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Industrie<br />

| The network of expertise for industry<br />

<strong>EPP</strong><br />

05 2017<br />

www.epp-europe.eu<br />

<strong>EUROPE</strong><br />

Electronics Production and Test<br />

COVER<br />

A quantum leap towards the<br />

factory of the future<br />


Trade shows + events<br />

2. InnovationsForum<br />

Hungary<br />

PCB + Assembly<br />

Smart electronics<br />

production<br />

Packaging<br />

Optimal process<br />

stability<br />

SMT/Nuremberg<br />

Visit us at<br />

Booth 4-140<br />

Test + Quality Assurance<br />

Revolutionizing<br />

defect analysis for<br />

electronics circuitry

Industrie<br />

The network of expertise for industry<br />

Hungary<br />

Focus: Manufacturing Technology<br />

at the Speed of Innovation<br />

25th May 2017<br />

9.00 to 17.00<br />

Academy of Sciences<br />

Budapest, Hungary<br />

Register<br />

now!<br />

Platform for Information and Networking<br />

• Innovation meets Volume Manufacturing<br />

• Rapid Prototyping Techniques and accelerated<br />

New Product Introduction (NPI)<br />

• Connecting Innovation to the Manufacturing<br />

Supply Chain<br />

• IoM & Industry 4.0 – Getting started<br />

• Connected and Collaborative Manufacturing<br />

Automation<br />

• TQM (Total Quality Management) & Zero-<br />

Defect-Strategy as a Competitive Advantage<br />

Register online now:<br />

innovationsforum-epp-emsnow.com<br />

Our Partners:


Advancing towards Industry 4.0<br />

Today, it is imperative to optimize the manufacturing process<br />

to ensure high productivity and reliability of all products.<br />

Koh Young’s Ksmart Solution provides full-automated<br />

process control in real time by communicating all elements<br />

together, collecting data from inspection, measurement,<br />

quality recognition, and analysis systems. With this solution,<br />

defects can be remotely monitored, establishing an<br />

efficient manufacturing process, all while minimizing defect<br />

rates and costs.<br />

The future begins with the ‘Smart Factory’ of today.<br />

Ersa!<br />

Award winning and<br />

patented systems<br />

for challenging<br />

rework applications.<br />

SMT Hybrid Packaging 2017<br />

This year, the international tradeshow and congress for system integrations<br />

in microelectronics presents itself with a new layout. Visitors<br />

can find numerous highlights in Halls 5, 4, and 4A. This particular orientation<br />

of the Halls emphasizes the focal points and value of the show.<br />

Simultaneously, PCIM Europe will also take place in Halls 6, 7, and 9.<br />

Inspiration. Innovation. Information.<br />

Ersa HR 550<br />

product video<br />

2. InnovationsForum Hungary 2017<br />

Electronic manufacturing in Eastern Europe has come a long<br />

way towards becoming more innovative, flexible, and agile.<br />

Continuing with last year’s success, visitors from the electronics<br />

design and manufacturing process will come together<br />

this year in Budapest, Hungary, to have heightened discussions<br />

about the latest innovations in the industry. This year, keynote<br />

speaker and senior executives will give presentations with a<br />

focus on manufacturing technology at the speed of innovation.<br />

Reflecting changes in manufacturing landscape.<br />

LED applications made in Italy<br />

In order for an LED module to function properly, converters<br />

and drivers are necessary to have a constant<br />

input and output voltage. TCI, an Italian specialist in<br />

LED applications, with the long-term help of Ersa’s<br />

wave soldering equipment, has realized all standard<br />

designs and innovative ideas. Continuing with the collaboration<br />

with Ersa, the company is making plans to<br />

go towards Smart Environment, where lights will be<br />

able to control themselves, adapting to external lighting<br />

conditions, to eliminate unnecessary electricity<br />

costs.<br />

40 % reduction of soldered assembly defects.<br />

16. – 18.05.2017 | Hall 4 | Booth 111<br />

HR 200<br />

Rework out of the box! –<br />

Simple and fast desoldering<br />

and soldering of SMDs.<br />

HR 550<br />

Guided Rework! –<br />

For highest requirements<br />

in precision and process<br />

safety.<br />

HR 600/2<br />

One Click Rework! –<br />

Automatic desoldering,<br />

placement and soldering<br />

of SMDs.<br />

HR 600/2 VOIDLESS<br />

High-end rework system<br />

for void-free repair of board<br />

assemblies.<br />

Source: Tom Oettle<br />

Doris Jetter<br />

Editor in Chief <strong>EPP</strong> E<br />

w w w . e r s a . c o m

Content 05 2017<br />

European Magazine for<br />

Production and Test in the<br />

Electronics Industry<br />

Cover<br />

A quantum leap<br />

towards the factory of the future<br />

With unique Ksmart functions including SPC@Ksmart and<br />

Link@Ksmart, manufacturers can trace the root cause of defects<br />

and process deviation by carrying out essential analyses of<br />

reliable full 3D board data.<br />

Koh Young Technology’s Ksmart Solution is an integrated,<br />

comprehensive productivity and process control center.<br />

Source: <strong>EPP</strong>E/EMSNow<br />

20<br />

InnovationsFORUM Hungary on May<br />

25, 2017 at the Academy of Sciences<br />

in Budapest.<br />

News + Highlights<br />

6 Juki announces changes in management<br />

New President and CFO<br />

6 Indium welcomes Vice President, Marketing<br />

Tim Twining joins the team<br />

7 Broadening selective soldering capabilities<br />

Nordson acquires InterSelect GmbH<br />

7 Slate of board members grow<br />

Cao XI elected as IPC board member<br />

Trade Shows+ Events<br />

8 IPC APEX Expo 2017<br />

Turning inspiration into innovation<br />

10 30th anniversary celebration<br />

Bringing colors into the business (IBL)<br />

Source: Indium<br />

Solder fortification with preforms for<br />

better pin-in-paste joints.<br />

76<br />

12 7th annual LED Symposium + Expo<br />

Lighting technologies event (Luger Research)<br />

13 IPC‘s hand soldering competition<br />

Competition heating up at SMT Hybrid Packaging 2017<br />

13 Technology forum in June 2017<br />

Presentations, workshops, and more in Hanover (Viscom)<br />

14 Open House 2016<br />

Spirit of 25 Years of Innovation (Fuji)<br />

18 Technology seminar with Denmark<br />

All about selective soldering (Ersa)<br />

20 2. InnovationsFORUM Hungary 2017<br />

Reflecting changes in manufacturing landscape<br />

Source: F&S Bondtec<br />

88<br />

The manual wire bond pull tester is perfectly<br />

aligned with the needs of pull tests in practice.<br />

PCB + Assembly<br />

45 Product-Updates PCB Assembly<br />

46 In search for efficient substitute<br />

Alternatives to the ozone-depleting HCFC-225 (MicroCare)<br />

49 Product-Updates PCB Assembly<br />

50 Wave soldering collaboration<br />

LEDs made in Italy (Ersa)<br />

53 Product-Updates PCB Assembly<br />

54 Plasma treatment before conformal coating<br />

Solution to defects in PCBA process (Nordson MARCH)<br />

4 <strong>EPP</strong> <strong>EUROPE</strong> May 2017May 2017

40<br />

56 Defining void formation: the soldering alloy<br />

A novel approach towards void reduction (Interflux)<br />

58 Product-Updates PCB Assembly<br />

60 Focus on solder paste stencils<br />

Quality aspects in solder paste stencils (LPKF)<br />

63 Product-Updates PCB Assembly<br />

64 Helping Viessman with energy management project<br />

Continual improvement of energy efficiency (Rehm)<br />

67 Product-Updates PCB Assembly<br />

68 Technology for air purification<br />

Influence of clean air on the value-added chain (ULT)<br />

70 Small is beautiful: using Smart SMT Factory Network<br />

Smart electronics production (ASM and Aros)<br />

73 MB Elettronica uses surface mount technology<br />

Human qualities and advanced automation (Yamaha)<br />

76 Economical way to solve solder starved conditions<br />

Solder fortification with preforms (Indium)<br />

79 Product-Updates PCB Assembly<br />

Packaging<br />

84 Optimal process stability<br />

Sealing, gluing, and potting solutions (Sonderhoff)<br />

86 Product-Updates Packaging<br />

Test + Quality Assurance<br />

88 Economical testing equipment<br />

Challenging traditional pull testers (F&S Bondtec)<br />

91 Product-Updates Test + Quality Assurance<br />

94 Revolutionizing defect analysis for circuitry<br />

Optimum quality assurance (Nikon)<br />

97 Product-Updates Test + Quality Assurance<br />

Columns<br />

3 Editorial<br />

4 Content<br />

99 Imprint/List of advertisers<br />

Source: Koh Young<br />

Components from simple<br />

to complex:<br />

We have been manufacturing<br />

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Reliable solutions for production<br />

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production security. Whether you are looking<br />

for assemblies, standard or individual components,<br />

we will find the most suitable products for<br />

your applications..<br />

Download catalog here:<br />

http://doceram.com<br />


Advanced Ceramic<br />

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We offer highperformance<br />

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24. - 28. April 2017<br />

Visit us in<br />

Hall 6, Stand B16<br />

DOCERAM GmbH | 44309 Dortmund, Germany<br />

+49 231 925025 950 | doceram.com<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 5


Juki announces changes in management<br />

Juki Corporation (Tama Center – Tokyo,<br />

Japan) and Juki Automation Systems (Morrisville,<br />

NC) are pleased to announce that William<br />

D. (Bill) Astle has been promoted to<br />

President of Juki Automation Systems, Inc.<br />

effective immediately. Bill has been serving<br />

as General Manager of the company for the<br />

last three years. Robert J Black, Jr., former<br />

President and CEO, will remain with the<br />

company as CEO.<br />

Juki‘s new President, Bill Astle.<br />

Source: Juki Automation Systems<br />

Dave Frac retires at Juki.<br />

With over 30 years of experience in the electronics<br />

production field, Mr. Astle is a solid<br />

choice as the new leader of the company.<br />

Prior to his time with the company, he was<br />

General Manager of Koh Young USA and<br />

Product Manager for Agilent Technologies. “I<br />

can think of no one more qualified than Bill to<br />

follow me as President of Juki,” commented<br />

Bob Black. “His extensive experience in our<br />

industry and outstanding work ethic will<br />

allow him to guide our company to new<br />

heights. All of us at JAS are excited about<br />

this move.”<br />

“I couldn’t be more excited to become President<br />

and help lead the continued success of<br />

Juki Automation Systems,” added Bill. “This<br />

company has been a great innovator and respected<br />

market leader for many years in the<br />

SMT market. With Bob’s great leadership, we<br />

have reached a stage where we are truly one<br />

Source: Juki Automation Systems<br />

The new CFO of Juki, Andy Hirst.<br />

Source: Juki Automation Systems<br />

of the world’s leading SMT solutions providers.<br />

Going forward, we will continue our<br />

forward design thinking. We’re inspired by<br />

our customers’ desires, and plan on delivering<br />

revolutionary new products in automation<br />

to meet their evolving needs. In addition, the<br />

company has always been given accolades<br />

for outstanding support. This tradition of providing<br />

the best customer experience possible<br />

will continue as we expand our line solutions<br />

portfolio.” The company has also announced<br />

that Dave Frac is retiring and Andy<br />

Hirst will be taking his place as the new CFO<br />

of the company.<br />

Mr. Frac retires after more than 40 years in finances,<br />

starting his career as a certified public<br />

accountant, working his way up the corporate<br />

ladder to CFO of Camelot Inc. in 1993. He<br />

joined the company in 1999 as CFO and VP<br />

Operations, handling all financial functions for<br />

both the US and European operating companies,<br />

plus operations (logistics, procurement,<br />

inside sales) for the US.<br />

“I am excited to see Andy step into the role<br />

that I have held for many years,” commented<br />

Dave. “He will bring new ideas and a different<br />

approach to this important role, and I am sure<br />

he will be very successful in his new position.”<br />

Mr. Andy Hirst holds an MBA from Strathclyde<br />

Business School in Glasgow, Scotland,<br />

and has worked in finance for 30 years. He<br />

has over 17 years of experience in the electronics<br />

manufacturing industry.<br />

“I look forward to building upon the great<br />

work Dave has done over the last 17 years,”<br />

commented Mr. Hirst. “I plan to help Juki<br />

continue to meet and exceed customers’ expectations<br />

with new, exciting products and<br />

our continued level of high service. We will<br />

continue to strive to make the customers and<br />

stakeholders experience with the finance and<br />

operations group a great one as we continue<br />

to utilize the technology tools at our disposal<br />

to improve our supply chain operations.”<br />

www.jukiamericas.com<br />

Indium Corporation welcomes Vice President, Marketing<br />

Indium Corporation has hired Tim Twining as<br />

the company’s new Vice President, Marketing.<br />

Twining is responsible for leading the development,<br />

implementation, and oversight of<br />

the company’s market strategies.<br />

Twining has extensive global sales and marketing<br />

experience in industrial, business-tobusiness,<br />

and manufacturing environments.<br />

As part of his extensive career, he has lived<br />

and worked in England, Russia, Singapore,<br />

and the USA.<br />

Twining earned a bachelor’s degree in Mechanical<br />

Engineering from the University of<br />

Minnesota and an MBA with a concentration<br />

in finance from the University of St. Thomas<br />

in Minneapolis, Minn.<br />

The company is a premier materials manufacturer<br />

and supplier to the global electronics,<br />

semiconductor, thin-film, and thermal<br />

management markets. Products include<br />

solders and fluxes; brazes; thermal interface<br />

materials; sputtering targets; indium, gallium,<br />

germanium, and tin metals and inorganic<br />

compounds; and NanoFoil. Founded in 1934,<br />

the company has global technical support<br />

and factories located in China, Malaysia, Singapore,<br />

South Korea, the United Kingdom,<br />

and the USA.<br />

SMT Hybrid Packaging, Booth 4-321<br />

www.indium.com<br />

The new Vice President,<br />

Marketing, Tim Twining.<br />

Source: Indium Corporation<br />

6 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

Broadening selective soldering capabilities for<br />

electronics assembly<br />

Nordson Corporation has acquired InterSelect<br />

GmbH, a German designer and<br />

manufacturer of selective soldering systems<br />

used in a variety of automotive,<br />

aerospace and industrial electronics assembly<br />

applications. The transaction is not<br />

material to Nordson results, and terms of<br />

the deal were not disclosed.<br />

“The InterSelect acquisition follows Nordson’s<br />

recent acquisition of the assets of<br />

ACE Production Technologies Inc., another<br />

high quality provider of selective soldering<br />

systems, and expands our participation in<br />

an attractive growth niche within the electronics<br />

assembly market,” said Joseph<br />

Stockunas, Corporate Vice President for<br />

Nordson’s Advanced Technology Systems<br />

segment. “InterSelect’s selective soldering<br />

solutions, like ACE’s, are adjacent and<br />

highly complementary to the company’s<br />

existing conformal coating and optical inspection<br />

solutions and are sold to the<br />

same set of customers. InterSelect’s<br />

largely European business is an ideal complement<br />

to ACE’s strong North American<br />

presence, and we expect to leverage<br />

Nordson’s global footprint to grow both<br />

businesses more rapidly.”<br />

Founded in 2010, the business operates<br />

with seven full time employees and a network<br />

of outsourced partners. InterSelect’s<br />

end markets are expected to continue<br />

growing at a mid to high single digit rate<br />

over the next several years driven by increasing<br />

electronic content in automobiles<br />

and electric vehicles, and further<br />

penetration of electronics in areas such as<br />

avionics, industrial automation and appliances.<br />

Going forward, Nordson intends to operate<br />

InterSelect together with ACE Production<br />

Technologies under the new name<br />

Nordson Select.<br />

SMT Hybrid Packaging, Booth 4A-214<br />

www.nordson.com<br />

New IPC Board member<br />

The Nominating and Governance Committee<br />

of the IPC Board of Directors presented one<br />

candidate for election at the IPC Annual<br />

Meeting, held in conjunction with IPC APEX<br />

Expo 2017 at the San Diego Convention<br />

Center.<br />

Cao Xi, technical director at Huawei Technologies<br />

Co., Ltd. was elected as a new Board<br />

member and will serve a four-year term<br />

through February 2021.<br />

Mr. Cao has more than 20 years’ experience<br />

in DFM, DFR and process technology research<br />

and application and is a main contributor<br />

of Huawei’s electronics assembly technology<br />

platform and DFX standard system.<br />

„The organization is privileged to have Mr.<br />

Cao added to our current slate of Board<br />

members. He is an active contributor to IPC<br />

initiatives and we look forward to his continued<br />

contributions to advancing IPC and our industry,“<br />

said John Mitchell, president and<br />

CEO.<br />

www.IPC.org<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 7


Source: <strong>EPP</strong> Europe<br />

The turning point of technology<br />

Turning inspiration into innovation<br />

throughout the industry<br />

IPC APEX Expo 2017, the largest technical exhibition show in North America, was a successful five-day event for the electronic<br />

industry. This year, the conference and exhibition portion of the show took place at the San Diego Convention Center in<br />

February 2017. The theme was technology’s turning point and for those who had the opportunity to attend this event, they were<br />

able to experience this memorable moment in the industry. According to John Mitchel, IPC President and CEO, “This is a place<br />

where industry professional come together in order to turn inspiration into innovation”.<br />

Source: <strong>EPP</strong> Europe<br />

Every year, professionals from the printed circuit board and electronics<br />

manufacturing industry come together from all around<br />

the world. 4,169 attendees from 39 countries came to the show<br />

while 449 exhibitors occupied 149,600 square feet of show space.<br />

Some of the exhibitors that took part of this year’s show included:<br />

• ASM Assembly Systems<br />

• ASSCON Vapor Phase Technology<br />

• ASYS Group Americas Inc.<br />

• CheckSum, LLC<br />

• CyberOptics Corporation<br />

• Fuji American Corporation<br />

• Henkel Electronic Materials, LLC<br />

This year IPC APEX Expo took place at the San Diego Convention Center.<br />

• Indium Corporation<br />

• ITW Electronic Assembly Equipment<br />

• Kic Thermal<br />

• Koh Young Technology Inc.<br />

• Nordson ASYMTEK<br />

• MicroCare Corporation<br />

•SAKI America<br />

• TopLine<br />

• Viscom, Inc.<br />

• Yamaha Motor Europe<br />

This event not only educated attendees with 9 buzz sessions, 36<br />

technical conferences, and 34 professional development courses,<br />

but it also created networking opportunities with vendors and potential<br />

clients. The industry’s experts covered various topics, including<br />

Industry 4.0, adapting to flexibility, supply chain traceability, and<br />

much more. The professional development courses addressed all<br />

different subjects, including assembly processes, cleaning and coating,<br />

design, quality and test, and PCB fabrication. Keynote speakers<br />

were also a highlight this year, as Mayzim Bialik (actress and author)<br />

and Mary (Missy) Cumming (military pilot and Duke University professor)<br />

gave inspirational presentations about the future of science<br />

and technology. This year also marked IPC’s 60 th anniversary. Joseph<br />

O’Neil, first-time Board Chairman of IPC, was excited to be<br />

part of this event and said, “Attendees this year will be inspired to<br />

take ideas they encounter onsite and turn them into real-world solutions<br />

and business opportunities.”<br />

The next IPC APEX Expo will once again take place at the San Diego<br />

Convention Center on February 27 to March 1, 2018.<br />

SMT Hybrid Packaging, Booth 4-400<br />

www.ipcapexexpo.org<br />

8 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

Together in Process Perfection<br />

Together in Process Perfection<br />

ITW EAE brings together the world-leading brands of electronics assembly equipment. Brands with<br />

reputations for driving process perfection. Manufacturers need speed, accuracy and repeatability<br />

over time in order to produce reliable products. Every product we make is measured by its ability to<br />

deliver on this promise. The combined knowledge and experience of the ITW EAE group is sure to<br />

drive further innovation and speed the development of next generation technology.<br />

See our latest developments at SMT Nuremberg - Booth 4-429, May 16-18<br />

Learn more at www.itweae.com<br />

A division of Illinois Tools Works<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 9


30-year anniversary for Vapor Phase Manufacturer IBL<br />

Simply bringing color<br />

into the business<br />

IBL-Löttechnik GmbH (IBL-Technologies LLC) from Königsbrunn, Germany has<br />

recently celebrated their 30 th year anniversary in the vapor phase industry.<br />

With over 2,000 installed systems worldwide, and 37 Sales and Distributors<br />

representing 54 countries, the company has come a long way. This includes,<br />

in 2009, expanding their operation to North America, together with R&D Vapor<br />

Tech LLC taking over the portfolio in 2014. This made the company the only<br />

manufacturer producing in both Europe and North America. They are also<br />

looking forward to further expanding into South America.<br />

Source: Doris Jetter<br />

Source: Doris Jetter<br />

The founder, Helmut Leicht, founded a mechanical engineer consultant<br />

firm in 1985 in a small apartment in Augsburg, Germany,<br />

after completing his engineering degree at the University of Munich.<br />

He decided to build a machine to solve all soldering problems.<br />

At that time, vapor phase soldering was already founded in the<br />

United States, but was expensive and complicated. Which led to<br />

other methods being used for soldering because it was easier to<br />

handle. Although the founder was told that vapor phase would<br />

eventually die, his response to that was; “No, vapor phase isn’t<br />

dead, it never really lived.” He was determined to find a better solution.<br />

In 1987, the company moved beyond engineering when it created<br />

the first prototype for vapor phase soldering in Königsbrunn.<br />

From left to right: Jochen Lipp, Andreas Thumm, Helmut and Eva Leicht<br />

welcomed all clients and guests.<br />

Source: Doris Jetter<br />

From left to right: Jochen Lipp, Helmut Leicht, Andreas Thumm color coordinated<br />

with the re-styled BLC 420.<br />

With improvements of materials and its procedure, the first machine<br />

was ready for use in 1991. By 1996, they introduced the Soft<br />

Vapor Phase technology. Just five years later, in 2001 in collaboration<br />

with Fraunhofer Institute, the company developed and patented<br />

the vacuum vapor phase system. Continuing with their<br />

growth, in 2008, Soft Vapor Temperature Control was introduced.<br />

Since then, they have not only expanded, they have also developed<br />

systems including, their Intelligent Profiling System IPS in 2012 and<br />

in 2013 their 2 nd generation traceability system for a premium-line.<br />

Having many successes to celebrate, this anniversary began with<br />

Helmut Leicht, along with his wife Eva, the CEO Jochen Lipp, and<br />

Andreas Thumm, welcoming the mayor of Königsbrunn Franz Feigl,<br />

Robert G. Linse from the office of Economic Development, as well<br />

as, their partners, clients, and employees. A historical overview of<br />

the year 1987 was given, including interesting facts, such as Aretha<br />

Franklin, the first woman to enter the Rock and Roll Hall of Fame, or<br />

how at that time, one liter of gas had only costed about 50 cents.<br />

This is when the company first started and has achieved so much<br />

since then. The founder and CEO both exclaimed that these accomplishments<br />

could not have happened without the motivated employees<br />

working for the company, the key to the success.<br />

10 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

CX 600 is the complete<br />

solution of an<br />

inline vapor phase<br />

soldering system.<br />

The VAC 745 was also<br />

redesigned and unveiled<br />

by color coordinated<br />

Sabine Mengel<br />

and Eva Leicht.<br />

Continuing with the festivities of the celebration, the company also<br />

introduced new machines and systems to the market. With their vibrant<br />

colors of pink, green, and orange, the exterior and interior updated<br />

BLC 420 soldering machines were on display. Used for medium<br />

to high volume production, these machines are available in three<br />

different sizes: 420 (length 1,060 mm , 620 (length 1,260 mm), and<br />

820 (length 1.460 mm). The exterior changes of this series includes<br />

swinging doors changed to panels for easier access and a large<br />

touchscreen display. The interior changes includes an installed PC,<br />

creating more possibilities than before. The easy to use software<br />

makes generating soldering programs fast and simple. For instance,<br />

it is now possible for this machine to do both lead free and lead soldering<br />

with different temperatures. Other advantages to this machine<br />

is that there is a fast setup, the transport system is maintenance<br />

free, and records the solder profiles. The Intelligent Profiling<br />

System, including Soft Vapor Temperature Control for temperaturecontrolled<br />

profiles, completes the image of a premium steam phase<br />

soldering system for the highest demands, available both as a batch<br />

and as an inline system.<br />

The main attractions at the anniversary celebration were the new<br />

VAC745, with a circuit board size of 635 x 444 x 70 mm, and the<br />

VAC765 with a circuit board size of 635 x 644 x 70 mm. These machines<br />

have both the advantages of vapor phase, as well as, the vacuum<br />

process, guaranteeing high quality void-free solder joints. With<br />

a 15-inch touchscreen, these machines offer an easy to use system<br />

with unlimited program and data storage. They are equipped with<br />

the Integrated IPS Intelligent Profiling System, which also includes<br />

real time recording capability of solder profiles. With its Vapour Technology<br />

during the vacuum process, this increases reliability of the<br />

finished products. Double vacuum is also available further increasing<br />

thoroughness and quality. The Rapid Cooling System ensures a<br />

fast transition from the liquid to the solid. Not only do these machines<br />

decrease the chance of rework and touch up, they are also<br />

designed for low maintenance and have low running costs.<br />

Other benefits include a maintenance free-patented transport system,<br />

a fluid filter system, all moving parts are located outside the<br />

process chamber, and, panel doors which saves floor space.<br />

As of last year, the company has developed about 60 % of their own<br />

milling parts. The soldering systems that they have also produced includes<br />

the MiniLab, SV260 Economy, SV540 Economy, and the<br />

SLC/BLC Premium systems. These machines are flexible with easy<br />

to use software. For instance, the SV540 is a high-performance system<br />

for single and serial production with a small footprint of just<br />

80 cm, which makes it able to fit through any standard door. Mr.<br />

Leicht concluded this wonderful event, with a powerful message.<br />

“What we have done until now, for the last 30 years, I would say it<br />

was the startup period. Now that we are settled quite well, with the<br />

ideas that we have in mind, we will create much more business<br />

than we’ve had in the past. We will continue to grow.”<br />

SMT Hybrid Packaging, Booth 4-205<br />

www.ibl-loettechnik.de<br />

Source: Doris Jetter<br />

The new features of<br />

the systems were<br />

presented to the<br />

partners during the<br />

celebration of their<br />

anniversary.<br />

Source: Doris Jetter<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 11



Professional Symposium + Expo<br />

The 7 th annual LED professional Symposium<br />

+Expo will be taking place from September<br />

26 th to 28 th . Every year, renowned speakers<br />

and experts from the areas of research and<br />

the lighting industry meet in Bregenz, Austria<br />

for a three-day symposium and exhibition<br />

where the newest lighting technologies and<br />

national lighting industry. This year, the organizers<br />

are expecting over 1,600 visitors from<br />

50 countries.<br />

In 2017, for the first time, the event Trends in<br />

Lighting (TiL), will be running parallel to the<br />

LpS. Trends in Lighting is a forum for architects,<br />

interior designers, lighting and building<br />

be structured around the subject areas of<br />

Strategy, Design & Development and Applications<br />

& Solutions over three days. The entire<br />

event program includes the Opening Ceremony<br />

with a Keynote from Dr. Wu Chou,<br />

CTO at Huawei, for the conference, the<br />

Opening Ceremony for the exhibition, subject<br />

oriented lectures, workshops, discussion<br />

panels, press conference – which will include<br />

product launches – and an evening event<br />

aboard the MS Vorarlberg. The exhibition associated<br />

with the conference will present the<br />

newest products, capital goods and services.<br />

The expo offers comprehensive views of<br />

everything from components to modules,<br />

measuring devices to production machines,<br />

and research facilities to test laboratories.<br />

Companies like auer Lighting, Arrow, AT&S,<br />

Bartenbach, Dow Corning, Instrument Systems,<br />

Konica Minolta, Megaman, Merck, Nichia,<br />

Plessey, Samsung, Seoul Semiconductor,<br />

SwitchTech, TUEV SUED, Vossloh-<br />

Schwabe, Wacker Chemie and WAGO will be<br />

presenting their market innovations in Bregenz.<br />

Every year, LpS brings renowned speakers and experts together to discuss trends in the lighting industry.<br />

Lectures, workshops, forums, and discussions about<br />

the newest developments took place at LpS 2016.<br />

innovations are presented and discussed.<br />

The symposium is comprised of a series of<br />

lectures, workshops, forums, and discussion<br />

panels while the exhibition is filled with the<br />

newest technologies components and developments<br />

presented by international companies<br />

and organizations. The LpS focuses on<br />

an expert audience from the areas of Design<br />

& Engineering, Quality Assurance, Technical<br />

Management, and authorities from the inter-<br />

Source: Luger Research e.U.<br />

This year, over 1,600 visitors from 50 countries are<br />

expected to attend the 7th annual LED Expo.<br />

planners, lighting designers, and lighting consultants.<br />

TiL will be looking at the subject of<br />

transitions in indoor lighting, as well as,<br />

covering current trends like Human Centric<br />

Lighting, Smart Lighting, and the Internet of<br />

Things.<br />

LpS 2017<br />

The motto for the LpS 2017 is “Smart Technologies<br />

for Lighting Innovations” which will<br />

Source: Luger Research e.U.<br />

Source: Luger Research e.U.<br />

Trends in Lighting – TiL 2017<br />

Digitalization, communication and new lifestyles<br />

change the way we deal with light.<br />

These changes necessitate adaptations and<br />

improvements to existing light systems and<br />

lighting solutions. Completely new concepts<br />

are needed due to the rapid developments of<br />

LED and OLED technologies and altered implementation<br />

profiles. Trends in Lighting is a<br />

forum for architects, interior designers, light<br />

planners, lighting designers and IT/IoT system<br />

integrators, that looks at the newest<br />

trends in the lighting industry and takes place<br />

parallel to the LpS. Next to the forum the TiL<br />

expo, which will be in the Foyer of the Bregenz<br />

Opera House, will be presenting highly<br />

innovative lighting systems, luminaries,<br />

lamps, control systems and fixtures. The<br />

motto of this expo is “Smart Trends in Indoor<br />

Lighting – from HCL to Luminaries to Internet<br />

of Things”.<br />

Organizer<br />

Luger Research e.U. is the publisher of the<br />

LED professional publications, organizer of<br />

the LED professional Symposium +Expo and<br />

Trends in Lighting events as well as technology<br />

and innovation consultant for various international<br />

research projects.<br />

www.LpS2017.com and www.trends.lighting<br />

12 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

Viscom Technology Forum in June 2017<br />

Up-to-date industry information and a host of<br />

opportunities for guests and inspection experts<br />

to share experiences are waiting for<br />

participants at this year’s Technology Forum<br />

on June 21–22 in Hanover. Once again, Viscom<br />

will offer a wide range of interesting<br />

topics, interesting discussions and first-class<br />

entertainment.<br />

At last year’s Technology Forum, customers<br />

could choose between informative presentations,<br />

user-oriented workshops and opportunities<br />

to speak with experts on specific<br />

topics (Meet the Experts) – as well as tutorials,<br />

which were directed primarily towards<br />

newcomers. This multi-faceted arrangement<br />

has proven itself and so remains unchanged<br />

this year.<br />

Based on the positive experiences with the<br />

innovations in 2016, the company will tailor<br />

the individual formats even more closely to<br />

participants’ needs. “Value to our visitors<br />

very clearly takes center stage,” emphasizes<br />

Martina Engelhardt, responsible for the<br />

event. She continues, “Whether it’s system<br />

operation and optimization of inspection concepts<br />

or informing visitors about today‘s se-<br />

lection criteria for the most<br />

modern inspection systems –<br />

we have different offerings directed<br />

specifically to answering<br />

our guests‘ questions.”<br />

While the tutorials mainly introduce<br />

visitors to the requirements<br />

and possibilities in the<br />

areas of solder paste inspection<br />

(SPI), automatic optical<br />

inspection (AOI) and X-ray inspection<br />

(AXI/MXI), in “Meet the Experts”<br />

the company’s customers have the chance to<br />

extensively discuss even the most complex<br />

questions and bring individual solutions back<br />

to their own companies. A broad array of<br />

topics currently important in quality control<br />

will be covered.<br />

This year’s topics will include practical solutions<br />

in the realm of Industry 4.0, such as<br />

standardization of communication between<br />

machines or intelligent identification of products<br />

in the SMT process. Additionally, there<br />

will be no shortage of system demonstrations<br />

and presentations that allow visitors to<br />

broaden their horizons.<br />

Source: Viscom AG<br />

Last year‘s Technology Forum in Hanover.<br />

As usual, visitors can expect an attractive<br />

program with interesting presentations,<br />

some going beyond electronics. For<br />

example, they can already look forward to an<br />

exciting opening talk about “a secret<br />

mission,” which will take them to a world<br />

most know only from books or films.<br />

And – of course – there will be an evening<br />

event with entertainment highlights and the<br />

opportunity to expand on the day’s impressions<br />

through relaxed conversations and to<br />

develop new contacts.<br />

SMT Hybrid Packaging, Booth 4A-122<br />

www.viscom.com<br />

Source: SEHO Systems GmbH<br />

Seho Technology Days in Mexico<br />

The premier of the SEHO Technology Days in<br />

Guadalajara and Queretaro, two major Mexican<br />

centers of electronics production, was a<br />

tremendous success. In cooperation with<br />

STE Latino America, the company held two<br />

rounds of seminars, attended by a great<br />

number of users, mainly from the automotive<br />

sector. STE Latino America is an expert<br />

partner for electronics productions in Mexico<br />

with extensive, long-term experience in the<br />

relevant processes and SEHO systems engineering.<br />

“We know exactly what electronics manufacturers<br />

in Mexico require,” explains Guillermo<br />

Maldonado, Managing Director of STE<br />

Latino America. “Through the framework of<br />

the Technology Days, we wanted to offer an<br />

opportunity to discuss the current develop-<br />

ments with other experts and to find approaches<br />

for optimizations in their own production<br />

environment.”<br />

Exciting lectures and intense discussions addressed<br />

everyday requirements in electronics<br />

production, but also focused on the<br />

latest in system developments and technologies<br />

of the future.<br />

A focal point of the Technology Days in Mexico<br />

were the challenges of high-mix/high-volume<br />

production, which is becoming more<br />

and more common, especially in the automotive<br />

industry. Dr. Andreas Reinhardt, the<br />

company’s Director of Research and Development,<br />

pointed out that a high product mix<br />

and high-volume production need not be mutually<br />

exclusive. One of the key aspects to<br />

ensure cost-efficient goods at a consistently<br />

high quality is top<br />

equipment productivity.<br />

www.seho.de<br />

In cooperation with<br />

STE Latino America,<br />

SEHO held two rounds<br />

of seminars.<br />

Hand soldering competition<br />

to heat up<br />

IPC’s Hand Soldering Competition at SMT<br />

Hybrid Packaging 2017 will see skilled competitors<br />

go soldering iron to soldering iron.<br />

Hand soldering of high-density printed<br />

boards demands highly skilled operators to<br />

ensure a zero-defect soldering process, and<br />

this contest – annual competition at SMT Hybrid<br />

Packaging – will recognize the best skills<br />

in hand soldering complex printed board assemblies.<br />

Over three days, participants will<br />

compete against each other to build a functional<br />

electronics assembly within a 60-minute<br />

time limit. Assemblies will be judged on<br />

soldering in accordance with IPC-A-610F<br />

Class 3 criteria, the speed at which the assembly<br />

was produced and overall electrical<br />

functionality of the assembly. IPC-A-610<br />

Master Instructors will serve as judges.<br />

The winner and two runners-up will each<br />

earn cash prizes. In addition, the first-place<br />

winner will earn a chance to compete against<br />

the best hand soldering technicians from<br />

around the world at the World Championship,<br />

located in Munich, Germany, this November.<br />

SMT Hybrid Packaging, Booth 4-400<br />

www.IPC.org<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 13


Fuji Open House 2016<br />

The Spirit of 25 Years<br />

of Innovation<br />

With a 2-day celebration in Wiesbaden, Germany, Fuji Machine Europe commemorated<br />

their 25-year mark with 250 clients and partners at the Fuji Open House. With a 2-day<br />

program, interesting presentations took place regarding accomplishments, future<br />

company plans, a technical tour, and a podium discussion about the developments of<br />

Industry 4.0.<br />

Source: <strong>EPP</strong><br />

The Moderator,<br />

Uta Rötzer, gave<br />

an introductory<br />

overview from<br />

1991 until 2016.<br />

Since the start of the company in 1991, Fuji has developed into a<br />

full-line supplier. Starting with board handling and adhesive dispensers,<br />

to now including paste printers, the company ensures the<br />

needs of all customers are met.<br />

Klaus Gross<br />

The Spirit of 25 Years of Innovation<br />

As the Managing Director since 2012, Klaus Gross gave an overview<br />

of the company’s history starting with November 1991 when it was<br />

founded by Hiroo Itoh. In June 1992, the sales and service operation<br />

in Mainz-Kastel started with ten employees and six departments in<br />

a 500 m ² space.<br />

They have continued to grow since then, even through two market<br />

crises, one in 2001 and the other from 2003 to 2009, and are now in<br />

a 2,000 m ² space with 70 motivated employees. They are also planning<br />

to build a new office building in the business area of Staudenäcker<br />

in Kelsterbach starting in March 2018. With this investment,<br />

enough room and space will be available for further growth. The<br />

company first began with focusing on the telecommunication field;<br />

however, they are now also pushing towards the automotive sector,<br />

including customers that are well-known manufacturers. This growing<br />

market focuses on industrial and consumer electronics. The goal<br />

for the future is not only to increase the market share with new customers<br />

and future projects, but also to increase customer satisfaction<br />

and their own efficiency by improving internal communication.<br />

Keynote: Lutz Wagner, Executive coaching<br />

Making decisions in stressful situations<br />

After nearly 20 years as a federal league judge, in 2010 the speaker<br />

decided to change career directions to become a coordinator for the<br />

referee training at DFB and a coach for the German National Referee<br />

League. With this drastic change, he experienced firsthand how to<br />

deal with certain situations depending on the role one plays. For<br />

example, a manager should always be vigilant, analytical, supportive,<br />

accompanying, and decisive. On the other hand, a project manager<br />

should be more versatile, informative, and knowledgeable.<br />

Further training on behavior and conduct is crucial when making<br />

decisions in critical situations. Additionally, the most important factor<br />

is to make the actual decision, whether it is right or wrong<br />

comes second. However, before a decision can be made, preparation<br />

is necessary which takes place in two phases. The first phase is<br />

to gather all important information to be able to plan accordingly.<br />

The second phase consists of believing in oneself and trusting that<br />

the decision made is the most suitable. Afterwards, it is highly recommended<br />

to reflect and analyze the conclusion. After all, perfection<br />

is hard to attain and one should always strive to learn from mistakes<br />

that occurred. This presentation closed with three final points:<br />

good decision makers are automatically identified, how well a decision<br />

maker handles a controversial situation is important, and last<br />

but not least, to minimize errors when making a critical decision one<br />

should always act instead of react to a situation.<br />

Stefan Janssen<br />

Project Smart-Fab: Siemens Berlin<br />

The presentations started with an overview of both Backend and<br />

Automation themes, which is precisely the aim for the concept of<br />

the machine for the Smart-Fab project. The machine is configured<br />

Christin Lutz from the IHK Wiesbaden<br />

gave Klaus Gross a certificate for 25<br />

years of entrepreneurial performance.<br />

Source: <strong>EPP</strong><br />

14 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

ased on what is needed and required, as each component of the<br />

system is independent from each other. The unit interacts with the<br />

machine based on the process performance. The speaker further explained<br />

the different possibilities of the systems adaptations. The<br />

Smart-Fab supports various components, including radial and axial<br />

belts, trays, sticks, and bulk material conveyors. The specific part<br />

that is needed will be selected based on the shape of the component,<br />

which will then automatically be replaced in the machine. The<br />

Smart-Fab is a solution for automation and production concepts of<br />

Industry 4.0 and the Internet of Things. Since September 2016, in<br />

the collaboration with the Measuring Equipment Berlin of Siemens<br />

AG, the Smart-Fab machine can now show its true capabilities and<br />

has replaced the manual assembly printed circuit boards in the<br />

Backend.<br />

Hartmut Eger<br />

Presentation & World Premier AimexIII<br />

To meet the growing demands of high-mix, variable mix, as well as,<br />

flexible volume production, the AimexIII and its sister assembly platform<br />

AimexIIIc were developed. The main difference between both<br />

systems is the size. With its compact design and reduced length,<br />

the AimexIIIc provides space saving in the production line. The<br />

Source: <strong>EPP</strong><br />

The participants of the panel discussion (v.l.n.r.): Prof. Dr. Gerrit Sames, Dieter<br />

Meuser, Marcel Pannu, Gerd Ohl.<br />

crease production even more. The functions on the machine can be<br />

changed or edited directly on a 12-inch touchscreen. Not only will<br />

this speed up the process of finding the best solutions to errors that<br />

may occur, but also the user will be able to react as quickly as possible.<br />

The LCR Check is used for measuring and verifying all characteristics<br />

of each component to guarantee the quality of each, even<br />

when there are a variety of different volumes.<br />

Source: <strong>EPP</strong><br />

The Keynote speaker from the<br />

first day: Lutz Wagner.<br />

Source: <strong>EPP</strong><br />

Stefan Janssen talked about<br />

SmartFab.<br />

Florian Ritter, Asys Group<br />

Asys Smart Factory with Pulse<br />

Smart Factory is an essential part of Industry 4.0. This concept<br />

breaks down complicated processes, such as, marking, printing,<br />

mounting, and de-paneling. This also brings a connection between<br />

the individual isolated solutions and the autonomous transport robots.<br />

Software is of course an important component to this trend,<br />

which is gaining more and more recognition. With Pulse, there is a<br />

variety of devices, plating connections, and software solutions that<br />

are offered, which significantly simplifies day-to-day work in the production<br />

environment. More specifically, the Pulseone software is<br />

designed for cross-line applications. By using the app, new features<br />

and upgrades can be downloaded at any time directly to the software.<br />

Along with this, robots supply the production line automatically<br />

with material, creating a self-organized logistics for materials.<br />

This can also be integrated to be used in manual workstations. By<br />

using robots or Smartwatches, complex production processes are<br />

now less complicated, supporting the user in all aspects, making<br />

monotonous work no longer an issue. This will be possible only if a<br />

new mindset takes place and we have the courage to believe in the<br />

future of the industry and all that it can bring.<br />

Source: <strong>EPP</strong><br />

Die Aimex III was presented by<br />

Hartmut Eger.<br />

Source: <strong>EPP</strong><br />

Asys Smart Factory with-<br />

Pulse from Florian Ritter.<br />

AimexIII offers up to 130 feeder slots in the front and back. The DynaHead,<br />

with its revolving heads and grippers, can make the assembly<br />

of any sized components, from small to large. With its<br />

single-track configuration, the AimexIII can work with circuit boards<br />

up to 710 mm x 924 mm. With its double-track configuration, two different<br />

products can be equipped at the same time, which increases<br />

the capacity of production. Including the puffer function will in-<br />

Ulf Oestermann, IZM Fraunhofer Berlin<br />

Industry 4.0 – Rebellion of Machines<br />

What would happen if there was a rebellion of machines, and an assembly<br />

machine automatically presses the dash button? The speaker<br />

answered the questions of where such a development came<br />

from, what is happening with it now, and where will it go in the future.<br />

It all began with the first industrial revolution starting at the<br />

end of the 18 th century, involving mechanical production plants operated<br />

with the help of water and steam power. Today, we are in the<br />

fourth industrial revolution of cyber-physical systems that is mainly<br />

driven by the complexity of manufactured products, as well as, the<br />

requirements and obligations of documentation. It can also be said<br />

that Industry 4.0 is highly dependent on the subject or perspective.<br />

Although there are many different support measures, ever since<br />

politicians have declared this an important subject, the efforts of in-<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 15


Foto: <strong>EPP</strong><br />

Source: <strong>EPP</strong><br />

dividual companies are driven by costs. There are many advantages<br />

with this new trend, including minimizing downtime, as well as, optimizing<br />

cycle time and expanding the areas of component preparation<br />

and automatic storage. The future of this revolution looks very<br />

promising. The speaker explained that it will promote the development<br />

of protocols and sensor interfaces, the integration of vertical<br />

and horizontal levels in production, and the implementation of Multitransmission<br />

Bases. All sensors and software interfaces are to be<br />

accessible across the entire system. There will also be a stronger<br />

focus on usability of all programs and interfaces.<br />

Jonas Ernst<br />

Future of Smart Factory & IoT<br />

This presentation gave a great overview of what the future holds for<br />

FUJI and their systems. Building off the Nexim Machine, the existing<br />

software will be redesigned to be in the direction of Industry<br />

4.0. The first part of this project, the focus plan, concentrates on<br />

program creation, optimization, simulation, setup changes, and flexible<br />

production scheduling across multiple production lines and machines.<br />

The second part of this project, the Do Plan, covers the preparation<br />

documents, support of material exchange, as well as, providing<br />

and tracking supplies for all operators. The last part for this project,<br />

the See Plan, focuses on monitoring all production lines in real<br />

time. No matter the location, the web based overview of production<br />

line utilization, production analysis, and traceability, will give the<br />

user more control. With this, it will also be easy to create new components<br />

and programs, as well as, use the optimization tools. Incorporating<br />

this project with MES-Systems, the luminance quality<br />

products, such as LEDs, and the control of moisture sensitive level<br />

Ulf Oestermann from<br />

IZM Fraunhofer Berlin<br />

talked about Industrie 4.0.<br />

Dr. Werner Laub from Staufen AG<br />

discussed Best Practices.<br />

Source: <strong>EPP</strong><br />

Source: <strong>EPP</strong><br />

Jonas Ernst was not just the Moderator<br />

for the panel discussion, but<br />

he also had a presentation about<br />

the future of Smart Factory.<br />

Heinz Floren from Insta Elektro<br />

GmbH talked about the way towards<br />

„value creation excellence“.<br />

components will be a child’s play. In addition, it will also be possible<br />

to integrate storage systems. The clear and easy-to-use interface<br />

will intuitively guide all users throughout the program. The data that<br />

is monitoring one machine or even an entire production line, even<br />

when machines are in different locations, will be collected in realtime.<br />

This will automatically optimize utilization and give an immediate<br />

response in the event of any faults or changes.<br />

Dr. Werner Laub, Staufen AG & Mr. Heinz Floren, Insta Elektro<br />

GmbH<br />

The Path to Added Value Excellence<br />

The two speakers presented the journey the company, Insta, took<br />

towards added value excellence with the help of Staufen AG. With<br />

this new collaboration, along with Insta recognizing in 2014 that a<br />

change needed to take place to achieve the goals set in SMT production,<br />

a partnership was established to promote best practice solutions.<br />

At the time, the OEE performance of three production lines<br />

was just at 36 %, making the processing time about 10 days. Due to<br />

this, a comprehensive project was created to restore competitiveness<br />

in the SMT production, through creative approaches and by following<br />

the lean principles. By using these 4 phases: preparation,<br />

analysis, concept, and implementation, the project aimed to improve<br />

the process, logistic, and leadership areas. With this integrated<br />

approach, the Insta SMT manufacturing greatly improved by<br />

increasing the OEE performance to 65 % and cutting down the processing<br />

time to only 4 days. It also reduced personnel costs by<br />

40 % and greatly reduced the set up time by almost 83 %.By creating<br />

these conditions for end-to-end-pull, the high demand created<br />

an increase in post-production for devices and modules.<br />

Podium discussion<br />

S.E.F.e.V- Industry 4.0<br />

SEF Smart Electronic Factory e.V. and its associates are working together<br />

to find solutions for the popular trend, the fourth industrial<br />

revolution. Along with the moderator, Jonas Ernst, the Area Sales<br />

Manager of Fuji Machine, the following participants took part in the<br />

podium discussion: the CTO of iTac Software AG, Dieter Meuser,<br />

the Managing Director of Limtronik GmbH, Gerd Ohl, the SMD<br />

Manager of Limtronik GmbH, Marcel Pannu, and the Professor Dr.<br />

Gerrit Sames from the Technical University of Mittelhessen. The podium<br />

focused on the state of development, standards, and professionals<br />

within Industry 4.0. They also discussed how this revolution<br />

affected Germany compared to other countries. Although Germany<br />

is an exemplary character in the electronics industry, it still lags<br />

somewhat behind against the international competition. The panel<br />

also went into further discussion about which interface standards<br />

should be implemented to last the longest, which came to no concrete<br />

conclusion. On the subject of the cloud, the participants<br />

agreed that the transfer of data to the Cloud is secure, because data<br />

is well protected against attacks, making them safe. The end of the<br />

discussion focused on the fact that the main problem does not<br />

come from the lack of technology, but the main issue is converting<br />

these technologies into practical solutions. This is especially true for<br />

small to medium sized enterprises. (dj)<br />

SMT Hybrid Packaging, Booth 4-131<br />

www.fuji-euro.de/en/<br />

16 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

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<strong>EPP</strong> <strong>EUROPE</strong> May 2017 17


Ersa launches country specific Technology seminar<br />

All about selective soldering<br />

With the help of their long-term sales partner Interflux Denmark, Ersa started a successful Technology seminar<br />

that occurred on the 23 rd and 24 th of January, at the headquarters of the company in Wertheim, Germany.<br />

Together with around 50 customers and participants from Denmark, the seminar focused on the company’s<br />

machines, more specifically their selective soldering technology for Danish electronic manufacturing.<br />

Continuing with this trend, the goal is to orientate more Technology seminars towards other countries.<br />

The Versaflow 4/55 is the fourth<br />

generation of the leading inline<br />

selective soldering system.<br />

Source: Doris Jetter<br />

Since the company has been in the soldering business since as<br />

far back as 1779, Ersa ensures high quality soldering systems<br />

worldwide. This includes several different types of soldering systems,<br />

rework stations, inspection systems, stencil printers, soldering<br />

station and smoke extractors, solders, and fluxes. As a system<br />

supplier with pioneer work, the company stands out for having a<br />

smooth production process for their customers.<br />

Advantages of selective soldering systems<br />

Although the market is now demanding for smaller wired components,<br />

where solder joints must have a high quality standard to ensure<br />

reliability, selective soldering is the way to go for such jobs.<br />

This is done by approaching each solder joint individually and<br />

thereby individually matching the soldering parameters. By using<br />

this method, it will avoid a thermal exposure throughout the assembly.<br />

This means that the already existing soldered components<br />

will not remelt or get destroyed. There are two different ways of soldering<br />

within this system, with either mini wave or multi wave. The<br />

mini wave soldering creates maximum flexibility for all possibilities.<br />

Depending on the customer’s requirements, the single solder pot<br />

can be positioned on the same or different axes, which ensures optimum<br />

processing. Combining soldering with multi wave can process<br />

complex assemblies in a short amount of time. The Mini-Vario-<br />

Wave soldering nozzle is mounted with a few grips on a single tray.<br />

The advantage of this is shown in the soldering work of individual<br />

areas of a circuit board throughout the wave soldering process.<br />

The Sales Director from Ersa, Rainer Krauss,<br />

is giving a tour of the production facilities.<br />

In addition, individual product-specific mini dip soldering nozzles can<br />

be used, which solder several pins or components simultaneously<br />

to achieve short cycle times. Selective soldering methods are economically<br />

successful in the processes are adapted exactly to the applications<br />

and quantities. One of the most important factor with this<br />

is increasing productivity. In order to achieve high-volume production<br />

in selective soldering, simultaneous processes are required.<br />

This is where the multi-wave soldering module can be used, that<br />

ensures maximum throughput for every need. There are product<br />

specific soldering tools with individual soldering nozzles. With this,<br />

they are able to solder precisely to the soldering points of the wired<br />

components, simultaneously. Regardless of the number of components,<br />

soldering times lasts up to two to three seconds per module.<br />

An extensive monitoring of process-relevant parameter occurs right<br />

after, to ensure high quality of the soldered assemblies.<br />

Selective soldering with mini-waves<br />

The Smartflow 2020 is the smallest selective soldering system available.<br />

It is also a batch operation system with a user-friendly modern<br />

technology. The pre-heating guarantees an optimal heating of the circuit<br />

board before the actual soldering process. Depending on the<br />

requirements of the components to be soldered, various heating<br />

modules can be selected: lower infrared or a combination of upper<br />

and lower infrared emitters. The automatic solder wire feeder supports<br />

the integrity of the manufacturing process. Manual filling of the<br />

pot is no longer necessary due to the constant monitoring of the<br />

solder level, meaning that the idle times of the machine is no longer<br />

Source: Doris Jetter<br />

18 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

equired. The camera inspects the soldering process in detail to ensure<br />

quality in real time. The user is able to observe the process via<br />

the Picture-in-Picture (PIP) function on the control panel. Any offline<br />

programming of the printed circuit board is carried out by the CAD<br />

Assistant 3 directly on the machine or on an external PC program<br />

based on CAD data. As a result, the set up times during a product<br />

change and restart is greatly reduced. Other benefits of the Smartflow<br />

include low maintenance, a modern process visualization, and<br />

low maintenance solder pump. This system can also process large<br />

circuit board formats and it is ideal for an island production.<br />

The compact Ecoselect 4, configurable as an inline or batch selective<br />

soldering system, is designed for small to medium size lines,<br />

where flexibility is important. The circuit board dimensions can be a<br />

maximum of 508 x 508 mm and can still be used on the reel transport.<br />

The optional new advanced power convection top heater ensures<br />

consistent component heating throughout. The precision<br />

spray fluxer with integrated spray jet control is programmable,<br />

which allows for precise and economical application of flux in specific<br />

spots or in tracks. As an option, a second spray head is also<br />

available, as well as, the new Versaflow dual solder pot system.<br />

Both Miniwave pots can be moved in Y/Z direction. This creates new<br />

possibilities in the processing of individual assemblies and significantly<br />

increases flexibility. The software Ersasoft 5 makes the control<br />

of the machine more intuitive and leads to simple operation,<br />

simultaneously increasing the range of functions. Interfaces to MES<br />

and Traceability systems are also available.<br />

Versaflow 4– the top of the line<br />

The Versaflow 4/55 is the fourth generation of the leading inline selective<br />

soldering system and is designed for mass production with<br />

high volumes and low product changeover, as well as, for the production<br />

of small volumes with frequent product change. Unlike the<br />

previous model, Versaflow 3/45, with a maximum of circuit board<br />

size of 400 x 500 mm, the latest model is capable of handling a maximum<br />

circuit board size of 508 x 508 mm. With its modular design,<br />

the system offers an almost unlimited amount of configuration options<br />

to meet all customer requirements. Up to four spray heads<br />

can be installed in the flux module. A laser system monitors the flux<br />

application to the printed circuit board for a secured automated process.<br />

For efficient and homogeneous heating of complex components,<br />

the new power convection top heating is available with the<br />

infrared emitters and convection heaters. Up to three soldering<br />

modules can be integrated into the system, which are available as a<br />

single, as well as, double soldering module. New dimensions of<br />

flexibility has become available with the Versaflex solder module.<br />

Around 50 customers and participants from Denmark attended this Technology<br />

seminar at Ersa.<br />

The two solder pots module creates added value to the production<br />

because it doubles the throughput and the use of different solder alloys<br />

or nozzle shapes without the need for replacements. The two<br />

solder pots are mounted on two independent axle systems, so the<br />

pots are individually and independently moveable of one another in<br />

the X, Y, and Z direction. This allows for simultaneous soldering in<br />

the X or Y direction, as well as, simultaneous soldering of an assembly<br />

with two soldering nozzles with different applications. The<br />

CAD Assistant 4 also offers offline programming with automatic optimization<br />

of cycle times. The intuitive system software, Ersasoft 5,<br />

is based on the latest Microsoft technologies and benefits from a<br />

user-oriented structure with a 24-inch touch screen. This software<br />

also includes continuous process monitoring and visualization, reduction<br />

of time required for configuration of parameters, comprehensive<br />

process data management, documentation of all process<br />

and machine relevant data, and an interface for traceability integration<br />

by using ZVEI protocol and MES systems. It is also an option<br />

to have two image processing systems.<br />

The Versascan module is located in the front of the flux module. This<br />

can scan codes, detect bad boards out of useful PCBs, check the<br />

presence and polarity of the component, and control the direction of<br />

transport. Up to nine cameras can be used, which allows for a full<br />

assessment of the solder joints from a 45° angle. The quality assessment<br />

of each solder joint is based on analysis algorithms that<br />

can be individually customized.<br />

Although most of the focus was on selective soldering systems, the<br />

rework systems were also presented to complete the full picture of<br />

this successful event. These systems are for the professional repair<br />

of assemblies, soldering tools, and the stencil printer with fully integrated<br />

3D solder paste inspection.<br />

Tours throughout the Ersa production facilities at the end of the official<br />

program, gave the guests the opportunity to look behind the<br />

scenes. After two eventful days, a lot of interesting knowledge has<br />

been exchanged and the enthusiastic Scandinavian visitors were<br />

able to take valuable input home to make their own production processes<br />

as successful and future-proof as possible. (dj)<br />

SMT Hybrid Packaging, Booth 4-111<br />

www.ersa.com<br />

Source: Doris Jetter<br />

Source: Doris Jetter<br />

The Versaflow 4/55 is built for high volume,<br />

low mix to high mix, low volume production.<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 19


Reflecting changes in manufacturing landscape<br />

2. InnovationsFORUM<br />

Hungary<br />

From the keynote through each and every presentation, the 2017 InnovationsFORUM<br />

Hungary, held on May 25th at the Hungarian Academy of Science in Budapest, reflects<br />

the changes that are occurring in Eastern European manufacturing and the desire to<br />

utilize innovation at every point in the product lifecycle.<br />

Innovation for competitiveness has been the overarching theme of<br />

the InnovationsFORUM when launching the event more than five<br />

years ago in Germany. This seems even more important today as regions<br />

that were formally associated with lower cost volume manufacturing<br />

become hubs of innovation.<br />

Following the success of the inaugural event last year, Innovations-<br />

FORUM Hungary will open with a keynote from one of the major influencers<br />

in the region’s startup world. Tamás Péter Turcsán is President<br />

of the Startup Section at the Hungarian Economic Association;<br />

The conference 2016 opened with<br />

a Keynote by Dan Copocean from<br />

Kimball Electronics Romania.<br />

Source: <strong>EPP</strong>E/EMSNow<br />

he is an international mentor, a<br />

startup consultant, a visionary, a<br />

communication and media expert,<br />

a crowdfunding specialist<br />

and a social innovator. As the<br />

COO of the Connect East Incubator,<br />

he is one of the opinion<br />

leaders of the local startup ecosystem.<br />

He has been helping innovative,<br />

domestic startups with<br />

education, mentoring, social capital,<br />

public relations and communication.<br />

He will present his own<br />

take on what is driving innovation<br />

in the region and the challenges<br />

he expects to see along the way,<br />

setting the scene for a day of discussion<br />

about innovations that<br />

aim to make manufacturing in the<br />

region more competitive, more<br />

flexible and more agile.<br />

His presentation will be followed<br />

by innovative solutions to real<br />

world manufacturing challenges<br />

provided by vendors of equipment,<br />

software, consumables and services. Presenting this year are<br />

senior executives from Aegis Software, Christian Koenen, Ersa, Fuji<br />

Machine MFG., Indium Corporation, Koh Young, Viscom, Nordson<br />

Matrix, ASM and Vi Technology.<br />

Hungary, like much of Eastern Europe, entered the electronics<br />

manufacturing world as a lower cost environment, where skilled engineers<br />

and operators serviced a growing outsourced manufacturing<br />

footprint, but that has changed. Now Hungary is a hot bed of in-<br />

Impressions from the table-top show and networking time.<br />

novation and brands are in place alongside the EMS giants, competing<br />

for the skilled labor pool that is present. All of that changes the<br />

manufacturing landscape; the need for innovation to exist not just in<br />

products, but also in processes is being felt more than ever. This<br />

suits Hungary with its innovative and creative spirit. After all, this is<br />

the nation that brought us the Rubik’s Cube, the Biro, Binoculars<br />

and the safety match. More than a dozen Hungarians have won the<br />

Nobel Prize, and Joseph Pulitzer was Hungarian. He published<br />

newspapers in the US and he also founded the famous Columbia<br />

School of Journalism that is responsible for awarding Pulitzers.<br />

Source: <strong>EPP</strong>E/EMSNow<br />

Source: <strong>EPP</strong>/EMSNow<br />

20 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

PROGRAM 2. InnovationsFORUM 2017<br />

The InnovationsForum Hungary<br />

took and will take place at the<br />

Academy of Sciences in Budapest.<br />

Source: <strong>EPP</strong>E/EMSNow<br />

08:00 – 09:00<br />

09:00<br />

09:10<br />

09:50<br />

10:20<br />

10:50<br />

11:20<br />

Registration and networking<br />

Welcome from Philip Stoten, Founder of EMSNow<br />

Keynote Presentation – Innovation in Hungary<br />

Tamás Péter Turcsán – President of the Startup Section at<br />

the Hungarian Economic Association; he is an international<br />

mentor, a startup consultant, a visionary, a communication<br />

and media expert, a crowdfunding specialist and a social<br />

innovator. As the COO of The Connect East Incubator, he is<br />

one of the opinion leaders of the local startup ecosystem.<br />

He has been helping innovative domestic startups with<br />

education, mentoring, social capital, public relations and<br />

communication. Organizer of several startup events.<br />

Ambassador and judge of the OpenAxel startup competition,<br />

founded by the European Commission. Founder of the series<br />

of university business idea competition, Hackathon-in-the-<br />

Box.Journalist, tech and startup blogger. Regular speaker at<br />

national startup conferences.<br />

Process Interlocking with dynamic sample adjustment –<br />

A way to Zero Defect Production<br />

Dr. Friedrich W. Nolting, Aegis Software<br />

High Tech Stencil Material<br />

Claus Schulz, Christian Koenen<br />

Coffee Break<br />

Interfaces for RFID and robots – comprehensive automation<br />

and connectivity in the Smart SMT Factory<br />

Norbert Heilmann, Technology Scout, ASM Assembly Systems<br />

11:50<br />

12:20<br />

Cutting edge technologies for your high-quality pick &<br />

placement processes<br />

Jonas Ernst M.B.A., Area Sales Manager, Fuji Machine MFG.<br />

Lunch<br />

In 2016 over 120 executive level delegates from EMS & OEM companies filled<br />

the Ceremony Hall.<br />

Source: <strong>EPP</strong>E/EMSNow<br />

13:30<br />

14:00<br />

Minimizing QFN Voiding during SMT Assembly<br />

Karthik Vijay, Technical Manager, Europe, Africa, Middle East,<br />

Indium Corporation<br />

Zero-defect strategy – feasible or wishful thinking?<br />

Rainer Krauss, Vice President and General Sales Director of<br />

Ersa GmbH<br />

InnovationsFORUM Hungary, like its sister events in Germany and<br />

Mexico, draws its audience from those involved in the entire electronics<br />

design and manufacturing process. Innovators, designers,<br />

engineers, process managers and executives all come together on<br />

a single day to get an intense burst of the latest innovations in the<br />

industry. More than ever the lines between different disciplines are<br />

blurring and it becomes even more important to look at innovation<br />

from cradle to grave, from idea, along the entire supply chain and<br />

through to the final recycling and disposal of the product.<br />

When we initially created the event, the aim was clear – to make it<br />

simple for someone involved in manufacturing to get an overview of<br />

what’s new and what’s good in manufacturing, allowing them to<br />

take that back and have a positive impact on their business. All packed<br />

around a day that provides unique networking opportunities for<br />

delegates.<br />

http://epp-europe.industrie.de/events-tutorials/innovationsforum-hungary/<br />

14:30<br />

15:00<br />

15:30<br />

16:00<br />

16:30<br />

Zero defectproduction in thecourseof time<br />

Gábor Tóvaj Sales Manager of Koh Young Europe GmbH<br />

Coffee Break<br />

Eastern EuropeCommitted to speed – Unique X-ray<br />

inspection systems and technologies setting new standards<br />

in high volume production environments<br />

Istvan Latos, Sales and Application Manager, Nordson MatriX<br />

Reaching quality production faster by revealing and leveraging<br />

the information buried in SPI & AOI data<br />

François Amblard, CEO at Vi Technology<br />

Ensure competitiveness with intelligent inspection concepts<br />

and innovative product ideas<br />

Hagen Berger, New Business Development Manager Viscom AG<br />

17:00<br />

Close<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 21


Process Interlocking with<br />

dynamic sample adjustment –<br />

A way to Zero Defect Production<br />

Zero Defect Production presupposes integrated holistic digital processing of production data. Strategies with respect to<br />

the Industry 4.0 concept so far focus on data transfer and standardization of interfaces. This alone, however does not<br />

allow for timely avoidance of production defects. How can this huge amount of digitized information of the processes<br />

be used in order to achieve an improved and more efficient production? In the following, this presentation will provide<br />

some solutions on how to act and react and/or timely interlock processes, if necessary.<br />

The entire NPI process should already be mainly based on digital<br />

information. This includes product design data, revisions, machine<br />

programs, work instructions and process data. The shop floor is<br />

provided with such data and the production process is planned<br />

together with all the necessary steps regarding production, test,<br />

calibration, adjustments and rework. In theory, this should enable a<br />

zero defect production. In practice however, there is a variety of<br />

disturbance variables that need to be recognized, measured and<br />

reacted upon accordingly. To digitally gather such information in a<br />

timely manner is a prerequisite for zero defect production. However,<br />

another challenge is to timely analyze and qualify such information.<br />

On the one hand there will be numerous digital measurements that<br />

lead to the required quality within a defined process window. On<br />

the other hand, there will be measurements that only allow for<br />

insecure statements regarding process stability and product quality.<br />

This includes numerous defect symptoms that can only be analyzed<br />

and hereinafter qualified by applying further examination and<br />

testing. Hence, qualified employees are necessary in most electronic<br />

productions who implement such assessments and analysis.<br />

In the digital production world, this “manual” quality process<br />

should be included in the same way as any other automated<br />

production and test facilities. Again, the goal of zero defect<br />

production requests employees to have access to all information in<br />

order to analyze defects correctly, detect symptoms and<br />

understanding their correlation by constant learning. For this<br />

purpose, Aegis fully provides the production employees in<br />

electronic production with the original construction data in the<br />

current version as a digital template. With such prerequisite, we<br />

enable the employees to react on disturbance variables accordingly<br />

and to initiate process improvements. The zero defect principle<br />

should be embedded in the digital production process in order to<br />

make these measures effective in real time and in current<br />

production. This means that quality data analysis following the<br />

production does not contribute to zero defect production but only<br />

embedding such quality data surveillance in the current production<br />

process ensures the zero defect rate.<br />

Disturbance variables have to be reacted upon in the current<br />

production in real time and such reaction measures have to be<br />

monitored again. Zero defect production means to produce<br />

without any defects in the first place and does not mean to select<br />

those products without any defects at the end of production. This<br />

requests that reaction upon defects and disturbance variables<br />

have to be included as a work step in the current production<br />

process. The integrated system, however is the prerequisite for an<br />

zero defect production because production and quality plans only<br />

allow for zero defect production in an integrated system and not<br />

independent from each other.<br />

Dr.-Ing. Friedrich W.<br />

Nolting is CEO at Aegis<br />

Software GmbH in<br />

Erlangen. Dr. Nolting<br />

achieved cross-sectoral<br />

recognition with numerous<br />

initial developments in the field of electronic<br />

production. Today, his ideas and concepts such<br />

as cluster analysis for setup optimization or<br />

the dynamic LED binning are included in<br />

the portfolio of renowned manufacturers.<br />

Assembly and teststeps are digitally configured and<br />

monitored in a system<br />

Intelligent Process Interlocking<br />

Another great advantage of digital support regarding the<br />

production process and quality data surveillance is the feature to<br />

react upon disturbance variables with automated regulation<br />

22 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

Quality data collection with symptoms<br />

mechanisms. Influences on disturbance variables can be reacted<br />

upon and/or regulated with mathematical methods in case of a<br />

physical defined reaction of control loops. Statistical methods are<br />

applied in everyday practice of electronic production. Consequent<br />

implementation thereof during current production as well as<br />

quality data surveillance is a core element of the new Aegis<br />

solution.<br />

At the beginning of the production phase, a process plan pursuant<br />

to the respective quality routes is designed for each product. The<br />

process parameters with the process windows are also defined and<br />

determinated in the planning. The process and quality manager<br />

does not have to design or develop everything from scratch but<br />

can refer to proven templates and individually adjust them, if<br />

necessary. As a result, an electronic „route“ is designed for<br />

production which is again used to monitor the compliance with<br />

the defined routes and quality data.<br />

It would be possible to work with such a production and quality<br />

plan successfully if everything always worked smoothly in<br />

production. In practice, however, any interferences are opposed to<br />

this theory and it is mandatory to react upon them in a dynamic<br />

way. Mainly automatic algorithms that re-adjust the process based<br />

on feedbacks from the shop floor are very useful for this purpose.<br />

Any symptoms and defects that are determined in the current<br />

production lead to an automatic reaction. The result of such<br />

reaction is documented and the monitoring of the implemented<br />

measure is integrated in the process flow in case of quality<br />

improvement.<br />

Any implemented measures have to be monitored continually in<br />

order to achieve the goal of zero defect production. This<br />

requirement is only practicable with a continuous digital solution<br />

for all process steps involved. In case planned measures, production<br />

or test steps have not been implemented, the system should react<br />

upon that automatically. Process interlocking is a crucial factor in<br />

the Aegis solution. This ensures that there are no scrap productions<br />

or uncontrolled process steps in the production. Correct reaction<br />

on incorrect conditions is herewith ensured permanently in the<br />

current production operation.<br />

Statement<br />

Working with digital product data on the shop floor is a prerequisite<br />

for zero defect production. Measuring and monitoring the<br />

manufacturing and process steps continually allows for timely<br />

recognition of any deviations. By using learning digital systems<br />

that draw the correct conclusions from occurring symptoms, will<br />

drive us towards zero defect production. Only a closed control loop<br />

provides a solution for a reaction on any interferences and the<br />

regulation in the production process.<br />

About the speech<br />

Topic of this speech is digital support covering the entire<br />

production process of an electronic product including the<br />

integration of the test and calibration steps until final shipment<br />

of the product. Zero defect production can only be realized<br />

under certain circumstances. This include dynamic reaction on<br />

newly occurring disturbance variables as well as monitoring of<br />

the adherence to each and any process parameters that are<br />

crucial for the product quality. A self-learning system that links<br />

symptoms and reasons for defects helps analyzing such defects<br />

and leads the way to avoiding scrap and missing parts<br />

production.<br />

Profile<br />

Aegis Software GmbH originated from diplan GmbH in<br />

Erlangen. Since 2012, Aegis Software GmbH in Erlangen has<br />

been part of the worldwide Aegis Software Corporation that<br />

is among the leading suppliers of Manufacturing Operation<br />

Systems. The headquarter in Horsham, USA started<br />

developing customer orientated solutions for the<br />

implementation in electronics production. Based on its<br />

experience with over 1700 customers worldwide, practiceoriented<br />

solutions for the optimization of quality<br />

management as well as material control are offered in the<br />

latest Factory Logix Release 3 at Aegis. Aegis’ field of business<br />

activity also includes the integration into existing IT<br />

landscapes apart from the mentioned solution modules.<br />

Aegis already has been rewarded the prize for the best<br />

electronic production software twice by Frost and Sullivan.<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 23


HighTech Stencil Material<br />

„Quality is never an accident; it represents the wise choice of many alternatives“. This quotation by William A. Foster<br />

aptly describes today‘s requirements for the selection of the right stencil for printing. Nowadays, a large number of<br />

variants are available that are combined with diverse rework processes or coatings to make lasered stencils better.<br />

In the following, a few examples are described to help with the decision …<br />

Rework is becoming increasingly more difficult to carry out,<br />

or is not permissible at all in newer finished products. For this<br />

reason, it is vital to do things right the first time.<br />

The continuously progressing miniaturization of electronic<br />

products, combined with increasingly finer grids and smaller<br />

apertures, places new requirements on the stencils.<br />

Which does not make it easier to<br />

choose the right stencil from the<br />

different variants available.<br />

9mil (230μm) QFP opening in a<br />

6mil (150μm CK Nanovate Stencil<br />

Very frequently, specialist rework<br />

or coating is then applied to<br />

achieve better release properties<br />

of the paste or reduce cleaning.<br />

Unfortunately, however, this very<br />

often has a negative effect on the<br />

life of the stencil.<br />

Claus Schulz has been employed with<br />

KOENEN GmbH since 2010. Claus Schulz<br />

was born in 1976 in Munich. After<br />

completing his school education, he<br />

started an apprenticeship as<br />

draughtsman in civil engineering in 1996,<br />

which he completed in 1998. Subsequently, he attended the<br />

Higher Technical Vocational School and passed the advanced<br />

technical college entrance qualification (1998). In 2000, he<br />

comple ted the basic studies in food technology, and in the<br />

following year, he successfully qualified as a Certified Fitness<br />

Manager at the BSA Academy. Mr Schulz held senior sales<br />

positions at several companies in the consumer electronics<br />

industry: From 1999 to 2001, he worked as Account Manager at<br />

Siemens/MMS, from 2001 to 2006, he held the position of Key<br />

Account Manager at Sagem Communications, and from 2006 to<br />

2010, he headed the Key Account Management and Product<br />

Management department at Sky Deutschland. In 2010, Mr<br />

Schulz joined KOENEN GmbH where he initially held the position<br />

of responsible manager of Sales, Marketing, Purchasing and IT. In<br />

addition, he was a member of the management team. In<br />

January 2015, following the takeover of KOENEN GmbH by<br />

Christian Koenen GmbH, he took over functions in the business<br />

development area of Christian Koenen GmbH and has since<br />

then held the position of Head of Sales of KOENEN GmbH. In<br />

December 2015, he was promoted to Head of Sales Department<br />

of Christian Koenen GmbH. Claus Schulz’s areas of expertise<br />

include process optimization and traceability.<br />

CK Nanovate Nickel Stencil<br />

With all these advantages and disadvantages in mind, research<br />

was ongoing in the past few years on how to improve the basic<br />

material of the stencil in order to avoid any additional processes,<br />

where applicable.<br />

The newly designed CK Nanovate Nickel combines the<br />

improvements achieved over the past decade in respect of the<br />

printing performance and the life of the stencil.<br />

• Improved paste release properties as a result of finer grain sizes<br />

and enhanced laser-cutting properties<br />

• Better sealing of the print deposit thanks to a sharper cutting<br />

edge on the circuit board side<br />

• Self-cleaning effect almost equivalent to surface coatings<br />

• Extended useful life thanks to improved hardness and ductility<br />

• No waviness of the stencil on uneven printed circuit boards/<br />

substrates<br />

As Tom Peters said: „All quality improvement comes via<br />

simplification.“ This means that if the raw material is already<br />

designed to guarantee a perfect print, there will be no need for any<br />

additional processes to improve it. As a result, error sources and<br />

additional processes are avoided and costs are reduced.<br />

24 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

Lecture<br />

The lecture looks at the history of stencil materials. Furthermore,<br />

it explains which raw material is best suited for printing stencils to<br />

achieve the best printing performance. These improved properties<br />

are documented in a number of comparisons and tests.<br />

Statement<br />

Miniaturization, smaller volumes and the complexity of the<br />

modules increase the demands for electronics production. As a<br />

result, the selection of the printing tool (stencil) is becoming even<br />

more important. In the past, less focus was placed on the raw<br />

material of the stencil as only a very limited choice was available.<br />

With the new CK Nanovate Nickel, a material specially designed<br />

for the requirements of the printing process is now being offered.<br />

As a result, it has become possible to improve the quality standards<br />

consistently. This development significantly supports the „zero<br />

defect strategy” in electronics manufacture.<br />

In conjunction with a consistently high quality of the printing tool,<br />

this will provide customers with a competitive edge in the market.<br />

The primary goal to be achieved is to facilitate an efficient printing<br />

process that will save your resources and thus reduce the<br />

environmental impact.<br />

New HighTech Materials for Stencil Printing<br />

Claus Schulz, Christian Koenen GmbH<br />

The precision stencil is the tool of choice for defining the print<br />

deposits in a wide variety of printing processes employed in the<br />

electronics industry. Since laser cutting machines were introduced,<br />

stainless steel has been the preferred raw material used for these<br />

stencils. For decades, the utilised stainless steel has not been<br />

changed, only the plates made from it have become increasingly<br />

thinner.<br />

With the arrival of Ultra Finepitch components (e.g. 0201, 01005<br />

and μBGA) and new printing media, the conventional raw material<br />

has reached its limits and new materials for manufacturing the<br />

stencil had to be found.<br />

Sample Benchmark Board print pattern<br />

The lecture looks at the requirements that the raw material of<br />

the stencil must meet today. In this context, the manufacture,<br />

processing and also the impact on the print quality are examined<br />

in depth. A wide variety of stainless steel and Nickel materials are<br />

discussed.<br />

It will be pointed out which raw materials should be considered for<br />

which printing requirements.<br />

Profile<br />

The companies of Christian Koenen are the technological<br />

leaders and market leaders in Europe in the manufacture<br />

of high-precision metal stencils and precision screens for<br />

technical printing. The precision stencils and screens<br />

feature an extremely high degree of precision. This<br />

accuracy opens up wider process windows for the<br />

customers‘ production, saves costs and increases<br />

efficiency. From the beginning, the area of research and<br />

development enjoys the highest priority, and the<br />

innovative products – some of which have been patented<br />

– highlight this technological competence. Especially the<br />

areas failure analysis, customer-specific process<br />

development with focus on cost reduction coupled with<br />

enhanced quality, process training and the further<br />

development of new printing technologies require the<br />

new orientation of the Application Center – the new Inline<br />

Concept. Christian Koenen Kft was founded in Györ/<br />

Hungary in 2013.<br />

www.ck.de<br />

QFP print deposits at 0.3 mm pitch for a stencil thickness of 130μm<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 25


Zero-defect strategy – feasible or<br />

wishful thinking?<br />

One major growth motor in the electronics industry are the increasing digital networks in both the industrial and<br />

private sectors, including the automotive industry and e-mobility. However, in the production of electronic assemblies,<br />

equipment manufacturers and EMS providers are faced with enormous cost pressure. “Zero-defect strategies” are a<br />

major component when it comes to taking up these challenges.<br />

In terms of meeting the demand for zero-defect production,<br />

smart sensor technology plays a major role and is being<br />

increasingly incorporated into soldering machines and systems.<br />

In a soldering process, printed circuit boards are connected with<br />

electronic components of every kind. The methods range from<br />

simple hand soldering to mass soldering processes such as<br />

reflow, selective or wave soldering. In order to achieve stable<br />

quality, and meet the associated demand for zero-defects,<br />

permanent monitoring of the assembly’s specific side conditions<br />

and the process parameters of the soldering systems is<br />

indispensible. The primary requirements in terms of printed<br />

circuit boards and components, such as wettability, soldering<br />

heat requirement, soldering heat resistance, layout, etc. have to<br />

be assumed as constants and presupposed in a soldering process.<br />

These preconditions cannot be adequately controlled in a<br />

soldering system but are essential for the quality of the soldering<br />

process.<br />

Arising from this fact, the soldering system process inspection<br />

can only monitor some of the parameters, which contribute<br />

essentially to the quality of the electronic assembly. The aim of a<br />

“zero-defect strategy” in soldering is therefore to eliminate those<br />

soldering system factors, which can directly influence the process,<br />

from the outset.<br />

Beginning with the solder paste printing, the position and<br />

volume of the solder paste depot are inspected. Where deviations<br />

are detected, the results are immediately used in the system to<br />

make process corrections for the immediately following<br />

assemblies.<br />

VERSAPRINT S1 3D: Solder paste print inspection result – graphic<br />

visualization, 2D and 3D image and result of the measurement with set<br />

and actual values.<br />

Rainer Krauss is Vice President and<br />

General Sales Director of Ersa GmbH in<br />

Wertheim. He is responsible for a total<br />

turnover of over €110 million<br />

worldwide as well as the company’s<br />

leading market position as system<br />

supplier of electronics production equipment with<br />

international sales and service network. Rainer Krauss has<br />

over 30 years experience in development, production and<br />

marketing of machines and systems in the sector of<br />

investment goods, especially in the manufacturing industry<br />

of PCBs and electronic assemblies.<br />

Thermal processes are monitored by determining the degrees of<br />

heating in known masses. In this way, the energy transfer is<br />

monitored, and stability ensured in the heating of the assemblies.<br />

Wave and selective soldering involve further factors as well. The<br />

flux application is a very closely monitored process, as the soldering<br />

result is directly related to the quantity of flux applied. Further<br />

parameters relating to the solder wave are the core of the soldering<br />

process. In modern soldering machines, the latest image processing<br />

systems are used here. Among other things, they serve to monitor<br />

the process and settings and measure the height of the solder<br />

wave.<br />

A further important component in the context of the “zero-defect<br />

strategy” is constituted by standardised processes on which<br />

modern production facilities increasingly rely. In the selective<br />

soldering area, the selective soldering system always consists of<br />

the same components, such as flux module, pre-heat module and<br />

solder module, regardless of the configuration level and the system<br />

type. This allows products to be switched from one line to another,<br />

under the same process conditions.<br />

When the diversity of influences is considered, it quickly becomes<br />

evident that, in real production, the zero-defect target is<br />

extremely difficult to achieve. For this reason, it makes much<br />

greater sense to develop and introduce strategies with which the<br />

26 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

VERSASCAN component inspection<br />

recognises faults before they occur<br />

The Ersa i-CON VARIO 4 operates up to four soldering tools at the same<br />

time and ensures optimum process control via the smart temperature<br />

regulation of the tools.<br />

“zero-defect” target can be asymptotically approximated. In this<br />

context, the monitoring of the soldering process is a very<br />

important, individual stage of production. Altogether, however,<br />

all the quality-relevant details in an electronic assembly must be<br />

taken into consideration. As all these factors are subject to<br />

constant change, a “zero-defect strategy” is a process which<br />

needs to be continually lived out and enhanced. We now end<br />

with a frequently-cited quotation from Confucius, which goes …<br />

The way is the goal …<br />


The presentation shows the efforts being made today to safeguard<br />

soldering processes. But even with the most perfect monitoring of<br />

individual functions, we must still always be clear about the fact<br />

that, in the soldering process, a multitude of quality-determining<br />

electronic assembly features come together, all decisive for the<br />

result.<br />


The development of Europe’s industrial landscape depends<br />

primarily on the competitive capability of the companies. Whether<br />

operating locally or globally – today’s world market framework<br />

conditions make forward-thinking orientation, and a high level of<br />

innovative power, indispensible. Only with constant innovations<br />

will it be possible to ensure the success of the companies in the<br />

medium and long term.<br />

As a medium-sized engineering company with a tradition going<br />

back for decades, we place our technological lead and our<br />

innovative power at the service of our customers, allowing them to<br />

sustainably optimise their production processes in terms of quality,<br />

costs and delivery. With the zero-defect strategy, each company<br />

takes a different approach; here Ersa is making the decisive<br />

contribution. We look forward to interesting discussions and a<br />

lively exchange of information, and wish the participants<br />

productive contact with experts which will successfully advance<br />

their future-securing projects. We have the solutions for the<br />

challenges you face when it comes to soldering!<br />

Calibration and measurement of the solder wave height via<br />

ERSASOFT operating software and VERSACAM process camera<br />

As Europe’s largest manufacturer of soldering systems, we<br />

supply our equipment to the electronics industry worldwide.<br />

Whether manual soldering, stencil printing, rework &<br />

inspection or highly flexible, modular high-end soldering<br />

systems: As the no. 1 equipment supplier Ersa continuously sets<br />

new standards in electronic manufacturing, advancing the<br />

technology into new dimensions. The complete product range<br />

is oriented on the factors highest productivity, highest<br />

efficiency and highest quality. With an annual turnover of about<br />

€130 million, Ersa has obtained, for the third year in a row, a<br />

record result, which contributed substantially to the historically<br />

best total turnover of nearly €250 million of the Kurtz Ersa<br />

Group. Also for the future, Ersa will do all that is necessary to<br />

further strengthen and to extend its technologies and<br />

innovative strength – always keeping in line with the goal: to<br />

offer a competitive advantage in the market for our customers.<br />

www.ersa.com<br />

Profile<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 27


Cutting edge technologies for your highquality<br />

pick & placement processes.<br />

Smart features and the right use of human resources<br />

makes the difference.<br />

Electronics production is increasingly characterized by small to medium quantities with frequent product changes. Short<br />

change-over times and high flexibility are the most important requirements. Faster, cheaper and production in smaller<br />

batches are a part of industry 4.0 and the goal of every producer. But this must not happen by the loss of quality.<br />

Especially in high-tech production sites, mistakes and production losses lead to high costs, which would be avoid by the<br />

customer. The devil is, of course, in the details. Now it is about process control. Fuji has looked at many different<br />

influencing variables and set screws to avoid these. With the NXT machine concept and the new NEXIM software Fuji<br />

offers smart tools to the target 0 PPM.<br />

The production process starts with the material supply, goes<br />

through printing, loading, soldering and ends when the boards<br />

are separated or in the test field. Fuji’s ambition is to automate this<br />

process chain as much as possible so that the system controls the<br />

machines. Nevertheless, there are numerous activities that must<br />

be carried out by hand. NEXIM offers an unprecedented operator<br />

interface that simplifies the life of the operator as much as possible<br />

and guides him in his tasks.<br />

For years, Fuji’s engineers have worked with customers to analyze<br />

the SMT business processes. Many errors have been reported and<br />

the solutions implemented in the NXT and other machines. Fuji<br />

divided the mistakes into four categories. 4M = man-power,<br />

machine, method and material. Among these headings, many<br />

solutions have been developed.<br />

If the focus is placed on the component, the process begins when<br />

the component is installed. We categorize this error as a “manpower”<br />

of 4M. Here, first mistakes can happen, which can lead to<br />

errors later. Synonymous are the many descriptions and adjustment<br />

of various components, e.g. in the night shift. Fuji offers the “Auto<br />

Shape Generator” and the “VPD Plus Stand”. Components can be<br />

photographed offline and shapes can be created correctly.<br />

Jonas Ernst M.B.A. is<br />

Area Sales Manager and<br />

responsible for customers<br />

in West Germany,<br />

key accounts in EMS and<br />

semiconductor, as well<br />

as for the market development in the Iran. In<br />

addition to his sales activities, he is a specialist<br />

in the field of setup concepts as well as digital<br />

production (SmartFactory) and industry 4.0.<br />

For Fuji, as a founding member of the SEF Smart<br />

Electronic Factory, he works together with<br />

partner companies, universities and corporate<br />

consultancy at the digital factory.<br />

Perfect Nozzle condition with automated nozzle cleaning<br />

Automatically. That saves time and money. The algorithm is a nice<br />

function also, applied components were checked here. Components<br />

which have passed this check are also 99% recognized by the<br />

machine.<br />

The next category “machine” from 4M belongs to the assembly. The<br />

results were errors such as loss of parts, pick-up errors, excessive<br />

set-up pressure, etc. When the component is collected, measured<br />

and set, it is up to the machine what will happen now …. An error,<br />

often after splice operations, is the faulty or “not” picking of<br />

components. A minimum of offset of the second tape results that<br />

Offline inspection of placement and PCB support<br />

28 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

the head is not picking the component<br />

correctly. So the pick-up position has to be<br />

fixed again. With the “alternative feeder”<br />

function, which effects that the machine<br />

automatically recognizes new feeders and<br />

replaces them, such errors no longer occur.<br />

Two other errors that can lead to miss-picks<br />

are electrically charged components and dirty<br />

nozzles. But here, too, influencing variables<br />

could already be minimized by means of<br />

intelligent machine design. Fuji has the fastest<br />

feeder by the use of turret heads. Electrically<br />

charged components have always been a<br />

topic. One solution here is the feeder, which<br />

has several pick-up positions. ESD critical<br />

components can be held by a cap in the tape<br />

and do not slip in the belt. Ionized airflow also<br />

helps to reduce the voltage drop. Brushes and<br />

vacuum cleaners hidden in the machine allow<br />

regular cleaning of the vacuum pipettes. This<br />

results in longer cleaning intervals of the<br />

nozzles and though save a lot of time and<br />

money.<br />

The list of possible errors and their countermeasures<br />

can be demonstrated further and<br />

will be presented in the lecture in Budapest.<br />

In future, software process monitoring and error prevention will be<br />

much more important. Lot sizes are becoming smaller and smaller<br />

and changes of the components, PCB, or the product are becoming<br />

increasingly common. A process has to succeed from beginning.<br />

As is known, this is usually dependent on several factors. Here the<br />

software is gaining importance. In the coming year, Fuji will present<br />

pioneering features that allow monitoring of all processes from a<br />

single point of view. The SmartFactory Network was created for<br />

this purpose. Now customers can view data from SPI, AOI and<br />

Oven-Manufacturers in NEXIM. In case of an error, all documented<br />

process steps are brought to a visual field. The “learning function”,<br />

which is to be implemented in NEXIM, will also be brilliant. Here,<br />

with the help of data scientists, Fuji has prepared a function in<br />

which the machine predicts possible errors from data and learns<br />

countermeasures to recommend them to the operator.<br />

Since the generation of NXT it is possible to bring a new set up on the<br />

machine during operation<br />

To the lecture:<br />

My lecture deals with the four influencing variables 4M - machine,<br />

material, method and man-power, and how to influence quality<br />

problems by means of adequate techniques.<br />

In doing so, I portray the well-known main causes of error and then<br />

use countermeasures to increase the quality and avoid problems<br />

beforehand.<br />

At the same time, the future value of human beings in production,<br />

especially with regard to supporting software, is being worked out.<br />

Profile<br />

Correction of placement for misaligned print before and after<br />

„Target on Paste”<br />

Statement:<br />

There is more than ever the desire to drive the production as<br />

predictably and without errors as possible. The process chains<br />

become increasingly demanding and difficult for the operator to<br />

control. Software and algorithms help the customers, and will be<br />

used more and more in the future. Nevertheless, the machine still<br />

is very important. Avoiding mistakes in the run-up by intelligent<br />

machine design and helpful tools, is the king’s discipline of Fuji!<br />

Fuji is now looking back on more than 50 years of experience<br />

in mechanical engineering and more than 30 years in the<br />

field of electronic placement systems. Result of this is that Fuji<br />

became one of the most important machine suppliers. As a<br />

“full-line supplier” from board handling to glue dispensers to<br />

paste printers, Fuji now offers a complete program for all<br />

needs. Permanent innovations, guaranteed perfection and<br />

excellent machines are the basis for the long-term market<br />

leadership.<br />

www.fuji-euro.de<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 29


Minimizing QFN Voiding During<br />

SMT Assembly<br />

Low-standoff components, such as QFNs, are proliferating in electronics due to their increased functionality as well as<br />

lower cost. Power QFNs with high heat fluxes specifically need good thermal dissipation. Excess solder voiding, especially<br />

with the large lake voids beneath the QFN thermal pad (Figure 1) will affect thermal management and may reduce<br />

operational life of the PCB assembly.<br />

Figure 2 lists the variables that can influence voiding. Since there is<br />

no industry specification on QFN voiding, this study specifically<br />

looked at achieving less than 10% voids on the QFN thermal pad<br />

by looking at the effect of the variables of (i) reflow profile; (ii)<br />

stencil thickness; (iii) flux chemistry type. Voiding less than 10%<br />

was achieved in most instances.<br />

Figure 3 shows the QFN ground plane of 7.75mm per side, and a<br />

window pane stencil design of 2.2mm per side. The squeegee<br />

printing speed was set at 100mm/s to simulate high speed printing<br />

for volume manufacturing.<br />

Effect of the Reflow Profile & Flux Chemistry on Voiding<br />

Figure 4 shows the two reflow profiles. Profile #1 is a ramp-to-peak<br />

profile with a peak temperature of 240˚C ± 4˚C, and time above<br />

liquidus of 70<br />

seconds. Profile #2<br />

has a slight soak<br />

and a higher peak<br />

of 254˚C ± 4˚C with<br />

time above liquidus<br />

of 77 seconds.<br />

Figure 1. X-ray image on the left shows 35% voiding with big<br />

voids in the center. The image on the right has less than<br />

10% voiding that exponentially improves thermal dissipation.<br />

Karthik is based in the UK<br />

and manages Indium<br />

Corporation’s technology<br />

programs and technical<br />

support throughout Europe.<br />

His expertise is focused on<br />

solder paste, engineered solders, thermal interface<br />

materials, and semiconductor-grade electronics<br />

assembly materials. Karthik is active in several<br />

industry organizations, including IMAPS and the<br />

Surface Mount Technology Association (SMTA),<br />

and has presented at industry forums and<br />

conferences internationally. He earned his master’s<br />

degree in systems science and industrial<br />

engineering from the State University of New York,<br />

Binghamton.<br />

Profile #2 gave significantly lower voiding (10% in many cases)<br />

compared to Profile #1. Not only does Profile #2 significantly<br />

reduce voiding, the scatter in the data is also greatly reduced, as<br />

seen in Figure 5.<br />

Our theory is that the hotter profile is more successful in driving<br />

out the volatiles than the cooler profiles. This concept is easy to<br />

understand when one considers that the vapor pressure of most<br />

solvents increases considerably at higher temperatures. But higher<br />

peak temperatures would cause more oxidation, therefore causing<br />

higher voiding. This paradox can be resolved only by utilizing flux<br />

chemistries with an enhanced oxidation barrier, that can effectively<br />

prevent/minimize oxide and still utilize the positive effect of vapor<br />

pressure with the higher temperatures.<br />

Effect of Stencil Thickness on Voiding<br />

Using Profile #1 described above, voiding was compared between<br />

two stencil thicknesses of 100u and 125u. Figure 6 shows that<br />

the 100u print<br />

deposit exhibited<br />

more voiding than<br />

the 125u print<br />

deposit. This<br />

difference is<br />

statistically significant<br />

based on a<br />

Tukey analysis<br />

with 95% CI. We<br />

believe that the<br />

125u print deposit<br />

exhibited lesser<br />

voiding because<br />

of the higher<br />

stand-off (compared<br />

to 100u)<br />

that allowed for<br />

easier outgassing/<br />

venting of the<br />

solder paste flux<br />

volatiles.<br />

Effect of Different<br />

Flux Chemistries on<br />

Voiding<br />

A final experiment<br />

evaluated the effect<br />

of 16 different<br />

Figure 6. The 100u thick print deposit<br />

exhibited more void area than the 125u thick<br />

print deposit<br />

Figure 7. By selecting an optimized solder<br />

paste flux chemistry, voiding can be reduced<br />

to less than 10%.<br />

30 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

Figure 2. Ishikawa diagram lists multiple<br />

variables that can influence voiding.<br />

Figure 3. The “window<br />

pane” stencil design<br />

used in the experiments.<br />

Figure 4. Profile #1 vs. Profile #2.<br />

solder paste flux vehicles (halogen-free as well as<br />

halogen-containing) on voiding. Three PCBs, with 12<br />

QFNs each were used for each solder paste, with a total<br />

of 36 QFNs per paste. The results were striking, as seen<br />

in Figure 7. Some pastes consistently produced less<br />

than 10% voids, while others produced as much as 45%.<br />

These results were not only surprising, but also very<br />

encouraging. While voiding is a complicated process<br />

with many variables, selecting the optimum solder<br />

paste alone can ensure significantly lower voiding of<br />

less than 10%.<br />

Figure 5. Profile#2 resulted in significantly lower voiding than Profile#1.<br />

Profile<br />

Summary<br />

In this voiding study, it was found that all the three variables<br />

considered - (i) reflow profile; (ii) stencil thickness; (iii) flux chemistry<br />

type - had a significant effect on voiding.<br />

The hotter profile could reduce voiding due to expulsion of<br />

volatiles with higher vapor pressure, but it is critical to use the<br />

optimum flux chemistry with an enhanced oxidation barrier to<br />

counteract the effect of increased oxide with hotter profiles. The<br />

125u thick stencil resulted in lesser voiding compared to the<br />

100u thick stencil, because the higher standoff facilitated better<br />

outgassing of volatiles. The greatest surprise, however, was how<br />

significant solder paste formulations were in reducing voiding.<br />

The better solder pastes significantly reduced voiding to less<br />

than 10%, whereas the worst paste produced greater than 45%<br />

voiding.<br />

Indium Corporation is a premier materials manufacturer and<br />

supplier to the global electronics, semiconductor, thin-film,<br />

and thermal management markets. Products include solders<br />

and fluxes; brazes; thermal interface materials; sputtering<br />

targets; indium, gallium, germanium, and tin metals and<br />

inorganic compounds; and NanoFoil®. Founded in 1934,<br />

Indium has global technical support and factories located in<br />

China, Malaysia, Singapore, South Korea, the United<br />

Kingdom, and the USA.<br />

www.indium.com<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 31


Zero defect production in the course of<br />

time.<br />

In order to avoid the defects in production<br />

someone must knows the individual<br />

process steps and their tolerances very precisly.<br />

Only the very clear disctiction between the production requirements and inspections’ tolerances of the<br />

process deviation helps to achieve the goal of zero defect production. The minimum deviations are from an<br />

optimized process. The more accurate and certfied measurement data must be base if it.<br />

Electronics manufacturing in Europe is inceasingly demanding<br />

and each board has its own challanges.<br />

In order to obtain the quality and reliable product, the key is a solid<br />

automatic inspection.<br />

Koh Young’s product portfolio includes 3D SPI systems, pre-and<br />

post reflow 3D AOI systems.<br />

With the installed 9.800 systems worldwide, the company is<br />

succesfull. Since 2005, after 12 years still the market and technology<br />

leader in the field of 3D measurement technology – the<br />

international company provides know-how and innovative<br />

solutions. Thus, Koh Young systems also meet the highest<br />

requirement of electronics manufacturing.<br />

3D solder paste measurement<br />

A 3D solder paste inspection system is virtually irreplaceable in<br />

today’s assembly of products. Ensure that only well-printed circuit<br />

boards are transferred to the next process step. Koh Young’s<br />

patented SPI measurement technology provides the highest<br />

measurement accuracy, reliability and speed. Over 2.000<br />

customers worldwide confirm the outstanding technology.<br />

Zenith 3D AOI system<br />

Gábor Tóvaj Sales Manager of<br />

Koh Young Europe GmbH. since<br />

August 2016 and more than<br />

21 years in the field of automatic<br />

optical inspection<br />

From the real-time process visualized feedback on the individual<br />

process steps, including their control, the company provides its<br />

customers an optimum system.<br />

The 3D solde paste inspection system is also used for analysing<br />

weak points in the printing process as well as optimizing the entire<br />

production. With the real 3D measuring solutions, reliable systems<br />

are developed and offered for compresensive monitoring and<br />

optimization of the manufacturing process.<br />

Unique 3D AOI technology<br />

With the innovative 3D measurement technology, the 3D-AOI-<br />

Zenith offers an incomparable flaw. Pseudo-errors, slippage and<br />

personal programming results are definitely a thing of the past.<br />

Through the use of 100% 3D measurement in combination with<br />

classical 2D inspection technology, the Zenith is able to handle<br />

the challenges through component shading, warping of the<br />

printed circuit board and various construction suppliers. A<br />

parametric programming, which can of course also be carried<br />

out completely offline, makes the test result independent of the<br />

programmer. The setting of test parameters and threshold<br />

values does not require any special experience in image<br />

processing. The system is based on a component library for the<br />

rapid creation of the test program, since already set parameters<br />

and threshold values for components without adaptation can<br />

32 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

Koh Young Europe<br />

GmbH. Alzenau<br />

be taken over completely uncomplicated. The system measures<br />

all component attributes, from position to solder joint, polarity,<br />

etc. in 3D. By measuring the height for each individual pixel,<br />

there is no dependence on light or shadow, so that finetuning is<br />

superfluous.<br />

To the lecture<br />

Zero defect is the goal of any modern, profitable manufacturing<br />

facility. If in the past the errors were determined and analyzed and<br />

thus the cause was turned off, the prevention of errors is at the<br />

forefront today.<br />

The precise recording of process influences is no longer sufficient.<br />

Smaller and smaller designs, which eventually force the designers<br />

to go to the design borders. The question is what is still reliably<br />

producible? Focusing on a perfectly optimized set-up of machines<br />

and materials as well as processes does not lead to the desired<br />

success.<br />

The diverse requirements on the production and their employees,<br />

which are then to produce the smallest batches of 50, 100 or 1,000<br />

pieces with the same quality or production efficiency, are also<br />

disturbing influencing factors.<br />

The well-known fish-bone chart can not be the number of<br />

individual factors today (processes, machine, materials).<br />

The precise monitoring of the individual significant process steps,<br />

such as paste printing, assembly and soldering process, allow a<br />

preventive reaction in order to ultimately avoid the actual error<br />

before the formation. The miniaturization mentioned above<br />

practically excludes the operator from recognizing these subtle<br />

differences in time. The exact measurement and recording of the<br />

individual paste deposits (area, volume, shape) as well as the<br />

placement accuracy, (twisting, offset coplanarity before the<br />

soldering process, but also the final result, the parameters of the<br />

individual soldering point (volume, solder rise, solder angle). In<br />

order to keep the production quality high and to maintain this<br />

high level even in small numbers. Only through this holistic<br />

detection can also conclusions about the delivery quality of<br />

components (housing tolerances, solderability etc) with IC and fine<br />

pitch constant pin length as well as pin heights. Not least, the<br />

process stability of the solder paste used as well as the<br />

documentation of the circuit board quality are visualized.<br />

Because often it is still possible to compensate for a deviation in<br />

the process, but the unfortunate combination leads then<br />

surprisingly increase of the failure rates.<br />

To avoid this, the employees at the line as well as the process<br />

managers have to get the tools for high-precision visualization at<br />

hand. Making decisions in real time helps to realize zero defect<br />

production.<br />

Koh YoungTechnology Inc. is one of the leading suppliers of<br />

3D measuring and testing equipment systems in the<br />

manufacturing of leading industrial companies in the printed<br />

circuit and semiconductor industry. For example in the<br />

automotive electronics, telecommunications, military,<br />

medical and semiconductor industries.<br />

Koh Young Technology Inc. has been supporting users for<br />

years in evaluating complex data. The headquarters of the<br />

international company is in Seoul, Korea. The German base is<br />

located in Alzenau with Koh Young Europe. Other sales and<br />

support centers are located in the USA, Japan, Singapore,<br />

China and Korea. Danutek Kft. and Danutek Balkan are<br />

responsible for selling the systems in the countries of<br />

Hungary, Romania and Ukraine. Based in Budapest amd<br />

Timisoara, close to customers.<br />

Danutek Kft. and Danutek Balkan are the contact person for<br />

sales and service of the Koh Young systems in the above<br />

mentioned countries.<br />

www.kohyoung.com<br />

Profile<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 33

34 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 35

36 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 37


Electronics production in Europe<br />

Ensure competitiveness with intelligent inspection<br />

concepts and innovative product ideas<br />

In the medium term, only those electronics producers that meet the highest quality requirements and optimize their<br />

production processes will stay in business. To avoid defects, the causes must be identified and systematically eliminated.<br />

Linking various inspection gates creates wide-ranging possibilities for cost optimization and process reliability and<br />

permanent improvements in product quality. Constant development of inspection technology is essential.<br />

The inspection systems from Viscom are intelligently linked in the production line<br />

Without doubt, the electronic design of a product must primarily<br />

meet customers’ expectations. But developers should also take<br />

into account costs for material, production and inspectability and<br />

adapt their concept to these requirements. In this way, later<br />

production errors and unnecessary costs can be avoided. E-CAD<br />

designers in a company with its own production can take advantage<br />

of the short communication paths and discuss necessary production<br />

processes with the in-house experts. Companies that rely on the<br />

support of an EMS service provider (electronics manufacturing<br />

services) for manufacturing should contact the specialists working<br />

there. Performance of failure mode effects analyses, abbreviated<br />

FMEAs, is recommended. With aids such as the Ishikawa diagram,<br />

developers and experts can together determine what influence the<br />

5-Ms (manpower, machines, methods, material, measurement) and<br />

Speaker: Hagen Berger,<br />

New Business<br />

Development Manager<br />

Viscom AG<br />

Hagen Berger has been<br />

working for more than 10 years in the field of<br />

optical measurement and inspection. After he<br />

finished his studies in mechanical engineering<br />

he was working in Philadelphia, USA. He gained<br />

experiences as product manager and is now<br />

focusing on innovative concepts and ideas<br />

around Industry 4.0, digitization, big data and<br />

Internet of things.<br />

the related risks have for the origination process of the product. The<br />

goal is to produce innovative products with no defects in an<br />

optimized production process.<br />

Data from experience are important for evaluating risks correctly.<br />

In electronics production, automatic inspection systems provide<br />

such experience continuously in the form of both data and images.<br />

Results from solder paste inspection provide information about<br />

the quality of the solder paste print designs and of the printing<br />

process. The print template used is created based on Gerber data<br />

generated from the E-CAD system. If the specifications defined in it<br />

are not optimally adapted to the production conditions, there will<br />

be systematic solder problems. The aperture geometries of solder<br />

paste surfaces in the E-CAD system should be coordinated regularly<br />

between the developer and the production expert responsible for<br />

the solder paste print. The SPI system (solder paste inspection)<br />

provides the data required for efficient coordination.<br />

Depiction of a bridge with 3D SPI<br />

38 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

The 3D AOI system<br />

S3088 ultra gold from<br />

Viscom convinces users<br />

with its ultra-modern<br />

high performance<br />

camera technology<br />

and highest<br />

throughput<br />

The results of the various inspection gates can be merged with clarity<br />

The Viscom solder paste inspection system, for example, has<br />

interfaces with both the paste printer and the assembler. In<br />

accordance with Industry 4.0, the result data from the<br />

downstream SPI system is read by the printer and correction<br />

measures are automatically introduced, such as template<br />

cleaning or correction of a template offset. With increasing<br />

miniaturization, transmission of the SPI result logs to the<br />

assembly machines is becoming more and more important, as<br />

assembly of very small components (01005, 03015) and of<br />

components with small pitch (< 500 μm) to the actual position<br />

of the solder paste has been shown to result in fewer defects<br />

than assembly of the components to the target position relative<br />

to the register mark in the copper.<br />

In addition, the results of the solder paste and assembly<br />

inspection before the oven can be clearly merged with those of<br />

the post-reflow solder joint inspection with AOI and X-ray. The<br />

data and images gained can be used by both the process<br />

owners and the product developers to identify and<br />

systematically eliminate causes of defects in the process and<br />

design. Special software tools, such as the Viscom Quality Uplink<br />

with Viscom Uplink Process Analyzer (VUPA) or the Viscom SPC<br />

software (statistical process control) help with evaluation and<br />

visualization of the many results collected by Viscom inspection<br />

systems. The advantages include a reliable separation of classes<br />

between genuine defects and false calls (false reports). Many<br />

possibilities are thus available to take process-relevant<br />

information into account early and thus optimize the production<br />

process. This is especially successful when reaction times can be<br />

kept as short as possible. To achieve this, Viscom offers the<br />

possibility to have all process-relevant data available on<br />

smartphones and tablets.<br />

Mobile real-time access to production and quality with<br />

the Viscom app<br />

About the presentation<br />

Electronics designers rely on data from experience for their<br />

development work. Automatic inspection systems not only<br />

reliably detect defects, but also provide important quality data<br />

and microscopic images of defective layouts. This is an important<br />

contribution to future avoidance of design-related defect causes.<br />

In the production process, in turn, costs are optimized, process<br />

reliability is increased, and product quality is improved through<br />

linking of the data of different inspection gates.<br />

Benefit statement<br />

Electronics manufacturers must constantly optimize their<br />

production processes using the latest inspection technology.<br />

Development of an attractive, easy to produce, but still robust<br />

product today requires close interaction between all who<br />

participate in the origination process. Intelligent inspection<br />

significantly helps to optimize solutions, processes and costs, from<br />

development to production.<br />

The Viscom AG is one of the world’s leading<br />

providers of automatic inspection systems for electronic<br />

assemblies. The model range reaches from high-performance<br />

3D AOI systems for inspecting solder paste, placement and<br />

solder joints, to inspection systems for MID, wire bond and<br />

conformal coating inspections. The X-ray inspection area<br />

covers the complete bandwidth from microfocus X-ray tubes<br />

through offline inspection islands with μCT function, up to<br />

fully automated 3D in-line X-ray inspection. Viscom systems<br />

are technologically cutting-edge products and have been<br />

successfully applied around the world by well-known<br />

companies in the most widely varying branches – reaching<br />

from the automotive and electronics industries through<br />

aerospace technology, and up to the medical technology and<br />

semiconductor industries. With branch offices in Europe, Asia<br />

and the USA, as well as a tight network of representatives,<br />

Viscom is present around the globe.<br />

www.viscom.com<br />

Profile<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 39

Leading the way to Industry 4.0 with optimized automation<br />

A quantum leap<br />

towards the factory<br />

of the future<br />

Electronics manufacturers are constantly seeking better ways to optimize,<br />

efficiently monitor, and control their manufacturing processes. Koh Young<br />

Technology’s Ksmart Solution, a portal to Industry 4.0, helps Koh Young<br />

customers achieve fully automated process control in anticipation of the<br />

‘Smart Factory’ of tomorrow. Automated control with Ksmart delivers<br />

the immense benefits of true process optimization in real time; it boosts<br />

productivity while minimizing costs and ultimately builds a better bottom line.<br />

40 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

TITEL<br />

The factory of the future begins with the ‘Smart Factory’<br />

of today. Once a futuristic concept, but now a<br />

developing reality, Industry 4.0 is emerging from the<br />

chaos of creation and its development is being driven on<br />

many fronts and in many ways. In the vanguard of this<br />

quantum leap forward are innovations including Koh<br />

Young Technology’s Ksmart Solution, which helps customers<br />

achieve the most effective process management<br />

for flexible, agile manufacturing. Industry 4.0, after all,<br />

will only be realized with a totally integrated and optimized<br />

manufacturing process. Total integration enables<br />

communication, which is the literal nexus of the ‘smart<br />

factory’. But it isn’t simply enough to drive the production<br />

process. For true Industry 4.0 productivity and efficiency,<br />

the process must be optimized as well, and communication<br />

is the key, linking the production elements together<br />

with feedback from inspection, measurement,<br />

and quality recognition and analysis systems.<br />

As the global No. 1 leader in true 3D measurement and<br />

inspection (AOI and SPI), the company has learned to<br />

apply true 3D measurement and defect detection information<br />

to benefit the entire manufacturing line, and<br />

Ksmart Solution is the advanced system that ties everything<br />

together with ‘Smart’ process analysis plus fast<br />

and easy remote monitoring and control of the process<br />

in real time. With the solution, a factory manager can<br />

monitor defects, analyze root causes, and apply<br />

changes to inspection programs ‘on the fly’ as needed<br />

even from remote locations. An increasing number of<br />

industrial manufacturers are adopting automation for<br />

‘Smart’ factories to be in place to maximize production<br />

efficiency and enhance yields. But what is Ksmart Solution<br />

and how does it work to benefit the factory manager?<br />

Source: Koh Young<br />

The factory of the future begins<br />

with the ‘Smart Factory’ of today.<br />

In the vanguard of this quantum<br />

leap forward are innovations<br />

including Koh Young Technology’s<br />

Ksmart Solution, which helps<br />

customers achieve the most<br />

effective process management<br />

for flexible, agile manufacturing.<br />

Industry 4.0, after all, will only be<br />

realized with a totally integrated and<br />

optimized manufacturing process.<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 41

TITEL<br />

Koh Young Technology’s Ksmart Solution is an integrated, comprehensive<br />

productivity and process control center. The success of the<br />

implementation results from the convergence of new company<br />

software technologies working in concert with 3D AOI and SPI capabilities.<br />

These technologies include the Ksmart Remote Monitoring<br />

System (RMS), Ksmart Link, and others.<br />

Ksmart Solution incorporates a software module ‘Intelligent Platform’<br />

that ensures the highest level of connectivity for all the inspection<br />

stations, enhancing overall automation capability. This<br />

unique Intelligent Platform is a software module using an Artificial<br />

Intelligence (AI) machine algorithm. The Intelligent Platform supports<br />

a high level of flexibility since it can connect all the inspection<br />

machines (AOI, SPI, peripheral) in a given SMT line or lines. It also<br />

has the capacity to collect and analyze a great amount of measurement<br />

data from the SMT process.<br />

Ksmart Solution is the child of Koh Young Technology’s long-term vision<br />

to help customers realize maximum production efficiency and<br />

control for today‘s advanced electronics manufacturing. Today‘s production<br />

environment confronts the manufacturer with various challenges;<br />

new (smaller) components being introduced for reduced<br />

product size, greater flexibility requirements for high-end/high-mix<br />

productions, and much higher standards for equipment that must<br />

communicate in real time. Ksmart Solution comprises an easy-touse,<br />

but powerful integrated toolbox designed to meet these challenges.<br />

It enables real-time analysis of defects, beginning with<br />

simply providing true 3D inspection data obtained from Koh Young‘s<br />

3D inspection systems. This data is essential for finding root causes<br />

of defects, and achieving process optimization. Further, it achieves<br />

‚Copy Exact‘ for multiple production lines and even different sites,<br />

as it provides the ability to control multiple inspection systems with<br />

standardized conditions and recipes.<br />

Intelligent platform of Koh Young.<br />

Source: Koh Young<br />

Advancing to Industry 4.0 on local, global levels<br />

In addition to carrying out real-time analysis of defects with<br />

SPC@Ksmart, some other functions of the Ksmart Solution include<br />

the following:<br />

• RMS (Remote Monitoring System)@Ksmart: RMS is the first<br />

software product to encompass the total Ksmart Solution, which<br />

enables tracking defects in real time;<br />

• LM(Library Manager)@Ksmart: Stores and distributes Job files<br />

and inspection conditions from a centralized Database to Koh<br />

Young’s 3D Inspection;<br />

• Link@Ksmart: Review, diagnosis and optimize Surface Mounting<br />

Technology (SMT) lines by storing and communication inspection<br />

results from Koh Young’s 3D Inspection;<br />

• OLD (Off-Line Debugging) @Ksmart: On-time fine-tuning without<br />

stopping the production line.<br />

Ksmart Remote Monitoring System (RMS@Ksmart) is the first<br />

software product to encompass the total Ksmart solution. With<br />

RMS@Ksmart , Koh Young inspection machines‘ status, production<br />

line yield information, and real time defect information from all Koh<br />

Young SPI and AOI machines in multiple production lines can be di-<br />

Ksmart Solution.<br />

Source:Koh Young<br />

42 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

ectly communicated with and operated efficiently. Factory managers<br />

can track root causes of defect issues and apply changes to<br />

inspection programs in real time. Real Time defect information is<br />

also shared with remote operators who can confirm the information.<br />

Koh Young‘s trusted 3D measurement-based inspection<br />

dataset is the underlying enabling technology that allows users to<br />

optimize processes based on such data, provided by Koh Young systems.<br />

RMS@Ksmart is followed by Link@Ksmart, which allows customers<br />

to analyze all 3D inspection results from Koh Young 3D SPI<br />

and 3D AOI systems. RMS@Ksmart shares crucial Information such<br />

as yield data, machine condition, and defect data from different SPI<br />

and AOI systems to one location. Fewer engineers and operators<br />

are required for real-time multi-line management, which is now easier<br />

and centralized for higher productivity. Process status and<br />

analysis from individual production lines can also be managed from<br />

a remote location.<br />

LM@Ksmart.<br />

Source: Koh Young<br />

Ksmart Library Manager (LM@Ksmart) provides process risk<br />

management by recovery and automatic process condition backup.<br />

Library Manager is the best risk management solution for AOI; For<br />

SPI, it provides easy management of JOB files, including inspection<br />

Souce: Koh Young<br />

Source: Koh Young<br />

Source: Koh Young<br />

RMS@Ksmart.<br />

SPC@Ksmart.<br />

conditions. Additionally, a Real-time SPC Chart feature provides realtime<br />

management of multiple lines, enabling Process Engineers to<br />

check data such as status, model, yield, availability, alarm, etc., selectively;<br />

it also provides analysis and comparison data visualization<br />

by specific need, e.g., yield, availability, production count, and more.<br />

About Koh Young Technology<br />

Koh Young Technology provides customized 3D measuring inspection<br />

solutions suitable to diversified manufacturing environments including<br />

smart devices, automotive electronics, telecommunications, military,<br />

aviation, and the health care and medical device industries. Direct<br />

sales and support centers are located in Germany, the United States,<br />

Japan, Singapore, China and Korea. For more information about the<br />

company, visit www.kohyoung.com.<br />

Benefits of the Ksmart Solution<br />

Ksmart is an easy-to-use, powerful integrated toolbox that helps factories<br />

to control and optimize their manufacturing process to ensure<br />

the lowest possible defect rates, based largely on reliable 3D<br />

measurement data.<br />

With unique Ksmart functions including SPC@Ksmart and<br />

Link@Ksmart, manufacturers can trace the root cause of defects<br />

and process deviation by carrying out essential analyses of reliable<br />

full 3D board data. Additionally, monitoring and analysis can be ongoing<br />

even when fine-tuning is carried out with OLD@Ksmart. This<br />

ultimately results in achieving process optimization; the net result<br />

will be zero escapes. ‘Zero Escape’ performance capability prevents<br />

hard-to-catch defects from slipping by. Since no defects pass<br />

through undetected, the process is optimized and robust, manufacturing<br />

is efficient and products reliable.<br />

Process optimization<br />

Ksmart Process Optimizer connects all process-related information<br />

gathered from all production lines for analysis and comparison, enabling<br />

process optimization. Ksmart Process Optimizer connects all<br />

process-related information gathered from Koh Young Inspection<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 43

TITEL<br />

systems in the line, and provides analysis data for real-time multiline<br />

management, e.g., providing comparison data for each machine<br />

and for every line. Machine status for all production lines can be<br />

managed from remote locations.<br />

Dedicated investment, calculated moves<br />

The development and implementation worldwide of the Ksmart Solution<br />

is ongoing, and the company has invested significant resources<br />

and energies toward furthering its evolution. The company<br />

is expanding its R&D centers worldwide, and has invested in new facilities<br />

as well as partnered with others in complementary fashion.<br />

For example, Koh Young has partnered with Binghamton University’s<br />

(SUNY at Binghamton) Integrated Electronics Engineering Center<br />

(IEEC) which has its own Smart Electronics Manufacturing Laboratory,<br />

and in South Korea, the Ksmart Solution division collaborates<br />

with the KAIST R&D Center to research and develop AI solutions<br />

using machine learning and deep learning.<br />

Koh Young has also opened an AI Center in San Diego, California as<br />

to establish a foundation of AI platforms for manufacturing process<br />

optimization.<br />

This should not be surprising for an inspection technology leader<br />

that has held the position of No.1 in global market share for 11 consecutive<br />

years, is No.1 in SPI market share (49 %), and holds 25 % of<br />

the total SPI & AOI market share worldwide. The company has<br />

10,000 inspection and measurement machines installed worldwide,<br />

an extraordinary figure for the SMT inspection industry. With the<br />

continued emergence and development of the Ksmart Solution,<br />

pushing the industry forward into Industry 4.0 levels of optimized<br />

automation in PCB assembly, this number is only likely to increase.<br />

Link@Ksmart.<br />

Source: Koh Young<br />

Source: Koh Young<br />

KPO.<br />

Koh Young’s AI centers worldwide.<br />

Source: Koh Young<br />

Source: Koh Young<br />

Zusammenfassung<br />

Elektronikhersteller suchen ständig nach besseren Wegen, ihre<br />

Fertigungsprozesse zu optimieren, effizient zu überwachen und zu<br />

kontrollieren. Die Ksmart-Lösung von Koh Young Technology unterstützt<br />

die Kunden, bereits heute eine vollautomatisierte Prozesskontrolle<br />

für die Smart Factory von morgen zu erreichen. Automatisierte<br />

Steuerung mit Ksmart liefert die immensen Vorteile einer<br />

Prozessoptimierung in Echtzeit; Es steigert die Produktivität bei<br />

gleichzeitiger Minimierung der Kosten und sorgt letztendlich für ein<br />

besseres Ergebnis.<br />

Résumé<br />

Les fabricants d‘électronique recherchent toujours de meilleures<br />

méthodes pour optimiser surveiller et contrôler efficacement les<br />

procédés de fabrication. La solution Ksmart de Koh Young Technology<br />

aide les clients à obtenir dès à présent un contrôle automatisé<br />

pour l‘usine intelligente de demain. La commande automatisée<br />

avec Ksmart apporte les avantages énormes d‘une optimisation<br />

des processus en temps réel ; la productivité augmente et les<br />

coûts diminuent avec un meilleur résultat final.<br />

Резюме<br />

Производители электроники постоянно ищут более выгодные<br />

пути оптимизации процессов производства, обеспечения<br />

эффективного контроля и управления ими. Решение Ksmart от<br />

Koh Young Technology помогает клиентам уже сегодня<br />

гарантировать полностью автоматизированный контроль<br />

производственного процесса на перспективных «умных<br />

фабриках». Автоматизированная система управления Ksmart<br />

предоставляет бесчисленное количество преимуществ<br />

оптимизации производственного процесса в реальном<br />

времени; она повышает продуктивность при одновременной<br />

минимизации расходов, в конечном итоге обеспечивая<br />

наилучший результат.<br />

44 <strong>EPP</strong> <strong>EUROPE</strong> May 2017



Intelligent manufacturing using smart methods<br />

With over a decade of specializing in the design,<br />

development, and manufacture of thermal<br />

profiling equipment for the lead-free<br />

electronics industry, SolderStar Ltd will introduce<br />

its newest internet based technology,<br />

SmartLine, which enables ‘big data’ capture<br />

from reflow ovens for intelligent manufacturing<br />

requirements.<br />

The system was developed to work with the<br />

Industry 4.0 / Internet of Manufacturing concept,<br />

a principle where machines are connected<br />

through intelligent networks that can<br />

control each other autonomously to create a<br />

Smart Factory.<br />

Mark Stansfield, Managing Director of SolderStar,<br />

said: “As the requirement for cost reduction<br />

in manufacturing is always a hot<br />

topic in the industry, and the growing realization<br />

that the way to do this is through Smart<br />

manufacturing, the importance of using solutions<br />

that work with Industry 4.0 is really<br />

important.“<br />

In the coming years, the Smart manufacturing<br />

concept is set to revolutionize the manufacturing<br />

process and the company wanted<br />

SmartLine cloud.<br />

to be ahead of this trend by ensuring<br />

our profiling systems could run<br />

efficiently in these conditions. The<br />

accessibility to obtain data will<br />

only increase and this information<br />

and its real-time processing will<br />

become one of the most important<br />

resources for companies in<br />

the future.<br />

Real-time monitoring will be key in this transition<br />

and that is where SmartLine comes in.<br />

SmartLine is essentially a data capture system,<br />

which provides a network link and software<br />

for streaming live process data from<br />

the ovens on the production floor. The system<br />

is scalable and provides all the tools for<br />

‘big data’ capture from single test/evaluations<br />

lines to full Smart Factories scenarios.<br />

“Since introducing the system this year we<br />

have received a lot of interest and we hope<br />

to grow on this. Especially within the SMT<br />

Hybrid Packaging gives us the perfect opportunity<br />

to introduce the SmartLine to an audience<br />

that will understand just how the capabilities<br />

of such a system will help in their future<br />

production.”<br />

SmartLine captures data from the soldering<br />

processes with measurement sensors and<br />

interface modules that communicates via IP<br />

networks providing data from the SMT line.<br />

The system also provides tools for analysis of<br />

the captured data-using web based methods<br />

via desktop or mobile platforms. These tools<br />

provide an immediate insight into the performance<br />

of the process, providing engineers<br />

with an invaluable insight into the manufacturing<br />

environment.<br />

SMT Hybrid Packaging, Booth 4-441<br />

www.solderstar.com<br />

Source: Solderstar<br />

Source: Specialty Coating Systems<br />

Compact system automates manual coating<br />

and dispensing processes<br />

Specialty Coating Systems (SCS)<br />

announced that it launched the<br />

new PrecisionCoat BT at the IPC<br />

APEX Expo at the San Diego<br />

Convention Center. Designed for<br />

The PrecisionCoat BT applies<br />

materials via configurable conformal<br />

coating and/or dispense<br />

valves (up to two) that move<br />

along three axes (x, y and z) with<br />

companies looking to automate a command accuracy of<br />

their time-intensive manual coating<br />

± 0.0001“ (0.003 mm) and<br />

and dispensing processes, or<br />

those who would like to have additional<br />

coating capacity in their<br />

laboratory or on their production<br />

floor, the PrecisionCoat BT improves<br />

accuracy, productivity and<br />

efficiency in a highly reliable,<br />

compact unit.<br />

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<strong>EPP</strong> <strong>EUROPE</strong> May 2017 45


Alternatives to the ozone-depleting HCFC-225 as global phase-out is completed<br />

Search for environmentfriendly,<br />

efficient substitute<br />

The phase-out of the last major ozone-depleting solvent, HCFC-225, finally has been completed. In addition,<br />

in many parts of the world, the regulatory pressure on older chlorinated solvents also has increased, so users<br />

of nPB, TCE, methylene chloride and other fluids also are migrating to newer, better and safer alternatives.<br />

Mike Jones, MicroCare, New Britain, CT, USA<br />

The good news,” reports David Ferguson, product manager at<br />

MicroCare Corp., “is that the industry is meeting the call to develop<br />

new cleaning alternatives. In the past two years, we have<br />

seen more new chemistries come out of the lab and onto the market<br />

than we saw in the entire decade before.” But none of the alternatives<br />

are a slam-dunk, according to Barbara Kanegsberg, president<br />

of BFK Solutions, a US consulting firm specializing in precision<br />

cleaning issues. “Anybody who does not have a cleaning strategy<br />

needs to be developing one urgently, and telling his boss to budget<br />

for it, right now.”<br />

Montreal Protocol<br />

Life on this planet is protected from dangerous solar radiation by a<br />

thin layer of ozone in the upper atmosphere. This layer is constantly<br />

in turmoil, with ozone being created and destroyed in relative balance.<br />

In the 1970s, it was discovered that synthetic chemicals were<br />

depleting this protective barrier faster than nature could restore it.<br />

After just a few years of debate, more than 100 nations agreed to<br />

the Montreal Protocol 1) that set the rules for globally eliminating<br />

ozone-depleting substances. The first chemicals banned were the<br />

refrigerants, aerosol propellants, blowing agents and precision<br />

cleaning solvents called Class I ozone-depleting substances. Now<br />

the less damaging Class II solvents have been phased out, and the<br />

last among these is HCFC-225.<br />

Thirty-four different HCFCs fluids were developed as interim replacements<br />

for the widely popular CFC materials. HCFC-225 was<br />

the last of the precision cleaning solvents to be phased-out because<br />

it had the lowest projected impact on the ozone layer. This policy<br />

was both prudent and practical: HCFC-225 has an ozone-depleting<br />

impact approximately only 1/25 of the far more popular CFC-113<br />

fluid. HCFC-225 also is a very good cleaner, nonflammable and fastdrying,<br />

VOC-exempt, with a relatively low global warming potential<br />

2) . Since companies found the transition from CFCs to HCFCs to<br />

be relatively painless they made the change fairly quickly, which<br />

helped minimize the damage to the ozone layer.<br />

Was the use of HCFCs ever a smart public policy? Many people<br />

disagreed with it; Greenpeace describes “the commercial and<br />

political influence of the chemical industry” as a major barrier to environmental<br />

improvements. 3) But Howard Sidebottom and James<br />

Franklin in their definitive study wrote that “HCFCs have played an<br />

essential role, as interim replacement compounds, in ensuring the<br />

speedy elimination of CFCs.” 4) So it is a case of the least bad<br />

answer, and the EPA (Environment Protection Agency) clearly<br />

agreed: one HCFC-225 product received the Best of the Best Stratospheric<br />

Ozone Protection Award from them in 1997. 5) This pragmatic<br />

approach to protecting the environment is the proper path for<br />

future efforts, according to MicroCare Corporation’s COO Tom Tattersall.<br />

“The teamwork and collaboration behind the Montreal<br />

Protocol is the optimal role-model for government-industry co-ordination,”<br />

he said.<br />

Source: Microcare<br />

Assembled PCB washed with ultrasonics in a<br />

degreaser chamber. Small sizes, tight spacings<br />

and tiny stand-offs of electronic circuits are<br />

problematic for aqueous cleaning technologies<br />

due to surface tension and wetting index.<br />

46 <strong>EPP</strong> <strong>EUROPE</strong> May 2017


PCBs are being prepped for cleaning in<br />

a vapor degreaser. The function of the<br />

two different cooling-coil arrangements<br />

around the top of the chamber is such:<br />

the lower coils trap the evaporating<br />

solvent in the machine, and the upper<br />

ones keeps humid air out.<br />

Why have companies waited so long to make the change away<br />

from HCFC-225? Rob Lee, who was at this time Product Manager<br />

at DuPont Corp., suspects the main issue is a combination of solvency<br />

and materials compatibility. “Companies were hanging on to<br />

these cleaners from a compatibility perspective. HCFC-225 is a<br />

good cleaner, and it is generally more compatible with materials of<br />

construction than the alternatives, plus HCFC-225 has been spec’d<br />

in on military projects. Combine all that with the costs of testing<br />

and approving a new fluid, and it’s hard to change.” While it has<br />

been a long-time coming, this phase-out is important. One expert<br />

estimates the reduction in global warming impact may be “the<br />

equivalent of removing the climate emissions from 70 million U.S.<br />

passenger cars for the next 30 years. 6)<br />

Cleaning alternatives<br />

“As a class, HCFCs were remarkable materials,” said David Ferguson.<br />

“They were the last group of cleaners that contained chlorine<br />

on the molecule, instead of blending a chlorinated solvent to a fluorocarbon<br />

to enhance solvency.” This characteristic gave them broad<br />

compatibility with moderate solvency. Duplicating those properties<br />

with a different molecule is proving to be a challenging task. Most<br />

companies that had been using HCFC-225 will find the fastest and<br />

easiest transition to be to move to another nonflammable, solventbased<br />

product. Almost all of the new cleaning fluids in their pure<br />

form are very stable and mild. To kick up their cleaning power, many<br />

suppliers enhance the ingredients with a chlorinated material called<br />

trans 1,2 dichloroethylene along with other ingredients. The resulting<br />

formulas may form azeotropes which are thermally stable mixtures<br />

preferred for their excellent cleaning power, their chemical<br />

characteristics, their ease of handling and their compatibility with<br />

vapor degreasing.<br />

“But users must do their testing,” Barbara Kanegsberg explains.<br />

“The low-boiling alternatives may need major equipment and process<br />

changes. The high-boiling blends may leave residues that are<br />

hard to remove. Esters can break down and form acids and alcohols.<br />

You have to consider the consequences of switching cleaning<br />

agents to assure consistent, cost-effective cleaning.” “Companies<br />

that could go no-clean went no-clean long ago,” Lee adds. “Companies<br />

that could use water are there already. There are complex<br />

reasons why companies have stuck with HCFC-225, nPB, TCE and<br />

others.“<br />

Source: Microcare<br />

The contenders<br />

Novec HFE cleaners. For more than 15 years the hydrofluoroethers<br />

(HFEs) from 3M Corp. have been available under the Novec brand<br />

name. Now an aging technology, they are nonflammable, fast-drying<br />

and environmentally acceptable. There are a handful of Novec<br />

blends, allowing the cleaning to be tailored to suit the contamination<br />

and the application. They are effective in vapor degreasers.<br />

Sion HFO cleaners. Chemours’ Sion is a new HFO (hydrofluoro-olefin)<br />

alternative. Pure HFOs are very attractive because they can be a<br />

candidate for VOC exemption and they have a medium-low global<br />

warming impact. The blended product is a strong cleaner and easily<br />

used in a vapor degreaser. Long-term, with a profile near HCFC-225<br />

in terms of equipment design, and a superior environmental and<br />

toxicity profile, this may be one of the big winners to replace<br />

HCFC-225. This product looks to be the optimal drop-in replacement,<br />

requiring only modest changes to temperature settings and<br />

cycle times.<br />

Solstice HFO Cleaner is another solvent from Honeywell. A mild<br />

cleaner used in its pure form, this product is VOC-exempt by the US<br />

EPA and has excellent materials compatibility. However, the Solstice<br />

fluid has an ultra-low boiling point (19 °C) which will require expensive<br />

retrofits to existing vapor degreasers to keep the fluid<br />

trapped inside the cleaning machine. Nonetheless, in some regions,<br />

it may be the best alternative acceptable to regulatory agencies.<br />

Tergo Performance Fluids from MicroCare is a new class of choices<br />

in the market. These cleaners use a new type of chemistry — sometimes<br />

called a co-solvent cleaning process — that is compatible<br />

with vapor degreasing but offers greatly expanded solvency. These<br />

cleaners have excellent environmental profiles and can be used in<br />

high-temperature applications, such as removing buffing compounds<br />

or lead-free solders and fluxes.<br />

Vertrel HFC cleaners. First to the market in the late 1990s, Vertrel<br />

hydrofluorcarbons (HFCs) from Chemours Corp have been widely<br />

accepted as worthy successors to CFCs and HCFCs. Interestingly,<br />

the product line includes more than 20 different formulations. This<br />

allows Chemours to tackle more varied types of contamination and<br />

different regulatory environments than the HFE cleaners. However,<br />

HFC products have a slightly higher global warming impact than<br />

HFE-based choices so they are not available in Europe.<br />

At this point, one option to seriously study and possibly avoid is any<br />

brominated or chlorinated solvent. These products are highly effective<br />

precision cleaners with very attractive prices. However, the<br />

toxicity standards for these products are being tightened and their<br />

use will become problematic. Brominated solvents (also called nPB<br />

and featuring a cleaner with the CAS number #106–94–5) are marketed<br />

under the brand names of Absolv, Bromothane, DrySolv, En-<br />

Solv, EnTron, LekSolv, Lenium, Metalnox, Solvon and others. 7) Tricholoethylene<br />

(also called TCE or trike) is under great scrutiny in the<br />

USA. For most companies, it makes no sense to transition into another<br />

problematic cleaner that might only have 18–24 months of<br />

useful life on the market.<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 47


Cleaning conversion plan<br />

What’s the best way to migrate to a new cleaning solvent? There<br />

are four steps in solving this puzzle. First, do your internal research.<br />

Conduct an internal cleaning audit to determine which products in<br />

their warehouses and tool cribs contain HCFC-225, nPB, TCE or the<br />

other cleaning fluids scheduled to be eliminated in the next few<br />

years. For example, HCFC-225 can be found in drums, pails, glass<br />

bottles and even in aerosol cleaners. Determine who in your facility<br />

is using these products. Collecting the details about each cleaning<br />

application will help narrow the search for a proper replacement.<br />

Companies also should take the time to consider the effectiveness<br />

of their current cleaning process. Is the current cleaner doing everything<br />

it should? Is it fast enough, reliable enough and is the cost-perpart<br />

cleaned affordable? What’s the future of this project – will we<br />

still be making this module in five years? This is also a good time to<br />

review the cleanliness specification – how clean is clean enough?<br />

Once you have your house in order, it’s time to start reviewing the<br />

candidates. Read and understand the SDS and the product specifications<br />

available online. Contact the main vendors to get samples of<br />

prospective new cleaners that meet the cleaning criteria. Vendors<br />

should be willing to send small samples at no charge, such as liters<br />

and gallons. With samples of this size the effectiveness of the<br />

cleaner can be evaluated, and materials compatibility can be tested<br />

as well. Having pruned the list of choices, it’s now time to prepare<br />

product samples and send them to the vendors’ labs for cleaning<br />

evaluations. Bundle up a significant quantity of soiled parts and<br />

package them in clean, airtight packages for shipment to the cleaner<br />

vendors. Be as generous as you can with samples for testing, as a<br />

lack of test parts can affect the accuracy of the lab work. Usually,<br />

one cleaning fluid will prove to be the optimal answer.<br />

Based on the results from the lab, clients might want to fine-tune<br />

their expectations with more in-depth cleaning tests, conduct largescale<br />

cleaning tests in their own systems, or to vary the cleaning<br />

hardware to see if the results might shift. Once that’s done, work<br />

with top management to fund and schedule the transition.<br />

SMT Hybrid Packaging, Booth 4-301<br />

www.microcare.com<br />

Ed Lamm of Branson Ultrasonics in Danbury/CT loads a medium-sized<br />

degreaser with a test basket of PCBs.<br />

References<br />

1) http://www.epa.gov/ozone/intpol/index.html<br />

2) http://www.agc.com/english/chemicals/gas/e_solvents/<br />

e_225_6.html<br />

3) http://www.greenpeace.org/international/en/publications/reports/<br />

position-paper-on-f-gases/<br />

4) Howard Sidebottom and James Franklin, “The Atmospheric Fate and<br />

Impact of HCFCs and Chlorinated Solvents”, Pure and Applied Chemistry,<br />

Vol. 68, No. 9, Pp 1757–1769, 1996. At http://pac.iupac.org/<br />

publications/pac/pdf/1996/pdf/6809x1757.pdf. They also noted<br />

“HCFCs and chlorinated solvents make a small or insignificant contribution<br />

to stratospheric ozone depletion (with the exception of<br />

1,1,1,-trichloroethane), global warming, photochemical smog, acid<br />

rain, or chloride and fluoride levels in precipitation.”<br />

5) Plant Engineering Magazine, 6/12/2003, www.PlantEngineering.com<br />

6) http://www.theozonehole.com/recentment.htm<br />

7) List provided by the State of Massachusetts; www.turi.org/content/<br />

download/7249/132886/file/ý for a fairly comprehensive list of<br />

brand names<br />

Source: Microcare<br />

Zusammenfassung<br />

Die Ablösung des Fluorkohlenwasserstoffs HCFC-225 steht unmittelbar<br />

bevor. Es handelt sich um eine spezielle Formulierung innerhalb<br />

dieser chemischen Stoffklasse HCFC. Bei diffizilen Reinigungsaufgaben<br />

keine leichte Aufgabe. Immerhin gibt es eine ganze<br />

Reihe von Alternativen bekannter Hersteller, die bezogen auf die<br />

Applikation und die Nebeneffekte gezielt ausgesucht werden müssen.<br />

Denn ein typisches Produkt, das einfach das bisher verwendete<br />

HCFC-225 ersetzt, ist nicht darunter. Wir geben hier eine Anleitung,<br />

wie dieser wichtige Prozess erfolgreich absolviert werden<br />

kann.<br />

Résumé<br />

Le remplacement de l’hydrochlorofluorocarbure HCFC-225 est pour<br />

très bientôt. Il s‘agit d‘une formulation spéciale dans cette catégorie<br />

de substances chimiques HCFC. Pas si simple quand il est<br />

question de nettoyages difficiles. Quoiqu‘il en soit, des fabricants<br />

de fabricants connus proposent un grand nombre de solutions alternatives<br />

qui doivent être recherchées de manière ciblée sous<br />

l’angle de l‘application et des effets secondaires Car aucun produit<br />

typique remplaçant le HCFC-225 ne figure au tableau. Nous proposons<br />

ici des instructions pour mener à bonnes fins ce processus<br />

important.<br />

Резюме<br />

Переход от фторопроизводного углеводорода HCFC-225<br />

представляется неизбежным. Речь идет о специальной<br />

формуле внутри этого класса химических веществ HCFC. Это<br />

не так-то легко при выполнении сложных задач по очистке.<br />

Тем не менее, существует целый ряд альтернатив от<br />

известных производителей, которые требуют направленного<br />

изучения в зависимости от вариантов применения и побочных<br />

эффектов. Ведь среди них нет типового продукта, который мог<br />

бы просто заменить использовавшийся ранее HCFC-225.<br />

Здесь приводится инструкция по успешному выполнению<br />

этого важного процесса.<br />

48 <strong>EPP</strong> <strong>EUROPE</strong> May 2017



Pick-and-place systems and features<br />

Hanwha Techwin Automation Americas, Inc., formerly Samsung<br />

C&T Automation, announced new PLUS features on its<br />

next-generation SM Series pick-and-place systems.<br />

Features include higher resolution drive motors that increase<br />

chip placement accuracy by 20 percent, flying vision<br />

verification for pre- and post-placement process enhancements,<br />

and compatibility with optional electrical test verification<br />

and progressive build capability to increase efficiency<br />

and versatility within prototyping, new product introduction,<br />

and volume production environments.<br />

SMT Hybrid Automation, Booth 4A-318<br />

http://smt.hanwhatechwin.com<br />

SM series specifications.<br />

Simplify the production<br />

The patented PCB support system MBU (Memory BackUp<br />

Unit), since 2008, sold by Hoang-PVM, has a modular design<br />

and works with a completely new concept, whether in the<br />

screen printer or the SMD placement machine. The aim is to<br />

optimize the set-up time during the mid-stage support process<br />

and to ensure the topography of the component bottom<br />

of the double PCB´s. It has been used worldwide and<br />

adapted for E-production in Europe for around eight years.<br />

MBU systems are available for various PCB-support heights,<br />

e.g. for stencil printers from DEK, Ekra, Ersa, MPM, Speedprint<br />

or pick & place machine like Siplace, Juki, Samsung, Yamaha,<br />

Essemtech and relatives dispensing-systems. The<br />

special feature of these patented modules consists of two<br />

important features: No electrical power and no compressed<br />

air is required. Here, the topic of mechanical sensitivity of<br />

SMD device destruction and ESD suitability is given.<br />

Source: Hanwha Techwin Automation Americas, Inc<br />

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Solder Paste<br />

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High process reliability through full tunnel wave soldering system<br />

LEDs made in Italy<br />

Although LEDs (light-emitting diode) have a significantly higher light output than light<br />

bulbs, they do require high demands of energy. If they are not optimally supplied with<br />

energy, flickering of lights or unsteadiness can occur. In order for this not to happen, LED<br />

drivers are the solution. TCI is one of the leading LED manufacturers based in Saronno,<br />

Italy and known for their extensive range of LED modules, drivers and converters.<br />

Typical THT PCB for the<br />

driver manufacturing.<br />

Privately owned for 30 years, TCI has around 250 employees to<br />

ensure all manufactured LED applications function properly and<br />

flawlessly. An LED module is not solely responsible for a perfect<br />

functioning light source or different dimming capabilities. This is<br />

why, in addition to LED converters, LED drivers are also necessary.<br />

Converters guarantee that the input voltage is transformed into a<br />

constant output voltage, whereas drivers provide a constant output<br />

current and can often produce a constant output voltage. The different<br />

types of dimming available is also interesting. As well as the fact<br />

that even small voltage changes affects the current and fluctuations<br />

of current, which can easily destroy LEDs.<br />

Groundbreaking technology<br />

The Italian manufacturer is a specialist in LED applications with an<br />

increasing clientele to customers worldwide. Although TCI began to<br />

produce modules only 6 years ago, this area continues to expand.<br />

According to Plant Manager, Ing. Alessandro Gallingani, 175 different<br />

LED modules are produced on a weekly basis. He also emphasizes<br />

that they do not only produce standard designs. The needs<br />

and wishes of their customers are very important, which means<br />

they try to realize all special requests. The company is currently expanding<br />

their production area to a new 5,000 m² building. To meet<br />

the needs of the growing market, this new site will mainly produce<br />

LED modules between 1.20 m and 1.50 m in length, as well as,<br />

driver-on-board modules.<br />

The manufacturer is also focusing on pushing innovations in the<br />

area of LED drivers forward. All special requests are taken into consideration,<br />

not only standard designs. From a blank paper to the<br />

prototype, all requests are made within 20 days. The company<br />

brought on a knowledgeable research and development team, putting<br />

them in the forefront of the market. They are currently producing<br />

drivers that have integrated Wi-Fi or Bluetooth modules.<br />

The full tunnel<br />

wave soldering<br />

system,<br />

Powerflow N2,<br />

that manufactures<br />

the drivers.<br />

Source: Doris Jetter<br />

50 <strong>EPP</strong> <strong>EUROPE</strong> May 2017


Source: Doris Jetter<br />

Source: Doris Jetter<br />

In the area of driver manufacturing, there are 12 THT lines.<br />

The idea behind this is to go in the direction of Smart Environment,<br />

where all light sources and the luminescence of the LEDs will be<br />

controlled or modified remotely by only one person. In the future,<br />

the light should be able to control itself, adapting to external lighting<br />

conditions, and eliminating unnecessary electricity costs. The company’s<br />

imagination shows no boundaries, which in combination with<br />

high flexibility, they will continue to grow exponentially. Long-term<br />

partnerships are also a sign for continuous stability, which the<br />

manufacturer has with Ersa. With their long-term collaboration of 20<br />

years, Ersa has helped the manufacturer realize their innovative<br />

ideas with the use of their soldering equipment. In addition to two<br />

Powerflows N2 in the THT section of the driver manufacturing, the<br />

SMD department has a Versaflow and four Hotflows with two different<br />

models. There are also four other Hotflow machines from Ersa<br />

in the module assembly line. The focal point of this article is on the<br />

THT area where drivers are manufactured, so the focus will be on<br />

the Powerflow N2.<br />

The two full tunnel wave soldering systems, Powerflow N2, are the<br />

perfect addition to the production of well-functioning LED drivers. To<br />

handle the long and narrow LED strips, the soldering systems are<br />

equipped with special belts and special carriers that ensure planarity.<br />

The spray flux systems have a flow rate setting that allows for a<br />

fine and accurate deposition, which decreases the waste of flux.<br />

VOC-free water based fluxes can also be used. The 2-head spray<br />

Demand for soldering in LED applications<br />

Wave soldering is predestined for wired electronic components or<br />

connector elements, even if the control of the process is more complicated<br />

than in reflow soldering. Several factors, such as soldering<br />

alloy, flux, preheating temperature, wetting time and the atmosphere<br />

in the soldering module play a crucial role in the quality of the<br />

result. In the assembly production, TCI uses two Powerflow N2<br />

from Ersa to produce LED drivers. An SMD process accompanies<br />

the bottom of the double-sided circuit board, while the top side is<br />

responsible for the current of components, such as electrolytic capacitors,<br />

electrical resistors, coils, and other components associated<br />

with through-hole mounting. This process is carried out on 12<br />

THT lines with approximately 60 employees, the majority being<br />

women. The Plant Manager, Alessandro Gallingani, exclaims:<br />

“There is currently no technology that could reduce the size of our<br />

components with its current dimensions. In addition, the space between<br />

the THT components is very small, so much so that this<br />

could not be handled automatically. Our design of the modules for<br />

the LED drivers requires manual work, especially on the top where<br />

the electrical functions are. Our THT seats are filled with 90 % of our<br />

staff who are concentrated on this work alone.”<br />

The separation of the LED stripes.<br />

Source: Doris Jetter<br />

Source: Doris Jetter<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 51


fluxer with the intelligent pattern spraying programming is even<br />

more precise than the previously pneumatically driven motor control.<br />

This ensures less residue on the printed circuit board, as well as<br />

the end of complex manual cleaning with a brush, saving exponential<br />

time and cost. The preheating concept with convection, as well<br />

as medium and short wave infrared emitter modules reduces faulty<br />

soldering points by approximately 40 %. Particularly with large<br />

mass-efficient components, that are available at TCI, the configurable<br />

preheating concept of the system ensures uniform heating<br />

without overheating. Only high quality materials are used for soldering,<br />

so that the solder cannot react with the surface. The use of the<br />

Wörthmann wave ensures a complete wetting of the SMD pads.<br />

This causes fewer soldering bridges and a positive soldering result,<br />

especially with the difficult THT components of the LED drivers.<br />

Alessandro Gallingani further confirms this: “We have not only reduced<br />

problems involving soldered assembly by about 40 %, but we<br />

have also increased our production by 25 %, all thanks to the wave<br />

soldering systems.” Another positive aspect of the systems is the<br />

multi-stage cleaning systems, which minimizes maintenance times.<br />

Throughout the preheating zones and the soldering units, a part of<br />

the atmosphere is constantly absorbed, cleaning the central module.<br />

The three gas streams are never mixed, which helps prevent<br />

the residual oxygen content in the soldering module from forming<br />

air pockets. The constant change of the atmosphere prevents overheating<br />

of the gas and helps to stabilize the thermal conditions. All<br />

of this has an easy-to-use control system concept with simple operation<br />

via a desktop-PC or touchscreen.<br />

+++ Video-Interview +++<br />

A full tunnel wave soldering system ensures high process<br />

reliability in the THT area during the manufacturing of drivers.<br />

Our readers can find the video here: http://epp-europe.eu/applikation-video/<br />

full-tunnel-wave-soldering-system-ersa-tci.<br />

From left to right: Alessandro Gallingani (TCI), Tom Berx (Ersa) and<br />

Luca Fiorucci with the camera crew.<br />

Source: Doris Jetter<br />

In the manufacturing<br />

area for the<br />

modules with a<br />

Hotflow 3/20 XL.<br />

TCI is not looking to forgo this collaboration with Ersa, as the Plant<br />

Manager confirms: “We have many advantages with this long-term<br />

cooperation with Ersa. Not only is the company trustworthy, but<br />

they also provide great support, along with their innovative equipment.<br />

I also would like to include Packtronic and their Managing Director,<br />

Luca Fiorucci. If we ever have any problems with one of the<br />

systems, support is directly here to investigate deeper and find an<br />

efficient solution. We also receive specific instructions to be able to<br />

start production as quickly as possible.” (dj)<br />

SMT Hybrid Packaging, Booth 4-111<br />

www.tci.it; www.packtronic.it; www.ersa.com<br />

Source: Doris Jetter<br />

Zusammenfassung<br />

TCI ist einer der führenden LED-Hersteller mit Sitz in Saronno und<br />

bekannt durch sein umfangreiches Angebot an LED-Modulen, -Treibern<br />

und -Konvertern. Einer langjährigen Partnerschaft verdankend<br />

findet sich umfangreiches Lötequipment von Ersa in der Produktion.<br />

Der Artikel befasst sich mit der THT-Herstellung der Treiber, die<br />

mit hoher Prozesssicherheit durch die Volltunnel-Wellenlötanlage<br />

einhergeht.<br />

Résumé<br />

TCI fait partie des constructeurs pilotes en matière de LED et a son<br />

siège à Saronno. La société est connue par son offre très étendue<br />

de modules, de pilotes et de convertisseurs pour LED. Grâce à un<br />

partenariat déjà établi depuis longtemps, on trouve dans la production<br />

un vaste choix d’équipements de soudure d’Ersa. L’article<br />

traite de la fabrication THT des pilotes, laquelle s’accompagne<br />

d’une grande sécurité des processus du fait de l’installation de<br />

brasage à la vague en tunnel complet.<br />

Резюме<br />

TCI — один из ведущих производителей светодиодов,<br />

штаб-квартира которого расположена в Саронно. Компания<br />

известна обширным предлагаемым спектром светодиодных<br />

модулей, приводов и конвертеров. Благодаря многолетнему<br />

партнерству в производстве используется обширный<br />

ассортимент паяльного оборудования Ersa. Статья<br />

рассказывает о ТНТ-производстве приводов, высокая степень<br />

безопасности которого обеспечивается за счет<br />

полнотуннельной установки для пайки волной припоя.<br />

52 <strong>EPP</strong> <strong>EUROPE</strong> May 2017



Versatile, stable, low-voiding solder paste<br />

Indium Corporation will feature its void-reducing<br />

Indium8.9HF solder paste to help customers<br />

“Avoid the Void” at SMT Hybrid Packaging<br />

May 16–18, in Nuremberg, Germany.<br />

This solder paste is a no-clean, halogen-free<br />

that delivers versatility and stability in the<br />

printing process. Under optimal process conditions,<br />

Indium8.9HF:<br />

• demonstrates consistent printing performance<br />

for up to 12 months when refrigerated.<br />

• maintains excellent printing and reflow performance<br />

after remaining at room temperature<br />

for one month.<br />

• delivers excellent response-to-pause even<br />

after being left on the stencil for 60 hours.<br />

The company has specifically formulated Indium8.9HF<br />

solder paste to reduce voiding<br />

significantly below the industry average for<br />

improved finished goods reliability. This paste<br />

delivers robust reflow capabilities and a wide<br />

processing window, which accommodates<br />

various board sizes and throughput requirements,<br />

and minimizes defects.<br />

It has a unique oxidation barrier technology<br />

that makes it perfectly suited for a variety of<br />

applications, especially automotive assembly.<br />

Source: Indium Corporation<br />

Indium8.9HF is a no-clean, halogen-free solder paste.<br />

SMT Hybrid Packaging, Booth 4-321<br />

www.indium.com<br />

New solder paste & preform<br />

innovations for low voiding<br />

Alpha Assembly Solutions, a part of the Mac-<br />

Dermid Performance Solutions group of businesses<br />

featured Alpha OM-358, the next<br />

generation high-reliability Innolot solder<br />

paste with ultra-low voiding properties ideal<br />

for automotive applications.<br />

Alpha Accuflux Preforms, designed specifically<br />

for large area power components that<br />

require consistent low-voiding solder joints<br />

from normal SMT processes, will also be<br />

highlighted.<br />

“Voiding is a critical reliability issue that one<br />

can help mitigate by choosing the right soldering<br />

materials for your process or application,”<br />

said Robert Wallace, Regional Marketing<br />

Manager for the Americas.<br />

“Alpha OM-358 is ideal for OEM’s using high<br />

reliability alloys, alloys that historically have<br />

produced a larger amount of voids than the<br />

SAC family of standard alloys, to reduce the<br />

level of voids in the joints close to those<br />

achieved in SAC305 while using Innolot/Maxrel<br />

/Maxrel Plus alloys and benefitting from<br />

all the mechanical properties of these high<br />

reliability alloys.”<br />

He continues, “Accuflux Preforms also contain<br />

an ultra-low voiding flux formulation that<br />

is deposited very accurately from preform to<br />

preform ensuring repeatable performance<br />

every time. They are available in Tape & Reel<br />

for easy assembly in SMT reflow applications.”<br />

SMT Hybrid Packaging, Booth 4-101<br />

Future packaging line at SMT<br />

A subset of IPTE’s capabilities will be shown<br />

in the Future Packaging line, at the SMT Hybrid<br />

Packaging show at the Messe in Nuremberg,<br />

Germany. Besides all connection conveyor<br />

between the various brands of equipment,<br />

they will also show a laser marker Flex-<br />

Marker II and a test handler ETH Boardhandler.<br />

The FlexMarker II can be equipped with a selection<br />

of lasers matching your requirements.<br />

The laser is positioned in an XY table allowing<br />

marking on a wide area. An optional fast flip<br />

unit can also be used to enable marking on<br />

the other side as well.<br />

The ETH is the economical test handler within<br />

the company’s portfolio and is ideally<br />

suited for flashing/functional/small ICT appli-<br />

cations. An optional bypass transport within<br />

the 500 mm footprint can be used to enable<br />

parallel testing in a serial line. The ETH can<br />

also be equipped with an optional Cage of Faraday<br />

for RF testing.<br />

The family of boardhandlers also include<br />

heavy-duty handler (up to 15,000 N), as well<br />

as, real in-line hot test (125 ºC) handler.<br />

IPTE’s Easyline conveying equipment can be<br />

easily integrated in your production lines and<br />

offer smooth PCB transport between processes.<br />

EasyLine modules are available in<br />

Small (300 mm), Medium (500 mm) or Large<br />

size (600 mm) segments for both conventional<br />

PCBs as Hybrid ceramic panels.<br />

SMT Hybrid Packaging, Booth 5-434<br />

www.ipte.com<br />

Source: IPTE<br />

http://alphaassembly.com<br />

The future packaging line.<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 53


Issues with conformal coating of board assemblies after introduction of lead-free operation<br />

Plasma treatment virtually<br />

eliminated adhesion problems<br />

When a manufacturer who made sensor circuits for the oil and gas industry changed to a lead-free process to<br />

comply with RoHS standards, the manufacturing team found it was having adhesion problems that were resulting<br />

in board failures when applied to harsh environments. The company eventually realized that the flaws were due<br />

to a wetting problem which resulted in a poor conformal coating process. Plasma treatment before the conformal<br />

coating procedure turned out to be the efficient solution for the adhesion issues.<br />

Alex Berlin, Carla Loeffler, and Dave Selestak, Nordson MARCH, Concord, CA, USA<br />

RoHS (now version 2) is the EU’s directive on reduction of hazardous<br />

substances and has become a global standard, and its<br />

requirements had driven printed circuit board assembly (PCBA) materials<br />

to ever higher temperature capabilities. The high glass transition<br />

temperature (Tg) of the materials was designed to withstand<br />

the higher reflow temperatures of the lead-free solder process, but<br />

on the other hand, these materials reduced the adhesion of conformal<br />

coatings to them. The sensor manufacturer noticed therefore<br />

unacceptable defects in its PCBA process. As a result, the company<br />

quickly looked for a sufficient solution.<br />

The pull-test shows the results of adhesion testing using the ASTM<br />

method D3350 or ISO 2409 Scotch tape test. To perform the test,<br />

the coating is deposited on the board surface, then scored in a<br />

cross hatch pattern. Scotch tape is applied and then peeled off. The<br />

number of squares removed is then simply after that compared to<br />

an adhesion chart. The more squares removed, the less the adhesion,<br />

while the fewer squares removed, the better the adhesion.<br />

Conformal coating was a necessary part of the assembly procedure<br />

because the assembled boards were going to be used in a ruggedized<br />

environment. However, the conformal coating was not adhering<br />

to the boards and the coating that did adhere was not sufficiently<br />

uniform. The manufacturer realized that the failures were due<br />

to a wetting problem which resulted in a poor conformal coating<br />

process. Dewetting, or lack of adhesion, is a function of putting a<br />

liquid coating on the surface of a printed circuit board (PCB), package,<br />

or device, and before it dries or cures, the liquid moves away from an<br />

area of contamination. In the circuit board manufacturing operation,<br />

first, solder is applied to the pads of the printed circuit board. After<br />

that, components are placed into the solder deposit with their terminations<br />

or pins, and eventually the populated PCB goes through a reflow<br />

or wave soldering oven where it is exposed to heat so the solder<br />

can melt, fusing the component to the pads on the PCBA substrate.<br />

In high-temperature metal joining procedures, flux is added to prevent<br />

oxidation of the base and filler materials, as well as to provide<br />

good wetting conditions. Contamination can be caused by residual<br />

flux, mold release compound, epoxy bleed-out, or even fingerprints<br />

from handling and dust particles. In theory, no-clean flux gets consumed<br />

by the wave soldering process, but it doesn’t really remove<br />

all the contaminants.<br />

As long as the dewetting problem existed, the sensor manufacturer’s<br />

PCBA line had to be shut down because the failure rate was<br />

too high. Research was conducted and it was concluded that plasma<br />

treatment prior to conformal coating might help. Upon visiting a<br />

neighboring board assembly company, it was noticed that Nordson<br />

MARCH plasma treatment systems were being used, and subsequently<br />

the application team of the company was contacted.<br />

Testing the defective boards<br />

In order to diagnose the problem and better identify the reason for<br />

the defective boards, the company team performed a standard contact<br />

angle test using a contact angle measuring goniometer to<br />

measure the surface tension of the board, see the respective<br />

image. The better the surface tension, the better the wetting. To perform<br />

the test, a controlled droplet of water is placed on the end of<br />

the needle and lowered until the droplet comes in contact with the<br />

surface of the board. The needle is retracted and the board is examined<br />

to see if the drop stays. If it beads up, that indicates a high contact<br />

angle. If there is good surface tension, and therefore wetting,<br />

the droplet will lay flat on the surface of the board.<br />

The degree of the contact angle shows the amount of contamination<br />

on a board. The higher the angle, the greater the contamination.<br />

The failed PCBA that the company team tested for the manufacturer<br />

had a huge contact angle of almost 90 degrees. An ideal<br />

contact angle is below 20 degrees. Therefore, it’s no wonder the<br />

ASTM Scotch tape pull test applied to high Tg material.<br />

Source: Nordson MARCH<br />

Removal of organic flux residues improving coating coverage.<br />

Source: Nordson MARCH<br />

54 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

conformal coating wouldn’t adhere to the surface.<br />

Plasma treatment with results<br />

The application of plasma renders an excellent outcome for improving<br />

adhesion by increasing the surface energy of materials, and is<br />

also very useful for cleaning contaminants that can adversely affect<br />

the adhesion of conformal coatings. Plasma treatment is suitable<br />

for a wide variety of cleaning requirements, surface activation procedures,<br />

as well as adhesion improvement applications in semiconductor<br />

manufacturing, microelectronic packaging and assembly, and<br />

is also used by manufacturers of medical and life science devices.<br />

The plasma treatment system causes interaction with the PCBA<br />

surface in two distinct ways, physically and chemically. The physical<br />

interaction is via ion bombardment of the surface at a nano level.<br />

Energetic ions impact the surface, dislodging the contaminant material.<br />

This is typically performed using an inert gas like argon.<br />

Chemical interaction with the surface takes advantage of active<br />

species created within the plasma, such as oxygen radicals, that are<br />

very reactive with organic material contaminants. Both mechanisms<br />

are often present during a plasma treatment and the dominant<br />

mechanism can be controlled via process parameters such as<br />

pressure, power, location, as well as chemistry.<br />

A plasma treated surface normally will result in a high-energy surface<br />

state due to surface activation during the cleaning process.<br />

High energy surface states are preferred for enhanced bonding,<br />

whether it is adhesive bonding, wire bonding, or, as in the current<br />

case with the sensor circuit manufacturer’s PCBAs, lamination or<br />

conformal coating bonding. Untreated (low surface energy) surfaces<br />

typically demonstrate hydrophobic characteristics, while plasma<br />

treated surfaces typically are hydrophilic.<br />

In conducting the tests at the company, an AP-1000 batch processing<br />

plasma system was used to treat the PCB assemblies prior to<br />

conformal coating. This system was selected because once the<br />

tests were completed, the same set of parameters could be easily<br />

scalable to any one of several size AP-Series systems based on capacity<br />

requirements, as well as an automated in-line, high-speed<br />

plasma treatment system should production requirements warrant<br />

a continuous line-flow approach.<br />

Boards from two different product lines were treated with plasma<br />

using a batch process, and then each one was verified by repeating<br />

the goniometer test for contact angles. Even after just a short treatment,<br />

improvement was noticeable. To really see the effectiveness<br />

of using a plasma treatment system, it was important to run the<br />

boards in a normal PCB assembly procedure on the shop floor. The<br />

support team visited the company several times. Having the company<br />

application engineers help establish the ideal parameters was<br />

important to the process. The original tests were done in the company<br />

facility at sea level, but the sensor company’s production is located<br />

over 1500 m above sea level. To verify the settings, additional<br />

runs using the AP-1500 plasma treatment system featuring a larger<br />

Conformal coating enhances surface energy thus surface wettability.<br />

Source: Nordson MARCH<br />

Source: Nordson MARCH<br />

Nordson MARCH AP-1500<br />

plasma treatment system.<br />

capacity and handling high volumes,<br />

were performed at the manufacturer’s<br />

production facilities in conjunction with<br />

the company’s application team to see<br />

the effects that elevation had on the process.<br />

They found that indeed the difference in altitude, e.g. the<br />

lower partial oxygen pressure, really did have an impact. The flexibility<br />

of the plasma system’s control features enabled recalibration to<br />

achieve the best results at the higher altitude. Once the PCB assemblies<br />

that had received plasma treatment were returned to the<br />

assembly line for conformal coating, the reduction in defect rate<br />

was significant in all cases. The company was able to resolve the<br />

coating-related failures and get the assembly line up-and-running.<br />

www.nordsonmarch.com<br />

Zusammenfassung<br />

Ein Hersteller von Sensorschaltungen für die Öl- und Gasindustrie<br />

ist im Zuge seiner Adaption des RoHS-Standards für den Schutz<br />

der Umwelt auf die Bleifrei-Fertigung übergegangen. Musste dann<br />

aber feststellen, dass auf den Baugruppen die Schutzbeschichtung<br />

aufgrund der höheren Prozesstemperaturen nicht mehr zufriedenstellend<br />

haftete und damit die Schutzwirkung deutlich beeinträchtigt<br />

war. Mit einer Plasmabehandlung vor der Beschichtung konnte<br />

man, wie die daraufhin durchgeführte Applikations-Studie zeigt,<br />

dieses Problem letztlich bestens beheben und die nötige hohe Produktqualität<br />

sicherstellen.<br />

Résumé<br />

Un fabricant de circuits à capteurs pour l‘industrie pétrolière et<br />

gazière est passé à la fabrication du sans plomb en s’adaptant la<br />

norme RoHS visant à protéger l‘environnement. Force a été de<br />

constater que le revêtement de protection n‘adhérait plus de manière<br />

satisfaisante sur les cartes en raison des températures supérieures<br />

des process et que l‘effet protecteur était nettement dégradé.<br />

Avec un traitement au plasma avant d‘appliquer le revêtement,<br />

il a été possible, comme le montre l‘étude d‘application effectuée<br />

de ce point de vue, de remédier à ce problème et d‘assurer l’indispensable<br />

qualité élevée du produit.<br />

Резюме<br />

Производитель сенсорных механизмов переключения для<br />

нефтяной и газовой промышленности по ходу внедрения<br />

стандарта RoHS для защиты окружающей среды перешел на<br />

производство без использования свинца. Однако, при этом<br />

выяснилось, что вследствие воздействия высоких температур<br />

в процессе изготовления более не обеспечивается<br />

надлежащая степень адгезии защитного покрытия на<br />

компонентах, что приводит к значительному снижению<br />

характеристик защиты. Как показывает проведенное<br />

исследование варианта применения, плазменная обработка<br />

покрытия позволила бы наилучшим образом устранить эту<br />

проблему, обеспечив при этом необходимое высокое качество<br />

изделий.<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 55


A novel approach towards void reduction<br />

Which solder alloy is the best?<br />

Void formation under components with large soldering planes and low stand-off heights, such as<br />

QFN components, is a well-known phenomenon. The use of this type of components is on the rise,<br />

giving many designers, SMD line operators and quality control staff ever growing headaches to<br />

meet IPC criteria. This article focuses on a novel approach toward void reduction.<br />

Interflux Electronics NV, Gent (Belgium)<br />

The mechanism behind the formation of voids in a solder joint has<br />

been the subject of study for many years. A number of void<br />

types and forming mechanisms have been identified. Most notable<br />

are macro voids, where the main contributor to the void formation<br />

appears to be the soldering chemistry of the solder paste. Micro<br />

voids, shrinkage voids and Kirkendall voids are also well known and<br />

documented void types, but fall outside the scope of this article.<br />

Many techniques to reduce void formation have been established<br />

over the years. Adjusting the solder paste chemistry, the reflow profile,<br />

the component, PCB and stencil design or finish, are some of<br />

the optimizing tools that are actively being used in the field today.<br />

Even machine manufacturers are jumping on the wagon by offering<br />

solutions to reduce voids by ways of a frequency sweep or vacuum<br />

technology. There is, however, another very important, parameter<br />

that defines void formation : the soldering alloy.<br />

The soldering alloy : an unusual suspect<br />

The main contributor to void formation is and has always been<br />

thought to be the solder paste flux. Designing a solder paste flux<br />

that actively works on reducing voids seems to be the right way to<br />

go, since about 50 % of the flux paste will evaporate during the reflow<br />

process, actively generating voids. Because of this focus on<br />

the solder paste flux however, investigations on void formation differences<br />

between soldering alloys have always been flying under<br />

the radar. Until now.<br />

Void level determination<br />

A baseline void formation percentage was established with standardly<br />

available soldering alloys, such as SnAg3Cu0,5(SAC305),<br />

SnAg0,3Cu0,7(LowSAC0307) and Sn42Bi57Ag1. The same solder<br />

paste chemistry was used for all tests described in this paper.<br />

To level out differences between PCB finishes, tests were performed<br />

on 3 commonly used finishes in the field: OSPCu, ENIG (NiAu)<br />

and I-Sn. To have sufficient void generation, a stencil of 120 μm was<br />

used without any pad reduction. 60 Sn-finished QFN components<br />

for each paste were reflowed using a standard ramp-up reflow profile,<br />

suitable for each specific soldering alloy.<br />

Each component was X-rayed and the void level of the ground plane<br />

was used for determining the void percentage. Void percentage is<br />

calculated as the area of voids compared to the area of the ground<br />

Source: Interflux<br />

Source: Interflux<br />

Source: Interflux<br />

Different levels of voiding.<br />

Sample pictures of reference test:<br />

SAC305<br />

LowSAC0307<br />

Source: Interflux<br />

Source: Interflux<br />

Source: Interflux<br />

Test component example.<br />

Sn42Bi57Ag1.<br />

56 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

Source: Interflux Source: Interflux Source: Interflux<br />

TGA analysis.<br />

plane surface. Individual void size was not taken in consideration.<br />

The test results show rather poor results for SAC305 and Low-<br />

SAC0307. Better results were obtained with Sn42Bi57Ag1.<br />

Alloy optimization<br />

Based upon these test results, a research project was started to determine<br />

the optimal soldering alloy in perspective of voiding performance.<br />

TGA analysis and X-Ray analysis were used for this purpose.<br />

Further parameters, such as reflow profile, yield strength,<br />

pasty range, elongation and usability in other processes were taken<br />

into consideration as well.<br />

The strategy of development involves starting with the standard<br />

lead-free soldering alloys and adjusting them with e. g.<br />

Sn,Bi,Ag,Zn,Cu,…<br />

As this quickly results in numerous candidate alloys, TGA analysis<br />

was used as an initial selection tool. With TGA analysis, the evaporation<br />

of the flux paste chemistry in combination with a certain alloy<br />

and reflow profile can be monitored. A smoother evaporation curve<br />

means lower void formation. From this research eight Prototype soldering<br />

alloys were chosen for further investigation.<br />

Reference void levels.<br />

Prototype alloys void levels.<br />

Zusammenfassung<br />

Porenbildung unter Komponenten mit großen Lotflächen und niederen<br />

Spalthöhen wie QFN Bauteile ist ein wohl bekanntes Phänomen.<br />

Doch steigt die Verwendung dieser Art von Bauteilen, so dass<br />

SMD-Linien Bediener sowie das Qualitätsmanagement zunehmend<br />

Probleme haben, den IPC-Kriterien zu entsprechen. Dieser Artikel<br />

konzentriert sich auf einen neuartigen Lösungsansatz zur Voidreduzierung.<br />

Résumé<br />

La formation de pores sous les composants présentant une grande<br />

surface de soudage et de faibles hauteurs tels que les composants<br />

QFN est un phénomène bien connu. Mais l‘utilisation de ce type de<br />

composants augmente de sorte que les opérateurs de lignes de<br />

CMS ont toujours plus de problèmes pour satisfaire aux critères de<br />

la norme IPC. Cet article se concentre sur une nouvelle approche<br />

de réduction des vides.<br />

Резюме<br />

Образование пор под компонентами с большой площадью<br />

пайки и малой высотой зазора, такими как компоненты QFN<br />

— достаточно хорошо известный феномен. Тем не менее,<br />

степень использования компонентов такого вида возрастает,<br />

соответственно, увеличивается и количество проблем в части<br />

соответствия критериям IPC для операторов линий SMD, а<br />

также для отделов контроля качества. Настоящая статья<br />

концентрируется на новом подходе к решению вопроса<br />

уменьшения пор.<br />

Super-8<br />

The eight prototype soldering alloys were subjected to the same<br />

test setup as the initial reference testing. This means soldering<br />

QFNs with each solder paste on different PCB finishes and analyzing<br />

real voiding performance with X-ray. The initial test results<br />

showed significant reduction of the void levels when compared to<br />

the standard SAC305, LowSAC0307 and even Sn42Bi57Ag1. Test<br />

alloy G resulted in lowest voiding values in combination with the narrowest<br />

spreading of the results. This alloy was selected for further<br />

mechanical reliability testing.<br />

Together, with its low voiding properties, it also showed good shock<br />

and vibration resistance in combination with better thermal cycling<br />

properties than SAC305. Furthermore, beside reflow, the alloy<br />

proved also to be suitable for wave and selective soldering.<br />

Alloy G was chosen for commercialization under the name LMPA-Q.<br />

Conclusion<br />

A serious decrease in void formation was obtained with the adjusted<br />

soldering alloys when compared to the market standards<br />

SAC305 and LowSAC0307.<br />

Furthermore, the ultra-low voiding soldering alloy LMPA-Q performs<br />

better in thermal cycling & vibration resistance when compared to<br />

most of the soldering alloys used on the market today.<br />

www.lmpa-q.com<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 57



Process control<br />

Metcal’s CV-5200 Connection Validation Soldering<br />

Station provides real-time closed loop<br />

feedback on intermetallic compound<br />

formation. Plus, a new communication port<br />

enables process traceability and firmware<br />

upgrades.<br />

The company announced the introduction of<br />

its CV-5200 Connection Validation soldering<br />

station. The solution provides operators with<br />

real-time, closed loop feedback, via a green<br />

or red light integrated into the hand piece, to<br />

indicate intermetallic compound formation –<br />

the key to a good solder joint.<br />

“Connection Validation, or CV, is the next big<br />

step in the evolution of process control,” said<br />

Christopher Larocca, President of OK International,<br />

which acquired the company in<br />

1996. “When Metcal first introduced SmartHeat,<br />

we offered customers a new level of<br />

process control within their hand soldering<br />

operations, which is historically the weakest<br />

link. Now with CV, we offer control not only<br />

of the tip temperature, but also solder joint<br />

quality itself. It’s the most innovative advancement<br />

in soldering technology in almost<br />

30 years and represents a quantum shift in<br />

process control – particularly in the prototyping<br />

and production of automotive, aerospace,<br />

military, medical devices, and other products<br />

with zero risk tolerance.”<br />

The company’s Chief Technology Officer, Hoa<br />

Nguyen, added, “The CV-5200 also provides<br />

data capture capability and a communication<br />

port – enabling process traceability and firmware<br />

upgrades to achieve higher levels of<br />

process control. The company is building<br />

stations that mitigate risk for our customers<br />

while also supporting compliance and quality<br />

tracking. And of course, all our soldering<br />

stations continue to feature SmartHeat and<br />

Source: Metcal<br />

Connection Validation<br />

provides operators with<br />

real-time, closed loop<br />

feedback.<br />

never need calibration, saving customers<br />

time and money.”<br />

The CV-5200 also features a patented Chipin-Cartridge<br />

technology that precisely calculates<br />

and displays tip temperature on the<br />

unit’s color TFT graphic display.<br />

“With the CV-5200’s communication port, tip<br />

temperature and other data can be collected<br />

and analyzed in production reports,” said<br />

Nguyen.<br />

SMT Hybrid Packaging, Booth 4-101<br />

www.metcal.com/cv<br />

Ultra-selective solder module<br />

Kurtz Ersa North America, a leading supplier<br />

of electronics production equipment, today<br />

announced plans to exhibit the new Versaflex-Ultra<br />

selective solder module. The system<br />

will be displayed at the upcoming SMT<br />

Hybrid Packaging show, to be held May<br />

16–18 at the Messe in Nuremberg, Germany.<br />

The selective solder module offers unlimited<br />

flexibility, productivity and uncompromising<br />

quality – two solder pots, either y- and x-variable<br />

or z-variable, equipped with different<br />

solder and different solder nozzles, can work<br />

in parallel.<br />

With its revolutionary flexibility, the soldering<br />

pots are able to move freely in x-, y- and z-direction.<br />

Each soldering pot is completely in-<br />

Source: Kurtz Ersa North America<br />

dependent and has no y- or x-dependencies<br />

to the other one. An anti-collision software<br />

ensures the free movement of the servodriven<br />

axis system of the soldering pots.<br />

Rainer Krauss, Vice President of the company,<br />

commented, “The Versaflex is taking<br />

selective soldering to the next level of automation.<br />

This innovation is a direct result of<br />

the high demands and stringent require-<br />

The Versaflex-<br />

Ultra will be<br />

shown at SMT.<br />

ments from our customers. The selective<br />

solder module demonstrates that, once<br />

again, Ersa is developing equipment to meet<br />

the needs of our customers and setting the<br />

standard of excellence for selective soldering<br />

machines.”<br />

SMT Hybrid Packaging, Booth 4-111<br />

www.ersa.com<br />

Connecting automated device programming to your smart manufacturing<br />

Data I/O Corporation, global provider of advanced<br />

data and security programming solutions<br />

for flash, flash-memory based intelligent<br />

devices, and microcontrollers, presented<br />

the ConneX smart programming software<br />

for PSV systems.<br />

“The rapid growth of the automotive electronics<br />

systems and smart Internet-of-Things<br />

devices is creating demand for extensive traceability,<br />

process monitoring and predictive<br />

analytics,” said Anthony Ambrose, President<br />

and CEO. “Automotive electronics manufacturers<br />

demand robust traceability and detailed<br />

programming history for each pro-<br />

grammed product. This information must be<br />

seamlessly and easily integrated into their<br />

existing factory management systems to ensure<br />

highest quality of their mission critical<br />

products. Designed to support Industry 4.0<br />

and China Smart Factory Initiatives, ConneX<br />

smart programming software delivers realtime<br />

comprehensive traceability and process<br />

monitoring for the Smart Factories of today<br />

and tomorrow.”<br />

ConneX software integrates the company’s<br />

PSV automated programming systems into<br />

manufacturing systems. ConneX software<br />

extracts detailed data for each device programmed<br />

including programming performance<br />

and device characteristics for comprehensive<br />

component level traceability in real<br />

time. The PSV family is the company’s fastest<br />

ramping automated programming systems<br />

series with over 130 systems sold worldwide.<br />

Including the PSV7000, PSV5000 and<br />

PSV3000, they offer customers a range of<br />

automated programming systems to support<br />

their throughput and quality requirements<br />

with industry leading speed and flexibility for<br />

the lowest total cost of ownership.<br />

www.dataio.com<br />

58 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

Launch of Floor Life Reset Cabinets<br />

Super Dry Totech introduces a new Floor Life<br />

Reset Cabinet for moisture sensitive devices,<br />

setting new standards in terms of flexibility<br />

and speed. Depending upon ambient humidity<br />

and temperature, components can be<br />

safely used only within a limited time period,<br />

as classified by the IPC/JEDEC J-Std- 033C.<br />

New and proven technologies can now safely<br />

reset component floor life using low temperatures<br />

and ultra-low humidity without<br />

requiring extensive time, but insufficient<br />

tracking and process control implementation<br />

can lead to haphazard component drying, particularly<br />

when multiple batches of different<br />

MSL level parts need to be accommodated.<br />

The Reset cabinets can independently track<br />

the timing of 4 separate batches of components<br />

being reset at the same time. Two separate<br />

chambers, each with their own dry-unit<br />

and heater enable two different temperatures<br />

to be utilized in the same cabinet. Both<br />

compartments are insulated with 6 mm<br />

walls. Dehumidifying to less than 1 % RH,<br />

both chambers have their own dry-unit and<br />

heater, so they can operate independently<br />

from each other. Low temperature<br />

heat is added to accelerate<br />

the drying time.<br />

Each compartment features a<br />

4“ color display with countdown<br />

timers for MSL. Component<br />

batch ID and MSL level are entered<br />

directly at the cabinet, and standardized<br />

reset times are either automatically calculated<br />

and timed, or entered manually per internally<br />

developed procedures. When the<br />

Floor life time has been reset, the user is<br />

Dry Tower is a fully automated, robotically controlled,<br />

component handling and storage system.<br />

Source. Super Dry Totech<br />

Floor Life Reset Cabinet for moisture<br />

sensitive devices.<br />

notified, and the part is ready for use or for<br />

placing into a storage cabinet or Moisture<br />

Barrier bag. All data can be tracked & recorded<br />

over time through an Ethernet connection<br />

and integrated software helping manufacturers<br />

on the path to achieving their industry<br />

4.0 goals.<br />

Amongst other systems on display on the<br />

SMT booth will be the fully automated, robotically<br />

controlled, component handling and<br />

storage system, Dry Tower. Incorporating<br />

mature, proven MSD technology and wide<br />

ranging WMS-System integration capabilities,<br />

the systems are capable of automatically<br />

managing tens of thousands of reels<br />

and trays and are totally modular.<br />

SMT Hybrid Packaging, Booth 4-547<br />

www.superdry-totech.com<br />

Source: Super Dry Totech<br />

Turn Vision into Reality.<br />

Meticulous<br />

protective coating.<br />


Meticulous protective coating with Protecto!<br />

The use of protective coatings improves the quality and durability of your products. Our Protecto selective<br />

conformal coating system protects sensitive electronic assemblies from damage by corrosion<br />

or other environmental influences. The multifunctional lacquer applicator enables all standard protective<br />

lacquers to be precisely applied by dispensing, spraying, jet or curtain coating – with absolute precision and<br />

reliability! The system also is available as a production line design with lacquer dryer.<br />

SMT<br />

Hybrid/Packaging<br />

Nuremberg<br />

May 16 –18,<br />

Hall 4A,<br />

Booth 100<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 59<br />



Solder paste stencils in focus<br />

Quality is multidimensional<br />

The ever-rising demands on quality can be seen in solder paste stencils and cutting elements.<br />

An application team, from the laser specialist company LPKF, examined quality features using the<br />

StencilLaser P6060 and the StencilLaser G6080 as examples. In extensive test runs, the experts<br />

scrutinized the individual aspects. They compiled the results in the LPKF tech paper titled<br />

„Quality Aspects in Solder Paste Stencils“ with the goal of optimizing universal quality criteria<br />

in various applications.<br />

It is not always possible to obtain optimal results for cutting, engraving<br />

of text and fiducials, step-down, step-up, CW welding,<br />

punching, cutting elements, and stick-in – because even if certain<br />

processing parameters show very good results, other quality aspects<br />

may suffer.<br />

Stencil foil cutting<br />

The application team chose to define quality aspects using the parameters<br />

of taper, roughness, burr, dross, and heat-affected zone for<br />

laser cutting. The unavoidable taper from the cutting process is a<br />

conical expansion of the hole in the material resulting from the difference<br />

in cutting diameter at the laser entry and exit points. For a<br />

positive taper, the laser entry side has a larger diameter than the<br />

laser exit side does. This favors release of solder paste and facilitates<br />

adhesion of the solder paste to the board when the stencil is<br />

lifted up off of the board. The position of the focal point affects the<br />

taper size. Hence, an unusually large taper can be traced back to a<br />

defocused laser beam.<br />

A defocused laser beam increases the roughness of the cut wall,<br />

which can have a significant effect on the release of the solder<br />

paste and the efficiency of paste transfer from the stencil to the<br />

PCB. A low roughness, in contrast, leads to low friction of the solder<br />

paste on the inside wall and creates a small inside wall surface area.<br />

This also lowers the adhesion of the solder paste to the inside wall<br />

surface. The focal position of the laser additionally affects the heataffected<br />

zone, i.e., the edge region of the cut. The amount of heat<br />

diffused through the laser beam during processing decreases with<br />

increasing cutting gas pressure but increases with material thickness.<br />

In addition, with increasing laser beam diameter, the melt volume<br />

increases, making precise in-focus work essential.<br />

With properly adapted laser parameters, the cutting gas type, unlike<br />

the energy output by the laser beam, has almost no effect on the<br />

heat-affected zone. Hence, a lower energy input leads to a high-viscosity<br />

melt, which remains for a long time in the cutting gap and<br />

gives off heat to the edge regions. An excessively high amount of<br />

energy causes the heat that is not required for cutting to be transferred<br />

to the edge regions. The extent to which the heat penetrates<br />

into the material can only be determined precisely via elaborate material<br />

analysis. However, the discoloration in the edge region resulting<br />

from the effect of heat can be used as a measure of this.<br />

Another quality criterion is the melt expelled on the laser exit side<br />

(dross), which should be kept to a minimum. Factors influencing<br />

dross formation are viscosity of the melt and cutting gas pressure.<br />

The extent of dross formation increases with increasing cutting gas<br />

pressure because the melt adhesion is poorer at the exit. The dross<br />

amount can also be reduced with a reduced laser power, although<br />

the roughness of the cut wall is thereby increased. For minimizing<br />

the extent of dross formation, an optimal setting of the laser energy<br />

is crucial.<br />

Source: LPKF<br />

The laser power is<br />

a crucial factor in<br />

the engraving of<br />

text or fiducials.<br />

Source: LPKF<br />

An entire series of parameters<br />

has different effects on different<br />

quality aspects.<br />

60 <strong>EPP</strong> <strong>EUROPE</strong> May 2017


Source: LPKF<br />

Solder paste stencils made of<br />

metal foils are indispensable<br />

aids for solder paste printing<br />

in SMT assembly of PCBs.<br />

For fusion cutting with microsecond pulses, burrs are unavoidable.<br />

Like dross, burrs are formed on the cutting edge on the laser exit<br />

side. The individual burr protrusions (whiskers) can be several<br />

hundreds of micrometers in height and are only weakly connected<br />

to the cutting wall edge. Burrs usually occur at the end of an aperture<br />

when the material is bent before the end of the cutting line. Parameters<br />

such as aperture shape, size, pierce position, height, and<br />

angle affect burr formation. With suitable system adjustments, the<br />

burr height can be optimized for individual apertures.<br />

Text and fiducial engraving<br />

Engraved texts and fiducials should be legible without causing a<br />

large amount of heat distortion. The heat distortion increases with<br />

decreasing material thickness for an average power level, whereas<br />

the contrast shows varying results. The pulse width and the power<br />

should be adapted to the materials. This also applies to fiducials,<br />

which are filled with a lower line spacing. A similar contrast can be<br />

achieved here with lower power. The contour is an important parameter<br />

for fiducials for precise read-in. Because the fiducials form<br />

the basis for step-down ablation, the melting region should not overlap<br />

the ablation region.<br />

Optimization of step-down steps<br />

Step-down ablation, the step surface roughness, the heat-affected<br />

zone, and the expulsion are factors that influence the processing<br />

time. For example, the roughness decreases with an increasing<br />

number of passes. When power increases the heat-affected zone<br />

size increases, hence the parameters of heat distortion and roughness<br />

increase.<br />

Expulsion is a type of dross formed around a step. It is formed from<br />

small molten balls blown off of the step by the cutting gas. During<br />

this process, known as ablation, a higher power can lead to more<br />

material around and on the step edge.<br />

Precision welding techniques in focus<br />

Step-up stencils are produced through welding of sheet metal onto<br />

the step region by precision spot welding. Even if the quality criteria<br />

for spot welding differ from those applicable to step-down step production,<br />

both processes require the best possible surface quality. In<br />

the step-up process, the number of spatters and the expulsion<br />

height are important parameters. For spot welding, the joining surface<br />

and the welding depth are additional parameters to be considered.<br />

The shear strength is another important aspect because a<br />

doctor blade exerts a shear force on the weld spot during solder<br />

paste printing. As welding depth increases, the maximum force<br />

generally increases and the shear strength decreases slightly. In relation<br />

to the surface area however, the opposite applies. This is because<br />

the increase in force combined with increasing pulse width is<br />

significantly lower in comparison with the increase in joining surface.<br />

Air pockets in the weld spots decrease the shear strength.<br />

If a continuous line, instead of a continuous weld seam, is desired in<br />

pulse mode, CW (continuous wave) welding with continuous radiation<br />

is used. The precision welding technique enables a uniform<br />

depth of weld as well as a uniform weld curvature. Here too the<br />

welding depth and the molten material volume are important. The<br />

aspect ratio, that is, the relationship between the processed weld<br />

seam depth and the lateral expansion on the surface, can be adjusted<br />

via power and speed.<br />

In precision welding, penetration welding and conduction welding<br />

are different. In conduction welding, material is melted by heat conduction,<br />

whereas in penetration welding, higher-temperature melts<br />

generate a vapor that exerts pressure against a melt and achieves a<br />

greater welding depth through displacement. At high speeds, a<br />

vapor capillary (keyhole) forms and advances with the beam. The<br />

further the working point extends into the penetration area, the<br />

higher the aspect ratio becomes.<br />

Today‘s Stencil<br />

Lasers can weld<br />

step-up regions<br />

directly onto<br />

stencil foils.<br />

Source: LPKF<br />

One pulse, one hole<br />

Unlike precision welding, punching introduces holes into stainless<br />

steel foils by means of a pulse, whereby the hole diameter can be<br />

varied through the extent of defocussing. For small hole diameters,<br />

punching represents a time-saving alternative to cutting. „Punching<br />

on the fly“, a method in which the pulse is output at defined intervals<br />

while the material is moved, is even faster. The speed should not be<br />

set too high, though, because the path length traversed in one<br />

pulse width becomes too high and an elongated hole is produced.<br />

Parameters such as an imprecisely adjusted nozzle, an excessively<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 61


high cutting gas pressure, an average power that is too low, and a<br />

large material thickness cause surface spatters. These material deformations<br />

can lead to defocusing and disruption of the punch process.<br />

The maximum material thickness is thus restricted insofar as<br />

the heat distortion depends on the material thickness and increases<br />

with increasing melt volume. To avoid overlapping of heat-affected<br />

zones for adjacent holes, the maximum adjustable speed should be<br />

oriented to the cooling time and the size of the hole pattern.<br />

Additionally, hole size, material thickness, cutting gas pressure, and<br />

cutting gas type affect the expulsion height. The hole size and the<br />

material thickness have an effect on the melt volume, which is proportional<br />

to expulsion and dross. Similarly to step-up welding, expulsion<br />

is lower for a cutting gas with a low oxygen content than for a<br />

cutting gas with a high oxygen content. However, expulsion, in<br />

contrast to dross, decreases with increasing oxygen content.<br />

Smaller holes can be generated with oxygen at lower material<br />

gauges. The opening ratio, or the ratio of generated holes to stillclosed<br />

holes, is also higher. With decreasing oxygen content, the<br />

heat-affected zone size decreases and the maximum material thickness<br />

to be processed also decreases.<br />

Percussion drilling in metal foils<br />

In percussion drilling (also known as „piercing“), in order to make<br />

each aperture or cutting line, a hole is first produced in the material<br />

by pulses. Then the actual cutting process begins. Spatters are<br />

thereby produced on the material surface. They should not be too<br />

large and should be as low in number as possible because they can<br />

deposit on the inside walls of the nozzles and plug them. Deposits<br />

hamper discharge of the melt, enabling burrs to be formed on the<br />

exit side of the beam. A larger hole diameter prevents nozzle clogging<br />

but also increases the amount of molten material that must be<br />

removed from the hole.<br />

Production of ultra-fine cutting elements with the<br />

StencilLaser<br />

For cutting elements, cutouts in the individual parts as well as the<br />

outer contour must be considered. Cutting and fast cutting techniques<br />

allow for precise outer contours. If tabs are required for<br />

keeping parts in focus, they must be able to be separated easily<br />

A thorough study<br />

of the process<br />

parameters is given<br />

in the LPKF tech<br />

paper „Quality<br />

Considerations in<br />

Stencil Applications.“<br />

Zusammenfassung<br />

Der stetig steigende Qualitätsanspruch macht auch vor Lotpastenschablonen<br />

und Schneidteilen nicht halt. Ein Applikationsteam des<br />

Laserspezialisten LPKF hat sich eingehend mit Qualitätsmerkmalen<br />

befasst. Anhand umfangreicher Testläufe haben die Experten einzelne<br />

Qualitätsaspekte genau unter die Lupe genommen. Zugleich<br />

haben sie die Ergebnisse in einem TechPaper zusammengefasst,<br />

um allgemeingültige Qualitätskriterien in verschiedenen Anwendungsbereichen<br />

zu optimieren.<br />

Résumé<br />

Une exigence de qualité toujours plus grande ne s‘arrête pas aux<br />

pochoirs pour pâte à braser et les pièces découpées. Une équipe<br />

application du spécialiste du laser LPKF s‘est concentrée sur les<br />

critères de qualités. Lors de tests poussés, les experts ont scruté à<br />

la loupe certains aspects de qualité. Ils ont collecté les résultats<br />

dans un TechPaper pour optimiser les critères de qualité généralisables<br />

dans divers domaines d‘application.<br />

Резюме<br />

Постоянно растущие требования к качеству заставляют<br />

модернизировать в том числе и шаблоны для паяльной пасты<br />

и режущие части. Группа по вопросам применения<br />

специалистов по лазерному оборудованию LPKF вплотную<br />

занялась характеристиками качества. На основе множества<br />

тестовых пусков эксперты подробно рассмотрели отдельные<br />

аспекты качества. Результаты были сведены в техническом<br />

документе для оптимизации общих действующих критериев<br />

качества в различных областях применения.<br />

from the surrounding material. The tab width varies according to<br />

material type, material thickness, and magnitude of sheet stress.<br />

For a higher material thickness, the tabs can be narrower, whereas<br />

for a higher sheet stress, the tab width must be increased. The tabs<br />

should be positioned to ensure minimal subsequent disturbance. At<br />

the same time, the contour quality can be improved through manual<br />

modification of the tab shape.<br />

Experience helps<br />

The company published a study of quality aspects for different applications<br />

in a tech paper, which is available in English and German for<br />

free download from the Knowledge Center on the company Web<br />

site.<br />

SMT Hybrid Packaging, Booth 5-434<br />

www.lpkf.com<br />

Source: LPKF<br />

62 <strong>EPP</strong> <strong>EUROPE</strong> May 2017


Low cost SMT rework system<br />

PACE Worldwide announced the<br />

ST 925 convective and infrared<br />

system for SMT rework which<br />

combines three popular products<br />

together into one convenient,<br />

low-cost system. It is comprised<br />

of the ST 325 programmable<br />

convective/hot air rework station,<br />

the PH 100 low profile infrared<br />

preheater, and the ST 500A<br />

Z-axis platform. The system provides<br />

a 575 Watt convective topside<br />

heater plus a 1600 Watt IR<br />

bottom-side preheater which<br />

allows operators to safely rework<br />

PCBs for fast, efficient soldering,<br />

rework or repair, even on the highest<br />

mass, thermally challenging,<br />

lead-free PCBs.<br />

The system features a self-contained<br />

convective/hot air SMT rework<br />

station that is fully programmable<br />

and can be used to<br />

remove and install surface<br />

mount components. From the<br />

front panel, the system can be<br />

used in either manual or “timed”<br />

modes. Manual mode means<br />

that the system generates<br />

heated airflow when the cycle<br />

button is pressed. “Timed”<br />


modes allow the operator to create<br />

up to 20 “Profiles” that consist<br />

of time and temperature parameters<br />

to ensure process control<br />

and repeatability. The system<br />

uses a pump to generate airflow<br />

that first passes through a<br />

heater, where it is warmed to the<br />

appropriate temperature, and<br />

then through optionally available<br />

heat-focusing nozzles that<br />

“shape” the air stream for the<br />

specific component. A userfriendly<br />

front panel interface with<br />

digital display allows for easy adjustment.<br />

SMT Hybrid Packaging, Booth<br />

4A-120<br />

www.paceworldwide.com<br />

T 925 convective and infrared<br />

system for SMT rework.<br />

Vapor phase soldering with advanced<br />

batch systems<br />

IBL Technologies, LLC today announced<br />

plans to showcase its<br />

BLC 420 batch soldering machine<br />

during SMT Hybrid Packaging<br />

show in Nuremberg. The BLC<br />

reflow vapor phase soldering<br />

system is perfect for medium to<br />

high volume production, batch<br />

and inline machines. The machines<br />

offer the highest quality<br />

performance with the smallest<br />

footprint. Many patented features<br />

are available and provide a<br />

Source: PACE Worldwide<br />

wide range of flexibility, including:<br />

• Small footprint<br />

• Low power consumption<br />

• Real time temperature profiling<br />

• Intelligent Profiling System<br />

• Excellent solder quality<br />

• Fast setup<br />

• One profile for most operations<br />

The company offers a full line of<br />

single vapor batch and inline type<br />

reflow systems.<br />

SMT Hybrid Packaging, Booth<br />

4-205<br />




BENCH<br />

Full process and cost control<br />

included as standard<br />

Weller Generation WT<br />

Setting new standards in user-friendliness<br />

Best-in-class – attractive price / performance ratio<br />

Maximum flexibility – backward compatibility with<br />

existing soldering tools<br />

Weller Zero Smog TL fume extraction system<br />

WT hub connector facility for efficient integrated<br />

performance<br />

Prolonged clean air attributable to the exceptionally<br />

large filter capacity<br />

Automatic filter change notification system and<br />

audio-visual filter alarm<br />

Low sound level<br />

www.ibl-tech.com<br />

Source: IBL<br />

www.weller-tools.com<br />

BLC 420 batch<br />

soldering machine.<br />

More<br />

information<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 63


Energy efficiency has never been out of sight<br />

Investment concept<br />

with suitable systems<br />

This year, the Viessmann Group will be 100 years old. A reason to celebrate, because the leadership<br />

in Allendorf (Eder) is firmly focused on further development. Viessmann is an international<br />

leader in the manufacture of heating, industrial, and cooling systems. It is safe to say they are a<br />

leading technology company, because their products have signaled milestone after milestone in<br />

the heating industry across the decades. Now a large investment programme in electronics<br />

manufacturing has been successfully completed after a five-year run.<br />

Energy efficiency is one of the topics that has had great significance<br />

at Viessmann for a long time already. As early as ten years<br />

ago, a programme was started in Allendorf to increase energy efficiency<br />

– and it was a success. Consistent analysis and the courage<br />

to change have garnered three prizes in the German Sustainability<br />

Awards, in 2009, 2011 and 2013. The German federal government<br />

goals in energy and climate for the year 2050 – 80 % reduction in<br />

CO output and a 60 % proportion of energy from renewable<br />

2<br />

sources – were already reached by the company in 2013. The company<br />

is even using “Etanomics” to help accelerate “Energy Management”<br />

as a consulting topic and is helping other companies to<br />

implement sustainable energy concepts. The experts have clearly<br />

demonstrated that it is possible with the means currently available.<br />

Forward-looking corporate philosophy<br />

The group of companies currently employs 11,600 staff members in<br />

74 countries worldwide, with 120 branches and 22 manufacturing<br />

companies. 4,300 employees work at the headquarters in Allendorf<br />

(Eder). The company is one of three globally leading companies<br />

when it comes to heating technology. Export figures have already<br />

exceeded 55 %, with rising tendency. Europe, and especially Germany,<br />

is the strongest sales market, but global growth is significant.<br />

As part of the sustainability strategy, energy efficiency in the company<br />

is continually being increased. Of course this means all components<br />

of manufacturing are constantly examined. For example, in<br />

2012 we even tested the soldering systems in use for ten years –<br />

four V8 Reflow soldering systems from Rehm Thermal – at a location<br />

where 200 employees work in a three-shift operation. The<br />

systems were tested against the general parameters of electronics<br />

manufacturing, which have significantly changed in recent years –<br />

and of course also against the Viessmann Group’s dynamic portfolio.<br />

Development in the electronics industry has accelerated greatly.<br />

More component varieties on the market, more product varieties in<br />

the product range of the company, and shorter life cycles for the<br />

products between two and five years, all require manufacturers to<br />

Source: Rehm Thermal Systems<br />

During the Viessmann Group’s optimisation<br />

project, four SMD lines were fitted<br />

with identical soldering systems from<br />

Rehm Thermal Systems.<br />

64 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

View of a 6.7 m Rehm Thermal Systems Reflow VisionXP+<br />

soldering system with extended cooling<br />

segment and new pyrolysis technology, in the Viessmann<br />

Group electronics factory.<br />

Source: Rehm Thermal Systems<br />

Source: Rehm Thermal Systems<br />

The SMD lines were<br />

successfully started up<br />

for operation—completion<br />

of the Viessmann Group’s<br />

energy efficiency programme.<br />

have the ability to adjust to constant change. Long-running series<br />

must give way to smaller batch sizes. And this should happen<br />

quickly so that no production time is lost. The average batch size<br />

today is between 100 and 200 items. Production is characterised by<br />

“high mix low volume” and is quite challenging due to the necessary<br />

flexibility and smaller batches.<br />

So it made sense to swap the four SMD lines – the V8 Rehm soldering<br />

systems – for a set of four identical Reflow systems. This<br />

means we are flexible in our planning and able to organise each line<br />

according to available capacities, since all processes can be reproduced<br />

and quickly implemented on the other machines. The new<br />

systems also had to meet the high quality standards of Viessmann’s<br />

engineers and be able to manufacture prototypes as well as<br />

serial production.<br />

Decision assures long-term success<br />

Prior to deciding on a manufacturer, we carried out thorough market<br />

research and analysis. Which system would satisfy the requirements<br />

with regard to quality and precision?<br />

Individual components are becoming smaller and smaller, innovation<br />

cycles shorter and shorter, and requirements for automatic<br />

placement machines and soldering systems grow higher and<br />

higher. The machines must be able to adjust quickly and comfortably.<br />

Which machine fits into the production process and can keep<br />

up with the required cycle times? And for Viessmann, another important<br />

question: which machine fits into the company’s energy efficiency<br />

concept?<br />

After thorough research, market comparisons, benchmarks and<br />

tests, we finally came back to a machine from Rehm Thermal Systems<br />

from Blaubeuren near Ulm. Rehm also works on the basis of a<br />

self-imposed energy efficiency and sustainability concept, developing<br />

its own machines with a focus on this orientation. The shortlist<br />

included the new Reflow soldering system VisionXP+. Compared to<br />

the V8 system, the data is astounding.<br />

Electronics manufacturing hit its limits with cycle times on the V8.<br />

With the VisionXP+, cycle times under 25 seconds are well able to<br />

be attained. This means it is possible to reduce cycle times by 20 %.<br />

Besides this, the required energy (power, N 2<br />

) and emissions (residue,<br />

noise) were expected to reduce by 20 %.<br />

Thanks to the development of a new type of pyrolysis technology<br />

for cleansing the residue, the maintenance costs for the processing<br />

chamber can even be reduced by 50 %. With sustainability in mind,<br />

it is also important that Rehm gives a replacement parts guarantee<br />

of ten years for the VisionXP+. This means that replacement parts<br />

for repairs and maintenance are available from the manufacturer to<br />

cover the entire scope of intended use – giving planning security<br />

that is not to be underestimated. The VisionXP+ works at the cutting<br />

edge of technology, which also speaks in favour of an efficient<br />

changeover.<br />

Compared to the V8, which had a length of 5.6 meters, the VisionXP+<br />

was introduced by Rehm as a system measuring 6.7<br />

meters, with modern technology, a longer cooling section, and new<br />

pyrolysis technology, satisfying the requirements of the current market<br />

– and based on Viessmann’s Technology Roadmap Requirements,<br />

it will continue to do so.<br />

The complex development of this convection soldering system was<br />

supported by the German Environmental Foundation. In the Rehm<br />

Technology Centre in Blaubeuren, intensive testing and measuring<br />

were carried out to improve processes. Now, the vacuum chambers<br />

and pyrolysis technology deliver optimum results.<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 65


The investment project began in 2012 and benchmarks were compared<br />

from all market providers for the components of an SMD system.<br />

From each segment there remained three potential partners,<br />

with whom we ran further tests. Test production began with one of<br />

the most complex real serial boards from Viessmann’s product<br />

range. At the end of the extensive process, criteria such as supplier/<br />

manufacturer assessment, technology, energy efficiency, cost and<br />

quality were again assessed and weighted. In the end, the VisionXP+<br />

was the clear winner.<br />

Now the entire changeover has been completed. The individual lines<br />

were replaced in an annual cycle and now the fourth system has<br />

been set up, tested and handed over. Project manager Olaf Eisele<br />

from Viessmann Elektronik GmbH is happy that Rehm systems<br />

were chosen. “In the past, we already had good experiences with<br />

Rehm’s quality and service. Now we can go on in the same way.”<br />

During significant project phases, a team of experts from Rehm<br />

Thermal Systems was on location in Allendorf to monitor and support<br />

each step. There were often only two days between dismantling<br />

an old machine and starting up a new one. Production processes<br />

were to be disturbed as little as possible.<br />

“It was an enormous logistical challenge to prepare the locations for<br />

the machines with all the supply lines and connections, and then to<br />

integrate the machines into the SMD lines so that everything fit in –<br />

without interrupting production. But we did it.” Michael Hanke,<br />

Chief Customer Officer of the Rehm Group, is very satisfied with<br />

the successful project.<br />

The Viessmann Group aims at continual improvement of energy efficiency<br />

in manufacturing. The new VisionXP+ machines will contribute<br />

to implementing this.<br />

SMT Hybrid Packaging, Booth 4A-100<br />

www.rehm-group.com; www.viessmann.de<br />

Zusammenfassung<br />

Ein international führender Hersteller von Heiz-, Industrie- und<br />

Kühlsystemen verwirklicht nachhaltige Energiekonzepte mit einer<br />

zukunftsorientierten Unternehmensphilosophie. Um der Nachhaltigkeitsstrategie<br />

und der Energieeffizienz im Unternehmen gerecht<br />

zu werden, wurde nun ein großes Investitionskonzept in der Elektronikfertigung<br />

nach fünf Jahren abgeschlossen. Mit dabei sind die<br />

VisionXP+ Reflowlötsysteme von Rehm Thermal Systems.<br />

Résumé<br />

Un leader international dans la fabrication de systèmes de chauffage,<br />

industriels et autres systèmes de refroidissement réalise des<br />

concepts d‘énergie durable avec une philosophie d‘entreprise<br />

d‘avenir. Un grand concept d‘investissement dans la fabrication<br />

électronique a été mené à bout après 5 ans afin de répondre à la<br />

stratégie de développement durable et d‘efficacité énergétique<br />

dans l‘entreprise. Les systèmes de soudure par refusion VisionXP+<br />

de Rehm Thermal Systems ont participé à l’opération.<br />

Резюме<br />

Ведущий международный производитель промышленных<br />

систем обогрева и охлаждения реализует долговременные<br />

энергетические концепции с учетом философии предприятия,<br />

ориентированной на будущее. Для соответствия концепции<br />

продолжительного использования и энергетической<br />

эффективности была разработана масштабная концепция<br />

инвестирования в производство электроники в течение 5 лет.<br />

Одним из ее компонентов являются системы пайки<br />

оплавлением припоя VisionXP+ от Rehm Thermal Systems.<br />

Source: Rehm Thermal Systems<br />

From left to right: Volker Feyerabend<br />

(Apros Int. Consulting + Company<br />

Services), Olaf Eisele (Head of<br />

Manufacturing at Viessmann Group)<br />

with his project team Rüdiger<br />

Feldbusch, Thomas Finger and Hans-<br />

Werner Jeude (not pictured) and<br />

Michael Hanke (Chief Customer<br />

Officer at Rehm Thermal Systems).<br />

66 <strong>EPP</strong> <strong>EUROPE</strong> May 2017



Reducing waste dross by 85 percent<br />

EVS International, the leader in<br />

solder recovery, presented the<br />

new EVS 500LF lead-free version<br />

and EVS 8KLFHS at the<br />

2017 IPC Apex Expo, at the San<br />

Diego Convention Center in California.<br />

The simple yet ruggedly designed<br />

EVS 500LF is highly compatible<br />

with ISO14001, as it<br />

complies with the ISO mantra of<br />

Reduce – Reuse – Recycle. The<br />

system enables the customer to<br />

reduce solder consumption by<br />

up to 50+ percent, an unheard of<br />

reduction in the electronics pro-<br />

duction industry.<br />

The EVS 500 also can help to reduce<br />

de-drossing time by 75 percent<br />

and waste dross off-site by<br />

up to 85 percent. The system<br />

meshes perfectly with environmental<br />

control systems and<br />

helps to reduce customers’ carbon<br />

footprint, an important environmental<br />

imperative, by utilizing<br />

the latent heat already imputed<br />

to the dross to help the recovery<br />

process.<br />

The EVS 8KLFHS offers a capacity<br />

of 6 kg/12 lbs. Its integrated<br />

hopper makes the rapid transfer<br />

of dross simpler and safer, and<br />

speeds de-drossing time by up<br />

to 75 percent. This provides a<br />

cleaner wave with less maintenance,<br />

less downtime, and a reduction<br />

in shorts and bridging, as<br />

well as, the potential to discontinue<br />

the use of messy wave oils<br />

and/or dross reduction powders.<br />

Source: EVS<br />

EVS 500 (Lead).<br />

www.solderrecovery.com<br />

Updated control system for thermal equipment<br />

BTU International, Inc., a supplier<br />

of advanced thermal processing<br />

equipment for the electronics<br />

manufacturing and alternative<br />

energy markets, announced<br />

plans to exhibit with <strong>EPP</strong> Electronic<br />

Production Partners GmbH<br />

at SMT Hybrid Packaging. The<br />

company’s representatives will<br />

demonstrate the Pyramax reflow<br />

oven with the Wincon connected<br />

factory interface in.<br />

“Our Wincon platform has<br />

proved to be a powerful tool in<br />

delivering solutions for Industry<br />

4.0,” said Peter Tallian, general<br />

manager of the company. “Our<br />

connected factory interface and<br />

related solutions set the benchmark<br />

for Industry 4.0 implementation,”<br />

added Tallian.<br />

The solution is an advanced<br />

windows-based software system<br />

for controlling the operation<br />

of the company’s thermal pro-<br />

cessing equipment. It combines<br />

both the simplicity of a graphical<br />

user interface with powerful<br />

diagnostic and analytical tools.<br />

The system is used in conjunction<br />

with the company’s proprietary<br />

Intellimax control board on<br />

all systems; including the Pyramax<br />

family of convection reflow<br />

ovens.<br />

Intelllimax platform has been<br />

powering the company’s ovens<br />

and furnaces for the past decade;<br />

Wincon 6.0 adds support for<br />

the next-generation controller Intellimax2:<br />

a powerful, scalable<br />

and flexible control platform that<br />

delivers precise control to ensure<br />

process optimization and<br />

availability.<br />

SMT Hybrid Packaging, Booth<br />

4-551<br />

www.btu.com<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 67


The influence of clean air on the value-added chain<br />

in electronics production<br />

Technology for<br />

air purification<br />

The value-added chain – what is this actually?<br />

“The idea of the value chain is based on the process view of organizations, the idea of<br />

seeing a manufacturing (or service) organization as a system, made up of subsystems<br />

each with inputs, transformation processes and outputs”. 1 The definition of a valueadded<br />

chain by Michael E. Porter is one of many that can be found in reference books,<br />

works and on websites. In principle, it involves a sequence of activities, executed by<br />

a manufacturing company to develop, produce, sell, ship and maintain products or<br />

services.<br />

Source: ULT<br />

Stefan Meißner, Head Corporate Communications ULT AG, Loebau, Germany<br />

Three main parameters essentially influence a value-added chain:<br />

• Direct activities − research, development, production, shipment<br />

etc.<br />

• Indirect activities − maintenance, operation, occupational safety,<br />

environment etc.<br />

• Quality assurance − monitoring, test/inspection;<br />

quality management etc.<br />

In particular, indirect activities and quality assurance generate a<br />

greater part of the costs in product manufacturing. This article principally<br />

focusses on the indirect activities.<br />

Indirect activities and their influences<br />

The indirect activities within a value-added chain comprises of three<br />

subdivisions:<br />

• Maintenance – this includes production resources and rooms as<br />

well as the entirety of all systems and plants.<br />

• Product quality – this includes precision of manufacture, accuracy,<br />

functionality and cleanliness.<br />

• Occupational safety – this includes work clothing, ESD protection,<br />

injury potential and clean air.<br />

All three issues have one common factor: they depend on clean air<br />

in the production rooms. How is this the case?<br />

In modern electronics production, there is a multitude of different<br />

processes: from connection and separation technologies, surface<br />

processing such as marking, drilling, sintering and milling, the utilisation<br />

of fluxes, up to production processes such as 3D printing or<br />

rapid prototyping by means of laser, soldering, welding and gluing –<br />

all these processes generate harmful substances that might have<br />

extreme health impacts.<br />

Airborne contaminants and their impacts<br />

To put it shortly, all airborne pollutants have negative effects on employee<br />

health but also on production plants and products.<br />

Source<br />

Mobile extraction and filtration system for larger<br />

amounts of soldering fume, the LRA 1200 from ULT.<br />

1) Porter, Michael Eugene, Competitive Advantage, Free Press,<br />

New York 1985<br />

The threefold<br />

damaging effect<br />

of laser fume<br />

on humans,<br />

machines and<br />

products.<br />

Source: ULT<br />

Selection of capturing elements.<br />

Source: ULT<br />

68 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

Source: ULT<br />

In principle, airborne pollutants are classified due to particle sizes.<br />

This classification primarily focuses on the influence of emissions<br />

on the human body. In addition to the possibilities of brain damages,<br />

neurotoxic effects or airway injuries, they are differentiated in terms<br />

of being inhaling (E fraction) or alveolar (A fraction).<br />

The capture of contaminants is regulated by law in various countries.<br />

These regulations determine categories of danger for specific<br />

hazardous substances, e.g. in terms of fire and explosion risks, or in<br />

types of health damaging effects (cancerogenic, mutagenic or toxic<br />

for reproduction).<br />

Airborne contaminants may additionally have negative impact on<br />

production systems and products. Depending on technology (laser,<br />

soldering, welding, etc.), they consist of various inorganic and organic<br />

substances, which might have partly dramatic effects based<br />

on chemical reactions.<br />

Soldering fume, for instance, mainly consists of fluxes, soldering<br />

material and detergent residues, which often join up to adhesive<br />

aerosols. They also compromise machinery and products – and finally<br />

product quality − as they create firmly attached dirt layers.<br />

Contamination of electronic assemblies with tacky dusts may lead<br />

to conductor track corrosion, which can lead to partly or complete<br />

functional failure. Product quality suffers from the impact of hazardous<br />

emissions in the long term.<br />

Soldering fume<br />

extraction at<br />

manual workplace<br />

– utilisation<br />

of a suction pipe<br />

mounted on an<br />

extraction arm.<br />

Source: ULT<br />

Protecting values<br />

in electronics<br />

manufactruing by<br />

the utilisation of<br />

technology for<br />

air purification.<br />

Extraction and filtration technology and its support<br />

The early removal of airborne pollutants prevents their impact.<br />

Extraction and filtration systems provide an effective solution. The<br />

variety of systems on the market is high.<br />

Extraction and filtration units are determined by type, composition<br />

and amount of pollutants; system utilisation in automated, semiautomated<br />

and manual production as well as mobility or flexibility.<br />

Modern extraction and filtration systems clean process air to such a<br />

high degree that the purified air can be moved back to the working<br />

area. This is based upon innovative filtration concepts, which can additionally<br />

be configured to special requirements.<br />

The capturing of airborne pollutants is another decisive aspect in air<br />

purification. Closest proximity to the source of pollution is of critical<br />

importance – the closer, the better. Not only to capture the majority<br />

of all particles but to minimise economic efforts.<br />

A general rule says that twice the distance between emission<br />

source and capturing element requires four times the exhaust performance<br />

in the extraction and filter system. Capturing elements<br />

are nozzles mounted on extraction arms. They guarantee the ideal<br />

capturing of airborne contaminants.<br />

Due to pollution amount and type as well as airflow principles, they<br />

are available in various versions – up to complete housing solutions.<br />

Basically, the appropriate capturing element can deliver a substantial<br />

contribution to the quality of the extraction and filtration device.<br />

The degree of capture rate forms the basis for subsequent highgrade<br />

filtration, finally providing high overall efficiency and low residue<br />

in the returned clean air.<br />

The value-added chain and its dependence on clean air<br />

Analysis of possible impacts of airborne pollutants on indirect activities<br />

within the value-added chain shows that all three subdivisions<br />

are concerned.<br />

• Production resources and rooms must not be polluted.<br />

• Product quality and cleanliness must be guaranteed under all circumstances<br />

– restricted functionality is intolerable.<br />

• Employee protection is of highest importance – regulatory bodies<br />

determine the demands to be achieved.<br />

Extraction and filtration in electronics production goes far beyond<br />

the vacuum cleaner principle. It is not just a case of dirt removal but<br />

to eliminate hazardous substances in the air that may have negative<br />

impacts on humans, machines and products – consequently on the<br />

entire value-added chain.<br />

SMT Hybrid Packaging, Booth 5-312<br />

www.ult.de/en<br />

Zusammenfassung<br />

Damit luftgetragene Schadstoffe ihre Auswirkungen nicht entfalten<br />

können, müssen sie so früh wie möglich beseitigt werden. Absaugund<br />

Filteranlagen stellen hierfür eine effektive Lösung dar. Der Artikel<br />

zeigt den Einfluss sauberer Luft auf die Wertschöpfungskette in<br />

der Elektronikfertigung.<br />

Résumé<br />

Pour que les polluants transportés par l‘air ne puissent déployer<br />

leurs effets nocifs, ils doivent être éliminés dès que possible. Des<br />

systèmes d‘aspiration et de filtrage constituent une solution efficace<br />

pour y parvenir. L‘article montre l‘influence de l‘air propre sur<br />

la chaîne de valeur ajoutée dans la fabrication électronique.<br />

Резюме<br />

Для того, чтобы переносимые по воздуху опасные вещества<br />

не могли проявить свои свойства, их необходимо<br />

ликвидировать как можно раньше. Эффективным решением<br />

этого вопроса являются установки вытяжки и фильтрации<br />

воздуха. В статье показано влияние чистого воздуха на цепь<br />

видов деятельности, создающих добавленную стоимость, в<br />

производстве электроники.<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 69


Small is beautiful: Aros electronics shows how it‘s done<br />

Smart electronics production<br />

With only a single SMT line on which it produces highly specialized drive controllers in tiny batches,<br />

Aros electronics in Gothenburg, Sweden, is not the kind of company you would associate with terms<br />

like Industry 4.0, digitization and high-level automation. Aros is nevertheless considered a smart factory<br />

trailblazer in its home country, because it implements state-of-the-art manufacturing concepts in cooperation<br />

with ASM Assembly Systems and its Smart SMT Factory Network.<br />

environments. Aros already operated with an extremely high level of<br />

flexibility and automation on its line. They wanted to increase their future<br />

output capacity exclusively by making improvements and not by<br />

adding more machines or lines. In our talks, we realized how progressive<br />

their approach was, from the first drawings produced by the<br />

development department to the finished product.” The result was an<br />

operation that was not only very advanced, but made Aros a part of<br />

the Smart SMT Factory Network of reference sites for the Smart #1<br />

SMT Factory that ASM is currently building.<br />

Because it is implementing state-of-the-art manufacturing concepts, Aros is<br />

considered a smart factory trailblazer in its home country Sweden.<br />

If you run an electronics manufacturing plant, take a rather skeptical<br />

view of the current talk of networked production and don‘t believe<br />

that it really applies to your everyday requirements, get in<br />

touch with Per-Johan Edgren, manufacturing process manager at<br />

Swedish manufacturer Aros electronics AB. He explains his viewpoint<br />

in his extremely cordial way: “Whether you call it smart factory<br />

or something else, I am always looking for opportunities to<br />

meet my customer’s increasingly demanding requirements efficiently<br />

and on time. To accomplish this, we have developed a roadmap<br />

for our factory‘s development over the coming years. We defined<br />

improvement targets, but not the technologies for achieving<br />

them. We then showed this roadmap to partners and equipment<br />

suppliers and asked them how we can achieve these targets in<br />

stages and with minimal disruption of our everyday operations.”<br />

One of the company’s partners is SMT line solution supplier ASM, the<br />

maker of DEK printers and Siplace placement machines. Alexander<br />

Hagenfeldt, solutions marketing manager at ASM and project manager<br />

for the company’s Smart SMT Factory Network, remembers: “At<br />

first glance, this kind of inquiry was rather unusual for a producer of<br />

small and medium-sized lots. Aros didn‘t just want to buy printing and<br />

placement solutions, but was looking for sophisticated networking<br />

capabilities and optimized process integration. Fortunately, we were<br />

familiar with this type of focus from clients with large high-volume<br />

Source: ASM Assembly Systems<br />

Clearly formulated objectives<br />

Aros electronics AB is a member of Van de Wiele Group, a technology<br />

enterprise with sales of almost 400 million euros. The 135 employees<br />

bring in 34 million Euros of this amount by developing and<br />

manufacturing highly specialized controllers for drive solutions,<br />

power electronics and embedded systems for the automotive and<br />

mechanical engineering industries. Per-Johan Edgren explains: “Our<br />

company has long been known for innovative, high-quality developments.<br />

But since the demands on quality, flexibility and speed are<br />

getting tougher all the time, particularly in the automotive field, we<br />

wanted to become even better.”<br />

The company formulated ambitious goals and developed a roadmap<br />

for achieving them. It called for a zero-defect philosophy in addition<br />

to a central planning instance, advanced user guidance, and highly<br />

automated continuous flow production with minimal manual operations<br />

from introducing the new product to packaging it.<br />

Alexander Hagenfeldt of ASM: “I am impressed by the sense of purpose<br />

and the speed with which Aros is upgrading its production.<br />

Our technicians visit the factory in Gothenburg regularly, and each<br />

time they go there something has changed. But the line is always<br />

running at full speed.”<br />

Barcodes contain everything<br />

A laser applies a unique ID and barcode to each board that enters the<br />

line. The entire line is also equipped with dual asynchronous conveyors,<br />

i.e. they operate separately of each other. That way, the plant<br />

can run large batches of high-volume products and small lots or single<br />

prototypes side-by-side. If an order calls for unusually large boards,<br />

the two tracks can be combined to form a single wide conveyor.<br />

Shuttles and conveyors ensure that a board does not have to be<br />

touched by human hands after it has entered the line. The boards run<br />

first through the laser-marking machine before a shuttle transports<br />

them to one of two tracks that take them through two DEK printers<br />

(one per track), each of which is linked to an ASM ProcessExpert<br />

70 <strong>EPP</strong> <strong>EUROPE</strong> May 2017


Every square meter of production<br />

floor space is precious, which is<br />

why complex transport systems<br />

are used to move the circuit boards<br />

around.<br />


The whole line features state-of-the-art operator guidance, an absolute necessity<br />

in a high-mix production environment.<br />

system. Per-Johan Edgren: “We expect the ASM ProcessExpert<br />

systems to provide huge benefits. At this time we use them as<br />

high-quality 5D SPI quality control systems and to run DFM checks<br />

for new products. We are already very impressed by them, and we<br />

plan over the medium term to let them control the printers and their<br />

process parameters completely autonomously.”<br />

One of the first things that visitors notice is how crowded the plant is.<br />

Since floor space is expensive, it must be used as effectively as possible,<br />

which is why complex transport systems are used to move the<br />

circuit boards around. For example, the two DEK printers and their<br />

ASM ProcessExpert system are arranged in a row, with one track<br />

using lifts and conveyors to route the boards over the other machines.<br />

The SMT line itself is arranged in a U-shape. After the boards have<br />

been printed, a lift and shuttle system routes them over a walkway<br />

before they enter the placement machines on two tracks.<br />

The placement line consists of six Siplace SX1 machines, five of<br />

which are equipped with a flexible CPP head. The end-of-line machine<br />

features a TwinHead for large components, connectors and<br />

odd shapes. When the boards leave the line, they run on two separate<br />

tracks through two ovens before two inline AOI systems perform<br />

the quality control. This is followed by special processes like<br />

THT, selective soldering, encapsulating, and additional IC tests.<br />

Source: ASM Assembly Systems<br />

Source: ASM Assembly Systems<br />

A global network of digitized<br />

electronics production<br />

ASM Assembly Systems, the SMT solution provider for electronics<br />

manufacturing plants, is rapidly advancing its developments in the<br />

field of smart SMT factory applications. To show what is possible and<br />

how electronics plants can transform themselves step-by-step into<br />

smart SMT factories irrespective of their initial situation, size, production<br />

type of location, ASM is building a global Smart SMT Factory<br />

Network that will bring together users and partners and support them<br />

on their move to the smart SMT factory.<br />

At its center will be ASM‘s SMT Centers of Competence, which will<br />

promote programs, host meetings and coordinate joint smart factory<br />

projects of ASM, customers and partners. Together they will develop<br />

concrete solutions and implement them step-by-step. At the same<br />

time, the global Smart SMT Factory Network will show what‘s already<br />

possible and what effect technological innovations, automation and<br />

integrated processes will have on relevant performance indicators in<br />

SMT production. Interested customers can visit plants in the Smart<br />

SMT Factory Network and benefit from exchanging information and<br />

experiences with others. At the same time, the www.smart-smt-fac<br />

tory-forum.com will continuously report on the progress.<br />

Membership in the Smart SMT Factory Network will be based on a<br />

mix of factors like location, production model, size, applications/industry,<br />

OEM/EMS and others to represent to whole diversity of the electronics<br />

manufacturing industry. All member companies will have a<br />

clear vision of their factory’s future as well as of the goals they want<br />

to reach. They will also have the desire to embark on the road to the<br />

smart SMT factory together with ASM.<br />

“This network, the first of its kind, represents all facets of our industry.<br />

We already see that building a smart SMT factory requires an entirely<br />

new level or cooperation between electronics manufacturers<br />

and equipment vendors. Both sides have to open themselves to their<br />

partners and divulge much more of their objectives, plans and capabilities<br />

than in normal projects. This is not just selling projects or machines,<br />

but real partnership,” explains Alexander Hagenfeldt, solutions<br />

marketing manager and project manager for the Smart SMT<br />

Factory Network at ASM Assembly Systems.<br />

Special software provides transparency<br />

The progress of a circuit board can be tracked not only on the line.<br />

Anywhere in the company, users can call up an Aros-developed program<br />

that displays the line, its dual conveyors and the boards moving<br />

along them with their barcode IDs. Clicking on a board shows<br />

additional real-time information about the underlying order as well<br />

as all process parameters. The user can even call up for each board<br />

the associated SPI images, the placement program, and the reflow<br />

oven‘s heat profile. This is made possible because each board is<br />

identified before it enters a line component so that its UID can be<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 71


Per-Johan Edgren: “We could have increased<br />

our output by adding more gantries to the<br />

Siplace SX machines, but our goal was to<br />

improve flexibility and throughput through<br />

process integration and automation.”<br />

Source: ASM Assembly Systems<br />

linked to the process data in the database. Clicking on a machine<br />

shows its current settings. “We plan to make this data available to<br />

our customers in the foreseeable future. At this time, we use this<br />

additional transparency to control and optimize our flexible production,”<br />

explains Per-Johan Edgren.<br />

Each side of the line runs with a different setup<br />

concept<br />

The company has the ability to produce even the smallest lots efficiently<br />

by combining Siplace material flow and setup planning tools<br />

with innovative concepts.<br />

One side of each placement machine has a fixed setup with standard<br />

components. Operators splice the reels for each feeder as instructed<br />

by the ASM Line Monitor. “The whole line features stateof-the-art<br />

operator guidance. The Line Monitor shows the operator<br />

when and where he or she needs to splice or switch out a feeder in<br />

order to keep the line running. Over the coming weeks, we will<br />

combine the information from the Line Monitor with the data in our<br />

own software. On the active feeder rack in the kitting area, for<br />

example, the LEDs tell the operators what to do. And in the THT<br />

area, we display instructions on the workstation monitors. I am convinced<br />

that such support and guidance tools are an absolute<br />

necessity in a complex and high-mix production environment like<br />

ours. Without them, you would undoubtedly have lots of mistakes<br />

and line stops,” explains Edgren.<br />

On the other side of the line, the remaining components are set up<br />

via changeover tables. This combination of fixed and flexible setups<br />

minimizes the setup effort and accelerates product changeovers.<br />

While the setup is being changed on a machine, the rest of the line<br />

can keep running. The machine reads the barcode ID of each board<br />

and adjusts the support pins and conveyor rails automatically.<br />

All component logistics and setup family planning operations, the<br />

component storage systems, the line-adjacent Siplace Material<br />

Tower and the setup preparation procedures are controlled via the<br />

Siplace Material Manager and the Siplace Material Setup Assistant.<br />

When changeover tables come back from the line, LEDs indicate<br />

whether the operator can leave a feeder in place, move it to the active<br />

feeder rack, or tear it down and return the components to the<br />

material storage area. This saves on trips and minimizes the number<br />

of withdrawals and returns from/to the main warehouse.<br />

Process improvements alone deliver huge productivity<br />

increases<br />

Aros’s roadmap extends through 2021, but the success of the improvements<br />

is already measurable today. For example, the company<br />

used to run three shifts, each with eight workers on the shop floor.<br />

Today, it runs only two six-hour shifts with four people each while<br />

placing 50 percent more components per shift. The company installs<br />

between 2 and 2.5 million components per week on roughly<br />

220 active products, many of which are dual-sided.<br />

Per-Johan Edgren: “We could have increased our output by adding<br />

more gantries to the Siplace SX machines, but this would only alleviate<br />

a few process weaknesses while creating bottlenecks somewhere<br />

else. Our goal was to improve flexibility and throughput<br />

equally through process integration and automation. We are convinced<br />

that we can double our production performance once more.<br />

For example, we will install a robot that distributes the boards to the<br />

different IC test stations. We will also upgrade our final assembly<br />

and packaging operations to a continuous-flow model that operates<br />

in tandem with the SMT production. Our goal is to have each board<br />

packaged and ready for shipping within 24 hours after it has received<br />

its barcode, even with lot sizes of 1.”<br />

SMT Hybrid Packaging, Booth 4-219 + 4-309<br />

www.siplace.com; www.aros.se<br />

Zusammenfassung<br />

Mit einer einzigen SMD-Linie produziert Aros electronics aus<br />

Schweden hoch spezialisierte Antriebsregler in Kleinstmengen.<br />

Daher gehört es nicht unbedingt zu den Unternehmen, die man mit<br />

Industrie 4.0, Digitalisierung und höchste Automatisierung in Verbindung<br />

bringen würde. Dennoch ist das Unternehmen ein Wegbereiter<br />

in Bezug auf Smart Factory, da es ein State-of-the Art-Produktionskonzept<br />

in Zusammenarbeit mit ASM Assembly Systems<br />

erfolgreich implementiert hat.<br />

Résumé<br />

Sur une seule ligne CMS, Aros electronics de Suède produit en<br />

toutes petites quantités des servo-variateurs hautement spécialisés.<br />

Ainsi, elle ne compte pas obligatoirement parmi les entreprises<br />

que l‘on associerait à Industrie 4.0, le concept de numérisation<br />

et d‘automatisation le plus poussé. Toutefois, l‘entreprise est<br />

pionnière en matière d‘entreprise intelligente, ayant implémenté<br />

avec succès un concept de production de pointe en coopération<br />

avec ASM Assembly Systems.<br />

Резюме<br />

С помощью единственной SMD-линии компания Aros electronics<br />

из Швеции производит сверхмалые серии<br />

высокоспециализированных регуляторов приводов.<br />

Соответственно, эта компания не относится к тем, которые<br />

можно было бы связать с промышленностью 4.0, переходом<br />

на цифровые технологии и высокой степенью автоматизации.<br />

Тем не менее, компания является пионером в развитии<br />

«умных фабрик» (Smart Factory), так как в сотрудничестве с<br />

компанией ASM Assembly Systems она успешно внедрила<br />

сверхсовременную концепцию производства.<br />

72 <strong>EPP</strong> <strong>EUROPE</strong> May 2017


Panoramic view of the main assembly room at MB Elettronica, including four Yamaha SMT lines.<br />

Source: Yamaha<br />

The right balance of human qualities and advanced automation<br />

Advanced technology<br />

Tuscan Manufacturing Services Specialist, MB Elettronica, has consistently chosen Yamaha<br />

SMT equipment to provide a technological edge that complements the company’s investment in<br />

its people. CEO Roberto Banelli believes successful manufacturing in Europe depends on<br />

keeping the right balance between the human abilities to visualise and adapt, and technological<br />

innovation to handle state-of-the-art processes cost-effectively.<br />

The company was formed in 1988 in Cortona, near Arezzo in Tuscany,<br />

Italy, and became one of the country’s first surface-mount<br />

electronic manufacturing services businesses. In fact, its history<br />

reaches back further, to 1961, when Roberto’s father Francesco Banelli<br />

started the firm Cafel, assembling mechanisms for consumer<br />

audio products. As MB Elettronica embraced the new surfacemount<br />

technology, the new company grew with the emerging<br />

contract electronics manufacturing sector. Typical contracts involved<br />

building high-quality assemblies in large numbers – usually several<br />

thousand units each – for a select few customers.<br />

As the pattern of manufacturing in Europe changed dramatically in<br />

the 1990s, the company adapted by advancing its capabilities and<br />

reaching out to the new generation of high-tech businesses; small,<br />

dynamic, innovative, and pushing the boundaries in specialist fields<br />

such as railway control and signaling, medical technology, highspeed<br />

telecommunications, and aerospace.<br />

Central to its ability to address these new opportunities, the company<br />

had invested in advanced manufacturing technology. In 1995,<br />

one of the world’s first surface-mount placement platforms to feature<br />

on-board machine vision took its place on the factory floor in<br />

Cortona, boosting the company’s ability to deliver extremely high<br />

quality assemblies quickly and cost-effectively. The purchase of that<br />

machine, a Yamaha Comet, was an important part of a sustained investment<br />

in technology and people that has powered the company<br />

to its present position, with annual sales now exceeding €32 million.<br />

Capabilities, and the human dimension<br />

The company’s wide-ranging in-house skills now permit a complete<br />

portfolio of lifecycle services, beginning with proof of concept work<br />

and rapid prototyping, as well as Design for Manufacture (DFM),<br />

component engineering, materials management, re-engineering,<br />

redesign, and repair and maintenance. “Our engineering services<br />

have saved customers not only many Euros but also valuable cubic<br />

centimeters inside enclosures through improvements to aspects<br />

like board layout, component selection, and power consumption,”<br />

explains Roberto Banelli. As far as surface-mount product manufacturing<br />

is concerned, services range from straightforward board assembly<br />

to complete box-build, leveraging extensive in-house skills<br />

including wiring and designing and assembling high-quality cables<br />

and harnesses. “Cabling is in our DNA, from the 1960s, so it is natural<br />

that this should differentiate our box-build offer. We also offer<br />

cable assembly as a specialist service in its own right,” he adds.<br />

By continuous investment in capabilities, the company has built a<br />

broad portfolio of competencies including conformal coating, rework<br />

including BGA packages, and the use of structural adhesives.<br />

Massimo Morandi, Site Manager takes up the story. “Our customers<br />

often require electronic assemblies to operate in harsh environments<br />

for long periods, frequently up to 10 years or more. Our competencies<br />

with coatings, adhesives, and other processes give us<br />

many options to ensure ruggedness and reliability.”<br />

Highlighting the company’s extensive test-engineering capabilities,<br />

he lists Keysight, Seica, HP, and Spea in-circuit board test capabilities,<br />

as well as flying-probe, boundary scan, and custom functional<br />

test among the techniques on offer. “We can also offer materialsmanagement<br />

services as well as component-level traceability. This<br />

is supported through our custom-developed manufacturing-management<br />

software, which passes information seamlessly between<br />

our automated assembly equipment and enterprise systems.”<br />

Perhaps one of the most remarkable facilities at MB Elettronica’s<br />

Cortona factory is the well-equipped ISO Class-8 space-qualified<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 73


clean room with facilities including surface-mount assembly, vapourphase<br />

soldering, automatic optical inspection (AOI), and microscopy.<br />

This provides the cornerstone of the company’s advanced capabilities<br />

for space projects, capable of specialised processes such<br />

as baking, degolding, pre-tinning, and pre-forming.<br />

Moreover, in addition to ISO 9001 and 9100 quality approvals, the<br />

company has also recently been awarded International Railway Industry<br />

Standard (IRIS) and ISO-TS certifications. “We can demonstrate<br />

the highest credentials for building and handling electronic assemblies<br />

for the most demanding industries,” confirms Roberto Banelli. “We<br />

are also very proud of the standards our staff have achieved, which include<br />

important industry accreditations such as IPC-A-610, and ECSS<br />

(European Cooperation for Space Standardization).”<br />

The company’s investment in skills and training reflects the Banelli<br />

family’s belief in balancing human qualities with advanced technologies.<br />

“We value highly the experience and knowhow of our longstanding<br />

employees, and at the same time seek to encourage<br />

young talent to grow with the organisation. The enthusiasm and<br />

openness of youth are vital to keep the business moving forward,<br />

and we encourage this in several ways,” explains Roberto Banelli.<br />

Not the least of these is the MB Elettronica industrial mentoring<br />

scheme. Each year, this scheme gives 20 young people the chance<br />

to come and spend time with the company’s experts, and to follow<br />

practical and theoretical courses. Their time ends with an<br />

examination. “Achieving a good score adds value to the time spent<br />

with us.”<br />

State-of-the-Art surface mount<br />

In all, MB Elettronica has 4,000 m 2 of factory space, organised on<br />

two levels. While the upper level houses support services, the<br />

ground level is dominated by four surface-mount assembly lines.<br />

Driving each one, inline Yamaha YS12 and YS12F mounters deliver<br />

total placement capacity of 200,000 components per hour. Roberto<br />

Banelli explains the decision to extend his company’s partnership<br />

with Yamaha, “Our first Comet mounter gave us a technical edge in<br />

the mid-1990s, and we were delighted to find Yamaha still setting<br />

the pace in 2014 as we planned this significant upgrade and expansion<br />

of the factory’s facilities.”<br />

The Yamaha platforms can place package types down to 0402 metric<br />

(01005) chip-size devices, and the YS12F can handle components<br />

up to 45 mm x 100 mm and 15 mm high, including challenging components<br />

such as large QFPs, surface-mount electrolytic capacitors,<br />

or long board-mounted connectors. By featuring the company’s<br />

multi-angle camera system for component verification and alignment,<br />

these state-of-the-art mounters ensure extremely high placement<br />

accuracy, even with ultra fine-pitch components. In addition,<br />

the company’s Multiple Accuracy Compensation System (MACS)<br />

corrects automatically for machine variables to maintain consistent<br />

3-sigma accuracy within ±5 μm.<br />

The high mix of specialised products MB Elettronica is now building,<br />

typically in small numbers of a few tens or hundreds of units,<br />

demands extremely flexible equipment and processes. The<br />

mounters are engineered for fast and easy setup, with features to<br />

streamline program generation and with the added advantage of intelligent<br />

electric feeders with built-in component identification.<br />

The Cortona surface-mount lines are fed by Yamaha printers, including<br />

YSP high-speed printers and the compact YCP10. The YCP10 accepts<br />

the same PCB-size range as the YSP, up to 510 mm x 460 mm,<br />

in a highly space-efficient 1.13 m x 1.76 m machine footprint. Powerful<br />

features shared by the two types include built-in barcode monitoring<br />

for efficient setup, as well as Yamaha’s 3S Swing Single-<br />

Squeegee head and automatic Filling Adjust that ensure consistent<br />

aperture filling on every print stroke. The 3S head allows continuous<br />

variation of the squeegee angle, and Filling Adjust compensates for<br />

the effects of stencil cleaning. In addition, the YSP and YCP10 come<br />

with powerful options such as wide-view print inspection and badmark<br />

transfer that shares information with downstream equipment<br />

to help minimise waste and boost productivity.<br />

Inline mounters YS12<br />

(left) and YS12F (right)<br />

deliver total placement<br />

capacitiy of 200,000<br />

components per hour.<br />

Source: Yamaha<br />

Source: Yamaha<br />

74 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

Support to optimise efficiency<br />

The investment made by MB Elettronica in advanced technology<br />

spreads throughout the entire factory floor. Six automated component<br />

tower systems are clustered to store and manage components,<br />

helping operators quickly gather the parts they need and<br />

minimise feeder setup times.<br />

As the business evolved and expanded into the new millennium, including<br />

growing capacity by investing in the new high-speed Yamaha-based<br />

lines in 2014, Roberto Banelli and his management team<br />

identified the need to reorganise the factory floor to make the most<br />

of the space and increased production capacity. In the summer of<br />

2016, they decided the time was right to go ahead. Supported by<br />

partners, including the company as the single biggest capital equipment<br />

supplier, the project was completed within just two weeks, including<br />

complete renovation of the factory’s floor. “We absolutely<br />

had to complete this ambitious project within a two-week time<br />

window, to be ready to deliver the first batch of a new product for<br />

one of our customers in September,” says Massimo Morandi. “The<br />

support we received from Yamaha and Mancini, the Yamaha representative<br />

here in Italy, was tremendous. I would say it was pivotal in<br />

enabling us to meet the ambitious timetable we set for ourselves.”<br />

MB Elettronica continues to look forward, investing in advanced<br />

technologies and capabilities, building close partnerships with suppliers<br />

such as Yamaha, and helping to develop tomorrow’s engineers<br />

and production experts. Increasing international business development,<br />

directed by International sales and finance head Daniela Banelli,<br />

is the next important goal for this ambitious company. Currently,<br />

about 20% of sales come from outside Italy, and this is expected<br />

to increase as the company keeps investing in the technology<br />

and skills to move forward.<br />

SMT Hybrid Packaging, Booths 4-229 and 4-321<br />

www.yamaha-motor-im.eu; www.mbelettronica.com<br />

Zusammenfassung<br />

Ein italienischer EMS-Dienstleister hat sich immer wieder für SMT-<br />

Equipment von Yamaha entschieden, um sich einen technologischen<br />

Vorteil zu verschaffen, der die Investitionen des Unternehmens<br />

in seine Mitarbeiter ergänzt. Eine erfolgreiche Elektronik-<br />

Produktion in Europa ist wesentlich von einem ausgewogenen Verhältnis<br />

aus der menschlichen Beobachtungs- und Lernfähigkeit einerseits<br />

und technologischer Innovation andererseits abhängig.<br />

Résumé<br />

Un prestataire de services de fabrication de produits électroniques<br />

italien n‘a cessé de choisir l‘équipement SMT Yamaha pour obtenir<br />

un avantage technologique en complément des investissements en<br />

personnelde son ‚entreprise. Comme le montre l‘article, la réussite<br />

de la production électronique en Europe dépend pour l‘essentiel<br />

d‘un rapport équilibré entre d’une part la capacité humaine d‘observation<br />

et d‘apprentissage et d’autre part l‘innovation technologique.<br />

Резюме<br />

Итальянский поставщик услуг EMS вновь и вновь выбирает<br />

SMT-оборудование производства Yamaha, чтобы обеспечить<br />

технологическое преимущество, которое дополнит инвестиции<br />

предприятия в своих сотрудников. Успешное производство<br />

электроники в Европе в значительной степени зависит, с<br />

одной стороны, от выверенного соотношения способности<br />

человека наблюдать и учиться, а с другой стороны — от<br />

технологических инноваций, как следует из статьи.<br />

High-speed printer YSP (left) and<br />

the compact printer YCP10 (right).<br />

Source: Yamaha<br />

Source: Yamaha<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 75


Advanced manufacturing process for mixed-product technology boards can minimize soldering defects<br />

Solder fortification with preforms<br />

for better pin-in-paste joints<br />

Although many have predicted the demise of through-hole components, they are alive and well with tens of<br />

billions parts assembled each year. In many cases, these components are manufactured using wave soldering.<br />

However, in many mixed product technology board assemblies (i.e. SMDs – surface mount devices – and throughhole<br />

parts on the same board), it makes sense to consider assembling the through-hole elements with the<br />

pin-in-paste (PIP) process. For the advancement of this procedure, solder preforms in the Solder Fortification<br />

techniques can be used. In some applications, soldering defects were reduced by 95 % after implementing<br />

the preforms.<br />

Carol Gowans, Paul Socha, Ronald C. Lasky, Ph.D., P.E., Indium Corporation, Clinton, NY, USA<br />

Source: Indium<br />

The soldering technology pin-in-paste has been successfully used<br />

for several decades now. However, in many cases it is not possible<br />

to print enough solder paste to obtain acceptable solder joints<br />

for this technology. In addition to this “solder starved” condition,<br />

the large quantity of solder paste used to form the through-hole<br />

joints can result in excess residual flux supplied with the paste. This<br />

residual flux may lead to difficulties in in-circuit testing (ICT) of the<br />

board assemblies, and also rise potential concerns in regard to surface<br />

insulation resistance issues.<br />

Solder preforms come in<br />

many shapes and sizes.<br />

PIP preforms<br />

are supplied<br />

in tape & reel<br />

feeder packaging.<br />

In light of the need to overcome these manufacturing problems,<br />

solder preforms have been developed. These slugs of solder typically<br />

come in the same sizes as 0402, 0201, 0603, and 0805 passive<br />

parts. The solder preforms are set down by the already existing<br />

component placement machines onto the before stencil-printed<br />

solder deposit. This additional solder assures that an adequate<br />

solder joint is formed with a minimum of solder paste and its residual<br />

flux.<br />

Although PIP was an early application of solder preforms, more recently<br />

other “solder starved” applications have emerged such as<br />

radio frequency (RF) shields for PCB circuitry and connectors. In addition,<br />

the use of ultra-thin stencils in the assembly of miniaturized<br />

components can result in some other components being solder<br />

starved and, hence are candidates for solder performs. So let’s have<br />

a look at the design and assembly techniques for using of preforms<br />

in the main Solder Fortification application areas. Several successful<br />

implementations have already been provided. In some of these applications,<br />

defects were reduced by 95 % after employing solder<br />

preforms.<br />

The pin-in-paste process<br />

Through-hole technology still remains important<br />

in all kinds of state-of-the-art electronics.<br />

There are several reasons for this<br />

fact; one being that some components or<br />

connectors might only be available in<br />

through-hole technology, but more likely<br />

the mechanical strength of more solid<br />

through-hole connections is critical for longterm<br />

reliability in many applications.<br />

As an example, a laptop PC usually has<br />

multiple USB, power, video, audio, and internet<br />

connectors. Many of these connectors<br />

need the strength of through-hole connectivity<br />

to withstand the multiple plugging<br />

and unplugging in their service life. Often<br />

these connectors are few in number and a<br />

full wave solder process to assemble them<br />

may not make economic sense. In such<br />

Source: Indium<br />

76 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

situations, as an alternative to the standard wave soldering, selective<br />

wave soldering may be an appropriate choice, or perhaps the<br />

pin-in-paste (PIP) process. The pin-in-paste process involves printing<br />

solder paste near or over the through-hole object. The through-hole<br />

component is placed and reflow soldered with the surface mount<br />

devices (SMDs). The development of an effective PIP process is discussed<br />

in references 1) and 2) . PIP is usually performed with no-clean<br />

solder paste.<br />

In many applications, PIP has several challenges. One being that so<br />

much no-clean solder paste has to be used to obtain an effective<br />

solder joint, that excessive residual flux can make electrical in-circuit<br />

testing (ICT) difficult. Another challenge of the PIP process is solder<br />

starvation which occurs because it is often not possible to print<br />

enough paste to form a complete solder joint. Even if a solder joint<br />

of this nature passes the procedures of the standard ANSI/<br />

J-STD-001C, many manufacturers and their customers would be<br />

dissatisfied with the quality of and potential reliability issues with<br />

such solder joints. The use of solder preforms to support the PIP<br />

process can mitigate both of these problems.<br />

Solder preforms are stamped from rolled solder ribbon to the desired<br />

XY dimensions. Preforms are available in numerous shapes,<br />

sizes and alloys and are specifically designed to deliver an exact<br />

quantity of solder to a desired location. Typically solder preforms to<br />

support the PIP process are rectangular in shape and are the size of<br />

common passive components (e. g. 0201, 0402, 0603, etc.) so that<br />

they can be put in position by component placement machines.<br />

These preforms come in tape & reel feeder packaging. The solder<br />

preform process for through-hole connectors on mixed-technology<br />

boards utilizes current equipment and process expertise. A typical<br />

example follows:<br />

Step 1: Solder paste is printed at the site of the connector pin. The<br />

solder paste deposit may be an overprint to provide a wicking path<br />

for the preform. For example, a preform can be placed in the overprint<br />

portion and during reflow the preform solder will wick to the<br />

pin. Additional flux is not required because sufficient fluxing activity<br />

is available in the solder paste.<br />

Step 2: Preforms are placed in the solder paste using automated<br />

placement equipment. The preform shape may be a washer or a<br />

0603 segment.<br />

To achieve excellent results with the solder preform plus solder<br />

paste solution, the paste is printed and the preform is located on<br />

the paste with a component placement machine. The benefits<br />

were:<br />

• Full barrel fill that is easily inspected<br />

• No loss of throughput<br />

• Elimination of step stencil with reduced defects at fine-pitch devices<br />

• Reduction of overprint, which eliminated solder beads and balls<br />

• Increased flexibility for future designs<br />

This process achieved good hole-fill and ease of inspection of the<br />

solder joints. While PIP was an early adaptor of preforms, more recent<br />

Solder Fortification applications may actually be more popular.<br />

Two of these applications follow.<br />

A mobile phone circuit with two Faraday shields.<br />

The SAC preform is put in position by the component placement machine.<br />

0603 preform used in the application.<br />

Grounding of mobile phone shields<br />

Most of us probably don’t think about it, but a mobile phone is really<br />

a radio. As a sophisticated radio, it is very susceptible to stray electromagnetic<br />

(EM) waves or electrostatic discharge (ESD). These<br />

threats could potentially cause serious malfunctions. In light of this<br />

concern, mobile phone designers encase the most EM/ESD sensitive<br />

components in the mobile phones in Faraday shields. To assemble<br />

these shields to the board circuit, solder paste is printed<br />

onto the receiving pads and the metal shields are attached during<br />

the normal reflow soldering procedure. Due to the miniaturization<br />

and increased functionality of mobile phones, in some designs it is<br />

difficult to print enough solder paste to electrically connect the<br />

shield to the pad on the board assembly so that the shield can successfully<br />

perform its ESD and EM protection duties. Solder preforms<br />

were proposed as a potential solution to such solder starved<br />

conditions. In these processes, the component placement machine<br />

puts the preforms in position.<br />

The SAC (tin-argentum-copper) preform is typically the size of an<br />

0603 passive component. The volume of this preform should be calculated<br />

to deliver the needed amount of solder. Tape & reel feeder<br />

packing is typically used in this application for the preforms. After<br />

Source: Indium<br />

Source: Indium<br />

Source: Indium<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 77


The process flow for<br />

shield assembly with<br />

solder preforms.<br />

Source: Indium<br />

the solder paste is printed, a chip shooter places the tiny passives<br />

and small components. An component placer puts the ICs in place<br />

and later the shields. The solder preforms are then arranged by the<br />

IC placer. After these steps, the PCBA goes into the reflow oven.<br />

It is possible, but not likely, that the placement of the preforms<br />

could slow the IC placer down. These types of applications have<br />

been implemented with high yields and reliability. In conclusion,<br />

solder preforms enable a low cost, reliable solution to solder starvation<br />

in Faraday shield assembly for mobile phones. In addition,<br />

the process is part of the in-line electronics board assembly and the<br />

final result is not visible to the end user.<br />

Capacitor terminal applications<br />

Terminals of large capacitors can also experience solder starvation.<br />

In one such application, 0603 size preforms were placed near the<br />

capacitor terminals. In this application, the number of solder-starved<br />

related defects was reduced by 95 % after using preforms.<br />

Conclusion<br />

Solder preforms can be an economical way to solve solder starved<br />

conditions in various types of SMT (surface mount technology) assembly<br />

applications. It is always best to consult with the technical<br />

support team at your solder supplier to be sure that the correct<br />

solder, solder form, and flux best suit your application.<br />

SMT Hybrid Packaging, Booth 4-321<br />

www.indium.com<br />

References<br />

1) Lasky, R. C.; Jensen, T.; Practical Tips in<br />

Implementing the “Pin in Paste” Process, at<br />

SMTAI, Chicago, IL, Sept. 2002.<br />

2) Berntson, R. B.; Lasky, R. C.; Pfluke, K. P.;<br />

Through-Hole Assembly Options for Mixed<br />

Technology Boards, SMT Magazine, Aug.<br />

2004.<br />

Portions of this information were presented at<br />

SMTAI 2010 in Orlando, FL, and APEX 2011.<br />

Zusammenfassung<br />

Bedrahtete Bauteile, meist Passive, werden oft im Wellen oder Selektivlötverfahren<br />

mit dem Board verbunden. Sind jedoch auf Baugruppen<br />

sowohl oberflächenmontierbare als auch bedrahtete Komponenten<br />

gleichzeitig eingesetzt und wird per Reflow zusammen<br />

gelötet und die bedrahteten Teile vorzugsweise oft im Pin-in-Paste-<br />

Prozess verarbeitet. Allerdings gibt es dabei immer wieder Applikationen,<br />

in denen dafür das vorher auf die Leiterplatte aufgedruckte<br />

Lotdepot nicht ausreicht. Mit Lot-Preforms wie Solder Fortification,<br />

also dem Einsatz vorbereiteter Lotelemente, bietet sich hier eine<br />

ausgezeichnete Lösung. Es gibt Applikationen, in denen die Lötdefekte<br />

um maximal 95 % reduziert werden konnten.<br />

Résumé<br />

Les composants câblés, généralement passifs, sont souvent assemblés<br />

à la carte par soudage à la vague ou par soudage sélectif.<br />

Des composants câblés en surface et des composants câblés et<br />

soudés par refusion et les parties câblées sont de préférence soudées<br />

à l’aide de la technologie pin-in-paste. Cependant il existe<br />

toujours des applications dans lesquelles un dépôt de soudure sur<br />

le circuit imprimé ne suffit pas. Les préformes telles que Solder<br />

Fortification, donc l‘utilisation d’éléments de soudage préfabriqués,<br />

apportent une solution excellente. Il existe des applications dans<br />

lesquelles les défauts de soudage peuvent être réduits de 95 %<br />

maximum.<br />

Резюме<br />

Компоненты с проводкой, чаще всего пассивные, часто<br />

соединяются с платой при помощи пайки волной припоя или<br />

селективной пайки. Если же в узлах одновременно как<br />

компоненты с поверхностным монтажом, так и с проводкой,<br />

которые спаиваются при помощи пайки оплавлением припоя,<br />

то компоненты с проводкой предпочитают часто обрабатывать<br />

по технологии PIP. Тем не менее, всё же существуют варианты<br />

применения, при которых ранее нанесенного на печатную<br />

плату запаса припоя недостаточно. В этом случае<br />

потребителям предлагается превосходное решение благодаря<br />

мерам подготовки к пайке, таким как укрепление пайкой, то<br />

есть использованию подготовленных элементов для пайки.<br />

Существуют определённые задачи, в которых можно<br />

уменьшить количество дефектов пайки как максимум на 95 %.<br />

78 <strong>EPP</strong> <strong>EUROPE</strong> May 2017



100% process control for selective soldering system<br />

SEHO Systems GmbH, a manufacturer of<br />

complete solutions for soldering processes<br />

and automated production lines, will focus<br />

on automatic process control at the upcoming<br />

SMT Hybrid Packaging show, scheduled<br />

to take place May 16–18, 2017 at the Messe<br />

in Nuremberg, Germany. The selective soldering<br />

system SelectLine-C has been even<br />

further optimized.<br />

The company will introduce its new cross<br />

sensor at the exhibition that takes over several<br />

functions. On the one hand, the wave<br />

height is precisely controlled. The measurement<br />

is made touchless directly at the solder<br />

nozzle and it is fully independent from the<br />

solder alloy used. In addition, the cross sensor<br />

is also used for automatic tool measurement:<br />

diameter, height and mounting position<br />

of the solder nozzle are automatically<br />

controlled, thus excluding potential operator<br />

errors. Also new, being introduced for the<br />

first time is an automatic nitrogen flow quantity<br />

control.<br />

The company offers the opportunity to integrate<br />

additional processes directly into its selective<br />

soldering systems. This includes, for<br />

example, a brush system for solder joint<br />

cleaning or an AOI system for automatic detection<br />

of soldering defects. The benefits are<br />

obvious: no additional floor space is required<br />

in the production area. At the same time, production<br />

costs will be reduced as the entire<br />

board handling is performed by the axes systems<br />

that are integrated in the selective soldering<br />

machine anyway.<br />

By adding an intelligent handling concept, assemblies<br />

that have been identified as defective<br />

can automatically be removed from the<br />

Tool measurement will be shown at SMT.<br />

production line. The new process control<br />

functions ideally supplement already existing<br />

features such as flux quantity monitoring,<br />

monitoring of the nitrogen quality or the<br />

automatic position and z-height correction<br />

thus ensuring a 100 % process control.<br />

SMT Hybrid Packaging, Booth 4-129<br />

www.seho.de<br />

Source: SEHO Systems GmbH<br />

Tin-lead, water-washable solder paste<br />

Henkel’s development continues with the<br />

commercial launch of Loctite HF 2W, a tinlead,<br />

water-washable solder paste designed<br />

for high-throughput, high-yield production.<br />

Halide- and halogen-free and REACH compliant,<br />

the solder paste addresses environmental<br />

responsibility while delivering outstanding<br />

performance for Pb-based soldering.<br />

The solder paste is available with a standard,<br />

tin-lead Sn63 eutectic alloy, as well as<br />

the company’s proprietary anti-tombstoning<br />

63S4 alloy. The material’s properties allow it<br />

to reflow at high temperatures, expanding<br />

the reflow process window to facilitate<br />

strong intermetallic formation between the<br />

tin-lead paste and lead-free and tin-lead components.<br />

The result is excellent solderability<br />

in air or nitrogen across a broad range of<br />

challenging surface finishes including OSP-<br />

Cu, ENIG and silver. The material is suitable<br />

for high-speed, fine-pitch printing, with a<br />

wide print window and excellent results on<br />

components as small as 0201s, keeping defects<br />

such as solder bridging to a minimum.<br />

In addition, Loctite HF 2W flux residues can<br />

be cleaned via ultrasonic and spray under immersion<br />

cleaning processes as many as<br />

seven days post-assembly, providing assembly<br />

specialists with maximum flexibility.<br />

The solder paste has been formulated for<br />

high-reliability applications such as those<br />

found in the medical, hard disk drive, aerospace<br />

and defense markets, among others.<br />

SMT Hybrid Packaging, Booth 4-241<br />

www.henkel-adhesives.com/electronics<br />

Powerful and Compact<br />

The LPKF MicroLine 2000 Ci sets new standards in laser cutting of<br />

rigid, flexible and flex-rigid circuit boards. Discover the new benefits<br />

of using lasers. Find out more: www.lpkf.com/laser-depaneling<br />

SMT: 16 – 18 May 2017, Hall 5, Booth 434A<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 79



Professional<br />

soldering systems<br />

for productivity<br />

and flexibility<br />

16-18 May 2017<br />

booth 4-125<br />

CUBE Batch<br />

Our system for<br />

automation in the<br />

manual soldering area<br />

CUBE Inline<br />

The soldering system<br />

for highest flexibility<br />

and efficiency<br />

Special solutions<br />

We are a reliable partner when<br />

it comes to technical production<br />

challenges. INERTEC realises<br />

individual customer projects.<br />

Mounter for faster, more efficient<br />

electronics assembly<br />

Yamaha Motor IM Europe is to showcase the<br />

YSM40R ultra-high-speed modular surface<br />

mounter as part of its full line solution at<br />

SMT Hybrid Packaging 2017 in Nuremberg.<br />

The YSM40R’s 200,000 cph placement capability<br />

and area-efficient 1 m-wide outline<br />

frees OEMs and contract assemblers to increase<br />

capacity and maximize use of available<br />

space. Visitors can see the technical advances<br />

in head, feeder, camera and nozzle<br />

technologies – including high-speed motion<br />

and simultaneous multi-component visual<br />

recognition – that enable such extremely<br />

high productivity per square meter.<br />

Visitors to Nuremberg can see further powerful<br />

options for configuring fast and flexible<br />

SMT lines, including the high-efficiency<br />

modular YSM20 2-beam mounter and iPulse<br />

S10 and M20 hybrid mounters. The YSM20<br />

features innovations including smart component-shape<br />

recognition and accuracy compensation.<br />

With the company’s efficient<br />

“1-head solution” concept and special design<br />

features for fast changeovers, YSM20 delivers<br />

market-leading productivity in the<br />

90,000 cph class. The S10 and M20 hybrid<br />

mounters give the option of built-in adhesive<br />

dispensing, and have capacity for 90 or 180<br />

feeders respectively. They can place components<br />

from tiny chips and CSPs to larger ICs<br />

and connectors on long boards such as large<br />

LED assemblies. The M20 accepts boards up<br />

to 1.48 meters long, allows multiple head<br />

choices to balance speed and precision, and<br />

can place odd-form components. Options<br />

and upgrades for the S10 3D mounter enable<br />

component placement on contoured or tilted<br />

boards, and Molded Interconnect Device<br />

(MID) assembly.<br />

Source: Yamaha IM America<br />

The Yamaha Z:TA-R YSM40R.<br />

From screen print to inspection<br />

In addition, the company will present advanced<br />

solutions, spanning high-speed highresolution<br />

screen-printing and visual inspection,<br />

and powerful software products that are<br />

affordable, easy to use, and take advantage<br />

of its unique inter-machine data structures.<br />

These empower operators to manage their<br />

activities for optimum efficiency, and provide<br />

deeper insights into equipment health and<br />

production status.<br />

The high-performance, compact equipment<br />

theme continues with the YCP10 screen<br />

printer. This features the company’s original<br />

swing-single-squeegee head with variable<br />

angle for ultimate efficiency and perfect<br />

paste transfer. Further features that boost<br />

productivity include easy-to-use graphical<br />

alignment, automatic stencil cleaning, and<br />

options, such as in-printer inspection and<br />

solder-roll measurement.<br />

Booth displays will also express how recent<br />

additions to the YSi-V AOI family greatly expand<br />

access to high-accuracy 3D optical inspection<br />

augmented by laser componentheight<br />

and coplanarity checking. 5M pixel and<br />

12M pixel configurations with multi-angle/<br />

multi-wavelength inspection, and the highspeed<br />

TypeHS variants that incorporate additional<br />

technologies to accelerate throughput,<br />

provide options to suit many budgets.<br />

SMT Hybrid Packaging, Booth 4-321 / 229<br />

Source: Yamaha IM America<br />

INERTEC has been building selective<br />

soldering machines for more than<br />

twenty years and is one of the leading<br />

companies in this market sector.<br />

Yamaha I-Pulse M20.<br />

www.yamaha-motor-im.eu<br />

Inertec Löttechnik GmbH<br />

www.inertec.de<br />

80 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

Hot air technology station<br />

With the WTHA 1, Weller Tools GmbH is<br />

presenting the latest generation of hot air<br />

stations, boasting a power of 900 watts.<br />

The company’s WTHA 1 hot air station is the<br />

first model on the market to have a detailed<br />

LC display with self-explanatory user navigation<br />

for intuitive operability. The WTHA 1 is<br />

currently the best hot air station on the market<br />

in its price segment in terms of performance,<br />

ease of use and ergonomics. A built-in<br />

turbine produces up to 100 liters of hot air,<br />

and the new tandem control system with a<br />

dual sensor system ensures that this model<br />

performs twice as well as its predecessor.<br />

Clear menu structure<br />

The WTHA 1 hot air station is operated using<br />

five buttons on the front. A clear menu structure,<br />

which is easy to navigate, allows quick<br />

and easy access to all functions.<br />

The menu can be used to predefine up to five<br />

presets, allowing air quantity, temperature<br />

and time to be individually set and saved. The<br />

saved temperature profiles can be linked<br />

with each other and implemented successively<br />

via the profile mode. This protects the<br />

individual components while they are being<br />

worked, typically when used in rework pro-<br />

cesses.<br />

IPC standards are standard<br />

The WTHA 1 meets all of the current IPC<br />

standards and is particularly suited to demanding<br />

soldering tasks, for instance when a<br />

certain gradient has to be complied with in<br />

order to avoid damaging the components.<br />

„We focused on user-friendliness, high performance<br />

and ergonomics during development,“<br />

explained Gert Mittmann, R&D Manager.<br />

User-friendliness<br />

The mains switch on the WTHA 1 is fitted to<br />

the front of the station, meaning that it is<br />

user-friendly and can be accessed conveniently.<br />

The handle of the hot air iron has an<br />

ergonomic shape and is equipped with a<br />

practical finger-operated activation switch.<br />

The 90 cm long, flexible silicone hose is heatresistant<br />

and has an outlet at the front to provide<br />

increased safety at the workplace.<br />

The hot air iron can be positioned in two<br />

orientations on the safety support, which can<br />

be installed on either side, therefore making<br />

the WTHA 1 ideally suited to one-handed soldering<br />

tasks too. In additional, an interface<br />

for an optional foot-operated switch and a<br />

Source: Weller Tools GmbH<br />

The WTHA 1, the latest generation of hot air<br />

stations, with a power of 900 watts.<br />

heat-resistant silicone pad as a storage option<br />

on the station (for tools or nozzles, for<br />

example) round off the station‘s ergonomic<br />

features.<br />

All stations in the WL line can be stacked on<br />

the WTHA 1 hot air station, therefore saving<br />

valuable space at the workplace.<br />

At a glance:<br />

• Integrated turbine for up to 100 liters of expanded<br />

hot air<br />

• Unique, detailed LC display<br />

• Intuitive user navigation and operability<br />

• Air quantity, temperature, and time can be<br />

individually saved in five presets<br />

• Ergonomic and saves space – ideal for a<br />

modern workplace<br />

SMT Hybrid Packaging, Booth 4-400<br />

www.weller-tools.com<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 81



S-Track traceability package launches in Europe<br />

Pick & place platform with tester<br />

Surface mount screen printing<br />

specialist, Speedprint Technologies,<br />

announces the European<br />

launch of its S-Track system at<br />

SMT Nuremberg. S-Track introduces<br />

the benefits of traceability<br />

earlier, one process step upstream<br />

from the placement machine,<br />

by allowing the placement<br />

of barcode labels on boards<br />

while they are still in the printer.<br />

The solution deploys a label<br />

feeder within the printer’s archi-<br />

S-Track barcode label placement and<br />

traceability package.<br />

tecture to allow an unlimited<br />

number of pre-printed barcode<br />

labels to be positioned on the<br />

board in an unlimited number of<br />

locations. The package provides<br />

automated barcode reading and<br />

includes the company’s Traceability<br />

Option software, allowing<br />

users to scan barcodes to recall<br />

all the process data related to<br />

that board – including those once<br />

part of a panelized PCB.<br />

The label feeder technology provides<br />

the same functionality and<br />

Source: Speedprint Technologies<br />

operational convenience found in<br />

pick & place machines, with<br />

quick-change nozzles for different<br />

label styles and sizes, and<br />

precise positioning for location<br />

accuracy. Labels can be oriented<br />

through 90 degrees to fit around<br />

PCB features. For panelized<br />

PCBs, S-Track users can affix a<br />

label to each board in the panel<br />

and take advantage of incremental<br />

indexing of barcode data to<br />

distinguish and track each board<br />

after depaneling further downstream.<br />

This enables complete<br />

end-to-end traceability across an<br />

SMT assembly line. Taking traceability<br />

automation further,<br />

S-Track scans barcodes directly<br />

after placement and saves that<br />

data to the SPC database. Any<br />

label that fails to read accurately<br />

is immediately replaced. It’s<br />

high-speed scanning head can<br />

read 1D, 2D and laser-etched barcodes<br />

markings. The S-Track<br />

placement head mounts alongside<br />

the Advanced Dispense Unit<br />

(ADu), renowned for its ability to<br />

dispense solder paste and adhesive.<br />

With S-Track added to the<br />

ADu module, the SP710 machine<br />

allows users to print the board,<br />

pick and place the barcode label,<br />

dispense additional solder paste<br />

and adhesive if necessary, and<br />

scan all the labels on the board.<br />

SMT Hybrid Packaging, Booth<br />

4-251<br />

www.speedprint-tech.com/s-track<br />

Source: Europlacer Deutschland<br />

Europlacer announces the European<br />

launch of its newest pick &<br />

place machine, the iineo+ platform,<br />

positioned at the top of its<br />

product range. Based on the<br />

company’s iineo machine, the<br />

new iineo+ platform includes an<br />

integrated component electrical<br />

tester, a new operating system,<br />

multi core processing and improved<br />

operator interface, as<br />

well as, optional upgrades for enhanced<br />

traceability. The platform<br />

will be unveiled at the SMT Hybrid<br />

Packaging event.<br />

Visitors to the exhibition will be<br />

the first in Europe to see the<br />

new placement machine, witness<br />

the new design and discover<br />

the productivity benefits<br />

on offer. The platform is designed<br />

to deliver a step change in value<br />

for production-wide management,<br />

process refinement and<br />

user accessibility.<br />

The embedded component<br />

tester is the company’s Kelvinconnected<br />

electrical measuring<br />

system calibrated to all inter-<br />

The new iineo+ placement platform<br />

launching at SMT Nuremberg.<br />

national standards. Manufacturers<br />

in demanding sectors like<br />

aerospace, medical, defence and<br />

automotive will welcome the optional<br />

Track Pack traceability upgrade.<br />

This takes 1D and 2D traceability<br />

to a new level by adding<br />

a suite of interoperable traceability<br />

and smart data analysis tools,<br />

including the Promon live production<br />

dashboard, to the test<br />

function. The Track Pack upgrade<br />

includes an auto-width conveyor.<br />

The latest RC5.16 operating system<br />

software deploys multi core<br />

processing technology and<br />

client/server architecture to support<br />

an all-new graphical user interface,<br />

exploited through a large<br />

touch-screen monitor to drive<br />

productivity. The processing<br />

power behind RC5.16 boosts onmachine<br />

vision analysis processes<br />

and streamlines interplatform<br />

communications – perfect<br />

for networked multi-machine<br />

production floors. iineo+ also introduces<br />

an enhanced Package<br />

Library, with new features that<br />

include the display of nonoptimal<br />

package settings,<br />

exact shape representations<br />

for different<br />

device types, and a<br />

new special analysis<br />

mode for difficult devices.<br />

SMT Hybrid Packaging,<br />

Booth 4-251<br />

www.europlacer.de/iineoplus<br />

82 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

Dispensing and conformal coating systems<br />

Nordson Asymtek, a Nordson company, exhibited<br />

its latest technologies for fluid dispensing,<br />

jetting, conformal coating, and hot<br />

bar soldering at the IPC APEX tradeshow, in<br />

San Diego, California. The company joined its<br />

sister companies to support IPC as it celebrated<br />

its 60th year in the electronics manufacturing<br />

industry. The company delivers a<br />

variety of precise, flexible, intuitive, and reliable<br />

solutions to solve modern manufacturing<br />

challenges. Their products offer value and<br />

uncompromising quality along with high<br />

throughput, ease of cleaning and operation,<br />

and low cost-of-ownership. Available to run a<br />

small operation or to manage a giant industry.<br />

On display were the Conexis and Select<br />

Coat SL-940 conformal coating systems,<br />

which fit a wide range of needs for both<br />

spray and selective conformal coating. The<br />

systems feature one of the company’s newest<br />

developments, dual-simultaneous programmable<br />

pitch. Using this motorized<br />

bracket, two of the same applicators operate<br />

simultaneously to conformally coat two parts<br />

at the same time. The pitch is automatically<br />

repositioned to match the programmed pitch,<br />

increasing speed, accuracy, and repeatability.<br />

Coating process time is reduced by 50 % -resulting<br />

in significant UPH improvement.<br />

For fluid dispensing and jetting solutions, the<br />

company demonstrated its Quantum and<br />

Spectrum II Premier systems. Also, on display<br />

was the award-winning IntelliJet Jetting<br />

System, the premier jet valve for achieving<br />

consistent small volume fluid dots at high<br />

frequency in long-term production. The dispensing<br />

platforms are prized for their closedloop<br />

process controls and high-yield production<br />

management and offer a wide range of<br />

configurations with a variety of scalable options<br />

and valves to handle the dispensing<br />

needs for the most challenging applications.<br />

The company’s service and support has received<br />

12 Service Excellence Awards, winning<br />

every year they entered the contest.<br />

Their customer support legacy is an asset<br />

Source: Nordson Asymtek<br />

Dual-simultaneous programmable pitch.<br />

that sets them apart from its competitors.<br />

They are dedicated to supporting customers<br />

and helping them to succeed.<br />

Reflow soldering, heat seal, and ACF bonding,<br />

the DIMA hot bar products were also on<br />

display.<br />

In May, the company will exhibit at the SMT<br />

Hybrid Packaging show in Nürnberg.<br />

SMT Hybrid Packaging, Booth 5-434<br />

www.nordsonasymtek.com<br />

Wash bath concentration system<br />

Source: Kyzen<br />

Analyst is a wash bath concentration<br />

monitoring and reporting system.<br />

Kyzen announced plans to introduce<br />

the Kyzen Analyst in Europe<br />

this spring at SMT Hybrid Packaging<br />

2017. The company will<br />

have live, on-site demonstrations<br />

of their latest innovation at the<br />

show. The show is scheduled to<br />

take place May 16–18, 2017 at<br />

the Messe in Nuremberg, Germany.<br />

The solution is a wash bath concentration<br />

monitoring and reporting<br />

system that maximizes performance<br />

of virtually all chemistries,<br />

not just a few. Ram Wissel,<br />

the company’s VP of Global Technology,<br />

stated, “We know there<br />

is a need for this product in Europe<br />

just like there is in the U.S.<br />

and Asia, so we are very excited<br />

to demonstrate what it can do at<br />

SMT Hybrid Packaging 2017.” Mr.<br />

Wissel went on to say, “The response<br />

to our USA launch last<br />

September was tremendous and<br />

the feature that is the most innovative<br />

is the integration into Industry<br />

4.0 technology.”<br />

This system makes concentration<br />

monitoring faster, safer<br />

and more precise while saving<br />

critical time and money. Providing<br />

real-time access to data, analytics<br />

and reporting anytime, anywhere,<br />

it makes retrieving, logging<br />

and charting SPC reports<br />

fast and user-friendly. Additionally,<br />

it provides complete monitoring<br />

of wash bath concentration.<br />

This also features a user-friendly<br />

7” LCD touchscreen interface,<br />

Ethernet / WiFi connection, and<br />

is Industry 4.0 enabled to easily<br />

collect and exchange data.<br />

SMT Hybrid Packaging,<br />

Booth 4-536<br />



Sealing, gluing and potting diversity for the automobile industry<br />

Optimal process stability<br />

The Sonderhoff group of companies presented their products for the automotive industry in China at the<br />

17th Shanghai International Automobile Industry Exhibition. The German company is the world‘s leading<br />

system supplier for foam sealing, gluing and potting solutions including the dispensing machines for<br />

precise material application on the automotive parts. Particular highlights at the company booth were<br />

the Low-Emission and Fast-Cure polyurethane foam seal systems Fermapor K31 and the newly developed<br />

polyurethane-based 2-Component adhesives Fermaglue. The visitors experienced the precision of<br />

the 3 component DM 403 mixing and dosing machine during live demonstrations at the booth.<br />

Florian Kampf, Sonderhoff, Cologne (Germany)<br />

Source: Sonderhoff<br />

Sonderhoff is process specialist for the automated material application<br />

on parts of small to large series productions using the<br />

formed in-place (FIP) sealing technology. It has established as industry<br />

standard for an efficient, accurate and economical production<br />

method not only in the car manufacturing. When it comes to precise<br />

material dosing, accurately applied to the parts’ contour, the advantages<br />

of FIP become very clear. This is especially true for the highly<br />

synchronized series production in the making of cars. Most of the<br />

parts are processed with the very precise linear robots of the company’s<br />

mixing and dosing machines. Six axis robots for the part<br />

handling are used for complex 3D component geometries. Due to<br />

different lengths and diameters dosing nozzles reach into remote<br />

areas of 3 dimensional parts so that foam sealant, glue or potting<br />

can be applied accurately.<br />

Using FIP sealing technology and dispensing machines foam seal<br />

applications are reliably reproducible in large numbers subject to the<br />

required zero fault tolerance in the automobile industry. The raw materials<br />

for foam sealing are exploited almost to 100 %. There occur<br />

no punching or scrap losses as with the classical pre-fabricated<br />

moss rubber seal.<br />

The dispensing systems DM 40x precisely apply Fermapor K31 Fast-Cure foam<br />

seals to the contours of door modules, while the 6-axis robot is in charge of the<br />

part handling.<br />

For clean air in the<br />

vehicle interior:<br />

car makers are increasingly<br />

using<br />

low-emission foam<br />

gaskets and platics.<br />

All information relevant for the quality of safe engineering, material<br />

and the process are automatically recorded by the company mixing<br />

and dosing systems, accessible at any time. The traceability of previous<br />

processing operations of the system ensures a reproducible<br />

production quality.<br />

Wide range of material properties<br />

Components and modules that are used in the manufacture of automobiles<br />

must be tightly sealed after their assembly against moisture,<br />

dust and harmful media. The foam sealing, adhesive and potting<br />

systems from the company are very versatile for the use in the car<br />

industry. For instance, Fermapor K31 Low-Emission foam gaskets<br />

seal air intake passages. Very reactive Fermapor K31 Fast-Cure<br />

foam seals with very short tack-free time adapt to the highly synchronized<br />

car production. Fermaglue 2-component adhesives in different<br />

degrees of hardness are used for bonding various auto parts.<br />

And Fermasil silicone foam gaskets are suitable for enclosure sealing<br />

in the engine compartment due to their temperature resistance.<br />

The polyurethane foam seals that is used for air conditioning systems<br />

in cars ensure a leak-free fit of the filter of air intake passages,<br />

so that no unfiltered air passes the filter into the car interior. The<br />

antimicrobial properties prevent that microorganisms settle on the<br />

filter seals used on the air duct. Thus the hygiene requirements of<br />

VDI 6022 are met for air filters.<br />

The polyurethane potting systems are applied in various application<br />

areas, from surface coating and protection against environmental<br />

effects, to encapsulating electronic components, e.g. the potting of<br />

automotive connector plugs, relays, transformers, condensers, sensors<br />

and others.<br />

Source: Sonderhoff<br />

84 <strong>EPP</strong> <strong>EUROPE</strong> May 2017


Source: Sonderhoff Source: Sonderhoff<br />

3 component mixing and dosing<br />

machine DM 403 for automated<br />

FIP (F)G material application.<br />

However, decisive for constant quality of foam sealing, gluing and<br />

potting are the right choice of raw materials, excellent workmanship<br />

as well as security and accuracy of the dispensing machines. Thus,<br />

a more precise application process of the materials on the components<br />

can be achieved.<br />

One-stop shop for the automotive industry in China<br />

The rapid development of the Chinese automotive industry which<br />

demands new advanced technologies and specialized new products<br />

was reason enough for Sonderhoff to exhibited at AutoShanghai<br />

again. After years of trade show attendance Sonderhoff (Suzhou)<br />

Sealing Systems Co.Ltd., founded 2009 in Suzhou near Shanghai,<br />

gained market shares very successfully. This is mainly due to the<br />

complete portfolio of sales and technical application services, machine<br />

maintenance, spare parts supply for existing machines and<br />

trainings.<br />

Last year Sonderhoff (Suzhou) Sealing Systems moved to a larger<br />

location in Suzhou. Now, more than 6,000 square meter are available<br />

for new growth. They established their own production of polyurethane<br />

material component in Suzhou. This makes them independent<br />

from material imports from Sonderhoff’s production facilities in<br />

Germany. It shortens the delivery times to Chinese customers significantly.<br />

Sonderhoff (Suzhou) operates as extended workbench for the automotive<br />

suppliers in China, for prototype sampling and contract<br />

manufacturing in a two-shift operation from zero to small, up to<br />

large series. More often customers place orders of 100,000 pieces<br />

annually and above.<br />

New machines from the company are placed for extended contract<br />

manufacturing at the new location. Three dispensing machines with<br />

linear robots are used for polyurethane and silicone foam sealing,<br />

potting and gluing applications as well as one six axis robot for the<br />

Plastic air duct in<br />

the car – applied with<br />

low-emission polyurethane<br />

foam gasket.<br />

Source: Sonderhoff<br />

New location of Sonderhoff (Suzhou) Sealing<br />

Systems Co. Ltd. in the Suzhou Industrial Park.<br />

part handling. In case of material dispensing on 3D parts, the mixing<br />

head can be mounted on the robot arm, which then accurately<br />

moves above the part contour. Alternatively, the part is held with the<br />

robot arm under the mixing head of the dispensing machine.<br />

The major benefit for the automotive customers: Sonderhoff (Suzhou)<br />

Sealing Systems offers the material systems together with the<br />

dispensing machines. Optimal process stability and fine-tuned<br />

adaption of the used material with the setup parameters of the mixing<br />

and dosing machine is guaranteed. Thus, the customers get<br />

everything from one source.<br />

www.sonderhoff.com<br />

Zusammenfassung<br />

Komponenten und Module, die bei der Herstellung von Automobilen<br />

verwendet werden, müssen nach ihrer Montage gegen Feuchtigkeit,<br />

Staub und schädliche Meiden dicht verschlossen werden.<br />

Der Artikel präsentiert Schaumdichtungs-, Klebe- und Vergusssysteme<br />

in Verbindung mit Materialien, welche für den Einsatz in der<br />

Automobilindustrie sehr vielseitig einsetzbar sind.<br />

Résumé<br />

Après montage, les composants et les modules utilisés dans la production<br />

automobile doivent être étanches à l‘humidité, à la poussière<br />

et aux milieux nocifs. L‘article présente des systèmes de<br />

mousse étanche, de collage et d‘encapsulage en liaison avec des<br />

matériaux aux utilisations variées dans l‘industrie automobile.<br />

Резюме<br />

Компоненты и модули, используемые при производстве<br />

автомобилей, после монтажа необходимо тщательно<br />

герметизировать во избежание проникновения в них<br />

влажности, пыли и вредных веществ. В статье представлены<br />

системы уплотнения пеной, клеем и заливкой в сочетании с<br />

материалами, которые могут использоваться в очень многих<br />

аспектах автомобильной промышленности.<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 85



Positive displacement PC pump<br />

Techcon Systems, a product group<br />

of OK International and provider of<br />

fluid dispensing systems and products,<br />

exhibited at the 2017 IPC Apex<br />

Expo at the San Diego Convention<br />

Center. The Techcon team demonstrated<br />

the new TS8100 Series Positive<br />

Displacement PC Pump with<br />

the TS500R-PC, along with its<br />

TSR2000 Bench Top Robot Series.<br />

The continuously volumetric dispense<br />

pump is based on Progressive<br />

Cavity (PC) technology. Due to<br />

the PC pump’s unique dispensing<br />

technology, accuracy and repeatabil-<br />

TS8100 Series positive displacement<br />

PC pump.<br />

Automated dispensing and coating systems<br />

Global manufacturer and supplier of conformal coating and precision<br />

dispensing systems, Precision Valve & Automation, Inc., brought the<br />

latest in automated dispensing and coating equipment to the IPC<br />

APEX Expo.<br />

The company featured several automated systems that can be used<br />

for a diverse range of applications. The display included the patented<br />

fourth axis technology, the new ProFlow 2K, a servo controlled progressive<br />

cavity pump, and the JDX jet dispense valve.<br />

Also, featured was the Spectra, the newly redesigned UV curing oven.<br />

The Spectra was part of an inline system that showcased the company’s<br />

ability to provide a customized solution with single or double<br />

sided processing, configurable cure and transfer speeds, and various<br />

beam widths to accommodate a wide range of substrates.<br />

SMT Hybrid Packaging, Booth 4-321<br />

www.pva.net<br />

Source: Techcon<br />

ity of ±1 percent is achievable. The<br />

turning rotor on the TS8100 moves<br />

the fluid in tightly sealed cavities<br />

through the stator’s fluid chambers<br />

to create a volumetric fluid flow that<br />

does not change the shape or size<br />

of the fluid.<br />

The TS8100 comes standard with a<br />

syringe bracket, mounting bracket<br />

kit, luer lock fitting, cleaning kit, and<br />

dispensing tip selection pack. Typical<br />

applications include under filling<br />

PCBA components, encapsulation<br />

and potting applications, applying lubrication<br />

on automotive parts, and<br />

dispensing pastes and flux.<br />

The TSR2000 bench top robot<br />

series has been designed for a wide<br />

range of fluid dispensing applications,<br />

from inline to batch. The<br />

versatile TSR2000 dispensing platforms<br />

deliver consistent, high-performance<br />

dispensing results at an<br />

affordable price. The TSR2000<br />

Series is ideal for the following applications:<br />

dispense dots of solder<br />

paste, form-in-place gasket, filling,<br />

potting, encapsulation, bonding,<br />

coating and many more. Three models<br />

are available to accommodate a<br />

wide range of working envelopes.<br />

SMT Hybrid Packaging, Booth<br />

4-101<br />

www.techcon.com<br />

Optical encapsulants for LED packages<br />

Dow Corning, a wholly owned subsidiary of Dow Chemical<br />

Company, further expanded the design flexibilities for<br />

LED packaging manufacturers today with the addition of<br />

five new optical encapsulants (OEs) to its fast-growing<br />

portfolio of advanced LED solutions. Offering extra high<br />

thermal and optical stability with optimized refractive indexes,<br />

hardness and gas barrier properties, these five<br />

new products broaden design latitudes for very high<br />

power LED packages, such as ceramic substrate-based<br />

surface mount device (SMD), chip on-board (COB) and<br />

plastic leaded chip carrier (PLCC) packaging.<br />

The five new products include OE-7840, OE-7841,<br />

OE-7843, OE-7810 and OE-7820 Optical Encapsulants.<br />

They fall into two separate categories of targeted performance<br />

properties, but all deliver photothermal stability<br />

and reliability at sustained temperatures of 150° C.<br />

“As today’s LED manufacturers continue to design brighter,<br />

smaller, and more cost-effective LED packages, Dow<br />

Corning is working closely with them to evolve advanced<br />

new silicone solutions to meet their most demanding<br />

challenges,” said Takuhiro Tsuchiya, the global marketing<br />

manager. “These five cutting-edge optical encapsulants<br />

build on the success of our industry-leading OE product<br />

family, and enable customers to continue pushing the design<br />

boundaries for their high-power LED packages.”<br />

Source: Dow Corning<br />

Five new optical encapsulants,<br />

including OE-7840,<br />

OE-7841, OE-7843, OE-7810<br />

and OE-7820.<br />

Three of the products –OE-7840, OE-7841 and OE-7843<br />

Optical Encapsulants – provide OEMs optimized refractive<br />

indexes and other features to improve both efficiency<br />

and reliability of high-power PLCC LED packages. The<br />

OE-7840 and OE-7841 products respectively offer RIs of<br />

1.5 and 1.48 to allow designers to optimize light output<br />

while ensuring their LED packages have good gas barrier<br />

properties. OE-7843 Encapsulant rounds this category<br />

out by combining an RI of 1.5 with good anti-silver corrosion<br />

properties to enable high-power PLCC LED packages<br />

to withstand severe environmental conditions.<br />

The two remaining new products –OE-7810 and OE-7820<br />

Optical Encapsulants – target high-power COB and ceramic<br />

substrate-based SMD LED packages, where very<br />

high thermal resistance is the priority and corrosive silver<br />

is not used. They offer a choice of durometer tailored to<br />

improve durability depending on design parameters.<br />

OE-7810 Encapsulant provides a hardness of Shore A55<br />

for packaging applications that require higher elongation<br />

for improved durability under thermal cycling. OE-7820<br />

Encapsulant, with a durometer of Shore A70, delivers<br />

higher hardness that can contribute to better handling<br />

and minimal dust pick up.<br />

www.dowcorning.com<br />

86 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

Placement & jetting in a single pass through<br />

Essemtec, the Swiss manufacturer<br />

of production systems for electronic<br />

assembly and packaging, has exhibited<br />

in at the 2017 IPC Apex Expo<br />

at the San Diego Convention Center<br />

in California. The company debuted<br />

the FOX² and demonstrated the<br />

compact Spider jet dispenser.<br />

The new FOX 2 combines jetting of<br />

solder paste or glue and placement<br />

in a single machine. The new version<br />

is based on the original awardwinning<br />

platform, which is the first<br />

machine in its class with linear motors<br />

and a mineral cast frame, providing<br />

excellent speed, stability, accuracy,<br />

and making it perfectly<br />

suited for use in small to medium<br />

production environments. The system<br />

has a machine footprint of just<br />

1 m 2 and can accept PCB sizes up to<br />

16 x 12“. Components with sizes<br />

from 01005 up to 1.3 x 3.1“are<br />

placed. The machine achieves<br />

7,500 cph (IPC9805A) at 50 μm,<br />

3 sigma with a<br />

two-nozzle head.<br />

The Spider can utilize<br />

two dispensing<br />

jet valves rated at<br />

up to 150,000 dots<br />

per hour. It dispenses<br />

3D patterns<br />

and can be easily<br />

adapted to your application.<br />

The system<br />

occupies only 1 m² of floor<br />

space and features linear motor<br />

drives for high accuracy: 40 μm (3 σ)<br />

at full speed. Job changeover is<br />

quick with intuitive CAD import and<br />

job preparation. Mapping of heights<br />

by laser technology enables 3D applications.<br />

A mineral-cast chassis<br />

provides stability at varying temperatures.<br />

SMT Hybrid Packaging, Booth<br />

4-318<br />

www.essemtec-usa.com<br />

Source: Essemtec<br />

FOX 2 combines<br />

jetting of solder<br />

paste or glue and<br />

placement in a<br />

single machine.<br />

Bonding wire for universities, labs, small-volume users<br />

TopLine has started a new service<br />

that makes it much easier for Universities,<br />

research facilities, laboratories,<br />

and small-volume users to<br />

obtain bonding wire manufactured<br />

by Tanaka. The One Spool policy<br />

allows users to purchase as few as<br />

a single spool of bonding-wire. This<br />

policy is welcomed by customers<br />

who had been previously forced to<br />

purchase large lots of bonding-wire.<br />

“Other manufacturers of bonding<br />

wire typically require customers to<br />

buy minimum order quantities,<br />

which might be 10 to 20 spools,” the<br />

President, Martin Hart, states. “But<br />

the company’s M.O.Q. is just one<br />

spool. Our goal is to make it easy for<br />

small-volume customers to have<br />

quick, hassle-free access to Tanaka’s<br />

world -class quality bonding<br />

wire, helping Universities, laboratories<br />

and R&D projects helps to advance<br />

technology,” he added.<br />

Bonding wire is used in a wide<br />

range of applications, mostly involving<br />

wiring silicon die inside IC<br />

packages or bonding chips directly<br />

to PC boards, known as Chip on<br />

The new one spool policy<br />

Board.<br />

The company offers a full range of<br />

bonding wire in four alloys: Gold,<br />

Aluminum, Silver, and Copper, as<br />

well as, flat gold ribbon used in RF<br />

Microwave and certain segments of<br />

the solar industry. They offer standard<br />

lengths on spools: 50 m,<br />

100 m, 300 m, 500 m and 1000 m,<br />

depending how much the customer<br />

needs on the spool. Wire is packaged<br />

on two-inch spools, as well as,<br />

half-inch spools for industry standard<br />

manual or automated bonding<br />

machines.<br />

SMT Hybrid Packaging, Booth<br />

4A-120<br />

www.topline.tv<br />

Source: TopLine Corporation<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 87


Challenging traditional pull testers<br />

Economical testing equipment<br />

F&S Bondtec Semiconductor GmbH from Austria’s Braunau is breaking with tradition in the industry and<br />

taking a completely novel direction in its product portfolio and sales concept. The new high-quality wire<br />

bond pull tester for less than half the common market price is the company’s answer to the market’s call for<br />

state-of-the-art, but economical testing equipment – introducing the F&S Bondtec Labtester. With only one<br />

week for delivery, the company outclasses all other offerings in the market.<br />

For more than 40 years, testing standards have required the testing<br />

of wire bonds, especially by pull tests. The internationally accepted<br />

MIL standard 883, ASTM F458/459, and the DVS guidelines<br />

2811 (newest issue published by BeuthPress in 02/2017) all require<br />

pull tests to record, monitor, and statistically prove pull forces to ascertain<br />

that certain thresholds are maintained. Every user – SMEs,<br />

universities, research institutions, corporate research departments –<br />

have to fulfill these standards whenever wire bond technology is involved.<br />

They need powerful equipment to conduct these tests,<br />

often while working with definite cost constraints. Typical pull<br />

testers require investments of €25 k to €40 k. Optional extras, for<br />

automation or more complex data processing, can easily increase<br />

the costs to €50 k to €60 k. A far cheaper option, at around €1,000,<br />

is offered by simple spring scales to estimate pull strengths. However,<br />

the actual benefit in terms of reliable quality assurance of<br />

these systems is questionable. F&S Bondtec does not believe in<br />

these systems and has decided to establish a completely new category<br />

of testers – the Labtester, a manual pull tester brought back<br />

to the very essence of pull testing needs, with an intuitive user interface,<br />

cutting-edge software, and an innovative sales concept that<br />

guarantees superfast deliveries at an unbeatable price point.<br />

With over a quarter of a century of active experience in the market,<br />

the company knows the needs and challenges of its users. One<br />

common argument: An investment in quality testing does not automatically<br />

mean an improvement in the quality of the product. Despite<br />

this, testing is an inevitability: If it has to be done, it should at<br />

least be economical and efficient.<br />

The pull tester of the company is a compact system perfectly<br />

aligned with the needs of pull tests in practice. The designers considered<br />

two key questions: What do the users actually need? And<br />

what are they willing to invest in? The force testing system has to<br />

live up to exacting quality standards. As an established specialist in<br />

the development of these systems, F&S Bondtec never compromises<br />

on quality. In their choice of the electromechanical components<br />

and computer architecture, the product designers deliberately<br />

decided against expensive industrial solutions. The required precision<br />

and durability can be achieved by carefully selecting the right<br />

consumer-grade components.<br />

The most exciting feature of the lab tester is not its functionality,<br />

despite its unrivaled ease of use. Rather, it is the modular design<br />

and the fast availability of the system. The sales concept has been<br />

fine-tuned to enable reliable delivery within one week to clients anywhere<br />

in the world. The system is designed to make it easy for the<br />

client to assemble and launch the device with only minimum effort.<br />

All components use a modular system that can be replaced or upgraded<br />

whenever needed, avoiding the need for complex and costly<br />

The software<br />

interface.<br />

Source: F&S Bondtec<br />

88 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

servicing. The devices are not built to order, but kept on stock at the<br />

company to enable the record delivery time of only a week. No<br />

more waiting for sales representatives: The client can contact the<br />

company directly and will receive the package after a quick check<br />

whether the ordered system meets his needs. The client can then<br />

set up the system with the enclosed instructions and has a trial period<br />

to test the system, before either returning it or keeping it and finalizing<br />

the purchase. Configuring the system is easy: the client decides<br />

beforehand whether to use an automated or a manual table.<br />

With its accurate measuring technology, a<br />

large range of pull tests can be conducted,<br />

handling thin or heavy wires with tensile<br />

strengths of 100 cN (thin wire) up to 500 cN<br />

(heavy wire). Reports are shared in a common<br />

format by standard USB interface. The company<br />

can assist the client in setting up the<br />

computer used for test analysis, but the system is made for use<br />

with standard PC equipment– using regular Ethernet or WiFi connections.<br />

Source: F&S Bondtec<br />

Detailed system information<br />

The system is designed with intuitive use in mind, removing the<br />

need for specialised training. It usually takes only 30 minutes for<br />

users to acquaint themselves with the system and all of its features<br />

The new F&S Bondtec<br />

Labtester LT101.<br />

You need:<br />

Economical pull test equipment for random sample testing<br />

Intuitive use with minimal training<br />

Efficient workflows and lab-proven usability by touchscreen<br />

State-of-the-art test and measurement results rivalling the quality of<br />

premium systems<br />

High accuracy and long life<br />

Working heights of up to 80 mm on the z-axis<br />

Manual or precise automatic (optional) sample movement<br />

Simple data sharing via standard interfaces (USB, Ethernet, WiFi)<br />

Essential statistical functions (mean values, standard deviation, CpK)<br />

Sophisticated analytical capabilities (optional) for the Corporate Standard<br />

Report (CSR) analytical software in the fully automated tester<br />

system<br />

We offer: Lab Tester<br />

7” touchscreen<br />

Intuitive user interface requiring little familiarization with the software<br />

Joystick for moving each axis, keypad for defining failure codes<br />

Max. pull force of 500 cN<br />

Accuracy ±0.25 % (of max. value)<br />

Motorized Z-axis 40 mm (plus 80 mm manual height adjustment)<br />

z-axis resolution: ±2 μm<br />

Turning pull hook<br />

Different pull hooks available<br />

Simple pull hook replacement – no tools required<br />

Motorized X/Y table 40 mm * 40 mm (optional)<br />

x/y-axis resolution: ±2 μm<br />

CSR – Corporate Standard Report (Option)<br />

Export formats: CSV, PDF<br />

USB2.0<br />

Ethernet (cable or WiFi)<br />

MIL-STD-883 and DVS-2811 compliant<br />

CE certified<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 89


and functions. A touchscreen and a few physical buttons are all that<br />

is needed to operate the system, start tests, and define failure<br />

codes. The user interface never shows more than two sub-menus<br />

to make it easy to navigate the system, and all essential information<br />

is displayed on screen to make the workflow as economical as<br />

possible. The user is not forced to switch display modes or skip<br />

from tabs to tabs to use the system.<br />

The substantial amounts of data produced by concurrent tests is<br />

easy to manage and process with the Corporate Standard Report<br />

(CSR) analytical software which can also access the lab tester database<br />

via Ethernet. The user selects the production lots for the test<br />

series for inclusion in the reports – optionally with custom adjustments<br />

for each clients. The display immediately shows any unusual<br />

results and helps track any trends. The system is a powerful tool for<br />

all users that need to check the test data immediately on the device<br />

e.g. to change bonding parameters on the go. The tools and indicators<br />

included in the system apply potent analytical resources. In<br />

addition to tracking means, standard deviations, minimum and<br />

maximum results, the system can determine important procedural<br />

indicators like Cp and CpK capability scores.<br />

Visualization is a great way to monitor and record complex processes.<br />

The CSR analytical software offers versatile resources for<br />

this, which are constantly updated and expanded by the company,<br />

including:<br />

• Histograms with failure code allocation<br />

• Force-Time charts<br />

•Charts<br />

• SPC with quality control charts<br />

• Individual value plots for trend and deviation analysis<br />

Compact Labtester<br />

with maximum<br />

Z-traversing range<br />

optional.<br />

The consolidated data can be shared as screenshots, via the data interface,<br />

or with the automatic report generator for the most userfriendly<br />

option. All selected data is included in the report, alongside<br />

additional important information (e.g. production lot, bonding program,<br />

user) and visual elements (e.g. client logos). The data tables<br />

are visualized with charts perfectly scaled to match the format. The<br />

reports can be exported in all common formats (including PDF) to<br />

share all of the information immediately with the right recipients.<br />

The raw data is an excellent resource for customer specific evaluation<br />

and can be accessed easily via the available interfaces for later<br />

analysis with external SPC software.<br />

www.fsbondtec.at<br />

Zusammenfassung<br />

F&S Bondtec Semiconductor bricht mit der Tradition in der Branche<br />

und nimmt einen völlig neuen Weg in ihrem Produktportfolio<br />

und ihrem Vertriebskonzept ein. Der hochwertige Drahtbond-Pulltester<br />

ist die Antwort des Unternehmens auf die Forderungen des<br />

Marktes nach wirtschaftlichen Prüfgeräten.<br />

Résumé<br />

F & S Bondtec Semiconductor rompt avec la tradition dans la branche<br />

et s‘engage sur une voie entièrement nouvelle dans son portefeuille<br />

de produits et son concept de vente. De toute première qualité,<br />

le dynamomètre pour fils (Pull-Tester) est la réponse de l‘entreprise<br />

aux exigences du marché en matière de testeurs économiques.<br />

Резюме<br />

F & S Bondtec Semiconductor нарушает традиции отрасли,<br />

выбирая абсолютно новый путь в спектре предлагаемой<br />

продукции и концепции сбыта. Высококачественный<br />

измеритель усилия для испытания проволочных выводов на<br />

отрыв — это ответ предприятия на запрос рынка об<br />

экономически эффективных измерительных приборах.<br />

Source: F&S Bondtec<br />

90 <strong>EPP</strong> <strong>EUROPE</strong> May 2017



Scanning acoustic microscope<br />

3D AOI and SPI inspection systems<br />

Microtronic GmbH, a leading sales specialist<br />

of microelectronics, today announced plans<br />

to show the Sonix Echo scanning acoustic<br />

microscope at SMT Hybrid Packaging, scheduled<br />

to take place May 16–18, 2017 in Nuremburg,<br />

Germany. The Echo enables package<br />

inspection of stacked dies, complex flip<br />

chips and more traditional plastic packages.<br />

The Echo VS adds industry-leading features<br />

for the clearest imaging of Cu pillars, molded<br />

flip chip (MUF), CSP, MCM, stacked die, hybrids,<br />

and other advanced package inspection<br />

applications. The Echo Pro adds fully<br />

automated handling for 100 percent package<br />

inspection in high-volume production environments.<br />

Ernst J. M. Eggelaar, President of the company<br />

commented, “We are excited to present<br />

the latest developments and features of<br />

the Sonix Echo to our customers. The system<br />

offers many new and cutting-edge features.”<br />

SMT Hybrid Packaging, Booth 5–221<br />

www.microtronic.de<br />

Source: Microtronic GmbH<br />

Sonix Echo will<br />

be shown at the<br />

SMT show.<br />

Mirtec announced they will display their 3D<br />

AOI and SPI inspection systems in pb tec’s<br />

booth at the upcoming SMT Hybrid Packaging<br />

show, scheduled to take place May 16–18<br />

in Nuremberg, Germany.<br />

The company is a strong presence at the<br />

show each year, and 2017 is no exception.<br />

They are planning to display several systems,<br />

including the MV-6E Omni, MV-7Omni,<br />

MS-11, and the Intelli-Sys Inc. Intelli-Track.<br />

The company’s MV-6E Omni, is unquestionably<br />

the inspection industry’s most technologically<br />

advanced AOI system in consideration.<br />

This all new MV-6E Omni 3D in-line AOI<br />

system is configured with the company’s<br />

Omni-Vision 3D inspection technology which<br />

combines their award winning 15 Megapixel<br />

ISIS vision system with the digital multi-frequency<br />

eight projection 3D system to provide<br />

precision inspection of SMT devices on<br />

finished PCB assemblies. The company’s 15<br />

megapixel ISIS vision system is a proprietary<br />

camera system designed and manufactured<br />

for use with our complete product range of<br />

inspection equipment. The digital multi-frequency<br />

eight-projection technology provides<br />

true 3D inspection using a total of four (4)<br />

programmable digital moiré projectors. This<br />

proprietary system yields precise height<br />

measurement used to detect lifted component<br />

and lifted lead defects, as well as,<br />

solder volume post reflow. Fully configured<br />

the new MV-6e Omni machines feature four<br />

(4) 10 megapixel side-view cameras in addition<br />

to the 15 megapixel top-down camera.<br />

The MV-7 Omni-QHD 3D AOI machine features<br />

the next generation of the Omni-Vision<br />

The MV-6E<br />

AOI system.<br />

3D inspection technology in a high-performance<br />

AC Servo Drive Platform. This technology<br />

combines the proprietary 15 MP CoaX-<br />

Press Vision System with the Quantum High<br />

Definition (2048 x 1536) digital multi-frequency<br />

3D projection technology to provide unprecedented<br />

image quality, accuracy and repeatability<br />

necessary for precision inspection<br />

of SMT devices on finished PCB assemblies.<br />

The MS-11 3D in-line SPI Machine is configured<br />

with the 15 MP ISIS vision system, providing<br />

enhanced image quality, superior accuracy<br />

and incredibly fast inspection rates.<br />

The machine uses dual projection shadow<br />

free moiré phase shift imaging technology to<br />

inspect solder paste depositions on PCBs<br />

post screen print for insufficient solder, excessive<br />

solder, shape deformity, shift of deposition<br />

and bridging.<br />

SMT Hybrid Packaging, Booth 4–140<br />

www.mirtec.com or www.pbtecsolutions.com<br />

Source: MIRTEC Europe<br />

Advanced in-line dual-sided optical inspection system<br />

Nordson Yestech, a subsidiary of Nordson<br />

Corporation and supplier of automated optical<br />

and conformal coat inspection systems<br />

for the electronics industry launched their latest<br />

innovation, the FX-942 dual-sided optical<br />

inspection system.<br />

The FX-942 incorporates 12 MP / 5 axis inspection<br />

technology for top and bottom side<br />

applications, including solder ball inspection,<br />

solder fillet quality inspection, lead and pin inspection<br />

and foreign material inspection. The<br />

100 mm clearance allows for final assem<br />

The system can also be configured with proprietary<br />

UV lighting for automated conformal<br />

coating inspections. Advanced Fusion Light-<br />

ing and newly available image processing<br />

technology integrate several techniques, including<br />

3D inspection, color inspection, normalized<br />

correlation and rule-based algorithms,<br />

to provide complete inspection coverage<br />

with an unmatched low false failure rate.<br />

The system has a Picture in Picture (PinP)<br />

feature and is MES / Industry 4.0 compatible.<br />

Off-line programming maximizes machine<br />

utilization and real-time SPC monitoring provides<br />

a valuable yield enhancement solution.<br />

SMT Hybrid Packaging, Booth 4A-214<br />

www.nordsonyestech.com<br />

Source: Nordson Yestech<br />

FX-942 AOI in-line dual sided optical inspection.<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 91



Live demonstrations of inspection systems at SMT<br />

Nordson Dage, Nordson Matrix, and Nordson<br />

Yestech, divisions of Nordson, announced<br />

that they will exhibit at the upcoming SMT<br />

Hybrid Packaging scheduled to take place<br />

May 16–18 at the Messe in Nuremberg, Germany.<br />

Dage will demonstrate their flagship system<br />

– the new Quadra 7 with 0.1 μm sub-micron<br />

feature recognition which comes equipped<br />

with two 4K UHD displays and 8 million pixels<br />

to fully show the 50 μm pixel pitch and<br />

6.7 MP image size of the Aspire FP detector.<br />

The Quadra 5, with will also be showcased.<br />

This system offers high performance and<br />

ease of use for 2D and 3D X-ray applications.<br />

0.35 μm feature recognition up to 10 W of<br />

power, makes the Quadra 5 the leading<br />

choice for printed circuit board and semiconductor<br />

package inspection.<br />

Matrix – an automated inline X-ray inspection,<br />

complements its existing application<br />

spectrum of SMT and PTH solder joint inspection<br />

with power hybrid applications (e.g.<br />

IGBT), battery inspection and wire bond testing.<br />

By focusing on these applications, Matrix<br />

answers the increased demand for more<br />

safety and quality inspection of consumer<br />


products like smartphones or earphones. The<br />

flexible configuration of its inline systems<br />

offers maximum possibilities to adapt to customer<br />

specific needs as one can choose between<br />

different inspection technologies (2D<br />

Transmission, SFTTM, 2.5D Off-Axis, 3D<br />

SART) depending on the actual inspection<br />

demand.<br />

Yestech FX-940 Ultra 3D AOI with cuttingedge<br />

3D technology is ideal for the inspection<br />

of solder defects, lead defects/lifted<br />

leads, component presence and co-planarity<br />

Source: Nordson Corporation<br />

Source: Nordson Corporation<br />

DAGE Quadra 7.<br />

of chips, BGAs and other height sensitive devices.<br />

With its Advanced Fusion Lighting and<br />

comprehensive inspection tools including<br />

angled cameras, full-color digital image processing<br />

and both image and rule-based algorithms,<br />

it offers complete inspection coverage<br />

with unsurpassed 2D and 3D defect detection.<br />

SMT Hybrid Packaging, Booth 4-214<br />

www.nordson.com<br />

2D + 3D inspection with advanced technology<br />

V810i S2EX features Scan Path Merging<br />

(SPAM) state-of-art new technology.<br />

ViTrox Technologies, provider of innovative,<br />

advanced and cost-effective automated vision<br />

inspection systems and equipment for<br />

the semiconductor and electronics packaging<br />

industries, today announced plans to brought<br />

its new product line to the IPC APEX Expo.<br />

The V510i XXL system uses 2D and 3D inspection<br />

concurrently to achieve high productivity<br />

and high detectability. It boasts capabilities<br />

that are unmatched by other existing<br />

solutions in the market. The system is<br />

Source: ViTrox Technologies<br />

coupled with structured lighting for 2D illumination<br />

with multiple color LEDs. The multiangle<br />

multi-color illumination capability<br />

allows multiple images to be acquired for<br />

each view. The company has developed a<br />

platform for the V510i XXL for single lane inspection<br />

to cater to larger board inspection.<br />

The V810i S2EX is able to inspect boards up<br />

to 482 x 609 mm and provides the best support<br />

on the market for boards up to 7 mm<br />

thick and 4.5 kg . The solution features Scan<br />

Path Merging (SPAM) state-of-art new technology<br />

that can reduce the inspection time<br />

and hardware scanning path. Single Unified<br />

Management Office (SUMO) uses an 8-core<br />

processor with 128GB of RAM that accelerates<br />

the system to its optimum level of performance.<br />

Simultaneous Efficient Reconstruction<br />

Technique (SERT) and a new 64bit<br />

imaging processor architecture combine Predictive<br />

Slice Height (PSH) into a single scanning<br />

path. Phase Shift Profilometry 2 (PSP 2)<br />

boosts the projection and image acquisition<br />

speed up to 10 times faster using an inhouse<br />

proprietary projector. PSP 2 improves<br />

accuracy and test coverage on 100 percent<br />

pressfit and PTH boards. One of the highlighted<br />

features is 3D CT, which was released<br />

for failure analysis and volume calculation,<br />

while the repair station is for the operator to<br />

view the failed joints in 3D CT to make better<br />

judgement. Users can view the 3D image,<br />

vertical slicing, and 3D CT view at a glance.<br />

The Auto Exposure is a new advanced technology,<br />

with auto learning of the optimal exposure<br />

settings by weaving together the data<br />

from various exposure settings into a projection,<br />

in order to improve the image quality for<br />

very heavily shaded components. The 2 x 2<br />

binning cameras are able to achieve higher<br />

resolutions up to 6 um .<br />

V-One is the new software-based product<br />

that combines all of the previous and future<br />

of the company’s software into one suite of<br />

solutions to connect the inspection machines<br />

in SMT production lines, in order to monitor<br />

their performance on a real-time basis. It<br />

allows users to manage factories smarter<br />

and optimize factory resources across geographical<br />

locations.<br />

www.vitrox.com<br />

92 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

Software packages and backend<br />

quality management<br />

Digitaltest, Inc. demonstrated their latest<br />

flying probe solutions, engineering<br />

data exchange tools, back-end quality<br />

management software and their ICT systems.<br />

The company’s latest stand-alone<br />

versions of C-Link was introduced.<br />

These packages allow any manufacturer,<br />

OEM or EMS provider, to process over<br />

seventy CAD systems and output data<br />

for all test and inspection platforms used<br />

in electronics manufacturing. The company<br />

believes C-Link is easiest way to<br />

pass data from CAD to production and<br />

test. Their software suite also provides<br />

the facility to compare and analyze<br />

boards with many tools including Design-For-Manufacturing<br />

(DFM) and Design-For-Test<br />

(DFT). The EMS Edition of<br />

C-Link is bundled with all their CAD Importers<br />

and your choice of Test, Inspection<br />

and Manufacturing outputs. Whereas,<br />

the OEM Edition is fully configurable<br />

for every environment.<br />

The latest Condor flying prober now provides<br />

the highest fault coverage with enhanced<br />

capabilities for larger boards.<br />

With CITE 7 software, we are now able<br />

to provide automation in the programming<br />

and debug process that provides<br />

the fastest Time-To-Market of any of<br />

their test solutions. When these features<br />

are combined with the throughput, test<br />

capabilities and accuracy provided by the<br />

Condor, they have the most cost-effective<br />

test solution for all low to medium<br />

volume production requirements.<br />

Focused at the back-end test, inspection<br />

and manufacturing processes, the new<br />

release of QMAN allows manufacturers<br />

to quickly understand and control their<br />

process. Providing full reporting packages,<br />

routing checks, manual work instructions,<br />

paperless repair tools and<br />

real-time alarms, QMAN fills in the gaps<br />

missed by current manufacturing software<br />

solutions. In addition, on the hardware<br />

side, the company showed significant<br />

updates to their in-circuit and functional<br />

test systems, which include the<br />

Lambda versions of their MTS systems.<br />

Dependent on the configuration used,<br />

the latest Lambda solutions can deliver<br />

2–6X the productivity of conventional<br />

test systems.<br />

18-camera simultaneous AOI and GTAz range<br />

At the IPC APEX Expo in San Diego, Marantz<br />

Electronics (Mek), showcased its newest and<br />

most advanced optical head available on the<br />

company’s PowerSpector and SpectorBOX<br />

range of AOI machines including a combined<br />

Top/Bottom version.<br />

The GTAz delivers true Stereoscopic imaging<br />

using its 9 high speed (90 Fps) CameraLink<br />

cameras operating in full 24 bit color. This<br />

new generation optical head precludes the<br />

need for external capture cards. Full color 3D<br />

enables the user to actually see the side of<br />

components rather than extruded 2D images<br />

from single camera systems. The result is a<br />

perfect combination of the 2D fast programming<br />

advantages and 3D features such as<br />

verification of body height, tilt and coplanarity,<br />

pin height and solder meniscus profile<br />

analysis in addition to component presence/<br />

absence, polarity, value, angle, offset, color,<br />

extra part detection, solder ball detection,<br />

and short detection.<br />

Unique stereoscopic 3D imaging is achieved<br />

utilizing the full 9 cameras of the GTAz. In the<br />

case of chips, for example, the height<br />

measurement of chip capacitors in combination<br />

with color analysis produces a more<br />

reliable inspection of the chip capacitors<br />

value.<br />

Line Sourced DOAL (Direct on Axis Lighting)<br />

coaxial lighting with high resolution Telecentric<br />

Optics enables the inspection of solder<br />

joints without shadow effects from tall com-<br />

Source: Marantz Electronics<br />

ponents nearby, as well as accurate inspection<br />

model building. Omnidirectional multi<br />

angle, multi color LED lighting provides optimal<br />

illumination regardless of component direction.<br />

The company’s flagship PowerSpector AOI<br />

featuring the GTAz head stands out in situations<br />

where production quality is the top<br />

priority. The PowerSpector series is available<br />

in Desktop, Inline and Dual Inline AOI in an 18<br />

camera, top/bottom configuration for simultaneous<br />

inspection. Simultaneous Top/Bottom<br />

inspection delivers a huge efficiency and<br />

speed boost in both inline and island configurations.<br />

The SpectorBOX GTAz modular AOI can be<br />

used for bottom up/top down inspection of<br />

THT solder joints and the detection of solder<br />

bridges and solder balls. Component clearance<br />

over 5 ”, a 3 ” Z-Axis and 9 cameras per<br />

module allow for maximum THT versatility.<br />

Also on display was the iSpector, a desktop<br />

AOI solution with exceptional defect coverage.<br />

The iSpector is an entry-level machine<br />

for manufacturers requiring high-quality AOI<br />

with a low price tag. Providing a rapid, repeatable<br />

inspection process at an affordable<br />

cost, it’s a plug-and-play installation with<br />

iMentor online training and is exceptionally<br />

easy-to-program.<br />

www.marantz-electronics.com<br />

www.digitaltest.com<br />

PowerSpector and<br />

SpectorBOX range of AOI machines.<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 93


Revolutionizing defect analysis for electronics circuitry<br />

Optimum quality assurance of<br />

hidden connections and features<br />

Saline Lectronics, Michigan, USA, is an electronics contract<br />

manufacturer (EMS), offering to solve the most complex technical<br />

production challenges with its impeccable quality standards.<br />

Up to date with the latest technological advancements<br />

and using advanced manufacturing equipment, the EMS company<br />

invests in the 3D X-ray system Nikon XT V 160.<br />

Davina McDonnell, Marketing Director, Saline Lectronics, USA<br />

Established in 2002 in the same-named city, Saline Lectronics is<br />

an electronics contract manufacturer based in Saline, Michigan.<br />

Lectronics encompasses a talented and experienced team of electrical,<br />

mechanical, test and quality engineers, offering comprehensive<br />

assembly and manufacturing support for products. The aim for<br />

Saline Lectronics is to solve the most complex and technical challenges<br />

in electronics for its customers. Up to date with the latest<br />

technological advancements, the manufacturer invests in only the<br />

best equipment.<br />

Guaranteeing continuous product performance<br />

As Lectronics’ customers continue to design highly-complex, highly<br />

reliable, and extremely dense circuit board assemblies, it’s crucial<br />

that both of the company’s teams, the manufacturing specialists as<br />

well as the engineers, can properly inspect and safely guarantee the<br />

manufacturing quality of those electronics circuitries. In order to<br />

guarantee the performance of a product throughout its entire lifecycle<br />

without any problem, you need to see and analyze the connections<br />

of hidden solder joints underneath bottom-terminated<br />

components such as BGAs and others.<br />

Traditionally, the electronics manufacturing industry has relied on<br />

manual visual inspection, or 2D X-ray systems for a long time, to determine<br />

whether or not a soldered connection is acceptable. Unfortunately,<br />

both of these methods are highly unreliable and completely<br />

subjective in their diagnosis by the human operators. It’s<br />

been shown that without an accurate picture of what’s going on<br />

underneath a component package, technicians won’t always agree<br />

on what constitutes an appropriate solder joint.<br />

To remove the subjectivity of measuring accurate connections in<br />

leadless components, Saline Lectronics recently invested in a Nikon<br />

XT V 160 with a Varian 1313Dx flat panel detector and X.Tract technology.<br />

Upgrading from a 2D X-ray system, this new, high-quality<br />

PCBA inspection system will allow Lectronics’ technicians to get inside,<br />

underneath, and a highly-magnified look at component connections<br />

for complex printed circuit board assemblies (PCBAs).<br />

Jason Sciberras, Manufacturing Manager and Denise Keunzer,<br />

Senior Process Engineer, operating the Nikon XT V.<br />

Exposing hidden features<br />

“Our old machine was simply an X-ray,” commented Scott Sober, VP<br />

of Operations and Manufacturing at Lectronics. “The Nikon XT V<br />

160 is a proper inspection tool. With it, I will definitively know that<br />

my manufacturing process is providing excellent results for all bottom-terminated<br />

components.” This X-ray equipment will expose any<br />

hidden features allowing further examination into BGAs and other<br />

array style package, as well as inspect heels of solder joints, finepitch<br />

packages, and internal characteristics of solder joints. With a<br />

proprietary NanoTech 160kV X-ray spot and electromagnetic lens,<br />

this system offers the latest digital imaging technology available and<br />

produces clear, sharp images at the micron level.<br />

This Nikon XT V 160 will also serve as an excellent process development<br />

tool for Lectronics. Getting clear pictures of specific areas on a<br />

PCBA that were not previously seen on older X-ray systems, will<br />

help to reveal any hidden, unknown defects. With defects being<br />

brought to light sooner in the assembly process, Lectronics’ manufacturing<br />

team will be able to engage in root-cause analysis, and update<br />

production procedures in order to prevent the defects from reoccurring.<br />

Source: Saline Lectronics<br />

94 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

Automated inspection saves time<br />

With the automated inspection mode feature on the Nikon XT V<br />

160, Lectronics will be able to program a variety of routines into the<br />

system that will function as batch automated X-ray inspection (AXI).<br />

These routines will automatically control a certain PCBA, or an area<br />

with components on the board, and perform a full 2D and 3D analysis<br />

of the region of interest. This will enable Lectronics’ technicians<br />

to quickly and intuitively run routines of repeated inspections for<br />

production circuit board assemblies.<br />

Running routines will help the manufacturer‘s team save time on<br />

first-time build assemblies, as well as during the troubleshooting<br />

process of any production fall-out. The intelligent program control<br />

feature on the X-ray machine allows for customization of the system<br />

controls, which makes setting up the camera for each PCBA seamless<br />

and quick.<br />

An unprecedented magnified view<br />

“We chose the Nikon system because of the X.Tract software,”<br />

commented Jason Sciberras, Lectronics’ manufacturing manager.<br />

“The laminography technology gives us an unprecedented, magnified<br />

view of any ball underneath a BGA. Even if the BGA has 2,000<br />

balls, I can examine each one individually from any angle. This technology<br />

will completely revolutionize how we measure appropriate<br />

connections.”<br />

X.Tract works by taking 2D images at the submicron level 360 degrees<br />

around the PCBA or component of interest. Those sliced, 2D<br />

images are then reconstructed into a detailed 3D model that can be<br />

analyzed on any plane with the X.Tract analysis tool. The highly-magnified<br />

3D image will give Lectronics’ technicians insight into defects<br />

that are typically obscured in standard 2D X-ray systems such as<br />

head-on-pillow (HoP), open solder joints and cracks. Additionally,<br />

X.Tract helps to isolate views of the different layers of complex<br />

component packages such as package-on-package (PoP) or multichip<br />

modules.<br />

NEW & UNIQUE:<br />

Our Labtester LT101<br />

Unbeatable ratio of cost<br />

of ownership<br />

Smart program teaching with 7“<br />

touch screen<br />

State of the art data export<br />

(USB, Bluetooth, Ethernet, WLAN)<br />

Industrie 4.0 ready<br />

Pulltester LT101<br />

For further information please visit us<br />

at the<br />

Hall 4 Booth 442<br />

Source: Saline Lectronics<br />

Close-up 3D rendering of the BGA balls on a specific plane and angle.<br />

or contact us directly!<br />

F&S BONDTEC Semiconductor GmbH<br />

Industriezeile 49a<br />

A-5280 Braunau am Inn, Austria<br />

T: +43.7722.67052.8270<br />

F: +43.7722.67052.8272<br />

Mail: info@fsbondtec.at<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 95<br />



Sliced 2D images are reconstructed into a 3D model that can be analyzed<br />

on any plane with the X.Tract analysis tool.<br />

Non-destructive testing saves money<br />

The enhanced visual inspection of the Nikon X-ray system will afford<br />

in-depth analysis during troubleshooting that will be enormously<br />

beneficial to Lectronics’ test engineers. In previous cases of unknown<br />

production failures, if the board had a micro-BGA or QFN,<br />

the PCBA may be sent out for cross-sectioning and destructive testing<br />

to best determine root cause. By being able to examine these<br />

components in-house, without destroying the PCBA, Lectronics will<br />

not only guarantee a faster resolution to test fall-out, but also save<br />

clients’ precious time and money.<br />

The 3D X-ray technology will also be incredibly beneficial for Lectronics’<br />

mechanical assembly technicians as they assemble and<br />

complete different types of box-build products. Of all the different<br />

products that Lectronics assembles, electro-mechanical builds<br />

make up about 40 % of the total business. With this new 3D X-ray<br />

analysis, technicians will be able to see inside closed box-build units<br />

to guarantee that everything is sitting correctly inside of the module.<br />

The X-ray system will prove that components are not put under<br />

any additional stress after mechanical assembly is finalized.<br />

Clear pass/fail reporting with Inspect-X<br />

The Inspect-X feature provides a full, real-time, automated reporting<br />

system that details the X-ray system’s inspection results. Reports<br />

are fully customizable and will detail the analyses results of the specific<br />

components that were inspected with both 2D and 3D images<br />

of the solder connections underneath analyses components.<br />

The Inspect-X reports will also clearly define passed and failed components<br />

with quantifiable data to support those determinations.<br />

These reports will be invaluable to Lectronics’ customer base. With<br />

a variety of clients in the medical and aerospace industries with<br />

Class 3 assembly requirements,<br />

Lectronics will now be able to supply these patrons with real-time<br />

data and 3D images that show the proper conditions of solder joints<br />

on their assemblies, and thus help to eventually guarantee the functionality<br />

and reliability of the entire PCBA.<br />

“As a future-thinking organization, we are always investing in the appropriate<br />

tools and resources to provide our customers with unparalleled<br />

quality,” commented Mario Sciberras, Lectronics’ President<br />

and CEO. “This Nikon X-ray will better ensure quality for highly-complex<br />

circuit board assemblies with leadless components.”<br />

SMT Hybrid Packaging, Booth 4-306<br />

www.nikonmetrology.com<br />

Source: Saline Lectronics<br />

Nikon XT V 160 X-ray inspection system.<br />

Zusammenfassung<br />

Mit der Einführung eines leistungsfähigen automatischen Röntgensystems,<br />

das mittels Laminographie schichtweise aufgenommene<br />

2D-Schnitte der Objekte für die Analyse in 3D als Rekonstruktion<br />

ermöglicht, hat eine EMS-Company sein Inspektionsequipment für<br />

die Qualitätsüberwachung erweitert. Das Nikon-Röntgensystem<br />

versetzt den Anwender in die Lage, gezielt unter BGAs, QFNs und<br />

anderen Bauteilen mit verdeckten Kontakten bzw. Pins diese problemlos<br />

zu kontrollieren. Damit wird zum einen die hohe Qualität<br />

und Zuverlässigkeit der Elektronikbaugruppen in der Fertigung abgesichert<br />

und zum anderen haben sich damit deutliche Potentiale<br />

für Kostensenkungen in Produktion und Qualitätssicherung erschließen<br />

lassen.<br />

Résumé<br />

Avec l‘introduction d‘un système de radiographie automatique performant<br />

procédant par prises de couches en 2D des objets en vuede<br />

leur analyse en 3D grâce à laminographie par reconstruction,<br />

une société de sous-traitance électronique a complété son équipement<br />

d‘inspection pour la surveillance de la qualité. Le système<br />

de radiographie Nikon met l‘utilisateur en capacité de contrôler<br />

sans problèmes de manière ciblée sous boîtiers BGA, QFN et autres<br />

composants dont les contacts ou les broches sont cachés.<br />

Ainsi, la qualité et la fiabilité élevées des modules électroniques<br />

ont été assurées dans la la fabrication, d‘autre part de nets potentiels<br />

de baisse des coûts ont pu être dégagés au niveau de la production<br />

et de l‘assurance de la qualité.<br />

Резюме<br />

Благодаря внедрению производительной автоматической<br />

системы рентгеновского исследования, которая позволяет<br />

реконструировать из послойно отсканированных при помощи<br />

томографии двухмерных слоев объектов объёмные<br />

трёхмерные объекты для анализа, компания EMS получила<br />

инспекционное оборудование для контроля качества.<br />

Рентгеновская система Nikon позволяет потребителю<br />

направленно и без проблем контролировать состояние<br />

контактов, расположенных под BGA, QFN и другими узлами с<br />

закрытыми контактами. В результате, с одной стороны,<br />

гарантируется высокое качество и надежность электронных<br />

узлов в процессе изготовления, а с другой — открываются<br />

явные возможности для уменьшения расходов на<br />

производство и обеспечение качества.<br />

Source: Saline Lectronics<br />

96 <strong>EPP</strong> <strong>EUROPE</strong> May 2017



Full inspection solution for PCB assembly<br />

Vi Technology, a provider of inspection solutions<br />

for PCB assembly, will exhibit at SMT<br />

Hybrid Packaging, scheduled to take place<br />

May 16–18, 2017 at the Messe in Nuremberg,<br />

Germany. The company will show its<br />

5K 3D AOI coupled with the PI Series 3D SPI<br />

and Sigma Link to create a complete inspection<br />

solution for smart factories.<br />

The process improvement software, Sigma-<br />

Link, coupled with two high performance<br />

systems, from the PI Series (3D SPI) and K<br />

Series3D (3D AOI) products families, drive<br />

PCBA process control in new ways. A new<br />

era in process control begins. The result is<br />

one integrated solution for automated optical<br />

inspection, with a live link between systems<br />

and smart interface to improve the SMT process<br />

and productivity.<br />

For Smart Factories, the software is the essential<br />

element to combine all inspection<br />

data and transform them into valuable information<br />

for the users. This real-time interface<br />

ensures full traceability and enables interlocking<br />

of machines to automate SMT<br />

lines while driving yields to new levels, especially<br />

important for the automotive, aerospace<br />

and defense sectors.<br />

The new 5K 3D is a full 3D AOI based on<br />

laser technology with angled cameras combined<br />

with best-seller Spectro optical solution.<br />

This new-patented 3D AOI combination<br />

offers complete defect coverage with high<br />

precision metrology.<br />

SMT Hybrid Packaging, Booth 4-240<br />

www.vitechnology.com<br />

Source: Vi Technology<br />

Vi Technology will<br />

be exhibiting at the<br />

SMT show 2017.<br />

Inline solutions & boundary scan<br />

Acculogic Inc., a global leader in electronic<br />

production test solutions, exhibited at the<br />

2017 IPC APEX Expo, company representatives<br />

demonstrated the FLS980 Series III,<br />

Scorpion Briz test & programming station,<br />

and comprehensive line of boundary scan<br />

test tools. Additionally, the company introduced<br />

high volume inline solutions, as well<br />

as, end of line functional test.<br />

The FLS980 Series III with the ultimate accuracy<br />

package option, along with high throughput<br />

features such as the latest version Flying<br />

Bed of Nails (FBON), was showcased at the<br />

show. The new ThermoScan thermal imaging<br />

test solution and MicroScan miniature image<br />

observation and testing solutions were also<br />

displayed.<br />

The Scorpion Briz is a compact, totally customizable,<br />

all-in-one test station. It can be<br />

configured to perform in-circuit, functional<br />

and boundary testing, and in-system programming.<br />

As a result, in one manufacturing<br />

stage users can achieve the highest level of<br />

test coverage, perform device programming,<br />

and meet and exceed throughput requirements.<br />

This makes the station a truly affordable<br />

tester.<br />

The company’s comprehensive line of<br />

Boundary Scan Test tools can be effectively<br />

used in the entire product life cycle, starting<br />

with design verification and validation and<br />

continuing into pilot production and manufacturing.<br />

Use of these tools in field service and<br />

repair depots can help further reduce test<br />

cost and cycle time. Additionally, the Scan-<br />

Navigator integrated boundary scan test environment<br />

offers a quick, easy and a cost-effective<br />

way to perform boundary scan test<br />

using Teradyne’s Di-Series, family of C-size<br />

VXI digital test instruments.<br />

www.acculogic.com<br />

Multi-reflection suppression sensor technology<br />

CyberOptics Corporation, a developer and<br />

manufacturer of high-precision 3D sensing<br />

technology solutions, will display an advanced<br />

ultra-high resolution Multi-Reflection<br />

Suppression (MRS) sensor for the company’s<br />

SQ3000 3D Automated Optical Inspection<br />

(AOI) system at the upcoming SMT Hybrid<br />

Packaging, scheduled to take place May<br />

16–18, 2017 at the Messe in Nuremberg,<br />

Germany.<br />

The company has advanced the proprietary<br />

Multi-Reflection Suppression (MRS) sensor<br />

to an even finer resolution. The ultra-high resolution<br />

MRS sensor will be an option available<br />

for the award-winning SQ3000 3D Automated<br />

Optical Inspection (AOI) system. This<br />

sensor enhances the SQ3000 3D AOI platform,<br />

delivering superior inspection performance,<br />

ideally suited for the 0201 metric process<br />

and micro-electronic applications where<br />

Multi-Reflection<br />

Suppression sensor.<br />

Source: CyberOptics Corporation<br />

an even greater degree of accuracy and inspection<br />

reliability is critical.<br />

“The ultra-high resolution MRS sensor enables<br />

an even greater degree of accuracy<br />

that will provide our customers superior inspection<br />

performance and reliability to address<br />

the finer 0201 metric and micro-electronics<br />

applications,” said Dr. Subodh Kulkarni,<br />

the President and CEO. “This advancement<br />

will enable CyberOptics to further penetrate<br />

these market applications that have<br />

the most stringent requirements.”<br />

The SQ3000 3D AOI system maximizes ROI<br />

and line utilization with multi-view 3D sensors<br />

that capture and transmit data simultaneously<br />

and in parallel, accelerating 3D inspection<br />

speed versus alternate technology.<br />

The proprietary MRS sensor technology with<br />

the highly sophisticated 3D fusing algorithms<br />

offers microscopic image quality at production<br />

speeds.<br />

The company’s CyberGage360 3D scanning<br />

and inspection system and SE600 SPI system<br />

will also be demonstrated.<br />

SMT Hybrid Packaging, Booth 4-101<br />

www.cyberoptics.com<br />

<strong>EPP</strong> <strong>EUROPE</strong> May 2017 97


Advertisers / Editorials<br />

Acculogic Inc. 97<br />

AEGIS Software 22-23<br />

AIM Metals & Alloys LP 7<br />

Alpha Assembly Solutions 53<br />

Aros electronics 70<br />

ASM Assembly Systems 70<br />

ASSCON Systemtechnik-<br />

Elektronik GmbH 82<br />

BTU International, Inc. 67<br />

CyberOptics Corporation 97<br />

Data I/O Corporation 58<br />

Digitaltest, Inc. 93<br />

DOCERAM GmbH 5<br />

Dow Corning 86<br />

Electrolube a Division of<br />

H.K. Wentworth Limited 81<br />

Ersa 3, 26-27, 18, 50<br />

Essemtec 87<br />

Europlacer 82<br />

EVS International 67<br />

F&S Bondtec Semiconductor 95, 88<br />


Prüftechn.f.d.Elektronik 45<br />

FUJI Machine Europe 28-29, 14<br />

Hanwha Techwin Automation<br />

Americas, Inc. 49<br />

Henkel 79<br />

Hoang-PVM 49<br />

IBL Löttechnik 83, 10<br />

Indium 76<br />

Indium Corporation 30-31, 49, 6, 53<br />

Interflux Electronics 56<br />

Inertec Löttechnik GmbH 80<br />

IPC 7, 13<br />

IPC APEX Expo<br />

8<br />

IPTE 53<br />

ITW EAE – Speedline<br />

World Headquarters<br />

9<br />

Juki Corpo<br />

oration<br />

6<br />

This issue carries an insert from<br />

AdoptSMT Europe GmbH,<br />

AT- Grödig b. Salzburg<br />

We ask our readers for their<br />

kind attention.<br />

Christian Koenen GmbH 24-25<br />

Koh Young Europe GmbH 32–33, 100<br />

Koh Young Technology 40<br />

Kurtz Ersa North America 58<br />

KYZEN 83<br />

LPKF 79, 60<br />

Luger Research e.U. 12<br />

MatriX Technologies GmbH<br />

A Nordson Company 34-35<br />

Marantz Electronics 93<br />

MB Elettronica 73<br />

Metcal 58<br />

MicroCare 46<br />

Microtronic GmbH 91<br />

MIRTEC 91<br />

Nikon 94<br />

Nordson 92<br />

Nordson ASYMTEK 83<br />

Nordson Corporation 7<br />

Nordson MARCH 54<br />

Nordson Yestech 91<br />

PACE Worldwide 63<br />

Precision Valve & Automation, Inc. 86<br />

Rehm Thermal Systems 59, 64<br />

Saline Lectronics 94<br />

Scheugenpflug AG 87<br />

SEHO 13<br />

SEHO Systems GmbH 67, 79<br />

SolderStar Ltd 45<br />

Sonderhoff 84<br />

Specialty Coating Systems 45<br />

Speedprint Technologies 82<br />

Super Dry Totech 59<br />

TCI 50<br />

Techcon Systems 86<br />

TopLine 87<br />

ULT 68<br />

Vi TECHNOLOGY 36-37, 97<br />

Viessmann Elektronik 64<br />

Viscom 33-39,13<br />

Weller Tools GmbH 63,81<br />

Yamaha 73<br />

Yamaha Motor IM Europe 80<br />

ISSN 1618–5587<br />

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98 <strong>EPP</strong> <strong>EUROPE</strong> May 2017

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