EPP Europe P2.2020

11 2020 www.epp-europe.eu 

INTERVIEW 

 

Gabriela Reckewerth, ASM 

Enabling the digital world. 

 

 

COVER 

How far can Artificial 

Intelligence go? 

CONTENTS 

Trade Shows + Events 

electronica 2020 uses 

digital platform 

PCB + Assembly 

Keeping moisture out of 

electronic components 

10 reasons to switch PCB 

cleaning fluids 

Expanding control with 

X-ray component counter 

Test + Quality Assurance 

Reliable conformal 

coating inspection 

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2 EPP EUROPE November 2020

EDITORIAL 

The Smart Factory of the future 

The ultimate goal of Artificial Intelligence is for machines to use machine 

learning effectively, in order for them to become smarter and more intelligent. 

The cover story depicts how far this field of science has come and the 

benefits it has on the electronics industry, which include increasing efficiency 

and flexibility, while achieving self-optimization processes. Although it 

still has a way to go, Artificial Intelligence can be adopted in today’s factory 

by enabling the Smart Factory of the future and generating “knowledge” 

from “experience.” 

Dedicating AI to inspection. 

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As the electronics industry continues to evolve, manufacturers need to adapt 

to changes by finding alternatives to their cleaning solutions. It can be a challenge 

to find better choices that are more efficient, easy to implement, still 

reliable and economical, all while being less hazardous for employees and 

the environment. It is also imperative that cleaning performance is maintained 

with minimal impact on productivity. Fortunately, there are a number 

of solvent alternatives in today’s market that can be even more beneficial. 

Making the switch easier. 

Power of renewable energy 

The electronics industry plays a great part in the renewable energy market, 

due to its heavy reliance on the solutions that make it possible to harvest 

energy from natural resources. The world depends greatly on water based, 

solar based, and wind based renewable energy. Which is why, using the correct 

thermal management material, conformal coating or encapsulation 

resin is vital for the protection, reliability, and lifetime of energy generation 

and harvesting technologies. 

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EPP EUROPE November 2020 3 

Ersa GmbH | Wertheim | info@ersa.com

Contents 11 2020 

European Magazine for 

Production and Test in the 

Electronics Industry 

Source: Peter Roskothen 

24 

A change-over to photoimageable solder resists has created 

alternative photoinitiators. 

Cover Feature 

Adopting Artificial Intelligence 

based solutions 

Today, Artificial Intelligence technology is associated with a variety 

of businesses and applications. To help solve the growing 

challenges in the SMT industry, it has now also been implemented 

into inspection technology. By incorporating learning in the solutions, 

AI can be used to prevent measurement errors. Applying 

deep learning with AI engines will enable the future of electronics 

manufacturing. 

Generating knowledge from experience 

News + Highlights 

6 Enabling the digital world 

Interview with Gabriela Reckewerth, ASM 

9 Appointment of Senior General Manager 

Saki strenghtens Asian operations 

10 Inspection system programming 

Collaboration with Mentor and Koh Young 

10 Improve service accessibility 

Viscom creates customer care teams 

11 Total customer focus 

Kurtz Ersa opens new hall 

Source: Aegis USA 

40 

Factory digitization has opened a need for Artificial Intelligence. 

Trade Shows+ Events 

12 Virtual electronica 2020 

Expanding digital offering 

12 Electronics production tradeshow 

SMTconnect 2020 goes digital 

13 IPC Apex Expo rescheduled 

Postponed for 2021 

PCB + Assembly Features 

20 Improved process yield with dual head dispensing 

New level of robustness (ITW EAE) 

24 Overcoming PCB production challenge 

Using suitable solder resists (Lackwerke Peters) 

27 Product-Updates PCB + Assembly 

Source: Viscom AG 

The S3088 CCI inspection system 

offers inspection of transparent 

protective coatings. 

52 


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28 Power of renewable sources of energy 

Assisting with protection compounds (Electrolube) 

32 Product life cycle with flexible automation 

Following the TLC methodology (MTEK) 

34 Dry run over IC bridge 

Moisture sensitivity treatment (Totech) 

36 Reasons to use a better PCB cleaning fluid 

Finding the right alternative (MicroCare) 

38 Expanding control with X-ray component counter 

Staying one step ahead (Nordson Dage) 

40 Where is artificial intelligence today? 

Factory digitization (Aegis Software) 

42 Advancing the smart factory 

Production with PC-based control (Beckhoff) 

45 Product-Updates PCB + Assembly 

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Test + Quality Assurance Features 

52 Providing reliable conformal coating inspection 

CCI systems using UV illumination (Viscom) 

55 Product-Updates Test + Quality Assurance 

Columns 

3 Editorial 

4 Contents 

58 Imprint/List of advertisers 

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NEWS + HIGHLIGHTS 

Enabling the digital world with 

integrated smart factory 

An automated smart factory has now become more important than 

ever before since the spread of Covid-19. Electronic manufacturers 

have had to learn how to modify their processes to be more resilient, 

by making significant changes to their productions. The EPP 

Europe team spoke with Gabriela Reckewerth, the Senior Director 

Global Marketing from ASM SMT Solutions, and discussed 

how the company has been affected by this year’s uncertainties 

and the changes they have noticed since the start of 

the pandemic. She further explained their commitment to their 

customers, even with the various restrictions set in place and their 

thoughts about the future market. 

Gabriela Reckewerth, Senior Director Global Marketing, ASM SMT Solutions. 

What has the company focused on for 2020? 

We continued following our innovation roadmap in 2020 and kept 

working on our developments for the integrated smart factory. The 

new Release 2020, which we presented in a major livestream event 

due to the coronavirus crisis, includes several innovations for our 

customers. For example, we introduced a new generation of the Siplace 

SX. With new placement heads, an open interface for connecting 

specialty feeders from third parties, new station software 

and a whole lot more, the Siplace SX has enhanced its position as a 

powerful solution for high-mix manufacturing environments even 

further. Other releases include the DEK TQ high-volume printer with 

more than 8 hours of ‘non-stop production’ and many innovations in 

our software solutions. The most important innovation in the software 

field is our smart factory suite called ASM Works. 

Source: ASM 

The pandemic has also posed new challenges regarding the ways in 

which we interact with our customers. Thanks to our advanced remote-service 

infrastructure, we were able to provide help quickly, 

and in most cases without having to even be on-site when something 

had gone wrong or the production had to be expanded. Currently, 

we are working with our customers to make their manufacturing 

and business processes even more resilient. With our knowhow 

and as the world’s largest equipment supplier to the electronics 

manufacturing industry, we are for many customers the supplier 

of choice when it comes to getting reliable support. While 

many suppliers were often involved with themselves, we were 

much more active and started many support programs for our customers. 

For example, with our “Time4Academy” initiative, we 

opened up our e-training platform to all customers for several 

months so that they could put the production stops during the pandemic 

to use by training their employees at no charge. This earned 

us a lot of praise from our customers, and the online courses and 

webinars at our SMT Centers of Competence were very well attended. 

What are the advantages of ASM Works, and how 

does it differ from your other software solutions? 

To network and integrate a production, you had to purchase, install 

and maintain many different software options until now. Projects to 

network your electronics production often failed because of software 

compatibility problems, which was not only troublesome but 

also very expensive. 

With our modular software suite of proven ASM software components, 

our customers can now build a solid foundation for their integrated 

smart factory – one that they can adapt in stages in accordance 

with their respective requirements and capabilities. 

The ASM Works Core base module provides the architecture that 

enables machines to seamless exchange data right away. Even 

orders and setups can now be planned for the entire factory, resulting 

in optimized shop floor management. And with currently eight 

upgrade modules, more smart functionalities can be added at any 

time and in any order. Since ASM Works integrates the individual 

software components into an overall concept, electronics manufacturers 

no longer have to worry about interfaces, compatibilities, 

data transfers between lines, or licenses and upgrades. All components 

are managed from a single launch pad. General configuration 

settings, such as shift calendars or roles and permissions, are administered 

centrally and automatically transmitted to the individual 

modules. All this makes networking and integration much easier, 

faster, and more cost-effective. 



The DEK TQ stands for maximum precision 

and industry-leading performance. ASM 

now extends the function spectrum of its 

high-end high-volume printers even further. 

How important do you find smart factory solutions, 

especially with the effects of the Covid-19 virus? 

Companies that operate in a more connected and integrated 

manner have proven to be much more resilient and robust during 

the crisis. ASM’s concept of smart operator pools and our remote 

support solutions, for example, proved to be extremely helpful in 

minimizing personal interactions between employees in accordance 

with social distancing rules during the pandemic. Smart operator 

pools replace rigid team assignments, and the automatic transmission 

of data and information makes it much easier to work under 

pandemic conditions. I believe that there will be a huge boost in 

digital upgrades and modernizations after the crisis. In addition to 

efficiency and quality, companies will increasingly focus on resilience, 

a field in which ASM’s concepts for the integrated smart factory 

provide ways for making companies better and more robust in 

the ‘new normal’. 

Source: ASM 

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Source: ASM 

The ASM Works 

software suite paves 

the way to the integrated 

smart factory. 

Where are the most effects of Covid-19 in 

business terms (i.e. in which country, but perhaps 

also in which segment)? 

As a globally active group and technology leader in the field of SMT 

production, ASM was already positioned to master the extreme 

challenges of the pandemic thanks to its strategic alignment. Partly 

because of the unabated strong demand for electronic products, 

the crisis has affected us much less than many other industries. The 

same applies to the majority of our customers. Of course, every 

company has to contend with the new conditions, but many of our 

customers have developed creative solutions and are positioned 

better than their competitors thanks to their high degree of digitalization 

and automation. 

The global easing of pandemic-related regulations has an effect as 

well. We are seeing significant growth in some major markets. 

China is an example of this. There is also a noticeable increase in demand 

in Central Europe, as evidenced in the utilization of our Center 

of Competence in Munich that is operating at full capacity with lots 

of visitors and appointment requests. 

How does ASM see the developments of the 

future? What’s coming? Are there new 

developments planned for the company? 

ASM’s claim of ‘Enabling the Digital World’ sums up our mission 

perfectly. After the pandemic, the need for a sustainable and comprehensive 

digital transformation will become even stronger. This 

applies to our customers as well as to our own processes. Fortunately, 

we are extremely well positioned for this with our innovation 

projects and the new solutions we have rolled out in recent years. 

What will change, however, is that resilience will be a new dimension 

in the customers’ purchasing decisions, also with regard to the 

selection of suppliers and the way in which the parties work together. 

Which suppliers can I really depend on even in extreme situations? 

And which of my suppliers can fully maintain the scope and 

quality of their services through modern digital concepts when the 

next crisis comes along? These are the new questions that customers 

will ask themselves, and we as the world’s largest equipment 

supplier and technology leader want to provide the best answers to 

them. 

Thank you very much for 

your time Mrs. Reckewerth. 

www.asm-smt.com 

What would you convey or suggest to your 

customers on how to optimize their production? 

Electronics manufacturers should keep transitioning to the integrated 

smart factory consistently and forcefully – maybe even accelerate 

the process. The pandemic has made it alarmingly clear how 

inflexible our old manufacturing concepts are and how quickly they 

lead to a dead end. The digital transformation, automation, remote 

access capabilities and smart operator concepts in combination 

with powerful and flexible machines and solutions make companies 

not only more efficient but much more resilient. 

The ASM Command Center automates the transmission of tasks and 

information to the employees. It makes rigid assignments to lines or tasks 

a thing of the past and turns operators into smart operator pools. 

Source: ASM 



Appointment of Senior General Manager 

Saki Corporation, an innovator in the field of 

automated optical and X-ray inspection 

equipment, announces the expansion of its 

global sales organization with the creation of 

an Asia Sales Department that covers the entire 

Asia-Pacific area including China, South 

Korea, Singapore, Thailand and India. Headed 

by Mr. Katsuhiro Eddie Ichiyama, recently appointed 

Senior General Manager of the regional 

headquarters in Singapore, this regional 

organization will support customers‘ 

production of highest quality products with 

the company’s high precision inspection 

equipment and autonomous process inspection 

system. 

In his new role, Mr. Ichiyama assumes responsibility 

for sales, application support, service, 

and operations in the wider Asian region 

excluding Japan, providing customers 

with access to Saki‘s total M2M solution: 3D 

solder printing automated inspection system 

(SPI), 2D/3D automated visual inspection 

system (AOI), X-ray automated inspection 

system (AXI) and their system software li- 

neup. 

Mr. Ichiyama is relocating to Singapore from 

Europe where, as regional General Manager 

since the founding of Saki‘s European subsidiary 

Saki Europe GmbH, he has been instrumental 

in successfully driving business 

growth in the European region. With the 

company’s high-quality inspection systems, 

he has contributed to the quality assurance 

process for quality-conscious customers 

from diverse industries including the power 

semiconductor industry. 

Katsuhiro Eddie Ichiyama comments: 

“Against the backdrop of the current Covid-19 

pandemic, expectations for ‘connected’ technology 

in many areas have risen sharply, and 

the absolute quality of communication infrastructure 

has become a real challenge. At the 

same time, there is a growing need to optimize 

labor resources with a rise in demand 

for automated production solutions at our 

customers’ manufacturing sites. Saki offers a 

wide range of solutions that improve the efficiency 

and productivity of production lines 

Mr. Katsuhiro Eddie Ichiyama has recently been appointed 

to Senior General Manager of the regional 

headquarters in Singapore. 

with our automated inspection system that 

solve the problems our customers are facing, 

particularly those who have transferred production 

from China, South Korea, Japan, Europe 

and America to alternative Asian manufacturing 

sites.” 

www.sakiglobal.com 

Source: Saki Corporation 

Solutions for Electronic Assemblies and Systems 

Manufacturing together 

Meet the electronics manufacturing community at the SMTconnect and make contacts 

with international decision-makers from industries such as industrial electronics, medical 

electronics and automotive. 

Present your products and services and prepare business deals, for example at the special 

showcase areas EMS Park or PCB meets Components. 

Nuremberg, 4 – 6 May 2021 

# smtconnect 



Collaboration with Mentor and Koh Young 

Koh Young announces it has joined forces 

with Mentor, a Siemens business, to deliver 

an enhanced programming solution, which 

will benefit the printed circuit board assembly 

market. Building on the AI-powered 

Koh Young Auto Programming software 

(KAP), Mentor integrated its Valor Process 

Preparation Software to further simplify 

Automated Optical Inspection (AOI) programming 

and reduce production costs by saving 

time through the implementation of Mentor’s 

Open Product Model. 

“The synergy between our companies has 

resulted in an outstanding solution that is designed 

to help reduce time to market and improve 

production quality across the line,” said 

Mr. JD Shin, Chief Sales Office for Koh Young 

Technology. “We are especially excited about 

this particular collaboration with Mentor because 

it was in direct response to the voice 

of the customer. The partnership highlights 

the benefits customers can realize when two 

suppliers work together towards a common 

goal. It was a win-win for everyone.” 

The enhanced software eliminates the need 

for CAD and Gerber files, which saves time 

as the programmer no longer needs to locate, 

upload, and manipulate these product 

files. The new solution reduces programming 

time by blending several elements together 

that automatically creates the necessary AOI 

Building on the Koh Young Auto Programming 

software (KAP), Mentor integrated its Valor Process 

Preparation Software to further simplify Automated 

Optical Inspection (AOI) programming 

programming files. 

One of the elements Koh Young integrated 

from Mentor includes the Valor Open Product 

Model (OPM). Introduced in 2018, OPM is an 

open data assembly format structured in 

XML, which focuses on the printed circuit 

board assembly model (PCBA) and the associated 

manufacturing process plan. OPM 

is a solution for the open exchange of process 

engineering information between disparate 

machines and processes. In the same 

way that ODB++ works for design data, 

OPM is the answer to the need for flexibility 

that Smart Industry 4.0 factories demand. 

A second element that is now part of the 

software is the extensive Valor Parts Library 

(VPL) database. Comprised of over 35 million 

component manufacturers part numbers and 

package geometry definitions, Valor Process 

Preparation software uses this information to 

fully automate the creation of new parts and 

packages for use in inspection systems and 

mounters using its “Auto-Generation” rule 

methodology. 

Combining a single assembly format file output 

like OPM and a standardized machine 

package library from VPL, the manufacturer 

minimizes program variations between machines 

like inspection systems and component 

mounters. This improved programming 

approach can eliminate human error and variation, 

while significantly reducing NPI programming 

time. Additionally, OPM is generalized 

so it is interoperable among various systems 

and easily enables moving production 

between lines and—more importantly—factories 

across the world. 

“This joint programming project was just the 

first step in an expanded collaboration to improve 

the PCBA manufacturing experience 

for our customer,” said Mr. Rick Esposito, Director 

of Valor’s Processing Engineering 

Product Line. “When industry leaders collaborate, 

remarkable solutions result. We are excited 

about this relationship and the future 

together.” 

www.kohyoung.com; www.mentor.com 


Customer care teams ensures intensive support 

Viscom has reorganized its customer service for 

European customers and established new customer 

care teams. 

Viscom has reorganized its interfaces to the 

company‘s European customers as of July 

2020. With the reorganization, the market 

and technology leader for inspection solutions 

intends to enhance its customer focus 

and improve service accessibility even 

further. The establishment of customer care 

teams for each product area will ensure the 

achievement of these objectives. The newly 


created teams support and assist Viscom‘s 

customers in their selection of the right inspection 

solutions as well as in the purchase, 

commissioning, training and maintenance of 

these. This will reduce processing times and 

enable the comprehensive, precisely tailored 

implementation of customer-specific requirements. 

These new customer care teams are 

composed of specialists from the areas of 

AOI, AXI, MXI, wire bond inspection, SPI, 

CCI and various applications such as battery 

inspection, 5G, e-mobility and consumer 

electronics. They are responsible for technical 

sales, project management, applications, 

maintenance and repair as well as the hotline, 

and provide competent, targeted support 

to customers throughout the entire 

product life cycle. The newly created customer 

care teams are replacing the previous divisions 

such as SP and NP with a streamlined, 

service-oriented and sustainably successful 

organization. 

The central sales organization also includes 

direct sales, key account management and 

regional collaboration with the European 

sales representatives, who will remain the 

primary contacts for the customers. In providing 

professional customer support, the 

customer care teams will also access the expertise 

of our specialists in the central service 

and product development departments. 

„This realignment took place as a second 

step following the earlier successful reorganization 

of our product and software development 

division, which is working at full speed 

on various innovations to ensure that Viscom 

continues to inspire with its advanced inspection 

solutions delivering the highest 

level of quality. By charting this course, we 

can ensure powerful and professional collaboration 

at all levels,“ said Carsten Salewski, 

Head of Sales, Marketing and International 

Business. 

www.viscom.com 



Inauguration of production and administration hall 

In the “Gold” room, CEO Rainer Kurtz welcomed 

around 60 guests from politics and 

business as well as shareholders and employees 

of the company to the inauguration 

ceremony of the new production and administration 

building in Bestenheid. After around 

24 months of construction and furnishing, 

the new building, which offers around 

4,500 m 2 of space, was officially opened. 

In the new hall, mainly selective and wave 

soldering machines, stencil printers and reflow 

systems are assembled on two lines. 

The company thus offers its customers from 

the international electronics industry an extensive 

product and service package for their 

electronics production. As a technology provider 

for many sustainable products, Kurtz 

Ersa supports its customers with tailor-made 

complete solutions, especially in the field of 

megatrends such as electromobility and 5G 

communication. 

In his speech, Rainer Kurtz informed the 

guests about the development of Ersa GmbH, 

which has been based in Bestenheid since 

1961 and has developed rapidly over the past 

25 years. Kurtz was confident about the current 

situation and gave an optimistic outlook: 

“We see strong long-term growth prospects 

for Ersa and are pleased that we were even 

able to acquire another site here. We stand by 

the Bestenheid site,” he emphasized. 

Ralph Knecht, Managing Director of Ersa 

GmbH, thanked the shareholders for the investments 

made and emphasized the high 

level of customer proximity as an important 

factor in the company´s success. “When 

planning the building and optimizing the processes, 

the customer was always the focus 

of attention. The new building will enable 

even shorter delivery times while maintaining 

the same high quality and will also provide 

a customer center for conferences and 

machine acceptance tests.” In his speech, he 

also referred to the new cycle production in 

the assembly area and emphasized the great 

importance of Industry 4.0 processes for 

their production system. “In 2021, Ersa 

GmbH will celebrate its 100 th anniversary. 

The cutting of the ribbon for the inauguration: 

Kurtz (CEO), Knecht (Managing Director Ersa GmbH), 

Herrera Torrez (Lord Mayor), Menig (architect) and 

Leidig (general contractor). 

The new hall is a sustainable investment with 

which we will celebrate 100 years of Ersa 

next year,” concluded Ralph Knecht. 

Markus Herrera Torrez, Lord Mayor of Wertheim, 

also attended the event and congratulated 

on the completion of the hall. “Despite 

difficult times, you were able to implement 

your ambitious project according to plan and 

meet the deadline – congratulations on this 

precision landing! The inauguration was concluded 

with the handover of a symbolic key 

from Rainer Kurtz to Ralph Knecht and the 

cutting of a ribbon together. 

www.kurtzersa.de 

Source: Kurtz Ersa 

 

 

‹ 3D measurement capability at 

the highest state of the art 

‹ Side-View camera solutions 

for expanded inspection 

capabilities 

‹ Auto programming based on 

 

Koh Young Europe GmbH 

Industriegebiet Süd E4 

63755 Alzenau 

Tel. +49 (0)6188 9935663 

E-mail: europe@kohyoung.com 

www.kohyoung.com 


TRADE SHOWS + EVENTS 

electronica 2020 tradeshow to be held digitally 

The tradeshow will take place digitally this year, 

from November 10–13, 2020. 

Messe München will organize the trade fair 

and conference for electronics as a virtual 

event, from November 10 th to the 13 th . The 

current travel restrictions in Europe have 

required a re-thinking of planning. The digital 

format for the tradeshow in November will 

give exhibitors the opportunity to book digital 

trade fair booths. electronica virtual will also 

provide all customers additional ways to interact 

and network. A large portion of the 

conference and supporting program will also 

be available digitally. 

Digital platform 

Source: Messe München 

New developments related to the coronavirus 

pandemic prompted Messe München to 

decide to hold electronica as a virtual event 

this year. In light of travel restrictions that 

have been imposed by a large number of visitor 

and exhibitor countries, the show would 

have lost its character if it had been held as 

an in-person event in November. Falk Senger, 

Managing Director of Messe München, said: 

“Even though an in-person trade fair could 

have been conducted with the help of our 

safety and hygiene concept, the latest developments 

related to travel restrictions in many 

countries forced us to rethink our plans. We 

are adapting these plans to this dynamic situation 

and are now focusing solely on our virtual 

format. International exhibitors and visitors 

are the heart of electronica. In light of 

current Covid-19 conditions, we would not 

have been able to meet the expectations 

with an in-person trade fair.” 

Kurt Sievers, the CEO of NXP Semiconductors 

and the Chairman of the electronica Advisory 

Board, added: “After reevaluating the 

situation, I consider the decision of Messe 

München to be very appropriate and responsible. 

We are pleased that, with electronica 

virtual, a concept is now offered for 2020 that 

allows exhibitors to reach their international 

customers, even in the continuing difficult 

pandemic period. Via this digital platform, exhibitors 

can present their innovations, learn 

about industry trends and efficiently network 

with customers and suppliers.” 

Christoph Stoppok, the Head of Components, 

Mobility & Systems at the German 

Electrical and Electronic Manufacturers’ Association, 

said: “The electronics industry and 

the solutions it provides are one of the major 

driving forces behind digitalization. Let’s put 

the industry’s ingenuity to use and get together 

this year at a virtual fair. This is exactly 

the right time to foster a dialogue in the industry 

and generate economic momentum 

once again.” 

Virtual product presentations 

The virtual format of electronica will provide 

the electronics industry with a platform for 

global industry discussions this November. 

Its opportunities will include virtual trade fair 

booths, which will enable exhibitors to continue 

to communicate with their international 

customers and sell them on their products 

and solutions. The virtual event will be complemented 

by a digital conference and supporting 

program. Individual talks and panel 

discussions on trend topics like the automotive 

industry, embedded systems, IIoT, 5G, 

medical electronics and smart energy will be 

available online. 

www.messe-muenchen.de 

SMTconnect 2020 goes digital 

The digital version of the SMTconnect took 

place this year from 28 – 29 July 2020. Over 

1,200 participants from the field of electronics 

production took advantage of the opportunity 

to participate in the varied program 

and enjoy expert dialogue. 

With an offering for the international community, 

which included several high-quality presentations 

on the current situation of the industry, 

attendees were also able to benefit 

from fruitful group discussion. Several representatives 

from renowned companies, such 

as the Zollner Elektronik AG, the Katek Group 

and the Celonis SE, joined the exchange and 

shared their own views on how far Covid-19 

is set to accelerate digital transformation 

within the EMS sector. 

Relevant topics such as sustainable manufacturing 

and the circular economy formed a 

further highlight in the program. Experts were 

brought from the field of electronics manufacturing 

together where they talked about 

Source: Mesago 

Petra Haarburger 

(President, Mesago 

Messe Frankfurt GmbH) 

and René Travnicek 

(Host) opened this year‘s 

digital tradeshow. 

the implementation of 5G and its importance 

for different key industries. The annual expert 

exchange would not have been complete 

without a look to the future and participants 

had the opportunity to discuss advanced and 

emerging trends in the sector, as well as how 

electronics manufacturing is continuing to 

drive the fourth industrial revolution. 

“For me, the lectures were very well conceived 

both in their relevance to the electronics 

manufacturing industry and in their diversity. 

I would like to thank all those involved 

for the opportunity of participating in the digital 

trade fair”, commented Denny Bartels, 

Manager Planning Process, Tonfunk GmbH. 

The recordings of the lectures and discussions 

will be provided free of charge by 

mid-August. 

The next SMTconnect will take place as 

usual from 4 – 6 May 2021 in Nuremberg. 

www.smtconnect.com 


TRADE SHOWS + EVENTS 

IPC Apex Expo 2021 has been rescheduled 

With health and safety top of mind for all IPC 

Apex Expo exhibitors, attendees, staff and 

business partners, IPC has made the critical 

decision to move the 2021 event to March, 

due to ongoing concerns with Covid-19. Originally 

scheduled for end of January, it will 

now be held March 6–11, 2021 at the San 

Diego Convention Center in San Diego, California. 

This will be an in-person event with 

options for virtual exhibition. 

“We didn’t consider the decision to move 

Apex Expo to March, lightly,” said John Mitchell, 

IPC president and CEO. “When events 

staff became aware of open dates in March 

at the convention center, we reached out to 

exhibitors and prospective attendees and 

asked for their input. Feedback from those 

we surveyed indicated a strong desire for a 

rescheduled in-person event as opposed to a 

virtual one.” 

Mitchell added, “IPC will implement several 

infection control and prevention guidelines 

for IPC Apex Expo 2021, including social dis- 

tancing protocols, face mask requirements 

and daily temperature checks and other 

screening measures. We will ensure our 

plans follow the recommendations of public 

health experts and standards set by the federal, 

state and local governments. And, as 

safety guidelines and measures evolve, we 

will communicate these details as soon as 

they become available.” 

Source: EPP Europe 

Now taking place in 

March 2021, IPC Apex 

Expo will be an in-person 

event with options 

for virtual exhibition. 

In addition to IPC’s safety protocols, the San 

Diego Convention Center (SDCC) will implement 

a program of stringent processes for 

cleaning, disinfection, and infectious disease 

prevention under its Global BAC STAR facility 

accreditation. Registration will open early-October. 

www.ipcapexexpo.org 

REHM 

THERMAL 

SYSTEMS 

GERMANY 

Years 

Best performance in every 

production environment with the 

Condenso series! 

CondensoX is perfect for handling large or highmass 

boards in a stable process atmosphere. 

In order to improve control of the condensation 

phase, Rehm has developed a patented injection 

principle that allows the soldering procedure to be 

individually regulated. 

The new CondensoXS smart ensures high process 

stability and optimum throughput. 

CondensoXS smart 

Condensation Soldering 

www.rehm-group.com 

Anzeige_EPP_Condenso_30Years.indd 1 22.09.2020 11:54:56 


COVER 

Enabling the Smart Factory of the future 

Artificial Intelligence: 

How far can you go? 

Artificial Intelligence (AI) is a buzzword often used in association with business and industrial technologies. 

In recent times, it has demonstrated promising potential across a variety of industries, from 

self-driving cars to virtual doctors. All of which, though, have been limited exclusively to the human 

world. However, it has far-reaching applications within the manufacturing sector too. By using the 

right mixture of AI technologies, manufacturers can boost their efficiency, improve flexibility, speed 

up processes, and even achieve self-optimizing processes. The SMT industry is no exception, which 

is currently facing a chronic shortage of skilled labor. While leading organizations such as IPC and 

SMTA are trying to address the challenge with education programs and training initiatives, it is still 

not enough due to lack of consideration of realities. Equipment providers like Koh Young are enabling 

the Smart Factory of the future by adopting AI to generate “knowledge” from “experience.” 


COVER 

The machine-to-machine (M2M) communications, 

guided in part by Industry 4.0, are quickly changing 

the manufacturing process by aggregating process data 

such as first pass yield and throughput. Koh Young is 

strengthening its large-scale datasets using the highest 

quality data captured through its 3D metrology expertise, 

then the AI algorithms necessary for smarter manufacturing 

processes are trained by utilizing the datasets. As 

part of this mission, Koh Young is dedicated to adapting 

AI technologies to inspection technology across a multitude 

of developments. 

What is AI? 

Artificial Intelligence is a multidisciplinary field of science 

where the goal is to create intelligent machines by making 

things “smarter”. Historical applications of this goal include 

natural language processing and translation, visual 

perception, pattern recognition, and decision making, but 

the number and complexity of applications have been 

quickly expanding. Out of all the advancements researchers 

have made, the current driver of the AI inflection 

point is thanks to major advances in deep learning. 



COVER 


Koh Young KSMART solution. 

Deep Learning, which is a subset of machine learning, is an algorithm 

with a hierarchy of “deep layers” of large neural networks fed 

by data without feature engineering. The company is also applying 

deep learning with its AI engine, solving problems that are difficult 

for experts to model. From practical solutions like Koh Young Auto 

Programming (KAP) and Koh Young Process Optimizer (KPO) to improvements 

in measurement quality and inspection accuracy, the 

company has been utilizing AI to meet the rising difficulty in the 

SMT industry through its KSMART solution. 

Value of accurate 3D Data 

Data is the most crucial element of the success of the AI solutions. 

Deep learning effectiveness is linked to the quality and quantity of 

the input data to address many different requirements from a numerous 

number of fields. The use of AI to provide smarter inspection 

systems has been desired by every inspection provider. However, 

it has been difficult to realize due to the limitations of 2D imaging, 

which was the de facto standard for the past 25 years. Not 

only is it difficult for 2D Automated Optical Inspection (AOI) systems 


The inspection machines can be the “sensors”. 


COVER 

to identify defects on curved and reflective solder joint, 2D AOI systems 

cannot generate reliable data. Every aspect of 2D inspection 

relies on 2D features like contrast; thus, it is extremely challenging 

to correlate with to the quantitative measurement of 3D objects. 

The company, however, measures the 3D information of the components 

and solder joints. Their AOIs offer the most valuable and reliable 

measurement data, so they become the most reliable “sensor” 

on the line. The validity of 3D data is guaranteed as the company 

uses 3D technology for all components types to extract the 

exact body dimensions, unlike other system that use “blob detection”, 

which may be susceptible to external factors like board warpage 

and component proximity. The combination of measurement 

and process data piles collected from its SPI and AOI systems, as 

well as from printers and mounters, allows Koh Young to deliver advanced 

AI features with reliable “big data”. Indeed, the quality of 

data is more important than the quantity of data to create effective 

and reliable solutions with high value proposition. 


3D measurement Improvement 

with Koh Young AI engine. 

Zusammenfassung 

Künstliche Intelligenz und die damit verbundenen Vorteile helfen 

der Fertigungsindustrie, Herausforderungen wie Kostenminimierung 

oder dem Mangel an qualifizierten Arbeitskräften entgegenzutreten. 

Die Titelstory zeigt, wie der Einsatz KI-basierter Lösungen 

die Zukunft der Elektronikfertigung ermöglicht. 

Résumé 

L’intelligence artificielle et les avantages qui y sont associés aident 

l’industrie manufacturière à relever des défis tels que la réduction 

des coûts au minimum ou l’absence de main d’œuvre qualifiée. 

L’article à la une montre comment l’utilisation de solutions basées 

sur l’IA rend possible l’avenir de la production électronique. 

Резюме 

Искусственный интеллект и связанные с ним преимущества 

помогают промышленному производству решать такие 

задачи, как минимизация затрат или нехватка 

квалифицированных рабочих. На титульной странице статьи 

рассматривается, как использование решений на основе 

искусственного интеллекта обеспечивает будущее 

производства электроники. 

Measurement getting ever more accurate 

So how does Koh Young use AI? It all begins with solving inspection 

challenges of SMT assemblies. The solder and components on finished 

boards have many specular surfaces, which will reflect some 

light back to camera, while creating strong inter-reflection with 

other lighting reflections. Since some of the reflected light does not 

reach the camera, they generate false signals which may cause 

measurement value errors. This specular reflection issue is becoming 

more troublesome, in relation with increasing board density and 

decreased component spacing. 

The company uses AI to prevent measurement errors by incorporating 

learning in the product. The hybrid fusion of an analytic approach 

which utilizes a mathematical measurement model and AI which is 

used for learning abnormal symptoms from the combination of 

good and bad measurement data, allows Koh Young to detect and 

eliminate abnormal measurements, which reduces false calls and 

escapes. Through the hybrid fusion approach, the measurement accuracy 

only gets better against many different challenges. 

Share knowledge between lines 

Another area where the company has been proactively applying AI 

is with AOI programming. With the help of deep learning methods 

using true 3D data, the assignment of components on a PCB is 

gradually becoming autonomous. The Koh Young AI-powered Auto 

Programming (KAP) system proposes the recommended inspection 

conditions based on 3D measured data, which not only simplifies inspection 

condition programming, but also makes it faster and more 

consistent with the best mapping conditions. 


COVER 

Koh Young Automatic 

Programming (KAP) 

solution. 

KAP reduces job preparation by up to 70 percent, which makes it an 

ideal solution for high-mix, low-volume or time-sensitive applications. 

Moreover, their prediction and decomposition engine 

allows components to be categorized by lead count, component 

type, measurement score, and more. These elements further help 

cleaning, parsing, enriching, and shaping the data, which plays a 

major role in AI empowerment. Going further, the company will apply 

AI for pad grouping and inspection condition tuning, while incrementally 

learning new packages at new sites. 

KPO Smart Factory solution. 



COVER 


Improve yield and process optimization 

With increasing component miniaturization, improving inspection 

quality, and increasing inspection system throughput programming 

is paramount in the manufacturing industry. These needs are increasingly 

fulfilled with more computational power, which then 

yields even better inspection solutions. AI implies that such improvements 

can be fulfilled quicker with machines that continuously 

learn to solve new problems. However, the main challenge is complete 

end-to-end optimization. Harnessing the power of its own AI 

solution, the company has developed Koh Young Process Optimizer 

(KPO) solution. 

KPO is the company’s smart factory solution driven by AI to control 

and optimize the printing and mounting operations. KPO heavily 

relies on accurate 3D measurements data and error detection from 

SPI and AOI machines, which sets the stage for smart factory solutions. 

The KPO printing solution includes three interlinking modules that 

exercise complex algorithms to develop closed-loop print process 

recommendations, which are namely Printer Diagnosis Manager 

(PDM), Printer Advisor Manager (PAM), and Printer Optimizer Manager 

(POM). The enhanced AI engine actively optimizes the printing 

process by combining real-time printing and SPI measurement data. 

PAM automatically performs DOEs designed to perform a detailed 

SPI result analysis using advanced diagnostic algorithms and noise 

filtering models, and then recommends the ideal print parameters. 

PDM uses multiple anomaly detection algorithms to actively optimize 

the print process and further reduce false calls. The final module, 

called POM, uses the Koh Young adaptive learning engine to 

generate models and fine-tune process parameters. While each 

module provides inherent standalone process benefits, the combined 

power of the three modules ensures the highest process reliability 

and production flexibility while reducing dedicated resources 

and expertise. 

The KPO mounting solution includes three modules called mounter 

advisor, mounter diagnosis, and mounter optimizer. Mounter advisor 

studies and analyzes the offset distribution of the major mounter 

elements and differentiates these offsets from the component offsets 

measured by the pre-reflow AOI system. The system will automatically 

identify mechanical and software mounter failures, as well 

as the root cause(s). The mounter diagnosis and mounter optimizer 

modules are currently being developed in collaboration with our 

mounter partners. These solutions will recommend ideal component 

placement positions by utilizing SPI, pre-reflow AOI, and postreflow 

AOI data, all the while automatically notifying technicians and 

engineers about mounter issues in real-time during production. 

Conclusion 

Artificial intelligence and its associated benefits will help advance 

the manufacturing industry confront challenges like the lack of skilled 

manpower and cost of minimization. Koh Young is focusing on 

using an AI-based solution as the primary vehicle to enable the future 

of electronics manufacturing. 

As the inspection market and technology leader, the company is 

using its AI solutions to achieve its vision with a focus on next-generation 

cooperative efforts that expand process capabilities and factory 

performance. To realize this plan, Koh Young has established 

three additional R&D centers to generate a quantum leap in technological 

leadership and competitiveness. The company can apply its 

AI solution to its current areas of expertise while paving the way 

into new markets and industries beyond SMT. 



PCB + ASSEMBLY 

Bringing new level of robustness 

Improved process yield with 

dynamic “real-time” dual head 

dispensing 

Automated high-speed fluid dispensing systems are used to dispense complex patterns onto the substrate with high 

accuracy and long-term repeatable performance. When it comes to PCB assembly, panelization has been a good manufacturing 

tool, which has been referred to as grouping of PCBs into a single panel array. In high volume, PCB manufacturers 

use panelization for higher throughput. In low PCB manufacturing, panelization might not be required, due to more 

expenditure required to resolve design restrictions on thickness and space between individual PCBs. In this scenario, 

customers usually prefer individual PCBs in a carrier tray like a Jedec tray. All these scenarios can be covered through 

dual dispenser valves simultaneously dispensing side by side, having either identical substrates laid out as individual 

pieces or in a single PCB panel. 

Sunny Agarwal, Applications Engineer, ITW EAE 

Standard fluid dispensing systems involve a dispenser valve 

mounted to the XY gantry, which is movable to dispense patterns 

at desired locations onto the substrate, and is positioned in 

horizontal XY plane, through the conveyor system. Dispenser valve 

can be positioned in the three-dimensional space, dependent upon 

the component’s orientation on the substrate. The gantry system is 

driven through a drive mechanism and controlled through a motion 

control system. To dispense a pattern, the controller determines the 

location and orientation of each substrate through a camera system 

mounted on the gantry system itself. 

The camera system does the vision capture of reference points or fiducials 

located on top of the substrate, through a pre-programmed 

path set in the dispense process program. Captured vision images 

of the reference points determine the location of the substrate, in 

the XY coordinate plane. Height sensing is performed through a 

height sensing laser, mounted on the gantry, to determine the dispenser 

valve needle tip position from the substrate. The motion controller 

then positions the dispenser valve at the XY programmed location, 

followed with the dispenser valve needle tip coming down to 

the programmed dispense gap from the substrate. At this point, the 

dispenser valve starts dispensing a pre-programmed fluid pattern 

onto the substrate. 

Advances in dual head dispensing 

To optimize the line throughput, dual dispenser valves pitched at a 

desired distance are used to dispense identical substrates synchronously. 

If PCBs are panelized in a single processing panel then 

all the PCBs must be rotated in the horizontal XY plane. First and 

second substrate alignment can be found through global reference 

points or fiducials located on the body of the panel. Existing dual 

dispensing methods automatically realigns patterns to make a onetime 

automated adjustment of valve 2 relative to valve 1 prior to dispensing, 

and only considers the global skew. Therefore, both identical 

PCBs get dispensed synchronously, based on global skewness. 

Dual head dispensing has been driving on a single Z-axis to dispense 

identical patterns with each dispenser valve synchronously. 

Most of the existing techniques only considers the lateral shift of 

the second identical pattern in either X or Y direction but not the 

part-to-part rotation. Lateral shift is generally considered with the 

fixed micrometer adjustment on either X/Y or both directions on the 

mounted dispenser valves, prior to dispensing operation. 

Conventional dual dispensing methods do not incorporate the dynamic 

real time adjustment of both heads during active dispensing 

onto the identical substrates. If parts are skewed to each other in a 

tray and only global skewness is considered, then the dispense pattern 

gets misaligned. Only global fiducials are captured which defines 

the global alignment of the tray/board leaving behind the part 

to part rotation of individual parts in the tray. For part to part rotation, 

movable gantry system is required to capture the local fiducials or 

reference points through the camera vision system for each individual 

PCB. Parts can be locally skewed due to improper tooling or substrate 

sized smaller than the carrier pocket tray where the part is 

Synchronous dispensing based on global skew. 

Source: ITW EAE 

Synchronous dispensing during different scenarios. 




Process capability in synchronous mode with mini XY drive system 

Head type 

Pattern orientation 

Left 

180° 

Right 

180° 

Left 

0° 

Right 

0° 

Standard deviation, millimeters 

X Position 

Y Position 

0.0077 

0.0083 

Cpk value 

0.0075 

0.0055 

0.0079 

0.0055 

0.0062 

0.0064 

X Position 

2.02 2.01 2.08 2.24 

also includes a second linear drive motor 

assembly configured to move the second 

bracket along the first bracket. The second 

linear drive motor assembly includes a ball 

screw driven linear actuator, which is 

driven by a mechanically coupled motor. 

For each of the first dispensing unit and the 

second dispensing unit, the automatic adjustment 

assembly also include a Z drive 

mechanism configured to support and 

lower the dispensing unit when performing 

a dispense operation with the first dispensing 

unit. 

Y Position 

1.84 

2.54 

seated. Therefore, conventional dispensing methods are uncapable 

of active correction, to consider the skew angle and scale factor locally. 

Scale factor is based on where the gantry vision system finds 

the fiducials or reference points in comparison to the programmed 

locations in the process program. Mounting each dispenser valve on 

an individual Z-axis drive system provides the capability to compensate 

for part-to-part rotation through the local reference points or fiducials. 

Part to part rotation considers the skew factor and scale factor 

for each individual PCB. 

The machine gantry system is configured to provide movement in 

XY direction with the first dispenser valve coupled to the gantry for 

dispensing. A second dispenser valve is coupled to the gantry 

through the automatic adjustment mini drive system to drive the 

second dispenser valve for dispensing. A mini XY drive system is 

mounted and configured onto the second Z-axis to move the second 

dispenser valve in XY direction, to manipulate spacing between 

the first and second dispenser valves. A controller controls a dispense 

operation of the first dispensing valve on the first electronic 

substrate pattern and a dispense operation of the second dispensing 

valve on the second electronic substrate pattern. 

The mini drive system includes a linear bearing secured to the gantry 

and mounting block, configured to ride along the linear bearing, 

and coupled to the second dispensing valve. The automatic adjustment 

mechanism includes a first linear drive motor assembly configured 

to move the mounting block along the linear bearing. The first 

linear drive motor assembly includes a ball screw driven linear actuator, 

which is driven by a mechanically coupled motor. The automatic 

adjustment mechanism further includes a first bracket secured 

to the mounting block, the first bracket extending in a direction 

perpendicular to a direction of the linear bearing, and a second 

bracket secured to the second dispenser valve and configured to 

ride along the first bracket. The automatic adjustment mechanism 

2.61 

2.59 Technological advantages 

Multiple independent dispensing systems 

are sometimes used to increase the production 

of dispense operations. This solution is often expensive, 

requiring multiple machines, additional manufacturing space and in 

some cases multiple machine operators. In typical operations, 

manufacturing floor space is both limited and expensive. It is therefore 

desirable to reduce the „footprint“ of each manufacturing system 

on the manufacturing floor and to reduce the number of separate 

machines that need to be operated and maintained. 

For some applications, multiple instances of the same circuit pattern 

are fabricated on a common substrate. A common example is a 

circuit pattern for a cell phone, wherein four or more patterns may 

be disposed on a single substrate. In such cases, there is often a 

fixed and uniform offset between the multiple instances of the circuit 

patterns, which may be disposed on a common substrate and 

separated from one another after completion, along the perforations. 

Furthermore, it is known in the industry that a dispensing 

system with multiple dispensing units or pumps may be utilized to 

increase throughput. In such systems, the offset distance between 

the multiple dispensing pumps may be adjusted to be substantially 

the same as the offset distance between the multiple circuit distances. 

If the accuracy of this offset adjustment is within the accuracy 

requirements of the resultant dispense pattern, then the 

multiple dispensing pumps can be positioned simultaneously by a 

single X, Y, Z gantry and operated simultaneously. 

Experimental set-up and analysis 

The main objective of this research is to conduct a detailed study to 

match the positional accuracy of the fixed right dispenser valve to 

the left dispenser valve mounted on the mini XY drive system, along 

with good dot and line dispense quality. The study involves the use 

of a high-speed dispensing system with a pneumatic jet pump installed, 

which can currently dispense material in a repeatable 

manner without affecting the dispense quality. 





Glass plate jig for dot positional accuracy. 

Glass accuracy plate for line 

positional accuracy. 

Line Positional Accuracy 

measurement on metrology tool. 

Process capability report for six runs of line 

positional accuracy. 




Dispense quality 

for both heads in 

synchronous mode. 

It begins at a point of performing the experiment on a pneumatic jet 

pump. A nozzle heater was used to maintain the fluid temperature 

equivalent to ambient temperature conditions. It concludes by running 

the experimental run to determine the dot and line positional 

accuracy to confirm the robustness of the mini XY drive system 

with minimal effect on dispense quality. This involves the use of 

glass jig plates to perform the dot and line positional accuracy tests. 

Dot positional accuracy 

Dot positional accuracy is measured as the difference between the 

commanded position and the actual dispensed position for each individual 

dot, through dispensing an array of dots. Positional accuracy 

also defines whether the dot can shoot vertically or not (i.e., 

downwards) from the needle tip onto the substrate. From the customer’s 

point of view for field engineering applications, the dispensing 

should allow for certain dot characteristics, such as good shaped 

circular dots with good positional accuracy. Measurement of dispensed 

dots on the glass jig are performed with the optical measuring 

machine, through back lighting to measure the shift in XY direction. 

Each head needs to dispense 84 dots for each orientation type. 

The orientation type displayed, resembles the smartphone manufacturing 

board, which generally has patterns oriented either at 0 degree 

or 180 degrees. Height sensing is performed on the glass to 

ensure correct dispense height from the glass jig top surface. Each 

Process capability for line positional accuracy 

Run 

Head 

Cpk 

Cp 

Cpu 

Cpl 

Target, mm 

Avg, mm 

STDEV, mm 

Max, mm 

Min, mm 

Range, mm 

USL 

1 

Left / Right 

2.10 / 2.94 

2.28 / 2.95 

2.10 / 2.96 

2.47 / 2.94 

0.750 / 0.750 

0.754 / 0.750 

0.007 / 0.006 

0.776 / 0.765 

0.743 / 0.739 

0.032 / 0.026 

0.8008 mm 

2 

Left / Right 

1.83 / 2.52 

2.05 / 2.58 

1.83 / 2.52 

2.26 / 2.63 

0.750 / 0.750 

0.755 / 0.751 

0.008 / 0.007 

0.767 / 0.765 

0.742 / 0.739 

0.025 / 0.026 

3 

Left / Right 

1.74 / 3.03 

1.92 / 3.18 

1.74 / 3.03 

2.10 / 3.32 

0.750 / 0.750 

0.755 / 0.752 

0.009 / 0.005 

0.769 / 0.763 

0.741 / 0.738 

0.028 / 0.025 

LSL 

4 

Left / Right 

1.78 / 4.24 

2.02 / 4.38 

1.78 / 4.24 

2.26 / 4.51 

0.750 / 0.750 

0.756 / 0.752 

0.008 / 0.004 

0.768 / 0.758 

0.741 / 0.740 

0.027 / 0.018 

pattern is rotated either clockwise or counterclockwise by 2 degrees 

to prove the left head dispense accuracy is equivalent to the 

right head in real synchronous mode dispensing. 

Process capability index, Cpk measures how close the process is to 

the target and how consistent the process is around its average performance. 

An operator may be performing with minimum variation, 

but he/she can be away from his/her target towards one of the 

specification limits, which indicates lower Cpk, whereas Cp will be 

high. For both the shifts, high value of Cp and low value of Cpk indicate 

that the process has a centering problem. A generally accepted 

minimum value for the indices is 1.33 according to industry guidelines 

to determine whether the process is capable or not. Process 

capability is determined for ± 50 microns specification limits at ± 3 

sigma capability. Cpk values are also much higher than the industry 

acceptable standard for both heads in real time dynamic dispensing 

in synchronous mode. 

Line positional accuracy 

Line positional accuracy is measured as the shift between the commanded 

location of the programmed line to the actual dispensed 

line. Line comprises of series of dots stacked together at a correct 

spacing and align properly to form a straight and non-scalloped line. 

Once the dots touch each other, the boundary is scalloped but the 

dots are compressed further, and fluid takes the shortest path to 

the deepest scallop, to form a perfectly 

straight line. The closer the 

dispense valve is to the substrate, 

the better the line quality. 

0.6992 mm 

Experimental test was performed 

5 

Left / Right 

1.75 / 2.86 

1.95 / 2.90 

1.75 / 2.86 

2.14 / 2.94 

0.750 / 0.750 

6 

Left / Right 

1.75 / 2.08 

1.89 / 2.17 

1.75 / 2.08 

2.04 / 2.26 

0.750 / 0.750 

on the glass accuracy plate. Patterns 

on the left side are skewed 

at an angle of 1.5 degrees in 

counterclockwise direction, while 

in the middle patterns are skewed 

at an angle of 1.5 degrees in the 

clockwise direction. Patterns on 

the extreme right side are not 

skewed at all. Pattern on both extreme 

sides are pitched at 44 millimeters. 

Fiducial alignment is performed 

before dispensing the lines 

around the edges on the chip. The 

machine vision system locates the 

0.755 / 0.751 0.754 / 0.752 

chip edges through a vision algorithm 

and dispenses line patterns 

0.009 / 0.006 0.009 / 0.008 along the chip edges at the programmed 

position offset. Position 

0.767 / 0.763 

0.742 / 0.739 

0.025 / 0.025 

0.767 / 0.768 

0.740/ 0.740 

0.028 / 0.028 

offset is defined as the offset distance 

away from the center of the 

chosen chip edge, in the direction 

perpendicular to the chip edge. 

Lines highlighted in blue color are


dispensed at a position offset of 0.75 millimeters from dispense 

height of 2 millimeters. Patterns are dispensed with both heads in 

synchronous mode with the mini XY drive system set-up. 

A metrology tool named SmartScope has been programmed to 

measure the distance between the center point of the programmed 

centroid on the dispensed line and the midpoint of the programmed 

chip edge. Specification limits are based on tolerances of ± 50 

microns around the 0.75 millimeters position offset. 

Results showed that the standard deviation of the left head to be 

quite close to the standard deviation of the right head on most of 

the runs. Process capability is higher than the 1.33 value which is 

the industry acceptable standard for both heads in real time dynamic 

dispensing in synchronous mode. The right head has a little 

bit higher process capability than the left head due to its fixed mechanism 

onto the right Z-axis, while the left head is mounted on a 

movable mini XY drive system on left Z-axis. 

Dispense quality 

Line quality depends on the dot characteristics in terms of dot positional 

accuracy and circularity. Line width is defined by the series of 

dots dispensed at a correct spacing to align properly to form a 

straight and non-scalloped line. Visual inspection relates to humanbased 

optical inspection of line quality under the microscope to capture 

any satellite formation during the dispense cycle. Visual inspection 

also helps to determine whether the lines are misaligned or not 

and the lines are fine across the edges. Line quality shows both 

heads have good dispense quality in dual head synchronous mode. 

Increased throughput 

Increased throughput in the production environment has been a significant 

factor to meet the required units per hour (UPH) set mostly 

by the electronic device manufacturers to satisfy the customer’s demand. 

UPH is used to measure an industrial production process in 

terms of how many units produced per hour of the final product. 

Some of the major factors contributing to throughput are better vision 

capture and imaging system, conveyor mechanism, powerful 


Mittels eines Mini-XY-Antriebssystem wird eine doppelte dynamische 

Dosierung für ein höheres Maß an Prozesssteuerung sowie 

Produktzuverlässigkeit während des Herstellungsverlaufs und bei 

weniger Produktionsfläche realisiert. 

Résumé 

Un système d’entraînement Mini-XY permet de réaliser un double 

dosage dynamique pour un plus haut degré de contrôle du processus 

et de fiabilité du produit pendant le déroulement de la fabrication 

avec une surface de production réduite. 

Резюме 

Система привода Mini -XY обеспечивает двойное 

динамическое дозирование для более высокого уровня 

контроля процесса, а также обеспечивает надежную работу 

продукта в процессе производства при меньшей 

производственной площади. 

software-controlled architecture and laser height sensing which is 

mounted on a more precise and faster platform to deliver consistent 

dispensing results. 

The cycle time calculation does include the time interval for the 

board transfer, board clamp, capture board fiducials, height sensing, 

clean needle, dispense, board unclamp and transfer downstream. 

Total process time went down by 46.75 percent which is quite close 

to cutting the process time to half, from switching single head to 

dual head with mini XY drive system. The cycle time and UPH calculation 

involves dispensing operation of one carrier containing 16 

Cycle time savings leading to increased throughput. 

pieces of the product. Indicated UPH and cycle time percentages 

have been calculated through running a programmed test which includes 

lines and dot commands in the process program, to simulate 

the production environment at most of the manufacturer’s facility. 

There was a 24.00 percent reduction in height sensing and fiducials 

feature scan while switching from single head to dual head with 

mini XY drive system. Dispense time went down by 49.18 percent, 

which is a significant saving, almost cutting down the dispense time 

to half with a switch to dual head dynamic dispensing. There is no 

savings with board load, clean needle, board unload and board 

transfer time as they have no effect on the process. The desired high 

actuation speed can only be achieved for a small interval of time, limited 

by gantry motion along the three axes and mechanical friction 

between the parts. UPH went up by 87.79 percent while switching 

from single head to dynamic “real time” dual head dispensing. 

Summary 

Dual dynamic dispensing with the mini XY drive system has brought 

a new level of robustness to the high-volume manufacturing. The 

offset distance between the dispensing pumps is adjusted dynamically 

in XY direction to be the same as the offset distance between 

the multiple circuit distances to attain the same level of accuracy as 

the dispensing system. This way the multiple dispensing pumps can 

be utilized to increase throughput without any defect count coming 

from the left head mounted on the mini XY drive system. 

With Cpk numbers greater than 1.33 for both dot and line positional 

accuracy at ± 3 sigma capability indicates that mini XY drive mechanism 

does not have any adverse effect on the accuracy of the left 

head which in turn is close to the right head. Dual head “real time 

dispensing” with mini XY drive system has arrived, offering greater 

degree of process control with skewed identical substrates adjacent 

to each other thus providing good product reliability during the 

production run. Also, less manufacturing floor space required with 

almost dual increase in productivity. 

www.itweae.com 




Using suitable solder resists 

PCB production challenge: 

SVHC classified photoinitiator 

All photoimageable solder resists include photoinitiators in their formulation, serving the purpose of initiating the 

radicalic polymerisation under UV light exposure. To achieve this, a photoinitiator by the chemical name of 

2-methyl-1-[(4-methylthio)phenyl]-2– morpholinopropan-1-one (CAS no. 71868–10–5), also simply referred to as 

photoinitiator 907 is used, mostly combined with other photoinitiators. One can easily perceive it by its characteristic 

odour as released under UV light or heat as generated for example when curing or reflow soldering a solder resist. 

Peter Heuser, Sven Kramer, Detlev Schucht, Tilman Sehlen, Lackwerke Peters GmbH & Co. KG 

Needles consisting of photoinitiator 907 in a pre-drying oven for solder resists. 

As early as in 2012, the industry classified the photoinitiator 907 

as a reproduction toxic substance of category 1B on a voluntary 

basis. In 2017, the European Chemical Agency (ECHA), categorised 

it as such in a legally binding manner within the 10th adaption to 

technical progress. In consequence, solder resists were labelled by 

the skull subject to the concentration contained therein, in accordance 

with the formerly applicable hazard directive 1999/45/EC. At 

that time, Peters was on the lookout for alternative substances in 

view of launching solder resists without photoinitiator 907. 

History and risks 

Since January 2020, this photoinitiator as well as a second one, has 

come to the focus again as far as hazard labelling is concerned. 

ECHA has added the photoinitiator 907 as well as type 369 by the 

chemical name of 2-Benzyl-2-dimethylamino-1-(4– morpholinophenyl)-butanone-1 

(CAS no. 119313–12–1) to the candidate list of Substances 

of Very High Concern (SVHC). 

Substances listed on the SVHC candidate list are of concern because 

they are either: 

Source: Lackwerke Peters GmbH & Co. KG 

• carcinogenic, mutagenic or reprotoxic, 

• persistent, bio-accumulating and toxic, 

• persistent and bio-accumulating, or 

• could have serious effects on human health or the environment 

(as hormone-like substances). 

This has launched a process which, after further evaluation, will lead 

to the registering of these substances in “Appendix XIV list of substances 

subject to authorisation (EC)” no. 1907/2006 (REACH = 

Registration, Evaluation, Authorisation and Restriction of chemicals). 

Once registered in appendix XIV, i.e. the list of substances subject 

to authorisation, such a substance has to go through the authorisation 

process and will be admitted only for certain applications and 

a limited period of time; the use of it will only be admissible until the 

so-called „Sunset date“ i.e. the date of expiration. Requests for 

authorisation have to be filed 18 months before the transition period 

has elapsed, at latest. 

PCB production and packaging technologies 

To this day, the photoinitiators 907 and 369 are the most common 

photoinitiators formulated in photoimageable solder resists. However, 

their classification as SVHC candidates faces the PCB manufacturers 

with the challenge of a change-over to photoimageable 

solder resists formulating alternative photoinitiators. 

Photoinitiator 907: 2-Methyl-1-[(4-methylthio) 

phenyl]-2-morpholinopropan-1-one. 


Photoinitiator 369: 2-Benzyl-2-dimethylamino- 

1-(4-morpholinophenyl)-butanone-1. 




The polymerisation process triggered during the exposure of the 

solder resist is not fully completed: even additional UV bumps will 

not change this effect. As a consequence, one would find condensate 

material with photoinitiators in drying and curing ovens, in 

some cases in the form of white powder or needles. 

Moreover, one can clearly identify through analysis, the photoinitiator 

907 in reflow solder units during the packaging process. A substantial 

amount of condensate material is generated here. 

In view of determining the quantity of photoinitiator 907 discharged 

from a solder resist, a solder resist with a given quantity of photoinitiator 

907 was formulated. A sample of a free ink film (without 

substrate) taken from this was then extracted at 288 °C for 5 minutes. 

The degassed substances at the end of the tube were collected 

into a gas washing bottle by means of a dissolvent, followed 

by an analysis of this washed solution using the GC-MS method. 

The analytes were then assigned through retention comparison 

based on reference standards, while the quantification was made 

via a standard single-point calibration with the respective analytes. 

The result of this study was astounding: 2.2 % of weight of the 

photoinitiator 907 found accounted for approximately 1/3 of the 

quantity degassed from the ink film, without being chemically converted. 

Even the use of a UV bump did not make a significant difference. 

In practical conditions, it is not possible to reduce the photoinitiator, 

since otherwise the exposure speed will drop significantly 

and the resolution will be lower, in a way that the resistance in 

chemical finish processes is no longer ensured. 

Material from a condensate trap of a reflow oven – 7.7 % of weight of 

this brownish, semiliquid material was identified as photoinitiator 907 by 

GC-MS-analysis. 

In this context, it is important to know that the degassing from the 

photoinitiator 907 seems to have an impact on the melting of the 

second PCB side during the first reflow solder process. This can 

also be called ”self-dewetting“, which can have an impact on a 

solder resist’s flank, for example. A UV bump of the solder resist 

does not prevent this effect in a reliable manner. 

Labelling of contents 

A question may arise on the labelling requirement of coated PCBs: 

Should one evaluate the PCB as a whole? Or should just the solder 

resist be considered? 


 

 

 

 

MUSASHI ENGINEERING EUROPE GmbH 

Marcel-Breuer-Str. 15, D-80807 München 

Tel: +49(0) 89 321 996 06 E-Mail: sales@musashi-engineering.de


Flawless immersion tin plating layer after reflow soldering. 

Source: Atotech 

Self-dewetted immersion tin plating layers after 

reflow soldering. 

Source: Atotech 

Resolution example of Elpemer edition 766. 

Source: Peter Roskothen 

Reference is made to the REACH regulation (EC) No. 1907/2006. 

According to the information provided by the Federal Institute for 

Occupational Safety and Health (REACH CLP Biocide Helpdesk), the 

“dry“ ink layer has to be regarded as a component of the product 

i.e. of the printed circuit board. Thus, the reference of the candidate 

substance is not the ink layer itself, but the total weight of the PCB 

comprising the ink. If the mass percentage of the candidate substance 

to the PCB is < 0.1, there is no duty to notify this information. 

When a candidate substance liable to notification is formulated with 

a mass percentage of > 0.1, the REACH regulation does not specify 

how the notification has to be passed; a respective notification can 

be provided either with the documents supplied, or by the labelling 

of the product. 

At the first glance, this seems to be good news, since labelling will 

not be required in most cases. However, one has to consider the 

substantial accumulation during the assembly process (condensate 

trap), and thus the “exporting” and exacerbating of the problem 

from PCB fabrication to assembly production. 

Proven photoinitiators solutions 

It is possible to dispense with the two photoinitiators mentioned 

above, in particular with photoinitiator 907, without suffering any 

loss in performance. Shortly after the announcement of the new 

classification, Peters developed solder resists free from the photoinitiators 

907 and 369. For several years now, such Elpemer solder 

resists made by the company have been available, which are also 


Aufgrund der aktuellen SVHC-Situation sind nicht nur Leiterplattenhersteller, 

sondern auch Elektronikhersteller und EMS-Firmen 

hinsichtlich der Inhaltsstoffe der von ihnen verwendeten Produkte 

sensibilisiert. Praxiserprobte Lötstopplacke ohne kritische Foto - 

initiatoren sind verfügbar. 

Résumé 

En raison de la situation actuelle des SVHC, les fabricants de PCB, 

d‘électronique ainsi que les entreprises d’EMS ont tous été 

sensibilisés aux substances contenues dans leurs produits. Des 

résistances de soudure sans photo-initiateurs essentiels, qui on 

était éprouvées sur le terrain, sont disponibles. 

Резюме 

В связи с текущей ситуацией с SVHC было привлечено 

внимание производителей электроники и компаний EMS к их 

составам продуктов, а также к использованию защитного 

резиста (СПОТ маска) без фотоинициатора. 

suitable for direct imaging with LED or laser light sources. Many 

PCB manufacturers have successfully introduced these products. 

Since ECHA has now included the photoinitiator 907 in the SVHC 

candidate list, the discussion about substitutes has been revived. 

This way, the early development of alternative products pays off 

now, on which ample practical experience has been gained in the 

meantime. Even the new solder resists free from these photoinitiators 

reach reproduction accuracies of up to 50 μm. 

For Peters, it has been important that by their Elpemer 733 edition, 

a product series for the classical contact exposure, and by edition 

766, a product series for direct imaging have been developed which 

are both free from the photoinitiators 907 and 369, with all common 

coating methods being covered. 

Amongst others, the Elpemer editions 733 and 766 fulfil today’s demanding 

requirements of the automotive field, reaching excellent 

insulation results under moisture even after a permanent storage at 

a temperature of 175 °C. What is more, they show a high degree of 

elasticity and adhesion without cracking after temperature shock 

tests. 

The Elpemer editions 733 and 766 stand for 

• high permanent temperature resistance and temperature shock 

resistance of up to 175 °C, 

• temperature-critical high current applications, 

• an excellent surface insulation resistance (SIR) at 1000 V, and 

• finest structures thanks to direct imaging and contact exposure. 

Moreover, photoimageable solder resists variants are available in 

special colours such as red, blue, black or temperature-stable white, 

also free from the photoinitiator type 907. 

Conclusion 

Owing to the current SVHC situation, both electronics manufacturers 

and EMS companies have been sensitised to this situation, 

as far as the content of their products is concerned. PCB manufacturers 

who were early in changing over to type 907-free solder resists 

do not have to worry, thanks to Elpemer, and can respond with 

ease to a growing number of SVHC related questions. 

www.peters.de 

Special colours are also free from the photoinitiator 907. 

Source: Peter Roskothen

PRODUCT UPDATES 


Solder fume filter for healthy work environment 

In corona-times, all topics around the health 

of employees are receiving higher attention – 

and that´s a good thing because staff 

members remain the most important asset. 

The media reported research from the Technical 

University Berlin addressed the spreading 

of aerosols in closed room environments including 

the risk of infection. Technical ventilation 

minimizes the risks of infection. 

Wearing a mask in a hand soldering work environment 

is uncomfortable. Additionally, 

face masks are limited to reduce the spread 

of fine aerosols created while a person is just 

speaking or breathing. In closed room environments, 

technical ventilation is needed to 

have sufficient air exchange rates. Fresh air is 

“thinning” the potentially virus charged aerosols 

and thus reduces the immediate danger 

of infection. 

Filter units to clean the process air also fit 

into the concept of freshening the air! Es- 

The fume extraction units Easy Arm 1 and Easy Arm 

2 supply a three-stage filter system to clean the 

process air. This creates a healthy work environment 

and operators are protected against illnesses. 

Source: Ersa 

pecially in a soldering environment, the 

highly efficient filter systems capture the air 

in the operators’ direct work area. They filter 

out harmful particles generated from flux in 

the solder smoke. In combination with technical 

aeration, the indoor climate is improved. 

Solder fume extraction units protect from respirable 

particles (< 1 micrometer) contained 

in solder smoke. Thereby, they have a preventative 

effect against the pollution of human 

respiratory tracts and chronic diseases like 

asthma and bronchitis. 

The Ersa fume extraction units Easy Arm 1 

and Easy Arm 2 supply a three-stage filter 

system to clean the process air. The pre-filter 

(class F7) captures particles larger than 1 μm 

size. In the combined filter (class H13), 

micro-particles smaller than 1 μm are bound, 

and activated carbon neutralizes harmful 

gases. The units are connectable to Ersa soldering 

stations and rework systems, and 

thus supply effective protection. This creates 

a healthy work environment and operators 

are protected against illnesses. 

www.kurtzersa.de 

Products for battery thermal management 

Electrolube’s thermal gap filler, GF400, is a 

highly effective heat transfer solution, providing 

excellent thermal performance 

at 4.0 W/m.K. The two-part, liquid siliconebased 

filler is ideal for a PCB placed in an aluminium 

casing, filling potential voids with 

material and improves the transfer of heat, 

improving reliability. GF400 is a thick liquid 

that can easily be applied around different 

shaped housings with low stress on components. 

Following application, the gap filler 

can be cured at room temperature or accelerated 

with heat, with a wide operating 

temperature range between –50 to +200 °C. 

The low viscosity of GF400 enables easier 

dispensing and following curing, it forms a 

low modulus elastomer, preventing the 

pump-out phenomenon of the thermal interface 

layer from the bond line. 

HTCPX non-silicone heat transfer compound 

Plus Xtra provides the ultimate in thermal 

conductivity together with the advantage of 

using a non-silicone base oil. The exceptional 

properties obtained from HTCPX are due to 

the novel use of various metal oxide (ceramic) 

powders. These materials are electrically 

insulative to ensure that leakage currents 

can not be formed if the paste should 

come into contact with other parts of the assembly. 

HTCPX has excellent thermal conductivity 

at 3.40 W/m.K and provides a wide 

operating temperature range from –50 °C to 

+180 °C. Designed for gap filling applications, 

the non-silicone heat transfer compound is 

vibration stable, low in toxicity and upholds 

excellent non-creep characteristics. 

To achieve prolonged battery life and higher efficiency, 

the thermally conductive epoxy potting 

compound, ER2221, is a highly thermally 

conductive resin with low viscosity, ideal for 

potting cells within electric vehicle batteries. 

The UL94 V-0 approved epoxy potting compound 

can withstand long durations at high 

temperatures and can assist with securing 

cells in place whilst dissipating the heat away 

to the surroundings. The resin effectively creates 

a protective shield around the battery and 

enables excellent adhesion, high temperature 

resistance, high thermal conductivity, and retention 

of characteristics throughout the thermal 

cycling process. ER2221 is coloured black 

with an operating temperature of 150 °C and 

an advanced thermal conductivity value. 

The company‘s thermally conductive epoxy 

compounds are ideal for potting cells within electric 

vehicle batteries. 

Source: Electrolube 

The soft and removable PU resin, UR5044, is 

a high-performance potting compound that 

allows easy repair and rework in-field with 

user-friendly resin packs. The material provides 

protection from extreme and varied environmental 

factors and is fully UL approved. 

The flexibility and softness of this resin 

makes it highly shock absorbent, ideal for 

battery applications subject to vibration and 

shock. It provides excellent protection from 

extreme and varied environmental factors. 

Ron Jakeman, Managing Director, comments, 

“We have numerous, versatile solutions 

that provide excellent protection in a 

wide range of environments and frequently 

develop bespoke solutions for our customers 

if an application presents more of a challenge.” 

www.electrolube.com 

Electrolube has developed thermal management and 

encapsulation resins for better battery protection. 




Assisting with protection compounds 

The power of renewable 

sources of energy 

Renewable energy is energy collected from renewable resources that are naturally 

replenished on a human timescale and are projected to account for more than 50 % of global 

electricity production by 2035. Put another way, this is energy harnessed from the earth’s 

infinite or non-exhaustible natural resources rather than our traditional reliance upon finite 

resources of fossil fuels. According to Allied Market Research, the renewable energy market 

is predicted to grow exponentially by 2025 with biomass representing the leading form of 

energy within this market. From looking into the applications in more detail, a much wider 

potential use for all forms of renewable energy sources can be demonstrated. 

Jade Bridges, Technical Manager, Electrolube 

The discussion commences with a traditional source of renewable 

energy, water. Water-based power sources, hydropower, 

tidal power and wave power all rely on hydrokinetic potential; that is, 

the energy carried by bodies of water. Water-based power is sustainable 

and has a low carbon footprint. The energy generated by falling 

or fast-moving water is typically known as hydropower and has 

been used for centuries for a variety of mechanical applications. In 

the late 19th century, hydropower was first used for the generation 

of electricity and has since continued to develop as an important 

source of renewable power. 

Water based renewable energy 

Hydroelectricity is produced by passing the flowing water through 

turbine generators which consist of a number of electronic parts; 

simply identified as alternators, inverters, control panels and power 

switches or breakers. This type of power is incredibly versatile, and 

examples of its application can be seen around the world, one of 

the most famous being the Hoover Dam in USA. Run-in-river applications 

can also be utilised to harness the power from flowing 

water, rather than falling water as seen in a reservoir-dam facility. 

Whilst the emissions from these plants may be low, they are not 

totally emission free and their effect on the environment also has to 


With the future development of energy generation and harvesting technologies, thermal management materials, conformal coatings and encapsulation resins 

will continue to have a vital part to play. 



Electrolube products assist with protection compounds that aid the efficient and prolonged application of electronics in challenging environmental conditions. 


be considered; protection of fish from turbines, appropriate use of 

the land and evaluation of surrounding wildlife, are just some criteria 

that must be addressed when developing new sites. 

The two remaining water based renewable energy sources sound 

similar but in fact are very different. Tidal pattern is continuous 

therefore the energy generation from this is predictable. Tidal generators 

are placed on suitable shorelines in order to harness the 

power of this source. Wave power, however, is generated at sea, is 

unpredictable and currently plays a very minor role in the global mix 

of energy sources. Consideration in both cases, needs to be placed 

on the effects of any machinery or movement on the surrounding 

ecosystem. It is in these demanding electronic applications where 

Electrolube products assist with protection compounds, such as encapsulation 

resins and conformal coatings, that aid the efficient and 

prolonged application of these electronics in challenging environmental 

conditions. Devices such as sensors and data loggers are 

important for gathering information both in and out of the plant, providing 

details such as water depth and wave acceleration to adjust 

systems and achieve maximum capability. Water protection for 

these devices is just one example of where an encapsulation resin 

may make these measurements possible, greatly reducing maintenance 

requirements and human interaction in data collection. 

Solar based renewable energy 

Moving on, solar energy has to be one of the most iconic forms of 

renewable energy, particularly prevalent in the domestic electricity 

market. Solar cells produce direct current electricity from sunlight 

via the technology known as photovoltaics (PV), and it is these solar 

cells that are seen in many different applications globally. However, 

the technology doesn’t stop at the solar cell alone. Inverters are 

used to convert the direct current into alternating current electricity 

so that it can be fed from the solar panel into a home/building to operate 

standard appliances. In addition, capacitors are used to temporarily 

store electricity where required, or in off-grid applications 

batteries may be required to store power for more widespread use. 

In such cases, these electronic devices will require protection from 

the elements but will also be required to operate at higher temperatures 

and offer some form of thermal dissipation, due to the heat 

emitted during operation. Depending on the design, thermal management 

products may be used to help dissipate heat away from 

devices, this could be in the form of thermal gap fillers (Electrolube 

GF400) for example. However, to offer both protection from the environment 

and thermal dissipation, specialist encapsulation resins 

such as the ER2221 may be required. 

In addition to capturing and converting the energy, the requirement 

for measuring the performance or having some control over the 

solar panel may be required. Measurements such as solar panel 

temperature, can help to manage solar farms and ensure the most 

efficient use of the technology is attained. Unfortunately, some of 

these system electronics can be relatively small and possibly fragile, 

yet conversely, the average piece of solar equipment must be 

able to withstand some pretty extreme weather conditions, including 

direct exposure to the sun, heat and other environmental elements. 

Electrolube has worked directly with organisations harnessing 

solar power. In one particular instance, a small device displaying 

information on the performance and connectivity of the 

solar panels in an array required protection from the external environment. 

Some issues had arisen with resins tested, where the 

hardness and Tg of the material resulted in pressure on the LCD 

screen, leading to failures in operation. Initially silicone options were 

tested due to this low stress requirement, but these did not perform 

to the high level achieved by the company’s UR5044, which 

showed great stability and low hardness over a wide temperature 

range. Adhesion of this polyurethane resin was greatly improved 

compared to the previous silicone resins tested and thus an improved 

protection from the external conditions was realised. 

Devices separate from the solar farm are also very important. 

Measurements of solar radiation, incoming UV and infrared light 

spectrums will give data to help correctly position and manage 

these solar plants. Such data is required to be transmitted, often by 

GPRS or maybe Bluetooth, and any protection compound used 

must not interfere with these signals. Encapsulation resins with a 

low dielectric constant are most suited, such as the UR5118, which 

also offers excellent water resistance. However, if the unit is well 

sealed by the outer casing and has a high IP rating, it may also be 

possible to use a conformal coating (Electrolube AFA) to prevent the 

effects of condensation on the electronics and also minimise the 

weight of the device in comparison to a potted unit. 



Solar panels can be seen powering devices from decorative garden 

lighting to streetlights and road signs. Smart streetlights and solar 

benches are amongst the newest products to fully integrate numerous 

technologies, such as remote management control, wireless 

charging and Wi-Fi hotspots all built in, and again, all requiring protection 

for the electronics used. The chemical industry is playing a 

strong part in these novel developments, right up the development 

of solar paint. The possibilities here are seemingly endless. 

Wind based renewable energy 

The third renewable source for discussion is wind power, one of our 

most predominant sources, with the UK currently ranking as the 6th 

largest producer of wind power in the world. Wind farms capture 

the energy of wind flow by the use of turbines and convert it into 

electricity. Commercially positioned wind systems can power many 

alternative organisations whereas single wind turbines are predominantly 

used as a method to supplement pre-existing energy 

sources. 

(these can change depending upon the location but can include salt 

mist/spray and limited accessibility). Longevity of component life, 

reduced maintenance and long-term cost are all key drivers prompting 

reliable protection systems in the form of either conformal coatings, 

encapsulation resins or sometimes a combination of both. 

There are also requirements for thermal management materials 

within the use of wind turbines and the company was faced with a 

particularly tricky problem when a ‘greener’ version of a standard 

thermal interface material was required. It is encouraging that green 

energy developers are considering all aspects of environmental impact, 

including the materials used with the manufacture of their 

products. In this case, the thermal interface material had to be 

classed as completely non-hazardous and as traditional TIMs contain 

zinc oxide they were deemed completely unsuitable. Presented 

with the problem, Electrolube developed a solution specifically for 

the purpose, HTCX_ZF. This was developed using alternative thermally 

conductive fillers which removed the zinc oxide and the corresponding 

H410 hazard phrase, representing toxicity to aquatic life. 

The product also offered an increased thermal conductivity compared 

to the standard material and thus offered greater efficiency of 

heat dissipation in customer testing. 

The location of the wind farm is as important as the location of any 

other renewable energy sites. In offshore wind farms, the conditions 

are much more extreme and corrosive elements such as salt 

mist can have a detrimental effect on both mechanical and electrical 

parts. With experience in electronic devices for marine applications, 

the company can offer support and advice on suitable protection 

compounds for such applications. Like the developers of integrated 

technology, Electrolube strives to utilise experience gained from 

multiple industries and from the varying types of products offered in 

our range. Combining the understanding of protection levels 

required, with correct thermal management and suitability for applications 

such as LED technology, assists in the correct selection of 

products for complex and critical applications. For example, the use 

of the company’s products to protect lighting arrays in outdoor applications, 

such as shopping centres, sports arenas and even aircraft 

Renewable energy is the harnessing of energy from the earth’s non-exhaustible 

natural resources. 

The traditional turbines are huge with very large blades driven by 

wind power which in turn powers a rotor. This rotor spins the shaft 

within the tall upright of the turbine and this powers a generator for 

harnessing electricity. Almost all wind turbines can contain up to 

8,000 separate parts including gearboxes, power systems, generators, 

sensors and devices for electronic control. One of the huge 

challenges is to assemble these enormous devices, enable a long 

life and trouble-free operation. All electronics and components 

mounted in the tower must also be able to withstand constant vibration, 

temperature changes (extremes), environmental conditions 



Wärmemanagementmaterialien, konforme Beschichtungen sowie 

Harze zur Verkapselung spielen bei der Planung und Wartung von 

Energieerzeugungs- und Energiegewinnungstechnologien eine 

entscheidende Rolle für den Schutz, die Zuverlässigkeit und die 

Lebensdauer der Geräte. 

Résumé 

Les matériaux de gestion thermique, les revêtements conformes 

ainsi que les résines destinées à l’encapsulation jouent un rôle 

essentiel pour la protection, la fiabilité et la durée de vie des 

équipements lors de la conception et de la maintenance des 

technologies de production d’énergie et de collecte d’énergie. 

Резюме 

Терморегулирующие материалы, конформные покрытия, а 

также герметизирующие смолы играют решающую роль при 

проектировании и обслуживании энергогенерирующих и 

энергодобывающих технологий для защиты оборудования, 

обеспечения его работоспособности и срока эксплуатации. 



runways, gives confidence and understanding of the potential use 

of these products to protect the warning lights used on the top of 

wind turbines. Combine that with their understanding of products in 

applications where wireless data transfer is required, the smart 

management of such lighting technology can be successfully 

achieved, even in such harsh external conditions. 

The most used form of renewable power in the UK however is carbon-neutral 

and comes from bio-waste, making use of the unwanted 

by-products of today’s way of life. Biomass is an alternative 

fuel made from organic materials, including wood, crops and plants, 

animal waste and more. Biomass products are burned within a 

boiler, generating a source of steam to turn a turbine thereby producing 

electricity. Traditional coal-fired power stations can be converted 

to run entirely on biomass fuel. Biomass, hydroelectricity and 

wind power are the three resources on which we depend the most 

on, in order to achieve cleaner energy goals and reduction of carbon 

footprint. 

Whilst the most reliable and productive sources of renewable energy 

have a heavy reliance on harvesting equipment with a myriad of 

moving parts, it is clear that electronic developments have been key 

in the development and integration of these sources into our everyday 

lives. Over time, the harvesting of energy is likely to become 

even more automated and entwined with the IoT as trees are being 

fitted with PV cells and pressure power sensors can now be found 

underneath high traffic roads. Efficiency and reliability will increase 

as the level of AI builds. Thermal management materials, conformal 

coatings and encapsulation resins all have a vital part to play in the 

protection, reliability and lifetime of devices throughout the planning 

and maintenance of energy generation and harvesting technologies. 

www.electrolube.com 

In the late 19 th century, hydropower was first used for the 

generation of electricity and has since continued to develop 

as an important source of renewable power. 


Jade Bridges is the Technical 

Manager with Electrolube. 



Following the TLC methodology 

Mastering the product life 

cycle with flexible automation 

Production volumes tend to increase as products move through their life cycle and the maturity of the 

technology progresses. With a mature, high-volume product, industrial automation is an attractive 

solution. In such a scenario, infrastructure investment will likely pay-off over time. But the right strategic 

choice for automation earlier in the product life cycle, when the volumes are lower and the products 

tend to be less mature and stable in their technology, is less clear. 

Mattias Andersson, CEO & Founder MTEK Industry AB 

When going from prototype to mass production, manual labor 

has been the answer in many processes, instead of automation. 

That is until now. Flexible automation is now readily available 

and will be a game changer for manufacturing automation. 

Defining automation 

The Product or Technology Life Cycle (TLC) is a methodology used in 

high-tech industries to recognize changing manufacturing and mar- 

ket conditions triggered by the maturation of a product and of the 

technologies it uses. When the technology of a product evolves, so 

will the requirements in terms of product features, design, price and 

service. This impacts supply chain and operations strategies. The 

TLC is therefore an important concept to consider when defining 

business and automation strategy. 

Considering the right automation throughout the TLC is key to creating 

the most cost-efficient production process. In the past, the alternative 

to automation was manual work. Manual 

labor’s advantage over traditional automation is 

that it is flexible and configurable. It is relatively 

easy to assign new tasks and move operators as 

demand is shifting. This is not the case with traditional 

automation, which is by nature rigid, inflexible 

and hard to redeploy, not to mention capital 

intensive. 

Source: MTEK 

Flexible automation 

Today, with the emergence of collaborative robots 

and software defined robotics, there is an 

Source: MTEK 

Data is at the heart of the smart factory and is the 

currency for continuous improvement. 

Digital twins can be created 

for both manufacturing 

systems and products. 



Source: MTEK 

Analysis of trends and real-time data allows better decisions to be made faster. 

Source: MTEK 

Adaptable automation modules, like MCell are the digital building 

blocks of smart manufacturing. 

alternative to both traditional hard automation and manual labor, and 

that is flexible automation. Using this in the right way allows manufacturers 

to cost-efficiently automate from prototype to mass-production. 

This shortens the development cycle of the product and removes 

the need to redesign the product as it enters the later stages 

in its life cycle, since design for automation (DfA) has been applied 

already from the start. 

Flexible automation has many of the benefits that manual labor provides. 

If deployed in the right way, it will be simple to move the 

robot to the line and the position where it is required for the shift, 

and support tasks previously undertaken by an operator. What’s 

more, a software defined approach, allows new tasks and new configurations 

to be downloaded to the robot instantly. This is very different 

to how hard automation is working today and much more like 

an operator taking updated work instructions. The robot becomes 

the physical representation of the software model and can immediately 

start the task it has been requested to execute. Collaborative 

robots are not delivering on this promise today, but with added 

functionality for adaptability to new tasks and increased flexibility, 

they become a hybrid of traditional automation and the manual operator, 

all with the efficiency and lower cost of an automated solution. 

As an example, the insertion of odd shape components, such as capacitors, 

relays, and terminal blocks, is usually carried out manually 

in the electronics industry. The shape and form of the components 

as well as the relatively high mix of products makes it hard to automate 

using standard solutions. But flexible automation, a collaborative 

robot and a software defined approach, 

would allow this task to be automated. 

This provides a route to efficiently automate 

very early in the product life 

cycle when volumes are lower and 

there are often changes to the products. 

It also allows for that automation 

to scale-up during the later 

phases of the product life cycle as volumes 

grow. 

Mattias Andersson 

is the founder and 

CEO of MTEK. 

Source: MTEK 


Flexible Automatisierung schafft einen Mehrwert zu Beginn des 

Produktlebenszyklus bei hohem Produktmix sowie geringem Volumen 

und sie bietet eine Methode zur Skalierung bei steigender 

Nachfrage, wenn die Produkte im Produktlebenszyklus später 

marktfähig werden. 

Résumé 

L’automatisation flexible apporte une valeur ajoutée au début du 

cycle de vie du produit en présence d’un assortiment important et 

d’un faible volume et offre une méthode d’évolution à mesure que 

la demande augmente, lorsque les produits arrivent à maturité plus 

tard dans leur cycle de vie. 

Резюме 

При большой комбинации продуктов и малых объемах гибкая 

автоматизация создает дополнительные преимущества в 

начале жизненного цикла продукта и предлагает метод для 

масштабирования по мере увеличения спроса, когда продукты 

созревают на более поздних этапах их жизненного цикла. 

Approach for automation 

An important aspect to the success of flexible automation is to simplify 

and empower the organization to use the full capabilities of the 

solution, to adapt it to the changes that happen as product mix and 

volumes change. Proprietary knowledge is an inhibiting factor for 

digital transformation and solutions which fail usability and ease will 

not be successful. 

In an increasingly connected world, last mile connectivity to the factory 

floor is essential. This is not only important for performance and 

configuration, but also to secure the product and process data feedback 

loop in the early stages to secure optimal use of solutions in 

the later stages. Finding deviations early in the various process 

steps provides insight into the changes required in products or processes 

for a successful scale-up. 

Flexible automation is a contemporary approach for automation. It 

adds value early in the product life cycle when mix is high, and volumes 

are lower, and it provides a method to scale as demand increases 

and products mature later in the product life cycle. 

www.mtek.se 



Treatment of moisture sensitivity 

Dry run over IC bridge 

Keeping moisture out of electronic components before they enter the manufacturing process is a 

critical concern for the automotive sector. Tackling the problem, Melexis has come up with a 

towering solution. Cars have always needed to be safe, but safety is no longer just about having 

robust engine and chassis. With the shift in automotive technology being from mechanical to 

electronic, it is the performance of the electronic components that need to be completely reliable. 

The consequences of failure can, of course, be devastating as these component manufacturers 

are all too aware. 

Melexis is a leading 

player in the automotive 

semiconductor sensors 

market. 

Source: Totech Europe B.V 

One of the leading players in the automotive semiconductor sensors 

market, as well as in the integrated circuits for motor 

driving, car networking and wireless communication, is Melexis, 

and it has recently completed the first phase of a new project to ensure 

components are delivered in the same impeccable condition 

that they were made in. 

Moisture in semiconductors is a serious issue. Trapped moisture 

can vaporise and expand when subjected to the temperatures of a 

reflow oven during assembly. While this can lead to catastrophic failure 

of the part during the production process – an effect called ‘popcorning’ 

– it can also introduce cracks and weaknesses in the component 

that could present reliability issues once the assembly is out 

on the market. It is an issue that is obviously taken very seriously 

both by the electronics assembly sector in the way that they handle 

and store components, and by the semiconductor makers themselves. 

Final drying stage 

With this latest project, Melexis is aiming to provide additional assurance 

for the step from its semiconductor factory in leper, Belgium 

to its assembly customers. The site works around the clock to 

test around 40 million ICs a month, principally sensors for the automotive 

market, though their high performance has also led to applications 

in consumer and industrial. 

Bertrand Leterme, Manufacturing Manager at Ieper, explained he 

was “looking to control temperature, humidity and timing. The Dry 

Tower project enables us to do this accurately.” 

Dry Tower is the solution provided by Totech, a company that was already 

well-known to Melexis. “Totech solutions and tools are 

known and used internally and at our customers,” continued Leterme, 

who also recognised Totech’s support and reactivity. 


Eine Lösung zur automatisierten Lagerung mit kontrollierter Klimatisierung 

sowie die Umsetzung einer kundenspezifischen Schnittstelle 

inklusive Einbindung weiterer Lagerorte erfüllte die Anforderungen 

eines belgischen Unternehmens für Halbleitersensoren im 

Automobilbereich. 

Résumé 

Une solution de stockage automatisé avec climatisation contrôlée 

ainsi que la mise en place d’une interface spécifique au client, y 

compris l’intégration d’autres lieux de stockage, répondaient aux 

exigences d’une entreprise belge de capteurs à semi-conducteurs 

dans le secteur automobile. 

Резюме 

Решение для автоматизированного хранения с 

контролируемым кондиционированием воздуха и реализация 

индивидуального интерфейса клиента, включая интеграцию 

дополнительных мест складирования, соответствовали 

требованиям бельгийской компании к полупроводниковым 

датчикам в автомобильной отрасли. 



This project was looking at the stage just before final packing and 

sending off to customers. All components will have had their testing 

at three different temperatures: –40 °C, 25 °C and 135 °C, followed 

by final optical inspection before being taped and reeled. Then this 

final drying stage ensures components are completely dry before 

despatch. It is a stage that is standard – and defined by JEDEC standards 

– within the industry. All components are held for a minimum 

of 24 hours at 1 % RH (relative humidity). 

Totech’s standard drying cabinets were already being deployed at an 

earlier stage in the company’s process. However, to use these cabinets 

for the final drying application would have meant a footprint of 

around three times that of the adopted Dry Tower solution – and 

floor space was one of the key considerations. 

After benchmarking against another main European supplier, it was 

considered that the Dry Tower would offer the best solution. Leterme 

said: “Totech provided more technical answers to our concerns. 

And has proved in the past year to give good support in case 

of trouble – important in our market.” 

The Dry Tower is really designed for automated storage with precise 

and proven environmental control technology. However, its ability to 

tie in with inventory control systems made this an ideal solution to 

Melexis’ drying requirements. Leterme says: “It gives us the expected 

control and traceability for our products and our customers. 

There is also flexibility in the software to manage large batches of 

reels including a high automated quality control.” 

Moreover, it will allow Melexis to continue to develop the project. 

“The tool is flexible and gives us capacity for potential future production 

automation projects,” Leterme commented. The next step 

over the coming year or so is to increase the level of automation 

with the addition of customised conveyors and other automated 

handling equipment – the Dry Tower is currently loaded and unloaded 

manually. 

Perhaps, ultimately, this drying solution could play its part in a full 

‘Smart factory’ scenario. All component data is saved into a data 

base, from when it enters the system after reeling to when it leaves 

the Tower for packaging and shipping. 

It sounds like a complex arrangement for a one-day stop-over for 

components on their way to their end application, especially as they 

will already have passed their ‘final’ test. However, it is a stage that 

forms a crucial bridge connecting the often separate worlds of semicon 

and assembly, and it is imperative to drive in efficient, comfortable 

and, most importantly, safe cars – that these components 

cross that bridge in perfect condition. 

Dry Tower 

centralised 

materials 

storage. 


Dry Tower installment at Melexis’ semiconductor factory in leper, 

Belgium. 

Moisture in semiconductors 

Ever increasing miniaturization of electronics, including thinner components 

and new materials has made the management and treatment 

of moisture sensitivity an increasingly critical element of electronics 

manufacturing and product reliability. Electronics manufacturers 

are thus challenged to manage larger and larger volumes of 

parts in a controlled and traceable manner. 

The Totech Dry Tower comprises integrated drying and storage environments 

with complete operator free material handling. Incorporating 

mature, proven drying technology and WMS-system integration 

capabilities, the system is also modular, and can be configured 

for different size and storage requirements. All relevant data 

for processing components is saved into a data base, from entering 

the system through to the retrieval of components. Important storage 

parameters, such as humidity and temperature, are logged and 

available for analysis. 

The Dry Tower storage system can be connected to different inventory 

control systems (WMS) through standard interfaces. Automated 

input and output at a central point reduces personnel time. 

Incoming reels are recognized by specific characteristics and automatically 

scanned by unique barcode before they are fed into the 

system ready to be transported to storage locations. The gripper 

systems are driven by low-noise and low-maintenance servomotors 

and move simultaneously within a 5-axis system. Vacuum grippers 

transport component packages quickly and safely. 

The system can also calculate the smallest storage position the 

components require, in order to save space. As an example of storage 

capacity, up to 15,000 7 ” reels can be stored. Like the entire 

range of Totech Super Dry products, these are solutions for a new 

generation of electronics process problems. They are also cost efficient 

and extremely eco-friendly. They consume less energy than 

traditional methods, while at the same time reducing overall floor 

space and logistics. 

www.superdry-totech.com; www.melexis.com 




Finding the right solvent alternative 

Top ten reasons to switch to 

a better PCB cleaning fluid 

The electronics manufacturing industry has seen incredible changes over the years. The evolution to 

smaller, high density circuit boards with low standoff or zero-clearance components is ongoing. With 

the pervasive deployment of BGAs and microBGAs, MCM devices and even denser semiconductor 

packages, today’s PCBs run hotter, and are more complex than ever before. In addition, the pressure 

to produce PCBs faster and more economically amid ever-changing environmental regulations and 

requirements makes it an exciting but challenging time to be in the industry. So, it is imperative that 

PCB fabricators adapt to these changes to stay current, competitive and profitable. 

Emily Peck, Senior Chemist, MicroCare, LLC 

Source: MicroCare 

Each of these changes, especially those regarding environmental 

regulations, impacts the way printed circuit boards and other 

electronics parts are cleaned and prepped for further processing like 

conformal coating or packaging. Historically, brominated and chlorinated 

solvents like nPB (n-propyl bromide) and TCE (trichlorethylene) 

were used inside a vapour degreaser to reliably and economically 

clean PCBs. 

Following European regulations 

Once the chief cleaning solvents within industry, these legacy solvents 

are no longer acceptable for use without extreme restrictions 

in Europe. TCE has a carcinogen classification and has not been 

available for vapour degreaser cleaning in Europe, without special 

authorisation and stringent controls on factory emissions, since 

2016. And under EU REACH (registration, evaluation, authorisation 

and restriction of chemicals) regulations, nPB requires special permission 

for use in Europe as of July 2020. 

Even water-based or aqueous cleaning is proving to be problematic. 

Aqueous systems use water to clean. In some areas, water is a 

precious non-renewable resource giving aqueous cleaning systems 

a low score for environmental sustainability. They produce a waste 

stream that requires treatment before discharge. Wastewater must 

be filtered, distilled, deionized, and osmosis prepped ready for disposal. 

The cleaning agent added to the water can be toxic and poorly 

biodegradable, making disposal problematic. 

Finding the right solvent alternative 

In addition, the energy required to operate an aqueous system can 

be high. Aqueous systems require high temperatures to be effective. 

This means more power is needed. Also, aqueous machines 

are generally bigger and more complicated than solvent-based systems. 

They have larger pumps, sprayers, blowers and filters, as well 

as longer cycle times that consume more energy. This in turn means 

more electricity is consumed, adding to the global warming impact. 

So, what options are there for company owners, facility managers 

and environmental safety and health officers looking for better 

choices that are more efficient, easier to maintain and less hazardous 

for workers and the environment? Faced with the challenge of 

changing to alternative solvents, they are concerned about the impact 

the change will have on their bottom-line. 

Small, densely packed semiconductor packages 

make PCB cleaning a challenge. 

The biggest concerns are that switching out their cleaning solvents 

and processes will cause production down-time, require a big capital 

investment in new equipment or result in time lost training employees 

on new processes. Not to mention the worry that the new 

cleaning fluids will not deliver the same cleaning results as the old 

ones. 

Fortunately, there are a number of solvent alternatives on the market 

that clean just as well, if not better than the old solvents. In 

many instances, the changeover to these modern fluorinated fluids 

is simple and does not require any investment in new equipment. 

Benefits can include consistent cleaning quality, improved throughput 

and decreased energy usage. Plus, these next generation cleaning 

fluids have an excellent toxicity profile, making them safer for 

people and the planet. 

So, here are the top 10 reasons to switch to a better cleaning fluid 

today: 

• Same or better cleaning: The modern fluorinated cleaning fluids 

have been lab-tested and analyzed to ensure the cleaning results 

are reliable, consistent and just as good as the legacy solvents. 

Cleaning efficiencies were maintained or improved, even on hard 

to remove lead-free and no-clean flux residue. Although the aggressive 

cleaning fluids have high solvency to dissolve contaminants, 

they are formulated to not damage delicate PCB substrates 

or components. 



• Low cost of conversion: In many cases, most of the modern cleaning 

fluids can be used in existing equipment, using the same 

methods. After emptying and cleaning the vapour degreaser, many 

of the replacement cleaning fluids can be “dropped in” into the 

machinery without an appreciable change to the cleaning process. 

• Energy savings: Many of the modern cleaning fluids have a lower 

boiling point and heat of vapourization than the older solvents. 

This requires less energy consumption, resulting in an overall 

energy cost savings. 

• Improved efficiency: Since modern cleaning fluids boil at a lower 

rate than the legacy solvents, PCBs come out of the vapour degreaser 

cool enough to handle. No extra time is required for them 

to cool down. This allows technicians to move on to the next production 

process sooner, boosting the overall throughput and productivity. 

• Enhanced safety: Many of the new cleaning fluids are nonflammable 

for improved safety in the workplace. Their azeotropic properties 

ensure the compositions are thermally stable and safe to use 

throughout their service life. 

• Healthier for workers: Many of the substitutes for nPB, PERC or 

TCE have better toxicity profiles and higher TLVs (Threshold Limit 

Values) than the legacy solvents making them safer for workers to 

be around. 

• Better environmental impact: Since the modern cleaning fluids do 

not carry a heavy regulatory burden like some of the legacy solvents, 

switching to a modern cleaning fluid helps you improve 

your environmental footprint. Modern cleaning fluids boast ODP 

(Ozone Depleting Potential) ratings of zero and have a very low 

GWP (Global Warming Potential). This allows them to follow the air 

quality emissions regulations of the European Union, including 

REACH requirements. 

• Improved maintenance procedures: Except under the most extreme 

conditions, such as if exposed to a strong base or acid, or 

exposed to extreme heat, the modern cleaning fluids will not 

“turn acid”. They do not require chemical stabilizers or scavengers 

or the weekly testing required of the legacy chlorinated solvents. 

• Better working conditions: Most modern cleaning fluids do not 

have the same pungent, sweet smell associated with TCE or the 

other legacy solvents. Less fumes means a more pleasant work 

area and happier, more productive workers. In addition, since 

many of the next generation fluids are safer to use, PPE requirements 

may be less stringent, making the working environment 

more convenient and comfortable for employees. 

TCE (trichlorethylene) has a 

carcinogen classification 

and is under stringent 

control. 


Vapour degreasing reliably and economically cleans PCBs. 

• Easier handling, transport and disposal: Modern cleaning fluids 

are more easily recycled on-site because they do not contain any 

stabilizers or additives required when using legacy chlorinated solvents. 

Employees do not need the same type of intensive training 

to manage the new fluids safely, saving time and money. 

The change to a new cleaning fluid can be full of uncertainty. For 

many PCB fabricators who are looking to make the switch to a 

better solvent, it is imperative that they maintain their cleaning performance 

with minimal impact to throughput and productivity. The 

best course of action is to partner with a trusted electronics cleaning 

expert. A few companies have experienced field engineers that 

will audit the current solvents and processes, and make recommendations 

on the best fluids and process to make the switch to a 

better solvent easier. 

www.microcare.com 


Die rasanten Veränderungen in der Elektronikfertigungsindustrie 

mit zunehmender Miniaturisierung und Komplexität der Baugruppen 

machen auch die Umstellung auf ein besseres Lösungsmittel 

unerlässlich. Der Artikel stellt die zehn wichtigsten Gründe hierfür 

vor. 

Résumé 

Les changements rapides dans l’industrie de la fabrication électronique 

avec la miniaturisation et la complexité croissantes des 

sous-ensembles rendent également indispensable le passage à un 

meilleur solvant. L’article présente les dix principales raisons à 

cela. 

Резюме 

Быстрые изменения в производстве электроники с 

увеличением миниатюризации и сложности узлов делают 

переход на данное лучшее решение необходимым. В статье 

представлены десять наиболее важных причин этого. 




Staying one step ahead 

Distributor expands goods control 

with X-ray component counter 

The industrial area near Frankfurt exudes modernity and at the same time a cool serenity. 

This is where Chip 1 Exchange, a European distributor of electronic components, is located. 

Founded in 2001, the company prides itself on maximizing quality and speed, and always 

staying one step ahead of others. And that should remain the case. 

Guaranteeing number of components 

The company is a hybrid distributor – a dealer for some manufacturers 

– but also a broker. Brokers have to purchase components 

worldwide when customers need them, sometimes within a very 

short timeframe. Every now and then, it is necessary to do this with 

new, unknown suppliers, but only after consultation with the customers, 

as Mesut Aksu QC & Logistics Manager and Radiation Protection 

Officer states expressly. 

In order to ensure flawless quality for customers, the company has 

a high-quality check, which the components must pass. This is communicated 

openly with the customers. This is because the worldwide 

acquisitions, which also consist of overstocks or subsets of 

customers, require extensive tests so that defective components or 

even counterfeits can be screened. These tests include visual testing, 

X-ray testing, Acetone Test, chemical checking and now X-ray 

counting. Chip 1 customers in the automotive, medical and telecommunications 

sectors can expect and rely on component quality, 

and now – thanks to Assure- they are guaranteed the exact number 

of components. 

Chip1 Exchange has acquired the automatic component counter solution, Assure. 

Source: Nordson Dage 

The company is the first and only hybrid distributor to offer its 

customers bundles with guarantees an exact number of pieces. 

For half a year, they have been using the sophisticated software 

technology of the Assure automatic component counter from Nordson 

Electronics Solutions. Throughput at hybrid distributors is always 

high – goods which arrive in the morning often have to be released 

in the evening, and must be inspected accurately, counted, 

labelled and packaged. 

Customers expect this level of turnaround time, and Chip 1 Exchange 

meets these requirements quickly and easily. Every day, 

there are about 85 deliveries that need to be processed further: 

often containing 250 reels or more, which must be counted and 

checked immediately upon receipt of goods. Sometimes a single 

component can cost up to 100 Euro– so the exact number of pieces 

is important. 

Chip1 Exchange offers their customers a customized PDF report, 

containing the evaluation image, the corresponding article number, 

and the most important information for the customer. 




Assure will count reels in 

less than 10 seconds, no 

matter the size or the shape 

of the container. 

„It‘s not that easy to give up control. This has to be built up slowly. 

What used to be done by hand,“ reports Mesut Aksu, „is now carried 

out using X-ray technology. So, I have to entrust my goods to 

technology.“ However, it is now the case that 80 % of the goods 

must go out the same day. If the employees counted manually, the 

entire process per role would take about four to five minutes. With 

Assure, counting reels takes less than 10 seconds, no matter how 

big it is or what shape the container has. If four reels are scanned at 

once, it takes only 20 seconds”. Aksu is highly satisfied, because the 

machine not only saves time, but also allows employees to take 

care of other processes. 

Delivering unique requirements 

After careful examination of all machines on the market, Chip 1 

chose Assure as the market and technology leader. The company 

commissioned special specifications that were implemented 

quickly and easily. For example, the software from the automatic 

component counter has a key code that allows the respective operator 

to log in via his personal identification card. The counting results 

are automatically assigned to the respective operator. 


Their most important feature request was a customized report, containing 

the evaluation image, the corresponding article number, and 

the most important information for the customer, all saved in a 

single PDF document. This is provided to the customer as added 

value – with the guarantee: Counted by Assure. 

The automatic component counter solution has been installed in the 

specially separated ESD area of the warehouse, where it is responsible 

for ensuring the stock during receipt and quality checking. The 

goal for the company is to completely exclude complaints due to 

shortages. They can also alert suppliers if the number of components 

delivered does not match with the number on the delivery 

note, as soon as the quick count is complete. 

Thanks to the speed of the component counter, the company can 

now finally count the full amount of goods received instead of just 

examining samples as before. 

Always one step ahead 

„Assure has not only convinced us by its speed,“ Aksu emphasizes. 

„The machine also meets the high ESD protection requirements 

that we place on our processes. Assure is designed to be absolutely 

user-friendly and the Dage team manages to simplify everyday work 

from the customer‘s point of view.“ 

Chip 1 Exchange has been anticipating the future of the company 

with Assure and will equip its new 5,000 m 2 warehouse, which is located 

in the USA, with the X-ray scanner. 

Accurate material stocks secure the future of a company – at a time 

when resource planning of people (time) and materials (components), 

transport and optimization are crucial. 

www.nordsondage.com 


Ein führender Distributor für elektronische Komponenten erweitert 

seine Warenkontrolle mit einem innovativem Röntgenscanner und 

ist damit durch garantiert exakte Stückzahlen stets einen Schritt 

voraus. 

Résumé 

Un distributeur majeur de composants électroniques étend son 

contrôle des marchandises grâce à un scanner à rayons X innovant 

et a ainsi toujours une longueur d’avance grâce à la garantie 

de quantités exactes. 

Резюме 

Ведущий дистрибьютор электронных компонентов расширяет 

свой товарный контроль с помощью инновационного 

рентгеновского сканера и, следовательно, благодаря 

гарантированному точному количеству всегда находится на 

шаг впереди. 


The automatic component 

counter has a key 

code that allows the 

respective operator to 

log in via his personal 

identification card. 




Although there is a misconception of the abilities of AI, some current excellent applications involve speech recognition, text-to-speech, and noise detection/cancelation. 

Factory digitization 

Artificial Intelligence is 

not thinking yet 

Artificial Intelligence remains an emerging field. It has entered the mainstream consciousness through 

the abstract discussions and concerns among folks like Elon Musk and Mark Zuckerberg regarding 

future risks, advertisements that put forward an image of AI capability that evokes science fiction, and 

the increasing rate of movies exploring AI in robots that often end badly for their human progenitors. 

All of this has resulted in a flawed public perception of the actual state of AI. The following briefly 

summarizes Aegis’ view on the current technical capability and application value of AI, and then 

where the company thinks this capability can have practical application in manufacturing. 

Jason Spera, CEO, Aegis Software 

At present, AI is not ‘thinking.’ It cannot simulate or approximate 

the human capacity for intuition, inference, creation. In reality, it 

is not yet even close. It likely will be at some time, and we need to 

think toward that and plan for that, but to envision current applications 

predicated on a false belief in actual cognitive ability in AI is 

wasteful and unproductive. So, what is AI good for? One need only 

look slightly below the surface of even the marketing for AI applications 

one might see on television. 

Artificial Intelligence applications 

Finding snow leopards on a mountain face against which they are 

nearly perfectly camouflaged — finding the pattern within an archeological 

site image that would suggest where something of interest 

is located. These image processing applications are ideal for AI 

— because AI is good at finding patterns within images that, while 

humans also can do it, we find it tedious, slow, and are sloppy at it. 

AI algorithms don’t bore or degrade in their diligence and are even 

better than humans at reliably finding pattern matches at great 

speed in huge volumes of images. This pattern-matching capability 

is a great application for AI. 

Other current excellent applications of AI involve speech recognition, 

text-to-speech, and noise detection/cancelation. Once taught 

and given parameters, AI is excellent at evolving automatically to 

cancel noise from content more fluidly, and refining the way it 

understands a speaker, and how it might speak back. 

The above examples, while not exhaustive, have commonality. 



Whether sound waves or raster images, AI excels at learning patterns, 

automatically evolving its comparative patterns, and making 

matches and suggestions. AI is differentiated from traditional algorithms 

in its ability to self-learn. In the snow leopard example, it 

would be possible to write a traditional algorithm that finds snow 

leopards, of course. But for this algorithm to improve, coders would 

have to continually refine the algorithm, and publish new versions 

regularly. The AI version gets better on its own because it learns and 

continuously refines the algorithm itself. AI is also adept at highspeed 

acts of tedium humans loathe, but this learning also enables 

it to become better at it—on its own—over time. The more it does, 

the better it becomes, so to speak. It is in this area of detecting 

anomalies or changes in patterns, becoming better at it with greater 

use and exposure to the problem, and pointing them out that AI has 

current and powerful potential. 

This pattern recognition and mapping extend to multidimensional, 

large volumes of patterns within data sets. Humans are woefully 

lacking in this area. Imagine extending the snow leopard search, not 

to one mountain but thousands, then add a third dimension to the 

data set of each. 

Managing big data 

That brings us to practical applications in manufacturing. Aegis entered 

this exploration from the perspective of what is lacking in 

MES/MOM and the digitization of factories, rather than from what 

AI can do or cannot do. Another element to the consideration was 

the fundamental tenet of Industry 4.0, which is a fully automatically 

adapting factory environment. This scenario led Aegis to believe 

that, ironically, it is factory digitization that has opened an opportunity—or 

more accurately, a need—for AI. 

IIoT and factory digitization has caused a massive increase in data 

sets available about everything happening in production. The precise 

real-time nature of each detail of production, materials, quality, 

operator actions, test data, throughput, errors, etc. is all entering 

giant data reservoirs. So, the question becomes, we have this data, 

why are we not seeing the grand benefits of Industry 4.0? The 

answer is simple—we aren’t doing anything with the data because 

there is too much for any human to make sense of it quickly enough 

and to derive any actions as a result of it. 


Der Artikel zeigt die Einschätzung, wo die gegenwärtige technische 

Fähigkeit und der Anwendungswert von KI liegt und wo diese 

Fähigkeit praktische Anwendung in der Fertigung finden könnte. 

Résumé 

L’article présente une évaluation de la capacité technique actuelle 

et de la valeur d’application de l’IA, ainsi que là où cette capacité 

pourrait trouver une application pratique en fabrication. 

Резюме 

В статье даётся оценка текущему техническому свойству и 

прикладная ценность искусственного интеллекта, и где это 

свойство может найти практическое применение в 

производстве. 


This data gap is where the company believes AI will add value. The 

application of AI to continuously monitor and learn from the massive 

incoming data about production and do a few things with that to assist 

its human colleagues. First, its value comes in detecting areas 

for improvement to the processes by revealing causal relationships 

that humans could never detect. Detecting multidimensional cause/ 

effect from factors not just on an assembly line but also from incoming 

materials, out to shipment, and back to design. This is a 

Factory digitization has opened a need for Artificial Intelligence, especially 

when it can detect areas for improvement by revealing causal relationships 

that humans could never detect. 

massive data set continuously in flux—which is where AI excels at 

establishing baseline patterns and then the deviations from it. This 

would enable AI to reveal opportunities for continuous improvement, 

to ultimately direct human colleagues to focus their investigation 

and apply their creativity, etc. 

Another potential value is in the area of scheduling and simulation. 

Once the AI has developed its baseline pattern of ‘normal’ or even 

‘ideal’ operations, it is in a great position to apply that to ‘what if’ 

scenarios to help its human colleagues to see the impact of a 

sudden schedule change. However, it would not be doing this in the 

current algorithmic way, but more based on reality borne of extremely 

thorough historical patterns as well as the reality from production 

at the moment. This could usher in true, instantaneous production 

adaptation to nearly continuous flux in demand, materials 

supply, and product types. 

In the end, all of the envisioned applications are using AI to augment 

human shortcomings in the areas of pattern detection and the 

analysis of massive data sets in real-time to both see patterns, see 

changes to baseline patterns, and reveal the cause/effect of changing 

a pattern that is already understood. 

www.aiscorp.com 

Jason Spera is the co-founder 

of Aegis Software. 



Advancing the smart factory 

Smart electronics production 

with PC-based control 

Two companies in China, CYG Intelligent Automation Co., Ltd. (CYGIA) and CYGDM, have used 

PC-based control technology from Beckhoff to develop a smart factory platform with unified interfaces 

and protocols as part of a new and flexible manufacturing strategy for electronics products. The 

platform combines sensors, actuators, operator terminals, control systems and communications 

equipment in an intelligent network that connects multiple users, including humans with machines, 

and machines with services. From an Industry 4.0 perspective, the platform maximizes integration, 

both at the device level and at the vertical and horizontal production levels. 

Kevin Gao, Technical support engineer, Beckhoff China 

Formed in 2006, CYGIA is one of China’s foremost high-tech 

companies. Its business is customer-specific automation and 

test solutions for industries such as consumer electronics, semiconductors, 

automotive, energy, medical engineering and lighting technology, 

among others. CYGDM, founded in 2015, is a software and 

hardware services vendor specialized in developing and implementing 

smart factory solutions. Examples of projects include the ALC 

line control system, the iSPC smart data analytics system, and 

smart warehouse management and logistics systems. 

Open control technology for the smart factory 

CYGIA’s smart factory solution utilizes IoT and monitoring technology 

to facilitate information management, to track the production 

process better, to reduce manual intervention on production lines, 

and to streamline production planning. Other technologies deployed 

as part of the solution include simulation, multimedia, and augmented 

reality. CYGIA and CYGDM chose powerful CX2030 and 

CX9020 embedded PCs from Beckhoff to deliver the requisite computing 

power. The CX2030 handles higher-level hub control in the 

smart factory, while the CX9020 is used as control platform for distributed 

sub-stations. The open architecture of PC-based control, 

combined with ultra-fast EtherCAT communication technology, 

meets all their requirements when it comes to keeping response 

times as short as possible, while at the same time supporting timedivision 

multiplexing and multitasking, programming in high-level 

languages, and extensive data storage capacity. 

On the software side, the integration of the TwinCAT 3 automation 

software into Visual Studio is a key benefit for CYGIA’s experts: In 

their view, the standardized bottom-layer control platform, created 

in TwinCAT 3’s object-oriented development environment, combined 

with the upper-layer control platform developed in .NET, has 

made it easier to integrate a wide variety of devices and to shorten 

the time required to develop their smart factory solution. Plus, 

being able to develop the software on a modular and distributed 

CYGIA’s smart factory solution for electronics manufacturing. 

Source: CYGIA, China 




Information displayed on the central control platform’s HMI. 

basis, they say, results in greater software efficiency while minimizing 

development and maintenance costs. In the higher-level control 

system, they use both ADS.Net components and the Dynamic Link 

Library (DLL) to implement asynchronous communication between 

the server and multiple clients. The entire communication architecture, 

they claim, not only saves time, it is efficient and compatible, 

too. In addition, the TwinCAT automation interface enables developers 

to program device interaction using COM technology. 

With TwinCAT, CYGIA’s engineers can use a unified, object-oriented, 

modular program framework, structured text, object-oriented programming 

and customer-specific libraries – all of which help streamline 

the development of this complex system. Joshua Wang, R&D 

Director at CYGIA, explains: “We’ve succeeded in improving programming 

efficiency through modularization and standardization. 

We only need to modify a few methods when developing new production 

technologies. The program may be large and complex, but 

we can reuse the code efficiently, nonetheless. The program has a 

clear structure, is easy to read, and is highly portable.” 

It makes the most of TwinCAT 3’s built-in capabilities for system 

configuration, PLC code development, motion control configuration, 

bus and module configuration, and HMI development, as well as its 

oscilloscope functionality. And the program structure, process control, 

data structure, alarm release and security control have all been 

standardized as well. 

Smart factory solution for mobile phone 

production 

The software and hardware from Beckhoff perfectly fulfill CYGIA’s 

requirements for smart solutions in electronics manufacturing. 

Compared to a conventional setup with separate production 

stations, the company’s system can achieve greater manufacturing 

and supply-chain flexibility and improve capacity utilization. For instance, 

it enables the ERP, MES and monitoring systems involved in 

the manufacture of mobile-phone circuit boards to exchange data, 

resulting in comprehensive process automation that spans everything 

from order booking and handling, material distribution, product 

manufacture and inspection to packaging, warehousing, logistics 

and transportation. The smart factory’s system architecture 


combines order, asset and quality management functions with a 

management dashboard, inventory control and product traceability. 

The intelligent warehouse assigns codes to all goods and creates 

unified racks and pallets that are carried by forklifts or shuttles into 

the intended positions. Each storage location is controlled by the 

warehouse management software. Product locations, inventory levels, 

open storage locations and storage strategies are all administered 

through a parameter management system. The CX9020 embedded 

PC is the core element in inventory control, running the PLC 

program, connecting to the local MES over TCP/IP, and operating as 

an NC controller for material requirements planning. It also connects 

with the extended part of the feed and removal mechanism, 

in a chain topology, via an EK1110 EtherCAT extension. 

The CX9020 embedded PC that controls the smart warehouse. 

The main elements in the automated production line include hollowboard 

printing, surface mounting, reflow welding, dispensing, 

screw locking, automated optical inspection, integrated and functional 

circuit testing, and packing and unpacking. The line has three 

CX2030 embedded PCs in total, which communicate at high speed 

with the higher-level central control system and are essential to ensuring 

efficient production and precise fabrication of semiconductor 

components. 



The CX2030 embedded PC 

(left) that serves as the 

main controller for the 

automated production line. 


The master CX2030 runs both the PLC program and the motion 

control and HMI software. It also sends data bidirectionally at high 

speed between the control system and the MES over TwinCAT TCP/ 

IP (TF6310), and controls the printing, surface mounting and reflow 

welding processes. Here, TwinCAT PLC/NC PTP 10/NC I (TC1260) 

provides full motion control functionality that can dynamically position 

20 EtherCAT servo axes per machine. The NC I interpolation 

function serves to achieve smooth, steady, coupled movements on 

two axes and to control the arc-welding process. 

The second CX2030 embedded PC runs PLCs, motion control and 

HMI software, handles communication over TCP/IP, and exchanges 

data with the ALC line control system. It also receives instructions 

from the MES over TCP/IP to run tests and execute packing and unpacking 

processes. It can flexibly configure ten EtherCAT servo 

axes through a synchronization device that can switch quickly and 

efficiently between specific test environments for different products. 

The third CX2030 handles PLCs, motion control and HMI software, 

and in addition controls a high-resolution TCP/IP camera for 

optical inspection. 


Eine Smart-Factory-Plattform stellt im Rahmen eines flexiblen Fertigungskonzepts 

für Elektronikprodukte einheitliche Schnittstellen 

und Protokolle bereit, so dass ein vollständiger Automatisierungsprozess, 

vom Auftragseingang bis zum Transport, realisiert wird. 

Résumé 

Une plate-forme Smart Factory fournit des interfaces et des protocoles 

uniformes dans le cadre d’un concept de fabrication flexible 

pour des produits électroniques, ce qui permet de réaliser un processus 

d’automatisation complet, depuis la réception des commandes 

jusqu’au transport. 

Резюме 

«Умная фабрика» предоставляет для электронных устройств в 

рамках гибкой производственной концепции 

унифицированные интерфейсы и протоколы, позволяющие 

реализовать полный автоматизированный процесс со стадии 

поступления заказов до доставки. 

EtherCAT technology boosts system performance 

CYGIA chose EtherCAT as a high-speed communication system to 

ensure fast, precise transmission of sensor signals. The company 

runs master communication on its automated production line over 

EtherCAT in a star topology. Slave devices are easy to connect, 

which simplifies management, maintenance and expansion. A line 

topology is used at sub-station level to keep the wiring as simple as 

possible. 

Says Jianming Huang, a senior electrical engineer: “The EL1809 

and EL2809 HD EtherCAT terminals are not just highly compact and 

inexpensive, they operate on multiple channels and can be configured 

flexibly for different topologies. They also support offline configuration 

and hot connect groups, which makes them much easier 

to set up. In addition, EtherCAT provides a wide range of useful information, 

such as diagnostic codes, diagnostic types, text IDs and 

time stamps. This helps to locate and fix master-slave communication 

outages potentially caused by EMC disturbance, cable damage 

or equipment faults. This makes maintenance much more efficient.” 

Future development potential 

The company’s aim with its smart factory solution is to integrate assembly 

and manufacturing units for discrete electronic components 

within a unified production system. Other goals are to connect production 

plants, to visualize production data, to make production processes 

transparent, and to create fully automated production sites. 

Given the broader trend toward Industry 4.0, CYGIA also needed 

smart factory software that would enable access to a wide range of 

data resources, including cloud computing, big data, and IoT. 

With TwinCAT 3, Joshua Wang has found the right solution and is 

now looking forward to the new production model the company has 

lined up: “We’ll gradually incorporate TwinCAT 3 functionality to support 

big data analysis, IoT advancements, and machine vision in future 

upgrades. Going forward, this will further enhance the setup of 

this hybrid control system to fully exploit the benefits of cloud data 

storage and distributed data interaction.” 

www.beckhoff.com; www.cygia.com 




Introducing flexible laser marking solution 

The miniaturization of the printed circuit board with simultaneous 

high assembly density increases the requirement to apply codes in 

the smallest possible space. Asys has the answer: the laser marking 

system Insignum 6000 uses a CO2 laser and a positioning accuracy 

of ± 100 μm@5Sigma to mark codes smaller than 1 mm. Therefore, 

module sizes of < 3 mil (0.08 mm) are possible. 

A product becomes a unique specimen by providing it with a unique 

code. Traceability is the big keyword here. In times of electromobility 

and 5G technology, high performance electronics are applied to a 

smaller PCB area. Accordingly, the markings must also shrink. This 

requires a new type of technology in the field of laser marking. 

Laser marking with CO2 

The company’s laser experts have taken up the challenge. They have 

succeeded in guiding the laser beam through optics in such a way 

that a small spot is created with which 3 mil codes can be generated. 

This technology is integrated in the new laser marking system 

Insignum 6000 3 mil. The system uses a CO2 laser and a positioning 

accuracy of ± 100 μm@5Sigma to mark codes smaller than 1mm. 

Therefore, module sizes of < 3 mil (0,08 mm) are possible. 

Flexible platform – Configuring the machine 

With this flexible solution, it is possible to realize any requirements 

in the field of laser marking. In addition to the realization of module 

sizes smaller than 3 mil, model variants for double-track solutions, 

the processing of large format printed circuit boards and the marking 

of e.g. ceramics, plastics and DBC substrates are also possible. 

Transport system and laser types are individually adapted to the process 

requirements. Different laser sources such as CO2, fiber, 

green and UV can be used in the system to meet any special 

requirements. In the basic version, the plant is equipped with a 

10-Watt CO2 laser, X/Y linear axis and transport system. 

The benefits: 

• Miniature markings: codes smaller than 1 mm with module sizes 

< 3 mil 

• High-precision marking: with a positioning accuracy of ± 100 μm @ 

5 sigma 

• Flexible: different laser sources can be integrated 

www.asys-group.com 

PanaCIM-EE Gen2 - 

Smart Factory solutions 

for today and tomorrow 

Shorter cycle times and optimized 

line productivity thanks to production 

planning at line level 

Digitization of all production steps and 

cross-plant inventory management thanks 

to systems for maintenance and asset 

management 

The laser marking system Insignum 6000 uses a CO2 laser to make markings 

smaller than 1mm. 

Source: Asys 

industry.panasonic.eu 




Solution for assembly of press-fit contacts 

The flexible automatic inline system, FlexPresser II 

has a cell with a rear feeder bank, for all sorts of 

component feeding. 

With the FlexPresser, IPTE, a supplier of 

automation solutions for the electronics and 

mechanics industry, offers innovative, powerful 

and flexible press-fit solutions for almost 

every customer application. The next generation 

of this proven machine for the assembly 

of press-fit contacts, the FlexPresser 

II, is based on the High Dynamic Cell, the 

company’s new production cell, and is now 

available. 

The basis of the machine is a cell with a rear 

feeder bank, for all sorts of component feeding. 

The most important highlights of the 

FlexPresser II are a three-part belt segment 

for the PCB transport, the highly dynamic linear 

motors for moving the setting unit and a 

PCB support to absorb the joining forces. 

Source: IPTE 

High press-in forces of up to 7,000 Newton 

are possible, due to the adapted cell design. 

The IPTE FlexPresser II stands out: 

• Designed as a fully automatic inline system 

and easy to integrate into production lines: 

Feeding and removal of printed circuit 

boards with SMEMA interface. 

• Free programmable component positions 

(x, y, angle of rotation) creates huge flexibility 

during pickup and press-in, thus not only 

for layout or component changes purposes. 

• The wide feeder bank (max. 12 places) 

allows the docking of different component 

feeders such as stick feeders, tray feeders 

and sorting conveyors. Further customerspecific 

feeders are easy to integrate. 

• Excellent process monitoring through force 

and travel-dependent pressing-in. 

• Easy to adapt to application-specific 

requirements. 

• Press-in forces of up to 7,000 N. 

• Low maintenance linear motors allow high 

dynamic and precise positioning of the setting 

unit. 

• An optional vision scan of the component 

pins with subsequent position correction 

compensates component tolerances and 

improves the quality of the press-in process. 

• An automatic gripper quick-change system 

allows different component types to be 

pressed in per PCB without operator intervention. 

• A quick-change system for the PCB support 

plate minimizes set-up times for other PCB 

types. 

• Stepless variable press-in speeds allow 

flexible adaptation to different setting 

tasks. 

• For smooth maintenance access, the component 

feeders are quickly undocked from 

the machine and easily re-docked afterwards. 

• For process monitoring, the placement process 

is carried out with a controlled placement 

force. 

High dynamic cell – the 

production cell 

IPTE is successively converting all its production 

cells to the new design. In addition to 

align to the requirements of Industry 4.0, to 

introduce a new visual appearance and to optimize 

the arrangement of machine components, 

the new generation of the company‘s 

production cells adds another step into the 

further standardization of the so-called standard 

machines. The new High Dynamic Cell 

series is available with a height of two 

meters, three widths (1 m, 1.5 m & 2 m) and 

three depths (1.5 m, 1.7 m & 2 m). They are 

scalable depending on the application and 

customer requirements. 

With the new production cells, IPTE offers a 

powerful and modern concept for the automation 

of various manufacturing processes 

in electronics and mechanical production. 

This new line contains many improvements 

compared to the previous generation. 

www.ipte.com 

Robot flexibility boost with software for feeder 

Yamaha Motor Europe Factory Automation 

section is giving customers extra power to 

boost the pick-and-place flexibility and productivity 

of their Scara and cartesian robots 

by providing a free software plugin for the 

Asyril Asycube intelligent parts feeder. 

The software eases integration of Asycube 

and lets the intelligent feeder take advantage 

of RCXiVY2+ high-speed, high-resolution vision 

system. Any of the company’s Scara or 

cartesian robot compatible with the RCX320 

or RCX340 controller can rely on Asycube to 

quickly sort and orientate bulk components for 

easier, faster, pickup. This feeder intelligently 

adjusts vibration frequency, amplitude, and 

platter orientation to position the parts optimally, 

leveraging advanced 3-axis vibration technology. 

A standard Ethernet connection simplifies 

setup and scalability is assured by con- 

necting multiple feeders via a switching hub. 

“The plugin software for Asycube easily integrates 

the Asyril flexible feeder with Yamaha’s 

fast and agile robots and efficient 

RCXiVY2+ vision system to bring further 

flexibility and increase productivity,” said Ryosuke 

Nakamura, Branch Manager of Yamaha 

Motor Europe Robotics Division. 

The plugin integrates Asycube with Scara and 

cartesian robots and sharpens pick-and-place 

flexibility with Yamaha RCXiVY2+ non-stop vision. 

Source: Yamaha Motor Europe N.V. 

The RCXiVY2+ vision system maximises the 

advantages of Asycube with features such as 

non-stop vision that checks the pickup orientation 

on the fly. This system, developed using 

knowhow gained from high-speed surfacemount 

electronics assembly, increases productivity 

by up to 20 %. Any gripping deviation 

is automatically corrected, allowing picked 

parts to be placed or assembled directly. 

The Asycube plugin is available to download 

for registered users of the company’s robot 

member website. It also contains information 

to help select equipment and accessories 

such as actuators, tips on product 

design for robotic assembly, and help to 

setup, program, and maintain Yamaha industrial 

robots. 

www.yamaha-motor-im.eu 


Green vapor degreasing cleaners 

MicroCare’s vapor degreasing chemistries 

help improve the manufacturing process of 

electronic devices. The Tergo family of cleaning 

products boasts impressive ‘green’ credentials. 

“When it comes to selecting cleaning solutions 

for vapor degreasing, we are seeing a 

change to the approach in which the electronics 

industry is choosing their cleaning 

processes,” said Rob Lee, Senior Market and 

Technical Manager. “A very important consideration 

is its sustainability. Cleaning processes 

must minimize any negative environmental 

impact, while also conserving resources 

like energy and water. At the same 

time, it has to clean effectively. This is particularly 

important as electronic components 

become smaller and more intricate.” “Another 

significant factor is ensuring the safety 

of the workers. The Tergo product range upholds 

regulatory compliances with excellent 

toxicity profiles, making them safer for the 

environment and people. The vapor degreasing 

and the product range, including Tergo 

high performance flux remover are having a 

very positive effect on long-term sustainable 

cleaning for companies around the world.” 

The Tergo high performance flux remover is a 

non-flammable fluid engineered for cleaning 

PCBs in vapor degreasers. It features a nonvolatile 

additive specifically developed to 

clean challenging high-temperature solder 

pastes and flux residue, stubborn white residue 

and water-soluble (OA) fluxes. This flux 

remover is a drop-in replacement for many 

older legacy chemistries that are being 

phased-out under environmental, health, 

safety or economic pressures. It also makes 

it an excellent replacement for power-hungry 

aqueous cleaning machines, therefore helping 

to conserve natural resources. 

The Tergo chlorine-free cleaning fluid is a nonflammable 

cleaner, which contains no harmful 

chlorine-containing elements. This ensures 

strict global regulatory and environmental 

boundaries. It is an effective degreaser offering 

comprehensive and reliable cleaning of 

the most challenging contamination including 

The Tergo high performance flux remover is a 

non-flammable fluid engineered for cleaning PCBs 

in vapor degreasers. 

complex shapes and delicate substrates. 

In addition, since the vapor degreasing process 

is automated, it provides an effective 

way to batch clean circuit boards with just 

one operator. It easily meets local and global 

health agency Covid-19 social distancing recommendations 

without manufacturers needing 

to stagger production schedules or run 

extra shifts. 

www.microcare.com 


 

 

 

‹ Process control by KY 

realtime monitoring 

‹ User-friendly library 

manager for local 

access to global 

database 

Koh Young Europe GmbH 

Industriegebiet Süd E4 

63755 Alzenau 

Tel. +49 (0)6188 9935663 

E-mail: europe@kohyoung.com 


‹ Improvement of 

processes through 

 

data 




Injection principle in vapour phase soldering 

Whether in aerospace technology, medical 

electronics, e-mobility and automotive, 

power electronics, LED production or in the 

aerospace & defence sector – the areas of 

application for reflow soldering are diverse. 

Electronic components only function in end 

devices thanks to high-quality soldering of 

the electronic contact points. But what if the 

components on the circuit board are very 

large or of high-mass? Or if vacuum soldering 

processes need to be realised inline? 

This is where the efficiency of condensation 

soldering (vapour phase soldering) stands 

out, for example with the Condenso series 

systems from Rehm Thermal Systems. The 

heat transfer is up to ten times higher than 

with convection soldering, so even large, 

high-mass boards can be reliably processed 

in a stable atmosphere and with the added 

advantage of their innovative vacuum technology. 

Condensation with injection 

principle 

Vapour phase soldering is not a new invention, 

but with the company’s patented systems 

within the Condenso series, a greater 

range of flexibility is provided for the soldering 

process than can be achieved with other 

more conventional methods. The usage of an 

injection principle and the control of the temperature, 

the number of injections, as well as 

its quantity, and the pressure (vacuum) facilitates 

more precise and more diverse reflow 

profiling. The soldering process takes place in 

a hermetically sealed process chamber. 

With condensation soldering, a film of liquid 

builds up with the aid of the heat-conducting 

medium, Galden, which is distributed 

throughout the entire process chamber and 

The Condenso series provides a greater range of flexibility for the soldering process. 

surrounds the whole assembly and evaporates. 

The vapour condenses for as long as 

the assembly takes to reach a soldering temperature 

of between 240 and 260 °C. Galden 

is perfluoropolyether, a liquid polymer that 

consists of carbon, fluorine and oxygen. 

Rehm uses the patented injection principle 

to achieve better control of the condensation 

phase. In the process, exactly the right quantity 

of Galden is added at the correct time. 

With this procedure, the latent heat that is 

released during the change in state of the 

medium from its vaporous form to a liquid is 

then used to warm up an assembly evenly 

and constantly. Galden is a self-limited medium. 

This offers additional safety as the components 

cannot overheat. 

Vacuum – for maximum 

reliability 

This condensation principle with vacuum has 

proven to be extremely efficient and reliable 

in practice. Due to the increased demand for 

high-performance electronics and safety-relevant 

electronic components, a vacuum soldering 

process is increasingly sought after. 

The vacuum technology of the Condenso is 

therefore used in an extremely varied range 

of processes. Reflow soldering reduces oxidation 

and increases solder joint reliability by 

reducing voids. This results in soldering 

points with a surface bonding percentage of 

up to 99 %. In addition, a vacuum can already 

be drawn during the heating phase before 

the actual soldering process. This facilitates 

not only a more even distribution of the 

Galden vapor in the process room but also 

the degassing of solvent and moisture from 

the soldering paste. Furthermore, in addition 

to the temperature, the atmosphere can also 

be varied over the entire time in the process 

chamber. 

Proven technology – adapted 

for the entire series 

The range of condensation soldering systems 

from the company has been continuously 

expanded due to market requirements. 

Thus, their customers now have access to 

optimised production equipment for the condensation 

soldering processes. The flexible 

system variants of the Condenso smart 

series can be integrated in an extremely 

broad range of production environments. Regardless 

of whether batch operation, inline 

connection or soldering in the run-through 

process is required, Rehm provides maximum 

process reliability for all areas. 

www.rehm-group.com 

Source: Rehm Thermal Systems GmbH 

Manual cleaning bath concentration measurement 

Source: Zestron Europe 

The bath analyzer is a manual test that enables a reliable 

concentration measurement of cleaning baths. 

In order to achieve good cleaning results consistently, 

the cleaner concentration in the 

cleaning bath should remain constant. The 

concentration can change through various 

process factors like carry-over or thinning. It 

is therefore advisable to check the concentration 

over time. 

A simple method for regular concentration 

checks is the Zestron Bath analyzer. The 

quick manual test enables a reliable and 

exact concentration measurement of cleaning 

baths whether new or used. In addition, 

the inexpensive test method is compact and 

portable, enabling flexible usage throughout 

the production environment. For the bath 

concentration measurement of alkaline 

cleaning media, the Bath analyzer 10 is recommended, 

because it also indicates the alkalinity 

of the cleaner using a color code. The 

Bath analyzer 20 was designed exclusively 

for the measurement of pH-neutral cleaning 

media. 

The Zestron Eye is an automatic method that 

displays cleaning agent concentration measurement 

results in real time and is an alternative to 

the manual Bath Analyzer products. 

www.zestron.com 


Soldering solution adapts to all future requirements 

With the SelectLine platform, Seho developed 

a selective soldering system 

that provides the highest precision and 

solder joint quality and features maximum 

flexibility. The machine concept is 

consistently modular, thus ensuring clear 

cost benefits. Several modules with different 

dimensions can be configurated individually 

with fluxer, preheatings, soldering 

units, cooling modules, selective 

brush unit and AOI system. Thus, it 

adapts to virtually any manufacturing 

requirement and if the production conditions 

should change, it may be expanded, 

the configuration can be modified, or SelectLine 

modules can be shifted to different 

manufacturing lines at any time. Up 

to six soldering units and more than 15 

parallel workstations can be integrated in 

one system. 

Electro-magnetic soldering units with innovative 

nozzles for mini-wave and 

multi-wave soldering processes are part 

of the standard machine equipment. 

Maximum throughput requirements are 

met with the Synchro concept, patented 

by Seho. This intelligent software feature 

coordinates the soldering process with 

several soldering units for one assembly 

type in such a way that the cycle time is 

nearly halved without the need for significant 

investment. If different products 

are manufactured in mixed operation, 

the SmartSplit function ensures automatic 

split of the available soldering 

units, thus providing maximum throughput 

rates. 

Automatic ultrasonic cleaning of solder 

nozzles is another highlight in the soldering 

area. The solder nozzle is gently 

cleaned and completely re-wetted. The 

SelectLine is ideally suited for using the 

new LongLife mini-wave solder nozzle. 

This new nozzle features a lifetime that 

is at least three times longer than that of 

conventional nozzles. Therefore, the an- 

The SelectLine platform can be easily 

be expanded or modified if the production 

conditions should change. 

nual savings potential is remarkable. 

Maintenance requirements for the new 

nozzle are significantly reduced. The 

LongLife solder nozzle does not need to 

be cleaned or re-activated throughout a 

complete production shift. In addition, 

there is no activation needed prior to 

production start. 

Moreover, the solution is perfectly prepared 

for the constantly growing requirements 

in the manufacturing of next-generation 

products, such as 5G antennas or 

LED technology. By means of an automatic 

software switch, the system is able 

to process virtually endlessly long PCBs. 

The software automatically coordinates 

and optimizes the assembly transport 

and the positioning of the process 

stations. As the individual processing 

stations thereby do not have to match the 

actual length of the assemblies, it stands 

out for its very compact design. This minimizes 

production floor costs, resulting in 

an excellent cost-efficiency. 

The SelectLine provides a complete hardware 

and software package for 100 % 

automated process control. The flux 

quantity monitoring system and gradientcontrolled 

temperature profiles in the preheat 

area, automatic monitoring of the nitrogen 

quantity and nitrogen quality, the 

touchless wave height control or automatic 

setup control and tool measurement 

are only some of the monitoring 

functions that ensure a reliable process. 

The machine can be equipped with a selective 

brush system for automatic removal 

of solder balls and an AOI system 

for automatic inspection of solder joints 

immediately after the soldering or brushing 

process. The advantages are obvious: 

Safe and reliable processes on the 

one hand and reduced overall production 

costs on the other hand. 

www.seho.de 

IPTE strenghtens its 

presence in E-Mobility 

On October 22nd this year, 

AZL together with an 

international industrial 

consortium consisting of 

automotive OEM Audi and 

suppliers along the value 

chain, including IPTE, 

will launch a joint project to 

develop a multi-material 

battery casing. 

The 8-month product 

development will start 

with an international market 

analysis as well as a concept 

study in which different 

multi-material component 

concepts including production 

scenarios will be developed 

and evaluated with regard to 

their costs. Finally, a final 

multi-material battery casing 

is designed in detail, which 

will be manufactured as a 

prototype in a follow-up 

project. 

Source: Seho 

www.ipte.com 




Productivity boost with E-solutions 

When the growing demand for smart-home 

solutions had pushed Norwegian manufacturer 

CTM Lyng AS to its capacity limits, the 

company decided to transition to an integrated 

smart factory with E-Solutions for 

printing and placement as well as with ASM 

software solutions. The result: much more 

throughput and improvements in flexibility 

and productivity. 

Embarking in new directions 

“After our production had moved more and 

more toward our own smart-home solutions, 

the time had come in 2018 to make the 

necessary replacement and expansion investments,” 

explains Thomas Kruksve, process 

engineer. “Both production lines had 

reached their capacity limit, and our technical 

capabilities were no longer in line with the 

high demands we place on our products in 

terms of quality and flexibility.” 

Another goal was to modernize and automate 

the Norwegian company‘s material 

management operations with powerful hardware 

and software solutions. “Our operators 

handled the material management and production 

planning more or less by the seat of 

their pants in processes that had grown over 

the years, which made the workflows increasingly 

susceptible to mistakes, depending 

on specific people, and more labor-intensive 

as the number of products and variants 

increased,” adds Thomas Kruksve. 

Innovative total package 

The company compared proposals from various 

equipment suppliers in detailed evaluations. 

“We wanted a mid-speed solution 

with short setup times and optimized material 

supplies that would give us the flexibility 

we needed to produce the PCB for our various 

product lines. ASM quickly was at the 

top of the short-list with its E-Solutions for 

printing and placement. We were particularly 

impressed by the software concept because 

the E-solutions software is identical to the 

software for ASM’s high-end solutions, which 

makes it compatible with their workflow solutions. 

In combination with forward-looking 

solutions like the Material Manager and Remote 

Smart Factory, the total package was 

unbeatable in terms of cost, effective benefits 

and investment protection,” says 

Kruksve. 

Optimally positioned 

ASM implemented one E by DEK printer and 

three E by Siplace placement machines. To 

supply the production with component reels, 

an automatic Material Tower storage system 

is available. Material-related processes and 

setups are coordinated via the Material Manager 

software solution, which closed the 

software support gap between the ERP and 

the shop floor. 

“The new ASM equipment provides us with 

complete control over all aspects of the PCB 

production for the more than 300 of our own 

products,” says Thomas Kruksve. “From 

small batches to lots sizes of between 2,000 

and 4,000 units, we now produce exactly 

based on demand and with a level of speed 

and quality that we could never achieve in the 

past. The teaching and simulation processes 

for new product introductions are also impressive 

and accelerate the entire NPI process. 

And the new setup and material supply 

concept has cut our setup changeover times 

from several hours to a few minutes.” 

Significantly faster setups 

For example, on the old production lines of 

CTM Lyng, setup changeovers lasting two to 

three hours were everyday occurrences – 

time that was long and unproductive. With 

the Material Manager and a new family setup 

concept of the ASM E-Solutions, the setup 

times dropped to as little as one to five minutes, 

with 50 different products run on the 

line. “These are numbers that deliver previously 

unthinkable benefits,” says Kruksve. 

Support is also provided by the Line Monitor, 

which pools all production-relevant material 

status information and displays it above the 

line and on all station computers. Order and 

line status data is now available at a glance. 

The software prioritizes all pending steps on 

the lines and alerts the line with plenty of 

lead time – for example, whether a new component 

reel is needed or the remaining units 

on the reel are still sufficient to complete an 

order. 

Material management optimized 

and automated 

The installation of the Material Manager and 

the Material Tower led to significant changes 

at CTM Lyng. “The introduction of workflow 

solutions required our employees to change 

their way of thinking,” explains Thomas 

Kruksve. “ASM helped us to accomplish this 

with professional training that alleviated their 

initial reservations and demonstrated the advantages 

of automation and showed them 

how to deal with it. Today, we all benefit from 

having an accurate overview of what is 

where on the shop floor. And the fact that 

the machines trigger material issues by 

themselves and notify the operators in advance 

of what needs to be picked up and installed 

where, is a huge improvement for 

us.” 

Secure access to service specialists 

To enable ASM’s service specialists to provide 

support for CTM Lyng‘s operators and 

technicians at any time, the company also 

decided to install the Remote Smart Factory 

solution that connects all ASM line components 

and systems in a remote service LAN 

that’s separate from their corporate network 

and even has its own internet link. When 

problems occur or settings need to be improved, 

ASM service technicians can now access 

the machines directly and instantly. And 

if manual actions are needed to troubleshoot 

or optimize a machine, the specialist can be 

consulted via video link and give the local 

technician step-by-step instructions. “They 

can access our machines only if we request 

it, and all activities are logged in detail. These 

links, which meet our strict security standards, 

have been very useful several times 

already, and always quickly and very efficiently,” 

says Kruksve. 

www.asm-smt.com 

Source: ASM 

With the three E by 

Siplace placement 

solutions, setup times 

of up to three hours 

have been reduced to 

just a few minutes. 


Installing X-ray component counter 

Dynamic Source Manufacturing, Inc., a high-volume, fully integrated, 

leading-edge technology manufacturing and turn-key assembly 

organization, has recently installed the Nordson Dage Assure 

X-ray component counter at their Calgary location. 

Celebrating its 20 th year in business, DSM embraces leading-edge 

technology when selecting equipment for its state-of-the-art, worldclass 

manufacturing facilities. With its primary focus on printed circuit 

board assembly, the company also provides mechanical assembly, 

design for manufacture, and supply chain management services 

for its strategic customer partners ensuring a steady flow of 

critical customer assemblies and components via their long-term 

supplier partnerships. 

“Over the past decade it has become apparent that in order for 

contract manufacturers to stay competitive locally and internationally, 

selecting quality automation equipment designed into lean, high-volume, 

efficient assembly processes are paramount. Such investments 

allow DSM to be agile in its manufacturing planning and processing 

while ensuring accuracy, quality, and shortened delivery lead times to 

our customers.” stated by Kevin Falenda, General Manager. 

“Additionally, with the continued emergence of IoT4 globally, the 

Assure X-ray component counter assists DSM on its integration 

path of ensuring all its factory’s equipment are connected and working 

together to minimize/eliminate manual labor intensive data processing 

and line down scenarios by receiving notifications early in 

the process that can be addressed before they become an issue.” 

Business Development Manager from Nordson, Todd O’Neil stated 

“Immediately after the installation, we were able to connect to 3 rd 

party s/w systems for reel and feeder management, which tied into 

an inventory control storage system. These features are standard on 

our machine. Before we left after just two days, their team was able 

to begin their semiannual inventory and count nearly 2000 reels in a 

couple of days, and with zero programming. This would have taken 

weeks using the manual counting method”. 

Inventory knowledge is essential for modern industry. Live assurance 

of correct inventory in an MRP system at all times minimizes stock, 

labor, errors and costs ensuring customer confidence and trust. 

Assure is a fast, simple and reliable way to implement live component 

inventory management into an organization. The solution increases 

productivity and minimizes component shortage downtime. 

PRECISION 

WITHOUT 

LIMITS 

Contact solutions 

from finest pitches 

to highest currents. 

Every child 

is one of a kind and unique. Each child needs 

individual support according to their needs. 

Please help us by donating. Thank you! 

www.nordsondage.com; www.dynamicsourcemfg.com 

DMS acquired the Assure X-ray componen counter, which minimizes 

component shortage downtime. 


Tel.: 0800/50 30 300 (free of charge) 

IBAN DE22 4306 0967 2222 2000 00 

BIC GENO DE M1 GLS 

www.sos-kinderdoerfer.de 

2016/1 


TEST + QUALITY ASSURANCE 

CCI systems use UV illumination 

Reliable and fast conformal 

coating inspection provides 

greater safety 

In recent years, the conformal coating production process has become increasingly important for electronics 

manufacturing. In this process, protective coatings are applied to printed circuit boards at a standard thickness 

ranging from 100 to 200 μm 1) . The coatings are designed to protect the entire assembly or individual components 

against environmental factors such as dirt, dust, moisture and condensation, as well as against temperature changes. 

Protective coatings may also have insulating properties and can be used to protect against electrical breakdown. 

The S3088 CCI‘s integrated UV LEDS provide optimal contrasting 

between protective coatings and non-coated areas. 

There are many different manufacturers that offer a wide range of 

conformal coatings for various areas of application. In most 

cases, the coatings are either silicon- or acrylic-based, so different illumination 

options also need to be taken into consideration during 

inspection. The coatings are easy to handle, they adhere well, and 

their viscosity can be easily adapted, making them suitable for use 

in many different areas. They offer precise handling especially when 

being applied, and they cure reliably. 

There are also chemical hybrids and environmentally-friendly coatings 

in use which contain no solvents. Demand for these is growing, 

as they contain fewer volatile organic compounds (VOC). However, 

these conformal coatings do not provide the same level of adhesion 

as solvent-based coatings. In series production, conformal 

coatings are normally applied via dosing systems, making the entire 

process reproducible. In prototype environment and small lot size 

production, the coatings can be applied manually. 


Protecting safety-relevant electronics is crucial 

Conformal coatings are often used when electronic systems need 

to perform with high levels of reliability. These electronic systems 

need to be impervious to environmental factors, as they are often 

responsible for performing safety-relevant tasks. Conformal coatings 

are used in the military and maritime sector, in aerospace, in industry 

automation and the automotive industry, which in recent 

years has contributed tremendously to the continued development 

of the overall conformal coating process, as well as to the development 

of new coatings. This development has played a crucial role in 

electromobility and in semi-autonomous driving. Through these applications, 

a growing number of electronic systems are finding their 

way into vehicles, including camera systems and sensors which perform 

safety-relevant tasks and, in some cases, are already making 

decisions for human drivers. 

For this reason, high levels of reliability are imperative. And they will 

play a decisive role in future developments in the area of autonomous 

vehicles and aircraft, as these safety-relevant systems are 

exposed to wide-ranging, critical environmental factors. Salt spray, 

extreme temperature changes and chemicals, such as those used in 

car washes, can cause electronic assemblies to oxidize and become 

damaged. Protection, and hence proper functioning, can only be 

achieved by applying conformal coating to assemblies or critical 

components. The situation is similar in other application areas, such 

as green energy, where control units in solar parks and wind turbines 

are exposed to demanding environmental conditions, including 

salty sea air and extreme changes in humidity and temperature. 

Source 

1) Figure provided by Electrolube (introduction to the product brochure 

„Conformal Coatings: Enhanced protection for ultimate PCB performance“). 

Coating thicknesses up to 300 μm can be found in other 

sources. 




Various forms of surface-level damage are made visible by 

the ultraviolet light, such as cracks, blisters, missing coating 

(right) and bubbles (left). 

Other reasons for the growing use of conformal coatings include 

progressive miniaturization as well as the increasing component 

density on electronic assemblies. This development is accompanied 

by a growth in system functionality. The insulating effect of protective 

coatings allows the distance between conductor paths to be reduced, 

thus making higher component densities possible. In addition, 

the conductor paths are able to carry more electrical power, 

which leads to better performance in end devices. 

Defects and risks of conformal coating 

However, all applications of conformal coating have one prerequisite: 

the assembly surface and the applied protective coating must 

form a stable, fixed bond, and this bond must hold up against the 

environmental conditions described above. The growing demands 

on this process are not entirely unproblematic — the final quality of 

the conformal coating can be negatively impacted by many materialand 

process-related variables. These defects have many different 

causes. A large portion of them can be traced backed to impurities 

on the assembly, which in turn arise when the circuit board or components 

are manufactured, or which become attached during assembly 

production. Material incompatibilities and also quality issues 

in circuit boards and components, such as poor solder resist curing, 

flux residues and separating agents on component housings, can 

play a role in this as well. In most cases this leads to delamination 

between the assembly surface and the protective coating. 

Many other defects can arise frequently and in many different 

forms. For example, coating can be applied to locations which need 

to remain uncoated, such as sockets and contacts. Another defect 

is blistering. Blisters form when air becomes trapped, and in the 

worst case they can push through to the surface, burst open and 

leave craters during curing. Moreover, if the coating is applied with 

excessive pressure, the resulting foam can cause orange peel to 

form on the coating surface. The thickness of the applied protective 

coating layer also plays a role — the coating must be applied evenly. 

Exceeding the layer thicknesses recommended in the manufacturer‘s 

technical data sheets can lead to delamination and cracks in 

the coating, or may cause solvent to become trapped, which in turn 

may cause the formation of blisters. Double-coating as well should 

only be performed if the material allows for it. 

In addition to handling the protective coating in accordance with the 

manufacturer‘s specifications, the application process needs to be 

performed without defects and with the right configuration of systems. 

The assembly to be protected needs to be pretreated. There 

is a wide range of solutions available for this. Plasma surface treatment 

not only cleans the assembly, but also activates the surface, 

allowing a stable bond to be formed between the components. Finally, 

an automated assembly inspection is the only way to reliably 

acquire information about the extent to which the conformal coating 

process was performed without defects. This inspection is essential 

because it is the only way to ensure compliance with standards and 

specifications. 

Conformal coating inspection: quality criteria 

The applied protective coating needs to be inspected in terms of 

three quality criteria: coating presence, the even and defect-free application 

of the coating, and layer thickness. The latter can only be 

determined with a coating thickness spot measurement process, 

and in practice random sample spot measurements have proven effective 

for this. For comprehensive inspections of large areas of a 

circuit board to determine whether the coating is present and has 

been applied evenly and without defects, the suitable option is automatic 

optical inspection (AOI), which is called conformal coating in- 

The S3088 CCI also works with Viscom‘s vVision and Easy Pro inspection 

software. 




The S3088 CCI inspection 

system has camera resolution 

of up to 15 μm/pixel and offers 

inspection of transparent 

protective coatings. 

spection (CCI) when used for applied protective coatings. Since the 

coating is usually transparent and therefore contains few structures, 

fluorescent dyes must be used, which can be recognized by the AOI 

system‘s special cameras. 


CCI functions and areas of application 

CCI systems use UV illumination because coating manufacturers 

normally add ultraviolet fluorescent particles to their products. These 

particles can be easily detected by cameras with UV LEDs, thereby 

making it possible to perform manual and automatic optical inspections 

on coatings. For this, the particles need to be evenly distributed, 

and they need to fluoresce uniformly and steadily. If the 

coating layer has been evenly applied, the properties of the fluorescent 

particles ensure that light is emitted at a consistent intensity 

when the particles are exposed to continuous UV light. Camera systems 

are able to detect and capture the emitted light intensity. Various 

forms of surface-level damage, such as cracks, blisters, orange 

peel, excessive coating and even missing coating are made visible by 

the ultraviolet light. The use of camera systems mounted at angles 

enables the documentation of these defects and imperfections, as 

well as of missing protective coating in visible and illuminable gaps, 

such as the coating on pins and in the spaces between them. 

The inspection images captured by the CCI system are automatically 

analyzed for acceptance or rejection with permitted tolerance 

values. Detected deviations are classified as defects. Other indicators 

which can be used for optimizing the conformal coating process 

are evaluated as well. The protective coating can be inspected 

both before and after it has cured. With a wet inspection, the coating 

is inspected before it cures, which makes subsequent reworking 

and improvements by manufacturing personnel possible. 

The S3088 CCI inspection system from Viscom AG offers inspection 

of transparent protective coatings. With a camera system that features 

one orthogonal and eight angled cameras, as well as a transport 

clearance of 105 mm for circuit boards, the S3088 CCI sets 

itself apart from the other S3088-series systems. It also works with 

Viscom‘s vVision and Easy Pro inspection software, and hence features 

the same user interface as the other AOI systems. In standard 

configuration, the S3088 CCI can perform inline inspections on circuit 

boards measuring 508 mm x 508 mm. Standard options are 

available for longer boards. It is important to note that different coating 

types require different exposure times. For less reflective coatings 

that contain silicon, the HD option provides a more powerful 

emission of UV light. 

The S3088 CCI‘s integrated UV LEDS provide optimal contrasting 

between protective coatings and non-coated areas. With a camera 

resolution of up to 15 μm/pixel, the S3088 CCI makes cracks, 

blisters, smearing and coating splatter easy to see. The coating can 

also be inspected for completeness. In addition to dry inspection, 

the it also offers a wet inspection option. For this option, the customer 

connects an internal extraction system to the S3088 CCI to 

ensure that the concentration inside the system remains low. The 

S3088 CCI also offers a 3D spot measurement option for coating 

thickness, which uses a vertically installed sensor to spot measure 

the distance between the coating surface and the circuit board surface 

as a reference plane. The resulting differences represent the 

thickness of the coating. 

The S3088 CCI can also perform qualifications of electrical insulating 

compounds on circuit boards based on the IPC-CC-830C standard. 



Sicher funktionierende Elektronik benötigt eine zuverlässige Inspektion 

von Schutzlacken. Das vorgestellte Inspektionssystem ist 

einfach adaptierbar auf die Anforderungen unterschiedlicher 

Schutzlacke zur präzisen Detektion von Fehlstellen inklusive 

schneller Prüfprogrammerstellung. 

Résumé 

Le bon fonctionnement de l’électronique exige une inspection fiable 

des vernis de protection. Le système d’inspection présenté est 

facilement adaptable aux exigences des différents vernis de protection 

pour une détection précise des points de défaut, y compris 

la création rapide de programmes d’inspection. 

Резюме 

Решение для автоматизированного хранения с 

контролируемым кондиционированием воздуха и реализация 

индивидуального интерфейса клиента, включая интеграцию 

дополнительных мест складирования, соответствовали 

требованиям бельгийской компании к полупроводниковым 

датчикам в автомобильной отрасли. 




Bond Tester by F&S BONDTEC 

Source: Goepel electronic 

The new 3D AOI systems of the 3D XE series: 

Basic Line · 3D XE and Advanced Line · 3D XE. 

>> Fully automatic pull- & sheartesting 

by using most modern 

Pattern-Recognition-Software 

>> Reproducible test results and 

precision within a few μm 

>> BAMFIT - Revolutionary quick test 

Introducing affordable 3D AOI systems 

Large and small electronics manufacturers are subject to relentless 

demands for reduced cost and improve quality. To meet these demands, 

Goepel electronic has launched two new automatic optical 

inspection systems. The 3D XE series of AOI platforms are characterised 

by low acquisition costs whilst still delivering full 3D inspection 

functionality. 

The series consists of the stand-alone system Basic line · 3D XE 

and the inline system Advanced line · 3D XE. Flexible interfaces, 

such as Hermes or Pulse, allow production line integration of the inline 

version; for smaller quantities, the offline 3D AOI system with 

manual loading is an attractive solution. In addition, both systems 

can be used as full 3D solder paste inspection systems (SPI). Thus, 

configuration as an inspection island offers a highly efficient and 

flexible production environment. (especially for the Advanced line · 

3D XE) 

3D XE series platforms are controlled using the latest Pilot AOI software 

and MagicClick for AI-based, fully automatic creation and optimization 

of inspection programs. This functionality enables the system 

to inspect new assemblies within a few minutes and without 

any component library. This is especially important for manufacturing 

service providers with a large variety of products. It guarantees 

a high degree of cost-effective use even for the smallest of board 

quantities and saves up to 80 % of program creation and optimization 

time. 

Goepel electronic‘s 3D AOI systems, developed and manufactured 

in Germany, feature innovative hardware and software components 

with a very user-friendly operating concept. They provide a cost-effective 

initial purchase and are highly efficient in production operation. 

This opens the door for smaller electronic manufacturers to 

use the latest fully-fledged 3D-AOI technology. 

for lifetime of heavy wire bonds 

UPGRADED & UNIQUE 

Our SERIES 56i 

What‘s new? 

A lot - and yet everything stays the same. 

The new edition of the Series 56 has kept 

its basic features - high flexibility, 

combined with unique possibilities. 

A new control unit has found its way into 

the Series 56i. This enables faster and more 

precise travels, which for the first time, 

makes extremely fine wires up to 12 μm 

bondable on the machine. 

www.goepel.com 

F&S BONDTEC Semiconductor GmbH 

Industriezeile 49a 

5280 Braunau am Inn 

Austria 

3D image acquisition by the Advanced Line · 3D XE. 

Source: Goepel electronic 

Phone: +43-7722-67052-8270 

Fax: +43-7722-67052-8272 

E-Mail: info@fsbondtec.at 

EPP EUROPE November 2020 55 

www.fsbondtec.at



High-precision 3D sensing technology solutions 

Auto Resistance Sensor (ARS) with CyberSpectrum 

software enables real-time resistance measurements 

of plating cell contacts in semiconductor application. 

CyberOptics Corporation, a global developer 

and manufacturer of high-precision 3D sensing 

technology solutions, has recently released 

its In-line Particle Sensor (IPS) and 

Auto Resistance Sensor (ARS) for semiconductor 

tool set-up and equipment diagnostics, 

and the WX3000 metrology and inspection 

system for wafer-level and advanced 

packaging applications. 

An extension of the industry-leading Wafer- 

Sense and ReticleSense Airborne Particle 

Sensor (APS) technology that is documented 

by fabs as the Best Known Method (BKM), 

Source: CyberOptics 

The In-line Particle Sensor (IPS) with CyberSpectrum 

software detects particles in gas and vacuum lines in 

semiconductor process equipment. 

the In-line Particle Sensor (IPS) with Cyber- 

Spectrum software detects particles in gas 

and vacuum lines 24/7 in semiconductor process 

equipment. The IPS quickly identifies 

monitors and enables troubleshooting of particles 

down to 0.1 μm. 

The new WaferSense Auto Resistance Sensor 

(ARS) with CyberSpectrum software for 

semiconductor tool set-up and diagnostics 

enables real-time resistance measurements 

of plating cell contacts in semiconductor 

Electrochemical Deposition (ECD) applications. 

Source: CyberOptics 

Process and equipment engineers in semiconductor 

fabs can speed equipment qualification, 

shorten equipment maintenance 

cycles, lower equipment expenses and optimize 

preventative maintenance plans. 

“Whether it’s used in the front-end, mid-end 

or back-end of the semiconductor fab, our 

high-precision sensor technology is delivering 

significant improvements in yields, processes, 

productivity and through-put,” said 

Dr. Subodh Kulkarni, President and CEO, 

CyberOptics. 

The WX3000 system focuses on wafer-level 

and advanced packaging metrology and inspection. 

Performing two to three times 

faster than alternate technologies at data processing 

speeds in excess of 75 million 3D 

data points per second, the NanoResolution 

Multi-Reflection Suppression (MRS) sensorenabled 

WX3000 systems deliver throughput 

greater than 25 wafers per hour. 100 % 3D 

and 2D metrology and inspection can be 

completed simultaneously at high speed, as 

compared to an alternate, slow method that 

requires two separate scans for 3D and 2D 

and only a sampling of a few die. 

The proprietary NanoResolution MRS sensor 

meticulously identifies and rejects multiple 

reflections caused by shiny and mirror-like 

surfaces. Effective suppression of multiple 

reflections is critical for highly accurate 

measurements. 

www.cyberoptics.com 

Ensuring high quality for screen printing 

Like Harley Davidson, Google, Microsoft, and 

Apple, Laritech was started by enthusiastic 

engineers working in their garage. This newly 

published case study, including interviews 

with Joel Butler, Vice President of Manufacturing 

and Matthew Banks, SMT Manager, 

explores how the company grew and how 

Koh Young helped them reach their goal of 

manufacturing excellence and exceptional 

quality. 

Laritech has Koh Young 8030–2 SPIs and Zenith 

LiTE AOIs connected with the KSmart 

smart factory solution software. Joel and 

Matt explain the selection process, why they 

chose Koh Young, and the installation process, 

as well as their experience with the 

equipment and with Koh Young as a partner. 

Joel Butler, Vice President of Manufacturing, 

explains, “Everybody knows screen printing 

is the core of quality. If you don‘t get that 

right, nothing else matters. When we got our 

first Koh Young SPI, we had a large board 

with around 4,000 components, plus 50 different 

BGAs. We saw our yields increase 

overnight.” 

Brent Fischthal, Sr. Manager, Americas Marketing 

and Regional Sales at Koh Young 

added, “we really enjoy working with companies 

like Laritech and with people like Joel 

and Matt who have an enthusiasm for what 

they do and the way they serve their customer. 

It really is an honor to be involved in their 

success story and we thank them for taking 

the time to talk to us about it.” 

The video on the use case can be found here: 

https://youtu.be/1BFmyfKKnrU 

www.kohyoung.com; www.laritech.com 

Source: Laritech 

Laritech uses an SPI, AOI and a software 

solution from Koh Young to help them reach 

their manufacturing goals. 


Investing in 3D AOI for THT line 

E.D.&A. NV (Kalmthout) is one of Belgium’s 

most advanced electronics production company, 

which earned them the title of “Factory 

of the Future” in 2016 and 2019. They are always 

looking for innovations to adapt their 

manufacturing process which recently 

prompted them in buying the Viscom 3D automated 

optical inspection system S3016 ultra. 

With their multidisciplinary team of engineers, 

E.D.&A. offers hardware and embedded 

software solutions for, amongst 

others, machine and equipment manufacturers. 

For the production of these solutions 

they use their own ultramodern automated 

assembly lines. They are the frontrunners 

when it comes to quality, flexibility, efficiency 

and short lead times thanks to a thorough 

automation. The company is expanding: To 

continue to meet customer’s demand, they 

have major plans including the construction 

of a new production hall and the increasing of 

their production capacity. 

For the 3D inspection of the THT line, 

E.D.&A. carried out an extensive market 

E.D.&A. chose the S3016 ultra for the inspection of 

their THT line. 

study and did many tests and measurements 

to determine which machine best correlated 

with their demands and wishes. This guided 

them to the impressive performance of the 

S3016 ultra, which combines high accuracy 

with ease of use. The 3D AOI system inspects 

PCB bottom sides precisely even 

under extreme cycle times. The great inspection 

scope covers SMD, THT, press-fit and selective 

solder joints in full 3D. Thanks to the 

special sensor technology, accurate 


measurements of soldering and THT pin 

lengths can be performed. Besides measuring 

pins, algorithms make fast detection of 

open solder joints, solder bridges, missing 

pins and other defects possible. 

Unique to Viscom are the eight angled cameras 

that complete the orthogonal image and 

guarantee a shadow-free inspection. The 

clear color images are displayed from all 9 

perspectives to the operator, allowing for a 

smooth verification of the quality of the connections. 

“As Factory of the Future staying up-to-date is 

not enough, but looking to the future is the 

only motto. That is why reinventing oneself 

and observing evolutions closely is crucial. Especially 

when certainties of the past are 

suddenly uncertain, it is of utmost importance 

that we look ahead, think ahead and stay 

ahead – just like E.D.&A. and Viscom”, so Tom 

Van Tongelen from Smd-Tec, sales representative 

of Viscom for the Benelux countries. 


AOI solution designed for THT processes 

Seho Systems GmbH, a manufacturer of 

complete solutions for soldering processes 

and automated production lines, is the right 

partner when innovative ideas are required. 

With the PowerVision, the company focuses 

on two key points in the manufacturing of 

THT assemblies: Continuous quality assurance 

and cost-efficient production processes. 

The PowerVision stands for fast, automated 

optical inspection, and it is particularly designed 

for THT processes. The system can be 

configured depending on the manufacturing 

requirements: For component placement inspection 

in front of a wave or a selective soldering 

machine, or for solder joint inspection 

after wave or selective soldering processes, 

or as a combination of both inspection tasks, 

integrated into the same module to save 

space. 

The system reliably detects typical placement 

defects, such as presence of components 

or polarity, and soldering defects like 

incomplete solder joints, solder bridges or 

solder balls, for instance. Additionally, the 

system is capable of reading and processing 

product IDs. 

The stand-alone variant of the Seho PowerVision 

can be flexibly integrated into each fully 

automated production line. Moreover, the 

system can be directly integrated in many of 

the company’s selective soldering systems, 

thus providing additional benefits, particularly 

in terms of floor space and board handling 

costs. 

Generation of test plans is performed easily 

and comfortably at any PC using an offline 

teach program. Basic data can be taken from 

Gerber data, DXF files or from any digital 

image file (camera or scan). A simple wizard 

leads the operator through the programming 

procedure. Moreover, the comprehensive 

and individually expandable component library 

includes component-specific test elements, 

as well as an automatic inspection 

search to simplify programming. 

Even optimization of a test plan that usually 

requires temporary interruption of the production 

to adjust parameters can be made 

offline. Thus, the AOI system will be permanently 

available for production. PowerVision 

software provides analyzing tools that can 

draw conclusions on the current production. 

These tools include a heatmap that visualizes 

error frequencies based on their geometrical 

location on the PCB and a trend analysis that 

effectively supports optimization of the test 

program. The detected defects can easily and 

Source: Seho Systems GmbH 

The PowerVision detects typical placement 

as well as soldering defects and is capable 

of reading and processing product IDs. 

quickly be classified using the intuitive interface 

of the SehOverify software. 

Based on this classification of the test results, 

the software module Seho spc calculates 

and graphically displays different statistical 

key figures such as first pass yield, false 

calls rates or defect rates (FCPMO/DPMO). 

The benefits are obvious: Early identification 

of defects allows a fast increase of the overall 

manufacturing quality. Simultaneously, 

production costs can be sustainably reduced 

due to automated inspection and computerassisted 

rework. 

www.seho.de 


ADVERTISERS 

(Anzeige / Redaktion) 

Aegis Software 40 

ASM SMT Solutions 6 

ASM 50 

Asys 45 

Beckhoff 42 

BJZ GmbH & Co. KG 60 

CyberOptics Corporation 56 

CYGIA 42 

Dynamic Source Manufacturing 51 

E.D.&A. NV 57 

Electrolube 27, 28 

Ersa 3, 27 

F&S BONDTEC 55 

FEINMETALL 51 

Göpel electronic 55 

IPTE 46, 49 

ITW EAE – Speedline 5, 20 

Koh Young Europe 10, 11, 14, 47, 56 

Kurtz Ersa 11 

Lackwerke Peters 24 

Melexis 34 

Mentor 10 

Mesago Messe Frankfurt 9 

Messe München 12 

MicroCare Corporation 7, 47 

MicroCare, LLC 36 

MTEK Industry AB 32 

Musashi Engineering Europe 25 

Nordson DAGE 38, 51 

Panasonic Industry Europe 45 

Rehm Thermal Systems 13, 48 

Saki Corporation 9 

Seho 49, 57 

Totech 34 

Viscom 10, 52, 57 

Yamaha Motor Europ 46 

YXLON International 2 

ZEVATRON Löttechnik 31 

ISSN 1618–5587 

Trade journal for all fields of production in the 

electronics industry, manufacturing equipment, 

test and messurement, materials 

Publisher: Katja Kohlhammer 

Publishing House: 

Konradin-Verlag Robert Kohlhammer GmbH, 

Ernst-Mey-Straße 8, 70771 Leinfelden-Echterdingen, 

Germany 

General Manager: Peter Dilger 

Editor-in-Chief: 

Doris Jetter, Phone +49 7021 53 609 

E-Mail: doris.jetter@konradin.de 

Online Editor: 

Charlene Hesse, Phone +49 (0)711 7594–428 

E-Mail: charlene.hesse@konradin.de 

Editorial Assistant: Birgit Niebel, 

Phone +49 711 7594 -349, Fax –1349, 

E-Mail: birgit.niebel@konradin.de 

Layout: Helga Nass, 

Phone +49 711 7594 -278 

Advertising Manager: Andreas Hugel, 

Phone +49 711 7594 - 472, 

E-Mail: andreas.hugel@konradin.de 

Order processing: Josephine Linseisen, 

Phone +49 711 7594 -315 

E-Mail: josephine.linseisen@konradin.de 

Advertising rate card No. 41, 1. October 2017 

is currently in effect. 

Reader Service: Ute Krämer, 

Phone +49 711 7594-5850, 

Fax +49 711 7594-15850 

E-Mail: ute.kraemer@konradin.de 

EPP and EPP Europe are published nine times a year, 

and will only be supplied free of charge to qualified 

subscribers. Non-qualifying individuals place subscriptions 

via bookshops or the publish ing house. 

Annual subscription price Germany € 85,40, abroad 

€ 86,10 incl. post age. Single copy: € 12,50 + post age. 

Unless ordered for a specific period, a subscription 

continues until cancelled. You can cancel your subscription 

for the first time by giving notice of termination 

four weeks prior to the end of the subscription 

year. After one year, the termination period is four 

weeks prior to the end of each quarter. Prepaid subscription 

fees will not be reimbursed for non-publication 

due to technical reasons or force majeure. Reprint 

requires express previous approval by the editor. 

Signed articles represent the views of the author, not 

necessarily those of the editors. No responsibility is 

accepted for unsolicited manuscripts and industry reports. 

Bank accounts: Baden-Württembergische Bank 

Stuttgart, Konto 26 23 887, BLZ 600 501 01; Postbank 

Stuttgart, Konto 44 689-706, BLZ 600 100 70. 

Articles published in this magazine are protected by 

copyright. All rights are expressly re served, in particular 

the right of translation into foreign languages, and 

also of reproduction in any form whatsoever, for 

example by photo copying, microfilming or other processes, 

input to data proc essing systems or dissemination 

by public speaking, radio or tel evision 

transmis sion, with the sole excep tion of the special 

circum stances provided for in § 53 and 54 of the German 

Copy right Act (UrhG). All legal settlements in 

Stuttgart. 

Print: 

Konradin Druck GmbH 

Leinfelden-Echterdingen 

Printed in Germany 

© 2018 by Konradin-Verlag Robert Kolhammer GmbH, 

Leinfelden-Echterdingen 


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