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EPP Europe P2.2022

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» PCB & ASSEMBLY<br />

FOUPs and other storage facilities should<br />

be cleaned to prevent cross-contamination<br />

of the wafers<br />

Source: Microcare<br />

of the hydrofluoro-olefin fluids results in<br />

greater drag forces acting on the particles.<br />

This makes it easier to dislodge the<br />

particulate from the substrate. The particles<br />

push away from the substrate and<br />

wash away, dispersing into the cleaning<br />

fluid.<br />

Low boiling point<br />

Particle displacement fluids are lowboiling<br />

with typical boiling points between<br />

40˚C/105˚F and 65°C/165°F. This<br />

minimizes the risk of damage to wafers<br />

and other delicate components. Vaporization<br />

displacement fluids (below 100°C)<br />

are aggressive enough to remove the particles,<br />

yet won’t damage the substrate,<br />

including composite materials. They are<br />

compatible with most hard plastics, ceramic,<br />

glass and metal.<br />

Low boiling fluids also allow the vapor<br />

degreaser to run more efficiently. And<br />

since vapor degreasing cleans and dries in<br />

one step, there is no need for blowers, air<br />

knives or any other drying method that<br />

uses power. This translates into less fossil<br />

fuel consumption, lower carbon emission<br />

and reduced greenhouse gas output. All<br />

with the added benefit of energy cost<br />

savings.<br />

Environmentally friendly<br />

Environmentally-friendly HFO-based<br />

displacement fluids replace higher GWP<br />

(Global Warming Potential) hydrofluorocarbon<br />

(HFC) and hydrofluoroethers<br />

(HFE)-based fluids. They also are better<br />

for the environment than high ODP<br />

(Ozone Depleting Potential) solvents like<br />

CFC-113, HCFC-141b, HFC-225 and 1,1,1<br />

trichloroethane. They meet strict regional<br />

air quality regulations and many are not<br />

considered HAPs (Hazardous Air Pollutants).<br />

Many fluids are accepted by key<br />

environmental and governmental regulatory<br />

agencies in the United States and<br />

most countries around the globe. They<br />

meet global environmental directives including<br />

the <strong>Europe</strong>an F-Gas and REACH<br />

(Registration, Evaluation, Authorisation<br />

and Restriction of Chemicals) legislation.<br />

Environmentally sustainable<br />

Vapor degreasing with particle displacement<br />

fluids uses no water, conserving<br />

this precious non-renewable resource.<br />

In addition, the process doesn’t produce<br />

wastewater that requires specialty filtration<br />

or treatments before disposal.<br />

Another environmental benefit of particle<br />

displacement through vapor degreasing<br />

is its suitability for recycling. The<br />

displacement fluid is used for hundreds of<br />

cycles before it requires refreshing or replacing.<br />

Additionally, the vapor degreaser<br />

concentrates the contaminants as it<br />

works. This reduces waste generation and<br />

lowers hazardous waste disposal costs.<br />

Wrapping up<br />

Particle contamination is detrimental<br />

to intricate semiconductors and silicon<br />

wafers. Removing contamination is essential<br />

to ensuring their performance.<br />

Vapor degreasing using particle displacement<br />

fluid not only ensures semiconductor<br />

cleanliness, it also addresses environmental<br />

and regulatory concerns.<br />

Companies looking for help with displacement<br />

cleaning should partner with<br />

an expert that has displacement fluid and<br />

vapor degreasing expertise. They can conduct<br />

on-site audits or perform in-lab<br />

tests with sample wafers to ensure cleaning<br />

success. Based on the wafer substrate<br />

and the particulate, these specialists can<br />

recommend, or engineer, the fluids and<br />

processes that achieve the best results.<br />

www.microcare.com<br />

Zusammenfassung<br />

Die Entfernung von Verunreinigungen bei komplexen Halbleitern<br />

und Silizium-Wafern ist durch Dampfentfettung mit Partikelverdrängungsflüssigkeit<br />

gewährleistet und berücksichtigt zudem Umweltaspekte<br />

sowie gesetzliche Vorgaben.<br />

Résumé<br />

L'élimination des impuretés dans le cas de semi-conducteurs complexes<br />

et de plaquettes de silicium est assurée par un dégraissage à<br />

la vapeur avec un liquide de déplacement des particules. Elle tient<br />

également compte des aspects environnementaux et des exigences<br />

légales.<br />

Резюме<br />

Удаление загрязнений в случае сложных полупроводников и<br />

кремниевых пластин осуществляется методом паровой<br />

очистки с использованием вытесняющей жидкости, при этом<br />

учитываются аспекты охраны окружающей среды и<br />

требования законодательства.<br />

24 <strong>EPP</strong> <strong>Europe</strong> » 11 | 2022

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