16.04.2019 Views

EPP Europe P1.2018

  • No tags were found...

Create successful ePaper yourself

Turn your PDF publications into a flip-book with our unique Google optimized e-Paper software.

Industrie<br />

| The network of expertise for industry<br />

05 2018<br />

www.epp-europe.eu<br />

INTERVIEW<br />

Mark Challingsworth,<br />

Heraeus Electronics<br />

Fast changing speed of the<br />

semiconductor industry<br />

COVER<br />

The heart of the<br />

electronic industry<br />

CONTENT<br />

Trade shows + events<br />

Accomplishments of<br />

the past 100 years<br />

PCB + Assembly<br />

Real added value with<br />

assistance systems<br />

Zero-fault production<br />

in soldering processes<br />

Test + Quality Assurance<br />

The “Golden Hour” of<br />

the assembly line<br />

SMT/Nuremberg<br />

Visit us at<br />

Booth 4-140<br />

<strong>EPP</strong> EUROPE May 2018 1


The True Smart Factory Solution<br />

AI<br />

Platform<br />

Engine<br />

Printing Analysis<br />

Optimization<br />

Mounting Analysis<br />

Feedback<br />

World’s No.1 Inspection Company,<br />

now powered by our AI Platform<br />

from Programming to Optimization<br />

Ultra High Inspection<br />

Speed<br />

Perfect True 3D<br />

Inspection Performance<br />

3D Data based<br />

SMT process Control<br />

System<br />

Ultra High Inspection<br />

Speed<br />

Complete<br />

Process Solutions<br />

Highest Accuracy<br />

Koh Young <strong>Europe</strong> GmbH<br />

Industriegebiet Süd E4, 63755 Alzenau, Germany<br />

Tel:+49-6188-99-35-663, Email: europe@kohyoung.com<br />

www.kohyoung.com<br />

2 <strong>EPP</strong> EUROPE May 2018


EDITORIAL<br />

SMT Hybrid Packaging 2018<br />

This international tradeshow, taking place this year in June,<br />

will unite the electronic manufacturing industry in Nuremberg,<br />

Germany. Similar to last year, visitors will find exhibitions<br />

in Halls 4A, 4, and 5. Presentations, panel discussions<br />

and more can be found in the Conference hall, located by<br />

the east entrance. PCIM will also take place at the same<br />

time in Halls 6, 7, and 9.<br />

Don’t forget to stop by our Booth 4–140.<br />

Automating all production areas<br />

A sensor manufacturer is involved in a project called SMT Smart Network.<br />

This project is a platform for companies that want to share and<br />

exchange ideas and best practices, in order to reach the Smart Factory.<br />

It is for those who want to have a smarter and more automate production,<br />

optimize their factory, as well as share their results and experience<br />

with others.<br />

Sharing own path towards automation.<br />

Source: Carina Zarfelder<br />

Managing heat of LED assemblies<br />

Producing LEDs is not as easy as it may seem, challenges can<br />

come up for manufacturers during production. The cold light<br />

shift is a complication that can occur, as well as, the dissipation<br />

of the operating heat can have a significant effect on radiation<br />

power and the lifespan. Using a primer is one solution that prevents<br />

shifting of color temperature.<br />

Achieving a precise color temperature.<br />

Product safety industries inspection<br />

In many fast paced industries, such as in the automotive<br />

area, AOI or MXI solutions are not sufficient<br />

enough to keep up with production, especially when<br />

product safety is of high importance. 3D AXI solutions<br />

are not only user friendly, but a complete fast inspection<br />

coverage is also guaranteed.<br />

Flawless balanced combined solution.<br />

Charlene Perrin<br />

Trainee/Editor <strong>EPP</strong> E<br />

05. - 07.06.2018 | Hall 4 | Booth 111<br />

Ersa soldering systems and tools set standards<br />

with flexible and energy-efficient production<br />

technologies. As a system supplier offering the<br />

most comprehensive product range in this field<br />

worldwide, we provide you with smart solutions.<br />

In an intelligent way Ersa interconnects your<br />

electronics production to the next productivity<br />

level. What can we do for you?<br />

Portfolio<br />

Stencil printers<br />

Reflow systems<br />

Wave soldering systems<br />

Selective soldering systems<br />

Automation<br />

Rework systems<br />

Inspection systems<br />

Soldering stations<br />

Solder fume extraction units<br />

Solders, fluxes and more<br />

Staff training/certification<br />

w w w . e r s a . c o m<br />

<strong>EPP</strong> EUROPE May 2018 3


Content 05 2018<br />

<strong>Europe</strong>an Magazine for<br />

Production and Test in the<br />

Electronics Industry<br />

Cover<br />

The heart of the electronic industry<br />

Source: Ersa GmbH<br />

36<br />

Assistance systems support staff in decisionmaking<br />

and permit access to data and information.<br />

The SMT Hybrid Packaging show will take place from<br />

June 5 th to the 7 th in Nuremberg, Germany.<br />

As new trends, including Smart Factory, Internet of Things, and Industry<br />

4.0, have become more popular, new challenges and technologies<br />

have surfaced and been brought to a new level. With the<br />

help of over 400 exhibitors, the entire value chain with solutions<br />

to these challenges will be discussed. This includes technology<br />

and processes, materials and components, manufacturing equipment,<br />

reliability and testing, and more.<br />

News + Highlights<br />

6 Succeeding in today’s fast changing market<br />

Heraeus’ tips on how to stay innovative and competitive<br />

8 Opening of new location in Kelsterbach, Germany<br />

Fuji Machine MFG. (<strong>Europe</strong>) GmbH has new building and name<br />

9 Expanding fluid options for electronics applications<br />

Nordson Asymtek acquired dispensing and dosing products<br />

9 Electrical engineer moves up the ladder<br />

KIC appoints a new R&D manager<br />

Source: Nordson Select<br />

Source: Göpel electronic GmbH<br />

4 <strong>EPP</strong> EUROPE May 2018<br />

42<br />

Production can benefit from a parallel soldering<br />

where 2 boards are simultaneously soldered.<br />

70<br />

Press-in connectors are being used for components,<br />

which means quality inspection is required.<br />

Trade Shows + Events<br />

10 100 years of experience<br />

Connecting to the factory of tomorrow (Panasonic)<br />

12 IPC Apex Expo 2018<br />

Speed in which the industry is changing<br />

14 Revolutionized lighting design at LED expositions<br />

LpS and TiL discusses the evolution of the lighting industry<br />

14 Supporting college students at GCSU career day<br />

TopLine offers internships to young individuals<br />

15 Succeed at the velocity of technology<br />

Electronic professionals exhibit innovations at IPC‘s event<br />

16 Electronic industry continues to thrive<br />

productronica 2017 was a hit<br />

18 SMT Hybrid Packaging 2018<br />

System integration in micro electronics<br />

PCB + Assembly Features<br />

32 Product-Updates PCB Assembly<br />

34 Digitalisation in programming soldering systems<br />

Added value with assistance systems (Ersa)<br />

37 Product-Updates PCB Assembly<br />

38 Handling high-density boards with exotic components<br />

Future investment for the “right kind of business” (Europlacer)<br />

40 Implementing high-volume selective soldering<br />

Dealing with mixed PCBAs (Nordson Select)<br />

42 Product-Updates PCB Assembly<br />

44 Automating all areas in the production of sensors<br />

Optimizing material flow for efficient processes (ASM)


Source: .Mesago/Thomas KLerx<br />

18<br />

47 Product-Updates PCB Assembly<br />

48 Quality management based on quality assurance<br />

Zero-fault production in soldering processes (Seho)<br />

52 Colour temperature and heat of LED assemblies<br />

Controlling the cold-light shift effect (Lackwerke Peters)<br />

54 Product-Updates PCB Assembly<br />

56 Environmentally-friendly disposal of solder waste<br />

Ecological and economical mode of disposal (MTM)<br />

58 Product-Updates PCB Assembly<br />

60 Resistance welding electrodes for perfect joint<br />

Ensuring optimum current transfer (Wolfram)<br />

62 Precise dip tinning at high temperatures<br />

Soldering and handling soldering tasks (Zevatron)<br />

Packaging Features<br />

64 Product-Updates Packaging<br />

Test + Quality Assurance Features<br />

66 The ‘Golden Hour’ in the assembly line<br />

Additional features to solder paste inspection (Koh Young)<br />

68 Product-Updates Test + Quality Assurance<br />

70 3D assembly inspection of press-in contacts<br />

Deeper insights: quality of the signal transmission (Göpel)<br />

73 Product-Updates Test + Quality Assurance<br />

74 Inline inspection system for product safety industries<br />

Versatility with high-throughput x-ray (Viscom)<br />

78 Product-Updates Test + Quality Assurance<br />

80 Insight into the inside: x-ray inspection of solder quality<br />

Power semiconductor devices in production line (Nikon)<br />

Columns<br />

3 Editorial<br />

4 Content<br />

82 Imprint/List of advertisers<br />

<strong>EPP</strong> EUROPE May 2018 5


NEWS + HIGHLIGHTS<br />

Source: Heraeus Electronics<br />

Staying competitive and innovative<br />

in a fast-changing market<br />

In this interview, Mark Challingsworth, the Global Head of Marketing<br />

at Heraeus Electronics, discusses how fast the industry is<br />

changing and the increasing demands that calls for this growing<br />

pace. He explains what companies should focus on in order to succeed<br />

with today’s trends and what is yet to come. He also further<br />

discusses the developments and what the future of the company<br />

will look like.<br />

What is the company’s USP and how does it differentiate<br />

from other competitors?<br />

As we have talked to and worked with customers in the power electronics,<br />

semiconductor and LED industries, there is a growing trend<br />

toward the streamlining of their supply chains. There is an increasing<br />

demand for partners who can deliver simplicity and expertise<br />

from a complete portfolio perspective of packaging materials, and<br />

that certainly plays to our strengths. We are an expert for materials<br />

and matched materials solutions for electronic packaging. Our product<br />

portfolio ranges from substrate materials with metal substrates,<br />

and metal ceramic substrates to thick film materials, solder products<br />

and sinter materials, as well as, adhesives and both heavy and<br />

fine bonding wires.<br />

We also strongly invest in R&D facilities. Customers profit from our<br />

application competencies and engineering services in our application<br />

centers and prototyping facilities around the world. Next to<br />

our Customer Applications Labs in Germany, Singapore, and Shanghai,<br />

we have recently opened a SMT Customer Applications Lab in<br />

Philadelphia, to work collaboratively with customers in the Americas,<br />

to resolve specific performance challenges, manage joint development<br />

projects and support the design and simulation of processes.<br />

We can bring a broader, integrated, and holistic approach to<br />

our customers’ needs.<br />

The solder paste product series that was released<br />

at productronica, how has this benefited clients?<br />

We developed the new solder paste to help manufacturers address<br />

the competitive cost challenges of the market while delivering superior<br />

performance. We had a lot of great feedback from the show<br />

last year. The F498 soldering paste is a lead-free, low-temperature<br />

solder paste, specifically designed for step-soldering when a sec-<br />

6 <strong>EPP</strong> EUROPE May 2018


or solution we offer is guided by three essential principles: help our<br />

customers to shorten development cycles, bring down costs, and<br />

reduce risks in all the applications they are working on. If you can<br />

help your clients in those three areas, it can help them keep them<br />

competitive and innovative in a fast-changing market.<br />

Source: Heraeus Electronics<br />

The company has Customer Applications Labs in<br />

Germany, Singapore, and Shanghai, as well as a<br />

recently opened SMT Customer Applications Lab in<br />

Philadelphia, Pennsylvania.<br />

Heraeus Electronics is a producer of materials and<br />

matched materials solutions for the electronics<br />

packaging industry.<br />

ond, lower temperature reflow process is needed, which is often<br />

used in consumer electronics and telecommunications. The soldering<br />

temperatures are lowered by 70 °C to 80 °C, so it also reduces<br />

the energy consumption of furnaces.<br />

How has the speed of the changing industry affected<br />

clients?<br />

The electronics markets are dynamic and evolve at a very fast pace.<br />

A short time-to-market for new products becomes a crucial sales<br />

advantage. Two other trends that will continue to grow in scope are<br />

price competition, obviously, and the rising expectations on device<br />

features. Only those who optimize design and processes will succeed.<br />

Regardless of the customer’s specific needs, every product<br />

The Global Head of Marketing,<br />

Mark Challingsworth,<br />

discusses challenges that can<br />

be seen in today’s market and<br />

what can be expected in the<br />

future for the industry.<br />

Source: Heraeus Electronics<br />

What are some other challenges that the company<br />

has seen recently?<br />

There are many challenges companies are facing today. The functionality<br />

of devices keeps increasing and it needs to fit into a smaller<br />

footprint. With less space, it becomes crucial to develop materials<br />

that can perform with smaller form factors and increase performance<br />

and functionality. At the same time, more electronic functions<br />

in smaller spaces result in higher power density, so that the heat<br />

caused by power losses needs to be dissipated. Therefore, thermal<br />

management also represents a major challenge. Our application<br />

centers around the world help to build prototypes and see how future<br />

devices can be structured in order to achieve optimal performance.<br />

What are future trends that can be seen in the<br />

semiconductor industry?<br />

More than Moore will drive the semiconductor industry in the<br />

coming years. Focus has shifted from transistor scaling to advancements<br />

in device system packaging with smaller form factor components.<br />

The application of assembly materials is critical to guarantee<br />

high yields. We are therefore developing advanced packaging products<br />

with our ultra-fine Welco powder to give customers the ability<br />

to attach their components with very fine features, up to Type 8<br />

solder powder.<br />

What other innovations will be released this year?<br />

We recognize the continuous need for innovation to enable customers<br />

in achieving their goals. We support the drive for miniaturization<br />

while maintaining high yields and providing effective cost solutions<br />

to our customers. In power electronics, we have a new sinter paste<br />

for high power density packages, as well as, a high reliability solder<br />

paste for Die Attach and DCB. But we’re also creating innovations<br />

for the LED industry with our multi-layer substrate for LED Chip on<br />

Board (CoB) applications, as well as our non-pressure pin transfer<br />

silver sinter paste for high power LEDs requiring high thermal dissipation<br />

and precise positioning.<br />

What does the future for the company look like?<br />

It looks very bright for us. We will continue to focus on growth markets<br />

including power electronics, automotive and advanced packaging.<br />

As society and industry becomes more energy efficient, power<br />

electronics will play a key role. While devices become smaller, the<br />

need for advanced packages will grow. Our products and solutions<br />

are being used in all these devices. We also see strong growth opportunities<br />

in the battery sector with our wires and roll-clad products<br />

for cell-to-cell connections and our thick film pastes for heaters.<br />

We are continuing to develop from a materials supplier to a solution<br />

provider, offering our customers perfectly matched solutions for<br />

their innovations. And with a global network of research labs located<br />

close to customers, research and development is a 24/7 operation.<br />

It enables us to quickly move our customer’s challenges from the<br />

research lab to the real world, so they can compete and succeed.<br />

SMT Hybrid Packaging, Booth 4–554<br />

www.heraeus.com<br />

<strong>EPP</strong> EUROPE May 2018 7


NEWS + HIGHLIGHTS<br />

Fuji Machine MFG. (<strong>Europe</strong>) GmbH has new building and new name<br />

The company is currently in the process<br />

of moving into a new building,<br />

and will be changing their name at<br />

the same time.<br />

On March 15 th , the keys for the<br />

new business building in Kelsterbach<br />

were handed over to<br />

Klaus Gross, General Manager of<br />

Fuji Machine MFG. (<strong>Europe</strong>)<br />

GmbH, by Kelsterbach’s mayor<br />

Manfred Ockel and Bernd<br />

Bützler, General Manager of the<br />

Source: Fuji <strong>Europe</strong> Corporation GmbH<br />

executing general contractor<br />

Takenaka <strong>Europe</strong> GmbH, the<br />

daughter of Takenaka Corporation,<br />

which has been based in<br />

Düsseldorf since 1973. The Corporation,<br />

Japan‘s oldest architectural,<br />

engineering and construction<br />

company, with more than<br />

400 years of tradition, includes in<br />

its portfolio a large number of<br />

Japan‘s most famous landmarks<br />

and numerous buildings in <strong>Europe</strong>.<br />

An own headquarter back to<br />

the origins<br />

Since 1991, Fuji Machine <strong>Europe</strong><br />

is a direct subsidiary of the Japanese<br />

Fuji Machine MFG Co.<br />

LTD., working on the <strong>Europe</strong>an<br />

market. For a decade, the company<br />

has been serving <strong>Europe</strong>an<br />

customers from the Rhine-Main<br />

area. “At that time, the company<br />

operated an office in Kelsterbach”,<br />

so Klaus Gross, “We have<br />

With just 12 months of construction, the building is now open for business.<br />

fulfilled our long-cherished wish<br />

with our new building here in<br />

Kelsterbach!”<br />

The modern business building includes<br />

premises for management,<br />

showroom, customer<br />

trainings and education, sales,<br />

service (Hard-/Software), unit repair,<br />

customer process support<br />

with special applications (Made<br />

in Germany), order processing/logistics,<br />

finance, marketing, spare<br />

parts and permanent Japanese<br />

colleagues for support. This gives<br />

the company the opportunity to<br />

grow in an innovative and forward-looking<br />

manner – both<br />

technologically and personally.<br />

Construction in record time<br />

In the industrial area at the Staudenäcker,<br />

directly next to the<br />

South Park of Kelsterbach, the<br />

company celebrated successfully<br />

at the end of March 2017 –<br />

just one year earlier –the ground<br />

breaking ceremony for the new<br />

business building. At the end of<br />

July 2017, the completion of the<br />

roofing, masonry, and concrete<br />

work was solemnly celebrated,<br />

where – as the custom stipulates<br />

– a symbolic phrase was presented<br />

by a carpenter. Since almost<br />

no wood was used in the<br />

construction of the new <strong>Europe</strong>an<br />

headquarter, the carpenter<br />

had adjusted his ceremonial<br />

statement accordingly.<br />

Large, innovative and bright<br />

“Today is an important and<br />

eventful day for us”, said Klaus<br />

Gross happily. “Our new business<br />

building, and that after only<br />

12 months of construction“. He<br />

again reviewed the steps that led<br />

to this day. “The time frame for<br />

our large 3,700 m 2 new building<br />

was very tight. In addition to the<br />

800 m 2 needed demo space,<br />

1,500 m 2 of office space was<br />

also created, equipped with the<br />

latest communication technology.<br />

The large open spaces, the<br />

patio, and the large rooms provide<br />

plenty of natural light in the<br />

offices and production areas.<br />

Move<br />

During a tour, Klaus Gross and<br />

Stefan Janssen, Ass. General<br />

Manager, gave an insight into the<br />

new rooms. They explained the<br />

peculiarity of the demo room,<br />

which can be expanded and<br />

made smaller according to one’s<br />

own needs, as well as other innovations,<br />

such as the photovoltaic<br />

modules and the ventilation<br />

system.<br />

In the next few weeks, starting<br />

mid March, the 56 of the 79 employees<br />

will move into the new<br />

business building day by day. The<br />

entire facility is designed so that<br />

an extension is possible at any<br />

time. The company will also follow<br />

in the footsteps of its parent<br />

company from Japan and will rename<br />

itself. Starting April 1 st ,<br />

2018, they will have a new company<br />

name and the following<br />

new address:<br />

Fuji <strong>Europe</strong> Corporation GmbH<br />

Fujiallee 4, 65451 Kelsterbach,<br />

Tel : +49 (0)6107 / 68 42 – 000<br />

SMT Hybrid Packaging, Booth<br />

5-324; 5-434<br />

www.fuji-euro.de<br />

Source: Fuji <strong>Europe</strong> Corporation GmbH<br />

8 <strong>EPP</strong> EUROPE May 2018


Fluid dispensing options for<br />

electronics applications<br />

Nordson Asymtek, a Nordson company in<br />

dispensing and coating technologies, has acquired<br />

the rights and assets to progressive<br />

cavity pump (PCP) product lines from Infiniti<br />

Dosing o.m.s, based in Polling, Germany. This<br />

provides the company with dispensing and<br />

dosing products under the Dot Streamer (DS)<br />

and Accura brands. Infiniti‘s founder, Mr.<br />

Jean-Claude Tytgat, will work on the technology<br />

developments for the company.<br />

Infiniti Dosing products deliver fluids in mini<br />

and micro levels for electronics applications.<br />

Materials include silicones, MS polymers,<br />

solder pastes, MMAs, thermally and electrically<br />

conductive adhesives, and more.<br />

„Joining Nordson Asymtek is the perfect<br />

synergy for Infiniti,“ said Mr. Tytgat. „Their global<br />

infrastructure and deep technical competence<br />

will speed the growth and adoption of<br />

the micro-dispense capabilities that our PCP<br />

technology offers.“<br />

SMT Hybrid Packaging, Booth 5-434<br />

www.nordsonasymtek.com<br />

Promotion to R&D manager<br />

KIC announced the appointment of Ryan Wilshusen<br />

as its R&D manager. He joined the<br />

company in 2016 with more than 16 years of<br />

experience as an electrical engineer with respected<br />

companies, such as HP, and various<br />

industries, including medical, industrial, aviation<br />

and consumer. Wilshusen has demonstrated<br />

strong management capabilities with<br />

a track record of anticipating consequences<br />

of new designs, initiating solutions, and completing<br />

specifications on the first attempt.<br />

The company’s President Bjorn Dahle states:<br />

“We are fortunate at KIC to have a worldclass<br />

talent like Ryan Wilshusen to guide our<br />

R&D to deliver never-before experienced<br />

smart factory technologies. We are entering<br />

a period of data-driven sensor technologies<br />

that significantly reduce production cost and<br />

will enable manufacturers to run their operations<br />

far more effectively, while sharing with<br />

their customers the process control and traceability<br />

data they now demand.”<br />

Wilshusen is detail-driven with outstanding<br />

communication skills and success of manag-<br />

Source: KIC<br />

ing up and down, and interfacing with peers,<br />

customers and third-party vendors. He has a<br />

background in product design, development<br />

and manufacturing, and a firm grasp of developing<br />

solutions for high and low volumes<br />

within cost constraints.<br />

He holds a Bachelor’s of Science in Electrical<br />

Engineering from the University of California.<br />

He is technically capable in electrical, mechanical,<br />

software and test architecture, design,<br />

and review.<br />

SMT Hybrid Packaging, Booth 4A-230<br />

www.kicthermal.com<br />

Ryan Wilshusen is the new<br />

R&D manager for KIC.<br />

Turn Vision into Reality<br />

set for powerful output<br />

Best performance in every production environment<br />

with the CondensoX series!<br />

CondensoX is perfect for handling large or high-mass boards in a stable process<br />

atmosphere. In order to improve control of the condensation phase, Rehm has developed<br />

a patented injection principle that allows the soldering procedure to be individually<br />

<br />

and dependably, at temperatures of up to 260 °C.<br />

SMT<br />

Hybrid/Packaging<br />

Nuremberg<br />

June 5 – 7, 2018<br />

Hall 4A<br />

Booth 100<br />

www.rehm-group.com<br />

<strong>EPP</strong> EUROPE May 2018 9


TRADE SHOWS + EVENTS<br />

Clients and partners gathered<br />

at a full day<br />

Technology day event,<br />

which took place at the<br />

Technical Center in Hohenbrunn,<br />

Germany.<br />

Source: Charlene Perrin<br />

The accomplishments of the past 100 years<br />

Cyber solutions and latest<br />

equipment to connect to the<br />

factory of tomorrow<br />

This year marks the 100th anniversary for Panasonic Corporation. Founded in 1918, the company started out in a Japanese<br />

village and created its first attachment plug and a double cluster socket. Over the years, the company became<br />

internationally well known for its name, products, as well as established offices and facilities around the world. Their<br />

focus then was how to improve the quality of life for the individual, as well as the society as a whole, and that still<br />

hasn’t changed today. They continue to follow their slogan, “A better life, a better world”. Now a worldwide electronics<br />

manufacturer, they will proceed to increase product development, and revolutionize the industry.<br />

As part of their anniversary celebration, the company held an<br />

event called Technology days. Customers, clients, and partners<br />

had the chance to take part in this full day event, which took place at<br />

their Technical Center in Hohenbrunn, Germany. The recently<br />

opened building was nicknamed “hotspot” and follows the slogan,<br />

“connect to the factory of tomorrow”. This location was made<br />

exactly for this event, as visitors had an enlightening firsthand look<br />

at the company’s solutions for the smart factory of the future.<br />

On display in the Demo area included a production line with the<br />

company’s SPV screen printer, an SPI from Viscom, an AOI from<br />

Asys, and the NPM W2 placement machines. Part of the NPM<br />

series, the NPM VF and NPM DX were also displayed, as well as a<br />

stencil and nozzle cleaner. Other third party solutions were present,<br />

which included Essemtec’s material tower and Inovaxe’s smart material<br />

trolley. With live demonstrations of their latest equipment and<br />

software solutions, this event was divided into 3 main topics.<br />

Smart Factory solutions through M2M<br />

Machine communication has been an important theme in the electronic<br />

industry for quite some time. In order to be fully productive,<br />

to be able to use the time given and have as little downtime as<br />

possible, machines need to be able to share its data and communicate<br />

with each other in a line, no matter the manufacturer. With the<br />

Integrated Line Management System, iLNB, which is made in cooperation<br />

with Siemens, it is easier to have an overview of an entire<br />

line that includes 3 rd party solutions. This system, partnered with<br />

Asys Pulse, monitors the line, as well as, collect and analyze data,<br />

all from one computer or tablet.<br />

10 <strong>EPP</strong> EUROPE May 2018


Source: Charlene Perrin<br />

The Panasonic team gave live demonstrations of latest equipment and software solutions.<br />

Source: Charlene Perrin<br />

Machines must also be able to send each other feedback about defects<br />

and inconsistencies, or potential errors that may occur. The<br />

APC system software communicates with the printing machine,<br />

and can correct printing positions based on the data it accumulates.<br />

It gives automatic feedback and information, which is also based on<br />

AOI measurements, to make the necessary adjustments and corrections,<br />

in order to reach complete accuracy and high productivity.<br />

It is available with a variety of 3 rd party SPI and AOI machines.<br />

Source: Charlene Perrin<br />

Heading towards “No operator” SMT operation<br />

There are smart software options with the company’s NPM series<br />

machines, which gives the machine more control and direction. It<br />

also aids the operator with knowing what to do best in order to keep<br />

the production running and not waste material.<br />

Reducing error recovery time is now made possible with the remote<br />

operation option. With the NPM-DX modular placement machine,<br />

a monitoring center can oversee an error, for instance a pick<br />

up position or component placement error, and quickly fix it remotely.<br />

This eliminates time to figure out the error and the actions<br />

that need to be taken thereafter, reducing manual labor as well.<br />

With the automatic recovery option, the machine will automatically<br />

learn pick up trends and realize when there are stoppages. It will<br />

then teach itself certain details, such as accurate positioning, so<br />

stoppages occur less frequently. An operator can also change specific<br />

details, which the system will automatically change for the next<br />

job.<br />

The NPMW-2 can detect when a material that is being used is not<br />

the same that is originally programmed. With the auto-load feeder<br />

option, it also has an autonomous splicer and detects when a reel is<br />

empty. Since it does not need joint tape, it reduces wasted material,<br />

as well as, takes less time to operate, which dramatically cuts down<br />

on long manual labor.<br />

Displaying a variety of<br />

solutions for factories of<br />

all shapes and sizes.<br />

The company is celebrating their 100th anniversary this year. (Part of the Panasonic<br />

team, from left to right: Balazs Tarsoly, Claus Hanelt, Mokhtar Marzouk)<br />

The feeder setup navigation system is another tool used for setting<br />

up a production line, to estimate the time that is needed for production,<br />

instructing how to prepare for preparation, and giving an overview<br />

of performance completion.<br />

Entire shop floor optimization<br />

Staying connected to production at all times is no longer a luxury, it<br />

is a necessity in today’s industry. The company’s software solutions<br />

manage all assets of the production floor, including analyzing and<br />

controlling inventory and scheduling, in order to be most productive<br />

at all times. The PanaCIM Material Control manages, tracks, and locates<br />

the quantity of all materials needed within an inventory, including<br />

ones that need to be restocked. As an added option, Material<br />

Control Allocation can also provide a specific item list for an upcoming<br />

project, as well as, assign specific materials only to be used<br />

for a certain project. The PanaCIM Maintenance software goes<br />

beyond a regular MMS software system, as it helps to verify, edit,<br />

and predict what is needed to keep maintenance smooth. This helps<br />

manage production and reduces the cost of maintenance. The<br />

Manufacturing Operation Optimizer MFO is a line management system<br />

that creates a plan to increase production and efficiency, while<br />

decreasing manual labor. This is applicable to a variety of the company’s<br />

machines. (cp)<br />

SMT Hybrid Packaging, Booth 4–311<br />

http://PFSE.panasonic.eu/<br />

Source: Charlene Perrin<br />

<strong>EPP</strong> EUROPE May 2018 11


TRADE SHOWS + EVENTS<br />

The remarkable speed in which the industry is changing<br />

Taking the right path towards<br />

factory communication and<br />

Industry 4.0<br />

Technology is changing at such a fast pace that it can be a challenge to keep up with every new innovative product and<br />

technique, especially within the electronic industry. At this year’s IPC Apex show, exhibitors successfully went along with<br />

the theme of the show, which was “Succeed at the Velocity of Technology”. Leaders and professionals were able to grasp<br />

the trends and best practices that the beginning of 2018 has brought so far. Taking place in San Diego, California, this 3-day<br />

exposition was one of the best ones yet.<br />

The three day event<br />

was full of lectures,<br />

speeches, buzz<br />

sessions, and technical<br />

conferences.<br />

Source: Charlene Perrin<br />

IPC held a sold out exhibition, showcasing 479 exhibitors and their<br />

innovating products, which makes it one of the largest shows<br />

since it was first launched in 2000. Across 43 countries, 9,169 professionals<br />

from the electronic manufacturing industry came together<br />

to exchange knowledge and ideas. On the very first day of<br />

the show, there was a 22 % increase in attendance than the previous<br />

years. Visitors were exposed to new products, training and<br />

education, as well as, networked with industry professionals.<br />

Not just a regular trade show<br />

Continuing with its past successes, buzz sessions, keynote speaker<br />

presentations, management programs, design forums, technical<br />

conferences, and professional development courses occurred<br />

throughout the week. Within this educational portion of the show,<br />

visitors were able to gain further knowledge on today’s trends and<br />

new developments throughout the industry. This included buzz<br />

sessions on Industry 4.0 and e-textiles, as well as, programs on designing<br />

for manufacturing, reliability, and assembly. There were also<br />

lectures and presentations on a variety of topics, including solder<br />

joint reliability, advanced rework, and electronic assembly reliability.<br />

“When I spoke with exhibitors and attendees at this year’s show,<br />

feedback was resoundingly positive. Attendees said that networking<br />

and educational events and activities helped them find new<br />

ways to solve challenges; the exhibition provided them the opportunity<br />

to meet suppliers that could help them save time and money,<br />

and foster new business opportunities,” said John Mitchell, President<br />

and CEO.<br />

Awards based on its value in the industry<br />

Given to the most innovative companies and products, Innovations<br />

Awards were awarded within the following categories: PCB design,<br />

PCB fabrication, assembly, test and inspection, as well as, services.<br />

The submissions were ranked based on the impact the product or<br />

software had within the industry and its value for customers. Out of<br />

12 <strong>EPP</strong> EUROPE May 2018


TRADE SHOWS + EVENTS<br />

IPC Apex 2018 started out with 20 % more attendees on its opening day.<br />

Source: Charlene Perrin<br />

the 32 participating companies, the Best of Innovation Awards for<br />

2018 went to:<br />

• DfR Solutions for the Sherlock Automated Design Analysis software,<br />

which improves reliability prediction, and increases product<br />

quality.<br />

• JBC Tools for its JCB Net, a software that manages and optimizes<br />

the soldering process.<br />

• Metcal for its Connection Validation Robotic Soldering system,<br />

which shows when a good joint is created and increases productivity.<br />

• Orbotech, Inc. for its Ultra Dimension, a 4-in-1 AOI solution system<br />

which includes pattern inspection, laser via inspection, Remote<br />

Multi-Image Verification (RMIV) and 2D metrology.<br />

For the past several years, Apex has also had a technical paper competition<br />

where members of the Technical Program Committee selects<br />

the best paper based on its content, including the procedures<br />

and data used for its conclusion, as well as, writing professionalism,<br />

and its value to the industry. Out of over 100 submitted papers, this<br />

year’s winner was from Oracle and its topic covered copper foils.<br />

First look at industry’s initiative<br />

What marked the greatest highlight of this year, is undoubtedly the<br />

live demonstration on the show floor. Introduced for the first time,<br />

24 exhibitors took part in the Connected Factory Exchange Showcase.<br />

To continue to grow within Industry 4.0, communicating<br />

throughout the entire manufacturing process, as well as, being able<br />

to use large amounts of data are challenges that need to be surpassed.<br />

The CFX Factory Connectivity standard is a free data and<br />

control method used to communicate across the entire process.<br />

This includes machines, sensors, software, etc.<br />

Also known as IoT electronics network, EMS and OEM manufacturers,<br />

suppliers, and vendors allowed visitors of the show to see<br />

machine data in real-time. Right after scanning a QR code with a cell<br />

phone, visitors were able to access analytical reports and live machine<br />

activity data, which was connected via the CFX cloud server.<br />

Never before seen, the floor demonstration introduced this standard<br />

to everyone on a firsthand basis. This is just the beginning of<br />

this initiative, and what a great beginning it was.<br />

www.ipcapexexpo.org<br />

New products and innovations were introduced,<br />

where visitors could get a firsthand look.<br />

Next year, IPC Apex Expo will take place at the end of January<br />

at the San Diego Convention Center in California.<br />

Upcoming shows<br />

IPC Apex has already been set for<br />

the next 4 years:<br />

• 2019: Jan. 29-31<br />

• 2020: Feb. 04-06<br />

• 2021: Jan. 26-28<br />

• 2022: Jan. 25-27<br />

Source: Charlene Perrin<br />

Source: Charlene Perrin<br />

<strong>EPP</strong> EUROPE May 2018 13


TRADE SHOWS + EVENTS<br />

Digitization and connectivity revolutionized lighting design<br />

Source: Luger Research e.U.<br />

Source: Luger Research e.U.<br />

2000 experts in light technology will meet at the LpS 2018 to discuss the latest<br />

t trends in LEDs, OLEDs, thermal management, luminary design, etc.<br />

These two events are dedicated to bridging the gap between technologies and<br />

applications with exhibitions, lectures, workshops, and more.<br />

Every sector has been affected by the evolution<br />

of technology that has taken place in<br />

the last decade. In lighting, this evolution has<br />

become a revolution, taking us from the use<br />

of phosphors, through LEDification and onto<br />

the current-day connected, smart solutions<br />

that open the sector to a world of potential.<br />

Lighting technologies, and their development<br />

and application have never needed to be<br />

more agile, market aware and reactive to<br />

keep up with the changes. This need for fast<br />

and accurate investment and decision-making<br />

makes the LpS event more relevant today<br />

than it has ever been before.<br />

This international symposium and exhibition<br />

has kept up with the rate of change that has<br />

taken place. Over the last 8 years, this <strong>Europe</strong>an<br />

lighting conference calls on experts to<br />

present their latest research, developments,<br />

and innovations for future technologies.<br />

LpS 2018 will see nearly 2000 leaders in light<br />

technology come together to share the latest<br />

updates for researchers and engineers in the<br />

fields of LEDs, OLEDs, drivers, controls, optics,<br />

thermal management, materials, standardization,<br />

testing, technology trends, and<br />

luminary design. This year, the focus will not<br />

only be on the technologies; but also the<br />

multiple knock-on-effects created by this<br />

boom in development. Specialists in cyber<br />

security, miniaturisation, the human centric<br />

approach, productivity, manufacturing and<br />

economics will also be welcome.<br />

Another event that was successfully<br />

launched last year is the Trends in Lighting<br />

(TiL) conference. A combined 1800 delegates<br />

joined light experts from international companies<br />

including Zaha Hadid Architects, Amazon,<br />

Philips Lighting, Osram and Zumtobel<br />

Group. Today, lighting designs must adopt a<br />

human centric approach. Designs for smart<br />

buildings and cities must be agile to keep up<br />

with rapidly changing user behaviors and<br />

new functionality requirements.<br />

This year, the event returns with a focused<br />

ambition, it is dedicated to bridging the gap<br />

between technologies and design, to reinvigorate<br />

concepts of lighting designers, architects,<br />

engineers, consultants, planners and<br />

investors so they can realize the potential<br />

and value of lighting design. By bringing together<br />

innovators and industry leaders, this<br />

event will inspire attendees to build a future<br />

for lighting design that is relevant and secure.<br />

Both events are organized by Luger Research<br />

e.U., and will take place on September<br />

25–27, 2018 in Bregenz.<br />

www.led-professional-symposium.com ,<br />

www.trends.lighting<br />

Reaching out to students on career day<br />

TopLine will attend the Georgia College and<br />

State University (GCSU) career day on March<br />

7, 2018, for the 10 th time, to support students<br />

in the field of Science Technology Engineering<br />

and Mathematics (STEM) studies.<br />

GCSU has a growing number of students pursuing<br />

an education in STEM studies at the<br />

Milledgeville, GA campus, near the company’s<br />

east coast headquarters. Martin Hart,<br />

CEO, states that “We are particularly interested<br />

in supporting students pursuing majors<br />

in Chemistry, Physics and Biology with internships,<br />

scholarships and work-study programs<br />

in 2018 and beyond. We want to meet<br />

students early in their educational careers.“<br />

Hart noted that selected students will be offered<br />

jobs at the company to round out their<br />

understanding of the electronics components<br />

industry on a real-time, hands-on<br />

basis. “We want to challenge students to put<br />

their STEM educations to the test by being<br />

bold, thinking big, and staying local in the<br />

greater Milledgeville area, an area that includes<br />

Macon and Robins Air Force Base,” he<br />

added. “Our mission and responsibility is to<br />

provide solutions to customers that enable<br />

them to do things better; thus advancing the<br />

frontiers of all that is possible.”<br />

The company participates in a community<br />

with global interdependencies, Hart emphasizes,<br />

and he believes that just one person<br />

has the potential to positively affect many,<br />

even a continent away. “Each day, our employees<br />

are energized by helping others and<br />

improving our world,” he concludes.<br />

SMT Hybrid Packaging, Booth 4A-120<br />

www.topline.tv<br />

TopLine will attend GCSU’s career day, because<br />

they believe in meeting students early in their<br />

education careers.<br />

Source: TopLine Corporation<br />

14 <strong>EPP</strong> EUROPE May 2018


Electronics industry succeeds at the velocity of technology<br />

It was all business at IPC Apex Expo 2018 as<br />

9,169 electronics manufacturing professionals<br />

from 43 countries came to San<br />

Diego. In addition to experiencing a 22 % increase<br />

in first-day show floor attendance,<br />

Apex hosted a sold-out exhibition: 479 exhibitors<br />

showcased cutting-edge products<br />

and services on 149,700 net square feet,<br />

making it the largest exhibition in a decade.<br />

And with more than 80 % of the 4,574 attendees<br />

identifying themselves as key buyers or<br />

influencers, the exhibitors at North America‘s<br />

largest electronics assembly event enjoyed<br />

three days of qualified leads, business development,<br />

and brisk sales.<br />

In keeping with the event’s theme, “Succeed<br />

at the Velocity of Technology,” it featured<br />

nearly 100 technical papers detailing original<br />

research and innovations. Attendees had access<br />

to research on materials and processes,<br />

opportunities to learn more about trending<br />

materials, applications and processes such<br />

as Industry 4.0 (including a live demonstration<br />

on the show floor by more than two<br />

dozen exhibitors using CFX standard) and<br />

e-textiles.<br />

The show‘s professional development<br />

courses had electronics industry topics with<br />

hot-new developments, delivered by corporate<br />

technologists, training center staff and<br />

university faculty. Attendees chose from<br />

leading topics such as: PCB fabrication troubleshooting;<br />

dispensing/jetting; printing;<br />

manufacturing yield, defect analysis, failure<br />

analysis; reliability and design for excellence<br />

(DFX).<br />

“When I spoke with exhibitors and attendees<br />

at this year’s show, feedback was resoundingly<br />

positive. Attendees said that networking<br />

and educational events and activities<br />

helped them find new ways to solve challenges;<br />

the exhibition provided them the opportunity<br />

to meet suppliers that could help<br />

them save time and money, and foster new<br />

business opportunities,” said John Mitchell,<br />

President and CEO. “Overall, I am proud of<br />

everything we accomplished in San Diego, I<br />

am equally as invigorated with everything we<br />

Source: IPC— Association Connecting Electronics Industries<br />

APEX Expo‘s ribbon cutting ceremony, officially<br />

opening the show to visitors.<br />

will do in the rest of the year. We are already<br />

working on putting together next year’s<br />

show, and look forward to our industry’s continued<br />

support in making IPC Apex Expo<br />

2019 a success.”<br />

Next year, the show will return on January<br />

26–31, 2019.<br />

www.ipc.org<br />

BUILDING THE COMPLETE<br />

PICTURE IN ELECTRONICS<br />

PROTECTION<br />

When it comes to protecting electronics<br />

from their operating environment,<br />

no other company does more to build<br />

the complete picture.<br />

With a portfolio of products available<br />

globally from every chemistry and for every<br />

application you can trust HumiSeal to have<br />

the complete solution for your<br />

electronics protection.<br />

<strong>EPP</strong> EUROPE May 2018 15


TRADE SHOWS + EVENTS<br />

productronica was a hit<br />

Electronic industry continues<br />

to thrive in 2017<br />

2017 was a prosperous year for the electronics manufacturing industry, with an increase in production<br />

and manufacturing, as well as, innovations and new technology. Much the same can be said about<br />

productronica 2017: it was a great success.<br />

44,000 visitors from 85 countries attended the productronica 2017 trade show,<br />

which was a 20 % increase compared to the previous event in 2015.<br />

Taking place last November at the Munich trade fair, more exhibitors<br />

and visitors came from all around the world for networking<br />

and learning opportunities. There was an astonishing 44,000 visitors<br />

from 85 countries, which was a 20 % increase compared to the<br />

previous event in 2015. Specifically, more visitors from Taiwan, U.S.,<br />

France, and the Netherlands, attended than ever before. The market<br />

research Institute Gelszus survey stated that 97 % of visitors rated<br />

this trade show with a satisfaction rating of good to excellent. There<br />

were also 1200 exhibitors from 42 countries demonstrating products<br />

and cutting-edge technology. That means, 160 more exhibitors<br />

attended and demonstrated in this show.<br />

Throughout all 7 halls, there was an exciting atmosphere with a<br />

positive morale. The main topics and discussions of all booth visits<br />

were about the thriving market, the booming industry, and how<br />

positive the future is looking. In a video interview with <strong>EPP</strong>, Falk<br />

Senger, Managing Director of Messe München, pointed out the<br />

popular central trends that were heard throughout the show. He<br />

mentioned miniaturization, digitalization, as well as, Smart Factory,<br />

IoT, big data, and Industry 4.0.<br />

Source: Charlene Perrin<br />

Smart Factory roundtable discussion<br />

Along with an increase in attendance, there were a variety of different<br />

opportunities to be up-to-date with new products, technologies,<br />

and developments. This included the Industry 4.0-Smart Factory<br />

roundtable discussion, with 4 participants having interesting insights<br />

on the future of production and how to involve employees<br />

within an automated manufacturing line. The panel consisted of<br />

Stephan Baur (BMK Group), Dipl.-Ing. Petra Foith-Förster (Fraunhofer<br />

Institute IPA), Dr.-Ing. Friedrich W. Nolting (Aegis Software),<br />

Florian Ritter (Asys Group), with Markus Strehlitz (on behalf of <strong>EPP</strong><br />

magazine) as the moderator.<br />

Industry 4.0 has now been around long enough that not only has it<br />

attracted other trends, for instance, big data, digitization, internet of<br />

things, traceability, etc. clear benefits can now be seen and<br />

measured. Zero defect production can be reached due to being able<br />

to find mistakes sooner, and in many cases, before they actually<br />

happen. With machine to machine communication, as well as, having<br />

real time data available to operators, being able to react appropriately<br />

to any problems or changes is important. This does not only<br />

bring faster production time, but it also brings better quality and security<br />

of products. As popularity for this trend grew, however,<br />

requirements needed to be adjusted in order to reach the end goals<br />

set by manufacturers.<br />

Employee involvement and how to connect automated production<br />

with all employees has been a challenge for most. Here the speakers<br />

agreed that solutions to this issue need to start from the early<br />

education of the employee, in order to prepare them for the future<br />

of what Industry 4.0 will bring. Collaboration with other companies<br />

The Industry 4.0-Smart Factory roundtable discussion took place with 4<br />

participants giving interesting insights on the future of manufacturing<br />

for the electronic industry.<br />

Source: Doris Jetter<br />

16 <strong>EPP</strong> EUROPE May 2018


The next productronica<br />

show will<br />

take place in 2019<br />

in Munich from<br />

November 12 th<br />

to the 15 th .<br />

Source: Charlene Perrin<br />

Source: Charlene Perrin<br />

Miniaturization, digitalization, Smart<br />

Factory, IoT, big data, and Artificial<br />

Intelligence were among the important<br />

topics that were discussed.<br />

Source: Charlene Perrin<br />

There were a total of 1200 exhibitors from 42 countries, which means<br />

there were 160 more than the previous show.<br />

Source: Charlene Perrin<br />

and institutes is also what can help to build the future of the industry.<br />

Artificial Intelligence is also an important topic for Industry 4.0., although<br />

the participants agreed that it is only the beginning. They<br />

also agreed that limitations will most likely have to be set for AI, in<br />

terms of how far it will be taken. For instance, it will most likely not<br />

take over the entire production line, but instead aid with smaller<br />

tasks and problems. There has been a lot of changes since Industry<br />

4.0 has first been introduced, which can only mean that the future<br />

will definitely bring further developments and improvements for the<br />

electronic manufacturing industry.<br />

Special events and more<br />

Continuing its previous success, innovation awards were given to<br />

companies within 6 different clusters: PCB & EMS (Nano Dimension),<br />

SMT (Juki Automation Systems), Semiconductors (LPKF<br />

Laser & Electronics), Cables, Coils & Hybrids (Komax), Future Markets<br />

(Acculogic), and Inspection & Quality (Viscom). With approximately<br />

60 submissions, these companies were chosen due to their<br />

reliable, sustainable, and innovative products. Along with this event,<br />

the hand soldering competition, special show “cleanroom” with live<br />

demonstrations, and “Hardware Data Mining” virtual learning<br />

course also occurred.<br />

Semiconductor show alongside<br />

Alongside the productronica show, Semicon Europa made its first<br />

debut and was directly successful. Focusing on the semiconductor<br />

production, this show connected key individuals together to discuss<br />

new market developments, as well as, to provide insights on trends<br />

in the automotive and mobile communication sectors. More specifically,<br />

a Material Conference was held that presented visitors with<br />

the latest innovations dealing with Internet of Things products and<br />

applications. This year, this show will take place at the same time as<br />

electronica 2018, from November 13 th to the 16 th , 2018.<br />

As productronica and electronica alternate every year, the next productronica<br />

show will occur in Munich from November 12 th to the<br />

15 th , 2019.<br />

www.productronica.com<br />

<strong>EPP</strong> EUROPE May 2018 17


COVER<br />

SMT Hybrid Packaging 2018 show will take place June 5-7, in Halls 4A, 4, and 5.<br />

Source: Mesago/Thomas KLerx<br />

The heart of the electronic industry in Nuremberg<br />

SMT Hybrid Packaging 2018<br />

Every year, the electronic manufacturing industry gathers in Nuremberg, Germany, to demonstrate<br />

and see new trends, developments, products, and solutions. The SMT Hybrid Packaging 2018 show<br />

will take place from the 5 th to the 7 th of June, in Halls 4A, 4, and 5.<br />

Over 400 international companies will exhibit from the entire value<br />

chain, including technology and processes, materials and components,<br />

manufacturing equipment, reliability and testing, software<br />

and systems, and more. Exhibitors will have the chance to experience<br />

the entire production of electronic assemblies, from the beginning<br />

idea stage to the end of the final product.<br />

Obtain comprehensive knowledge<br />

Conferences, lectures, panel discussions, and vendor presentations<br />

will also take place. The main focus for the conferences are basics,<br />

technologies and processes, reliability, test, analysis, and innovations<br />

& trends. English practical training tutorials will also be available<br />

throughout the week, which include experiences, case studies,<br />

and activities by experts in the industry. There is the possibility to attend<br />

1.5 hour short training courses, or 3 hour long sessions, giving<br />

plenty of time for questions and conversation. These cover a variety<br />

of topics including, design, assembly, and rework guide on Land<br />

Grid Array (LGA) and Quad Flat No-lead (QFN), as well as, failures of<br />

Printed Circuit Boards and how it can be fixed. Thermal management<br />

concepts and conformal coating technologies will also be addressed.<br />

The discussions and presentations will incorporate trending themes<br />

that have occurred throughout the electronics industry. These include,<br />

micro molding, video simulation, inspection systems, Smart<br />

Factory, low temperature soldering, and lead free alloys. Artificial intelligence<br />

is also an important topic that will be discussed, as well<br />

as, the difficulties of advanced packaging in manufacturing.<br />

Highlights and live tours of the show<br />

A few highlights will take place this year at the international exhibition<br />

and conference for system integration in micro electronics<br />

show. There will be a live production line with a guided tour, which is<br />

called: “Smart Motion: Intelligent automation for e-mobility and robotics”.<br />

Once a day, this future packing line will have an English tour.<br />

At the booth 5–434, visitors will be able to experience a live produc-<br />

18 <strong>EPP</strong> EUROPE May 2018


Source: Doris Jetter<br />

tion line that will simulate actual conditions of a production.<br />

With over 30 exhibitors participating, viewers will<br />

get a firsthand look of the operating process and how the<br />

machines effectively work together, as well as be able to<br />

ask questions and have discussions with experts. The exhibitors<br />

that are part of the line include machine manufacturers,<br />

research institutes, component suppliers, and<br />

software providers. This highlight is way to show how<br />

well the industry can work together in order to achieve<br />

Smart Factory and Industry of Things. This particular line<br />

is based on an IoT toolkit to find solutions and fulfill all<br />

types of needs that clients and customers may have.<br />

There will also be a hand soldering competition, where<br />

the 1st place winner will win a cash prize, as well as,<br />

have a chance to compete in the World HSC Championship<br />

in San Diego, California in 2019. This competition is<br />

for manual soldering experts to compete against one another<br />

based on their soldering skill, speed, and precision<br />

on complex print circuit boards. This year, the show will<br />

also introduce for the first time a hand soldering competition<br />

for beginners. Competitors will be judged based on<br />

the same qualifications as the expert competition, however<br />

the test will be adapted to a level for beginners.<br />

The last highlight for this year’s show is the joint stands,<br />

which includes 4 groups with different topics covered in<br />

each. The groups are divided into following categories.<br />

The first is the “Mixed Double -- PCB meet components”,<br />

which is located in the special interest area in Hall 5. Five<br />

companies will display products and solutions for the<br />

PCB industry, including circuit boards, modules, and materials.<br />

The second is “Optics meets electronics”, which is<br />

aimed towards optoelectronics products and solutions.<br />

At Booth 4A-410, three exhibitors will focus on automotive<br />

communications, optical sensors, analysis and detection,<br />

and process management. The third is “EMS intersection”,<br />

which is mainly for contract manufacturers. At<br />

Booth 5–223, eight companies will focus on hardware<br />

and software for electronic design and development, repair<br />

services, THT assemblies, and more. The last is the “Newcomer<br />

Pavilion”, which was introduced for the first time at last year’s show.<br />

Five companies will display their products and solutions in Booth<br />

4–429. Only available for first time exhibitors, it gives great benefits,<br />

Over 400 international companies will be exhibiting new products and<br />

solutions this year.<br />

Source: Doris Jetter<br />

Have an interview at Booth 4-140 with us, set up an appointment today!<br />

including being introduced to the show and having great networking<br />

opportunities with the industry.<br />

Simultaneous show<br />

PCIM <strong>Europe</strong> will also take place simultaneously in Halls 6, 7, and 9.<br />

This show focuses on power electronics, intelligent motion, renewable<br />

energy, and energy management. Taking place in three exhibition<br />

halls, visitors will get a glimpse of trends and innovations on<br />

power semiconductors and components. This includes thermal<br />

management technologies, sensors, e-mobility applications, and<br />

more.<br />

Don’t forget to stop by and say hello at the <strong>EPP</strong> and <strong>EPP</strong> <strong>Europe</strong><br />

Booth 4–140. We will also be conducting interviews with the experts<br />

of the industry over trends, new products and innovations,<br />

and more. If you would like you and your company to take part, sign<br />

up here for a free interview in English or German: http://interview.<br />

konradin.de/dates/app_smt2018_en.<br />

www.mesago.de/en/SMT/home.htm<br />

<strong>EPP</strong> EUROPE May 2018 19


ADVERTORIAL<br />

APPLY OUR EXPERTISE TO<br />

YOUR PRINTING PROCESS<br />

Innovative Precision Tools from the Technology Leader:<br />

Optimizing paste release behavior – PLASMA Coating<br />

Compensating for height differences – 3D and Step Technology<br />

Offering a high yield and long service life – CK Nanovate Nickel<br />

Know-how Quality Experience Reliability<br />

Progressing miniaturisation of SMD components continues<br />

to increase the demands on stencil manufacture. The<br />

release properties of the apertures have a decisive impact<br />

on the printing process.<br />

During laser cutting, melting residues are formed on the stencil<br />

surface and the inner walls of the openings. Such changes<br />

in the material are the cause of unclean deposits in many<br />

applications, particularly in the fine pitch area. We recommend<br />

that our customers make use of in-depth advice beforehand<br />

based on the layout to ensure that the right surface technology<br />

is chosen.<br />

Hall 4A, Booth 320<br />

The technology of the PLASMA<br />

stencil ® features several vital<br />

characteristics. Significant ly<br />

im proved release properties<br />

can be seen, in particular in<br />

fine struc tures and apertures.<br />

The metal stencil provides a<br />

measur ably more consistent<br />

per formance.<br />

The PLASMA coating reduces the adhesion of print media and<br />

makes cleaning significantly easier. Production output and firstpass<br />

yield are increased.<br />

Overall, when evaluating the condition of the stencil based<br />

on the paste volume, the stencil life is significantly prolonged.<br />

Volume transfer onto the pads is also increased.<br />

20 <strong>EPP</strong> EUROPE May 2018


States of matter and phase transitions; Source: Christian Koenen GmbH<br />

Result: The characteristics of the PLASMA stencil ® improve the<br />

printing process significantly and increase the performance of<br />

the manufacturing line.<br />

Advantages of CK PLASMA Coating:<br />

• Improved release behavior<br />

• Greater process safety<br />

• Smooth inner walls, even without electro-polishing<br />

• High chemical resistance<br />

• High mechanical resistance<br />

CK Nanovate<br />

Nickel extends<br />

stencil service life<br />

New, innovative stencil materials are essential when it comes<br />

to keeping up with miniaturization from a manufacturing engineering<br />

perspective. Over the past few years, more and more<br />

research and development has focused on stencil materials,<br />

with nickel coming out as a promising option. CK Nanovate<br />

Nickel is a proven product in the field of aeronautics.<br />

Extensive tests were carried out in the Application Center to<br />

begin with. A number of customers are now already using<br />

the material and ongoing test phases are producing excellent<br />

results. Above all, finer grain sizes and enhanced laser cutting<br />

behavior make for excellent paste-release properties, leading<br />

to higher yields and lower costs. Sharper cutting edges on<br />

the PCB-side result in far better sealing of the print deposits.<br />

Stencil life is significantly prolonged due to improved hardness<br />

and ductility, while uneven boards do not risk bending<br />

the stencil. The new high-tech stencil material CK Nanovate<br />

Nickel is suitable for specialist applications and is an excellent<br />

addition to our existing product portfolio.<br />

CK Nanovate Nickel – outstanding material<br />

properties:<br />

• More consistent printing performance<br />

• Improved paste release properties<br />

• Optimized printing depot sealing properties<br />

• Enhanced self-cleaning effect<br />

• Increased tool life<br />

• Shape retention in high runner applications<br />

• Increased process reliability<br />

Profile<br />

Stepped Stencils keep a firm<br />

grip on the SMD welding paste<br />

Stepped Stencils have become increasingly important in<br />

electronic assembly production. They are used whenever the<br />

applied paste quantity can no longer be adequately regulated<br />

by modifying the apertures.<br />

Another area of application comes in the compensation of<br />

height differences on the board surface, which can result<br />

e.g. from labels or excessively high via-hole pluggings. Height<br />

differences are compensated for by recesses on the underside<br />

of the SMD stencil, preventing unintended snap-off and<br />

subsequent print smearing.<br />

Headed up by Christian Koenen, the Munich-based company is the<br />

<strong>Europe</strong>an technology and market leader when it comes to manufacturing<br />

high-precision metal stencils and precision screens for technical<br />

printing. Due to the increasing miniaturization of components and their<br />

more varied use on ever smaller surfaces, customers need an overall<br />

package that meets their performance requirements. Our long-established<br />

company has always placed special value on quality, precision<br />

and service – A high quality standard visible at every one of our sites.<br />

The stencils and screens exhibit an extraordinary level of precision.<br />

This accuracy allows customers to enjoy larger process windows<br />

for production als well as cost savings and increased efficiency.<br />

<strong>EPP</strong> EUROPE May 2018 21


ADVERTORIAL<br />

No need to fear<br />

artificial intelligence in<br />

electronics production<br />

We are living in a world increasingly marked by digitalisation and networking. This development<br />

is also filtering through into production areas previously shaped by the implicit<br />

expertise and experience of individual employees. The demand for reduced reliance on<br />

these leads to the deployment of new technologies. Assistance systems play a major role<br />

here, supporting production staff in their decision-making.<br />

In the production of electronic assemblies, the quality of the<br />

final product is dependent not only on the processes in the<br />

production line itself but also, to a major extent, on the quality<br />

of printed circuit boards, components and process materials.<br />

These factors are subject to manifold reciprocal effects. As a<br />

rule, an understanding of the interrelated processes is the implicit<br />

knowledge of the employees who have acquired it by<br />

experience in the course of their working lives. Only a very<br />

small proportion of this knowledge is explicitly recorded in the<br />

form of working instructions or technical reports.<br />

Conversely, this fact means that quality in electronics manufacturing<br />

relies on individual employees. In the worst case,<br />

valuable knowledge is lost when they leave the company. Because<br />

this form of dependency is simply not acceptable, industry<br />

has long been calling for further validation and process<br />

support measures to assist staff, in parallel with the existing<br />

process monitoring in the individual systems.<br />

Stencil printing and 3D SPI<br />

The VERSAPRINT 2 series is the new<br />

generation of stencil printers from<br />

Ersa, based on the proven concept<br />

of the VERSAPRINTseries. Modern<br />

drive technology with encoders<br />

enhances control and verification of positioning processes<br />

on all process relevant axes. The VERSAPRINT 2 models are<br />

equipped with modern camera technologies for fast setup<br />

and integrated 100% inspection of the print area.<br />

The VERSAPRINT 2 ULTRA³ model uses the very latest<br />

measuring technology provided by the 3D-LIST camera. The<br />

shape of the smallest solder paste depots plays a major<br />

role in the printed volume and ultimately for the shape of<br />

the solder connection. Is the height of the paste depot<br />

consistent or does it drop towards the edges? The ULTRA³<br />

can answer this question for you. It is both a stencil printer<br />

and 3D-SPI in one. It can also be upgraded or retrofitted<br />

with all the options of the VERSAPRINT 2 series.<br />

A production line for the manufacture of SMT components is<br />

always structured according to the same scheme. The first step<br />

is the solder paste printing, followed by the component placement<br />

and then the reflow soldering process. The individual process<br />

steps can be easily monitored. Solder paste volumes,<br />

placement offset and the thermal processes in the reflow systems<br />

are physical factors which can be measured relatively easily.<br />

On the other hand, there are non-measurable factors, such<br />

as the wettability of PCB surfaces and components. If a supposed<br />

"soldering defect" occurs in the form of an open soldering<br />

joint, it cannot be directly assigned to one process in the line.<br />

This is where the networking comes in. The error’s location is<br />

linked with the component type, the layout and the product.<br />

Now, when the AOI data is compared with the component type,<br />

the layout and the error frequency for other products, interesting<br />

details can be analysed. The statistical inference permits<br />

conclusions on how the layout, the component and the product<br />

influence the error. With this data at hand, determining the<br />

cause of the error is easier as the observation period extends<br />

beyond the faulty product and the line. The same process also<br />

applies for wave and selective soldering. Here it is the approach<br />

to the solder bead issue which makes networking and analysis<br />

of product-specific errors particularly interesting.<br />

It makes sense to turn around the "learning from your mistakes"<br />

approach. Today, the error rates in electronics manufacturing<br />

lie in the low double-figure ppm area. With an error rate as<br />

low as this, software-based AI systems cannot extrapolate<br />

data for a learning process. For this reason, the quality of the<br />

processed material is documented and then, using the diverse<br />

data and a process of elimination, conclusions can be drawn<br />

on possible causes when faults occur.<br />

Many employees take a critical view of this development: they<br />

fear that their jobs will be taken by systems based on artificial<br />

intelligence. These fears are unfounded, as intelligent assistance<br />

systems are primarily a tool for staff. The analysis of<br />

large volumes of data is a piece of cake for today’s computer<br />

systems. They allow analyses to be generated wich provide a<br />

high level of transparency regarding the entire manufacturing<br />

process, and the materials processed. This transparency is<br />

very important, contributing greatly to the acceptance of the<br />

22 <strong>EPP</strong> EUROPE May 2018


Integrity check prior to the soldering process with VERSASCAN<br />

VERSAFLOW 4 selective soldering<br />

platform in modular design with unique<br />

flexibility and assistance systems<br />

decisions made by or suggestions provided by the assistance<br />

systems.<br />

A further advantage of AI systems is that, unlike humans, they<br />

always take the same decision. For humans, decisions are<br />

often subject to influencing factors – form on the day, stress<br />

levels, personal wellbeing, too little sleep, and so on. These<br />

influencing factors do not apply for AI systems.<br />

CAD Assistent 4 – Modern 3D printed circuit board formats for simple programming<br />

Intelligent assistance systems in harmony with experienced staff<br />

are an optimum symbiosis when it comes to enhancing quality.<br />

A look is taken at the influence of new technologies in the<br />

area of process optimisation as well as the associated benefits.<br />

Exciting scenarios describe future developments and<br />

provide food for thought on cross-sectoral implementation.<br />

Assistance systems make a major contribution; they are to be<br />

seen as an opportunity for staff, not as a threat.<br />

Developments in <strong>Europe</strong>’s industrial landscape are fundamentally<br />

dependent on the competitive capacity of the companies.<br />

Regardless of whether they operate locally or globally, under<br />

today’s boundary conditions as dictated by the world market,<br />

far-sighted orientation and a high degree of innovative power<br />

and willingness are indispensible. Only with constant innovations<br />

will it be possibly to safeguard medium-term and longterm<br />

company success.<br />

As an SME in the machine engineering sector with a tradition<br />

going back many years, it is our duty to support our customers<br />

in their production processes, to optimise their quality,<br />

costs and delivery service through our technological lead and<br />

our innovative power.<br />

Intelligent assistance systems are an important detail; on the<br />

basis of extensive datasets, they support our customers in<br />

their decision-making processes.<br />

We look forward to interesting discussions and a spirited exchange<br />

of information at SMT Hybrid Packaging in Nuremberg,<br />

and wish visitors constructive contact with our experts to successfully<br />

advance the projects which will secure their future.<br />

Documentation and generation of QA data with VERSAEYE<br />

Ersa – Electronics Production Equipment – As the largest manufacturer<br />

of soldering systems, we look after connections in the electronics<br />

industry around the world.<br />

Ersa is one of the worldwide largest suppliers in the area of soft<br />

soldering and possesses the most comprehensive range of services<br />

under one corporate umbrella. The engineers at Ersa have set<br />

themselves the task of adapting their products, production processes<br />

and complete solutions to the constantly-changing demands in joining<br />

technology.<br />

In the area of soldering machinery, Ersa offers solder paste printers<br />

and reflow ovens as well as wave and selective soldering systems.<br />

The range on offer in the hand-soldering sector extends from<br />

the proven soldering irons to intelligent soldering stations and<br />

fully-automatic repair stations for soldering and<br />

desoldering a diverse range of components.<br />

More about Ersa<br />

P r o f i l e<br />

<strong>EPP</strong> EUROPE May 2018 23


ADVERTORIAL<br />

Creating a Smart Factory<br />

Optimize production with<br />

M2M communication<br />

Built on the principles of Industry 4.0, the fully realized Smart Factory is linked with<br />

machines from other companies in M2M communication. As it is the market trend, all<br />

electrical devices want to be connected to a network with IoT and smart grids, and<br />

this will help to build a more sustainable society. The goal behind this is the auto mation<br />

of product changeover, printing and assembly process as well as maintenance and other<br />

tasks required for production. In addition, processes should be monitored to intervene<br />

where parameters must be changed.<br />

The demand for products is becoming increasingly diverse<br />

and complicated, through the globalization that has arisen<br />

in keeping with the times and changes in the market. The goal<br />

of Smart Factory is to provide autonomy that gives enough<br />

flexibility to support changes in user needs and to greatly increase<br />

productivity through further optimization.<br />

From our point of view, the Smart Factory process consists<br />

of the following three stages which will contribute to users<br />

achieving a truly Smart Factory:<br />

• Semi-automation<br />

By automating the work which is repeatedly performed manually,<br />

variance and waste in work will be eliminated and<br />

production activities will be kept stable<br />

• Automation<br />

Improving productivity and stabilizing quality are achieved<br />

through automating manual work and linking machines<br />

• Autonomization<br />

From the large volume of data, collected by the production<br />

system, rules and criteria standards as well as a growing<br />

production system are created in which optimum selections<br />

and decisions are made in cooperation with people<br />

Smart Factory Concept<br />

The Smart Factory will control four main areas and will make<br />

it so that there are no gaps between actual results and control<br />

indicators as well as production plans. This means that<br />

even there are changes in demands, production is ramped<br />

up and performed (real) according to the simulated plans on<br />

the computers (virtual). This is achieved with a quad closedloop<br />

system:<br />

• Engineering loop (design)<br />

– Optimize equipment configurations<br />

– Automatic production program creation<br />

– Automatic creation of production plans for multiple lines<br />

• Logistics loop (logistics)<br />

– Display the required items<br />

– Issue the required instructions when needed<br />

– Deliver the required volumes to the required locations<br />

– Minimize the production line downtime by reducing stops<br />

and waste due to stagnation<br />

• Process loop (manufacturing)<br />

– Entire SMT line management<br />

• Analytics loop (analysis)<br />

– Visualizing the quality built into processes<br />

– Dashboard supporting collaboration between<br />

people and automatic lines<br />

– Changing work styles to take advantage of IT<br />

greatly improves productivity<br />

Summary<br />

In order to contribute to making a smart factory<br />

for users, production companies had to expand<br />

the management area from just the placing<br />

machine system, which has been the focal point<br />

of the past, to the entire SMT line. This provides<br />

entire line optimization (horizontal integration).<br />

Furthermore, directly or indirectly linking to key<br />

user systems facilitates vertical integration<br />

between production management and manufacturing,<br />

and contributes to smarter manufac-<br />

24 <strong>EPP</strong> EUROPE May 2018


Supply chain management<br />

Provides valuable information to staff and assists in building knowledge<br />

Smart Factory roadmap<br />

the data for processes across entire lines, the furthering of<br />

automation for changeover, printing and assembly processes,<br />

maintenance and other tasks required for production, will in<br />

turn give birth to a new generation of manufacturing factories.<br />

In Smart Factory, all of the SMT processes are connected<br />

together and optimized. The area of wearable technology will<br />

continue to grow with smart devices (such as smartphones<br />

and tablets, watches, glasses, and even clothes) beginning to<br />

acquire advanced functions. The quantity of products available<br />

will greatly increase. As the development of automated guided<br />

technology progresses, the ratio of electronic parts and devices<br />

is going to greatly increase.<br />

turing where only what is needed is produced, when needed,<br />

only in the necessary volume, and within the determined lead<br />

time.<br />

Smart Factory mainly considers the manufacturing, which can<br />

reach the user’s quality cost and delivery goals as well as<br />

reducing the load on people to achieve a friendly working environment.<br />

It provides flexible support for diversified demands<br />

and changes in production technology as well as providing<br />

value added total solutions which suit user demands.<br />

Conclusion<br />

This lecture deals with the production in the most modern way<br />

and that machines from different manufacturers are networked<br />

in a Smart Factory via M2M communication. A production<br />

environment is created in which manufacturing plants<br />

and logistics systems are largely self-organizing and communicating<br />

together without human intervention.<br />

Statement<br />

In previous production management systems, individual<br />

machines were managed and optimized. By breaking down<br />

the walls which restrict enterprises to construct an environment<br />

with the freedom to connect openly, and by managing<br />

Since 1991, FUJI EUROPE CORPORATION GmbH has been a direct<br />

subsidiary of the Japanese FUJI CORPORATION, working on the<br />

<strong>Europe</strong>an market and based in Kelsterbach (Germany). As a strong and<br />

competent partner, FUJI EUROPE CORPORATION can look back on more<br />

than 27 years of best service and sales support in the area of electronic<br />

placement systems for full-line suppliers. With this wealth of experience,<br />

FUJI EUROPE CORPORATION can cover all areas of a modern production<br />

– from highly flexible placement systems in the high mix to complete<br />

assembly lines in the high volume.<br />

Innovative placement systems from the NXT- and AIMEX-series are the<br />

basis of your SMT requirements. Continuously new innovations bring<br />

Fuji always to the top of the market.<br />

More about FUJI EUROPE CORPORATION GmbH<br />

www.fuji-euro.de/en<br />

P r o f i l e<br />

<strong>EPP</strong> EUROPE May 2018 25


26 <strong>EPP</strong> EUROPE May 2018


<strong>EPP</strong> EUROPE May 2018 27


ADVERTORIAL<br />

The production location Germany for the electronics industry can only<br />

assert itself through quality and know-how.<br />

Preservation of the<br />

quality seal „Made in Germany“<br />

through optimized processes<br />

in smart factories<br />

We all know keywords such as: Industry 4.0, Smart Factory, Zero Defect Line.<br />

But very few companies have concrete approaches for implementation.<br />

This is essential for the preservation of the production location Germany.<br />

What prevents companies from becoming a smart factory?<br />

Most of the time it is the fact that they do not<br />

know how to start, what it costs and, most importantly, if it<br />

really benefits them.<br />

Nobody has time to give away, and in production everyday<br />

life, as the name implies, must be produced.<br />

However, if we focus only on the quantity of produced PCB,<br />

there is a big risk of missing the train to the „zero-defect<br />

line“.<br />

The biggest challenge in implementing process optimization<br />

tools is managing the huge amount of data that is generated<br />

by all assets. Therefore, the key is to convert collected data<br />

into useful information.<br />

Speaker:<br />

Tarak Charfi joined Vi TECHNOLOGY<br />

as Sales Director EMEA 3 years<br />

ago. After completing his dual<br />

studies in Germany and France,<br />

he started his career as a Sales<br />

Engineer at Keyence, a Japanese company for sensors,<br />

camera technology and microscopy. He became the<br />

position of Sales Director Northwest Germany after a<br />

few years.<br />

His focus at Vi TECHNOLOGY is the DACH region,<br />

where his team and himself are the direct contact<br />

persons for customers and interested companies.<br />

The quality advantage of german products through the<br />

concept of a zero-defect line can only be achieved if the inspection<br />

systems provide reliable information. The key is not<br />

to detect errors, but to prevent them in advance. In addition<br />

to being able to find all the faults without escapes, inspection<br />

systems must be very accurate in order to detect trends<br />

and trigger warnings before defects actually occur. In such a<br />

case, a high repeatability is not enough. The equipment must<br />

measure very accurately to feedback information to other<br />

machines (e.g., SPI to AOI or SPI to printer). Especially with<br />

highly variable processes, accuracy is the key factor to measure<br />

accurately the paste volume for small pads, as well as the<br />

offset for small components. When we see inspection equipment<br />

as ‚visible‘ measurement tools in SMT lines, the key<br />

component of the zero-defect line is the software that collects<br />

all the information, processes all the data, and provides useful<br />

feedback to the operators. With 100% control of all process<br />

steps and the need for data traceability, the amount of data<br />

generated by inspection systems is in creasing. The challenge<br />

of the zero-defect line lies in the software ability to transform<br />

data into relevant information.<br />

SIGMA Link, Vi TECHNOLOGY‘s web-based software solution<br />

provides a range of simple tools from programming to<br />

data analysis, delivering meaningful and useful information.<br />

The software solution paves the way to continuously improving<br />

process performance and translates SPI and AOI<br />

inspection data into useful process information. Based on a<br />

unified database and the correlation of inspection and image<br />

data, SIGMA Link provides easy diagnostics on the entire<br />

PCB manufacturing process and full traceability of data and<br />

images. For modern production sites SIGMA Link is the<br />

central component for connecting inspection systems with<br />

MES and paving the way for Industry 4.0.<br />

28 <strong>EPP</strong> EUROPE May 2018


Sigma Live: The detection of trends and live analysis of process data<br />

Sigma Review / Feed-forward: The power of data correlation between SPI and AOI<br />

Statement<br />

In the future, the competitiveness of electronics production<br />

in Germany will primarily be determined by the right quality<br />

management. Delivering better quality than countries like<br />

China, Hungary or Poland is becoming more and more difficult<br />

as the quality in these countries has increased enormously<br />

in the last years. Times when only the simplest products<br />

were made or copied in China are long gone. Therefore,<br />

it is important to continue the way to the zero defect line in<br />

the future. In addition to very precise machines, software<br />

plays an important role here. Obtaining important information<br />

about process control from many data and statistics is a<br />

first step towards Industry 4.0.<br />

Sigma Link: a powerful software suite that converts inspection data in important<br />

process information<br />

The next step is the standardization of interfaces across manufacturers<br />

and systems. Approaches such as the Hermes<br />

standard (in which Vi TECHNOLOGY also participates) are<br />

the first promising approaches to improve communication<br />

from machine to machine. For example, it is sufficient for<br />

traceability of PCB to read the data matrix code only at the<br />

beginning of the line. Then to forward it from machine to<br />

machine. Downtimes or errors due to a code that is difficult<br />

or impossible to read would thus be avoided.<br />

To protect Germany as a production location, we still have to<br />

go a step further. Uniform software for all systems and standards<br />

of formats to program the machines, evaluate the errors<br />

and analyse the data. The time required is thus minimized.<br />

The data is processed once, the printer, SPI,<br />

pick&place and AOI get all this data and can thus be programmed<br />

more easily. The Mycronic Group, which includes<br />

Vi TECHNOLOGY, will pursue this path in the future.<br />

German companies have to come up with a strategy for industrie<br />

4.0 today. Waiting too long will cost the existence of<br />

many companies. Selling only by giving high discounts already<br />

doesn´t work. But companies from Eastern <strong>Europe</strong> or Asia<br />

are also gaining in quality. Above all, german EMS can only<br />

survive if they can offer added value to their customers. The<br />

proof of having the process under control is a strong argument.<br />

The ability to show to their end customer already today<br />

that mistakes can not only be found but traced back to the<br />

source and stopped immediately is a way to keep up „made<br />

in Germany“.<br />

Vi TECHNOLOGY is a worldwide developer, manufacturer and supplier<br />

of a wide range of innovative inspection equipment and software<br />

solutions for PCB assembly. Vi TECHNOLOGY serves demanding<br />

market segments, such as telecommunications, consumer, computer,<br />

automotive, infrastructure, industry and medicine.<br />

With systems for solder paste inspection (SPI) and automatic<br />

optical inspection (AOI) as well as the associated software solutions,<br />

Vi TECHNOLOGY supports its partners in the definition of new<br />

quality levels of their production processes.<br />

Motivated and knowledgeable staff at offices near technology centers<br />

around the world provide customized solutions and world-class support.<br />

More about Vi TECHNOLOGY<br />

P r o f i l e<br />

<strong>EPP</strong> EUROPE May 2018 29


ADVERTORIAL<br />

Valuable data and images for attaining a stable process<br />

Total control with<br />

automatic in-line inspection<br />

Highly efficient defect detection is not the only capability that makes automatic<br />

inspection systems an indispensable element in electronics production.<br />

The information they deliver also helps optimize production processes.<br />

For electronics manufacturing companies, the generation,<br />

structured storage and systematic evaluation of huge data<br />

amounts have already been standard practice for several<br />

decades. One driving force for this is the traceability requirement<br />

that product liability concerns bring to bear – the<br />

mandate to be able to trace defective assemblies back to their<br />

manufacturer and, if need be, even to extend the search all<br />

the way back to the raw material supplier. Today, identifying<br />

and assigning liability to a culpable party is no longer of<br />

primary importance; instead, tracking down causes of defects<br />

and defining reliable measures to prevent their recurrence<br />

now take priority.<br />

Inspection data from the various inspection stages makes it<br />

possible to exactly retrace a production process – even down to<br />

each individual step – while the associated statistical process<br />

control is decisive in pointing out where in production specified<br />

limits have been exceeded. Moreover, indications can be derived<br />

from this information to provide the basis for improving the<br />

production process. For example, the PPM rate (parts per<br />

million), DPMO rate (defects per million opportunities) or firstpass<br />

yield assist in evaluating process quality. Big data, including<br />

inspection results, component names and other details,<br />

are merged with information from other machines in comprehensive<br />

databases and evaluations via extremely powerful<br />

interfaces.<br />

Paste print has an early and decisive influence on quality<br />

throughout the entire production process. The solder paste<br />

inspection system (SPI) measures the geometric properties of<br />

printed solder paste (surface, height variation, volume) and<br />

generates a machine-readable protocol that can be sent to the<br />

paste printer and/or the following placer as well as a higherlevel<br />

Manufacturing Execution System (MES). The printer needs<br />

this protocol information to derive measures for controlling<br />

quality (e.g., stencil offset correction or cleaning the stencil).<br />

The placer can use the information regarding actual position<br />

and height of the solder paste to adjust the component setting<br />

position and height. Viscom uses a<br />

proprietary interface, the Viscom<br />

Quality Uplink, to transmit images<br />

and data from the SPI system to<br />

other Viscom systems in the line<br />

and to the defect verification station<br />

at the end.<br />

To improve evaluation of critical points, e.g., additional AOI results can also be reviewed on a manual X-ray system.<br />

This demonstrates that today, machines<br />

constantly communicate with<br />

each other, detect process fluctuations<br />

in real time and automatically<br />

initiate appropriate countermeasures<br />

by applying control algorithms. Theoretically,<br />

it is possible to check placement<br />

by integrating an automatic<br />

optical inspection system (AOI) into<br />

the line after component placement<br />

and before the reflow oven; in this<br />

configuration, an additional search for<br />

missing components is only started<br />

when directed by the placer. In most<br />

cases, however, AOI systems are<br />

30 <strong>EPP</strong> EUROPE May 2018


Defect verification for several production lines can be centrally bundled to reach<br />

maximum efficiency in process control.<br />

Statistical process control with the Viscom vSPC software:<br />

Inspection results are presented in clearly structured diagrams<br />

that can be directly exported, e.g., for reports.<br />

the individual inspection stages as well as the collected image<br />

material are compiled into one report.<br />

In conclusion, this article has described existing data interfaces<br />

and automatisms which today are already used effectively<br />

to optimize processes. Anyone who uses inspection systems<br />

only to find defects is completely missing the bigger<br />

picture. Inspection systems must be used to identify defect<br />

causes, to prevent defects from emerging in the first place.<br />

Progressive advancements in miniaturization force the electronics<br />

manufacturer to achieve stable processes with consistently<br />

high first-pass yield through automated processes<br />

and efficient communication between machines.<br />

Viscom’s high-end 3D AOI system S3088 ultra gold<br />

only deployed after soldering in the reflow oven, primarily to<br />

inspect solder joints. Placement is also checked in this step.<br />

High-quality 3D AOI image acquisitions and other resources<br />

can be drawn on during defect verification.<br />

In any case, event logs should contain the identification<br />

number (ID) of the electronic assembly. The ID can be affixed<br />

either as machine-readable barcode, DMC code or RFID. If,<br />

e.g., an inspection system reports a critical defect, the corresponding<br />

assembly can be automatically blocked from all<br />

further production steps. Accidental reintroduction to the process<br />

is no longer possible.<br />

Depending on the complexity of the assembly and the end<br />

customer‘s requirements, AOI or in-line X-ray inspection systems<br />

(AXI) alone, or a combination of the two (AOI/AXI), can be<br />

deployed after reflow. If the 3D X-ray inspection discovers,<br />

e.g., gas inclusions (voids), adding in the SPI results can make<br />

a decisive contribution to improving the production process.<br />

The Viscom Quality Uplink offers the possibility of consolidating<br />

the data for each detected defect from all Viscom inspection<br />

systems integrated in the line into a VUPA protocol (Viscom<br />

Uplink Process Analyzer). Both the quality data determined in<br />

The Viscom AG is one of the world’s leading providers of automatic<br />

inspection systems for electronic assemblies. The model range reaches<br />

from high-performance 3D AOI systems for inspecting solder paste,<br />

placement and solder joints, to inspection systems for MID, wire bond<br />

and conformal coating inspections. The X-ray inspection area covers<br />

the complete bandwidth from microfocus X-ray tubes through offline<br />

inspection islands with μCT function, up to fully automated 3D in-line<br />

X-ray inspection. Viscom systems are technologically cutting-edge<br />

products and have been successfully applied around the world by<br />

well-known companies in the most widely varying branches – reaching<br />

from the automotive and electronics industries through aerospace<br />

technology, and up to the medical technology and semiconductor<br />

industries. With branch offices in <strong>Europe</strong>, Asia and the USA,<br />

as well as a tight network of representatives, Viscom is<br />

present around the globe.<br />

www.viscom.com<br />

P r o f i l e<br />

<strong>EPP</strong> EUROPE May 2018 31


PCB + ASSEMBLY<br />

PRODUCT UPDATES<br />

Fume extraction system concept with additional filter modules<br />

At the SMT show, fume extraction vendor units are capable of maintaining the required<br />

ULT AG will introduce a unique system concept.<br />

The ULT 200 unit series was not only capturing elements attached to the system.<br />

performance level, even if there are several<br />

renewed conceptually and technically, but However, the overall concept with a range of<br />

provides users with unrivaled benefits. accessories provides added value. It includes<br />

The 200 systems help to remove soldering a food switch, suction hoses, Y-tube pieces,<br />

fume (LRA series), dust and smoke (ASD sleeves, reductions and a bracket for extraction<br />

arm installations. The accessory range is<br />

series), as well as odors, gases and vapors<br />

(ACD series). The modularly designed units specifically designed for this series, showing<br />

can be equipped with additional filter modules,<br />

e.g. for higher amounts of air pollutants Visitors will get first-hand information on the<br />

economic and applicable benefits.<br />

or with activate carbon. A variable number of high flexibility of the system, as well as purchasing<br />

and maintenance cost savings.<br />

capturing elements, such as extraction arms,<br />

tubes or hoses can also be installed per unit. The fume extraction systems provide clean<br />

Enabling an automatic vacuum stabilization air in production processes. They protect employees,<br />

manufacturing plants and products<br />

and selectable pressure range, ideal extraction<br />

performance is guaranteed. This is also from hazardous airborne contaminants occurring<br />

during the utilization of laser ideal for several workplaces. Hence, the<br />

systems,<br />

The ULT 200 helps to remove soldering<br />

fume, dust, and smoke.<br />

soldering equipment as well as gluing, laminating<br />

and coating technologies. Designed<br />

for medium quantities of pollutants, the systems<br />

provide long filter life times, easy-tohandle<br />

and low-noise operation.<br />

SMT Hybrid Packaging, Booth 5–212<br />

www.ult.de/en<br />

Source: ULT AG<br />

Achieving Industry 4.0 digital factory operation<br />

Aegis Software, a provider of Manufacturing thered live from multiple machines and vendors<br />

across the entire show-floor, and made<br />

Execution Software (MES), will showcase<br />

their latest release of true Industry 4.0, digitalized<br />

MES software, FactoryLogix, at the straightforward metrics and analytic reports<br />

available to every visitor simply by looking at<br />

SMT tradeshow in Nuremberg, Germany. delivered to their mobile phones.<br />

The company will also be a key participant in The second element to achieve Industry 4.0<br />

the show-wide, live, IPC Connected Factory is to have MES software that is specifically<br />

Exchange (CFX) IoT demo.<br />

designed for Industry 4.0 and IoT technology.<br />

The achievement of Industry 4.0 digital factory<br />

operation requires three critical el-<br />

its latest release that has many functions, in-<br />

The FactoryLogix software is unique due to<br />

ements, all of which the company will have cluding the integration of Administrative<br />

at the show. The first is the introduction of Quality Management, which combines CAPA<br />

the IoT-based industry standard for the live (Corrective And Preventive Action) and FRAand<br />

secure exchange of data between machines<br />

and processes, IPC’s CFX. In its Eurorective<br />

Action System). Unlike in-process<br />

CAS (Failure Reporting, Analysis, and Corpean<br />

debut at the show, data will be ga- quality tools ensuring every product is<br />

shipped without defects, administrative<br />

quality automates corrections and continuous<br />

improvement procedures, so defects<br />

don’t occur in the first place. Together with<br />

the existing automated symptom and defect<br />

data collection and reporting capabilities,<br />

FactoryLogix provides a complete solution.<br />

The third critical element for Industry 4.0 is<br />

the understanding of the business case and<br />

operational goals that utilize the latest technology<br />

to its fullest extent. Experts in Industry<br />

4.0 for business and strategy will be available<br />

for discussions at the company’s booth.<br />

SMT Hybrid Packaging, Booth 4–150<br />

www.aiscorp.com<br />

Source: Totech <strong>Europe</strong> B.V<br />

The company will exhibit dry storage<br />

solutions for moisture sensitive devices<br />

at SMT.<br />

Innovative solutions for dry storage and floor life reset<br />

Along with Asys, Super Dry Totech will feature<br />

its dry storage solutions for moisture ing needs, will be shown. Incorporating the<br />

drying cabinet that adapts to storage and dry-<br />

sensitive devices at the SMT show. Designed<br />

to exceed IPC/JEDEC J-Std-033C, the be expanded without additional dry units<br />

U5000 Dynamic Dry Unit, the basic MSD can<br />

company’s cabinets can dehumidify to less needed, resulting in a cost saving of 50 %.<br />

than 0.5 % RH. This qualifies them to safely XSDR ‘Floor Life Reset Cabinets’ uses sensor<br />

technology and software that tracks the<br />

remove moisture, resetting floor life without<br />

oxidation, even at ambient temperatures. timing of 10 separate batches of components<br />

The MSD series, a<br />

being simultaneously reset per<br />

chamber. Two separate chambers,<br />

with their own dry-unit and heater<br />

allow for 2 different temperatures<br />

in the same cabinet, dehumidifying<br />

to less than 1 % RH.<br />

The XSDC series of cooling cabinets<br />

keeps all substances at a precise safe<br />

operating temperature with 4.0 traceability.<br />

With an internal temperature of 2 – 20 °C<br />

with low energy expenditure, they help slowdown<br />

the inter metallic growth.<br />

The robotically controlled, component handling<br />

and storage system, Dry Tower, will also<br />

be shown. Incorporating MSD technology<br />

and WMS-system capabilities, they can manage<br />

tens of thousands of reels and trays.<br />

The Super Dry XSDC long term storage cabinets<br />

are suited for long term storage of components.<br />

The U-5000 series dynamic drying<br />

unit reaches very reliable, low humidity values<br />

of


Chemistries to remove fluxes easily<br />

and efficiently<br />

Source: MicroCare Corporation<br />

The no-clean flux remover pen can clean adhesives, oil and grease,<br />

and doesn‘t leave any residue.<br />

MicroCare <strong>Europe</strong> bvba will<br />

showcase its electronics cleaning<br />

products at the SMT Hybrid<br />

Packaging Show in Nuremberg,<br />

Germany. These new circuit<br />

cleaners will help companies<br />

boost quality, enhance throughput<br />

and lower PCB production<br />

costs. They will also help clients<br />

meet ever-more stringent <strong>Europe</strong>an<br />

regulations.<br />

Amongst the new range of products,<br />

are three new flux-cleaning<br />

chemistries including the noclean<br />

flux remover, the RMA flux<br />

remover, and the water-soluble<br />

flux remover pens. Packaged in a<br />

pocket-sized, convenient pen,<br />

the highly effective cleaners<br />

have been developed to specifically<br />

remove fluxes easily and efficiently.<br />

The no-clean flux remover pen is<br />

formulated to remove no-clean<br />

fluxes and pastes quickly, leaving<br />

no residue, and has the advantage<br />

of also cleaning other contaminants<br />

like adhesives, oil and<br />

grease. It is also exceptional as a<br />

Source: MicroCare Corporation<br />

The ESD presaturated cleaning wipes<br />

remove flux residues, oils, fingerprints,<br />

grime and debris from PCB<br />

manufacturing surfaces.<br />

degreaser and general-purpose<br />

cleaner and boasts low Global<br />

Warming Potential (GWP) credentials.<br />

It is exempt from VOC<br />

regulations in most areas making<br />

it an ideal cleaning option during<br />

assembly.<br />

Visitors will also be introduced to<br />

the high-purity RMA flux remover<br />

pen, which contains an<br />

extra-strength formulation to<br />

help clean aged and baked-on<br />

flux which can prove difficult to<br />

remove. It easily penetrates and<br />

dissolves excess flux and removes<br />

ionic and non-ionic activators,<br />

drying residue-free.<br />

Completing the range is the<br />

economical Water-Soluble (OA)<br />

flux remover pen used to clean<br />

organic acid solders, pastes and<br />

fluxes. Featuring a slow evaporation<br />

rate, the product works effectively<br />

to remove baked-on flux<br />

residues.<br />

“Having received such a great response<br />

from visitors at IPC Apex<br />

Expo in San Diego, CA where we<br />

launched the products to the<br />

USA market, we are looking forward<br />

to showcasing our new and<br />

innovative cleaners to <strong>Europe</strong>,”<br />

said Scott Wells, General Manager<br />

<strong>Europe</strong>.<br />

“As well as the range of flux remover<br />

pens, we will introduce the<br />

new ESD presaturated cleaning<br />

wipes. The static-dissipative, lintfree<br />

wipes effectively remove<br />

flux residues, oils, fingerprints,<br />

grime and debris from ESD<br />

mats, tools, bins, tool racks,<br />

workbenches and other surfaces<br />

in a PCB manufacturing facility,<br />

making it the perfect choice for a<br />

variety of cleaning jobs.”<br />

SMT Hybrid Packaging, Booth<br />

4–531<br />

www.microcare.com<br />

Selective Soldering<br />

<strong>EPP</strong> EUROPE May 2018 33


PCB + ASSEMBLY<br />

Possibilities of digitalisation in programming soldering systems<br />

Real added value with<br />

assistance systems<br />

We are living in a world increasingly marked by digitalisation and networking. This development is also filtering<br />

through into production areas previously shaped by the implicit expertise and experience of individual<br />

employees. The demand for reduced reliance on these leads to the deployment of new technologies. Assistance<br />

systems play a major role here, supporting production staff in their decision-making.<br />

Ersa GmbH, Wertheim (Germany)<br />

ODB++ data permit photo-realistic representation of the assembly in 3D format.<br />

ODB++ data permits a view of the PCB.<br />

One assistance system which responds to these requirements<br />

to a high degree and provides long-term support in the in part<br />

complex field of soldering program generation for selective soldering<br />

systems is the completely newly-developed Ersa CAD Assistant<br />

4.<br />

Electronic assemblies are becoming ever-more complex, with the<br />

most diverse components, densities and board designs. Despite<br />

Source: Ersa GmbH<br />

the SMT mainstream, selective soldering engineering is<br />

still a strong growth market in electronics production. The<br />

later soldering of THT components on electronic assemblies<br />

which have already been reflow soldered, is as<br />

an inherent element in many manufacturing environments.<br />

One firmly-established technology is selective soldering<br />

with miniwave soldering systems. These systems operate<br />

with small soldering waves, which approach and<br />

solder the THT soldering joints on an X-Y-Z axis system,<br />

CNC-controlled.<br />

The CNC sequence contains all the position data, route<br />

parameters and process parameters necessary for reliable<br />

and high-quality THT soldering joints.<br />

Programming made fast, intuitive and easy<br />

The fast and reliable program of the soldering process is<br />

an essential element of efficient electronics production.<br />

In order to guarantee the highest machinery uptime, Ersa<br />

CAD Assistant 4 allows the programming to be undertaken,<br />

and changes made, while the system is running.<br />

Due to the complete integration into the Ersasoft 5 operating<br />

software, these programs can be used directly on<br />

the machinery, without any detours.<br />

CAD Assistant 4 also supports the programming of modules<br />

with two independent axis systems (Versaflux & Versaflex).<br />

The data sets for the CNC axis systems are edited<br />

with a simple “drag and drop”. Predefined data sets can<br />

be easily adapted to the current application. A plausibility<br />

test actively supports the user in the integrity check. The<br />

solution uses CAD data or images of scanned assemblies<br />

for programming.<br />

All movements of the fluxer and solder wave appear<br />

graphically in the image of the PCB, with the process parameters<br />

being entered in parallel.<br />

The program data generated in this way is immediately<br />

available in the selective soldering system and allows the entire process<br />

to be simulated and checked for integrity.<br />

Moreover, the CAD Assistant 4 offers an auto-routing function,<br />

based on the traveling salesman principle, which allows the software<br />

to independently calculate the fastest soldering program for<br />

an assembly, i.e. the software suggests the ideal route for the flux<br />

and soldering program.<br />

Source: Ersa GmbH<br />

34 <strong>EPP</strong> EUROPE May 2018


PCB + ASSEMBLY<br />

Data processing – Using CAD data or<br />

image files<br />

The CAD Assistant 4 offers the user new possibilities to<br />

create a soldering program. The import of 3D data provides<br />

the process engineer with additional information<br />

that supports him in programming. This data includes information<br />

about the conductive layers of the boards, drilling<br />

holes, component part lists, placement data and<br />

exact measurements. This means that the exact free<br />

space around the solder joints is known at every spot on<br />

the board.<br />

ODB++ is a data exchange format that can be exported<br />

from almost all the layout programs available on the market.<br />

But of course all the other current 3D-/CAD data,<br />

such as GenCAD or IPC 2581 can also be used. Furthermore,<br />

there is the possibility of scanning-in images of<br />

the PCB. Here too, all standard formats (jpg, bmp, png,<br />

tif, gic, etc.) can be used. In this case, the 2D image is projected<br />

onto the screen, then cross-referenced and provided with the<br />

necessary process parameters by the operator.<br />

Take advantage of your own data<br />

The use of CAD data such as ODB++ offers the process engineer<br />

enormous benefits in programming. Such information as heat capacity,<br />

drilling data, etc. is of central significance for optimum soldering<br />

results. Components and the relevant process parameters<br />

are stored in a database, so that the pre-defined process parameters<br />

from familiar components can be automatically transferred<br />

to new assemblies.<br />

Where necessary, these can be individually adapted by the operator.<br />

The option is also available of “marrying” components with flux<br />

and soldering parameters and storing these permanently in the database.<br />

On the basis of the ODB++ data of the assembly, the CAD<br />

Assistant 4 supplies further information on the components to be<br />

used, the drill holes and the individual layers of the PCB.<br />

The geometry of the components is stored as a 3D model in the<br />

ODB++ data set. If there are already components on the soldered<br />

side of the assembly, they may not come into contact with the soldering<br />

wave. The solder pots have to avoid and detour around this<br />

area during positioning. To ensure this, the user defines the “off-limit<br />

areas”. When the software generates the CNC route, it recognises<br />

the areas which are off limits and masks them from the operating<br />

space available.<br />

Definition of off-limit areas.<br />

Create templates just once worldwide<br />

Templates offer the process engineer a fast start in program creation<br />

with the CAD Assistant 4. In the program, Ersa has stored<br />

templates for different nozzle sizes and operation modes which can<br />

be used for the creation of soldering programs.<br />

Pre-defined templates can be individually adapted, re-defined if<br />

necessary, and saved for future use.<br />

When changing the parameters of the templates, the process engineer<br />

has enormous flexibility and adapts the order of the process<br />

steps to his requirements by drag & drop. Completed templates can<br />

simply be transferred from one machine to another by the export<br />

and import function.<br />

In addition, the software offers the option of authorising different<br />

user levels. The adaptation or alteration of templates of this kind,<br />

where required, can only be carried out in pre-defined areas. For<br />

example, a specific work sequence and speed can be set while the<br />

contact time at the individual point can be individually adapted.<br />

Real-time monitoring of performance through simulation<br />

While programming, the process engineer defines the solder nozzle<br />

for each solder joint. The intelligent autorouting algorithm then assigns<br />

the individual jobs to the available solder modules and solder<br />

pots. This ensures that the correct nozzles and process parameters<br />

for the solder joints are used.<br />

Source: Ersa GmbH<br />

Structure for integrating soldering<br />

systems in the company IT.<br />

Source: Ersa GmbH<br />

<strong>EPP</strong> EUROPE May 2018 35


PCB + ASSEMBLY<br />

The Versaflow 4-Generation series.<br />

Source: Ersa GmbH<br />

The autorouting algorithm is designed to calculate the fastest path.<br />

In addition, the software offers the option of simulating the soldering<br />

sequence and soldering paths, in real time, while still in the office.<br />

This offers huge advantages, particularly for the highly-flexible<br />

Versaflux and Versaflex modules. The user always retains the possibility<br />

of adapting the autoroute function. In this way, high-mass<br />

components or sensitive components can be prioritised so that they<br />

are soldered first.<br />

Central, database-driven machine software<br />

For saving all the data on the soldering plant, the Ersasoft 5 platform<br />

uses a common database system. This ensure that the data is<br />

saved in a structured form. The data can then be retrieved easily and<br />

quickly when needed, for example for long-term analyses. A high<br />

level of data security is always ensured by the automatic backup intervals<br />

which can be set individually.<br />

In order to further increase data security, installing the database in<br />

the customer’s computer centre is advised. This means that a<br />

number of machines can share a database and use it to exchange<br />

data among themselves. This ensures, for example, that when a<br />

product is manufactured in several different locations, the processes<br />

are the same in all the production sites, no matter where in<br />

the world the soldering system is standing. The huge benefit offered<br />

by this approach is the central administration of the datasets.<br />

Changes to the datasets are possible at any time, but are carried out<br />

centrally. When a soldering system retrieves a dataset from the central<br />

database, it is ensured that the data is up to date. This approach<br />

keeps process reliability at the highest possible level.<br />

In sharp contrast to this is the updating of datasets on the computer<br />

in the system itself. With manufacturing sites scattered around the<br />

globe, local data management is difficult and not guaranteed. Local<br />

data saving is still possible, but for the reasons given, is not recommended.<br />

Summary<br />

With the CAD Assistant 4, the company is offering a further central<br />

component for the digital, networked factory of the future. The open<br />

database system and the use of conventional 3D data formats from<br />

the assembly development, permit mutual access to immense<br />

quantities of data and information. Process parameter, PCB and<br />

component specifications are centrally available. With simultaneous<br />

feedback of quality data to the same database, completely new<br />

possibilities open up. For one thing, for the easy creation of soldering<br />

programs, as the programmer has access to data and values<br />

based on experience from other production sites. For another, it<br />

makes much greater sense to link the program and quality data in<br />

smart form and, in this way, create the basis for efficient process<br />

optimisation.<br />

When the user exploits the possibilities of centralising data in his<br />

computer centre, the highest level of data security is guaranteed. At<br />

the same time, this provides the huge benefit of central data management.<br />

With manufacturing sites scattered around the globe, this<br />

is a major advantage and the essential basis for maximum process<br />

reliability.<br />

The CAD Assistant 4 is a central component of the Ersasoft 5 and is<br />

available for the Versaflow 4 Generation selective soldering systems.<br />

It encompasses the series – Smartflow 2020, Ecoselect 4,<br />

Versaflow 4/55 and Versaflow 4 XL.<br />

SMT Hybrid Packaging, Booth 4–111; 5–434<br />

www.kurtzersa.de<br />

Zusammenfassung<br />

Wir leben in einer Welt, die zunehmend von Digitalisierung und<br />

Vernetzung geprägt ist. Diese Entwicklung schlägt sich auch in<br />

Produktionsbereichen nieder, die zuvor vom Know-how einzelner<br />

Mitarbeiter geprägt waren. Die Forderung nach einer geringeren<br />

Abhängigkeit von diesen führt zum Einsatz neuer Technologien. Der<br />

Artikel zeigt, dass Assistenzsysteme dabei eine große Rolle spielen<br />

und die Produktionsmitarbeiter bei ihren Entscheidungen unterstützen.<br />

Résumé<br />

Nous vivons dans un monde de plus en plus façonné par la digitalisation<br />

et la mise en réseau. Ce développement se trouve également<br />

dans les zones de production qui étaient auparavant caractérisées<br />

par le savoir-faire de chaque employé. La demande pour<br />

une moindre dépendance conduit à une plus grande utilisation des<br />

nouvelles technologies. L‘article d’écrit que les systèmes d‘assistance<br />

jouent un rôle important en aidant les employés de production<br />

à prendre des décisions.<br />

Резюме<br />

Мы живем в мире, который уже невозможно представить без<br />

цифровых технологий и сетей. Это развитие находит<br />

отражение в сферах производства, эффективность которых<br />

прежде зависела от ноу-хау отдельных сотрудников.<br />

Необходимость в снижении подобной зависимости приводит к<br />

использованию новых технологий. В статье рассказывается о<br />

важной роли систем помощи, которые оказывают поддержку<br />

сотрудникам производства при принятии решений.<br />

36 <strong>EPP</strong> EUROPE May 2018


PRODUCT UPDATES<br />

PCB + ASSEMBLY<br />

Dust and hose-proof small casing for stationary<br />

and portable applications<br />

With the InterShell IP, Intermas has expanded<br />

its small casing series for euroboard<br />

formats and customer-specific electronics<br />

applications. The casing is not only suited as<br />

tabletop housing for measuring and testing<br />

devices, but also for small casing for other<br />

applications. Also, the robustness and tightness<br />

serves as a perfect solution for portable<br />

outdoor applications. The design with specific<br />

conductible silicone sealings ensures an<br />

optimal EMV-protection.<br />

You can choose between 2 standard types:<br />

• Type 1 with a height of 81,8 and a width of<br />

145 mm.<br />

• Type 2 with a height of 145 and a width of<br />

229,2 mm.<br />

Both types are available in the nominal<br />

depths of 150, 200 and 250 mm.<br />

In addition to optimal functionality, the development<br />

of the casings were done by paying<br />

close attention to a cost-efficient design with<br />

a maximum degree of flexibility. The sophisticated<br />

basic structure consists of an alumi-<br />

num extruded sheath,<br />

which is used in type 1 as<br />

upper- and lower part, respectfully<br />

in type 2 (3U,<br />

42HP) as side panel. By<br />

using plugged-in side panels<br />

as top/bottom cover<br />

plates, the standard dimensions<br />

of the casing can<br />

easily and economically be<br />

adapted to customer-specific<br />

dimensions.<br />

The standard casing has a<br />

blank surface. Other surfaces can, of<br />

course, also be provided upon request.<br />

Therefore, the customer can request individual<br />

coloring, creating a unique customer interface.<br />

For individual assembly, a multitude<br />

of accessories like handles, wall-or bottomfastening<br />

angles, and stands with or without<br />

tip-up hinged feet, are available.<br />

With the InterShell IP casing, the assembled<br />

electronics are perfectly protected. It is not<br />

The small casing series, InterShell IP, is mostly<br />

used in measuring and testing systems or mobile<br />

applications.<br />

only effective, but it can be custom-fitted<br />

while still staying cost efficient.<br />

www.intermas-el.com<br />

Source: Intermas-Elcom GmbH<br />

<strong>EPP</strong> EUROPE May 2018 37


PCB + ASSEMBLY<br />

Handling high-density boards that feature exotic components<br />

Investing for the future in<br />

Haaksbergen pays off<br />

Back in 2014, Netherlands-based contract manufacturer, Global Electronics made the decision to<br />

invest in surface mount assembly technology that would give capacity it didn’t need to meet its<br />

customers’ requirements at that moment. Instead, the decision was based on a forward-looking<br />

philosophy to position the company for the “right kind of business” in the future.<br />

Source: Europlacer<br />

Global Electronics invested in two XPii platforms and a twin-turret iineo machine, from Europlacer, that are able to handle high-density boards with exotic components.<br />

For Global Electronics, that future has since arrived, and it turns<br />

out to be a bright future. The company, based at Haaksbergen in<br />

eastern Netherlands just a few miles from the German border, celebrated<br />

its 25 th anniversary this year. In that quarter-century, it has<br />

seen its business proposition broaden, its customer profile change,<br />

and the complexity of its customers’ products escalate. Some of<br />

the boards it now manufactures are valued up to € 50 k each – which<br />

is the business the company sought.<br />

In the four-year period since its investment decision, the company<br />

has evolved from a conventional EMS provider into a complete fulfillment<br />

partner. More than assembly, they deliver downstream resources<br />

including box build and shipping logistics, and upstream<br />

support to manage supply chains and procurement, and to offer<br />

strategic collaboration during product development.<br />

Surface mount assembly remains a core operational function. In<br />

order to focus on its broader aims, the company first needed to ensure<br />

that this production process ran flawlessly. And that it could address<br />

the high-complexity, high-value board business it wanted to<br />

target. The decision to invest in progressive manufacturing technology<br />

was the outcome. After evaluating the market, the company selected<br />

Europlacer placement machines for their technology and<br />

quality capabilities. "Having built up a good relationship firstly with<br />

SMANS, our local distributor, and then with Europlacer directly, we<br />

had the confidence to make this investment,” explains Jeroen<br />

Schuiling, Head of Sales at Global Electronics. „They are one of the<br />

few brands that can comply with our requirements to handle highdensity<br />

boards that feature exotic components. That was the ‘right<br />

kind of business’ we wanted to attract.<br />

At the time of the evaluation and acquisition, Schuiling was the Production<br />

Manager. From that vantage point, and with 20 years of experience,<br />

he knows the right decision was made by investing in two<br />

XPii platforms and a twin-turret iineo machine. In addition, the company<br />

had an older Vitesse machine on its factory floor; this was upgraded<br />

to full iineo specification. "It was a more cost-effective path<br />

than purchasing a second new machine, and we ended up with the<br />

same capability," he explains.<br />

The company’s surface mount operation is split into two distinct<br />

functions: NPI/prototype work; and complete production for medi-<br />

38 <strong>EPP</strong> EUROPE May 2018


PCB + ASSEMBLY<br />

um-volume, high mix products. "The machines can address both<br />

sets of unique requirements with a single platform," says Schuiling.<br />

With its assembly function optimized, the company has been able<br />

to attract premium ultra-high-tech work from discerning OEMs<br />

(Schuiling refers to boards for the EU Supercomputer 2020 Project<br />

that require techniques available on the high-tech assembly lines).<br />

Other high-value assemblies include Zero-flux PSUs destined for<br />

the particle accelerator at Cern where faultless high quality is expected.<br />

"We also deliver advanced products to Cern for high-speed<br />

data collection, as well as to other customers in demanding telecoms<br />

and photonics markets,” says Schuiling, adding: "And we also<br />

manufacture an ingenious agricultural product for monitoring livestock<br />

– that brings things back down to earth, though it is a very<br />

serious and demanding electronics application."<br />

Source: Europlacer<br />

In a single platform, the company has the capability and capacity to offer highvolume<br />

manufacturing, in order to continue to grow throughout the industry.<br />

The next step in continuing its growth is to offer high-volume manufacturing,<br />

supported by the company’s end-to-end infrastructure resources,<br />

from procurement to direct-to-customer shipping. "With<br />

the platforms, we already have the capability and capacity," claims<br />

Schuiling, pointing out that it‘s been proven with some recent projects,<br />

featuring consumer products ripe for production in Asia. "But<br />

we were smart enough to invest in the tooling to address the volumes<br />

the customer required. Our per-unit pricing came in just € 1<br />

more than the cost of assembling abroad – a negligible amount<br />

given the value of the PCBs and all the attendant advantages in<br />

communications and quality that come from manufacturing in <strong>Europe</strong>,"<br />

he states.<br />

There is another agenda coming into play in <strong>Europe</strong>, particularly in<br />

the Netherlands. Something that the company intends to capitalize<br />

on, which is having the ‘Made in Holland’ stamp on products. "It is<br />

an increasingly desirable label for our local and regional customers,<br />

and even for those beyond our borders," Schuiling explains. "It portrays<br />

top quality, focus and attention to detail, and we are very<br />

happy to be seen as the providers of that quality."<br />

SMT Hybrid Packaging, Booth 4–251<br />

www.europlacer.com; www.global-electronics.nl<br />

Zusammenfassung<br />

Ein in den Niederlanden ansässiger Auftragsfertiger hat vor wenigen<br />

Jahren in Bestückungstechnologien investiert, die weit über<br />

die damaligen Kundenanforderungen hinaus gingen. Denn die Bestückung<br />

ist das Herz einer SMT-Linie und benötigt innovatives<br />

Equipment. Durch diese vorausschauende Entscheidung konnte<br />

sich der EMS Dienstleister ständig weiterentwickeln und ist heute<br />

ein kompletter Fulfillment-Partner mit Produkten Made in Holland.<br />

Résumé<br />

L‘assemblage est le cœur d‘une ligne CMS et demande d‘avoir des<br />

équipements innovants. Il y a quelques années, un fabricant basé<br />

aux Pays-Bas a investi dans des technologies d‘assemblage, qui<br />

allaient bien au-delà des exigences de l‘époque. Grâce à cette décision<br />

tournée vers le futur, le fournisseur de services EMS a pu<br />

constamment évoluer et maintenant est un partenaire à part entière<br />

dans l‘exécution avec des produits ‘Made in Holland’.<br />

Резюме<br />

Один голландский контрактный производитель несколько лет<br />

назад инвестировал в технологии установки навесных<br />

элементов на печатную плату, которые на тот момент<br />

значительно превосходили требования клиентов. Установка<br />

навесных элементов на печатную плату — это сердце линии<br />

поверхностного монтажа, требующее использования самого<br />

современного оборудования. Благодаря этому дальновидному<br />

решению разработчик микроэлектронных схем смог<br />

развиваться дальше и превратиться в полноценного<br />

партнера-соисполнителя, предлагающего продукты „Made in<br />

Holland“.<br />

<strong>EPP</strong> EUROPE May 2018 39


PCB + ASSEMBLY<br />

Successfully implementing high-volume, high-performance selective soldering<br />

Dealing with mixed PCBAs<br />

The selective soldering process is an essential part of the electronic assembly manufacturing operations<br />

throughout the world. Complex printed circuit board assemblies (PCBAs) place greater demand on the overall accuracy<br />

and repeatability of the selective soldering process. This requires the selective soldering process to be more precise.<br />

Florian Strohmayer, Applications Development Manager, Nordson Select, Hagenbach, Germany<br />

Five-zone system with concurrent fluxing, preheating and soldering.<br />

Any company who deals with soldering of through-hole and surface<br />

mount mixed-technology printed circuit assemblies quickly<br />

discovers the selective soldering process is not only more efficient<br />

than wave soldering, but also provides the opportunity to meet customer<br />

requirements with significantly more flexibility. One such company<br />

is the second largest EMS provider in the north of Israel. With<br />

headquarters in Nazareth, RH Technologies Ltd., employs more than<br />

1,000 people worldwide and builds electronic systems and assemblies<br />

for the advanced technology field. With worldwide facilities<br />

in China, Israel, Romania and the USA, this company serves end-customer<br />

markets throughout the aerospace, communications, industrial,<br />

medical and defense sectors.<br />

In general, most selective soldering applications are unique and<br />

therefore require application engineering to determine the most appropriate<br />

soldering solution. To meet these requirements, the users<br />

need to have a complete understanding of the soldering process, and<br />

have a good relationship with the equipment supplier. This partnership<br />

should be based on prompt communications with the supplier<br />

having a worldwide logistical support system that can quickly respond<br />

to any need or potential problem.<br />

Implementing selective soldering for a high-volume, high-performance<br />

application involves choosing a selective soldering platform designed<br />

for demanding through-hole and SMT soldering applications.<br />

This was a deciding factor when this EMS provider chose a new system<br />

for their third selective soldering line. According to Yacov Rozenberg,<br />

Chairman of the company, this was a critical factor since they<br />

wanted one system that had 6 solder pots within one machine to provide<br />

high-volume production, as well as system flexibility.<br />

To solve their productivity challenge, they partnered with Nordson Select<br />

to implement an Integra 508.5PD 3S selective soldering system<br />

for their latest high-volume application. This system provides fivezone<br />

in-line operation with independent areas for concurrent fluxing<br />

and preheating, as well as dual solder pots in three soldering stations<br />

Source: Nordson Select<br />

to ensure high output while producing excellent solder joint quality.<br />

Selective soldering can be divided into five basic sub-processes: conveying,<br />

fluxing, preheating, board handling and soldering. In high-volume<br />

selective soldering applications, a SMEMA chain conveyor with<br />

positive PCB locations and automatic conveyor width adjustment is<br />

essential for transporting the board between process stations. Dual<br />

maintenance-free drop-jet fluxers provide fast and accurate flux application<br />

of flux to precise locations on the PCBA eliminating the need<br />

for post-soldering cleaning of the board assembly.<br />

Preheating in selective soldering is not intended to reduce thermal<br />

shock as it is with wave soldering, but rather to pre-dry the flux and<br />

remove solvent and bring the flux to the correct viscosity before soldering.<br />

In this case, preheating is accomplished with full surface topside<br />

and bottom-side infrared preheating with closed-loop pyrometer<br />

control to achieve optimal thermal distribution. Accurate board handling<br />

is necessary to confirm that adjacent SMT components will not<br />

be affected by the selective soldering nozzles. Often selective soldering<br />

systems use either a single nozzle for flexibility or a multi-nozzle<br />

arrangement for greater output. The EMS provider‘s high-volume application<br />

required having both soldering technologies available in a<br />

single selective soldering system to provide throughput and flexibility.<br />

Increasing throughput<br />

The Integra 508.5 is a multi-station selective soldering system designed<br />

for high-volume applications with maximum throughput and<br />

due to its modular design, the machine can be matched to a wide<br />

variety of high-performance requirements. When configured with<br />

dual drop-jet fluxers, the system can be operated in two different<br />

modes and is capable of processing up to 10 boards at one time.<br />

The parallel processing mode enables fluxing and soldering of two<br />

boards in each fluxing and soldering station at the same time, which<br />

doubles machine productivity. The Z-axis control raises both dual<br />

solder pots and solder nozzles in each of the three soldering stations<br />

simultaneously, doubling the output. Using in the parallel processing<br />

mode, the distance between the dual solder pots and dual solder<br />

nozzles is automatically adjustable between 80–240 mm. This allows<br />

each solder station to process two boards at the same time, at a variable<br />

distance which is beneficial for soldering of multi-up panels. A<br />

panel of any multiple of two boards aligned in the direction of the dual<br />

nozzles will derive the full benefit of fluxing and soldering two boards<br />

at the same time, including 2-up, 4-up, 6-up or 8-up panels. With an<br />

odd number of boards within a multi-up panel, a partial benefit in productivity<br />

is still obtained. For example, a 3-up panel has the full benefit<br />

of fluxing and soldering the first two boards at the same time while<br />

single fluxing and soldering the third board. A 5-up panel has the full<br />

benefit of parallel fluxing and soldering four boards and single fluxing<br />

and soldering the fifth within the panel. Alternatively, the double pro-<br />

40 <strong>EPP</strong> EUROPE May 2018


PCB + ASSEMBLY<br />

Source: Nordson Select<br />

Source: Nordson Select<br />

Parallel soldering mode solders two boards at the same time.<br />

Double soldering mode with multiple size solder nozzles.<br />

cessing mode allows soldering with multiple size solder nozzles,<br />

within the same program, with independent Z-axis control. This operates<br />

each of the small and large solder nozzles individually, which enhances<br />

flexibility and increases productivity of the system.<br />

With the use of a single drop-jet fluxer and dual solder pots in each<br />

of the three soldering stations, the system can be used in the<br />

double processing mode with two different solder alloys in each of<br />

the solder pots without requiring to physically exchange the solder<br />

pots. Additionally, with this unique parallel and double soldering<br />

mode capability, a production floor must no longer sacrifice between<br />

throughput versus flexibility, or flexibility versus throughput,<br />

since both capabilities are available via a simple click of a mouse.<br />

Selective soldering is widely used in the automotive electronics industry,<br />

which uses quality assurance programs such as ISO,<br />

QS9000 and Six Sigma. To implement these types of programs, failure<br />

mode and effects analysis (FMEA) studies are required. Vendors<br />

who supply production equipment to this industry must frequently<br />

provide assurance that their assembly processes, including selective<br />

soldering, are fully under control.<br />

The selective soldering system implemented by the company is<br />

equipped with a data logging system that monitors all aspects of the<br />

selective soldering process. This information is continually gathered<br />

and stored in an SQL database and can be instantly exported in XML<br />

format for detailed analysis. Parameters such as the temperature of<br />

the solder alloy, PCB temperature, accurate flux application, and error<br />

messaging are readily available. Any additional process parameters<br />

can be easily added to adapt to specialized traceability requirements.<br />

While drop-jet dispensing is a proven technology for no-clean processing,<br />

flux solvents can evaporate over time or impurities within<br />

the flux can cause a drop-jet orifice to partially clog and slightly dispense<br />

flux off center. The amount of flux dispensed by a drop-jet<br />

dispenser is so minuscule and is extremely critical to the quality of<br />

the selective soldering process, that automatic flux verification is<br />

essential especially in a high-volume lights-out operation.<br />

Zusammenfassung<br />

Selektives Löten kommt oft dann ins Spiel, wenn oberflächenmontierten<br />

und bedrahtete Bauteile auf einer komplexen Baugruppe<br />

bestückt werden. Die Kriterien sind neben der hohen Genauigkeit<br />

und Reproduzierbarkeit auch die Prozessgeschwindigkeit. Wellenlöten<br />

wurde hier bisher oft praktiziert, doch mit einer präzisen selektiven<br />

Lötanlage, die parallel mehrere Boards mit Flussmittel versorgen<br />

und löten kann, gibt es wirtschaftliche Alternativen mit hoher<br />

Flexibilität und Leistung.<br />

Résumé<br />

Le brasage sélectif est souvent utilisé lorsque les composants pour<br />

montage en surface et contenant du plomb sont montés sur un assemblage<br />

complexe. Les critères ne sont pas seulement la haute<br />

précision et la reproductibilité, mais aussi la vitesse du processus.<br />

Jusqu‘à présent la soudure à la vague a souvent été utilisé, mais<br />

avec un système de brasage sélectif précis qui peut alimenter et<br />

souder plusieurs cartes en parallèle avec du flux, il existe des alternatives<br />

économiques avec plus de flexibilité et de puissance.<br />

Резюме<br />

Селективная пайка зачастую применяется в тех случаях, когда<br />

смонтированные с использованием поверхностного монтажа и<br />

соединенные вместе детали устанавливаются на комплексные<br />

узлы. Основными критериями при этом являются высокая<br />

точность, повторяемость и скорость. Прежде для этого часто<br />

использовался метод пайки волной припоя, однако<br />

высокоточные установки для селективной пайки, способные<br />

подавать флюс и паять одновременно несколько плат,<br />

являются более экономичной, универсальной и эффективной<br />

альтернативой.<br />

The selective soldering system in use at this EMS provider is<br />

equipped with an in-process, closed-loop flux verification system<br />

that confirms the presence and accuracy of flux application by the<br />

drop-jet fluxers. This system ensures micro-deposition of flux to extremely<br />

small soldering locations with unparalleled accuracy and<br />

guarantees minimal flux consumption. Monitoring of this process<br />

has proven to greatly increase the consistency and overall solder<br />

quality during high-volume production.<br />

It is widely known that only clean and oxidation free solder nozzles<br />

can be properly wetted to guarantee consistent solder quality. The<br />

automatic solder nozzle tinning system on this selective soldering<br />

machine does not spray an adipic acid, or a liquid or powdered flux.<br />

The automatic solder nozzle tinning system keeps the surfaces of the<br />

solder nozzles meticulously clean by automatically removing oxidation<br />

residues and re-tinning the surface of the solder nozzles, without<br />

resulting overspray or contamination of the board or the machine.<br />

Conclusion<br />

Based on numerous case histories, including the positive experience<br />

of the EMS provider, high-volume, high-performance selective<br />

soldering is establishing itself as a cost-effective alternative to wave<br />

soldering. It provides faster time to market with increased flexibility<br />

to meet unanticipated changes in customer requirements.<br />

SMT Hybrid Packaging, Booth 4–101<br />

www.nordsonselect.com<br />

<strong>EPP</strong> EUROPE May 2018 41


PCB + ASSEMBLY<br />

PRODUCT UPDATES<br />

Connecting to live show floor demonstration<br />

Aegis Software, a provider of Manufacturing<br />

Execution Software (MES) unveiled their<br />

quality management capabilities, that compliments<br />

the company‘s FactoryLogix existing<br />

Incoming & In-Process quality assurance capabilities,<br />

to now deliver administrative<br />

quality management capabilities to drive a<br />

culture of continuous process and improvement.<br />

The company showcased this capability,<br />

as well as, participated in the live demonstration<br />

of the IPC CFX factory data exchange<br />

standard.<br />

The FactoryLogix platform has long provided<br />

manufacturers the best method for managing<br />

and reporting upon quality, repair, test,<br />

diagnostics and incoming materials inspection.<br />

At Apex 2018, this in-process quality<br />

management solution extended to enterprise-wide<br />

Administrative Quality, enabling<br />

manufacturers to take total control of the<br />

business processes that occur as result of<br />

non-conformances on the factory floor. A<br />

total solution covering Corrective Action and<br />

Preventive Action (CAPA), Material Review<br />

Board (MRB), and Failure Reporting, Analysis,<br />

and Corrective Action System (FRACAS)<br />

completes the shop-floor nonconformance<br />

and incoming inspection quality components<br />

already inherent in FactoryLogix. Together,<br />

they comprise the most complete single-platform<br />

quality management solution available<br />

for electronics manufacturers to increase<br />

quality outcomes at a lower cost. It also en-<br />

Source: Aegis Software<br />

Aegis connected their FactoryLogix Platform to the<br />

first, standards-based, live show-floor demonstration<br />

of the IPC CFX Internet of Things Standard.<br />

sures requirements are met and improves<br />

customer satisfaction.<br />

“Manufacturers on the FactoryLogix platform<br />

can now detect and correct quality problems<br />

at the loading docks and through the process<br />

itself, but also manage and trace the business<br />

processes that arise from those problems.<br />

They can now fully automate continuous<br />

improvement and preventive actions,”<br />

stated Jason Spera, CEO. “This ‘administrative<br />

quality’ capability brings uniformity<br />

and enforcement to the actions that must be<br />

taken to ensure mistakes are never repeated<br />

and processes actually improve over time.<br />

Further, this large system greatly simplifies<br />

and improves outcomes in quality audits, ISO<br />

compliance, and customer satisfaction and<br />

relationship management.”<br />

Also at the show, the company participated<br />

in the live demonstration of the IPC CFX factory<br />

data exchange standard that enabled<br />

visitors to monitor machines and devices in<br />

real-time across more than 15 different vendors<br />

– on their own mobile devices – simply<br />

by scanning a QR code when entering the<br />

show floor. The company‘s platform was connected<br />

to the shop-floor CFX network, which<br />

showed the power of this free, open and true<br />

IoT standard for the industry, and the already<br />

widespread incorporation of it within devices<br />

and machines in the industry.<br />

The holistic and modular platform delivers<br />

leading-edge technology with easily configurable<br />

modules to support and execute a<br />

manufacturer’s strategy towards Industry<br />

4.0. FactoryLogix manages the manufacturing<br />

lifecycle: from product launch to material<br />

logistics, through manufacturing execution,<br />

to analytics and real-time dashboards. This<br />

end-to-end platform helps companies accelerate<br />

product introductions, streamline processes,<br />

improve quality and traceability, reduce<br />

costs and gain greater visibility for competitive<br />

advantage and profitability.<br />

SMT Hybrid Packaging, Booth 4-150<br />

www.aiscorp.com<br />

Technology line program with a 2-channel soldering station<br />

Weller presented the WT 2M soldering<br />

station for high-performance soldering. It incorporates<br />

2 independent channels for 2<br />

irons adding up to a maximum of 150 watts<br />

of power. Besides many standard tools, the<br />

company’s Microtools can be run with this<br />

station. WMRP soldering iron and WMRT<br />

desoldering tweezers are fitted with cartridge<br />

tips. The tips can be changed quickly<br />

and easily without any additional tools and<br />

guarantees good soldering results.<br />

Not only is the station easy to operate, but it<br />

reduces the environmental impact and improves<br />

cost-effectiveness due to its energy<br />

saving properties. The multifunctional LC display<br />

provides a detailed overview of all functions.<br />

It features clearly arranged graphics<br />

that make it possible to understand setting<br />

parameters of both channels. The control<br />

panel on the front is distinctive and offers an<br />

uncluttered and particularly clear design. All<br />

of the important operating elements are<br />

placed on the front. The menu button ensures<br />

instant access allowing users to navigate<br />

through the menu structure easily.<br />

The 90 watt soldering iron is unique on the<br />

market because it is an active soldering system<br />

with replaceable, passive, high-performance<br />

soldering tips. The soldering iron combines<br />

the cost-effectiveness of a passive soldering<br />

system with the design and ergonomics<br />

of an active one. The lightweight and slim<br />

soldering iron has a soft rubber grip and a thin<br />

silicone cable offering ease of use and is<br />

beautifully ergonomic.<br />

Innovative 2-in-1 safety rest WSR<br />

The option of switching the safety rest between<br />

dry and wet cleaning is an innovative<br />

feature. It can be lifted and turned through<br />

180° allowing the user to choose between<br />

The WT 2M soldering station is not only easy to operate,<br />

but it also reduces the environmental impact and<br />

improves cost-effectiveness due to its energy saving<br />

properties.<br />

sponge and dry cleaner. The high-quality cast<br />

base material increases the stability. The soldering<br />

tips can be stored safely at the safety<br />

rest. It is also possible to attach several WSR<br />

next to one another.<br />

SMT Hybrid Packaging, Booth 4–102<br />

www.weller-tools.com<br />

Source: Weller Tools GmbH<br />

42 <strong>EPP</strong> EUROPE May 2018


Source: Kyzen<br />

Comprehensive data reporting platform with<br />

real-time access<br />

Kyzen has introduced a Cleaning<br />

IQ Test at the 2018 IPC Apex<br />

Expo. Inspired by the company’s<br />

commitment to education and<br />

technical support, it was easy to<br />

test knowledge at the show. All<br />

participants received a reward<br />

for their skills. “The company<br />

loves to make technical learning<br />

friendly, fun and efficient,” said<br />

Sherry Stepp, Global Segment<br />

Leader for Electronic Manufacturing.<br />

“It is part of our commitment<br />

to constantly improve<br />

cleaning process performance<br />

through the convergence of<br />

Science and Care.”<br />

The company provides a range of<br />

products and technical services<br />

that increase reliability and productivity<br />

for manufacturers<br />

around the world. The Analyst<br />

Data Services was also showcased.<br />

It delivers real-time access,<br />

traceability and advanced<br />

data analytics in a user-friendly<br />

customizable dashboard, complete<br />

with alerts. This service is a<br />

comprehensive data reporting<br />

platform that is fully integrated<br />

with the company’s PCS.<br />

Standing at the production line or<br />

manually logging data is no longer<br />

needed. It gives access to<br />

data, including historic trending<br />

data, from multiple production<br />

sites in one secure location. This<br />

includes being able to quickly<br />

compare performance across different<br />

production sites.<br />

SMT Hybrid Packaging, Booth<br />

4A-536<br />

www.kyzen.com<br />

The Analyst Data Service delivers real-time access, traceability and advanced<br />

analytics in one comprehensive platform.<br />

Most thermally efficient and cost-effective<br />

MCPCB enters lighting market<br />

LED thermal management innovator<br />

Cambridge Nanotherm<br />

launched Nanotherm MCPCB —<br />

a thermally-efficient and cost-effective<br />

metal-clad PCB. Due to a<br />

recent technological breakthrough<br />

regarding the company’s<br />

patented electro-chemical process,<br />

which creates a 20 μ-thick<br />

dielectric layer of alumina atomically<br />

bonded to the aluminium<br />

board, they have been able to<br />

drive down the cost of the metalclad<br />

PCB, which is available to<br />

customers at a lower cost but<br />

better efficiency.<br />

The MCPCB offers a thermal efficiency<br />

of 120 W/mK, offering designers<br />

better than 56 % of the<br />

thermal conductivity of an aluminium<br />

plate. It also offers a robust<br />

stability at an operating<br />

temperature of 130 °C, and is<br />

lead-free solder compatible and<br />

ROHS and UL recognised.<br />

This price reduction brings the<br />

company’s ceramicised aluminium<br />

boards, which used to be<br />

only affordable for high-power<br />

applications, within the range of<br />

all general lighting applications.<br />

The Sales and Marketing Director<br />

Mike Edwards said: “The fact<br />

that our Nanotherm MCPCB is<br />

now available to the general<br />

Nanotherm MCPCB offers electronics<br />

designers better than 56 % of the thermal<br />

conductivity of an aluminium plate.<br />

lighting market is testament to<br />

the hard work and research our<br />

scientists have put in over the<br />

past three years. One of our<br />

greatest strengths is that we can<br />

easily ‘swap in’ our thermal management<br />

technology to customers’<br />

existing MCPCB machining<br />

processes, but we are particularly<br />

dominant when it comes to<br />

integrating CSP designs into<br />

tuneable white solutions. Where<br />

a company may have previously<br />

used a traditional MCPCB, now<br />

they can use Cambridge Nanotherm’s<br />

technology, gaining<br />

greater thermal efficiency at a<br />

lower price, with no costly retooling<br />

and minimum integration effort.”<br />

MCPCB is available for prototyping<br />

and mass production orders.<br />

www.camnano.com<br />

Source: Cambridge Nanotherm<br />

Powerful and Compact<br />

The LPKF MicroLine 2000 Ci sets new standards in laser cutting of<br />

rigid, flexible and flex-rigid circuit boards. Discover the new benefits<br />

of using lasers. Find out more: www.lpkf.com/laser-depaneling<br />

SMT: 5 – 7 June 2018, Hall 5, Booth 434B<br />

<strong>EPP</strong> EUROPE May 2018 43


PCB + ASSEMBLY<br />

Automating all areas in the production of sensors<br />

Optimizing material flow to<br />

ensure efficient processes<br />

Vega Grieshaber KG develops and manufactures sensors for measuring fill levels, point levels and pressure, as well as<br />

devices and software for integrating these measurements into process control systems. The company produces all<br />

electronics for its measurement devices in-house on three SMT lines with ASM solutions. To streamline the entire<br />

process, both companies recently completed a project to optimize the material flow.<br />

“We were able to reduce the time spent on material storage and picking by 30<br />

percent,” says Michel Wucher, head of SMT production operations at Vega.<br />

Source: ASM Assembly Systems GmbH & Co. KG<br />

Each year, the company ships over 400,000 sensor solutions from Schiltach<br />

in the Black Forest to customers all over the world.<br />

Source: ASM Assembly Systems GmbH & Co. KG<br />

Each year, the sensor manufacturer ships over 400,000 sensor<br />

solutions from Schiltach in the Black Forest to customers all<br />

over the world. For almost 60 years, the family-owned company has<br />

developed and manufactured products for demanding measurement<br />

tasks in chemical and pharmaceutical plants, in the food industry,<br />

in water supply and treatment systems, in landfills, in mining<br />

and energy production, on drilling platforms, and on ships and airplanes.<br />

They produce modular electronics, which are a central component<br />

of each sensor system, in two shifts on three SMT lines<br />

with Siplace placement machines and DEK printers. Between<br />

150,000 and 200,000 modules on 85,000 to 90,000 PCBs leave the<br />

lines each month. In 2017, the company placed more than 164 million<br />

components, with significant increases expected for 2018. The<br />

spectrum comprises 0402 shapes in 0.5 mm grids, BGAs in grids of<br />

up to 0.4 mm, and PiPs.<br />

Highly efficient processes<br />

For quality and efficiency reasons, the company aims to automate<br />

its production wherever possible. In its SMT operation, a single person<br />

per shift handles the setups while another one supports the<br />

printers, dispensers, placement machines, reflow oven, AOI, and<br />

the handling equipment. There is also a shift leader and a technician<br />

for multiple shifts.<br />

The company is a member of the SMT Smart Network, a cooperative<br />

network that ASM‘s experts have founded for large and small<br />

companies with different production models all over the world. Its<br />

goal is to develop and optimize smart workflows in the individual<br />

member companies. The resulting findings and best practices will<br />

then be shared within the SMT Smart Network. At Vega, the experts<br />

focused on integrating and transparently controlling the company‘s<br />

material flows with the Siplace Material Manager. As a result,<br />

the need for manual assists was significantly reduced, and<br />

most material-related stops were eliminated.<br />

Integrated management of all storage sites<br />

To simplify these processes, the company agreed with its component<br />

suppliers on a special barcode labelling system. When component<br />

reels arrive, they are recorded with a MODI scanner, and a<br />

unique ID is assigned. Scanning this ID during all material movements<br />

ensures total transparency, because the location of each reel<br />

is known at all times.<br />

After their initial scan, the components are taken to the SMT plant<br />

and stored. The company has roughly 90 million components in<br />

stock on 25,000 reels with approximately 1,500 different article<br />

numbers. “Whether you are talking about an automatic Kardex storage<br />

system, MSD cabinets, the setup preparation area, or the actual<br />

production machines – all of them are covered and managed by the<br />

44 <strong>EPP</strong> EUROPE May 2018


PCB + ASSEMBLY<br />

Vega, a member of the SMT Smart Network,<br />

produces all electronics for its measurement<br />

devices in-house on three SMT lines with<br />

ASM solutions.<br />

Source: ASM Assembly Systems GmbH & Co. KG<br />

ASM Material Manager,” explains Michel Wucher, who heads the<br />

SMT production operations at Vega.<br />

Total operator guidance through the setup process<br />

The company operates with setup families. When the operator in<br />

the setup area selects the setup on his PDA, the Material Manager<br />

generates a BOM or pick list automatically and marks the items as<br />

reserved to prevent them from being scheduled for another production<br />

job. Without the need for printouts, PDAs guide employees to<br />

the various storage bins in the most efficient manner. The Kardex<br />

system issues the reels directly based on the Material Manager’s<br />

commands, and the operator confirms the receipt of each reel by<br />

scanning its barcode.<br />

When all items have been issued, the operator begins setting up<br />

the feeders on the single-slot EDIF. Afterwards, the feeders are inserted<br />

into the proper slots on the changeover table.<br />

Active feeder pool minimizes material travel<br />

Next, previously kitted feeders from the active feeder pool are<br />

added to the setup. The active feeder pool functions as a waiting<br />

room for feeders, because this is where kitted feeders sit and wait<br />

for one of the upcoming setups. Placing them in the active feeders<br />

avoids unnecessary tear-downs and cuts back on material travel.<br />

What makes all this possible is the integrated material flow control<br />

of the Material Manager which covers all storage locations and material-related<br />

processes.<br />

The SMT Smart Network: Sharing skills for the Smart Factory<br />

An open and global network of reference factories with the singular goal<br />

of promoting best practice sharing for electronics manufacturers on the<br />

road to the Smart Factory: this is the idea behind the SMT Smart Network.<br />

Its members, ten manufacturers from Germany to the USA, China,<br />

India, the Netherlands and Sweden, all were involved in trailblazing projects<br />

to improve the workflows of their respective companies’ together<br />

with SMT solutions provider ASM.<br />

The same approached them with the idea to interconnect via its SMT<br />

Centers of Competence: “Each factory must determine its own path to the<br />

Smart SMT Factory, but everyone can benefit from experiences and best<br />

practices in other companies – that‘s the idea being shared by all<br />

members of the SMT Smart Network,” explains Alexander Hagenfeldt,<br />

Project Manager SMT Smart Factory.<br />

In November 2017, the productronica trade fair provided an ideal opportunity<br />

for members of the SMT Smart Network to get together to exchange<br />

experiences and plan new projects. In the meantime, the companies<br />

have begun visiting each other: BYD and ATH from China were<br />

joined by Alessandro Bonara, head of the company’s AS’s own SMT production,<br />

in December at the two respective production sites.<br />

The plans for the future of the SMT Smart Network are clear: to increase<br />

exchange, to learn from each other, and to grow. “With ASM‘s organizational<br />

support, the SMT Smart Network allows us to go in new and innovative<br />

directions that lead to clear improvements in users’ KPIs. The network<br />

is open to anyone who wants to make their electronics production<br />

smarter, share their experiences, and subject themselves to open benchmarking.<br />

The only requirements: be willing to make intelligent and longterm<br />

process improvements and share your experiences with other<br />

members. Even after only a few months and meetings, it is already becoming<br />

abundantly clear that everyone benefits from this type of cooperation.<br />

I am confident that this network will enable us to reach our goals<br />

with much more speed and certainty,” said Jochem Winkelman, General<br />

Manager of Dutch SMT Smart Network member, Rena.<br />

www.asm-smt.com<br />

<strong>EPP</strong> EUROPE May 2018 45


PCB + ASSEMBLY<br />

To simplify these processes, the company agreed with its component suppliers on a special barcode labelling system. When component<br />

reels arrive, they are recorded with a MODI scanner, and a unique ID is assigned.<br />

Source: ASM Assembly Systems GmbH & Co. KG<br />

In the setup preparation area, the ASM Material Setup Assistant<br />

guides operators step-by-step through the preparation process with<br />

the help of the feeder LEDs. Once all newly set-up feeders and<br />

those from the active feeder pool are in their proper locations, the<br />

ASM Setup Center software verifies the setup, and the finalized<br />

changeover tables, after a final setup control with Siplace Setup<br />

Center, are rolled to their respective machines.<br />

Machines report material consumption automatically<br />

“Our Siplace placement solutions record all material movement and<br />

consumption details during the production and report the information<br />

to the Material Manager,” says Michel Wucher about another<br />

benefit of the smart workflow. The ASM Line Monitor creates<br />

an additional level of transparency, because it displays on large<br />

monitors above the lines which feeders are about to run empty. And<br />

thanks to the smart material logistics system, fresh supplies have<br />

already been moved to the respective lines. This enables operators<br />

to splice reels before a line stop occurs.<br />

Smart material management pays off<br />

“The multi-line integration of smart material flow solutions such as<br />

the ASM’s Material Manager, Material Setup Assistant, Kardex automatic<br />

storage systems and Modi have paid off for us,” reports Michel<br />

Wucher. Concrete improvements include space savings of over<br />

30 % in material logistics and setup preparation, and 30 % faster<br />

warehousing and retrieval procedures. All-in-all, optimizing the<br />

workflow via software has cut the time requirements for setup<br />

preparation operations in half – a significant gain in efficiency and<br />

flexibility for the sensor manufacturer.<br />

SMT Hybrid Packaging, Booth 4–309; 4–309A; 4A-230<br />

www.asm-smt.com; www.vega.com<br />

Zusammenfassung<br />

Ein Hersteller von Füllstands- und Druckmesstechnik für die Prozessindustrie<br />

produziert sämtliche Elektronik für die Messgeräte im<br />

eigenen Haus auf drei SMT-Linien mit ASM-Lösungen. Der Artikel<br />

zeigt auf, wie durch die enge Zusammenarbeit beider Unternehmen<br />

der komplette Prozess durch einen optimierten Materialfluss erheblich<br />

verbessert werden konnte.<br />

Résumé<br />

Un fabricant de technologie de mesure de niveau et de pression<br />

pour l‘industrie des procédés, produit en interne toute l‘électronique<br />

pour les appareils de mesure, sur trois lignes CMS avec les<br />

solutions d’ASM. L‘article d‘écrit comment la coopération entre les<br />

deux entreprises a considérablement amélioré l‘ensemble du processus,<br />

grâce à un flux de matériaux optimisé.<br />

Резюме<br />

Производитель оборудования для измерения уровня и<br />

давления в промышленности с непрерывными<br />

технологическими процессами производит всю электронную<br />

начинку измерительных приборов самостоятельно на трех<br />

линия поверхностного монтажа с применением решений ASM.<br />

В статье рассказывается, каким образом тесное<br />

сотрудничество между обеими компаниями помогло<br />

оптимизировать весь процесс за счет улучшения движения<br />

материалов.<br />

46 <strong>EPP</strong> EUROPE May 2018


PRODUCT UPDATES<br />

PCB + ASSEMBLY<br />

Flexible adhesive for hard to bond plastics with<br />

light curing capability<br />

Panacol has developed an extremely<br />

flexible adhesive, which<br />

adheres particularly well to hard<br />

to bond plastics including Peek:<br />

Vitralit UV 4802 is a one-component<br />

acrylic system that cures<br />

very fast when exposed to light.<br />

This light curing adhesive is<br />

based on acrylate resin, which<br />

features excellent adhesion to<br />

many plastics, such as Peek, Pen<br />

and TPU, which are typically hard<br />

to bond with conventional adhesives.<br />

This adhesive also adheres<br />

very well to ceramics and glass.<br />

Vitralit UV 4802 is highly resistant<br />

to heat: tests have shown<br />

that the adhesive keeps its soft<br />

and flexible characteristics even<br />

after being exposed to temperatures<br />

of 150 °C for seven days.<br />

Thanks to its high flexibility, it is<br />

perfectly suited for bonding thin<br />

and bendable materials.<br />

This light curing adhesive adheres well<br />

to ceramics, glass, and many plastics.<br />

This adhesive is of pink color and<br />

cures within seconds under a UV<br />

or visible light source. Both gas<br />

discharge lamps and LEDs, like<br />

the LED Spot 100 from Hoenle,<br />

are suitable for curing. Once<br />

cured, the adhesive fluoresces<br />

which enables inspection of the<br />

bond line under black light.<br />

www.panacol.com<br />

Source: Panacol-Elosol GmbH<br />

Cleaning machine improves surface<br />

area adhesion<br />

Anda Technologies USA, Inc., a<br />

provider of fluid application and<br />

custom design manufacturing<br />

equipment, announced that its<br />

technologically advanced atmospheric<br />

plasma treatment cleaning<br />

machine, the AP-460, removes<br />

all impurities and contaminants<br />

(including dust, grease<br />

and dirt, as well as static electricity),<br />

improving surface area adhesion.<br />

The unique, high-speed AP-460<br />

is a low-cost, in-line machine that<br />

boasts a sleek exterior with integrated<br />

aluminum frame, and can<br />

help achieve higher productivity.<br />

It is equipped with IPC + motion<br />

control card and Windows 7 OS,<br />

as well as two programming<br />

modes to meet various needs.<br />

The company offers precision<br />

coating, high-speed dispensing,<br />

plasma cleaning, high-precision<br />

Source: Anda Technologies USA, Inc.<br />

laminating and customized dispensing<br />

solutions. They serve<br />

the PCBA, 3D glass, camera<br />

module, CCM, fingerprint module<br />

and semiconductor industries.<br />

www.anda.us<br />

The AP-460 cleaning machine removes<br />

dust, grease and dirt, and static electricity.<br />

<strong>EPP</strong> EUROPE May 2018 47


PCB + ASSEMBLY<br />

Zero-fault production in soldering processes<br />

Quality management based<br />

on quality assurance<br />

A production process free from defects, with every step being reproducible and traceable, is the target of<br />

quality assurance in electronics production worldwide. In many cases, manual rework processes are not<br />

allowed due to quality related reasons and cost issues. It is time consuming and cost-intensive, and hidden<br />

costs need to be considered, such as productivity rates or personnel training. Because of this, assemblies<br />

with defects often go through the production process a second time. However, in this case the entire board<br />

is exposed to the thermal load, not only the faulty solder connections, which can affect the overall product<br />

reliability. An automated zero-fault production concept can provide a cost-effective solution. Automated<br />

process control and integrated automated rework enable a soldering process free from defects and is<br />

completely documented.<br />

Heike Schlessmann, SEHO Systems GmbH, Kreuzwertheim, Germany<br />

Source: SEHO Systems GmbH<br />

Solder bridges are one of the most frequently experienced solder defects.<br />

Process challenges: Compared to other automated processes,<br />

selective soldering is considered demanding. Structures with<br />

small pitches result in a small process window, variable parameters<br />

such as flux quantity, temperatures or wetting time, play a decisive<br />

role in terms of solder joint quality and reliability. In addition, material-related<br />

influences have to be considered.<br />

The zero-fault production concept: A controlled and reliable process<br />

is a basic requirement for approaching a zero-fault production. Besides<br />

the selective mini-wave soldering process with monitoring<br />

and control functions for all process steps, the zero-fault production<br />

concept incorporates integrated automated optical inspection (AOI)<br />

of the solder joints, as well as, a defined and automated rework soldering<br />

process at the fault coordinates, corresponding to the fault<br />

classification. This is an advantage from the technical processing<br />

point of view since only defective solder joints go through the process<br />

again, not the entire board. As all work stations are linked with<br />

a bi-directional data transfer, all process steps are completely traceable<br />

and reproducible. In addition, analysis of trend and series faults<br />

allows process optimization at an early stage. This applies particularly<br />

for component placement and the soldering process, however,<br />

design faults can quickly be identified as well.<br />

With a focus on the critical issues in a selective soldering<br />

process, this paper will describe all process steps<br />

that need to be controlled to ensure consistently high<br />

product quality. In addition, it will describe a production<br />

concept enabling automated rework with minimal<br />

thermal exposure for the assemblies. This paper and<br />

presentation was first presented at the 2018 IPC Apex<br />

Expo Technical Conference and published in the 2018<br />

Technical Conference Proceedings.<br />

Introduction<br />

One of the most frequently experienced solder defects<br />

is the formation of solder bridges. As for many<br />

typical solder defects, the root cause might be several factors. Particularly<br />

in lead-free applications, the reduced wetting-force of the<br />

solder alloy contributes to a changing flow behavior, which may result<br />

in bridging. Solder bridges, however, also might be caused by<br />

an inadequate quantity of flux applied to the solder joints or insufficient<br />

preheating of the assembly.<br />

Insufficient solder through-hole penetration is another typical process-related<br />

soldering defect and besides the option that the connecting<br />

partners, e.g. the printed circuit board and/or the component,<br />

show poor solderability, this defect is often related to a poor<br />

heat balance. Moreover, an insufficient flux quantity can also be the<br />

reason for this defect.<br />

Another typical solder defect which might occur in selective soldering<br />

processes is the formation of solder icicles. Most frequently,<br />

icicles are caused by an insufficient preheat process or inadequate<br />

energy transfer during the soldering process. But also insufficient<br />

flux application can be a reason for icicle formation.<br />

These are only some of the possible soldering defects and in many<br />

cases they are related to the flux application process or the heat<br />

transfer rate, while preheating the assembly or during the soldering<br />

process. Therefore, a controlled and reliable process is a basic<br />

requirement for approaching a zero-fault production.<br />

48 <strong>EPP</strong> EUROPE May 2018


PCB + ASSEMBLY<br />

Source: SEHO Systems GmbH<br />

Real-time flux quantity monitoring.<br />

Cross sensor for wave height control and automatic tool measurement.<br />

Source: SEHO Systems GmbH<br />

Measuring needle to control the wave height.<br />

Monitoring the fluxing process<br />

The flux makes soldering process possible, it removes the existing<br />

oxide layer and avoids re-oxidation, to allow a proper wetting process.<br />

Enough flux must be brought to the solder joints to achieve<br />

sufficient hole fill in the soldering process. On the other hand, residues<br />

on the PCB should be minimized, when using a no-clean flux<br />

type and if additional costs for a cleaning process are to be avoided.<br />

Flux residues can result in a significant loss of quality, in extreme<br />

cases causing total failure of the product. Therefore, fluxer monitoring<br />

systems are essential. There are different methods to monitor<br />

the flux deposition. The easiest way, but not the most reliable, is to<br />

monitor the function of the fluxer drop jet nozzle. Usually, this is performed<br />

in a test cycle using an appropriate sensor which is wetted,<br />

prior to the actual flux application in production. This method assures<br />

the function of the fluxer nozzle at the time of the test, however,<br />

it does not permit any conclusions to the actual production<br />

process and the flux quantity being applied to the printed circuit<br />

board cannot be clearly defined.<br />

Real-time monitoring of the flux quantity during flux deposition in<br />

the production process is more reliable. Here, the system monitors<br />

the flux quantity that is jetted to the printed circuit board during the<br />

fluxing process. The captured value is compared with the nominal<br />

Source: SEHO Systems GmbH<br />

values set in the soldering program and in case of any deviation, an<br />

error message will be initiated. In addition, the cause of the error, as<br />

well as, the name of the faulty geometry can be displayed. As this<br />

method is based on a real-time system, it ensures the highest reliability<br />

and stable process conditions without any influence on the<br />

cycle time.<br />

Control of the preheat process<br />

Monitoring of the preheat temperatures is essential to ensure reproducible<br />

temperature profiles which again are required for activation<br />

of the flux. One of the most common and most reliable<br />

methods to monitor and control the preheat temperature is the use<br />

of infrared thermometry. Depending on the temperature, each object<br />

emits a certain amount of infrared radiation. Changing the temperature<br />

of the object goes along with a change of the intensity of<br />

the radiation. The wavelength range used for infrared thermometry,<br />

the so-called “thermal radiation”, ranges between 1 μm and 20 μm.<br />

The intensity of the emitted radiation depends on the material. This<br />

material-specific constant is described with the help of the emissivity<br />

which is a known value for most materials.<br />

Infrared thermometers are optoelectronic sensors. They calculate<br />

the surface temperature based on the emitted infrared radiation<br />

from an object. The most important feature of the thermometers is<br />

the measurement of the objects without contact. Consequently,<br />

this helps to measure the temperature of inaccessible or moving<br />

objects without difficulties.<br />

In connection with the appropriate software, the required preheat<br />

temperature can be preset for a printed circuit board which allows a<br />

gradient-controlled preheat temperature profile.<br />

Controlling the soldering process<br />

Particular attention should be given to the soldering area – the heart<br />

of the process. There are many variables which can influence the<br />

soldering results. For example, the temperature of the solder alloy<br />

and the solder level in the solder bath, which should be continu-<br />

<strong>EPP</strong> EUROPE May 2018 49


PCB + ASSEMBLY<br />

AOI system integrated in a selective soldering machine.<br />

Source: SEHO Systems GmbH<br />

Concept of an automated “zero-fault production line”.<br />

Source: SEHO Systems GmbH<br />

ously monitored and automatically controlled. Due to the very small<br />

solder nozzle geometries that are used in selective soldering processes,<br />

it is important to ensure a constant and stable wave height<br />

which is decisive for a sufficient energy transfer to ensure a reproducible<br />

soldering quality.<br />

Multi-wave systems typically use an eddy current sensor to control<br />

the solder wave height and it simultaneously monitors the solder<br />

level in the solder pot. A measurement funnel, which has the same<br />

level as the solder nozzles, is connected with the pump channel.<br />

Based on the principle of communicating tubes, which is an indirect<br />

measurement, the same solder wave height arises at the solder<br />

nozzles and at the measurement funnel. The signal of the eddy current<br />

sensor is continuously compared with a nominal value to keep<br />

the wave height stable.<br />

The easiest method to measure the wave height in single nozzle<br />

mini-wave processes is using a measuring needle made of titanium<br />

or any other resistant material, which performs a contact measurement<br />

at the surface of the solder wave. This causes an electrical signal<br />

and the pump speed is regulated to the necessary speed to<br />

achieve the preset wave height. As the measuring needle only carries<br />

out a contact measurement and does not dip into the solder, it<br />

is important to keep the atmosphere stable. Changes in the surface<br />

tension can lead to different measurement results.<br />

Alternatively, the wave height can automatically be controlled using<br />

a laser measuring system. The measurement procedure is performed<br />

simultaneously with the production, and therefore, there is no influence<br />

on the cycle time. In addition, any change of the pump<br />

speed affects the measuring signal quickly. The direct measurement<br />

of the wave height also recognizes soiling in the nozzle system,<br />

which could affect the soldering results. The wide measuring range<br />

of the sensor and the adjustment to zero at the top edge of the<br />

solder nozzle enable the use of nozzles with different height.<br />

A newly developed wave height measurement system is a cross<br />

sensor that takes over several functions. On the one hand, the wave<br />

height in mini-wave soldering processes is precisely controlled. The<br />

measurement is made directly at the solder nozzle, without having<br />

to touch anything, and it is fully independent from the solder alloy<br />

used. In addition, the cross sensor is also used for automatic tool<br />

measurement: diameter, height, and mounting position of the<br />

solder nozzle are automatically controlled, thus excluding potential<br />

operator errors. The cross sensor carries out another task if additional<br />

processes are installed, such as, a brushing process for the<br />

removal of solder balls. Here, the cross sensor also monitors the<br />

condition of the brush and automatically indicates the need for a replacement<br />

if the brush is worn to a certain level.<br />

Additional control functions help to improve<br />

process reliability and stability<br />

Additional automatic monitoring and control functions help to avoid<br />

potential soldering defects or to eliminate operator errors. Such control<br />

functions, for example, are the automatic position correction of<br />

the x, y and z value for assemblies which show misalignment or<br />

warpage. Furthermore, an intelligent tool management based on<br />

sensors and software tools recognizes the current solder nozzle setup<br />

and assures that only printed circuit boards are allowed to enter<br />

the selective soldering system that are designed to be processed<br />

with this set-up.<br />

Due to the comparatively small solder volume that is available for<br />

energy transfer, selective soldering processes use relatively higher<br />

solder pot temperatures up to 320 °C. This goes along with an increased<br />

risk for oxidation. Selective soldering systems generally are<br />

operated in a nitrogen atmosphere. While the mini-wave in a nitrogen<br />

environment shows a controlled solder flow, the liquid solder<br />

rapidly oxidizes as soon as the inert atmosphere is lost. The solder<br />

flow then can be deflected easily and can hardly be controlled,<br />

which makes it difficult to produce reliable solder connections. Various<br />

control methods can be used to ensure a stable nitrogen atmosphere<br />

during the process. The quality of the supplied nitrogen<br />

can be monitored by measuring the rest-oxygen value at the nitrogen<br />

feed-in. This is particularly useful if a nitrogen generator is<br />

connected. It is also possible to permanently control the nitrogen<br />

quantity at the gas supply of the soldering unit. Here, an individual<br />

value that is needed for the specific process can be set in the soldering<br />

program (l/min).<br />

Integrated automated optical inspection and<br />

automated rework<br />

100 % process control is given with an AOI system that is integrated<br />

directly in the selective soldering machine, which offers significant<br />

benefits in view of the total production line. Soldering defects<br />

will be detected early, analysis of trend and series fault information<br />

allows process optimization at an early stage to reduce<br />

the overall defect rate. This particularly applies for component placement<br />

and the soldering process, however, design related defects<br />

50 <strong>EPP</strong> EUROPE May 2018


PCB + ASSEMBLY<br />

can quickly be identified as well.<br />

The inspection of one assembly is performed in parallel to the soldering<br />

process of the following assembly to ensure short cycle<br />

times. The integrated AOI system allows the inspection of solder<br />

joints for remaining solder balls, non-wetting or insufficient wetting,<br />

missing pins, bridging or removed neighboring SMD components.<br />

As the soldering unit and the AOI system are using the same x/y<br />

axis system, this solution also provides high efficiency.<br />

In a subsequent separation module, assemblies without defects<br />

and assemblies with defects are automatically separated. Verification<br />

and classification of soldering defects is made at a verify<br />

work place. Afterwards, the assembly can be processed with another<br />

soldering system, or alternatively can pass through the same<br />

selective soldering machine a second time. In both cases, an automatic<br />

rework process will be performed exclusively at the solder<br />

joints that were classified with a defect. This is a large advantage<br />

from the technical processing point of view, as only defective solder<br />

joints go through the process again, not the entire board. As all<br />

work stations of this production concept are linked with a bi-directional<br />

data transfer, all process steps are completely traceable and<br />

reproducible.<br />

Conclusion<br />

To ensure consistently high product quality and finally reach a zerofault<br />

production stage, it is necessary to control all process steps.<br />

Manual rework is costly and does not always provide the required<br />

quality. In addition, manual rework is difficult to trace. Automated<br />

control functions and – if necessary – automated rework offer both<br />

repeatability and traceability, which are independent from human<br />

actions.<br />

SMT Hybrid Packaging, Booth 4–141<br />

www.seho.de<br />

WELLER TECHNOLOGY LINE<br />

High flexibility for versatile applications<br />

Up to 150 Watts power<br />

User friendly, stackable units<br />

Zusammenfassung<br />

Mit Fokus auf die kritischen Punkte eines selektiven Lötprozesses<br />

beschreibt der Artikel alle benötigten Prozessschritte, um eine konstant<br />

hohe Produktqualität sicherzustellen. Zusätzlich wird ein Produktionskonzept<br />

beschrieben, welches einen automatisierten Reworkprozess<br />

mit minimaler Belastung für die Baugruppen ermöglicht.<br />

Résumé<br />

Sur les points essentiels d’un procède de soudure sélectif, l‘article<br />

décrit toutes les étapes nécessaires pour constamment garantir<br />

une haute qualité de produit. D’autre part, un concept de production<br />

est décrit, qui permet un procède de reprise automatique avec<br />

un minimum de tension sur les assemblages.<br />

Резюме<br />

В статье рассматриваются критически важные аспекты<br />

селективной пайки и описываются необходимые шаги для<br />

обеспечения стабильно высокого качества продукции.<br />

Дополнительно описывается концепция производства,<br />

обеспечивающая автоматизированную доработку брака с<br />

минимальной нагрузкой на узлы.<br />

Best in class – attractive price/performance ratio<br />

Maximum flexibility: backwards compatible with<br />

existing soldering tools<br />

Comprehensive range of accessories<br />

Nuremberg, 05 – 07.06.2018<br />

Generation WT<br />

product video<br />

weller-tools.com<br />

<strong>EPP</strong> EUROPE May 2018 51


PCB + ASSEMBLY<br />

Controlling the cold-light shift effect and reducing electrical power failures<br />

Managing colour temperature<br />

and heat of LED assemblies<br />

While LEDs are generally simple to apply for the user, manufacturers are faced with two challenges when dealing<br />

with their production. On the one hand, the conformal coating of luminescence conversion LEDs, which is applied to<br />

ensure a reliable operation, brings about an undesired displacement from the original colour temperature towards<br />

cold white light of blueish appearance, referred to as the cold-light shift. On the other hand, the operating heat<br />

which can be significant especially when using high power LEDs, needs to be dissipated in order to maintain the<br />

radiation power and to extend the lifespan.<br />

Source: Lackwerke Peters GmbH & Co. KG<br />

Functioning of Jetset solution.<br />

Spectrum of an LED in non-potted and potted condition and with<br />

Jetset solution (nano-primed and potted).<br />

Source: Lackwerke Peters GmbH & Co. KG<br />

The colour temperature (CCT – Correlated Colour Temperature) of<br />

white LEDs is produced by luminescent colourants transforming<br />

a portion of the short-wave blue light into long-wave yellow light,<br />

which will give a white light. In the potting process, the colour temperature<br />

on the interface between the conversion layer/potting interface<br />

is displaced, due to physical influence, towards the short-wave<br />

blue area and will therefore appear colder. The desired warm portion<br />

of the light provoked by its yellow portion will disappear.<br />

Subject to poor/irregular adhesion, this effect may be more or less<br />

intense, which will result in different colour temperatures. In order<br />

to achieve both a consistent colour temperature and a reliable protection,<br />

a homogeneous and good adhesion of the potting is indispensable.<br />

Jetset solution by Lackwerke Peters provides a solution to control<br />

the cold-light shift effect: The Elpecast Nano Primer NP 4 LED is applied<br />

in a very thin layer on the LEDs, evenly and reproducibly, prior<br />

to potting. Once the solvent formulated has completely evaporated,<br />

a fine film will be left on the LEDs. Subsequent potting with a crystal-clear<br />

Elpecast casting compound will prevent the shifting of the<br />

LEDs’ colour temperature and ensure an even result through optimum<br />

adhesion.<br />

Classical heat transfer – microscopic<br />

air inclusions reduce the contact area<br />

and lower heat dissipation.<br />

The solution causes repeated passage of the light through the conversion<br />

layer, which converts blue light portions into yellow ones.<br />

Depending on the quantity of primer applied, one can achieve a precise<br />

colour temperature. All depending on the luminescent colourants<br />

present in the conversion layer, as well as, on the geometry,<br />

the surface, the performance and the initial colour temperature of<br />

the LEDs.<br />

Thermal management of LEDs<br />

Based on silicone resins, the Elpepcb Thermal Interface Paste, TIP<br />

2792, is applied on the interface between the printed circuit board<br />

and the heatsink or heat-dissipating casing. Due to its elasticity, it<br />

Source: Lackwerke Peters GmbH & Co. KG<br />

52 <strong>EPP</strong> EUROPE May 2018


PCB + ASSEMBLY<br />

Source: Peter Roskothen<br />

Side view of LED strips. The middle is the initial state (non-potted),<br />

left is the cold light shift, and the right is with the Jetset solution.<br />

Depending on the quantity of primer applied, a precise colour temperature can<br />

be achieved.<br />

Source: Lackwerke Peters GmbH & Co. KG<br />

Heat transfer with printed thermal interface paste.<br />

Source: Lackwerke Peters GmbH & Co. KG<br />

ensures a reliable thermal connection and improves the heat<br />

transfer and heat dissipation while the operating heat is efficiently<br />

lowered. Heat vias can be safely filled with this paste in view of enlarging<br />

the thermal interface. Applied by screen printing in different<br />

structures and layer thicknesses, it is less costly than heat-conductive<br />

metal foils, for example, which have to be cut to fit their respective<br />

application.<br />

Selective coating and curing is made at the PCB manufacturer’s site<br />

prior to soldering, on the bare printed circuit board in the desired<br />

layout. This way, the user already receives the printed circuit boards<br />

with the TIP. As an alternative, by using the heatsink pastes, one can<br />

fully dispense with heat-conductive metal sheets and thus reduce<br />

the number and size of thermal transfer resistances. Based on<br />

epoxy resins, these are highly heat-conductive, electrically insulating<br />

1-pack screen printing inks which are an alternative to commonly<br />

used cooling elements. The heatsink pastes can be directly printed<br />

in heat vias and on the metal surfaces of the printed circuit board.<br />

Since there is no need for an insulating adhesive layer, the results<br />

are similar to those achieved with metal foils.<br />

It is also possible to combine the two thermal interface pastes in applications,<br />

where high insulation properties are required. In this<br />

case, HSP 2740 is printed in the heat vias and on the surfaces of the<br />

printed circuit board first, followed by the printing of TIP 2792 on<br />

top, in order to ensure a good connection to the heatsink. This not<br />

only increases the PCB’s reliability, but also the lifespan of the individual<br />

components.<br />

A thermal management aimed at a higher radiation performance of<br />

LEDs and a longer lifespan of assemblies and high power devices<br />

can be easily achieved through an efficient reduction of the operational<br />

heat by means of the two pastes. This also reduces the electrical<br />

power failures and a higher lumen/Watt performance can be<br />

reached.<br />

www.peters.de<br />

Zusammenfassung<br />

Während LEDs für den Verbraucher in der Regel unkompliziert in<br />

der Nutzung sind, stehen die Hersteller vor Herausforderungen bei<br />

der Produktion: So bringt die Schutzbeschichtung von Lumineszenzkonversions-LEDs<br />

eine unerwünschte Verschiebung von der<br />

ursprünglichen Farbtemperatur. Ebenso muss die Betriebswärme<br />

abgeführt werden, um den Lebenszyklus zu verlängern. Im Artikel<br />

wird der Einsatz von Jetset Solution und Wärmeleitpasten behandelt,<br />

welche die Produktion bzw. das Management von LEDs hinsichtlich<br />

ihrer Farbtemperatur und Wärmeentwicklung vereinfacht.<br />

Résumé<br />

Alors que les LED sont généralement faciles à utiliser pour le consommateur,<br />

les fabricants sont confrontés à des problèmes de production:<br />

le revêtement protecteur des LED de conversion de luminescence,<br />

par exemple, provoque un décalage indésirable par rapport<br />

à la température de couleur d‘origine. De même, la chaleur de<br />

fonctionnement doit être dissipée pour prolonger la durée des LED.<br />

L‘article traite de l‘utilisation de Jetset Solution et de la graisse<br />

thermique, qui simplifie la production et la gestion des LED en<br />

termes de température de couleur et de développement de la chaleur.<br />

Резюме<br />

Для потребителя светодиоды не представляют никакой<br />

сложности в использовании, однако производителям часто<br />

приходится сталкиваться с серьезными проблемами при<br />

производстве: Так, например, защитное покрытие<br />

светодиодов с конверсионным люминофором приводит к<br />

нежелательному сдвигу изначальной цветовой температуры.<br />

При этом необходимо также отводить тепло для продления<br />

срока службы. В статье рассматривается использование Jetset<br />

Solution и термопаст, упрощающих производство и<br />

эксплуатацию светодиодов, а также снижающих влияние<br />

таких факторов, как цветовая температура и тепловыделение.<br />

<strong>EPP</strong> EUROPE May 2018 53


PCB + ASSEMBLY<br />

PRODUCT UPDATES<br />

Building depanelling machines according to the modular principle<br />

The modular design of the ILR-2200 depanelling machine can be easily and<br />

quickly adapted to new challenges.<br />

Schunk Electronic Solutions<br />

brings the ILR-2200 to market. It<br />

is a fully automatic inline depanelling<br />

machine with a modular<br />

design, that separates individual<br />

printed circuit boards from large<br />

entire PCBs (panel), by using a<br />

milling module. „Electronics producers<br />

buy a cost-effective basic<br />

version and can retrofit the ma-<br />

chine at any time with milling and<br />

gripping modules, a camera system<br />

or a second, or even a third,<br />

printed circuit board handling<br />

that minimizes dead times,“ explains<br />

Jochen Ehmer, Managing<br />

Director. „The machine grows<br />

with the needs of the companies.<br />

This flexibility makes<br />

companies ready for the Industry<br />

Source: Schunk Electronic Solutions<br />

4.0 era, in which production environments<br />

must become more<br />

agile.“ The ILR-2200 will be available<br />

in the middle of this year.<br />

Short cycle times with positioning<br />

accuracy<br />

Users benefit from short cycle<br />

times. The panels reach the machine‘s<br />

interior in less than two<br />

seconds via a linear motor highspeed<br />

feed. There, a milling module<br />

separates the PCBs with an<br />

accuracy of ± 0.1 mm. Due to the<br />

linear motor axes and modern<br />

control technology, the modules<br />

achieve a traverse speed of two<br />

meters per second when milling<br />

and ten meters per second when<br />

sawing.<br />

The separated PCBs are placed<br />

on a conveyor belt or in a shuttle<br />

system using a gripper to be<br />

transported for further processing.<br />

The gripper works with a programmable<br />

angular position and<br />

achieves positioning accuracy of<br />

± 0.02 mm. This corresponds to a<br />

third of the diameter of a human<br />

hair. This accuracy ensures that<br />

sensitive components are not<br />

damaged. Milling and sawing are<br />

also simultaneously active in one<br />

depanelling machine. „Through<br />

the eliminated set-up times and<br />

maintenance-free linear motor<br />

axes, the production flow rate increases,“<br />

says Ehmer.<br />

Availability of over 98 percent<br />

Users also benefit from fail<br />

safety and low energy costs.<br />

„The ILR-2200 depanelling machine<br />

has a proven technical<br />

availability of over 98 %,“ according<br />

to Ehmer. „And the power<br />

consumption of a two-shuttle<br />

version is only 800 Watt – hardly<br />

more than the energy consumption<br />

of a microwave.“<br />

SMT Hybrid Packaging,<br />

Booth 4–459<br />

www.schunk.com<br />

Straightforward tool for minimizing voids<br />

Requirements for void-free<br />

solder joints are continuously<br />

increasing in the field of electronics<br />

manufacturing, i.e. the<br />

reduction or elimination of cavities<br />

in the connection technology<br />

used between component<br />

connectors and connector<br />

pads. With its Void Expert database,<br />

Rehm is offering a tool<br />

which provides an overview of<br />

influencing factors and interaction<br />

amongst the mechanisms<br />

which result in voids.<br />

The occurrence of voids is<br />

surely one of the most interesting<br />

phenomena associated<br />

with soft soldering. As a rule,<br />

voids can be found in most<br />

solder joints, which are formed<br />

as the result of gas which is<br />

trapped in the molten solder.<br />

When the molten solder<br />

hardens, these gas bubbles<br />

are frozen into place.<br />

The reliability of most solder<br />

joints is not necessarily influenced<br />

decisively by voids contained<br />

within them, although<br />

there are exceptions. For<br />

example, sensitivity to voids is<br />

taking on new dimensions with<br />

regard to evolving package<br />

trends such as LGAs and QFNs.<br />

The greater the power loss<br />

which has to be dissipated via a<br />

solder joint, the lower its tolerability<br />

to voids is. In particular<br />

solder joints in power semiconductor<br />

devices should be nearly<br />

void-free.<br />

This expert database makes a<br />

considerable contribution to<br />

understanding the mechanisms<br />

involved in the occurrence of<br />

voids and outgassing, and identifying<br />

the essential influencing<br />

variables. Influencing variables<br />

and the ways in which they interact<br />

are explained in a very clear-<br />

Überschrifcut<br />

manner with reference to the<br />

respective response variables.<br />

Various graphics and Pareto<br />

charts help to clarify the interrelationships,<br />

which are quite complex<br />

in some cases. This allows<br />

the user to draw conclusions regarding<br />

how voids can be minimized<br />

for certain applications.<br />

The expert database, developed<br />

by Dr. Heinz Wohlrabe from the<br />

Dresden Technical University,<br />

presents results which are based<br />

on work conducted by the voids<br />

workgroup and knowledge<br />

gained through previous projects<br />

(in some cases subsidized projects),<br />

as well as the international<br />

literature. Experiments conducted<br />

to this end were evaluated<br />

by means of statistical<br />

methods.<br />

The database is continuously updated<br />

with findings and can be<br />

obtained from the company.<br />

Source: Void Expert Datenbank<br />

This is an example of typical voids<br />

that are formed as the result of gas<br />

which is trapped in the molten solder.<br />

Fließtext std<br />

Advantages at a glance:<br />

• Database with selectable access<br />

to experimental results<br />

and comparison thereof as<br />

desired<br />

• Graphics export<br />

• Section with comprehensive<br />

documentation<br />

SMT Hybrid Packaging,<br />

Booth 4A-100<br />

www.rehm-group.com<br />

54 <strong>EPP</strong> EUROPE May 2018


Improving the long term reliability of PCBs<br />

Orbotech Ltd., a supplier of yield-enhancing<br />

and process-enabling solutions for the manufacture<br />

of electronics products, announced<br />

that Protecno, a France-based electronics<br />

manufacturer and part of Groupe GTID, has<br />

purchased the first Orbotech Nuvogo Direct<br />

Imaging (DI) solution to be installed in<br />

France. The electronics manufacturer intends<br />

to leverage this equipment to improve the<br />

long-term reliability of their printed circuit<br />

boards and thus meet the stringent electronics<br />

demands required for harsh environments.<br />

The company specializes in small and medium<br />

series, multilayer rigid flex, hyper frequencies,<br />

HDI and special boards, serving<br />

military, aeronautic, medical, transport<br />

and telecom customers. They are members<br />

of a consortium that is involved in a special<br />

project to design and manufacture a high<br />

density mixed microwave and digital board,<br />

on a multilayer material designed with at<br />

least two different electronic boards or based<br />

on a heterogeneous<br />

substrate material.<br />

“Protecno needed a set<br />

of solutions for rigid and<br />

flex applications that<br />

require superior DoF<br />

(Depth of Focus) for panels<br />

with uneven topology,<br />

high line uniformity<br />

and sharp side walls to ensure<br />

high quality impedance<br />

control,” said Mr. Lucien Traon,<br />

CEO.<br />

Nuvogo 500 is a member of the Orbotech<br />

Nuvogo family of Direct Imaging<br />

(DI) solutions. Utilizing a high-power laser<br />

and unique MultiWave laser technology, it<br />

provides maximum flexibility on a wide range<br />

of materials and applications. Incorporating<br />

the company’s field-proven Large Scan Optics<br />

(LSO) technology with its high depth-offocus,<br />

it is a perfect match for QTA, Flex and<br />

MLB patterning applications that demand<br />

Source: Orbotech Ltd.<br />

The Nuvogo<br />

500 is a Direct<br />

Imaging solution with<br />

unique MultiWave laser technology.<br />

fine structures on variating topography. This<br />

powerful system is designed for fast<br />

throughput while maintaining optimal quality.<br />

www.orbotech.com; www.protecno.fr<br />

<strong>EPP</strong> EUROPE May 2018 55


PCB + ASSEMBLY<br />

Certified legal certainty when dealing with soldering waste<br />

Environmentally-friendly<br />

disposal of tin waste<br />

According to Article 8 of the Directive 2008/98/EC of the <strong>Europe</strong>an parliament and of the council, assemblers of electronic<br />

components are liable for their soldering waste for as long as they retain their waste character as regulated in<br />

Article 6 of the same Directive 2008/98/EC. However, it is still common today for most companies to send their old solder<br />

to new solder suppliers or sell it to scrap dealers. The commissioning of third parties presents a high risk of legal uncertainty,<br />

since if the waste is handled improperly by the recipient, legal consequences may ensue for the manufacturer.<br />

In <strong>Europe</strong>, the component assembler is responsible for its waste until the end<br />

of the disposal chain. This obligation only expires when the materials lose<br />

their waste character.<br />

MTM NE-Metalle GmbH, located in Germany, is certified for the<br />

handling of old solder according to ISO 9001: 2015, offers<br />

free, up to date factual advice, and is qualified to recommend appropriate<br />

solutions for disposal of these materials. Due to being certified<br />

along with their extensive experience, they are a first port of<br />

call for component assemblers when it comes to managing solder<br />

waste. They also offer training in handling these harmful materials.<br />

“We work with around 300 tons of solder waste per year, and we<br />

are a large service provider in <strong>Europe</strong> for the recycling of used<br />

solder material”, says Dan Mutschler, Managing Director. “Using our<br />

expertise, we can support any component manufacturer that needs<br />

to take care of their waste.” The company guarantees legal certainty<br />

when disposing of solder waste by keeping documentation in which<br />

the recycling process is precisely recorded for auditing purposes.<br />

Efficient handling and a short supply chain saves<br />

money and time<br />

“When dealing with used solder material, sorting is important to ensure<br />

high recovery rates and effective utilization”, Mutschler explains;<br />

“Simply mixing the solder waste makes neither economical<br />

nor ecological sense, since it makes reprocessing much more difficult.<br />

This is inconsistent with the concept of sustainable recycling<br />

Source: MTM NE-Metalle GmbH<br />

and the functional use of materials.” The various additives, including<br />

nickel, germanium, silver, bismuth and phosphorus, require wellfounded<br />

metallurgical expertise to allow for effective sorting of the<br />

different micro-alloyed solders. In order to respond to these challenges,<br />

the company carries out material analysis using various<br />

spectrometers and x-ray devices. This is the only way to classify the<br />

waste solder so that a qualified recycling process can be selected.<br />

“It is not uncommon that through our accurate material analysis of<br />

the solder waste, component assemblers gain information about<br />

the impurities in their production process, which might otherwise<br />

go unnoticed”, Mutschler reports.<br />

Transport routes can also be better planned when experts for new<br />

and old solder are involved. “When commissioning a third party, the<br />

waste producer, i.e. the component assembler, should seek advice<br />

about regional and national statutes, and in the event that international<br />

disposal agencies are involved, also international statutes”,<br />

Mutschler states. “This can be a huge nightmare of logistical and<br />

legal problems which are beyond the abilities of those not trained or<br />

qualified to handle such matters.” In addition, much of the solder<br />

waste cannot be processed by the solder manufacturers themselves,<br />

so it must then be sold on to specialized metallurgical plants<br />

equipped with special smelting plants, pyrolysis and vacuum distillation<br />

ovens, and electrolysis systems. The company has a well-established<br />

network, with efficient supply chains so that complete<br />

processing and recycling is achieved within a short timeframe, as<br />

well as guaranteeing that the recyclable waste is delivered in an environmentally-friendly<br />

and cost-effective manner to the sites where<br />

it is recycled. This means that there is only one interim storage facility<br />

in which the material is sorted by experts before it is prepared for<br />

the proper recycling pathway.<br />

Containers guarantee environmental protection<br />

and safety at work<br />

Since solder waste can be dangerous, safe transportation is important.<br />

“A risk of transport damage can result in leakage of waste from<br />

ill-chosen packaging for solder waste, such as cardboard cartons,<br />

leading to environmental pollution,” Mutschler explains; “If packaged<br />

incorrectly, even when using waste disposal companies, contaminants<br />

can still gain access by seeping into the material during<br />

the handling process. For the legitimate and safe transportation of<br />

waste from the production site to its final processing location, a<br />

company needs to use special made containers.” The company<br />

supplies material-specialized drums for storage and transport, e.g.<br />

buckets, pails, and drums with capacities from 9 to 216 liters.<br />

56 <strong>EPP</strong> EUROPE May 2018


MTM NE-Metalle GmbH guarantees legal certainty in the disposal of the solder<br />

waste through the provision of appropriate documentation, in which the recycling<br />

process is precisely documented in the event of an audit.<br />

Source: MTM NE-Metalle GmbH<br />

Source: MTM NE-Metalle GmbH<br />

During handling and transport, occupational safety must also be<br />

considered. Pursuant to Article 6 of the Council Directive<br />

89/391/EEC of measures to encourage improvements in the safety<br />

and health of workers, the employer is obliged to pay attention to<br />

the safety needs of employees. For example, excessively large<br />

loads should not be moved around. “From an economical perspective,<br />

it may seem beneficial, if a container with a capacity of 60 liters<br />

is used, and filled to a weight of 100 kg, this poses an unacceptably<br />

high risk of an accident occurring”, warns Mutschler. “For this reason,<br />

we offer suitable handling aids, such as small cranes, so that<br />

the material can be loaded safely and correctly. In addition, we also<br />

advise companies on how they can best manage and deal with their<br />

waste.”<br />

Training sessions can serve to sensitize and qualify<br />

employees<br />

“Many companies are specialized in the production of component<br />

assemblies and are familiar with the corresponding electronics and<br />

DIN standards”, explains Mutschler. “However, the issue of waste<br />

management only plays a subordinate role.” The company offers<br />

training courses to make waste producers aware of waste legislation,<br />

for example the <strong>Europe</strong>an Ordinance on Waste Recovery and<br />

Disposal Records, and packaging regulations. Each material is categorized<br />

according to a code number and must be appropriately<br />

handled. Knowledge is important because not every company has<br />

the required reliability standard. “Many self-proclaimed waste dis-<br />

Source: MTM NE-Metalle GmbH<br />

„When dealing with old<br />

soldered products, sorting<br />

is important to ensure<br />

high recovery rates<br />

and effective utilization”,<br />

explains<br />

Mutschler, Managing<br />

Director.<br />

The German company is certified for the handlings of old solders, according to<br />

ISO 9001:2015, and offers free, correct, and effective advice, as well as, solutions<br />

for subsequent disposal.<br />

posal companies often do not have sufficient knowledge of waste<br />

disposal law, nor do they have environmental liabilities, let alone<br />

sufficient liability, to cover insurance claims. Since the waste producer<br />

can also be held liable after the commissioning of third parties,<br />

we strongly advise against using such disposal companies”,<br />

Mutschler states, “In our training courses, we draw attention to the<br />

usual pitfalls, so that companies can recognize who they should be<br />

working with. The different obligations regarding documentation are<br />

also covered. We educate companies about the recycling process,<br />

as well as what they need to ensure for storage and transport of<br />

materials. Complex logistical and physical processes are involved,<br />

which at first glance may not even be suspected”, reports Mutschler.<br />

With this training, companies will know what to look for, and be<br />

well informed of the ecological and economical mode of disposal.<br />

SMT Hybrid Packaging, Booth 4–215<br />

www.mtm-ne.de<br />

Zusammenfassung<br />

Bei einer unsachgemäßen Behandlung von Lotabfällen drohen juristische<br />

Konsequenzen für den Elektronikhersteller. Hier können<br />

sich Betriebe durch einen Händler helfen lassen, der deutschlandweit<br />

für das Handling von Altloten zertifiziert ist sowie eine effektive<br />

Beratung inklusive anschließender Entsorgungsmöglichkeit bietet.<br />

Résumé<br />

Le mauvais traitement des déchets de soudure pose des problèmes<br />

juridiques pour le fabricant d‘électronique. Ici, les entreprises peuvent<br />

être aidées par un revendeur, qui est certifié pour la manipulation<br />

des eaux usées en Allemagne et offre des conseils avisés, incluant<br />

diverses options pour l‘élimination de ces déchets.<br />

Резюме<br />

Ненадлежащее обращение с отходами, образующимися при<br />

пайке, может привести к серьезным юридическим<br />

последствиям для производителя электроники. В этом случае<br />

предприятия могут обратиться к дилеру, уполномоченному на<br />

транспортировку отходов пайки на всей территории Германии,<br />

который может проконсультировать клиента и предложить<br />

возможности утилизации.<br />

<strong>EPP</strong> EUROPE May 2018 57


PCB + ASSEMBLY<br />

PRODUCT UPDATES<br />

Customized automated systems to reduce costs<br />

The company will focus on equipment productivity<br />

at the SMT show.<br />

Seho Systems GmbH, a manufacturer<br />

of complete solutions<br />

for soldering processes and<br />

automated production lines, will<br />

focus on equipment productivity<br />

at the upcoming SMT Hybrid<br />

Packaging show, scheduled to<br />

take place June 5 – 7, 2018 at the<br />

Messe in Nuremberg, Germany.<br />

With the aim to make the production<br />

process in electronic<br />

manufacturing more efficient and<br />

Source: Seho Systems GmbH<br />

to reduce production<br />

costs sustainably,<br />

the company<br />

extended its<br />

range of automation<br />

solutions<br />

in recent years.<br />

The products<br />

range from board<br />

handling with<br />

conveyor systems<br />

to connect<br />

various machines<br />

and work places<br />

in production lines, buffer systems,<br />

turn stations, e.g. for<br />

changing the direction in manufacturing<br />

lines, lift stations, as<br />

well as transfer units and many<br />

more.<br />

Work places made by the company<br />

are ergonomically designed<br />

and individually adjustable in<br />

height to be adapted to different<br />

operators. All of the connected<br />

stations such as buffers or conveyors<br />

adjust their height automatically.<br />

In addition, a particular<br />

focus is on cobots and robots<br />

that are housed in a multifunctional<br />

production cell. This cell<br />

can be equipped individually so<br />

that the robot may take over several<br />

tasks: For component placement,<br />

for assembly and disassembly<br />

of component downholders,<br />

for loading and unloading<br />

of carriers, for precise positioning<br />

of boards for AOI and<br />

electrical tests, and for removal<br />

of reject parts.<br />

Combined with the innovative<br />

soldering systems, users benefit<br />

from complete solutions that are<br />

perfectly matched both technically<br />

and in regards to production<br />

flow. The company assists customers<br />

with creative ideas in the<br />

planning phase to best meet the<br />

individual production challenges,<br />

and constructs and manufactures<br />

the production line to provide<br />

customized automated solutions.<br />

At the show, the company will<br />

also introduce the redesigned<br />

flagship PowerSelective for the<br />

first time. This selective soldering<br />

system offers the highest<br />

flexibility at simultaneously large<br />

production volumes with minimum<br />

footprint requirements. The<br />

latest generation of this system<br />

presents itself with many new<br />

features, including a gripper system<br />

that can automatically be<br />

turned 360 ° thus leading to remarkable<br />

cost savings in multiwave<br />

processes, or an integrated<br />

AOI system that ensures reliable<br />

soldering results without influencing<br />

cycle time.<br />

SMT Hybrid Packaging, Booth<br />

4–141<br />

www.seho.de<br />

Exhibit of efficient equipment for IoT<br />

IPTE FA participates for the<br />

fourth time in the common<br />

booth “Future Packaging Line”<br />

at SMT in Nuremberg (June 5<br />

– 7). This year the production<br />

line, “Future Packaging Line”,<br />

shows an IoT construction kit<br />

which demonstrates different<br />

scenarios to learn more about<br />

the Internet of Things. Furthermore,<br />

the production line<br />

focuses on quick adaption of<br />

equipment concerning the<br />

products being produced.<br />

On an area of 1.000 m ² not only<br />

is the “Future Packaging Line”<br />

on display, but also a number<br />

of other exhibitors. The following<br />

components are integrated<br />

in the line: the conveying system<br />

“EasyLine”, the Laser<br />

Marking-System “FlexMarker<br />

II” and two EasyTesthandler<br />

“ETH”. The company will also<br />

have their own booth in the<br />

common area, where the dep-<br />

aneling system “EasyRouter”, a<br />

version with increased functionality,<br />

will be presented.<br />

The EasyLine program for boardhandling<br />

of PCBs and ceramic<br />

substrate (Hybrid-) boards can be<br />

easily integrated into production<br />

lines and production processes.<br />

The modules are available in the<br />

sizes small (300 mm), medium<br />

(500 mm), or large (600 mm).<br />

The FlexMarker II is a highly flexible<br />

applicable laser marking system<br />

for processing PCBs featuring<br />

dimensions from 50 to<br />

522 mm (both in width and<br />

length). Depending on customer<br />

requirements, CO2, Fiber, YaG<br />

and UV laser are available. Another<br />

outstanding feature is Verify@Mark,<br />

which verifies the<br />

code immediately after the marking<br />

without compromising cycle<br />

time.<br />

Batch change-over consequences<br />

(such as solder mask<br />

changes) are automatically corrected<br />

using the Verify&Correct<br />

feature. This feature will verify<br />

the marking and correct the laser<br />

settings to ensure highest output<br />

quality, without losing handling<br />

time and with no operator action.<br />

Flipping of the PCB is done without<br />

prior moving the laser to a<br />

secured area, resulting in a handling<br />

time less than one second.<br />

In-Circuit- or functional- test as<br />

well as programming processes<br />

can be inline automated with the<br />

company’s Easy-Test-Handler<br />

ETH. It is practical for the use<br />

with single- circuit boards,<br />

multiple boards or corresponding<br />

carriers for circuit boards. Both,<br />

one- or double-sided fixtures can<br />

be realized. The fixtures can be<br />

changed quickly and easily. For<br />

optional parallel use of more than<br />

one Test-Handler, it can be<br />

equipped with a bypass-segment.<br />

This allows a constant production<br />

process, which is not<br />

interrupted by the testing process.<br />

Moreover, the Bypass<br />

can be used to optimize the<br />

cycle time.<br />

The EasyRouter is an effective<br />

depaneling system for off line<br />

use which offers some new<br />

features. The machine is<br />

equipped with a productive<br />

milling tool featuring a speed<br />

of up to 60 mm/s for the fast<br />

routing of circuit boards from<br />

above. New features, for<br />

example, are increased accuracy,<br />

operator indicator lights<br />

for assistance in handling,<br />

noise level reduction by noise<br />

shielding panels and simulation<br />

of the tool route.<br />

SMT Hybrid Packaging,<br />

Booth 5–434<br />

www.ipte.com<br />

58 <strong>EPP</strong> EUROPE May 2018


Features for next-generation productivity, quality, and throughput<br />

The company will showcase their total line solutions at the SMT show.<br />

Source: Yamaha Motor <strong>Europe</strong><br />

Yamaha Motor <strong>Europe</strong>-SMT Section<br />

will debut advanced printing,<br />

3D print-inspection, and mounting<br />

machines at SMT Hybrid<br />

Packaging in Nuremberg, all featuring<br />

important innovations to<br />

boost productivity and efficiency.<br />

Headlining at the booth, the<br />

company’s printer introduces<br />

fully automated product changeovers<br />

for high-speed error-free<br />

productivity, down to the finest<br />

resolutions for 0201 passives<br />

and fine-pitch flip-chip ICs.<br />

Visitors also get the first opportunity<br />

to see the YSi-SP inline 3D<br />

paste-print inspection machine,<br />

after its global launch in January.<br />

Feeding today’s data-centric<br />

manufacturing, the machine with<br />

statistical process control (SPC)<br />

delivers greater insights into<br />

print-process performance for increased<br />

yield and continuous improvement.<br />

It is engineered for<br />

speed and efficiency using a<br />

single inspection head, with<br />

exclusive algorithms for<br />

2D/3D-image handling and<br />

camera-resolution control.<br />

Also newly launched and meeting<br />

<strong>Europe</strong>an audiences for the<br />

first time, the YSM20R mounter<br />

is built for all-round speed and<br />

flexibility. Extending the performance<br />

and capabilities of the<br />

Z:LEX high-efficiency modular<br />

line-up, it boosts mounting<br />

speed by about 5 % and expands<br />

maximum component dimensions<br />

with scan camera to<br />

12 mm x 12 mm for greater productivity.<br />

With options including<br />

the company’s Auto-Loading<br />

Feeder (ALF), Auto Tray Sequencer<br />

(ATS) for non-stop tray<br />

replacement, and the non-stop<br />

feeder-carriage exchange system,<br />

YSM20R keeps production<br />

moving for maximum efficiency.<br />

In addition, the Σ-G5S II builds on<br />

the success of the high-accuracy,<br />

direct-drive rotary head design<br />

with further innovations that<br />

raise ideal maximum mounting<br />

speed by 20 % to 90,000 cph.<br />

Other new features further boost<br />

productivity, including a revised<br />

circuit-board feeding sequence,<br />

and an enlarged internal buffer<br />

for storing larger boards. Σ-G5S II<br />

retains important innovations<br />

from the Σ-G5S, including diefeature<br />

recognition for repeatable<br />

and optically-accurate LED<br />

placement.<br />

The supporting cast: Intelligent<br />

Factory and tools<br />

At the same time, visitors can<br />

see the latest releases in the Intelligent<br />

Factory software suite,<br />

which unifies all equipment in<br />

the company’s True Total Line<br />

Solution, and gives manufacturers<br />

unrivaled visibility, understanding<br />

and control over SMD<br />

assembly activities on their factory<br />

floor, with help to fix problems<br />

or use predictive maintenance<br />

to maximize uptime and<br />

utilization. The latest new features<br />

of Factory Tools 4.0 include<br />

real-time performance and<br />

feeder-status monitoring, M2M<br />

capabilities that deliver production<br />

data directly to the line<br />

supervisor’s mobile anywhere in<br />

the factory, and database-driven<br />

traceability and statistical process<br />

control (SPC).<br />

The suite now comprises over 20<br />

applications covering setup, programming,<br />

monitoring, and traceability<br />

down to component<br />

and nozzle level. Moreover,<br />

manufacturing managers can<br />

customize the tools to meet their<br />

needs, such as optimizing one<br />

line, coordinating with automated<br />

component towers, or<br />

streamlining changeovers. Factory<br />

Tools 4.0 can also help simplify<br />

feeder management, optimize<br />

production on multiple<br />

lines, and satisfy the quality demands<br />

of markets like automotive,<br />

medical or aerospace.<br />

SMT Hybrid Packaging, Booth<br />

4–319<br />

www.yamaha-motor-im.eu<br />

Clear flame retardant PU resin suited for LEDs<br />

As the demand for LED encapsulation<br />

increases, the electrochemicals<br />

manufacturer, Electrolube,<br />

has developed an optically<br />

clear, flame retardant resin.<br />

Traditionally, in order to obtain<br />

the desired flame retardancy,<br />

resin manufacturers have used<br />

solid fillers to achieve this but<br />

such fillers simply do not permit<br />

a transparent resin when<br />

cured. Also, liquid flame retardants<br />

tend to be halogenated,<br />

whereas the UR5641 resin does<br />

not contain any fillers and has<br />

the additional benefit of being<br />

halogen free.<br />

This resin has an aliphatic urethane<br />

chemistry base, which is<br />

With popular demand, Electrolube<br />

developed the UR5641, an optically<br />

clear, flame retardant resin.<br />

naturally resistant to the yellowing<br />

effects of natural light, suitable<br />

for exterior and interior applications.<br />

It cures to provide a<br />

flexible and protective covering<br />

over the luminaire elements. The<br />

resin also offers high resistance<br />

to weather, acids and alkalis,<br />

water and mold growth. It is a<br />

two-part, semi-rigid, flame retardant<br />

polyurethane resin that<br />

meets the UL94 V-0 standard. As<br />

a durable, low viscosity system,<br />

it can be used for a variety of applications.<br />

It is suitable for the<br />

protection of LEDs exposed to<br />

hazardous atmospheres, such as<br />

emergency lighting, or for installations<br />

in ATEX rated/zoned environments.<br />

With a high dielectric strength of<br />

11 kV/mm and thermal conductivity<br />

of 0.35 W/m.K, it provides an<br />

operating temperature range of<br />

–40 to +120 °C. The RoHS-2 compliant<br />

resin also provides a cure<br />

time within 24 hours at 23 °C or 4<br />

hours at 60 °C.<br />

SMT Hybrid Packaging, Booth<br />

4-548<br />

www.electrolube.com<br />

<strong>EPP</strong> EUROPE May 2018 59


PCB + ASSEMBLY<br />

Ensuring optimum current transfer<br />

Instead of soldering: back-cast<br />

resistance welding electrodes<br />

As a common and easy to use welding method, resistance welding is used wherever metals have to be joined to each<br />

other without entrapped air or any impairment of their conductive properties. Such applications are primarily found in the<br />

automobile, aviation, electrical, and electronics, and household appliance industries. The reproducibility of the joint is<br />

among the benefits of resistance welding. Here, among other things, the quality of the electrode is crucial. The company<br />

Wolfram Industrie, based in Bavaria, along with Triconstant, offers a resistance welding electrode that guarantees a flawless<br />

joint between copper and the tungsten insert. This thereby ensures optimum, uninterrupted current transmission and<br />

better heat dissipation. It is achieved by back-casting the electrode’s tungsten core with copper or copper alloys, entirely<br />

avoiding the entrapment of air that frequently occurs in soldered electrodes and leads to poorer results.<br />

Wolfram Industrie fabricates the Triconstant electrodes according<br />

to the respective customer requirements and drawings. Both the<br />

power spectrum and requirements for the concrete dimensions are<br />

considered.<br />

Source: Wolfram Industrie<br />

An electrical engineering firm supplying the automobile industry<br />

welds several thousand copper wire ends to the coils of electric<br />

motors every day. The results of the previously used soldered electrodes<br />

were too variable and uncertain for them, which is why since<br />

the autumn of 2014, they have been using the WHG3 resistance<br />

welding electrode. This is a form of the Triconstant electrode from<br />

Wolfram Industrie and ensures more exact, reproducible results for<br />

point, seam, projection, and butt welding. A tungsten or tungstenlanthanum<br />

insert is back-cast with copper. The exact configuration<br />

of the resistance welding electrode is precisely adapted to the materials<br />

that will be joined. Only then is a solid weld guaranteed. A<br />

version with added pure copper is available as well. While copper reduces<br />

the mechanical strength of the electrode, it also improves<br />

current transmission and heat dissipation. In certain cases, this can<br />

significantly improve durability.<br />

“We achieve the special combination of the different materials with<br />

precise process control where the temperature gradients, times,<br />

and also pressure gradients play an important role,” explains Michael<br />

Bisaha, Product Manager Composites. Resistance welding<br />

electrodes made of various materials offer significant advantages,<br />

when they are optimally combined with each other. For example,<br />

their shafts and working surfaces are able to better withstand high<br />

thermal and mechanical loads, in addition to offering technical and<br />

economic benefits. From an application technology perspective, the<br />

best possible combination of hardness and elasticity, as well as,<br />

thermal and electrical conductivity is produced and economically,<br />

high durability is combined with better quality, and therefore greater<br />

efficiency.<br />

Combination based on infiltration and surface<br />

wettability<br />

Compared to competing materials, such as pure copper, pure tungsten,<br />

copper-chrome-zirconium combinations or a soldered tungsten-copper-chrome-zirconium<br />

combination, the WHG3 is made of<br />

back-cast tungsten-copper-WCu composite materials. This offers<br />

better results, in terms of hardness and strength, electrical and thermal<br />

conductivity, heat resistance, erosion, adhesion tendency and<br />

durability. “The respective values not only depend on the geometry,<br />

but also on the point welding machine, the welding parameters<br />

used and the materials being welded,” says Bisaha about the expected<br />

results. “By using various inserts – such as pure tungsten or<br />

tungsten, with for example, WLa20 or WCe20 doping – the heat resistance<br />

and conductivity can be individually adapted.” The resistance<br />

welding electrode also does not have a sandwich structure<br />

like other typical composite materials, since the combination is<br />

60 <strong>EPP</strong> EUROPE May 2018


PCB + ASSEMBLY<br />

Source: Wolfram Industrie<br />

In soldered electrodes, the entrapment of air<br />

between the electrode mantle and core can<br />

impair the results of the welding process.<br />

A tungsten or tungsten-lanthanum insert is<br />

back-cast with copper. A version with added<br />

pure copper is also available.<br />

Source: Wolfram Industrie<br />

“We achieve the special combination of the different<br />

materials with precise process control, where the temperature<br />

gradients, times, and also pressure gradients<br />

play an important role,” explains Michael Bisaha,<br />

Product Manager Composites.<br />

Source: Wolfram Industrie<br />

based on infiltration and surface wettability. The company fabricates<br />

the Triconstant electrodes according to the respective customer<br />

requirements and drawings. Both the power spectrum and requirements<br />

for the concrete dimensions are considered.<br />

Benefits of welded versus soldered joints<br />

The special properties of the electrode material are extremely important<br />

for optimum work results. The point forces used to press<br />

two opposing electrodes against each other in resistance welding<br />

often lie in the range of several kN, depending on the material and<br />

process. Therefore, the sufficient mechanical strength of the electrode<br />

has to be guaranteed for the entire service life.<br />

However, the pronounced alternating thermal load often causes severe<br />

electrode wear. The electrodes are stressed in a rapid sequence<br />

with short severe-amperage current pulses of several kA,<br />

that are in some cases applied for less than 100 ms. The better the<br />

thermal and electrical conductivity, the greater the durability. Here,<br />

back-cast electrodes offer benefits because the properties of soldered<br />

electrodes can vary significantly from one electrode to the<br />

next.<br />

Structure of the electrode<br />

“Realising a reproducible, non-porous solder joint is not technically<br />

feasible at this time,” Bisaha reports. “The connection, and therefore<br />

also the electrical contacting change, which means the resistance,<br />

and also the welding behaviour, can fluctuate quite significantly<br />

between individual electrodes.”<br />

In general, the company works exclusively with tungsten or composite<br />

materials, such as tungstite, for example made of tungsten<br />

and copper or tungsten and silver. “This is an infiltration composite<br />

material where a porous sintered body made of tungsten is infiltrated<br />

with copper or silver,” says Bisaha. Typical applications are<br />

found in eroding or contact material.<br />

www.wolfram-industrie.de<br />

Zusammenfassung<br />

Der Artikel zeigt eine Alternative zu herkömmlichen Lötverfahren:<br />

hintergossene Widerstandsschweißelektroden, die aus Wolfram,<br />

Kupfer und Wolframkupfer hintergossen sind. Neben längerer<br />

Standzeit und Leistungsvermögen ermöglichen diese eine verbesserte<br />

reproduzierbare Qualität der Punktschweißungen inklusive<br />

einer effizienten Fertigung.<br />

Résumé<br />

L‘article d’écrit une alternative aux procédés de brasage conventionnels:<br />

les électrodes de soudage par résistance en fonte, qui<br />

sont en tungstène, cuivre et cuivre tungstène. En plus d‘une durée<br />

de vie et d‘une performance plus longues, elles permettent une<br />

meilleure qualité de reproduction dans les soudures par points, y<br />

compris une production efficace.<br />

Резюме<br />

В статье рассматривается альтернатива традиционным<br />

методам пайки: электроды для контактной сварки,<br />

выполненные из вольфрама, меди и медно-вольфрамового<br />

сплава. Помимо длительного срока службы и мощности они<br />

обеспечивают более высокую повторяемость при выполнении<br />

точечной сварки, а также более эффективное производство.<br />

<strong>EPP</strong> EUROPE May 2018 61


PCB + ASSEMBLY<br />

Soldering and handling soldering task<br />

Precise dip tinning at<br />

high temperatures<br />

For more than 25 years now, Zevatron Löttechnik has been a reliable partner for professional soldering<br />

equipment. The diverse tasks of their customers motivates the company to further develop proven machines and<br />

to supplement them according to the individual requirements of optional equipment.<br />

The soldering stations and handling systems from<br />

Zevatron are used for high temperatures and most<br />

precise dip tinning processes.<br />

Source: Zevatron Löttechnik GmbH<br />

Source: Zevatron Löttechnik GmbH<br />

This soldering machine is for dip tinning of<br />

components. It has an easy-to-use process<br />

control with recipe management.<br />

The company‘s soldering stations and handling systems are used<br />

for most precise dip tinning processes. Multi-axis transport systems<br />

guarantee exact positioning, immersion depth, and dwell time<br />

of components or printed circuit boards above fluxer or solder bath.<br />

For the best tinning results, different factors have to be considered.<br />

On the one hand, solder alloy and temperature are important parts,<br />

on the other hand, the flux determines the result. However, the<br />

exact reproducibility of the parameters „immersion“ and „dwell<br />

time“ in the flux and in the solder bath is always decisive for best<br />

soldering results. Thus, a repeatable positioning of the components<br />

is crucial for the result of the entire soldering process.<br />

Before each immersion, the solder bath surface is detected and a<br />

consistently constant tinning result is ensured. Proven stripping systems<br />

ensure that the solder surface is always clean just before dipping.<br />

The highest quality in the soldering process is guaranteed by custom-tailored<br />

programmable controls and precise multi-axis travel<br />

systems for vertical, horizontal and axial movements. PLC-controlled<br />

processes and handling via 6-axis robots are now part of the<br />

the company’s standard, as are the feeding systems with the transport<br />

and removal of components and assemblies.<br />

The company offers solder baths and solder pump systems for high<br />

temperature range which are best suitable for tinning of enameled<br />

and TEX-E wires. They are used for soldering and tinning of electrical<br />

components, wires, cable shoes, connectors, capacitors, etc. The<br />

long-term stable solder baths and soldering machines are best suitable<br />

for lead-free alloys. For best soldering results, the halogen-free<br />

fluxes of the ZS-series (very good pickling) and the no-clean flux<br />

ZI2000 clean are recommended.<br />

www.zevatron.com<br />

62 <strong>EPP</strong> EUROPE May 2018


Source: Zevatron Löttechnik GmbH<br />

PLC-controlled processes and handling via 6-axis robots are now part<br />

of the the company’s standard.<br />

Zusammenfassung<br />

Zevatron Lötstationen und Handlingsysteme werden zum hochpräzisen<br />

Tauchlöten bei Temperaturen bis 500 °C eingesetzt. Mehrachs-Verfahrsysteme<br />

garantieren die exakte Positionierung,<br />

Tauchtiefe und Verweilzeit von Bauteilen oder Leiterplatten über<br />

dem Lötbad.<br />

Résumé<br />

Les stations de soudage et les systèmes de manutention de Zevatron,<br />

sont utilisés pour le brasage au trempé de haute précision à<br />

des températures allant jusqu‘à 500 °C. Les systèmes de mouvement<br />

multiaxes garantissent un positionnement exact, une profondeur<br />

d‘immersion et un temps de séjour des composants ou des<br />

cartes de circuits imprimés au-dessus du bain de soudure.<br />

Резюме<br />

Паяльные станции и системы перемещения Zevatron<br />

применяются для высокоточной пайки погружением при<br />

температуре до 500?°C. Многоосевые системы перемещения<br />

гарантируют высокую точность позиционирования, глубину<br />

погружения и время нахождения деталей или печатных плат<br />

над устройством нанесения флюса или ванной для пайки.<br />

IT’S TIME TO RISE UP<br />

AGAINST HIGH HEAT,<br />

WARPING AND<br />

DEFECTS.<br />

ALPHA ® OM-550. The revolution is here.<br />

Heat has taken its toll on your bottom line long enough.<br />

Introducing ALPHA ® OM-550 HRL1 – the most revolutionary<br />

advancement in solder paste since the introduction of<br />

lead-free. OM-550 cuts the soldering temperature required<br />

for SAC alloys by 50°C, while dramatically reducing power<br />

consumption and carbon emissions. The result is a highly<br />

reliable, cost effective, energy sufficient soldering process<br />

with up to 99% less warpage and significantly fewer defects.<br />

AlphaAssembly.com<br />

Visit us at SMT Nuremberg Hall 4, Booth 101<br />

<strong>EPP</strong> EUROPE May 2018 63


PACKAGING<br />

PRODUCT UPDATES<br />

Large area benchtop dispensing robot<br />

Smart fluid dispensing robots<br />

Intertronics has recently released<br />

the Fisnar F4500N dispensing<br />

robot which shares all<br />

the technical advantages of the<br />

F4000 range in an expanded<br />

format of 500 x 500 mm, still in a<br />

convenient benchtop design.<br />

The F4500N is a full function<br />

robot that enables cost effective<br />

automation of liquid dispensing<br />

operations, allowing increased<br />

productivity and consistent output.<br />

Integrated with dispensing<br />

equipment from the company’s<br />

range, it can dispense beads,<br />

dots, arcs and infills in three dimensions,<br />

with a positioning resolution<br />

of 0.001 mm/axis. Robust<br />

and reliable, it is suitable for use<br />

in continuous manufacturing environments,<br />

as well as in production<br />

development.<br />

By adding the appropriate dispensing<br />

setup to the robot<br />

(which might include syringes,<br />

valves or pumps) it can be configured<br />

for the application of<br />

form-in-place gaskets, adhesives,<br />

coatings, potting and encapsulation<br />

materials, sealants,<br />

filling and RFI/EMI shielding, and<br />

can handle single part or multicomponent<br />

materials.<br />

The dispensing robot programming<br />

is straightforward, using<br />

English language instructions on<br />

an included teach pendant. It is<br />

capable of storing up to 100 different<br />

programmes. Step-bystep<br />

intuitive instructions simplify<br />

job creation tasks, allowing<br />

The F4500N is a full function robot<br />

that enables cost effective automation<br />

of liquid dispensing operations.<br />

Source: Intertronics<br />

a programme to be entered and<br />

running in minutes. A 16-channel<br />

I/O interface provides for communication<br />

with external devices<br />

for secondary applications and<br />

multiple dispensing equipment<br />

components. An optional<br />

Windows software package with<br />

a DXF file converter is available<br />

for programming from a computer.<br />

The company will complete the<br />

package by offering safety enclosures,<br />

integration of all component<br />

parts, installation, and<br />

training – which means that<br />

benefits like higher production<br />

rates and increased productivity,<br />

more efficient use of materials,<br />

better product quality, improved<br />

safety, and reduced lead times<br />

are quickly gained, and quick payback<br />

on investment is readily<br />

achieved.<br />

www.intertronics.co.uk<br />

Techcon, a provider of<br />

precision fluid dispensing<br />

technologies, is<br />

pleased to introduce<br />

the TSR2000 series<br />

smart dispensing robots.<br />

The system is designed<br />

specifically for<br />

precise fluid dispensing<br />

applications and is compatible<br />

with all valve<br />

types and controllers.<br />

The user-friendly, smart<br />

PC-based software<br />

makes the robot easy to program<br />

and simple to operate.<br />

Smart features include intuitive<br />

software with touch-screen programing<br />

capability and CAD/DXF<br />

file import. The vision system<br />

allows the robot to automatically<br />

correct part misalignment and<br />

shorten programming time via its<br />

pattern recognition feature. The<br />

laser height sensor allows the<br />

robot to automatically adjust Z<br />

height to compensate for both<br />

surface height changes and part<br />

variation.<br />

From a general assembly manufacturer<br />

looking to automate an<br />

existing dispensing application,<br />

to an engineer designing a production<br />

process from the very<br />

Edgebond adhesive for automotive board<br />

level reliability<br />

Zymet featured its recently introduced<br />

edgebond adhesive,<br />

UA-3307-B, for enhancing board<br />

level reliability in automotive and<br />

other harsh environment applications.<br />

BGA’s and WLCSP’s,<br />

whose corners and edges are<br />

bonded with this adhesive, have<br />

passed more than 2000 cycles of<br />

–40 °C to 125 °C thermal cycling<br />

without failure. Large WLCSP’s,<br />

exceeding 8 mm in size, have<br />

passed more than 1500 cycles.<br />

The benefits of using this edgebond<br />

adhesive, rather than introducing<br />

an underfill under the<br />

component, are significant.<br />

Board preheat and dwell time are<br />

not needed for underfill flow.<br />

There is no risk of voids caused<br />

Smart dispensing robots are designed for precise<br />

fluid dispensing applications.<br />

Source: Zymet Inc<br />

beginning, the company’s systems<br />

dispensing robots offer unsurpassed<br />

value in automated<br />

precision fluid dispensing.<br />

The basic dispensing robot<br />

series are available in three platforms:<br />

• TSR2201: 200 mm x 200 mm<br />

• TSR2301: 300 mm x 300 mm<br />

• TSR2401: 400 mm x 400 mm<br />

There are also add-on Smart Kits<br />

available in several different options,<br />

including kits with a combination<br />

of software, touch screen,<br />

vision, and/or height sensor.<br />

SMT Hybrid Packaging, Booth<br />

4–209<br />

www.techcon.com<br />

by flux residues impeding flow.<br />

And, there is no risk of underfill/<br />

flux-residue chemical incompatibility<br />

affecting the cure. The use<br />

of this adhesive is simple, repeatable,<br />

and reliable.<br />

www.zymet.com<br />

WLP bonded with a reworkable edgebond<br />

adhesive.<br />

Source: Techcon<br />

64 <strong>EPP</strong> EUROPE May 2018


Bringing material solutions to the automotive industry<br />

Merck is offering material solutions to the<br />

next generation automotive applications. Future<br />

automotive requires different features<br />

from current electronic devices, such as heat<br />

resistance, safety and long-lasting functionality<br />

chips. As materials play a key role in the<br />

performance and reliability of advanced IC<br />

chips, the company is offering solutions in<br />

the semiconductor chip manufacturing and<br />

packaging to meet the needs of the automotive<br />

industry.<br />

According to IHS Market’s Luca De Ambroggi<br />

during his presentation at Semicon West<br />

2017, a high-end car will contain more than<br />

$6,000 worth of electronics in five years,<br />

driving a $160 billion automotive electronics<br />

market in 2022. Advanced IC chip packages,<br />

power systems, microcontrollers, sensors,<br />

camera, analog devices and application processes<br />

are driving the greatest adoption of<br />

semiconductor technology. Automotive has<br />

additional requirements additional requirements<br />

regarding redundancy and specific<br />

chip packaging, as well as minimum require-<br />

ments for performance, reliability and operation<br />

for more than 10 years under harsh conditions<br />

(e.g., high temperature).<br />

Electric vehicles and autonomous driving are<br />

key drivers for electronics’ continued growth<br />

in semiconductor sector, representing a new<br />

frontier for automotive electronic packaging<br />

and safety features. Future artificial intelligence<br />

platform applications will require ongoing<br />

collaboration with chipmakers and the<br />

automotive industry to understand their specific<br />

needs.<br />

The automotive materials for the semiconductor<br />

chips include:<br />

• Turnkey atomic layer deposition material for<br />

producing extremely powerful graphics<br />

chips, AI chips and processors Spinfil spinon<br />

dielectric material offers an essential<br />

component for automotive memory chips.<br />

• Innovative liquid-type photoresists for sensors<br />

and advanced packaging applications<br />

to achieve the narrowest and most conformal<br />

feature lines.<br />

• Lead-free sintering paste material offering<br />

The company is bringing material solution to the<br />

automotive industry.<br />

Merck provides lead-free sintering paste material for<br />

power chips and system-in-package module.<br />

low interfacial resistance, high thermal conductivity<br />

and adaptive process techniques<br />

for power chips and system-in-package<br />

modules able to operate in very high temperatures.<br />

www.merck-performance-materials.com<br />

Source: Merck<br />

Source: Merck<br />

<strong>EPP</strong> EUROPE May 2018 65


TEST + QUALITY ASSURANCE<br />

Additional features to solder paste inspection<br />

Extending the ‘Golden Hour’<br />

in the assembly line<br />

The first hour after the occurrence of a traumatic injury, or the “Golden Hour”, is considered by trauma surgeons<br />

to be the most critical time for successful emergency treatment. Although, it may not be the same as a life or death<br />

situation, it is similar in an SMT assembly line, where a few minutes of downtime can cost millions of dollars.<br />

Yet, the Golden Hour concept does exist in the SMT production process.<br />

It is widely recognized that over 70 % of soldering defects are associated<br />

with the solder paste printing process. 1) These defects<br />

pose serious concerns to the industry, especially with the component<br />

miniaturization trend and the 0201M microchip emergence.<br />

Manufacturers cannot scrap the board and the microchip, due to<br />

procurement challenges and component costs. However, if the<br />

manufacturer does not repair the issue quickly, the whole board is<br />

susceptible to failure. Leading inspection suppliers, like Koh Young<br />

Technology, are working diligently to extend the “Golden Hour” well<br />

beyond its limit, by implementing new innovations like integrated<br />

tools to repair defective solder depositions.<br />

Need for the correct solder volume<br />

What is the ideal amount of solder to deposit? It may be different,<br />

for too much solder paste will cause solder bridging, whereas insufficient<br />

solder paste may result in printing defects like bridges, tombstones,<br />

and more. With the widespread use of leadless packaging,<br />

insufficient solder volume is an increasingly occurring defect, because<br />

solder paste tends to clog smaller apertures and cannot be<br />

released onto the pad. Rework innovations can help solve insufficient<br />

solder issues.<br />

Rework applications<br />

The rework application can be categorized into two types: traditional,<br />

needle-based contact dispensing and non-contact jetting.<br />

Both methods have advantages, as well as limitations. Needlebased<br />

dispensing is suitable for many package types, including Ball<br />

Grid Array (BGA) packages. However, the system needs to maintain<br />

a constant z-axis distance between the substrate and needle tip. An<br />

inconsistent distance reduces repeatability and accuracy. Non-contact<br />

jetting, another relatively new method, has superior dispensing<br />

speed, but it is less flexible due to the limited number of certified<br />

solder paste for jetting.<br />

Koh Young’s volume & area repeatability results (each test was<br />

run independently 50 times).<br />

Automated dispensing with advanced accuracy<br />

Today’s production environments need equipment that is both flexible<br />

and easy to use. Koh Young meets the industry’s needs by adding<br />

a new “Auto Repair” dispensing system to its high-speed<br />

KY8030–3 3D SPI (solder paste inspection) platform. The company’s<br />

Auto Repair system replaces mechanical height sensors with a laser<br />

sensor to accurately measure the z-axis distance and overcome the<br />

challenge of traditional dispensing. This innovative sensor method<br />

provides excellent Gage R&R capability.<br />

The 3D SPI system can accurately inspect and identify solder defects,<br />

thanks in part, to its precisely engineered mechanical structure.<br />

Unlike other 3D SPI systems that move during the measurement<br />

process, the company’s SPI uses “stop and shoot” technique.<br />

Unwanted vibration and image stitching is eliminated. Auto Repair,<br />

when added to the high-speed SPI platform, is a great solution for<br />

production of today and the future.<br />

Source: Koh Young Technology<br />

References<br />

Dispensing or Jetting?<br />

1) Mitch Holtzer, Karen Tellesfen, Westin Bent, Predicting<br />

Solder Paste Transfer Efficiency and Print Volume 2017<br />

2) Fernando Coma, Jeffrey Kennedy & Thilo Sack. (2015)<br />

Deposition of Solder Paste into High Density Cavity<br />

Assemblies [PowerPoint slides] Retrieved from<br />

https://www.smta.org/chapters/files/April-2015-Ken<br />

nedy.pdf<br />

Dispensing<br />

Jetting<br />

01005<br />

(0402 mm)<br />

√<br />

X<br />

0201<br />

(0603 mm)<br />

√<br />

√<br />

0402<br />

(1005 mm)<br />

√<br />

√<br />

CSP<br />

0.3 mm<br />

√<br />

X<br />

CSP<br />

0.4 mmt<br />

√<br />

√<br />

Recommended deposition method based on package type 2)<br />

66 <strong>EPP</strong> EUROPE May 2018


Comparison of BGA pad when using Auto Repair system.<br />

(Left) Before : Volume: 5.57 % / Area: 16.25 %<br />

(Right) After: Volume: 62.79 % / Area: 86.54 %<br />

Comparison of capacitor pad when using Auto Repair system.<br />

(Left) Before: Volume: 58.92 % / Area: 73.66 %<br />

(Right) After: Volume 89.21 % / Area: 95.9 %<br />

Minimal maintenance<br />

The company has examined system maintenance and usability during<br />

the Auto Repair system development. The system, unlike other<br />

dispensing technologies, does not use a plunger to dispense solder<br />

paste. The plunger can crush the solder particles and clog the<br />

nozzle. Instead, the integrated Auto Repair dispenser uses air pressure,<br />

which reduces wear and increases nozzle longevity. It also significantly<br />

extends the service interval to upwards of seven days.<br />

When cleaning is needed, the syringe holder incorporates a onetouch<br />

release for fast and easy replacement. These minimal maintenance<br />

requirements improve the return on investment (ROI), by<br />

reducing labor and material costs.<br />

Superior flexibility<br />

Does the Auto Repair system offer other benefits? Yes. The design<br />

is highly flexible and considers many production variables. For<br />

example, imagine a hundred different board layouts with different<br />

components- each component type requires a unique solder paste<br />

amount. The system can be an effective solution, especially for<br />

small BGAs and microchips. It can dispense solder to repair insufficient<br />

errors to a wide range of component sizes, including 0402 M<br />

microchips with a pad-to-pad distance of over 100 μm. Additionally,<br />

dynamic z-axis tracking automatically adjusts the distance between<br />

the head and the board surface to maintain the ideal focal range and<br />

prevent false calls due to PCB warp. Such flexibility allows users to<br />

readily improve yields and efficiency in their assembly lines.<br />

Future of Smart Factory<br />

Looking forward, Industry 4.0 is rapidly gaining traction among<br />

manufacturers. The factory is not a static place, it is a dynamic zone<br />

where machines work together to execute complex tasks. In fact,<br />

the Koh Young’s Auto Repair system already addresses Industry 4.0<br />

in many aspects. By integrating 3D inspection and repair, it establishes<br />

a closed-loop process and eliminates unnecessary board<br />

cleaning or scrap. Additionally, it integrates a real-time process<br />

dashboard, so operators can quickly verify rework performance and<br />

make the right decisions by comparing with previous results.<br />

Source: Koh Young Technology<br />

Source: Koh Young Technology<br />

Zusammenfassung<br />

Der Druckprozess ist einer der kritischsten Schritte in der SMT-Fertigungslinie,<br />

da er die Ursache für die meisten Prozessdefekte ist.<br />

Die Vorteile der Reparatur von Druckdefekten reichen weit über die<br />

Kosteneinsparungen hinaus. Im Artikel werden innovative Lösungen<br />

vorgestellt, um diesbezüglich die Prozesskapazität und Leistungsfähigkeit<br />

einer Produktion zu steigern.<br />

Résumé<br />

Le processus d‘impression est l‘une des étapes les plus critiques<br />

de la ligne de production SMT car c’est à ce moment où la plupart<br />

des défauts de traitement peuvent se produire. Les avantages de la<br />

réparation au fur et a mesure, des défauts d‘impression, engendre<br />

des économies de coûts. L‘article présente des solutions innovantes<br />

pour augmenter la capacité de traitement et l‘efficacité d‘une<br />

production.<br />

Резюме<br />

Печатный процесс является одним из критически важных<br />

этапов производства на линии поверхностного монтажа,<br />

поскольку может стать причиной возникновения большинства<br />

технологических дефектов. Возможность исправления<br />

дефектов печати позволяет добиться значительной экономии<br />

ресурсов. В статье рассказывается об инновационных<br />

решениях, направленных на повышение производительности<br />

и эффективности предприятия.<br />

What is next for the Auto Repair system in a future smart factory? In<br />

the ideal future, connected systems should remove inefficiency<br />

from the start, so there may not be anything to repair. Will manufacturers<br />

still need an Auto Repair system? The answer may be “yes,”<br />

as this is not going to happen soon. Indeed, the Smart Factory will<br />

not replace rework applications, instead it will enhance the functionality.<br />

Auto Repair powered by AI may be able to recognize complex<br />

patterns of solder pads, synthesize information, draw conclusions,<br />

and provide recommendations to optimize the solder<br />

paste printing process.<br />

Conclusion<br />

The printing process is one of the most critical steps in the SMT assembly<br />

line, because it is the origin for most of the process defects.<br />

The benefits of readily repairing printing defects extend far beyond<br />

the cost savings from eliminating cleaning, post-reflow rework, and<br />

scrap. As rework costs and complexity increases, the ability to extend<br />

the Golden Hour with Auto Repair system will increase line<br />

productivity and yield.<br />

The company has been developing innovative solutions to overcome<br />

industry challenges, expand process capabilities, and boost<br />

factory performance. They have set up three additional R&D centers<br />

to facilitate a quantum leap in technological leadership and competitiveness.<br />

They continue to integrate AI advancements in many of its<br />

systems, while overcoming the Golden Hour challenge and paving<br />

the way for new markets and industries beyond SMT.<br />

SMT Hybrid Packaging, Booth 4A-233; 4A-230<br />

www.kohyoung.com<br />

<strong>EPP</strong> EUROPE May 2018 67


TEST + QUALITY ASSURANCE<br />

PRODUCT UPDATES<br />

IoT and Industry 4.0 at Apex show<br />

Viscom announced that it had its best IPC<br />

Apex Expo to-date with a record number of<br />

visitors inspired by its intelligent cross-linked<br />

systems – ready for i4.0 applications. The<br />

company presented a complete range of advanced<br />

inspection systems, including 3D<br />

SPI, 3D AOI, 3D MXI and 3D AXI, and won a<br />

2018 NPI Award for its X7056-II cutting-edge<br />

inline X-ray technology. The company also<br />

partnered with the IPC Connected Factory<br />

Exchange (CFX) initiative, introduced for the<br />

first time ever at the show.<br />

The CFX showcase included live demonstrations<br />

of standardized Internet of Things (IoT)<br />

data from the company’s machines through<br />

the cloud and on to visitors’ mobile phones.<br />

The demo took place during the entire show:<br />

On their personal devices, visitors observed<br />

real-time analytical reports, such as OEE<br />

(overall equipment effectiveness), unit<br />

counts, as well as, live data stream showing<br />

actual events occurring on the machines in<br />

front of them. With no software to install, nothing<br />

proprietary, and no middleware<br />

required, this illustrated the true nature of<br />

IoT, with CFX as the 100 % open standard.<br />

“As an AOI and X-ray inspection vendor, our<br />

systems are the sensors of any Industry 4.0<br />

environment,” commented Carsten Salewski,<br />

President and CEO. “Our equipment provides<br />

the data that can be used to improve<br />

processes and product quality. We have supported<br />

the IPC CFX standardization efforts<br />

from day one. It was very exciting to see our<br />

industry‘s first standard based IoT network<br />

come to life in San Diego.”<br />

When implementing concepts within the<br />

scope of Industry 4.0, 3D inspection systems<br />

for SPI, AOI, AXI and MXI from the same<br />

source are an obvious advantage. “So naturally<br />

Viscom was involved early on with several<br />

platforms like our own Quality Uplink and<br />

an open i4.0 interface that allows third parties<br />

to connect to our equipment” emphasized<br />

Salewski.<br />

With the Quality Uplink software feature, the<br />

company enables intelligent linking of results<br />

from the different inspection gates. The operator<br />

has fast access to all the essential data<br />

and images. Furthermore, the inspection systems<br />

can carry on fully automated communication<br />

with, for example, the placement machines<br />

and paste printers, and influence their<br />

parameters (Closed Loop). Open Interface<br />

4.0, from the company, on the other hand enables<br />

customers who have decided on a 3D<br />

AOI system to combine their results with<br />

those from a solder paste inspection for a<br />

networked evaluation, even if the SPI system<br />

is not from the company.<br />

SMT Hybrid Packaging, Booth 4A-122<br />

www.viscom.com<br />

Source: Viscom Inc.<br />

3D AXI demonstration with the X7056-II.<br />

Industry 4.0 solutions and the 3D AOI system S3088 ultra gold.<br />

Source: Viscom Inc.<br />

68 <strong>EPP</strong> EUROPE May 2018


Cost-efficient solutions for testing electronic assemblies<br />

ECT switch probes are cost effective and reliable<br />

solutions for non-destructive testing to<br />

verify the presence of components or contact<br />

leads within a connector assembly. The<br />

company’s experience and design standards,<br />

combined with its knowledge of materials<br />

and platings, allows for the quick alignment<br />

of probe features with project requirements.<br />

The switch probes are replaceable by using<br />

one of many receptacle termination options.<br />

Customers can choose from gold or nickel<br />

plated plungers.<br />

A switch probe is a spring contact that is<br />

used to verify the presence of components<br />

or contacts within a connector assembly. The<br />

current path for test is from the probe tail to<br />

the receptacle which is normally open (“No”<br />

or “closers”). As the plunger is compressed<br />

to a defined switch travel, the circuit is<br />

closed. The most common application is in<br />

the cable harness testing industry. They are<br />

used to verify the correct location of a terminal<br />

contact in a connector while also<br />

checking the retention force. They also verify<br />

Source: Everett Charles Technologies<br />

the physical presence of non-conductive<br />

components or devices on a circuit board.<br />

Switch probes are used for wire harness contact<br />

sensing and component sensing. For applications,<br />

such as automotive component<br />

test where zero defects are allowed, they<br />

must typically function without error for tens<br />

of thousands of cycles. The company’s<br />

switch probes easily meet this standard for<br />

reliability.<br />

www.ect-cpg.com<br />

A switch probe can verify<br />

the correct location of a<br />

terminal contact in a connector<br />

while also checking<br />

the retention force.<br />

NEW & UNIQUE:<br />

Our Labtester LT101<br />

Unbeatable ratio of cost<br />

of ownership<br />

Smart program teaching with 7“<br />

touch screen<br />

State of the art data export<br />

(USB, Bluetooth, Ethernet, WLAN)<br />

Industrie 4.0 ready<br />

Pulltester LT101<br />

All-in one HD digital microscope with high image quality of solder<br />

Source: Inspectis AB<br />

Inspectis AB announces the F30 all-in-one<br />

full HD digital microscope. New features and<br />

all-round performance come together in this<br />

durable, industrial grade package. The F30<br />

joins the F30s full HD digital microscope,<br />

known for its adaptability and versatility.<br />

The F30s has a reputation as the all-around<br />

‘best choice’ for the widest range of visual inspection<br />

applications. Now, it combines all<br />

features and competitive advantages into an<br />

all-in-one system with a plug-and-play format,<br />

with LED array and essential built-in controls<br />

(e.g., zoom, iris, color balance).<br />

All basic parameters such as zoom, brightness<br />

and color levels, can be controlled<br />

The full HD digital microscope provides excellent<br />

image quality of solder joints on PCB assemblies and<br />

reflective metallic parts.<br />

through on-board buttons, and additional control<br />

features and setting memories can be accessed<br />

using the HD-020 remote control or<br />

via computer software. The F30 also has an<br />

auxiliary power socket for use with the new<br />

ring light, providing excellent image quality<br />

for such structures as solder joints on PCB<br />

assemblies and highly reflective metallic<br />

parts, all with minimum glare and reflection.<br />

F30 options include an ESD-protected housing<br />

and a built-in laser pointer. It brings uncommon<br />

capabilities and advantages to digital<br />

microscopy for SMT electronics assembly<br />

inspection including full FHD, 1080p 60 fps<br />

HDMI output for lag-free magnified working,<br />

superior 30:1 zoom optics with auto-focus,<br />

and a generous practical working distance.<br />

Objects under inspection are rendered sharp,<br />

clear, and large; its 56 x screen magnification<br />

on a 24 ” monitor, for example, can be increased<br />

up to 200 x with auxiliary lenses.<br />

An optional built-in laser pointer aims at the<br />

area of interest and assists in quickly locating<br />

it on the screen, whilst efficient object handling<br />

is aided by the full range of thoughtfullydesigned<br />

accessories.<br />

SMT Hybrid Packaging, Booth 5–434<br />

www.inspect-is.com<br />

For further information please visit us<br />

at the<br />

Hall 4a Booth 440<br />

or contact us directly!<br />

F&S BONDTEC Semiconductor GmbH<br />

Industriezeile 49a<br />

A-5280 Braunau am Inn, Austria<br />

T: +43.7722.67052.8270<br />

F: +43.7722.67052.8272<br />

Mail: info@fsbondtec.at<br />

<strong>EPP</strong> EUROPE May 2018 69<br />

www.fsbondtec.at


TEST + QUALITY ASSURANCE<br />

Playing a big role in the quality of the signal transmission<br />

Deep insights: 3D assembly<br />

inspection of press-in contacts<br />

After the conversion from leaded to lead-free soldering of electronic components caused a big stir in joining<br />

technology several years ago, a no less spectacular conversion – for certain components, at least – is now at<br />

hand: for an increasing number of connectors, soldering has been entirely left out for some time now. The manufacture<br />

of the electrical contact here takes place with a load-carrying connection of the connections with the<br />

through-hole plating in the circuit board. However, in order to guarantee safe functionality, there are therefore<br />

new requirements for quality inspection, which require new processes for measurement technology for their<br />

part. The following example shows how this new task is solved by the use of innovative technologies at Coriant.<br />

Jens Kokott, Göpel electronic GmbH, Thomas Hoheisel, Coriant GmbH<br />

They have more than 500 customers<br />

in more than 100 countries – operators<br />

of mobile phone networks,<br />

landline networks, Cloud and data<br />

center networks or providers of<br />

Web 2.0 or major companies – and<br />

counts nine out of the top ten network<br />

operators in the world<br />

amongst its customers. In its delivery<br />

operations center in Berlin,<br />

the company primarily manufactures<br />

systems for long-distance<br />

transmission.<br />

Coriant is a provider of innovative and dynamic data transfer systems<br />

in the area of packet optical and for connections of data<br />

centres to one another. With its solutions, products and services,<br />

the company supports telecommunications suppliers worldwide to<br />

reduce the complexity of their networks, form a basis for the new<br />

generation of services in the area of mobile, video and Cloud and<br />

therefore to draw the best possible value from existing network infrastructure.<br />

They are supported by more than 1,800 patents and<br />

over 35 years of experience in the construction of high-performance<br />

optical telecommunication networks.<br />

Source: Göpel electronic GmbH<br />

Typical telecommunications<br />

component with press-in connectors.<br />

The challenge: depth<br />

measurements in holes<br />

Components are installed in control<br />

cabinets, also known as racks, and<br />

are parts of a transmission path. Increasingly,<br />

press-in connectors are<br />

used in the latest generation of<br />

components, which have very short<br />

pins for fulfilling the high-frequency<br />

technical requirements. In complex<br />

multilayer boards with more than 20<br />

layers, the pins are shorter than the<br />

circuit board thickness and cannot<br />

be checked for correct fitting from the opposite side by conventional<br />

means. What makes this even more complicated is that the diameter<br />

of the holes for these connectors is far less than a millimeter.<br />

Alongside simply the existence of the pins in the hole, the realized<br />

press-in depth plays a role in the quality of the signal transmission.<br />

Should the pin, upon being pressed in, have become bent in such a<br />

way that a short circuit is created, this can lead to electrical damages<br />

to further components.<br />

The search for an inspection team that can test the press-in connectors<br />

described safely and with sufficient speed proved difficult.<br />

When talking to Göpel electronic, there was finally the possibility of<br />

equipping a system of the already established „AdvancedLine“<br />

70 <strong>EPP</strong> EUROPE May 2018


Source: Göpel electronic GmbH<br />

Advanced Line·3D AOI system in production at Coriant.<br />

3D measurement based on TMSA technology.<br />

Source: Göpel electronic GmbH<br />

series with an innovative 3D measurement technology, so that it<br />

meets the given criteria.<br />

3D measurements based on TMSA technology<br />

Telecentric Multi Spot Array, or TMSA in short, is a new technology<br />

provided by the company, which makes it possible to carry out 3D<br />

measurements even into deep holes with very small diameters.<br />

In this process, a light source is coupled into a telecentric measuring<br />

lens developed especially for this purpose. As a result, there is<br />

no angle between the light source and the sensors – in contrast to<br />

the triangulation technologies – which means that the lighting and<br />

signal beam path are identical. The advantage of this arrangement is<br />

that, on the one hand, no shadowing on high components and, on<br />

the other, there can be safe measurement even in deep component<br />

chasms.<br />

The lens now differentiates the individual light wavelengths, so that<br />

only a small wavelength range is focused, depending on the distance<br />

between the measuring lens and the surface to be measured.<br />

The reflected light, or measuring signal, is then converted to a<br />

height value by evaluating the respective intensity. Since this lens<br />

projects individual measurement points onto the PCB, the spot<br />

array must be moved for a wide-area recording of measurement<br />

values. Depending on the increment, this makes it possible to implement<br />

different lateral resolutions during scanning, so that they<br />

3D visualization of a pin pressed<br />

into the circuit board.<br />

are freely configurable based on the requirements of the measuring<br />

task.<br />

The TMSA technology is available as the 3D•EyeZ sensor system<br />

and can be integrated into the stand-alone and inline AOI systems<br />

by the company. Alongside the conventional visual inspection of<br />

electronic components, the measurement of the press-in depth of<br />

press fits is a decisive unique selling point of the systems. Here the<br />

circuit board hole can be directly „measured into“ and the position<br />

of the pin head within the circuit board material can be determined<br />

in all three dimensions. Even when it comes to holes with a diameter<br />

of up to 200 μm, measurement of the precise height in the hole<br />

is possible with a precision of up to 5 μm.<br />

Efficient use of the system in the production<br />

process<br />

The decisive criterion for use is the proof of process capability, i.e.<br />

the precision of depth measurements and the spreading of<br />

measurement values in repeated measurements. The measurement<br />

precision was checked with a 3D measurement standard; repeated<br />

measurements were undertaken using a standard component.<br />

Both the theoretical and practical suitability, including under<br />

the influence of environmental conditions, were able to be proven<br />

by this.<br />

The system is installed directly after the „press in“ process step.<br />

This allows every circuit board to be checked by the same operator<br />

immediately after complete of the process. Faults can be corrected<br />

before the component is completed, fitted and tested. The entire<br />

test process is also quicker than the press-in process in complex<br />

test tasks with many connectors to be tested, so that there is no<br />

delay in the operational process due to the additional test step. The<br />

test results are saved in a SQL database and available for process<br />

quality analyses.<br />

Source: Göpel electronic GmbH<br />

<strong>EPP</strong> EUROPE May 2018 71


TEST + QUALITY ASSURANCE<br />

Source: Göpel electronic GmbH<br />

3D/2D AOI systems by Göpel electronic for stand-alone and inline use.<br />

This great product diversity at Coriant Berlin means that new test<br />

programs have to be continuously created for prototypes, pilots,<br />

and series products. An inspection system therefore has to make<br />

the simple and quick production of programs possible. Thanks to the<br />

presented system, programs can simply be produced from the<br />

existing circuit board data. Once produced connector models can<br />

be used again for all subsequent programs.<br />

The previous experiences in regular use show that the use of the<br />

existing system could minimize fault frequency. Incorrectly pressed<br />

in connectors are safely detected and can be repaired. The inclusion<br />

of test results in the existing data collection environment is planned<br />

for the future so that a complete picture of the production history of<br />

every component can be attained.<br />

A further, major benefit lies in the significant reduction of the downstream<br />

test engineering activities. These can now be reduced to a<br />

minimum thanks to the extremely high test precision of the AOI.<br />

Equally, costly reworking due to faulty connectors is now a thing of<br />

the past. This not only allows resources to be more specifically<br />

used, but also customers to be provided with an even better production<br />

quality.<br />

In addition to the inspection of press-in contacts and connectors,<br />

Göpel electronic also offers the 3D•ViewZ measurement module<br />

for the 3D measurement of components and solder joints in the<br />

SMD area. It combines 3D measurement technology based on<br />

triangulation with 2D image recording processes with an identical<br />

field of view and therefore also allows the use of production lines<br />

with the shortest of cycle times.<br />

Author: Jens Kokott,<br />

Göpel electronic GmbH,<br />

Product Manager AOI.<br />

Source: Göpel electronic GmbH<br />

Author: Thomas Hoheisel,<br />

Coriant GmbH, Senior Lead Engineer<br />

Operations.<br />

Source: Coriant GmbH<br />

The implementation of the 3D fitting inspection proves how quickly<br />

and flexibly Coriant has taken on an existing challenge and developed<br />

a practical, „Made in Germany“ solution together with Göpel<br />

electronic.<br />

SMT Hybrid Packaging, Booth 4A-222<br />

www.goepel.com; www.coriant.com<br />

Zusammenfassung<br />

Seit einiger Zeit wird eine zunehmende Anzahl von Steckverbindern<br />

nicht mehr gelötet. Die Herstellung des elektrischen Kontaktes<br />

erfolgt dabei mit einer lasttragenden Verbindung der Anschlüsse<br />

mittels Durchkontaktierung in der Leiterplatte. Um dabei eine sichere<br />

Funktionalität zu gewährleisten, gibt es neue Anforderungen<br />

an die Qualitätsprüfung, die wiederum neue Verfahren für die<br />

Messtechnik erfordern. Das folgende Beispiel zeigt, wie diese neue<br />

Aufgabe durch den Einsatz innovativer Technologien gelöst wird.<br />

Résumé<br />

Depuis un certain temps, un nombre croissant de connecteurs ne<br />

sont plus soudés. Le contact électrique est réalisé avec une connexion<br />

porteuse des connexions au moyen d‘une connexion intégrée<br />

dans la carte de circuit imprimé. Afin d‘assurer une fonctionnalité<br />

fiable, il existe de nouvelles exigences pour les tests de qualité,<br />

qui nécessitent à leur tour de nouvelles procédures pour la<br />

métrologie. L‘exemple suivant montre comment cette nouvelle tâche<br />

peut être résolue en utilisant des technologies innovantes.<br />

Резюме<br />

С некоторого времени производители все чаще отказываются<br />

от пайки штекерных соединителей. При этом создание<br />

электрического контакта осуществляется за счет создания<br />

несущего сквозного соединения внутри печатной платы. Для<br />

обеспечения надежной работы изделий были выработаны<br />

новые требования в отношении контроля качества,<br />

реализация которых не возможна без применения новых<br />

методов измерения. В статье рассказывается, каким образом<br />

решается подобная задача с применением инновационных<br />

технологий.<br />

72 <strong>EPP</strong> EUROPE May 2018


PRODUCT UPDATES<br />

TEST + QUALITY ASSURANCE<br />

Launch of software to test and analyze micro-materials<br />

Nordson Dage, a division of Nordson Corporation,<br />

and a supplier of Bond Test and Materials<br />

Test equipment, launched Paragon Materials,<br />

a suite of software designed for performing<br />

mechanical failure analysis on a range of<br />

micro-materials.<br />

It is an exciting time to be in the micro-electronics<br />

industry as devices continue to become<br />

more complex and demands on their<br />

performance increase. Expectations on product<br />

lifetime are as critical as ever, meaning<br />

new device evaluation needs to assess both<br />

long-term fatigue and cyclical performance.<br />

Adding to this complexity is the fact that failure<br />

can come from many different sources,<br />

including individual interconnects, surface<br />

Paragon Materials has built-in analysis tools and statistical<br />

algorithms, which makes finding failures easy.<br />

Source: Nordson Dage<br />

components, the substrate material, or a<br />

combination of several of these sources.<br />

Paragon Materials is designed to tackle these<br />

complex failure modes and take the operator<br />

straight to the root cause of the failure mode.<br />

Traditionally, micro-materials testing has<br />

been difficult to set-up and even more taxing<br />

to extract the correct failure information from<br />

the raw data. The software presents a clear<br />

interface to the user featuring built-in analysis<br />

tools and statistical algorithms – allowing the<br />

user to easily find every failure.<br />

Alan King, Business Director, Bond Test and<br />

Materials Test commented, “Paragon Materials<br />

is a software platform focused on the<br />

mechanical testing and data analysis of materials<br />

used in conjunction with the packaging<br />

of complex electrical devices. Bond testing<br />

typically evaluates the integrity of interconnect<br />

associated with die and integrated<br />

circuits, essentially their connection to the<br />

outside world, however micro materials testing<br />

concentrates on evaluating the strength<br />

of the die and packaging itself.”<br />

This second level of functionality is especially<br />

applicable to researchers when qualifying<br />

new materials and quality assurance when<br />

new products go into production.<br />

SMT Hybrid Packaging, Booth 4A-214<br />

www.nordsondage.com<br />

CUBE Inline +<br />

Nuernberg, 05. - 07.06.2018<br />

Booth 4-125<br />

The modular Soldering<br />

System from Inertec for<br />

highest efficiency<br />

Fast in-line 3D-CT AXI<br />

Omron brings AXI performance to a higher<br />

level with the VT-X750. It is a fast AXI machine<br />

that uses Computed Tomography<br />

(3D-CT) as its core of image and inspection<br />

quality. With a high speed technology, it enables<br />

the machine to be up to twice as fast<br />

as previous models. The automated inspection<br />

logic has been improved for many parts<br />

such as IC heal fillets, stacked devices (PoP),<br />

through hole components, press-fit connectors,<br />

and other bottom terminated parts.<br />

Increasing automated inspection speed and<br />

expanding inspection logic enables full, inline<br />

inspection coverage by 3D-CT method.<br />

With reconstruction algorithms, this method<br />

provides unprecedented solder shape recognition<br />

and defect detection. It overcomes design<br />

restraints, such as dense and dual sided<br />

board design that x-ray inspections can have.<br />

This machine also offers the possibility to inspect<br />

XL boards of up to 610 x 515 mm for a<br />

foot print of nearly 50 % less than other large<br />

size AXI machines with only 2.99 m 2 .<br />

SMT Hybrid Packaging, Booths 4A-300;<br />

5-434<br />

www.inspection.omron.eu<br />

The VT-X750 AXI machine uses Computed<br />

Tomography and is twice as fast as previoux models.<br />

Source: Omron <strong>Europe</strong> B.V.<br />

Our intelligent<br />

modular system,<br />

flexible for every<br />

kind of customer<br />

requirements<br />

INERTEC has been building selective<br />

soldering systems for more than<br />

20 years and is one of the leading<br />

companies in this market sector.<br />

Inertec Löttechnik GmbH<br />

www.inertec.de<br />

<strong>EPP</strong> EUROPE May 2018 73


TEST + QUALITY ASSURANCE<br />

Fully automatic fast inline inspection system for product safety industries<br />

Complete versatility with<br />

high-throughput x-ray<br />

While they are essential characteristics of an AOI system, today 3D inspection and high speed are just as<br />

important for AXI. With time-optimized image acquisition technologies and efficient handling concepts,<br />

in-line x-ray performance is continually increasing. Advantageous automation possibilities also exist<br />

where the use of MXI is recommended.<br />

Printed circuit board in the AOI section of the X7056-II inspection system shortly before transport to X-ray.<br />

In the inspection of electronic assemblies, especially for components<br />

with hidden solder joints, such as BGAs (ball grid array) or<br />

QFNs (quad-flat no-leads package), automatic optical inspection<br />

(AOI) is insufficient. Random samples with manual x-ray (MXI) arise<br />

as one option, but this is not always the optimum solution. Where<br />

product safety plays an especially crucial role, particularly in the<br />

automotive area, a fast, thorough inspection of solder joints is<br />

needed. This calls for a fully automatic in-line x-ray inspection (AXI),<br />

which also satisfies the speed constraints. On such a system,<br />

throughput is heavily determined by the inspected assembly handling,<br />

since a fully protected housing with mechanical gates is<br />

necessary.<br />

Fast, precise change<br />

One ingenious solution can reduce the time to change the in- and<br />

out feed of the assemblies to under four seconds. This results from<br />

a hardware concept that works with several printed circuit boards<br />

that can be in the system simultaneously and are moved in overlapping<br />

time slices. Because of the shortened paths, the corresponding<br />

switching of assemblies from one position to the next is extremely<br />

quick and precise. This reduction<br />

in handling time reduces the idle<br />

time necessary as overhead just to<br />

change assemblies. The actual productive<br />

time is the pure analysis time, in<br />

which the images are captured and<br />

evaluated. Thus, if the handling is reduced,<br />

e.g. from the previously typical<br />

10 to 12 seconds, down to 4 seconds,<br />

with a pure analysis time of an additional<br />

ten seconds, total throughput<br />

time is 14 instead of 20 seconds – a<br />

major gain of 30 %. Even with just this<br />

aspect in mind, a comparison of the<br />

available systems is definitely worthwhile.<br />

Optimizing the analysis time can<br />

bring additional significant throughput<br />

gains. During program creation, the<br />

time-consuming 3D inspection can be<br />

restricted to those components for<br />

which it is truly necessary. Everywhere else, faster orthogonal and<br />

angled processes are employed.<br />

Source: Viscom AG<br />

First-class 3D AXI hardware<br />

Optimized solutions for fast image acquisition also have a positive<br />

effect on the analysis time. High-value linear motors, which ensure<br />

An automatic height correction can also be performed for sagging printed<br />

circuit boards, particularly in the 3D X-ray inspection.<br />

Source: Viscom AG<br />

74 <strong>EPP</strong> EUROPE May 2018


that flat panel detectors on a cross table (xytable)<br />

can be moved quickly to the different<br />

positions, sharply cut image acquisition<br />

times for variably angled radiation penetration,<br />

especially when acquiring several<br />

views for 3D reconstruction. With the right<br />

settings, electronic assemblies can also be<br />

optimally represented in the 3D image from<br />

predefined perspectives. Experience points<br />

out, e.g., that for structures generally arranged<br />

on a grid, such as BGA balls, irregularly<br />

arranged acquisition positions are recommended.<br />

Because of the resulting suppression<br />

of periodic structures, artifacts can<br />

be largely eliminated, significantly improving<br />

the 3D results of the planar computed tomography<br />

(PCT).<br />

During the development and revision of an<br />

AXI system, particularly in this context, it has<br />

proven expedient to lay out the overall 3D inspection<br />

area with ample space, to give the<br />

ultimate user complete flexibility in selecting<br />

the acquisition angle. In addition to larger<br />

penetration angles and different perspectives,<br />

leading to better 3D results, larger<br />

printed circuit boards can be inspected. For<br />

high throughput, the use of a flat panel detector<br />

with as large a field of view as possible<br />

is important.<br />

The entire volume of an inspection object (here, all the BGA balls) is saved and with a special tool, can<br />

be displayed from freely selectable perspectives.<br />

Source: Viscom AG<br />

Many useful options<br />

The 3D reconstruction processes are central<br />

in determining the quality of the 3D reproduction<br />

of the acquired scene. Besides<br />

simple and fast methods, such as the addition<br />

process, the Viscom AXIs implement the<br />

FDK process (Feldkamp, Davis, Kress). Dirk<br />

Nülle, Managing AXI Product Developer, is<br />

responsible for the new X7056-II 3D AXI system:<br />

„This special process of filtered rear projection<br />

delivers better slice image reconstructions, especially for<br />

BGAs. However, it does take somewhat more computation time.“<br />

Not only is it equipped with a user-friendly display and has a basic<br />

image improvement, there are also appropriate aids such as<br />

contrast filters or the possibility of grayscale value adaptation<br />

(gamma correction). All results are flawless, even for sagging<br />

printed circuit boards, it is also possible to add a height correction to<br />

the automatic inspection run. This is accomplished by a tool that correspondingly<br />

adapts the individual inspection positions. The calculated<br />

sag model of the electronic assembly is then applied for each<br />

inspection method.<br />

The inspection system software should be as easy to operate as<br />

possible. For instance, a user can specify 3D AXI acquisition positions,<br />

has various resolution stages to choose from, and decides on<br />

a number of viewing positions appropriate to the application and desired<br />

inspection depth. Later, depending on the task, a selection between<br />

these predefined 3D cameras can be made. Again depending<br />

on the task, either inspection quality or cycle time is the priority.<br />

Individual slice from a 3D analysis: View in the vVision X-ray viewer after application of the FDK<br />

reconstruction process.<br />

„In our experience, at least nine views are necessary to realize 3D.<br />

Yet sometimes, it turns out more acquisitions are needed, depending<br />

on shadowing and on which components are in opposite positions<br />

on a printed circuit board assembled on both sides,“ states<br />

Dirk Nülle.<br />

Conclusive results<br />

Today, partial or complete volumes of an object inspected with 3D<br />

AXI can be displayed on a screen relatively quickly and easily, and<br />

can be tilted, rotated and zoomed with a mouse or on a touchscreen.<br />

A special feature compared to a purely optical reconstruction:<br />

a slice-by-slice view into the interior of an object, such as an<br />

Source: Viscom AG<br />

<strong>EPP</strong> EUROPE May 2018 75


TEST + QUALITY ASSURANCE<br />

Source: Viscom AG<br />

Source: Viscom AG<br />

The new 3D AXI system, X7056-II, from Viscom achieves<br />

extremely short handling times.<br />

array of BGA balls, is possible. Setting up such a tool on the verification<br />

station yields additional options for explicit defect classification<br />

and for researching defect causes in the process.<br />

The capability to calculate meaningful volume information from several<br />

two-dimensional penetrations of the inspection object and derive<br />

individual slices from this information is the most important advantage<br />

of the 3D technology in x-ray inspection of electronic assemblies.<br />

For example, if the voids on a QFN are to be inspected,<br />

but there is another component, say, a chip, on the other side of a<br />

printed circuit board assembled on both sides, then it is likely that<br />

not all of the air inclusions would be optimally visible in typical x-ray<br />

images, because the objects overlap in the image and conceal each<br />

other. The 3D reconstruction of the volumetric unit in the 3D x-ray inspection<br />

permits precisely the relevant slices to be separated,<br />

greatly facilitating this type of inspection without interfering overlapping.<br />

Because in principle, the entire volume of the scene can be irradiated<br />

so its structure can also be determined, the slices do not<br />

necessarily have to be made only horizontally. For example, a vertically<br />

separated slice may be able to deliver important information,<br />

such as that one BGA ball in the outer row is not attached, indicating<br />

a head in pillow (HIP) defect. On a printed circuit board assembled<br />

on both sides, now the components located on each side are seen.<br />

Each slice image, whether horizontal or vertical, can be directly forwarded<br />

to the analysis. Voids, for instance, can now be identified<br />

and classified easily and without error.<br />

Printed circuit board handling in an X7056-II with 3D AXI and 3D AOI.<br />

Balanced combined solution<br />

Additional advantages arise when AXI and AOI are integrated in a<br />

single system. With this combination, not only can the proportions<br />

of orthogonal, angled and 3D x-ray be optimally tuned to each other,<br />

but by the inclusion of optical inspection methods, their use can<br />

also be reduced to a minimum. This in turn further improves the<br />

cycle time of the entire inspection while – as an often overlooked effect<br />

– the radiation load on individual components is lowered. Some<br />

criteria, most apparently the example of OCR (optical character recognition)<br />

– recognizing plain text on the component – must be conducted<br />

purely optically; in other cases, features can be captured<br />

either optically or with x-ray. Logically, other effects can only be inspected<br />

with x-ray technology methods.<br />

In a good combination system, printed circuit boards shuttle quickly<br />

and nearly simultaneously between the two inspection sections.<br />

Optical fiducial cameras can already start before the lead plate separating<br />

the two inspection sections has fully closed. With just a<br />

single system, complete, fast inspection coverage can be guaranteed.<br />

If there is a suspicion that undetected hidden defects still<br />

exist after the optical inspection, an additional x-ray inspection that<br />

runs in the same system can be automatically started just for these<br />

cases.<br />

The operating convenience of such a combination system can extend<br />

to integrated automatic inspection program creation and the<br />

use of an inspection simulator with which the user can run through<br />

different inspection scenarios off-line, e.g., with greater weighting<br />

of the inspection quality, the costs or the speed.<br />

Interplay with MXI<br />

The x-ray results from the inspection system can be linked with<br />

other inspection results (3D SPI, 3D AOI) via a networked line, e.g.,<br />

with Viscom Quality Uplink, and intelligently merged for evaluations.<br />

Incidentally, this does not only apply to an in-line x-ray. MXI systems<br />

also prove themselves as true team players here. „I can transfer the<br />

inspection results from the line to a manual system and, for<br />

76 <strong>EPP</strong> EUROPE May 2018


Source: Viscom AG<br />

The company offers a wide range of X-ray systems.<br />

example, conduct detailed inspection at the corresponding positions<br />

for ambiguous defects or random samples there,“ states Rolf<br />

Demitz, co-responsible for MXI development and other assignments<br />

as Division Head. Of course, post-classification software can<br />

also be used on such a system.<br />

Despite the ever increasing speed of the AXI solutions, manual x-ray<br />

remains an essential component in electronics production. Both reclaimed<br />

electronic assemblies and newly developed prototypes can<br />

be optimally inspected with MXI. Normally, this is done without taking<br />

cycle time into account. The inspection takes place between the<br />

tube and the pivot-able detector (image converter), for as long as is<br />

necessary. The object arrives, e.g., on the rotating platform of a manipulator<br />

that the employee can maneuver upwards and downwards<br />

with a joystick. The most impressive characteristic of the results is<br />

the extremely high detail recognition, which also benefits 3D reconstructions<br />

from both rotary and planar CT. Naturally, certain automations<br />

can already be realized with a manual system: Position lists<br />

and classifications can be created for small series, so only the locations<br />

that are actually relevant are inspected. For program creation,<br />

the operator can draw on CAD data, just as for in-line x-ray,<br />

and start a series inspection with fully automatic evaluation. It is<br />

also conceivable that a magazine connected to the system, with the<br />

assistance of an appropriate handling concept, will permit the inspection<br />

to run entirely independently without other intervention for<br />

a given time (batch operation). In principle, even connection to the<br />

production line is possible.<br />

Wide offering for x-ray application<br />

The company offers complete versatility for x-ray inspection of electronic<br />

assemblies. The X8011-II PCB is extremely successful in the<br />

MXI area. For heavy components up to 15 kg and a sample size of<br />

up to 722 mm diameter, the otherwise similarly technically<br />

equipped system, X8068, is ideally suited. For in-line x-ray inspection,<br />

the X7056RS has been used around the world for many years.<br />

When purchasing, a majority of the users decide to integrate an appropriate<br />

optical inspection solution from the company. The new version<br />

of this system is the X7056-II – equipped with the innovative<br />

handling concept xFastFlow, which can change in- and outfeed<br />

printed circuit boards in less than 4 seconds, and is also designed<br />

as a combination option with 3D AXI and 3D AOI. The X7056 series<br />

offers the possibility to order the so-called „AOI-prepared“ version,<br />

so the customer can deploy an AXI system that can later be quickly<br />

and economically extended with the AOI option. The X7056-II is<br />

available with the software vVision, to offer the same ease of operation<br />

the company has already realized for its AOI, as well as, SPI<br />

and CCI systems; that is, also for solder paste and conformal coating<br />

inspection on electronic assemblies.<br />

SMT Hybrid Packaging, Booth 4A-122<br />

www.viscom.com<br />

Zusammenfassung<br />

3D-Inspektion und hohe Geschwindigkeit als wichtiges Merkmal<br />

für AOI-Systeme sind mittlerweile auch für die Röntgensysteme<br />

bedeutend geworden. So steigt durch zeitoptimierte Bildaufnahmetechnologien<br />

sowie effizienten Handhabungskonzepten die Inline-<br />

Röntgenleistung ständig. Vorteilhafte Automatisierungsmöglichkeiten<br />

bestehen auch dort, wo der Einsatz von MXI empfohlen wird.<br />

Résumé<br />

Non seulement l‘inspection 3D et les caractéristiques à grande vitesse<br />

sont devenus important pour les systèmes AOI, cette importance<br />

est devenue aussi significative pour les systèmes à radiographie.<br />

Avec des technologies d‘acquisition d‘images optimisées<br />

dans le temps et des concepts de manipulation efficaces, les performances<br />

en ligne des rayons X sont en augmentation constante.<br />

Des possibilités d‘automatisation avantageuses existent également<br />

avec l‘utilisation de MXI.<br />

Резюме<br />

3D-инспектирование и высокая скорость — важные<br />

характеристики системы оптического контроля качества<br />

печатных плат, которые в настоящее время становятся<br />

актуальны и для рентгенографических систем. Благодаря<br />

высокоскоростным технологиям регистрации изображения, а<br />

также эффективным концепциям применения<br />

производительность рентгенографических установок<br />

постоянно возрастает. Удачные решения по автоматизации<br />

существуют также там, где рекомендуется использование<br />

MXI.<br />

<strong>EPP</strong> EUROPE May 2018 77


TEST + QUALITY ASSURANCE<br />

PRODUCT UPDATES<br />

The purchase of two X-ray systems<br />

Scienscope International, an American supplier<br />

of cabinet style micro-focus X-ray systems,<br />

is pleased to announce that Milwaukee<br />

Electronics purchased two X-Spection<br />

6000 systems – one for their facility in Oregon<br />

and one for their facility in Mexico. The<br />

company offers services in circuit board design<br />

and PCB assembly, and has evolved in<br />

both its design engineering and contract<br />

manufacturing capabilities. With manufacturing<br />

facilities in Wisconsin, Oregon and Mexico,<br />

the company offers both U.S. regional<br />

support options and a migration path to a<br />

low-cost manufacturing solution for mature<br />

products.<br />

The X-Spection 6000 systems have been<br />

setup and programmed to perform automated<br />

inspection of BGAs. The company<br />

uses them to check the first product off the<br />

line daily. They also operate a quick turn operation<br />

in Oregon, named Screaming Circuits<br />

that offers rapid turnaround assembly and<br />

prototyping. The system is also used to<br />

evaluate the company’s prototypes and vali-<br />

date their process<br />

for the rapid turnaround<br />

products.<br />

The X-ray inspection<br />

system is the company’s<br />

most technologically<br />

advanced<br />

cabinet style X-ray<br />

inspection system.<br />

As with all X-Scope<br />

platforms, it includes<br />

every advanced software<br />

tool required<br />

for a wide variety of<br />

applications. With<br />

more tilt and a rotating<br />

work table, the X-Spection 6000 offers<br />

the ultimate in flexibility. Standard features of<br />

this X-ray inspection system include:<br />

• Fully integrated, 130 kV micro-focus high<br />

power closed X-ray tube<br />

• 5 “ x 5 “ or 4 “ x 3 “ high resolution and ultraresolution<br />

CMOS digital flat pane image<br />

detectors<br />

Milwaukee Electronics has recently purchased two inspection machines, from<br />

Scienscope International, for their facilities in Oregon and Mexico.<br />

• 60 ° camera tilt for oblique angle viewing<br />

• 22 “ x 18 “ inspection stage with 350 ° rotation<br />

• Color mapping camera with zoom window<br />

provides easy location and identification of<br />

faults<br />

www.scienscope.com; www.milwakeeelectronics.com<br />

Source: Scienscope International<br />

<br />

<br />

<br />

Receiving reliable data quickly with confocal<br />

microscope<br />

With a four times higher scan<br />

speed, Olympus’ confocal microscope,<br />

Lext OLS5000, combines<br />

4K scanning and a large working<br />

distance to capture the shape of<br />

any sample under any angle. The<br />

3D measuring laser microscope<br />

has dedicated objectives, an improved<br />

scanning algorithm and a<br />

210 mm extension frame, to be<br />

able to measure a larger range of<br />

samples.<br />

The microscope also incorporates<br />

a Peak algorithm for 3D data<br />

Source: Olympus Europa SE & Co. KG<br />

The Lext OLS5000 has a four times<br />

faster scan speed and an extension<br />

frame with dedicated optics.<br />

construction. Combined with the<br />

Skip Scan function, data acquisition<br />

times can be reduced by<br />

75 %. Also, with the extension<br />

frame, samples of up to 210 mm<br />

can be analysed. A long working<br />

distance objective measures<br />

dents of up to 25 mm and inspects<br />

challenging samples. The<br />

microscope is also equipped<br />

with 4K scanning technology that<br />

can capture steep slopes of up to<br />

87.5°. The company has also designed<br />

dedicated objectives that<br />

perform uniform measurements<br />

across the field of view. Finally, a<br />

Smart Judge function can distinguish<br />

between steps on a<br />

sample and noise.<br />

Using an intuitive software, it has<br />

the ability to automate settings<br />

that had to previously be specified<br />

by the operator. The Smart<br />

Scan function and analysis templates<br />

automate the workflow<br />

from data acquisition to reporting,<br />

making it easy to operate<br />

with a push of the start button.<br />

www.olympus-ims.com<br />

78 <strong>EPP</strong> EUROPE May 2018


Fast, repeatable, high-resolution tests<br />

Yxlon International launched its<br />

x-ray inspection systems series,<br />

Cheetah EVO and Cougar EVO,<br />

custom-built systems for SMT,<br />

semiconductor, and laboratory<br />

applications.<br />

The Cheetah EVO SMT offers<br />

users accurate, fast, and repeatable<br />

inspection – both manually<br />

and automatically; high power,<br />

high resolution inspection of very<br />

small features, as well as easy to<br />

use, dynamic image enhancing<br />

filters like eHDR. The model<br />

Semi addresses the needs of<br />

semiconductor producers by providing<br />

accurate and repeatable<br />

void measurements and auto-<br />

Source: Yxlon International GmbH<br />

mated multi area void calculations,<br />

excellent resolution at<br />

low power and low kV, automated<br />

inspection routines, and<br />

quick ‘on the fly’ inspections. The<br />

model Plus is perfect for laboratory<br />

work. With microCT coming<br />

as standard in this system, users<br />

get the ultimate quality resolution<br />

for failure analysis, highperformance<br />

CT inspection, and<br />

highest industry CT reconstructions<br />

with VGStudio and CERA<br />

Software.<br />

SMT Hybrid Packaging, Booth<br />

4A-350<br />

www.yxlon.com<br />

Source: Yxlon International GmbH<br />

Yamaha True Total Line Solution is the industry leading portfolio in the market for entry level,<br />

high-mix low/medium-volume up to high-mix high-volume and ultra-mass production.<br />

The Yamaha Intelligent Factory Solutions offer the most complete software solution for Industry 4.0.<br />

In the Yamaha Intelligent Factory we focus on the 4M connection by digital technology inside<br />

electronics manufacturing: MACHINE – MATERIAL – HUMAN – METHOD.<br />

Maximize line productivity & factory efficiency with 4 x M2M connections: Machine to Machine,<br />

Material to Machine, Method to Machine and Machine to Human.<br />

www.yamaha-motor-im.eu<br />

05.-07.06.2018, Nuremberg, Germany<br />

HALL 4<br />

STAND 319<br />

VISIT<br />

US!<br />

Source: Vi Technology<br />

The Cheetah EVO range is tailored to<br />

the needs of various areas.<br />

Real-time 3D SPI and 3D AOI inspection<br />

measurements<br />

Vi Technology showcased the<br />

5K3D AOI system, 3D SPI system,<br />

and software module<br />

Sigma Line.<br />

This Sigma Line offers a real-time<br />

combination of 3D SPI and 3D<br />

AOI inspection measurements.<br />

The 5K3D is a 3D AOI that offers complete<br />

defect coverage with high precision<br />

metrology and limited shadow effect.<br />

The Cougar EVO systems are spacesaving<br />

X-ray system alternatives.<br />

By considering all inspection systems<br />

as one tool, it is a new way<br />

to optimize the SMT process and<br />

converge to the zero defect line.<br />

Also, it is the prerequisite to<br />

transform large volumes of data<br />

into actionable data.<br />

The 5K3D is a patented 3D AOI<br />

combination that offers complete<br />

defect coverage with high precision<br />

metrology. The 5K3D is a<br />

100 % 3D AOI, it offers a wide<br />

range of z-measurement, up to<br />

25 mm, while maintaining high<br />

accuracy and speed. With limited<br />

shadow effect, it comes with the<br />

best accuracy and repeatability.<br />

SMT Hybrid Packaging, Booth<br />

4–349<br />

www.vitechnology.com<br />

CONTACT<br />

TECHNOLOGIES<br />

AT THE<br />

HIGHEST<br />

LEVEL<br />

Shanghai Skyline and<br />

Contact Probes.<br />

Best Contacts worldwide.<br />

<strong>EPP</strong> EUROPE May 2018 79


TEST + QUALITY ASSURANCE<br />

Insight into the inside: x-ray inspection of solder quality<br />

Checking power semiconductor<br />

devices in production line<br />

Ixys UK Westcode, part of the power semiconductor manufacturer, Ixys Corporation, is investing in its Chippenham,<br />

UK factory to manufacture a new range of power semiconductor devices, which will be marketed alongside the<br />

company‘s press-pack capsules. Nikon Metrology was chosen to supply the x-ray equipment for checking the quality<br />

of the reflow soldering process during production.<br />

Power semiconductor devices are used for switching high currents<br />

and voltages and are widely used in the rail, wind turbine,<br />

mining, and petrochemical sectors. Press-pack capsules are<br />

clamped together under high pressure to achieve the required electrical<br />

rating, whereas isolated power modules use integrated circuit<br />

on DCB (direct copper bonded) substrate technology. The Metrology<br />

XT V 160 is needed because the reflowed solder, which attaches the<br />

chips to their contact pads, must be continuous with a controlled<br />

level of voids and x-raying is the only way to see if these conditions<br />

have been met.<br />

Fiona Lambert, Process Engineer at the company commented, „I<br />

previously used a smaller Nikon 130 kV x-ray quality assurance (QA)<br />

system when I worked at an electronics company in South Wales,<br />

so I knew how easy their equipment is to use. After reviewing what<br />

else was on the market, it was clear that the 160 kV model would<br />

best suit our application, which involves penetrating thicker and<br />

higher density materials to observe solder coverage.<br />

„What I particularly like about this system is the easy access to the<br />

large stage, which allows me to place several, quite large components<br />

on it at the same time. The machine is fast in operation and<br />

the stage is easy to manipulate in multiple axes, so tilting, rotating<br />

and positioning, as well as, zooming the image on the screen is<br />

rapid. You can see everything clearly, as the image is in high resolution.<br />

The software is also user-friendly and even works out automatically<br />

the percentage of voids in the solder, required to ensure<br />

the product meets rigorous specifications.”<br />

Two-step x-ray inspection<br />

X-raying is carried out at two stages of manufacture. The first is after<br />

the chips have been placed on the blank DCB substrate and reflow<br />

soldered. After six built substrates have been electrically tested and<br />

soldered onto a 5 mm thick aluminum-silicon-carbide baseplate, the<br />

whole assembly is x-rayed again.<br />

The system inspects the assembly reliably, even without the optional<br />

x-ray laminography software or CT (computed tomography)<br />

add-on. Features of the machine that assist in completing the task<br />

efficiently include its 20 watt target power rating, focal spot size between<br />

1 μm and 10 μm depending on power output, up to 36,000x<br />

system magnification and the high image quality provided by a<br />

Varex 16-bit flat panel. Having such fine resolution allows easy distinction<br />

between geometrical shapes and the amorphous voids.<br />

Multiple uses: x-ray system inspects quality of<br />

incoming materials<br />

While the x-ray machine was installed specifically for DCB inspection,<br />

its presence on the Chippenham site has proved beneficial for<br />

Fiona Lambert, Process Engineer, IXYS UK Westcode.<br />

Source: Nikon Metrology NV<br />

A video of Fiona Lambert talking about the<br />

advantages of the system: www.youtube.<br />

com/watch?v=0Uy9T13Y6_E&feature=youtu.be<br />

TIP<br />

80 <strong>EPP</strong> EUROPE May 2018


Source: Nikon Metrology NV<br />

Fiona Lambert operating the Nikon Metrology XT V 160 X-ray inspection system.<br />

The XT V screen displays high resolution images of solder coverage and the<br />

software automatically works out the percentage of voids to ensure the product<br />

meets rigorous specifications.<br />

Source: Nikon Metrology NV<br />

last for a couple of years but can stop working without warning, perhaps<br />

at the worst possible time for the user. The manufacturer then<br />

has to be called in to renew the tube at a high cost and the machine<br />

is down for days.<br />

Conclusion<br />

The company’s inspection of power semiconductor devices will increase<br />

over the coming years. With one or two products per batch<br />

to be x-rayed for QA, the Nikon Metrology machine will be in constant<br />

use once the process has been finally established. As a postscript,<br />

it is interesting to note that the transmission target x-ray<br />

source in this particular system is the 1,000 th to be manufactured in<br />

the UK at the Tring factory since manufacturing began there in 1987.<br />

SMT Hybrid Packaging, Booth 4–308<br />

www.nikonmetrology.com; www.westcode.com<br />

Source: Nikon Metrology NV<br />

Top: The company’s isolated power modules being inspected. Bottom: The<br />

x-ray machine shows 1,000th x-ray source to be manufactured at the firm‘s<br />

factory in Tring, UK.<br />

verifying the quality of bought-in materials. On one occasion, a supplier<br />

disputed that there was a high incidence of solder blockages in<br />

a consignment of delivered coolers that form part of press-pack<br />

IGBT stacks. A simple analysis using the inspection machine provided<br />

irrefutable evidence and resulted in the prompt arrival of a replacement<br />

batch.<br />

Open-tube x-ray source design reduces<br />

maintenance cost<br />

An additional advantage of the x-ray technology is the stability of<br />

output due to the micro-focus spot source and advanced image processing<br />

capabilities, essential to avoid degradation of image quality.<br />

Focus of the electron beam is maintained by a computer-controlled,<br />

electromagnetic lens that ensures the target does not overheat<br />

whilst maintaining a micron spot size, even at high kV settings.<br />

Although a high power machine, the XT V 160 is of open-tube design.<br />

As part of planned maintenance, replacement of the electron<br />

beam-producing filament can be scheduled a couple of times per<br />

year for a cost of a few pounds. Filament replacement takes minutes,<br />

so downtime is short. A sealed tube, on the other hand, will<br />

Zusammenfassung<br />

Nachdem die Inspektion von Leistungshalbleitern eines Herstellers<br />

in den kommenden Jahren eine zunehmende Tendenz zeigt, wurde<br />

zur Prüfung einer neuen Produktreihe von Leistungshalbleiter-Modulen<br />

in Röntgen-Equipment von Nikon investiert. Damit soll die<br />

Qualität während des Reflowlötprozesses überprüft und gesichert<br />

werden, wie der Anwenderartikel zeigt.<br />

Résumé<br />

Après une tendance croissante dans l‘inspection des semi-conducteurs<br />

de puissance d‘un fabricant au cours des prochaines années,<br />

Nikon a investi pour mettre au point une nouvelle gamme de<br />

modules de semi-conducteurs de puissance dans l‘équipement à<br />

rayons X Nikon. Le but est de vérifier et de sécuriser la qualité pendant<br />

le procède de brasage par refusions, comme le montre l‘article<br />

de l‘utilisateur.<br />

Резюме<br />

Поскольку инспектирование силовых полупроводниковых<br />

приборов в ближайшие годы станет стандартной процедурой,<br />

при запуске новой линейки силовых полупроводниковых<br />

модулей было принято решение инвестировать в<br />

рентгенографическое оборудование Nikon. В статье<br />

рассказывается о том, каким образом обеспечивается<br />

контроль качества при пайке оплавлением.<br />

<strong>EPP</strong> EUROPE May 2018 81


ADVERTISERS<br />

Advertisers / Editorials<br />

Aegis Software 34, 44<br />

AIM Metals & Alloys LP 47<br />

Alpha Assembly Solutions 63<br />

Anda Technologies USA 49<br />

ASM 46<br />

ASSCON Systemtechnik-<br />

Elektronik GmbH 68<br />

BJZ GmbH & Co. KG 84<br />

Coriant 70<br />

ECT 69<br />

Electrolube a Division of H.K.<br />

Wentworth Limited 37<br />

Ersa 3, 22-23, 36<br />

Europlacer 40<br />

FEINMETALL GmbH<br />

Prüftechn.f.d.Elektronik 79<br />

FUJI EUROPE<br />

CORPORATION GmbH 24-25<br />

Fuji Machine MFG 8<br />

F&S BONDTEC Semiconductor<br />

GmbH 69<br />

Global Electronics 40<br />

Göpel electronic GmbH 70<br />

Heraeus Electronics 6<br />

HumiSeal <strong>Europe</strong> Ltd. 15<br />

IBL-Löttechnik GmbH 8<br />

Indium Corporation of America 5<br />

Inertec Löttechnik GmbH 73<br />

Inspectis AB 69<br />

Intermas 39<br />

Intertronics<br />

64<br />

IPC 15<br />

Ixys UK KWestco<br />

code<br />

80<br />

KIC 9<br />

Christian Koenen GmbH 20-21<br />

Koh Young Technology 2, 66<br />

Kyzen 45<br />

Lackwerke Peters 54<br />

Luger Research e.U 14<br />

LPKF Laser &<br />

Electronics AG 43, 26-27<br />

Merck 65<br />

MicroCare <strong>Europe</strong> bvba 35<br />

MTM NE-Metalle GmbH 58<br />

Nikon Metrology 80<br />

Nordson Asymtek 9<br />

Nordson Select 42<br />

Olympus 78<br />

Omron 73<br />

Orbotech Ltd 57<br />

Panacol 49<br />

Panasonic Corporation 10<br />

Pemtron <strong>Europe</strong> GmbH 55<br />

PIEK International Education<br />

Centre (I.E.C.) GmbH 65<br />

Rehm 9, 56<br />

Schunk Electronic Solutions 56<br />

Scienscope International 78<br />

SEHO Systems 33, 50<br />

Super Dry Totech 34<br />

Techcon 64<br />

TopLine 14<br />

ULT AG 34<br />

Vega Grieshaber 46<br />

Vi Technology 28-29, 79<br />

Viscom 30-31, 68, 74<br />

ViscoTec Pumpen- und<br />

Dosiertechnik GmbH 78<br />

Weller 44<br />

Weller Tools GmbH 51<br />

Wolfram Industrie 60<br />

www.olympus-ims.com 78<br />

Yamaha Motor <strong>Europe</strong> N.V.<br />

Niederlassung Deutschland 79<br />

Yxlon International 79<br />

ISSN 1618–5587<br />

Trade journal for all fields of production in the<br />

electronics industry, manufacturing equipment,<br />

test and messurement, materials<br />

Publisher: Katja Kohlhammer<br />

Publishing House:<br />

Konradin-Verlag Robert Kohlhammer GmbH,<br />

Ernst-Mey-Straße 8, 70771 Leinfelden-Echterdingen,<br />

Germany<br />

General Manager: Peter Dilger<br />

Editor-in-Chief:<br />

Doris Jetter, Phone +49 7021 53 609<br />

E-Mail: doris.jetter@konradin.de<br />

Trainee / Editor:<br />

Charlene Perrin, Phone +49 (0)711 7594–428<br />

E-Mail: charlene.perrin@konradin.de<br />

Editorial Assistant: Birgit Niebel,<br />

Phone +49 711 7594 -349, Fax –1349,<br />

E-Mail: birgit.niebel@konradin.de<br />

Layout: Matthias Rösiger,<br />

Phone +49 711 7594 -273<br />

Advertising Manager: Andreas Hugel,<br />

Phone +49 711 7594 - 472,<br />

E-Mail: andreas.hugel@konradin.de<br />

Order processing: Josephine Linseisen,<br />

Phone +49 711 7594 -315<br />

E-Mail: josephine.linseisen@konradin.de<br />

Advertising rate card No. 41, 1. October 2017<br />

is currently in effect.<br />

Reader Service: Ute Krämer,<br />

Phone +49 711 7594-5850,<br />

Fax +49 711 7594-15850<br />

E-Mail: ute.kraemer@konradin.de<br />

<strong>EPP</strong> and <strong>EPP</strong> <strong>Europe</strong> are published nine times a year,<br />

and will only be supplied free of charge to qualified<br />

subscribers. Non-qualifying individuals place subscriptions<br />

via bookshops or the publish ing house.<br />

Annual subscription price Germany € 85,40, abroad<br />

€ 86,10 incl. post age. Single copy: € 12,50 + post age.<br />

Unless ordered for a specific period, a subscription<br />

continues until cancelled. You can cancel your subscription<br />

for the first time by giving notice of termination<br />

four weeks prior to the end of the subscription<br />

year. After one year, the termination period is four<br />

weeks prior to the end of each quarter. Prepaid subscription<br />

fees will not be reimbursed for non-publication<br />

due to technical reasons or force majeure. Reprint<br />

requires express previous approval by the editor.<br />

Signed articles represent the views of the author, not<br />

necessarily those of the editors. No responsibility is<br />

accepted for unsolicited manuscripts and industry reports.<br />

Bank accounts: Baden-Württembergische Bank<br />

Stuttgart, Konto 26 23 887, BLZ 600 501 01; Postbank<br />

Stuttgart, Konto 44 689-706, BLZ 600 100 70.<br />

Articles published in this magazine are protected by<br />

copyright. All rights are expressly re served, in particular<br />

the right of translation into foreign languages, and<br />

also of reproduction in any form whatsoever, for<br />

example by photo copying, microfilming or other processes,<br />

input to data proc essing systems or dissemination<br />

by public speaking, radio or tel evision<br />

transmis sion, with the sole excep tion of the special<br />

circum stances provided for in § 53 and 54 of the German<br />

Copy right Act (UrhG). All legal settlements in<br />

Stuttgart.<br />

Print:<br />

Konradin Druck GmbH<br />

Leinfelden-Echterdingen<br />

Printed in Germany<br />

© 2018 by Konradin-Verlag Robert Kolhammer GmbH,<br />

Leinfelden-Echterdingen<br />

Zevatron Löttechnik 64, 62<br />

Zymet 64<br />

82 <strong>EPP</strong> EUROPE May 2018


Industrie<br />

The<br />

network of<br />

expertise<br />

for industry<br />

18 media brands for all major sectors<br />

of industry<br />

Information, inspiration and networking<br />

for professionals and industry executives<br />

Practical knowledge spanning all media<br />

channels: Trade journals, websites, newsletters,<br />

whitepapers, webinars, events<br />

Your qualified partner for future topics<br />

of industry<br />

Discover the appropriate media for<br />

you and your specific industry sector:<br />

konradin.de/industrie<br />

media.industrie.de<br />

<strong>EPP</strong> EUROPE May 2018 83


84 <strong>EPP</strong> EUROPE May 2018

Hooray! Your file is uploaded and ready to be published.

Saved successfully!

Ooh no, something went wrong!