, product presentations<br />

and forums will also take place. Reoccurring events will<br />

also be present, including the hand soldering competition, the future<br />

packaging production line, newcomer pavilion, and more. PCIM<br />

<strong>Europe</strong> will also run in parallel, which will have presentations, forums,<br />

and guided tours. These will all focus on a variety of topics, including<br />

power electronics for e-mobility, intelligent motion, reliability<br />

and robustness validation, renewable energy, and energy management.<br />

The event brings together people and technologies from the areas<br />

of development, production, services, and applications in connection<br />

with electronic assemblies and systems. Industries covered<br />

during the event include mechanical/apparatus engineering, telecommunications,<br />

medical technology, aerospace engineering, railway<br />

technology, measurement technology, industrial electronics,<br />

safety engineering, automotive electronics.<br />

www.smtconnect.com<br />

<strong>EPP</strong> EUROPE April 2019 19


IPC Apex Expo 2019<br />

The future of technology<br />

coming together<br />

With increasing board complexity, deciphering through large amounts of data, communication<br />

between machines, and the growing development of automatic processes, not only is the industry<br />

constantly changing, but it is also not easy to keep up with these evolving trends. IPC Apex Expo<br />

2019 made it possible to get a first look at what this year will bring.<br />

There were 440 exhibitors and 9,796 visitors at this year’s IPC Apex Expo.<br />

All branches of the industry gathered in San Diego, California, for<br />

a three-day event that was complete with workshops, professional<br />

development seminars, competitions, live tutorials, committee<br />

meetings, and networking opportunities. Special events also occurred,<br />

which made this year even more significant than the previous<br />

ones. The theme, “Technology’s future comes together”, was<br />

a perfect fit for the 440 exhibitors to display exclusive products, applications,<br />

and services. 5,292 attendees from 56 countries participated<br />

in what this show had to offer. This amounted to a total of<br />

9,796 visitors on the show floor, coming together to network and<br />

exchange ideas. The Chief Technical Officer of Tesla, JB Straubel,<br />

marked the opening of the show. As the keynote speaker, he discussed<br />

the story of the company, including their history, challenges<br />

that they faced, and their motives to become more innovative. He<br />

also highlighted planned initiatives for the future.<br />

The importance of education<br />

The show’s organizers have always emphasized education as a big<br />

part of this North American expo,<br />

believing that learning and training<br />

is key for the success of the<br />

future. Finding employees with<br />

the right skillset and correct education<br />

is getting more difficult.<br />

Therefore, numerous opportunities<br />

were given to the attendees,<br />

in order to gain information<br />

and acquire further knowledge<br />

on today’s most important<br />

topics. This year, visitors had access<br />

to 75 technical papers that<br />

were submitted, detailing research<br />

and developments for the<br />

challenges faced today. This included<br />

research on Industry 4.0,<br />

smart manufacturing, and miniaturization.<br />

Buzz sessions also<br />

took place, covering topics such<br />

as, the fourth industrial revolution,<br />

pb-free applications, warpage<br />

on SMT process, solder<br />

materials, and more. Professional development courses occurred<br />

that was targeted for all levels of experience and knowledge, as<br />

well as, a variety of subjects and best practices. This included, advanced<br />

rework, ionic residue testing, defect prevention, thermal<br />

management solutions, selective soldering, and much more.<br />

Source: Charlene Hesse<br />

Live production lines<br />

Last year’s virtual demo of the Connected Factory eXchange (CFX)<br />

standard was so successful that it was decided to put it into practice<br />

this year. As a collaboration between CFX and Hermes, two live<br />

production lines ran boards and manufactured assemblies, throughout<br />

the week. The first line contained the Hermes and CFX IoT<br />

messaging standards and the second line focused on assembly production.<br />

These comprised of the participation of several equipment,<br />

software, and manufacturing vendors and suppliers, including Aegis<br />

Software, ASM Assembly Systems, Asys, Cogiscan, Creative Electron,<br />

FlexLink, Fuji, Heller, Keysight, KIC, Koh Young, Kulicke & Soffa,<br />

Nutek, OK International, Pemtron, Saki, Test Research, Inc., and<br />

Vayo.<br />

These lines showed what the capabilities are for automated machine-to-machine<br />

communication and the value of a connected setting.<br />

With multiple demonstrations per day, visitors were able to<br />

20 <strong>EPP</strong> EUROPE April 2019

Source: Charlene Hesse<br />

The tradeshow accomplished the goal of their theme,<br />

which was "Technology’s future comes together".<br />

Source: Charlene Hesse<br />

A big highlight this year was the live production lines that followed the CFX and Hermes standards,<br />

where visitors could access real time data and information.<br />

Source: Charlene Hesse<br />

Source: Charlene Hesse<br />

The CFX demonstrations show the value in machine to machine communication.<br />

A live demonstration of the line which included different equipment<br />

and software vendors.<br />

see live data and information in real time. Different sized boards<br />

were used to emphasize the flexibility and simplicity of the standard.<br />

The standard was approved in the beginning of this year. “The<br />

demos that we did last year were tremendous. It has brought us to<br />

this point, where we can now do it for real and truly realize the<br />

protocol. The ability for data to be transferred from machine to machine<br />

as parts and boards are being processed is great,” says Sanjay<br />

Huprikar, Vice President, Solutions, IPC.<br />

Influential reoccurring events<br />

The world championship hand soldering and rework competition<br />

also took place. A total of 13 certified competitors from across the<br />

world, including France, China, Germany, India, Indonesia, Japan,<br />

competed in this year’s tournament. It was quite challenging, as<br />

competitors needed to remove specific components, as well as, old<br />

solder, then clean the area, and finally place new parts back on, all<br />

within 75 minutes. Out of a maximum of 634 points, they were<br />

judged by an expert, based on standardized regulations, best practices,<br />

and techniques. Functional tests were also completed at the<br />

end. After four sessions, the first-place winner was announced and<br />

received a perfect score as he did not make any mistakes, second<br />

place received 628 points, and the third place received 625 points.<br />

All exclaimed that the competition was harder than they would have<br />

thought.<br />

Another reoccurring event that took place was the Innovation<br />

awards, which acknowledged the efforts made by the innovators of<br />

today. Five winners had ingenious products or services that benefits<br />

the electronic manufacturing industry and its customers. The<br />

winning solutions included an automated and green fabrication facility<br />

(Greensource Fabrication LLC), an inkjet printed solder mask solution<br />

(Meyer Burger (Netherlands) BV), a manual X-ray inspection<br />

system (Nordson Dage), an underfill that can handle high operating<br />

temperatures (Henkel Corporation), and a 3D DFA/DFM solution<br />

(Vayo (Shanghai) Technology). These winners showed what the industry<br />

is capable of, and the direction the market is going.<br />

Every year, this tradeshow brings much more than just an exhibition<br />

of products and services. Technical experts, industry leaders, engineers,<br />

and others get together to discuss ideas and challenges, as<br />

well as, to find answers to their questions. Through forums, live<br />

demonstrations, and special events, it sets a certain tone for the<br />

year to come. In 2020, the Apex expo will take place on February<br />

4–6 at the San Diego Convention Center, with the theme “Elevate<br />

the excellence of electronics”. (ch)<br />

www.ipc.org<br />

<strong>EPP</strong> EUROPE April 2019 21


A handful of engineers made it to a globally performing partner<br />

Over 25 years of IPTE<br />

experts in automation<br />

IPTE, a major internationally present automation specialist with a strong focus on production systems for the electronics<br />

industry and special mechanics solutions, has now been in existence for over 25 years. As CCO Hubert Baren<br />

underlines the enterprise’s aim, “Our mission is to be the leading, independent, global factory automation partner to the<br />

electronics and mechanical manufacturing industry”. Now, also their well-managed Portuguese branch can celebrate<br />

its 15 years in business, and probably even more good news is to follow from them.<br />

Hubert Baren (left): “Our mission is to be the leading, independent, global<br />

factory automation partner to the electronics and mechanical manufacturing<br />

industry”. Freerk Macor (right): “From this company site, we can serve our <strong>Europe</strong>an<br />

customers in time, with high quality and a remarkable cost-benefit ratio.”<br />

Source: <strong>EPP</strong> <strong>Europe</strong><br />

More than ever, manufacturing companies are facing increasing<br />

requirements for lower cost, high-quality, high-reliability products<br />

and shorter delivery times to meet new and emerging market<br />

needs. “The drive to automation and the requirement to optimize<br />

production equipment means that our customers in order to meet<br />

the market demands have to to be flexible, agile and responsive to<br />

technology and technology changes”, Hubert Baren says. “We<br />

supply automated production equipment around the world for the<br />

manufacturing industry. In our portfolio, we have standard systems,<br />

custom-designed assembly systems, and turnkey test and automation<br />

solutions that ensure the manufacture of high-quality products,<br />

delivered on time and on budget.” IPTE’s investment in people<br />

and hardware is complemented with the design of new software<br />

solutions critical to the manufacturing industry, just as needed for<br />

the realization of novel Smart Factory/Industry 4.0 concepts.<br />

So have a look at the facts behind this remarkable market position<br />

of a middle-sized and worldwide acting enterprise in the field of<br />

automation, test and production engineering that started more than<br />

25 years ago from scratch. Founded by just five engineers in 1992,<br />

the company has grown continuously both organically and through<br />

merger and acquisitions. The IPTE group currently has a staff of approximately<br />

880 employees, more than 40 % of them give their best<br />

in design and application. All in all, they generated sales of around<br />

127 million euros in 2018. According to Hubert Baren, the company<br />

continues to operate successfully at a high level as production automation<br />

is regarded as being a helpful and sensible solution in many<br />

industries, so a further moderate increase in sales can be expected<br />

for the year 2019.<br />

Full range of automation gear<br />

For example, the successfully operating branch in Portugal, based in<br />

Ovar near Porto, has now been in existence for 15 years. Under the<br />

leadership of Freerk Macor, they began with a very small team, typical<br />

for IPTE, but have ever since grown continuously. And in their<br />

fourth expansion stage, they have now reached the limits of growth<br />

on the existing site. This year, the branch will generate a turnover of<br />

14 million euros with about 100 employees. As Freerk Macor explains,<br />

”Our employees here design and manufacture customized<br />

machines and projects as well as turnkey solutions for the mechanical<br />

and electrical industries for all of clients worldwide. From this<br />

company site, we can serve them easily in time, with high quality<br />

and a remarkable cost-benefit ratio. With our efficient solutions, we<br />

can offer the full range of manufacturing automation: manual assembly<br />

lines, semi-automatic systems, fully automated assembly<br />

stations, and customer-specific production lines built with interlinked<br />

cells.” In addition to the subsidiary in Portugal, IPTE Spain in<br />

Reus, Catalonia, is another division present on the Iberian peninsula.<br />

Hubert Baren further explains the vision that drives the company forward:<br />

”Our optimally flexible solutions, which are geared to the<br />

requirements of the market, are of the highest quality. And be assured,<br />

we definitely know what we are talking about. Our technologically<br />

outstanding position and the consistent application of such<br />

22 <strong>EPP</strong> EUROPE April 2019

Source: <strong>EPP</strong> <strong>Europe</strong><br />

IPTE’s Ovar production floor: work<br />

in progress for an extensive and<br />

complete, customer-specific<br />

manufacturing line. For this, a huge<br />

amount of space is needed.<br />

Very high vertical range of manufacture<br />

(over 90 %) of the mechanical parts<br />

characterizes the location Ovar.<br />

Source: <strong>EPP</strong> <strong>Europe</strong><br />

industry standards as Hermes and IPC CFX stand for this. We are a<br />

strong and reliable partner for our international customers. Currently,<br />

our business basis encompasses more than 600 customers,<br />

most of them are highly significant in their field of business and<br />

technology and/or market-leading Tier One companies, the suppliers<br />

of modules and systems.”<br />

To date, the largest market is <strong>Europe</strong>, whereas the Americas as a<br />

whole, as well as Asia, are accounting each for approximately 10 %<br />

of their sales. Broken down by application segments, around 75 %<br />

goes to automotive manufacturing, around 10 % to the industrial<br />

sector and the rest to various application areas, such as consumer,<br />

medical technology, computers, and communications.<br />

Competence meets careful growth<br />

The company is proud of providing reliable service with high competence<br />

and support around the globe. The focus lies, of course, on<br />

customer care, leading technology solutions, excellent price/performance<br />

ratio, and a worldwide presence, as Mr. Baren says. Reportedly,<br />

the strength is based on quality, service, expertise, and cooperation.<br />

They have built a dynamic organization, with regional locations<br />

amid the regions where their clients’ fab sites are.<br />

The company stress their proven expertise in process technology<br />

that allows them to stand out in competition, this knowledge is the<br />

bedrock on which their business is built upon. Users can benefit<br />

from a wealth of experience and skillfulness. A customer-focused<br />

approach helps the company to meet demanding project requirements,<br />

and in order to provide the optimum solution, the company<br />

is also looking to the requirements of a solution from a process perspective.<br />

Customers can rely on the leading technology and expertise<br />

in factory automation, coupled with skillful consultancy, fast<br />

reacting on-site support, and profound after-sales services, Mr.<br />

Baren concludes. In addition to the 15 globally distributed national<br />

divisions with their engineering, production, and application departments,<br />

there is also a number of local offices for service and support<br />

at strategically important places.<br />

One major goal for 2019 and surely beyond is the further development<br />

of process capabilities for Industry 4.0/Smart Factory. In addition,<br />

the customer base reportedly will be expanded by targeting<br />

other industrial areas. And in IPTE’s also important field of the production<br />

test of PCB assemblies, which is a crucial step in electronics<br />

production automation, fine-pitch structures down to<br />

0.3 mm pad dimensions can now also reliably contacted with the<br />

existing line equipment. Highly needed is this as electronics miniaturization<br />

and ever shrinking board assemblies are, as experience<br />

shows, an ongoing process. (Gerhard B. Wolski)<br />

www.ipte.com<br />

<strong>EPP</strong> EUROPE April 2019 23


The future of electronics is certain<br />

electronica 2018 exceeds<br />

all expectations<br />

The electronic industry has increased exponentially as everything is now made up of electronics. Several innovative<br />

waves have rolled into the industry, as new technologies and trends came into play, effecting all branches. The automotive<br />

industry has especially been transformed. Previously, only a small percentage of a car was dependent on electronics.<br />

Today, however, drastically more electronic parts are being used throughout, which will continue to broaden, especially<br />

with the advancement of autonomous vehicles. As innovations continue to grow, qualified labor with the correct knowledge<br />

base is also becoming challenging. Which is why collaboration and communication is important for success.<br />

The Managing Director of Messe München,<br />

Falk Senger, addressed visitors at the<br />

beginning of the tradeshow.<br />

The future of the electronics industry seems secure considering<br />

how successful electronica 2018 was. Taking place in Munich<br />

this past November, the tradeshow had an increase in attendance,<br />

exhibitors, floor space, as well as the launch of several supporting<br />

events. Throughout 4 days, over 3,100 exhibitors from 50 countries<br />

welcomed 81,000 international visitors. Industry experts, professionals,<br />

and decision-makers came from all over the world, including<br />

Italy, Austria, Great Britain and Northern Ireland, France, Switzerland,<br />

the U.S., the Russian Federation, China and Poland.<br />

For over 50 years, the show has been covering a variety of important<br />

topics and trends, while gathering the industry in one place.<br />

With new initiatives and premieres, the organizers, Messe<br />

München, brought focus on current challenges and difficulties. Discussions,<br />

forums, and conferences took place, including themes<br />

concerning the entire range of the industry. Networking and talent<br />

recruiting opportunities were also a highlight for this show.<br />

Source: Charlene Hesse<br />

The conferences<br />

Four main conferences took place throughout the week, which created<br />

a platform for visitors to gain information and obtain answers<br />

to their questions. Specific highlights were automotive and electromobility,<br />

which is why the Automotive Conference (eAC) was<br />

beneficial, as trends and strategies were covered by prominent<br />

automotive experts. Topics included electronics and PCBs in the<br />

automobile. The Embedded Platform conference (eEPC) focused on<br />

development tools and software solutions. Discussions of challenges<br />

were also mentioned, while highlighting current and future<br />

topics. Lectures, panels, and roundtable discussions were part of<br />

the Wireless Congress conference. Specialists from the industry<br />

discussed the most recent news about systems and applications.<br />

The Medical Electronics conference (eMEC) made its premiere,<br />

which focused on health and medical applications, as well as, wearables.<br />

The forums<br />

Giving visitors exclusive information regarding the industry, the 16<br />

available forums were informative, as they comprised of lectures<br />

and presentations, technical papers, and roundtable discussions. A<br />

variation of topics were discussed addressing all knowledge levels,<br />

including automotive, cyber security, IIoT, LED, PCB, components,<br />

power electronics, and more.<br />

A specific highlight was the e-ffwd forum, which focused on building<br />

a connection between startups and reputed companies. This<br />

platform was a win-win for all parties involved, as it helped startups<br />

receive advice and market information. It was also beneficial for<br />

others to learn about innovations, examine prototypes, and get<br />

fresh business ideas within the industry.<br />

Further forums included the Discovery stage, where lectures and<br />

panel discussions, as well as the keynote speaker was held.<br />

Special initiatives<br />

24 <strong>EPP</strong> EUROPE April 2019

Source: Messe München<br />

Source: Charlene Hesse<br />

Ajit Manocha, President and CEO of SEMI, expressed his optimism with<br />

the collaboration between Semicon Europa and electronica.<br />

Over 3,100 exhibitors from 50 countries welcomed 81,000 international<br />

visitors in Munich, Germany.<br />

Source: Messe München<br />

Artificial Intelligence was discussed in detail at the CEO roundtable platform.<br />

Source: Messe München<br />

This past show increased in attendance, exhibitors, floor space,<br />

and supporting events.<br />

Bringing even more value to this tradeshow, education was a great<br />

focus for this year. The exchanging of knowledge and ideas is important<br />

for the advancement of the industry. Which is why the CEO<br />

roundtable was so notable, since international business professionals<br />

from renowned companies gave their insights on artificial intelligence<br />

and its impact on small to large businesses. This platform<br />

also discussed, from a global viewpoint, the status of AI in the market<br />

and what it will bring for the future.<br />

The job market is evolving at a rapid pace, however young talent can<br />

be hard to come by. With the recruiting initiative and ‘electronica Experience’,<br />

the tradeshow made it possible for young qualified entrepreneurs<br />

to make connections with potential employers. A list of<br />

job openings was available for high school and college students, as<br />

well as, attendees, to be able to meet with exhibitors. Supporting<br />

talent and giving them the correct tools can help the industry in the<br />

long run.<br />

The exhibitions<br />

Compared to 2016, the showroom this year expanded in size, giving<br />

the opportunity for the display of even more products and solutions.<br />

This covered a variety of subjects, including automotive, displays,<br />

EMS manufacturing, test and measurement, micro- and nanosystems,<br />

wireless, and much more.<br />

For the first time, Semicon Europa took place simultaneously. 327<br />

exhibitors displayed semiconductor products, materials, and solutions,<br />

targeting the microelectronics industry. More specifically,<br />

this included LEDs, MEMS, as well as, printed and organic markets.<br />

9,220 attendees visited this show with a strong interest in sensors,<br />

nanoelectronics, IoT, smart manufacturing, and electronics applications.<br />

With 42 conferences, workshops, and more, visitors were<br />

able to gain further knowledge, including flexible electronics, advanced<br />

packaging, smart manufacturing, silicon wafer, smart mobility,<br />

and more. This tradeshow strongly believes in the initiative to<br />

find talent as well, which is why a workforce development program<br />

was created.<br />

The collaboration with Semicon enabled the expansion of resources<br />

for all show attendees. The next show will take place for the second<br />

time along with productronica in Munich this year, on November<br />

12–15, 2019.<br />

This most recent electronica show had a bigger purpose than most<br />

regular events. From the increase in showroom floorspace, to the<br />

added educational feature, there were advantages for all visitors.<br />

The organizers summarized it as: ‘We showcase, we network, and<br />

we support talent!’. As it takes place every two years, the next one<br />

will be held on November 10–13, 2020.<br />

www.electronica.de<br />

<strong>EPP</strong> EUROPE April 2019 25


1. LED meets SMT forum<br />

Significance of LEDs in the<br />

electronic industry<br />

The industry of LEDs has grown exponentially, due to its high durability, long service life, as well as, distinct capabilities in<br />

versatile applications. In order to ensure the high-quality production of LEDs, the manufacturing process needs to follow<br />

updated trends, requirements, and proficient methods. Depending on individual processes, the material used (solder<br />

paste, solder pad, etc.) is of high importance, which also correlates to the methods applied for component placement,<br />

soldering, and inspection. Due to this shift in the industry, <strong>EPP</strong> hosted the LED meets SMT forum in collaboration with<br />

Osram Opto Semiconductors GmbH for the first time.<br />

Source: Michael Vogl<br />

The entire manufacturing<br />

of LEDs was covered, including<br />

topics such as<br />

thermal conductive, material<br />

positioning, soldering<br />

processes, and inspection.<br />

In collaboration with Osram Opto Semiconductors,<br />

the event discussed the implications the electronics<br />

industry has on LEDs.<br />

Source: Michael Vogl<br />

Source: Michael Vogl<br />

(From left to right) Dr. Hans Bell (Rehm<br />

Thermal Systems), Kurt-Jürgen Lang (Keynote/<br />

Osram Opto Semiconductors), Wolfgang Runte<br />

(Koh Young <strong>Europe</strong>), Ferdinand Lutschounig<br />

(AT&S AG), Norbert Heilmann (ASM Assembly<br />

Systems), Harald Grumm (Ersa), Jörg Trodler<br />

(Heraeus Deutschland), Andreas Gladis<br />

(Viscom AG), Axel Wolff (Asscon)<br />

Taking place in Regensburg, Germany, visitors gained knowledge<br />

on solutions to manufacturing challenges, as experts discussed<br />

the implications the electronics industry has on LEDs. Participating<br />

companies included AT&S AG, Heraeus Deutschland, Ersa, ASM Assembly<br />

Systems, Asscon Systemtechnik-Elektronik, Koh Young <strong>Europe</strong>,<br />

Rehm Thermal Systems, and Viscom AG. The all-day German<br />

event consisted of technical presentations made by industry<br />

leaders with a keynote presentation from Osram Opto Semiconductors,<br />

as well as, networking opportunities. The entire manufacturing<br />

of LEDs was covered, including topics such as thermal conductive,<br />

material positioning, optimal soldering processes, and quality inspection.<br />

Visitors were given the chance to participate in a tour of<br />

Osram’s SMT laboratory, complete with a LED line assembly, which<br />

consists of a printer, placement system, vacuum reflow soldering<br />

oven, as well as, inspection systems.<br />

Keeping up with LED trends<br />

As this industry continues to grow, design difficulties are arising<br />

along with changes in production needs. LED manufacturing<br />

requires high assembly accuracy, nearly free of voids, as well as, attention<br />

to thermal resistance. Optical impairment of the LED is also<br />

probable, where cracks and breaks in bond wire or a chip offset can<br />

occur. Correct heat dissipation is becoming a challenge with miniaturization<br />

trends and overloaded boards. This can create an overheating<br />

of components, and ultimately impact the product life.<br />

Which is also a cause to pay attention to the design of PCB, solder<br />

pads, as well as, the type of paste.<br />

Advantages of different soldering methods were discussed, depending<br />

on specific processes. Whether using vapor phase, vacuum,<br />

or convection reflow technologies, all agreed that the goal is<br />

to have an oxidation-free process for void-free results. Solder paste<br />

was also analyzed, including the optimum amount of paste and its<br />

volume that would be needed to accomplish the best bonding results.<br />

Chip placement, as well as, solder pad design and size were<br />

also common topics, explaining the best solutions to overcome any<br />

thermal issues.<br />

A variety of inspection tools were presented, to ensure solder pads,<br />

beads, pores, as well as, partially or completely concealed solder<br />

joints were visible. It is sufficient to inspect visible joints with 2D<br />

technology but was recommended to use 3D inspection for any<br />

hidden joints. It was also advised to invest in error prevention tools,<br />

in order to regularly improve processes.<br />

The 2 nd LED meets SMT forum will take place October 24 th , 2019 in<br />

Regensburg, Germany. (cp)<br />

www.epp.industrie.de/led-meets-smt<br />

26 <strong>EPP</strong> EUROPE April 2019

productronica Fast Forward platform for start-ups<br />

The innovation leaps in electronics are getting<br />

bigger and bigger, the cycles shorter and<br />

shorter. Start-ups and new players, in particular,<br />

are attracting attention. Together with<br />

Elektor, productronica offers a platform that<br />

brings together their ideas and prototypes<br />

with an international specialist audience.<br />

Companies can become involved as a sponsor—and<br />

benefit from that involvement.<br />

Innovators don‘t always have it easy: As a<br />

start-up or new company, they must gain a<br />

foothold in an agile business, sustainably establish<br />

their development and develop it in<br />

line with the market conditions. And that preferably<br />

on an international level right away.<br />

On the other hand, companies willing to support<br />

or interested in cooperation do not have<br />

an easy time: They must be able to recognize<br />

among the multitude of innovations what is<br />

only a short-term trend and what is a promising<br />

development.<br />

Fast Forward offers the following benefits to<br />

innovators:<br />

• productronica Fast Forward Award<br />

• productronica Fast Forward Booth<br />

• productronica Fast Forward Forum<br />

Sponsors benefit from positive marketing<br />

and image effects<br />

There are many marketing benefits that<br />

come with being a sponsor of Fast Forward.<br />

Moreover, companies position themselves<br />

as an innovation promoter and start-up supporter<br />

of the global electronic manufacturing<br />

industry. There are four sponsor packages<br />

that are available. However, the sponsorships<br />

are limited.<br />

productronica Fast Forward—the Award<br />

Which founder or developer can win over the<br />

jury with their innovative idea in a 5-minute<br />

pitch and bring home the award?<br />

Who is eligible to enter?<br />

National and international start-ups, that<br />

• have been on the market for less than six<br />

years.<br />

• have tangible products and prototypes that<br />

are reflected in the nomenclature.<br />

• have developed a scalable business model<br />

and a detailed business plan.<br />

• are looking for suitable financing and the<br />

corresponding funds.<br />

The prizes<br />

• First prize: A marketing package worth EUR<br />

25,000.00 from Elektor International Media<br />

including a trade fair stand at productronica<br />

2021.<br />

• Second prize: A media campaign by Elektor<br />

with a total value of EUR 15,000.00.<br />

• Third prize: A media campaign by Elektor<br />

with a total value of EUR 5,000.00.<br />

Participation deadline is October 1, 2019.<br />

productronica Fast Forward—the Booth<br />

The start-up platform is a joint stand in the<br />

middle of the trade fair. Participants have a<br />

chance to present their innovations to more<br />

than 250,000 Elektor community members,<br />

as well as 45,000 estimated productronica<br />

2019 visitors. The stand space will be given<br />

to the participants at a reduced price.<br />

productronica Fast Forward —the Forum<br />

The forum provides founders, developers and<br />

established companies with an ideal opportunity<br />

to make contacts and jointly promote<br />

Elektor and productronica will offer a platform for<br />

Start-ups that brings together their ideas and prototypes<br />

with an international specialist audience.<br />

forward-looking projects. The forum also<br />

hosts pitches, lectures and workshops.<br />

The program at a glance:<br />

Discover new business ideas: Are you an established<br />

company looking for fresh ideas for<br />

your business? Be there when creative<br />

minds present their ideas, prototypes and<br />

start-ups at the forum, which are evaluated<br />

by the jury. Here you have the opportunity to<br />

discover innovations from all over the world<br />

at an early stage.<br />

Consulting for young entrepreneurs: Get advice<br />

from experienced experts at the forum.<br />

In addition to the exchange with other<br />

founders and entrepreneurs, business angels<br />

and investors give valuable tips. What do the<br />

first steps of a company depend on? How is<br />

financing secured and what do I have to consider<br />

as a start-up? Listen to our presentations.<br />

Trends and interesting facts: What are the<br />

cultural differences between Old Economy<br />

and New Economy? How do they affect the<br />

cooperation between start-ups and corporations?<br />

What are the preferences of up-andcoming<br />

talent? Lectures in the forum will<br />

shed light on current trends and questions.<br />

www.elektor.com; www.productronica.com<br />

Source: Messe München<br />

Exhibiting companies earn 2019 Innovation Awards<br />

IPC – Association Connecting Electronics<br />

Industries announced the winners of the<br />

this year‘s Innovation Awards at Apex, a<br />

celebration of forward thinkers who are<br />

changing the technological landscape of<br />

the electronics industry.<br />

A panel rated each product on: How innovative<br />

it is? How is it changing the manufacturing<br />

industry? What value will customers<br />

experience with this new product?<br />

The awards were presented to:<br />

• GreenSource Fabrication LLC for their<br />

PCB fabrication facility, the only fully<br />

automated and „green“ fabricator.<br />

• Meyer Burger (Netherlands) BV for an<br />

inkjet printer for PCB soldermask. It com-<br />

bines a dedicated production inkjet printing<br />

system based on their product line and<br />

Agfa’s unique DiPaMat solder mask ink.<br />

• Nordson Dage for Explorer one, an entry<br />

level, operator controlled, manual X-ray inspection<br />

(MXI) system for checking the<br />

quality in electronics assemblies. Open or<br />

bridged solder connections, BGA reflow<br />

quality and voiding can be checked easily.<br />

• Henkel Corporation for its Loctite Eccobond<br />

UF 1173, an underfill that can withstand<br />

harsh environments and the elevated<br />

operating temperatures inherent with<br />

smaller, higher-functioning devices.<br />

• Vayo (Shanghai) Technology Co., Ltd. for its<br />

DFM Expert v5, a 3D DFA/DFM solution for<br />

electronics manufacturing.<br />

“The awards allow us to celebrate the innovators<br />

who are changing the technological<br />

landscape of the electronics industry,”<br />

said John Mitchell, IPC president and CEO.<br />

“This year, product and service submissions<br />

were certainly innovative, and<br />

the companies did an exceptional job in<br />

identifying their product’s unique value in<br />

the industry. They directly indicate the<br />

strength of the electronics industry and its<br />

ability to respond to new challenges resulting<br />

from emerging technologies in the<br />

electronics marketplace,” Mitchell added.<br />

www.ipcapexexpo.org<br />

<strong>EPP</strong> EUROPE April 2019 27


Christian Koenen Technology Day<br />

Forward thinking ideas shape<br />

the future of tomorrow<br />

With the focus on “Innovative ideas for today, and for the demands of tomorrow”, Christian Koenen GmbH had<br />

an informative Technology Day at their headquarters in Ottobrunn, Germany. Managing Director, Michael Brianda,<br />

greeted about 75 attendees and started the day off with reviewing their goals and aspirations for the future<br />

and their clients. The company wants to continue to meet the growing demands of customers, while keeping the<br />

focus on quality, reliability, and expertise. Immediately following, a variety of presentations took place that was<br />

moderated by Frank Breer (Sales Manager) and the day concluded with a company tour.<br />

A<br />

live demonstration of the application center was one of the<br />

main highlights of this day. The team for the application center,<br />

Sebastian Bechmann and Daniel Rudolph, took the visitors around<br />

the center, with the help of representatives from partners, including<br />

Ekra, Asys, Koh Young, Ersa, Wagenbrett, kolb Cleaning Technology,<br />

and GMS. Opened since 2008, it was built and configured with the<br />

customer in mind. A variety of services are offered, to analyze and<br />

test theories, before bringing the results to a real production. Customers<br />

can take advantage of the resources it includes, target it to<br />

the needs of their specific processes in order to find optimal solutions,<br />

reduce costs, and increase quality. The team also assists<br />

customers with measurement of PCBs, pad and opening sizes, as<br />

well as, 3D measurement of deposits, and more.<br />

The center includes an X5 STS screen printer from Ekra, a PB46<br />

printing and balling machine from Wagenbrett, as well as a stencil<br />

printing and rework system Hybrid Rework 550 (S1) from Ersa. As<br />

part of the inline concept, a Series 5000 printer from Ekra, a SPI system<br />

8030–2 from Koh Young, and a board handling system from<br />

Asys can be found. On the same floor, a cleaning area is also part of<br />

this application center. For cleaning screens, stencils, and substrates,<br />

it is equipped with two fully automatic cleaning systems, a<br />

PS 300 from kolb Cleaning Technology and a MC4000 from GMS.<br />

Manual cleaners are also part of this area which supports<br />

smaller cleaning processes.<br />

Dr. Thomas Ahrens, Trainalytics GmbH<br />

DoE (Design of Experiment) as tool for paste<br />

printing optimization<br />

The goal is to always have an optimal manufacturing in<br />

an SMD assembly, establishing reliable solder joints.<br />

Especially with paste printing, it may become complex<br />

to find what works best, as there are a variety of<br />

different processes, techniques, trends, and materials<br />

that can be used. This is why a plan needs to be put in<br />

place to achieve these optimal steps towards productivity. In order<br />

to do this, testing needs to be done to find what works best. According<br />

to Dr. Thomas Ahrens, there are different ways to achieve<br />

this, which include different experimental tests. Trial and error or the<br />

best guess are methods frequently used can be methods used, although<br />

these may not be very accurate. Instead, he suggests to<br />

use Design of Experiment (DoE) techniques, which is the act of<br />

gathering as much information as possible based on influencing factors,<br />

to evaluate an experiment.<br />

The specific approach used will depend on the goal of the experimental<br />

design and the desired end results. For instance, which processes<br />

should be optimized, how big of an optimization is it, as well<br />

as, how much effort should be made into it should first be considered.<br />

By using the fully partial factorial design, will track all available<br />

combinations and bring more conclusive results, but this also increases<br />

the effort put in. However, the partial factorial design is best<br />

used for more complex experiments, as it reduces the scope to the<br />

strongest combinations, however it is not the most accurate. By<br />

using DoE, all parameters and combinations can be tested to find<br />

the best process to be used for an assembly, and everything is recorded<br />

for future use.<br />

www.trainalytics.de<br />

Source: <strong>EPP</strong> <strong>Europe</strong><br />

Dr. Thomas Ahrens,<br />

Trainalytics GmbH.<br />

28 <strong>EPP</strong> EUROPE April 2019

Source: <strong>EPP</strong> <strong>Europe</strong><br />

The Managing Director, Michael Brianda, welcomed all visitors<br />

to the Technology Day.<br />

The Sales Manager, Frank Breer moderated and introduced each speaker,<br />

throughout the day.<br />

Source: <strong>EPP</strong> <strong>Europe</strong><br />

Christoph Hippin, Endress+Hauser SE+Co KG<br />

Stencil printing challenges for SOT and SOD components<br />

In recent years, miniaturization has been a prominent trend, and<br />

now consequences are starting to come about. There has been a<br />

higher demand for compact circuit boards and a more complex<br />

layout design, which has increased the requirements of stencil<br />

printing technology, especially when processing SOD and SOT designs.<br />

According to Christoph Hippin, this also affects the components,<br />

circuit board, layout, stencil, reliability, and rework. Ramifications<br />

can occur if these requirements are over looked, including<br />

locking gap, tilting, and twisting of the component. In order to have<br />

a reliable release of the solder paste from the stencil to the pad<br />

sizes, he believes that the openings should be 1:1. With this, due to<br />

the stencil opening being larger than the area of the top of the pad,<br />

a smaller adhesive is needed. The speaker also further discussed<br />

the benefits of using a brushing process versus electropolishing. It<br />

doesn’t create larger apertures, improves process stability, removes<br />

the least amount of material, keeps consistent thickness, and has<br />

lower edge rounding. Coating is also an important topic for stencil<br />

printing, as it reduces underside contamination and increases repeatability.<br />

Many benefits come with using the CK Plasma 3.0, including<br />

a longer stencil life with better process reliability and a<br />

better cleaning performance. Using the brushing process with the<br />

Plasma 3.0, creates a better filling, especially when it comes to<br />

miniaturization.<br />

www.de.endress.com/en<br />

Karsten Dierker, Tonfunk GmbH Ermsleben<br />

From prototyping to mass production- When the component<br />

mix ranges from 0402 to THR components<br />

The speaker first went through the company’s process. Starting<br />

with defining the template parameters, to adjusting the design of<br />

the stencil, applying adhesives dots to components, then describing<br />

the adhesive application, to its final step of reflow soldering and adhesive<br />

curing. The variety of the components that the company<br />

uses were then discussed, which in turn explained why a step tem-<br />

Karsten Dierker, Tonfunk GmbH Ermsleben,<br />

Source: <strong>EPP</strong> <strong>Europe</strong><br />

Source: <strong>EPP</strong> <strong>Europe</strong><br />

Christoph Hippin,<br />

Endress+Hauser SE+Co KG.<br />

<strong>EPP</strong> EUROPE April 2019 29


Source: <strong>EPP</strong> <strong>Europe</strong><br />

Daniel Rudolph (Christian Koenen) and Torsten Vegelahn (Asys Group) in the<br />

application center at the headquarters of the company.<br />

The live demonstration of the application<br />

center was a highlight of the<br />

day, which gave the visitors more<br />

detail about the inline concept.<br />

Source: <strong>EPP</strong> <strong>Europe</strong><br />

plate from Christian Koenen was chosen. Once in use, advantages<br />

were seen especially when using the plasma coating for a secure<br />

printing process. Mr. Dierker gave specific examples of different<br />

components that needed stencil design adjustments to ensure high<br />

quality results and consequences that occurred prior to the change.<br />

These components included TSSOP 20, DFN 8, and X2SON. The<br />

reason for why 0402 and 0603 components need further adhesive<br />

dots and its benefits were also presented. The speaker then explained<br />

the different technologies used for their adhesive application,<br />

which included the DEK Stinger, which is ideal for partial fixation<br />

but not suitable for 0603 and 0402 adhesive dots. The stainless-steel<br />

screen printer is used for manual bonding and has no repeatability<br />

capabilities. For reflow soldering and SMT adhesive curing,<br />

the ASM Glue Feeder is used with Koki‘s adhesive. This flexible<br />

machine forms small adhesive dots, suitable for 0603 and 0402<br />

components, as well as, aids in centering components during processes.<br />

www.tonfunk.de/en<br />

Lukas Wüsteney, Trajectory Planning db018, TUfast Racing Team<br />

Autonomous driving- New challenges in cyber physical<br />

systems<br />

Autonomous vehicles are no longer a thought for the future, as with<br />

the progression of technology, it is now available today. A driverless<br />

automobile does not only put the vehicle in motion, it also includes<br />

planning the best trajectory, checking for motion control, collision<br />

control, and so much more. The team of TUfast e.V. built their first<br />

racecar in 2004, and has been competing in the worldwide Formula<br />

Lukas Wüsteney,<br />

TUfast Racing Team.<br />

Source: <strong>EPP</strong> <strong>Europe</strong><br />

30 <strong>EPP</strong> EUROPE April 2019

Source: <strong>EPP</strong> <strong>Europe</strong><br />

As part of the application<br />

center, the cleaning area is<br />

equipped with two fully automatic<br />

cleaning systems, as<br />

well as, manual cleaners.<br />

Technology partners are involved<br />

in the application center, in order<br />

to meet all customers’ needs.<br />

Source: <strong>EPP</strong> <strong>Europe</strong><br />

Student competition. This competition is judged based on different<br />

categories, including specific dynamics: acceleration, handling<br />

(Skidpad), endurance, efficiency, and speed (autoX). It is also tested<br />

on statics, such as the business plan and its cost report. The engineering<br />

design is also evaluated, based on its skills, overall concept,<br />

and project management. Last year’s main focus of the competition<br />

and the racing team’s aspirations, was to build an autonomous car.<br />

With the help of Christian Koenen, they were able to make their<br />

dreams come true, with the db2018. The company sponsored this<br />

team with stencils for various electronics in the racecar, including<br />

emergency breaks, systems, and much more. With their help, they<br />

were also able to upgrade their racecar for this year, which included<br />

additional cameras, improved brake system, optimized aerodynamics,<br />

etc. They came first place in the last competition, with the<br />

hopes of winning the next one as well.<br />

www.tufast-racingteam.de<br />

www.ck.de<br />

Christian Koenen sponsors the TUfast e.V.<br />

racing team and their autonomous car.<br />

Source: <strong>EPP</strong> <strong>Europe</strong><br />

<strong>EPP</strong> EUROPE April 2019 31


The future of electronics in Taiwan<br />

Hotbed for AIoT<br />

& IoT integration<br />

Hosted by Taiwan External Trade Development Council<br />

(TAITRA), 2018 marked the 44 th anniversary for the Taipei International<br />

Electronics show (Taitronics). Taking place at the Nangang<br />

Exhibition Center in Taiwan, the four-day show gave visitors<br />

a chance to see just how much the industry has changed<br />

since it first began. Throughout its existence, technology has<br />

evolved at a rapid pace.<br />

Taitronics and AIoT Taiwan took place at the Nangang Exhibition Center in<br />

Taipei throughout 4 days.<br />

Source: Charlene Hesse<br />

The opening ceremony emphasized the importance of the collaboration of<br />

the two shows to prepare for future challenges.<br />

To encourage more innovation, 12 products were<br />

chosen for the smart innovation application<br />

award, based on their capabilities and reliability.<br />

Source: Charlene Hesse<br />

Bringing out new trends, which impacted techniques and processes<br />

that were previously unheard of. The development of<br />

cell phones, electronic gadgets, automation, Industry 4.0, big data,<br />

and smart living has revolutionized the industry. Hardware is now no<br />

longer enough just by itself. Everything needs to be connected to<br />

one another, which means software and hardware integration is key.<br />

Therefore, Taiwan International AIoT show (AIoT Taiwan), organized<br />

by TAITRA and Taiwan Electrical and Electronic Manufacturer’s Association<br />

(TEEMA), took place for the first time simultaneously. This<br />

collaboration gave extra value to the week, by not only focusing on<br />

parts, which is the first step towards the future. By focusing on<br />

smart integration, this makes smart applications, AI, and autonomous<br />

transportation more reliable, which can soon become the<br />

norm. Total solutions and stronger ecosystems are crucial towards a<br />

simpler future. As the country is a strong believer in this, they have<br />

made many efforts and put in a lot of resources to make a difference<br />

in the manufacturing of electronics. The goal is to move towards<br />

multi integration and communication of applications, as well as, customizable<br />

processes and services.<br />

Opening ceremony<br />

With the theme “Transforming for an innovative future”, more than<br />

350 exhibitors interacted with over 15,000 visitors, demonstrating<br />

their solutions and processes at 650 booths. At the opening ceremony,<br />

the show started off with speeches from Mr. Ming-Hsin<br />

Kung, Deputy Minister of Ministry of Economic Affairs (MOEA), Mr.<br />

James C. F. Huang, Chairman of TAITRA, Mr. T. C. Gou, Chairman of<br />

TEEMA, and Mr. Pankaj Kumar, Additional Secretary of Ministry of<br />

Electronics & Information Technology, India. The history of Taiwan<br />

and its contributions to the industry were also discussed. Although<br />

the country has faced natural disasters and other challenges, the<br />

economy pushed forward with the help of investments, including<br />

the Apple supplier, TSMC and Amazon, just to name a few.<br />

The government has also been very supportive with the launch of<br />

the 2016 Asian Silicon Valley Development plan, which further<br />

helped the country make the shift from traditional industrials to digital<br />

markets. This also aided small businesses and startups be able to<br />

make their mark. Mr. Huang further discussed what the future<br />

brings for this market, and how important smart solution integration<br />

is to be able to face challenges of modern time. Mr. Gou explained<br />

that by combining the two tradeshows, it not only aids to prepare<br />

for impending challenges, but also to continue to expand the platform<br />

on the international market.<br />

It was TEEMA‘s 70 th anniversary, and as he exclaimed it is the Chinese<br />

belief that life starts at 70, so there is much more to come in<br />

the next years.<br />

32 <strong>EPP</strong> EUROPE April 2019

Actively researching and expanding<br />

into emerging areas, including<br />

robotic processes, and machine<br />

intelligence, are just a few areas<br />

that the country is taking part in.<br />

Source: Charlene Hesse<br />

Source: Charlene Hesse<br />

Five pavilions were found at the show, depicting the most recent trends<br />

and innovative solutions, which included smart living, Artificial Intelligence,<br />

and cloud computing and IoT pavilion.<br />

Source: Charlene Hesse<br />

This year’s show will take place on October 16–18, 2019, in Taipei.<br />

Forward thinking mindset<br />

The exhibition presented highly innovative solutions and an insight<br />

on what the future will bring, with a focus on Artificial Intelligence,<br />

especially Artificial Intelligence of Things. As a highlight, a knowledge<br />

hub was created in a form of 5 pavilions. The energy storage<br />

pavilion focused on Taiwan’s parts and components manufacturing<br />

and integration solutions. The smart industrial parks pavilion was directed<br />

towards 5G and domestic information systems. The smart<br />

living and health care center pavilion demonstrated wearable devices<br />

and smart health technologies. The Artificial Intelligence pavilion<br />

concentrated on smart living solutions and AI learning. Lastly,<br />

the cloud computing and IoT pavilion exhibited cloud solutions. This<br />

also further explained the Cloud Computing Association (Taiwan AI<br />

Alliance) that has 145 members, which focuses on connecting IoT<br />

to the cloud.<br />

The smart innovation application award was also a great success at<br />

this show. Products were selected for their AIoT capability, and<br />

were assessed based on their innovation, technology, functionality,<br />

reliability, and contribution. This award is to encourage Taiwanese<br />

companies to become more innovative and successful. These 12<br />

winners include:<br />

• I-Ctrl Wi-Fi remote control box (Aifa Technology Corp.)<br />

• 3D projection mapping media server (Bruvis Multimedia Creative<br />

Co., Ltd.)<br />

• iCam intelligent camera (Chimei-Motor Electronics., Ltd.)<br />

• BoostFix Posture Detector (Compal Electronics, Inc.)<br />

• Smart auto liquid nano-material inspection system (Flowview Tek)<br />

• C-1200 LoRa tester (Good Will Instrument Co. Ltd.)<br />

• AI NVR image analysis system (Ironyun Inc. Taiwan)<br />

• NB-IOT/LoRa smart parking system (Nietzsche Enterprise Co Ltd.)<br />

• Dual-system smart home solution (Phytrex Technology Corp.)<br />

• CardiNova heart disease recorder (Singular Wings Medical Co. Ltd.)<br />

• Nursemaid (Sinopulsar Technology Inc.)<br />

• Caduceus smart surgical glasses (Taiwan main Orthopaedics Biotechnology<br />

Co. Ltd.)<br />

Forums, seminars, and workshops were also a success, which included<br />

professionals and experts discussing a variety of topics. This<br />

included subjects, such as semiconductor technologies, IoT integrated<br />

service center, AIoT development trends, design forums,<br />

smart home, and digital transformation.<br />

Throughout the show, the altogether feeling was how promising the<br />

future looks in Taiwan. Companies have a forward-thinking mindset,<br />

not only focusing on automating and optimizing all processes with<br />

intelligent and smart solutions, but also with guaranteeing efficient<br />

delivery time. Most promise international delivery time of 14 days,<br />

or the cost of airfare will be supplied. Many also had a sense of<br />

pride by supporting manufacturing in Taiwan, as most factories are<br />

based near Taipei. The ‘Made in Taiwan’ promise made for a supportive<br />

environment.<br />

There was a great focus on actively researching and expanding into<br />

emerging areas, including robotic processes, machine intelligence,<br />

and machine deep learning. Not to mention, continuing to prepare<br />

for Artificial Intelligence of Things, the next generation of IoT. As well<br />

as, emphasizing the significance and benefits of teaching software<br />

and applications, whether in a class room or professional setting.<br />

Throughout this show, it was evident that mass production and<br />

technology-oriented processes is no longer the trend. Integrated applications<br />

and customized production and services is what the future<br />

holds. Next year, Taitronics will take place on 16–18 October<br />

2019. (ch)<br />

www.taitronics.tw<br />

Source: Charlene Hesse<br />

<strong>EPP</strong> EUROPE April 2019 33


Fuji Innovation Days – All about Smart Factory<br />

What the digital age is all about<br />

The Innovation Day in Kelsterbach by Fuji <strong>Europe</strong> Corporation was innovative and varied with extensive topics. It<br />

took place at the company’s German headquarters, and began with presentations from Nobuyuki Soga, President,<br />

and Klaus Gross, Executive Director. They discussed their milestones, which included the opening of their German<br />

location, their official name change, and the recent celebration of their 60-year anniversary. The company is looking<br />

forward to the future this year and staying innovative as well as employee-oriented. With their recent accomplishments,<br />

they are looking to expand their team of experts to stay innovative for their customers.<br />

The Innovation Day, that took place at Fuji <strong>Europe</strong> headquarters in Germany, followed the<br />

theme of the Smart Factory.<br />

Source: Charlene Hesse<br />

Philip Hall gave an overview of the<br />

company’s roadmap.<br />

Source: Charlene Hesse<br />

With the theme “All about Smart Factory”, presentations from<br />

their partners focused on the digital age, automated digitalized<br />

processes, miniaturized component, high quality stenciling,<br />

and flexible, traceable manufacturing. A demonstration of the Fuji<br />

line also took place, as well as, an overview of their roadmap, which<br />

included details of their fast-forward technology. In the near future,<br />

the company is planning to release a variety of tools, including the<br />

handling of odd form components, optical verification capability, and<br />

the support of tray operation. Future projects on automation are<br />

also in the works, including automatic warehouses, automatic part<br />

suppliers, and automatic maintenance.<br />

Ulf Oestermann, Fraunhofer IZM<br />

Where is the research going for the digitized production<br />

process?<br />

The digitalized production process is an aspiration for the electronics<br />

industry. The dream is to have an autonomous production<br />

with a goal of being self-organized, from the very beginning of describing<br />

functions to the end of delivery. The most important parts,<br />

as circuit development, housing design and machine manufacturing,<br />

Source: Doris Jetter<br />

are already digitalized. Changes to work procedures, spatial restructuring,<br />

or product changes are first analyzed digitally before they are<br />

implemented, in order to identify and eliminate in advance any difficulties<br />

that may arise. This saves money and time. Smart, digital<br />

helpers support users to make work easier and optimize processes.<br />

This is only the beginning. In the future, every single processing<br />

step will be clearly traceable down to the smallest part for complete<br />

transparent traceability.<br />

Ulf Oestermann,<br />

Fraunhofer IZM.<br />

34 <strong>EPP</strong> EUROPE April 2019

Source: Doris Jetter<br />

Stefan Lau, Wilo.<br />

Abderazzak Essanhaji, Fuji.<br />

Source: Charlene Hesse<br />

Keynote speaker, Nicola Fritze.<br />

Source: Charlene Hesse<br />

Stefan Lau, Wilo<br />

From digital transformation to smart factory<br />

With the Wilo Smart Factory, the production is equipped with new<br />

concepts. This primarily involves the consistent planning and control<br />

of customer orders in the digital age, in conjunction with the dynamic<br />

linking of production and logistics processes. This implements<br />

a 5 + 1 production, which means that the raw material cannot<br />

be more than five days in the production, to be manufactured in a<br />

maximum of one day, between the different production steps. With<br />

this, the customer can be supplied as quickly as possible despite individualized<br />

products. All processes are supported digitally where<br />

the networking enables a real-time check of the process data. The<br />

constant exchange of data allows flexible and demand-oriented responses<br />

to short-term changes.<br />

Jonas Ernst & Abderazzak Essanhaji, Fuji<br />

All about Nexim<br />

The presentation focused on new features and conversions to<br />

Nexim (Nexus Integrated Manufacturing System). With the three<br />

tools Plan, Do and See, the operator can easily create new parts and<br />

programs, as well as, use optimization tools. It also supports the<br />

connection to MES systems, the handling of luminaire class products,<br />

as well as, the control of MSL components, which can be connected<br />

to storage systems. With the clear user interface, the operator<br />

can find his way quickly and easily. Today, a customer can already<br />

have many tools included in the standard purchase, there is<br />

no production installation limitation. The standard functions of Fuji<br />

Flexa and Fujitrax as well as the possibility of other options, which<br />

are constantly being further developed, were discussed.<br />

same. Through participation, the audience was asked to take on<br />

challenges in a self-determined and trusting way, in order to break<br />

out of unfavorable thinking and behavioral routines. Only those who<br />

are able to motivate themselves, actually become motivated and<br />

can then develop their potential.<br />

Helge Schimanski, Fraunhofer ISIT<br />

Processing of discrete components<br />

Miniaturized component geometries combined with increased packing<br />

density present challenges for the manufacturing process. A<br />

systematic evaluation of the process parameters leads to processreliable<br />

application recommendations. The recommendation that<br />

was developed for the printed circuit board layout and printing process<br />

is based on what was then the state of the art and end user<br />

specifications, such as optically testable solder joints. High quality<br />

stencils can increase paste transfer efficiency and reduce the<br />

required area ratio. The danger of overpressure is caused by pad reduction.<br />

However, the 3D solder paste inspection provides a<br />

necessary quantitative control. Components of the metric assembly<br />

Nicola Fritze<br />

Just do it<br />

Failure to implement knowledge is due to a lack of courage to<br />

change. In her activating lecture, author and keynote speaker, Nicola<br />

Fritze, explained why and how this could be changed and emphasized<br />

that motivation is the key factor. Using extraordinary activities,<br />

she showed how thinking and perception can be set in motion. The<br />

goal was to take a step back from the comfort zone and avoid routines<br />

in the future, since 80 to 90 % of every day thoughts are the<br />

Helge Schimanski, Fraunhofer ISIT.<br />

Source: Charlene Hesse<br />

<strong>EPP</strong> EUROPE April 2019 35


A demonstration of the Fuji line took place demonstrating the Smart Factory capabilities.<br />

Source: Charlene Hesse<br />

size 0402 require a nitrogen atmosphere for a secure soldering process.<br />

Basically, the process window for manageable and secure assembly<br />

production is the goal for the production of reliable electronics.<br />

Frank Breer, Christian Koenen<br />

Smarter service for error-free printing<br />

With the approach of barcode, data matrix code and RFID on the<br />

template, traceability is enabled in a networked production. A highquality<br />

stencil is no longer just a laser-cut metal sheet, it has to be<br />

refined, since the precision stencil or screen-printing tool has a high<br />

impact on the quality of SMT production. Attention should be paid<br />

to high-quality and specific basic materials as well as, coordinated<br />

and consistent control. Precision and know-how in production in<br />

conjunction with an optimal, product-specific layout is also important,<br />

as well as, a reliable and fast delivery and a partnership-based<br />

cooperation. Despite smaller components for improved functionality,<br />

the Plasma 2.0 solution provides a stable printing process, especially<br />

if IPC recommendations cannot be met. For more challenging<br />

applications, Plasma 3.0, laser photoplotter, or special step<br />

stencils for pin-in-paste technology without preforms were discussed.<br />

Wolfgang Runte, Koh Young Technology <strong>Europe</strong><br />

Smart Production by Smart Data<br />

The presentation covered the company‘s KSmart solution, which<br />

implements process optimization of the complete line and provides<br />

a variety of useful tools. The analysis tool collects all the information<br />

from the measurement and inspection processes of each system,<br />

in order to control every step of the process within the machine. The<br />

3D SPI (printing system), Pre-Reflow AOI (placement system) and<br />

Post-Reflow AOI (soldering process) gives feedback and feedforward<br />

to each other, in order to communicate any process inconsistencies<br />

in real time. Through immediate intervention, the process<br />

can be optimized so no errors can occur. The 3D real-time measurement<br />

creates a complete reconstruction of an object, to be able to<br />

detect the height of the component or the entire structure of a<br />

printed circuit board. Other various tools were also discussed, in<br />

order to do justice to the Smart Factory. This included the Library<br />

Manager, Statistical Process Control, Offline Programming Optimizer,<br />

Real-time Monitoring, Remote Monitoring, and KSmart Process<br />

Optimization.<br />

Werner Kreibl, Asys Group<br />

Intelligent Factory – Next Steps<br />

In addition to complete transparency and traceability, holistic solutions<br />

are necessary for flexible production. In particular, the material<br />

flow is crucial for achieving planned production goals. This means<br />

that individual production stations, both inside and outside a line,<br />

are automatically supplied with material without interruption. Selforganizing,<br />

intelligent transport systems should autonomously<br />

transport the material from A to B. The so-called AIVs are very flex-<br />

Frank Breer, Christian Koenen.<br />

Source: Charlene Hesse<br />

Wolfgang Runte, Koh Young Technology <strong>Europe</strong>.<br />

Source: Charlene Hesse<br />

Werner Kreibl, Asys Group.<br />

Source: Charlene Hesse<br />

36 <strong>EPP</strong> EUROPE April 2019

Source: Charlene Hesse<br />

Dr. Helmut Schweigart, Zestron <strong>Europe</strong>.<br />

Markus Ankenbrand, FAPS.<br />

Source: Charlene Hesse<br />

ible and can be adapted to individual applications. Higher-level software<br />

virtually maps the production line, as well as, monitors and<br />

analyzes the current data and machine conditions. This also ensures<br />

controlled processes based on the data collected. The company is<br />

thus gradually approaching its vision, from manual to fully automated<br />

solutions for flexible production.<br />

Dr. Helmut Schweigart, Zestron <strong>Europe</strong><br />

Underside cleaning in the printer<br />

The cleaner for the underside cleaning should not only have a good<br />

cleaning power and low fluid consumption, but it should also be<br />

compatible with the solder paste. This is because the cleaning<br />

agent can pass through the apertures during the cleaning and interact<br />

with the solder paste. Incompatible cleaning agents, such as isopropyl<br />

alcohol (IPA), change the viscosity of the solder paste, which<br />

can have a negative effect on the printing result in the next printing<br />

process. The company offers specially developed water- and solvent-based<br />

stencil cleaners which are suitable for cleaning typical<br />

steel stencils or nanocoated stencils in the printer. The cleaning of<br />

the underside of the stencil in the printer is important for an optimal<br />

and constantly good printing result, in addition to the mechanical<br />

stencil cleaning.<br />

Markus Ankenbrand, FAPS<br />

Additive manufacturing of mechatronically integrated circuit<br />

carriers<br />

By combining classic additive manufacturing processes with printed<br />

structures, the production of complex mechatronically integrated<br />

assemblies is realized. This not only aids to shorten production process<br />

chains and delivery times, but it can also implement customerspecific<br />

production and design freedom across all relevant economic<br />

sectors. Instead of semiconductor processes, printing processes<br />

for the additive processing of functional materials are used<br />

in printed electronics, with emphasis on simple and large-area electronic<br />

systems. While additive printing processes provide electrical<br />

functionality for a variety of applications based on different materials<br />

and technologies, digital printing processes can be used to create<br />

3D functional structures for high-frequency applications. The rapid<br />

developments in the field of printed electronics open new potential<br />

for the functionalization of components.<br />

www.fuji-euro.de<br />

Mastering electronics<br />

automation<br />

Make the switch to consistent output.<br />

From processing through assembly & test to final packaging.<br />

Stäubli’s range of clean, consistent high performance<br />

Robots provide flexible manufacturing solutions, even in the<br />

most sensitive electronic environments.<br />

Stäubli – Experts in Man and Machine<br />

www.staubli.com<br />

Stäubli Tec-Systems GmbH, Tel. +49 (0) 921 883 0, sales.robot@staubli.com<br />

<strong>EPP</strong> EUROPE April 2019 37

COVER<br />

Capabilities and limitations of AXI and 3D AOI<br />

I 4.0 for inspection<br />

in the electronics<br />

industry<br />

In a connected smart factory, all machines and systems essentially become<br />

smart sensors, collecting all possible data from the production line and the<br />

boards themselves. It is obvious that the quality of the raw data is one of the<br />

core components. Therefore, the accuracy and sensitivity of those sensors is<br />

very critical, especially in quality control systems such as AOI and AXI.<br />

Without diminishing the strong characteristics of the in-line inspection<br />

equipment, these still need assistive technologies for the verification of some<br />

challenging faults that appear at the same pace as the miniaturization of<br />

electronic assemblies.<br />

Ragnar Vaga, Yxlon International GmbH, Germany<br />

38 <strong>EPP</strong> EUROPE April 2019

COVER<br />

In recent years, Package on Package (POP) and Bottom<br />

Termination Components (BTCs) devices have become<br />

very important and widely used in the PCBA manufacturing<br />

process. Two of the most challenging PCBA process<br />

failures are component warpage and HoP defects. Therefore,<br />

achieving the best possible solder joint quality becomes<br />

an increasingly important consideration for the<br />

PCB assemblers. Most of the solder joints of a POP and<br />

BTC device are invisible by optical means, so X-ray inspection<br />

is the only way to examine the solder quality in a<br />

non-destructive way. At the same time, the only method<br />

for assessing the warpage and co-planarity issues of the<br />

component is 3D AOI.<br />

As a consequence, AXI and 3D AOI are more frequently<br />

used on the SMT lines. However, both these technologies<br />

have certain limitations that may need assistive<br />

technologies for the verification of possible false faults.<br />

The false-fault rate of the inspection system, one of the<br />

key items of the fault coverage, affects the overall efficiency<br />

of defect detection. Simply put, the more false<br />

faults you pass on to a repair station for validation, the<br />

more real defects could get missed. False faults generate<br />

costs. Each defect reported by AOI or AXI must be verified.<br />

If the reported defect turns out to be a false alarm,<br />

then its verification effort is a cost that could have been<br />

saved, because the verification did not create any real<br />

value. False-alarm verification costs include labor, capital<br />

equipment and other related costs such as factory overheads<br />

and panel handling.<br />

Due to the continuous miniaturization of SMT components<br />

and increasing complexity of the assemblies, false<br />

faults have not been eliminated so far and smart verification<br />

strategies should be implemented.<br />

Component warpage and Head on Pillow<br />

(HoP)<br />

Component warpage: For PoP packages, the warpage<br />

issue is always one of the most difficult for SMT process<br />

engineers, because it is easy to cause an open solder<br />

joint problem. The typical SMT defect modes, such as<br />

non-wet open, solder bridging, head and pillow, and noncontact<br />

open are applicable to both the joints between<br />

the PoP bottom package with the board and the PoP<br />

memory package.<br />

Package warpage is widely recognized as a primary factor<br />

in the formation of HoP. In fact, several industry consortia<br />

efforts are currently in progress to help characterize factors<br />

influencing package warpage behavior in an attempt<br />

to define mitigation measures. These include the iNEMI<br />

Package Warpage Qualification Criteria and the HDPUG<br />

FCBGA Package Warpage projects.<br />

Source: Yxlon<br />

Due to the continuous miniaturization of SMT components<br />

and increasing complexity of the assemblies,<br />

false faults have not been eliminated so far and smart<br />

verification strategies should be implemented.<br />

<strong>EPP</strong> EUROPE April 2019 39

COVER<br />

Typical SMT defect modes.<br />

Source: Yxlon<br />

In the case of a BGA warping, the corners have the largest displacement<br />

causing bridges.<br />

Virtually all BGAs warp, certainly plastic ones and some ceramic,<br />

and particularly those that have a complex internal structure and are<br />

not thermally balanced. In the case of a BGA warping, the corners<br />

have the largest displacement causing open and, potentially,<br />

bridges due to warping up (concave) and lifting above the circuit<br />

board or warping down (convex) and pushing into the solder paste,<br />

therefore causing bridges.<br />

Once a solder is open, the board will fail in the function or reliability<br />

tests and will need to be reworked. In addition, the rework of PoP<br />

packages is a challenge compared to the normal, single BGA. It is<br />

therefore critical to avoid unnecessary rework, if the connection is<br />

still reliable despite the warpage of the component.<br />

HoP: Open circuit at the ball interface is an increasingly problematic<br />

failure mechanism, since BGA components have been converted to<br />

lead-free alloys, lead-free solder is the norm in assembly and higher<br />

reflow temperatures are needed.<br />

However, there is some confusion about this critical defect. Headon-pillow<br />

defects can often be attributed to a chain reaction of<br />

events that begins as the assembly reaches reflow temperatures.<br />

Components generally make contact with solder paste during initial<br />

placement, and they start to flex or warp during heating, which may<br />

cause some solder spheres to lift. This unprotected solder<br />

sphere forms a new oxide layer. As further heating takes place, the<br />

package may flatten out, again making contact with the initial solder<br />

paste deposit. When the solder reaches the liquidus phase, there is<br />

insufficient fluxing activity left to break down this new oxide layer,<br />

resulting in possible HoP defects. Warping of the PCB causes the<br />

same fault, as does insufficient solder paste and poor stencil aperture<br />

design.<br />

On the other hand, HiP defects are actually very rare and even<br />

harder to detect. In this case, the shape of the solder ball may not<br />

have changed. The solder paste has reflowed, wetting the pad and<br />

40 <strong>EPP</strong> EUROPE April 2019<br />

Source: Yxlon<br />

When the solder reaches the liquidus phase, there is insufficient fluxing activity<br />

left to break down this new oxide layer, resulting in possible HoP defects.<br />

molding around the solder sphere. This type of defect is also referred<br />

to as ‘ball-in-up’ and many other names. A HiP defect can appear<br />

if the preheat time is too long and/or the dwell temperature is<br />

lower than required and the flux exhausts its activation and cleaning<br />

capability. In both cases, due to the lack of solder joint strength or<br />

contamination, these components may fail with very little mechanical<br />

or thermal stress. Eventual separation of what was never a<br />

proper metallurgical bond can lead to late-stage manufacturing defects<br />

and even early-stage field return issues.<br />

This potentially costly defect is not usually detected in functional<br />

testing but can be detected by X-ray systems. If not detected, these<br />

only show up as failures in the field after the assembly has been exposed<br />

to some physical or thermal stress.<br />

3D AOI as a sensor<br />

The continuing evolution toward advanced miniature packaging has<br />

led to ever increasing PCB density and complexity. As the manufacturing<br />

process becomes progressively more complicated, there is<br />

an ever increasing probability for defects to occur on finished PCB<br />

assemblies.<br />

References<br />

SMTA: BTC: Bottom Termination Component or Biggest Technical<br />

Challenge? Greg Caswell and Cheryl Tulkoff, ASQ CRE<br />

SMTA: Optimizing x-ray inspection with package on package: David A.<br />

Geiger, Zhen (Jane) Feng, Ph. D., Weifeng Liu, Ph.D., Hung Le, Tho Vu,<br />

Anwar Mohammed, Murad Kurwa<br />

SMTA: Collaboration between OEM and EMS to combat head on<br />

pillowing defects, Alex Chan, Paul Brown, Lars Bruno, Anne-Kathrine<br />

Knoph, Thilo Sack, David Geiger, David Mendez, Mulugeta Abtew,<br />

Iulia Muntele, And Michael Meilunas<br />

SMTA: Automated x-ray inspection: SMT process improvement tool,<br />

Zhen (Jane) Feng, Jacob Djaja, and Ronald Rocha<br />

Package-on-Package Warpage Characteristics and Requirements;<br />

Wei Keat Loh, Intel Malaysia, and Haley Fu, iNEMI<br />

Head-in-Pillow BGA Defects; Karl Seelig, AIM<br />

Source: Yxlon

Source: Yxlon<br />

A HiP defect can appear<br />

if the preheat time is too<br />

long and/or the dwell<br />

temperature is lower than<br />

required and the flux<br />

exhausts its activation and<br />

cleaning capability.<br />

Source: Yxlon<br />

User interface<br />

of 3D AOI.<br />

If the BGA ball is contaminated and does not wet, we get a result.<br />

For years, the Automated Optical Inspection (AOI) industry has relied<br />

solely upon two-dimensional (2D) inspection principles to test<br />

the quality of workmanship on electronic assemblies. While advancements<br />

in conventional 2D optical inspection have made this<br />

technology suitable for detecting such defects as missing components,<br />

wrong components, incorrect component orientation, insufficient<br />

solder, and solder bridges, there is an inherent limitation in the<br />

ability to inspect for co-planarity of ultra-miniature chips, leaded devices,<br />

BGA and LED packages. True co-planarity inspection of these<br />

challenging devices is an absolute necessity and requires the addition<br />

of a third dimension in inspection capability: 3D inspection technology.<br />

Although 3D inspection technology has existed for many years in<br />

the electronic inspection industry, this technology has primarily<br />

been reserved for inspecting solder paste depositions on printed circuit<br />

boards directly after the screen printing process. Over the past<br />

few years, however, 3D inspection has emerged as a viable technology<br />

for testing gull-wing and BGA devices as well as a host of other<br />

co-planarity sensitive circuitry on finished PCB assemblies. Of<br />

course, the main reason for the industry trend toward 3D inspection<br />

technology is to compensate for the limitations of conventional 2D<br />

inspection.<br />

The only limitation of 3D AOI is that it is an optical inspection system<br />

– it cannot see underneath any black devices, such as BGA,<br />

PoP, QFN, etc. Therefore, it does not allow the system to make a<br />

conclusive decision if the solder joints of the black devices are still<br />

acceptable, despite co-planarity or warpage issue.<br />

If one side of the BGA is lifted, it requires an additional verification in<br />

an off-line X-ray system or under a microscope. Manual inspection<br />

is always slower and more costly, but in many cases, it is the only<br />

way to verify the findings of the in line systems. In this particular<br />

case, the reason for co-planarity was one loose, small component<br />

underneath the BGA.<br />

Source: Yxlon<br />

Manual inspection is always slower and more costly but, in many<br />

cases, the only way to verify the findings of the in line systems. In<br />

this particular case, the reason for co-planarity was one loose, small<br />

component underneath the BGA.<br />

Source: Yxlon<br />

AXI as a sensor<br />

The use of AXI for printed circuit board inspection continues to grow<br />

in manufacturing, especially on high-density/high complexity<br />

boards. The AXI is an effective test tool for solder joint inspection,<br />

and it usually detects about 90 % of the total defects on a circuit<br />

board assembly. The AXI uses 3D X-ray testing to locate manufacturing<br />

defects; this is especially important to increase coverage on<br />

boards with limited access. The AXI pinpoints the exact location of<br />

defects, and thus repairs are both fast and inexpensive. The AXI is<br />

an ideal tool for testing high-reliability boards with medium-to-highcomplexity<br />

designs and components that have limited visual and<br />

electrical access. The AXI covers most of the process fault spectrum,<br />

including short, open, insufficient/excess solder, misaligned<br />

and missing components, reversed polarized capacitors, and even<br />

unreliable solder joints that might escape electrical tests.<br />

One of the challenges in AXI performance is to detect HoP and<br />

open defects for optically hidden solder joints, such as BGA, BTC,<br />

POP, and other advanced packages. The in-line X-ray inspection systems<br />

try to find HoP defects by looking at BGA balls in at least 3 different<br />

positions – the PCB Pad slice, the BGA Mid-ball slice and The<br />

Package Slice. The images are automatically analyzed with the original<br />

CAD-based designs and user definable settings.<br />

The advanced algorithms and adjustable magnification allow defining<br />

if the particular ball is smaller or bigger than its neighbors. With<br />

challenging components, the number of slices can even be increased,<br />

but then the required time also increases. However, most<br />

in-line X-ray inspection systems have rather high false-fail rates.<br />

False failure calls cannot be eliminated completely, but the rate<br />

must be reasonable for the production line. These findings should<br />

be confirmed either on a verification station or inspected again on a<br />

high-end at-line X-ray system.<br />

Source: Yxlon<br />

<strong>EPP</strong> EUROPE April 2019 41

COVER<br />

Source: Yxlon<br />

Head on Pillow slices.<br />

Oblique view of BGA with 16bit DFP.<br />

Source: Yxlon<br />

Source: Yxlon<br />

BGA Overview: The advanced algorithms and adjustable<br />

magnification allow defining if the particular<br />

ball is smaller or bigger than its neighbors.<br />

Source: Yxlon<br />

The proper search of HoP defects requires<br />

high-resolution oblique view images.<br />

X-ray sources, and some can perform in<br />

three different modes – nanofocus, microfocus<br />

and high-power modes. Due to the<br />

mechanical design, an at-line system can<br />

also gain better

COVER<br />

Source: Yxlon<br />

An at-line x-ray system should<br />

become an additional high-end<br />

sensor that can compensate, for<br />

example, for the limitations of<br />

AXI or 3D AOI.<br />

Source: Yxlon<br />

A solution like smart factory can add value in different phases of production.<br />

Zusammenfassung<br />

Der Artikel zeigt, dass derzeit die beste intelligente Lösung für eine<br />

Qualitätskontrolle in der Elektronikproduktion die Kombination aus<br />

menschlicher Intelligenz und Algorithmen darstellt.<br />

Résumé<br />

L‘article indique qu‘à l‘heure actuelle, la solution la plus adapté<br />

pour le contrôle de qualité dans la production électronique est une<br />

combinaison d‘intelligence humaine et d‘algorithmes.<br />

Резюме<br />

В статье рассказывается о лучшем на текущий момент<br />

интеллектуальном решении для проведения контроля<br />

качества электронных продуктов, представляющем собой<br />

комбинацию человеческого интеллекта и алгоритмов.<br />

of settings and limits to ensure that the product produced remains<br />

within the optimum process window, yielding a potentially 100 %<br />

acceptable product coming off the line, at least in terms of assembly<br />

defects. It is also a big step towards “full automation” and,<br />

therefore, well worth embracing as a way of improving yields and<br />

reducing costs.<br />

Considering all this, an at-line X-ray system should become an additional<br />

high-end sensor that can compensate, for example, for the<br />

limitations of AXI or 3D AOI.<br />

An at-line system is essentially an off-line system that is linked to<br />

the production line and placed beside it, allowing real-time response<br />

to issues and making the X-ray system a tool of the production and<br />

QA teams and not simply a test machine in a lab, used by QC staff.<br />

This solution is simple to implement and, therefore, reliable. The atline<br />

X-ray can be connected to an in-line 3D AOI or in-line AXI inspection<br />

system directly where it becomes a smart verification tool,<br />

where only questionable and unsolved faults will be transferred for<br />

repeat inspection on a high-resolution at-line X-ray system. The inspection<br />

results can be stored on the system PC, but can also be<br />

exported to the customer’s MIS.<br />

The connectivity of the at-line system is based on Internet Protocol<br />

(IP) via Transmission Control Protocol (TCP). Further use of data (collation<br />

and visualization of results from different inspection systems)<br />

will depend on the end customer’s demands and capabilities. The<br />

collected data allows us to understand what has happened in the<br />

past to make predictive analyses about future trends. The general<br />

task is to provide a dashboard view to the Process Manager who<br />

can track down the possible problem areas and initiate proactive<br />

measures to improve the quality of production, before rejects or<br />

scrap units are produced.<br />

Added value of smart factory<br />

The ultimate target for this solution is to increase production yield<br />

and reduce the manufacturing costs, including troubleshooting and<br />

rework. In high-reliability products, for instance aerospace, military<br />

and automotive, there is no room for uncertainties. All possible defects<br />

have to be verified and reworked. Conventional methods for<br />

troubleshooting are the ICT, microscope, etc. These are usually<br />

quite expensive and should be avoided at any costs.<br />

As a reference, we can use 700 USD as the hourly cost of the ICT<br />

method (incl. technology, labor and overheads). 400 USD per hour<br />

will be an average cost of a PCB rework. Obviously, these numbers<br />

vary from country to country but should reflect the industry standard.<br />

The value of this smart factory to the user will be on-demand<br />

locations scanned from 2 different inspection systems – 3D AOI and<br />

X-ray – which can be compared side-by-side so that the user can<br />

make an informed and conclusive decision on the defect calls.<br />

Conclusion<br />

Based on our studies, we conclude that the AXI and 3D AOI algorithm<br />

threshold settings are critical for detecting certain PCBA process<br />

failures. The AXI and 3D AOI program optimization is based on<br />

its measurement data analysis. Per current AXI and 3D AOI performance,<br />

it is beneficial to utilize the AXI or 3D AOI equipment jointly<br />

with an at-line X-ray system for verifying defective location for AXI<br />

and 3D AOI algorithms optimization process. A solution like smart<br />

factory can add value in different phases of production. The major<br />

value of smart factory comes from regular production, where a<br />

company with an average production yield of 90 % can increase it to<br />

99,5 %. At the moment, the best smart factory quality control solution<br />

is the combination of human brainpower and algorithms.<br />

www.yxlon.com<br />

<strong>EPP</strong> EUROPE April 2019 43


EMS provider with a new innovative line concept<br />

Producing top quality<br />

up to 30 % faster<br />

Expert knowledge of highly complex product designs for chip verification (FPGA) that meet the toughest technical<br />

demands is the trademark of PRO Design Electronic GmbH. It’s why customers from all over the world come<br />

to the Bavarian EMS provider. And this in turn is reflected in the growing order books and the resulting need to<br />

further expand the company’s in-house SMT production. To do this, the company has added a new SMT line from<br />

ASM that consists of a stencil printer and three placement machines. During the evaluation process for the new<br />

equipment, the company placed great emphasis on its increased quality requirements as well as on high<br />

accuracy and flexibility for its high-mix environment.<br />

Source: ASM<br />

PRO Design Electronic in Bruckmühl is a full-service solution provider<br />

from the idea to the finished product. Its customers come<br />

predominantly from high-quality markets, such as the automotive,<br />

medical technology, aerospace and semiconductor industries. In addition<br />

to providing production services, the company offers its own<br />

Components of size 01005 are nothing special, and BGA pitches can be as<br />

small as 350 μ, all of which is no problem for the new DEK NeoHorizon and<br />

the Siplace SX machines.<br />

Left to right: Günter Herbold, ASM, with René Dösinger, Head of Production<br />

Planning at PRO Design Electronic, PRO Design CEO Gunnar Scholl, and Katrin<br />

August, Product Marketing Manager at PRO Design.<br />

Source: ASM<br />

family of “proFPGA” prototyping products. They do not just manufacture<br />

for others, but also focus on product development and<br />

layout. Over more than 30 years, the company has become known<br />

for its expertise in highly complex product designs that meet the<br />

highest technical requirements. To be ready for the future and to<br />

meet its rising order volume, the company decided last year to add<br />

a new production line to its SMT factory. At the end of the evaluation<br />

process, ASM came out as the winner. The new DEK NeoHorizon<br />

printer and the three new Siplace SX machines impressed the<br />

decision-makers with their high precision and reliability thanks to<br />

the state-of-the-art Siplace vision system. Quick with simple programming,<br />

the ease with which new components can be described,<br />

high feeder capacities and simple programming via a clear, Germanlanguage<br />

user interface were additional factors in favor of ASM. The<br />

line also features a new Rehm oven with vacuum technology for<br />

shrinkage-free soldering.<br />

High-mix production handles various components<br />

and FPGA chips<br />

With the company’s specialization in complex products designs, the<br />

jobs PRO Design Electronic runs in its internal SMT production and<br />

tend to be characterized by a high degree of component diversity<br />

and density. 400 different products are manufactured on two SMT<br />

lines, including circuit boards with up to 4,500 components and 200<br />

different component types. Components of size 01005 are nothing<br />

special, and BGA pitches can be as small as 350 μ. All of this is no<br />

problem for the printer and the placement machines. Since the installation<br />

of the new SMT line, the companies printing quality has<br />

increased significantly, and the new printer is much more flexible<br />

than the old equipment. “Our production is incredibly diverse. Our<br />

own products as well as those of our customers demand versatility<br />

and precision. Some of our jobs involve very expensive components,<br />

which is why the SMT line is not allowed to make mistakes.<br />

In addition, we need high feeder capacities, because our frequent<br />

setup changeovers require us to be quick and flexible. ASM’s line<br />

concept convinced us completely. The three Siplace SX machines<br />

provide roughly 360 feeder slots,” explains EMS provider CEO Gunnar<br />

Scholl. “High-volume components stay on the line, and fast<br />

setup changeovers can be executed with great flexibly thanks to the<br />

random setup capability of the company. Even 01005 components<br />

as well as exotic and unwieldy shapes can be handled with ease.<br />

44 <strong>EPP</strong> EUROPE April 2019

PRO Design Electronic also builds its<br />

own line of “proFGPA” prototyping systems<br />

that are based on FGPA technologies.<br />

PRO Design Electronic GmbH<br />

Source: PRO Design Electronic<br />

With over 100 employees, PRO Design Electronic has manufactured<br />

electronics products for an international customer based in highquality<br />

markets like the automotive, medical technology and semiconductor<br />

industries for over 30 years. As an EMS provider, the company<br />

offers the complete spectrum of services for consulting, development,<br />

layout and prototyping and volume production. The company specializes<br />

in demanding designs with high component densities, complex<br />

shapes and diverse components ranging in size from 01005 to<br />

200 x 120 mm. The company also builds its own line of “proFGPA”<br />

prototyping systems that are based on FGPA technologies. The systems,<br />

which are used for testing new chip designs and their corresponding<br />

software, require the high-quality placement of especially<br />

expensive components.<br />

With its new production line consisting of a DEK NeoHorizon 03iX,<br />

three Siplace SX machines and two new Rehm reflow ovens with vacuum<br />

technology for shrinkage-free soldering, the company produces<br />

its jobs 30 percent faster than before with minimum downtime and<br />

zero placement errors.<br />

We can even get the stencils for our more complex boards from<br />

ASM. They meet all of our needs to the fullest.”<br />

Faster, minimal downtime, and a technology<br />

partner that is always available<br />

The flexibility of the new line was apparent from the start. Since the<br />

EMS provider was still building a new production hall for it at its<br />

plant in Bruckmuehl, its people could start training and run some initial<br />

products on a standalone solution with a two-gantry Siplace SX<br />

in its existing plant. As soon as the new building was completed,<br />

two more placement machines were added and the gantries reconfigured.<br />

The production could start right away. And since the second<br />

SMT line continued to operate, there were no production interruptions.<br />

“Switching to an entirely new system with the new machines was a<br />

challenge for our line staff, of course. But ASM safely supported us<br />

throughout the training process, and we are very happy and satisfied<br />

with the modern and speedy programming options for the<br />

printer and the placement machines,” says René Dösinger, Head of<br />

Production Planning at the EMS provider. “ASM’s support was also<br />

quite impressive. Having the SMT Center of Competence so close<br />

by in Munich was especially helpful. During our visits we learned a<br />

lot from their experts and were kept up-to-date on the latest technological<br />

and functional developments.”<br />

“The conversion to ASM was a complete success,” summarizes<br />

Scholl. “With a little more practice, our setup changeovers will become<br />

even faster in the future. But we can already state that the<br />

new line enables us to produce roughly 30 percent faster than before<br />

while meeting all our customers’ quality requirements. We do<br />

not regret our decision in favor of ASM.”<br />

For the future, the EMS provider plans to add high-performance<br />

computing to its business as a third segment. With its flexible gantry<br />

concept, the new line can easily accommodate this growth. Another<br />

project on the agenda: “Today all production steps are linked<br />

and affect each other. In a high-mix environment like ours, the material<br />

management must function seamlessly, which is why we<br />

want to take a look at the Material Manager and other options very<br />

soon. An integrated warehousing solution will give our productivity<br />

another significant boost,” says Dösinger.<br />

SMTconnect, Booth 5-311<br />

www.asm-smt.com; www.prodesign-europe.com<br />

Zusammenfassung<br />

Ein EMS-Dienstleister erweiterte seinen Maschinenpark um eine<br />

neue SMT-Linie mit Schablonendrucker sowie drei Bestückmaschinen<br />

desselben Herstellers. Der Fokus bei der Auswahl lag dabei<br />

auf gesteigerte Qualitätsansprüche, hohe Genauigkeit und Flexibilität<br />

bei einem vielfältigen Produktmix.<br />

Résumé<br />

Un prestataire de services EMS a élargi son parc de machines<br />

avec une nouvelle ligne SMT, qui contient une imprimante a stencil<br />

et trois machines de placement du même fabricant. La sélection<br />

s‘est concentrée sur un besoin d‘exigences accrues en qualité,<br />

précision et flexibilité, dans une gamme diversifiée de produits.<br />

Резюме<br />

Разработчик микроэлектронных схем расширил свой парк<br />

оборудования за счет новой линии поверхностного монтажа с<br />

трафаретным принтером, а также тремя автоматами для<br />

установки компонентов того же производителя. Выбор был<br />

обусловлен возросшими требованиями к качеству, высокой<br />

точностью и гибкостью при работе с широким спектром<br />

продукции.<br />

<strong>EPP</strong> EUROPE April 2019 45



Material manager for entire production process<br />

Asys is committed to the automation of manufacturing.<br />

This includes integrating intelligent<br />

software solutions into the production environment<br />

and processing the data streams<br />

generated there. In its latest software solution<br />

– the Material manager – the company uses<br />

this data to implement orderly and automatic<br />

order processing within production.<br />

The Material manager collects data on all elements<br />

of a production process– from AIVs<br />

to warehouse systems, process machines<br />

and modules installed in machines. It then<br />

evaluates this data and makes the right decisions<br />

based on it. It ensures that the right<br />

material arrives at the right place at the right<br />

time. “It takes into account important parameters<br />

such as floor lifetime and the availability<br />

of autonomous transport robots“, says<br />

Florian Ritter, Unit Director Software Solutions<br />

& New Business.<br />

In addition, the software independently determines<br />

a line’s material demands. It knows<br />

when a new order starts on a line and what<br />

material it requires. It automatically initiates a<br />

The Material manager looks after the entire process, ensuring the right materials arrive at the<br />

right place and at the right time.<br />

just-in-time supply to the line, avoiding downtimes.<br />

The Material Manager can also be used<br />

to map the entire movement of goods within<br />

production. “RFID technology allows material<br />

to be tracked at any time during production.<br />

Based on this data, paths and processes can<br />

be mapped, evaluated and optimized,” he describes<br />

this being the new way of meeting the<br />

traceability requirements in the production.<br />

In software topics, the company relies on<br />

openness from the beginning. For example,<br />

Pulse was able to establish itself on the mar-<br />

ket as the preferred assistance system within<br />

a very short time. They pursued the same concept<br />

with the OIC software (Overall Inline<br />

Communication) also to the material manager<br />

external systems can be connected. Ritter<br />

emphasizes: “Vendor independencies important<br />

to us. For example, we can integrate any<br />

placer system into the Material Manager, as<br />

well as various storage and robot systems.”<br />

SMTconnect, Booth 4A-324<br />

www.asys-reinraum.de<br />

Source: Asys<br />

Primerless silicone encapsulant protects LED<br />

Dow, a provider of silicones, silicon-based<br />

technology and innovation,<br />

unveiled DOWSIL EI-2888<br />

primerless silicone encapsulant,<br />

an optically-clear silicone for professional<br />

LED lighting that cures<br />

at room temperature. This advanced<br />

silicone technology provides<br />

superb optical performance<br />

without compromise and<br />

offers unique rheological properties<br />

for use with light fixtures in a<br />

variety of shapes and forms. Designed<br />

for explosion proof and<br />

high ingress protection rated luminaries,<br />

the encapsulant is also<br />

cost-effective to buy and use as<br />

its patented composition does<br />

not contain platinum– unlike<br />

other silicone solutions currently<br />

available on the market.<br />

“LED luminaries in harsh environments<br />

need protective materials<br />

that are reliable, easy to<br />

apply, and that provide robustness<br />

of cure,” said Konstantin<br />

Sobolev, Strategic Marketing<br />

Manager. “DOWSIL EI-2888 primerless<br />

silicone encapsulant<br />

eliminates a time-consuming<br />

processing step and reduces<br />

waste that can occur if curing is<br />

compromised by surface contaminants<br />

or moisture. This lowviscosity<br />

silicone also dispenses<br />

readily and adheres reliably without<br />

sacrificing optical properties.<br />

It is an excellent choice for many<br />

professional applications, including<br />

explosion proof lighting, outdoor<br />

displays, and flexible and<br />

rigid LED strips.”<br />

A two-part protective material<br />

with a 1:1 mix ratio, DOWSIL<br />

EI-2888 cures at room temperature<br />

with optional heat acceleration.<br />

This UL 94 compliant, 100<br />

percent polydimethylsiloxane<br />

Source: Dow<br />

(PDMS) silicone provides even<br />

curing and is insensitive to inhibition,<br />

a typical issue for platinum<br />

catalysts; and material reversion,<br />

a traditional problem in<br />

enclosed spaces at high temperatures.<br />

It can be applied with<br />

automated static or dynamic metered<br />

mixing, manual mixing, or<br />

with flow, pour or needle dispensing<br />

equipment. This novel<br />

self-priming encapsulant adheres<br />

to a variety of substrates and<br />

supports the design of innovative<br />

LED luminaires in IP-rated enclosures.<br />

www.dow.com<br />

The primerless silicone<br />

encapsulant is an optically<br />

clear silicone for<br />

professional LED lighting<br />

that cures at room<br />

temperature.<br />

46 <strong>EPP</strong> EUROPE April 2019

Flux remover chemistries to improve quality<br />

MicroCare <strong>Europe</strong> BVBA will<br />

showcase its popular cleaning<br />

chemistries at SMTconnect in<br />

Nuremberg. These products use<br />

formulations to help companies<br />

lower their PCB cleaning costs,<br />

improve product quality and<br />

meet increasingly stringent regulatory<br />

obligations.<br />

A product taking centre stage is<br />

the recently improved heavyduty<br />

flux remover – SuprClean<br />

fast drying and versatile, it delivers<br />

impressive cleaning even<br />

on the hardest jobs. Removing<br />

old-style rosin fluxes, as well as<br />

most acrylic and urethane conformal<br />

coatings, it eliminates<br />

white residue without rinsing or<br />

drying. Importantly it complies<br />

with the strict regulations and<br />

worker safety rules enforced by<br />

<strong>Europe</strong>.<br />

“The range of products we will<br />

be showcasing during SMTconnect<br />

are highly effective, longterm<br />

answers to the difficult<br />

cleaning issues facing production<br />

engineers in <strong>Europe</strong> today,” said<br />

Scott Wells, General Manager.<br />

“With cleaning chemistries to<br />

suit all applications, and contaminants,<br />

the company can offer a<br />

complete answer to specific<br />

cleaning requirements.”<br />

“We have evaluated our supply<br />

chain and will continue to maintain<br />

continuity of our products<br />

throughout <strong>Europe</strong>.”<br />

Another product being presented<br />

during the show, which<br />

also meets the <strong>Europe</strong>an F-Gas<br />

regulations and is REACH, GHS,<br />

WEEE- and ROHS compliant is<br />

the general-purpose flux remover<br />

C. Suitable for all types of<br />

electronics, this flux remover can<br />

be used on a variety of components<br />

including through-hole<br />

PCBs and SMT boards, hybrids,<br />

cables and connectors. This<br />

powerful, non-flammable cleaner<br />

is fast drying and easy to use, effortlessly<br />

removing no-clean and<br />

rosin fluxes in benchtop cleaning<br />

applications.<br />

Joining the spotlight will be the<br />

slow-drying citrus flux remover.<br />

A natural, biodegradable, heavyduty<br />

flux remover and degreaser,<br />

it delivers impressive cleaning.<br />

Working on all types of fluxes,<br />

pastes, inks, oils, grease, acrylic,<br />

silicone conformal coatings and<br />

most glues, it is now a staple addition<br />

to the benchtop.<br />

Working in combination with all<br />

the company’s aerosol flux removers<br />

is the TriggerGrip dispensing<br />

tool. Using the Trigger Grip<br />

saves money by reducing solvent<br />

usage by 66 % and ensuring<br />

the can empties completely. It<br />

also enhances worker safety by<br />

limiting exposure to the cleaning<br />

fluid fumes.<br />

SMTconnect, Booth 4-531<br />

www.microcare.com<br />

Your partner for<br />

trailblazing<br />

inspection solutions<br />

in the SMT production<br />

Source: MicroCare <strong>Europe</strong> BVBA<br />

The range of products<br />

from MicroCare will be exhibited<br />

at the SMTconnect tradeshow.<br />

Viscom's trailblazing inspection systems make it the partner of choice for all your assembly inspection needs.<br />

Its full spectrum of 2D, 2.5D and 3D optical inspection solutions, as well as X-ray inspection, guarantees<br />

outstanding inspection depth and fast handling. Viscom solutions ensure sustainable process optimization.<br />

Come see us and discover your ideal inspection solution.<br />

Stand No. 4A, 120<br />

3D SPI 3D AOI 3D AXI 3D MXI 3D Bond CCI www.viscom.com<br />

<strong>EPP</strong> EUROPE April 2019 47


Helping with continual path to improvement<br />

Consistent quality with robust<br />

design and process repeatability<br />

ACC Electronix has been providing electronics manufacturing services (EMS) to a diverse customer base for<br />

more than 40 years. It is an ISO 9001-2015 certified contract manufacturer that got its start in 1976 by providing<br />

quality equipment to the broadcast industry. In 1992, the company expanded on this foundation and began<br />

providing its electronic manufacturing and assembly services to other industries. Today, they serve customers<br />

in the industrial, agricultural, off-road, construction, mining, and medical markets.<br />

Curt Williams, ACC Electronix, Inc.<br />

ACC partnered with Ersa two years ago and has purchased two Versaflow 4/55 systems since then, to provide<br />

effective selective soldering solutions for customers.<br />

From prototypes to proven designs, ACC can help its customers<br />

achieve their goals for quality improvement, on-time delivery, inventory<br />

control, and cost reduction. Additionally, it develops a custom<br />

formula to assist in each customer’s success. Their process engineers<br />

work constantly to improve their manufacturing processes.<br />

Improvements range from selecting new manufacturing equipment<br />

to selecting solder with improved formulations. Other benefits of<br />

working with the company include design for manufacturability, design<br />

for testability, and manufacturing process selection.<br />

Two-sided mixed technology<br />

The company supports customers that have environmental concerns<br />

and need hardened electronic products (potting, conformal<br />

coating, adhesives, etc.). According to Mike Parker, Vice President<br />

Manufacturing, the enterprise has experienced tremendous growth<br />

over the past two years as top line revenue has grown over 2.5<br />

times. They have generated this growth by investing in the best<br />

Source: ACC Electronix<br />

equipment and capabilities, which add value<br />

for customers in terms of speed, quality and<br />

lower cost. Parker added: “We show no<br />

signs of slowing down in 2019 based on current<br />

new product launches, as well as, new<br />

customer demand.”<br />

To keep up with that type of growth, the<br />

company needed to purchase additional<br />

equipment. They looked to existing partner<br />

Kurtz Ersa. In 2017, the company purchased<br />

its first dual pot Versaflow 4/55. Based on its<br />

excellent performance, they purchased and<br />

installed a second machine 12 months later,<br />

in December 2018. Parker stated that they<br />

chose this same machine over any competitive<br />

systems because of Ersa’s long history<br />

in providing selective solder systems and its<br />

reputation for robust design and process repeatability.<br />

The company is already noticing measurable<br />

benefits from having these two systems in<br />

its facility. “Our customers’ need for twosided<br />

mixed technology with extremely tight<br />

component spacing has increasingly eliminated<br />

wave soldering as an effective process solution. The control<br />

and repeatability of our Versaflow machines allow our process engineering<br />

team to dial in the solder process for each joint, resulting<br />

in consistent quality,” said Parker. “Originally, we were concerned<br />

about throughput of the selective soldering process, but with the<br />

modular design of the Versaflow and its ability to have units at each<br />

stage of the process (flux, preheat, solder), we have been thrilled<br />

with the speed and quality output.”<br />

Keeping consistent quality<br />

Meeting customers’ needs while being flexible and providing high<br />

quality is an important part of ACC’s mission. From hand-built to<br />

prototypes to high-volume production, the company has the resources<br />

needed. Its production facility is designed to efficiently<br />

handle diverse customer production requirements, product testing<br />

and final product assembly. Additionally, the company views its customers<br />

as partners. Parker said that they act as an extension of their<br />

48 <strong>EPP</strong> EUROPE April 2019


Source: ACC Electronix<br />

The company values its employees<br />

and provides regular<br />

training to help improve efficiency<br />

across the facility.<br />

electronics-manufacturing departments. “ACC’s personalized customer<br />

service is most effective when we are partnered with our<br />

customers,” Parker added. “By involving our manufacturing experts<br />

early in the design process, we can provide valuable assistance that<br />

will significantly reduce startup problems, increase quality and reduce<br />

cost. We will use our ISO-certified procedures to build customers’<br />

product.”<br />

As a result, the company knows how important strong service is to<br />

the success of any partnership. Parker said that after the initial trip<br />

to Kurtz Ersa, they knew that it was going to be a good fit, and that<br />

Zusammenfassung<br />

Um dem rasanten Wachstum gerecht zu werden, investierte ein<br />

Elektronikfertigungsdienstleister (EMS) aufgrund der langen Geschichte<br />

in der Bereitstellung von Selektivlötsystemen und dem Ruf<br />

für robustes Design und Prozesswiederholbarkeit für dasselbe Selektivlötsystem,<br />

das bereits 12 Monate zuvor gekauft wurde.<br />

Résumé<br />

Grace a un système de soudage sélectif, acheté 12 mois plutôt, un<br />

fournisseur de services de fabrication électronique (EMS), pour répondre<br />

aux fortes demandes, a investi dans ce même système qui<br />

dans ce domaine avait une réputation de conception robuste et de<br />

répétabilité des processus de soudage sélectif.<br />

Резюме<br />

Чтобы соответствовать темпам развития компании,<br />

разработчик микроэлектронных схем принял решение<br />

инвестировать в систему селективной пайки, аналогичную той,<br />

что уже была приобретена год назад. При этом<br />

определяющими факторами был богатый опыт производителя<br />

оборудования в сфере систем селективной пайки, надежная<br />

конструкция и высокая повторяемость процессов.<br />

they were impressed not only with the equipment, but also with the<br />

people and support of the team. He added that ACC has received<br />

quick, informative responses to application questions whenever<br />

needed, and that the service has been excellent.<br />

The company’s facility is customized specifically for electronics<br />

manufacturing and runs updated programs to maximize quality and<br />

efficiency. Other facility features include high-efficiency lighting for<br />

maximum illumination in the hand assembly area, air locks and<br />

power humidifiers for temperature/humidity control, conductive<br />

floors for maximum ESD protection, and an ESD program in which<br />

foot/wrist straps and conductive jackets are worn to dissipate electro-static<br />

energy in a controlled manner into its conductive floors<br />

and work benches. Additionally, they use online work instructions to<br />

eliminate paperwork and control documents as well as cell workgroups<br />

to improve efficiency and quality by eliminating batch processing.<br />

Finally, all employees continually attend lean training to<br />

further improve efficiency.<br />

ACC provides a range of electronics manufacturing services. While<br />

full product assembly is its specialty, PCB assembly is core to<br />

everything built by them. This includes surface mount assembly as<br />

well as fine-pitch placement, BGA/LGA placement, through-hole assembly<br />

hand-built prototypes, product verification builds (pilot runs),<br />

high-volume production, in-circuit testing, functional testing, monitored<br />

burn-in, conformal coating, final assembly services (box<br />

builds), full-range manufacturing services and in-warranty/out-ofwarranty<br />

repair. As additional resources, the company provides design<br />

for manufacturability assistance and design for testability recommendations.<br />

Quality is another important aspect for the company, as they are<br />

ISO 9001-2015 certified and committed to the ISO concept of continuous<br />

improvement. They use IPC-A-610E as its soldering and assembly<br />

standard and, depending on customer need, solders to<br />

either IPC Class 2 or Class 3 industry standards.<br />

SMTconnect, Booth 4-111, 5-434B<br />

www.kurtzersa.com; www.accelectronix.com<br />

<strong>EPP</strong> EUROPE April 2019 49


ADAS take advantage of the flexible, small form factor approach<br />

Solder paste attributes<br />

for SiP assembly<br />

Due to the rapid development of internet-of-things (IoT) edge devices, the industry has seen a surge in demand for<br />

system-in-package (SiP) assemblies, which are capable of increased functionality in a smaller package format 1) . The<br />

automotive industry has also started to take advantage of this flexible, small form factor approach in a variety of different<br />

system types—especially in advanced automated driver assistance (ADAS) applications. The SiP element places higher<br />

requirements on the assembly process, especially solder paste, fluxer chemistry, and reflow.<br />

Sze Pei Lim, Kenneth Thum, Dr. Andy C. Mackie, Indium Corporation<br />

Fine-feature solder paste printing for passive component sizes,<br />

from 01005 (0.4 mm x 0.2 mm) and now down to 008004<br />

(0.25 x 0.125 mm), has become more challenging in SiP assembly.<br />

Due to small stencil aperture designs, finer powder size solder<br />

pastes, typically type 5 (15 – 25 μm), type 6 (5 – 15 μm), and type 7<br />

(2 – 11 μm), are used for these applications. Since more components<br />

are being packed into a SiP, the rheology of the solder paste is an important<br />

attribute, as the gap between neighboring pads can be as<br />

close as 50 μm. Solder paste with minimal slump behavior will be<br />

required to minimize bridging in such designs. Consistency in solder<br />

paste printing transfer efficiency, stencil life, good wetting, graping<br />

resistance, and minimal voiding are other key attributes of solder<br />

paste for SiP assembly as well.<br />

Desire for zero failures<br />

As the trend toward miniaturization in SiP applications continues,<br />

from current 01005 components going down to 008004 (0201 m) or<br />

even 0050025 for next generation packages, the printing performance<br />

of solder paste becomes critical. The conventional SMT solder<br />

paste printing process using type 3 or type 4 powder size has<br />

evolved into a more complicated printing process for SiP, using<br />

types 5, 6, or even 7 powder size, with much smaller stencil apertures,<br />

thinner stencils, and more stringent requirements for allowed<br />

paste deposit variability.<br />

SiP, and similar forms of heterogeneous integration, are now being<br />

adopted in complex automotive systems where space is a premium.<br />

For many years there was confusion about the appropriate<br />

reliability testing for these packages, but the recent issuing of<br />

AEC-Q104 Failure Mechanism Based Stress Test Qualification for<br />

Multichip Modules (MCM) in Automotive Applications makes it clear<br />

that SiP can be covered within the main AEC-Q100 spec, SiP…. can<br />

be qualified within the scope of AEC-Q100 per Section 2.1.<br />

The desirability of zero failures for complex systems, ultimately<br />

driven by the desire for increased safety, and most especially by<br />

Powder size is classified by type according to IPC J-STD-005A.<br />

Source: Indium<br />

Source: Indium<br />

Comparison of the mentioned flux systems.<br />

Source: Indium Source: Indium<br />

Different solder powder sizes and their stencil requirements.<br />

Summary of the paste specimens.<br />

50 <strong>EPP</strong> EUROPE April 2019


Test vehicle Practical<br />

Components board.<br />

Source: Indium<br />

ISO-26262:2018 (road vehicles: functional safety) has meant a dual<br />

approach for automotive system design engineers: design for reliability<br />

at the ppb level, and (unfortunately from a cost perspective)<br />

build-in redundancy for mission-critical subsystems. Consistent,<br />

low-voiding solder joints lead to enhanced reliability. It is the SiP assemblers’<br />

task to create reliable miniature solder joints, even when<br />

dealing with fine-pitch solder paste at quantities of tonnes per year.<br />

In addition to printing a smaller and thinner solder paste deposit, the<br />

gap between neighboring pads is smaller, too. Some customers are<br />

already looking at a gap of 50 μm between pads. In order to achieve<br />

good and consistent printing performance under such challenging<br />

conditions, besides having good printer setup and appropriate stencil<br />

technology 2) 3) , the choice of correct powder size, flux system,<br />

rheology, and slump behavior of solder pastes is key.<br />

Solder powder<br />

Powder size is classified by type according to IPC J-STD-005A. The<br />

table outlines the different solder powder sizes available in the electronics<br />

and semiconductor industries. Although types 3 – 5 are increasingly<br />

in use for SMT, some OSATs (outsourced semiconductor<br />

assembly and test companies) and others are already using powder<br />

size type 6 for SiP with 01005 chips; for next generation packages<br />

with 008004 chips, both types 6 and 7 powder sizes are being considered.<br />

It is a general industry guideline that in order to achieve consistent<br />

solder paste printing performance, it is important to choose the correct<br />

powder size so that a minimum of 5 – 6 solder particles (the<br />

large particle size of the range) can be maintained across the aperture.<br />

According to this rule, there is a recommended minimum stencil<br />

aperture for each powder type.<br />

Another concern when choosing a smaller powder size is the increase<br />

in the powder surface area. As shown in the table, when<br />

powder size decreases from type 3 to type 7, the powder surface<br />

Source: Indium<br />

Different stencil designs were used.<br />

Pressure to wipe the stencil surface clean.<br />

Source: Indium<br />

Source: Indium<br />

Both vacuum support and carrier pallet are capable setups.<br />

The characteristics of the four tested soldering profiles.<br />

Source: Indium<br />

<strong>EPP</strong> EUROPE April 2019 51


Source: Indium<br />

Source: Indium<br />

Soldering profile 1. Soldering profile 2.<br />

area increases significantly. This increased powder surface area will<br />

require more flux activation, or flux with a better oxidation barrier to<br />

protect the powder from surface oxidation 2) . Hence, it is important<br />

to both choose a correctly formulated flux that works with finer<br />

powder, as well as a solder powder with a low oxide level. These<br />

factors will enhance the stability of the fine-pitch solder paste in<br />

terms of shelf life, stencil life, and wetting or solderability performance.<br />

Excessive activator levels can also destabilize the paste, so<br />

flux formulation is complex.<br />

Flux system<br />

Different types of flux systems are typically available: water-soluble<br />

flux, standard no-clean flux, and more recently, the ultra-low residue<br />

(ULR) no-clean flux have seen widespread use, especially in semiconductor<br />

assembly applications 4) .<br />

Currently, most SiP applications use the water-soluble flux system,<br />

where the residue is cleaned away using water after reflow, followed<br />

by the drying and overmolding steps. As the miniaturization<br />

trend continues, some SiP applications will soon reach a point<br />

where effective cleaning with a very tight gap and standoff becomes<br />

challenging, and using an ultra-low residue no-clean paste<br />

will be necessary. This new class of solder paste enables all cleaning<br />

and chemicals process costs to be eliminated, while reducing<br />

both component warpage and cycle time.<br />

Acknowledgement<br />

Special thanks to Indium Corporation’s Suzhou Simulation Lab team –<br />

Ms. Wisdom Qu, Dr. Fiona Chen, and Leon Rao – for their help and<br />

support in performing the solder paste printing tests in their lab. First<br />

presented at IWLPC, October 2016, San Jose, California.<br />

Paste rheology<br />

Decreasing the powder size of the solder paste increases the viscosity,<br />

though, since the flux vehicle itself is thixotropic. The paste<br />

used in stencil printing is a shear-thinning thixotropic material 5) with<br />

a low yield stress, the rheology being governed by both the flux system<br />

and the solder powder. The paste rheology controls a variety of<br />

factors: paste aperture filling ability, transfer efficiency of paste from<br />

stencil onto substrate, and the shape of the paste deposit after<br />

printing. These are keys for good printing performance of a solder<br />

paste.<br />

Paste slump<br />

The term “slump” describes an x-y direction expansion of the solder<br />

paste deposit caused by gravity. A yield stress in the paste can prevent<br />

slump. A metal load that is too high can give the paste a very<br />

high yield stress and prevent the paste from filling and releasing<br />

from stencil apertures; therefore, optimizing the metal load for the<br />

printing process is important and is driven by several factors.<br />

Paste stencil life<br />

A solder paste with long stencil life is important to reduce print-toprint<br />

variability over time. Typically, a stencil life of at least 4 to 8<br />

hours will be required for a high-volume manufacturing environment.<br />

Printing experiment<br />

Several combinations of paste, tooling setup, and stencil aperture<br />

sizes were investigated, together with three solder paste specimens<br />

featuring different flux chemistries and different powder sizes.<br />

Also, a board support system of pallet and vacuum support were<br />

compared to investigate whether the use of a pallet alone could<br />

allow the printing process to achieve a comparable consistency. Finally,<br />

laser-cut and electroformed stencils were compared by printing<br />

different apertures sizes.<br />

52 <strong>EPP</strong> EUROPE April 2019


Source: Indium<br />

Source: Indium<br />

Soldering profile 3. Soldering profile 4.<br />

Test vehicle<br />

A test vehicle was specially designed to mimic a typical substrate<br />

size of 237 mm in length, 62 mm in width, and 0.5 mm thick. There<br />

are two arrays of pads on the test vehicle. Each row has different<br />

pad sizes: 150 μm x 125 μm on row 1; 150 μm x 100 μm on row 2, and<br />

150 μm x 112.5 μm on row 3. Each column has a different gap distance<br />

between pads, i.e., 50 μm, 80 μm, 100 μm, 130 μm, and<br />

150 μm. Pads are arranged in horizontal and vertical positions such<br />

that different squeegee wiping directions could be simulated. The<br />

pad surface finishing is NiAu (ENIG, electroless nickel immersion<br />

gold ) and are non-solder mask defined (NSMD). The test vehicle<br />

also consists of 01005 pads, but it is not the focus.<br />

Paste specimens<br />

Three flux vehicles were chosen in this printing test: two water-soluble<br />

fluxes and one no-clean flux. These three fluxes were mixed<br />

with type 6 and 7 powders. As finer powders yield higher viscosity,<br />

a slight tweak in the metal load for type 7 pastes is needed to reduce<br />

the viscosity to about the same viscosity as the type 6 solder<br />

pastes.<br />

Stencil design<br />

Three stencils were prepared for this study: one 50 μm-thick lasercut<br />

stencil and two electroformed stencils with thicknesses of<br />

35 μm and 50 μm. The laser cut stencil has a 1-to-1 opening with the<br />

pad size on the test vehicle, while the left array of the electroformed<br />

stencil follows a 1-to-1 opening, and the right array has a smaller<br />

aperture. The two electroformed stencils have the same aperture<br />

designs but only differ in the stencil thicknesses.<br />

Equipment and tooling setup<br />

• DEK Horizon printer<br />

• Koh Young SPI machine<br />

• 12 “ squeegee at 60 ° wiping angle<br />

• Vacuum support<br />

• Carrier pallet<br />

Printing parameters<br />

Print speed was fixed in all experiments while the squeegee pressure<br />

was adjusted so that minimum pressure was used in each experiment,<br />

i.e., enough pressure to just wipe the stencil surface<br />

clean, see table. A minimum pressure is crucial in achieving consistent<br />

prints as excessive pressure could cause movement of the<br />

printing surface during the squeegee stroke. Cleaning frequency<br />

was set to three pieces, with a cleaning mode of wipe/vacuum/dry<br />

(W/V/D).<br />

Bridging between pads<br />

The comparison demonstrates a clear difference between tooling<br />

combinations. By using for the board support a carrier pallet, no<br />

bridging was observed down to an 80 μm gap distance when using<br />

a laser cut stencil. By using a vacuum support, the laser-cut stencil<br />

was able to achieve non-bridging at the 50 μm gap distance column.<br />

This suggests that the vacuum support provides a much better functionality<br />

with minimal gap between the stencil and PCB during printing.<br />

References<br />

1) Lim, Thum and Mackie: Meeting Solder Paste Printing Challenges<br />

for SiP in ‘Smart’ IoT Devices, Chip Scale Review magazine, Jul-Aug<br />

2016.<br />

2) Ed Briggs: Meeting Future Stencil Printing Challenges with Ultrafine<br />

Powder Solder Pastes, International Conference on Soldering and<br />

Reliability, Toronto, Canada, May 2014.<br />

3) Rita Mohanty Ph.D., S. Manian Ramkumar Ph.D., CEMA, Chris Anglin,<br />

Toshitake Oda: Effect of Nano-Coated Stencil on 01005 Printing,<br />

APEX 2011.<br />

4) Sze Pei Lim, Maria Durham, A. Mackie: No Clean Material For Advance<br />

Packaging Assembly, Semicon China, Feb 2016.<br />

5) Kravcik and Vehec: Study of the Rheological Behavior of Solder<br />

Pastes, Proc. Scientific Conference of Young Researchers 2010, FEI<br />

TU of Kovice.<br />

<strong>EPP</strong> EUROPE April 2019 53


Source: Indium<br />

For the water-soluble solder paste, the voiding is affected by different profiles.<br />

However, with electroformed stencils, one array prints encountered<br />

bridging. The amount of bridging increased from column 1 (50 μm<br />

gap) to column 5 (150 μm gap). The increased transfer efficiency of<br />

the electroformed stencil is most likely the cause for this distinct<br />

difference in print performance. The other array with reduced apertures<br />

did not give any bridging.<br />

Comparison of solder pastes<br />

On the other array, the aspect ratio ranges from 0.40 to 0.45 only for<br />

a 50 μm thick stencil. However, a consistent print is still achievable<br />

for these pads. Comparing the deposit volume of the three pastes<br />

with different aspect ratios shows: paste C ranks the best among<br />

the three pastes; paste A ranks second; and paste B is third. Paste<br />

B has a tighter distribution compared to paste A and paste C; however,<br />

it has many more insufficient compared to the other two<br />

pastes. The rheology plays a big role in printing ultra-fine apertures,<br />

and good printability is achievable with both water-soluble and noclean<br />

flux chemistries.<br />

The 35 μm thickness stencil gave a higher aspect ratio, hence it was<br />

believed that the thinner stencil could yield better printings over the<br />

50 μm thick stencil. The aspect ratio improved from a range of<br />

0.40 – 0.45 to 0.57 – 0.64. The improvement was obvious by using<br />

paste sample C. The printing results of T6 and T7 pastes show that<br />

the standard deviation of T7 prints is smaller, so it has a lower variation.<br />

However, it was also observed that more bridges were seen.<br />

Process capability<br />

Cp, Cpk, and Ppk were calculated using Minitab software. The reference<br />

specification limit used was 40 % to 150 % to compare the<br />

paste performance. Both vacuum support and carrier pallet are capable<br />

setups, as the table reveals; however, vacuum support has a<br />

greater consistency as the Cpk and Ppk values are larger. The process<br />

capability of all pastes can be seen in the table, using various<br />

pad sizes and stencil thicknesses. The combinations of pad size and<br />

stencil thickness were represented as their respective aspect ratio.<br />

Reflow and test vehicle<br />

Reflow testing was done on one of the water-washable pastes that<br />

is being used in a high volume SiP application to study the void performance<br />

with different reflow profiles in air. The Practical Components<br />

test board was used, with pad and stencil apertures both of<br />

180 μm circles. The thickness of the stencil was 75 μm. Four different<br />

profiles were tested as shown in the diagrams. The actual profiles<br />

were recorded.<br />

Results and conclusions<br />

The results are summarized in table and figure. For this particular<br />

water-soluble solder paste, the voiding is affected by different profiles.<br />

The long profile with soak zone shows a lower void %. The relationship<br />

between the void performance and reflow profile should<br />

be adequately characterized for each solder paste, as different<br />

solder pastes may work best with different temperature profiles.<br />

In order to achieve consistently good fine-feature printing performance<br />

for SiP applications, solder paste attributes, i.e., powder size,<br />

flux system, rheology, slump behavior, and stencil life, are important<br />

and need to be taken into consideration. Solder paste with suitable<br />

rheology, mixed with the correct powder size and flux, should be<br />

evaluated and selected accordingly. The suitable stencil technology,<br />

design, and thickness, coupled with an appropriate board support<br />

system, are also keys for consistently good solder paste transfer efficiency.<br />

Reflow profiles need to be properly characterized in order<br />

to minimize voiding for different solder pastes.<br />

SMTconnect, Booth 5-310<br />

www.indium.com<br />

Zusammenfassung<br />

In der Automobilelektronik finden sich mit steigender Tendenz SiPs<br />

in den vielen Helfersystemen für die Fahrer – insbesondere in Systemen<br />

für die Advanced Automated Driver Assistance (ADAS).<br />

Doch stellen die SiP-Bausteine deutlich höhere Anforderungen an<br />

den Fertigungsprozess der Baugruppen, insbesondere an Lotpaste,<br />

Flussmittelchemie und Reflow.<br />

Résumé<br />

Dans l‘électronique automobile, les SiP se retrouvent de plus en<br />

plus dans les nombreux systèmes d‘assistance à la conduite, en<br />

particulier dans les systèmes d‘aide à la conduite automatique<br />

avancée (ADAS). Cependant, les composants SiP imposent une demande<br />

plus importante au processus de fabrication des assemblages,<br />

en particulier en ce qui concerne la pâte à souder, la<br />

chimie des flux et la refusion.<br />

Резюме<br />

В автомобильной электронике все чаще применяются корпуса<br />

с однорядным расположением выводов (SiP). В частности, это<br />

касается множества систем помощи водителю, например Advanced<br />

Automated Driver Assistance (ADAS). Однако при<br />

производстве к узлам SiP предъявляются более высокие<br />

требования. Речь идет о паяльной пасте, флюсе и системах<br />

пайки оплавлением.<br />

54 <strong>EPP</strong> EUROPE April 2019


Importance of drying in printed-circuit board assemblies cleaning<br />

No moisture should be<br />

left beneath parts<br />

There are four steps to successfully clean printed circuit boards assemblies (PCBAs). The wet, scrub and rinse<br />

operations are obvious. Wet the board with a pure cleaning fluid. Scrub it using a good quality scrubbing<br />

brush. Then rinse it off with more clean fluid. However, the necessary dry step is often overlooked, or in some<br />

instances, completely left out of the PCBA cleaning plan. This article outlines the various techniques and tools<br />

used when drying electronics circuitry either in a vapor degreaser or at the benchtop.<br />

Sheri Pear, Marketing Communications Specialist, MicroCare Corporation<br />

PCBA in the basket of vapor degreaser<br />

system where it was immersed in the<br />

boiling cleaning fluid.<br />

There are different ways to dry PCBAs depending<br />

on the cleaning process used, including<br />

in-line aqueous cleaning, benchtop<br />

scrubbing or vapor degreasing. Whether<br />

using heat, vapor, wipes or compressed gas,<br />

there is a drying method available to ensure<br />

assembled circuit boards are not only clean,<br />

but also dry for optimum reliability and performance.<br />

For reliable performance, circuit boards must<br />

not only be clean, they must be dry in order<br />

to function properly. Leftover moisture on a<br />

PCB surface can lead to a host of problems<br />

including corrosion, electrochemical migration,<br />

delamination, dendrite growth, pin<br />

holes and blow holes and adhesion problems<br />

with conformal coatings later in production.<br />

Modern PCBAs often have bottom termination<br />

components like land grid arrays and<br />

QFNs (quad-flat no-leads) with very tight standoff heights. Moisture<br />

can get trapped under these components, making drying even<br />

more complicated.<br />

Batch cleaning & drying with vapor degreasing<br />

For bulk or batch drying PCBAs, convection ovens with air knives<br />

might be used. However, when using drying ovens, temperature<br />

and air flow are major concerns and care should be taken. For<br />

example, if the circulating air flow isn’t strong enough or if the temperature<br />

isn’t high enough, it might not reach the moisture hidden<br />

under low-mounted components. Or if the temperature is too high,<br />

Source: Microcare<br />

it may cause surface damage to the board itself or the components<br />

by baking on any residual contaminants left behind.<br />

Vapor degreasing is an affordable and convenient alternative to<br />

using drying ovens. The vapor-based procedure is an industrial<br />

cleaning process for PCBAs that is quick, consistent and affordable.<br />

The operation uses cleaning fluid immersion, combined with vapor<br />

rinsing and vapor drying, to remove all types of contaminates including<br />

fluxes, pastes, particulates and residue.<br />

<strong>EPP</strong> EUROPE April 2019 55


Circuit boards immersed into the boiling degreaser cleaning fluid,<br />

usually between 40 ˚C/105 ˚F and 65 °C/165 °F.<br />

Source: Microcare<br />

Manual cleaning by fluid and absorbing wipe.<br />

Source: Microcare<br />

Cleaning and drying PCBAs employing the vapor degreasing<br />

method uses nonflammable cleaning fluids in special, engineered<br />

cleaning machines called vapor degreasers. Such equipment ranges<br />

in size from small benchtop models to huge floor systems. No<br />

matter the size of the vapor degreaser being used, the cleaning and<br />

drying processes are the same. The vapor degreaser boils a cleaning<br />

fluid at a relatively low temperature, usually between<br />

40 ˚C / 105 ˚F and 65 °C / 165 °F, to produce a pure, clear and dense<br />

vapor blanket. PCBAs are lowered into the boiling cleaning fluid in<br />

the boil sump to heat, loosen and remove the majority of the contamination.<br />

They then move to the rinse sump where any final vestige<br />

of contamination is rinsed away. Finally, the PCBAs are raised<br />

up and held inside the vapor blanket, allowing the parts to dry and<br />

cool. The entire process takes approximately 8–15 minutes per<br />

batch.<br />

The cleaning fluid has a low surface tension allowing it to permeate<br />

the entire board circuitry, including under and in-between tightlyspaced<br />

components to wash away oils, fluxes and other residue.<br />

Using a low temperature fluid minimizes the risk of damage to the<br />

PCBAs and since the cleaning fluid is ultra-pure, it leaves no residue<br />

behind.<br />

The vapor blanket dries the PCBAs extremely quickly. The vapor<br />

passes under the low-mounted components, so that the boards<br />

come out of the vapor degreaser completely dry, cool enough to<br />

handle and are immediately ready for packaging or the next step of<br />

manufacturing.<br />

Manual cleaning & drying with wipes and dusters<br />

One of the most commonly used methods technicians use to dry<br />

PCBAs during benchtop cleaning is a simple lint-free wipe. Whether<br />

using it to capture the excess spray of cleaning fluid on a circuit<br />

board or gently pushing the wipe under low-surface mounted components,<br />

wipes are a quick and effective way to dry the PCBA without<br />

leaving lint or fuzz behind. There are many factors to consider<br />

when selecting a lint-free drying wipe, including absorbency, material<br />

and packaging.<br />

The most important factor when choosing a drying wipe is the ability<br />

of the wipe to absorb the type of moisture encountered. For<br />

example, some wipes will absorb cleaning fluids, but they will not<br />

absorb water. The key is to match the type of wipe absorbency to<br />

the contamination to be removed.<br />

The material makeup or the type of fiber used to make the wipe is<br />

also important. Nonwoven wipes, since they are made without<br />

glues or binders, don’t leave residue on the surface being cleaned,<br />

resulting in a cleaner board. Another way to limit re-contamination<br />

to the PCBA is to choose pre-washed wipes or wipes with finished<br />

or heat-sealed edges. This eliminates loose fibers and dust, ultimately<br />

leaving the circuit board assembly cleaner.<br />

Packaging is also an important consideration when choosing a drying<br />

wipe. Some manufacturers require wipes to have static-dissipative<br />

properties and to be packaged in ESD-safe wrappers. These<br />

specialty ESD wipes not only limit dust attraction, but also limit the<br />

threat of static damage to the fragile electronic components. Other<br />

manufacturers may require clean room type wipes for maximum<br />

cleanliness. Clean room wipes are typically cut and packaged in a<br />

clean room environment to ensure their purity.<br />

For some benchtop post reflow (rework) assembly, a good drying<br />

method is to use a dust remover. A quick blast from a duster can be<br />

effective at blowing trapped moisture from underneath larger components<br />

that a wipe alone might not reach. The dust remover can be<br />

targeted to a very small area on the PCBA and works extremely well<br />

in getting into and under intricate and hard-to-reach nooks and crannies<br />

on the circuit board. Using a duster in combination with a wipe<br />

doubles the drying power and prevents the fluid from being pushed<br />

back onto the board and spread contaminant around.<br />

56 <strong>EPP</strong> EUROPE April 2019


Manual drying of board assembly with lint-free wipe.<br />

Source: Microcare<br />

Manual drying of board assembly by using a dust remover,<br />

for example, after rework.<br />

Source: Microcare<br />

When selecting a duster to use for a drying application, safety is<br />

key. Inexpensive canned air is readily available from a number of retail<br />

outlets. However, many of these formulations may pose a hazard<br />

due to their high flammability ratings. A safer alternative is to select<br />

a dust remover that is made with nonflammable gas. A 360°<br />

type of dust remover also adds drying convenience since the can<br />

operates at any angle, even upside down, allowing operators the<br />

flexibility to quickly dry very complex or intricate PCBs. Using the<br />

duster may take a little bit of practice, but once the operator understands<br />

the velocity of the high-purity gas, the moisture can be<br />

blown away quickly and efficiently with no residue left behind.<br />

Stay dry before and after cleaning<br />

Moisture is a potential threat to board assemblies throughout the<br />

entire manufacturing process, not just during the cleaning phase.<br />

PCBAs can pull moisture out of the air at any stage, so it is important<br />

to keep them dry. Using climate control in your facility or designating<br />

an area for “dry” PCBA storage away from other manufacturing<br />

operations may help prevent this issue. Properly handling<br />

boards during pre-and-post cleaning storage and shipping helps protect<br />

moisture-sensitive components on the board. Finally, after the<br />

PCBAs are cleaned and dried, be sure to package and store the<br />

cleaned items with care to prevent any subsequent moisture infiltration<br />

before shipping to end users.<br />

Conclusion<br />

Moisture left on the today’s modern PCBAs may impact the function<br />

and the reliability of the circuitry. Water or cleaning fluid left behind<br />

after rinsing may cause a number of problems including corrosion,<br />

delamination, electrochemical migration and dendrite<br />

growth. To prevent these problems from occurring, it is imperative<br />

that PCBs are completely dry.<br />

No matter what drying method used, the goal is to ensure that<br />

PCBAs are not only clean, but also dry for optimum dependability<br />

and performance. It is recommended to work with a partner with<br />

specialized experience and expertise in electronics cleaning and<br />

drying to choose the best methods to use.<br />

SMTconnect, Booth 4-531<br />

www.microcare.com<br />

Zusammenfassung<br />

Für eine zuverlässige Funktion müssen Schaltungen sauber und<br />

auch trocken sein. Restfeuchte auf einer Leiterplattenoberfläche<br />

bzw. unter Komponenten kann zu einer Vielzahl von Problemen führen<br />

wie u. a. Korrosion, elektrochemische Migration, Delamination<br />

oder Dendritenwachstum sowie im späteren Fertigungsverlauf zu<br />

Haftungsprobleme von konformalen Beschichtungen.<br />

Résumé<br />

Pour un fonctionnement fiable, les circuits doivent être propres et<br />

secs. L‘humidité résiduelle sur la surface d‘une carte de circuit imprimé<br />

ou sous les composants peut entraîner une variété de problèmes<br />

tels que la corrosion, la migration électrochimique, la délamination<br />

ou la croissance de dendrite et, plus tard dans le processus<br />

de fabrication, des problèmes d‘adhérence avec les revêtements<br />

conformes.<br />

Резюме<br />

Надежная работа схем обеспечивается только в том случае,<br />

если они чистые и сухие. Остаточная влага на поверхности<br />

платы или под компонентами может привести к различным<br />

проблемам, например, коррозии, электрохимической<br />

миграции, расслаиванию, росту дендритов, а также<br />

проблемам с адгезией традиционных покрытий на<br />

последующих этапах производства.<br />

<strong>EPP</strong> EUROPE April 2019 57



PCB and packaging for drives and assistance systems<br />

Source: AT&S<br />

AT&S expects growth in electromobility applications in the near future and is<br />

focusing on embedded power technologies.<br />

Electromobility and automated driving are<br />

the two defining trends in the automotive industry<br />

with high growth potential, but also<br />

technological challenges. For example, hybrid<br />

and/or electric powertrains require, among<br />

other things, efficient power electronics for<br />

the major subsystems such as inverters, onboard<br />

chargers or DC/DC converters. Finally,<br />

the implementation of electromobility also<br />

requires efficient, space-saving and reliable<br />

connection and packaging solutions. On the<br />

other hand, new high-performance sensor<br />

systems with sensor fusion and high-speed<br />

communication are required along the way to<br />

autonomous driving, all whilst maintaining<br />

functional safety and security. AT&S address-<br />

es all of these key<br />

automotive trends<br />

with innovative connection<br />

and packaging<br />

solutions.<br />

Efficient power<br />

Electromobility continues<br />

to make headway,<br />

driven by legal<br />

requirements in all<br />

key regions – led by<br />

China. To date in the<br />

EU, the target of 95 g<br />

CO 2 /km has been<br />

the fleet average for 2021. According to a recent<br />

EU compromise, new cars in the EU are<br />

to emit another 37.5 % less carbon dioxide by<br />

2030 than in the comparable year 2021. The<br />

company expects above-average growth in<br />

electromobility applications over the next<br />

few years and is focusing here amongst<br />

other things on embedded power technologies<br />

– in other words, the embedding of<br />

power semiconductors such as Mosfets in<br />

PCBs. Key benefits of ECP (embedded component<br />

packaging) over conventional PCB assembly<br />

include significant miniaturization<br />

thanks to higher integration, improved reliability<br />

and superior thermal performance. In<br />

addition, ECP facilitates integrated EMI<br />

shielding and supports the adaptation of different<br />

coefficients of thermal expansion<br />

(CTE) for rapid and easy system integration.<br />

As silicon-based solutions slowly reach their<br />

limits, the use of wide-band gap materials<br />

such as GaN promises more efficient power<br />

conversion, with higher efficiency and higher<br />

power density.<br />

The second megatrend in the automotive industry<br />

is automated driving. With the increasing<br />

degree of automation and thus more<br />

sophisticated advanced driver assistance systems<br />

(ADAS), the need for sensors and different<br />

sensor technologies is also increasing in<br />

cars. Whilst a combination of camera and<br />

radar systems is sufficient up to level 2, from<br />

level 3 lidar also plays a crucial role.<br />

Due to the ever-higher frequencies such as for<br />

the radar, the traces on the circuit boards<br />

must also be regarded as RF components and<br />

designed accordingly. The company is a<br />

specialist in this field and has developed PCBs<br />

that deliver the necessary and also cost-efficient<br />

performance in the frequency range up<br />

to 80 GHz. The company addresses all these<br />

aspects. By way of example, they are working<br />

on new materials to further reduce the dielectric<br />

constant and the loss factor.<br />

www.ats.net<br />

Smart manufacturing for electronics processes<br />

Siemens announced the introduction of<br />

Camstar Electronics Suite software, an innovative<br />

manufacturing execution system<br />

(MES) for electronics. Building on the successful<br />

enterprise-level platform for integrated<br />

circuit (IC) manufacturing, this powerful,<br />

configurable and scalable MES solution<br />

enables PCB and box assemblers to meet<br />

traceability requirements, improve efficiency<br />

levels and control manufacturing operations<br />

through direct IoT connectivity with machines<br />

and production lines. Expanding on<br />

their digital innovation platform, the MES<br />

system creates a true digital thread to empower<br />

electronics companies to further their<br />

digitalization strategy in line with Industry<br />

4.0. By closing the loop between engineering<br />

and the shop floor, and enabling quick reactions<br />

to design modifications, manufacturers<br />

can shorten product lifecycles, increase production<br />

complexities and improve quality<br />

across the entire manufacturing lifecycle.<br />

“Siemens made an important step towards<br />

helping electronics manufacturers improve<br />

operations performance when they acquired<br />

Camstar, but by adding capabilities from<br />

Mentor’s Valor Electronics Manufacturing<br />

Solutions software they can now drive a new<br />

level of productivity, throughput, and quality<br />

for both PCB, mechanical and box-build manufacturing,”<br />

said Greg Gorbach, Vice President,<br />

digitization and IoT, ARC Advisory Group.<br />

“With the Valor edge data acquisition technology<br />

and tight integration with Teamcenter to<br />

support a robust digital twin and digital thread,<br />

Source: Siemens<br />

the Camstar Electronics Suite now enables<br />

customers in the electronics industry to<br />

rapidly adapt to design changes and to speed<br />

production by directly connecting with<br />

specialized machines and production lines.”<br />

Siemens PLM Software continues to grow<br />

its digital innovation platform and look for<br />

new ways to expand on the most robust digital<br />

twin. The Suite activates the seamless<br />

flow of product and business data between<br />

product lifecycle management (PLM), enterprise<br />

resource planning (ERP) and shop floor<br />

execution through an integrated digital<br />

thread, enabling faster and streamlined<br />

change cycles. Using this single data source,<br />

closed-loop feedbacks from production to design<br />

and engineering departments can result<br />

in improved quality levels and shorter new<br />

product introduction (NPI) processes and goto-market<br />

times.<br />

SMTconnect, Booth 5-434B<br />

www.siemens.com<br />

58 <strong>EPP</strong> EUROPE April 2019

Fume extraction devices for manual workstations<br />

“Efficient capturing of airborne pollutants” is<br />

the central subject of ULT’s trade show appearance<br />

at SMTconnect 2019.<br />

The vendor of fume extraction solutions will<br />

demonstrate the influence of high-degree<br />

capturing of emissions, such as soldering<br />

fume, laser fume, vapors or gases, on the entire<br />

filtration process and, consequently, air<br />

cleaning procedure.<br />

At a specially designed experimental setup,<br />

visitors may experience an efficient air cleaning<br />

process from extraction to outlet.<br />

Moreover, the company will exhibit mobile<br />

fume extraction devices for small and medi-<br />

Source: ULT AG<br />

Mobile, solid soldering<br />

fume extraction unit LRA 160.1.<br />

um pollutant amounts – ideally configured for<br />

manual workstations (manual prototype<br />

placement, small batches, repair etc.) and integration<br />

into either production lines or processing<br />

plants, e.g. laser marking systems or<br />

automated soldering systems.<br />

The first-time introduction of the new LRA<br />

160.1 device series for soldering fume removal<br />

rounds off their trade show presence.<br />

In addition to the new, visually appealing design<br />

and improved device handling, users<br />

benefit in the system series by means of<br />

high filtration rates, extremely low-noise operation<br />

and an optimized price-performanceratio.<br />

Special module combinations within<br />

the LRA 160.1 system increase filter lives, resulting<br />

in significant cost savings for users.<br />

Visitors to the company’s exhibition stand<br />

get first-hand information on the air purification<br />

systems‘ high flexibility and variability,<br />

receiving concrete conclusions on potential<br />

applications as well as purchasing and maintenance<br />

cost savings.<br />

The fume extraction systems provide for<br />

clean air within the production processes.<br />

They protect employees, manufacturing<br />

plants and products from hazardous airborne<br />

contaminants, occurring during the utilization<br />

of laser systems, soldering equipment as<br />

well as in gluing, laminating and coating applications.<br />

SMTconnect, Booth 5–214<br />

www.ult.de<br />

Bond Tester by F&S BONDTEC<br />

>> Fully automatic pull- & sheartesting<br />

by using most modern<br />

Pattern-Recognition-Software<br />

>> Reproducible test results and<br />

precision within a few μm<br />

>> Automatically rotating and<br />

positioning of pull hooks and<br />

shear tools<br />

NEW & UNIQUE:<br />

Our BAMFIT<br />

BONDTEC Accelerated<br />

Mechanical Fatigue<br />

Interconnection Testing<br />

Revolutionary quick test for<br />

lifetime of heavy wire bonds<br />

Adds power cycling tests<br />

of power semiconductors,<br />

but in minutes instead of months<br />

Low residue fluxes for tabbing and stringing applications<br />

Source: MacDermid Alpha Electronics Solutions<br />

The Assembly division of MacDermid Alpha<br />

Electronics Solutions, a producer of electronic<br />

soldering and bonding materials, has<br />

recently introduced the Alpha 7 series low<br />

residue fluxes to meet the demanding<br />

requirements of the photovoltaic industry<br />

when higher peel strength is deemed<br />

necessary.<br />

There is minimum<br />

flux deposits that<br />

accumulates inside<br />

tabbing and stringing<br />

equipment and<br />

spray nozzles when<br />

using the Alpha 7<br />

series.<br />

“With the use of the latest flux chemistry<br />

and technology, Alpha 7 Series Low Residue<br />

Fluxes are designed so that minimum flux<br />

deposits accumulate inside tabbing and<br />

stringing equipment and spray nozzles, thus<br />

eliminating corrosion and clogging issues,“<br />

said Eric Poh, Global Portfolio Manager for<br />

Non-PCB Assembly. “The unique chemistry<br />

provides excellent soldering with fast wetting<br />

in standard module assembly processes and<br />

methods that are used widely, such as preheat<br />

and soldering, for both spray or dipping<br />

application methods.“<br />

These low solid fluxes also allow for an extended<br />

shelf life compared to many competitive<br />

fluxes in the industry.<br />

www.alphaassembly.com<br />

Visit us at SMTconnect<br />

07. – 09.05.2019 in Nürnberg; Hall 4A, Stand 430<br />

F&S BONDTEC Semiconductor GmbH<br />

Industriezeile 49a<br />

5280 Braunau am Inn<br />

Austria<br />

Phone: +43-7722-67052-8270<br />

Fax: +43-7722-67052-8272<br />

E-Mail: info@fsbondtec.at<br />

www.fsbondtec.at<br />

<strong>EPP</strong> EUROPE April 2019 59


Process tracking and traceability across all lines<br />

Reflow quality and<br />

cost improvements<br />

Calsonic Kansei is a multinational automotive parts manufacturer with its own branded OEM products. Their main<br />

production focus is on quality, closely followed by cost effectiveness. This is no surprise when operating in the automotive<br />

industry and the highly competitive EMS business. The company, however, views quality and cost effectiveness as mutually<br />

reinforcing, in that poor quality is expensive, especially in the automotive segment where rework is quite undesirable<br />

for most, and altogether disallowed for certain processes. Implementing a solution for controlling and tracking the reflow<br />

process, while optimizing productivity through maximum equipment utilization was the reason for winning the regional<br />

process/quality improvement competition. This is their story.<br />

Rod Sampson, Process Engineer, Calsonic Kansei<br />

Process Engineer, Rod Sampson,<br />

is responsible for the<br />

thermal processes, which include<br />

reflow, wave, and selective<br />

wave soldering. For each new<br />

product introduction (NPI), Design<br />

of Experiment (DoE) is run<br />

to identify the “sweet spot” in<br />

the thermal process. This typically<br />

entails experimenting with<br />

machine settings that result in a<br />

process (profile) in the high, low,<br />

and center points of the process window. (The company’s HQ provides<br />

the appropriate process window.) When the best process is<br />

identified, it is locked in place, then tracked and verified daily. While<br />

defects are rarely attributed to the reflow process, the challenges<br />

that are encountered when defects that actually do occur are often<br />

more difficult to resolve. Quality is not something that should be<br />

weighted between the different processes, as weights are of little<br />

importance once an assembly has been rendered defective. In this<br />

case, all involved should go about their business as if their respective<br />

processes are the most crucial/vital from a quality standpoint.<br />

With this, the impact of internal and external defects can be minimized,<br />

positively driving overall factory productivity.<br />

The recent trend to aggressively reduce solder void has made process<br />

optimization and consistent soldering critical for success. Previously<br />

this work was time consuming, and although<br />

the quality was acceptable, productivity and cost effectiveness<br />

suffered due to the necessary line stoppage<br />

to perform the work. It was challenging due to<br />

the numerous generations of reflow ovens and wave<br />

solder machines. Not only do their thermal properties<br />

differ, but the older machines made performance<br />

tracking difficult. In today’s age with virtually unlimited<br />

information available via a click, the company’s<br />

method was outdated and inadequate. There had to<br />

be a better way.<br />

“We researched the market and found new technologies<br />

that seemed promising. One was a smart ther-<br />

60 <strong>EPP</strong> EUROPE April 2019<br />

mal profiler with predictive process<br />

optimization software that<br />

“With the smart profiler,<br />

automatic reflow process monitor, and allowed us to input the process<br />

window target, and immediately<br />

factory-level database software, identify the corresponding machine<br />

settings. This cut our process<br />

optimization time dramati-<br />

we automated quality assurance and<br />

cally, and it allowed us to find<br />

saved engineering and production<br />

more optimum process settings<br />

time,” exclaimed Rod Sampson. than in the past,” explained Rod<br />

Sampson.<br />

“Previously, we had relied on<br />

technicians performing manual process verifications on each line<br />

multiple times per day. This was less than optimum because such<br />

manual verification is not consistent, and it also reduced our productivity<br />

by stopping the entire line for 10 + minutes every time a verification<br />

profile was run on a reflow oven,” he further explained. Additional<br />

verification events were prompted by yield issues, preventive<br />

maintenance work, and unscheduled line stoppage. (Their procedures<br />

required running a profile if the line stoppage exceeds four<br />

hours.) A secondary concern was the lack of information on the thermal<br />

process during the production between the twice daily manual<br />

profiles.<br />

It was decided to invest in KIC’s automatic profiling systems for reflow<br />

that use permanently embedded sensors in the oven to calculate<br />

each PCB’s profile on the fly during production. The automatic<br />

profiling systems were retrofittable on all reflow ovens<br />

regardless of age, giving consistent process tracking<br />

and traceability across all lines. To test the non-contact<br />

profile accuracy and repeatability, changes were<br />

forced in the oven while verifying that the system did<br />

indeed correctly identify the resulting out-of-spec<br />

event. “I also found it interesting that we could stop a<br />

blower motor in the reflow oven without triggering an<br />

oven alarm or notification,” explained Mr. Sampson.<br />

“This probably is due to the temperature not chang-<br />

Source: Calsonic Kansei<br />

Calsonic‘s Rod Sampson said that KIC’s smart thermal<br />

profiler significantly cut process optimization time.

ing. But the convection rate had changed, causing the profile on the<br />

PCBs to change, which is what determines the in-spec production.”<br />

The automatic system allows for the reflow process to be controlled<br />

and documented. In addition to full thermal process traceability, the<br />

system instantly gives a notification for an out-of-spec event. It will<br />

also provide SPC charting with Cpk limits that provide early warning<br />

on an out-of-control reflow process. Hence, the company replaced<br />

manual verification profile spot checks with on-the-fly profiling of<br />

every PCB.<br />

However, it was challenging to make use of the thermal process<br />

data for trend analysis, yield troubleshooting, and other issues due<br />

to the sheer volume of data located on each reflow oven PC. “One<br />

of our use cases would be triggered by a negative trend in our production<br />

line yield. In the past, it could take me more than a day (accounting<br />

for the normal interruptions in a workplace) to put together<br />

a trend analysis report to gain the appropriate insight to take corrective<br />

action on yield issues. When we stop the production line, we<br />

are keenly aware that every second of downtime is expensive. SPI<br />

and AOI inspection are very helpful. And while sometimes the root<br />

cause of the problem is obvious, other times, it isn’t. Fortunately,<br />

Vantage, a new factory-level database software, became available<br />

that made accessing the relevant data quick and convenient. Now I<br />

can identify the thermal process for a specific PCB or time period<br />

with a deteriorating production line yield. We will quickly rule the<br />

thermal process in or out, reducing troubleshooting time. And<br />

should reflow be the problem, which happens quite infrequently,<br />

then the automatic profiling system points us to where and what in<br />

the oven needs to be adjusted,” he further added.<br />

“This progression made me realize that I had previously lacked<br />

timely reflow process data to make good decisions, and suddenly I<br />

had so much information that I was still not able to take corrective<br />

action quickly enough,” Mr. Sampson observed. The introduction of<br />

the Vantage factory-level database software changed that by moving<br />

from data to insight. It is similar to looking for information online.<br />

Zusammenfassung<br />

Ein multinationaler Automobilzulieferer mit Fokus auf Qualität und<br />

Effizienz beschloss, seinen Reflowprozess zu optimieren, und entschied<br />

sich dabei für ein automatisches Profilierungssystem, welches<br />

nachrüstbar war und eine lückenlose Prozessverfolgung sowie<br />

Rückverfolgbarkeit über alle Linien hinweg ermöglicht.<br />

Résumé<br />

Un fournisseur international dans l’industrie automobile, centré sur<br />

la qualité et l’efficacité, a décidé d’optimiser son processus de refusion,<br />

en optant pour un système de profilage automatique afin<br />

d‘assurer un suivi et une traçabilité transparents des processus<br />

sur toutes les lignes de production.<br />

Резюме<br />

Международный автоконцерн, уделяющий особое внимание<br />

качеству и эффективности, пожелал оптимизировать процесс<br />

пайки оплавлением, для чего принял решение о приобретении<br />

дооснащаемой автоматической системы профилирования,<br />

позволяющей внимательно отслеживать все этапы процессов,<br />

а также собирать весь объем информации об изделии на всех<br />

линиях.<br />

Source: Calsonic Kansei<br />

KIC’s Vantage database software helps Calsonic access the data it needs quickly.<br />

Collecting massive volumes of data can be easily captured, but a<br />

strong browser or analytical tool is needed to identify the relevant<br />

information or answers needed. Data is turned into insight, and insight<br />

is always quickly needed.<br />

A final dramatic use case, which improved the production line uptime<br />

by several hours for each event, was the occasional inability to<br />

run the profile verification due to broken thermocouples (TCs), damaged<br />

profile board or other. If such occurrences took place when<br />

the responsible process engineer was unavailable, for example on a<br />

night shift, then the line was shut down until a profile verification<br />

could be performed. Shutting the line down for several hours because<br />

of a broken profiler or a TC, may sound unheard of, but the<br />

top priority is quality. The company, however, is now no longer held<br />

hostage by such events.<br />

Every year, the company conducts an internal competition on improvements<br />

in two main categories:<br />

• Quality: improvements & assurance<br />

• Cost reduction: cost & time savings<br />

The regional Calsonic contest was won with the following results:<br />

• Defects due to out-of-spec profiles all but disappeared<br />

• Automatic verification of process adherence<br />

• Effective void reduction<br />

• Near elimination of periodic profiling downtime led to an increase<br />

of production time<br />

• Improved set-up time for new products (NPI)<br />

• Line utilization gains of multiple minutes for each of the following<br />

events:<br />

a. Preventive maintenance<br />

b. Troubleshooting yield issues<br />

c. Unscheduled stoppage<br />

• Full thermal process traceability for every produced PCB –<br />

customer satisfaction<br />

• Dramatic decrease of production stoppage due to inability<br />

to run manual profiles<br />

The future<br />

As a company, they have high aspirations of using technology to<br />

drive the core initiatives of quality and cost effectiveness. “Personally,<br />

I envision a factory with smart machines and processes, with<br />

real-time dashboards connected to an MES system. Where manual<br />

and inconsistent tasks can be replaced with automation for better<br />

process control as well as improved quality and production. Eventually,<br />

we will be able to use data, insight and automation to run our<br />

factory more effectively. Perhaps there is another competition, we<br />

can win soon,” added Mr. Sampson.<br />

SMTconnect, Booth 4A-230<br />

www.kicthermal.com; www.calsonickansei.co.jp/en<br />

<strong>EPP</strong> EUROPE April 2019 61



Increasing production with storage towers<br />

Whizz Systems, Inc. has improved operational<br />

technology and increased production<br />

by implementing an automated warehouse<br />

system supplied by Juki Automation Systems.<br />

Consisting of eight ISM 2000 Fortresses<br />

and an ISM 500 Intelligent Storage<br />

System, it replaces the company’s ware-<br />

Human-error is no longer an issue as it ensures<br />

correct parts are always available.<br />

Source: Whizz Systems, Inc.<br />

house consisting of shelving and racks while<br />

reducing the amount of space required. “We<br />

are always investing in enhancing our capabilities<br />

and value that we offer to our customers,”<br />

stated Muhammad Irfan, President.<br />

“This includes equipment and training. Whizz<br />

was the first adopter of Juki the Fortress and<br />

intelligent storage systems. It is a significant<br />

investment for companies of our size, but<br />

demonstrates our commitment to excellence<br />

and we have seen great improvements.” The<br />

Fortress is designed for optimal management<br />

of all reels, regardless of the reel diameter<br />

or thickness. Now, their automated<br />

warehouse will store all of the necessary material<br />

to run complex, high-mix, low volume,<br />

high-changeover, NPI type assemblies that<br />

the company manufactures regularly.<br />

Whizz Systems has improved efficiency by<br />

reducing the time and labor spent trying to<br />

locate parts, as well as realizing quality improvements<br />

by always picking the correct<br />

parts. With the Fortress, there is no longer<br />

the risk of any human-error selecting the incorrect<br />

part ensuring that the correct reel is<br />

available during production runs.<br />

Designed for the optimal management of all<br />

reels for production requirements, it offers<br />

the flexibility to support a combination of 7 “<br />

reels from 8 mm to 16 mm in height,<br />

13 “/15 “ reels up to 88 mm in height as well<br />

as JEDEC trays.<br />

With the possibility of configuring up to 640<br />

different positions, in the ISM500 intelligent<br />

static warehouse, it is possible to insert<br />

7/13/15 “ reels, JEDEC trays, SMT and PTH<br />

tubes, screen-printing frames and foils,<br />

printed circuits, PTH components and more.<br />

SMTconnect, Booth 4-221<br />

ww.juki-smt.com; www.whizzsystems.com<br />

Source: Whizz Systems, Inc.<br />

The automated warehouse system has<br />

improved efficiency by reducing the time and<br />

labor spent trying to locate parts.<br />

Flexible XL rework and selective systems<br />

Kurtz Ersa Inc., a supplier of electronics production<br />

equipment, introduced the HR 600<br />

XL and the Versaflow 4XL with Versaflex.<br />

With the HR 600 XL, it is possible to professionally<br />

rework BTC components on big<br />

board assemblies. Boasting a heated area of<br />

24 x 24 inch and a PCB thickness of up to<br />

10 mm opens up rework capabilities in the<br />

segments of telecommunication, network<br />

and infrastructure.<br />

The HR 600 XL features a bottom-side IR Matrix<br />

heater with a total power of 15 kW that<br />

consists of 25 individually controllable heating<br />

elements. For each application the ideal<br />

heat distribution can be set. The highly efficient<br />

800 W hybrid heating head executes<br />

the component desoldering or installation<br />

from chip resistors to 60 x 60 mm<br />

(2.36 x 2.36 inch) BGAs or sockets.<br />

The Versaflow 4XL is designed for PCB sizes<br />

of up to 610 x 1,200 mm. This selective soldering<br />

system provides a flexibility and application<br />

variety – at the highest soldering<br />

quality.<br />

Printed circuit board (PCB) formats of up to<br />

these sizes can be soldered efficiently and<br />

safely with the Versaflow 4XL, making it a<br />

perfect system for large, highly integrated assemblies<br />

or LED applications. Featuring the<br />

Versaflux and Versaflex modules, the Versaflow<br />

4XL is flexible and manages most diverse<br />

solder jobs.<br />

Part of the company portfolio includes, the<br />

Versaflow 455 selective soldering system,<br />

Smartflow 2020 selective soldering system,<br />

N2 Generator, Hotflow 3/20 reflow oven,<br />

Source: Kurtz Ersa Inc.<br />

Powerflow Air, Versaprint Ultra with the latest<br />

measuring technology via 3D camera, and<br />

HR550 & HR600/2 rework systems. Additionally,<br />

automation solutions (conveyors, lifts,<br />

etc.), as well as, hand tools.<br />

SMTconnect, Booth 4-111, 5-434B<br />

www.ersa.com<br />

The Versaflow 4XL<br />

is a selective soldering<br />

system that<br />

is great for large,<br />

highly integrated<br />

assemblies or LED<br />

applications.<br />

62 <strong>EPP</strong> EUROPE April 2019

Cleaning machines, cleaning agents and analytical support<br />

At SMTconnect, Zestron will be exhibiting a<br />

selection of cleaning machines from leading<br />

international manufacturers that will showcase<br />

a variety of innovative and proven technologies<br />

to trade show visitors looking for a<br />

Zestron will be exhibiting cleaning machines at this<br />

year’s SMTconnect show.<br />

Source: Zestron<br />

new cleaning machine. The company’s process<br />

engineers and technologists of the<br />

equipment manufacturers are available to<br />

answer questions about the technology as<br />

well as the compatible cleaning chemistry.<br />

Highlights of the cleaning chemistry are the<br />

latest pH-neutral and alkaline media of the<br />

Vigon PE series with a focus on power electronics,<br />

as well as, the innovative stencil<br />

cleaner Hydron SC 300.<br />

In addition to the selection of machines and<br />

cleaning agents, the focus is on process<br />

monitoring. Trade show visitors can get information<br />

about innovative test methods and<br />

measuring concepts that help to ensure the<br />

reliability of electronic assemblies and to optimize<br />

production processes.<br />

SMTconnect, Booth 4–329<br />

www.zestron.com<br />

<br />

<br />

<strong>Europe</strong>an reveal of printer with automated changeovers<br />

Yamaha Motor <strong>Europe</strong> SMT section will<br />

showcase the latest innovations from its<br />

Total Line Solution for high-productivity surface-mount<br />

assembly, including the richly<br />

automated YSP10 screen printer, at 2019<br />

SMTconnect show, Nuremberg, May 7–9.<br />

Headlining at their booth, the YSP10 minimizes<br />

the most time-consuming part of the<br />

screen-print process with new features for<br />

fully automated changeovers. Automatic<br />

push-up pin exchange, stencil replacement,<br />

and solder-paste gathering for direct transfer<br />

to the new stencil cut human intervention to<br />

an all-time low. Cycle time is also 20 % faster,<br />

setting the world’s best tact time, and the enlarged<br />

standard maximum board size of<br />

510 mm x 510 mm handles large display-backlight<br />

panels, industrial boards, and more with<br />

ease. Alongside the advanced printer, the<br />

company will demonstrate precision solderpaste<br />

inspection with the YSi-SP. Proprietary<br />

high-speed algorithms accelerate the 2D and<br />

3D inspection modes, and switchable superhigh<br />

resolution gives extra accuracy where<br />

needed. YSi-SP captures the data needed for<br />

deeper insights into the print process that reveal<br />

new ways of boosting productivity, and<br />

integrates smoothly with other equipment in<br />

their Total Line Solution to put the results of<br />

analysis into action.<br />

Next on the booth, the YSM20R high-speed<br />

modular mounter combines the company’s<br />

one-head solution that minimizes reconfiguration<br />

stoppages with component recogni-<br />

tion on the move and placement of the latest<br />

0201 (0.25 mm x 0.125 mm) SMD chips to enhance<br />

capability and efficiency. Increased<br />

structural rigidity allows higher X-Y axis<br />

speeds, contributing to 5 % greater throughput<br />

compared to the YSM20. Auto-loading<br />

feeders and the auto tray sequencer for nonstop<br />

tray replacement make the most of the<br />

superior mounting speed of 95,000 cph.<br />

Bringing everything together, the YSi-V postplacement<br />

inspection system demonstrates<br />

the latest features including a full-HD LCD<br />

touch panel with enhanced navigation for<br />

programming and character-recognition algorithms<br />

to boost usability. The 12-Mpixel<br />

camera combines unbeatable performance<br />

with great value, consolidating 2D, 3D, and<br />

oblique-angled inspection for coplanarity and<br />

height as a single cost-effective unit. Also<br />

featuring the company’s exclusive image-capture<br />

technology, the YSi-V delivers more than<br />

double the inspection capability of ordinary<br />

inspection systems.<br />

With the Factory Tools 4.0 software suite, the<br />

most complete software solution for Industry<br />

4.0, completing the digital connection of machines,<br />

materials, humans, and method, the<br />

company will demonstrate how its True Total<br />

Line Solution fulfills production demands<br />

from entry level, through high-mix medium/<br />

high-volume up to ultra-mass production.<br />

SMTconnect, Booth 4–319<br />



Sensing the world’s needs<br />

Providing turnkey sensors to<br />

increase market share<br />

Comus International, founded in 1978 by President and CEO Robert P. Romano, began as a manufacturer of<br />

glass mercury tilt-switches for residential and commercial thermostats. Immediate success and rapid growth<br />

led to new product development and soon the metal mercury switch and, ultimately, the patented non-mercury<br />

switch were designed and offered to the market, which led to further success.<br />

Dhiran Rana, Chief Engineer, Comus International<br />

Today, the company is a manufacturer of tilt and tip-over<br />

switches, motion/vibration sensors, reed switches, reed relays,<br />

solid state relays, proximity sensors, float switches, and a wide variety<br />

of custom turnkey sensors. Its product growth and offering has<br />

been built with an excellent reputation for quality and service.<br />

Pick-and-place machine with local support<br />

The company has evolved into the design, development and manufacture<br />

of a wide variety of sensors and sensor-related products. Applications<br />

are found in market segments, such as medical, automotive,<br />

white goods, alarm and security, and military/aerospace. Products<br />

include reed switches, relays, proximity sensors, tilt switches/<br />

Source: Combus International<br />

motion sensors, liquid level/pressure sensors, smart sensors and<br />

custom products.<br />

“Our lasting commitment is to meet the ever-changing necessities<br />

of our customers and the markets they serve,” said Romano. “We<br />

strive to continually improve our processes and our products and to<br />

pioneer developments and sensors that use less power while never<br />

sacrificing quality or function. Additionally, we work to expand our<br />

product knowledge and diversification, so that we may continue our<br />

mission of ‘sensing the world’s needs’.”<br />

To meet this mission and exceed customer needs, the company<br />

partners only with manufacturers that hold the same high standards.<br />

Essemtec is one such partner and has worked with them<br />

since 2011, with the original purchase of the Pantera line. Romano<br />

said, “We were amazed how the machines worked and the precision<br />

technology behind the line.”<br />

Since that time, the company upgraded to the Fox4 pick-and-place<br />

machine. They originally chose the Pantera because it allowed the<br />

company to realize its strategic vision of kitting and board products<br />

for customers, without worrying about deploying too much capital<br />

too soon in a fairly new market. Romano added, “Over time, we<br />

were able to add customers and products and increase our market<br />

share to the point where increasing capacity was the only way to<br />

ensure we could continue our success. The Essemtec team was<br />

great to work with and they were our logical first choice when it<br />

came time to make another investment.”<br />

The pick-and-place machine allows the company to scale its new<br />

business ventures with the assurance of not sacrificing quality. The<br />

Fox4 can place up to 18,800 cph on 4-axes at 50 μm, 3 sigma with a<br />

two-nozzle head. It has an 8 mm tape feeder capacity of 200 and<br />

features a footprint of 1 m 2 . Additionally, the system can handle<br />

component sizes up to 80 x 80 mm. The machine features quick<br />

changeover including nonstop production and nonstop, intelligent<br />

smart feeders. The platform is the first in its class to feature linear<br />

motors with a mineral cast frame, providing excellent speed, stability,<br />

accuracy, and making it perfectly suited for use in small to medium<br />

production environments. The motors also are maintenance-free<br />

and provide a long lifetime.<br />

The Fox4 placement machine helps Comus<br />

International keep up with new business<br />

ventures without sacrificing quality.<br />

64 <strong>EPP</strong> EUROPE April 2019

In addition to quality, the company is provided with excellent service.<br />

Romano said Essemtec was first chosen seven years ago because<br />

local service and strong technical support are key. “Having<br />

access to local support during times of crisis is what keep customers<br />

in the long run. Having equipment that can work interchangeably<br />

with what we already have is also a big plus,” he added. Both companies<br />

are located in New Jersey, and Comus International likes<br />

knowing there is a local branch in the same state, if needed.<br />

He continued to say that their customer service has been great over<br />

the years. “All our questions and concerns are always addressed efficiently<br />

and comprehensively. We have professional help for technical<br />

troubleshooting in a matter of minutes. Additionally, the Fox4 installation<br />

was very well-organized and the training that was provided<br />

was excellent.”<br />

The company continues expanding its services and capabilities as<br />

its reputation continues growing. They now offer PCB design and<br />

packaged solutions to customers. It has a team of engineers and<br />

technicians for the highest quality of manufacturing and assembly.<br />

“We are proud to offer quick turnarounds and rapid prototyping for<br />

customers who require an expedited flow from design inception to<br />

conceptual testing and, finally, production scaling,” concluded Romano.<br />

Essemtec will be there for Comus International, working to<br />

help the company succeed by providing adaptive technology that<br />

grows with the company.<br />

SMTconnect, Booth 4-318<br />

www.essemtec.com; www.comus-intl.com<br />



AT THE<br />


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Produzenten von diversen Schaltern, Sensoren und Relais<br />

zum Erfolg, wie der Artikel zeigt.<br />

Résumé<br />

L‘article montre la gamme de technologies adaptatives offertes par<br />

un constructeur de machines, qui a contribué au succès d‘un fabricant<br />

international d‘interrupteurs, de capteurs et de relais divers.<br />

Резюме<br />

Адаптивные технологии для бурно развивающихся<br />

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производстве различных переключателей, датчиков и реле,<br />

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статье.<br />

Yamaha True Total Line Solution is the industry leading portfolio in the market for entry level,<br />

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VISIT<br />

HALL <strong>EPP</strong> EUROPE 4<br />

US!<br />

April 2019 65<br />




System developments and optimizations for soldering<br />

Source: Rehm Thermal Systems<br />

Rehm product portfolio.<br />

Every year SMTconnect in Nuremberg (formerly<br />

SMT Hybrid Packaging) highlights current<br />

topics in the field of electronics manufacturing.<br />

Rehm Thermal Systems will be attending<br />

this year as well.<br />

“Look further, go beyond” is the motto that<br />

the company is using for its trade fair appearance<br />

this year. Their developers and designers<br />

are looking to the future and are paving the<br />

way in the development of electronics manufacturing<br />

with their additional developments<br />

and optimizations in system and process engineering.<br />

The company will be introducing the following<br />

systems:<br />

• VisionXP+: The system for reflow convection<br />

soldering with or without a vacuum is<br />

now even more efficient. The company will<br />

present its highlights, for example, the use<br />

of new EC fan motors, which are not only<br />

quieter and more sustainable, but also enable<br />

comprehensive production data collec-<br />

tion, a more effective cooling zone and design<br />

optimization.<br />

• CondensoXC: It has a compact structure<br />

thanks to the innovative processing<br />

chamber and is a high-performance device.<br />

Thanks to the patented injection principle,<br />

exactly the right quantity of Galden is supplied<br />

for optimal profiling. Thanks to the<br />

closed-loop filter system, the medium can<br />

be recovered and filtered at virtually 100 %.<br />

The system is fully suitable for vacuums and<br />

has an integrated process recorder for optimal<br />

traceability.<br />

• CondensoXS smart: These smart systems<br />

are based on the chamber design of the<br />

CondensoXC and thus ensure high process<br />

stability. An enlarged process chamber,<br />

boasting a significantly reduced footprint,<br />

enables higher throughput and thus shorter<br />

process times.<br />

• Nexus: The vacuum soldering system is<br />

ideal for pore-free and flux-free soldering at<br />

up to 450 °C with a variety of process gases.<br />

The wet-chemical activation with formic acid<br />

is available as an option. It is possible to use<br />

lead-free or lead-containing preforms and<br />

pastes. Contact soldering is used in advanced<br />

packaging and power electronics.<br />

• Securo Minus: The Securo range has developed<br />

to analyze the reliability of sensitive<br />

electronics under extreme temperatures.<br />

Securo Minus is deployed in the context of<br />

the cold function test to check the winter<br />

performance of electronic assembly groups<br />

for example. The electronic components are<br />

exposed to cold air or nitrogen at low temperatures<br />

of up to –55 °C in the system and<br />

thereby brought to the optimal temperature<br />

for checking.<br />

• ProtectoXP: This selective conformal coating<br />

system protects sensitive electronic assembly<br />

groups from damage by corrosion<br />

or other environmental influences such as<br />

humidity, chemicals or dust. The company<br />

will be presenting a variety of application<br />

methods for different deployment areas<br />

and materials at the trade fair.<br />

• ProtectoXC: Even with minimal throughput,<br />

the system guarantees reliable coating processes<br />

and can be integrated as a batch or<br />

line variation. It will present with ViCON<br />

system software at the trade fair for the<br />

first time. The new operating concept simplifies<br />

image creation for coating and includes<br />

numerous features for an easy-tocreate,<br />

reproducible coating result.<br />

SMTconnect, Booth 4A-100<br />

www.rehm-group.com<br />

Adhesives cure with UV light and moisture<br />

Panacol developed a variety of adhesive<br />

products with low ion content which cure<br />

with UV light and moisture. These products<br />

were specially formulated for applications in<br />

the electronics and consumer electronics industry,<br />

where heat sensitive parts must be<br />

assembled. Vitralit UD 8050 is a one-component<br />

acrylic adhesive, which can be used as<br />

an encapsulant to protect electronic components<br />

on PCBs. It can be cured with UV or<br />

visible light. Moisture post-curing ensures<br />

full cure in shadowed areas or deeper layers<br />

of the adhesive, which cannot be reached by<br />

light. For specific requirements several versions<br />

of the adhesive are available. The Vitralit<br />

UD 8050 MV F allows enhanced flow con-<br />

trol and focused dispensing on each component<br />

thanks to its shear-thinning behavior. Its<br />

low ion content prevents corrosion on electronic<br />

components. For superior process<br />

control, it contains a fluorescent marker.<br />

For jetting, the low viscosity version Vitrali<br />

UD 8050 LV is the perfect solution. Thanks to<br />

its easy dispensing and fast curing, it is very<br />

convenient for applications in the production<br />

of consumer electronics where a high<br />

throughput is needed.<br />

By default, the adhesive is transparent, but it<br />

is also available in blue or fluorescing versions.<br />

Other colors are available on request.<br />

www.panacol.de<br />

The adhesive products from Panacol cures<br />

with UV or visible light.<br />

Source: Panacol<br />

66 <strong>EPP</strong> EUROPE April 2019

Visual virtual factories with the CFX standard<br />

Aegis Software, a provider of Manufacturing<br />

Execution Software (MES) announced that<br />

FactoryLogix is the first MES solution to<br />

natively leverage the power of the IPC Connected<br />

Factory Exchange (CFX) standard. The<br />

platform leverages CFX from data acquisition<br />

to analytics and process control automation.<br />

As a result, any manufacturer on this platform<br />

that purchases a CFX-compliant device,<br />

machine or system will instantly interpret,<br />

and leverage the critical information from<br />

those devices without the need for middleware<br />

or custom integration. The emergence<br />

of CFX combined with an MES that understands<br />

the data streams ushers in the era of<br />

true IIoT, which is an enterprise that is free of<br />

the need for custom middleware to get data<br />

from the factory floor. Now manufacturers of<br />

will be able to fast-track the actual realization<br />

and transformative benefits of Industry 4.0.<br />

“Until now, for manufacturers to truly capitalize<br />

on the promise of IIoT and Industry 4.0,<br />

middleware was required to reside between<br />

the device layer and the upper system layer.<br />

The use of middleware always meant additional<br />

costs and complexity. Additionally, as<br />

soon as a factory introduced a new machine<br />

or upgraded existing machines, more development<br />

resources and time would be<br />

needed to update existing adapters to leverage<br />

the machine information,” stated Jason<br />

Spera, CEO. “By updating the entire architecture<br />

of the FactoryLogix platform to fundamentally<br />

‘understand’ CFX data from acquisition<br />

up to analytics and process control automation,<br />

we have enabled it to natively support<br />

any CFX-enabled machine, device or system<br />

instantly and without the need for<br />

middleware or custom programming.”<br />

Driving factories forward<br />

FactoryLogix is a holistic and modular platform<br />

which delivers leading-edge technology<br />

with easily configurable modules to support<br />

and execute a discrete manufacturer’s strategy<br />

towards Industry 4.0. It manages the entire<br />

manufacturing lifecycle: from product<br />

launch to material logistics, through manufacturing<br />

execution and quality management,<br />

CFX standard was demonstrated at Apex this year<br />

with the help of Aegis’ FactoryLogix software.<br />

to powerful analytics and real-time dashboards.<br />

This end-to-end platform is helping<br />

companies accelerate product introductions,<br />

streamline processes, improve quality and<br />

traceability, reduce costs and gain greater<br />

visibility for competitive advantage and profitability.<br />

SMTconnect, Booth 4-150<br />

www.aiscorp.com<br />

Source: Aegis Software<br />

7-9 May 2019, Nuremberg<br />

Hall 4, Stand 339<br />

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Electronic & General<br />

Purpose Cleaning<br />

Conformal<br />

Coatings<br />

Encapsulation<br />

Resins<br />

Thermal Management<br />

Solutions<br />

Contact<br />

Lubricants<br />

Maintenance<br />

& Service Aids<br />

<strong>EPP</strong> EUROPE April 2019 67


Reliable protection for electronics<br />

Offering flexible and versatile<br />

types of dryers<br />

There are dryers, and there are “dryers” – especially in the electronics manufacturing industry. “Dryer” should<br />

be understood as an umbrella term for thermal systems in the electronics industry, which are not used to<br />

produce firmly bonded connections, i.e., neither soldered, sintered, nor diffusion-soldered. These can be real<br />

drying processes (e.g. the drying out of pastes), curing (e.g. of polymer coatings), burn-in processes (burn-in test<br />

for components to locate early defects) or, annealing (to produce special properties of connecting materials).<br />

This article focuses on three dryers from Rehm Thermal Systems.<br />

The headlights of a car ensure a safe journey day and night; the<br />

vehicle airbag saves lives no matter the conditions; the onboard<br />

computer and sensors in an aircraft provide reliable measurements,<br />

even at an altitude of 10 kilometres, to safely guide the aircraft in the<br />

sky and bring it back to the ground. Behind each one of these functions<br />

is a myriad of highly complex electronic assemblies and connections,<br />

which are produced using a dryer.<br />

In order to ensure the reliability of these sensitive electronic assemblies,<br />

even in the harshest environment, a coating layer is applied<br />

to the assembled circuit boards and then cured in a special<br />

drying system. The coating protects sensitive electronic components<br />

from damage through corrosion or other environmental influences,<br />

such as humidity, chemicals or dust. Additionally, it greatly<br />

increases the service life and quality of the product. Alternatively,<br />

complete assemblies can be potted and encapsulated. The company<br />

offers innovative drying and curing processes to suit any demands<br />

in this field – such as the vertical drying system Alteco, as<br />

well as a dryer that meanders horizontally or a continuous dryer that<br />

guarantees optimal drying and curing results thanks to reliable vertical<br />

looped transport system (Pramo).<br />

Vertical dryer<br />

One of the company’s latest developments is the vertical drying<br />

system Alteco, which offers maximum performance with minimum<br />

space requirements. All industries that utilise coating processes<br />

and work with sensitive flat assemblies with protective coating<br />

benefit from this system. In addition to the best temperature profiling<br />

possibilities and low energy consumption, the minimum space<br />

requirement was also successfully achieved in the implementation<br />

of this system. Thanks to vertical transport, the Alteco replaces a<br />

comparable 40-metre-long horizontal dryer with a system length of<br />

just 4 metres. With this innovative system concept, valuable space<br />

in the production hall can be saved, existing resources can be optimally<br />

used, and daily production can be optimised. Two process<br />

towers can be arranged according to the vertical stacking principle.<br />

The system is equipped with appropriate drip protection mechanisms<br />

in order to avoid soiling of the mechanics and undesirable contamination<br />

of the assemblies with e.g. coating drops.<br />

The space-saving vertical<br />

drying system Alteco for<br />

curing coated assemblies.<br />

Source: Rehm Thermal Systems GmbH<br />

68 <strong>EPP</strong> EUROPE April 2019


Source: Rehm Thermal Systems GmbH<br />

Arrangement of the process<br />

towers according to the<br />

vertical stacking principle.<br />

An important aspect for every manufacturer of highly complex electronic<br />

assemblies is the flexibility of the equipment used. The company’s<br />

vertical drying system enables flexible, high-performance<br />

drying and curing processes for all protective coatings and casting<br />

compounds that can be cured with convection heat. In the furnace<br />

inlet the PCBs are loaded onto product carriers. These pass through<br />

the drying process in the system in a vertical direction and are<br />

stacked on top of each other during the curing process. The actual<br />

drying process is carried out in two process towers, which are each<br />

divided into several heating zones.<br />

The downstream, segmented cooling section ensures gentle and<br />

uniform cooling of the assemblies for subsequent production<br />

stages. Alternatively, the cooling section can also be integrated into<br />

the vertical system. This principle is ideally suitable for assemblies<br />

that require shorter process throughput times due to their lower<br />

mass, or which are not processed directly afterwards and can therefore<br />

cool down in downstream magazines.<br />

Two transport variants are available for the Alteco vertical dryer.<br />

Firstly, a fixed transport width in which the circulating product carriers<br />

are set to a fixed position, and secondly, a flexible transport<br />

width in which the circulating product carrier transport automatically<br />

adjusts to the respective assembly size. This allows simultaneous<br />

drying of different coated boards or boards of different sizes. This<br />

means that several coating lines can feed different products with a<br />

mix of different PCB transport widths to the Alteco. This is specially<br />

designed for the drying process of flat assemblies with a maximum<br />

height of 50 mm.<br />

A drying or curing process must meet important requirements.<br />

There are particular parameters, such as the maximum temperature,<br />

the process duration at this temperature, the temperature<br />

deviation from the maximum temperature, and the temperature homogeneity,<br />

e.g. over the entire surface of the goods carrier. As an<br />

example, a temperature profile for drying potted assemblies was<br />

created. For this application, a process time of 40 minutes was<br />

achieved at 80 °C. In addition, the profile only exhibits a small fluctuation<br />

in the temperature tolerance.<br />

The heating system based on the convection principle under air is<br />

the basis for this optimal temperature profiling. In order to react to<br />

temperature fluctuations as flexibly as possible, temperature and<br />

volume flow can be set separately in all heating zones. In addition, a<br />

Source: Rehm Thermal Systems GmbH<br />

An example of the meander system.<br />

specially developed air duct guarantees uniform heating of all assemblies.<br />

The exhaust air volume is also controlled separately for<br />

each zone. Thus, the system can be optimally adjusted to the<br />

amount of coating and the solvent throughput.<br />

Meander system<br />

Vertical dryers save space on the surface, but require sufficient<br />

height clearance in the production facilities. In addition, the natural<br />

thermals in a vertical process chamber are crucial for the process,<br />

as heat always rises. If very small tolerances in the reproducibility of<br />

the temperature-time profile are required, it may be technically<br />

more sensible to thermally process the products in a horizontal process<br />

chamber.<br />

<strong>EPP</strong> EUROPE April 2019 69


Example of a temperature profile with 80 °C drying temperature and 40 minutes process time.<br />

Source: Rehm Thermal Systems GmbH<br />

With the RDS 45000 meander system, the company has developed<br />

a special solution that enables equally long product dwell times at a<br />

productivity of 3.5 units/min in a horizontal position. The products<br />

meander in 13 tracks through the process chamber, which has a<br />

maximum temperature of 130 °C and is equipped with 18 heating<br />

zones. The goods carrier transport can be loaded either manually or<br />

automatically, but always according to the first-in-first-out principle.<br />

The position of loading and unloading is variable.<br />

The meander system also features seamless traceability: the barcode<br />

of the individual assembly is read in, which enables an exact<br />

assignment of the process-related data. The time stamps for loading<br />

and unloading, as well as the heating temperature in the furnace<br />

or a single zone are also included. The supply air of the meander<br />

dryer is on one hand preheated by the reverse flow process and on<br />

the other filtered by a filter monitoring system. Due to the fact that<br />

each part runs through the same process, the system has high reproducibility.<br />

It is available in an oxygen or nitrogen model. A cooling<br />

section can be optionally integrated. However, if a cooling section is<br />

integrated, it can be ordered in an air-cooled or water-cooled model.<br />

Continuous dryer<br />

In the continuous dryer Pramo, the assemblies are transported<br />

through the system on goods carriers with “shuttle” supports. Within<br />

the dryer, they pass through several zones in which they are<br />

heated up to the appropriate temperature and then maintained at<br />

the set temperature for the drying/hardening process. The maximum<br />

temperature in the dryer is 150 °C.<br />

In order to harden the materials according to the specifications, the<br />

cycle time can be adjusted according to the necessary dwell time of<br />

the assemblies in the drying system. The flexible goods carrier receptors<br />

are interchangeable, which means various assemblies and<br />

also special forms can be guided safely and reliably through the sys-<br />

Info box<br />

The application or the product to be produced, as well as the expected<br />

throughput in production, determine the technical configuration of the<br />

dryer. In photovoltaics, for example, a throughput of


The Pramo is available as a 2-, 3 -, or 4-looped transport.<br />

Source: Rehm Thermal Systems GmbH<br />

tem at any time. The Pramo offers flexibility and security in the design<br />

and implementation of your testing tasks, also with regard to<br />

warm function testing. A stable circular product carrier transport ensures<br />

absolute process stability and safe transport of the assembly<br />

through the system. This gives the system sufficient capacity to reliably<br />

adhere to the desired test temperature, even when processing<br />

large parts in a short cycle time. In order to guarantee the removal<br />

of the assemblies at the appropriate temperature, the product<br />

carrier return is designed as an additional heating zone.<br />

A robot or handling system loads and unloads the assemblies into<br />

the product carriers. The gondolas/carrier boats are equipped with a<br />

clamping unit for automatic loading with a robot. Manual loading<br />

and unloading can be an alternative. The transport is carried out in<br />

loops in order to achieve the longest possible throughput times and<br />

process a high number of units. This reduces the surface area, as<br />

well as the height of the system, and saves space in the production<br />

facility.<br />

Depending on the number of product carriers, the Pramo is available<br />

as a 2-, 3-, or 4-looped transport. With a maximum size of<br />

1520 x 200 mm, the size of the goods carriers is identical in each of<br />

the available models. However, the number of goods carriers in the<br />

system varies between 27 and 58. The assemblies for downstream<br />

processes are cooled in the cooling section. This allows immediate<br />

further processing of the assemblies. Cooled air is blown onto the<br />

carrier with the assembly in each segment. The waste heat is transferred<br />

to the incoming fresh air via a heat exchanger and thus removed<br />

from the production room in an energy-saving way. Alternatively,<br />

a residual management system with two cooler/filter units<br />

for cold condensation is available instead of the heat exchanger.<br />

The cooler and filter units can be easily cleaned in an ultrasonic bath<br />

for maintenance purposes. If the parts are unloaded warm as part of<br />

a warm function test, the return line can be run as an additional<br />

heating zone. A measuring cable with prepared parts and a memory<br />

meter can be easily used via a quick-release fixing. The system is<br />

controlled by software via a touchscreen user interface. All relevant<br />

process parameters such as throughput time and temperature are<br />

documented via a barcode on the product carrier gondola and, if<br />

necessary, transferred to an MES system. SMEMA interfaces allow<br />

the integration of the system into any production line.<br />

A variety of basic physical principles of heat transfer are used and<br />

many technical designs are implemented to make drying processes<br />

as efficient as possible. Day by day, Rehm rises to the challenge of<br />

converting innovative technologies into series production-ready systems<br />

and can help to evaluate the optimum technology parameters<br />

with the customer, during the conception phase.<br />

SMTconnect, Booth 4A-100<br />

www.rehm-group.com<br />

Zusammenfassung<br />

Um die Zuverlässigkeit empfindlicher elektronischer Baugruppen<br />

auch unter härtesten Bedingungen zu gewährleisten, wird eine Beschichtungsschicht<br />

auf die bestückten Leiterplatten aufgebracht<br />

und anschließend in einem speziellen Trocknungssystem ausgehärtet.<br />

Im Mittelpunkt des Artikels stehen innovative Trocknersysteme<br />

und -verfahren für alle Anforderungen.<br />

Résumé<br />

Afin d‘assurer la fiabilité des assemblages électroniques sensibles,<br />

même dans les conditions les plus difficiles, une couche de revêtement<br />

est appliquée sur les cartes de circuits imprimés assemblées,<br />

puis durcie dans un système spécial de séchage. L‘article se<br />

concentre sur des systèmes et des procédés de séchage innovants<br />

pour satisfaire toutes demandes.<br />

Резюме<br />

Для обеспечения надежного функционирования<br />

чувствительных электронных узлов в самых суровых условиях<br />

эксплуатации на укомплектованные платы наносится слой<br />

защитного покрытия, отверждаемого в специальной системе<br />

сушки. В статье рассказывается об инновационных системах и<br />

методах сушки, удовлетворяющих различным требованиям.<br />

<strong>EPP</strong> EUROPE April 2019 71


At the heart of production<br />

Surface-mount line to fulfil<br />

emerging market demands<br />

MI Elektronika is the first high-tech EMS in Slovenia to install the atom3 high-speed pick-and-place<br />

platform at the heart of a full line solution. The electronics assembly services specialist installed the highspeed<br />

surface-mount assembly line, supplied and supported by Europlacer, at its factory to accelerate<br />

growth in domestic and export markets.<br />

The Europlacer atom3 inline<br />

at the factory of MI Elektronika.<br />

The new line contains the first atom3 pick-and-place platform to<br />

be installed in Slovenia, which is tightly integrated with the latest<br />

printing, inspection, and reflow equipment from Speedprint,<br />

Cyberoptics, and Heller. Trusted by medical, automation, and consumer<br />

brands to build complex electronic assemblies for applications,<br />

such as laser surgery, industrial controls, and advanced<br />

home appliances, the company chose Europlacer’s flagship model<br />

to combine cutting-edge surface-mount capabilities with high speed<br />

and superior flexibility.<br />

More flexibility with an extra line<br />

Tomaž Zorko, Chief Technical Officer, explains the timing of the decision:<br />

“We aim to achieve our growth targets by meeting our current<br />

customers’ needs and winning new business. This requires boosting<br />

capacity, while at the same time increasing flexibility, to cost effectively<br />

fulfil small orders, as<br />

well as extend our capabilities to<br />

assemble the latest component<br />

types, including 01005 SMD<br />

chips and wafer-level IC packages.<br />

The atom3 at the heart of<br />

our new SMT line enables us to<br />

meet those demands and is fast,<br />

accurate, and extremely reliable.”<br />

The new line is the fourth to be<br />

installed at the Slovenian<br />

1400-square-metre factory. The<br />

three existing lines comprise of<br />

Europlacer iineo pick-and-place<br />

machines, Speedprint screen printers, Cyberoptics Solder Paste Inspection<br />

(SPI) and Automatic Optical Inspection (AOI) stations, and<br />

Heller reflow ovens. They have delivered outstanding service for<br />

over 10 years.<br />

Source: MI Elektronika<br />

Simple integration with more support<br />

In addition to considering previous successful experiences with the<br />

brand and evaluating the new equipment’s performance, Tomaž<br />

Zorko and his team also considered how the new line would integrate<br />

with the established systems and practices. “Our current machines<br />

interoperate extremely smoothly together and with the Enterprise<br />

Resource Planning (ERP) system on which we run the business,”<br />

comments Zorko. “The new line communicates perfectly<br />

with our existing OT/IT infrastructure, giving us full control and access<br />

to the data we need without having to adapt our procedures.”<br />

The company has considered its investment carefully and planned<br />

every detail. From first extending the factory to house the new line,<br />

to identifying the most suitable equipment for handling the latest<br />

technologies, and scheduling the purchase optimally, ready to meet<br />

market demand, it’s the right equipment, for the right reasons, at<br />

the right time.<br />

72 <strong>EPP</strong> EUROPE April 2019


Source: MI Elektronika<br />

The EP710 screen printer is also part of the lines at the Slovenian factory.<br />

The EP710 screen printer is also part of the lines at the Slovenian factory.<br />

Source: MI Elektronika<br />

The 1400-square-metre<br />

factory in Slovenia had to<br />

be extended to accommodate<br />

its 4 th line.<br />

Source: MI Elektronika<br />

Zusammenfassung<br />

Ein Hightech-EMS Dienstleister in Slowenien installierte in seinem<br />

Werk eine Hochgeschwindigkeits-SMD-Linie, um das Wachstum im<br />

In- und Ausland zu beschleunigen. Herzstück dieser Komplettlösung<br />

ist ein Highspeed-Bestückungssystem.<br />

Résumé<br />

En Slovénie, un prestataire de services EMS de haute technologie<br />

a installé une ligne de SMT à grande vitesse dans son usine pour<br />

accélérer la croissance nationale et internationale. Le cœur de<br />

cette solution complète est un système de placement à grande vitesse.<br />

Резюме<br />

Высокотехнологичный разработчик микроэлектронных схем<br />

установил на своем заводе высокоскоростную линию<br />

поверхностного монтажа с целью интенсификации роста как<br />

внутри страны, так и за ее пределами. Сердцем этого<br />

комплексного решения является высокоскоростная система<br />

для установки компонентов.<br />

Europlacer supports the company and its four SMT lines directly<br />

from its local office in Trieste, Italy, little more than 100km from the<br />

Brezovica factory. With that said, visits are few and mostly only for<br />

routine maintenance. “The equipment has always been extremely<br />

reliable and remote support provides effective answers to small<br />

questions over the Internet,” says Zorko.<br />

“Our four SMT lines are perfect for us right now,” he continues.<br />

“The speed and accuracy of our latest line, with the atom3, now<br />

positions us to tackle large and technically demanding projects. At<br />

the same time, we have retained our flexibility to help customers<br />

through new product introduction or building small batches, and always<br />

to win with the fastest turnaround time.”<br />

SMTconnect, Booth 4-251<br />

www.europlacer.com<br />

<strong>EPP</strong> EUROPE April 2019 73



UV cure conformal coatings at thicknesses below 150<br />

microns, and can be cured with<br />

either 365 nm LED lamps or ‘D’<br />

bulb microwave technology.<br />

The UVCL-X has also been developed,<br />

which shares the benefits<br />

of the plus version with resistance<br />

to thermal shock, immediate<br />

board handling with a guaranteed<br />

chemical cure in 6 hours<br />

due to the secondary chemical<br />

Electrolube launched seven new UV cure<br />

conformal coating products. These UV cure<br />

coatings offer a high level of protection for<br />

electronic circuitry with a fast processing<br />

time. The range features UVCL, a single component,<br />

medium-low viscosity dual cure<br />

coating with secondary moisture cure, for<br />

complete cure in shadow areas. Available in<br />

5L packaging, UVCL is VOC-free, non-flammable<br />

and demonstrates excellent electrical<br />

properties. The coating provides a wide operating<br />

temperature range and is ready to use<br />

for selective spray application.<br />

UVCL-P, the plus version, is a transparent,<br />

flexible coating which is resistant to thermal<br />

shock. Benefits include an improved coverage<br />

and protection, along with a guaranteed<br />

chemical cure in 6 hours thanks to its secondary<br />

cure mechanism. Selectively applied<br />

at 50–150 microns thickness, it has a higher<br />

level of condensation protection than UVCL<br />

when sprayed at the same thickness. It also<br />

has a maximum operating temperature of<br />

150 °C, meets the requirements of UL94V-0<br />

cure mechanism and exceptional coverage<br />

and protection. Reflecting its environmental<br />

credentials as well as increasing the ease of<br />

inspection, UVCL-X is a green-opaque coating<br />

that can be applied at up to 300 microns and<br />

has a maximum operating temperature of<br />

150 °C. It is a highly flexible coating that demonstrates<br />

thermal conductivity 0.7 Wm-1K-1<br />

for improved heat dissipation. The coating is<br />

also UL746 qualified and meets the requirements<br />

of UL94V-0 at thicknesses below 300<br />

microns.<br />

Other UV cure coating products include,<br />

UVCL-FC, a film coating product that enables<br />

even thinner coatings and faster curing line<br />

Electrolube launched seven UV<br />

cure conformal coating<br />

products.<br />

speeds. It is a low viscosity, fast-curing UV<br />

formulation for rapid processing.<br />

UV cure coating specifically for LED applications.<br />

The UVCL-LED coating is also a low<br />

viscosity coating that enables rapid cure with<br />

low energy 365 nm LED lamps.<br />

UVCL-HV is a high viscosity UV curable material,<br />

designed to provide better coverage of<br />

component leads and exposed metal surfaces<br />

during dispensing applications and the<br />

UVCL-Gel is a no-flow gel version, designed<br />

for sealing connectors and non-coated areas.<br />

SMTconnect, Booth 4-339<br />

www.electrolube.com<br />

Source: Electrolube

High-performance cleaning for electronics assembly materials<br />

Kyzen, a provider of innovative environmentally<br />

friendly cleaning chemistries, continually<br />

researches and develops the next generation<br />

of solutions. Recently, the company announced<br />

that the newest addition to its<br />

Aquanox line.<br />

When asked how to get consistent high-performance<br />

cleaning for all widely used electronics<br />

assembly materials, Vice President<br />

Tom Forsythe said: “You rely on the Aquanox<br />

family of solutions because each and every<br />

product in the line is the result of an arduous,<br />

continual improvement engineering protocol<br />

that stays ahead of rapidly evolving electronics<br />

manufacturing technologies– and is<br />

thoroughly tested on the manufacturing floor<br />

prior to release.”<br />

The company’s latest Aquanox release is the<br />

result of thousands of hours of laboratory<br />

tests and “live” beta site testing scientifically<br />

validating the outstanding rinsability, extended<br />

tank life and consistently reliable,<br />

long-term performance advantages. This<br />

stable chemistry is excellent on a wide variety<br />

of components, coating, labels and<br />

equipment.<br />

SMTconnect, Booth 4-138<br />

www.kyzen.com<br />

The newest addition to the Aquanox family of solutions<br />

was heavily tested to ensure its reliability and<br />

long term performance.<br />

Source: Kyzen<br />

Aqua scrub flux management technology<br />

Source: BTU International, Inc.<br />

BTU International, Inc., a supplier of advanced<br />

thermal processing equipment for<br />

the electronics manufacturing and alternative<br />

energy markets, has recently introduced the<br />

Aqua Scrub flux management technology installed<br />

on the Pyramex 150N.<br />

This solder reflow flux management system uses an<br />

aqueous-based scrubber that works well with most<br />

pastes and fluxes.<br />

Aqua Scrub technology is the company’s next<br />

generation solder reflow flux management<br />

system. The patent-pending design uses an<br />

aqueous-based scrubber technology compatible<br />

with most known paste and flux types.<br />

The flux and solution are automatically contained<br />

and packaged for disposal.<br />

“We’ve been working for a long time towards<br />

a total solution for flux management.<br />

One that realizes the goals of flux independence,<br />

and a has a truly clean, hands-off<br />

maintenance approach,” said Peter Tallian,<br />

General Manager. “With Aqua Scrub, we can<br />

say we’ve achieved these goals, which will<br />

ultimately result in a competitive advantage<br />

for our customers.” This technology has a<br />

very attractive cost of ownership and is designed<br />

to decrease operational cost by 4X<br />

over traditional condensation systems. Reduction<br />

in cost can be attributed to reduced<br />

downtime, labor and disposal costs.<br />

It is purpose-built as a stand-alone system<br />

that can be easily retrofitted on Pyramax reflow<br />

ovens already in the field as well as new<br />

ones. This self-contained unit mounts on the<br />

back side of the oven to minimize the impact<br />

on oven operation and factory floor space.<br />

SMTconnect, Booth 4-551<br />



Encapsulation optimised for the LED market<br />

Outlook on transparent resin<br />

choices and applications<br />

The use of clear resins for electronics potting and encapsulation is growing as LED lighting and wearable<br />

electronics manufacturers seek quality finishes, as well as, reliable protection for their products.<br />

Such trends place new demands on these materials, as Electrolube’s Alistair Little explains.<br />

Clear resins are now used for<br />

protection, as well as, a surface finish,<br />

where the appearance is also<br />

important.<br />

Clear resins are now frequently used to provide, not simply protection,<br />

but a surface finish for certain electronics products. So,<br />

where such a resin may once have been used primarily as a protective<br />

medium, today’s clear resins now also have to perform aesthetically<br />

and hence their final appearance on cure is of prime consideration.<br />

Optimum resin results<br />

In the first instance, resin choice will likely be dictated by the device<br />

design as this will determine how the resin is introduced into those<br />

parts requiring encapsulation. For example, if an enclosure or housing<br />

is used and the components to be potted are flush with its top,<br />

how thick a layer of resin must be applied above these components<br />

to provide adequate protection,<br />

and how will the resin be held in<br />

place until it has cured in position?<br />

Further problems concerning<br />

resin retention will be posed<br />

if the components are actually<br />

proud of the enclosure top.<br />

One obvious solution to this is to<br />

consider recessing the components<br />

so that the resin’s surface<br />

remains flush with the top of the<br />

unit, enabling the cure to take<br />

place without risk of resin spill. If<br />

this is not possible, mounting a<br />

temporary mould over the enclosure<br />

will ensure that the desired<br />

surface profile is obtained<br />

every time.<br />

Another area of concern is the<br />

presence of protrusions or lips<br />

inside the housing or enclosure<br />

which might entrap air; sharp<br />

corners or angles are also potential<br />

air entrapment points. While avoiding these design ‘flaws’ in the<br />

first place will help mitigate the problem, choosing resins of lower<br />

viscosity, paying attention to how the resin components are mixed<br />

and maintaining the optimum temperature of both resin and encapsulation<br />

volume can all help prevent air bubble formation.<br />

Cleanliness is vital to achieving a satisfactory result. Metal enclosures,<br />

for example, must be thoroughly cleaned before resin application<br />

to remove any dirt, grease or metal working fluids that might<br />

be present, as these will reduce the resin’s ability to adhere to the<br />

metal surface. Similar precautions need to be taken with plastic<br />

moulded housings to remove any residual mould release agents.<br />

And should a temporary mould be used, as mentioned previously,<br />

care should be taken concerning the use of release agents, as these<br />

may leave a thin film on the surface of the moulded resin, giving a<br />

cloudy or hazy appearance. A point worth mentioning here is that<br />

Source: Electrolube<br />

76 <strong>EPP</strong> EUROPE April 2019


Source: Electrolube<br />

Air entrapment points are concerns that could be avoided by using resins of lower viscosity and paying<br />

attention to how the resin components are mixed.<br />

Source: Electrolube<br />

After mixing components, the reservoirs should<br />

be placed upright to release any air that might<br />

have been entrapped during the process.<br />

The two component (2K) is ideal for LED potting and encapsulation due to its<br />

resistance to UV light and yellowing.<br />

Source: Electrolube<br />

some clear resins may present with a hazy/cloudy appearance<br />

when first dispensed. However, this will disappear on curing to provide<br />

the desired optical clarity.<br />

Two component mixture<br />

There are three main classes of resins: epoxy, polyurethane and silicone,<br />

all of which are available in optically clear versions. Polyurethane<br />

and silicone resins are particularly recommended for LED<br />

lighting units as epoxies tend to yellow over time due to a combination<br />

of UV and heat degradation. While LEDs are very efficient<br />

light sources, they do also produce heat, which must be taken into<br />

account when choosing an appropriate resin for this type of application.<br />

Clear resins are frequently supplied as two component (2K) systems<br />

in various packaging sizes comprising pre-weighed parts A and<br />

B. For the smaller pack sizes these can be mixed inside the pack and<br />

then dispensed. These types of packs help minimise air entrainment<br />

during mixing and are popular for prototyping and for low volume<br />

production runs. Larger kits are available for higher volume production<br />

runs and are designed for use in mixing and dispensing equipment.<br />

The Part A and Part B mix ratio is crucial: for machine mixing, the<br />

volume mix ratio is required, while for manual mixing the weight<br />

mix ratio is used. Manual mixing is generally not recommended as it<br />

is difficult to avoid air entrainment during the mixing process. Both<br />

parts should be poured carefully from the original containers into<br />

the mixing machine reservoirs and then allowed to stand, allowing<br />

any air that was entrained during the pouring process to be released.<br />

Once mixed, the resin must be carefully dispensed into the housing<br />

and around the components. Best practice is to dispense the resin<br />

slowly from one end or corner of the housing and then allow it to<br />

flow around the components; this will help displace any air from<br />

underneath and between the components. If component topography<br />

is tight, then it might be worth considering lowering the viscosity<br />

of the resin by increasing its temperature; however, this does<br />

have the downside of speeding up the curing process, reducing the<br />

resin’s gel time.<br />

Even with the most careful dispensing and application procedures,<br />

air bubbles can still form, but some further precautions can be taken<br />

to ensure a bubble free cured resin. When using polyurethanes, for<br />

example, the surface of the component, PCB and the housing that<br />

<strong>EPP</strong> EUROPE April 2019 77


Alistair Little is the Global Business & Technical Director for<br />

Electrolube’s Resins Division.<br />

is to contain the resin must be both dry and dust free. Ambient conditions<br />

during the pour are also important, with temperature and humidity<br />

ideally being at 18–25 °C and 40–70 %RH respectively.<br />

Humidity is an important parameter, depending upon which type of<br />

resin is being mixed and dispensed. If epoxies are used, then the<br />

ambient humidity is generally not of concern; however, for silicones,<br />

maintaining a 50–70 %RH is desirable, particularly if the silicone is a<br />

moisture curing type. In the case of polyurethane and silicone resins,<br />

it will be necessary to protect both parts A and B from moisture,<br />

either by fitting desiccant traps to the product holding tanks or<br />

by flushing the tanks continuously with dry nitrogen.<br />

If the components that need to be encapsulated have a very complicated<br />

geometry, lots of tight windings, or there is a significant<br />

depth (> 10 mm) or volume of material to be used in a single unit,<br />

then it might be worth considering using vacuum potting as a<br />

method to ensure that all of the air is removed, both from the resin<br />

and the component surroundings.<br />

There are also several ‘housekeeping’ tasks to perform in order to<br />

minimise air entrainment. In particular, it is recommended that only<br />

a maximum of one typical day’s worth of resin and hardener consumption<br />

is placed into the dispensing machine reservoirs. Additionally,<br />

the pipe work from the reservoirs to the mixing head must<br />

be purged to ensure that there is no air left in the lines and that all of<br />

the connections are tight and leak-free.<br />

The parts A and B mix ratio must be checked at least once a day.<br />

This is done by removing the static mixer (or mix head in the case of<br />

a dynamic mixer) and weighing the output of parts A and B separately<br />

to ensure that the correct amount of each component is being<br />

dispensed. When completed, the static mixer is replaced back into<br />

the machine and purged to ensure that the correct mix volume is<br />

being dispensed and that it is being mixed correctly.<br />

Source: Electrolube<br />

LED lighting<br />

The exponential growth in LED lighting has seen a corresponding<br />

leap in demand for optically clear, UV stable resins that offer a variety<br />

of cured properties. Selecting an encapsulation resin to protect<br />

LEDs depends upon a number of different factors: the viscosity of<br />

the mixed system, useable life and gel time, as well as the hardness,<br />

density, colour and operating temperature of the cured resin.<br />

When directly protecting the LED elements, the cured resin must<br />

be optically clear and retain this property to preserve the light output<br />

and colour temperature of the LED array.<br />

The company has developed a number of encapsulation resins that<br />

cover a range of different property requirements and which have<br />

been optimised for the LED encapsulation market. Two component<br />

(2K), optically clear polyurethane and silicone resin systems offer<br />

the ease of handling and flow characteristics required to ensure that<br />

the liquid resin penetrates every part of the housing and around the<br />

LEDs, ultimately forming a cross-linked polymer on cure that is free<br />

of air bubbles and tough enough to protect against adverse environmental<br />

conditions.<br />

These optically clear resins are ideal for LED potting and encapsulation<br />

due to their resistance to UV light and yellowing. Two-part silicone<br />

resin systems are more flexible than polyurethanes and offer<br />

low viscosity for ease of application; they are particularly suited to<br />

applications where thin films are required thanks to their moisture<br />

cure nature. Moreover, cured silicone resins tolerate high operating<br />

temperatures and can be easily removed for rework or repair.<br />

It is always advisable to discuss with suppliers which type of optically<br />

clear resin is most appropriate for a particular application. The<br />

technical support teams of reputable suppliers have a wealth of experience<br />

to call upon and, should it become necessary, they have<br />

the expertise to modify chemical formulations, in order to meet particular<br />

application needs.<br />

SMTconnect, Booth 4-339<br />

www.electrolube.com<br />

Zusammenfassung<br />

Die Verwendung von klaren Harzen für die Vergusstechnik in der<br />

Elektronikindustrie nimmt zu, da LED-Beleuchtungen und Wearable-Elektronikhersteller<br />

neben hochwertigen Oberflächen auch einen<br />

zuverlässigen Schutz ihrer Produkte anstreben. Solche Trends<br />

stellen neue Anforderungen an diese Materialien.<br />

Résumé<br />

L‘utilisation de résines transparentes pour la technologie d‘encapsulation<br />

dans l‘industrie électronique est en augmentation, car les<br />

fabricants d‘éclairage LED et d‘électroniques portables cherchent<br />

à fournir une protection fiable pour leurs produits ainsi que des<br />

surfaces de haute qualité. Ces tendances imposent des nouvelles<br />

exigences à ces matériaux.<br />

Резюме<br />

Все чаще в электронной индустрии для заливки компонентов<br />

используется прозрачная смола. Причиной является<br />

стремление производителей светодиодных светильников и<br />

носимой электроники обеспечить наряду с идеальной<br />

поверхностью также надежную защиту для своих продуктов.<br />

Следствием этих тенденций являются постоянно<br />

возрастающие требования к этим материалам.<br />

78 <strong>EPP</strong> EUROPE April 2019



Participating in the real-life production line<br />

IPTE will once again complete the “Future<br />

Packaging”, a fully operational production line<br />

at SMTconnect, which will start with bare<br />

boards to a working product.<br />

The company is supplying conveying equipment<br />

to interconnect with other process<br />

equipment. Components include bare board<br />

loader, conveyors, turn units, buffers, workstations<br />

and a multi magazine loader/unloader.<br />

The integration of a laser marker will<br />

also be shown.<br />

The programming and testing of a product<br />

will be shown by using the EasyTest Handler<br />

and the Multi-Functional Test Handler. The<br />

test handlers are setup as a parallel tester. A<br />

depaneling system will be also be presented.<br />

EasyLine<br />

The EasyLine program for board-handling of<br />

PCBs or ceramic substrate (Hybrid-) boards<br />

can be integrated into production lines and<br />

processes. Modules are available in 300 mm,<br />

500 mm or 600 mm.<br />

FlexMarker<br />

The FlexMarkerII has an integrated electrical<br />

flip unit with PCB thickness compensation<br />

(option) so a piece can be laser-marked on<br />

both surfaces. This automated compensation<br />

results in an always-in-focus laser beam – independent<br />

of the PCB thickness. A board<br />

warpage correction is also an option. Flipping<br />

of the PCB is done without prior moving of<br />

the laser, resulting in a handling time less<br />

than one second.<br />

Easy Test Handler<br />

In-Circuit- or functional- test as well as programming<br />

processes can be inline automated<br />

with the Easy Test Handler ETH. It is<br />

practical with single or multiple boards, as<br />

well as, corresponding carriers for circuit<br />

boards. Both, one- or double-sided fixtures<br />

can be realized. For parallel use of more than<br />

one handler, it can be equipped with a bypass-segment.<br />

This allows for a constant production<br />

process.<br />

Multi-Functional Test Handler<br />

This is a 19-in. rack-type handler for performing<br />

in-circuit and functional tests on PCBs<br />

that are routed through the handler on transport<br />

belts. Its modular design offers multifunctional<br />

possibilities for test handling.<br />

Multi magazine loader/unloader<br />

The board handling components MLL 3P and<br />

MLU 3P are designed as multi magazine<br />

loader/unloaders, which have a servo driven<br />

conveyor shuttle that can pick up or store a<br />

PCB from any slot in the magazines. The<br />

cycle time and maintenance is improved by<br />

removing movement of the magazines.<br />

EasyRouter<br />

The EasyRouter II is a depaneling system for<br />

off line use and is equipped with a productive<br />

milling tool featuring a speed of up to<br />

60 mm/s for the fast routing of circuit boards.<br />

New features include increased accuracy, operator<br />

indicator lights, noise level reduction<br />

and simulation of the tool route.<br />

SMTconnect, Booth 5–434B<br />

www.ipte.com<br />

PIEK Training & Certification<br />

IPC Training & Certification<br />

Consultancy<br />

Test Center PB’s & PBA’s<br />

Audit services<br />

IPC Validation Services<br />




Flexible robotic reel handling system<br />

VJ Electronix, Inc., provider of rework technologies,<br />

X-ray inspection, and component<br />

counting systems, recently introduced a concept<br />

in reel handling automation for component<br />

counting.<br />

The company coupled its automatic component<br />

counting system with a high-speed,<br />

three axis robot to transfer reels from an<br />

input storage buffer, into the X-ray counting<br />

system, and back to an output storage buffer.<br />

The integrated bar code camera reads one or<br />

more barcodes at the input buffer, prior to<br />

loading. Labels may be applied at the output<br />

buffer.<br />

“Our new robot approach is truly flexible,”<br />

said Engineering Manager, Steve Bowler.<br />

“We can incorporate most any brand of<br />

robot, add multiple buffers, and/or integrate<br />

directly with commercial storage systems. I<br />

can imagine creation of a docking station for<br />

our customers’ AGVs.”<br />

Built in the company’s Chelmsford, MA factory,<br />

the robotic reel handling system is a collaborative<br />

effort between their Chelmsford<br />

and Suzhou China locations, as well as, their<br />

technology partner, AccuAssembly.<br />

www.vjelectronix.com<br />

Robot transfers reels from an input<br />

storage buffer, into the X-ray counting system, back<br />

to an output storage buffer.<br />

Source: VJ Electronix, Inc<br />

Large all-in-one platform for high-speed dispensing<br />

Source: Essemtec<br />

The large all-in-one platform from Essemtec<br />

can be used for the assembly of high-speed<br />

applications, rapid prototyping and highspeed<br />

dispensing.<br />

Fox 2 has a machine footprint of just 1 m 2 and<br />

can accept PCB sizes up to 16 x 12 “. Compo-<br />

Essemtec‘s Fox 2 systems<br />

have linear motors<br />

and a mineral<br />

cast frame, providing<br />

excellent speed, stability,<br />

accuracy.<br />

nents with sizes from 01005 up to<br />

1.3 x 3.1 “are placed. The machine achieves<br />

10,800 cph (IPC9850) at 50 μm, 3 sigma with<br />

a two nozzle head. It has linear motors and a<br />

mineral cast frame, providing speed, stability,<br />

accuracy, and suited for small to medium<br />

production environments.<br />

Puma is a high-speed pick-and-place solution<br />

that can be used in the ultra-flexible prototyping<br />

development sector. With an IPC assembly<br />

performance of 18,100 cph, it pushes<br />

into the mid-range field. It boasts up to 280<br />

feeder positions, which offers the highest<br />

number of feeders in relation to its foot print.<br />

The machine processes PCB sizes up to<br />

1,800 mm x 610 mm.<br />

Aside from handling the assembly processes,<br />

Puma also dispenses and jets in parallel<br />

up to 150,000 dots per hour. When all<br />

three axis are used for dispensing fluids, the<br />

platform is called Tarantula. There are five<br />

valve technologies to choose from, and with<br />

the plug-and-play method, all heads can be<br />

retrofitted or changed over on site.<br />

The linear motor technology paired with the<br />

material “Epument” for the mineral cast<br />

frame gives a speed increase of up to<br />

52.5 %. The updated vibration absorption<br />

through the mineral cast frame gives consistent<br />

accuracy. Replacing spindles and belts<br />

with the linear motor technology means the<br />

required maintenance is reduced. The assembly<br />

and dispensing processes are also<br />

displayed on the same X/Y system.<br />

The system’s software has been optimized.<br />

The structured interface on a large touch<br />

screen monitor is easy to operate. This enables<br />

the operator to process simple assembly<br />

groups and more complex projects<br />

with mixed processes, 2.5D applications and<br />

more, directly on the machine.<br />

SMTconnect, Booth 4-318<br />

www.essemtec-usa.com<br />

All-in-one smart device compatible with all profilers<br />

KIC, the market and technology provider of<br />

smart oven solutions, has recently introduced<br />

the SRA (Smart Reflow Analyzer). It is<br />

an integrated fixture and profiler specifically<br />

designed for collecting reflow oven related<br />

data to analyze and track machine stability<br />

from run to run, and over time.<br />

As it contains a built-in data collection module,<br />

it is an all-in-one smart fixture. This<br />

means that the SRA can be used no matter<br />

whose profiler you may currently have.<br />

The SRA has six embedded thermocouples –<br />

three Air TCs and three Mass TCs – which are<br />

used to calculate and display a variety of data<br />

for each oven zone, such as measured zone<br />

temperatures and side to side uniformity.<br />

With the use of the SRA, users also are able<br />

to identify changes in heat transfer in a zone<br />

over time, through the display of HTI (Heat<br />

Transfer Index). Additionally, it utilizes the latest<br />

in laser sensor technology to automatically<br />

measure the conveyor speed each time<br />

it is run through a machine.<br />

The device is used to routinely check the performance<br />

of a machine and identify changes<br />

over time. Using a variety of available specifications,<br />

the machine’s performance is<br />

measured each time a pass is made based<br />

on the selected Process Window. The included<br />

SPC charting feature allows for tracking<br />

of the performance of individual zones, as<br />

well as other key parameters, based on specifications<br />

selected.<br />

SMTconnect, Booth 4A-230<br />

www.kicthermal.com<br />

80 <strong>EPP</strong> EUROPE April 2019

Smart storage systems streamlining material handling systems<br />

Inovaxe is a supplier of lean material handling<br />

solutions to the electronics manufacturing industry.<br />

Their total production and inventory<br />

management solutions streamline material<br />

handling and accuracy issues.<br />

The Smart Srex stationary storage solution is<br />

designed to store and manage all inventory<br />

needs. As with the company’s reel storage<br />

system, the InoMechanical carts and racks<br />

utilize the InoAuto material management system.<br />

This system allows users to store and<br />

manage bagged parts, Jedec trays, PCB’s<br />

and more. This product comes in two models<br />

and a multitude of configurations. The first<br />

model is the SR140, which is a mobile smart<br />

cart that not only supports reels, but can support<br />

trays, bins, and other non-reel parts as<br />

well. This mobile smart cart can accommodate<br />

up to 7 rows of reel parts, or 14 rows of<br />

non-reel parts, or a combination of both. The<br />

Srex200 is a fixed smart storage system that<br />

allows all manufactures looking for storage<br />

and traceability of non-reel parts. Within the<br />

small and compact footprint solution, you can<br />

store and manage up to 264 unique part<br />

numbers. This can include bagged parts,<br />

Jedec tray parts, PCB‘s, and more. With<br />

these two additions to the family of smart<br />

storage solutions, it will allow users to manage<br />

every part in their inventory, not just reel<br />

parts.<br />

Additionally, part of the company‘s portfolio<br />

include the InoAuto Smart storage solutions,<br />

including reel storage, stencil storage, MSD<br />

storage and more. The ultra-lean material<br />

handling systems enable users to locate<br />

parts in less than four seconds and return a<br />

part in less than eight seconds. The carts are<br />

mobile or fixed, can store 560 reels in<br />

0.23 m 2 or 1120 reels in 0.42 m 2 , and the ROI<br />

is less than six months. The company has<br />

provided manufacturers with the capabilities<br />

to substantially streamline their material<br />

handling systems to achieve the following<br />

benefits:<br />

• More than 90 % labor reduction in pulling<br />

kits and returning parts<br />

• More than 90 % space reduction for storing<br />

SMT parts and kits<br />

• Reduction of set up time and increase in<br />

The InoMechanical carts and racks utilize a material<br />

management system that allow users to store and<br />

manage bagged parts, trays, PCB’s and more.<br />

machine up time<br />

• Reduction of operator travel time by 60 %<br />

• Eliminates paper for kit pull and feeder<br />

loading operation<br />

• Enhances inventory accuracy without<br />

counting parts<br />

• Reduces errors in the feeder set up operation<br />

• Typical ROI is less than three to six months<br />

www.inovaxe.com<br />

Source: Inovaxe Corp.<br />

Automated Optical Inspection<br />

2019 NEW 3D AOI Series launch at SMT!


Timely fault detection in tightest spaces<br />

An inspection system for THT<br />

component testing<br />

Written off for dead yet still alive and kicking: THT components (Through Hole Technology) simply can’t be replaced.<br />

This can be seen in the manufacturing of electronics by ebm-papst. Thanks to power electronics, the manufacturer of<br />

fans and electric motors uses THT components in a large portion of its printed circuit boards. Assemblies of this kind<br />

require reliable quality assurance, because it is often complicated and expensive to carry out repairs after soldering.<br />

The THT manual assembly stations,<br />

left, and the downstream inspection<br />

system MultiCam Line, right.<br />

Source: Göpel electronic<br />

ebm-papst has a vast product range. For the most part, it is<br />

centred around fans, blowers and pumps. Some products are<br />

just a few centimetres in size, with others measuring over a metre<br />

in diameter. They have one thing in common: they all need electronics.<br />

At its site in Mulfingen, Germany, the company manufactures<br />

approximately 650,000 assemblies per month, around half a<br />

million of which are THT assemblies – mathematically speaking, that<br />

means that three quarters of all assemblies have components that<br />

are soldered using through-hole technology. The fact that such a<br />

large number of assemblies also have to be tested is a logical consequence<br />

of this. There are various different systems from different<br />

manufacturers for automatic optical inspection (AOI), in particular<br />

for THT components. A special requirement for a new testing system<br />

for ebm-papst was ultimately what saw the contract awarded<br />

to the MultiCam Line from Göpel electronic: an exceptionally small<br />

system footprint, along with outstanding performance.<br />

High quality production<br />

At the production site, PCBs are assembled<br />

on a total of eight SMD lines and one THT<br />

line. The THT production line consists of 12<br />

manual assembly stations, where components<br />

are fitted to the PCB by hand. The assemblies<br />

are automatically transported into<br />

the line on a workpiece carrier and to the respective<br />

workstations. Each of the assemblies<br />

is then navigated to its assigned assembly<br />

stations using an RFID code. This is<br />

all fully automated, which at the same time<br />

ensures enormous efficiency when there are<br />

around 1,000 different product variants.<br />

Once the respective THT components have<br />

been mounted on the PCBs, which are already<br />

fitted with SMD components, the<br />

components are then soldered in a final step using wave soldering.<br />

At ebm-papst, an automatic inspection is carried out before soldering,<br />

however. For Tobias Brand, process developer in Mulfingen, the<br />

advantages of this are clear: “Repairing an incorrectly mounted THT<br />

component after soldering involves a great deal of effort. If you can<br />

identify the error early, that saves time and money.” When it came<br />

to installing an inspection system between manual assembly<br />

stations and the soldering furnace, however, the problem was one<br />

of a lack of space. Because the production line as it was had already<br />

reached its limits when it came to space, the MultiCam Line impressed<br />

with its ability to be integrated easily into the production<br />

line with a footprint of just 660 mm x 760 mm. The highlight of the<br />

whole thing is that the system manages without any kind of axis<br />

system for the camera module and thus operates completely wearfree.<br />

The solution is to save space<br />

The secret to saving space and zero maintenance is the image-capture<br />

module by the name of MultiEyeS. It consists of a matrix arrangement<br />

of multiple cameras. The image capture from all cameras<br />

takes place virtually simultaneously. The individual images are<br />

82 <strong>EPP</strong> EUROPE April 2019

The MultiEyeS camera module with 28 cameras.<br />

Source: Göpel electronic<br />

Source: Göpel electronic<br />

High component clearance during image capture of<br />

assemblies on workpiece carriers.<br />

Source: Göpel electronic<br />

Zusammenfassung<br />

Die Leistungselektronik eines Herstellers von Ventilatoren und<br />

Elektromotoren benötigen THT-Komponenten. Baugruppen, die zuverlässige<br />

Qualitätssicherung erfordern, wozu ein System mit außergewöhnlichem<br />

kleinem Platzbedarf bei gleichzeitig hervorragender<br />

Leistung gesucht wurde.<br />

Résumé<br />

La puissance électronique pour des ventilateurs et des moteurs<br />

électriques nécessite des composants THT. La clientèle recherche<br />

des composants d’une qualité fiable et comprenant un système<br />

avec un encombrement adapté et des performances optimales.<br />

Резюме<br />

В силовой электронике производителя вентиляторов и<br />

электродвигателей активно применяются компоненты для<br />

сквозного монтажа в отверстия (THT). Эти узлы требуют<br />

серьезного контроля качества. Для этого производитель ищет<br />

компактную систему, обеспечивающую при этом высокий<br />

уровень производительности.<br />

Tobias Brand (ebm-papst) and Marius Otto (Göpel electronic)<br />

at the verification station.<br />

then automatically assembled to form an overall picture. This technology<br />

has now become common in smartphone cameras thanks to<br />

panorama features and is known as ‘stitching’.<br />

In the system software Pilot 6, the individual images are combined<br />

to form an overall picture using a stitching algorithm that is optimised<br />

for the application in question. This means that there are a total<br />

of 12,000 x 10,000 colour pixels, i.e. a total of 120 megapixels, available<br />

for image capture of the inspection area. Since the image capture<br />

of the cameras is performed as far as possible in parallel and<br />

the stitching algorithm is trimmed for speed, a full-surface image of<br />

an assembly measuring 490 mm x 390 mm can be captured and processed<br />

in less than 5 seconds. With a physical resolution of 40 μm,<br />

the MultiEyeS image-capture module is aimed in particular at inspection<br />

tasks for THT placement monitoring – for example presence,<br />

positional accuracy and polarity. Because THT components<br />

differ greatly in size, different focal planes can be set in the inspection<br />

process according to requirements. This can vary from 2 mm to<br />

100 mm, which means a high clearance height and at the same time<br />

a high degree of flexibility in the inspection.<br />

Looking back, Tobias Brand is very satisfied with the decision to<br />

choose the MultiCam Line for THT inspection. “Following the installation<br />

at our site in Mulfingen, we also added more systems at our<br />

production site in Hungary.” The test programs are created in Germany<br />

and transferred to Hungary. Because the production sites are<br />

networked, adjustments can be made to the test programs quickly<br />

and easily from Germany. The programming is carried out quickly,<br />

and the component library is now well stocked. “It takes little more<br />

than half an hour to create the test programs,” observes Tobias<br />

Brand in conclusion. With the high speed of programming and of<br />

the test procedure as well as its wear-free operation, the MultiCam<br />

Line at ebm-papst does exactly what it claims to do: it finds errors<br />

early, before it’s too late – and in the tightest spaces.<br />

www.goepel.com; www.ebmpapst.com<br />

<strong>EPP</strong> EUROPE April 2019 83


Accelerated mechanical fatigue interconnect test<br />

Rapid test for reliability<br />

of heavy wire bonds<br />

In modern power electronics, an enormous number of heavy wire bonds are used, which ideally withstand high<br />

thermal alternating loads for many years. Therefore, special attention is paid to the quality of these bonds. The<br />

difficulty with quality assurance lies in the fact that the service life of the bond connection must be maximized, i.e.<br />

its reliability. However, this cannot easily be traced back to an abstract bond quality at the time of manufacture.<br />

Standard quality tests, such as pull and shear tests, are therefore first and foremost a makeshift solution designed<br />

primarily to ensure compliance with production quality. Conclusions about the service life of a bond connection<br />

require much more complex – and above all more time-consuming – test procedures in which typical load<br />

scenarios are simulated, as they will occur in actual use.<br />

Siegfried Seidl, F&S Bondtec Semiconductor GmbH, Dr. Bernhard Czerny, TU Vienna<br />

Bond tester 5600 by F&S Bondtec.<br />

Source: F&S Bondtec<br />

The most widely used such test is the Active-Power-Cycling-Test<br />

with active load cycles. The component is energized under<br />

quasi-real conditions until a defined temperature rise is observed;<br />

these load cycles are then repeated until the component fails. The<br />

main variables here are the temperature swing that occurs, the initial<br />

temperature and the cycle time, which is usually a few seconds.<br />

Due to the significantly different CTE (coefficients of thermal expansion)<br />

of bond wire (aluminum) and semiconductor chip (silicon), the<br />

heating generates a mechanical load that eventually causes cracks<br />

at the ends of the wire bond after many thousands of cycles. Over<br />

time, these cracks then travel through the entire bond until the connection<br />

lifts off and the component fails.<br />

Disadvantages of active cycle test<br />

It is obvious that such a cycle test is timeconsuming:<br />

even with a relatively short cycle<br />

time of 5 seconds and a service life of only<br />

100,000 cycles, the measurement takes almost<br />

6 days. For a component (or test scenario)<br />

with ten times the service life, the<br />

measuring time would then be almost 2<br />

months. It is therefore becoming increasingly<br />

difficult to develop components with ever<br />

longer service lives, because it can take several<br />

months just to decide between several<br />

process variants. Consequently, it is no solution<br />

either to further accelerate the tests by,<br />

for example, increasing the temperature stroke and thus the<br />

thermo-mechanical load. Although this usually leads to an earlier<br />

failure, the mechanism of fatigue can be different from that at a<br />

lower temperature swing – and the significance of the test is therefore<br />

limited.<br />

This is not even the only weakness of the PC test. As a quality control<br />

during production, or to ascertain that process changes, different<br />

component suppliers, etc. do not have a harmful effect, the long<br />

test duration bears the risk that, in the worst case, several weeks<br />

worth of production might have to be discarded or devalued.<br />

The magic solution, to the latter problem in particular, would be a<br />

rapid test that, like a kind of time machine, accelerates the test and<br />

allows at least semi-quantitative results or comparisons between<br />

different component batches.<br />

84 <strong>EPP</strong> EUROPE April 2019

Source: F&S Bondtec<br />

The clamping device controls the opening width and adapts it to<br />

the required space, so adjacent wires can also be gripped.<br />

Resonance tweezer clamp: FEM simulated preload, mode of<br />

vibration and manufactured clamp.<br />

Source: F&S Bondtec<br />

Source: F&S Bondtec<br />

The lifting of the bond wire directly after the fatigue test.<br />

Dr. Khatibi‘s research group at the Vienna University of Technology<br />

has developed such a rapid test, which has since been implemented<br />

on an automated Bond tester, the F&S Bondtec 5600C, in<br />

the framework of a Christian Doppler Laboratory with F&S Bondtec,<br />

Braunau/Austria, and is now available as standard commercial<br />

equipment.<br />

Straightforward rapid testing<br />

The process is based on a simple idea: during a temperature<br />

change, the aluminum bonding wire expands almost nine times as<br />

much as the silicon base of the chip – the wire tugs at the connection<br />

interface, so to speak. This tensile stress occurs mainly along<br />

the wire axis, because a heavy-wire bond is considerably longer<br />

than wide. Precisely this mechanical tension can be reproduced by<br />

gripping the bond wire at the bond foot with a clamp and pulling it<br />

back and forth along the wire direction. The movement amplitude<br />

must be as large as the expansion at the corresponding temperature<br />

stroke.<br />

This principle was implemented in the BAMFIT Bond tester (Bondtec<br />

Accelerated Mechanical Fatigue Interconnect Test), based on a<br />

heavy wire bonder. The crucial new technical development, now<br />

patented, is a forceps clamp which is mounted in place of the bond<br />

tool and can grip and clamp the bond foot. In addition, it functions<br />

exactly like a bond wedge, i.e. it is mechanically excited by an ultrasonic<br />

transducer at 60 kHz and vibrates in resonance. Made of<br />

special steel, it is pre-stressed inwards so that the tip closes with a<br />

constant and defined clamping force. It can be opened by an external<br />

mechanism so that it continues to work in resonance when<br />

closed. With this clamping device, the opening width can be freely<br />

controlled and adapted to the space required, so that closely adjacent<br />

wires can also be gripped. Each resonance tweezer clamp is<br />

specially dimensioned, and the clamping strength and tip size are<br />

adapted to the wire diameter and material to be tested.<br />

The entire process was realized on the platform of the Bondtec<br />

5600 automatic Bond tester. This device features interchangeable<br />

bond or test heads and allows programmable, automatic operation<br />

at any number of test positions, even with automatic image recognition<br />

for accurate and reproducible positioning. Other functions of<br />

the automatic tester, such as automatic height measurement with<br />

touchdown, have also been implemented.<br />

<strong>EPP</strong> EUROPE April 2019 85


Fatigue fracture pattern on the chip side of a bond wire lifter (lift-off).<br />

The BAMFIT test head is simply exchanged for another bond or test<br />

head on the machine base, so that standard pull or shear tests can<br />

be carried out interchangeably. If the machine already has an ultrasonic<br />

generator, this is also used for the tests. The machine software<br />

is identical to that used for bonding or testing. The training effort<br />

for the new test procedure is therefore comfortably low.<br />

A test run is straightforward: First, both the position and direction of<br />

the wedge bond contact are precisely located, and the clamp is<br />

then opened so that the clamp tips move past the wire as they are<br />

being lowered. Touching the bond surface is detected by the touchdown<br />

sensor; the clamping tweezers are then raised to the programmed<br />

clamping height and closed. In this state, at a defined distance<br />

from the bond surface, the bond wire is mechanically connected<br />

to the 60 kHz transducer from both sides with a constant<br />

clamping force via the clamping jaws.<br />

These clamping jaws are slightly longer than the wedge bond foot<br />

so that they project beyond it and achieve the largest possible<br />

clamping surface. During the entire duration of the ultrasonic signal,<br />

the bond force device applies a small constant tensile preload in the<br />

Z direction to prevent the connection from frictional re-bonding. This<br />

upward pull is so small that no additional damage is caused. The<br />

height sensor now allows to determine the exact time of failure<br />

when the wire lifts off.<br />

Efficient process optimization<br />

The ultrasonic power at the transducer can be adjusted and is directly<br />

proportional to the oscillation at the tip of the clamp jaws.<br />

These cyclic deflections are well below 1 μm and are therefore<br />

much lower than for the actual bonding itself. Depending on the amplitude<br />

applied, the number of cycles until complete lift-off is in the<br />

Source: F&S Bondtec<br />

range of about 10 4 to 10 8 and above. At an excitation frequency of<br />

60 kHz, 10,000 cycles correspond to a measurement time of approx.<br />

160 ms, which can still be clearly resolved at a measurement<br />

interval of approx. 15 ms. In a typical service life range of 10 to 100<br />

times more cycles, a very acceptable measurement time of approx.<br />

1.5 to 15 s is achieved. Thus, a rough lifetime prognosis is achieved<br />

simply by measuring the time from switching on the ultrasonic oscillation<br />

until the wire detachment.<br />

In this way, an entire layout can be programmed and tested automatically<br />

in a very short time. Start (source), middle (stitch) or end<br />

(destination) bonds can be gripped and tested in the same way, as<br />

long as they are accessible from above, similar to the bonding itself.<br />

For the precise positioning of already existing bonds, the program<br />

and the image recognition unit (PRU) of the Bond tester can be<br />

used advantageously for previously bonded wires.<br />

As a result, the number of load cycles until final lift-off is determined<br />

as a function of freely programmable oscillation amplitudes, which<br />

can be converted into shear stress values at the joint. There is a correlation<br />

between pure mechanical stress amplitudes and the reference<br />

junction temperature differences (∆ Tj) for PC tests. Finite element<br />

analyses can be used to convert between the thermally and<br />

mechanically induced stresses in the contact interface with great<br />

accuracy. The mechanically determined lifetime curves show remarkable<br />

good agreement with results from PC tests in the ∆ Tj<br />

range 50 to 160 K for the same failure pattern, a bond wire lift-off.<br />

The mentioned tester is already in series production with first<br />

manufacturers of power modules. It is expected to make a valuable<br />

contribution to efficient quality assurance and simpler process optimization<br />

for thick wire bonds. Further developments for the extension<br />

of the technology to copper heavy wire bonds as well as ball<br />

bonds with copper wire are already underway and are also showing<br />

very positive results.<br />

www.fsbondtec.at<br />

Zusammenfassung<br />

Bond-Drahtverbindungen müssen über mehrere Dekaden und unter<br />

hohen thermomechanischen Belastungen zuverlässig halten. Dafür<br />

sorgt ein Bondtester mit einem extrem schnellen automatischen<br />

Qualitätstest zur Lebensdauerbestimmung der Bond-Drahtverbindungen.<br />

Résumé<br />

Les connexions des fils de liaison doivent être fiables pendant plusieurs<br />

années et résister à des charges thermomécaniques fortes.<br />

Ceci est réalisé par un testeur de liaison dans lequel est incorporé<br />

un test de qualité automatique et rapide ; ceci afin de déterminer la<br />

durée de vie des connexions des fils de liaison.<br />

Резюме<br />

Контактные соединения с использованием гибких<br />

металлических проводников должны служить десятилетия в<br />

условиях серьезных термомеханических нагрузок.<br />

Качественное соединение можно обеспечить только при<br />

использовании высокоскоростного тестера, позволяющего в<br />

автоматическом режиме осуществлять контроль сварок.<br />

86 <strong>EPP</strong> EUROPE April 2019



3D AOI and X-ray for high-volume production<br />

Viscom Inc. will exhibit their inspection systems<br />

at the SMTconnect tradeshow in Nuremberg,<br />

Germany. The company‘s portfolio<br />

include the S3088 ultra chrome, X7056-II 3D<br />

X-ray, and automatic inspection assignment.<br />

The S3088 ultra chrome is based on the company’s<br />

3D AOI technology, and combines accurate<br />

defect detection with high inspection<br />

speed. This makes the system the first<br />

choice for efficient SMT production.<br />

Some of its features include inspection<br />

speed of up to 65 cm 2 /s and 65 mega pixels<br />

of information in each 50 mm x 50 mm field of<br />

view. The resolution is switchable, and with<br />

10 μm per pixel even 03015 components can<br />

be reliably inspected. Together with the eight<br />

angled-view cameras, a virtually shadow-free<br />

3D inspection is one of the key advantages<br />

of the system. Along with the high-performance<br />

hardware, the company delivers excit-<br />

ing new software features that enable automatic<br />

3D program generation utilizing an extensive<br />

IPC compliant library, Gerber and<br />

centroid data to create a precise and comprehensive<br />

3D image. With the unique 360View<br />

capability, side views of electronic components<br />

can be rendered in True to Life images.<br />

Automatic 3D X-ray inspection<br />

The X7056-II automatic 3D X-ray inspection<br />

system features high throughput and superb<br />

image quality for the requirements in highend<br />

electronics production.<br />

This new AXI in-line system can ensure precise<br />

inspection of hidden solder joints and<br />

components in production, including μBGA<br />

HIP (head in pillow) defects on bumps down<br />

to 0.2 mm Ø.<br />

The system is equipped with the xFastFlow<br />

transport module, which cuts printed circuit<br />

board transfer times. With this feature, up to<br />

three boards can be processed at the same<br />

time.<br />

The company‘s portfolio also includes their<br />

3D SPI and Offline uCT X-ray systems.<br />

SMTconnect, Booth 4A-120<br />

www.viscom.com<br />

Source: Viscom Inc.<br />

An advantage for the S3088 ultra chrome is its<br />

virtually shadow-free 3D inspection.<br />

Rapid test method to detect defects in protective coating<br />

The integrity of coatings of electronic assemblies<br />

to protect against interference,<br />

harsh climate conditions, and harmful gasses<br />

has a significant effect on the reliability of<br />

those assemblies. An inability to protect<br />

against such risks may lead to damages that<br />

result in an edge escape at connection contacts<br />

and pore channels in paint pooling<br />

areas, among other potential problems. By<br />

using the Coating Layer Test from Zestron,<br />

defects in protective coatings or non-closed<br />

layers in μ-coatings become visible via the<br />

appearance of black dyed indicators.<br />

This non-destructive test on closed and<br />

dense coating represents a significant upgrade<br />

from commonly used methods for<br />

coating thickness measurement. Therefore,<br />

the test can also be used during production<br />

for cost-effective sampling.<br />

www.zestron.com<br />

Zestron introduces rapid test method to detect defects<br />

in protective coating of electronic assemblies.<br />

Source: Zestron <strong>Europe</strong><br />

Purity is Found<br />

in the Cold<br />

FR4 Laser Cutting without Carbonization<br />

The LPKF PicoLine 3000 and the new LPKF CleanCut<br />

Technology are defining all new standards for cutting printed<br />

circuit boards with a laser. www.lpkf.com/picoline-3000<br />

SMTconnect: 7 – 9 May, Hall 5, Booth 434B<br />

<strong>EPP</strong> EUROPE April 2019 87



Software featuring live image overlay<br />

Inspectis AB’s new Pro and Pro-X software<br />

editions feature a live image overlay comparison<br />

function with auto image alignment,<br />

making inspection clearer and easier to use.<br />

This function is additional to the existing<br />

comparison functions that includes overlay of<br />

two saved images.<br />

In addition to other inspection and measurement<br />

functions, Live Overlay function can be<br />

used as a simple image comparator to assist<br />

in detecting differences between a live<br />

image and a saved reference image. The<br />

company’s software makes it easy to spot<br />

faults, such as incorrectly placed, badly<br />

placed and missing parts.<br />

A video demonstration of this powerful feature<br />

can be seen on the company‘s Youtube<br />

channel.<br />

The Pro and Pro-X Windows PC software is<br />

compatible with all of the company’s camera<br />

models, from the C12 to U30 Series, and all<br />

editions are built upon the same carefully-designed<br />

and developed user interface with<br />

clear and intuitive controls and tools.<br />

www.inspect-is.com<br />

The Live Overlay function can assist in detecting differences<br />

between a live image and saved reference.<br />

Source: Inspectis AB<br />

High multi-site automotive and industrial device testing<br />

Automotive<br />

power electronics<br />

ICs<br />

are complex<br />

and have<br />

stringent<br />

test requirements.<br />

This<br />

limits how many IC’s can be tested in parallel,<br />

and inhibits the cost-effectiveness of<br />

modern parallel manufacturing test strat-<br />

Source: Cohu Inc.<br />

The VI1x offers a solution for CAN<br />

and LIN bus testing, including<br />

specialized loads, detailed timing<br />

measurements, and high voltage<br />

leakage testing.<br />

egies. The Diamondx platform, with a range<br />

of power and automotive instrumentation<br />

featuring SmartMux, enables maximum efficiency.<br />

The VI1x from Xcerra, a Cohu company,<br />

has uncompromising measurement<br />

quality and high parallel test efficiency.<br />

Leveraging a discrete channel design, the<br />

VI1x delivers up to 100 mA in the ± 60V range<br />

and up to 300 mA in the ± 20V range, while<br />

offering force and measure current accuracy<br />

as low as 1.2 nA. With a 64 channel Smart-<br />

Mux topology, the platform dramatically reduces<br />

loadboard PCB complexity, speeding<br />

time to market and reducing cost and risk associated<br />

with leading-edge automotive and<br />

industrial power management devices.<br />

Christopher Lemoine, Product Marketing Director,<br />

notes: “The Diamondx already offers<br />

an impressive range of automotive and industrial<br />

instrumentation products, and the<br />

VI1x is the latest member of this family.<br />

Coupled with the AT1x instrument, it offers a<br />

complete solution for CAN and LIN bus testing,<br />

including specialized loads, detailed timing<br />

measurements, and high voltage leakage<br />

testing. The HPVIx and FPVIx handle high<br />

power devices up to ± 100V and up to 5A, respectively,<br />

with the ability to combine instruments<br />

for higher current or voltage. All of<br />

these instruments feature SmartMux technology,<br />

to enable higher multi-site and uptime,<br />

and faster time to market. The benefits<br />

are higher yield, lower cost, and better responsiveness<br />

to a fast-changing market.”<br />

www.cohu.com<br />

Expansion of product portfolio for the semicon industry<br />

Yxlon International, a division of the Swiss<br />

Comet Group, has launched a range of X-ray<br />

inspection systems dedicated to the semicon<br />

industry. They offer advanced automated 2D<br />

and 3D inspection of bumps and filled vias to<br />

locate, identify and measure failures, including<br />

non-wetted bumps, voiding and misalignments.<br />

In terms of resolution, these systems<br />

are among the best in the market.<br />

The FF70 CL and FF65 CL series are fully<br />

automated analysis systems offering ultrahigh<br />

resolution and magnification for the<br />

smallest semiconductor defect detection.<br />

These systems provide automated analysis of<br />

TSVs, C4 bumps, 3D packages and MEMS at<br />

wafer, strip or component level. Lastlyk, the<br />

The FF70 CL has a computed laminography for<br />

ultra-high volume resolution and has defect<br />

inspection capability at a micron level.<br />

FF65 IL with its integrated loader is designed<br />

to meet the needs of volume manufacturing<br />

whilst maintaining market leading features<br />

and benefits. They were developed under collaboration<br />

with Nagoya Electric Works.<br />

“Our customers in the semicon industry<br />

require analyzing continuously smaller features<br />

at higher speed. Classical electrical<br />

Source: Yxlon International<br />

testing and optical inspection are coming to<br />

their limits, especially in complex 3D packaging”,<br />

states Eike Frühbrodt, Vice President<br />

Product and Project Management. “The<br />

FF70 CL with its computed laminography for<br />

ultra-high volume resolution can handle this<br />

challenge easily. An air-suspended high precision<br />

manipulator, anti-vibration mechanics<br />

and 7 tons of machine weight make it an<br />

ideal choice for defect inspection at micron<br />

level. And when speed is more an issue than<br />

ultra-high resolution, the FF65 CL and FF65<br />

IL will deliver. All three systems are an excellent<br />

complimentary range to our existing<br />

product portfolio for the electronics market<br />

with Cougar and Cheetah EVO, as well as<br />

FF20 CT and FF35 CT.”<br />

www.yxlon.com<br />

88 <strong>EPP</strong> EUROPE April 2019

Latest range of AOI technology<br />

A challenge when programming AOI systems<br />

is the detection of all non-conforming<br />

placements, especially those related to<br />

solder joints, without creating ‘’false calls’’.<br />

This commonly results in long debugging<br />

time and complex programming.<br />

Implementing a new AOI system can take<br />

several months and the ongoing creation of<br />

new programmes to increase its reliability is<br />

labour intensive. A programmer can override<br />

programs and instruct a machine to accept all<br />

boards or reject all components and solder<br />

joints, depending on the settings.<br />

Mek offers a line of inspection equipment for<br />

maximized defects coverage, with minimum<br />

human interaction. The benefits of ISO-Spector<br />

M1A include:<br />

• Engineer independent, exceptionally fast,<br />

automatic programming<br />

• Self-learning algorithms for solder-joint inspection<br />

using Artificial Intelligence<br />

• Dramatically reduced programming time<br />

• Less ‘’false calls’’ and debugging time<br />

• More reliable inspection results<br />

The full 3D ISO-Spector M1A delivers<br />

a self-learning algorithm for<br />

solder joint inspection that will<br />

detect deviation outside the expected<br />

standard appearance of a<br />

solder joint. A proprietary solution<br />

with Artificial Intelligence<br />

monitors production and adjusts<br />

hundreds of tolerance values<br />

where needed to maximize detection.<br />

The programmer does not have to specify inspection<br />

locations, light settings or acceptance<br />

criteria. This reduces programming time<br />

and removes human variable to ensure reliable<br />

inspection results. Overruling settings<br />

is still doable, but experience has proven that<br />

it is rarely needed. Typically programming a<br />

new part number requires 1-2 minutes and<br />

part numbers can be stored in the library to<br />

reduce programming time for future NPI’s.<br />

Also the desktop PowerSpector GTAz 520 is<br />

designed for maximum defect coverage with<br />

short programming times. It is equipped<br />

with 9 cameras: 1 top and 8 side cameras.<br />

Mek offers a line of inspection equipment<br />

for maximized defects coverage, with<br />

minimum human interaction.<br />

Source: Mek<br />

The optical unit is configurable to fit all needs<br />

of today.<br />

The SpectorBOX GTAz 550 “Bottom Up/Top<br />

Down” system is engineered to accommodate<br />

solder frames on return and/or feed conveyors.<br />

The system offers bottom top, or dual<br />

side inspection, deploying up to 18 cameras,<br />

Z axis positioning and auto-focus. The design<br />

is for the inspection of THT components to<br />

identify defects such as presence/absence,<br />

wrong polarity, type, and bent pins. Integration<br />

alternatives are enhanced by its slim,<br />

compact mechanical design.<br />

www.marantz-electronics.com<br />

Smart Manufacturing capabilities for inspection<br />

As ‘Your Partner for Smart Factory<br />

Realization,’ Koh Young Technology<br />

has true 3D solutions<br />

with expanded capabilities that<br />

improve production throughput<br />

and yield.<br />

Leveraging its core strengths in<br />

robotics and true 3D measurement,<br />

the company brought the<br />

next generation of accuracy to<br />

the pin inspection, machined<br />

parts, and semiconductor inspection<br />

markets. The KY-P3 delivers<br />

true 3D inspection data for<br />

single array, forked, press-fit, and<br />

other pin configurations for Final<br />

Optical Inspection (FOI) with applications<br />

like engine control<br />

units. The system also measures<br />

pin height, solder height, and pin<br />

tip separation with the highest<br />

accuracy and repeatability.<br />

The latest Machining Optical Inspection<br />

(MOI) system was also<br />

appealing for visitors. Developed<br />

around its core 3D measurement<br />

technologies, the MOI system<br />

inspects metal case surfaces for<br />

scratches, cracks, and stains,<br />

along with height, diameter, vol-<br />

ume, and more. Committed to<br />

bringing about “Smart Manufacturing”<br />

innovations, the system<br />

delivers both visual and process<br />

inspection simultaneously, which<br />

improves process yield and reduces<br />

false calls.<br />

Beyond pin and machined part inspection<br />

capabilities, the latest<br />

Meister D solution focuses on<br />

the SiP (System-in-Package) assembly<br />

process. This machine<br />

improves production yields on<br />

high density modules comprised<br />

of bare die and passives by integrating<br />

defect analysis and metrology<br />

software. With small<br />

sized component inspection<br />

down to 008004 inch, the system<br />

overcomes challenges in<br />

semiconductor packaging, which<br />

are compounded by chip stacking<br />

and wafer thinning. What’s<br />

more, the system also allows<br />

machine learning-based crack inspection.<br />

SMTconnect, Booth 4A-233,<br />

4A-231<br />

www.kohyoung.com<br />

<strong>EPP</strong> EUROPE April 2019 89


Advertisers / Editorials<br />

ACC Electronix 48<br />

Aegis Software 67<br />

AIM Metals & Alloys LP 47<br />

ALL Circuits 12<br />

ASM 44<br />

ASSCON Systemtechnik-<br />

Elektronik GmbH 75<br />

Asys 46<br />

AT&S 58<br />

Bayern Innovativ Ges. f. Innovation 17<br />

BJZ GmbH & Co. KG 92<br />

BTU International, Inc 75<br />

Calsonic Kansei 60<br />

Christian Koenen 14<br />

Christian Koenen GmbH 28<br />

Cohu 88<br />

Comus International 64<br />

Dow 46<br />

ebm-papst 82<br />

Electrolube 67, 74, 76<br />

Elektor 27<br />

EMA Design Automation 16<br />

ERSA GmbH, Wertheim 3<br />

Essemtec 64, 80<br />

Europlacer 72<br />

FEINMETALL GmbH 65<br />

F&S Bondtec 59, 84<br />

Fuji <strong>Europe</strong> Corporation 34<br />

Göpel electronic 82<br />

IBL-Löttechnik GmbH 89<br />

Inertec Löttechnik GmbH 63<br />

Inovaxe 81<br />

Inspectis AB 88<br />

IPC 6, 20, 27<br />

IPTE 5, 22, 79<br />

ITW EAE – Speedline World<br />

Headquarters 9<br />

Juki Automation Systems. 62<br />

KIC 17, 60, 80<br />

Koh Young Technology 2, 89<br />

Kurtz Ersa 48<br />

Kurtz Ersa Inc 62<br />

Kyzen 75<br />

LPKF Laser & Electronics AG 87<br />

MacDermid Alpha Electronics<br />

Solutions 59<br />

Mek 89<br />

Mentor 58<br />

Mesago Messe Frankfurt GmbH 18<br />

Messe München 24<br />

MI Elektronika 72<br />

MicroCare 55<br />

MicroCare <strong>Europe</strong> BVBA 47<br />

Musashi Engineering<br />

<strong>Europe</strong> GmbH 13<br />

Panacol 66<br />

Pemtron <strong>Europe</strong> GmbH 83<br />

PIEK International Education<br />

Centre (I.E.C.) GmbH 79<br />

PRO Design Electronic 44<br />

productronica 27<br />

Rehm Thermal Systems 15, 17, 66, 68<br />

Siemens 58<br />

Speedprint Technology 14<br />

Super Dry Totech 14<br />

Stäubli Tec-Systems GmbH<br />

Robotics, 37<br />

TAC Software AG 17<br />

Taiwan Electrical and Electronic<br />

Manufacturer’s Association 32<br />

Taiwan External Trade Development<br />

Council 32<br />

TopLine 16<br />

ULT 15, 59<br />

Viscom Inc. 47, 87<br />

VJ Electronix, Inc. 80<br />

Whizz Systems, Inc 62<br />

Yamaha Motor <strong>Europe</strong> 65, 63<br />

Yxlon International 1, 38, 88<br />

Zestron 63, 87<br />

ZEVATRON Löttechnik GmbH 46<br />

ISSN 1618–5587<br />

Trade journal for all fields of production in the<br />

electronics industry, manufacturing equipment,<br />

test and messurement, materials<br />

Publisher: Katja Kohlhammer<br />

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Ernst-Mey-Straße 8, 70771 Leinfelden-Echterdingen,<br />

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90 <strong>EPP</strong> EUROPE April 2019

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