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Industrie<br />

| The network of expertise for industry<br />

11 2017<br />

www.epp-europe.eu<br />

INTERVIEW<br />

Paolo Bertoldo, Seica<br />

The Compact series has<br />

been designed for maximum<br />

configurability<br />

COVER<br />

Zero-defect green manufacturer<br />

uses selective soldering<br />

CONTENT<br />

Trade shows + events<br />

What the future holds at<br />

productronica 2017<br />

PCB + Assembly<br />

The workplace in the<br />

age of Industry 4.0<br />

Selection and application<br />

of protection compounds<br />

productronica<br />

Visit us at<br />

Booth A2.281<br />

Test + Quality Assurance<br />

Combined 2D and 3D<br />

technologies offer the<br />

best inspection coverage<br />

special<br />

supplement<br />

fair guide


Together in Process Perfection<br />

Together we are meeting increasing demands<br />

of automotive and smart device manufacturers<br />

With the exponential growth of electronics in cars, smart phones and homes, manufacturers are demanding<br />

improvements in throughput, yield and performance. Miniturization and other technical challenges require<br />

continuous advancement in manufacturing equipment. ITW EAE brings together the world-leading brands<br />

of electronics assembly equipment. Brands with reputations for advancing process perfection. The combined<br />

knowledge and experience of the ITW EAE group is driving further innovation and speeding the development<br />

of next generation technology.<br />

See our latest developments at Productronica - Booth A4.554, Nov. 14-17<br />

Learn more at www.itweae.com<br />

A division of Illinois Tools Works


EDITORIAL<br />

Zero defect manufacturer in Malaysia<br />

As our Cover Story, the manufacturer of high-end<br />

medical equipment, Paramit Corporation, has recently<br />

opened an environment-friendly facility. Relying on<br />

Ersa‘s high performance selective soldering technologies,<br />

the company is constantly improving their process<br />

to have a very close to zero-defect production.<br />

They recently acquired 5 systems, not only because of<br />

the familiarity with them, but also because of the first<br />

class customer support.<br />

Green factory in the forest<br />

Production needs us.<br />

Expectations for this year‘s productronica<br />

Taking place at Messe München in November, productronica 2017 is<br />

just around the corner. Over 1,200 companies are expected to be<br />

presenting a wide range of products and services, as well as, their latest<br />

developments and innovations. With the Highlight Days, roundtable<br />

sessions, interactive live shows, parallel fairs, and competitions,<br />

topics like automation, IoT, Smart Factory, Industry 4.0 will definitely<br />

be addressed.<br />

Come visit us at our Booth 281 in Hall A2<br />

DISCOVER<br />

SMART<br />

TECHNOLOGIES<br />

Ersa GmbH, Booth A4.171<br />

LED protection in tough environments<br />

The LED industry has been continuously growing, not only because<br />

of its efficiency, but also because of its durability and<br />

adaptability. However, there are many factors that need to be<br />

considered in order to enhance the longevity, as well as, the<br />

performance of an LED. Depending on environment changes,<br />

exposure to a variety of elements or chemicals, and its utilisation,<br />

different protection media will be needed.<br />

Correct selection of protection compounds<br />

Best inspection coverage<br />

Although AOI and SPI technologies have been around<br />

for a long time, it is only recently that there‘s been a<br />

development and an improvement to these systems.<br />

Companies are now offering the use of 2D and 3D<br />

technologies in one machine, which provides a comprehensive<br />

overall test coverage, while reducing errors<br />

and false calls. Some components may not be<br />

found and inspected by a 2D inspection, but with 3D,<br />

and vice versa. When making an investment with inspections<br />

systems, specific parameters should be<br />

considered.<br />

When production experts benchmark 3D AOI<br />

The productronica shows the whole electronics<br />

production supply chain. During your visit at the<br />

Kurtz Ersa booth you will experience the unique<br />

advantages SMART TECHNOLOGIES offer for<br />

your production: High throughput, top quality, optimal<br />

availability of our systems as well as the consequent<br />

usage of the possibilities of digitization.<br />

Let’s talk about the new chances in electronics<br />

production.<br />

At the productronica 2017 in Munich.<br />

Foto: Tom Oettle<br />

Doris Jetter<br />

Editor-in-Chief <strong>EPP</strong> EUROPE<br />

Munich, November 14 – 17<br />

w w w . k u r t z e r s a . d e


Content 11 2017<br />

<strong>Europe</strong>an Magazine for<br />

Production and Test in the<br />

Electronics Industry<br />

Cover<br />

Zero-defect green manufacturer<br />

uses selective soldering<br />

The zero-defect manufacturer, Paramit Corporation, has recently<br />

opened its second facility in Malaysia. This new location is constantly<br />

striving for high quality products and equipment, which is easier to do<br />

with uncompromising top quality in soldering and the support of a<br />

system supplier.<br />

Ersa‘s high-performance, flexible soldering technology brings the<br />

environment-friendly factory to the top.<br />

Source: Electrolube<br />

Source: Saki Corporation<br />

Source: Messe München<br />

productronica 2017: The entire<br />

value chain for the electronics<br />

manufac turing.<br />

12<br />

36<br />

The correct selection and application of LED<br />

protection compounds.<br />

64<br />

Automated advanced X-ray system with PCT technology<br />

enables full inspection.<br />

News + Highlights<br />

6 Adding strategic marketing & sales capability<br />

Koh Young expands its marketing and eastern sales team<br />

6 Technical center to evaluate cleaning process for customers<br />

Zestron compares cleaning machines<br />

6 Sales representative for Australia, New Zealand New Guinea<br />

Advising on customized solutions (SMT Thermal Discoveries)<br />

8 Equipment that enables a lean manufacturing environment<br />

In-circuit and functional testers (Seica)<br />

10 Vapor phase soldering representative in Vienna, Austria<br />

Asscon acquired a partner for sales and customer support<br />

10 Production supervisor to manufacturing manager<br />

MicroCare‘s promotes employee of 11 years<br />

10 German electronic companies access to advanced systems<br />

Partnership with VJ Electronix and SmartRep GmbH<br />

Trade Shows+ Events<br />

12 What the future holds at productronica 2017<br />

Value chain of electronics production together in one place<br />

14 2.InnovationsFORUM Hungary 2017<br />

Manufacturing technology with zero defect production<br />

18 Technology forum with workshops and expert knowledge<br />

Viscom focused on inspection solutions for electronics industry<br />

18 IPC Hand Soldering Competition to “Heat Up”<br />

Skilled competitors to demonstrate skills at productronica 2017<br />

PCB + Assembly<br />

24 The workplace in the age of Industry 4.0<br />

Communication technologies for the Smart Factory (Aegis)<br />

26 Product Updates PCB + Assembly<br />

28 3-phase project for efficiency improvement<br />

Implementing of an all-around process optimization (Mycronic)<br />

31 Perfect lighting management due to modern LED technology<br />

Efficient light emitting diodes for the automotive industry (Rehm)<br />

34 Product Updates PCB + Assembly<br />

36 Enhancing LED performance in challenging environments<br />

Selection and application of protection compounds (Electrolube)<br />

40 Product Updates PCB + Assembly<br />

4 <strong>EPP</strong> EUROPE November 2017


20<br />

42 Soldering unit vendor ensures clean air<br />

When the soldering specialist bans soldering fume (Seho)<br />

45 Protection of components<br />

Conformal coating over no-clean flux residues (AIM Solder)<br />

48 Contact abuse and 'hot' versus 'cold' switching<br />

Maximizing the reliability of designs (Pickering)<br />

50 Product Updates PCB + Assembly<br />

52 Suitability of an enhanced low melting point alloy<br />

The effects of lead-free soldering temperatures (Interflux)<br />

54 Reduce voiding for low-standoff components<br />

Determine void reducing optimized profile (Indium)<br />

57 Product Updates PCB + Assembly<br />

Source: Ersa<br />

LONGER SERVICE<br />

LIVES – FEWER<br />

FAILURES!<br />

HIGH-PERFORMANCE CERAMICS<br />

BY DOCERAM WILL CHANGE YOUR<br />

TESTING TECHNOLOGY FOREVER!<br />

Packaging<br />

58 Product Updates Packaging<br />

Test + Quality Assurance<br />

60 2D/3D technologies offer the best inspection coverage<br />

Experts benchmarking advanced 3D AOI (Vi Technology)<br />

63 Product Updates Test + Quality Assurance<br />

64 The magic of image reconstruction on-the-fly<br />

3D computed tomography enables full inspection (Saki)<br />

68 Flexible EMS partner focuses on quality<br />

Optical control with high resolution measurement (Mirtec)<br />

71 Product Updates Test + Quality Assurance<br />

72 Benchtop AOI removes production bottleneck<br />

Reacting to an increase in manufacturing demands (Cupio)<br />

73 Product Updates Test + Quality Assurance<br />

Columns<br />

3 Editorial<br />

4 Content<br />

74 Imprint/List of Advertisers<br />

From simple components to complex<br />

assemblies:<br />

For more than 20 years, our profession has been the development and manufacturing<br />

of high-strength and wear-resistant machine elements as well as components made<br />

from high-performance ceramics. Dependable solutions reduce failures and increase<br />

production reliability in various industries such as manufacturing, processing and<br />

automation technology. Whether you need assembly groups, standard or individual<br />

components, we will always have the right product for your application.<br />

Katalog Download unter http://doceram.com<br />

Learn more about our extremely wear-resistant high-performance<br />

ceramics at www.doceram.com or visit us at Productronica 2017,<br />

hall A1, booth 330<br />

DOCERAM GmbH | 44309 Dortmund<br />

0231 925025 950 | doceram.com<br />

<strong>EPP</strong> EUROPE November 2017 5


NEWS + HIGHLIGHTS<br />

Adding strategic marketing & sales capability<br />

In a strategic move by the true 3D measurement<br />

company to further accelerate its<br />

growth and continue delivering intelligent inspection<br />

solutions, Koh Young Americas hired<br />

Brent Fischthal for the newly created position<br />

of Senior Manager for Americas Marketing<br />

and Eastern Regional Sales.<br />

With over 20 years of progressive sales and<br />

marketing leadership roles in the global electronics<br />

assembly industry, Fischthal was the<br />

ideal candidate for the role. He brings industry-focused<br />

experience in marketing strategy,<br />

sales management, business intelligence,<br />

and product management from positions<br />

held previously at Panasonic Factory Solutions<br />

Company, Philips Assembleon, and<br />

Universal Instruments. He holds a B.S. in<br />

Marketing from West Virginia University and<br />

an M.B.A. from the University of Florida<br />

Hough Graduate School of Business.<br />

Fischthal also serves to advance the electronics<br />

industry in several capacities, including<br />

the SMTA Carolinas Chapter Board of Directors<br />

and the SMTA Marketing Committee.<br />

Brent Fischthal, the new Senior Manager for<br />

Americas Marketing and Eastern Regional Sales.<br />

He is also on the Assembly Equipment Statistical<br />

Committee and the Tradeshow Committee<br />

for IPC, a global trade association<br />

serving the electronics assembly industry.<br />

Additionally, he is a member of the Board of<br />

Directors with MESA International, a global<br />

community focused on driving business results<br />

from manufacturing information. Together<br />

with his application and process<br />

knowledge, he has authored several technical<br />

white papers to support the development<br />

of advanced surface mount assembly techniques.<br />

“Our industry-leading 3D measurement technology<br />

is undisputed, and our expanding customer<br />

list proves the fact. While we continue<br />

growing, we are adding key personnel<br />

necessary to expand our world-class organization<br />

and ensure the highest levels of customer<br />

satisfaction,” said Mr. Juan Arango,<br />

General Manager. “Adding Brent to the team<br />

will galvanize our drive and focus. His capabilities,<br />

talents, and leadership will certainly<br />

help propel us forward as we push the leading<br />

edge of 3D measurement technology and<br />

Industry 4.0 integration. With Brent’s industry<br />

experience and customer understanding,<br />

we are positioned for even more success in<br />

the coming years.“<br />

www.kohyoung.com<br />

Source: Koh Young Americas<br />

Training and coaching provider is expanding its team<br />

Responsible for technology coaching sessions of<br />

the Zestron Academy: Dr. Markus Meier.<br />

Source: Zestron <strong>Europe</strong><br />

The Zestron Academy, provider of sessions<br />

for training, coaching and training online lessons<br />

on demand concerning cleaning and reliability<br />

in electronics manufacturing, is looking<br />

forward to welcoming Dr. Markus Meier<br />

as a new contact for technology coaching<br />

sessions.<br />

Dr. Markus Meier received his PhD in chemistry<br />

from the Technical University Munich<br />

and is an expert in the fields of interfacial<br />

chemistry and surface analysis. At the academy,<br />

he is responsible for the organizational<br />

and professional handling of technology<br />

coaching sessions. For this, Dr. Meier pre-<br />

pares individual coaching programs together<br />

with customers that is specifically tailored to<br />

the needs and requirements of the manufacturing<br />

process and based on the knowledge<br />

of the participants. In addition to the professional<br />

training of employees, the technology<br />

coaching within the company’s Academy can<br />

also help to solve specific problems. For<br />

example, issues such as damage analysis or<br />

risk assessment for ionic or particulate impurities<br />

are among other topics part of the<br />

coaching portfolio.<br />

www.zestron.com/us/<br />

Sales representative agreement for Australia/New Zealand/Papua New Guinea<br />

SMT Thermal Discoveries, expert in the field<br />

of mechanical engineering for thermal processes,<br />

has announced the sales representative<br />

agreement with HW Technologies,<br />

which has its headquarters in North Parramatta/Sydney<br />

in Australia. Since 2006, HW<br />

Technologies has been providing the very latest<br />

technical solutions. Through their contacts<br />

in <strong>Europe</strong> and the USA, they are able to<br />

source and advise on customized solutions<br />

for a variety of needs; including acoustic testing<br />

and visualizing, electronic testing, vibrations<br />

testing and surveying, SMT production,<br />

energy systems simulation and optimization,<br />

and more.<br />

Hugo Waibel stated,: „With SMT Thermal<br />

Discoveries, we have a well-respected<br />

partner from the SMD industry on our side.<br />

The long-term experience and the high<br />

quality of the products are just as convincing<br />

as the company’s environmental philosophy.<br />

We look forward to a common cooperation.“<br />

www.smt-wertheim.com<br />

Hugo Waibel, the CEO of HW Technologies.<br />

Source: SMT Thermal Discoveries<br />

6 <strong>EPP</strong> EUROPE November 2017


CONSISTENTLY MORE EFFICIENT.<br />

<br />

<br />

<br />

<br />

www.sick.com/smart-sensors<br />

<strong>EPP</strong> EUROPE November 2017 7


NEWS + HIGHLIGHTS<br />

INTERVIEW<br />

Flexible equipment enables a<br />

Lean manufacturing environment<br />

Source: Seica S.p.A.<br />

Paolo Bertoldo, part of<br />

the Automotive Business<br />

Development Dep. of<br />

Seica, discusses the<br />

company‘s Compact line.<br />

Electronics manufacturers are facing many challenges. The industry,<br />

especially in <strong>Europe</strong>, is focused on small to medium batch sizes,<br />

which require more frequent line changes. This can negatively affect<br />

productivity and can lead to excess wastage. New technologies, including<br />

flexible boards and smaller components, also make line<br />

changes even more difficult and demanding.<br />

To stay productive and profitable, while increasing efficiency, equipment<br />

needs to be flexible enough to cope with a wide variety of<br />

product variations, and still be able to changeover to different designs<br />

quickly and easily without disturbing the workflow of the<br />

plant. To cope with these changing demands, manufacturers may<br />

turn to a single machine that can perform several tasks, instead of<br />

having several dedicated pieces of equipment.<br />

In this article, we talk to Paolo Bertoldo, Automotive Business<br />

Development Dep. of Seica, to understand how the company’s<br />

Compact line of in-circuit and functional testers help manufacturers<br />

to meet the needs of today’s manufacturing industry.<br />

How are manufacturers incorporating<br />

the Lean philosophy?<br />

Manufacturers often follow guidelines to enable them to implement<br />

the latest techniques and meet global standards. The World Class<br />

Manufacturing (WCM) guideline was created with the intention of<br />

defining manufacturing practices according to standards recognized<br />

worldwide. The basic tenet of the guideline is the systematic reduction<br />

of all types of waste and loss through the use of rigorous<br />

methods and standards, with the involvement of everyone in the organization.<br />

How does the Compact range help manufacturers?<br />

Firstly, I think it is important to stress the need for flexibility in<br />

manufacturing. The Compact series has been designed for maximum<br />

configurability, to enable the series to meet today’s diverse<br />

test requirements. This flexibility defined by the VIP platform allows<br />

the user to choose the configuration which best suits the application:<br />

in-circuit tester, in-circuit programmer, functional test bench,<br />

or a completely automated test solution to provide a powerful tool<br />

that is not confined to one specific function.<br />

The configurability of the range is supported by the single Seica proprietary<br />

VIVA software environment, meaning that all of the test<br />

functions mentioned above can be implemented easily. The single<br />

environment means that technicians only need to learn one set of<br />

tools, saving training time and costs. It has integrated tools to deal<br />

with test program generation, debug, execution, diagnostics, repair<br />

and data logging.<br />

The Functional Graphic Environment guides the user through a<br />

series of automated operations in an intuitive environment. A series<br />

of complete test libraries for both analog and digital components is<br />

available in the dedicated test language.<br />

VIVA is also compatible with numerous other “front-end” packages<br />

and allows easy integration of external software modules, as well as<br />

third party languages and sequencers such as Labview and Test-<br />

Stand.<br />

How is the system manufactured to be so flexible?<br />

At the core of all Compact systems is the ACL Synthetic Instrument,<br />

which uses independent D/A and A/D converters for each<br />

synthesized instrument. Each card hosts three independent Arbitrary<br />

Waveform Generators, a Multimeter, a Timer-Counter, and large<br />

on-board memory and processing capability to enable signal analysis<br />

and digital scope functionalities. Four high speed digital channels<br />

are also available and routed, like other signals, through the analog<br />

signal bus, or can be directly accessible on the front panel.<br />

Controlled by the system PC through the high-speed fiber-optic bus,<br />

the resources present in the card reach the device under test by<br />

The Compact series has been designed for maximum configurability.<br />

Source: Seica S.p.A.<br />

8 <strong>EPP</strong> EUROPE November 2017


Source: Seica S.p.A<br />

The company‘s Compact line of<br />

in-circuit and functional testers<br />

help to meet the needs of today‘s<br />

manufacturing industry.<br />

using digital and analog cards, which are then available on the system<br />

receiver for any type of use.<br />

Does the company’s platform support the latest<br />

test requirement?<br />

I can start with an example: if Boundary Scan testing is required,<br />

the company’s Virtual Bed of Nails (VBN) capability can increase test<br />

coverage using the JTAG pins on the UUT as a group of I/O virtual<br />

channels, adding driving and sense capability, even though direct access<br />

is not available for that group of pins. The VBN module does<br />

not require additional hardware resources.<br />

Besides that, a fully-integrated On-Board Programming (OBP) solution<br />

can be included in any Compact series system. This solution<br />

offers important advantages in terms of operational costs, speed<br />

and ease of use, ensured by the dedicated SW management environment.<br />

The maximum configuration is up to 16 devices that can<br />

be programmed simultaneously, which includes an available library<br />

of dozens of available plug-ins.<br />

Technicians only need to learn one set of tools, saving training time and costs.<br />

It has integrated tools to deal with test program generation, debug, execution,<br />

diagnostics, repair, and data logging.<br />

Source: Seica S.p.A.<br />

Source: Seica S.p.A.<br />

The database can collect repair actions on multi-panel boards, on board<br />

panels, and single boards. The SPC tool enables the statistical analysis<br />

of test data, and the generation of CP, CPK, and Gauge R&R reports.<br />

Moving on to software features, can we discuss<br />

the repair station or statistics modules?<br />

The repair station module provides a graphic software environment<br />

for fault location and repair. After the test phase, the operator can<br />

recall and visualize the faults detected on every tested board and<br />

the relative circuit connections of the implicated components. A dialogue<br />

displays all the critical points requiring inspection, and allows<br />

the operator to enter the information regarding the repair actions<br />

performed, which are then stored in a database.<br />

The QSTAT tool uses this database to generate troubleshooting tips<br />

and repair information for the operator, and can create reports related<br />

to repair activity on boards tested. To facilitate the collection<br />

and analysis of data, the database can collect repair actions on<br />

multi-panel boards, on board panels, and single boards. The SPC<br />

tool enables the statistical analysis of test data, and the generation<br />

of CP, CPK, and Gauge R&R reports.<br />

What if I need to perform functions that are not<br />

supported by the base tester?<br />

The open architecture of the VIP platform enables the easy integration<br />

of external software and hardware modules, managing not<br />

only test, but also with programing capabilities. For example, additional<br />

modules are available for high voltage analysis or RF testing.<br />

Apart from the test process, how does the Compact<br />

range facilitate Lean manufacturing practices?<br />

The WCM guidelines go much further than manufacturing, defining<br />

manufacturing practices in general. For instance, the Compact line<br />

machines are designed to comply with the ergonomics, servicing,<br />

and safety features described by the guidelines. This makes the<br />

range easy to use and safe for the operator, while being easily accessible<br />

for servicing. All gauges and indicators are positioned for<br />

easy monitoring, and the machines are designed to reduce or eliminate<br />

downtime.<br />

productronica, Booth A1.445<br />

www.seica.com<br />

<strong>EPP</strong> EUROPE November 2017 9


NEWS + HIGHLIGHTS<br />

Vapor phase soldering representative in Vienna, Austria<br />

Asscon Systemtechnik Elektronik GmbH, a<br />

manufacturer of vapor phase soldering equipment,<br />

has found a new partner for its business<br />

in Austria: Stepan GmbH. From now on,<br />

they will provide sales, service, and support<br />

for the manufacturer’s portfolio of soldering<br />

solutions from its HQ in Vienna. The main<br />

contact for Austrian customers is Mr. Stefan<br />

Kessler, one of Stepan’s general managers<br />

and a long-time, experienced SMT expert.<br />

“I’m sure that in Stepan we have found a<br />

strong business partner in order to localize<br />

and develop new market opportunities in<br />

Austria and to deliver competent support<br />

even quicker to our local customers,” Axel<br />

Wolff, the manufacturer’s Head of Sales explains.<br />

“A deciding factor for our partnering is<br />

their profound knowledge of the industry we<br />

are in, as well as the rich expertise their support<br />

and service staff has,” he goes on. “And<br />

we should not forget that the closely linked<br />

international business facilities in Eastern Eu-<br />

The main contact for Austrian customers is<br />

Mr. Stefan Kessler, one of Stepan’s general<br />

managers and a SMT expert.<br />

rope are being operated in many cases as an<br />

extended work bench for companies with<br />

their HQs in Austria.”<br />

For several years now Klaus Stepan, Stefan<br />

Kessler, and Andreas Höfner have been at<br />

the management of this well-respected company<br />

with facilities running in Hungary, Croatia,<br />

and Slovenia. It can be expected that Asscon<br />

will benefit remarkably from the supplier’s<br />

extensive market knowledge in its<br />

Austrian territory. The representative offers<br />

the complete portfolio of vapor phase soldering<br />

systems, provides support and service,<br />

and is a trustworthy partner for technical advice<br />

on the optimum configuration of the<br />

equipment.<br />

Stepan executive Stefan Kessler comments<br />

on this encouraging agreement with satisfaction:<br />

“With our well-trained and experienced<br />

sales and support team, we assist our clients<br />

with the decision for the best-fitting configuration.<br />

We can provide our customers with allin-one<br />

solutions for maximum production<br />

success, and for this purpose we cooperate<br />

with market leaders and competent machine<br />

suppliers. Just as important as the good<br />

quality delivery of the systems is the aftersales<br />

backing of the clients by our service<br />

and support staff. And of course we also give<br />

free-of-charge telephone support for rapid<br />

clarification of queries”.<br />

www.asscon.de<br />

Source: Asscon Systemtechnik Elektronik GmbH<br />

Production supervisor to manufacturing manager<br />

Mr. Luis Rodriguez has been promoted to<br />

Manufacturing Manager.<br />

MicroCare Corp. has announced that Mr.<br />

Luis Rodriguez has been promoted to the<br />

post of Manufacturing Manager. He will be<br />

responsible for all the manufacturing processes,<br />

including oversight of more than 30<br />

employees. Previously, Mr. Rodriguez was a<br />

production supervisor at the company, managing<br />

about a dozen individuals.<br />

Luis has been with the company for eleven<br />

years. He started as a “line tech” filling aerosol<br />

products and has consistently excelled at<br />

every opportunity with which he has been<br />

challenged. “The environment here is a great<br />

atmosphere, almost like a family,” Mr. Rodri-<br />

Source: MicroCare Corporation<br />

guez said. “We’re growing so fast, and the<br />

company trusts us with such big responsibilities.<br />

We work together and we work hard,<br />

and when we complete something it‘s a<br />

proud accomplishment for all of us.”<br />

Brian King, the Vice President of Operations,<br />

feels that Luis epitomizes the characteristics<br />

the company seeks in new employees. “Our<br />

goal is to help each employee realize his or<br />

her full potential through training, setting<br />

high expectations and even higher standards,<br />

and by developing an atmosphere of trust.<br />

We are incredibly proud of Luis as a person<br />

and as an employee.”<br />

Mr. Rodriguez further said, “MicroCare has<br />

allowed me to grow, to learn new skills and<br />

advance my career,” he said. “Now I understand<br />

that reinvesting in your employees is<br />

huge! Hopefully in the future I can provide<br />

that opportunity to my employees.” He also<br />

hopes to continue to further his career in<br />

manufacturing “hopefully with a larger staff,<br />

more responsibilities, newer products, and of<br />

course more customers!”<br />

Prior to working with the company, Mr. Rodriguez<br />

worked at Guidas Milk in New Britain<br />

and also at Laurel Land Design, a landscaping<br />

company in Burlington, CT. He grew up in<br />

New Britain and graduated from the E.C.<br />

Goodwin Technical High School in 2004.<br />

www.microcare.com<br />

Giving German companies access<br />

to advanced electronic systems<br />

VJ Electronix, Inc., a provider of rework technologies,<br />

X-ray inspection, component counting<br />

systems, has partnered with SmartRep<br />

GmbH as its distributor throughout Germany<br />

and Austria, offering both sales and technical<br />

support capabilities. By partnering together,<br />

the company will be able to provide local<br />

coverage in a more thorough and responsive<br />

manner. The newly appointed distributor is<br />

well-known for its understanding of the challenges<br />

facing electronic manufacturers. With<br />

this partnership, their portfolio has expanded<br />

with the addition of automated rework and<br />

X-ray inspection systems, which will advance<br />

German electronic manufacturing by covering<br />

specific application requirements.<br />

“VJ Electronix is extremely pleased to have a<br />

partnership with one of the most respected<br />

distributors servicing the German speaking<br />

territories,” says Don Naugler, President.<br />

"SmartRep extended the product portfolio<br />

with material management concepts in 2017,“<br />

says Andreas Keller, Managing Director. “In<br />

VJ Electronix, we found a partner who develops<br />

systems that perfectly complete our material<br />

handling solutions. In times of the<br />

smart factory, this field becomes more and<br />

more important and will be very interesting<br />

for our customers.“<br />

www.vjelectronix.com; www.smartrep.de/en<br />

10 <strong>EPP</strong> EUROPE November 2017


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www.cyberoptics.com<br />

Copyright © 2017. CyberOptics Corporation, Inc. <strong>EPP</strong> All EUROPE rights reserved. November 2017 11


TRADE SHOWS + EVENTS<br />

What the future holds at productronica 2017<br />

Value chain for the electronics<br />

manufacturing together in<br />

one place<br />

As one of the most impressive trade fairs for the electronics industry is approaching, productronica 2017 is<br />

getting ready to welcome global market leaders, industry start-ups, and experts from all over the world. This year,<br />

the show will take place from November 14th to the 17th at Messe München in Munich, Germany. Occurring<br />

every two years, the electronics development and production show is always memorable, as it brings the entire<br />

value chain for the electronics manufacturing together in one place.<br />

This year, productronica 2017 will take place on November 14–17<br />

in Munich, Germany.<br />

Source: Messe München<br />

In 2015, visitors came to productronica to see new products and services,<br />

as well as, the latest developments and innovations.<br />

Source: Messe München<br />

At its 40th anniversary in November 2015, the show was a success,<br />

as it brought over 37,000 visitors and 1,000 exhibitors<br />

from 80 countries. 91 % of those visitors were decision makers and<br />

28 % came from a background of manufacturing in the industrial<br />

electronics. This year, even bigger success can be expected, with<br />

over 1,200 companies presenting a wide range of products and services,<br />

as well as, their latest developments and innovations.<br />

From technology to applications, software to process control, and<br />

product to system solution, visitors will get an insight into what the<br />

future will look like for this industry. Throughout the 4 days, professional<br />

insights about important topics, such as zero defect production,<br />

miniaturization, IoT, Smart Factory, and automation will be addressed.<br />

Visitors will also have a chance to take part in special<br />

shows, forums, discussions, and roundtables, as well as, great networking<br />

opportunities.<br />

Highlight Days: Path towards the factory<br />

of the future<br />

This year’s Highlight Days event will focus on the following various<br />

topics; Robots in the electronic production, Industry 4.0-Smart Factory,<br />

Future-oriented EMS, and Miniaturization. During “Industry<br />

4.0– Smart Factory”, <strong>EPP</strong> magazine’s roundtable discussion, in Hall<br />

A1, will focus on the path towards a highly productive, valueoriented,<br />

and transparent factory of the future. Taking place at 12<br />

pm on Thursday November 16th, Dipl.-Ing. Petra Foith-Förster from<br />

Fraunhofer Institute IPA, Stephan Baur from BMK Group, Dr. –Ing.<br />

Friedrich W. Nolting from Aegis Software, and Florian Ritter from<br />

Asys Group will discuss processes towards Industry 4.0. Visitors<br />

will get insights from industry experts on questions, such as: how<br />

to manage the increasing variation diversity, and how to involve employees<br />

in the process?<br />

Cluster structures: For easier navigation<br />

Since the show includes 7 different halls with a total of 7,000 square<br />

meters of space, it is separated into cluster structures. The PCB &<br />

EMS cluster, in Hall B3, includes manufacturing and services within<br />

printed circuit boards and EMS service providers. The SMT cluster,<br />

in Halls A1-A4, includes measurement and test technology, as well<br />

as, quality assurance, for soldering and joining of printed circuit<br />

boards. The Cables, Coils, & Hybrids cluster is located in Hall 5. This<br />

features innovative production solutions for cables, connectors,<br />

wrapped goods, and hybrid components. In Hall B2 will be the<br />

Semiconductors cluster, which will cover the manufacturing of<br />

semiconductors, production of displays, LEDs, micro and nano pro-<br />

12 <strong>EPP</strong> EUROPE November 2017


Source: Messe München<br />

Source: Messe München<br />

Not only do visitors have the chance to network, they are also able<br />

to see first-hand how products function.<br />

This year, over 1,200 companies are expected to be participating at the show.<br />

Source: Doris Jetter<br />

<strong>EPP</strong>‘s roundtable discussion, in Hall A1 on Nov. 16th at 12 pm, will focus on Industry 4.0– Smart Factory.<br />

MEM/Sensors markets. It also includes<br />

applications, such as; hybrid electronics,<br />

smart manufacturing, automotive, Internet<br />

of Things, and more. Having this show<br />

alongside will expand the range of visitors<br />

from the electronics supply chain, creating<br />

an even better opportunity for further<br />

networking, exchanging of ideas and solutions.<br />

The exhibition for Industrial Print Technology,<br />

InPrint, will also take place alongside<br />

the show, in Hall A6. Along with exhibitions<br />

of the latest printing machinery and<br />

systems, drying and curing equipment<br />

will also be present, as well as printing<br />

inks, primers, and liquid coatings. Also on<br />

display will be equipment that prints on<br />

metal, plastics, textile, glass, ceramics,<br />

and wood. Visitors will receive best practice<br />

printing solutions for their manufacturing<br />

processes.<br />

duction, and more. Also included in this hall is the Future Markets<br />

cluster. This covers 3D printing, Smart Factory, Industry 4.0, etc. The<br />

last sector that will take place at this year’s show is the Overall Production<br />

Support, which includes a wide range of products and services<br />

for the entire value-added chain and day-to-day work.<br />

Bringing even more knowledge: Parallel fairs<br />

Embedded in productronica for the second time, IT2Industry@productronica<br />

is following the trending topic of Industry 4.0 by focusing<br />

on ways towards the Smart Factory. Located in Hall B2, this platform<br />

is a “fair within the fair” that gives a chance for ICT systems<br />

and software suppliers access to users in the production of manufacturing<br />

sectors. Exhibitors will be showing their solutions covering<br />

the entire production process, such as embedded systems, M2M<br />

communication, digital networks, cloud computing, IT security, etc.<br />

The Open Conference is also available, which includes 30 lectures,<br />

panel discussions, and keynotes speakers regarding the latest developments.<br />

Visitors will get further knowledge about ICT solutions<br />

and services.<br />

Semicon Europa will also be taking place at the same time as productronica.<br />

This show focuses on the microelectronics industries,<br />

bringing visitors together from the semiconductors, LEDs, and<br />

Special shows and rewards: See it live<br />

Interactive live sessions help visitors and users see how everything<br />

works first-hand. Visitors can attend these special shows that will<br />

present and explain hot topics to the electronic industry. These important<br />

topics include, data collection and processing, cleaning<br />

agents and supplies for cleanrooms, as well as, filtration and metrology.<br />

Also as part of the special shows, the recurring hand soldering competition<br />

will take place, as well as, the HSC World Championship,<br />

where industry experts will compete to complete a functional assembly<br />

within a 60 minute time period. Another recurring event is<br />

the innovation award for 2017. This award will show developments<br />

and techniques that are the most innovative in the electronics production.<br />

Participants will be separated by clusters, giving a total of 5<br />

winners.<br />

A productronica app is available to download that can help visitors<br />

to plan the trip accordingly. There is also the ShowGuide productronica,<br />

that can be found online: https://www.keosk.de/read/<br />

LljCdOUdwsI4I/epaper-<strong>EPP</strong>_<strong>EPP</strong>_<strong>Europe</strong>_ShowGuide_productronica_2017.<br />

Through this guide, a list of exhibitors, schedules, as well<br />

as, map plans of each hall is shown.<br />

www.epp-europe.industrie.de/productronica-2017<br />

<strong>EPP</strong> EUROPE November 2017 13


TRADE SHOWS + EVENTS<br />

2. InnovationsForum Hungary<br />

Manufacturing technology with<br />

zero defect production<br />

Part of a series organized by <strong>EPP</strong>, <strong>EPP</strong>-<strong>Europe</strong>, and EMSNow, InnovationsForum takes place in Germany,<br />

Hungary, and Mexico. As the 2 nd annual InnovationsForum Hungary has come to a close, participants<br />

and guests have collected enlightening information in regards to innovation and the changes occurring<br />

in the manufacturing industry, in Eastern <strong>Europe</strong> and throughout.<br />

2nd annual InnovationsForum<br />

Hungary included 9 partners<br />

discussing different methods to<br />

reach zero defect production.<br />

Source: Bence Kovacs<br />

This year, the event occurred at the Hungarian Academy of<br />

Science in the heart of Budapest with Kim Sauer as the moderator.<br />

The day opened with an informative presentation from the Keynote<br />

speaker discussing new trends and what is driving innovation<br />

in the region. Nine presentations from Partners followed throughout<br />

the day, with an overall theme of how to best reach a zero defect<br />

production when so many conditions can influence the outcome.<br />

Keynote: Tamás Péter Turcsán/ President of Startup Section at Hungarian<br />

Economic Association<br />

Hungarian Innovation: Legend or Reality?<br />

Hungary can be underestimated when it comes to innovation, development,<br />

and manufacturing. As a prime example, not many<br />

people know that Hungarian engineer, Jozef Galamb, a chief engineer<br />

for Ford Motor Company, was one of the primary creators of the<br />

Ford T Model, the most popular car in the 20 th century. The speaker<br />

went on to say that, innovation is imperative in order to be successful.<br />

One needs to follow new trends of business models, all while<br />

opening more channels and creating more opportunities to connect<br />

start-ups with larger companies. Ideas and innovation only become<br />

a realization with financial support and a connection to the market.<br />

This can be better done with corporate networking. The communication<br />

gap between startups with great ideas and larger companies<br />

with financial gain need to be bridged together. The speaker also<br />

IF Hungary took place at the Hungarian Academy of Science in<br />

the heart of Budapest.<br />

gave some insight into what will come next in the future, which is<br />

more automation. Although many are skeptic to go forward with<br />

total automation, the speaker insists that it will not replace workers<br />

with robots or machines. On the contrary, becoming fully automated<br />

will open job opportunities.<br />

Dr. Friedrich W. Nolting, Aegis Software GmbH<br />

Process interlocking with dynamic sample adjustment- A way<br />

to zero defect production<br />

To be able to reach a zero defect production should be no mystery.<br />

According to the speaker, placing a process flow into every connection<br />

is all that is needed, or in other words, getting on board with Industry<br />

4.0. Digital integration is of high importance and should be<br />

implemented throughout the entire process; therefore becoming<br />

paperless. This includes the measurement, testing, and calibrating<br />

sector, so both machines and operators, can become part of the<br />

Source: Bence Kovacs<br />

14 <strong>EPP</strong> EUROPE November 2017


Keynote speaker,<br />

Tamás Péter Turcsán.<br />

Source: Bence Kovacs<br />

Dr, Friedrich W. Nolting,<br />

Aegis Software GmbH.<br />

Source: Bence Kovacs<br />

Kim Sauer was the moderator for<br />

this year‘s event.<br />

Source: Bence Kovacs<br />

Claus Schultz,<br />

Christian Koenen GmbH.<br />

Source: Bence Kovacs<br />

Norbert Heilmann, ASM Assembly<br />

Systems GmbH & Co.KG.<br />

communication flow of the process to obtain the highest quality<br />

data. This digital process not only needs to react quickly to all<br />

changes of non-predesigned thresholds, but it should also have a<br />

self-learning process. Therefore, the root cause of any problems or<br />

quality issue will be known to the operators in order to make quick<br />

decisions. In order to no longer produce excess scrap, these features<br />

should include interlocking processes (alarms), going off when<br />

any irregularities occur. By integrating the entire process digitally, on<br />

average, NPI time has decreased from 24 hours to 6 hours, rework<br />

and debug time have decreased by 50 %, assembly rework has decreased<br />

by 28 %, and average productivity has increased by 10 %.<br />

As Mr. Friedrich also stated, “zero defect isn’t an innovation, it is a<br />

requirement for modern factories”.<br />

Claus Schultz, Christian Koenen GmbH<br />

New high tech materials for stencil printing<br />

When comparing a Nokia 3110c to today’s smartphones, the differences<br />

are clear. Complexity and miniaturization is making zero defect<br />

production more difficult to reach. Even more challenging is the<br />

fact that the process of stencil printing is complicated, detailed, and<br />

generally, precision is a problem. However, when it comes to stencil<br />

Scource: Bence Kovacs<br />

printing, the material of the stencil is very important. With the recently<br />

released Nanovate Nickel material, stencil printing increases<br />

the quality of products. This material is not only very flexible with a<br />

longer lifespan, but it also has a high laser cutting result with a finer<br />

grain size. Furthermore, this has a better sealing of print deposits,<br />

which means it has sharper, more defined cut edges on a PCB. Due<br />

to its very smooth surface, it also has an improved self-cleaning effect.<br />

For this company, selling solutions for problems their customers<br />

have is the most important factor. This is why innovation is vital<br />

for their strategy, and creating a material with the most benefits, for<br />

a better zero defect production, and for better quality results for<br />

their customers is important.<br />

Norbert Heilmann, ASM Assembly Systems GmbH & Co.KG<br />

Interfaces for RFID and robots – Comprehensive automation<br />

and connectivity in the Smart SMT<br />

Automated factories are the reality of the future, giving more control,<br />

flexibility, and productivity. However, most manufacturers are<br />

not yet equipped for automation, as today’s standardized interfaces<br />

have been created for human beings to use, and not for machines.<br />

Not only is bringing robots into the production challenging, integrating<br />

them into the line is even more difficult. Some production lines<br />

have been created to be user friendly for humans, which would not<br />

work well for robots, and vice versa. This is where new methods for<br />

interfaces need to be implemented, in order for both to work. For instance,<br />

with the Siplace Bulk Feeder, component reels are no longer<br />

needed, replacing cartridges is easy, and a single filler can hold as<br />

many components as about 30 tapes. This means, no splicing is<br />

needed and waste is greatly reduced. According to the speaker, operators<br />

and workers cannot be forgotten when building towards<br />

automation. We have to also keep in mind that making everything<br />

automated for these operators is not the solution. Errors and a decrease<br />

in quality will most likely happen, if this is how we think<br />

about automation. Instead, there needs to be an equal balance between<br />

the two when automating the production lines.<br />

<strong>EPP</strong> EUROPE November 2017 15


TRADE SHOWS + EVENTS<br />

Source: Bence Kovacs<br />

Source: Bence Kovacs<br />

Source: Bence Kovacs<br />

Source: Bence Kovacs<br />

Jonas Ernst,<br />

Fuji Machine MFG (<strong>Europe</strong>) GmbH.<br />

Karthik Vijay,<br />

Indium Corporation.<br />

Rainer Krauss,<br />

Ersa GmbH.<br />

Gábor Tójav, Koh Young<br />

<strong>Europe</strong> GmbH.<br />

Jonas Ernst, Fuji Machine MFG (<strong>Europe</strong>) GmbH<br />

Cutting Edge Technologies: for your high-quality pick and placement<br />

process<br />

When reaching for a perfect production, many factors can influence<br />

the outcome. Over the years, not only has there been an increase in<br />

complexity of products and a demand for faster production, there‘s<br />

also been an increase in labor changeover that has become challenging<br />

to deal with. According to the speaker, there are four factors<br />

that affect quality: man, machine, material, and method. With these<br />

factors in mind, a few points should be followed to be the most successful.<br />

At first, the correct parts need to be in the correct order.<br />

The main concept is to automate as much as possible, however, not<br />

everything can be automated. This means there is still a great need<br />

for operators, and guidance is essential to be the most productive.<br />

Opening communication, not only, between operators and machines,<br />

but also throughout all machines that are part of the line.<br />

Creating a connection between all machines and software will enable<br />

each machine to learn how the operation should work. Lastly,<br />

being able to monitor the process at all times, even remotely, and<br />

analyzing the current situation of the process, will optimize all aspects<br />

of the line.<br />

Karthik Vijay, Indium Corporation<br />

Minimizing QFN Voiding during SMT Assembly<br />

Products, especially in the automotive industry, have now more<br />

electrification, sensors, and hybrid technology. This is why the topic<br />

of voiding is a common issue in the manufacturing industry. The<br />

three most important aspects when engineering flux is decreasing<br />

the overall percentage of void, the positioning of the void, and<br />

breaking up the size of the void. To reduce the amount of voids, the<br />

peak temperature, the speed of the process window for the reflow<br />

profile, the texture of the flux, the temperature of the soaking process,<br />

and the ball melting point should also be considered. The<br />

speaker also discussed the effects that pad design used for reflow<br />

profiles have on voids, depending on the fluxes used. Solutions that<br />

can be used, depending on your needs, are a short reflow profile,<br />

which reduces the void average, while the long hot profile is better<br />

for reducing larger voids. Using a vent, as well as, vacuum soldering,<br />

are also possibilities, as these methods decrease the amount<br />

and size of voids. Placing flat flux coated preforms is also a solution,<br />

when keeping the placement force in mind. Even though there may<br />

be different levels of criteria of voiding, it is becoming more stringent<br />

and is an important part of zero defect production.<br />

Rainer Krauss, Ersa GmbH<br />

Zero defect strategy- feasible or wishful thinking?<br />

Many factors can contribute to errors within manufacturing, however,<br />

many of those cannot be changed. For instance, PCB, components,<br />

and the environment do not give a lot of legroom for drastic<br />

improvements. Instead, manufacturers should focus on altering details<br />

within the operators, process, and machines. Giving the right<br />

tools to the operator and having full control of the entire process, all<br />

while making machines more intelligent, is the key for a zero defect<br />

strategy. Requirements within manufacturing should be Smart, future<br />

oriented systems with modular design, flexible software platforms,<br />

and oriented towards Industry 4.0 or cloud based applications.<br />

It is also imperative to know what is going on within the<br />

process, from beginning to end. A Smart machine should be able to<br />

document the quality of the process. Machines should also know to<br />

alert the operator when something is out of its parameter, but only<br />

after running a few tests. With the company’s Versacam, Versascan,<br />

and Versaeye, the process is controlled with sensors and cameras,<br />

ensuring that components are in the correct position and are not<br />

missing, all while documenting all details throughout the process.<br />

Nevertheless, as the speaker indicated, “A zero defect production is<br />

not black and white. It is cost and product driven; has to deliver<br />

100% good quality. Especially when it comes to safety parts, we<br />

cannot make any compromises.”<br />

Gábor Tójav, Koh Young <strong>Europe</strong> GmbH<br />

Zero defect production in the course of time<br />

Even though technology is evolving at a rapid pace, the goal of<br />

reaching zero defect has never changed. To be the most successful,<br />

the speaker discussed the importance of human-machine communication,<br />

implementing “the clever way” into your production, to<br />

be able to see the entire line. In doing so, the first step to take is to<br />

set up best practices throughout the entire line. The following steps<br />

should ensure to continuously have a high First Pass Yield. With the<br />

company’s solutions, all aspects of the line is measured and controlled.<br />

It records all details of materials used, including its height,<br />

16 <strong>EPP</strong> EUROPE November 2017


István Latos, Nordson<br />

Matrix.<br />

Source: Bence Kovacs<br />

François Amblard,<br />

Vi Technology.<br />

Source: Bence Kovacs<br />

After presentations, short Q&A took place to<br />

answer any questions visitors had.<br />

Source: Bence Kovacs<br />

width, surface, and length. The process also tracks the offset X/Y,<br />

coplanarity, FMI, etc. Receiving information, including the offset<br />

range, predicts problems before they occur, which also improves<br />

throughput, as the amount of scraps decreases, reducing waste<br />

and costs. Specific details about each component is also useful to<br />

have, including measurements of the solder joint, joint volume,<br />

slope, solder angle, height of the joint, etc. The speaker also discussed<br />

the difficulty of dealing with a large quantity of data and how<br />

close to impossible it is to do without the help of machines. This is<br />

why creating a clever platform, which builds communication between<br />

man and machine, is necessary. The operators can handle<br />

programing and tuning, while the machines use intelligent monitoring<br />

to optimize the process, in order to obtain precise information.<br />

István Latos, Nordson Matrix<br />

Committed to speed- Unique X-ray inspection systems and<br />

technologies setting new standards in high volume production<br />

environment<br />

To reach an optimal production line with zero defect, key factors<br />

should be followed when using an inspection system. The first is to<br />

achieve the most speed and stability, all while maximizing the coverage<br />

of defects. According to the speaker, being able to flexibly use 4<br />

inspection technologies, Transmission 2D Imaging, Oblique 2.5D<br />

Imaging, Thomosynthesis 3D, and the company’s Slice Filter Technique,<br />

in one system, will minimize cycle time while inspecting all<br />

defects. For instance, inspecting a double-sided board is no longer a<br />

Source: Bence Kovacs<br />

Guests had the opportunity<br />

to network and<br />

further discuss new<br />

strategies to minimize<br />

risks within the electronics<br />

manufacturing<br />

industry.<br />

challenge, as the system can examine both sides without difficulty.<br />

Another important factor to follow is to not occupy the line. The machines<br />

within the line should be brought up to speed as fast as<br />

possible. The speaker specifically discussed using an offline program<br />

approach and a global library. Using these methods, a large<br />

quantity of boards can be tested for quality as the production is running,<br />

as the machine compares each item to a golden board. The<br />

final factor is ensuring a proper calibration within each machine.<br />

Having automation calibration, where it is transparent to the owner,<br />

all while keeping a constant resolution, will enable communication<br />

between all machines, and optimize the production line.<br />

François Amblard, Vi Technology<br />

Reaching quality production faster by revealing and leveraging<br />

the information buried in SPI & AOI data<br />

Although detecting defects has become easier, due to continuous<br />

improvements within SPI and AOI machines, manufacturers are<br />

now running into new challenges. Due to lack of resources, tolerances<br />

are not being set correctly while production is running. Many<br />

of them are blindly set, which creates uncertainty at the end of the<br />

production line. All information from the SPI and AOI need to be gathered<br />

to pin point exactly where tolerances need to be adjusted.<br />

This is what is called the Feed Forward concept, where all images<br />

of SPI are also transferred to the AOI. For example, if the SPI detects<br />

a defect that isn‘t one, and the AOI does not detect it at all,<br />

then the tolerance needs to be enlarged at the SPI. Another problem<br />

that can arise is the compilation of large amounts of data, as<br />

the speaker pointed out that throughout one day of production, a<br />

line can accumulate one terabyte of information. With a smart purging<br />

process, only information on defects found with the SPI and<br />

AOI is kept, all other data is automatically thrown away. Finding the<br />

root cause of issues can also be challenging. Although this is not a<br />

perfect solution, the company has data analysis with drill down capability.<br />

This means, a line can give automatic attribution to defects<br />

depending on where in the line the problem is found. For instance,<br />

if a defect is found at SPI, it will automatically attribute it to print,<br />

and so on. By using this method, it goes further than the traditional<br />

statistical process control tools, which is normally used today. (cp)<br />

Next year‘s event will take place at Királyi Kastély on May 17, 2018.<br />

www.epp-europe.industrie.de/events-tutorials/innovationsforum-hungary/<br />

<strong>EPP</strong> EUROPE November 2017 17


TRADE SHOWS + EVENTS<br />

PRODUCT UPDATES<br />

Technology forum with workshops and expert knowledge<br />

Participants attended the Viscom Technology<br />

Forum on June 21st and 22nd, which focused<br />

on inspection solutions for electronics<br />

production. Michael Mügge, the company’s<br />

sales engineer, led them through the event,<br />

as the president of the company, Volker<br />

Pape, delivered the welcome speech.<br />

Technical presentations, workshops, tutorials,<br />

and live demonstrations covered different<br />

perspectives, including the Hermes Standard.<br />

Which is an accessible protocol that<br />

could manage manufacturer-independent<br />

communication between machines in the<br />

SMT and THT lines.<br />

Thomas Mückl, Zollner Elektronik AG, furthered<br />

discussed RFID chips with a rewritable<br />

memory that handle intelligent identification<br />

without contact. The data on it is<br />

adapted to each process step; data over the<br />

life cycle and after production can be saved<br />

and recalled.<br />

During this event, the company also presented<br />

their own innovations. Through the<br />

workshops and talks, details on different<br />

topics were discussed, such as, AOI color<br />

gradient inspections and classification based<br />

on realistic 3D images (360View). The company’s<br />

Pilot and the optimal combination of<br />

orthogonal, angled, and 3D inspection based<br />

on a best-mix library were also discussed.<br />

Dirk Nülle, the company’s Head of SP product<br />

development, presented the X7056-II<br />

system, which has a handling speed of under<br />

four seconds during an automatic x-ray inspection.<br />

Rolf Demitz, Vice President of NP, used the<br />

X8068 to demonstrate the advantages of<br />

manual X-ray (MXI). This system includes operable<br />

analysis tools, a robust manipulator,<br />

and automatic opening and closing of the<br />

window. A flat panel detector delivers magnifications<br />

up to 2500x, with multifaceted<br />

Guests arriving at this year‘s Viscom<br />

Technology Forum.<br />

image filters. Rainer Duhm (Applications)<br />

then used this system and a connector with<br />

THT connections to show the 3D reconstruction<br />

of an inspection object with planar computed<br />

tomography. The company’s Product<br />

Developer, Detlef Beer, also discussed current<br />

and future projects.<br />

www.viscom.com<br />

Source: Viscom AG<br />

Mirko Weißgerber presents 3D AOI and other functions in the system<br />

demonstration.<br />

Source: Viscom AG<br />

Volker Pape greets the participants in Technology Forum 2017.<br />

Source: Viscom AG<br />

Hand Soldering Competition to “Heat Up” productronica 2017<br />

In cooperation with productronica 2017, IPC<br />

— Association Connecting Electronics Industries<br />

is presenting its very popular Hand Soldering<br />

Competition at this year’s event. Skilled<br />

competitors will demonstrate their soldering<br />

skills, on 14 – 16 November, as they<br />

compete for cash prizes: 1st place — € 300;<br />

2nd place — € 200; 3rd place — € 100. New<br />

this year, the company will feature the World<br />

Hand Soldering Championship on 17 November,<br />

2017, with the regional winner from productronica<br />

and competitors from around the<br />

world. The winners of the IPC HSC World<br />

Championship will receive cash awards<br />

amounting to: 1000 € to the winner, 500 € for<br />

the runner up and 300 € for third place. The<br />

awards will be presented Friday, November<br />

17. Hand soldering of high density printed<br />

boards demands highly skilled operators to<br />

ensure a zero-defect soldering process, and<br />

this competition will recognize the best skills<br />

in hand soldering complex printed board assemblies.<br />

Over three days, participants will<br />

compete against each other to build a functional<br />

electronics assembly within a 60-minute<br />

time limit.<br />

Assemblies will be judged on soldering in accordance<br />

with IPC-A-610F Class 3 criteria,<br />

the speed at which the assembly was produced<br />

and overall electrical functionality of<br />

the assembly. IPC-A-610 Master Instructors<br />

from the company’s licensed master training<br />

centers will serve as the judges.<br />

Competition entries will be accepted until<br />

November 1 st , by searching hsc-productronica<br />

via the ipc.org website. Participation is limited<br />

and competitors will be selected on a<br />

first-come, first-served basis.<br />

The company thanks Hand Soldering Competition<br />

Gold Sponsors: JBC Tools, Kurtz<br />

Ersa, Weller; Silver Sponsors: Almit GmbH,<br />

Balver Zinn GmbH, and NCAB Group; Bronze<br />

Sponsors: IFTEC, PIEK International Education<br />

Centre, Optilia, MicroCare, ULT and<br />

Weidinger; and contest Contributor Sponsor:<br />

Microsolder, for their support.<br />

productronica, Booth A1.307<br />

www.IPC.org<br />

18 <strong>EPP</strong> EUROPE November 2017


<strong>EPP</strong> EUROPE November 2017 19


COVER<br />

Zero-defect green manufacturer uses selective soldering<br />

Fantastic factory<br />

in the forest<br />

The Paramit Corporation is a California-based “zero-defect” manufacturer<br />

of high-end medical equipment. In November 2016, the American<br />

company opened its second facility in Malaysia, doubling its capacity in<br />

Southeast Asia. Like the headquarters in the US, the “factory in the<br />

forest” strives for a quality of product and equipment that is “better than<br />

the best-in-class”. For uncompromising top quality in soldering, the company<br />

now calls on to five Ersa systems: 2x wave, 2x reflow, 1x selective.<br />

20 <strong>EPP</strong> EUROPE November 2017


COVER<br />

Customers, who have their medical devices manufactured<br />

by the company from California, do not just receive<br />

products which comply with the strict criteria of the<br />

US Food and Drug Administration (FDA) – they actually<br />

get a lot more. The founder and CEO of the company, Billoo<br />

Rataul, puts it like this: "Quality is decisive, but the<br />

Paramit experience goes much further: The motor for our<br />

corporate culture is the passion for constant improvement<br />

and smart problem-solving approaches. We consistently<br />

supply our customers with superb performance<br />

and peace of mind. Over many years, the team has developed<br />

an outstanding production standard by concentrating<br />

on printed circuit board production at Six-Sigma<br />

quality levels, combined with the patented vPoke system,<br />

which enables defect-free mechanical assembly.<br />

This computer-directed system breaks down assembly<br />

and testing of a complex product into hundreds or thousands<br />

of process steps, each of which is validated, verified,<br />

and documented. In assembly, we come very, very<br />

close to the zero-defect ideal – at a rate of under 1 DPMO<br />

(defects per million opportunities)! With a sophisticated<br />

100 % in-line soldering process layout, 3D inspection of<br />

the soldering paste application, fast machine set-up for<br />

high-mix environments, multiproduct-single-setup algorithms,<br />

automated in-line inspection and process validation,<br />

we achieve an almost unbelievable quality level of<br />

10 DPMO – by comparison: the highest IPC standard<br />

achieved in a high-mix low-volume environment is 30<br />

DPMO.<br />

Source: Kurtz Ersa<br />

Zero-defect approach, extreme performance<br />

In addition to the current product range, the new factory<br />

in Malaysia will increasingly focus on medical devices– of<br />

course with the same zero-defect approach that also<br />

applies in the US, supported by a perfect mix of quality in<br />

SMT production, 100 % just-in-time delivery of finished<br />

products, and an efficiency level exceeding even the high<br />

Six Sigma specifications. From the ground up, the facility<br />

in Penang Science Park replicated the design, concept,<br />

and function of the US headquarters in California. Which<br />

also includes the seamless integration of the company’s<br />

own performance processes to better than best-in-class<br />

level in terms of quality, adherence to delivery schedules,<br />

With the company’s strategic focus moving<br />

towards medical devices and life science instruments,<br />

and an increase of customer inquiries<br />

having also been received, more intensive<br />

attention towards selective soldering<br />

was made. The company in Malaysia is increasingly<br />

relying on the support of system<br />

supplier Ersa.<br />

<strong>EPP</strong> EUROPE November 2017 21


COVER<br />

Source: Kurtz Ersa<br />

The forest factory of Paramit Malaysia<br />

in Penang Science Park.<br />

Source: Kurtz Ersa<br />

David Chee, Long Shine Sales Engineer,<br />

standing in front of an Ersa selective<br />

soldering plant in the production<br />

hall.<br />

customer service, and costs. The idea of an environment-friendly factory,<br />

perfectly adapted to the Malaysian climate, originated with the<br />

company’s CEO– the holistic concept and the design of the building<br />

were supplied by a French architect. Everything addresses environment-friendly<br />

energy efficiency – from the in-slab, water-based cooling<br />

system, to the climate-regulating effect of the shade created by<br />

the canopy of trees. The numerous plants are irrigated using rainwater<br />

collected in huge tanks located under the car parks. In addition,<br />

energy-saving LED lamps are used and the production facility is primarily<br />

supplied with natural light through large-scale windows. The<br />

Malaysian facility combines this environment-friendly approach with<br />

an open office concept with gardens and waterfalls on multiple levels<br />

and meeting spaces which, as required, provide more space or allow<br />

employees to work undisturbed.<br />

The new 15,000 m 2 factory is said to be Malaysia’s largest facility for<br />

the production of complex medical devices, realizing sophisticated<br />

systems for genetic and molecular testing, robotic surgery, and<br />

cancer treatment. Existing customers, for whom the company produces<br />

industrial products such as gas and fire protection systems,<br />

electrical and digital measuring devices, automotive heating elements,<br />

and agricultural management applications, will also benefit<br />

from the additional capacity. "Our expansion in Asia allows us to provide<br />

more sophisticated and tailored offerings to our regional customers<br />

– bringing new levels of speed-to-market and peace of mind to<br />

Paramit Corporation – medical devices:<br />

• Ventricular assist devices<br />

• Robotic-assisted surgery<br />

• DNS sequencing/identification<br />

• Digital pathology<br />

• Telemedicine and mobile robots<br />

• Refractive laser surgery<br />

• Dialysis equipment for home use<br />

our customers,” says Mr. Rataul, on the strategic orientation in the<br />

Malaysian market, which is enjoying a particular boom in the medical<br />

devices industry – laterally displaying double-figure growth rates.<br />

The greenest production in Malaysia<br />

Back to the core of what is probably Malaysia’s greenest factory, the<br />

Paramit Malaysia manufacturing facility: "Of course, we were familiar<br />

with the concept of our new factory. But moving our 50 plant systems<br />

within just one day was still a major challenge. Nonetheless, we<br />

succeeded in setting up very quickly – with everything running<br />

smoothly within just one week,” says Chong Chit Leon, Section Manager<br />

Equipment Engineering. All production processes are subject to<br />

the highest standards – with the use of smart information and communication<br />

technology, such as automatic optic inspection (AOI) in<br />

order to uncover and eliminate any possible defects. “Our aim is to<br />

engage in dialogue with our customers at a very early stage in the<br />

product and board designs – allowing us to make our extensive engineering<br />

know-how available for efficient production. In this way, we<br />

achieve a speedy new product introduction and a shorter ‘time to<br />

market’, which is more economical for both sides,” adds Chong Chit<br />

Leon. The company in Malaysia is increasingly relying on the support<br />

of system supplier Ersa – since entering the market in 2011. Those responsible<br />

for production have ordered soldering systems for different<br />

requirements through the Singapore-based Ersa representative, Long<br />

Shine Equipment and Supplies Pte, which also looks after the Malaysian<br />

market. "For us as sub-contractors, the greatest benefit of the<br />

Ersa equipment is that it permits high-mix in every direction – for<br />

example, the Powerflow N2 full tunnel nitrogen wave soldering plant<br />

can handle all types of products. This gives us great flexibility in our<br />

manufacturing," says Chong Chit Leon. With the company’s strategic<br />

focus moving towards medical devices and life science instruments,<br />

and an increase of customer inquiries having also been received,<br />

more intensive attention was paid to selective soldering. Not only is<br />

this a high-performance and flexible soldering technology, it also fulfills<br />

all the criteria laid down for the high quality standards that apply<br />

in medical devices. Three companies were shortlisted during the purchasing<br />

process; in the end, the contract went to Ersa – specifically<br />

for the Versaflow 3/66 selective soldering system. In addition to the<br />

performance capacity of the plant, the link-up to corresponding ser-<br />

22 <strong>EPP</strong> EUROPE November 2017


COVER<br />

Source: Kurtz Ersa<br />

An unusual industrial facility – Paramit’s “factory in the forest” in Malaysia.<br />

Source: Kurtz Ersa<br />

A glimpse into the Paramit production hall.<br />

Good working environment at Paramit.<br />

vice and support was a significant deciding factor. The team had also<br />

already seen and thoroughly tested the systems in the supplier’s<br />

showroom in Penang.<br />

Soundly-based expertise for the soldering process<br />

At present, Ersa’s worldwide presence is not all that decisive. In Malaysia,<br />

the main focus is on industrial products, with the recent addition<br />

of medical devices. Contact is mainly through the Long Shine<br />

representative in Singapore. “When it comes to the Ersa soldering<br />

expertise and the constant improvement of our processes, we work<br />

closely with the colleagues from Long Shine who are thoroughly familiar<br />

with the processes of the Ersa equipment,” says Chong Chit<br />

Leon. In order to maintain the good business relationship among the<br />

three partners, it is also important that wear and spare parts be available<br />

in Malaysia, for first and second level support. If the worst case<br />

scenario were to occur, Paramit would need immediate support,<br />

since spare parts are not stocked on site. Stocking these parts would<br />

be too expensive and the “right” spare would probably not be available<br />

right away. The team knows that, with the comprehensive process<br />

solution that is offered by Long Shine and Ersa, they are always<br />

on the safe side– first class service and support are definitely of the<br />

essence. As a global player, Ersa is undoubtedly a good partner for<br />

Paramit when it comes to further expansion plans.<br />

productronica, Booth A4.162; A4.171<br />

www.kurtzersa.com<br />

Source: Kurtz Ersa<br />

Zusammenfassung<br />

Die in Kalifornien ansässige Paramit Corporation ist Hersteller von<br />

medizinischem Highend Equipment. Mit Eröffnung einer zweiten Fabrik<br />

in Malaysia im November 2016 wurde die Kapazität verdoppelt.<br />

Auch hier wird eine Spitzenklassen-Qualität der Produkte und Maschinen<br />

angestrebt, genauso wie im Headquarter. So sorgen für eine<br />

kompromisslose Lötqualität die Anlagen von Ersa.<br />

Résumé<br />

Paramit Corporation, basée en Californie, est un fabricant d‘équipements<br />

médicaux haut de gamme. Avec l‘ouverture d‘une deuxième<br />

usine en Malaisie en Novembre 2016, la capacité a été doublée.<br />

Ici, les produits et machine de haute qualité sont également recherchés,<br />

tout comme dans le siège social. Ainsi, les systèmes<br />

d’Ersa assurent une qualité de soudure sans compromis.<br />

Резюме<br />

Компания Paramit Corporation из Калифорнии является<br />

производителем медицинского оборудования класса high-end.<br />

После открытия своей второй фабрики в Малайзии в ноябре<br />

2016 г. объем производства увеличился вдвое. Здесь также<br />

уделяется особое внимание высочайшему качеству продукции<br />

и оборудования. За бескомпромиссное качество пайки<br />

отвечают установки Ersa.<br />

Ulrich Dosch is the Key Accounts<br />

& Business Development<br />

Manager for Kurtz Ersa Asia.<br />

<strong>EPP</strong> EUROPE November 2017 23


PCB + ASSEMBLY<br />

Communication technologies for the Smart Factory<br />

The workplace in the age<br />

of Industry 4.0<br />

Basically, a modern manufacturing operation according to Industry 4.0 standard will consist of a variety of „Smart“<br />

elements; i.e. machines, operators, plants, or even material. Digitally speaking, this means that all of these elements will be<br />

able to read, store, transmit, and react upon data. In order to serve this purpose, such Industry 4.0 factory will be linked<br />

with both its customers and suppliers.<br />

With the Smart Factory concept, new communication<br />

technologies will be required for the exchange of data<br />

in order to link humans with the other systems.<br />

reasons, it has to be assumed that manual activities shall remain an<br />

integral part of state-of-the-art manufacturing operations, in particular<br />

when it comes to highly flexible and complex assemblies. In the following,<br />

first solution approaches are presented which demonstrate<br />

an integration of manual activities into Industry 4.0 concepts.<br />

Source: Aegis Software<br />

Exceeding the principle of “Smart” factory, new communication<br />

technologies will be required for the exchange of data in order to<br />

link humans with the other systems. Afterwards, all information in<br />

this established Industry 4.0 environment is used in an intelligent<br />

way, where it will result in continuous improvements regarding efficiency,<br />

flexibility, and quality.<br />

New challenges for humans<br />

In the case of machines communicating with each other, the exchange<br />

of information via appropriate interfaces by using the latest<br />

technology and standardized reports, is the greatest challenge. According<br />

to their scope of application, machines follow standardized<br />

patterns while implementing processes and procedures. The concept<br />

of Industry 4.0 now shifts the additional decision-making competences<br />

to the process flows, in order to create production flows that<br />

more or less optimize themselves. However, extensive standardization<br />

for the exchange of data and the processing of large volumes<br />

of data is a prerequisite thereof. The entire industry already faces this<br />

challenge internationally and provides first approaches to tackle it.<br />

What requirements result for the staff thereof? All participants have<br />

to be integrated into the concept of Industry 4.0. Smart production<br />

planning, process definition. Manual process steps have to also be<br />

consciously included in this concept and shall be understood as part<br />

of an overall solution. Manual processes are significantly important<br />

when included in automated systems. The whole concept of Industry<br />

4.0 will fail if manual processes are not integrated. Due to economic<br />

The smart workplace in the environment<br />

of Industry 4.0<br />

A crucial aspect for the Industry 4.0 factory is how all relevant process<br />

and quality data are collected, processed, and provided. The<br />

Aegis solution meets the challenges that an Industry 4.0 solution requests<br />

from a system for the smart workplace of the future, with<br />

both its IT infrastructure and its software concept. In the field of communication,<br />

international standards have already been implemented<br />

in order to standardize and thus facilitate the information exchange<br />

between machines and systems. How is the smart human workplace<br />

integrated now? Initially, a process description is required that is independent<br />

from the workplace and has the ability to dynamically react<br />

upon changes in the workflow. As soon as a part is checked in at a<br />

workplace, the company’s system will monitor if it is at the correct<br />

workplace, and if so, what has to be done with it and if there are any<br />

additional test steps still missing. At the same time, the underlying<br />

workflow concept remains as flexible as possible, in order to allow for<br />

a smooth procedure through production.<br />

This means, however, that the work plan has to be updated permanently<br />

and thus does not follow the outdated, rigid specifications of<br />

an ERP. The system is controlled via centralized server instances,<br />

which can cope with large volumes of data based on modern scaling<br />

methods. This data model, as well as, all operation and testing procedures,<br />

are always directly linked with the technical CAD model of<br />

the product. Additionally to the product, there is the process model,<br />

which contains the process and test parameter. Only by intelligently<br />

combining these two different types of information, a complete and<br />

usable image unfolds, regarding both the product progress, as well<br />

as, the product quality. Thus, the right data is made available to the<br />

operators and the management, at the right place and at the right<br />

time. Each employee can retrieve information graphically or via "drilldown“<br />

mechanisms with the support of the company’s CAD intelligent<br />

data model and is hereinafter automatically forwarded to the<br />

necessary process steps. The workplaces should be equipped with<br />

touchscreens, where each employee logs in. Subsequently, all avail-<br />

24 <strong>EPP</strong> EUROPE November 2017


PCB + ASSEMBLY<br />

Source: Aegis Software<br />

The Aegis system will monitor all parts to ensure they are in the correct<br />

workplace and will see if any additional test steps are needed.<br />

able job orders are displayed on the screen. The product though decides<br />

which process step the employee has to follow upon arrival at<br />

his or her workplace. Any important engineering notes and instructions<br />

that have to be taken notice of, observed, and reported, are immediately<br />

displayed on the screen. This ensures that any amendments<br />

made between the commencement of the order and the processing<br />

thereof are dynamically included in the current work process.<br />

Conventional methods of both production and progress planning<br />

would completely fail here. All materials with their specific characteristics<br />

that are included in the process flow are monitored as well. In<br />

the background of material inspection, the Approved Manufacturer<br />

Lists (AML) are consulted to check the current release and quality<br />

data of each part. Any alterations regarding the characteristic of material<br />

and/or process specifications are discovered at once and can be<br />

reacted upon immediately. The employee should therefore be included<br />

in the communication network. Rigid and inflexible work instructions<br />

in written form are outdated in the age of Industry 4.0 and<br />

are not in accordance with the requirements of the new communication<br />

technology.<br />

The approach to meet this challenge is to simply take into consideration<br />

the diversity of human information processing. The Industry 4.0<br />

concept can integrate manual production processes, if the work descriptions<br />

and job orders can be implemented flexibly depending on<br />

the user.<br />

Another characteristic of the Industry 4.0 approach lies in the dynamic<br />

process flow. Workpiece carriers or products actively pass<br />

through the production facility and self-optimize while going towards<br />

the next production and assembly step. While doing so, the products<br />

actively submit inquiries to the machines and bring themselves to the<br />

next available workplace. Process ability and machine set up are<br />

taken into consideration together, along with approvals and machine<br />

capacity. If these requirements are transferred to the manual process<br />

steps, similar challenges to the human machine communication<br />

arise. The product asks for an appropriate manual process step. Finally,<br />

only appropriate workplaces with adequately qualified staff are<br />

selected. The human machine interface will show the employee<br />

which tasks have to be done and, if necessary, takes into account the<br />

required qualifications of the employee.<br />

Conclusion<br />

With its unique combination of a dynamic data model and paperless<br />

documentation, a modern IT concept can achieve the expected improvements<br />

for the smart workplaces with respect to productivity<br />

and quality. Additionally, the integrated quality data collection system<br />

improves the operator’s error management, as all data is made available<br />

via reports, based on which appropriate measures implemented.<br />

The customer profits from this modern Industry 4.0 solution, as well<br />

Source: Aegis Software<br />

By combining a dynamic data model and paperless documentation, a modern IT<br />

concept can achieve the expected improvements for smart workplaces.<br />

as, continuously improved products that are offered. The Industry 4.0<br />

operation system is regularly updated and expanded by the company.<br />

At the moment, first operations with an integrated logistic approach<br />

are running, in order to also prepare the material flow for the concept<br />

of Industry 4.0.<br />

productronica, Booth A3.340<br />

www.aiscorp.com<br />

Zusammenfassung<br />

Grundsätzlich besteht ein moderner Fertigungsbetrieb nach Industrie<br />

4.0 Standard aus einer Vielzahl von intelligenten Elementen wie<br />

Maschinen, Operator, die Fabrik oder sogar das Material. Digital<br />

gesagt bedeutet dies, dass alle diese Elemente in der Lage sind,<br />

Daten zu lesen, zu speichern, zu übertragen und zu reagieren. Damit<br />

dies funktioniert, wird die Industrie 4.0 Fabrik sowohl mit ihren<br />

Kunden als auch Lieferanten vernetzt. Im Artikel werden Kommunikationstechnologien<br />

für die smarte Fabrik vorgestellt.<br />

Résumé<br />

D’une manière générale, une entreprise de fabrication moderne selon<br />

la norme Industrie 4.0 se compose d‘une variété d‘éléments intelligents<br />

tels que les machines, les opérateurs, l‘usine ou même le<br />

matériel. Digitalement, cela signifie que tous ces éléments sont capables<br />

de lire, de stocker, de transmettre et de répondre aux données.<br />

Pour que cela fonctionne, l‘usine Industrie 4.0 est en réseau<br />

avec ses clients et ses fournisseurs. L‘article présente les technologies<br />

de communication pour l‘usine intelligente.<br />

Резюме<br />

В соответствии со стандартами Индустрии 4.0 современное<br />

производство должно включать в себя большое количество<br />

«умных» элементов, таких, как, например, оборудование,<br />

операторы, фабрика или даже сырье. В терминах цифровой<br />

техники это означает, что все элементы должны уметь<br />

считывать, запоминать, передавать данные и реагировать<br />

соответствующим образом. Чтобы это все работало<br />

надлежащим образом, фабрика, отвечающая стандартам<br />

Индустрии 4.0, объединяется в рамках общей сети со своими<br />

клиентами и поставщиками. В статье рассматриваются<br />

коммуникационные технологии для «умных» фабрик.<br />

<strong>EPP</strong> EUROPE November 2017 25


PCB + ASSEMBLY<br />

PRODUCT UPDATES<br />

Professional<br />

soldering systems<br />

for productivity<br />

and flexibility<br />

14-17 November 2017<br />

booth A4-460<br />

CUBE Batch<br />

Our system for<br />

automation in the<br />

manual soldering area<br />

CUBE Inline+<br />

The soldering system<br />

for highest flexibility<br />

and efficiency<br />

Component counting machine with micro-focus X-ray technology<br />

Accurate component count is vital for inventory<br />

management and production efficiency.<br />

Currently, this is a time consuming, labor intensive<br />

process. Most machines require an<br />

operator load, and a run through of each individual<br />

reel to count the components, to then<br />

record it manually. Counting using X-ray technology<br />

and intelligent algorithms can take as<br />

little as 7 seconds for an entire reel, and can<br />

interface directly with inventory management<br />

software to transfer the count instantly.<br />

Loading a reel on a manual counter can take<br />

up more time. The Scienscope AXI 5100c is<br />

an automated, fast, accurate component<br />

counting machine designed to increase productivity.<br />

Not only does it take less time and<br />

labor to have a proper component count, but<br />

the recording of results is more reliable,<br />

since it is more error proof.<br />

This counting machine uses micro-focus<br />

x‐ray technology and a high resolution digital<br />

image detector for accurate counting of standard<br />

SMT or THT components. A wide range<br />

of components, including 01005s and tall<br />

components, are supported without having<br />

to change hardware thanks to an industrial<br />

motion control system that can set the X-ray<br />

tube and image detector to various heights<br />

and magnifications automatically. Components<br />

are counted in the reels and a large database<br />

of common component types is included.<br />

New types of components are easy<br />

to add through a graphic, intuitive interface.<br />

Simple interface/operation<br />

Operation couldn’t be easier – insert the reel<br />

and close the door. The machine starts counting<br />

automatically. No need to position the<br />

reel or set parameters. A built in mapping<br />

camera locates the reel and moves the tube<br />

and detector to the correct location.<br />

Configuration for batch<br />

The standard machine is an offline system<br />

with a table to place the reels, which is accessible<br />

through the front door. Once you<br />

close the door, the machine will automatically<br />

start.<br />

Configuration for inline<br />

If complete automation is the requirement, it<br />

can be configured with a wide flat belt conveyor<br />

or a rail conveyor to move the reels in<br />

and out of the machine automatically. Special<br />

carrying trays are supported and the company<br />

can also develop the entire handling<br />

system to get the reels into the storage<br />

tower, or can be directly communicated with<br />

various handling systems via industry standard<br />

SMEMA interface, or other special<br />

protocols. The inline system can also be used<br />

in batch mode by accessing the front door.<br />

Accuracy and repeatability<br />

An inaccurate count is dangerous because<br />

other operations rely on the count being correct,<br />

which can then results in machine<br />

downtime and inaccurate inventory management.<br />

The machine count accuracy is >99 %<br />

for all supported component types. Whether<br />

the components are tightly wound or loose<br />

on the reel, you can always be sure the count<br />

will be correct.<br />

The smaller footprint inline AXC 800 is also<br />

available, that is just as reliable, accurate, and<br />

also with an easy interface.<br />

productronica, Booth A1.402<br />

www.scienscope.com<br />

Special solutions<br />

We are a reliable partner when<br />

it comes to technical production<br />

challenges. INERTEC realises<br />

individual customer projects.<br />

INERTEC has been building selective<br />

soldering machines for more than<br />

twenty years and is one of the leading<br />

companies in this market sector.<br />

Source: Scienscope International Inc.<br />

The inline AXC 800 count<br />

accuracy is >99 % for all<br />

supported component<br />

types.<br />

Inertec Löttechnik GmbH<br />

www.inertec.de<br />

26 <strong>EPP</strong> EUROPE November 2017


Reflow soldering system with special air flow<br />

concept<br />

Under the motto „SMT – innovation creates<br />

future“, SMT Thermal Discoveries will present<br />

its newly developed reflow soldering system,<br />

SMT Quattro Peak R360, at productronica in<br />

Munich.<br />

With its air flow concept, this system has the<br />

lowest energy consumption worldwide. The<br />

reduced distance from the operator to the<br />

transport system is also particularly important<br />

as a standard and ensures a high machine<br />

availability. Additional advantages are effective<br />

process cooling and precise nitrogen<br />

control. In addition, temperature-resistant<br />

clamping seals are now installed, which can<br />

be exchanged in the complete system, with<br />

minimum time requirements and without the<br />

need of tools. The system is controlled by the<br />

new intuitive user interface. With the 2 level<br />

in this system. Operators<br />

have easy access to the process<br />

room and the transport modules.<br />

Another highlight is the entire<br />

separation of the transport<br />

mechanics from the process gas<br />

stream, which means that there<br />

is no contamination on the transport<br />

mechanics. The topic of<br />

maintenance and its simplification<br />

plays an important role.<br />

Each zone is equipped with<br />

CATalysis process gas cleaning Reflow soldering system SMT Quattro Peak R360.<br />

structure, you can directly get to the correct<br />

page with only 2 clicks. With these new software<br />

options, SMT knows the way towards a<br />

Smart Factory from the aspects of Industry<br />

4.0.<br />

productronica, Booth A4.155<br />

www.smt-wertheim.com<br />

Source: SMT Thermal Discoveries<br />

Turn Vision into Reality.<br />

Strong performance<br />

with large components<br />

Best performance in every production environment with the CondensoX series!<br />

CondensoX is perfect for handling large or high-mass boards in a stable process atmosphere.<br />

In order to improve control of the condensation phase, Rehm has developed a patented injection<br />

principle that allows the soldering procedure to be individually regulated. Our CondensoX series<br />

<br />

Visit us at<br />

productronica<br />

Munich<br />

14 – 17/11/17<br />

hall A4,<br />

booth 335<br />

www.rehm-group.com<br />

<strong>EPP</strong> EUROPE November 2017 27


PCB + ASSEMBLY<br />

Swiss electronic manufacturer implements an all-around process optimization<br />

3-phase project for efficiency<br />

improvement and process<br />

optimization<br />

In order to be able to secure medium to long term jobs in Switzerland, processes have to be constantly checked and<br />

further optimized and automated. A smart and innovative investment policy forms the basis for a successful growth. Process<br />

optimization is key for success, as is the case for the company, EPH Electronics AG from Diessenhofen. Since 2015,<br />

they have devoted their efforts to go towards Industry 4.0 and optimize their process by modernizing their production.<br />

As part of the first phase, the<br />

MY200-DX10 placement system<br />

from Mycronic, as well as, the reconfiguration<br />

of the existing systems<br />

were obtained.<br />

Source: <strong>EPP</strong> <strong>Europe</strong><br />

In the second phase, the Material Tower and the associated software for<br />

material management were installed and put into operation.<br />

EPH Electronics AG was founded in 1980 in Feuerthalen. Today,<br />

the Swiss electronic production company is devoted to their<br />

customers with around 70 employees in 10,000 m 2 . By having the<br />

state-of-the-art machinery, combined with a qualified and motivated<br />

production and development team, enables the provision of services<br />

over the complete life cycle of a product. This starts with the<br />

creation of concepts, the development and prototyping, testing<br />

phase, production launch and the ramp-up, mass production, to the<br />

end-of-product life phase. As an EMS company, they go beyond just<br />

production services, from contract assembly to the production of<br />

complete assemblies and devices. In doing so, the company relies<br />

on long-term relationships with customers and suppliers. This is<br />

also the case with Mycronic, a company that develops solutions for<br />

the assembly of electronic components with its MY200 platform.<br />

Their product portfolio, including the unique jet and dispenser platform<br />

MY600, the automatic and intelligent material handling, and<br />

the latest generation SMT Tower 6150 series, provides a complete<br />

and powerful production solution.<br />

The benchmark of productivity<br />

As business started to increase, EPH recognized that not only was<br />

their tight space no longer practical, but also all systems in the SMT<br />

department were from different manufacturers, making them incompatible<br />

with one another. They knew they had to find a solution<br />

to these specific issues. It was also found that there wasn’t an effi-<br />

Source: <strong>EPP</strong> <strong>Europe</strong><br />

28 <strong>EPP</strong> EUROPE November 2017


The new equipment and the SMT<br />

tower was put into place in Diessenhofen<br />

in the beginning of 2016.<br />

Source: <strong>EPP</strong> <strong>Europe</strong><br />

Source: <strong>EPP</strong> <strong>Europe</strong><br />

Monitoring with visual inspection ensures the quality is right.<br />

cient back-up method, the setup processes at the facility were not<br />

useful, and parts were missing which resulted in high loss of time.<br />

Early 2015, an analysis was started, in order to determine exactly<br />

where the performance gaps were located and figure out how to<br />

optimize the process.<br />

EPH defined their goal as: “Maximum efficiency with the highest<br />

possible flexibility”. More specifically, this meant to:<br />

• increase efficiency<br />

• optimize the use of space<br />

• have compatibility within systems<br />

• have backup solution for machine failures<br />

• automate material handling<br />

• increase automation in the direction of Industry 4.0<br />

The actual state had to be determined first, to then be able to define<br />

what it should be like, in order to make definite changes. “We immediately<br />

recognized,” says the Quality and Lean manager, Ulf<br />

Schmidt, “that the problem was not in the assembly house, but actually<br />

the setup changeover, so this is where we started out. We<br />

also discovered that it came from missing components at machine<br />

downtime, so the material flow was not optimal.”<br />

Another issue that was found was the arrangement of the placement<br />

machines and the different level of hardware and software.<br />

With the aim of obtaining as much as possible from a single source,<br />

the company investigated the different possibilities at the SMT<br />

show in Nuremberg and productronica in 2015. This is where Mycronic<br />

was able to provide the required solutions.<br />

The 6150er series Material Tower and the software MyPLan from<br />

Mycronic was exactly the missing link between the warehouse and<br />

production that was needed.<br />

Together, both companies developed and implemented<br />

a concept, which was divided into<br />

3 separate phases. In the first phase, the outdated<br />

system of the second manufacturer<br />

was removed. In its place, a Mycronic<br />

MY200-DX10 placement system was obtained,<br />

as well as, a plan to reconfigure the<br />

other existing systems. All units were<br />

brought under the same software and hardware<br />

system. The conversion was planned in<br />

such a way that never more than one third of<br />

the capacity was blocked at one time.<br />

In the second phase, the Material Tower and the associated software<br />

for material management were installed and put into operation.<br />

Around the same time, the material flow was updated, meaning<br />

the automated external setup station was set up. This update included<br />

the Mycronic PRM 2.0 software, which enabled the monitoring<br />

of outgoing material on the equipment, and is displayed in real<br />

time on a large screen for all the lines to see.<br />

During this time, a user meeting was organized, at the office of Mycronic<br />

in Unterhaching, Germany, to find out about new trends, participate<br />

in lectures on topics as in Industry 4.0, and have the opportunity<br />

for other users of Mycronic systems to interact with each<br />

other and share ideas.<br />

Developers also took into account requests from the users for future<br />

developments. “For us as customers, the user meeting was a<br />

well-rounded win-win situation for all involved,” says Ulf Schmidt.<br />

Through the close cooperation with Mycronic and the effect that, at<br />

the time, Mycronic had with their new software tools that aimed at<br />

optimizing production, the EPH team used a part of the Mycronic<br />

360 ° approach.<br />

This 360 ° standard approach is used worldwide to analyze the efficiency<br />

and performance of a SMT manufacturing process. By implementing<br />

this approach, further optimization could be discovered.<br />

Due to a lag in the housing databases of the placement systems,<br />

which has grown over the years, Mycronic explored what benefits<br />

could come just from revising the database. Maik Karras, the Service<br />

Engineer and Process Optimization Expert of Mycronic, immediately<br />

knew where to start.<br />

<strong>EPP</strong> EUROPE November 2017 29


PCB + ASSEMBLY<br />

Focusing on process optimization<br />

Process optimization is used to improve efficiency and effectiveness<br />

of existing processes, as well as, the use of necessary resources<br />

that need to be continuously updated. It is based on a process<br />

oriented approach to the entire operational systems. When a<br />

Lean Manager is not specifically set in place, the system supplier<br />

and its 360 ° standard approach will help in this regard.<br />

With the conversion to external setup, EPH has already seen a significant<br />

benefit of almost 25 %. By investing in an additional placement<br />

machine and a new line configuration, an optimization was<br />

achieved by a total of 42 %. With a combination of the comprehensive<br />

data optimization, a further 20 % was achieved. According to<br />

the team, “The percentages and figures were easily detectable for<br />

+++ Video-Interview +++<br />

Within 3 phases, the Swiss company successfully optimized<br />

their process. Readers can find the video here, http://epponline.de/applicationvideos/prozessoptimierung-mycronic-eph.<br />

patible with each other. Redundancy is also available, which means<br />

that one product can be produced on all three lines. Two of the lines<br />

are designed for extra-large PCBs, while the third line is for smaller<br />

circuit boards with a higher component density. Although the Material<br />

Tower from Mycronic stands separately, it is planned to be relocated<br />

in the near future, bringing the tower directly into the lines.<br />

This will not only create an even higher material stability, but it will<br />

also avoid long distances of going back and forth, and therefore<br />

save time.<br />

All targets for the optimization values that were calculated before<br />

the start of the project were almost exactly reached. The program<br />

continually screens to make sure whether or not the goal has been<br />

reached and notices which direction trends are going. Since the beginning<br />

of this year, the Shop Floor Management implemented daily<br />

targets to constantly monitor the process. However, transitioning<br />

towards Lean Management is a constant checking process, as Ulf<br />

Schmidt emphasized, “We can clearly see differences in our evaluation<br />

curves when our attention is focused on other projects. But in<br />

terms of potential for optimization, we are on the right track.” The<br />

third phase is currently being implemented. This includes an expansion<br />

of capacity with a Mycronic MY200-HX 10 that will complement<br />

an existing line, with the hopes of accomplishing further potential<br />

of almost 20 %. (dj)<br />

productronica, Booth A3.341<br />

www.mycronic.com; www.eph.ch<br />

us, as we had previously well tracked our data.” The new equipment<br />

and the SMT tower was put into place in Diessenhofen in the beginning<br />

of 2016. Using the software tools, MYPlan (which generates reports<br />

indicating which component type is in which feeder load) and<br />

MYCenter, for the organization of the carrier database, a comprehensive<br />

functional material flow could be ensured. The carriers are<br />

matched with the component types specified by MYPlan from the<br />

warehouse, so that the external set-up is now fully automated and<br />

secure. An important aspect to think about is the frequent changeovers<br />

of service providers with batch sizes from 1 to 15,000. The<br />

typical size is 500 to 5,000.<br />

The conversion and optimization not only brought an increase in efficiency,<br />

but the backup solution is now secure, in the event of a<br />

complete failure. All systems in the three SMT lines are now com-<br />

Source: Doris Jetter<br />

Zusammenfassung<br />

Eine kluge und innovative Investitionspolitik bildet die Grundlage<br />

für eine erfolgreiche Wachstumspolitik. So ist Prozessoptimierung<br />

eines der Schlüsselworte zum Erfolg, wie sich deutlich am Beispiel<br />

der EPH Electronics aus Diessenhofen zeigt, die sich seit 2015<br />

intensiv gemeinsam mit Mycronic der Prozessoptimierung und<br />

Modernisierung ihrer Fertigung in Richtung Industrie 4.0 widmet.<br />

Résumé<br />

Une stratégie d’investissement intelligente et innovante est la base<br />

d’une stratégie de croissance efficace. L‘optimisation des processus<br />

est l‘un des mots clés du succès, comme on le voit avec l‘EPH<br />

Electronics de Diessenhofen, qui travaille intensément avec Mycronic<br />

depuis 2015 sur l‘optimisation des processus et la modernisation<br />

de leur fabrication dans la direction de l‘Industrie 4.0.<br />

Резюме<br />

Разумная и инновационная инвестиционная политика<br />

является основой успешного роста предприятия. Поэтому<br />

оптимизация процессов является одним из ключевых<br />

элементов успеха, что наглядно можно проследить на<br />

примере компании EPH Electronics из г. Диссенхофен, которая<br />

с 2015 г. в активном сотрудничестве с компанией Mycronic<br />

посвятила свою деятельность оптимизации процессов и<br />

модернизации своего производства в соответствии со<br />

стандартами Индустрии 4.0.<br />

30 <strong>EPP</strong> EUROPE November 2017


PCB + ASSEMBLY<br />

Efficient light emitting diodes for the automotive industry, medical technology, and power electronics<br />

Perfect lighting management<br />

thanks to modern LED technology<br />

LEDs are changing the world of light: they consume considerably less energy than conventional light bulbs and at the same<br />

time have a longer service life, are more economical, and do not contain any highly toxic substances, such as mercury. In the<br />

field of high-performance lamps, the automotive industry was one of the first sectors to get involved with this trend and<br />

at the end of the 1990s, was already installing headlight systems equipped with LEDs (light emitting diodes) into cars.<br />

Anna-Katharina Peuker, Public Relations, Rehm Thermal Systems GmbH<br />

In order to assure that this new lighting technology functions flawlessly,<br />

heat generated by the LEDs must be reliably dissipated.<br />

This is where Asetronics comes in. The company located in Bern,<br />

Switzerland, produces and develops modern electronics for LEDs<br />

and is continuously researching strategies targeted at improving<br />

temperature management. The company has been successful in<br />

manufacturing light modules for the automotive industry. Their product<br />

range also includes street lamps and railway illumination, work<br />

lamps for industry, laboratories and offices, as well as, lamps for surgery<br />

and examinations in the field of medical technology – all on the<br />

basis of LEDs.<br />

Quality connects: Swiss precision united with German<br />

machinery manufacturing<br />

Until 2004, the company belonged to the production division of telecommunications<br />

manufacturer, Ascom. In 2006, they successfully<br />

launched independent operations with its first LED applications involving<br />

chip-on-board technology. These applications are used in the<br />

brake lights, blinkers, fog lights, and daytime running lamps of vehicles<br />

produced by renowned automobile manufacturers. Asetronics<br />

has since experienced strong growth and in the meantime<br />

employs 190 persons. Roughly 60 % of the company’s annual turnover<br />

is generated alone with LED light modules for automotive<br />

headlights. The Swiss enterprise cooperates with suppliers of wellknown<br />

brand names, such as Audi, BMW, Daimler, and Porsche.<br />

Whereas only premium automobiles were equipped with LED light<br />

a number of years ago, cars without this modern lighting technology<br />

are now rare. Pressure is rising along with unbelievable growth of<br />

the industry sector. The company produces roughly 250 million<br />

SMD components each year. They are continuously expanding their<br />

product range and production capacity, maintaining high levels of<br />

quality, and conducting research targeted towards optimizing their<br />

technology. The company relies upon diversified know-how in order<br />

to make successful progress in this respect. And this means that<br />

they not only assemble and process the light modules, they also<br />

manufacture the metal-core PCBs for the LEDs. This makes it possible<br />

to optimize heat management and to continue to improve it by<br />

means of an in-house R&D.<br />

“In extreme cases, inadequate temperature management can result<br />

in irreversible damage or destruction of the LED and the PCB.<br />

Light emitting diodes radiate light to the front and heat to the back,<br />

The VisionXP+ Vac from Rehm Thermal Systems.<br />

which has to be dissipated from the chip as quickly as possible. At<br />

temperatures of greater than 150 °C, the sensitive diode degenerates”,<br />

explains Georg Schafer, the company’s Head of Turnkey Electronics.<br />

There’s a small thermal resistor between the component<br />

and the PCB, as well as between the PCB and the heat sink, in<br />

order to ensure ideal temperature management. Heat at the bottom<br />

can be removed and dissipated via the heat sink with the help of<br />

microvias. The heat sink functions in turn via the metal-core PCB<br />

with its extremely thin layer made of insulation material, which<br />

ideally spreads and dissipates the heat. This is particularly important<br />

due to the ever increasing levels of miniaturization.<br />

Where the production of sensitive electronic components is concerned,<br />

Asetronics relies on top quality systems engineering from<br />

Germany. Over the last three years, in order to reduce maintenance<br />

costs and manufacture more efficiently, the company has entirely<br />

switched over to reflow soldering systems from Rehm Thermal Systems.<br />

Three VisionXP+ convection soldering systems are currently<br />

being used in production.<br />

The team standing in front of a VisionXP+ Vac at Asetronics’ production facility.<br />

(left to right): Sven Schwalbach (Asetronics), Philip Längsfeld (Rehm), and<br />

Georg Schafer (Asetronics).<br />

Source: Rehm Thermal Systems<br />

Source: Rehm Thermal Systems<br />

<strong>EPP</strong> EUROPE November 2017 31


PCB + ASSEMBLY<br />

This system, equipped with a vacuum module for reducing voids in<br />

the solder joint, has been running since October 2016. Heavy equipment<br />

was necessary to bring the 4600 kilogram titan on the upper<br />

floor of Asetronics. And the effort has paid off, since vacuum soldering<br />

has become a central issue in electronics manufacturing. In<br />

order to assure the best possible quality, this became the Swiss<br />

company’s standard process. “Vacuum technology is an important<br />

issue, in particular where the production of sensitive electronics is<br />

concerned. In the meantime, LED manufacturers are demanding<br />

void content of less than 15 %. In some cases, the tolerance limit is<br />

even lower for certain products. We’re now able to fulfill these<br />

requirements reliably, and above all lastingly, with the VisionXP+<br />

Vac”, stresses Sven Schwalbach, the company’s head of the SMT<br />

Production department.<br />

This soldering system delivers reliable soldering results, even at<br />

high throughput levels. With a partial vacuum of down to 2 mbar,<br />

void content of less than 2 % is feasible – a great advantage, above<br />

all for future manufacturing requirements. With the help of the optional<br />

vacuum module, the user can decide, depending on the respective<br />

product, whether or not vacuum technology should be activated.<br />

As a result, manufacturing flexibility is greatly increased.<br />

“The option for systems networking represents a further advantage.<br />

The machines access a common database. And thus it’s possible<br />

to run identical profiles on our systems – a point which mustn’t<br />

be overlooked with regard to time and saving costs in production”,<br />

says Philip Längsfeld, Head of Sales <strong>Europe</strong> at Rehm Thermal Systems.<br />

Installing the VisionXP+ Vac reflow convection system at Asetronics<br />

in October 2016.<br />

Source: Asetronics<br />

Broad range of products<br />

for optimized illumination for<br />

medical examinations and<br />

operations.<br />

Source: Asetronics<br />

(Left to right): Sven Schwalbach and Georg Schafer, from Asetronics,<br />

present the latest generation of surgical lighting, namely ASE Lights.<br />

Source: Rehm Thermal Systems<br />

Source: Asetronics<br />

Source: Asetronics<br />

Perfect illumination for doctor’s offices<br />

and hospitals<br />

The favorable characteristics of LEDs are apparent in the field of<br />

medical technology – which is also the mainstay for Asetronics.<br />

Outstanding light quality and natural color rendering, full illumination<br />

without shadows, intensive and clear light without glare, and high<br />

levels of luminance with minimal heat radiation – medical lighting is<br />

subject to demanding requirements. Due to the fact that older light<br />

sources radiate a great deal of heat to the front, thus causing operating<br />

rooms to heat up very quickly for example, the company developed<br />

a lighting concept which is advantageous for surgeons. “Our<br />

new generation of surgical lighting consists of LEDs which can be<br />

individually regulated with regard to brightness, color temperature,<br />

and light focus. With the LED, heat is dissipated to the back. And<br />

thus in the active state, the lamp is no warmer than 35 to 40 ° C.<br />

32 <strong>EPP</strong> EUROPE November 2017


PCB + ASSEMBLY<br />

Light is focused in a bundled fashion – shadow-free and with natural<br />

color rendering. Beyond this, the lamp is equipped with an integrated<br />

HD camera. These conditions make work much more pleasant<br />

for attending physicians and surgery personnel”, says Georg<br />

Schafer.<br />

The product range also includes lamps for doctor’s offices in different<br />

sizes and variants. Optimum light spread and minimal heat generation<br />

assure, for example, that dentists and dermatologists can<br />

precisely illuminate the area to be examined without any glare for<br />

the patient.<br />

“Light On Demand”: Clever concept for street<br />

lamps with a promising future<br />

In 2014, the company successfully participated with the reconceptualization<br />

of street lighting in the canton of Bern. The manufacturer’s<br />

“Light On Demand” project was highly convincing. They developed<br />

a new type of LED light module system to this end for<br />

rugged outdoor lamps. Each street lamp is equipped with a motion<br />

detector which is capable of controlling light in an event-oriented<br />

manner. “When there’s no traffic, lighting power is reduced by 10 to<br />

20 %. If a person or a car approaches, the closest lamp and the next<br />

three are pushed up to full power. This results in energy savings<br />

amounting from 80 to 90 %, as compared with the inefficient older<br />

systems”, says Georg Schafer. A lamp consists of roughly 50 individual<br />

LEDs. Not only can they be switched on and off, they’re also individually<br />

dimmable. After being placed into service, the LED street<br />

lamps provide light for up to 20 years without having to be replaced.<br />

In the case of conventional street lamps, the light source has to be<br />

replaced every two to three years. In the meantime, Bern and its<br />

surrounding districts have already been equipped with roughly 3500<br />

of the new street lamps. Additional communities with extensive<br />

road systems will follow.<br />

Challenge: Miniaturization and networking<br />

What does the future hold for LED technology? As is the case in all<br />

fields of electronics manufacturing, the trend towards miniaturization<br />

is plainly apparent for lighting technology as well. LEDs are becoming<br />

smaller, more efficient and combinable into entire networks<br />

or arrays. LED chips are expected to evolve in the future, where it<br />

will be possible to place as many as 64 individual light emitting<br />

diodes. However, it is still a challenge to process these LEDs so that<br />

they will later be specifically controllable. Asetronics is not only continuously<br />

conducting research on the LED itself, the company is<br />

Source: Asetronics<br />

Source: Asetronics<br />

Efficient, dimmable street lamps based on the “Light On Demand” concept.<br />

Zusammenfassung<br />

Die Automobilindustrie baute bereits Ende der 90er Jahre Scheinwerfersysteme<br />

mit LEDs in Fahrzeuge ein. Damit die neue Lichttechnologie<br />

einwandfrei funktioniert, muss insbesondere die durch<br />

die LED erzeugte Wärme zuverlässig abgeführt werden. Hier kommt<br />

Asetronics ins Spiel, die zur Herstellung der sensiblen elektronischen<br />

Komponenten auf qualitativ hochwertige Reflow-Lötanlagen<br />

von Rehm Thermal Systems vertraut.<br />

Résumé<br />

À la fin des années 1990, l‘industrie automobile avait déjà installé<br />

des phares avec des LED dans des véhicules. Pour que la nouvelle<br />

technologie d‘éclairage fonctionne correctement, la chaleur générée<br />

par les LED doit être dissipée de manière sûre. C‘est à ce<br />

moment-là que Asetronics est entrée dans le jeu, toute en comptent<br />

sur les systèmes de bonne qualité de soudage par refusion de<br />

Rehm Thermal Systems pour la production de composants électroniques<br />

sensibles.<br />

Резюме<br />

Уже с конца 90-х гг. автопроизводители активно<br />

устанавливают в свою продукцию фары на базе светодиодов.<br />

В целях безупречной работы новых источников света следует<br />

обеспечить надежный отвод тепла, генерируемого<br />

светодиодами. На этом этапе в игру вступает компания Asetronics,<br />

которая при производстве чувствительных<br />

электронных компонентов полностью полагается на<br />

высококачественные линии пайки оплавлением Rehm Thermal<br />

Systems.<br />

also developing core expertise in the optimization of processing options.<br />

Within this context, attention is focused on the issue of heat<br />

management. This pursuit of continuous improvement, inquisitiveness<br />

directed at technological progress, and the enthusiasm to be<br />

an active player at the head of the market, unite both companies<br />

and are clearing the path for further successful collaboration. “In the<br />

final analysis, we were convinced by Rehm’s great innovative spirit.<br />

We’re on the same wavelength in this regard, because they also<br />

steadily continue to develop their products and offer their customers<br />

top quality and outstanding service as a global player. Thus far,<br />

we’re very satisfied with their products and we’re looking forward<br />

to new developments, especially in the area of vacuum technology”,<br />

says Georg Schafer in conclusion.<br />

productronica, Booth A4.335<br />

www.rehm-group.com<br />

<strong>EPP</strong> EUROPE November 2017 33


PCB + ASSEMBLY<br />

PRODUCT UPDATES<br />

Pick and place solution with dispensing valves technologies<br />

Source: Essemtec AG<br />

Essemtec AG, a Swiss manufacturer of production<br />

systems for electronic assembly and<br />

packaging, will present a large all-in-one platform<br />

that can be used for the assembly of<br />

Puma/Tarantula<br />

is a high-speed pick-and-place<br />

solution that can also be used in the ultraflexible<br />

prototyping development sector.<br />

high-speed applications, rapid prototyping<br />

and high-speed dispensing at productronica<br />

2017. With different modules, the system can<br />

grow synchronously with customer requirements<br />

for performance and processes.<br />

Puma and Tarantula platform<br />

Puma is the first high-speed pick-and-place<br />

solution that can also be used in the ultraflexible<br />

prototyping development sector.<br />

With an IPC assembly performance of<br />

18’100 cph, the machine pushes forward into<br />

the mid-range field. To further increase flexibility,<br />

it boasts up to 280 feeder positions;<br />

this means this solution offers the highest<br />

number of feeders in relationship to the<br />

machine’s foot print. It processes PCB sizes<br />

up to 1’800 mm x 610 mm.<br />

Aside from handling the assembly processes,<br />

it also dispenses and jets in parallel<br />

up to 150’000 dots per hour. When all three<br />

axis are used exclusively for dispensing<br />

fluids, the platform is called Tarantula. There<br />

are five valve technologies to choose from,<br />

and with the plug-and-play method, all<br />

heads can be retrofitted or changed over on<br />

site.<br />

The newly implemented linear motor technology,<br />

paired with the material “Epument”<br />

for the mineral cast frame, gives a speed increase<br />

of up to 52.5 % versus the previous<br />

model. The updated vibration absorption<br />

through the mineral cast frame guarantees<br />

high and consistent accuracy over many<br />

years of use. Replacing the traditional<br />

spindles and belts with the linear motor technology<br />

means the required maintenance is<br />

significantly reduced. Additionally, the assembly<br />

and dispensing processes are displayed<br />

on the same X/Y system.<br />

The system’s software also has been optimized.<br />

The clearly structured interface on a<br />

large touch screen monitor is as easy to operate<br />

as a smart phone. This enables the operator<br />

to process both simple assembly groups<br />

as well as more complex projects with mixed<br />

processes, 2.5D applications and more, directly<br />

on the machine. The management can<br />

check the efficiency of the machine at any<br />

time and the company offers online support<br />

service. The software has gateway connections<br />

to guarantee connectivity in production<br />

– it is available for an active exchange of process<br />

and production data or the execution of<br />

commands. Following the requests of digitalisation<br />

in production, the gateways are<br />

under constant development; Industry 4.0.<br />

productronica, Booth A3.218<br />

www.essemtec.com<br />

34 <strong>EPP</strong> EUROPE November 2017


Reliable production of modern LED headlights<br />

Asys depaneling systems with<br />

the optodrilling option can position<br />

holes with extreme accuracy.<br />

The latest systems lead the<br />

field with an accuracy of ± 50 μ<br />

@ 5 sigma. This level of accuracy<br />

allows reliable production of<br />

modern LED headlights, for<br />

example.<br />

For headlights to emit light most<br />

effectively in the real world, it is<br />

important to align the LED board<br />

relative to the other optical components<br />

and the housing. To do<br />

so, the assembly holes have to<br />

be very accurate in relation to<br />

the LED. Divisio depaneling systems<br />

have a ten megapixel<br />

camera to determine the position<br />

of the LED. The measured<br />

data is then used to drill the<br />

holes. This is where the company<br />

is setting new standards.<br />

Camera-guided positioning<br />

The company’s experts of the<br />

depaneling system do not just<br />

use LEDs as the reference point<br />

for drilling holes. Holes can now<br />

also be drilled with reference to<br />

synthetic fiducial marks, geo-<br />

Source: Asys Group<br />

Divisio depaneling systems have a ten<br />

megapixel camera to determine the<br />

position of the LED.<br />

metric shapes or chips. This<br />

makes it possible to compensate<br />

for all the tolerances that have<br />

arisen during production. „We<br />

are delighted to provide our customers<br />

with what is currently the<br />

highest possible accuracy available<br />

on the market for positioning<br />

location holes“, says Martin<br />

Gehring, Product Manager for<br />

Divisio product division.<br />

The optodrilling option can be integrated<br />

into inline and offline<br />

depaneling systems.<br />

productronica, Booth A3.277<br />

www.asys-reinraum.de/en<br />

Fast<br />

8 hour service for PCBs<br />

4 day service for assembly<br />

Reliable<br />

Express services: On time or FREE<br />

Unique<br />

Online assembly from 1 component<br />

Lead-free solder alloy that increases<br />

performance and integrity<br />

AIM Solder, a global manufacturer of solder assembly materials<br />

for the electronics industry, highlighted their REL61 lead-free<br />

solder alloy, along with their full line of solder assembly materials.<br />

The solder alloy addresses the most challenging issues with<br />

today’s common lead-free alloys, specifically voiding, cost, durability,<br />

and tin whiskers. Combined with the company’s M8 Solder<br />

Paste, the solder alloy has reduced voiding on BTC packages by<br />

over 45 %, increasing both thermal performance and solder joint<br />

integrity. It offers a low cost alternative to SAC alloys, with reliability<br />

and performance characteristics superior to SAC305 and<br />

low/no-silver solder alloys. Extensive testing indicates that the<br />

solder alloy can reduce tin whisker formation, as well as, outperform<br />

SAC alloys in thermal shock, vibration, and drop shock resistance.<br />

The company also highlighted its full line of advanced solder materials,<br />

including solder paste, liquid flux, and solder alloys, as<br />

well as, its newly developed REL22 solder alloy for extremely<br />

harsh environments.<br />

productronica, Booth A4.409<br />

www.aimsolder.com<br />

www.pcb-pool.com<br />

<strong>EPP</strong> EUROPE November 2017 35


PCB + ASSEMBLY<br />

The correct selection and application of protection compounds<br />

LED protection: enhancing<br />

performance in challenging<br />

environments<br />

The LED market must surely represent one of the fastest growing sectors within the electronics industry,<br />

considering LEDs are now utilised in all types of lighting, signage and domestic appliance products. LEDs offer many<br />

advantages over traditional lighting in the form of adaptability, lifetime, design and efficiency, and represent a real<br />

alternative to halogen, incandescent and fluorescent lighting systems for both interior and exterior applications.<br />

Ultimately, LED bulbs offer an exceptionally long life time, converting the majority of energy to light and thus<br />

minimising the heat given off.<br />

Source: Electrolube<br />

A layout of a LED street light.<br />

Damaged LED from over exposure to VOCs.<br />

Source: Cree<br />

Specially designed and formulated chemical products are widely<br />

used in the electronics industry for a vast array of applications.<br />

Whether it is during PCB manufacture or for the protection of components<br />

or complete devices, such products have become an essential<br />

factor in ensuring the performance and quality of electronic<br />

devices. Specifically in LED applications, such products can be used<br />

to assist Design Engineers in protecting LED systems in a variety of<br />

conditions, including the installation of lighting designs in corrosive<br />

environments, for example. Due to the design freedom that LEDs<br />

offer, applications are becoming more diverse and challenging and<br />

as such, aesthetic results must be achieved in conjunction with the<br />

consideration of reliability and lifetime of the product. In addition,<br />

specialist chemical products can also be used as part of the design<br />

for cosmetic reasons, as well as helping to provide key functional<br />

improvements, such as increased efficiency and reduced energy<br />

consumption.<br />

Enhancing performance in challenging<br />

environments<br />

The environment that the LEDs and associated electronic components<br />

are used in will have an effect on the type of product required<br />

to protect the system and ensure reliability. Environmental challenges<br />

can be in the form of corrosive environments; when high humidity,<br />

salt mist, or corrosive gases are present, for example. Due<br />

to the potential variety of LED applications, it is also possible that<br />

UV exposure, water immersion, or chemical exposure may make up<br />

part of the operating environment. It is therefore imperative that the<br />

end use application is fully understood to ensure the correct protection<br />

media is applied.<br />

Where protection directly over the LED is required, there are a<br />

number of points that must be considered. The clarity of the materi-<br />

36 <strong>EPP</strong> EUROPE November 2017


PCB + ASSEMBLY<br />

Source: Electrolube<br />

The different levels of<br />

protection expected from<br />

various coatings and<br />

encapsulation resins.<br />

Source: Electrolube<br />

Left – Epoxy resin before UV exposure. Right – Epoxy resin after UV exposure.<br />

Left – UR5635 light dispersing resin. Right – Clear Resin, UR5634.<br />

Source: Electrolube<br />

al applied is crucial to ensuring the maximum utilisation of light output<br />

from the LED. In addition, any potential changes to the colour<br />

temperature, clarity of the material, or light output of the LED during<br />

operation must also be considered. Protection can be offered in the<br />

form of conformal coatings or encapsulation resins, with the choice<br />

between the two being determined by the severity of the operating<br />

environment and the desired aesthetic effect.<br />

To discuss this in more detail, some example applications can be<br />

considered. LED signage is a rapidly growing industry, with LEDs<br />

offering more choices for design as well as providing affordable and<br />

efficient interactive displays. Depending on where the sign is placed<br />

and the design of the unit, the level of exposure to environmental<br />

conditions can differ. A roadside sign, for example, would be sealed<br />

from the elements (usually in an IP rated case) but the possibility for<br />

moisture ingress and condensation forming on the board is still apparent,<br />

particularly due to the changing temperature conditions. The<br />

condensation may also have some salt content and there may be<br />

prolonged exposure to UV light. In this situation, we would expect<br />

an acrylic conformal coating, such as Electrolube’s AFA, to offer the<br />

required protection against humidity and salt mist, whilst also maintaining<br />

its clarity after exposure to UV light. Consideration into the<br />

unit design and possibility of standing water forming on the PCB<br />

would have to be considered; if water was to constantly run over<br />

the board or ingress into the unit over time, the protection level<br />

required may increase.<br />

Another example would be the use of LED signage where exposure<br />

to corrosive gases could be possible. Corrosive gases can penetrate<br />

through coatings and on through the LED lens, discoloring the LED<br />

chip and in turn, dramatically reducing the light output and efficiency<br />

of the LED. Thus, the level of exposure to the corrosive gases is important.<br />

For a pricing sign in a fuel station, it is likely that the fumes<br />

given off are not concentrated enough to affect the LEDs in the<br />

forecourt display and so, a conformal coating would be recommended<br />

to protect against the general environmental conditions as<br />

discussed above. However, in the case where corrosive gases are<br />

present in high concentrations, a more sufficient barrier is needed.<br />

Applications, such as industrial lighting or lighting for agricultural or<br />

livestock environments, will need to use encapsulation resins to ensure<br />

the corrosive gases present do not penetrate through to the<br />

LED during the lifetime of the product. It is important to note that<br />

silicone resins are permeable to gases, which would perform poorly<br />

in such applications.<br />

Source: Electrolube<br />

<strong>EPP</strong> EUROPE November 2017 37


PCB + ASSEMBLY<br />

Colour temperature range of LEDs.<br />

Source: Electrolube<br />

Other LED applications may include those that require some physical<br />

protection, as well as, providing a barrier to environmental influences.<br />

An example application is LED strip lighting for floor luminaires<br />

in a shopping complex. The luminaires are both functional and<br />

part of the aesthetic design of the complex and will experience a<br />

high level of traffic passing directly over the resin used to protect<br />

the LEDs in the unit. Firstly, a conformal coating will not offer the<br />

physical protection required due to it being applied in a thin film<br />

(


PCB + ASSEMBLY<br />

Changes in colour temperature of the LED before and after potting.<br />

Source: Electrolube<br />

L*a*b* colour space system.<br />

Source: Electrolube<br />

ance and lifetime of LED systems. Colour temperature is not only<br />

affected by the protection media or surrounding environment, it can<br />

also be affected by the temperature at which the LED operates. For<br />

example, with white light an increase in operating temperature of<br />

the LED could lead to a ‘warmer’ colour of light being emitted. In addition,<br />

if a variance in die temperatures is present across LEDs in<br />

the same array, a range of colour temperatures may be emitted,<br />

thus affecting the quality and cosmetic appearance of the device.<br />

Encapsulation resins can also be used to dissipate heat away from<br />

electronic devices whilst also protecting the unit from environmental<br />

attack. The encapsulation resin essentially becomes the heat sink<br />

and conducts thermal energy away from the device. Such products<br />

can be used to encapsulate the technology behind and attached to<br />

the LED device and can also assist with the reflection of light back<br />

from within the unit, depending on the colour chosen. Encapsulation<br />

resins that incorporate the use of thermally conductive fillers<br />

can vary depending on the chemistry type; epoxy, polyurethane,<br />

and silicone chemistries are available. The choice between chemistries<br />

will depend on the environment, for example, if the assembly<br />

will be exposed to frequent and rapid changes in temperature, a<br />

flexible polyurethane or silicone material will offer better performance<br />

than a tough, rigid epoxy.<br />

Whether choosing a protective material for the individual LEDs or<br />

the entire unit design, it is clear that the operating environment<br />

must be considered. With applications becoming more and more diverse,<br />

the number of challenges is increasing. By the correct selection<br />

and application of protection compounds, it is also possible to<br />

use LED arrays in a wide range of products and when combined<br />

with efficient thermal management, it is possible to achieve consistent<br />

quality and appearance whilst improving the lifetime of LED devices.<br />

It is therefore clear that by the continued use of specially formulated<br />

electro-chemical compounds, the opportunities for further<br />

applications are increasing within this ever evolving industry.<br />

productronica, Booth A4.466<br />

www.electrolube.com<br />

Zusammenfassung<br />

Der LED-Markt ist derzeit einer der am schnellst wachsenden Bereiche<br />

in der Elektronik. Dabei steigen die Herausforderungen an<br />

LEDs durch die zunehmend vielfältigen Anwendungen. Der Artikel<br />

zeigt, wie durch eine korrekte Auswahl und Verwendung von<br />

Schutzmaterialien für LED-Arrays, diese in einem großen Einsatzbereich<br />

verwendet werden können. In Kombination mit einem effizienten<br />

Wärmemanagement lässt sich zudem eine gleichbleibende<br />

Qualität bei verbesserter Lebensdauer erzielen.<br />

Résumé<br />

Le marché des LED est actuellement l‘un des secteurs les plus dynamiques<br />

dans le domaine d‘électronique. En même temps, les défis<br />

des LED augmentent à cause des applications de plus en plus<br />

diverses. L‘article montre comment, avec une sélection et une utilisation<br />

appropriées des matériaux de protection pour les rangées<br />

de LED, ils peuvent être utilisés pour une grande variété d‘applications.<br />

Avec une gestion efficace de la chaleur, une qualité constante<br />

et une durée de vie améliorée peuvent être obtenues.<br />

Резюме<br />

Рынок светодиодного оборудования на сегодняшний день<br />

является наиболее активно развивающейся сферой<br />

электроники. При этом в результате расширения сферы<br />

применения светодиодов возрастают предъявляемые к ним<br />

требования. В статье рассматривается, каким образом<br />

благодаря правильному выбору и применению защитных<br />

материалов для светодиодных массивов возможно<br />

расширение их области применения. В комбинации с<br />

эффективными системами отвода тепла обеспечивается<br />

стабильное качество и более длительный срок службы.<br />

The Author, Jade Bridges,<br />

is the Global Technical Support<br />

Manager from Electrolube Ltd.<br />

<strong>EPP</strong> EUROPE November 2017 39


PCB + ASSEMBLY<br />

PRODUCT UPDATES<br />

Desktop robots for automated soldering<br />

Analyzing metrics and KPI over a period of time<br />

Source: ATN Germany<br />

Altus, a distributor of capital<br />

equipment for electronics assembly,<br />

has recently worked<br />

closely with their supplier, ATN<br />

Germany, to offer full pre and<br />

post sales and engineering support<br />

for their range of bespoke<br />

designed desktop robots to address<br />

automated soldering,<br />

which can grow with customers<br />

The Economic 400 enables robotic<br />

soldering with a compact device.<br />

and their future requirements.<br />

ATN Germany produces a range<br />

of soldering solutions to automate<br />

tasks which cannot be<br />

completed using SMT production<br />

techniques. The company<br />

designs and manufactures a<br />

wide range of heads which can<br />

be supplied for OEM integration,<br />

or integrated by the company to<br />

address a specific application.<br />

The Economic 400 is just one<br />

entry level example of an integrated<br />

system. The system enables<br />

robotic soldering with a<br />

compact device.<br />

In the case of automated soldering,<br />

the hot iron is placed on the<br />

soldering point with its pneumatic<br />

stroke. When the soldered<br />

joint is heated up to soldering<br />

temperature, the solder wire is<br />

fed with the automatic feeder.<br />

The soldering tip remains on the<br />

soldering point for a short time<br />

so that the solder runs correctly<br />

and forms a meniscus at the soldering<br />

point. The 150 W soldering<br />

iron with digital control allows<br />

short cycle times and high precision.<br />

The Economic A400 can also be<br />

equipped with Induction, Laser<br />

or LightBeam heads. The positioning<br />

is carried out by an XYZ<br />

system with a working range of<br />

400 x 300 x 140 mm. Optionally<br />

an additional rotation is also available.<br />

The programming with the<br />

Windows-based PC control is intuitive,<br />

simple and clear, and includes<br />

a camera that simplifies<br />

process monitoring and teaches<br />

the soldering positions.<br />

productronica, Booth A2.132<br />

www.altusgroup.co.uk<br />

Cogiscan Inc., a provider of Track,<br />

Trace and Control (TTC) solutions<br />

for the electronics manufacturing<br />

industry, will introduce its Factory<br />

Intelligence – Analytics at<br />

productronica 2017. The company<br />

will show the second major<br />

phase of evolution for the Factory<br />

Intelligence OEE software,<br />

along with SmartRep, its new<br />

sales and service partner for Germany<br />

and other German-speaking<br />

regions.<br />

The first phase was focused on<br />

real-time performance monitoring.<br />

The new Analytics package<br />

offers a series of capabilities to<br />

analyze metrics and KPI over a<br />

period of time. Being able to collect<br />

and analyze key metrics,<br />

such as machine OEE, is key to<br />

enabling manufacturing staff to<br />

quickly identify any deviation<br />

from expected performance and<br />

quickly drill down to the root<br />

cause for corrective actions. This<br />

will guarantee that all assets always<br />

operate at optimal conditions.<br />

The Analytics module is designed<br />

for ease-of-use. Its open<br />

and modular architecture enables<br />

different modes of implementation:<br />

Cogiscan will introduce the second<br />

major phase of evolution for the<br />

Factory Intelligence OEE software.<br />

• Factory Intelligence comes<br />

with a set of preconfigured<br />

dashboards and a tool for the<br />

creation of user specific dashboards.<br />

• Alternatively, customers can integrate<br />

the Analytics data with<br />

an existing third-party Business<br />

Intelligence (BI) dashboard<br />

application via a standard<br />

OLAP layer (Online Analytical<br />

Processing)<br />

Factory Intelligence runs on the<br />

standard platform of the company,<br />

which means that it is a<br />

very simple upgrade for existing<br />

customers. With the largest library<br />

of machine interfaces in<br />

the industry, the company can<br />

deliver a complete solution; including<br />

connectivity middleware<br />

and applications such as material<br />

control, traceability and analytics.<br />

productronica, Booth A2.361<br />

www.cogiscan.com<br />

Source: Cogiscan Inc.<br />

XXL Stencils<br />

Expand your Dimensions with the LPKF StencilLaser G 6080<br />

The LPKF StencilLaser G 6080 can easily be extended to hold extralong<br />

stencils. Max. cutting area: 600 x 1600 mm. Find out more:<br />

www.lpkf.com/smt-stencils<br />

productronica: 14 – 17 November 2017, Hall B2, Booth 303<br />

40 <strong>EPP</strong> EUROPE November 2017


Solution for issues with die attach reliability<br />

in high volume manufacturing<br />

Source: Alpha Assembly Solutions<br />

The company‘s sintering<br />

technology products.<br />

Alpha Assembly Solutions, a producer<br />

of electronic soldering and<br />

bonding materials, has recently<br />

introduced their latest technology<br />

developments, including<br />

their sintering technology products<br />

and a no-clean solder paste.<br />

The company’s sintering technology<br />

is a range of products designed<br />

to meet the demanding<br />

quality standards of the power<br />

semiconductor and LED industry.<br />

These products include Argomax,<br />

which has been specially<br />

designed for low pressure sintering<br />

die attachment.<br />

As well as advancements in sintering<br />

technologies, the company’s<br />

latest new cleanable, noclean<br />

material, OM-347 solder<br />

paste. The product has been designed<br />

to print and reflow Type 4<br />

and Type 5 powder to meet market<br />

segments requiring ultra-fine<br />

feature applications. This solder<br />

paste has been tested to give excellent<br />

printing performance and<br />

an outstanding reflow process<br />

window. After reflow, the resulting<br />

residue produced can be<br />

safely left on the board, or if<br />

needed, it can be very easily<br />

cleaned with a broad range of<br />

solvents.<br />

productronica, Booth B3.272<br />

www.alphaassembly.com<br />

Source: ULT AG<br />

Comprehensive extraction and filtration solutions<br />

At productronica in Munich/Germany,<br />

ULT AG will demonstrate<br />

its unique state as a full-range<br />

supplier of extraction and filtration<br />

technologies for air purification<br />

within electronics manufacturing.<br />

The company will present<br />

solutions for the efficient and<br />

economic removal of airborne<br />

pollutants, such as laser fume,<br />

soldering fume, gases, vapors,<br />

dusts, and odors.<br />

One focal point of the company’s<br />

trade show appearance is the<br />

capture and filtration of easily inflammable<br />

or explosive dusts<br />

and air mixtures, which may<br />

occur during surface processing<br />

of hard to handle elements, e.g.<br />

titanium. The particularly developed<br />

safe economic fume<br />

ULT AG will present<br />

solutions for<br />

the efficient and<br />

economic removal<br />

of airborne<br />

pollutants.<br />

extraction and filtration method<br />

is based on special filtration and<br />

capturing concepts.<br />

Additionally, the company will introduce<br />

the next development<br />

stage of its new device control. It<br />

allows for system remote control<br />

by means of LAN or WLAN via a<br />

webserver. Furthermore, users<br />

can read out specific device information,<br />

e.g. filter saturation<br />

state, performance figures, or<br />

the next maintenance date.<br />

Utilizing these types of systems<br />

in electronics manufacturing is a<br />

statutory requirement. Companies<br />

should also be aware that<br />

employees, production equipment,<br />

and products must be protected<br />

from the impact of hazardous<br />

emissions. They are generated<br />

during the utilization of<br />

laser machines, soldering technology<br />

or throughout gluing and<br />

welding processes.<br />

productronica, Booth A4.549<br />

www.ult.de/en<br />

<strong>EPP</strong> EUROPE November 2017 41


PCB + ASSEMBLY<br />

Source: SEHO Systems GmbH<br />

Demonstrations of all soldering<br />

systems take place in the Technology<br />

Center.<br />

Headquarters of SEHO<br />

Systems GmbH in Kreuzwertheim,<br />

Germany.<br />

Source: SEHO Systems GmbH<br />

When the soldering specialist bans soldering fume<br />

Soldering unit vendor ensures<br />

clean air around all systems<br />

In 1976, a still prevalent success story began: today‘s SEHO Systems GmbH started as SEHO Seitz & Hohnerlein<br />

GmbH, to drive rapid technology developments in the electronics industry. The enterprise emerged from a small wave<br />

soldering system provider into a global player offering customers complete solutions for soldering processes and<br />

automated production lines.<br />

Stefan Meißner, Head Corporate Communications, ULT AG; Heike Schlessmann, Marketing Manager, SEHO Systems GmbH<br />

The company develops and manufactures machines for all fields<br />

of automated soldering processes. They started with the production<br />

of wave soldering systems. By 1985, the product range had<br />

been expanded to include reflow machines. They then revolutionized<br />

the production of electronic devices with the introduction of its<br />

first nitrogen wave soldering system in 1986. The ongoing miniaturization<br />

of components resulted in the development of a completely<br />

new soldering technology. In 1998, the company introduced the first<br />

selective soldering system with robotic handling. During recent<br />

years, SEHO successfully implemented its strategy of providing<br />

complete solutions and developed from a standard machine provider<br />

to one of the leading system suppliers with innovative automation<br />

technology for board handling and materials management.<br />

Today, the company offers its customers complete solutions for a<br />

large variety of manufacturing tasks.<br />

In 2014, a new demonstration center was opened to illustrate these<br />

concepts to visitors. The company’s Technology Center provides<br />

customers a multitude of information in a very pleasant atmosphere.<br />

Being approximately 960 m 2 , there is enough space for demonstrating<br />

systems, meeting rooms, and a large event room for<br />

seminars and technology days.<br />

The entire product range of soldering units can be found in the<br />

demo center. Naturally, all systems are ready for operation, executing<br />

all common soldering tasks for electronic assemblies. Various<br />

PCB variants of different sizes, weights, or placement types (singlesided,<br />

double-sided, multilayer etc.) are processed.<br />

42 <strong>EPP</strong> EUROPE November 2017


PCB + ASSEMBLY<br />

LRA 200 fume extraction unit with<br />

flexible piping to soldering systems.<br />

Source: SEHO Systems GmbH<br />

Odorless and clean premises<br />

It is apparent that Technology Center’s visitors do not notice any<br />

odors, but every tinkerer knows the typical smell of molten solder.<br />

“There are strict legal regulations on air purification during system<br />

operation“, explains Hermann Liebler, Sales Area Manager. "Any soldering<br />

unit must not be operated without extraction and filtration.”<br />

Based on decades of activities with the company, among others in<br />

the area of process consulting, Hermann Liebler is considered as<br />

one of the soldering technology experts in Germany.<br />

Depending on PCB type and mounted components, different solder<br />

alloys and fluxes are utilized. During a soldering process, large parts<br />

of the fluxes and smaller portions of the solder evaporate. Resulting<br />

aerosols and particles are released into the process air. In addition<br />

to spreading unpleasant odors, they can cause severe illnesses to<br />

the personnel. Aldehydes, occurring from substances containing<br />

colophony, are particularly dangerous having carcinogenic potential.<br />

Furthermore, gases evolving during the heating of conformal coatings,<br />

adhesives or carrier material must also be considered.<br />

"The protection of machines and products should not be underestimated“,<br />

says Udo Kempf, Head of Application. Soldering fumes additionally<br />

contain adhesive aerosols, which may settle in the soldering<br />

systems and, in the worst case, contaminate products. This leads to<br />

increased maintenance efforts because system functionality can be<br />

reduced.<br />

In order to guarantee required air purification, extraction and filtration<br />

systems are applied. But there are no piping or suction<br />

hoods on the ceiling. The reason is the building architecture with its<br />

wooden beam look was not to be destroyed by such installations,<br />

i.e. a centralized extraction solution was simply unsuitable. That is<br />

why the company decided to run an extraction and filtration device<br />

with each soldering system.<br />

Flexible extraction solution for changing<br />

requirements<br />

Currently, each of the seven stations in the demo center features an<br />

LRA 200 extraction and filtration unit from ULT. The vendor’s LRA<br />

system series was developed for soldering fume removal. All filtration<br />

systems are placed adjacent to the soldering machines and<br />

connected to the systems via piping. These extraction channels, installed<br />

by SEHO themselves, are designed to be run also with<br />

changing demonstration units. Hence, this is a flexible way to<br />

extract and filter soldering fume from the systems. Filtration rate of<br />

the exhaust air is extremely high (99.95 %), so that it can be fed<br />

back to the working area after the filtration process.<br />

If an interested party decides to purchase a soldering unit, the company<br />

always recommends the acquisition of an air purification system<br />

– depending on the air pollutant volume they may vary in size<br />

and filtration performance. Partly, extraction devices are integrated<br />

into the soldering machine, if the customer’s production situation<br />

requires such a solution.<br />

The LRA 200 extraction and filtration units are small devices for<br />

medium volumes of soldering fume. They are fully adequate in the<br />

Technology Center: "Our soldering systems are not running for several<br />

hours or even around the clock”, explains Udo Kempf. "Additionally,<br />

we use few fluxes, so that vapors hardly occur and the entire<br />

contaminant volume is relatively low.”<br />

Since the extraction system purchase in 2015, it has not been<br />

necessary to exchange the filters, as they have not yet been saturated.<br />

On the one hand, this is due to the low quantities of soldering<br />

fume, and on the other by the special filtration concept within the<br />

extraction and filtration systems, which focuses on long-term filter<br />

lives at high filtration rates.<br />

In contrast to selective soldering, however, there are further applications<br />

where an entire circuit board is wetted with flux, as in wave<br />

soldering processes. The emerging spray mists from alcohol based<br />

flux and other assembly evaporations may lead to explosive, highly<br />

flammable vapor/air mixtures. In this case, a larger extraction unit is<br />

utilized. It features an expanded metal prefilter to reduce the risk of<br />

explosions or fires.<br />

<strong>EPP</strong> EUROPE November 2017 43


PCB + ASSEMBLY<br />

Training area for hand soldering seminars in the Academy with extraction<br />

installations for each workplace.<br />

The Academy – knowledge creates the future<br />

In such a dynamic industry as electronics production, it is important<br />

to build and continuously improve know-how, to ensure production<br />

is at the highest quality level and simultaneously reduce manufacturing<br />

costs. The SEHO Academy lays the foundation for this. Welleducated<br />

and experienced trainers provide their knowledge in intensive<br />

seminars about the soldering processes, as well as the operation<br />

and maintenance of machines. The efficiency of the company’s<br />

training courses is based on a simple principle: to provide a<br />

perfect balance of theory and practical application.<br />

In addition to process seminars and machine training courses, handsoldering<br />

seminars are also available at the SEHO Academy. To this<br />

end, six workplaces have been set up, where a clean working environment<br />

plays a critical role. An LRA 300 filtration unit is utilized<br />

for soldering fume removal, providing a central extraction solution.<br />

Each workplace has extraction arms (Alsident 50), with respective<br />

capturing elements (suction tip), that are connected to the filtration<br />

system via piping. They efficiently remove all generated airborne<br />

pollutants. This way, seminar attendees, trainers, work materials,<br />

products, and workplaces are protected from the hazardous impact<br />

of soldering fumes and vapors.<br />

Source: SEHO Systems GmbH<br />

Zusammenfassung<br />

Im Technologiecenter von SEHO mit dem vollständigen Produktportfolio<br />

an Lötmaschinen ist auffallend, dass Besucher keine Gerüche<br />

wahrnehmen können. Um entsprechende Luftreinhaltung zu<br />

gewährleisten, werden Absaug- und Filteranlagen von ULT betrieben,<br />

wobei an jeder Lötanlage jeweils ein Absaug- und Filtergerät<br />

installiert wurde. Nach dem Motto „Alles aus einer Hand“ funktionieren<br />

sämtliche Absauggeräte selbst bei wechselnden Lötaufgaben<br />

problemlos.<br />

Résumé<br />

Le centre technologique de SEHO, avec une gamme complète de<br />

produits de soudure, rend remarquable que les visiteurs ne perçoivent<br />

pas les odeurs. Afin d‘assurer une bonne purification de l‘air,<br />

les systèmes d‘aspiration et de filtration de l’entreprise ULT, ont été<br />

installés à chaque station de soudage avec un extracteur et un filtre.<br />

Selon la devise„tout d‘une seule source“, tous les dispositifs<br />

d‘aspiration fonctionnent sans problème, même avec le changement<br />

de tâches de soudure.<br />

Резюме<br />

В технологическом центре компании Seho представлен<br />

полный ряд паяльного оборудования, при этом посетители<br />

сразу же обратят внимание на отсутствие каких-либо запахов.<br />

Для обеспечения надлежащего уровня чистоты воздуха<br />

применяются аспирационные и фильтровальные установки<br />

ULT, при том что на каждой паяльной установке уже<br />

установлены вытяжка и фильтр. Даже при смене паяльного<br />

оборудования все без исключения аспирационные установки<br />

продолжают работать автономно без каких-либо проблем.<br />

A long-term relationship<br />

The entire extraction and filtration technology applied at the company<br />

is provided by a single source. One reason is the long-term<br />

partnership between the soldering specialist and the company IVH<br />

Industrievertrieb Henning, ULT’s distribution partner for the south of<br />

Germany for nearly 20 years. Long before building the demonstration<br />

center and training rooms, soldering systems from SEHO have<br />

been run with ULT extraction and filtration systems at numerous<br />

customer sites. Udo Kempf considers the lasting relationship with<br />

IVH as an important reason in the purchase process of the filtration<br />

solutions for the demo center. "Why change a working relationship?”<br />

he asks with a smile. IVH assisted SEHO in an advisory capacity<br />

during the premises furnishing and, additionally, helped to<br />

make sure that “all things flew”, describes Udo Kempf further.<br />

The extraction and filtration systems run smoothly and straightforwardly<br />

– and are nearly noiseless. "One of the ULT devices’ major<br />

advantages is their quiet operation”, says Udo Kempf. "Easy operation,<br />

high extraction and filtration performance; and one can hardly<br />

hear the systems running. That is fun air purification.”<br />

productronica, Booth A4.549; Booth A4.578<br />

www.ult.de; www.seho.de<br />

44 <strong>EPP</strong> EUROPE November 2017


PCB + ASSEMBLY<br />

Protection of components/ substrates from moisture/ contamination in tough environments<br />

Application of conformal coating<br />

over no-clean flux residue<br />

The requirement for increased electronics environmental robustness in tough application areas is normally<br />

accomplished with the application of conformal coatings. These coatings protect the underlying components<br />

and substrates from moisture and contamination in their operating environment. But what if the contamination<br />

comes from the inside, beneath the protective coating?<br />

Timothy O’Neill, Technical Marketing Manager, AIM Solder<br />

With electronics proliferating into every facet of our daily lives,<br />

they are also being subjected to harsher service environments.<br />

This fact, coupled with a need for increased reliability, has<br />

designers and materials manufacturers working furiously to develop<br />

products and materials to satisfy these application requirements. A<br />

prime example of this merger of high reliability and harsh service<br />

conditions is the rapid development of mixed energy powertrains<br />

and autonomous automobile capabilities. Ford Motor Company says<br />

a 2017 GT model has more computing power than an F-35 fighter<br />

jet! In both of these applications, and in numerous others, the electronics<br />

are expected to perform flawlessly in harsh environmental<br />

conditions for many years.<br />

High volume manufacturing requirements and the rapid deployment<br />

of low stand-off components has driven designers and manufacturers<br />

to adopt no-clean processes. A no-clean strategy dramatically<br />

reduces expenses by eliminating the need for a post-soldering<br />

cleaning process. Many QFN and LGA manufacturers recommend/<br />

mandate a no-clean process as the complete removal of flux residues,<br />

under this style of component is becoming more difficult as<br />

tolerances decrease and component density increases. This creates<br />

an intractable conflict with the recommendations of conformal coating<br />

manufacturers: for maximum long term reliability. The best practice<br />

in this case may be to follow the old adage, when in doubt –<br />

just clean. These conflicting recommendations leave many electronics<br />

companies with the difficult decision to violate the guidance<br />

of at least one of their supplier recommendations with the most<br />

common question being, “can we apply conformal coating over noclean<br />

flux residue?”<br />

No industry standard compatibility test<br />

One very well-known conformal coating manufacturer estimates<br />

that 80 % of conformal coating (by volume) is applied over no-clean<br />

flux residue. If there is security in numbers, adopting this strategy is<br />

an established approach. However, the challenge lies in determining<br />

the compatibility of the materials to be used. As of right now, there<br />

is no industry standard testing for establishing compatibility between<br />

flux and coating materials. Applying existing reliability test<br />

criteria for fluxes and coatings to a specific material set is a practical<br />

approach. The first step is to define the application reliability requirements,<br />

costs, and manufacturing capabilities. A basic understanding<br />

of the available coating technologies is required to do this.<br />

Solder/flux manufacturers develop products focusing on several key<br />

Source: AIM Solder<br />

Liquid flux applied on test coupon.<br />

Solder paste printed on test coupon.<br />

Source: AIM Solder<br />

<strong>EPP</strong> EUROPE November 2017 45


PCB + ASSEMBLY<br />

Acrylic Coatings<br />

Urethane Coatings<br />

Strengths<br />

Weaknesses<br />

Strengths<br />

Weaknesses<br />

Air dry<br />

VOC bearing solvents<br />

Chemical resistant<br />

High stress during temp. cycling<br />

Easy solvent rework<br />

Poor chemical resistance<br />

Humidity resistant<br />

Rework<br />

Good moisture barrier<br />

Flammable<br />

Abrasion resistant<br />

Long cure rate<br />

Ease of use<br />

Solvent in high temperature<br />

Dielectric properties<br />

Heath Risks/Solvent<br />

An example of adhesion test results.<br />

areas with the soldering performance being the most critical issue.<br />

This includes solder joint attributes such as wetting, voiding, and<br />

joint strength. Flux residue also receives a great deal of focus because<br />

the only materials on the substrate/PCB after soldering are<br />

the solder joint and the flux residue (more on residue later). Other<br />

considerations are paste print functioning which includes transfer<br />

efficiency, stencil life, shelf life, etc . The coating and cleaning attributes<br />

of no-clean solder residue can only be addressed after<br />

these more critical functions are satisfied. Therefore, there are<br />

paste and flux products that exhibit poor compatibility with coatings<br />

due to developmental priorities.<br />

Source: AIM Solder<br />

Test methods and pass/fail criteria<br />

Without an industry specification to determine compatibility between<br />

coatings and flux residues, designers and assemblers have<br />

to develop their own test methods and accompanying pass/fail<br />

criteria or rely on the experience and recommendations of their vendor<br />

base. AIM has collaborated with multiple major coating suppliers<br />

on a variety of customer applications to understand how different<br />

material sets will perform. The test approach has been to<br />

merge the pertinent specifications from the IPC J-STD-004 A/B and<br />

IPC CC-830 conformal coating specifications to provide insight as to<br />

how the materials will perform in the field. Solder paste, liquid flux,<br />

and cored wire residues were all subjected to the same battery of<br />

tests.<br />

The first test performed was visual inspection. B-24 SIR test coupons<br />

were selected as the test vehicle because the coating thickness<br />

is consistent, they do not introduce topographical variability,<br />

they are inexpensive and all three tests could be executed on the<br />

same style test coupon. After applying flux on coupons, they were<br />

coated and cured per the coating manufacturers recommendations.<br />

Adhesion issues were usually readily apparent at the time of coating<br />

with non-wetting, mealing, or blistering appearing right away. Liquid<br />

fluxes were more prone to fail at this point in the process which was<br />

attributed to the wetting agents used in the flux and the fact that the<br />

residue was present globally, whereas paste and wire residues are<br />

location specific. Materials that failed visual inspection after coating<br />

was applied were deemed incompatible and did not receive further<br />

consideration.<br />

The second test performed was surface insulation resistance (SIR)<br />

Results of solder flux<br />

SIR test; any value<br />

under 100 MΩ is a fail<br />

condition.<br />

Source: AIM Solder<br />

46 <strong>EPP</strong> EUROPE November 2017


PCB + ASSEMBLY<br />

Silicone Coatings<br />

Epoxy Coatings<br />

Strengths<br />

Weaknesses<br />

Strengths<br />

Weaknesses<br />

Humidity Resistant<br />

Abrasion<br />

Humidity resistant<br />

Two-part<br />

High dielectric strength<br />

Workplace contamination<br />

Moisture resistant<br />

Rework<br />

Flexibility/Low modulus<br />

Sulfur absorption<br />

Abrasion resistant<br />

Pot life<br />

Temperature tolerant<br />

Dielectric properties<br />

testing per J-STD-004 A/B. This test is common to flux manufacturers<br />

and establishes the insulative properties of the flux residue<br />

under temperature and humidity conditions that promote electrochemical<br />

interactions/migrations (40° C/90 % Rh). An apparent failure<br />

is any reading under 100 MΩ.<br />

Dozens of flux and coating combinations were subjected to these<br />

tests and patterns emerged between different classes of coatings<br />

with different types of residues. Some flux/coating combinations<br />

failed outright, due to what was hypothesized to be either an inhibition<br />

of curing not detected at the time of coating or a third product<br />

forming when the two materials combined. Some material sets<br />

showed little change versus uncoated residues while others<br />

showed significant changes with coating applied.<br />

Thermal shock testing under a wide range of parameters was also<br />

performed to understand how the coating durability was affected<br />

when applied over flux residue. Again, dozens of material sets were<br />

tested and patterns emerged. In general, a liquid flux that passed<br />

the visual test also passed thermal shock adhesion testing, regardless<br />

of coating technology. Paste results were much different, low<br />

modulus coatings such as silicone easily passed thermal shock adhesion<br />

tests, but more rigid coatings such as urethane acrylate, exhibited<br />

fracture and delamination much earlier and in a narrower<br />

temperature range. Surprisingly, exposure to lower temperatures<br />

(


PCB + ASSEMBLY<br />

Maximizing the reliability of designs with reed relay<br />

Contact abuse and ‘hot’<br />

versus ‘cold’ switching<br />

Graham Dale, Director of Research and Development at Pickering Electronics,<br />

explains the issue of contact abuse and ‘hot’ and ‘cold’ switching whilst using<br />

reed relays. The article is intended to help reed relay users maximize the<br />

reliability of their designs.<br />

High current or high power inrushes are the most damaging and<br />

most frequent causes of contact damage when using reed relays.<br />

They have a specific maximum amount of current, voltage, and<br />

power ratings. The power figure is the product of the voltage across<br />

the open contacts before closure and the instantaneous current<br />

that is made.<br />

Contact abuse<br />

At Pickering, we have lost count the number of times we have<br />

heard something along the lines of: “I was only switching to 5 volts<br />

at 50 milliamps on this CMOS logic board”, as the user usually disregards<br />

the current inrush into the sprinkling of decoupling capacitors<br />

and several microfarads of reservoir capacitance on that board.<br />

However, only relying on electronic current to limit the power<br />

supplies to protect relay contacts should not be done. Limiting electronic<br />

current takes a finite time to react and there are often decoupling<br />

capacitors on the output of a power supply. There is nothing<br />

better than limiting resistive current.<br />

Due to the charging of capacitive loads, inrushes also discharges capacitors,<br />

which can become a problem as the current is often only limited<br />

by the resistance of the reed switch and PC tracks. Even capacitors<br />

charged with low voltages can cause current inrushes of<br />

tens of amps and although they may only be for microseconds, they<br />

can cause damage to small reed switches.<br />

As voltage increases for some applications, inrushes can become<br />

an even greater issue, specifically when discharging cables after the<br />

proof testing of high voltage. The energy stored in a capacitance is<br />

equal to ½ CV 2 joules, meaning it increases with the square of voltage.<br />

So when increasing from 10 volts to 1000 volts, the stored<br />

energy will increase by 10,000 times.<br />

If you have had a relay contact stick closed, to be free only with a<br />

slight tap, or had a longer than expected release time, it is most<br />

likely caused by a micro-weld due to a current inrush.<br />

‘Hot’ versus ‘cold’ switching<br />

Reed relays generally have a higher carry current rating compared to<br />

their ‘hot’ switching current rating. It is usually during ‘hot’ switch-<br />

High current inrushes are the most damaging and most frequent cause of<br />

contact damage when using reed relays.<br />

Source: Pickering Electronics<br />

Less severe current inrushes will cause a milder weld or gradually build<br />

up a ‘pip’ on one contact and erode a ‘crater’ on the other, depending on<br />

the direction of current flow.<br />

Source: Pickering Electronics<br />

48 <strong>EPP</strong> EUROPE November 2017


PCB + ASSEMBLY<br />

ing where contact damage occurs, due to the resulting arc across<br />

the contacts as they open or close. A severe current overload will<br />

quickly melt the contact area causing the two surfaces to fuse together,<br />

creating a hard weld as soon as the contact closes. Less severe<br />

current inrushes will cause a milder weld or gradually build up a<br />

‘pip’ on one contact and erode a ‘crater’ on the other, depending on<br />

the direction of current flow. These can eventually lock together.<br />

Arcs can occur when contacts open, particularly when the load is inductive.<br />

Back EMFs from inductive loads should always be limited,<br />

usually by a simple diode for DC loads or by a snubber or varistor for<br />

AC loads.<br />

One way to reduce or remove these issues is to use the ‘cold’<br />

switch. This is a common technique in test instrumentation, where<br />

the current or voltage stimulus is not applied to the switch until after<br />

the relay has been operated and the contact bounce is finished. In<br />

the same way, the stimulus is removed before the contact is<br />

opened. By using this technique, there won’t be any arcing or<br />

switched current inrushes and the relay will achieve maximum life,<br />

often into billions of operations.<br />

Graham Dale, Director of Research and Development at Pickering Electronics,<br />

explains the issue of contact abuse and ‘hot’ and ‘cold’ switching.<br />

When calculating the delay time between switching on the relay coil<br />

and applying the current to the switch, it is important to consider<br />

the effects of high ambient temperature, as this is likely to be encountered.<br />

The maximum operating time and bounce figures given<br />

on the data sheets are at a 25 °C ambient level. At higher temperatures,<br />

the resistance of the coil winding will increase at a rate of<br />

0.4 % per °C, this being the coefficient of resistance of the copper<br />

coil wire. There will therefore be a corresponding fall in coil current<br />

and the level of the magnetic field that is generated to operate the<br />

reed switch. This lower drive level will increase the operating time<br />

slightly. The timing figures on Pickering data sheets are normally<br />

quite conservative, so this is unlikely to be an issue for the normal<br />

ambient specification of 85 °C. However, it is also necessary to consider<br />

any additional self-heating within the relay, due to a high carry<br />

current and the witch resistance (I-Squared-R Watts), and to allow a<br />

little more time before turning on the current through the switch.<br />

productronica, Booth A1.452<br />

www.pickeringrelay.com<br />

Source: Pickering Electronics<br />

Reed relays generally have a higher carry current rating compared<br />

to their ‘hot’ switching current rating.<br />

Source: Pickering Electronics<br />

<strong>EPP</strong> EUROPE November 2017 49


PCB + ASSEMBLY<br />

PRODUCT UPDATES<br />

Robotically controlled dry storage management systems<br />

Moisture control specialist Super Dry Totech’s<br />

latest generation of robotically automated<br />

component storage systems will be<br />

available at November’s productronica. The<br />

company’s Dry Tower incorporates complete<br />

moisture management, floor life reset and<br />

traceability of MSL components, in addition<br />

to optimising the storage demands of different<br />

sized reels and trays, operator-free.<br />

Businesses are striving for more flexible<br />

automation and digitalization of processes,<br />

symbolized by ever expanding Industry 4.0<br />

initiatives including sophisticated track and<br />

trace logistics throughout the entire supply<br />

chain. Relentless attention to the elimination<br />

of routine manual tasks and higher efficiencies<br />

within existing shop floor constraints is a<br />

fundamental and essential element of competitiveness,<br />

survival, and growth.<br />

The company’s robotically controlled Dry<br />

Storage management systems have demonstrated<br />

their ability to serve these needs and<br />

greatly aid making the vision of mass cus-<br />

tomization in Smart Factories a reality. The<br />

next generation of the Dry Tower is now expanding<br />

its pinpoint automation beyond the<br />

four walls of the automated, environmentally<br />

controlled warehouse to provide the automated<br />

delivery of goods directly to assembly<br />

lines in a more flexible manner. Fixed conveyors<br />

and operators are being replaced with<br />

a variety of more cost saving, and quickly<br />

changeable methods that can utilize existing<br />

factory layouts.<br />

Goods incoming, feeder preparation, line<br />

prep and replenishment, emergency components,<br />

delivery to support stations and return<br />

to floor life protective storage are examples<br />

of essential manufacturing process flow<br />

events. The Dry Towers’ Autonomous Indoor<br />

Vehicle (AIV) systems, developed and integrated<br />

by Asys, accomplishes these tasks,<br />

further reducing the need for operators in<br />

those areas of the manufacturing process. At<br />

the same time, they provide a flexible buffering<br />

of product flow, ensuring that feeding<br />

The automated logistics systems feed assembly<br />

lines operator free.<br />

production can be a priority, eliminating<br />

bottlenecks and accelerating the smooth logistics<br />

flow.<br />

At the show, Asys will showcase solutions<br />

for the automation of the entire material flow<br />

in a modern electronic manufacturing facility.<br />

The company has developed a modular, expandable<br />

logistics concept, which consists of<br />

three main components: Centralized Component<br />

Bearing, Autonomous Indoor Vehicles<br />

(AIV) and Material Stations. All system components<br />

communicate with each other via<br />

the company’s software solution Pulse and<br />

pass on the respective orders.<br />

productronica, Booth A3.277<br />

www.superdry-totech.com/dry-tower-system;<br />

www.asys.de<br />

Source: Super Dry Totech<br />

50 <strong>EPP</strong> EUROPE November 2017


Source: Zestron <strong>Europe</strong><br />

Compare cleaning machines at productronica<br />

Zestron will be exhibiting a selection of<br />

cleaning machines from leading international<br />

manufacturers at productronica from the<br />

Technical Center in Ingolstadt, Germany. As a<br />

Zestron will be exhibiting cleaning machines<br />

at productronica.<br />

result, trade show visitors who are looking<br />

for a new cleaning machine can compare different,<br />

innovative, and proven technologies<br />

directly on site. The company’s process engineers<br />

and representatives from equipment<br />

manufacturers are available for questions regarding<br />

the features, as well as, the optimally<br />

adapted cleaning agents.<br />

Further trade fair highlights are the pH neutral<br />

PCB cleaning agent Vigon N 640, providing<br />

excellent cleaning performance on the latest<br />

fluxes in specific batch systems, as well<br />

as the single-phase stencil cleaning agent<br />

Hydron SC 300, designed to effectively remove<br />

SMT adhesives without leaving<br />

streaks after drying.<br />

productronica, Booth A2.359<br />

www.zestron.com<br />

POWERFUL SPRINGS<br />

FROM FLEXIBLE<br />

MANUFACTURING<br />

THE PRODUCT RANGE<br />

EVERYTHING FOR YOUR SUCCESS<br />

» CONSTANT<br />

FORCE SPRINGS<br />

» INDUCTION COILS<br />

Launching of DMS for UV LED applications<br />

Thermal management innovator, Cambridge<br />

Nanotherm, announces the launch of Nanotherm<br />

DMS, a direct-metallised singlesided<br />

thermal management solution that addresses<br />

the challenges created by UV LED<br />

modules.<br />

Ultraviolet (UV) light has key applications for<br />

curing resins and inks (UVA) and for disinfection<br />

and sterilisation (UVC). LED technology<br />

has transformed the industry by enabling<br />

smaller, more cost-effective and robust devices<br />

that have opened up previously inaccessible<br />

applications.<br />

UVA LEDs are rapidly displacing traditional<br />

UV lamps in the industrial printing industry,<br />

speeding up print times and reducing cost,<br />

while UVC LEDs open up applications like<br />

portable sterilisation units that can provide<br />

millions with clean drinking water, or let you<br />

sterilise your toothbrush when you’re camping.<br />

The UVC market in particular is on the<br />

cusp of meteoric growth.<br />

However, UV LEDs present a significant thermal<br />

challenge. UVC LEDs often only convert<br />

5 % of the power put in to photons. The remainder<br />

must be conducted away as heat via<br />

the base of the LED to a thermally conductive<br />

PCB to avoid the LED die overheating.<br />

As shorter wavelengths of UV light degrade<br />

organic material the choice of PCB is often limited<br />

to inorganic materials, discounting<br />

cost-effective metal-clad PCBs (MCPCBs)<br />

that rely on an organic epoxy based dielectric<br />

layer. Ceramics such as aluminium oxide<br />

(Al 2<br />

O 3<br />

) or aluminium nitride (AIN) are used,<br />

but they present a conundrum to LED designers<br />

— low-performance but cost-effective<br />

alumina (25 W/mK), or high-performance<br />

but expensive aluminium nitride<br />

(140–170 W/mK).<br />

There is another issue with ceramic. It’s<br />

brittle and prone to cracking, far from ideal for<br />

the new wave of portable applications and<br />

equally an issue for industrial applications —<br />

overtighten a screw and the module PCB will<br />

fracture. The company has developed DMS<br />

to address these issues. It combines the robustness<br />

and manufacturability of aluminium<br />

with the high thermal performance of AIN<br />

and as it undergoes thin-film processing, it’s<br />

entirely inorganic.<br />

The company’s direct metallised single-sided<br />

PCB (Nanotherm DMS) uses an extensively<br />

patented electro-chemical oxidation (ECO)<br />

process to convert the surface of aluminium<br />

into an alumina dielectric layer. This nanoceramic<br />

alumina has a thermal conductivity of<br />

7.2 W/mK which, coupled with being just tens<br />

of microns thick and using a direct metallisation<br />

process, gives a composite thermal<br />

performance of 152 W/mK. While this is<br />

slightly inferior to the very best and most expensive<br />

AIN substrates, the mechanical robustness<br />

of the company metal board permits<br />

better approaches to mounting so<br />

measured system performance exceeds that<br />

of aluminium nitride.<br />

productronica, Booth B3.176<br />

www.camnano.com<br />

Constant force springs<br />

» Practically linear force progression and<br />

low hysteresis<br />

» Solutions for small installation spaces<br />

Induction coils<br />

» Single or double-wound body with stripped and<br />

tinned ends, as well as<br />

» With stampings and bonded core<br />

EMPLOYEES<br />

115<br />

Bohnert GmbH<br />

Weilerstraße 33<br />

78739 Hardt<br />

Tel. +49 (0) 7422.27 09-0<br />

info@bohnert-federn.de<br />

3<br />

MILLION<br />

SPRINGS DAILY<br />

40<br />

YEARS<br />

OF EXPERIENCE<br />

www.bohnert-federn.de<br />

<strong>EPP</strong> EUROPE November 2017 51


PCB + ASSEMBLY<br />

The effects of lead-free soldering temperatures<br />

Suitability of an enhanced low<br />

melting point alloy<br />

It is a well-known fact that current lead-free soldering temperatures can damage temperature sensitive<br />

components and even PCB board materials. Nearly every electronic unit has some critical component<br />

on it. Such as, BGAs, LGAs, fuses, displays, crystal oscillators, LEDs, displays, components with a plastic<br />

body, coils and transformers, etc. In most cases, damage by thermal stress after soldering can be<br />

determined by either visual, optical, X-ray, ICT, or functional testing.<br />

Megger’s electronic unit of a high accuracy hand held measuring device.<br />

However, it is a less-known fact that current lead-free soldering<br />

temperatures can also cause a shift in the properties of some<br />

components, which can then impact the functionality of sensitive<br />

electronic circuits, like e.g. measuring devices. These kind of failures<br />

are often harder to determine.<br />

An easy way to solve problems related to higher soldering temperatures<br />

is to use a soldering alloy that has a lower melting point. However,<br />

these alloys can have limitations in mechanical strength. Shock<br />

and vibration resistance tend to be the weakest points, which limits<br />

the field of use. The LMPA-Q low melting point alloy has been specifically<br />

developed, by Interflux Electronics N.V., to overcome these<br />

limitations.<br />

The following case study investigates the suitability of the LMPA-Q<br />

alloy with the use of Megger Instruments Ltd.‘s handheld high accuracy<br />

measuring device. Currently, the device is being used with a<br />

SnAg3Cu0,5 alloy, it is sensitive to heat in the soldering process,<br />

and is shock resistant in the field.<br />

Source: Interflux Electronics N.V.<br />

Source: Interflux Electronics N.V.<br />

Vibration and shock testing.<br />

Vibration and shock resistance testing<br />

Handheld devices need to have good shock resistance in the field.<br />

In the past, this particular property has proven to be the weak point<br />

of traditional low melting point alloys. The electronic unit is submitted<br />

to vibration and shock resistance testing according to the<br />

test standards described in BS EN 60945 and BS EN 60068. For objectivity<br />

purposes, the test are performed by a third party specialized<br />

testing lab.<br />

The Half Sine shock test will perform shocks in both directions on all<br />

three axes. Shocks will last 11 ms with a peak acceleration of 30 G<br />

or defined by practical limitations of the test setup. In this case, the<br />

shock in the X-axis was limited to 10 G due to the breaking of the<br />

measuring sensor with higher peak accelerations. Shocks in Y and<br />

Z-Axis were at 30 G. As a reference, 10G is equal to 4 times the<br />

Assembly of the electronic unit<br />

The electronic unit consists of a double sided I-Ag finished PCB<br />

board with SMD and through-hole components. The temperature<br />

sensitivity mainly lies in the different capacitors on the board that<br />

are all somehow affected by heat. The boards are printed with the<br />

DP 5600 LMPA-Q solder paste with ROL0 classification. The units<br />

are reflow soldered in a full convection oven without nitrogen and<br />

with a profile of a peak temperature below 205 ºC. This reflow profile<br />

will indulge the Tº-sensitive components. The through-hole components<br />

are being soldered with LMPA-Q solder wire.<br />

Reflow profile for LMPA-Q alloy.<br />

Source: Interflux Electronics N.V.<br />

52 <strong>EPP</strong> EUROPE November 2017


PCB + ASSEMBLY<br />

SAC305 vs LMPA-Q 30min X-axis vibration endurance<br />

Test sequence<br />

Frequency<br />

Acceleration<br />

LMPA-Q<br />

SAC 305<br />

1<br />

30 Hz<br />

18 G<br />

Pass<br />

Pass<br />

2<br />

30 Hz<br />

18 G<br />

Pass<br />

Pass<br />

Source: Interflux Electronics N.V.<br />

3<br />

30 Hz<br />

18 G<br />

4<br />

30 Hz<br />

18 G<br />

5<br />

30 Hz<br />

18 G<br />

Pass<br />

Pass<br />

Pass<br />

Pass<br />

Pass<br />

Fail<br />

SAC solder joint failure.<br />

SAC fails first in comparative vibration testing.<br />

shock a mobile phone experiences when it is dropped 1 meter<br />

above a concrete floor.<br />

The vibration test will start with a resonance frequency search on<br />

the electronic device on all 3 axes. The resonance frequency for a<br />

device is when it reaches the highest force. This will be different for<br />

each device, as well as, for each axis. Once the resonance frequency<br />

is found, a 2H vibration endurance test with a peak acceleration<br />

of 3G will be performed. If the resonance frequency isn’t found, a<br />

standardized endurance frequency of 30 Hz will be used with a peak<br />

acceleration of 3G. In this case, a resonance frequency was only<br />

found for the X-axis at 82,92 HZ.<br />

Results and extended testing<br />

After the shock and vibration resistance testing, the units soldered<br />

with the LMPA-Q alloy were subject to visual inspection. None of<br />

the units showed signs of failures or misalignments. The units from<br />

the company were all subject to ICT and functional testing, and they<br />

all passed.<br />

From the results, it was concluded that the alloy has sufficient<br />

mechanical strength for handheld devices. However, to get a better<br />

idea of how it holds up against the SnAg3Cu0,5 alloy, comparative<br />

vibration endurance tests were also done.<br />

Comparative shock is more difficult to test due to the previously<br />

mentioned limitations of the test setup. Shock and vibration resistance<br />

tend to go hand in hand, as vibration is a fast sequence of<br />

shocks.<br />

The same handheld high accuracy measuring device was chosen for<br />

this test. Electronic units soldered with SnAg3Cu0,5 and LMPA-Q<br />

were provided to the test lab. Since vibration in the X-axis was expected<br />

to be more critical, it was chosen as the only axis for this<br />

test. A standard test frequency of 30 Hz in combination with a peak<br />

acceleration of 18 G was used initially for a 30 minute vibration endurance.<br />

After visual inspection, the acceleration or frequency was<br />

increased step by step, until a first failure was noticed. The first failure<br />

manifested itself on an electronic unit soldered with the<br />

SnAg3Cu0,5 alloy at a frequency of 50 Hz and a peak acceleration of<br />

25 G.<br />

Results and conclusion<br />

As the LMPA-Q alloy passed the required shock and vibration tests<br />

and the SnAg3Cu0,5 alloy failed in comparative vibration testing,<br />

the LMPA-Q alloy was found suitable for the production of Megger’s<br />

handheld high accuracy measuring device. This alloy allows for<br />

lower soldering temperatures in the soldering processes and temperature<br />

sensitive components are less affected by heat. Based<br />

upon these results, the company has started the procedure to<br />

homologate this alloy for more processes and products.<br />

productronica, Booth A4.281<br />

www.lmpa-q.com<br />

Zusammenfassung<br />

Es ist eine bekannte Tatsache, dass Temperaturen beim bleifreien<br />

Lötprozess temperaturempfindliche Bauteile und sogar Leiterplattenmaterialien<br />

beschädigen können. Dabei befindet sich auf nahezu<br />

jeder Baugruppe eine kritische Komponente wie beispielsweise<br />

BGAs, Sicherungen, Displays, LEDs, Spulen und Transformatoren<br />

oder Displays. In den meisten Fällen kann solch Beschädigung<br />

durch visuelle, optische, Röntgeninspektion, ICT oder Funktionstests<br />

erkannt werden.<br />

Résumé<br />

Il est bien connu que les températures pendant la soudure sans<br />

plomb peuvent abîmer des pièces qui sont sensibles à la température<br />

et aussi les matériaux d’une carte de circuit imprimé. Des<br />

éléments critique, tel que les BGA, les fusibles, les écrans, les LED,<br />

les bobines, les transformateurs, se trouvent sur presque tous les<br />

modules. Dans la plupart des cas, ces dégâts peuvent être détectes<br />

par des tests visuels, optiques, aux rayons X, aux TIC ou test de<br />

fonctionnement.<br />

Резюме<br />

Общеизвестно, что высокая температура в процессе<br />

бессвинцовой пайки может повредить как компоненты,<br />

чувствительные к нагреву, так и материал печатной платы.<br />

При этом на почти каждом электронном узле найдутся<br />

критически важные компоненты, например, BGA,<br />

предохранители, дисплеи, светодиоды, катушки и<br />

трансформаторы. В большинстве случаев повреждение таких<br />

компонентов можно выявить при помощи<br />

визуально-оптического, рентгенографического контроля,<br />

сравнительных испытаний при приемочном контроле или в<br />

ходе проверки работоспособности.<br />

<strong>EPP</strong> EUROPE November 2017 53


PCB + ASSEMBLY<br />

Research done to determine void reducing optimized profile<br />

Reduce voiding for low-standoff<br />

components during reflow<br />

Bottom terminated components (BTCs) are one of the most ubiquitous of all electronic components. By the end of 2017,<br />

approximately 50 billion QFNs (quad-flat pack no-leads), the most common BTC, will be used. In fact, there are enough<br />

BTCs in electronics that every man, woman, and child in the world could each have seven. With this great dependency<br />

on BTCs, it is important that they perform well.<br />

A QFN is the most common BTC. Note the thermal pad on it.<br />

One area of great concern that can impact performance is the<br />

fact that BTCs generate a considerable amount of heat during<br />

their normal operation. The thermal pad, which is soldered to the receiving<br />

pad on the printed wiring board (PWB), is designed to remove<br />

this heat. Unfortunately, voids that form during reflow soldering<br />

can inhibit this process, causing the BTC to overheat and potentially<br />

impact reliability. An informal survey of engineers suggests<br />

that this voiding issue is the greatest concern in electronics assembly<br />

today.<br />

Source: Indium Corporation<br />

Why do voids form?<br />

Voids form due to the evaporation of flux materials in the solder<br />

paste. Solder paste is about 50 % of volume flux so the amount of<br />

these evolved volatile materials during reflow can be considerable.<br />

There is no standard as to how much voiding is acceptable, but<br />

there appears to be an agreement that a total void area of less than<br />

50 %, with no “lake” void greater than 40 % of the area, is an absolute<br />

requirement; however, 25 % is preferred. In some critical applications<br />

such as automotive, 10 % or less is required.<br />

Reducing voiding: past work<br />

To minimize voiding in the past, process engineers had to perform<br />

designed experiments to optimize many of the assembly variables,<br />

such as reflow profiles and stencil design. Considerable work was<br />

done to investigate the effect of stencil designs to create paths for<br />

the evolved flux vapors to escape. 1) Other work showed the benefit<br />

of using solder preforms to maximize the amount of solder between<br />

the BTC and the PWB pads. 2)<br />

Reducing voiding: current work with reflow ovens<br />

Considerable developments have occurred in reflow oven technology<br />

to minimize voiding – most noteworthy has been the use of vacuum<br />

reflow to aid in removing voids. 3) Reports suggest that these<br />

ovens have been successful in reducing voiding to less than a few<br />

percent. While this achievement is significant, it requires the as-<br />

Source: Indium Corporation<br />

These X-ray images show voiding. These “lake” voids occupy about 40 % of the<br />

area and may cause reliability issues.<br />

The “windowpane” stencil design used in the<br />

experiments.<br />

Source: Indium Corporation<br />

54 <strong>EPP</strong> EUROPE November 2017


sembler to purchase a new oven or at least an upgrade. There have<br />

also been anecdotal reports of solder paste spattering, but we expect<br />

that process optimization procedures can minimize this problem.<br />

Reflow ovens employing ultrasonic energy have been reported to<br />

achieve similar success. 4) As Heller Industries stated in a 2016 presentation,<br />

“Ultrasonics are applied when solder is in liquid state.”<br />

Ultrasonics create cavitation, which stretches voids/bubbles so they<br />

combine with other voids, and move to the outer surface of solder<br />

to escape. As with vacuum reflow ovens, the process engineer<br />

must purchase a new oven or an upgrade.<br />

Reducing voiding: current work with solder paste<br />

and process<br />

Recently, Indium Corporation conducted research to determine critical<br />

variables in minimizing voids, especially in light of modern solder<br />

pastes that have been designed to reduce voiding. 5) After considering<br />

the many possible variables, they settled upon an experimental<br />

plan using the following:<br />

• Entek Plus CU-106A-HT OSP PWB pad finish<br />

• Laser cut, non-nano-coated steel stencils of 100 μm and 125 μm<br />

thicknesses<br />

• A windowpane stencil design in the PWB thermal pad area to<br />

allow volatiles to escape. The windowpane squares were 0.088 “<br />

on each side<br />

• Squeegee printing speed of 100 mm/s with a pressure of 6 kg<br />

• Printer separation speed of 5 mm/s at a distance of 2 mm<br />

• A stencil wipe (W/D/V) was performed before each board<br />

The QFN they assembled had a square ground plane of 7.75 mm<br />

(0.30 “) on a side. They performed reflow in air with Profile #1—a<br />

straight ramp profile (0.9 ˚C/second ± 0.1 ˚C/second) and a peak<br />

temperature of 241 ˚C ± 4 ˚C for most investigations. However, a<br />

second optimized profile (Profile #2) was also investigated to determine<br />

the effect of the reflow profile on voiding. A variety of solder<br />

pastes was used that had halogen-free and halogen-containing<br />

fluxes and different solder particles sizes (e.g., Type 3, Type 4, Type<br />

References<br />

1) N.C. Lee et al. http://www.indium.com/technical-documents/white<br />

paper/voiding-control-for-qfn-assembly<br />

2) Homer, S., Lasky. R, Minimizing Voiding In QFN Packages Using<br />

Solder Preforms, SMTAI 2011, Fort Worth, TX.<br />

3) http://www.circuitnet.com/news/uploads/2/SMT_Vac<br />

uum_void_reduction_Sept2012.pdf<br />

4) http://www.hellerindustries.com/Inline-Vacuum-Reflow-System.pdf<br />

5) The work is discussed in detail in our paper Minimizing Voiding In<br />

SMT Assembly Of BTCs, SMTAI 2016, Chicago, IL.<br />

<strong>EPP</strong> EUROPE November 2017 55


PCB + ASSEMBLY<br />

Void percent area as a function<br />

of solder pastes. Note<br />

the significant difference<br />

between pastes, some giving<br />

as low as 5 % voids and<br />

others 45 %.<br />

Source: Indium Corporation<br />

4.5, and Type 5).<br />

The results were encouraging. Profile #2 (termed the ‘Void reducing<br />

optimized profile’) significantly reduced voiding from 22 % to 8 %,<br />

as compared to Profile #1. In addition, the standard deviation of the<br />

data was much “tighter” for Profile #2. The 125 μm stencil reduced<br />

voiding about 4.5 % as compared to a 100 μm stencil. The difference<br />

likely being that the 125 μm stencil provided a slightly better standoff<br />

to vent the vapors. Regarding solder paste particle size, the<br />

company found that only Type 3 solder powder produced statistically<br />

significantly different results as compared to Types 4, 4.5, and<br />

5. The Type 3 solder paste produced about 15 % more voiding.<br />

A final experiment was performed in which the effect of different<br />

solder paste flux vehicles on voiding was evaluated. Three PCBs,<br />

with 12 QFNs each, were used for each solder paste, for a total of<br />

36 QFNs per paste. The results were striking. Some pastes produced<br />

only about 5 % voids, while others produced as much as<br />

45 %.<br />

These results were not only surprising, but also very encouraging.<br />

solder pastes have now been developed that essentially eliminate<br />

voiding.<br />

productronica, Booth A4.214<br />

www.indium.com<br />

This was created in a collaboration, with:<br />

Chris Nash, Product Manager PCB Assembly Materials,<br />

Indium Corporation<br />

Ron Lasky, PhD, PE, Senior Technologist, Professor of<br />

Engineering/Director of the Cook Engineering Design<br />

Center, Dartmouth College, and<br />

Andreas Karch, Regional Technical Manager – Germany,<br />

Austria and Switzerland, Indium Corporation<br />

Zusammenfassung<br />

Der Artikel zeigt neue Verfahren bei Low-Standoff-Bauteile während<br />

dem Reflowlöten zur Reduzierung von Voiding auf. Dazu wurden<br />

Untersuchungen zur Bestimmung der kritischen Variablen für<br />

die Minimierung von Voids durchgeführt. Die Ergebnisse waren<br />

nicht nur verblüffend sondern auch anspornend. Denn nun sind<br />

Lotpasten verfügbar, die Voiding deutlich minimieren.<br />

Résumé<br />

L’article présente de nouvelles procédures pour les éléments de<br />

bas niveau lors du soudage par refusion pour réduire des soufflures.<br />

À cette fin, des recherches ont été menées pour déterminer<br />

les variables critiques pour la minimisation de soufflures. Les résultats<br />

n’étaient pas seulement surprenants mais aussi inspirants.<br />

Pour le moment, les pâtes à souder aident à réduire considérablement<br />

des formations de soufflures.<br />

Резюме<br />

В статье рассматриваются новые методы, применяемые при<br />

пайке оплавлением компонентов с малым зазором между<br />

корпусом микросхемы и печатной платой (stand-off) с целью<br />

уменьшения образования пустот. Для этого были проведены<br />

исследования, целью которых было определение критических<br />

переменных процесса минимизации пустот. Результаты<br />

превзошли все ожидания и подстегнули интерес к<br />

дальнейшим исследованиям. Теперь доступны паяльные<br />

пасты, значительно снижающие образование пустот.<br />

56 <strong>EPP</strong> EUROPE November 2017


PCB + ASSEMBLY<br />

PRODUCT UPDATES<br />

Board handling and material management<br />

Seho North America, Inc. has recently<br />

focused on the Select-<br />

Line-C selective soldering system<br />

in an automated production<br />

line together with different modules<br />

from the company’s streamline<br />

product line.<br />

The company believes that their<br />

customers profit from complete<br />

solutions. With the aim of making<br />

production processes more<br />

efficient, the company completely<br />

automates production<br />

lines for board handling and material<br />

management, particularly<br />

in through-hole processes. Workplaces<br />

for assembly of electronic<br />

components, buffer and paternoster<br />

stations, turn stations,<br />

automatic lifts, and, of course,<br />

The company assists customers<br />

with creative ideas during planning<br />

and construction, and also<br />

manufactures, assembles and installs<br />

the production line. This<br />

not only improves the overall<br />

workflow but also reduces<br />

manufacturing costs.<br />

The streamline product line includes<br />

a batch loader system and<br />

a lift station, that are both linked<br />

with the lines’ soldering system.<br />

The line also features a modular<br />

design, which allows for the integration<br />

of additional processes,<br />

such as selective brushing or<br />

automated optical inspection.<br />

Particular highlights for the soldering<br />

area are the Synchro software<br />

feature that can double the<br />

The SelectLine-C includes a<br />

batch loader system and a lift station.<br />

Source: Seho North America<br />

CONTACT<br />

TECHNOLOGIES<br />

AT THE<br />

HIGHEST<br />

LEVEL<br />

the completely automated conveyor<br />

units in between are only a<br />

few examples. Moreover, the<br />

company implements manual,<br />

semi-automatic, and automatic<br />

workplaces for the final assembly<br />

of products and subsequent<br />

testing procedures, either<br />

in individual production islands,<br />

or in interconnection with the entire<br />

production process.<br />

production volume without major<br />

investments, and the automatic<br />

ultrasonic cleaning of solder<br />

nozzles, that guarantees maximum<br />

machine availability and a<br />

nozzle service life up to several<br />

months.<br />

productronica, Booth A4.578<br />

www.seho.de<br />

PRODUCTRONICA<br />

MUNICH<br />

14. - 17. November 2017<br />

Hall A1 | Booth 181<br />

Singapore Downtown,<br />

Viprobe® Card<br />

and Coaxial Probes.<br />

Best Contacts Worldwide.<br />

<strong>EPP</strong> EUROPE November 2017 57


PACKAGING<br />

PRODUCT UPDATES<br />

Needle valve with modular design<br />

Nordson EFD, a Nordson company, a manufacturer<br />

of precision fluid dispensing systems,<br />

introduces the xQR41 series microdot<br />

needle valve. The valve features a 60 %<br />

smaller form factor than standard valves, an<br />

exchangeable modular design for greater<br />

customization and process control, and a<br />

quick release (QR) clasp that allows easy removal<br />

of the fluid body to replace wetted<br />

parts in seconds. The new valve expands<br />

manufacturing opportunities for multiple applications<br />

and industries, especially those related<br />

to wireless devices, sensors, mobile<br />

phones, and other high-end electronics.<br />

The xQR41 valve’s small profile of<br />

66 mm x 23.7 mm (2.60 “ x 0.93 “) enables<br />

multiple valves to be mounted closer together<br />

for greater output per batch, increasing<br />

production throughput. Ideal for automated<br />

assembly processes, the needle valve<br />

can dispense in tighter spaces and at angles<br />

that are more complex. Weighing only 141.4 g<br />

(5.0 oz.), the valve reduces the tooling payload.<br />

This not only means faster actuator arm<br />

movement and improved positioning stability,<br />

but also reduced tabletop automation<br />

(TTA) motor and belt wear. The xQR41’s small<br />

form factor also results in a smaller wetted<br />

path, resulting in less retained fluid volume,<br />

which minimizes fluid waste. It can be fed<br />

from a variety of reservoirs, syringe barrels,<br />

external cartridges, or tanks.<br />

The valve‘s unique QR clasp secures the fluid<br />

body to the air actuator and can be removed<br />

with a turn of a thumbscrew – no tools<br />

required. No longer is it necessary to remove<br />

the entire actuator or valve assembly from<br />

mounting fixtures. Full change-outs take seconds,<br />

not minutes. This is especially important<br />

in applications with fluids that have a curing<br />

time where the wetted part must be removed<br />

as quickly as possible and returned to<br />

operation.<br />

The pneumatically operated, adjustable valve<br />

applies precise micro-deposits as small as<br />

150 μm (0.15 mm) (0.006 ”) of low- to highviscosity<br />

fluids onto a substrate. The xQR41’s<br />

exchangeable modular design can be configured<br />

with stroke adjustable or non-adjustable<br />

cap, BackPack valve actuator, low-profile<br />

mounting block, and 90 ° air and fluid inlet fittings.<br />

The fluid body can be aligned and locked<br />

at 360 ° intervals to accommodate mounting,<br />

positioning, and fluid inlet alignment<br />

needs. It can be installed on many automation<br />

platforms.<br />

productronica, Booth A2.245<br />

www.nordsonefd.com<br />

The xQR41 valve’s small profile enables multiple<br />

valves to be mounted closer together for<br />

greater output per batch.<br />

Source: Nordson EFD<br />

The xQR41’s small form factor results in a smaller<br />

wetted path, which minimizes fluid waste.<br />

Source: Nordson EFD<br />

The valve expands manufacturing opportunities,<br />

especially those related to wireless devices, sensors,<br />

and mobile phones.<br />

Source: Nordson EFD<br />

58 <strong>EPP</strong> EUROPE November 2017


Biocompatible adhesive designed for bonding temperaturesensitive<br />

substrates<br />

Panacol adds epoxy-based adhesive Structalit<br />

8801 to its portfolio of medical grade<br />

adhesives. The biocompatible adhesive<br />

was especially designed for bonding temperature-sensitive<br />

substrates, as it cures<br />

quickly at low temperatures.<br />

It is a single-component adhesive based<br />

on epoxy resin. Due to its viscosity characteristics,<br />

it is perfectly suited as a potting<br />

or filling material. The beige-colored adhesive<br />

possesses high chemical resistance<br />

against common cleaning agents used for<br />

medical devices, including isopropyl alcohol.<br />

It develops high bond strength with<br />

ceramics, metals and many plastics. For<br />

example, it is successfully being used as a<br />

potting compound for sensors in medtech<br />

devices.<br />

This adhesive cures very quickly at low<br />

oven temperatures. At 100° C, it will fully<br />

cure in only a few minutes. Being certified<br />

according to ISO 10993–5 standards, it is<br />

also for applications in medical devices.<br />

Source: Panacol-Elosol GmbH<br />

Potting for sensors.<br />

The adhesive is 100 % solvent free and<br />

compatible with common sterilization processes<br />

such as autoclaving, gamma irradiation,<br />

E-beam, and EtO.<br />

productronica, Booth A4.465<br />

www.panacol.com<br />

NEW & UNIQUE:<br />

Our Labtester LT101<br />

Unbeatable ratio of cost<br />

of ownership<br />

Smart program teaching with 7“<br />

touch screen<br />

State of the art data export<br />

(USB, Bluetooth, Ethernet, WLAN)<br />

Industrie 4.0 ready<br />

Pulltester LT101<br />

Optical silicone binder extends thermal and<br />

optical performance<br />

Dow Corning, a leader in silicones, siliconbased<br />

technology and innovation, introduced<br />

CL-1000 Optical Silicone Binder, a<br />

new, more thermally stable, high refractive<br />

index (RI) material available only in China<br />

that is formulated to expand design options<br />

for high-power chip-scale LED packaging<br />

(CSP). The latest addition to the company’s<br />

portfolio of advanced solutions for<br />

LED lighting, CL-1000 Binder offers thermal<br />

stability and is optimized for compression<br />

molding processes.<br />

Validated through the company’s stringent<br />

testing, the thermal stability of the materi-<br />

CL-1000 Binder offers best-in-class<br />

thermal stability and is optimized for<br />

compression molding processes.<br />

Source: Dow Corning<br />

al enabled it to exhibit lower degradation<br />

and improved maintenance of mechanical<br />

properties vs. other high-RI silicone encapsulants<br />

after 2,000 hours of exposure to<br />

temperatures above 180° C. The new high-<br />

RI material also delivers excellent photostability<br />

with high clarity to further support<br />

reliable performance over the life of LED<br />

devices.<br />

The solution demonstrates good conformance<br />

with highly reflective WR-3001 and<br />

WR-3100 Die Edge Coat materials, enabling<br />

CSP packaging with enhanced reliability<br />

over longer periods. The product’s<br />

high Shore D60 hardness also enables<br />

LED packaging to withstand dicing operations.<br />

It leverages the same phenyl silicone<br />

chemistry as the company’s other<br />

high RI optical encapsulants, which can<br />

help optimize the efficiency of next-generation<br />

LED lighting designs without costly<br />

investments in more powerful LED dies.<br />

productronica, Booth B3.305<br />

www.dowcorning.com<br />

For further information please visit us<br />

at the<br />

Visit us!<br />

Hall B2,<br />

Stand 427<br />

or contact us directly!<br />

November 14 – 17, 2017,<br />

Messe München<br />

F&S BONDTEC Semiconductor GmbH<br />

Industriezeile 49a<br />

A-5280 Braunau am Inn, Austria<br />

T: +43.7722.67052.8270<br />

F: +43.7722.67052.8272<br />

Mail: info@fsbondtec.at<br />

<strong>EPP</strong> EUROPE November 2017 59<br />

www.fsbondtec.at


TEST + QUALITY ASSURANCE<br />

Which selection criteria matters when production experts are benchmarking advanced 3D AOI?<br />

Combined 2D and 3D technologies<br />

offer the best inspection coverage<br />

After twenty years, inspection systems are now perceived as a key step in quality assurance, and defect minimization,<br />

and production optimization of electronic manufacturing. Most of the SMT lines are now equipped with SPI (Solder Paste<br />

Inspection) and AOI (Automated Optical Inspection) systems. But in the past two years, component inspection has<br />

started the most important transition since its introduction. Thanks to new capabilities and enhanced computers, AOI<br />

companies are now offering advanced 3D technology to be able to carefully inspect PCB post or pre-reflow even more<br />

carefully. What really matters when users benchmark modern 3D AOI systems will be further discussed below.<br />

Jean-Marc Peallat, VP Global Sales, Vi Technology<br />

A 3D image of an assembled<br />

PCB, showing the hidden<br />

parts of components.<br />

is called Moiré technology<br />

and the other uses a laser<br />

beam known as laser technology.<br />

Some vendors like to use<br />

just one top-down camera<br />

coupled with a few angled<br />

projectors, others rather use a<br />

top-down projector coupled<br />

with angled cameras.<br />

Source: Vi Technology<br />

For years, AOI has suffered from a need of high maintenance to<br />

keep false calls and false accepts under tight control and from a<br />

lack of coverage when some defects were not detectable by the<br />

equipment. With modern 3D technology, images contain additional<br />

information to build more efficient and reliable tests but also to add<br />

more inspection capabilities such as coplanarity, lifted leads, or<br />

solder joints. Facing a wide offer in a very dynamic market, with<br />

slightly different technologies and performances, electronics manufacturers,<br />

through their process engineers, need to focus on key<br />

characteristics to select the optimum equipment for their particular<br />

needs.<br />

Most of the 3D AOI systems are using a technology called triangulation<br />

sensing which measures the height of components, joints, or<br />

leads. Basically, the light source (projector) and the camera are<br />

placed apart at a defined angle. To make it simple, the displacement<br />

of the light gives the height of the object. For the light source, there<br />

are two types of technology applied. One uses structured light that<br />

Inspection coverage<br />

If all 3D inspection systems<br />

are offering the same verification<br />

coverage, the solution<br />

often reflects on the technology<br />

background of the vendor. The suppliers that have developed<br />

3D AOI upon their 3D SPI basis technology, will have the original full<br />

3D only approach completed with some 2D ad-ons. On the other<br />

hand, companies that have long-term experiences with 2D AOI,<br />

have used their strong 2D base to build more powerful 3D technology.<br />

Today, combining both technologies 2D and 3D, and not only<br />

using one of the two, is the only method to offer the best inspection<br />

coverage.<br />

For the first time in the 20 years since the start of automated inspection<br />

technology, modern AOI can now provide a very comprehensive<br />

test coverage while drastically reducing false calls and eliminating<br />

all false accepts. The matrix shows that when combining the<br />

better of the two AOI technologies, it will provide the best results<br />

and inspection coverage. Even though 3D technologies enhance the<br />

examination coverage, some drawbacks may impact their ability to<br />

perform on any application.<br />

Shadow effects<br />

With components heights ranging from 1 mm to 25 mm, angles between<br />

cameras and projectors are creating shadows at the feet of<br />

the tallest components that can hide smaller components from 3D<br />

60 <strong>EPP</strong> EUROPE November 2017


Source: Vi Technology<br />

Here, a top-down camera is coupled with a few angled high-res cameras.<br />

Combining both 2D and 3D inspection technologies, and not only using<br />

one of the two, is the only method to offer the best test coverage.<br />

Source: Vi Technology<br />

reconstruction. The magnitude is directly dependent on the angle<br />

between sensors (cameras, projectors) as shown in the scheme of<br />

the principle.<br />

The more open the angle (α) is, the wider the shadow area is. Depending<br />

on the technology integrated into the system, the area can<br />

be double its size, shadowing an area of up to 14 mm around tall<br />

components. It can totally or partially impact the inspection coverage<br />

of the surrounded components. All these shadowed components<br />

won‘t be covered by any of the 3D tools and the verification<br />

of the assembled PCB won‘t be the best. Only 2D tools will be applied<br />

under these circumstances, however, if one component is<br />

slightly tilted or if some leads are lifted, these will not be detected.<br />

For applications in critical high-volume manufacturing environments,<br />

such as in the automotive, mobile devices, or other various industries,<br />

mixing tall, small, and leaded components, these criteria must<br />

be checked to ensure the best 3D coverage.<br />

PCB/component referencing<br />

When a system makes measurements, particular attention should<br />

be placed on the referencing system. 3D AOI systems, like 3D SPI,<br />

offer a range of different technologies to ensure the precise zero reference.<br />

Would it be more accurate to have references close to the<br />

components or global references placed on the PCB? There is no<br />

straight answer, as every location is unique and in some cases, local<br />

references work better than global ones and vice-versa. The viable<br />

solution is to combine both methods, define references across the<br />

PCB and use only the best for each location or reference designator.<br />

This strategy attributes automatically hundreds of references on the<br />

PCB itself surrounding all the components.<br />

Depth of Z-measurement<br />

When executing 3D imaging, one of the crucial parameters is the<br />

range of heights measured by the system. Contrary to SPI, where<br />

measured heights never exceed 1 mm, AOI at board level is facing a<br />

challenge with very small volumes of solder joints, and tall components,<br />

or relatively large connectors. Most of the 3D systems<br />

Source: Vi Technology<br />

AOI image of gull-wing leads, showing the solder bridge<br />

between two solder joints in the magnified snippet.<br />

struggle when it comes to having a wide range of measurements,<br />

and whether there is enough resolution, or not, to measure joints.<br />

That‘s the reason why some AOI systems are using a threshold,<br />

from about 3 mm to 5 mm, above which 3D measurement is deactivated<br />

and component heights exceeding this threshold are covered<br />

only by 2D technology. This issue is overcome by vendors using<br />

laser lighting technologies. They offer a complete range of measurements<br />

from 0 to 25 mm, while other suppliers, using Moiré lighting<br />

technology, may offer solutions using a complex, difficult to maintain,<br />

and expensive optical head.<br />

Measurement accuracy<br />

With upcoming Industry 4.0 strategies getting into most of the<br />

manufacturing floors, the need of line connectivity and feedback<br />

loops to achieve zero defect manufacture is driving AOI and SPI system<br />

suppliers to develop repeatable and highly accurate solutions.<br />

This is becoming critical with the miniaturization of components<br />

that are becoming smaller and smaller. Within Industry 4.0 concepts,<br />

a feedback loop to the P&P equipment in the line is a key<br />

contribution of AOI systems with exact X, Y and theta measurements.<br />

For years now, 2D technology has had a proven record of ac-<br />

<strong>EPP</strong> EUROPE November 2017 61


TEST + QUALITY ASSURANCE<br />

Angle (°)<br />

15<br />

20<br />

25<br />

30<br />

Shadow for 25 mm component<br />

(mm)<br />

6,70<br />

9,10<br />

11,65<br />

14,44<br />

Factor<br />

1<br />

X 1,36<br />

X 1,74<br />

X 2,2<br />

Source: Vi Technology<br />

The more open the angle (α) is, the<br />

wider the shadow area is. Depending<br />

on the technology, shadowing area<br />

can be up to 14 mm around tall<br />

components.<br />

3D image of tall components (about 20mm). Pins and small components<br />

show no shadow effects around the tallest parts, and all components<br />

can benefit from 3D tools.<br />

curacy and repeatability of component location. However, 3D technology<br />

has not yet reached the level of accuracy and repeatability of<br />

the old systems. AOI systems using only 3D technology to locate<br />

and measure components may suffer from a lack of this.<br />

With GR&R ranging from 10 % to 30 %, most of the systems are<br />

not capable of feedback measurements to correct the alignment of<br />

the placement machine. Some AOI systems are using 2D technology<br />

to accurately locate component placement positions, while 3D<br />

is dedicated to other potential defect issues, such as coplanarity or<br />

solder joints. These systems have maintained the same levels of accuracy<br />

and repeatability featuring GR&R within 10 %. Therefore,<br />

while looking for integrated solutions compatible with Industry 4.0<br />

strategies, process engineers have to integrate GR&R tests in their<br />

benchmark to ensure this capability.<br />

Conclusion<br />

If almost all 3D AOI systems offer the same inspection coverage,<br />

the main differentiator is the ability to maintain this coverage in all<br />

types of possible applications and configurations. With discrepancies,<br />

in terms of shadows, Z-range, and accuracy, some of them<br />

may not be suitable for a company‘s SMT line. Therefore, considering<br />

the investment consent by teams to select equipment, it becomes<br />

important to integrate these key parameters in the benchmark<br />

process.<br />

productronica, Booth A2.421<br />

www.vitechnology.com<br />

Source: Vi Technology<br />

Zusammenfassung<br />

Automatische Inspektionstechniken (AOI) sind seit mehr als 20<br />

Jahren in der Elektronikfertigung eingeführt, erst zögerlich und nun<br />

praktisch flächendeckend. Ein wertvolles Werkzeug für die Qualitätssicherung,<br />

Produktionsoptimierung sowie Defektminimierung.<br />

Neben der Pasteninspektion (SPI) kommt der Überprüfung der bestückten<br />

Baugruppe mittels 2D/3D-AOI sehr hohe Bedeutung zu.<br />

Oft, aber nicht immer, sind die Ergebnisse der dazu verwendeten<br />

Inspektionssysteme ähnlich. Allerdings gibt es Vor- und Nachteile<br />

abhängig von der Aufgabe. Deswegen müssen Anwender sorgfältig<br />

evaluieren, welche Lösung für sie die am besten geeignete ist.<br />

Résumé<br />

Les techniques d’inspection automatique ont été introduite il y a<br />

maintenant plus de 20 ans dans la fabrication électronique, initialement<br />

d’une manière hésitante, mais à présent en couvrant toute<br />

les domaines. Un outil important pour l‘assurance de la qualité,<br />

l‘optimisation de la production, et la minimisation des défauts. En<br />

plus de l‘inspection de la pâte à braser (SPI), la vérification de l‘assemblage<br />

monté en utilisant AOI 2D / 3D est d‘une grande importance.<br />

Souvent, mais pas toujours, les résultats des systèmes<br />

d‘inspection utilisés à cette fin sont similaires. Cependant, il y a des<br />

avantages et des inconvénients en fonction du travail à effectuer.<br />

Par conséquent, les utilisateurs doivent soigneusement évaluer<br />

quelle est la solution la plus appropriée pour eux.<br />

Резюме<br />

Системы оптического контроля качества печатных плат (AOI)<br />

начали применяться на производстве электроники более 20<br />

лет назад. Поначалу с некоторой долей осторожности, а затем<br />

практически повсеместно. Действительно ценный инструмент<br />

для обеспечения качества, оптимизации продукции и<br />

снижения количества брака. Наряду с контролем нанесения<br />

паяльной пасты (SPI) проверке комплектных узлов с<br />

применением двух- или трехмерных систем оптического<br />

контроля придается все большее значение. Однако не всегда<br />

результаты применяемых систем контроля одинаковы. В<br />

зависимости от задачи каждая система имеет свои<br />

преимущества и недостатки. Поэтому пользователи должны<br />

тщательно взвесить все факторы, чтобы понять, какое<br />

решение будет для них наиболее оптимальным.<br />

62 <strong>EPP</strong> EUROPE November 2017


PRODUCT UPDATES<br />

TEST + QUALITY ASSURANCE<br />

Line up of test & inspection systems for productronica<br />

The Quadra 7 displays 6.7 MP ultra-high<br />

quality images over two 4K UHD monitors.<br />

Nordson Dage, Matrix, and Yestech,<br />

divisions of Nordson Corporation,<br />

will exhibit at productronica<br />

2017. The Test & Inspection<br />

team will showcase a suite<br />

of systems including the Quadra<br />

5 and 7 X-ray inspection systems,<br />

the inline X-ray inspection<br />

platform XS-series complemented<br />

by the X#-series and<br />

XCT-1000, as well as, the FX-940<br />

ULTRA 3D AOI system. On the<br />

bondtester side, the company<br />

will demo the 4800 configured<br />

for ball shear on a 300 mm wafer<br />

and a 4000Plus bondtester configured<br />

for battery testing.<br />

Nordson Dage’s Quadra 7 represents<br />

the cutting edge of X-ray<br />

inspection performance. 6.7 MP<br />

ultra-high quality images are displayed<br />

at full one-to-one resolution<br />

over two 4K UHD monitors<br />

ensuring the clearest features.<br />

The Quadra 5 offers high performance<br />

and ease of use for 2D<br />

and 3D X-ray applications.<br />

0.35 μm feature recognition up to<br />

10 W of power, makes it a leading<br />

choice for printed circuit<br />

board and semiconductor package<br />

inspection.<br />

The 4800 Advanced Automated<br />

Wafer Testing bondtester is at<br />

the forefront of wafer testing<br />

technology catering for the testing<br />

of wafers from 200 mm up to<br />

450 mm. Advanced technology<br />

guarantees unsurpassed accuracy<br />

and repeatability to provide<br />

total confidence in product<br />

quality. A range of powerful<br />

camera and optical systems optimize<br />

load tool alignment, auto<br />

programming, and post-test<br />

analysis make this system the<br />

pinnacle of automated wafer<br />

testing. The 4000Plus bondtester<br />

with Camera Assist Automation<br />

is ideally suited<br />

for pull-and-shear<br />

testing of wafer<br />

interconnections,<br />

lead frames, hybrid<br />

microcircuits,<br />

or automotive<br />

electronic packages.<br />

Nordson Matrix<br />

will present the<br />

XS-series, a highspeed<br />

in-line<br />

automated X-ray<br />

inspection plat-<br />

Source: Nordson Dage<br />

form designed to<br />

achieve a smaller<br />

footprint<br />

(1300 mm width) for small and<br />

medium board sizes<br />

(350 x 250 mm) targeting automotive<br />

and semi-backend applications.<br />

It allows high-speed<br />

2D/2.5D/3D X-ray inspection of<br />

PCB-assemblies, samples in<br />

trays, as well as, hybrid applications.<br />

Newly designed sample<br />

table and linear driven detector<br />

motion system allow outstanding<br />

2.5D & 3D imaging speed.<br />

The X#-series is the most flexible<br />

AXI platform series in the company’s<br />

product portfolio. The system<br />

is available with two different<br />

handling modes (left in –<br />

right out/left in – left out) and is<br />

equipped with a verification terminal<br />

at its output. The embedded<br />

Barcode scanning gantry<br />

(BCR) enables automated scanning<br />

of product bar codes, provides<br />

the ability to add product<br />

changeover flexibility, and increases<br />

system throughput.<br />

With the showcased X2.5# high<br />

power setup, the company presents<br />

a sustainable solution for<br />

the inspection of power hybrid<br />

applications (e.g. IGBT), which<br />

has become a demanding<br />

requirement in the automotive<br />

industry.<br />

The XCT-1000, representing the<br />

company’s XCT-series, complements<br />

the existing AXI portfolio<br />

with CT-technology. This platform<br />

is especially suitable for the inspection<br />

of small to medium production<br />

volumes, sample tests,<br />

or for the use in laboratory environment.<br />

The XCT-1000 HR will<br />

be introduced at the show, that<br />

has a dedicated setup for superhigh<br />

resolution applications<br />

(μ-solder-joints on PCB or flex,<br />

wire-bond inspection, waferbumps).<br />

Implementing the latest<br />

model of the Dage tube as X-ray<br />

source and digital flat panel technology<br />

accomplish CT-Voxel-resolutions<br />

less than 1 μm.<br />

The Nordson Yestech FX-940<br />

Ultra 3D AOI with 3D technology<br />

PRINTING<br />

DISPENSING<br />

ONE<br />

O NE<br />

O N E<br />

GRAPHIC<br />

is ideal for the inspection of<br />

solder defects, lead defects/lifted<br />

leads, component presence and<br />

co-planarity of chips, BGAs, and<br />

other height sensitive devices.<br />

With its Advanced Fusion Lighting<br />

and comprehensive inspection<br />

tools including angled cameras,<br />

full-color digital image processing,<br />

and both image and<br />

rule-based algorithms, it offers<br />

complete inspection coverage<br />

with 2D and 3D defect detection.<br />

The company’s M1m AOI system<br />

offers high-speed microelectronic<br />

device inspection with exceptional<br />

defect coverage. With<br />

resolutions down to submicron<br />

levels and telecentric optics, it<br />

provides complete inspection, all<br />

within a footprint less than 1 m 2 .<br />

productronica, Booth A2.445<br />

www.nordson.com<br />

MOUNTING<br />

HYBRID PLACEMENT<br />

14.–17.11.2017, München<br />

S E R VI C E<br />

SOFTWA RE<br />

USER<br />

PLATF OR M<br />

INTERFACE<br />

www.yamaha-motor-im.de<br />

P R O V ID E R<br />

INSPECTION<br />

FINAL ASSEMBLY<br />

BESUCHEN<br />

SIE UNS!<br />

HALLE A3<br />

STAND 323<br />

<strong>EPP</strong> EUROPE November 2017 63


TEST + QUALITY ASSURANCE<br />

3D planar computed X-ray tomography enables full inspection<br />

The magic of image<br />

reconstruction on-the-fly<br />

Recent progress in all areas of microelectronics, such as mobile devices or automotive gear, is driving manufacturing<br />

industry needs at a fast pace to correspond with the increased global competition. As a result, a global production<br />

system is being developed by Saki, which addresses the increased diverse specifications in electrical products. In an<br />

advanced manufacturing environment, AXI inspection is going to play an even bigger role for the detection of hidden<br />

failures that is currently not visible with the “classical” automated optical inspection.<br />

Yasuo Watabe, Sales Promotion Group Leader, Saki Corporation<br />

Principle of planar<br />

computed tomography.<br />

The more slices you take, the better the image. The right side is captured<br />

using multiple slices with PCT.<br />

To achieve the production objectives of high quality, high reliability,<br />

shorter lead-times and lower cost, the following is required:<br />

• A smart factory that enables mass customization<br />

• Maximizing production efficiency within the smart factory<br />

• Optimizing the global supply chain<br />

To run a smart factory, it is necessary to open innovation with diverse<br />

machine vendors. For example, an automated SMT line that<br />

consists of equipment, from several different vendors, that interact<br />

with each other by using M2M (machine-to-machine) communication.<br />

In such an environment, AOI equipment is an integral part of<br />

the process to be able to:<br />

• Optimize production equipment with feed-back or feed-forward<br />

functions to other equipment<br />

• Deliver high inspection accuracy, especially for solder joints, to ensure<br />

high-quality products<br />

This is particularly necessary because, electronics are getting<br />

smaller, thinner, and ever more sophisticated, driving electrical components<br />

and semiconductor packages to be smaller, thinner, and<br />

denser. With changes in device parameters, 0201 ceramic capacitors,<br />

flip chip ball grid arrays (FCBGAs), package-on-package (PoP),<br />

and wafer level packages (WLP) are prevalent on printed circuit<br />

boards (PCBs), requiring a more accurate production technology,<br />

Source: Saki Corporation<br />

and inspection capabilities. For several years now, AOI has practically<br />

become a standard requirement in SMT high-volume lines, but<br />

this alone is no longer sufficient to ensure production quality and reliability.<br />

Therefore, AXI is needed to be able to see within the solder<br />

joints or under bottom terminated components (BTCs), such as the<br />

widely utilized QFN packages.<br />

True 3D automated X-ray inspection<br />

3D computed tomography (CT) X-ray inspection, in particular, has<br />

been successful in detecting defects that cause the most concern<br />

in the industry, such as voids under QFNs and head-in-pillow (HiP)<br />

defects in solder balls. However, global competition has pushed the<br />

demands for high-quality products even further, driving the need for<br />

full 3D CT X-ray in-line inspection. This uses X-rays to examine the<br />

features of assembled printed circuit boards, semiconductor packages,<br />

or power modules that are hidden from visual view and therefore<br />

cannot be captured by automated optical inspection, which<br />

uses visible light as its source.<br />

Most X-ray systems use deconstruction, where they capture an<br />

image and have to then remove the images from the underside of<br />

the board. A true 3D X-ray system operates using reconstruction,<br />

where a high resolution planar computed tomography (PCT) technology<br />

is used. PCT is an extension of CT scanners used in the<br />

medical field. This automated AXI process completely separates the<br />

top and bottom-side images of the board so images are not affected<br />

by back-side mounting. It utilizes a high-resolution image composed<br />

of 200 imaging slices acquired from everything: through the board,<br />

solder joints, and components. Most other AXI technologies use<br />

less than 10 slices for imaging.<br />

Source: Saki Corporation<br />

64 <strong>EPP</strong> EUROPE November 2017


A true 3D system uses these slices to accurately reconstruct the<br />

shape of solder balls and fillets/meniscus to perform reliable solder<br />

inspection. It doesn’t just inspect, it combines the layers, measures<br />

components and features, determines placement variance and<br />

board or substrate warpage, and analyzes their internal structures<br />

for a true volumetric representation of continuous 3D images without<br />

joints. Reconstruction of images is done on-the-fly, for every<br />

solder joint, creating 3D data for the entire sample. Defects are<br />

identified and classified, including 100 % of HiP defects, voids, and<br />

dry joints, resulting in excellent Cpk and gage repeatability and reproducibility,<br />

which is particularly critical in aerospace, medical,<br />

automotive.<br />

Role of AXI<br />

AXI systems have to meet the needs of three basic market requirements:<br />

1. Usually as part of the PCB assembly process after reflow for:<br />

• Solder ball joint inspection of BGAs<br />

• Solder joint inspection on the bottom side of QFNs (voiding)<br />

• Solder joint inspection for all parts; such as chips, connectors, and<br />

insert parts on the PCB<br />

2. Semiconductor for:<br />

• High resolution inspection (down to 15 μm)<br />

• Void inspection of laser through-holes (LTH)<br />

• Flip chip bonding inspection<br />

• Package-on-package soldering inspection<br />

3. Power modules for:<br />

• High power X-ray tubes (225 kV)<br />

• Void inspection inside the solder joints of insulated gate bipolar<br />

transistor (IGBT) modules<br />

Automated 3D X-ray inspection limitations<br />

Many X-ray inspection technologies, such as laminography, tomosynthesis,<br />

and oblique CT, are limited for in-line use because the<br />

time of inspection is too long, and there is a trade-off between inspection<br />

time and accuracy. In CT, the reconstruction of the objects<br />

slows down the process. PCT captures high-quality CT images of<br />

planar objects using fewer projections, and takes CT technology<br />

further, but the more slices the system takes, the more time it<br />

takes for the inspection process.<br />

Unique hardware enables high-accuracy inspection<br />

To overcome this trade-off, the company developed an AXI system<br />

which utilizes proprietary hardware and software, and PCT technology<br />

to achieve both high speed and accuracy inspection. To maintain<br />

results that are stable throughout the duration of high-speed, highvolume,<br />

in-line manufacturing production, it is essential to have a<br />

stable and accurate positioning control, as well as, a rigid hardware<br />

Source: Saki Corporation<br />

Automated advanced X-ray inspection system with PCT technology.<br />

construction. To achieve this, the sample and detector stages are<br />

mounted on a granite base, so the process is not affected by thermal<br />

expansion, vibrations, or aging that can occur from long, continuous<br />

machine operation. The granite foundation is necessary for<br />

the machine to uphold a high level of straightness, flatness, and parallelism.<br />

Each axis is directly driven by a linear motor to get high-definition<br />

performance, positioning control, and good repeatability at high<br />

speed. The Z-axis of the X-ray tube has a linear scale that can maintain<br />

good repeatability even if the resolution is changed in every<br />

field of view (FOV). Cycle time is reduced to maintain the speed,<br />

and a specially developed conveyor system enables a 45 % shorter<br />

processing time.<br />

Software for high-speed 3D inspection<br />

In some inspection operations, identifying every defect possible is<br />

not essential for proper functioning of the end-product. Fewer slices<br />

are needed, so the inspection process can be faster. However, for<br />

applications where failure is not an option, speeding the process by<br />

reducing the number of slices and images is not an option.<br />

A proprietary software was developed with a unique processing<br />

technology that fully utilizes its GPU and CPU capabilities. It works<br />

in conjunction with PCT, taking images, and reconstructing of up to<br />

200 slices through the solder joints, enabling high-speed, 3D inspection.<br />

For example, an accurate image of a fillet (meniscus) shape can be<br />

reconstructed to enable inspection of the fillet of the gull wing<br />

leads. According to the IPC standard (Class 3), the de-facto standard<br />

of the electronics industry, the criteria to define the joint as ‘Pass’ or<br />

‘Fail’ is the height of solder wetting of the gull wing back fillet. By<br />

using the information for the back-fillet position, the height, and<br />

angle that is received from the reconstructed image, poor wetting<br />

solders can be classified easily by the 3D AXI system, which would<br />

be difficult to detect by optical inspection. The company therefore<br />

3D image of solder fillet with graphs showing good meniscus shape (pass, left side) and poor solder wetting (fail, right side).<br />

Source: Saki Corporation<br />

<strong>EPP</strong> EUROPE November 2017 65


TEST + QUALITY ASSURANCE<br />

Source: Saki Corporation<br />

believes that the need for back-fillet inspection will increase. In addition,<br />

because 3D automated X-ray takes hundreds of slices throughout<br />

the solder joint which are then inspected with high definition<br />

3D, it can detect small voids that can occur anywhere, especially<br />

those hidden under QFN packages, later creating bigger issues in<br />

the reflow process. HiP defects that occur in solder balls are the<br />

most difficult to identify because of their varied defect shapes. With<br />

the combination of hardware, software, and special algorithms, almost<br />

all HiP defects, as well as, voiding, can be located.<br />

Other defects defined in the IPC standard are the ratio of the<br />

amount of solder filling the through-holes (barrels), micro-bumps in<br />

flip chips, solder joints of PoPs, and power modules, such as insu-<br />

Different soldering-related defects detected using AXI with PCT.<br />

lated gate bipolar transistors, that require solder inspection. They<br />

are also difficult to inspect, but the need in the industry to detect<br />

these defects is getting greater.<br />

Future prospects for AXI<br />

In 2020, 5G, the 5th generation mobile communication system, is<br />

planned to be released, accelerating the IoT with 5G high capacity<br />

and ultra-high-speed 5G network functionality. Devices, reportedly,<br />

will be connected to each other in real time, and products, such as<br />

self-driving cars, which are already being tested, will probably see<br />

more widespread use.<br />

At the manufacturing site, to maintain quality, reliability, and highvolume<br />

production, the Smart Factory/Industry 4.0 initiative is going<br />

to prevail. Automated inspection equipment will use innovative<br />

technology to collect sensor information from other equipment<br />

along the assembly line, then analyze this information and give realtime<br />

feedback. Not only will this optimize production for one factory,<br />

but also for several corporations that have their manufacturing<br />

plants connected globally. With an improved communication infrastructure<br />

and growth in IoT applications, devices will be even<br />

smaller and reach high functionality quicker. Inspection needs will<br />

become more advanced and varied. The role of 3D X-ray inspection<br />

is expected to grow and become more vital.<br />

In a Smart Factory environment, AXI system capabilities are used to<br />

enhance communication and linkage with peripheral equipment<br />

and/or the host system. They become part of a total inspection solution<br />

that uses a complete lineup of 3D automated solder, 3D AOI,<br />

and 3D AXI systems that must correspond to production needs. Inspection<br />

and test equipment have to continue to evolve in order to<br />

accommodate demanding manufacturing and assembly challenges.<br />

productronica, Booth A2.259<br />

www.sakiglobal.com<br />

Zusammenfassung<br />

In der Fertigung der Mikrolektronik steigen die Anforderungen an<br />

die Präzision und Zuverlässigkeit stetig. Neben klassischen elektrischen<br />

Testprozessen haben sich AOI sowie AXI als wichtige Ergänzungen<br />

durchgesetzt. Die meisten AXI-Systeme arbeiten auf<br />

Basis von Bild-Dekonstruktion, wobei sie anschließend von den<br />

Aufnahmen erst die Board-Unterseite für eine deutlichere Sichtbarkeit<br />

entfernen. Echte 3D-AXI-Systeme auf Basis der planaren<br />

Computertomographie (PCT) hingegen rekonstruieren aus vielen<br />

Bildschnitten eine genaue und hochaufgelöste Abbildung. Saki hat<br />

diese Technik in ein global funktionierendes Fertigungssystem implementiert,<br />

um hohe Qualität- und Zuverlässigkeitsanforderungen<br />

zu erfüllen – und offeriert damit ein effizientes Werkzeug für die<br />

Realisierung von Smart-Factory und Industrie 4.0-Konzepten.<br />

Résumé<br />

Dans la production de la microélectronique, les exigences de précision<br />

et de fiabilité augmentent continuellement. En plus des procédures<br />

d‘essai électriques classiques, AOI, ainsi qu‘AXI sont devenus<br />

des acquisitions importantes. La plupart des systèmes d’AXI<br />

fonctionnent sur la base de la déconstruction de l‘image, où les<br />

images de la partie inférieure de la carte de circuit imprimé sont<br />

retirées pour une visibilité plus claire. Les vrais systèmes 3D AXI<br />

basés sur la tomodensitométrie (TDM), cependant, reconstruisent<br />

une image à haute résolution et précise à partir de nombreuses<br />

tranches d‘imagerie. Saki a mis en œuvre cette technologie dans<br />

un système de fabrication mondiale pour répondre aux exigences<br />

de haute qualité et de fiabilité, en fournissant un outil efficace pour<br />

établir des concepts de Smart Factory et Industrie 4.0.<br />

Резюме<br />

В сфере производства электроники постоянно повышаются<br />

требования к точности и надежности. Наряду с классическими<br />

процессами тестирования продукции широкое<br />

распространение получили системы оптического (AOI) и<br />

рентгенографического (AXI) контроля качества печатных плат.<br />

В основе большинства систем рентгенографического контроля<br />

лежит принцип деконструкции изображения, при котором со<br />

снимка удаляется сначала нижняя сторона платы для<br />

обеспечения лучшего обзора. В то же время в настоящих<br />

трехмерных системах рентгенографического контроля (3D AXI)<br />

применяется метод планарной компьютерной томографии<br />

(PCT), при котором на основании множества слоев<br />

реконструируется точное изображение в высоком<br />

разрешении. Компания Saki внедрила подобную технологию в<br />

производственные системы, эксплуатируемые по всему миру,<br />

с целью обеспечения высокого качества и надежности<br />

продукции – тем самым компания предлагает эффективный<br />

инструмент для реализации «умного» производства в рамках<br />

концепции Индустрии 4.0.<br />

66 <strong>EPP</strong> EUROPE November 2017


<strong>EPP</strong> EUROPE November 2017 67


TEST + QUALITY ASSURANCE<br />

Optical control with high resolution measurement<br />

Flexible EMS partner<br />

focuses on quality<br />

SMTEC AG has been around for 18 years as an innovator and a flexible service provider in the electronic industry,<br />

which reliably thinks ahead and is geared towards customer requirements. Based in Kleinandelfingen, Switzerland,<br />

the service provider is centrally located in between Winterthur and Schaffhausen, directly on the A 4. With<br />

high quality standard that is reflected in the ISO9001: 2015 certification, the company manifests itself in innovative<br />

equipment, especially with the recently acquired 3D AOI from Mirtec.<br />

The modern electronic producer currently has 24 employees<br />

with customers mainly in Switzerland, which<br />

then usually export to Germany or the United States. From<br />

start to finish, SMTEC proves to be an absolutely competent<br />

partner, who is able to carry out the work reliably according<br />

to customer specifications – from component procurement<br />

to the required test depth and assembly. They<br />

have a loyal customer base of approximately 60 customers,<br />

a large component warehouse, conformal coating<br />

equipment, rework stations, as well as, an integrated traceability<br />

system, from receiving to final inspection.<br />

Source: SMTEC AG<br />

The 3D AOI MV-6e Omni has an 8-phase color lighting system<br />

for perfect illumination and reliable detection of faults on the<br />

circuit boards.<br />

With modern technology to the<br />

high-end product<br />

Powerful and modern machinery ensures that all wishes<br />

of customers are produced efficiently with the highest<br />

quality. The following services, individually or combined,<br />

are available:<br />

• Procurement of materials<br />

• Assembly of circuit boards in SMD and THT technology<br />

• Automatic inspection using 2D / 3D AOI<br />

• Flying Probe<br />

• Function test based on requirements of the customer<br />

• Traceability depending on component level<br />

• Assembly work right up to sales packaging<br />

• Rework of BGA, CSP, SO-IC, and QFP<br />

As a flexible EMS partner, the company provides its customers<br />

with competitive advantages in the market. Previously<br />

manufactured with stand-alone solutions, the company has<br />

recently converted to line manufacturing with a high degree of automation.<br />

The head of Technology / Quality Management and a<br />

member of the board, Adrian Scherer, said, “Our incentive laid in<br />

simple throughput, and we also had a large amount of manual work.<br />

We wanted to make our production go towards the Lean principle,<br />

which meant more automation. Now we have a complete line with<br />

68 <strong>EPP</strong> EUROPE November 2017


It also ensures a shadow-free 3D representation through eight 3D projections,<br />

whereby the inspection of different levels of components is made possible.<br />

Source: SMTEC AG<br />

Source: SMTEC AG<br />

two connected i-Pulse placement machines for our high volume<br />

series, as well as, two incomplete lines that handle our smaller lot<br />

sizes. This way, not only do we have the same output with less<br />

manpower, but the quality has also been improved by reducing<br />

manual work.”<br />

The complete SMD process is located on the first floor of the twostory<br />

building. In contrast, next to the THT and manual workstations,<br />

the inspection of all equipment and systems is located on<br />

the second floor. Being equipped with modern high-flex placement<br />

systems guarantees shorter delivery times. The spectrum of components<br />

are covered to the full extent. The screen printing is fully<br />

automated by an optically oriented stencil printer. A gentle soldering<br />

is available by using the vapor phase system within the soldering<br />

process, which is next to the reflow oven.<br />

Nevertheless, automation is not always reasonable or even feasible.<br />

For instance, when a service provider receives bulk material, mechanical<br />

parts, they have to be placed by hand and soldered on the<br />

PCB. This assembly is used in devices for development in the automotive<br />

industry and requires a high degree of accuracy and functionality.<br />

For this purpose, the company stands for the best quality,<br />

because all products are 100 % visually inspected before leaving the<br />

house. The final touch is the 3D AOI from Mirtec, which was acquired<br />

in the summer of 2016.<br />

Quality ensures competitiveness<br />

Next to the THT, in the top floor of the building, is the complete testing<br />

area. In addition to the MV-3L Desktop AOI system and Mirtec’s<br />

3D MV-6E Omni system, there is also a Pilot 4D line Flying Probe<br />

from Seica that is only used when customers expressively wish to<br />

do so. Furthermore, various function tests with needle adapters are<br />

also available for the customer, where a customer provides the<br />

tester so this process can be carried out. The company is open to all<br />

suggestions and provides appropriately trained staff. Despite the<br />

well-equipped test area, the company decided to invest in an inlinecapable<br />

3D AOI, where a comprehensive product specification<br />

sheet was prepared in advance. After all, it should be ensured that<br />

the investment meets 100 % of the requirements. Reto May, Sales<br />

Manager and a member of the board, reported, “At the SMT 2016 in<br />

Nuremberg, we looked at different vendors to get an overview of<br />

who could offer exactly what we were looking for. After only two remaining<br />

suppliers, we approached them with problematic and complicated<br />

assembly in the production. We wanted to make sure that<br />

our requirements were met, including all theoretical possibilities of<br />

the task, as well as, a flawless working process. In the end, we decided<br />

to go with Mirtec system, which is distributed by pb tec solution<br />

GmbH in Germany. The decision was reached mostly due to<br />

the side cameras of the system, which was very important for us. In<br />

addition, we were familiar with pb tec since we bought the desktop<br />

system about 10 years ago. We knew what we were getting into,<br />

because we already had good experiences and advise at the time.”<br />

The 3D AOI was delivered in June 2016, then installed and was already<br />

operational by July. Adrian Scherer added, “We were told<br />

exactly what we needed, which specific connections had to be<br />

available, etc. to have an easy installation process. We upgraded our<br />

server so that we were already prepared, when the large amount of<br />

data, that was generated by the system during the test, could be<br />

easily processed. The delivery was made on time, and despite our<br />

high requirements, we received a high quality training, instruction,<br />

and support on behalf of pb tec. We programed and tested our complex<br />

assemblies together in the training, so that the easy assemblies<br />

could be made even simpler.”<br />

Also, from the pb tec side, only positive things were said, in regards<br />

to the successful collaboration, on both a personal and professional<br />

level.<br />

Inspection relevant with process<br />

The 3D AOI MV-6e Omni is equipped with the latest features. It has<br />

an 8-phase color lighting system (RGB and yellow, with 4x white) for<br />

perfect illumination and reliable detection of faults on the circuit<br />

boards, as in cracks or breaks in components. The high-resolution 15<br />

megapixel top camera in combination with the four 10 megapixel<br />

side cameras ensure a clear detection of side defects, an inspection<br />

of J-Leaded components, and the identification of characters on<br />

<strong>EPP</strong> EUROPE November 2017 69


TEST + QUALITY ASSURANCE<br />

Source: Doris Jetter<br />

A manual workstation within the THT process.<br />

wired components. A telecentric lens ensures distortion-free magnification<br />

of the image. The Quad-Multifrequency 3D Moiré technology<br />

measures the component in all four directions, to obtain a 3D<br />

image for fast, accurate error detection. It also ensures a shadowfree<br />

3D representation through eight 3D projections, whereby the<br />

inspection of different levels of components is made possible<br />

through a combination of high and low frequency Moiré grids. The<br />

data-transfer technology CoaXPress achieves a 4 times larger data<br />

transfer rate and the inspection speed is approximately 40 % faster<br />

than conventional transmission technologies. The system is<br />

equipped with a stable spindle motor drive and due to its small size<br />

(1.080 mm x 1.560 mm), it fits in tightly sized production surfaces.<br />

Adrian Scherer is thrilled with the performance of the system, “In<br />

SMT and THT processes, we assembled 5,000 circuit boards,<br />

where some had toggle switches with different positions and<br />

clamps whose direction had to be checked. These 5,000 assemblies<br />

were then tested with the 3D AOI with 100 % accuracy, and then<br />

delivered to the customer. We had no failures and every assembly<br />

worked flawlessly. This was a sign for us that the system works<br />

very well in series.”<br />

“All assemblies that are processed by the system can be delivered<br />

directly and no longer requires manual final control. This not only<br />

saves us an immense amount of time, but also personnel costs. The<br />

results and customer feedback are convincing and very good. Also,<br />

the system goes beyond a pure test. Due to the statistics that are<br />

automatically created by the tests, I get feedback of what was incorrectly<br />

produced in my SMT assembly. With<br />

this, I am able to eliminate errors before they<br />

arise.” The company plans to start an expansion<br />

of the building late this summer. By<br />

early summer 2018, the project should be<br />

ready with an expansion of almost 600 m 2 ,<br />

which will prepare them well for the future.<br />

It should certainly be mentioned that the machine<br />

is both 2D and 3D capable because<br />

there are still errors that may not be detected<br />

with a 2D, but with 3D, and vice versa. These<br />

errors include, the OCR-character recognition<br />

which would only be truly recognized by a 2D<br />

system. (dj)<br />

productronica, Booth A2.329 + A2.331<br />

www.mirtec.com; www.pbtecsolutions.de;<br />

www.smtec.ch<br />

Zusammenfassung<br />

Die SMTEC AG ist seit 18 Jahren ein innovativer und sehr flexibler<br />

Dienstleister in der Elektronikfertigung, der zuverlässig voraus<br />

denkt und sich an Kundenwünschen orientiert. Der hohe Qualitätsstandard<br />

spiegelt sich in der ISO9001:2015 Zertifizierung wider und<br />

manifestiert sich in innovativem Equipment, speziell dem jüngst angeschafften<br />

3D AOI von Mirtec.<br />

Résumé<br />

Cela fait 18 ans que SMTEC AG est un fournisseur de services innovant<br />

et flexible dans le domaine de la fabrication d‘électronique,<br />

qui anticipe et s‘adapte aux besoins des clients. Le standard de<br />

bonne qualité se reflète dans la certification ISO9001: 2015 et la<br />

manifestation dans des équipements innovants, en particulier avec<br />

la récente acquisition 3D AOI de Mirtec.<br />

Резюме<br />

Компания SMTEC AG существует уже 18 лет и является<br />

чрезвычайно гибким поставщиком решений для электронных<br />

производств, работающим на перспективу и ориентированным<br />

на потребности клиентов. Соответствие высоким стандартам<br />

качества подтверждается сертификатом ISO9001:2015 и<br />

отражается в применении инновационного оборудования,<br />

например, такого как трехмерная система оптического<br />

контроля качества печатных плат (3D AOI) от компании Mirtec.<br />

70 <strong>EPP</strong> EUROPE November 2017


PRODUCT UPDATES<br />

TEST + QUALITY ASSURANCE<br />

Source: CyberOptics Corporation<br />

AOI system with PCB inspection flexibility<br />

CyberOptics Corporation, a developer and<br />

manufacturer of high-precision 3D sensing<br />

technology solutions, will demonstrate the<br />

SQ3000-DD 3D Automated Optical Inspection<br />

(AOI) system with the new ultra-high<br />

resolution Multiple-Reflection Suppression<br />

(MRS) sensors at productronica 2017. The<br />

company will also unveil the SE3000 3D SPI<br />

and SQ3000 3D CMM, both powered by<br />

MRS technology.<br />

The 3D AOI dual lane, dual sensor system<br />

maximizes flexibility catering to varying PCB<br />

widths. This unique design provides the ability<br />

to inspect high volume assemblies, the<br />

convenience of inspecting different assemblies<br />

and board sizes simultaneously on<br />

different lanes, or even switching from dual<br />

lane to single lane mode to inspect very large<br />

boards. Not only does this AOI system provide<br />

the PCB inspection flexibility, it also provides<br />

the flexibility to choose two of the<br />

The CyberCMM provides 100 percent metrology-grade measurement<br />

on all critical points, much faster than a traditional CMM.<br />

same or two different proprietary MRS sensors,<br />

both of which meticulously identify and<br />

reject multiple reflections caused by shiny<br />

components and reflective solder joints.<br />

The new ultra-high resolution MRS sensor<br />

option provides an even finer resolution than<br />

the standard, delivering superior inspection<br />

performance ideally suited for 0201 metric<br />

and microelectronics applications where an<br />

even greater degree of accuracy and inspection<br />

reliability is critical. The unique architecture<br />

of both MRS sensor options simultaneously<br />

captures and transmits multiple images<br />

in parallel, while highly sophisticated 3D<br />

fusing algorithms merge the images together,<br />

delivering microscopic image quality<br />

at production speed.<br />

The SE3000 SPI system is the first SPI system<br />

to incorporate the MRS sensor technology<br />

with a finer resolution for the best accuracy,<br />

repeatability, and reproducibility – even<br />

on the smallest paste deposits.<br />

Combined with the easy-to-use<br />

software, solder paste inspection<br />

has reached a new level of<br />

precision for the most stringent<br />

requirements.<br />

The SQ3000 3D CMM (Coordinate<br />

Measurement) system,<br />

powered by Multi-Reflection<br />

Suppression (MRS) technology<br />

utilizes CyberCMM, a comprehensive<br />

software suite for coordinate<br />

measurement. In a lab or<br />

Source: CyberOptics Corporation<br />

The Coordinate Measurement<br />

system utilizes CyberCMM, a comprehensive<br />

software suite for coordinate measurement.<br />

production environment, the system is fast<br />

and highly accurate, with repeatable and reproducible<br />

measurements for metrology applications<br />

in manufacturing of a wide variety<br />

of products, such as PCBs, semiconductors,<br />

and consumer electronics.<br />

This software is an extensive suite of CMM<br />

tools, provides 100 percent metrology-grade<br />

measurement on all critical points much<br />

faster than a traditional CMM, including coplanarity,<br />

distance, height and datum X, Y, to<br />

name a few. A fast and easy setup can be<br />

performed as compared to a slow, engineering<br />

resource-intensive setup that typically<br />

requires multiple adjustments with traditional<br />

CMMs.<br />

productronica, Booth A4.439<br />

www.cyberoptics.com<br />

Full 3D inspection solutions and closed-loop process optimizer<br />

Koh Young America is excited about their 3D<br />

measurement systems and closed-loop process<br />

solutions that help improve production<br />

throughput and yield.<br />

SPI systems<br />

The company’s 8030–3 Solder Paste Inspection<br />

(SPI) solution combines multi-projection<br />

moire technology with full 3D data-based<br />

process optimization and analytics to eliminate<br />

false calls and boost throughput. The flagship<br />

aSPIre3, with a feature set suitable for<br />

myriad challenges in demanding production<br />

environments, continues to raise the standards<br />

in the industry.<br />

AOI systems<br />

The company’s Automated Optical Inspection<br />

(AOI) solutions consist of three models<br />

targeting different production environments.<br />

The Zenith platform is the first full 3D AOI<br />

platform. The hardware technology and<br />

Source: Koh Young America<br />

The Solder Paste<br />

Inspection (SPI)<br />

solution eliminates<br />

false calls and<br />

boosts throughput.<br />

measurement algorithms within the series<br />

work together to identify defect sources and<br />

provide accurate inspection of components,<br />

joints, and more, regardless of the model.<br />

Process optimizer<br />

The Ksmart Process Optimizer (KPO) is<br />

powered by the company’s Intelligent Platform<br />

for adaptive learning. Combining realtime<br />

process monitoring with print parameters,<br />

this system actively optimizes the<br />

process to boost yield and advance towards<br />

Smart Factory. KPO is comprised of three<br />

modules. The Print Advisor Module (PAM)<br />

uses diagnostic algorithms to automatically<br />

generate print parameter guidelines. The<br />

Printer Diagnostic Module (PDM) uses<br />

multiple anomaly-detection algorithms to actively<br />

optimize the print process and reduce<br />

false calls. The Printer Optimizer Module<br />

(POM) uses the adaptive learning engine to<br />

generate models that optimize process parameters.<br />

KPO improves SPI utilization, while<br />

providing closed-loop print process recommendations<br />

with many of the industry’s leading<br />

screen printers.<br />

productronica, Booth A2.361 + A2.377<br />

www.kohyoung.com<br />

<strong>EPP</strong> EUROPE November 2017 71


TEST + QUALITY ASSURANCE<br />

Reacting to an increase in manufacturing demands<br />

Benchtop AOI removes<br />

production bottleneck<br />

With consistent expansion since its formation in 1984, Bela Electronic Designs has achieved strong recognition as an<br />

EMS supplier to the design and manufacturing sectors. Following a 50 % growth in business over the last three years,<br />

the company is now a £ 4 million concern with 29 employees, specializing in aerospace, scientific, commercial, covert,<br />

and security applications. Operating from their purpose – built facility outside Bedford, the company offers a wide<br />

range of processes, with flexible manufacturing capacity backed by technical expertise.<br />

With an increase in manufacturing<br />

demands, Cupio supplied a Nordson<br />

Yestech AOI to Bela Electronics Designs.<br />

As demand for manufacturing capacity grew, the existing assembled<br />

PCB inspection stage started to fall behind the technology<br />

levels of the production throughput. Accordingly, in 2010 the<br />

company updated their automated inspection process by purchasing<br />

a Nordson Yestech BX 12 automated optical inspection (AOI) machine,<br />

supplied and supported by Cupio. The BX 12 off-line benchtop<br />

system allows for PCB inspection with exceptional defect coverage.<br />

The operators can inspect solder joints and verify correct part assembly<br />

to improve quality and increase<br />

throughput.<br />

This new automated approach successfully<br />

resolved the company’s capacity issues;<br />

timely training and support from the supplier<br />

enabled them to fully utilize the AOI’s capabilities<br />

and eliminate the inspection bottleneck.<br />

Yet, as the business continued to expand,<br />

pressure once again started mounting on the<br />

inspection level. As previously, the AOI machine<br />

provided the solution; in May of this<br />

year delivery of a second BX 12 AOI machine occurred.<br />

The supplier found the benchtop AOI systems to be a good fit for<br />

the company‘s production profile, and easy to integrate into their<br />

manufacturing process. With connections into the factory network,<br />

both machines can access Gerber files from the network servers<br />

and run at the same time.<br />

Bela‘s operators could program the AOI systems fast and intuitively,<br />

typically taking less than 30 minutes to create a complete inspec-<br />

Source: Cupio<br />

The BX 12 AOI machine successfully resolved the company’s capacity issues and eliminated the inspection bottleneck.<br />

Source: Cupio<br />

72 <strong>EPP</strong> EUROPE November 2017


PRODUCT UPDATES<br />

TEST + QUALITY ASSURANCE<br />

Zusammenfassung<br />

Seit seiner Gründung hat Bela Electronic Designs ständig expandiert<br />

und eine hohe Anerkennung als EMS-Anbieter für die Designund<br />

Fertigungsbranche erreicht. Nach einem Umsatzwachstum von<br />

50 % in den letzten drei Jahren konnte das existierende Inspektionssystem<br />

den Anforderungen der steigenden Fertigungskapazitäten<br />

nicht mehr gerecht werden. Die Investition in ein AOI Tischgerät<br />

eliminierte den Produktionsengpass.<br />

Résumé<br />

Depuis le début, Bela Electronic Designs s‘est continuellement développée<br />

et a obtenu une grande reconnaissance en tant que fournisseur<br />

EMS pour l‘industrie de la fabrication et design. Après une<br />

augmentation de 50 % des ventes au cours des trois dernières années,<br />

le système d‘inspection actuel ne pouvait plus répondre aux<br />

augmentations des demandes de production. L’investissement dans<br />

une unité d’AOI a éliminé le goulot d’étranglement de la production.<br />

Резюме<br />

С момента своего основания компания Bela Electronic Designs<br />

постоянно расширялась и получила широкое признание как<br />

разработчик микроэлектронных схем для сферы<br />

проектирования и производства. За последние три года<br />

оборот компании вырос на 50 %, поэтому существующая<br />

система контроля качества продукции уже не могла отвечать<br />

требованиям постоянно возрастающих объемов<br />

производства. Инвестиция в настольную систему оптического<br />

контроля качества печатных плат (AOI) позволила устранить<br />

«узкое место» в производственной цепочке.<br />

tion program including solder inspection. Once generated, these<br />

programs can be used on either machine. The machines’ complete<br />

inspection coverage and extremely low false failure rate is enabled<br />

by advanced Fusion Lighting and 5-megapixel image processing<br />

technology. This integrates several techniques, including color inspection,<br />

normalized correlation, and rule-based algorithms.<br />

“Bela continuously invests in new, high-technology plant and equipment<br />

to maintain a competitive advantage and ensure the highest<br />

of quality for our customers,” commented Mike Lafratta, Managing<br />

Director, “and, as part of that strategy, Cupio’s Yestech AOI machines<br />

have been providing a good solution. They enable the<br />

throughput we need, with some leeway, together with sufficient<br />

flexibility to check a wider range of products. Buying the second machine<br />

was a particularly easy decision, as we could capitalize on our<br />

operators’ existing software experience and training.<br />

“We would attribute our AOI success to three core elements; the<br />

features of the machines themselves, our operators’ ease in programing<br />

them for new products, and the excellent response, service<br />

and communications we have enjoyed from Cupio.”<br />

www.cupio.co.uk<br />

Full metrological 3D AOI with 25 mega<br />

pixel sensor<br />

Mek (Marantz Electronics), will<br />

showcase and demonstrate a<br />

comprehensive range of AOI systems<br />

at this year’s productronica,<br />

featuring the latest in 3D inspection<br />

technology. This will include<br />

a unique AOI capability across a<br />

very wide range of applications<br />

and budgets.<br />

The ISO-Spector M1, a metrological<br />

AOI system of true<br />

measurement, delivers full,<br />

across-the-board height profile<br />

measurement and inspection.<br />

With a large, 25 mega pixel sensor<br />

and 69 x 69 mm FoV, it delivers<br />

ultra-high speed inspection<br />

of even 008004 components,<br />

leads, and solder joints. Multiple<br />

Moiré fringe projections enable<br />

high precision, shadow free<br />

measurement of heights up to<br />

30 mm, as well as, 4 fully programmable<br />

side view high-res<br />

cameras able to actively inspect<br />

J- leads and other devices invisible<br />

to top side imagers.<br />

Other product highlights at the<br />

show include the SpectorBOX<br />

GTAz 550. This “Bottom Up/Top<br />

Down” system is uniquely engineered<br />

to accommodate solder<br />

frames on return and/or feed<br />

conveyors. It offers bottom side,<br />

top side, or simultaneous dual<br />

side inspection, deploying up to<br />

18 cameras, Z axis positioning,<br />

and auto-focus. The design is optimized<br />

for the inspection of THT<br />

components to identify defects,<br />

such as presence/absence,<br />

wrong polarity, colour, type, and<br />

bent pins. Various integration alternatives<br />

are greatly enhanced<br />

by its slim, compact, mechanical<br />

design.<br />

The entry level iSpector JDz 520<br />

boasts high specifications, including<br />

a 5 mega pixel camera,<br />

15 micron telecentric lens, coaxial<br />

light, and 520 x 460 mm<br />

maximum PCB size. This bench<br />

Source: Marantz Electronics<br />

top powerhouse uses same high<br />

speed programming software as<br />

the PowerSpector series of machines.<br />

Simultaneous 3D and 2D (5D)<br />

Solder Paste Inspection on the<br />

ISO-Spector S2 is made possible<br />

with patented, third generation<br />

sensor technology. Shadow free<br />

violet/blue dual lasers ensure accurate<br />

and repeatable 3D<br />

measurements while episcopic<br />

and low angle diffuse RGB lighting<br />

creates the highest quality of<br />

2D colour imaging.<br />

The SpiderEye Machine Vision<br />

systems are static AOI machines<br />

for the inspection of moving objects.<br />

Inspection and quality control<br />

tasks traditionally performed<br />

by humans or inflexible mechanical<br />

procedures can be fully automated<br />

for increased throughput,<br />

lower defect counts, and to generally<br />

boost productivity and<br />

profitability. This is another machine<br />

vision solution, including<br />

powerful algorithms for THT<br />

solder joint inspection with meniscus<br />

profiling, and myriad integration<br />

alternatives.<br />

productronica, Booth A2.402<br />

www.marantz-electronics.com<br />

The AOI system delivers ultra-high<br />

speed inspection of even 008004<br />

components, leads, and solder joints.<br />

<strong>EPP</strong> EUROPE November 2017 73


ADVERTISERS<br />

Advertisers / Editorials<br />

Aegis 24<br />

AIM Solder 34, 35, 45<br />

Alpha Assembly Solutions 41<br />

Altus 40<br />

Asetronics 31<br />

Asscon Systemtechnik<br />

Elektronik GmbH 58, 10<br />

Asys 55, 35, 50<br />

Bela Electronic Designs 72<br />

Beta Layout GmbH 35<br />

Bohnert GmbH 51<br />

Cambridge Nanotherm 51<br />

Cogiscan Inc 40<br />

Cupio 72<br />

CyberOptics Corporation 11, 71<br />

Dow Corning 59<br />

DOCERAM GmbH 5<br />

Electrolube 50, 36<br />

EPH Electronics AG 28<br />

Ersa 3, 20<br />

Essemtec AG 34<br />

F&S BONDTEC Semiconductor<br />

GmbH 59<br />

FEINMETALL GmbH<br />

Prüftechn.f.d.Elektronik 57<br />

HW Technologies 6<br />

IBL-Löttechnik GmbH<br />

57<br />

Inertec Löttechnik GmbH 26<br />

Indium Corpora<br />

ration<br />

54<br />

Interflux Electronics N.V. 52<br />

IPC 18<br />

ITW EAE<br />

–<br />

Speedline<br />

World Headqua<br />

uarters<br />

2<br />

IVH Industrievertrieb Henning 42<br />

This issue carries inserts from<br />

Pickering Interfaces Ltd.,<br />

Clacton-on-Sea, GB<br />

Acceed GmbH, Düsseldorf<br />

We ask our readers for their<br />

kind attention<br />

Koh Young America 71<br />

Koh Young Americas 6<br />

Koh Young <strong>Europe</strong> GmbH 19<br />

LPKF Laser & Electronics AG 40<br />

Matrix 63<br />

Megger Instruments Ltd 52<br />

Mek 73<br />

Mesago Messe Frankfurt GmbH,<br />

Stuttgart 75<br />

Messe München GmbH,<br />

München 76<br />

MicroCare Corp 10<br />

Mirtec 68<br />

Mycronic 28<br />

Nordson Dage 63<br />

Nordson EFD 58<br />

Panacol 59<br />

Paramit Corporation 20<br />

pb tec solution GmbH 68<br />

Pickering Electronics 48<br />

Rehm Thermal Systems 27, 31<br />

Saki 64<br />

Scienscope 26<br />

Seho North America 57<br />

Seho Systems GmbH 41, 42<br />

Seica 8<br />

SICK AG 7<br />

SmartRep GmbH 10<br />

SMT Thermal Discoveries 6, 27<br />

SMTEC AG 68<br />

Super Dry Totech 50<br />

ULT AG 41, 42<br />

Vi Technology 67, 60<br />

Viscom 18<br />

VJ Electronix, Inc 10<br />

www.microcare.com 10<br />

Yamaha Motor <strong>Europe</strong> N.V.<br />

Niederlassung Deutschland 63<br />

Yestech 63<br />

Zestron 6, 51<br />

ISSN 1618–5587<br />

Trade journal for all fields of production in the<br />

electronics industry, manufacturing equipment,<br />

test and measurement, and materials.<br />

Publisher: Katja Kohlhammer<br />

Publishing House:<br />

Konradin-Verlag Robert Kohlhammer GmbH,<br />

Ernst-Mey-Straße 8, 70771 Leinfelden-Echterdingen,<br />

Germany<br />

General Manager: Peter Dilger<br />

Editor-in-Chief:<br />

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E-Mail: doris.jetter@konradin.de<br />

Editorial Assistant: Birgit Niebel,<br />

Phone +49 711 7594 -349, Fax –1349,<br />

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Layout: Matthias Rösiger,<br />

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Fax +49 711 7594-15850<br />

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74 <strong>EPP</strong> EUROPE November 2017


Nuremberg, 5 – 7 June 2018<br />

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