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04 2020 www.epp-europe.eu<br />

COVER<br />

3D AXI provides fast<br />

volumetric inspection<br />

CONTENTS<br />

News + Highlights<br />

Well trained solders better<br />

Trade Shows + Events<br />

Review of the<br />

IPC Apex Expo 2020<br />

PCB + Assembly<br />

Benefits of soldering with<br />

vacuum profiles<br />

Preventing electric vehicle<br />

recalls<br />

Digital twin of the production<br />

with real-time data<br />

<strong>EPP</strong> EUROPE April 2020 1


The leading information source<br />

for electronics manufacturing<br />

Industrie<br />

| The network of expertise for industry<br />

05 2018<br />

www.epp-europe.eu<br />

INTERVIEW<br />

Mark Challingsworth,<br />

Heraeus Electronics<br />

Fast changing speed of the<br />

semiconductor industry<br />

Industrie<br />

COVER<br />

| Das Kompetenznetzwerk der Industrie<br />

The heart of the<br />

electronic industry<br />

5-6 2018<br />

epp-online.de<br />

CONTENT<br />

Trade shows + events<br />

Accomplishments of<br />

the past 100 years<br />

PCB + Assembly<br />

Real added value with<br />

assistance systems<br />

IM INTERVIEW<br />

Christian Koenen,<br />

Christian Koenen GmbH<br />

Im Druckprozess<br />

schlummern noch große<br />

Einsparungspotenziale<br />

Zero-fault production<br />

in soldering processes<br />

TITELTHEMA<br />

SMT/Nuremberg<br />

Visit us at<br />

Booth 4-140<br />

Test + Quality Assurance<br />

Führende The “Golden Selektivlöt-Technologie<br />

Hour” of<br />

the assembly line<br />

sichert Wachstum<br />

AUS DEM INHALT<br />

<strong>EPP</strong> EUROPE May 2018 1<br />

Messen + Veranstaltungen<br />

21. EE-Kolleg<br />

Baugruppenfertigung<br />

Wettbewerbsfähig<br />

durch angepasste<br />

Produktionslogistik<br />

Packaging<br />

Dispensen von Leiterplatten<br />

im XXL-Format<br />

SMT/Nürnberg<br />

Sie finden uns:<br />

Halle 4, Stand 140<br />

Test + Qualitätssicherung<br />

Industrie 4.0-taugliche<br />

Inspektionssysteme<br />

LED meets SMT<br />

Your Multi-Channel Expert<br />

www.epp-online.de | www.epp-europe.eu<br />

2 <strong>EPP</strong> EUROPE April 2020


EDITORIAL<br />

Fight against the virus<br />

Since the worldwide epidemic of the Covid-19 virus began, the world as we<br />

knew it has completely changed. The everyday normal has turned into what<br />

we never thought was possible. Despite this state of emergency, many are<br />

already seeing the light at the end of the tunnel. Industries have been able<br />

to quickly replace their traditional structures for more creative business<br />

models. It is most likely improbable that all will go back to normal once this<br />

is over, however a new future will emerge in its place. Now is the time to<br />

share ideas and thoughts, collaborate and communicate, and help each<br />

other get through this together. We will come out on the other side,<br />

stronger as one.<br />

Work together for a better tomorrow.<br />

GLOBAL.<br />

AHEAD.<br />

SUSTAINABLE.<br />

The role of automated X-ray inspection<br />

The cover story discusses how important 3D X-ray inspection is, especially<br />

when ensuring the quality of critical devices. 3D X-ray provides inspection<br />

where classical AOI has limitations. Due to this, equipment needs to be<br />

faster, more accurate, and adopt machine-to-machine (M2M) capabilities to<br />

keep pace and deliver products that ensure reliability. In addition, planar computed<br />

tomography technology is essential for high accuracy defect detection,<br />

as it provides volumetric inspection of solder joints. Today’s technological innovations<br />

must also consider environmental factors and adhere to strict<br />

standards.<br />

Obtaining perfect 3D images.<br />

Traceability in electronics manufacturing<br />

In the <strong>Europe</strong>an region, most electronics manufacturing is geared toward<br />

building high-quality goods for automotive, telecommunications industries,<br />

and more. This is why traceability is no longer optional or a nice-to-have<br />

tool, it is a requirement. Only focusing on material traceability is also not<br />

enough. A proven solution will equip manufacturers with reporting of the<br />

complete process and help them better manage production environment by<br />

making detailed material, product and process information readily available.<br />

The perfect solution will also easily complement existing systems.<br />

No longer just an option.<br />

before<br />

VOIDLESS REFLOW.<br />

EFFICIENT AND SAFE.<br />

How to avoid Voids?<br />

Ersa EXOS 10/26<br />

after<br />

Optimum temperature profiles due to<br />

medium-wave emitters in the vacuum<br />

module<br />

Reduction of the void rate by up to 99 %<br />

Perfect synchronization and transitions<br />

thanks four-part conveyor<br />

Maintenance-friendly and lubricant-free<br />

roller conveyor in the vacuum module<br />

Highest machine availability<br />

Source: Carina Zarfelder<br />

Charlene Hesse<br />

Online Editor <strong>EPP</strong> E<br />

Ersa EXOS 10/26<br />

Convection reflow soldering<br />

system with vacuum module<br />

www.driven-by-kurtzersa.de<br />

<strong>EPP</strong> EUROPE April 2020 3


Contents 04 2020<br />

<strong>Europe</strong>an Magazine for<br />

Production and Test in the<br />

Electronics Industry<br />

Cover Feature<br />

3D AXI for fast volumetric<br />

inspection<br />

With the increasing complexity of electronic products, 3D X-ray<br />

inspection is becoming more important and vital, as it plays a key<br />

role in assuring the quality of critical devices, especially for<br />

applications where human lives are directly connected. Using a<br />

system with planar computed tomography is also essential for high<br />

accuracy defect detection.<br />

Achieving zero escapes<br />

Source: ULT AG<br />

Source: MicroCare<br />

08<br />

Every year, 250–300 soldering licenses are issued after completing<br />

an 8-module soldering program.<br />

30<br />

Test-cleaning in small batches prior to full-scale manufacturing<br />

can eliminate surprises to ensure better board reliability.<br />

News + Highlights<br />

6 Providing information during Covid-19<br />

Kyzen offers free resources in E-knowledge Center<br />

6 Impacts of virus on electronics industry<br />

IPC releases survey results for March<br />

8 Soldering license with the best air conditions<br />

ULT helps RAFI with training program<br />

11 Appointment of Director of EMEA Operations<br />

Rejoining the ECD team<br />

11 Partnership meets quality inspection<br />

Bosch chooses Mirtec as AOI partner<br />

12 AR-based customer service tool<br />

IPTE provides remote support<br />

12 Total focus on automation concepts<br />

Kurtz Ersa Automation meets Industry 4.0<br />

13 Staff changes within sales partnership<br />

Viscom AG welcomes change in personnel<br />

Trade Shows+ Events<br />

14 Elevating excellence of electronics<br />

IPC Apex Expo 2020 brings the industry together<br />

16 Electronic manufacturing value chain<br />

Innovative premieres at productronica 2019<br />

Source: Electrolube<br />

38<br />

As trends in the automotive industry continue to<br />

increase, this causes more challenges for electrical<br />

circuits, connectors and contacts.<br />

PCB + Assembly Features<br />

26 Five step cycle for jet valve dispensing<br />

The right automated dispensing technology (Techcon)<br />

29 Product-Updates PCB Assembly<br />

30 Fundamentals needed for critical cleaning<br />

Planning during initial design of PCB (MicroCare)<br />

33 Product-Updates PCB Assembly<br />

34 Benefits of soldering with vacuum profiles<br />

Void formation in the soldering process (Rehm)<br />

37 Product-Updates PCB Assembly<br />

4 <strong>EPP</strong> EUROPE April 2020


Source: Saki <strong>Europe</strong><br />

38 Improving performance with correct connectors<br />

Preventing electric vehicle recalls (Electrolube)<br />

42 Digital twin of production with real time data<br />

Support and maintenance from anywhere (ASM)<br />

45 Product-Updates PCB Assembly<br />

20<br />

46 Productivity with automated materials management<br />

Managing all materials in the supply chain (Mentor)<br />

49 Product-Updates PCB Assembly<br />

50 Need for traceability in electronics manufacturing<br />

Making information readily available (Cogiscan)<br />

53 Product-Updates PCB Assembly<br />

54 Solder paste for automotive reliability<br />

Challenges of harsh environments (Indium)<br />

57 Product-Updates PCB Assembly<br />

Test + Quality Assurance Features<br />

62 Product-Updates Test + Quality Assurance<br />

Columns<br />

3 Editorial<br />

4 Contents<br />

66 Imprint/List of advertisers<br />

Advancing Technology<br />

to Meet Demands<br />

ITW EAE brings together the world-leading brands<br />

of electronics assembly equipment. We are focused<br />

on developing technology to meet the demands<br />

for improvements in throughput, yield and<br />

performance. We have a strong relationship with the<br />

world’s leading manufacturers and work directly with<br />

them to identify areas that need further innovation.<br />

We are actively pursuing the benefits to be realized<br />

by Industry 4.0 and the resulting improvements in<br />

yield, overall equipment effectiveness, and lights out<br />

factory capabilities envisioned by our customers.<br />

Momentum II<br />

Printers<br />

NEW<br />

A fresh look and innovative new<br />

features for further enhancement<br />

in ease of use, yield , quality,<br />

productivity and versatility.<br />

Learn more at www.itweae.com<br />

A division of Illinois Tools Works<br />

<strong>EPP</strong> EUROPE April 2020 5


NEWS + HIGHLIGHTS<br />

Providing information during the Covid-19 pandemic<br />

Source: Kyzen<br />

Kyzen, a producer of innovative environmentally<br />

friendly cleaning chemistries, announces<br />

two important resources to help the industry<br />

during the Covid-19 pandemic. During these<br />

A variety of resources to help the industry during the<br />

Covid-19 pandemic can be found in the company‘s<br />

E-Knowledge Center.<br />

uncertain and unprecedented times, the<br />

company stands out as a leader who continually<br />

converges care with science.<br />

Two free resources have been added to the<br />

company’s E-Knowledge Center.<br />

The first resource is a short summary including<br />

recommendations about current practices<br />

involving hand sanitizers and lotions in<br />

manufacturing production areas. This summary<br />

is based on a paper developed and<br />

presented at IPC Apex 2010 by Collins Aerospace.<br />

The second resource is a technical brief providing<br />

alternatives to Isopropyl Alcohol (IPA).<br />

Demand for IPA is spiking and, in these challenging<br />

times, demand and prices for IPA are<br />

likely to continue increasing rapidly due to<br />

IPAs’ disinfectant qualities. Information about<br />

alternative solutions can be difficult to come<br />

by for these types of applications. To address<br />

that information gap, the company has developed<br />

a technical brief to help understand the<br />

alternatives and options. The technical brief<br />

can be found in the E-knowledge Center by<br />

searching the keyword “IPA.” This resource<br />

includes useful information about safe alternatives<br />

to IPA as well as conservation techniques<br />

for those continuing to use IPA.<br />

“Our greatest hope is that all our industry<br />

friends, customers and partners stay well<br />

during this pandemic. While we figure out<br />

how to conduct business during this time,<br />

we want you to know that you and your<br />

families are in our thoughts,” said Tom Forsythe,<br />

VP, on behalf of the entire Kyzen Corporation.<br />

www.kyzen.com<br />

Impacts of coronavirus on electronics industry<br />

Electronics manufacturers continue to feel<br />

the impact of the coronavirus on their businesses.<br />

Companies experiencing supply disruptions<br />

report they expect five-week shipment<br />

delays on average. But a majority of<br />

electronics manufacturers and suppliers expect<br />

business operations to be “back to normal”<br />

by July 2020, and collectively 75 percent<br />

of all respondents expect business to<br />

be back to normal by October 2020, according<br />

to a new IPC survey on the impacts of<br />

coronavirus disruptions.<br />

“Although manufacturers and suppliers continue<br />

to be hampered by the impacts of the<br />

coronavirus, most companies do not intend<br />

to make major cuts in capital expenditures,<br />

which suggests companies anticipate demand<br />

returning,” said John Mitchell, IPC<br />

president and CEO. “The delays will certainly<br />

impact sales for segments of electronics<br />

manufacturing, with consumer electronics<br />

likely to be the most impacted sector, followed<br />

by industrial and automotive.”<br />

Additionally, most respondents expect sales<br />

to decline in the first and second quarters of<br />

2020 and for the entire 2020 calendar year as<br />

a whole. Roughly 56 percent of respondents<br />

expect sales to fall in the first quarter, 63 percent<br />

expect sales to decline in the second<br />

quarter, and 62 percent expect sales to be<br />

down for the calendar year 2020.<br />

Other key findings:<br />

• Nearly 40 percent of respondents report<br />

they are feeling worse about the impact of<br />

Covid-19 on their businesses than they<br />

were last month.<br />

• Roughly 69 percent of respondents report<br />

being told by their suppliers that there will<br />

be delays in shipments due to Covid-19,<br />

and some delays are growing.<br />

• Most respondents report they are identifying<br />

alternative sources of inputs (55 percent)<br />

and cutting back business travel (54<br />

percent). Nearly 30 percent of firms are encouraging<br />

teleworking where possible.<br />

• Roughly 26 percent of respondents expect<br />

to cut capital expenditures in 2020, while<br />

63 percent report capital investment will<br />

remain the same.<br />

IPC surveyed its members – industry professionals<br />

at electronics manufacturing companies,<br />

including original equipment manufacturers<br />

(OEMs), electronics manufacturing<br />

services (EMS) companies, and printed circuit<br />

board (PCB) fabricators.— for a second<br />

time between March 3 and 5, 2020 following<br />

an initial February survey. Almost half of the<br />

survey respondents represent the contract<br />

electronics manufacturing services (EMS) industry.<br />

This segment performs an estimated<br />

25 percent of North American electronics<br />

manufacturing for original equipment manufacturers<br />

(OEMs).<br />

www.ipc.org<br />

According to IPC‘s second survey, a majority of electronics manufacturers and suppliers expect<br />

business operations to be “back to normal” by July 2020.<br />

Source: IPC<br />

6 <strong>EPP</strong> EUROPE April 2020


<strong>EPP</strong> EUROPE April 2020 7


NEWS + HIGHLIGHTS<br />

Every training participant is individually guided.<br />

Source: ULT AG<br />

Well trained solders better<br />

Acquisition of a soldering license<br />

under best air conditions<br />

Soldering is still one of the most dominant and important joining technologies in electronics<br />

manufacturing. In order to ensure the performance of electronic assemblies, there<br />

are high quality requirements. Keeping the standard on a high level, i.e. being able to<br />

reliably manage the latest techniques, is the primary objective of the training association<br />

for soldering technologies AVLE (Ausbildungsverbund Löttechnik Elektronik) in Germany.<br />

Stefan Meissner, ULT AG, Gangolf Götz, RAFI GmbH & Co. KG, Manfred Frank, freelance<br />

This idea was born among several companies from electronics<br />

manufacturing, machinery and device production as well as research<br />

and development. Based on extensive individual experiences,<br />

they saw the need to establish a cross-company job description<br />

for soldering techniques. The companies Hannusch Industrieelektronik<br />

e.K., Ersa GmbH, RAFI GmbH & Co. KG and Zollner Elektronik<br />

AG recognized the signs of the times and founded the AVLE<br />

association. The objectives were quite clear: improving the quality,<br />

reliability and reproducibility of hand soldering joints.<br />

The path to the soldering license<br />

From the very beginning, the founding members were conscious of<br />

the need to provide a structured training model. Thus, a modular<br />

development program was the result. Gangolf Götz, RAFI‘s production<br />

manager and seminar director within AVLE , explains: “Module<br />

one deals with soldering principals and provides basic knowledge<br />

on the soldering of THT components (through-hole technology).<br />

Module two teaches basics on SMT issues (surface-mount technology).<br />

Module three further extends the SMT skills, and module four<br />

deals with the rework of complex components. These are the first<br />

four out of the total of eight modules.”<br />

Professionally equipped training rooms, valuable documents and<br />

practically experienced trainers have been important in providing<br />

skill bases. The company RAFI, headquartered in Weingarten/Germany,<br />

implemented the concept and set up two seminar rooms,<br />

completely equipped with hand soldering instruments.<br />

Approximately 250–300 soldering licenses are issued per year. In<br />

addition, there are about 150 customer-specific soldering trainings.<br />

Automated soldering is part of the concept<br />

Automated soldering processes are also topics in the training program.<br />

The basics and operating principles of various technologies,<br />

such as selective soldering, wave soldering, or vapor phase soldering<br />

of THT and SMT components on PCBs (printed circuit boards),<br />

are provided by means of soldering machines.<br />

Not only system operators but managers also are “going to school”.<br />

8 <strong>EPP</strong> EUROPE April 2020


Techniques and parameters of the SMT process are introduced and<br />

deepened in training courses specially designed for executives in<br />

the field of electronic assembly manufacturing. Mounting successfully<br />

means: all process parameters from board layout and solder<br />

pad design, via the utilization of special solder pastes and masks in<br />

temperature-controlled environments, to assembling and thermal<br />

reflow oven profile must be precisely coordinated.<br />

Central fume extraction for clean air<br />

In electronics manufacturing, millions of solder joints are processed<br />

every day. An extremely unpleasant and dangerous by-product is<br />

soldering fume. What is basically perceived as smoke, are primarily<br />

decomposition products from fluxes, soldering materials and residues<br />

of cleaning agents that combine to form sticky aerosols. These<br />

air pollutants may have significant negative impact on human<br />

health.<br />

The capture of contaminants is regulated by law in various countries.<br />

These regulations determine risk categories for specific hazardous<br />

substances, e.g. in terms of fire and explosion risks or in<br />

types of health damaging effects (carcinogenic, mutagenic or toxic<br />

for reproduction).<br />

In addition to coarse particles, soldering fume contains fine dusts<br />

and particulates as well as gaseous components. Within this context,<br />

one also speaks of itchy dust that occurs when the metal contained<br />

in the solder oxidizes in air. The fluxes used often tend to<br />

form large amounts of flakes, especially since lead-free solders<br />

Training center at RAFI with automated soldering systems.<br />

form more solid particles than lead-containing ones. The flux contained<br />

in the solder also evaporates when soldering, the solder<br />

hardens. However, the generated vapors may be noxious.<br />

It is not enough to exhaust contaminated air. The complete removal<br />

of occurring dusts, fumes, vapors, or odors only works in combination<br />

with according filtration technologies. For this purpose, RAFI<br />

Source: ULT AG<br />

<br />

<br />

<br />

<br />

MUSASHI ENGINEERING EUROPE GmbH<br />

Marcel-Breuer-Str. 15, D-80807 München<br />

Tel: +49(0) 89 321 996 06 E-Mail: sales@musashi-engineering.de<br />

<strong>EPP</strong> EUROPE April 2020 9


NEWS + HIGHLIGHTS<br />

Manual workplaces with installed extraction arms.<br />

Source: ULT AG<br />

has invested in several LRA 1200 soldering fume extraction systems<br />

from ULT AG. At the manual workstations, the LRA 1200<br />

works as a central extraction system. The device is connected to<br />

extraction arms, which are installed at each of the twelve workstations<br />

and ensure that the soldering fume is captured at the<br />

emission source.<br />

This fume extractor is also applied with systems for selective and<br />

vapor phase soldering as well as rework.<br />

Soldering instructor Gangolf Götz talks about air cleaning issues as part of<br />

the training for the soldering license.<br />

Source: ULT AG<br />

The LRA 1200 utilized as central extraction system for soldering fume.<br />

Proper capturing improves degree of efficiency<br />

The efficiency of fume extraction technology is crucial. It rises and<br />

falls with the quality of pollutant capturing. Closest proximity to the<br />

emission source is essential. The formula is simple: the greater the<br />

distance, the higher the energy required. Doubling the distance to<br />

the pollutant source means quadrupling the suction power and extremely<br />

high energy consumption in order to capture the desired<br />

quantity of particles. Practical applications have proved that air<br />

pollutant are neither coarse nor fine but vary between particle sizes<br />

of 1 μm and about 10 μm. Hence, optimally developed filtration principles<br />

are required to capture and separate particles of any size.<br />

It is the aim to convert polluted air back into clean breathing air.<br />

Therefore, all occurring contaminants must be extracted and filtered.<br />

First the coarse particles, then fine dusts, and finally gases<br />

and toxic vapors. There are several information materials, regulations<br />

and DIN specifications suggesting procedures in this context.<br />

Within the LRA 1200 fume extractor, filtration is executed as follows:<br />

a prefilter stage first separates larger particles, thus preventing<br />

a clogging or premature saturation of subordinate fine dusts<br />

filters or particle filters. The latter work as main filters, binding the<br />

finest of aerosol drops, among others. A long filter life is important,<br />

as this results in savings in terms of energy, operating, maintenance<br />

and spare parts costs.<br />

The main filter element is an H14 filter. Such HEPA filters (High Efficiency<br />

Particulate Air Filter) are utilized in air cleaning to provide a<br />

purification degree of >99.95 percent. They are largely applied as<br />

storage filter, fitting best for the separation of sticky dusts. Finally,<br />

an adsorption filter with activated carbon helps due to its spongelike<br />

surface in the removal of toxic gases and vapors.<br />

The main filter has to be exchanged once a year – an optical signal<br />

indicates saturation. The prefilters are replaced every three months<br />

on average.<br />

Gangolf Götz is glad that the topic of air pollution as part of occupational<br />

health and safety has been taken up and summarizes: “When<br />

changing the filters, one can see what we would have in our lungs<br />

without fume extraction. You can also see the residues in the suction<br />

pipes at the workplace, which we clean every six months. By<br />

using fume extraction technology, we are able to guarantee our customers<br />

a health-conscious workplace. In our training rooms, there is<br />

a very pleasant air quality.”<br />

www.ult.de; www.rafi.de<br />

Source: ULT AG<br />

10 <strong>EPP</strong> EUROPE April 2020


Appointment of Director of EMEA Operations<br />

ECD announced that Mike Hayward will lead<br />

the company’s operations in the EMEA region<br />

where he will oversee product sales,<br />

channel partnerships, customer technical<br />

support and strategic relationships. Hayward,<br />

who has an extensive technical background<br />

and has worked in the electronics industry<br />

for over 35 years, previously held a similar<br />

role with ECD and is delighted to re-join the<br />

company to help lead growth initiatives as<br />

the Director of EMEA Operations.<br />

“I’m passionate about electronics and thrive<br />

when helping customers solve challenges,”<br />

shares Hayward, who says he learned a lot<br />

during his absence from ECD but missed<br />

working for a company that truly values their<br />

staff and is constantly innovating. “ECD<br />

leads in its respective product and service<br />

categories and is continuously developing<br />

and enhancing technologies to enable process<br />

optimization. The automotive, medical<br />

and industrial sectors in the region are hungry<br />

for solutions that offer in-depth and ac-<br />

tionable process data. ECD’s new OvenSentinel<br />

addresses this need, pushing the conventional<br />

boundaries of reflow monitoring and<br />

reporting so that output is high-yield and<br />

profits are maximized. This is just one<br />

example of the meaningful technologies the<br />

company has engineered. I’m excited to be<br />

back!”<br />

In addition to his previous time with the company,<br />

Hayward’s former electronics experience<br />

includes engineering, process development<br />

and production management roles at<br />

UK-based EMS firms and automotive component<br />

manufacturers, as well as sales positions<br />

with equipment suppliers. With a<br />

strong technical background, the ability to effectively<br />

communicate at all levels of management,<br />

broad commercial knowledge and<br />

a responsive, customer-focused mentality,<br />

he will undoubtedly be a strong addition<br />

to the ECD team and an asset to customers<br />

in the EMEA region.<br />

Bob Schnyder, VP of Sales and Marketing,<br />

Source: ECD<br />

Mike Hayward has<br />

rejoined the company<br />

as the Director of<br />

EMEA Operations.<br />

says Hayward returning to the company has<br />

already met with customer approval. “Even<br />

after his absence from ECD, customers remember<br />

Mike and his commitment to their<br />

success. Partners and customers past, present<br />

and future will find a true champion in<br />

Mike; we’re proud he’s again part of the ECD<br />

team.”<br />

Hayward holds an Engineering Technology<br />

National Diploma from Gwent College of<br />

Further Education and has over three decades<br />

of electronics experience.<br />

www.ecd.com<br />

Inspection technology meets quality initiatives<br />

Mirtec announced that after an extensive<br />

evaluation, Bosch has selected their 3D AOI<br />

technology to meet their ongoing quality initiatives.<br />

The evaluation process was exceedingly detailed<br />

and included a wide range of 3D AOI<br />

solution providers from around the globe. In<br />

the end, the company effectively demonstrated<br />

the lowest cost of ownership and absolute<br />

best overall cost/performance ratio.<br />

“It is truly a pleasure to continue our longstanding<br />

partnership with Bosch”, stated<br />

Chanwha Pak, CEO. “We at Mirtec are committed<br />

to continuous improvement through<br />

innovation and strong quality leadership.<br />

Ours is a business of precision and accuracy,<br />

reproducibility and specificity, timeliness<br />

and trust. These are the real products<br />

and services which we provide to our valued<br />

customers”, continued Pak. “We look forward<br />

to our continued partnership and the<br />

mutual success of our two organizations.”<br />

With over 17,000 systems installed throughout<br />

the world, Mirtec has earned a solid reputation<br />

as one of the most progressive and dynamic<br />

suppliers of Automated Optical Inspection<br />

equipment to the electronics manufacturing<br />

industry. Their products have been<br />

successful in high-volume markets such as<br />

consumer electronics as well as high-mix<br />

low-volume markets such as medical, auto-<br />

Bosch has chosen the 3D AOI technology from Mirtec,<br />

in order to meet their ongoing quality initiatives.<br />

motive, aerospace and defense. The company<br />

invests heavily in research and development,<br />

persistently focused on using state-ofthe-art<br />

optics, lighting and laser technology in<br />

the development of their inspection solutions.<br />

“It is quite an honor for Mirtec to be<br />

awarded this contract,” stated Holger Hansmann,<br />

Director of Sales and Marketing of<br />

their <strong>Europe</strong>an branch. “As a premier manufacturer,<br />

Bosch is recognized throughout the<br />

world for having the highest quality standards.<br />

As such, the company is extremely selective<br />

in purchasing equipment that will add<br />

value to their business. In Mirtec, they have<br />

found a partner that offers the most technologically<br />

advanced inspection systems, supported<br />

by a truly global infrastructure and excellent<br />

company procedures. We are proud<br />

to have been selected, yet again, as Bosch’s<br />

3D AOI partner.”<br />

www.mirtec.com; www.bosch.com<br />

Source: Mirtec<br />

<strong>EPP</strong> EUROPE April 2020 11


NEWS + HIGHLIGHTS<br />

Introducing AR-based customer service<br />

IPTE, a supplier of automated production<br />

equipment for the electronics and mechanics<br />

industry, relies on smart support: The global<br />

service support has recently started working<br />

with smart data glasses to be even more efficient<br />

in the service area. The data glasses<br />

connect the service employee on site with<br />

the service employee at IPTE. This guarantees<br />

immediate and error-free direct contact<br />

for fast and safe troubleshooting.<br />

The Smart Support enables live video<br />

streams and chat communication with integrated<br />

text translation in 125 languages. The<br />

voice communication includes a translation<br />

tool in 17 languages. In addition, there is a<br />

simple photo transmission with marking<br />

function, data transmission, video recording<br />

Smart data glasses are used for Smart Support, an<br />

AR-based service that enhances customer service.<br />

Source: IPTE<br />

and documentation. The Smart Support App<br />

required for use is simply loaded onto a<br />

smartphone or tablet. This process takes only<br />

one minute. In addition, the IPTE Service can<br />

connect to the machines concerned at any<br />

time and provide remote support.<br />

This AR-based service enables the company<br />

to maintain its customer service without<br />

problems even in the current situation under<br />

Covid-19. IPTE Smart Support makes it easy<br />

to implement a contactless service in line<br />

with current health regulations. The service<br />

hotline is available around the clock for all service<br />

questions.<br />

www.ipte.com<br />

Corporation focuses on automation concepts<br />

Conline GmbH was officially renamed Kurtz<br />

Ersa Automation GmbH. In order to meet current<br />

market and customer requirements and<br />

to act internationally as a system integrator,<br />

the name change accompanied focusing its<br />

range of services on automation technology.<br />

To this end, a well-coordinated team of engineers<br />

has been working intensively for<br />

three years to develop intelligent solutions<br />

for automation projects in industrial production.<br />

Following the name change at the beginning<br />

of 2020, „Kurtz Ersa Automation“<br />

will now become the official and central contact<br />

point for automation competency in the<br />

corporation. On the one hand, as in previous<br />

Source: Kurtz Ersa, Daniel Hartel<br />

Olaf Klink, Managing Director at Kurtz Ersa<br />

Automation GmbH.<br />

Kurtz Ersa Automation – systems<br />

integrator of automation technology.<br />

Source: Kurtz Ersa, Daniel Hartel<br />

years, automation concepts will be realized<br />

with the in-house, established brands Kurtz<br />

and Ersa, and on the other hand, the existing<br />

know-how in automation technology will now<br />

also be made available to the international<br />

market of various industries. One example is<br />

a current project from the automotive industry.<br />

In this, a fully automated solution in the<br />

field of electronic module assembly includes<br />

the integration of the Ersa soldering technology.<br />

Altogether, a holistic turnkey solution<br />

has been realized with proven, robust components<br />

and systems from the corporation.<br />

Whether internal or external – as a full<br />

member of the experienced machine manufacturer,<br />

Kurtz Ersa Automation supplies<br />

tailor-made systems that convince in terms<br />

of functionality, quality and adherence to delivery<br />

dates. They focus on the automation of<br />

complex assembly and testing processes,<br />

taking into account the logistical aspects in<br />

order to meet the requirements of Industry<br />

4.0, too.<br />

Focusing on automation technology, there is<br />

also a change in the management at the Wertheim<br />

location: Ersa Managing Director Ralph<br />

Knecht is now again devoting himself primarily<br />

to his tasks for Ersa GmbH. He is<br />

handing over his responsibilities regarding<br />

the former Conline GmbH to Olaf Klink who<br />

takes over the function of Managing Director<br />

of Kurtz Ersa Automation GmbH. Since the<br />

beginning of January 2020, Olaf Klink has<br />

been focusing on strategies for the system<br />

integrator as well as sales. The 51-year-old<br />

has 20 years of professional and international<br />

management experience in the field of automation,<br />

including major success in the automotive<br />

industry. Olaf Klink brings along the<br />

knowledge that is needed for its new alignment.<br />

„Treat the impossible as if it was possible“<br />

is the credo of the Osnabruck-born. This<br />

bon mot, which goes back to Goethe, is symbolic<br />

of their approach to face future tasks<br />

and to position itself in automation technology<br />

as a solution provider for complex tasks.<br />

The demand for complex, far-reaching and<br />

holistic automation systems is unbroken.<br />

Kurtz Ersa Automation will exploit the potential<br />

that lies in automation technology.<br />

www.kurtzersa.de<br />

12 <strong>EPP</strong> EUROPE April 2020


Staff changes within sales partnership<br />

In the year 2000, a long and fruitful business relationship began: Viscom<br />

AG and Repotech GmbH commenced joint sales activities in<br />

southern Germany, Switzerland and parts of Austria. After 20 years of<br />

this successful working partnership, Repotech founder Reinhard Pollak<br />

is now taking his well-earned retirement and handing over the<br />

reins to Thomas Winkel.<br />

Reinhard Pollak founded Repotech GmbH at Lake Constance in 1994,<br />

offering production facilities for preparing and testing electronic assemblies.<br />

Over the years, more than a hundred companies have used<br />

their services, and still use machines or production lines that were<br />

selected and configured with the benefit of the company’s expertise.<br />

Repotech GmbH kept to a small and select group of specialists in<br />

electronics production equipment, who represented the company in<br />

its sales region. This ensured that customers received top quality advice<br />

at all times. Reinhard Pollak’s customers ranged from small and<br />

medium-sized enterprises to multinational corporations. In 2016, they<br />

focused exclusively on its partnership with Viscom to guarantee sufficient<br />

technical consulting for customer-specific configurable inspection<br />

solutions.<br />

50%<br />

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Reinhard Pollak founded the company<br />

in 1994 and has partnered with<br />

Viscom for over 20 years.<br />

Source: Repotech GmbH<br />

Viscom also welcomes Thomas<br />

Winkel as the effective and reliable<br />

successor of Reinhard Pollak.<br />

Source: Repotech GmbH<br />

“We are looking back on a 20-year-old business relationship. When a<br />

business relationship lasts this long, it is based on core values such<br />

as trust, openness, reliability and loyalty. We have found all these<br />

qualities in this partnership and have gone through many successful<br />

years together, along with some more difficult ones. This in itself is<br />

extraordinary and our mutual customers have also noticed this. Reinhard<br />

Pollak’s honest and customer-focused approach, combined with<br />

the high level of technical expertise and many years of experience,<br />

has always been highly valued by our customers,” says Torsten Pelzer,<br />

general sales manager of Viscom AG, as he looks back.<br />

After Reinhard Pollak retires from active sales, Thomas Winkel will<br />

take over the sales activities and customer service. Viscom is very<br />

pleased to have found an equally effective and reliable successor in<br />

Thomas Winkel, and to be able to continue this customer service<br />

tradition at the same superior level. Thomas Winkel looks back on<br />

more than 20 years of professional experience in image processing,<br />

having advised customers from the automotive supply industry<br />

worldwide. “My goal is to provide our customers and other stakeholders<br />

with the same level of intensive and solution-focused advice<br />

and support as they have become used to from Reinhard Pollak,” says<br />

Winkel. Viscom AG wishes Reinhard Pollak all the best for his well-deserved<br />

retirement and would like to thank him for his many years of<br />

success and loyalty. Viscom also welcomes Thomas Winkel and<br />

wishes him well in his new duties.<br />

www.viscom.com; www.repotech.de<br />

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Fax: +49 (0) 6400 - 957 603 1<br />

info@mk-versuchsanlagen.de<br />

www.mk-versuchsanlagen.de <strong>EPP</strong> EUROPE April 2020 13


TRADE SHOWS + EVENTS<br />

Elevating excellence of electronics<br />

Bringing the electronics industry<br />

together at IPC Apex Expo 2020<br />

From factory of the future advancements displayed on the show floor to expert insights conveyed in technical conference<br />

sessions and professional development courses, IPC Apex Expo 2020 provided the education and networking<br />

connections that helped 8,516 visitors (attendee and exhibitor personnel) from 61 countries address<br />

today’s business challenges and prepare for the future.<br />

Source: <strong>EPP</strong> <strong>Europe</strong> / Doris Jetter<br />

In 2021, the tradeshow will return to the San<br />

Diego Convention Center, on January 23–28.<br />

This year, 477 exhibitors showcased cutting-edge products and<br />

services. With more than 80 percent of the 4,211 attendees<br />

identifying themselves as key buyers or influencers, the exhibitors<br />

at North America‘s largest electronics assembly event enjoyed<br />

three days of qualified leads, business development and brisk sales.<br />

In keeping with the event’s theme, “Elevate the excellence of electronics,”<br />

the tradeshow featured more than 75 technical papers detailing<br />

original research and innovations from industry experts<br />

around the world. Attendees had access to new<br />

research on materials and opportunities to learn<br />

more about trending materials, applications and<br />

processes, such as PCB fabrication, assembly<br />

processes and Industry 4.0 (including a live<br />

demonstration on the exhibit floor showing how<br />

two industry standards work together).<br />

Visitors to the tradeshow in San Diego were able to<br />

visit an integrated CFX line to learn more about this<br />

standard and how it may be easily adopted.<br />

Far-reaching ideas and insights<br />

The professional development courses blended traditional electronics<br />

industry topics with hot-new developments, delivered by<br />

corporate technologists, consultants, training center staff and university<br />

faculty. An array of leading topics were covered, such as:<br />

PCB fabrication troubleshooting, supply chain management, highspeed<br />

applications, surface reliability, semiconductor packaging<br />

technologies and design for excellence (DFX).<br />

Source: <strong>EPP</strong> <strong>Europe</strong> / Doris Jetter<br />

14 <strong>EPP</strong> EUROPE April 2020


Source: <strong>EPP</strong> <strong>Europe</strong> / Doris Jetter<br />

477 exhibitors showcased cutting-edge<br />

products and services.<br />

Source: <strong>EPP</strong> <strong>Europe</strong> / Doris Jetter<br />

The exhibition provided attendees the opportunity<br />

to meet suppliers that could help them save time<br />

and money, and foster new business opportunities,<br />

Many attendees achieved what they sought at the event. “At Apex<br />

Expo, I was able to evaluate all selective solder and placement machines<br />

in one place, with all of the relevant technical resources on<br />

hand to answer my questions. This was a great use of my time,”<br />

said Larry Davis, production engineer, Hach. Rodney Doss, ESD program<br />

manager at Samtec, Inc. added, “Networking at the committee<br />

meetings brought me together with individuals who share similar<br />

challenges at their facilities. This is a great way to learn how<br />

others throughout the world tackle manufacturing issues. I now<br />

have new resources to get expert opinions on ideas I may have in<br />

the future.”<br />

“When I spoke with exhibitors and attendees at this year’s show,<br />

feedback was positive. Attendees said that networking and educational<br />

events and activities helped them find new ways to solve<br />

challenges; the exhibition provided them the opportunity to meet<br />

suppliers that could help them save time and money, and foster<br />

At the Apex Expo, it was possible to evaluate machines in one place, with all<br />

of the relevant technical resources on hand to answer questions.<br />

Source: <strong>EPP</strong> <strong>Europe</strong> / Doris Jetter<br />

Dates for IPC APEX EXPO<br />

• January 25 – 27, 2022<br />

San Diego Convention Center<br />

• January 24 – 26, 2023<br />

San Diego Convention Center<br />

• April 23 – 25, 2024<br />

Anaheim Convention Center<br />

• March 18 – 20, 2025<br />

Anaheim Convention Center<br />

• March 17–19, 2026<br />

Anaheim Convention Center<br />

new business opportunities,” said John Mitchell IPC president and<br />

CEO. “Our team is already working on putting together next year’s<br />

show, and I look forward to our industry’s continued support in making<br />

IPC Apex Expo 2021 a success.“<br />

In 2021, the tradeshow will return to the San Diego Convention<br />

Center, January 23–28. Industry researchers, engineers and academics<br />

are invited to submit an abstract for consideration in next<br />

year’s technical conference or professional development courses in<br />

the online Call for Participation.<br />

www.ipc.org<br />

<strong>EPP</strong> EUROPE April 2020 15


TRADE SHOWS + EVENTS<br />

Electronic manufacturing value chain in one place<br />

Innovative premieres at<br />

productronica 2019<br />

The biggest tradeshow for electronics production and development that is organized by Messe<br />

München, productronica, wrapped up the year 2019 for all attendees. According to a VDMA market<br />

research that was presented at the press conference during the tradeshow, the industry had different<br />

expectations of what 2019 was going to bring. Based on this study, over 65 % of companies<br />

thought that the 2019 market would not be as good as in 2018. However, based on the outcome of<br />

the tradeshow, it seems that the industry has continued to prosper.<br />

Source: <strong>EPP</strong> <strong>Europe</strong>/ Charlene Hesse<br />

Over 1,500 exhibitors from 40 countries<br />

presented innovative products<br />

and solutions to 44,000 visitors at<br />

productronica 2019.<br />

Taking place in Munich, Germany, over 1,500 exhibitors from 40<br />

countries presented innovative products and solutions to 44,000<br />

visitors. Of these visitors, more than half came from abroad, including<br />

France, Italy, Austria, and Switzerland. They participated in all<br />

that was offered, which included various live demonstrations, forums,<br />

educational presentations, and more. Divided into specific<br />

clusters of the electronics production, navigation was easy for all.<br />

These cluster structure included SMT, Cables Coils, and Hybrids,<br />

Semiconductor, Future Markets, PCB and EMS.<br />

Tradeshow premieres<br />

Throughout the 4-day comprehensive show, a variety of different<br />

events took place, including successful premieres. These covered<br />

various trends and topics, such as Smart Factory, Smart Maintenance,<br />

Industry 4.0, automation, inspection, quality control, and<br />

more. These subjects didn’t only pertain to challenges for the cur-<br />

Top ten inspection manufacturers took part in the 3D AOI Arena and displayed<br />

their unique automated optical inspection solutions, side by side.<br />

Source: <strong>EPP</strong> <strong>Europe</strong>/ Jochen Hempler<br />

16 <strong>EPP</strong> EUROPE April 2020


TRADE SHOWS + EVENTS<br />

Four inspection experts discussed trends and current industry challenges at the 3D AOI Roundtable.<br />

Source: <strong>EPP</strong> <strong>Europe</strong>/ Charlene Hesse<br />

rent market, but also aided to bring knowledge towards the future.<br />

As inspection solutions have become imperative in the electronics industry,<br />

the 3D AOI Arena was the perfect opportunity to measure<br />

multiple inspection solutions all at once. Ten high-end inspection<br />

manufacturers displayed their unique automated optical inspection<br />

solutions, side by side, where visitors compared and evaluated each<br />

machine, in order to make informed decisions based on specific<br />

needs. These solutions included: SQ3000 (CyberOptics Corporation),<br />

Vario Line 3D (Göpel electronic GmbH), Xceed (GPS Technology), Zenith<br />

2 (Koh Young Technology), Alpha_SIP (Mirtec), VT-S730-H (Omron<br />

<strong>Europe</strong>), 3Di-LS2 (Saki Corporation), S3088 Ultra Gold (Viscom AG),<br />

5K3D-II (Vi Technology), and YSi-V (Yamaha Motor <strong>Europe</strong> N.V.).<br />

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<strong>EPP</strong> EUROPE April 2020 17


TRADE SHOWS + EVENTS<br />

Source: <strong>EPP</strong> <strong>Europe</strong>/ Jochen Hempler<br />

Visitors of the show gained<br />

knowledge, stayed informed<br />

of the latest innovations,<br />

and had the opportunity to<br />

ask questions directly to<br />

renowned industry experts.<br />

Further detailed discussions took place at the 3D AOI Arena Roundtable<br />

that included Markus Strehlitz, as the moderator, and four inspection<br />

experts; John Bashe, National Sales Manager of Parmi<br />

USA, Inc., Carsten Salewski, CEO of Viscom AG, Jaroslav Neuhauser,<br />

Deputy General Manager of Saki Corporation, and Harald<br />

Eppinger, Managing Director of Koh Young <strong>Europe</strong>. Interesting insights<br />

were given on current challenges, as well as, what the future<br />

of inspection holds. As technology is becoming more complex, difficulties<br />

are arising to ensure high quality production is still being<br />

met. Trends are shifting from 2D technology to 3D measurement,<br />

new material is being used more frequently, and industry standards<br />

are being regularly adopted. This is why inspection manufacturers<br />

need to assimilate to these fast-paced changes.<br />

Another premiere at productronia 2019 was the Fast Forward program.<br />

In collaboration with Elektor, the platform allowed for startups<br />

to present their solutions to more experienced companies, to help<br />

them get a foot through the door. By way of forums, pitches, workshops<br />

and more, visitors also discovered innovative products that<br />

were being introduced to the market.<br />

Additional events<br />

A variety of learning opportunities were available to all attendees.<br />

This included the Cleanroom, which highlights tools and solutions<br />

to remove possible contamination. The Smart Maintenance Pavilion<br />

focused on current topics, such as predictive maintenance,<br />

TPM, data analytics, remote services, mobile and computerized<br />

maintenance, thermography, and more.<br />

The Career Center was also successful since it is a continuous<br />

challenge for the industry to find qualified employees. Here,<br />

young professionals just entering the workforce or job seekers<br />

could gain knowledge on available openings in the electronic<br />

manufacturing industry.<br />

The hand soldering competition once again took place, not only at<br />

a <strong>Europe</strong>an level, but at an international level via the World Championship.<br />

Countries that participated included, France, Hungary,<br />

Indonesia, Poland, Germany, Thailand, Malaysia, Korea, Vietnam,<br />

United Kingdom, Japan, India, China and the Philippines. The competition<br />

consisted of soldering a complicated board within 60 minutes.<br />

The world champion winner was Indra Setiawan from PT<br />

SIIX EMS, who completed the challenge within 56 minutes.<br />

The semiconductor and electronics industries have started to<br />

overlap in recent years. This is why the Semicon Europa tradeshow<br />

also took place alongside productronica. Focusing on semiconductor<br />

production, Semicon highlighted market developments,<br />

including those in the automotive and mobile communication<br />

sectors.<br />

www.productronica.com<br />

The 3D AOI Arena provided a complete overview for visitors of the booth to<br />

compare and evaluate different solutions, and to make a decision based on<br />

their needs.<br />

Source: <strong>EPP</strong> <strong>Europe</strong>/ Jochen Hempler<br />

Worldwide productronica<br />

productronica China: July 3–5, 2020<br />

productronica India: Sept. 23–25, 2020<br />

productronica South China: Nov. 3–5, 2020<br />

productronica Munich: Nov. 16–19, 2021<br />

18 <strong>EPP</strong> EUROPE April 2020


Koh Young <strong>Europe</strong> GmbH<br />

0001754816-030-000001<br />

<strong>EPP</strong> EUROPE April 2020 19


COVER<br />

Trends in the market: The role of automated X-ray inspection<br />

3D AXI provides fast<br />

volumetric inspection<br />

Current market trends show that the role of 3D X-ray inspection is getting more important and<br />

becoming more vital. With the increasing complexity of electronic products, a total inspection<br />

solution of 3D solder paste inspection (SPI), automated optical inspection (AOI), and automated<br />

X-ray inspection (AXI) is required. X-ray inspection, in particular, plays a key role in assuring the<br />

quality of critical devices, especially for applications in the medical, automotive, and aerospace<br />

industries where human lives are directly connected to the quality of the products. In addition,<br />

today’s innovation cannot take place without considering environmental factors and improvements.<br />

Equipment designed today must adhere to strict environmental standards.<br />

Ikumi Sugawara, Saki <strong>Europe</strong><br />

20 <strong>EPP</strong> EUROPE April 2020


COVER<br />

3D X-ray provides inspection where classical automated<br />

optical inspection has limitations. Previously,<br />

most X-ray inspection was done off-line, but the inclusion<br />

of many more electronic parts in too-critical-to-fail products<br />

that require high-volume assembly with high<br />

throughput and yield, necessitates inline inspection. AXI<br />

equipment needs to be faster, ever more accurate, and<br />

adopt innovative technological and machine-to-machine<br />

(M2M) capabilities to keep pace and deliver products that<br />

ensure quality and reliability. To meet these requirements,<br />

Saki has developed the 3Xi-M110 automated<br />

X-ray system.<br />

Planar computed tomography provides accurate<br />

volumetric data<br />

To meet the demands for high-quality inspection, the<br />

company invented its unique planar computed tomography<br />

(PCT) technology, which provides volumetric<br />

and shape inspection of solder joints. PCT is an extension<br />

of the CT (computed tomography) technology used in the<br />

medical field for many years. PCT completely separates<br />

the images of the top and bottom sides of the printed circuit<br />

board assembly (PCBA), so images are not affected<br />

by back-side mounting.<br />

Many X-ray systems use a process of subtraction to remove<br />

the substrate images, whereas the company’s true<br />

3D system uses an additive process. High-resolution 3D<br />

images are made by capturing more than 200 slices (con-<br />

AXI needs to be faster, ever more accurate,<br />

and adopt machine-to-machine<br />

(M2M) capabilities to deliver products<br />

that ensure quality and reliability.<br />

Saki’s systems meet these requirements.<br />

Source: Saki Corporation<br />

<strong>EPP</strong> EUROPE April 2020 21


COVER<br />

Saki’s 3Xi-M110 AXI system.<br />

Source: Saki Corporation<br />

22 <strong>EPP</strong> EUROPE April 2020


COVER<br />

Sliced image by tomosynthesis and planar computed tomography.<br />

Source: Saki Corporation<br />

ventional X-ray systems typically capture less than 10 views or<br />

slices) through the entire PCBA area, including mounted components,<br />

solder joints, and even PCB warpage. This makes it possible<br />

to perform detailed volumetric and shape inspection on all parts of<br />

the PCB or module. After capturing the images, the system accurately<br />

reconstructs the slices into the shape of the solder ball and fillet<br />

(meniscus) to perform reliable solder inspection.<br />

Using this process, the system does not just inspect, it combines<br />

layers, measures components and features, determines placement<br />

variance and board or substrate warpage, and analyzes the internal<br />

structures. Measured solder joints are compared to established tolerances<br />

and all types of defects, including head-in-pillow (HiP), are<br />

identified and classified. PCT is essential for high accuracy defect<br />

detection.<br />

Hardware design provides better accuracy and<br />

image quality<br />

Starting with the right hardware is a key factor to realizing accurate<br />

inspection and obtaining perfect 3D images. All of the company’s inspection<br />

systems are built on a casted iron frame to maintain a rigid<br />

and stable platform. A combination of 1-micron analog linear encoders,<br />

servo motors on each axis, complex precision calibration,<br />

and the stable and robust hardware structure enables exact positioning,<br />

sharp clear images, and ensures that the data results collected<br />

and communicated are accurate and reliable.<br />

The AXI, 3Xi-M110 footprint is approximately 25 % smaller and 30 %<br />

lighter than previous models. With its super compact design and<br />

lighter weight, the machine can be installed in any standard building<br />

upper floors and easily transported. The machine can handle printed<br />

circuit boards that are 50 mm (W) x 140 mm (L) to 360 mm (W)<br />

x 330 mm (L) in size. For larger boards, a 2-step capturing and loading<br />

process can inspect boards that are 360 mm (W) x 510 mm (L) in<br />

size. Advanced applications, such as HiP inspection, have a 20 %<br />

faster capture time and are even more accurate.<br />

Accurate seamless 3D image reconstruction<br />

technology<br />

PCT technology provides high resolution in both the horizontal and<br />

vertical directions. For each PCB image slice, the AXI system provides<br />

completely separated images of the top and bottom sides.<br />

Because there are separate images for each field of view (FOV),<br />

these images can be reconstructed and connected into one image<br />

for a seamless 3D constructed model. Automatic board warpage<br />

compensation is performed while the image slices are taken to suppress<br />

board warpage.<br />

A sturdy platform construction improves accuracy.<br />

Source: Saki Corporation<br />

<strong>EPP</strong> EUROPE April 2020 23


COVER<br />

Planar computed tomography gives a seamless FOV.<br />

Source: Saki Corporation<br />

Automatic warpage compensation<br />

Robust warpage compensation is an essential function for accurate<br />

height reconstruction. Usually, an inspection tool, such as a laser, is<br />

used and the inspection machine has to be manually programmed<br />

with the exact location on the PCB where surface height is to be<br />

measured. This results in additional programming time and program<br />

optimization, and warpage of the surface underneath a covered surface<br />

is unknown. The company’s AXI system can automatically inspect<br />

the pad layer, measure warpage height, and automatically perform<br />

warpage compensation anywhere on the product.<br />

Head-in-pillow inspection algorithm<br />

Head-in-pillow (HiP) is a defect of the solder joint caused by the failure<br />

of the solder ball and the PCB pad to melt together and form a<br />

seamless mechanical connection during the reflow process. The<br />

solder joint will exhibit electrical integrity, but it will fail under mechanical<br />

or thermal stress. It is called head-in-pillow because it looks<br />

like a head pressed into a soft pillow.<br />

Defects have countless variations of their shapes, and to identify<br />

defective shapes is very difficult in HiP inspection. 3D inspection is<br />

focused on recognizing fine shape deviations of the solder and then<br />

detecting an abnormality by comparing it to an ideal shape. Deep<br />

analysis of the solder shape under the ball grid array (BGA) requires<br />

lots of measurements of various parameters related to the area of<br />

slices through the solder ball, such as circularity, volume, etc. The<br />

ability to separate layers and collect volumetric data enables a 3D<br />

AXI system to conduct detailed inspection of such solder joints.<br />

Based on years of research from collected customer data, Saki has<br />

been able to identify the deviations and trends of what is considered<br />

acceptable and unacceptable solder ball shapes. After defining<br />

the shapes, they created an inspection log that was turned into a<br />

new algorithm that takes AXI capabilities to the next level. The algorithm<br />

unifies the various definitions of solder shape and incorporates<br />

them into one inspection step. It uses shape detection capability<br />

knowledge and combines it with highly sensitive and accurate<br />

3D volumetric data to provide simple and easy parameter setting.<br />

This provides the ability to define the correct inspection parameters<br />

quickly and easily.<br />

Achieving zero escapes<br />

The number of escapes, or false passes, during production is a significant<br />

factor in judging inspection quality. An escape is a defect<br />

that isn’t discovered during test. Unfortunately, that defect is often<br />

overlooked and found by the customer when something fails. Having<br />

too many escapes is very costly to the assembly process in<br />

manufacturing time and money. If the defect is found during production,<br />

repair or replacement of the part is possible, but this slows<br />

down the line or the line has to be stopped. Throughput and yield<br />

are decreased. The later in the process that a defect is found, the<br />

more difficult and costly it is to fix it or adjust the line. The company’s<br />

3Xi-M110 AXI system produces such high inspection quality<br />

and reliability that the inspection process results in zero escapes.<br />

X-ray tube addresses environmental concerns<br />

In any X-ray system, strict adherence to control and use of the<br />

X-rays is critical in the system’s operation. With reduction of X-ray<br />

exposure as its focus, the company implemented a brand new,<br />

closed X-ray tube. The tube of the 3Xi-M110 has a pulse mode capability<br />

to switch on and off the X-ray during high speeds. Seventy percent<br />

X-ray dose reduction is possible by powering on the X-ray only<br />

at the moment of image capture and powering it off while waiting<br />

Zusammenfassung<br />

Inline 3D-Röntgensysteme kommt bei der Qualitätssicherung eine<br />

Schlüsselrolle zu, insbesondere für kritische Anwendungen, da sie<br />

eine präzise und schnelle volumetrische 3D-Inspektion ermöglichen.<br />

Résumé<br />

Les systèmes de radiologie 3D en ligne jouent un rôle crucial dans<br />

l’assurance de qualité, en particulier pour les applications critiques,<br />

car ils permettent de réaliser une inspection précise et rapide<br />

en trois dimensions.<br />

Резюме<br />

Встроенные рентгеновские 3D-системы играют ключевую роль<br />

в обеспечении качества, особенно в критически важных<br />

областях применения, так как они позволяют проводить<br />

точный и быстрый объемный 3D-контроль.<br />

24 <strong>EPP</strong> EUROPE April 2020


COVER<br />

for the board to be loaded. Moreover, conventional closed tubes<br />

must be turned on/off periodically, even when kept as a spare part<br />

to prevent deterioration of the tube. This is a costly and time-consuming<br />

operation.<br />

When using the new 3Xi’s X-ray tube, a tube-lead-box is not necessary.<br />

The tube stays in the inspection position during PCB loading and unloading.<br />

As a safety feature and to control exposure levels during inspection,<br />

the software is equipped with a dose simulator. The user can<br />

monitor the radiation dosage and according to that information, the delivery<br />

method and magnification can be set. The tube does not require<br />

any periodical maintenance or storage of spare parts. The built-in lifetime<br />

monitoring system reports the time to replace the tube. The new<br />

tube cuts X-ray exposure of the product and inner machine parts in<br />

half, minimizing component damage, increasing the life of the detector,<br />

and dramatically decreasing the cost of ownership for the system.<br />

Source: Saki Corporation<br />

Source: Saki Corporation<br />

Head-in-pillow defects.<br />

Further improvements for production quality<br />

control and Industry 4.0<br />

Saki’s total inspection lineup uses the same software and hardware<br />

platforms. Together with X-ray, the company offers fast and accurate<br />

3D SPI, 3D AOI, and bottom-side inspection during the printing, prereflow,<br />

and post-reflow processes. Each inspection process provides<br />

its own inspection result data. Their multi-process view (MPV)<br />

software shows inspection results from all processes in one place<br />

in real time, which enables the operator to analyze and make process<br />

corrections based on the inspection results from the previous<br />

process. Immediately, together with Saki’s advanced SPC and report<br />

function, MPV provides a more comprehensive perspective of<br />

the defect analysis for the entire process and serves as a key to improved<br />

production quality.<br />

www.sakiglobal.com<br />

Backend automated assembly line.<br />

<strong>EPP</strong> EUROPE April 2020 25


PCB + ASSEMBLY<br />

Source: Techcon Systems<br />

Piezo actuated jet<br />

dispensing valve that<br />

dispenses at approximately<br />

twice the speed of<br />

the pneumatic jet valve.<br />

Using a five-step jetting cycle<br />

Jet valve dispensing:<br />

1500 dots shot per second<br />

Selecting an automated dispensing technology that is the best fit for a specific application from the half<br />

dozen or so familiar technologies available – such as the auger valve, progressive cavity pump, time<br />

pressure valve or pneumatic jet valve – is not a consideration to be made lightly. For most operations, the<br />

consequent match is adequate, and attributes such as throughput and quality are well suited to the application<br />

on an ongoing basis. For others, however, such as medium- to high-volume mobile device, LED,<br />

consumer electronic and medical device assemblers, there is a constant drive for the ever-higher yields<br />

that can improve profitability and for an advanced dispensing technology, that can help them achieve it.<br />

Can La, Product Manager, Techcon Systems<br />

Source: Techcon Systems<br />

Piezo actuated jet dispensing system converts an electrical signal into a<br />

precise motion, in order to dispense material in the desired pattern.<br />

For these users, there is a relatively new technology that can increase<br />

dispensing rates for adhesives and other fluids by 20X or<br />

more – at rates, for comparison purposes, as fast as 1500 Hz continuously,<br />

with up to 2000 Hz maximum burst. This is the Piezo actuated<br />

jet dispensing valve that dispenses at approximately twice the<br />

speed of the pneumatic jet valve.<br />

Operators often are amazed at the impressive placement precision<br />

and small, neat dot sizes generated by a Piezo jet valve, especially<br />

considering that a) it is moving so fast, and b), the material is being<br />

shot and not physically placed, as would be the case with most dispensing<br />

solutions that rely on actual contact with the substrate.<br />

Using sophisticated controllers, shot sizes can be achieved as small<br />

as 0.5 nanoliter, with outstanding consistency and repeatability. This<br />

precision also makes the Piezo jet suitable for some other niche applications<br />

where speed is less of a factor, but where operators have<br />

a challenging time achieving the desired dispensing of ultra-small<br />

dots or ultra-thin lines consistently over time.<br />

Where the speed comes from<br />

Jet valves – both the older pneumatic jet technology and the newer<br />

Piezo jet technology – gain a significant speed advantage primarily<br />

by eliminating the Z-axis of movement. While the height sensing<br />

and repositioning, as well as, the up/down motion that is necessary<br />

for contact-based valves such as progressive pump and auger valve<br />

technologies – where the needle moves down to touch the substrate<br />

to dispense the fluid and then is pulled back up – are considered<br />

reasonably fast by most criteria, these account for a high percentage<br />

of the required dispensing time. Contactless jet dispensing, by<br />

contrast, shoots the material accurately from a fixed location above<br />

the substrate, shot after shot. This enables the pneumatic jet valve<br />

to reclaim this excess motion time and dispense at speeds some<br />

10X faster than contact-based valves.<br />

However, while the pneumatic jet valve technology leaves the<br />

speed enhancement at “only” 1000 %, the Piezo jet valve ups the<br />

ante considerably. In these devices, rather than relying upon air<br />

pressure, a piezoelectric actuator converts an electrical signal into a<br />

26 <strong>EPP</strong> EUROPE April 2020


PCB + ASSEMBLY<br />

The system has a five-step<br />

jetting cycle, which can be<br />

repeated up to 1500 times<br />

per second.<br />

Source: Techcon Systems<br />

highly precise motion that dispenses the material in the desired pattern<br />

far faster than a mechanical pneumatic-based solution, which<br />

must open, close, and reset, a process that expends about 20 extra<br />

milliseconds each time. In this way, speeds up to 2000 % faster<br />

than contact-based solutions – 2X faster than pneumatic jet solutions<br />

– can be achieved. For speed-sensitive, high-volume, highthroughput<br />

applications, the increase in yield can be extraordinary<br />

and highly profitable.<br />

Additionally, the ability of this technology to deliver the smallest<br />

dots or lines – with micro shots as small as 0.5 nanoliters – is hard<br />

to beat as is the accuracy and repeatability of each and every dispense.<br />

Another significant advantage of the Piezo jet technology is its ability<br />

to deliver speeds of up to 1500 Hz, even with those operations<br />

involved with the production of substrates with irregular heights or<br />

those where harder-to-access “nooks and crannies” must be reached.<br />

Since the fluid is shot rather than dropped, nozzles can be more<br />

readily angled to reach the exact point where material is required.<br />

Further, since the nozzle doesn’t need to be dropped down onto the<br />

item, products with irregular protrusions, such as a motherboard<br />

with high spots, will not be damaged as they might be when using a<br />

contact-based valve that must come down close to the substrate.<br />

This eliminates a common source of damage, waste and downtime.<br />

How it works<br />

In a Piezo jet valve cycle, the fluid starts inside the valve, held between<br />

the tappet (piston) and the nozzle. The electronic piezo crystal<br />

oscillates up and down at a high speed, generating kinetic energy<br />

that forces the fluid to shoot out under carefully controlled pressure<br />

to form a perfect bead of material at the target location.<br />

A complete, five step jetting cycle consists of:<br />

• Rising time: Total time for the tappet to move to open position<br />

• Open time: Total time the valve stays opened<br />

• Falling time: Total time for the tappet to move to closed position<br />

• Needle lift: The stroke length, based on the viscosity of the material<br />

• Delay time: Time the valve stays closed, waiting for the next cycle<br />

All of these steps will be repeated over and over again, up to 1500<br />

times per second continuously, with that number an objective basis<br />

for comparison with other dispensing methods should be considered.<br />

Under real world conditions, the number of drops dispensed per<br />

second will be impacted by factors such as desired shot size, the<br />

viscosity of the material, and the speed of the horizontal movement<br />

of the substrates being assembled. In use, as noted, contactless<br />

Piezo jet valves can typically dispense 20X faster than any contact<br />

valve.<br />

The jet valve is contactless, which means in use it can typically dispense<br />

20X faster than any contact valve.<br />

Ease of use, footprint size and other considerations<br />

When considering upgrading to the power of a Piezo jet valve dispensing<br />

system, a vital point to be aware of is that the phrase “jet<br />

valve” can refer to both the older pneumatic jet valve as well as the<br />

newer Piezo crystal-driven jet valve technology. While both technologies<br />

are significantly faster than familiar contact dispensing options,<br />

such as the auger valve or progressive cavity pump, the<br />

newer Piezo version of the jet valve can deliver up to 2X the speed<br />

of the incumbent pneumatic version. Nevertheless, since “jet<br />

valve” has been referred as “pneumatic jet valve” for so many<br />

years, many people still use the terms interchangeably. Many potential<br />

users and even valve manufacturers are relatively unfamiliar with<br />

the Piezo jet valve or have not yet had the impressive experience of<br />

seeing it in action. In other words, it behooves the buyer to specifically<br />

refer to “Piezo” in all discussions to ensure that everyone is on<br />

the same page.<br />

Currently, several manufacturers provide Piezo jet valve dispensing<br />

solutions, and as to be expected, a variety of design aspects, relating<br />

to both the valve itself and the related controller, can differ significantly.<br />

For example, a key issue to consider is the relative ease of identifying<br />

the right “recipe”, the combination of parameters to ensure correct<br />

placement and the correct amount of material. Piezo valves<br />

gain much of their small dot consistency through not only making<br />

use of tiny aperture nozzles, but also by providing the flexibility to<br />

fine-tune both material pressure and jetting pressure. Once the correct<br />

parameters are determined, the valve is extremely accurate<br />

and consistent in maintaining them but getting to that point often<br />

takes trial and error. Key in reducing the challenge is the provided<br />

capabilities of the controller, as well as any assistance that might be<br />

available from the manufacturer. As to the latter, some manufacturers<br />

might just look at an MSDS and render an opinion. Others will<br />

Source: Techcon Systems<br />

<strong>EPP</strong> EUROPE April 2020 27


PCB + ASSEMBLY<br />

The Piezo jet valve dispensing<br />

model is flexible<br />

enough to fit into a variety<br />

of Industry 4.0 or Smart<br />

Factory environment.<br />

Source: Techcon Systems<br />

Source: Techcon Systems<br />

offer some level of hands-on testing of specific material in their labs<br />

to ensure efficacy. Further, they might be willing to use the knowledge<br />

gained to help fine-tune the parameters in an operation more<br />

quickly. It pays to inquire before the sale.<br />

Additionally, the user interface of the controller can make a huge difference<br />

in the relative ease of determining the proper parameters<br />

and, therefore, the level of potential wasted product or loss of productive<br />

uptime during initial product set up. Some Piezo jet dispensing<br />

systems require manual tweaking with varying levels of precision;<br />

others provide the ability to fine-tune using software that<br />

allows the operator to modify the jetting properties for different fluid<br />

types and optimize the process for repeatable dispensing. Some include<br />

even more full-featured controllers with touch screens and<br />

graphic interfaces that optimize usability and make set up faster and<br />

more intuitive than in the past. Some manufacturers are raising the<br />

bar even further by providing the ability to set parameters as well as<br />

monitor and troubleshoot remotely, allowing operators to control<br />

their systems from anywhere at any time, around the world, using<br />

an app on their devices. These Piezo jet valve models fit into the operation<br />

of a sophisticated Industry 4.0-based Smart Factory – or one<br />

that is working towards becoming one.<br />

The amount of space that the jet units require also may be of importance<br />

to both benchtop users and machine integrators. For the<br />

former, sleeker units mean smaller work area demands and more<br />

efficient delineation of factory space. For the latter, with the speed<br />

and precision benefits of the Piezo jet valve, machine builders are<br />

more frequently looking to build one or several units into high end<br />

automation application equipment. They are being combined in the<br />

cabinet with robots and other complementary devices, in order to<br />

deliver best-in-class capabilities to their customers. Towards this<br />

end, it may be worth noting the relative size, weight and footprint of<br />

the individual brand Piezo jetting dispensing valves that are being<br />

considered.<br />

A more esoteric issue is that of all the dispensing valve technologies<br />

available on the market, the Piezo jet is not only the most advanced<br />

but also the most challenging to manufacture. The tolerances<br />

on components such as the nozzle and tappet are extremely<br />

tight and crafting them accurately is beyond the capabilities of many<br />

parts fabricators. Piezo jet models that cut costs using less complying<br />

components will most likely demonstrate issues quickly, including<br />

fluids dispensed out of place, inconsistent speeds, cleaning<br />

challenges, frequent failures and other problems that negatively impact<br />

productivity and quality. As benefits of different models are<br />

being weighed, speaking to other users about their experiences<br />

should be considered.<br />

Choosing a Piezo jet valve<br />

In addition, there are some limitations to consider. For example, potential<br />

users should consider the type of materials to be dispensed.<br />

Piezo jet valves can be used with materials demonstrating a very<br />

wide range of viscosities – up to two million centipoise or more and<br />

including materials as thick as silicone and urethane rubber. However,<br />

due to the need to evenly shoot the material, those that have<br />

solid particles blended into them, such as solder paste with its ultrafine<br />

metal particles, typically are not the best candidates for jet<br />

valve dispensing technology.<br />

Finally, and there’s no way around it, obtaining the superior cuttingedge<br />

technology of a Piezo jet valve represents a larger upfront investment<br />

than that of contact dispensing systems. However, it can<br />

be surprisingly comparable in cost to the older pneumatic jet valve<br />

considering how much faster it is. Further, helping significantly defray<br />

the lifecycle cost is the fact that the most expensive part of the<br />

system, the Piezo assembly, is highly robust and rated at around<br />

one billion cycles. Nevertheless, if a process will not benefit from<br />

the highest speed dispensing available as well as super-high precision,<br />

the investment might not be worth it. However, if a quantum<br />

leap in throughput with super accuracy would be valuable, significantly<br />

boosting profitability, then a Piezo jet valve might be a highly<br />

desirable investment.<br />

www.techcon.com<br />

Zusammenfassung<br />

Die Auswahl einer automatisierten Dosiertechnologie aus der<br />

Vielzahl an Technologien sollte passend zur jeweiligen Anwendung<br />

getroffen werden. Der Artikel bespricht die Vorteile der Technologie<br />

eines Piezo-Düsenventils.<br />

Résumé<br />

Parmi les nombreuses technologies de dosage automatisé disponibles,<br />

il convient d’en choisir une qui corresponde à l’usage prévu.<br />

Cet article présente les avantages de la technologie basée sur un<br />

clapet à buse piézoélectrique.<br />

Резюме<br />

Выбор подходящей технологии автоматического дозирования<br />

из множества доступных на сегодняшний день должен<br />

производиться с учетом специфики конкретной области<br />

применения. В статье обсуждаются преимущества<br />

использования пьезоэлектрических клапанов.<br />

28 <strong>EPP</strong> EUROPE April 2020


PRODUCT UPDATES<br />

PCB + ASSEMBLY<br />

Smart storage boosts value creation in production<br />

Mimot GmbH, a Smart Storage systems manufacturer,<br />

presented a holistic, modular, fully auto-<br />

their demands or to integrate additional features.<br />

ables customers to adjust the storage capacity to<br />

matic logistics solution. The Smart Storage system<br />

is manages the flow of goods for 30,000 or relabeling station or via reel trolley. An X-ray com-<br />

Reel storage can be done either via robot at the<br />

more components featuring continuous inventory ponent counter can be integrated which allows<br />

taking, MSD handling and AGV connectivity. continuous inventory taking. Due to real-time inventory<br />

data this optimized supply chain manage-<br />

This solution is a fully automated system for managing<br />

the flow of goods and is the heart of an ment allows minimal capital tie-up due to low inventory<br />

levels and avoids downtime of the lines<br />

optimized warehouse logistics solution. The result<br />

is cost reduction through optimized logistics, because of out of stock components.<br />

improved throughput and quality owed to the<br />

fully automated process. The modular design en- www.mimot.com<br />

The Smart Storage system is capable of<br />

managing 30,000 or more components and<br />

features continuous inventory taking, MSD<br />

handling and AGV connectivity.<br />

Source: Mimot GmbH<br />

Extraction system<br />

filters vapor and odors<br />

The ACD 1200 extraction and filtration<br />

system from ULT AG removes<br />

hazardous pollutants<br />

from the ambient air during<br />

gluing processes. Available in<br />

three performance versions between<br />

1,000 and 1,500 m 3 /h air<br />

flow, the unit can be utilized both<br />

mobile and stationary.<br />

Bonding processes are increasingly<br />

applied in manufacturing.<br />

The ACD 1200 extracts vapors,<br />

gases and odors, which occur in<br />

gluing, coating, laminating,<br />

molding or cleaning processes.<br />

Harmful air pollutants are exhausted<br />

via capturing elements<br />

and separated by several filtration<br />

stages. A combination of<br />

coarse dust pre-filters, compliant<br />

with DIN EN 779, and two adsorption<br />

filters (activated carbon)<br />

provides high separation rates.<br />

The cleaned air can be fed back<br />

to the working environment.<br />

Innovation is in our DNA:<br />

High-throughput inline inspection<br />

with state-of-the-art 3D X-ray<br />

technology for 100% reliability.<br />

www.ult.de<br />

Source: ULT AG<br />

The inline X7056-II 3D X-ray system offers high-precision, seamless<br />

X-ray inspection with extremely short cycle times to give you the<br />

best possible inspection strategy. Take advantage of networked<br />

3D SPI and 3D AOI data to make your production processes more<br />

efficient over the long term.<br />

Best of: The powerful and compact X7056-II combination solution<br />

brings advanced 3D AOI and 3D AXI technology together in a single<br />

system, enabling more extensive inspection coverage and even<br />

shorter cycle times. Significantly reduce false calls, rapidly detect<br />

100% of defects and track defects to prevent them in the first place.<br />

The ACD 1200 is suitable for the<br />

extraction of vapors, gases and odors,<br />

which occur in gluing, laminating,<br />

coating, molding or cleaning processes.<br />

WINNER<br />

Winner<br />

productronica<br />

innovation<br />

award 2017<br />

3D SPI 3D AOI 3D AXI 3D MXI 3D Bond CCI www.viscom.com<br />

<strong>EPP</strong> EUROPE April 2020 29


PCB + ASSEMBLY<br />

Fundamentals needed for a critical cleaning<br />

PCB cleaning – if you fail to<br />

plan, you are planning to fail<br />

The printed circuit board (PCB) is one of the most important elements within the design of an electronic<br />

product. As the heart of any electrical device, many features have to be considered to create<br />

a reliable and cost-effective board. Everything from determining the overall size and layout and<br />

whether it can accommodate all the components and signal tracks, to establishing what flux or<br />

paste to use. Will no-clean solder be the most effective solution, or a rosin or water-soluble paste?<br />

All of these factors have to be considered during the design stage and planned before PCB prototyping<br />

or production starts. One essential aspect however which is frequently overlooked during<br />

design is the critical process of cleaning the PCB to ensure reliability.<br />

Emily Peck, Senior Chemist, MicroCare Corporation<br />

PCB cleaning decisions should be made before prototyping or production starts.<br />

Cleaning can quite often be an afterthought once the initial design<br />

of the PCB has been planned. Or it may come into question<br />

as the planning process nears completion after important decisions<br />

about coatings, solder pastes and other materials have already<br />

been finalised. This results in a PCB that looks the part but<br />

performs poorly and is vulnerable to failure resulting in product recalls<br />

and costly returns. It can also have a substantial effect on<br />

manufacturing schedules, as designers seek answers to malfunctioning<br />

boards and post-production cleaning solutions to rectify the<br />

problem.<br />

Source: MicroCare Corporation<br />

Cleaning early in process<br />

Early planning is key for PCB manufacturing success and is becoming<br />

more significant with the continuing miniaturisation of components.<br />

The push to downsize has been driven by several industries<br />

particularly for medical applications and within the automotive sector<br />

with autonomous and intelligent transport systems advancing at<br />

speed. Because of the increasing need for sophisticated electronics,<br />

PCB designers are recognising the benefit of specifying<br />

their cleaning choices earlier in the design process, as they understand<br />

that one of the main causes of electronic device failure is contamination<br />

on the PCB.<br />

It is very often simpler to detect and rectify any cleaning problems<br />

before the prototyping and production stages. This is particularly<br />

true when manufacturing high-reliability PCBs such as those used<br />

within the military industry, or in medical devices like pacemakers<br />

where cleanliness is not just critical, it is a matter of life or death.<br />

Designers are starting to change their mindset by taking a proactive<br />

approach to PCB cleaning. They recognize the importance of successful<br />

cleaning and are stipulating cleaning details in the early<br />

stages of PCB design.<br />

Early identification of contamination<br />

The use of smaller PCBs filled with densely placed components<br />

makes managing faults problematic and cleaning a challenge. It is<br />

important to first identify the contaminant. There are two forms of<br />

contamination found on a PCB, ionic and non-ionic. Ionic contamination<br />

is most typically flux residue left behind during the manufacture<br />

of the board, or after the soldering process – and is usually inorganic<br />

salts or acids. This ionic residue contains molecules that are<br />

conductive when in a solution. If it is exposed to levels of moisture,<br />

the ionic residue can split into negatively or positively charged ions<br />

increasing the overall conductivity of the solution. If left untreated, it<br />

will degrade and may lead to corrosion and dendrite growth causing<br />

leakage and short-circuits, ultimately resulting in the failure of a device.<br />

The risk of malfunction increases further if a conformal coating is<br />

being used. Trapped moisture absorbed by the flux residue may be<br />

released during curing operations, causing the conformal coating to<br />

30 <strong>EPP</strong> EUROPE April 2020


separate from the board. This can allow corrosive materials, dust, or<br />

water to penetrate the PCB leading to an array of potential problems.<br />

It is therefore important for the PCB designer to choose an<br />

appropriate flux remover to clean any residue from the boards.<br />

Selecting a cleaning process that works<br />

Once the contaminant has been determined during the planning<br />

stage, the next question to ask is what cleaning fluid and method<br />

should be used?<br />

Effective cleaning ultimately contributes to the functionality and reliability<br />

of the board but it has to be performed using a process that<br />

will not damage the PCB. Components can be loosened, connections<br />

broken and substrates impacted if the wrong cleaning fluid or<br />

inappropriate cleaning method is used. For example, a strong cleaning<br />

fluid can dissolve plastics or other soft materials on the PCB. If a<br />

high-pressure spray is used to clean under low-standoff components,<br />

it could displace delicate components.<br />

The fluid used to clean a PCB has to be compatible with a variety of<br />

substrates, without damaging any coatings, yet strong enough to<br />

successfully remove the flux residue. The cleaning fluid needs to be<br />

matched to the contaminant to effectively clean without compromising<br />

the board.<br />

Pre-testing – the answer to successful PCB<br />

production<br />

Fundamental to PCB design is pre-testing. Understanding how to<br />

clean all the elements of the PCB early in the design process<br />

must be investigated. By instigating test cleaning at the initial<br />

concept stage, designers have an understanding of how their<br />

choices of pastes, fluxes and cleaners impact the performance of<br />

the board.<br />

Zusammenfassung<br />

Die Leiterplatte (PCB) ist eines der wichtigsten Elemente beim Design<br />

eines elektronischen Produkts. Ein wesentlicher Aspekt, der<br />

jedoch während der Entwurfsphase des Designs häufig übersehen<br />

wird, ist der kritische Prozess der Reinigung der Leiterplatte, um<br />

deren Zuverlässigkeit zu gewährleisten.<br />

Résumé<br />

Le circuit imprimé (PCB) est l’un des éléments les plus importants<br />

de la conception d’un composant électronique. Bien qu’il soit souvent<br />

négligé pendant la phase initiale de la conception, le processus<br />

de nettoyage du circuit imprimé est critique et essentiel pour<br />

garantir la fiabilité du circuit.<br />

Резюме<br />

Печатная плата (PCB) является одним из важнейших<br />

элементов при проектировании электронного<br />

устройства. Однако ключевым аспектом, который часто<br />

упускается из вида на этапе проектирования, является<br />

процесс очистки печатной платы, критически важный для<br />

обеспечения ее надежности.<br />

Protect your<br />

customers against<br />

negative surprises.<br />

High-end quality assurance<br />

in series. With ultra-precise<br />

test systems from MCD.<br />

Our electronical measurement and<br />

test systems cover the whole range<br />

of applications. From optic, accustic,<br />

haptic to sen soric realizations.<br />

Whether customized or out-of-the-box -<br />

MCD offers scalable solutions up to<br />

integration to industrial assembly line<br />

production.<br />

<strong>EPP</strong> EUROPE April 2020 31<br />

www.mcd-elektronik.com


PCB + ASSEMBLY<br />

In-lab testing helps match the best cleaning fluid to the PCB contaminants.<br />

Test-cleaning in small batches prior to full-scale manufacturing can<br />

be beneficial to achieving a successfully functioning part. Once the<br />

cleaning fluid and process have been demonstrated to work on a<br />

smaller scale, production can be increased to the higher volumes<br />

required. Through small-batch preemptive testing, any elements of<br />

surprise are eliminated to ensure better board reliability.<br />

Pre-testing can take place in-house if a facility has the correct capabilities,<br />

however, out-sourcing is a popular choice for the assurance<br />

of PCB cleanliness. Specialist companies can undertake comprehensive<br />

testing and cleaning trials, which adhere to the standards<br />

specified by the PCB designer. This can be anything from simple visual<br />

testing to strict IPC-610 requirement testing.<br />

Visual inspection looks for any apparent flux material or white residue<br />

left behind after production. With no quantitative results, it is an<br />

important method to use alongside other processes, particularly in<br />

high-reliability electronics manufacturing. If precision is critical, for<br />

example in the medical industry, stringent testing must be completed.<br />

This can include methods like Surface Insulation Resistance<br />

testing (SIR) which focuses on determining the reliability of an electrical<br />

component based on the strength and quality of the signal<br />

that comes through the component after cleaning. Another technique<br />

is Ion Chromatography (IC) testing. This is the only test that<br />

detects and quantifies weak organic acids and individual ions. It is<br />

an excellent process to quickly troubleshoot the source of contamination<br />

and predict the effect of each ionic type.<br />

Critical cleaning testing like SIR and IC are usually undertaken in<br />

critical cleaning labs. Sample parts are methodically tested to ensure<br />

cleaning success. Results are verified and documented to validate<br />

the cleaning process. Recommendations are then made confirming<br />

the cleaning fluid and process that will work effectively<br />

when full-scale production commences.<br />

Source: MicroCare Corporation<br />

Call in the cleaning experts<br />

To ensure cleanliness designers should consult with a critical cleaning<br />

partner that specialises in collaboration and cooperative problem-solving.<br />

Carrying out cleaning trials on PCBs that use the industry’s<br />

leading flux and solder pastes takes place daily within these<br />

dedicated critical cleaning labs. This means specific cleaning fluids<br />

and processes can be easily identified to successfully clean the<br />

PCB and ensure its reliability. A service like this will have substantial<br />

benefits to the bottom-line if applied during the planning process.<br />

Before out-sourcing any cleaning tests, there are a few fundamentals<br />

to look for when choosing a critical cleaning partner.<br />

• Do they have the technical expertise? Can they offer specific advice<br />

on cleaning a diverse range of PCB substrates through the<br />

use of different cleaning methods? There is no one size fits all<br />

when it comes to cleaning PCBs, so cleaning tests are essential.<br />

These can be performed through on-site cleaning audits or in a<br />

critical cleaning lab. Both methods will determine the contamination<br />

and what cleaning fluid and process will work effectively.<br />

• Pre-testing may have been undertaken in the early design stages,<br />

which has led to the correct cleaning process, however, testing<br />

should be ongoing. Choose a vendor that supports PCB designers<br />

throughout each phase of the process from research and design<br />

to testing and manufacturing and can respond quickly to change.<br />

This will help to identify any issues before they become critical.<br />

• Seriously consider testing in a critical cleaning lab. It is here where<br />

cleaning tests are conducted to match the cleaning fluid to the<br />

flux and paste contaminants. This ensures the PCBs are clean and<br />

will function properly.<br />

Small batch preemptive test cleaning helps eliminate any surprises.<br />

Plan, plan, plan<br />

Early planning is key to the successful production of electronic products,<br />

particularly when it comes to cleaning. Designers must put<br />

cleanliness at the top of the agenda when designing a PCB, this will<br />

help to ensure long-term PCB performance, functionality and reliability.<br />

Initiating pre-testing and through the selection of cleaning fluids and<br />

methods in the initial design stage will help to resolve cleaning<br />

problems before manufacturing begins reducing rework and discarded<br />

boards.<br />

Partner with a cleaning expert to quickly and effectively identify the<br />

best cleaning methods and fluids for the job. The long-term benefits<br />

will be substantial when it comes to time, finances and the successful<br />

production of a fail-safe product.<br />

www.microcare.com<br />

Source: MicroCare Corporation<br />

32 <strong>EPP</strong> EUROPE April 2020


PRODUCT UPDATES<br />

PCB + ASSEMBLY<br />

In use intelligent factory measurement tool<br />

Source: Insituware<br />

The Vision product family consists of the Mark-1 handheld device, the plug and play<br />

modules, application programs, and the Insitucloud.<br />

The handheld Mark-1 solution comes with Vision Insight, which enables<br />

the non-destructive inspection and process control of materials.<br />

Source: Insituware<br />

Insituware integrates hardware and software<br />

technology to assess materials during use.<br />

They combine analytical sensors, smart devices,<br />

and intelligent cloud-based information<br />

with innovative packaging methods to enable<br />

nonintrusive sensing of materials in motion.<br />

The company is cloud-based and operates<br />

with materials-specific apps on a handheld<br />

device. This enables better control by assessing<br />

materials on location and during use or in<br />

situ meaning ‘in place’. With analytical sensors,<br />

smart devices, and intelligent cloudbased<br />

information with innovative packaging<br />

methods, the company enables nonintrusive<br />

sensing.<br />

Measuring “in situ” (i.e. while in use) provides<br />

benefits over lab measurements, including:<br />

Effective: Enables users to make decisions<br />

quickly.<br />

Inexpensive: Integrated analytical sensors<br />

can be deployed at scale.<br />

Quick: Automated interpretations generated<br />

using machine learning methods.<br />

Intelligent factory measurement<br />

The Vision product family consists of the<br />

Mark-1 handheld device, the plug and play<br />

modules, material specific Mark-1 application<br />

programs (“Apps”), and the Insitucloud<br />

which incorporates the data management<br />

system, “MethodQC” (the statistical process<br />

control software), and the machine<br />

learning back-end analysis system. The Vision<br />

product family enables rapid measurements<br />

in the factory while trending and tracking the<br />

collected data from any computer with internet<br />

access. It enables the monitoring and<br />

control of laminates, soldering materials,<br />

coatings, masks, and adhesives.<br />

Plug and play modules<br />

The plug and play Insight modules expand<br />

the functionality of the Vision Mark-1 device<br />

to enable the non-destructive inspection and<br />

process control of materials both before and<br />

during use.<br />

Better monitor materials<br />

With a touch of a button, the Vision Mark-1<br />

shows results that can increase efficiency,<br />

knowledge and productivity. The hardware<br />

device technology is designed to be used as<br />

a partner with materials specific Insituware<br />

Apps, allowing users to see and use customizable<br />

results to better monitor and control<br />

materials. These apps, combined with Vision<br />

Mark-1, integrate statistical process control<br />

analysis methods (MethodQC) and machine<br />

learning in a cloud environment.<br />

Access to materials data<br />

The Insitucloud with the MethodQC provides<br />

access to a repository of materials data.<br />

Users can identify unknown materials, investigate<br />

changes in materials, and identify the<br />

root cause of material failure. It also provides<br />

users with material knowledge and predictive<br />

models to make informed decisions.<br />

Measuring in situ<br />

The company helps customers measure in<br />

situ by first using integrated, miniaturized<br />

analytical sensors. Next, they perform data<br />

science and machine learning techniques to<br />

compensate for the in-field sensor outputs.<br />

This helps customers replace a trained technician<br />

with automated software. Finally, sensors<br />

are connected to a centralized cloud<br />

backend to enable big data analyses.<br />

www.insituware.com<br />

The MethodQC is the statistical<br />

process control software, which<br />

provides access to a repository<br />

of materials data.<br />

Source: Insituware<br />

<strong>EPP</strong> EUROPE April 2020 33


PCB + ASSEMBLY<br />

Benefits of soldering with vacuum profiles<br />

Void formation in the soldering<br />

process safely under control<br />

Vacuum soldering has been a proven technique for decades in contact heat<br />

and vapour phase soldering systems, significantly reducing gas bubbles in<br />

solder joints. What does this mean in terms of convection soldering, the most<br />

widely used technique today with the highest throughput?<br />

Helmut Öttl, Head of Application and Process Development, Rehm Thermal Systems GmbH<br />

Influences in the assembly production on the formation of solder<br />

joints and thus on their quality are affected by an unmanageable<br />

number of parameters that are increasingly difficult to control or<br />

master. There are a variety of factors that can provide an initial insight<br />

into the complexity of the problem. However, only two factors<br />

can be used immediately before production of the assemblies in<br />

question to prevent voids from forming.<br />

Factors influencing voids<br />

The first factor is the stencil and the design of the aperture, the second<br />

is using vacuum technology in the soldering process itself. A<br />

unique selling point is that vacuum soldering can even be used in<br />

the production process, as a “firefighter” when there is short-term<br />

increase in the occurrence of bubbles. It reacts flexibly to fluctuations<br />

in the supply quality of components, printed circuit board surfaces<br />

or batch fluctuations in solder pastes.<br />

Where large numbers of voids or void size have been created in the<br />

first soldering pass using a conventional soldering system, both assemblies<br />

and series production items can be repaired in Rehm<br />

Thermal Systems’ modern vacuum soldering systems, such as the<br />

VisionXP+ Vac convection soldering system or the vapour phase soldering<br />

systems from the CondensoX series. These would normally<br />

have to be marked as rejects because they contravene relevant IEC<br />

standards criteria or IPC guidelines.<br />

Vacuum with reflow<br />

What does vacuum actually mean, though, and how does it influence<br />

the design of a reflow soldering system?<br />

Vacuum is defined in DIN 28400 as follows: “Vacuum means the<br />

state of a gas when the pressure of the gas and thus the particle<br />

number density inside a container is lower than outside or when the<br />

pressure of the gas is lower than 300 mbar, i.e. lower than the lowest<br />

atmospheric pressure existing on the earth’s surface.”<br />

The assembly profiling is the same as in vacuum-less processes,<br />

only here the vacuum process can be applied between the peak and<br />

cooling zone. This vacuum process does not have to be a single step<br />

but can also be split into several holding steps for more sensitive<br />

components. In the same way as a surfacing scuba diver, the pressure<br />

can escape gradually from the components and solder joints.<br />

Similarly, the speed needed to create a vacuum can be influenced<br />

to adjust the dynamics to prevent effects such as solder splashes<br />

and the like. One of the main advantages of convection soldering<br />

machines in today’s production process is the high production<br />

throughput.<br />

A compromise has to be found here between the quality that needs<br />

to be achieved (void content in the solder joint) and the cycle time.<br />

As a rule of thumb: the lower the void fraction needs to be, the<br />

higher the extra cycle time to the standard vacuumless profile. For<br />

example, a cycle time of 25 seconds can be achieved without vac-<br />

Factors influencing voids and reliability.<br />

Source: AK Poren; Dr. Wohlrabe, TU Dresden<br />

34 <strong>EPP</strong> EUROPE April 2020


PCB + ASSEMBLY<br />

Design of a convection<br />

soldering machine with<br />

vacuum chamber.<br />

Source: Rehm Thermal Systems<br />

uum equipment for a 200 mm-long assembly. If a 100 mbar vacuum<br />

process is selected here to achieve a void ratio below 10 % for QFN<br />

components, this can add 9 seconds to the above cycle time.<br />

The cycle times can also be changed in both directions, however, depending<br />

on whether the tolerance needs to be tightened to 5 % or<br />

broadened to 20 %. A second thought about the really needed void<br />

ratio percentage pays off in both ways, quality wise and cost wise!<br />

Comparison of soldering methods<br />

The influence of the different soldering methods on void creation<br />

was examined using a reflow convection soldering and a reflow<br />

vapour phase soldering machine. This comparison shows that vapour<br />

phase vacuum soldering and convection vacuum soldering do not<br />

differ. The advantages can therefore be used in convection soldering<br />

in the same way, but when making comparisons the “marginal parameters”,<br />

such as the solder paste, which differ regarding suitability<br />

for the different soldering methods, must never be forgotten.<br />

Source: Rehm Thermal Systems<br />

Assembly profile on a convection soldering machine with vacuum process.<br />

Zusammenfassung<br />

Das Vakuumlöten hat sich seit Jahrzehnten in Kontaktwärme- und<br />

Dampfphasenlötsystemen bewährt und reduziert erheblich Voids in<br />

Lötverbindungen. Doch welche Bedeutung hat dies für das Konvektionslöten,<br />

die heute am häufigsten verwendete Löttechnik für<br />

höchsten Durchsatz?<br />

Résumé<br />

Depuis plusieurs décennies, le brasage sous vide a fait ses<br />

preuves dans les systèmes de brasage par chaleur de contact et<br />

en phase vapeur et il limite considérablement les voids au niveau<br />

des joints de soudure. Mais quelles en sont les implications pour le<br />

brasage par convection, qui est aujourd’hui la technique la plus utilisée<br />

pour les cadences élevées?<br />

Резюме<br />

Вакуумная пайка зарекомендовала себя на протяжении<br />

десятилетий в системах контактной термопайки и<br />

конденсационной пайки, позволяя значительно сократить<br />

количество пустот в паяных соединениях. Но какое значение<br />

это имеет для конвекционной пайки, наиболее часто<br />

используемой на сегодняшний день технологии,<br />

обеспечивающей наибольшую производительность?<br />

Comparison of the percentage void contents for BGA and QFN components<br />

in relation to the soldering process.<br />

This influence is also seen when using two SAC solder pastes, but<br />

with different soldering flux formulations. There are larger void<br />

formation deviations in the QFN component between convection<br />

soldering with air and vapour phase soldering. The vapour phase soldering<br />

process here, however, is inert, even without the use of nitrogen.<br />

This itself can have a significant influence when using a soldering<br />

flux. The beauty of the vacuum option is that the influence of<br />

paste can be drastically minimised, irrespective of the soldering<br />

method used.<br />

Source: Voidexpert<br />

<strong>EPP</strong> EUROPE April 2020 35


PCB + ASSEMBLY<br />

Soldering field study<br />

A comparison was made here between these two soldering<br />

methods and different template apertures to evaluate the respective<br />

influencing variables. The stencils were also varied in material<br />

thickness and manufacturing method. A template with a 120 μm<br />

thickness was produced without any additional “refinement steps”.<br />

Its counterpart was built with a plasma-coated and electropolished<br />

surface and a template thickness of 110 μm. The test boards ran<br />

equally divided in numeric terms with both template variants.<br />

Histogram of surface soldering without vacuum in relation to the void content.<br />

Source: Rehm Thermal Systems<br />

Interaction of the<br />

solder paste with<br />

the soldering<br />

processes.<br />

In an extreme comparison of soldering at ambient pressure, compared<br />

with vacuum at 10 mbar, there were clear differences shown<br />

between vacuum application and standard reflow system. Throughput<br />

with reduced vacuum at 100 mbar verifies the result and shows<br />

that even with less effort, a result below 2 % voiding is achieved for<br />

the component combination. This has a significant influence on the<br />

cycle time, since during unthrottled vacuum pump operation, the<br />

necessary process times from 1000 mbar to 100 mbar are the same<br />

as from 100 mbar to 10 mbar (or 10 mbar to 1 mbar). This means that<br />

it is necessary to always work with only as much “pressure” as<br />

needed.<br />

Source: Voidexpert<br />

The influence of the selected aperture geometries only shows significant<br />

differences without the use of vacuum, mainly in the<br />

number of gas bubbles formed and partly on the total void ratio.<br />

The subjective impression is that the plasma template tends to result<br />

in a little less voiding, which can be attributed to the better release<br />

of the paste and the associated more stable printing process.<br />

A stable and constant paste pressure supports the soldering process<br />

here.<br />

Standard deviation of process<br />

Finally, a consideration of the process stability during soldering: the<br />

target figures for voiding are always absolute figures, such as<br />


PRODUCT UPDATES<br />

PCB + ASSEMBLY<br />

Thermal gap fillers for various applications<br />

Source: Electrolube<br />

Electrolube launched thermal gap fillers that<br />

provide heat transfer solution. The GF300<br />

and GF400 are two part, liquid silicone-based<br />

fillers, which provide thermal performance of<br />

The GF400 thermal interface material is a two-part<br />

liquid silicone-based filler that can be cured at room<br />

temperature or accelerated with heat.<br />

3.0 W/m.K (GF300) and 4.0 W/m.K (GF400).<br />

They reduce the risk of air pockets forming<br />

by filling the entire heatsink, which is ideal for<br />

applications where the gap is non-uniform.<br />

Using a simple 1:1 mix ratio in either 50 ml or<br />

400 ml cartridges, GF300 and GF400 are applied<br />

in a soft flexible ‚putty‘ that can be<br />

moulded around different shaped housings<br />

with low stress on components. They can be<br />

cured at room temperature or accelerated<br />

with heat. Both provide an operating temperature<br />

range between -50 to + 200 °C and<br />

have low viscosity. After curing, they form a<br />

low modulus elastomer, ensuring minimal<br />

degradation of heat dissipation. They are also<br />

UL approved with the UL94 V-0 flame retardancy<br />

rating and are RoHS compliant.<br />

Typically, thermal gap fillers are widely used<br />

in touch screen and mobile applications, but<br />

these interface materials are meeting the demands<br />

for various applications. This includes<br />

consumer electronics, PCB assembly, housing<br />

electronic components discretely, telecoms<br />

applications such as data centre<br />

Source: Electrolube<br />

servers and fiber optic equipment, lighting<br />

and LEDs applications, power electronics,<br />

and ECU’s and HEV/ NEV batteries.<br />

However, the company has seen demand<br />

surge for specific application requirements,<br />

including engine and transmission control<br />

modules, memory modules, power conversion<br />

equipment and more.<br />

www.electrolube.com<br />

The recently<br />

launched range of<br />

thermal gap fillers<br />

provide great thermal<br />

performance while<br />

reduce the risk of air<br />

pockets forming.<br />

The alternative to conventional fluxes<br />

Flux manufacturers have already reported<br />

a shortage of alcohol-based fluxes used in<br />

electronics manufacturing. Interrupted<br />

supply chains and an increasing demand<br />

for alcohol as a basis for disinfectants has<br />

resulted in massive price increases.<br />

Seho offers a solvent-free alternative – the<br />

PlasmaFluxer. In a plasma process, flux<br />

powder is deposited at the solder joints<br />

with great adherence and long-term stability.<br />

Product quality can also be improved.<br />

The PlasmaFluxer uses cold-active plasma<br />

to melt micrometer sized powder of pure<br />

adipic acid and is placed on the PCB surface.<br />

A liquid carrier material is not needed,<br />

and the gas that is used to create the plasma<br />

flame is Nitrogen. When processing assemblies,<br />

an aerosol formed out of meltable<br />

flux particles and Nitrogen is led into<br />

the plasma flame and directed to the PCB.<br />

Once the aerosols touch the surface, the<br />

particles solidify and form a stable coating.<br />

The plasma process substitutes the conventional<br />

wet-chemical flux activation with<br />

a dry process. Soldering results achieved<br />

with this process are comparable to standard<br />

liquid fluxes.<br />

An additional advantage is the cleanliness of<br />

the PCB surface after the soldering process.<br />

Therefore, an additional cleaning process can<br />

be avoided. Additionally, the degree of contamination<br />

of the fluxer work area and the<br />

soldering system is smaller, as there is no<br />

evaporation of solvents from the flux. Consequently,<br />

maintenance requirements are remarkably<br />

reduced while availability of the<br />

process equipment is increased.<br />

Solvent-based fluxes are declared as hazardous<br />

material and special measures are<br />

necessary in terms of storage, handling and<br />

waste management. In comparison, the<br />

handling and storage of powder is much<br />

easier, resulting in a reduction in manufacturing<br />

costs, and additional benefits<br />

emerge from the environment friendly<br />

concept of the plasma fluxing process.<br />

The selective flux application method leads<br />

to a reduction of the flux amount needed,<br />

and with the elimination of liquid, savings<br />

are achieved in the material costs.<br />

A particular benefit of the plasma fluxing<br />

method is its ability to “revive” overaged<br />

PCBs that show perfect wetting results.<br />

www.seho.de<br />

The PlasmaFluxer<br />

uses cold-active<br />

plasma to melt<br />

micrometer sized<br />

powder of pure<br />

adipic acid.<br />

Source: Seho Systems<br />

<strong>EPP</strong> EUROPE April 2020 37


PCB + ASSEMBLY<br />

Preventing electric vehicle recalls<br />

Improving electrical performance<br />

with the correct connectors<br />

The automotive industry continues to position itself at the forefront of technological developments<br />

and offers guidance for many other industries to follow. More recent developments in<br />

the automotive market have centred on electronic advancements, whether that be with driver/<br />

passenger experience or due to safety critical developments and semi-autonomous driving<br />

features such as automatic braking and driver lane assistance, for example. Now, the focus is<br />

on the switch away from the internal combustion engine to environmentally conscious alternatives,<br />

most notably the electric vehicle (EV) and various hybrid options (HEV) and with this<br />

change comes even more challenges for electrical circuits, connectors and contacts.<br />

The advancements of the automotive industry has caused more challenges<br />

for the electrical circuits, connectors and contacts.<br />

Regardless of the industry, electrical contact lubricants are used<br />

to enhance the performance and reliability of electrical contacts<br />

and connectors. Originally invented in 1941 for improving the electrical<br />

performance and reliability of volume controls by Electrolube’s<br />

founder, the use of contact lubricants has spread far and wide into<br />

many different industries and has been a critical factor in the dependable<br />

performance of automotive components for decades.<br />

Source: Electrolube<br />

Improving electrical performance<br />

Contact lubricants are specially formulated greases and oils, designed<br />

to reduce friction and wear and enhance electrical performance<br />

of current carrying metal interfaces, such as those found in<br />

switches and connectors. As no metal interfaces are entirely even<br />

and smooth, when applied to such surfaces in thin films, they fill in<br />

all surface imperfections, in turn improving contact and electrical<br />

performance as well as prolonging the contact life by reducing hot<br />

spots, frettage and arcing.<br />

By filling in the air gaps between the contacts, contact lubricants<br />

dramatically increase the effective surface area, in turn preventing<br />

arcing and the related temperature rise and oxide formation. They<br />

also provide a barrier to airborne contamination and reduce the effects<br />

of friction by facilitating smooth movement. In addition, the<br />

use of contact lubricants is typically evaluated for their ‘feel’ characteristics,<br />

improving the quality of movement of a switch or in simple<br />

plastic-plastic contacts, for example.<br />

Whether the application is for interior components, such as air conditioning<br />

ventilation flaps; exterior components such as side mirror<br />

adjustments; or on critical contacts within the wiring harness; the<br />

applications for contact lubricants are ever increasing in line with<br />

the advancements in CASE technologies (Connected, Autonomous,<br />

Shared, Electric).<br />

Preventing failures in electrical systems<br />

There are 3 main ways in which contact lubricants are used in automotive<br />

applications:<br />

1. To improve electrical transfer and reliability of the contact<br />

As already discussed, contact lubricants increase the contact surface<br />

areas by filling any gaps and reducing electrical resistance.<br />

Technology has spread into more safety critical operations within<br />

vehicles and with automotive recalls due to electronic components<br />

on the rise, it is imperative that these safety critical connections are<br />

maintained correctly. In a recent report by AlixPartners 1) , it was detailed<br />

that recalls to correct failures in electronic or electrical systems<br />

have grown 30 % a year in recent years. Such failures include<br />

issues with software and software integration; however, the vast<br />

majority of recalls are actually because of failures related to integrated<br />

electrical components.<br />

38 <strong>EPP</strong> EUROPE April 2020


PCB + ASSEMBLY<br />

Source: Electrolube<br />

The comparison of electrical properties<br />

and plastics compatibility.<br />

As an IATF 16949 approved electro-chemical solution provider, Electrolube<br />

is often asked to help prevent such issues from occurring.<br />

The company also fully understands the impact that such failures<br />

can have on businesses, with costs coming from all areas, including<br />

the effect it has on brand reputation for the automotive manufac-<br />

REHM<br />

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Meticulous protective coating<br />

with Protecto!<br />

The use of protective coatings improves the quality<br />

and durability of your products. Our Protecto selective<br />

conformal coating system protects sensitive<br />

electronic assemblies from damage by corrosion or<br />

other environmental influences. The multifunctional<br />

lacquer applicator enables all standard protective<br />

lacquers to be precisely applied by dispensing,<br />

spraying, jet or curtain coating – with absolute precision<br />

and reliability! The system also is available as a<br />

production line design with lacquer dryer.<br />

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www.rehm-group.com<br />

Anzeige_<strong>EPP</strong>_<strong>Europe</strong>_Protecto_04_2020.indd 1 27.03.2020 11:23:50<br />

<strong>EPP</strong> EUROPE April 2020 39


PCB + ASSEMBLY<br />

Contact lubricants ensure that material contacts have a good connection<br />

between parts, in order to reduce noise and movement caused by vehicle<br />

operation.<br />

turer. It is therefore extremely important that all aspects of electronic<br />

systems are considered, including the connection between<br />

devices and the correct selection of a contact lubricant.<br />

The electrical performance of a contact lubricant is usually evaluated<br />

by measuring the mV drop of the contacts/switches over a<br />

specified number of cycles. This is usually in excess of 20,000<br />

usage cycles. The performance of various contact lubricants can<br />

vary depending on the formulation and intended end use. For<br />

example, some materials have a more stable low mV drop over a<br />

large number of cycles but compromise on their plastics compatibility.<br />

In other cases, the application may have the requirement for a particular<br />

consistency of contact lubricant, in combination with good<br />

electrical properties. A ‘stiffer’ or ‘harder’ grease may be selected in<br />

order to stay in place during the mechanical action of the switch. In<br />

such cases, the cone penetration at different temperatures or wear<br />

testing of the lubricants may assist in product selection. Conversely,<br />

Surface Area<br />

Microscopic examinations of contact surfaces reveal ‘peaks and<br />

troughs’, therefore only the peaks touch when the two surfaces come<br />

together. The current carrying surface area is greatly reduced, which<br />

causes heat to be generated and oxide layers to be formed. Hot spots<br />

are created which reduce the efficiency of the switch and can result in<br />

complete failure should the two surfaces weld together.<br />

Source: Electrolube<br />

a very soft grease or a contact oil may be required in applications<br />

where there is a very low contact force and, in such cases, the<br />

mechanical action of the switch should be tested with a range of lubricants<br />

to determine suitability. It is therefore important to consider<br />

all electrical requirements, material compatibility and environmental<br />

influences when choosing the correct lubricant.<br />

Traditionally, the improvement in electrical properties of switches<br />

and connectors in vehicles was focused on low voltage switches<br />

and moved on to more critical applications, as the development of<br />

electronic applications progressed. With a change to EV’s, a further<br />

increased set of challenges has been posed, including more electrical<br />

connections and most notably, much higher voltages being<br />

transferred around the vehicle. With experience in industries such<br />

as medium and high voltage switchgear, electroplating and relays,<br />

Electrolube has a range of products to meet the demanding requirements<br />

of the electric vehicle market.<br />

2. To reduce the effects of external influences, reducing corrosion<br />

and wear<br />

Acting like the central nervous system of the vehicle, the wire harness<br />

contains many connections to facilitate the communication of<br />

a multitude of devices. Due to the complexity of the electronics applications<br />

within a vehicle, the harness also accounts for a lot of<br />

weight. This has led to different materials being used, such as aluminium<br />

and in some cases, differing metals could be used within<br />

the same harness. Whilst reducing weight, there are also other challenges<br />

with using aluminium, including the formation of hard oxide<br />

layers and electrochemical corrosion in the presence of moisture<br />

and differing metals.<br />

Zusammenfassung<br />

Die Automobilindustrie befindet sich in einer Zeit des ständigen<br />

Wandels und der Entwicklung. Entwicklungen in der Batterietechnologie<br />

und bei den Benutzerschnittstellen, alternative Kraftstoffquellen<br />

und der ständig wachsende Markt für autonomes Fahren<br />

stellen neue Herausforderungen an elektrische Steckverbinder,<br />

Schalter und Geräte.<br />

Résumé<br />

L’industrie automobile traverse une période de changements permanents<br />

et de développement. Les progrès de la technologie des<br />

batteries et des interfaces utilisateur, les sources de carburant alternatives<br />

et l’essor constant du marché des véhicules autonomes<br />

constituent de nouveaux défis pour les connecteurs, les interrupteurs<br />

et les équipements.<br />

Резюме<br />

Автомобильная промышленность претерпевает постоянные<br />

изменения и развивается. Разработки в области<br />

аккумуляторных технологий и пользовательских интерфейсов,<br />

альтернативных источников энергии и постоянно растущий<br />

рынок систем автономного вождения ставят новые задачи<br />

перед электрическими разъемами, переключателями и<br />

устройствами.<br />

40 <strong>EPP</strong> EUROPE April 2020


PCB + ASSEMBLY<br />

Sources<br />

1) https://emarketing.alixpartners.com/rs/emsimages/2018/pubs/EI/<br />

AP_Auto_Industry_Recall_Problem_Jan_2018.pdf<br />

2) https://www.prnewswire.com/news-releases/global-automotivewiring-harness-markets-to-2025---the-need-for-high-voltage-wiringdesigns-in-electric-vehicles-is-sparking-growth-300746753.html<br />

3) https://www.alixpartners.com/media-center/press-releases/alix<br />

partners-global-automotive-industry-outlook-2019<br />

Contact lubricants can be used to protect freshly mated contacts<br />

being exposed to the environmental conditions, but this is only part<br />

of the problem. During the lifetime of these contacts, corrosion<br />

caused by fretting is common and the use of a contact lubricant to<br />

prevent the exposure of any base materials on contacts or aluminium<br />

parts can greatly reduce failure rates of contacts and connectors.<br />

Environmental influences can include temperature changes, humidity<br />

exposure and corrosive atmospheres. Changes in temperature<br />

can affect the consistency of the contact lubricant, for example, a lubricant<br />

may have a cone penetration value of 320 at 25 ºC but when<br />

exposed to temperatures of -40 ºC or lower, this value may significantly<br />

reduce, resulting in a much harder consistency of grease.<br />

Humid environments are also common, and most contact lubricants<br />

will withstand high humidity for prolonged periods. When high humidity<br />

is combined with corrosive environments, differences between<br />

products can be realised. Electrolube has designed a series<br />

of tests to illustrate these differences and provide further assistance<br />

with correct product selection. These tests include wetting humidity<br />

followed by salt mist tests, chlorine resistance tests and consideration<br />

of different contact materials.<br />

The combined humidity and salt mist testing subjected the lubricants<br />

to 90 % humidity at 35 ºC for 3 weeks, followed by 1 week at<br />

35 ºC in the salt mist chamber. The protection of copper and steel<br />

substrates was visually evaluated after this test. Typically, the synthetic<br />

lubricants, such as Electrolube CTG, provided the best protection<br />

in this environment. In addition to this test, gold and silver contacts<br />

protected with various lubricants were also subjected to the<br />

salt mist environment. Results further strengthened previous findings,<br />

highlighting that some mineral based lubricants in particular<br />

are not suitable for protecting these materials in harsh environments.<br />

Finally, as an extreme test, an oxidative environment containing<br />

chlorine was created and maintained at 35 ºC for 2 months<br />

and results again showed that the CTG provided exceptional protection,<br />

closely followed by Electrolube CG53A and CG60.<br />

3. To improve the quality, feel and insertion force/operation of<br />

connectors and switches<br />

Contact lubricants are also widely used in many applications to improve<br />

the ‘feel’ of a switch, thus giving the impression of high<br />

quality. This is also true for many applications within the interior of<br />

vehicles, ensuring that metal-metal, plastic-metal and plastic-plastic<br />

contacts alike have a good connection between parts, thus reducing<br />

noise and movement when subjected to vibrations caused by the<br />

normal operation of the vehicle. With a move towards quieter vehicles,<br />

improvements in tyre technology and the future with EV’s,<br />

the vehicle interior is a much quieter place to be and as such, the<br />

quality of these contacts and overall noise dampening is essential to<br />

ensure a high quality driving experience is achieved.<br />

Products such as the CG60 and SPG have been used for such automotive<br />

applications for many years and are suitable for futureproofing<br />

the interior of vehicles, ensuring the upmost of comfort in the<br />

driving experience. In some cases, a fluorinated lubricant, such as<br />

Electrolube’s EGF, may be required to offer greater performance in<br />

these areas and particularly in the case of reducing the insertion<br />

forces when mating connectors.<br />

This again leads to a discussion about the wire harness and with the<br />

increase in number of electronic components and connectors as<br />

EV’s are discussed in further detail. The need for lubricants such as<br />

Electrolube’s CG60, CTG or EGF for improving manufacture and inuse<br />

protection is also greatly increased. In fact, in a study by Research<br />

and Markets 2) , it is reported that based on component, the<br />

connection of electronics within vehicles via wire harnesses is projected<br />

to witness the fastest growth up to 2025. This is due to the<br />

development of advanced technologies in the automotive field, including<br />

driver assistance systems and safety features.<br />

Challenges for electrical connectors<br />

The automotive industry is in a period of constant change and evolution.<br />

By switching to HEV’s and EV’s, a new set of challenges for<br />

electrical connectors, switches and devices are being put forward<br />

and will also continue to evolve for years to come. Developments in<br />

battery technology and user interfaces, alternative fuel sources, and<br />

the ever-expanding autonomous driving market, will all add to these<br />

challenges. By addressing the seemingly small task of ensuring<br />

high quality, reliable and protected connections, contact lubricants<br />

will assist in meeting these new demands.<br />

The EV powertrain is on average two and a half times more expensive<br />

than conventional powertrains 3) , leading to cost being another<br />

barrier for growth in this market. This cost will naturally come down<br />

over time with economies of scale and improvements in technologies.<br />

Due to the combination of the reduced overall costs from the<br />

maintenance of high quality levels as well as the reduced vehicle recalls<br />

from connector failures, manufacturers need to have the<br />

choice of contact lubricants high on their development agendas,<br />

now and for many years to come.<br />

www.electrolube.com<br />

Jade Bridges, Global Technical<br />

Support Manager, Electrolube.<br />

Source: Electrolube<br />

<strong>EPP</strong> EUROPE April 2020 41


PCB + ASSEMBLY<br />

Proactive support and predictive maintenance from anywhere<br />

Digital twin of the production<br />

with real-time data<br />

Proactively controlled service management is a component that‘s indispensable for<br />

building an integrated smart SMT factory, which is why ASM has developed a comprehensive<br />

and modular solution for this purpose with its ASM Equipment Center. Service<br />

teams can now optimize the planning and execution of maintenance activities in line<br />

with the ‘agile production’ approach. The fabLIVE module delivers instant benefits by<br />

mapping a digital twin of the complete production in a detailed 3D model, which shows<br />

current maintenance relevant machine conditions at a glance. The Equipment Center<br />

thus supports predictive maintenance to a previously unattainable degree. Necessary<br />

assists and troubleshooting measures become instantly visible, which reduces the frequency<br />

of production stops significantly.<br />

Having a seamless exchange of data is vitally important for the<br />

integrated Smart Factory. Even in heterogeneous production<br />

environments with equipment from many different manufacturers,<br />

the flow of data must be maintained at all times. It‘s the only way to<br />

proactively plan maintenance, in order to ensure a continuously high<br />

level of quality and prevent unnecessary production stops. “As we<br />

transition to the integrated Smart Factory in stages, our service operations<br />

must change as well. With a classic organization and traditional<br />

tools, the manufacturers’ service teams are no longer able to<br />

satisfy the growing demands on availability and thus the immaculate<br />

condition of machines, feeders and other components,” says<br />

Jim Leather, head of Product Management for ASM SMT Solutions,<br />

before adding: “Predictive maintenance based on sensors in the<br />

machines that make data available anywhere and in real time is one<br />

component of our Service 4.0 initiative.”<br />

With fabLIVE, you can create a true-to-scale digital twin of the production that visualizes all the data that‘s being transmitted live by the machines.<br />

Source: ASM Assembly Systems GmbH & Co. KG<br />

42 <strong>EPP</strong> EUROPE April 2020


PCB + ASSEMBLY<br />

The traffic light colors indicate<br />

each machine’s real-time status<br />

anywhere in the world.<br />

Source: ASM Assembly Systems GmbH & Co. KG<br />

Integrated Smart Factory lives on data<br />

The company believes in the use of powerful, flexible and open<br />

communication standards, such as IPC-CFX or ASM OIB across the<br />

entire production chain. The company is the first supplier in the SMT<br />

field to make it possible for the seamless flow of data from its own<br />

machines, as well as, third-party machines. Predictive maintenance<br />

is just one beneficiary of this approach as long as machine messages<br />

are processed appropriately. Virtualizing the collected and<br />

channeled data in a continuously updated user cockpit that can be<br />

seen anywhere in the company and not just at the individual machine<br />

opens up a new world of opportunities in predictive maintenance.<br />

Visualizing the digital twin of the factory<br />

Not every industrial user can and wants to implement the integrated<br />

Smart Factory everywhere in one step – in most cases, this<br />

is done in stages. One helpful module on this road is the fabLIVE<br />

module, which is part of the manufacturing execution system (MES)<br />

offered by the company’s subsidiary Critical Manufacturing. The<br />

browser-based software generates a virtual 3D image of the factory<br />

with all its production equipment and machines.<br />

Since ASM includes all the necessary 3D data with its own machines<br />

such as DEK printers or Siplace placement systems, they<br />

can be used to create the 3D image right away. In addition, the system<br />

can import maintenance calendars and other information from<br />

ASM machines such as manuals, job cards or checklists, and it does<br />

most of this automatically. This saves many hours of manual labor. If<br />

graphical templates cannot be imported from third-party equipment,<br />

they can be created with the software. For additional thirdparty<br />

machine data, a wide range of import options is available.<br />

After their data has been entered, fabLIVE can describe and depict<br />

all machines in detail with their location coordinates and their length<br />

and width dimensions. This alone would be nothing special – it’s the<br />

networking component that makes the difference.<br />

Via communication interfaces like ASM OIB or IPC-CFX, fabLIVE<br />

can now collect, filter and compile all available operating data from<br />

the machines, whether they are made by the company or someone<br />

else. The end product is an exact screen copy of the factory with<br />

maintenance relevant current production data in real time. In addition,<br />

many widgets for creating reports, charts or bills of materials<br />

can be assigned to tools, areas, or entire plants. Their display can be<br />

configured with great flexibility dashboards for specific user groups.<br />

Each machine’s status at a glance<br />

Traffic light colors indicate each machine‘s status within the production<br />

line. A click on the digital twin of a certain machine may deliver<br />

additional information, such as sensor data, job or work-in-progress<br />

data, information about operators or maintenance intervals, as well<br />

as key performance indicators (KPIs) such as utilization, productivity,<br />

Intelligent solutions for the<br />

integrated Smart SMT Factory<br />

First-class machines are an indispensable prerequisite for efficient<br />

SMT production. To support electronics manufacturers on the road to<br />

the integrated Smart Factory, ASM also offers top-grade, flexible and<br />

comprehensive software solutions and services for networking, optimizing<br />

and automating central workflows that allow customers and<br />

partners to realize significant improvements in productivity, quality<br />

and flexibility.<br />

In line with this philosophy, ASM invested in 2018 the Portuguese<br />

software specialist Critical Manufacturing, one of the leading suppliers<br />

of MES solutions in <strong>Europe</strong>. The modular, integrated solution<br />

from MES was designed from the start for the Industrial Internet of<br />

Things (IIoT), mobile devices, and automation and sensor technologies.<br />

Also unique in the field are the implementation of augmented<br />

reality and the ability to create a digital twin of the entire production<br />

environment. Its functional scope and the ability to introduce the system<br />

in stages make the Critical Manufacturing MES a veritable Industry<br />

4.0 hub that is unsurpassed in the field.<br />

<strong>EPP</strong> EUROPE April 2020 43


PCB + ASSEMBLY<br />

When the AR device is pointed towards the machine, it can display various<br />

KPIs, maintenance schedules, instructions, and a whole lot more.<br />

throughput, and a whole lot more. The system can also generate reports<br />

on the overall equipment effectiveness (OEE), historical data<br />

and material tracking data, as well as alarm analyses based on location,<br />

department or features.<br />

All these functionalities make it possible to monitor lines without<br />

having to be physically present on site. The clear display of current<br />

output data, pending maintenance activities or necessary assists as<br />

well as of trouble information broken down by location, type or<br />

scope provides a comprehensive overview – anytime and anywhere.<br />

And the consideration of preprogrammed fixed maintenance<br />

intervals paired with units produced, machine runtimes and<br />

other parameters, makes it possible to plan and schedule maintenance<br />

operations in accordance with the actual production numbers.<br />

Real-time communication<br />

Through fabLIVE, the Equipment Center software does not only<br />

centrally keep track of the status and maintenance history of each<br />

machine, but the user can also see feeder availability and locations,<br />

including those that have been sent out for repairs. For example,<br />

the software can show the individual feeder status – another way to<br />

prevent any negative impacts on throughput, yield or quality by minimizing<br />

the reaction time from the start.<br />

Source: ASM Assembly Systems GmbH & Co. KG<br />

Modular for more functions<br />

Thanks to the modular architecture of the solution packages from<br />

Critical Manufacturing, the functional scope of fabLIVE can be expanded<br />

quickly and easily, for instance with the implementation of<br />

bi-directional communication for interlocking by using further modules.<br />

For example, with the addition of augmented reality (AR), operators<br />

can receive maintenance and status data along with other information<br />

on their mobile devices when they stand in front of the<br />

machine. The camera recognizes the machine and calls up its stored<br />

information along with current production data. That way, data does<br />

not have to be requested and sorted individually, all of which takes<br />

time, but is displayed specifically for each user. Since AR enables<br />

each user to see in detail what needs to be done and how, even less<br />

experienced employees can perform many duties right away. While<br />

most suppliers still use AR mainly for maintenance instructions,<br />

Critical Manufacturing employs the technology to give users much<br />

deeper insights into the production environment.<br />

Immediate user benefits<br />

The Equipment Center together with the module fabLIVE makes<br />

factories transparent from day one because maintenance relevant<br />

machine data is available in real time. The software thus represents<br />

a major step towards the integrated Smart Factory. And since it is<br />

browser-based, the virtual twins can be viewed and analyzed on<br />

desktops or mobile devices without the need to install special software.<br />

The information is customized for specific user groups such<br />

as service technicians or production managers. The resulting support<br />

for predictive maintenance shortens response times dramatically,<br />

minimizes downtime, reduces the communication effort, and<br />

improves the performance.<br />

www.asm-smt.com<br />

Zusammenfassung<br />

Der Artikel zeigt, wie mittels einer umfassenden, modularen Lösung<br />

die Planung und Durchführung von Wartungsaktivitäten nach dem<br />

Ansatz einer agilen Produktion optimiert werden kann.<br />

Résumé<br />

L’article montre comment une solution modulaire complète permet<br />

d’optimiser la planification et la réalisation d’opérations de maintenance<br />

selon le principe de la production agile.<br />

Резюме<br />

В статье рассказывается о том, как комплексное модульное<br />

решение может помочь при оптимизации планирования и<br />

работ по техобслуживанию в соответствии с концепцией<br />

гибкого производства.<br />

44 <strong>EPP</strong> EUROPE April 2020


PRODUCT UPDATES<br />

PCB + ASSEMBLY<br />

Automated production equipment<br />

IPTE, a supplier of automated production<br />

equipment for the electronics and mechanics<br />

industry, has had a strong focus on technologies<br />

that are efficient with robust processes,<br />

as well as maximum flexibility.<br />

Their product portfolio reaches this focus, especially<br />

with the depaneling system Flex-<br />

Router II, the automated test cell, the laser<br />

marker FlexMarker II, the EasyTest Handler<br />

ETH and the Multi-Functional Test Handler<br />

MFT as well as some necessary conveying<br />

equipment from their EasyLine that can interconnect<br />

to a large variety of other suppliers’<br />

process equipment.<br />

The Flex Router II and the automated test cell<br />

are integrated into the company’s new production<br />

cells. These cells are built on a modular<br />

and scalable basis. Another part of the<br />

new design is the optimized layout inside the<br />

cells. This offers an increased user-friendliness<br />

and a better access to all parts of the<br />

machines. The handling of these production<br />

cells is even better for service and reequipping.<br />

Besides the standard processes like dispensing,<br />

milling and mounting, a lot of other<br />

functionalities can be built into these cells.<br />

Depaneling solution<br />

The FlexRouter II, globally tried and tested in<br />

numerous applications offers flexible, cost-efficient<br />

and fully automated depaneling with<br />

milling and/or sawing. It is aimed especially<br />

for middle to high volume production lots featuring<br />

a high variety of different PCB versions,<br />

these are the demanding high mix depaneling<br />

tasks based on short machine set-up procedures.<br />

Despite the small footprint (machine<br />

width is only one meter), boards with sizes of<br />

up to 330 mm x 500 mm can be processed<br />

without difficulties. Four of the seven ma-<br />

chine axes in total are integrated as precise<br />

linear drives of latest technology.<br />

Laser marking system<br />

The FlexMarker II is an even more efficient<br />

successor to the laser marking system, Flex-<br />

Marker. A unique feature of this advanced machine<br />

is the integrated electrical flip unit with<br />

PCB thickness compensation (option) so the<br />

work piece can be laser-marked on both surfaces.<br />

This automated compensation results<br />

in an always-in-focus laser beam – independent<br />

of the PCB thickness. A board warpage<br />

correction is being offered as an option as<br />

well. Flipping of the PCB is done without prior<br />

moving the laser to a secured area, resulting<br />

in a handling time less than one second.<br />

Test handler<br />

In-Circuit- or functional-test as well as programming<br />

processes can be inline automated<br />

with the easy test handler, ETH. It is<br />

practical for the use with single- circuit<br />

boards, multiple boards or corresponding carriers<br />

for circuit boards. Both, one- or doublesided<br />

fixtures can be realized. The fixtures<br />

can be changed quickly and easily. For optional<br />

parallel use of more than one test<br />

handler, it can be equipped with a bypasssegment.<br />

This allows a constant production<br />

process, which is not interrupted by the testing<br />

process. Moreover, the bypass can be<br />

used to optimize the cycle time.<br />

Multi-functional test handler<br />

The multi-functional test handler, MFT, is a<br />

handler for performing in-circuit tests and<br />

functional tests on PCBs that are routed<br />

through the handler on transport belts. The<br />

most important benefit is its concept: The<br />

modular design of the MFT offers multifunctional<br />

possibilities for test handling.<br />

The Flex Router II and the automated<br />

test cell are integrated into the company’s<br />

new production cells, which are<br />

built on a modular and scalable basis.<br />

Board-handling program<br />

The EasyLine program for board-handling of<br />

PCBs or ceramic substrate (hybrid-) boards<br />

can be easily integrated into production lines<br />

and processes. EasyLine modules are available<br />

in the transport sizes small (300 mm),<br />

medium (500 mm) or large (600 mm).<br />

Autonomous test cell<br />

The autonomous test cell is setup to unload<br />

PCBs from magazines, transport them to a<br />

test cell and to return them to either the<br />

“pass” or “fail” magazine depending on the<br />

test status. Magazines are exchanged by<br />

using IPTE’s AIV to unload or load magazines<br />

to the MLL/MLU 3P.<br />

Source: IPTE<br />

www.ipte.com<br />

Source: IPTE<br />

The conveying equipment from EasyLine can interconnect to a variety of other suppliers’ process equipment.<br />

<strong>EPP</strong> EUROPE April 2020 45


PCB + ASSEMBLY<br />

Digitally connecting the entire operation<br />

Improving productivity with automated<br />

materials management<br />

In electronics manufacturing, the cost of materials can easily represent around 90 %<br />

of the cost of the product or 80 % of an EMS factory’s expenses. The most important<br />

costs that can be controlled are the investment cost of excess inventory, the cost of<br />

space needed to store the materials, and the cost of additional logistics operations<br />

required to manage and move materials. Lost production time is an additional cost<br />

caused by the lack of control of material inventory.<br />

An effective automated material management system can improve productivity<br />

in electronics manufacturing operations, while reducing scrap and rework<br />

issues.<br />

The core issue with today’s legacy materials management systems<br />

is that there is no single responsibility to manage all materials<br />

in the supply chain across the whole operation. Traditional enterprise<br />

resource planning (ERP) systems generally cannot track<br />

materials effectively once they are moved to the production area,<br />

causing inefficient planning and ultimately costing money.<br />

One of the key principles behind the innovation of Industry 4.0 is<br />

flexibility of planning, quickly adjusting production rates to meet<br />

changing demands from the customer. What is needed is a single<br />

point of management and accountability of all materials, no matter<br />

what they are or where they are, that is automated and digitally connected<br />

throughout the operation.<br />

First steps to improving material management<br />

Keeping track of inventory is a challenge in itself. Materials are received<br />

and stored in warehouses before allocation to production.<br />

Different materials may be stored in different warehouses depending<br />

on the type of material and the time it will be needed. Some materials<br />

that are located are on the shop floor to accommodate bulk<br />

delivery of a few high-use materials or to support an area of nonstandard<br />

self-contained production, such as for new product introductions<br />

and small lot sizes.<br />

The production area may include family setups, materials stored on<br />

feeders or on trolleys, and moisture-sensitive materials that need<br />

special handling, such as baking, and all of it needs to be accounted<br />

for in the overall inventory management system.<br />

Source: Siemens Business<br />

For inventory to be accurate, timely consumption information needs<br />

to be fed back to ERP so that the count of materials available recorded<br />

by ERP matches the physically available material. Only by<br />

keeping these records up to date can the orders and deliveries be<br />

on time and accurate.<br />

What about unmanaged, partly used materials that accumulate on<br />

the shop-floor once work-orders are completed? They also must be<br />

included in the inventory management system with accurate data<br />

on how much material remains on each reel so that they can be<br />

quickly and effectively re-allocated.<br />

In traditional manufacturing, ERP pushes materials to the shop-floor<br />

according to the master factory plan. The materials often are unmanaged<br />

and invisible in the supply-chain until a record of consumption<br />

is returned, calculated by counting the number of products<br />

made multiplied by quantities per product according to the original<br />

production bills of materials (BOM).<br />

Legacy factory operations can immediately save money and time by<br />

optimizing their control of materials using lean, just-in-time (JIT)<br />

Zusammenfassung<br />

Nachdem die Materialkosten in der Elektronikfertigung einen sehr<br />

hohen Anteil der Produktkosten ausmachen, wird durch Beispiele<br />

gezeigt, wie lohnenswert die Investition in ein neues Materialverwaltungssystem<br />

ist.<br />

Résumé<br />

Alors que les frais de matériaux représentent une part très importante<br />

du coût des produits dans le secteur de la production de<br />

composants électroniques, des exemples mettent en lumière l’intérêt<br />

d’investir dans un nouveau système de gestion des matériaux.<br />

Резюме<br />

Поскольку материальные затраты в значительной мере<br />

отражаются на стоимости электронной продукции, в статье<br />

приводятся примеры, показывающие, насколько выгодно<br />

инвестировать в новую систему управления материальными<br />

ресурсами.<br />

46 <strong>EPP</strong> EUROPE April 2020


PCB + ASSEMBLY<br />

Optimizing material<br />

inventory will not only<br />

be cost effective, but it<br />

will also increase<br />

productivity as all<br />

information is known<br />

about materials in the<br />

process.<br />

Source: Business Siemens<br />

manufacturing practices. A lean “pull” signal can be derived directly<br />

from the machine operation, which means that kits of materials do<br />

not have to be prepared in advance; instead, all necessary materials<br />

remain in the warehouse ready for selection for immediate use on<br />

the machines and other processes.<br />

An automated pull system knows what the manufacturing process<br />

is currently producing, because it is linked to the bill of materials.<br />

Work-orders, derived from ERP, are managed at the machine level.<br />

In an automated, comprehensive, and digital material management<br />

system, work-orders are set up for each instance of production of a<br />

certain quantity of a product. The machine program, setup and<br />

execution data, and documentation are assigned at each step in<br />

each work-order.<br />

In this way, the exact routing of a work-order through multiple processes,<br />

each with their own execution instructions, can be known in<br />

real-time, including estimated start times, quantities, and run-times.<br />

The sequence of work-orders that will be executed can be viewed<br />

and tracked, which means the materials required for the current<br />

product in the current work-order are as well. With this, planning<br />

can be done accurately for changeovers that will take place for future<br />

products.<br />

Verification of materials during the logistics process can also be<br />

done during the setup of materials on the machines. An automated,<br />

digital management system prevents the machine or any other process<br />

from working until all of the materials have been correctly set<br />

up, according to the requirement defined in the work-order. Unique<br />

material IDs and their associated attributes are verified against the<br />

assigned setup that is derived from the work-order.<br />

This is far more comprehensive than simply checking the part<br />

number as done by many other solutions. For example, the MSD<br />

status is also checked, providing a warning and if necessary, preventing<br />

the machine execution, if contamination is likely to happen.<br />

This type of advanced verification process ensures that no mistakes<br />

in the materials setup are made, improving product quality performance<br />

while reducing scrap and re-work issues caused by incorrect<br />

material placement.<br />

The final essential piece of information required for automatic JIT<br />

delivery of materials to work is a live, networked interface tying together<br />

the machine processes, through which the progress of production,<br />

in terms of the number of PCBs produced, is communicated<br />

in real-time, along with the actual usage and spoilage of each<br />

of the materials.<br />

Material dashboards are used to better monitor and optimize inventory, while providing key metrics and guidelines.<br />

Source: Siemens Business<br />

<strong>EPP</strong> EUROPE April 2020 47


PCB + ASSEMBLY<br />

Materials management and connectivity<br />

Materials management can be tied easily into the Valor IoT Manufacturing<br />

hardware and software platform that connects machines<br />

from a wide variety of vendors and platforms to gather factory floor<br />

and operations data accurately in real-time, including from machines<br />

or manual processes that do not have a digital connection to the<br />

network.<br />

Material delivery between workstations, including bare-boards,<br />

semi-assembled products, and finished goods, can be fully automated.<br />

Factories can adapt to high-mix/low-volume manufacturing<br />

by moving from “traditional” linear assembly lines to manufacturing,<br />

based on dynamic cells where products “hop” between cells<br />

as required. The solution integrates with smart shelves, material<br />

towers, and automatic guided vehicles (AGVs).<br />

Integrating manufacturing analytics for materials<br />

Integrated with business analytics, materials management can provide<br />

key metrics and operative guidelines to help improve profitability<br />

with dashboards, reports, and AI. Material insights can be<br />

extracted from the data and used for quoting, procurement, and<br />

supply-chain optimization. For management, material dashboards<br />

also can be used to better monitor and optimize inventory.<br />

Traceability<br />

Traceability and compliance are a valuable component of the materials<br />

management system. For example, this includes providing information<br />

on the date and time a reel is placed in and taken out of<br />

the machine, quantities of components used for a reel, and the date<br />

and time that a PCB assembly leaves the last machine.<br />

Keeping track of all materials in current use is beneficial for the planning<br />

of future changeovers, in order to reduce changeover time.<br />

A digital material management system puts these pieces of information<br />

together to create the live just-in-time logistics schedule<br />

for materials to be selected from the warehouse and delivered to<br />

the machines, so that the right quantity and quality materials arrive,<br />

right on time.<br />

Overcoming challenges today, and for the future<br />

Let’s take a look at some specific challenges that can be addressed<br />

by an automated, digital solution such as Valor Materials Management.<br />

This is not only still available in the Valor Manufacturing Solutions<br />

suite of products, but it is now also available as part of<br />

Siemens Opcenter Execution Electronics solution for comprehensive<br />

electronics manufacturing management. These solutions have<br />

been proven to save money and time, as well as improve productivity<br />

in electronics manufacturing operations around the world.<br />

Source: Siemens Business<br />

Some real-world examples<br />

Stories from customers illustrate dramatically how optimizing material<br />

management can make a huge difference for a manufacturer.<br />

In one instance, a Chinese telecom factory decreased changeover<br />

time from an average of 150 minutes to an average of 40 minutes,<br />

and its PCB output increased from 240 to 305 PCBs per hour using<br />

the automated materials management solution.<br />

In Japan, a factory increased machine working time by 20 % due to<br />

changeover, as well as significant cost savings per year. Their<br />

changeovers took 45 to 100 minutes, which was reduced to 12.5<br />

minutes on average, with about 15 changeovers per day. After some<br />

time with the implementation, they reported further increase of productivity<br />

and high machine investment savings. Machine working<br />

time improved by going from 22-hour production with three shifts to<br />

16 hours with two shifts. They were able to increase line utilization<br />

from 72 to 91 %, reduce SMT inventory by 15 %, remove most of<br />

the shop-floor material storage, and let the operators focus on increasing<br />

quality.<br />

These examples show how upgrading to a legacy materials management<br />

system is a good investment, now and for manufacturing<br />

in the future, building in some needed business security as the global<br />

electronics market and supply chains are shifting and changing.<br />

www.mentor.com<br />

Sagi Reuven is a mechanical<br />

engineer who holds an MBA<br />

and is experienced in Mentor<br />

Graphics layout design and<br />

simulation products. Before<br />

joining Mentor, A Siemens<br />

Business, he was the CEO and<br />

co-founder of a medical device<br />

company in the retinal imaging<br />

sector and consulted for other<br />

start-up companies. Sagi is a<br />

part of the Siemens OpCenter-<br />

Valor business development<br />

team focused on electronics<br />

manufacturing.<br />

Source: Siemens Business<br />

48 <strong>EPP</strong> EUROPE April 2020


PRODUCT UPDATES<br />

PCB + ASSEMBLY<br />

Complete range of selective soldering systems<br />

Nordson Select, a Nordson company, a global<br />

provider of selective soldering systems,<br />

showcased a complete lineup of innovative<br />

selective soldering systems at the 2020 IPC<br />

Apex Expo. A complete range of selective<br />

soldering systems were featured, including<br />

the Integra 508.3, the Integra 103ILD, the<br />

Cerno 103IL, the compact Cerno 300S, and<br />

the FX-942 automated solder inspection system.<br />

The Integra 508.3 is a multi-station selective<br />

soldering system designed for high-volume<br />

applications with maximum throughput. With<br />

its flexible configuration, this system is a versatile<br />

selective soldering platform and can be<br />

equipped for either single, parallel or double<br />

processing. When configured with dual dropjet<br />

fluxers and dual solder pots, the Integra<br />

508.3 can solder two boards at the same<br />

time in each soldering station. When operated<br />

in the parallel mode, it can process up to<br />

six boards at one time significantly increasing<br />

machine productivity.<br />

The Integra 103ILD is a dual pot selective soldering<br />

system and features the company’s<br />

automatic solder nozzle tinning system<br />

which un-like other nozzle cleaning systems,<br />

does not spray an adipic acid, or a liquid or<br />

powdered flux. The Cerno 103IL is equipped<br />

with standard features including interchange-<br />

Source: Nordson Select<br />

able solder pots and pumps compatible with<br />

tin-lead, lead-free and HMP solder alloys. It<br />

comes standard with an automated fiducial<br />

location and correction system that provides<br />

single click fiducial teach capability, seamless<br />

fiducial recognition and true automated alignment<br />

and skew correction of a printed circuit<br />

board.<br />

Also, on display was the compact Cerno<br />

300S, which features combined fluxing, preheating<br />

and selective soldering offering exceptional<br />

value and superior process control<br />

and is suited for prototype, small batch production<br />

or cell manufacturing requirements.<br />

The company‘s FX-942 automated solder<br />

joint inspection system was on display showcasing<br />

its dual-sided optical inspection capability<br />

of plated through-hole, SMT and PCB<br />

inspection. The FX-942 can be paired with<br />

any of the company’s in-line selective soldering<br />

system and provides the ideal solution to<br />

ensure optimum solder joint integrity.<br />

www.nordsonselect.com<br />

Source: Nordson Select<br />

The Integra 508.3<br />

is a multi-station<br />

selective soldering<br />

system designed<br />

for high-volume<br />

applications.<br />

The Integra 103ILD is a dual pot selective soldering<br />

system with a solder nozzle tinning system.<br />

Source: KIC<br />

Making CFX implementation a reality<br />

KIC was a factory line participant in the<br />

CFX line running live at the recent IPC<br />

Apex Expo. Visitors were able to visit an integrated<br />

CFX line to learn more about this<br />

standard. Any company can begin live data<br />

collection and analytics. KIC, a member of<br />

the CFX committee, is a CFX supporter<br />

KIC took part at this year’s CFX line running live at the recent IPC Apex Expo.<br />

and equipment supplier. Industry 4.0, Smart<br />

Factory, connectivity is now a common part of<br />

the conversation about improving the manufacturing<br />

enterprise. However, there is still<br />

today much confusion and uncertainty. This is<br />

why IPC’s new standard 2581, CFX 2–17–<br />

Connected Factory Exchange was designed.<br />

MB Allen, Manager of Application and<br />

Sales, stated: “CFX offers companies the<br />

tools to begin collecting data on a smaller<br />

scale at a low price. They may evaluate<br />

what data is useful and then step through<br />

the parts of their manufacturing process<br />

little by little instead of spending so much<br />

money on large projects and then figuring<br />

out what to do with all the data. Now, they<br />

can make smart choices and reap the<br />

benefits, such as: immediate corrective action,<br />

consistent high quality, production<br />

planning lower production costs – higher<br />

profits, more competitive operations and<br />

happy customers.”<br />

This standard offers the lowest cost to<br />

entry and lowest risk solution for implementation<br />

of Smart Factory. The company<br />

offers the tools to provide all the product<br />

data during the reflow process.<br />

www.kicthermal.com<br />

<strong>EPP</strong> EUROPE April 2020 49


PCB + ASSEMBLY<br />

No longer just an option<br />

The need for traceability in<br />

electronics manufacturing<br />

Complete and accurate traceability is no longer optional in electronics<br />

manufacturing. The nature of this ever-changing, fast paced, reactive<br />

environment requires a robust traceability solution to help manufacturers<br />

better manage the production environment by making detailed material,<br />

product and process information readily available.<br />

Electronics manufacturing requires a traceability solution to help companies better manage the production environment. Up: Uartonica area under Clean-Room ISO8.<br />

Source: Uartronica Electronica<br />

While a thorough traceability system should be required for<br />

every electronics manufacturer, it’s not something regulated<br />

industry wide. Rather, these requirements are currently customerdriven<br />

or specific to certain safety-critical markets such as products<br />

for the automotive, aerospace or medical sectors.<br />

Why traceability in <strong>Europe</strong>?<br />

With billions of dollars of goods in the electronics manufacturing<br />

supply chain alone crossing the oceans and skies daily, we’re in a<br />

world where visibility and quality tracking is a necessity. As consumers<br />

in day to day purchasing, tracking and visibility of online purchases<br />

is automatically expected. So, why shouldn’t these expectations<br />

be held as well for circuit board manufacturing? It’s only a<br />

matter of time before more and more end customers are requiring<br />

detailed traceability analysis of their product’s entire production process.<br />

In the <strong>Europe</strong>an region, most electronics manufacturing is geared<br />

toward building high-quality goods for automotive, medical, consumer,<br />

and telecommunications industries. Many of these products<br />

cannot afford to go out into the field with a single defect – a minor<br />

issue in an automotive or medical product could have dire consequences<br />

to its end-user. Because of these stringent quality requirements,<br />

many <strong>Europe</strong>an-based electronics manufacturers must offer<br />

a robust traceability system in order to beat the competition and<br />

keep customers.<br />

Generally speaking, <strong>Europe</strong> is a bit ahead of the curve in terms of<br />

technological advancements, specifically related to Industry 4.0 and<br />

IIoT initiatives for manufacturing. Industry 4.0 was born in Germany,<br />

so early adoption of Smart Factory principles organically spread in<br />

nearby <strong>Europe</strong>an countries. Even culturally, <strong>Europe</strong>an-made products<br />

are associated with a better reputation than those manufactured<br />

elsewhere. Whether or not this perception is valid can be argued,<br />

but the fact remains, <strong>Europe</strong>an-made products typically<br />

garner a higher price tag.<br />

Thanks to this technologically centric mindset, automotive manufacturers<br />

are naturally drawn to have their goods assembled in this region.<br />

Not only do OEMs seek out EMS providers with the appropriate<br />

quality certifications, but they also need a manufacturer leveraging<br />

the latest traceability technology.<br />

Within the high-tech regions of Western <strong>Europe</strong>, electronics manufacturers<br />

have the added burden of a highly competitive labor market.<br />

Labor doesn’t come affordably in most <strong>Europe</strong>an countries, and<br />

50 <strong>EPP</strong> EUROPE April 2020


these manufacturers typically have to spend more in order to both<br />

recruit and retain a proficient workforce. With a higher spend on<br />

wages, these same manufacturers need to find other ways to help<br />

reduce cost and remain competitive.<br />

Additionally, many <strong>Europe</strong>an based manufacturers also rely on a<br />

higher level of automation throughout the manufacturing process.<br />

With more of an emphasis on automation, these manufacturers<br />

lean on their traceability solution to ensure quality and optimize both<br />

efficiency and cost.<br />

“… <strong>Europe</strong>an-based manufacturers deal with higher labor costs and<br />

struggle to reduce operational costs; so, either by helping in reducing<br />

the universe of potentially defective product or by helping in<br />

finding the root cause for the defect itself, traceability is a fundamental<br />

tool to keep costs low and remain competitive,” commented<br />

Rui Vidal, Technical Advisor at Uartronica Electronica, a Portugese<br />

EMS provider specializing in electronics manufacturing for the automotive<br />

and telecommunications industries.<br />

What is traceability?<br />

A misconception in our industry has focused on material traceability<br />

alone. But material traceability isn’t all that’s required when we talk<br />

about traceability in SMT manufacturing. Without also verifying detailed<br />

process and product information, material traceability is a<br />

small Band-Aid when a more rigorous healing regiment of a full cast<br />

and physical therapy is needed.<br />

A proven traceability solution will equip manufacturers with detailed<br />

reporting of the complete production process – who touched the<br />

product and when it was in process, what operations and equipment<br />

it went through and how that process transpired, what materials<br />

were used and where they came from – showing end-customers<br />

why they can trust in the quality produced. Anything less isn’t a<br />

complete traceability solution.<br />

A robust traceability application proves a thorough quality management<br />

system – allowing end-users to trust that the products they receive<br />

will work correctly. Additionally, in the case of an unforeseen<br />

Smart Support<br />

during<br />

Corona Crisis<br />

Remote Support 24/7 - even in<br />

challenging times<br />

IPTE remains available to you, even in these<br />

particularly uncertain times. The IPTE service<br />

hotline is open for you at all times 24/7.<br />

Personal service assignments of IPTE service<br />

on site are still possible, if this is still allowed<br />

by the local authorities. However, if it is not<br />

allowed to appear in person, we support you<br />

intensively with remote maintenance systems.<br />

We can log-in into your machines at any time<br />

via remote maintenance systems such as<br />

TeamViewer. We have also the option to<br />

support you with the new IPTE Smart Support<br />

app. Only your smartphone or tablet is<br />

required and downloading the app takes<br />

only one minute.<br />

Zusammenfassung<br />

In der heutigen, sich schnell wandelnden Welt der Elektronikfertigung<br />

ist eine vollständige Traceabilitylösung mit detaillierter Rückverfolgbarkeit<br />

des kompletten Produktionsprozesses einschließlich<br />

Material-, Produkt- und Prozessinformationen unabdingbar.<br />

Résumé<br />

Au vu des évolutions rapides auxquelles est confronté actuellement<br />

le secteur de la fabrication de composants électroniques, il<br />

est indispensable de disposer d’une solution complète offrant un<br />

suivi détaillé de l’ensemble du processus de production ainsi que<br />

des informations sur les matériaux, les produits et les processus.<br />

Резюме<br />

В современном быстро меняющемся мире электронного<br />

производства важное значение имеет полная<br />

прослеживаемость всего производственного процесса, в т. ч.<br />

информации о материале, продукте и технологическом<br />

процессе.<br />

IPTE service available 24/7<br />

Personal Service Assignments<br />

Remote Maintenance Login<br />

IPTE Smart Support App<br />

Contact Us<br />

24/7 Service Hotline:<br />

Tel: +32 89 623 100<br />

For all new service package<br />

requests send an inquiry to:<br />

tibor.pagacs@ipte.com<br />

Tel: +49 152 04763879<br />

You can find all contact<br />

details on our website<br />

www.ipte.com<br />

<strong>EPP</strong> EUROPE April 2020 51


PCB + ASSEMBLY<br />

product warranty claim, traceability data can help find, mitigate and<br />

correct the root cause issue. And crucially, in the unfortunate event<br />

of a product recall, a strong traceability solution can narrow down<br />

the scope to necessary units, potentially saving an OEM millions of<br />

dollars.<br />

“Traceability will support your toughest decisions and help you with<br />

your toughest challenges,” commented Mr. Vidal. “It’s like an allround<br />

insurance you will use systematically to overcome difficulties,<br />

reduce costs, and find ways to improve.”<br />

Most importantly, a traceability solution protects both business and<br />

brand by mitigating the risk of any type of recall. This keeps important<br />

names out of the media for a public product recall, which causes<br />

embarrassment. Remember the car manufacturer, Saturn? Probably<br />

not, because they had too many unnecessary recalls.<br />

“Traceability will support your<br />

toughest decisions and help you<br />

with your toughest challenges,”<br />

commented Mr. Vidal.<br />

“Traceability is a mandatory tool,<br />

you must use it to be able to play<br />

the game,” said Mr. Vidal.<br />

Traceability data<br />

How a traceability solution is built and collects information is critical<br />

to the overall success. Anyone can create aesthetically pleasing traceability<br />

reports to send to end-customers, but is the data accurate?<br />

Is it easy to collect? Does it reflect what actually happened?<br />

Does it require an engineer to review and make adjustments?<br />

A traceability solution should be powered by a strong connectivity<br />

and data management infrastructure. At the base level, connectivity<br />

to all of the machines used in production is a necessity, and the system<br />

must be able to harvest this machine data in real-time to automatically<br />

record everything that happens to the product.<br />

Considering SMT manufacturing moves at such a fast-paced, everchanging<br />

dynamic, all fed data should be managed by a reliable and<br />

scalable database that quickly and efficiently processes, stores and<br />

shares large volumes of data. With granular data automatically fed<br />

into a traceability application, precise reports of the production processes<br />

as well as materials used and consumed will be instantly<br />

available in a web-application with a single click of a button.<br />

Traceability: make or buy?<br />

Many of the potential customers are currently facing internal company<br />

disagreements amongst management as to whether it would<br />

be better to buy a traceability solution from a trusted third-party provider,<br />

or to make a custom traceability solution in-house.<br />

To keep this simple, buying is the best option.<br />

Playing devil’s advocate by taking an imaginary journey to build an<br />

internal traceability solution, the following questions should be<br />

asked: Are there four full-time employees available to be fully dedicated<br />

to this project? Is it a guarantee that they will be around to<br />

see this project to completion? And will they remain for the long<br />

term to maintain and update the system in response to evolving<br />

customer requirements for years to come? Do they have IT/code<br />

writing experience, the skills necessary to develop a scalable enterprise<br />

platform that will meet all current and future needs? Is all machine<br />

data easily accessible, especially in a format that is readable?<br />

How about a web-based reporting application to easily share with all<br />

customers?<br />

Developing a traceability solution in-house and from scratch is not<br />

only a major time and financial investment, but an additional liability<br />

risk to a company. The longer it takes to build a system internally,<br />

the more time lost to close deals with customers and expand market<br />

share. Furthermore, what if the system turns out to be less reliable<br />

than anticipated? A loss of traceability data will not only cause<br />

chaos to production and booked orders, but it could also cause established<br />

customers to leave.<br />

Off-the-shelf, proven solutions do exist for traceability in SMT manufacturing.<br />

Choosing a modular and flexible solution that can be up<br />

and running in a matter of months, that also offers long-term support<br />

and maintenance can be done. A third-party vendor that offers<br />

traceability within a larger connectivity and data management ecosystem<br />

can be considered, in order to easily expand to other products<br />

to improve manufacturing analytics and intelligence. The focus<br />

for internal talented resources should be on adding value instead of<br />

wasting energy on learning machine data code, and how to create<br />

complex databases and reports.<br />

In conclusion<br />

Traceability is a requirement, not a “nice-to-have”, and it’s not as<br />

simple as tracking material.<br />

“… most customers across all fields of activity require EMS providers<br />

to trace materials and process down to PCB level,” commented<br />

Mr. Vidal. “It’s a mandatory tool, so you must use it to be<br />

able to play the game.”<br />

A complete traceability solution will include detailed and accurate<br />

tracking and reporting of the entire production process including<br />

material, product and process information. The perfect solution will<br />

also easily complement existing systems. Be wary of a complete<br />

overhaul – instead it is advised to look for a third-party provider<br />

that’s willing to offer scalable and modular options to manufacturing<br />

tools.<br />

“For sure, one can forget the idea of managing a (manufacturing)<br />

business without traceability. It’s just not possible,” added Mr. Vidal.<br />

Cogiscan was one of the first software companies in the SMT industry<br />

to offer traceability to electronics manufacturers. Now recognized<br />

and respected as one of the leading connectivity and track,<br />

trace and control providers, hundreds of plants across the globe rely<br />

on their traceability application.<br />

www.cogiscan.com<br />

Jörg Both is the Sales Application<br />

Engineer at Cogiscan .<br />

52 <strong>EPP</strong> EUROPE April 2020


PRODUCT UPDATES<br />

PCB + ASSEMBLY<br />

Automotive leader invests in solder paste printer<br />

Source: Yamaha Motor <strong>Europe</strong><br />

Production quality meet stringent customer specifications while business<br />

pressures also demand high productivity. To be sure of the best<br />

results from the very beginning of assembly, the company AW, part<br />

of the global Aisin Group, installed two Yamaha YSP solder-paste<br />

printers, aided by Theo Loohuis and his team at <strong>Europe</strong>-SMT, their appointed<br />

sales representative for Belgium, Netherlands and Luxembourg.<br />

After experiencing excellent results, including the outstanding<br />

speed and accuracy of the on-board 2D inspection system, the team<br />

purchased two more YSP printers for other lines in the factory.<br />

AW researches, develops, and manufactures automotive infotainment<br />

systems and electronically controlled automatic transmissions.<br />

The company serves major carmakers that place high requirements<br />

on every unit produced by their partners. The <strong>Europe</strong>an branch builds<br />

the electronic control boards for the systems in-house using surfacemount<br />

assembly lines.<br />

The YSP printer<br />

contains a 2D inspection<br />

that can<br />

inspect the complete<br />

printed<br />

board with minimum<br />

impact on<br />

cycle time.<br />

Investment for quality and productivity<br />

The YSP printer contains advanced features to assist setup and enhance<br />

process control. Leveraging graphical base layer alignment, the<br />

stencil and board are quickly aligned within ± 10 μm (6õ) for perfect<br />

paste on pad. The 3S Swing Single Squeegee head attack angle setting<br />

ensures the perfect filling of stencil apertures and paste-volume<br />

repeatability. Automatic detection of remaining solder-paste quantity<br />

enables fast refill by the Print Stability Control (PSC) system to ensure<br />

constant paste volume and minimise paste loss. In addition,<br />

automatic stencil cleaning keeps the stencil surface clean and apertures<br />

clear to deliver perfect printed boards every time.<br />

Printing quality control with 2D inspection<br />

The printer contains a 2D inspection camera with a large field of view<br />

(30 mm x 22.5 mm) that can inspect the complete printed board with<br />

minimum impact on cycle time. With fast image capturing methods<br />

that leverage unique inspection technology, the complete printing<br />

cycle time including inspection is faster than the mounting cycle<br />

times in each line. The inspection camera has a LED dome containing<br />

three annular rings at different angles, each containing LEDs of two<br />

different colours, to illuminate the complete board without shadows.<br />

At every view, it captures two images with one top light and one side<br />

light. This gives a 2.5D inspection result due to excellent contrast between<br />

the solder paste, the board surface, and the solder pads. Comprehensive<br />

inspection modes include paste positioning, paste volume,<br />

bridging, and excess paste on pad.<br />

By testing the YSP built-in 2D inspection capability against the inline<br />

3D SPI machines already in place, the team at AW <strong>Europe</strong> confirmed<br />

the performance is just as fast and thorough as a dedicated standalone<br />

inspection system. This gave them confidence to rely on the<br />

printer’s 2D camera and inspection system, and save the burden of<br />

running additional SPI machines in the lines.<br />

“2D inspection with the Yamaha YSP printer delivers the same high<br />

level of solder-paste inspection capability as we had before, allowing<br />

us to provide the same, excellent quality assurance,” agrees Ludovic<br />

Anciaux, Senior Operations Improvement Engineer.<br />

Easy access to superior capability<br />

Impressed overall by the simplicity of the acquisition process, supported<br />

by Yamaha and <strong>Europe</strong>-SMT from the first equipment evaluations<br />

and help to choose the most suitable features and options, to<br />

delivery, setup, and operator training, he adds, “The service and support<br />

has been excellent, the equipment was installed and ready to<br />

use extremely quickly, and the machines are so reliable and intuitive<br />

that we have become highly proficient and productive in a very short<br />

space of time. Every experience has confirmed we made the right<br />

decision.”<br />

www.yamaha-motor-im.eu<br />

PRECISION<br />

WITHOUT<br />

LIMITS<br />

Contact solutions<br />

from finest pitches<br />

to highest currents.<br />

<strong>EPP</strong> EUROPE April 2020 53


PCB + ASSEMBLY<br />

Harsh environments and miniaturization are challenging<br />

Evolution of solder paste for<br />

enhanced automotive reliability<br />

Printed circuit board (PCB) assembly continues to evolve under the changing expectations<br />

and trends throughout the electronics industry. It is true now more than ever that<br />

automotive electronics are known for exacting reliability requirements due to harsh<br />

operating conditions and long-life expectancy. Increased automotive electrification and<br />

miniaturization of the chip components are just two evolving industry trends that<br />

necessitate a magnified focus on solder paste reliability.<br />

Andreas Karch, Regional Technical Manager for Germany, Austria, and Switzerland and Claire Hotvedt,<br />

Product Development Specialist for the PCB Assembly business unit, Indium Corporation<br />

Schematic representation of a car and its essential parts.<br />

Source: Indium Corporation<br />

While harsh environment testing requirements have continued<br />

to increase, there have also been broader trends of advancing<br />

electronics density, voltage, and miniaturization. Ensuring end<br />

product reliability necessitates taking all of these changes into account<br />

throughout processing. As a solder manufacturer, Indium Corporation<br />

has seen how the automotive electronics’ trend toward<br />

harsher test conditions has required a few relatively major changes<br />

to the solder paste material itself.<br />

The conditions outlined by the International Electronics Manufacturing<br />

Initiative (iNEMI) as “Elevated harsh” or the even greater “Severe<br />

harsh” have caused a shift away from standard SAC alloys towards<br />

those that are generally considered “high-reliability alloys”<br />

for specific applications. Thermal cycling tests from -40 to +150 °C<br />

replicate extreme operating conditions and ensure good performance<br />

therein. Despite efforts to make high-reliability alloys “drop-in”<br />

solutions, it is important to remember that these alloys are metallurgically<br />

complex. They enable enhanced thermal cycling performance,<br />

although the alloy is not the only variable in the equation. Thermal<br />

cycling can also be impacted by other factors, including the flux<br />

vehicle, component type, surface finish, and processing conditions<br />

among others.<br />

Miniaturization of high impact<br />

A fact that can occasionally be lost in the excitement of drastic innovation<br />

is that there are changes that do not necessarily increase performance<br />

requirements, but steadily increase the challenges of<br />

reaching existing quality and reliability standards. Miniaturization is a<br />

trend that revitalizes “old” necessities related to printing and processing.<br />

The impact of miniaturization is relevant across many applications<br />

due to a shared increase in expectations for electronics. The<br />

expanded everyday use of electronics and its integration into lives,<br />

homes, and vehicles operation and, in turn, are driven by miniaturization.<br />

Familiar metrics can continue to be used– such as area ratio,<br />

print transfer efficiency, and standard deviation– for these soldering<br />

processes, as long as their new context in relation to miniaturization<br />

is understood.<br />

As components shrink, so do their respective stencil aperture sizes.<br />

Reduced aperture areas give rise to more challenging solder printing<br />

Source: iNEMI<br />

Extremely small ferrite beads balanced on the tip of a needle.<br />

Source: Indium Corporation<br />

Standards and terminology for automotive harsh environment categorization.<br />

54 <strong>EPP</strong> EUROPE April 2020


PCB + ASSEMBLY<br />

Influence of thermal aging and flux vehicle on alloy shear strength.<br />

Expected worst-case harsh environment conditions for selected automotive<br />

electronic applications.<br />

conditions. Traditionally, the recommended area ratio (area of the<br />

stencil opening / area of the stencil walls) is greater than 0.66; however,<br />

as component sizes have decreased, that recommendation<br />

has become relaxed.<br />

The current smallest commercial chip (the Murata Manufacturing<br />

Co., Ltd. 008004) is 0.25 mm in length and 0.125 mm in width. The<br />

008004 is cutting-edge technology and its diminutive size is arguably<br />

not an immediate concern to most manufacturers, however,<br />

even the larger 0.4 mm by 0.2 mm 01005 chip requires pushing past<br />

previously definitive boundaries in electronics manufacturing. 01005<br />

chips may have aperture area ratios of approximately 0.5.<br />

Once the end of the 0.66 limit to aperture area ratios is acknowledged,<br />

it is inevitable that materials and processes will be stretched<br />

in the search for the next limit. These limits will continue to be<br />

pushed by varying both the soldering material and the process conditions.<br />

There are two primary constituents to vary and optimize in<br />

solder paste:<br />

• Powder size and distribution<br />

• Flux chemistry<br />

The table represents a printing test including four solder pastes and possible printing conditions.<br />

Printing speed, clamping, support, and aperture size were process variables. Powder size distribution<br />

varied between pastes.<br />

Source: Indium Corporation Testing<br />

Source: International Electronics Manufacturing Initiative (iNEMI)<br />

Demonstrating volume percentage transfer during continuous printing. It is<br />

used to compare solder pastes as well as demonstrate the impact of changing<br />

aperture shape and size.<br />

On the other hand, there are numerous variations to PCBA process<br />

conditions, including, but not limited to:<br />

• Print speed<br />

• Gasketing and clamping<br />

• Squeegee pressure<br />

• Stencil coatings<br />

• Aperture shapes<br />

• Temperature and humidity<br />

Powder size and process capability<br />

The selection of solder powder size distribution is a well-defined<br />

method for improving print performance at reduced aperture ratios.<br />

A Type 4 particle distribution ranges from 20-38 μm in diameter and<br />

for the average application, it is the first paste to be considered.<br />

Every variety following Type 4 is generally an acknowledgment of<br />

some challenging stencil design, aperture area ratio, or built-in processing<br />

restrictions.<br />

A print study was conducted, depicting the values of Cpk (Process<br />

capability index). As expected with decreasing component size and<br />

the associated minimized stencil aperture size, the printing performance<br />

decreased. However, the study also showed that miniaturization<br />

increased the relevance of every other parameter. When printing<br />

a deposit for a 0201 component, all four powder types and all<br />

four printing conditions demonstrated well-controlled processes<br />

with Cpk values over 1.66. There is a flexibility for the 0201 components<br />

because the area ratio is typically at least 0.66.<br />

However, the study also demonstrated that although it may be<br />

necessary at times, changing powder type is not a simple fix in regard<br />

to miniaturization. Without vacuum fixturing support and with<br />

top clamping, even Type 5MC solder paste did not enable consistent<br />

and controlled printing for 01005 components.<br />

The other major component of solder paste–flux–is<br />

somewhat less neatly categorized. Yet, the thixotropic<br />

rheology of flux is still an important attribute to the<br />

solder paste printing performance. Flux composition is<br />

made up of four major categories of materials that control<br />

the chemical activity and physical characteristics of<br />

the solder paste:<br />

• Resins serve both as an oxygen barrier and also as<br />

Source: Indium Corporation<br />

a tacky and viscous component in flux.<br />

• Gelling agents control the viscosity, stability, and<br />

related rheological properties of a paste.<br />

• Activators dissolve oxides and promote wetting as<br />

an active chemical cleaner during reflow.<br />

Source: Indium Corporation<br />

<strong>EPP</strong> EUROPE April 2020 55


PCB + ASSEMBLY<br />

Source: Indium Corporation<br />

The table shows the Cpk<br />

(Process Capability<br />

Index) values of a print<br />

study. As expected with<br />

decreasing component<br />

size and stencil aperture<br />

size, the printing performance<br />

decreased.<br />

• Solvents dissolve the resins, gelling agents, and activators to ensure<br />

a homogeneous flux vehicle for solder paste.<br />

The challenge regarding solder flux selection is the potential to affect<br />

many other processing steps beyond print transfer efficiency. The<br />

different constituents within flux chemistry may be optimized for<br />

other characteristics, such as low- or high-temperature reflow, low<br />

voiding, stability, and surface insulation resistance (SIR) performance.<br />

Modern no-clean fluxes have improved to the point where<br />

they can generally be optimized for a specific performance metric<br />

and also retain good rheology for print performance. However, it is<br />

worth remembering that as aperture sizes shrink, previously negligible<br />

differences become more noticeable and significant.<br />

Flux characteristics other than print performance can also be impacted<br />

by the changes in electronics’ density. In particular, SIR performance<br />

challenges are complicated as low-standoff components<br />

become more common. The components may not be as noticeably<br />

impacted by the printing process, but they carry an increased risk of<br />

corrosion due to retained flux solvent at the narrowed underside.<br />

Enhanced SIR expectations beyond J-STD-004B have already become<br />

relevant due to a separate trend of increasing voltage in automotive<br />

power-train electronics. Both changes–the trapped solvent<br />

and increased voltage–increase the risk of electrochemical migration<br />

and dendritic growth.<br />

Zusammenfassung<br />

Die Anforderungen in der Automobilelektronik steigen ständig und<br />

der Auswahl der Lotmaterialien kommt höchste Bedeutung zu. So<br />

dürfen Lotpaste, Flussmittel sowie Fertigungsprozess die Zuverlässigkeit<br />

der Automobil-Baugruppen, in denen auch höhere Spannungs-<br />

und Strompegel verarbeitet werden, keinesfalls beeinträchtigen.<br />

Résumé<br />

Alors que les composants électroniques pour les automobiles sont<br />

soumis à des exigences de plus en plus strictes, la sélection des<br />

matériaux à braser revêt une importance majeure. Ainsi, la crème<br />

à braser, les flux et le processus de production ne doivent en aucun<br />

cas nuire à la fiabilité des équipements automobiles également<br />

soumis à des tensions et des intensités élevées.<br />

Резюме<br />

Требования, предъявляемые к автомобильной электронике,<br />

постоянно растут, и выбор материалов для пайки имеет<br />

первостепенное значение. Паяльная паста, флюс и процесс<br />

производства не должны снижать надежность автомобильных<br />

узлов, в которых могут присутствовать более высокие уровни<br />

напряжения и тока.<br />

Enhanced SIR requirements have increased significantly beyond the J-STD-004B<br />

standards.<br />

Low-standoff components and higher voltage in automotive electronics can<br />

increase the risk of electrochemical migration and dendritic growth.<br />

Novel enhanced SIR tests reflect new expectations. Reduced line<br />

spacing and increased voltage during testing are some of the significant<br />

changes that are verifying long-term reliability in the face of<br />

increased electronics density and voltage potential within actual<br />

products.<br />

Outlook<br />

Indium Corporation believes that material science changes the world.<br />

When the current trends in electronics manufacturing and PCB assembly<br />

create and enhance process challenges, their focus is always<br />

on developing new solutions for current and evolving needs. Nevertheless,<br />

the existence of these trends has been enabled by the industry’s<br />

increasing capability to identify and address these challenges.<br />

New standards and tests are used to develop and verify solder material<br />

reliability. Other improvements, such as those to stencil technology<br />

and fixturing, have become more common now that new applications<br />

demand them. Solder paste inspection (SPI) systems are now more<br />

powerful than ever, capturing valuable data on shrinking deposit sizes<br />

and provide real-time print process statistics. The tools and technology<br />

are available as long as the users are diligent in their application.<br />

www.indium.com<br />

Source: Indium Corporation<br />

Source: Indium Corporation<br />

56 <strong>EPP</strong> EUROPE April 2020


PRODUCT UPDATES<br />

PCB + ASSEMBLY<br />

Development of next generation of lithium-ion batteries<br />

Source: Rehm Thermal Systems<br />

Rehm reel-to-reel drying<br />

system, primarily designed<br />

for research organisations.<br />

Electric mobility is a challenge for<br />

plant and mechanical engineering,<br />

research and development,<br />

the electronics industry, and<br />

other sectors. Rehm Thermal<br />

Systems is taking on this challenge:<br />

With the Artemys research<br />

project, the company is<br />

working with research institutes<br />

and partners to develop materials<br />

and technologies for solid<br />

state batteries – the next generation<br />

of lithium-ion batteries. The<br />

company has expertise in the<br />

drying and coating systems used<br />

in the manufacturing of conventional<br />

battery packs.<br />

Higher energy density, shorter<br />

charging time, longer service life,<br />

improved safety characteristics<br />

as well as environmentally<br />

friendly and resource-saving production<br />

are all required for batteries<br />

for electric mobility. Solid<br />

state batteries are a promising<br />

concept. The flammable liquid<br />

electrolyte is replaced by a solid<br />

body, which ensures safe operation<br />

even without cooling. This<br />

also prevents leakage of safetycritical<br />

and toxic substances. Another<br />

advantage is the high energy<br />

density, which means that a<br />

higher range can be achieved<br />

with the same installation space,<br />

or that less installation space is<br />

required for the same range, saving<br />

even more weight.<br />

As part of the Artemys research<br />

project funded by the Federal<br />

Ministry of Education and Research<br />

(BMBF), Rehm is working<br />

together with research institutes<br />

and partners, to develop these<br />

batteries. Suitable process technologies<br />

are being developed to<br />

produce fully ceramic solid state<br />

batteries. With this, the cathodes<br />

and the electrolyte consist of oxidic<br />

or sulfidic materials. These<br />

batteries not only function without<br />

any liquid components but<br />

also without any polymer content.<br />

The company is developing<br />

scalable production solutions for<br />

the drying and sintering of oxide<br />

composite cathodes and solid<br />

electrolyte separators.<br />

Drying electrodes is an important<br />

step in the production process<br />

for manufacturing lithiumion<br />

batteries. With its reel-to-reel<br />

drying system RDS battery, they<br />

provide a concept that can be<br />

used to achieve the drying temperature<br />

via infrared radiation,<br />

convection, or a combination of<br />

both heat-transfer mechanisms.<br />

With the ProtectoXP and ProtectoXC<br />

coating systems, the<br />

company also offers solutions for<br />

bonding and coating processes.<br />

Furthermore, their product portfolio<br />

offers solutions for the field<br />

of power electronics. There is a<br />

focus on thermal management<br />

for components, in order to prevent<br />

overheating and any failure<br />

that may occur, even with the<br />

heat loss created by the high<br />

level of performance. Voids may<br />

lead to hot spots. The vacuum<br />

option in the soldering process<br />

for Rehm systems is increasingly<br />

being used here to prevent the<br />

effects of pore formation. The<br />

vacuum option is available with<br />

the Vision series convection systems,<br />

the Condenso series condensation<br />

systems, and the<br />

Nexus contact system.<br />

www.rehm-group.com<br />

Source: Shutterstock<br />

Charging station for<br />

electric vehicles.<br />

<strong>EPP</strong> EUROPE April 2020 57


PCB + ASSEMBLY<br />

PRODUCT UPDATES<br />

Wave solder automation line at Apex 2020<br />

Source: Kurtz Ersa Inc.<br />

The Solder Smart SR 500<br />

has heating power of<br />

150 W, which allows fast<br />

soldering processes.<br />

Source: Kurtz Ersa Inc.<br />

The Powerflow Ultra system is a<br />

wave soldering system with<br />

flexible soldering bath technology.<br />

Kurtz Ersa Inc., a supplier of electronics production<br />

equipment, exhibited at the 2020 IPC<br />

Apex Expo. Company representatives showcased<br />

wave soldering, reflow soldering, selective<br />

soldering, rework equipment, I4.0<br />

connectivity and more.<br />

With the Powerflow Ultra system, the company<br />

presented a high-performance wave<br />

soldering system with flexible soldering bath<br />

technology at an attractive value. Technologically,<br />

the system is state-of-the-art and includes<br />

process-relevant components. It was<br />

shown with an automation line including Roboplace,<br />

Ersa Fit placement station with<br />

camera verification for correct placement,<br />

lifts and return conveyor.<br />

The EXOS 10/26 is a convection reflow soldering<br />

system with 22 heating and 4 cooling<br />

zones as well as a vacuum chamber after the<br />

peak zone, to remove voids in the solder contact<br />

areas between component and PCB surfaces.<br />

In addition to its extraordinary process<br />

reliability, the system impresses with its extreme<br />

ease of maintenance.<br />

The Versaeye module enables the optimal<br />

documentation of solder joint quality on the<br />

basis of your individual quality requirements.<br />

Incorporating it into the company’s<br />

Versaflow selective soldering systems, the<br />

Versaeye is optimized for the inspection of<br />

THT solder joints. Through the use of<br />

up to nine cameras, it can detect<br />

different wetting problems, solder<br />

bridges, solder balls or missed out<br />

pins.<br />

The HR 550 XL offers guided rework<br />

for large boards up to 530 x 530 mm. Rework<br />

at its highest level, the system performs<br />

safe reworking of large assemblies<br />

with high-resolution cameras for placement<br />

and process monitoring. Additionally, the rework<br />

system offers computer-aided component<br />

alignment and digital split optics.<br />

The Solder Smart SR 500 works with the<br />

powerful i-Tool, which has proven itself a<br />

thousand times over. Its heating power of<br />

150 W allows fast soldering processes with<br />

stable soldering temperature and the use of<br />

very fine soldering tips (from 0.4 mm) up to<br />

5 mm wide tips and more.<br />

www.ersa.com<br />

The HR 550 XL<br />

offers guided<br />

rework for large<br />

boards.<br />

Source: Kurtz Ersa Inc.<br />

The Versaeye module can use up to nine cameras in<br />

order to detect problems, including solder bridges,<br />

solder balls or missed out pins.<br />

Source: Kurtz Ersa Inc.<br />

The EXOS 10/26 is a convection<br />

reflow soldering<br />

system can remove voids<br />

in the solder contact areas<br />

between component and<br />

PCB surfaces.<br />

Source: Kurtz Ersa Inc.<br />

58 <strong>EPP</strong> EUROPE April 2020


Technical cleaning solutions highlighted at Apex<br />

MicroCare Corp. hosted live critical cleaning<br />

demonstrations at IPC Apex Expo and presented<br />

the latest advancements in benchtop<br />

and vapor degreasing cleaning.<br />

The TriggerGrip cleaning system and a vapor<br />

degreaser were demonstrated, which<br />

showed how these solutions clean effectively,<br />

safely and at the lowest-cost-per-part.<br />

The company‘s cleaning experts are application<br />

scientists that are well-versed in critical<br />

cleaning methodologies. They help companies<br />

identify PCB contamination and develop<br />

cleaning methods to remove it after soldering<br />

or reflow. Regional sales managers<br />

conduct on-site cleaning audits and provide<br />

product training and support while the chemists<br />

help customers select a cleaner and validate<br />

their cleaning processes.<br />

“MicroCare takes a total quality management<br />

approach to ensure customer satisfaction<br />

with product quality, responsiveness and<br />

technical service,” said Tom Tattersall, Executive<br />

Vice President and Chief Operating Officer.<br />

“This includes the cleaning tests con-<br />

Vertrel SFR is a non-flammable chemistry<br />

that easily cleans high-temperature<br />

lead-free solder pastes and flux residue.<br />

ducted at the critical cleaning labs located in<br />

the United Kingdom, United States and Singapore.<br />

Customers can send contaminated<br />

parts to the labs where our chemists clean<br />

them and then make recommendations on<br />

the best combination of cleaning fluids and<br />

processes for success. We encourage our<br />

customers to judge for themselves how effective<br />

our cleaners are,” Tattersall continued.<br />

The Vertrel SFR specialty fluid is a non-flammable<br />

chemistry that cleans high-temperature<br />

lead-free solder pastes and flux residue.<br />

It has excellent solvency power for a range of<br />

soils including both organic and ionic.<br />

“Vertrel SFR specialty fluid has been developed<br />

to clean very effectively and to replace<br />

regulated chemicals like nPB and TCE, both<br />

of which are being phased-out due environmental<br />

concerns. Not only does SFR clean<br />

well, it also has much better toxicity profile,”<br />

said Tattersall.<br />

With a history in critical cleaning, coating and<br />

lubrication products, the company has its<br />

finger on the pulse of modern cleaning solutions.<br />

In addition to their customer technical<br />

support, they invest in pioneering research<br />

and development to provide customers with<br />

both off-the-shelf products and customized<br />

cleaning fluids to meet their specific needs.<br />

www.microcare.com<br />

Source: MicroCare<br />

Release of thermally conductive adhesive<br />

The Elecolit 6607 adhesive from Panacol is thermally conductive<br />

and can be oven cured at temperatures as low as<br />

80 °C. It is characterised by excellent metal adhesion and is<br />

electrically insulating.<br />

It is an epoxy resin-based adhesive filled with aluminum<br />

oxide. It is a one-component adhesive and due to its flow<br />

characteristics, it can be applied by dispenser, screen printing<br />

or spatula.<br />

Since Elecolit 6607 cures at low temperatures, even heatsensitive<br />

components can be bonded together. Curing at<br />

higher temperatures will shorten the curing time.<br />

After curing, the light gray adhesive insulates electrically and<br />

provides excellent heat dissipation. Due to its properties, it is<br />

particularly suitable for bonding metal components and heat<br />

sinks to electronic circuit boards.<br />

www.panacol-usa.com<br />

Source: Panacol-Elosol<br />

The Elecolit 6607 is<br />

thermally conductive<br />

adhesive which can<br />

be cured at temperatures<br />

as low as 80 °C<br />

to spare heat sensitive<br />

components.<br />

CONTACT<br />

US!<br />

Yamaha Motor <strong>Europe</strong> N.V.<br />

Robotics Division · SMT Section<br />

Tel: +49-2131-2013 520<br />

info-ymeim@yamaha-motor.de · www.yamaha-motor-im.eu<br />

<strong>EPP</strong> EUROPE April 2020 59


PCB + ASSEMBLY<br />

PRODUCT UPDATES<br />

Thermal process soldering solutions<br />

Source: SMT Thermal Discoveries<br />

Reflow soldering system, SMT R360 with software „Thermal Tools“.<br />

As a manufacturer of machines for thermal<br />

process solutions from -50 ºC up to +450 °C,<br />

SMT Thermal Discoveries‘ portfolio includes<br />

innovations in the areas of SMD reflow soldering,<br />

vacuum soldering, curing and temperature<br />

treatment for temperature function<br />

tests.<br />

With the new reflow generation by SMT, the<br />

customer receives an improved heat transfer<br />

in the reflow soldering system due to the optimized<br />

airflow in the proven 3:1 zone concept.<br />

Flexible profile settings are easy to implement<br />

by combining “recipes” and “products”<br />

in the Thermal Tools operating software.<br />

The advanced, low maintenance “KAT”<br />

process gas cleaning system is integrated directly<br />

into the process area and does not<br />

require any additional energy consumption.<br />

In contrast to conventional process gas<br />

cleaning systems, the company has been<br />

relying on systems without any complex and<br />

fragile tubing for years. The customer benefits<br />

and saves not only energy losses in the<br />

tubes, but also an annual maintenance that<br />

can last several days.<br />

Moreover, the customer can change the catalyst<br />

themselves, thereby increasing the availability<br />

of the plant again. In the new reflow<br />

generation, cooling is done from above and<br />

below with one fan per zone only, which<br />

means better cooling performance with consistently<br />

low power consumption. The customer<br />

also benefits from the flat heat exchanger<br />

plates, which are easy to clean and<br />

do not “foul”. The constant cooling capacity,<br />

regardless of the degree of pollution, is another<br />

plus of the cooling. The use of one type<br />

of seal for the entire system is an innovation<br />

in the maintenance concept. The seal is not<br />

glued but clamped. This makes replacement<br />

very easy and quick and there is no need to<br />

store different types of seals. The advantage<br />

of the process area without physical zone<br />

separation is a large and easy to clean surface.<br />

Large filter surfaces for long maintenance<br />

cycles and the maintenance, which can<br />

be done from the front of the system, complete<br />

the improved maintenance concept.<br />

The vacuum reflow soldering system offers<br />

void-free soldering, precise nitrogen control<br />

and individually adjustable parameters<br />

(evacuation time, vacuum holding time, ventilation<br />

time and vacuum pressure). It also has<br />

the following advantages: fast cycle times<br />

and reliable transport handover in the system.<br />

Now all of the company’s vacuum reflow<br />

soldering systems can be controlled<br />

with the intuitive operating software „Thermal<br />

Tools“. With a 2-level structure, the correct<br />

page is achieved with only 2 clicks. With<br />

barcode and MES connection as well as with<br />

the new remote maintenance system „Smart<br />

Access“, SMT points the way to the Smart<br />

Factory from the aspects of Industry 4.0.<br />

The newly developed vertical oven (VH8) is<br />

designed for product-specific curing and perfect<br />

heat treatment for electronic components<br />

and modules. The highlights of the systems<br />

are the small footprint (up to 86 %<br />

Source: SMT Thermal Discoveries<br />

Source: SMT Thermal Discoveries<br />

Process area of SMT R360.<br />

Vertical oven, SMT VH8.<br />

60 <strong>EPP</strong> EUROPE April 2020


Source: SMT Thermal Discoveries<br />

space savings compared to horizontal ovens)<br />

and the modularly, expandable system. A<br />

flexible reaction regarding to quantities, as<br />

well as the lean concept which enables loading<br />

and unloading at one place are further<br />

highlight of the system. The machine is available<br />

as an inline or batch system.<br />

www.smt-wertheim.com<br />

Vacuum reflow soldering system<br />

– SMT VAC L with software<br />

„Thermal Tools“.<br />

Inline robot system and soldering station<br />

Thermaltronics USA, Inc. exhibited at the 2020 IPC Apex Expo<br />

and demonstrated the TMT-R9900S inline robot soldering system<br />

and TMT-2200 – “simultaneous” dual port operating<br />

solder station.<br />

The robot, Model TMT-R9900S, functions as an inline or<br />

stand-alone production system and is equipped with vision to<br />

verify the procedure being undertaken and does not simply<br />

follow a pre-determined program. It has an observation mode,<br />

a verification mode and – a decision making capability.<br />

This equipment is autonomously capable of collecting and<br />

utilizing data for production processing, which is an important<br />

factor necessary to meet the requirements of Industry 4.0.<br />

The TMT-2000S is based on curie heat technology which responds<br />

to the thermal demands of each solder joint by adjusting<br />

the power instantaneously, thereby meeting the exact<br />

requirements of the substrate component and solder material.<br />

Maximum flexibility allows the use of K, P and S Series<br />

tips.<br />

www.thermaltronics.com<br />

SMT-stencils<br />

1Z4<br />

Kunde<br />

Made in Germany<br />

Source: Thermaltronics<br />

The TMT-R9900S<br />

inline robot soldering<br />

system is autonomously<br />

capable<br />

of collecting<br />

and utilizing data<br />

for production processing.<br />

info@photocad.de<br />

<strong>EPP</strong> EUROPE April 2020 61


TEST + QUALITY ASSURANCE<br />

PRODUCT UPDATES<br />

HD package is the next best thing to real face time<br />

We can’t always be where we want to be,<br />

whether that is in the next room, the next<br />

city, or on the other side of the world, but Inspectis<br />

AB offers the next best thing to real<br />

The Real Life C12 system enables high-quality<br />

communication and sharing of detailed magnified<br />

images with others, regardless of location.<br />

Source: Inspectis AB<br />

face time. The Real Life HD technology package<br />

makes it possible for remote conferencing<br />

over readily-accessible common telecommunications<br />

applications via the Internet.<br />

This technology basically “super-charges”<br />

these telecommunications applications by<br />

adding or extending their impact and capabilities.<br />

The Inspectis Real Life HD C12 package<br />

enables easy sharing of vivid HD quality<br />

live video and details beyond the capability<br />

of normal webcams.<br />

Whether it’s remote learning, remote conferencing,<br />

or telecommuting, the Real Life<br />

C12 system requires only a simple connection<br />

to Windows or Mac computers. This establishes<br />

high-quality communication and<br />

sharing of detailed magnified images with<br />

others that use standard webcam-based conferencing<br />

systems, regardless of location.<br />

For example, the company’s macro/microscopic<br />

video imaging makes it possible to<br />

easily share and discuss tiny details of objects,<br />

circuit boards and assemblies, medical<br />

devices, and more. It enables participants to<br />

choose whether to problem solve, help with<br />

development, or simply show and tell, even if<br />

they are an ocean away. There’s no need to<br />

book a flight or drive long hours.<br />

The no-fuss controls allow the user to zoomin,<br />

share and have live discussions on technical,<br />

development and quality issues pertaining<br />

to any item or subject that requires close<br />

examination. The Real Life package allows<br />

easy USB3.0 connectivity. Other camera optional<br />

configurations including F30 and U30<br />

are also available.<br />

www.inspect-is.com<br />

GenX large cabinet X-ray systems<br />

PDR X-ray solutions introduced its GenX<br />

large cabinet X-ray systems. The GenX-90P<br />

and GenX-130P can both accommodate PCB<br />

sizes up to 21“ (533 mm) x 17.5“ (445 mm)<br />

with oblique angle viewing up to 70 °.<br />

They accommodate either 90 kV or 130 kV<br />

X-ray sources and are upgradable in the field<br />

from 90 kV to 130 kV, if the imaging needs<br />

change in the future. The large cabinet models<br />

are available at an affordable price without<br />

compromising image quality.<br />

GenX large cabinet X-ray systems can be<br />

configured with many sizes of flat panel detectors,<br />

or a versatile image intensifier for ap-<br />

plications with a range of part sizes and imaging<br />

requirements. Custom algorithms also<br />

can be tailored to specific inspection needs.<br />

These systems offer remarkable image clarity<br />

with proprietary HD camera and software.<br />

Additionally, they offer programmable 4-axis<br />

(X,Y, Z 1/Z2) fully motorized motion control.<br />

PDR systems are made in the USA with<br />

worldwide service and support, and one-year<br />

or multi-year warranties. The company can<br />

help to determine the best X-ray source and<br />

detector depending on the application.<br />

www.pdr-rework.com<br />

Source: PDR<br />

The GenX-130P offers remarkable image clarity with<br />

proprietary HD camera and software, and can be<br />

configured with many sizes of flat panel detectors.<br />

Launch of thermocouple simulation module<br />

Pickering Interfaces launched a low voltage<br />

output module for simulating the operation<br />

of a thermocouple. The 41–761 has a single<br />

PXI slot yet can provide up to 32 channels of<br />

thermocouple simulation. With ranges of<br />

± 20 mV, ± 50 mV and ± 100 mV, it is suitable<br />

The 41–761 low<br />

voltage output<br />

module has been<br />

launched, which<br />

can provide up to<br />

32 independently<br />

isolated channels<br />

of thermocouple<br />

simulation.<br />

Source: Pickering Interfaces<br />

for simulating any thermocouple type.<br />

Available with a choice of 32, 24, 16 or 8<br />

channels, the 41–761 is part of a growing<br />

family of thermocouple simulators. Each<br />

channel provides a low voltage output across<br />

two connector pins capable of providing<br />

± 20 mV with 0.7 μV resolution, ± 50 mV with<br />

1.7 μV resolution and ± 100 mV with 3.3 μV<br />

resolution, covering most thermocouple<br />

types. The use of two wire outputs and isolation<br />

from ground ensures that the 41–761<br />

can be used to simulate low voltages. Each<br />

simulation channel can provide an open circuit<br />

setting to simulate faulty wiring connections<br />

to a sensor. Each channel of the low<br />

voltage output carries calibration data stored<br />

in EEPROM on the module.<br />

When used for thermocouple simulation, the<br />

41–761 can be connected straight into the<br />

measurement system, bypassing the need<br />

for isothermal blocks and cold junction compensation.<br />

To assist in this, a 78-pin connector<br />

solution is also offered that has 32, 24, 16<br />

or 8 copper twisted pairs terminated with<br />

mini copper thermocouple plugs.<br />

“The accurate and reliable simulation of<br />

thermocouples is required by customers in<br />

demanding markets such as defense, aerospace<br />

and automotive”, said Keith Moore,<br />

CEO. “This new, high-density solution can be<br />

supported in PXI and Pickering’s modular LXI/<br />

USB chassis.”<br />

www.pickeringtest.com<br />

62 <strong>EPP</strong> EUROPE April 2020


Robotic process automation solutions<br />

Source: Seica S.p.A.<br />

The Compact RT is<br />

configurable for in-circuit,<br />

pre-functional,<br />

functional and combinational<br />

testing, as<br />

well as on-board programming.<br />

Robotic Process Automation (RPA) is a growing<br />

trend in electronic board manufacturing,<br />

and the board test solution in Seica’s Next<br />

Series, the Compact RT, provides maximum<br />

productivity in any RPA scenario: a dual-fixture<br />

rotary table ensures optimized test<br />

throughput, and its minimal, modular design<br />

provides versatility for deployment in automated<br />

handling concepts (robot/cobot) and<br />

layouts. Configurable for in-circuit, pre-functional,<br />

functional and combinational testing<br />

as well as on-board programming, it has the<br />

modularity needed to provide tailor-made<br />

test performance for specific requirements.<br />

The expansion of the electric vehicle market<br />

requires new solutions for rising demand, especially<br />

batteries. The Pilot BT has been developed<br />

for EV battery test. It performs parallel,<br />

precise Kelvin tests of 16 cells at once,<br />

achieving production rates of nearly 2400<br />

battery cells per minute. In addition to test<br />

throughput, the system utilizes “flying connectors”,<br />

that can be arranged from 2 to 16<br />

channels in either an X or Y axis orientation. It<br />

can test battery packs up to 1050 x 865 mm<br />

and weighing over 100 kilograms.<br />

www.seica.com<br />

Test system expanded with a collaborating robot<br />

The modular VTS 2030 test system from<br />

MCD Elektronik can now integrate robot applications<br />

for test processes within automated<br />

assembly lines.<br />

The prominent feature of the VTS 2030 is the<br />

possibility to modify it for various assemblies<br />

within short change-over times. It is possible<br />

to respond to the demand for high-end testing<br />

facilities, who rather manufacture small<br />

quantities of quickly changing variants. The<br />

“VTS Rack” is the basis of every system, including<br />

a PC and the Universal Measurement<br />

System “UMS 1300 ULC”. The test adapter<br />

with the assembly nest to be tested is located<br />

on the table´s surface which can be<br />

moved electrically to an acceptable work<br />

height. The test adapter is connected to the<br />

“VTS” through a “Pylon” interface. With over<br />

8.000 active licenses, the “TestManager CE”<br />

is also available for the control, evaluation<br />

and documentation of the test performance<br />

in the “VTS 2030”. Moreover, a solution is<br />

also offered for customers who prefer to<br />

work in a “LabView” test environment.<br />

With minimal adjustments, the system can<br />

be utilized for functional, end-of-line, manual<br />

functional as well as boundary scan tests. By<br />

the integration of a collaborating robot, it can<br />

be used for test processes within automated<br />

assembly lines. The robot arm offers self-employed<br />

gripping of tools or DUTs and an automated<br />

control of the test adapter. There is<br />

also a camera mounted on the robot which<br />

performs optical tests together with an imaging<br />

tool inside the test procedure.<br />

During a conflict with the protected area, the<br />

speed of the multi-axis robot is reduced up to<br />

a complete stop, if the collision protection<br />

with a scanned object or person cannot be<br />

ensured.<br />

MCDs versatile VTS 2030 test system with a robot<br />

application can now be integrated in fully automated<br />

assembly lines.<br />

www.mcd-elektronik.com<br />

Source: MCD Elektronik GmbH<br />

3D AOI/SPI combo, 3D AXI system, and M2M software<br />

Saki Corporation demonstrated inspection<br />

products, software, and capabilities at the<br />

IPC Apex Expo. On display were a combination<br />

3D automated optical inspection (AOI)<br />

with 3D solder paste inspection (SPI) system,<br />

an automated X-ray inspection (AXI)<br />

system for printed circuit board assemblies<br />

(PCBAs), self-programming software with<br />

Saki‘s inspection lineup.<br />

Source: Saki Corporation<br />

self-tuning, and advanced M2M capabilities.<br />

The combination AOI/SPI system fits NPI,<br />

high-mix/low-volume, and high-volume applications,<br />

enabling to use both SPI and AOI inspection<br />

to ensure the quality of manufacturing<br />

process and products, even when using<br />

01005 and 0201 metric components and<br />

board sizes up to 27 “ x 34 “. Multiple sensors<br />

of 7 μm, 12 μm, and 18 μm accommodate the<br />

inspection needs of manufacturing. Software<br />

and a user interface enable the company’s<br />

SPI, AOI, and AXI results to be viewed together,<br />

and programming is easy and intuitive,<br />

taking minutes instead of hours.<br />

www.sakicorp.com<br />

<strong>EPP</strong> EUROPE April 2020 63


TEST + QUALITY ASSURANCE<br />

PRODUCT UPDATES<br />

Modern X-ray and AOI solutions<br />

At the forefront of AOI, AXI and SPI innovation,<br />

Viscom showed at the IPC Apex Expo<br />

its X8011-II and X7056-II 3D X-ray inspection<br />

systems, along with the S3088 ultra chrome<br />

and S3088 DT.<br />

Source: Viscom<br />

The S3088 ultra chrome has eight angled-view<br />

cameras, which gives a virtually shadow-free 3D<br />

inspection.<br />

The X7056-II automatic 3D X-ray inspection<br />

system features high throughput and image<br />

quality for high-end requirements. This in-line<br />

system can inspect hidden solder joints and<br />

components in high-volume production. It is<br />

equipped with the xFastFlow transport module,<br />

which cuts PCB changing times. With<br />

this, up to three boards can be processed at<br />

the same time. The handling design means<br />

that larger board sizes can be inspected and<br />

the scope of angled radiation is extended.<br />

The S3088 DT is configured as standard with<br />

a dual-track system for use in 3D AOI. It features<br />

a efficiency, speed and performance<br />

that meets the requirements of large-scale<br />

mass production. It also inspects 03015 components<br />

at an impressive throughput rate.<br />

The connectors on BGAs, QFNs or QFPs are<br />

mostly hidden, and can only be checked with<br />

X-ray inspection. The X8011-II semi-automatic<br />

system was developed especially for these<br />

tasks. Typical applications are the inspection<br />

of electronic assemblies and components,<br />

quality assurance in power electronics, or<br />

non-destructive special inspections.<br />

The S3088 ultra chrome is based on unique<br />

3D AOI technology and combines accurate<br />

defect detection with high inspection speed.<br />

This makes the system the first choice for efficient<br />

SMT production. Some of the features<br />

include inspection speed of up to 65 cm 2 /s<br />

and 65 mega pixels of information in each<br />

50 mm x 50 mm field of view. The resolution<br />

is switchable, and with 10 μm per pixel even<br />

03015 components can be reliably inspected.<br />

Together with the eight angled-view cameras,<br />

a virtually shadow-free 3D inspection is a<br />

key advantages of the system.<br />

www.viscom.com<br />

Digitally transforming manufacturing<br />

Koh Young released a case study exploring<br />

how a low volume contract manufacturer<br />

with an fanatical approach to quality used<br />

automated SPI to improve the performance<br />

of their printing and of their whole process.<br />

PCBX acquired Koh Young’s 8030–3 SPI in<br />

2019 and hasn’t looked back since. The addition<br />

of the equipment has more delivered on<br />

their expectations, improving their quality,<br />

and expanding the performance and life of<br />

their screen printer. As Matt Polak, PCBX<br />

CEO, says “The SPI saves us money, because<br />

nearly all defects caught previously<br />

were printer related, and now we eradicate<br />

those much earlier. We literally dropped to<br />

0 % rework on most boards after installing<br />

the Koh Young SPI.”<br />

Koh Young Americas President said, “We are<br />

delighted to be a trusted partner of PCBX as<br />

they continue their digital journey”, adding, “it<br />

is really pleasing to see customers like PCBX<br />

gain even more value from our solutions than<br />

they bargained for, we know PCBX will be a<br />

long-term Koh Young partners and user.”<br />

www.kohyoung.com; www.pcbx.io<br />

After installing the 8030–3 SPI, PCBX has dropped<br />

to zero percent rework on most boards.<br />

Source: Koh Young<br />

Introducing large area LX-1000 AOI system<br />

Yestech Nordson introduced the LX-1000<br />

large area AOI system.<br />

The LX-1000 in-line offers high-speed inspection<br />

with exceptional defect coverage,<br />

inspecting solder joints and verifying correct<br />

part assembly, enabling users to improve<br />

quality and increase throughput. Its multipurpose,<br />

double-sided inspection system<br />

provides defect coverage, with dual sided<br />

top-down and bottom up viewing sensors,<br />

enabling users to enhance yields.<br />

2D/3D sensors and image processing technology<br />

integrates several techniques, including<br />

fringe projection, color inspection,<br />

and normalized correlation, to provide in-<br />

spection metrology with a low false failure<br />

rate. Programming is fast, as it takes 60 minutes<br />

or less to create an inspection program.<br />

It utilizes a standard package library to ensure<br />

program portability across manufacturing<br />

lines.<br />

The LX-1000 is highly effective for selective<br />

solder, post wave and connector inspections.<br />

Off-line programming maximizes machine<br />

utilization and real-time SPC monitoring provides<br />

a valuable yield enhancement solution.<br />

• Single or dual sided imaging with full travel<br />

imaging sensors<br />

• 630 mm x 630 mm large inspection area<br />

• Optional 3D/2D automated inspection<br />

• Up to 100 mm clearance<br />

• Conveyor options for samples to 15 kg<br />

• High defect coverage / low false failure rate<br />

• MES / Industry 4.0 compatible<br />

“The LX-1000 AOI is a valuable asset to<br />

any organization’s quality control procedure,”<br />

said Don Miller, Vice President.<br />

“The large area, dual-sided inspection<br />

offers a tremendous amount of flexibility to<br />

our customers, allowing them to inspect a<br />

broader range of boards. And as with all<br />

our systems, it offers the accuracy and reliability<br />

our customers demand.”<br />

www.nordsonyestech.com<br />

64 <strong>EPP</strong> EUROPE April 2020


AOI module with artificial intelligence<br />

Source: Göpel electronic<br />

THT assembly workstation<br />

with MultiEyeS<br />

plus camera module.<br />

In the search for manufacturing defects, electronics<br />

production can make use of artificial<br />

intelligence (AI). The MultiEyeS plus from<br />

Göpel electronic is an AOI camera module for<br />

mounting processes and THT assembly,<br />

which allows self-learning, robust classification<br />

under changing lighting conditions.<br />

THT is still not fully automated. Careless mistakes,<br />

e.g. due to fatigue, occur more frequently<br />

than in automatic processes. A solution<br />

to detect errors would be an optical inspection<br />

system at the assembly station.<br />

With the MultiEyeS plus, a smart automatic<br />

optical inspection module is offered for integration<br />

into mounting and THT assembly<br />

stations. The system concept based on multicamera<br />

image acquisition technology en-<br />

ables inspection with outstanding image<br />

quality and detail resolution. Due to the AI<br />

functions, the system is self-learning and<br />

works without light shielding. Real-time<br />

monitoring of assembly and placement processes<br />

at the workplace is therefore independent<br />

of lighting and ambient conditions.<br />

The MultiEyeS plus camera module provides<br />

checking, position and defect detection of assembled<br />

electronics and automotive assemblies.<br />

THT components can be checked<br />

for presence, correct positioning, polarity and<br />

marking (OCR). The module provides high<br />

resolution with up to 120 megapixels and is<br />

integrated directly at the assembly station.<br />

www.goepel.com<br />

Machine learning increases process automation<br />

Vi Technology’s (Mycronic Group) inspection<br />

equipment uses machine learning in order to<br />

increase process reliability by eliminating potential<br />

errors, and to free operators from<br />

tasks to allow them to focus on the manufacturing<br />

process. Machine learning is a field of<br />

artificial intelligence (AI) that allows a computer-controlled<br />

software to make decisions<br />

and learn based on the analysis of empirical<br />

data from a database or physical sensors.<br />

Ease of use due to machine<br />

learning<br />

The programming simplicity of the PI 3D SPI<br />

series is made possible due to using machine<br />

learning algorithms. The principle is simple<br />

but radical: only the information that the system<br />

cannot detect or reconstruct by itself is<br />

requested from the operator:<br />

• To optimize solder paste detection, the<br />

lighting level is automatically adjusted according<br />

to the color of the PCB, white or<br />

black. Therefore, the color, shape and position<br />

of the screen printing are also determined<br />

during the programming phase.<br />

• The machine is able to learn how to recognize<br />

glue dots when scanning the first<br />

printed circuit board and automatically optimizes<br />

its internal parameters accordingly.<br />

• The same applies to the recognition of<br />

„skip marks“: the system learns to identify<br />

them at the first inspection, regardless of<br />

the shape of the sticker or marker trace on<br />

subsequent boards.<br />

• The precise “stop” position of the board<br />

conveyor, regardless of the geometry or<br />

position of the board on the conveyor, is<br />

calculated in real time without any oper-<br />

ator-managed learning being required.<br />

3D AOI programming<br />

The K3D AOI software platform integrates<br />

new generation algorithms for programming.<br />

• Auto MatchMaker: When creating an inspection<br />

program for a new board, all components<br />

available in the library are automatically<br />

recognized by the algorithm.<br />

Searching manually, one by one, is no longer<br />

needed, as the automatic component<br />

recognition takes care of it. This shortens<br />

the programming time by half.<br />

• Auto Teach: For the addition of a component<br />

in the central library, the machine<br />

learning algorithm recognizes the shapes<br />

of the body and leads, and creates the reference<br />

model for inspection by associating<br />

the required AOI tests. This new model is<br />

then submitted to the operator for approval<br />

before being saved in the central library.<br />

Only a system that adapts to the measured<br />

physical conditions in real time can meet the<br />

challenges of increasing complexity of electronic<br />

boards and the miniaturization of components,<br />

respecting the takt time of the production<br />

line while preserving first pass yield.<br />

The 3D AOI K-series integrates machine<br />

learning technology to:<br />

With the machine learning<br />

algorithms, th PI 3D SPI can<br />

learn how to recognize glue<br />

dots and skip marks.<br />

Source: Vi Technology<br />

• provide analytical capability: The scan of<br />

each board is adjusted to its actual topography.<br />

This feature can only be achieved<br />

when the machine is able to measure the<br />

deformation of each board in real time and<br />

adapt its behavior independently.<br />

• achieve a first pass yield of 99 %: An ultratelecentric<br />

optical column with a sub-pixel<br />

resolution of 4.75 μm in XY-plane feeds the<br />

algorithm with input data and images,<br />

allowing it to deliver results with a metrological<br />

quality. This gives the system a high<br />

process stability at pre- or post-reflow inspection,<br />

with an optimal test coverage.<br />

• optimize inspection cycle time: During the<br />

programming phase, it is necessary to associate<br />

re-flattened areas with their components,<br />

and to deduce the best inspection<br />

path. Due to the POPE algorithm (PCBI Optimal<br />

Path Estimation), the machine adapts<br />

its behavior according to what it scans and<br />

calculates the acquisition path without degrading<br />

scanning quality.<br />

www.vitechnology.com<br />

<strong>EPP</strong> EUROPE April 2020 65


ADVERTISERS<br />

(Advertisers / Editorials)<br />

ASM 42<br />

Bosch 11<br />

BJZ GmbH & Co. KG, Eppingen 68<br />

Cogiscan 50<br />

ECD 11<br />

Electrolube 37, 41<br />

ERSA GmbH, Wertheim 3<br />

FEINMETALL GmbH, Herrenberg 53<br />

Göpel electronic 65<br />

Indium Corporation 54<br />

Insituware 33<br />

Inspectis AB 62<br />

IPC 6<br />

IPTE 12, 45<br />

IPTE Germany GmbH,<br />

Heroldsberg 51<br />

ITW EAE – Speedline<br />

World Headquarters,<br />

US-Hopkinton 5<br />

KIC 49<br />

Koh Young 64<br />

Koh Young <strong>Europe</strong> GmbH,<br />

Alzenau 19<br />

Konradin Verlag Robert<br />

Kohlhammer GmbH,<br />

Leinfelden-Echterdingen 2, 67<br />

Kurtz Ersa 12, 58<br />

Kyzen 6<br />

MCD Elektronik 63<br />

MCD Elektronik GmbH,<br />

Birkenfeld 31<br />

Mentor 48<br />

Messe München 16<br />

MicroCare Corp. 59<br />

MicroCare Corp.,<br />

US-New Britain, CT 17<br />

MicroCare Corporation 30<br />

Mimot GmbH 29<br />

Mirtec 11<br />

MK Versuchsanlagen und<br />

Laborbedarf e.K., Mücke 13<br />

Musashi Engineering<br />

<strong>Europe</strong> GmbH, München 9<br />

Mycronic Group 65<br />

Nordson Select 49<br />

Panacol 59<br />

PDR 62<br />

PHOTOCAD GMBH & CO. KG,<br />

Berlin 61<br />

Pickering Interfaces 62<br />

RAFI GmbH & Co. KG 8<br />

Rehm Thermal Systems 57<br />

Rehm Thermal Systems GmbH 34<br />

Rehm Thermal Systems GmbH,<br />

Blaubeuren 39<br />

Repotech GmbH 13<br />

Saki Corporation 63<br />

Saki <strong>Europe</strong> 20<br />

Saki <strong>Europe</strong> GmbH Czech<br />

(Prague) Office, CZ-Orech 7<br />

Seho 37<br />

Seica 63<br />

Siemens Business 48<br />

SMT Thermal Discoveries 60<br />

Techcon Systems 26<br />

Thermaltronics USA, Inc. 61<br />

ULT AG 8, 29<br />

Vi Technology 65<br />

Viscom 64<br />

Viscom AG 13<br />

VISCOM AG, Hannover 29<br />

Yamaha 53<br />

Yamaha Motor <strong>Europe</strong> N.V.<br />

Niederlassung Deutschland,<br />

Neuss 59<br />

Yestech 64<br />

ZEVATRON Löttechnik GmbH,<br />

Volkmarsen 57<br />

ISSN 1618–5587<br />

Trade journal for all fields of production in the<br />

electronics industry, manufacturing equipment,<br />

test and messurement, materials<br />

Publisher: Katja Kohlhammer<br />

Publishing House:<br />

Konradin-Verlag Robert Kohlhammer GmbH,<br />

Ernst-Mey-Straße 8, 70771 Leinfelden-Echterdingen,<br />

Germany<br />

General Manager: Peter Dilger<br />

Editor-in-Chief:<br />

Doris Jetter, Phone +49 7021 53 609<br />

E-Mail: doris.jetter@konradin.de<br />

Online Editor:<br />

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Layout: Matthias Rösiger,<br />

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E-Mail: josephine.linseisen@konradin.de<br />

Advertising rate card No. 41, 1. October 2017<br />

is currently in effect.<br />

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Phone +49 711 7594-5850,<br />

Fax +49 711 7594-15850<br />

E-Mail: ute.kraemer@konradin.de<br />

<strong>EPP</strong> and <strong>EPP</strong> <strong>Europe</strong> are published nine times a year,<br />

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Leinfelden-Echterdingen<br />

Printed in Germany<br />

© 2018 by Konradin-Verlag Robert Kolhammer GmbH,<br />

Leinfelden-Echterdingen<br />

66 <strong>EPP</strong> EUROPE April 2020


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<strong>EPP</strong> EUROPE April 2020 67


68 <strong>EPP</strong> EUROPE April 2020

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