EPP Europe P1.2023

Issue 04 | 2023
www.epp-europe.eu
Electronic
Production
Test
Trade Shows + Events
Driving manufacturing forward at
SMTconnect & PCIM Europe
» Page 20
W
PCB + Assembly
How to enhance thermal
management with IMS
» Page 28
IS-
Test + Quality
Assurance
Defend against ESD - the
invisible enemy in PCB reliability
» Page 46
Interview
“We see ourselves as the
French alternative,”
Robert Moor,
Protavic International
» Page 10
COVER FEATURE
Smart software
for smart
factories
» Page 22
SMT at its best

Ausgabe 11 | 2022
epp-online.de
Issue 11 | 2022
www.epp-europe.eu
The leading information source
for electronics manufacturing
in Germany and Europe
www.epp-europe.eu
www.epp-online.de
Elektronik
Produktion
Prüftechnik
Messen & Veranstaltungen
30. FED-Jubiläumskonferenz
in Potsdam
» Seite 12
Baugruppenfertigung
Weltneuheit aus dem Bereich des
maschinellen Lötens
» Seite 38
Test & Qualitätssicherung
Optische Qualitätsprüfung in
Bestückautomaten
» Seite 62
Interview
“Die Vorfreude auf die
electronica in der
Branche ist riesig.“
Dr. Reinhard Pfeiffer,
Messe München
» Seite 6
TITELSTORY
Digital
vernetztes
Handlöten
» Seite 26
SMT at its best
Electronics
Production &
Test
Industry News
IPC: Likelihood of 2023
recession in Europe is
increasing
» Page 13
Tradeshow + Events
Sustainability to take centre
stage at Electronica 2022
» Page 14
W
PCB + Assembly
Remove insoluble particulate
efficiently and sustainably with
vapor degreasing
» Page 22
Interview
“We do not offer a machine,
but a ready-made
application”
Daniel Schultze,
Tresky
» Page 6
COVER FEATURE
Overcoming
the challenges of
conformal coating
inspection
» Page 16
SMT at its best
Thickness
measurement
for transparent
materials
LIVE-EVENTS
WEBSESSION
Power Electronics
19.10.2023
Your Multi-Channel Expert
Andreas Hugel
andreas.hugel@konradin.de
phone +49 711 7594 -472
With 48 years at the heart of the industry, EPP Elektronik Produktion Prüftechnik together
with sister brand EPP EUROPE is today the market-leading information platform
within the field of electronics production in Germany and throughout Europe.
Our success in the market, long-time satisfied customers and alike confirm our
competence and unparalleled experience.
Take full advantage of these benefits and book your campaign with us now!
We will be happy to advise you!

» EDITORIAL
Dear readers,
Smart software for smart people
The digital transformation does not end with machines. Digital solutions
can also optimise how an operator uses their time. Read our cover story
on page 22 to find out how administrative processes including staff
assignments, material flow, reporting and maintenance and repairs,
can be planned and controlled using smart software.
THE ONE.
FOR
EVERYONE.
The VERSAFLOW ONE – Your Entry
into Selective Soldering Excellence.
Staying cool with IMS
In the age of power electronics and EVs, managing heat in PCB assemblies
is crucial; and yet thermal management solutions are often complicated or
bulky. The article on page 28 details a simple, space-saving way of cooling
through the substrate.
Say goodbye to static
As PCBs get more sophisticated, their sensitivity to ESD (electro-static
discharge) spikes increases. Luckily, there are some pretty easy ways of
eliminating this unwanted presence, and the damage it causes, as the
article on page 46 reveals.
Say hello to the future
This year’s IPC Apex event in San Diego emphasised the central role advanced
packaging will play in the future of electronics manufacturing
(see page 18). Those interested in this and other fascinating insights
about the technologies driving the sector forward will not want to miss
the Fraunhofer IZM Future Packaging production line on display at
SMTconnect in Nuremberg from 9-11 May (page 20). We’ll see you there!
Don‘t forget to visit our website
(epp-europe.eu) to stay up to date
with the latest industry news and
trends.
Sophie Siegmund
Online Editor EPP Europe
redaktion.eppe@konradin.de
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EPP Europe
SUSTAINABLE.
» 04 | 2023 3

» CONTENTS 04 | 2023 29. YEAR OF PUBLICATION
COVER FEATURE
Smart software
for smart
factories
ASMPT reveals » Page 22
how its software
portfolio can help
make factories more resilient,
more productive and ultimately
more competitive.
Source: ASMPT
NEWS & HIGHLIGHTS
Interview
Robin Ng, CEO & Günther Lauber, Exec. VP & CEO, ASMPT
“Our rebranding reflects our evolution” 6
Robert Moor, CEO of Protavic International
“We see ourselves as the French alternative” 10
Industry News
The latest updates from and about the industry 14
TRADE SHOWS & EVENTS
IPC Apex Expo 2023
“The best show in years” 18
SMTconnect & PCIM Europe 2023, 9-11 May
Driving manufacturing forward 20
COVER FEATURE
ASMPT on using software for better personnel deployment
Smart software for smart factories 22
PCB & ASSEMBLY
An alternative heat dissipation solution
Enhancing thermal management with IMS (Ventec) 28
Product Updates – PCB + Assembly 31
White paper on the ‘flying’ SMD components phenomenon
Why do some components get blown away? (Rehm) 32
Automated solutions on show at Apex 2023
Leveraging automation to improve efficiency (Panasonic) 36
Product Updates – PCB + Assembly 38
PACKAGING
News + Product Updates – Semiconductor Packaging 40
TEST & QUALITY ASSURANCE
How can AI be applied usefully in automated inspection?
AI: from assistant to decision-maker (Goepel) 42
Defending against the invisible enemy in PCB reliability
Managing electrostatic discharge (MicroCare) 46
Product Updates – Test + Quality Assurance 49
COLUMNS
Editorial 3
Imprint/List of advertisers 51
4 EPP Europe » 04 | 2023

Industrie
Source: MicroCare
Managing ESD: As electronic assemblies get smaller, more complex
and incorporate increasingly more expensive parts, it makes
sense to reduce and control ESD to protect PCBs during assembly
» Page 46
The
network of
expertise
for industry
SMTconnect 2023
9 – 11 May, Nuremberg
The annual expo for the European
electronics manufacturing community
will not only spotlight future technologies
but pressing issues including
rising energy costs, component and
raw material shortages, obsolescence
management and the reshoring trend
Visit us in Hall 4, Stand 351.
16 media brands for all major sectors
of industry
Information, inspiration and networking
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Practical knowledge spanning all media
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Discover the appropriate media for
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EPP Europe » 04 | 2023 5

NEWS & HIGHLIGHTS » Interview
Interview with ASMPT’s Robin Ng and Günther Lauber
“Our rebranding reflects our
evolution into a global company”
ASMPT, provider of hardware and software solutions for the semiconductor and electronics
manufacturing industries, recently opened a Centre of Competence (CoC) in Regensburg,
Germany which will serve as a think tank for technical innovation. It also changed its name.
At the opening of the CoC, we spoke to Robin Ng, Group CEO, and Günter Lauber, CEO and
Executive VP, about the future of both the company and the sector.
EPP Europe: The company recently underwent a
rebranding from ‘ASM Pacific Technology’ to
simply ‘ASMPT’. Why did you decide to take this
step?
making acquisitions such as SIPLACE in 2010 (placement),
DEK in Great Britain (printing), ALSI in the
Netherlands (laser dicing and grooving), NEXX (ECD
Panel and Plating) and AEI (automotive CIS) in the
US, and Critical Manufacturing (MES Software) in
Portugal.
Robin Ng, ASMPT Group
Chief Executive Officer
“Recent massive
supply chain
disruptions have been
a major reason for this
trend [for de-globalization]; behind these
location changes is a desire to regain
control over the supply chain to avoid
depending on others.”
Robin Ng, Group CEO of ASMPT
Robin Ng: I need to go back in time a bit to answer
that. The company started life in Hong Kong in 1975
as ASM Pacific Technology, the Asia-Pacific subsidiary
of Netherlands-based ASM International. At
the time, Hong Kong was fast becoming the
epicentre of the global semiconductor market and
we were listed on the Hong Kong Stock Exchange in
1989. The company then grew organically for about
40 years in the area of semiconductor solutions.
In recent years, however, we have expanded into the
European and US SMT and semiconductor markets,
Our business now consists of two segments: semiconductor
solutions and SMT solutions. With this
distinctive portfolio, we have become the market
leader in the two major domains of electronics
manufacturing. The two areas don’t operate
separately, however, and ASMPT has
brought together the best of both worlds, evolving,
in this way, from a machine supplier and
tech expert to a provider of solutions including analytics,
automation, scheduling software, and even
complete factory solutions. Our rebranding as ASMPT
reflects our evolution into a global company that
provides a unique and broad portfolio of solutions for
the manufacturing of semiconductors and electronics
components.
Source: ASMPT
Günther Lauber: Our customers have not only welcomed
our new brand, they also understand the
added value we can offer them thanks to the close
cooperation between our semiconductor and SMT
segments.
What kinds of ‘added value’ specifically?
Lauber: Let’s take the SIPLACE CA2 as an example.
Our new hybrid placement platform can process both
SMT components and dies directly from the wafer –
and all in the same work step.
With regard to the name change, did you also
want to make clear that you are a major player not
just in Asia but worldwide?
6 EPP Europe » 04 | 2023

Ng: Yes, as I mentioned earlier, the progression of
our acquisitions and our growth make it quite clear
that we are a global company with a deep and broad
footprint spread across solutions and geographies.
Our customers work very closely with us. We have 17
R&D facilities around the world, including many involved
in new product development for customers.
Having these capabilities closer to our customers is a
real advantage. These facilities enable us to respond
to the continuing trend towards de-globalization in
the semiconductor manufacturing sector which has
seen some electronics manufacturers shifting production
from Asia to North America and Europe.
Without a doubt, recent massive supply chain disruptions
have been a major reason for this trend; behind
these location changes is a desire to regain control
over the supply chain to avoid depending on
others. Wherever possible, our customers prefer support
and advice on-site from local teams. This is
something we have long had in place for our SMT
customers. For our semiconductor solutions customers
and partners in Europe, the CoC here in Regensburg
offers a direct point of contact to try things out,
exchange ideas, and put our machines through their
paces. Thus, while production may still take place in
Asia, research and development can take place here.
Added to this is the fact that many components used
in electronics production are purpose-built for customers,
and the CoC enables the exchanges that are
essential for our teams to understand the customers’
exact requirements so that we can continue to develop
new products and technologies.
Source: ASMPT
Robin Ng and Günter
Lauber launching the
first European ASMPT
SEMI Center of
Competence (CoC) in
Regensburg, Germany
EPP Europe » 04 | 2023 7

NEWS & HIGHLIGHTS » Interview
Günter Lauber,
Executive Vice-President,
SMT Segment CEO and Chief
Strategy and Digitalization
Officer, ASMPT
“We are focusing
on AI-powered
software solutions
that also work with
third-party machines
as well as on apps for
analytics, execution and
automation.”
New products and technologies such as...?
Ng: Well, everyone knows Apple or Microsoft, BMW
or Audi, but did you know that there‘s a good chance
that your camera, computer, or even car, will contain
components manufactured using ASMPT equipment?
Take your smartphone, for instance, I’d bet that some
of the components in it were manufactured using our
Günther Lauber, CEO and Executive VP, ASMPT
machines. Cameras, CMOS image sensors, LIDARs or
LED displays – virtually every digital device contains
components that probably wouldn’t exist without our
technology, which is why our motto ‘enabling the
digital world’ is an integral part of our rebranding.
We expect to see particularly rapid developments in
the area of silicon photonics i.e. optical waveguides,
lenses, polarization converters, and so on. To serve
this market, we acquired die bonding specialist Amicra
here in Regensburg in 2018. In the future, innovative
fibre optic technologies will allow data to
travel from one location to another even more
quickly, reliably, and securely. The new 5G mobile
communication standard and the increasing demand
for fast connections in data centres are also driving
the development of fibre optic technologies.
Lauber: In Germany, automotive is the flagship industry,
which is why it is particularly important for
us. We are seeing exciting developments in this sector,
driven mainly by the transition to e-mobility of
course. But the demand for ICs is also rapidly increasing
in conventional vehicles. Again, it is our
unique and broad-based portfolio encompassing
both semiconductor and SMT solutions that really
distinguishes us from our competitors, whose product
segments are mostly vertical.
You are currently concentrating heavily on software
development (see p. __ for more on this). As
a machine manufacturer, do you really have
enough experience in this area?
Lauber: Yes we do. We have been developing far
more than just hardware for many years, but our
software was simply not as visible as our machines.
The reality is that our software is in our
machines and lines, functioning as a control
platform for line-based assembly operations in
electronics production and governing the cooperation
between machines and people. Software
now accounts for a rapidly growing portion
of our revenue. Look at Portugal, where we
invested in developer of manufacturing execution
systems Critical Manufacturing in 2018. For some
time now, we have also been focusing on developing
AI-powered solutions to extract and analyse data
from machines – and not just our own ASMPT machines
– in order to achieve a range of benefits like
optimizing production operations. We also offer apps
for analytics, execution and automation which create
value for the customer via improvements in efficiency,
quality and flexibility.
Source: ASMPT
Ng: Industry 4.0 has been a major driver in increasing
the role that software plays in electronics production.
For starters, remote support and remote access
became very popular as a result of the Covid-19
pandemic, while time-to-market requirements are
getting shorter and shorter. With the collection and
analysis of data, it becomes possible to make electronics
production faster and more customized in
order to better respond to individual customer
requirements. Software is becoming more important
in our industry. But it is just as important for us to
recognise the needs of this fast-moving market and
work out what will be required not just tomorrow,
but years from now.
ESG - Environmental, Social, and Governance - is
now of central importance to companies in Europe.
What are you doing in this regard?
Ng: Luckily, investors haven’t only just started paying
attention to whether a company adheres to compliance
rules, promotes environmental protection, or
supports socially responsible operations, and that’s a
8 EPP Europe » 04 | 2023

good thing. To underpin our commitment to ESG, we
have identified our vision as ‘to shape a bright and
sustainable future for customers, employees, investors,
partners and society’. It must be our goal to respect
and enable equal rights and equal opportunities
for all genders and ethnic groups, as well as participation
in decision-making processes, as the backbone
of our corporate culture.
We have taken another important step towards ESG
compliance by becoming a founding member of the
inaugural Semiconductor Climate Consortium
(SCC). We joined SCC right from the start, and we
hope to be instrumental in helping it achieve sustainable
progress with regard to climate challenges
in the semiconductor industry.
ESG is a central issue for us, but, as a global company,
this is not new. We could certainly use more female
employees, but that’s not so easy in the mechanical
engineering industry, which has always been dominated
by men. Nevertheless, we have targets in place
for female representation as part of our ESG goals.
Lauber: Just to add to this - the market of course
expects our customers to conform to the principles
of ESG . After all, they are the ones who produce the
smartphones and cars that we all buy. Society simply
expects these manufacturers to operate in a climatefriendly
manner and we, as their solutions provider,
have a duty to help our customers do this by developing
machines that require less energy and emit
less CO 2 for instance. To ensure that this happens, we
have developed a three-stage model for reducing
emissions: stage 1 encompasses emissions from fossil
fuels for heating and power generation as well as
fuels for company vehicles; stage 2 encompasses
emissions from electricity usage, including purchasing
or generating electricity for the supply of facilities
and sites; and stage 3 encompasses emissions
from activities along the supply chain. In this way,
we close the circle linking us to our suppliers,
partners, customers and their customers.
www.asmpt.com
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EPP Europe » 04 | 2023 9

Robert Moor, CEO of Protavic International, a chemicals manufacturer based in Levallois-Perret, France
Source: Protex International
Interview with Robert Moor, CEO of Protavic International
“We see ourselves as the
French alternative”
French industrial group Protex International develops and manufactures
specialty chemical additives for a range of sectors. Its subsidiary
Protavic applies its solutions to electronics. Group CEO Robert Moor
reveals how the company keeps up with the dynamic requirements of the
global industry while retaining l‘esprit français.
10 EPP Europe » 04 | 2023

Interview « NEWS & HIGHLIGHTS
EPP Europe: Perhaps you could start off by
providing some background on Protavic and its
products?
Robert Moor: Protavic specializes in the development
and manufacturing of resins, glues and inks for
electronics. Headquartered in France, we operate
business entities in Europe, the US, South Korea and
China, and have three production sites and three laboratories
for product design and development.
Protavic products are used in the automotive electronics
market, in smart card modules, and in sensors
and passive components such as MLCC capacitors.
Can you go into more detail about which products
are used during which of the various stages of
electronics production and assembly?
Our products are employed in many different ways.
Besides standard applications such as conductive
and non-conductive die attach, underfill, dam and
fill, glob-top, and potting, we are also developing
tailor-made solutions to help our clients differentiate
their offerings from those of their competitors.
For instance, we developed an underfill resin with
extremely low coefficient of thermal expansion (CTE)
and fine granulometry for narrow gap filling which
has now become the standard for demanding underfill
applications.
How do your potting compounds differ from those
of your competitors?
We are investing a great deal of research and development
into the area of potting. Our view is that it is
important to develop high value resin formulations
when there are very specific or niche requirements or
components. For instance, the latest generation of
semiconductor dies for power module requires an
encapsulation resin with a unique set of performance
characteristics including: high ionic purity, low
CTE, medium to low modulus and short curing time.
This is an area in which we are developing new products
to replace conventional silicon gels which are
no longer adapted to the requirements of the new
generation of power modules.
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EPP Europe » 04 | 2023 11

NEWS & HIGHLIGHTS » Interview
How can these products be applied?
The encapsulation resins we design can be applied in
power modules used to control electrical generators
in the areas of mobility and renewable energies.
New semiconductors like SiC and GaN are being developed
which make it possible for devices to operate
at a higher frequency and voltage than with simple
silicon. Encapsulation solutions developed for silicon
do not work for these new wide band gap semiconductors.
With the emergence of new chemistry, it is
necessary to develop a resin with better thermomechanical
properties, such as higher temperature
holding (>200°C continuous and >250°C peak);
better heat dissipation to avoid hot spots; and better
fire resistance to avoid aggravation in case of short
circuit or incident.
We also support our customers if our products become
obsolescent.
How have requirements changed in the electronics
sector?
The approval processes for new products are becoming
extremely lengthy, cumbersome and costly. At
the same time, it is of the utmost importance to keep
up with the increasing pace of material and technical
developments. These two contradictory trends are
not easy to reconcile yet we believe that we, as a
supplier, are able to help the industry overcome
these challenges. The fact that we belong to a wellestablished
chemical company makes our product
offering even more sustainable - particularly when
considering the regulatory constraints experienced
by the electronics industry.
“We are starting to hear more or more about the
recycling of the electronics circuits. For us,
this means adding new features to products,
but also bio-based and even biodegradable products
whose carbon footprint is limited.”
Robert Moor, CEO of Protavic International
We are seeing a strong demand from customers –
who work in different industrial sectors – for products
that protect electronic components from external
aggressors. Unlike with standard potting resins
for electrical insulation, these kinds of encapsulation
compounds come into direct contact with the components.
This means they must be ultra-pure in order
to avoid corrosion of connection elements such as
bonding wires or soldering. In addition to this, they
have properties that allow them to deform homogeneously
with other electronic components in order
to minimize mechanical stress in the event of large
temperature variations.
What sustainability measures do you take to protect
the environment?
We are aware of the need to reduce our carbon footprint.
We believe it is important to keep our industrial
establishments in areas where HSE regulations
are among the most demanding in the world, and
thus ensure our finished products remain in compliance
with international and regional regulations.
How have recent world events such as the
Covid-19 pandemic or the war in Ukraine affected
you? Many companies are experiencing shortages
of components and skilled workers, and facing rising
energy prices...
As for most businesses, the pandemic was long and
painful. Since it was impossible to visit customers
during lockdowns, we ensured we maintained close
relationships with them via other communication
channels such as video meetings, webinars, by sending
multiple samples, and so on. The cohesion of our
sales and R&D teams in this particular context was
appreciated by our customers.
Like many manufacturers, we also faced problems
with raw material supply, rising prices and logistical
constraints. While the pandemic was not necessarily
a good time to start new projects, we sincerely hope
that it will now be possible to work with players in
the automotive and power electronics industry to
continue to advance technologies through the development
of new products.
12 EPP Europe » 04 | 2023

Regarding the war in Ukraine, the major impact so
far has been the availability of raw materials. Luckily,
we have been able to secure our main raw materials,
however the rising cost of energy is not helping to
stabilize market prices for raw materials or for finished
products. Despite all the headwinds, however,
we have been able to maintain supply to all our customers.
Do you fear competition?
We do not have any direct competitors in France
since our position in the market is very specific.
Having competitors is necessary though. It is an
emulation.
What will be the future trends in the electronics
sector?
We are starting to hear more or more about the recycling
of the electronics circuits. For us, this means
adding new features (such as reworkability to allow
easy dismantling) to products, but also bio-based
and even biodegradable products whose carbon
footprint is limited. We do not have such products on
our lab bench yet but, like everywhere else, the pull
from the industry will come.
Are you prepared for the future?
Yes, of course. The sales team works to anticipate
market demand and we pay attention to scientific
research in the field of electronics. At its core, Protavic
is an independent French manufacturer committed
to its values and driven by an entrepreneurial
spirit. As we are able to combine a wide range of
high added value products with the responsiveness
and flexibility of a small business, we see ourselves
as the French alternative.
www.protavic.com
An all-rounder
for a new era
fastest placement possible through 20 % shorter cycle time
high performance through flexible production
improved placement quality through new real-time sensing
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May 9 th –11 th 2022 in Nuremberg
Visit us: Hall 5 , Booth 430
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+49 (0)6107 6842-0
fec_info@fuji-euro.de
www.fuji-euro.de
EPP Europe » 04 | 2023 13

» NEWS & HIGHLIGHTS
ZVEI pushes for speedy implementation of EU Chips Act
German industry urges EU to promote investment in semiconductor industry
Source: ZVEI / SIA
Investment in microelectronics by global region
The German Electro and Digital Industry Association (ZVEI) has
urged the EU to promote investment in semiconductor industry.
“The global semiconductor market will double to around one trillion
US dollars by 2030. Although the semiconductor market is
currently exhibiting typical cyclical behaviour, with overcapacities
being built up in the short term, the chip rally of recent years is
not yet nearing its end,“ said Robert Kraus, Chairman of the ZVEI
Semiconductor Division and CEO Inova Semiconductors.
The organisation believes that the demand for chips will remain
high - especially in the automotive and industrial markets - with
Kraus pointing out that further digitization and sustainability
measures such as CO2-reducing technologies would drive high
growth in the long term. In 2022, chips worth USD 580 billion
were produced worldwide, but under 10 % of that in Europe.
“Europe runs the risk of being left behind if, among other things,
the measures in the EU Chips Act are carried out too late“, said
Wolfgang Weber, Chairman of the ZVEI Board of Management.
“Europe will hardly be able to maintain its position as a semiconductor
region – let alone expand its own share of global production
– if the necessary conditions for investment in Europe
are not put into place immediately“. The EU Chips Act, which
aims to double Europe‘s share of the global semiconductor market
to 20 % by 2030, was announced in autumn 2021.
Benchmark for Europe should be US Chips
According to ZVEI, the benchmark for Europe should be the US
Chips and Science Act, which will provide over USD 200 billion
for semiconductor manufacturing and R&D. Europe is planning
mobilise around EUR 43 billion for the EU Chips Act. Without
significant additional investment from other public sources Europe
will miss its 20 % target and further weaken Europe as an
investment location, despite the European Chips Act. Europe
needs a policy that promotes investment in a targeted manner.
“The goal must be to develop an internationally competitive
microelectronics ecosystem in Europe,” Weber said. ‘To achieve
this, the EU must implement the Chips Act ... with the highest
priority and stimulate investment in the semiconductor industry.“
www.zvei.org
SEMI World Fab Forecast report
Global fab equipment spending to decline in 2023, recover in 2024
Global fab equipment spending for frontend
facilities is expected to decrease
22 % year-over-year to USD 76 billion in
2023 from a record high of USD 98 billion
in 2022 before rising 21 % YoY to USD 92
billion in 2024 to reclaim lost ground, industry
association SEMI announced in its
latest quarterly World Fab Forecast report.
Next year’s fab equipment
spending recovery will be
driven in part by the end
of the semiconductor inventory
correction in
2023 and strengthening
demand for semiconductors
in the high-performance
computing (HPC)
and automotive segments.
“This quarter’s SEMI
World Fab Forecast update offers our first
look ahead to 2024, highlighting the
steady global expansion of fab capacity
to support future semiconductor industry
growth driven by the automotive and
computing segments and a host of
emerging applications,” said Ajit Manocha,
SEMI president and CEO. “The report
points to a healthy 21 % uptick in equipment
investment next year.”
Covering 2022 to 2024, the SEMI World
Fab Forecast report shows the global semiconductor
industry increasing capacity by
4.8 % this year after a 7.2 % rise in 2022.
Capacity growth is expected to continue in
2024, rising 5.6 %.
The latest update of the
SEMI World Fab Forecast
report, published in March,
lists 1,470 facilities and
lines globally, including
142 volume facilities and
lines with various probabilities
that are expected
to start production in 2023
or later.
Source: SEMI
www.semi.org
14 EPP Europe » 04 | 2023

One of two major construction projects the company has underway
RAFI Group to build new facility in Bad Waldsee, Germany
Manufacturer of electromechanical components and
systems for human–machine interaction, RAFI has
announced it is investing in two major projects in
Germany. In April 2023, the company will begin construction
of a new building in Bad Waldsee, Baden-
Württemberg with infrastructure that is both energy-efficient
and low-consumption. The new facility
is a combined, state-of-the-art office and production
building. It will house the operating equipment
for plastics and automatic machine production,
metal processing, tool and die making, and tool and
die development. A number of classrooms and the
facilities for basic training in metalwork will be combined
into an impressive apprenticeship, teaching,
and further training centre.
“These projects represent an investment in the sustained
further growth of the entire RAFI Group,” explained
Dr. Lothar Seybold, CEO of the RAFI Group.
“The construction of a new production plant in Bad
Waldsee is a clear statement of commitment to the
region as a business location. It
creates new, crisis-proof jobs
here,” said CFO Lothar Arnold.
Berg site revamp
The second major project is a
revamp of the location in Berg,
Baden-Württemberg. It was
launched in 2022 and the company has now completed
the first construction phase. As part of its
growth strategy, the manufacturer is investing a sum
in the high two-digit millions for the three-year renovation
and energy-saving modernization project. It involves
successively fitting the buildings with new, climate-friendly
roofs, façades, and glazing. The physical
effects are expected to deliver energy savings of
up to 45 % and a significant reduction in CO2
emissions of around 340 tons per year. The first construction
phase for Building A has been completed.
www.rafi-group.com
Source: RAFI Group
In April 2023, the company
will start construction of a
state-of-the-art office and
production facility in Bad
Waldsee, Germany
NEW
3D AOI
Next Level of
Quality Inspection
Strongest Performance
• Most advanced XM-II sensor technology
• Customizable analysis functions
• Extremely fast data processing
• Unbeatable defect detection
Visit us
www.viscom.com
EPP Europe Booth » 04 | 2023 4A, 120 15

» NEWS & HIGHLIGHTS
IPC economic outlook and global sentiment report
Labour, material and freight costs will continue to rise, say manufacturers
Manufacturers expect to see continued increase
in both labour and material costs
over the next six months, although to a
lesser extent than previously anticipated,
according to IPC’s February 2023 Global
Sentiment of the Electronics Supply Chain
Report. On average, electronics manufacturers
expect labour costs to increase 9.2
percent over 2022 levels; materials costs
to rise 9.9 percent during the year and
most surprisingly, they expect freight costs
to rise 7.2 percent in 2023. “Though manufacturers
anticipate freight costs to rise,
depressed demand and improving supply
chain dynamics are currently pulling
freight costs down, a trend that should
continue during the year,” said IPC Chief
Economist Shawn DuBravac. “Downward
cyclical pressures will curtail volume
which should keep prices in check. For
some companies, declining freight costs
are likely to be their most significant cost
On average, electronics manufacturers expect
labour costs to increase 9.2 percent compared to
2022 levels; materials costs to rise 9.9 percent
and freight costs to rise 7.2 percent in 2023
savings in 2023. Economic fundamentals
continue to slow,” said DuBravac. “However,
despite aggregate softness, certain
Source: Pexels/Tiger Lily
segments continue to do well. For
example, the defense and space equipment
sector hit new high in January, aerospace
is up significantly from pre-pandemic levels
and other sectors key to the electronics
industry are holding up well.”
EU electronics manufacturing
output fell in Dec. 2022
The report also shows that manufacturing
sectors in Europe, the U.S., and China are
all signalling contraction according to
their respective PMI indexes, but in China
and Europe at least, things are looking less
bad this month. Despite signs of slowing
demand, manufacturers continue to hire.
The report also found that EU electronics
manufacturing output fell in December
after a one month increase in November.
Output declined 1.4 percent and is down
0.9 percent over the last year.
www.ipc.org
German chipmaker acquires Canada-based GaN-based solutions provider
Infineon to purchase GaN Systems for $830 million
Source: Infineon
Jim Witham,
CEO of GaN Systems
Source: Infineon
Jochen Hanebeck,
CEO of Infineon
Infineon Technologies AG and GaN Systems
have announced that they have
signed a definitive agreement under
which Infineon will acquire GaN Systems
for USD 830 million (EUR 780 million).
GaN Systems is a global technology
leader in the development of GaN-based
solutions for power conversion. The company
is headquartered in Ottawa, Canada,
and has more than 200 employees.
“GaN technology is paving the way for
more energy-efficient and CO2-saving
solutions that support decarb
onization. Adoption in applications
like mobile charging,
data center power supplies,
residential solar inverters, and
onboard chargers for electric
vehicles is at the tipping point,
leading to a dynamic market
growth,” said Jochen Hanebeck,
CEO of Infineon. “The
planned acquisition of GaN
Systems will significantly accelerate our
GaN roadmap, based on unmatched R&D
resources, application understanding and
customer project pipeline.“
“The GaN Systems team is excited about
teaming up with Infineon to create highly
differentiating customer offerings,,” Jim
Witham, CEO of GaN Systems, said. ‘With
our joint expertise in providing superior solutions,
we will optimally leverage the potential
of GaN. Combining foundry corridors
with in-house manufacturing capacity en-
ables maximum growth capability to serve
the accelerating adoption of GaN in a wide
range of our target markets.”
As a wide bandgap material, GaN offers
customer value by higher power density,
higher efficiency, and size reductions, especially
at higher switching frequencies.
These properties enable energy savings and
smaller form factors, making GaN suited
for a wide range of applications. By 2027,
market analysts expect the GaN revenue
for power applications to grow by 56%
CAGR to approx. USD 2 billion (source:
Yole, Compound Semiconductor Market
Monitor-Module I Q4 2022). In February
2022, Infineon announced doubling down
on wide bandgap by investing more than
EUR 2 billion in a new frontend fab in
Kulim, Malaysia. The first wafers will leave
the fab in the second half of 2024, adding
to Infineon’s existing wide bandgap manufacturing
capacities in Villach, Austria.
www.gansystems.com | www.infineon.com
16 EPP Europe » 04 | 2023

Improved material flow from warehouse to production line
ASMPT enters partnership with cts
ASMPT has entered into a long-term partnership
with German automation specialist cts GmbH that
will improve material flow automation in electronics
production from the warehouse to the production
line. The portfolio of hardware and software solutions
for electronics production will be complemented
with cts’s storage systems and automatic
transport and handling solutions (AMR and robotics).
The former can thus offer its customers more flexibility
within its modular and manufacturer-independent
Open Automation concept for more efficient
and integrated electronics production.
Headquartered in Burgkirchen, Germany, the cts portfolio
includes solutions for the automated storage of
circuit board magazines as well as dedicated robotic
solutions for PCB handling. It implements AMR solutions
for the automated transport of materials using
ASMPT‘s Factory Automation Software in a non-proprietary
manner so that heterogeneous fleets can execute
any transportation tasks with maximum efficiency.
“cts is an important partner for
ASMPT in automating material flow
processes from the warehouse to
the line,” explained Sven Buchholz,
Head of Product Portfolio and Product
Management at ASMPT. “This
long-term partnership enables
ASMPT to expand its offerings and
its consulting expertise to cover the entire material
supply process. As part of our Open Automation concept
we can now offer our customers everything they
need from a single source to fully automate their material
flows in a way that is optimally coordinated
with our software solutions on the shop floor and SMT
factory levels.”
“We are pleased to support ASMPT as a technology
partner in the field of automated material supply
technology in electronics production,” said Alfred
Pammer, Head of Sales and Marketing at cts.
www.asm-smt.com
Source: ASMPT
German comany cts is a
systems integrator and
supplier of comprehensive
automation solutions for
in-house materials handling
PIEK Training & Certification
IPC Training & Certification
Consultancy
Test Center PB’s & PBA’s
Audit services
IPC Validation Services
PIEKTRAINING.com
EPP Europe » 04 | 2023 17

» TRADE SHOWS & EVENTS
IPC Apex Expo 2023
“The best show in years”
Over three sunny days at the end of January, 375 exhibitors gathered across over 11,000m 2 at
the San Diego Convention Centre to showcase the latest advances in assembly, testing and
inspection equipment, software automation, factory of the future technologies and more. But it
was the conference programme which featured special sessions on e-mobility and advanced
packaging, that many found the most compelling aspect of the event.
Source: Doris Jetter
The IPC Apex 2023
expo took place at the
end of January in San
Diego, California
The reviews are in, and the IPC Apex Expo 2023
was, for many, “the best show in years”. This was
not only down to the number of visitors – 6,901 participants
in total across the three days – but to the
event’s laser-sharp focus on the future of the industry.
This year’s theme ‘Advance in a New Era’ was no
more pertinent that at the well-attended technical
conference which comprised five tracks, 28 sessions
and 104 peer-reviewed papers, presenting research
from industry experts from 18 different countries.
“From attendees, I was pleased to hear accolades on
technical program offerings, many stating that it
was the best conference in years – attendance was
at an all-time high in more than a decade,” IPC
President and CEO John W. Mitchell said.
Advanced packaging is the new
king
Conference highlights included a jam-packed
special session on advanced packaging led by IPC’s
Chief Technical Officer Matt Kelly. In his opening
comments, Kelly quoted Todd Younkin President &
CEO Semiconductor Research Corporation, who said
during IPC’s first Advanced Packaging Symposium in
October 2022, that “packaging is the new king”.
Citing a recent IPC survey, Kelly underlined that
the electronics manufacturing industry is well-aware
that improving semiconductor performance is increasingly
reliant on advanced packaging and yet,
the USA and Europe are lagging well behind Asia
when it comes to IC substrate – build-up substrate,
and 300mm bumping specifically – and package assembly
capability and capacity.
Kelly urged both governments and the industry to
take a holistic view of the situation, focusing not
only on chips or ‘silicon’ but to the development of
an advanced packaging ecosystem. This he termed a
‘silicon to systems’ approach. As E. Jan Vardaman,
President and Founder of TechSearch International
said in her presentation following Kelly’s: “You can
make all the silicon chips you want, but if you can’t
package them they don’t do you much good … what
is the point of making the chips here if you just send
them overseas for assembly?”
Among other things, Kelly said the addition of robust
advanced packaging language into EU Chips
legislation would be necessary, and emphasised that
sustainable, regional advanced packaging ecosystems
in North America and Europe, required “Governments,
Commercial Industry, and Academia to
continue collaborating, developing, and executing”.
E-mobility & EVs
Another special session focusing on the market
trends and challenges in PCBA manufacturing for the
e-mobility industry was led by Brian O’Leary, Global
Head e-Mobility & Infrastructure at Indium Corporation
and Jason Schwartz, Business Development
Manager at KYZEN.
How to improve the reliability and performance of
electronics both in EVs themselves and in chargers
was central to discussions. The incidence of electronic
failures is almost 40% higher among EVs a
subset than those experienced by the automotive
sector as a whole – partly because of EVs have up to
18 EPP Europe » 04 | 2023

three times more electronics and because PCB assemblies
in EVs are having to work harder, longer and
at higher operating temperatures (requiring longer
mission profiles and higher voltage). Similarly, with
EV chargers not meeting consumer needs, a longlasting,
fast-charging infrastructure needs to be developed
in which devices can be protected from both
high heat and unpredictable weather. Speakers
called for the development of industry standards in
both areas.
Automation and robotics
It was clear on the showroom floor that the integration
of robotics and automation technology into
electronics manufacturing has become so ubiquitous
that no longer warrants the word ‘trend’. Demand for,
and interest in automation technology was at an alltime
high and visitors were not disappointed by the
offerings on show – everything from automated
component supply systems to automated rework systems
– the majority of which can now be seamlessly
integrated into existing manufacturing processes. AI
and factory of the future software solutions were
also very much in the spotlight.
Response to the show
IPC says its survey responses about the show were
overwhelmingly positive. “IPC APEX 2023 was a big
hit for us – the best show in years! Our booth was
consistently packed with every demo station in use
by customers,” said Davina McDonnell, global marketing
manager, Cogiscan.
“I applaud the association on its continued drive to
improve, enhance, and spotlight things that matter
to our industry. Insulectro had a super experience as
well – our best exhibiting experience ever,” said John
Lee, vice president of marketing and brand strategy,
Insulectro.
“IPC Apex Expo is a gathering place for the present
and future of electronics, enabling all of us to connect
in remarkable ways,” Mitchell said. “We at IPC
are profoundly grateful to an industry that has encouraged
and supported us in producing [the event].
We never lose sight of the fact that we could not
host this event without the dedicated volunteers
who share their time, their expertise, and their enthusiasm
with all of us.”
IPC Expo 2024 will take place from 6–11 April
2024, in Anaheim, California.
EPP Europe » 04 | 2023 19

At SMTconnect 2022, 9,055 visitors filled the halls of the Nuremberg Messe
SMTconnect & PCIM Europe 2023
Driving manufacturing
forward
From 9–11 May, the European electronics manufacturing community will once
again meet in Nuremberg for the annual SMTconnect expo. The event promises
to spotlight pressing issues including rising energy costs, component and raw
material shortages, obsolescence management and the ongoing reshoring trend.
ASYS, Ersa, Essemtec, Fuji, Juki, Panasonic, and
Viscom are just some of the big names to have
confirmed their participation as exhibitors at this
year’s SMTconnect. Visitors will not only encounter
products and solutions spanning the gamut of electronics
manufacturing, but also a lively forum in
which peers can exchange ideas as a basis for the
development of key future technologies.
Future packaging production line
Other highlights include the Future Packaging production
line presented by the Fraunhofer Institute
for Reliability and Microintegration (Fraunhofer IZM)
– this year focusing on establishing ‘competitiveness
through trust, sustainable tools and the supply
chain’.
The topic of supply chains will also be addressed at
the ‘EMS Park’ special showcase area. Offering ‘best
practice’ presentations on topics including EMS selection,
this area will highlight the benefits of close
collaboration between EMS providers and OEMs and
provide a platform for exchanges that build trust. It
will also focus on other development obstacles and
supply chain optimization.
20 EPP Europe » 04 | 2023

TRADE SHOWS & EVENTS «
The event has three stages each focusing on a different
area. The E-Mobility & Energy Storage Stage
will host presentations on electromobility and power
electronics energy storage. The Exhibitor Stage provides
a space for exhibitors to showcase their innovations.
And the Industry Stage will be a platform for
presentations and panels concerning the latest research
and development. Agenda highlights include
‘Wide Bandgap Design with GaN HEMT and Vertical
GaN’, ‘SiC is Sold Out for 2023 – Can GaN Help Me?’,
as well as ‘Support for Grid Integration of E-Mobility
Charging Infrastructure Using Energy Storage’.
With a promising future in the field of power
supply for IT and data centers, the USA is this year’s
event partner country. At the US Pavilion, visitors can
exchange ideas with companies hailing from across
the Atlantic.
The trade fair promises an exciting forum with
presentations covering everything from ‘integrating
AI into electronics manufacturing lines’ to ‘promoting
young talent’ and ‘women in mechanical engineering’.
For more information, visit smtconnect.com.
PCIM Europe
Taking place concurrently with SMTconnect, this
year’s PCIM Europe looks set to be the biggest show
yet. The international event showcases current products,
topics and trends in the field of power electronics.
Two months before the event, organisers confirmed
that floor space had reached a historical peak of
over 30,000 m². 57% of the companies exhibiting
come from beyond Germany, and include industry
leaders such as Fuji Electric Europe, Infineon, Mitsubishi
Electric Europe, Semikron Danfoss, Wolfspeed,
Nexperia, Rohm Semiconductor, Hitachi Europe
and Texas Instruments Deutschland.
A conference programme of around 400 presentations
will run alongside the expo – with topics ranging
from silicon and wide bandgap power semiconductors
to innovative packaging technologies, e-mobility
to renewable energy. A poster session will be
held on the final day of the conference.
Source: Mesago / Mathias Kutt
Keynotes
The three keynotes of the conference will be:
• ‘How Life Cycle Analyses are Influencing Power
Electronics Converter Design’, Franz Musil, Power
Electronics Engineer at Fronius International
• ‘On the Way to the DC Factory – The Open Industrial
DC Grid for Sustainable Production Sites is
Entering the Dissemination Phase’, Holger Borcherding,
Scientific Director, University of Applied
Sciences and Arts Ostwestfalen-Lippe
• ‘HV Silicon and SiC Power Semiconductors; Key
Components for Sustainable Energy Solutions’,
Munaf Rahimo, President and Founder, MTAL
Digital platform
The ‘PCIM Europe digital’ platform will complement
the on-site event. Here, participants can catch
up on missed presentations or re-watch them until
30 June 2023.
smtconnect.com
The EMS Park at the 2022 event
Source: Mesago / Mathias Kutt
EPP Europe » 04 | 2023 21

COVER STORY » SMART FACTORY
Efficient deployment of personnel in SMT production
Smart software for
smart factories
22 EPP Europe » 04 | 2023

AT A GLANCE
ASMPT reveals how its suite
of smart software solutions
can support factory
personnel - making
everyday tasks easier and
improving the overall
efficiency of
operations.
As performance, quality and cost burdens rise,
the shortage of skilled labour is putting the
electronics manufacturing sector under even
more pressure. To deploy people efficiently,
provide employees with the best possible
support and ensure they are happy, companies
need smart, flexible, and process-enhancing
solutions. ASMPT reveals how its broad portfolio
of smart software can help accomplish this,
making factories more resilient, more productive
and ultimately more competitive.
Source: ASMPT
As customer requirements steadily increase and
skilled labour shortages continue, manufacturers
must embrace digitalization if they want to
remain competitive and resilient. Despite this, a large
number of companies still believe the digital transformation
ends with machines. In many factories,
administrative processes such as staff assignments,
material flow, reporting and maintenance and repairs,
continue to be planned and controlled manually.
The tendency to rigidly assign employees to one particular
line or machine continues to prevail, and the
vast majority of manuals, checklists, maintenance
plans and service reports are still in paper format. As
a result, line staff are not deployed according to their
respective qualifications nor to task priorities, and
service technicians usually spend more time searching
for information than actually fixing a problem.
Keeping the line running
To ensure optimal Overall Equipment Effectiveness
(OEE), the most important task for operations staff is
to keep the line running. All processes must be properly
coordinated and run without interruptions. Materials
must be delivered and refilled on time, problems
must be resolved quickly, and maintenance
work must be performed without disrupting operations.
EPP Europe » 04 | 2023 23

COVER STORY » SMART FACTORY
Source: ASM
Employees receive orders and information automatically on a broad range of mobile devices
ASMPT’s WORKS Smart Shopfloor Management
Suite features an array of line operation functions to
help managers and operators on the shop floor to
control, optimize and automate eight workflows:
Planning, Programming, Integration, Optimization,
Monitoring, Operations, Preparations, and Logistics.
The software orchestrates all the necessary variables
such as personnel, equipment, materials, and processes
to ensure they interact seamlessly.
The solution provides information in the right
place at the right time and deploys employees across
all lines based on their individual qualifications. Instead
of being rigidly assigned to specific lines,
specialists are organized in smart operator pools and
deployed via smart devices where they are most
needed in accordance with their qualifications and
task priorities. The system collects, analyzes and consolidates
the necessary data from both the machines
and the monitoring software. For predictable tasks
such as material replenishment, consumption is
automatically anticipated, and the software organizes
deployment based on the shortest possible travel
distance. Another feature that saves many miles of
physical travel is the Remote Cockpit, a central console
solution that makes it possible to change
multiple machine settings from a single location. If a
quality assurance system reports a potentially defective
board, this convenient cockpit solution means it
can be visually inspected remotely.
Materials always on hand
Material logistics managers must ensure that materials
are always on hand in the right place, at the
right time and in the right quantities. The software
suite offers them an innovative solution that divides
the flow of materials into freely definable time slots.
Based on planned and actual material consumption
as well as stock on site, the software continuously
updates demand on the line. Based on this information,
it automatically issues material requests
to the central and local storage sites along with
time-based transportation orders. This eliminates the
need for manual reorders with all their potential errors,
as well as preventing machine downtime, and
eliminating the need for emergency stocks or lastsecond
operator deployments on the line.
Quality assurance
Since solder paste printing is essential for errorfree
production, quality assurance processes carried
out by operators in this area are of the utmost importance.
WORKS offers a unique solution for this.
With expert software that employs both ‘big data’
and AI, SPI systems – both those manufactured by
ASMPT as well as compatible third-party systems –
can now be integrated into the world’s first selflearning
inline expert system for electronics production.
The real-time software analyzes all current and
historical inspection data and learns from each indi-
24 EPP Europe » 04 | 2023

vidual print. Based on this information, the entire
printing process can be controlled and optimized
automatically. The software even takes data from
third-party systems, such as end-of-line AOI, into
account. It processes large volumes of data in far less
time than a human operator ever could, and it overlooks
nothing. In this way, it simplifies quality assurance
processes and improves the line’s overall productivity.
Keeping an eye on objectives
For production and factory managers, information
is the key to success. It is this information that
WORKS automates, prioritizes, and presents in an
easy-to-understand manner. It determines the line
status and all key production performance indicators
in real time and displays them as needed – in targetvs-actual
numbers, as graphics, or as target-vs-actual
comparisons with definable target values. It
allows managers to see at a single glance what is
working correctly on the factory floor and what isn’t.
It also provides technicians and process engineers
with important detailed information for their analyses
and informs production employees about order
progress, target achievement and potential improvements
by means of overhead monitors.
Source: ASMPT
AI assistant on the smartphone. Thanks to NLP, Virtual Assist makes
spoken enquiries possible and learns with each query
A large number of companies
still believe the digital
transformation ends with machines
Deploying employees efficiently and flexibly: WORKS assigns tasks across lines and in a qualification-oriented manner to a smart operator pool
Source: ASMPT
EPP Europe » 04 | 2023 25

COVER STORY » SMART FACTORY
Optimization along the whole line: WORKS Process Expert is the world’s first self-learning expert system for SMT lines. It integrates data from AOI
machines for successful defect root cause detection and controls and optimizes the placement and printing processes.
Source: ASMPT
Compiling and supplying
information
Diligent maintenance and rapid troubleshooting
are important prerequisites for a smooth production
flow. To perform their job properly, service technicians
require quick and easy digital access to information
– ideally on their mobile device – even if
the information they need comes from multiple
sources spread over many systems. To achieve this,
ASMPT offers intelligent IoT applications and flexible,
scalable licence models to increase the performance
of the entire SMT factory across equipment
suppliers and divisions. This functions as a central
and manufacturer-independent solution for predictive
maintenance of all machines – even outside of
SMT production – or as an AI- and natural language
processing (NLP)-supported virtual assistant on mobile
devices.
Organizing maintenance
operations
A maintenance manager must keep track of the
entire production inventory, reconcile maintenance
operations with production planning and maintain
adequate capacities without building up a service
backlog. Achieving all this is very demanding.
The smart solution to this is called Factory Equipment
Center, a scalable IoT-based application for enterprise-wide
asset and maintenance management
with a central maintenance calendar. The planning,
control, support, execution and documentation of
maintenance and service operations can be carried
out centrally for all equipment, including machines
from other manufacturers and non-SMT production
equipment.
The system keeps an eye on production scheduling
and coordination, making it possible to assign tasks
automatically and without errors. Factory Equipment
Center also provides operators with maintenance instructions
and checklists at the push of a button. It
tracks and monitors sensor data and even automates
time-consuming manual reporting.
Rapid troubleshooting
With the AI-supported Virtual Assist, service technicians
get an all-in-one manual they can carry in
their pocket as the perfect companion to their everyday
tasks. Upon request, it provides all the technical
26 EPP Europe » 04 | 2023

The software orchestrates all the necessary
variables such as personnel, equipment,
materials, and processes to ensure they interact
seamlessly
information needed for any machine. Thanks to its
natural language processing (NLP) and AI, they can
verbally query a system – regardless of source or machine;
the program automatically adapts its search
algorithms to the target medium. Even queries from
English-language sources entered in German produce
results quickly and directly. And thanks to machine
learning, the system adds knowledge with each
query and improves all the time. Since the SaaS solution
is not limited to ASMPT equipment, any
number of assets from different vendors can be
added. Knowledge thus remains in the company even
when employees leave. Virtual Assist also makes onboarding
new people a lot easier.
More efficiency,
happier employees
Today, software is as important in ASMPT’s product
portfolio as its equipment for printing, inspection
and SMT assembly. More complex tasks and new
technologies require the use of process-automation
and optimization software. By utilizing it, companies
can benefit from highly efficient personnel deployment,
better productivity and superior quality, while
employees get support that makes their work easier,
and less stressful. Thanks to big data and AI, the
software accumulates knowledge that stays inhouse
with each process – making the business more
competitive and resilient.
Modular design for optimal ROI
As with ASMPT’s hardware solutions, the modular
Open Automation concept forms the central component
of the company’s software strategy. It breaks
with dependencies on proprietary systems as well as
with rigid processes and restrictions. Instead, electronics
manufacturers can take a personalized,
modular path to the integrated smart factory while
still ensuring the best ROI.
facts-on-open-automation.asm-smt-events
smt.asmpt.com
Zusammenfassung
Der Fachkräftemangel setzt Unternehmen stark
unter Druck. Die Titelstory zeigt, wie mit einem umfassenden,
intelligenten und flexiblen Software-
Portfolio Mitarbeiter effizient eingesetzt, und best
möglich unterstützt werden können.
Résumé
La pénurie de main-d’œuvre qualifiée exerce une
forte pression sur les entreprises. L’article de couverture
montre comment une gamme de logiciels
complète, intelligente et flexible permet d’employer
efficacement les collaborateurs et de les assister
au mieux.
Резюме
Нехватка квалифицированной рабочей силы
оказывает сильное давление на предприятия.
В заглавной статье показано, как можно
эффективно привлекать и максимально
поддерживать работников при помощи
комплексного, интеллектуального и гибкого
программного портфолио.
EPP Europe » 04 | 2023 27

» PCB & ASSEMBLY
Alternative thermal management solutions
Enhancing thermal
management with IMS
A little understanding can make a big difference when designing
thermal management with insulated metal substrate (IMS). The first of a
two-part series, this article examines how IMS can help control and
dissipate heat in assemblies containing power semiconductors and LEDs.
Chris Hanson, Global Head IMS Technology, Ventec International Group
Proper thermal management is needed to ensure
the reliability of components that exhibit significant
self-heating. Typical examples include LEDs
in lighting applications and IGBTs and FETs in power
supplies, converters, and motor drives.
Various techniques are available to extract and
dissipate the heat from inside the component. The
designer’s decisions can influence other important
aspects of the end product, such as cost, size, and
appearance.
Attaching a heatsink, usually directly to the component
itself, is a typical solution. There can be drawbacks,
however. Depending on the power to be dissipated,
the heatsink needed may be large and bulky.
Active cooling, using a fan, may be required. In addition,
attaching the heatsink during product manufacture
may require special, or even manual, assembly
processes that increase the cost of the end product.
Cooling through the substrate
Fortunately, there are alternatives. One is to dissipate
heat into the substrate. This is a popular approach,
particularly where surface-mount packages
are used. Surface-mounted LEDs, for example, dissipate
a high proportion of heat through the underside,
to maximize utilization of the topside as the lightemitting
surface. As far as power transistors are concerned,
typical through-hole packages have design
features that ease attachment and optimize dissipation
from the die into a heatsink. Surface-mount
packages, on the other hand, may be optimized for
cooling through the topside, underside, or both.
IMS structure and
thermal dissipation
Source: Ventec International Group
28 EPP Europe » 04 | 2023

Various grades of IMS are available,
depending on the dielectric
composition, layer thickness, and
baseplate material and thickness
Source: Ventec International Group
Where heat is to be dissipated through the underside,
the substrate must be capable of dealing with
this. If the thermal properties of standard FR4 material
are not sufficient, adding thermal vias filled
with high-conductivity material can increase the
ability to remove heat from the component package.
However, this can increase the board cost and complicate
circuit layout and routing.
A thermally enhanced substrate can help overcome
these challenges and, in some cases, can allow
a heatsink-free design. Insulated Metal Substrate
(IMS) circuit boards provide high thermal conductivity
and are available in various grades. Some manufacturers
also offer economical non-IMS products
that deliver thermal performance several times
better than FR4.
IMS properties and parameters
An IMS laminate consists of a metal baseplate separated
from the circuit foil by a thin layer of dielectric,
arranged to promote heat flow from the mounted
component into the baseplate, from where it can be
dissipated into the ambient environment.
The dielectric is resin-based and serves to bond to
the metal layers as well as providing electrical insulation
between them. The baseplate is often
aluminum, typically chosen for its light weight and
DON’T MISS...
The second article in this
series will examine practical
IMS applications and
guidelines for material
selection.
relatively low cost. Various alloys are available that
offer designers a choice of properties. Pure
aluminum has superior thermal conductivity and is
relatively low cost. On the other hand, aluminum/
magnesium/chromium mixes such as Aluminum
5052 – a medium-cost alloy – are better suited to
processes such as bending, forming, and punching.
The opportunity to dissipate large
quantities of heat energy through the
substrate helps ensure reliability
while at the same time permitting a
space-saving solution.
Alternatively, the baseplate may be copper and,
sometimes, steel. Despite increased cost and weight,
copper may be chosen where superior thermal performance
is needed. It can also be chosen if there is a
need for the baseplate coefficient of thermal expansion
(CTE) to be closely matched with that of the circuit
foil, to minimize mechanical stresses at elevated
temperature.
The circuit layer is typically a standard HTE (High
Temperature Elongation) ED (Electro-Deposited) foil,
as used in regular copper-clad PCB laminates. Superelongation
foil can be specified where extreme CTE
mismatch is an issue.
The dielectric layer may be a composite of epoxy
resin with woven glass reinforcement, like a conventional
laminate construction. Compared to conventional
resins as used in ordinary FR4 laminates, its
thermal conductivity is enhanced by loading with a
thermally conductive ceramic filler. The conductivity
can be controlled by adjusting the proportion of filler,
up to a maximum of about 70%.
EPP Europe » 04 | 2023 29

» PCB & ASSEMBLY
Despite the effects of the filler, the thermal conductivity
of glass-reinforced materials is limited by
the nature of the glass. For highest thermal conductivity,
the dielectric may simply be a layer of unreinforced
resin. This demands critical control in manufacture
to maintain a consistent dielectric thickness,
whereas the glass fabric provides a natural mechanical
spacer. Note that whatever the proportion of ceramic
filler, and with or without glass reinforcement,
the resin must retain its ability to reliably bond the
baseplate and circuit foil and withstand potentially
Zusammenfassung
Ein entsprechendes Wärmemanagement ist erforderlich,
um die Zuverlässigkeit von Komponenten zu gewährleisten,
die eine erhebliche Eigenerwärmung aufweisen
wie z.B. LEDs in Beleuchtungsanwendungen sowie IGBTs
und FETs in Stromversorgungen, Umrichtern und Motorantrieben.
Im ersten Artikel einer zweiteiligen Serie wird
untersucht, wie IMS dazu beitragen kann, die Wärme in
Baugruppen mit Leistungshalbleitern und LEDs zu kontrollieren
und abzuführen.
Résumé
Une gestion thermique appropriée est nécessaire pour garantir
la fiabilité des composants qui présentent un auto-échauffement
important, comme par exemple les LED
dans les applications d’éclairage, ainsi que les IGBT et les
FET dans les alimentations électriques, les convertisseurs
statiques et les entraînements à moteur. Le premier article
d’une série en deux parties examine comment l’IMS peut
contribuer à contrôler et à dissiper la chaleur dans les
sous-ensembles comprenant des semiconducteurs de
puissance et des LED.
Резюме
Чтобы гарантировать надежность компонентов,
подверженных значительному самонагреванию,
например, светодиодов в осветительных системах,
биполярных транзисторов с изолированным затвором
и полевых транзисторов в источниках питания,
инверторах и электроприводах, требуется
соответствующее регулирование теплообмена. В
первой статье серии из двух частей рассматривается
вопрос, как изолированная металлическая подложка
может помочь в контроле и отводе тепла в
компонентах с силовыми полупроводниками и
светодиодами.
severe thermal cycling conditions. In general, the reinforced
dielectrics have lower thermal conductivity
and higher breakdown voltage.
Another basic difference between reinforced and
non-reinforced dielectrics is in their mechanical
bendability, which allows post-forming of the substrate
into three-dimensional shapes. This can help
in applications such as automotive LED lighting, giving
the opportunity to combine several elements into
a single fitting while also simplifying the design and
final assembly.
Choosing optimal IMS properties
By managing these variables – resin composition,
glass reinforcement, dielectric layer thickness, baseplate
material, and baseplate thickness – IMS manufacturers
can present a portfolio of materials that
offer various combinations of properties; particularly
thermal performance, reliability, and cost. The image
BILD2 compares the specifications of Ventec’s ‘tecthermal’
family of thermally enhanced substrates.
They cover thermal conductivity values ranging from
2.2W/m.K to 7.0W/m.K, which compares with
0.3W/m.K for standard FR4 material. The diagram includes
the non-IMS substrate VT-5A2, which has
thermal conductivity eight times better than FR4 and
is aimed at cost-sensitive applications.
Typical maximum operating temperatures for insulated
metal substrate laminates are about 130°C.
Certain glass-reinforced grades can be as low as
90°C. High-Tg thin laminates and prepregs are available,
capable of operation up to 150°C.
A simple and effective solution
An IMS can be a simple and effective solution to
thermal management challenges, particularly in systems
containing power semiconductors and LEDs.
The opportunity to dissipate large quantities of heat
energy through the substrate helps ensure reliability
while at the same time permitting a space-saving
solution. Depending on the application and operating
conditions, IMS also helps design without components
like heatsinks and other cooling devices
such as a fan.
Various combinations of dielectric composition,
baseplate material, dimensions, and circuit foil give
IMS products a wide range of thermal – as well as
electrical and mechanical – properties. These give
designers a broad scope to optimize the characteristics
to suit their application.
http://www.venteclaminatescom
30 EPP Europe » 04 | 2023

Product Updates « PCB & ASSEMBLY
New oven minimizes maintenance in high solder paste reflow applications
Vitronics Soltec introduces reflow oven upgrade
Vitronics Soltec, brand of ITW EAE, has released a
new reflow soldering oven that it says addresses the
unique challenges facing high solder paste customers.
The Centurion+ is an upgrade of the Centurion
with features that further minimize maintenance
and keep the process chamber cleaner.
“In applications that require a high amount of solder
paste, the amount of maintenance required increases,”
the manufacturer explained. “To address
this challenge, the new system features greater accessibility
to components that require maintenance.
Easily removable blow boxes with removable side
plates make cleaning easier in the cooling area.
Easily removable baffle boxes on infeed and outfeed
reduces downtime for cleaning.”
The machine can be configured with Ultra Cathox to
handle more than 50 kg of solder paste per week.
This reduces maintenance requirements while
keeping a clean process environment. It is very effective
in removing volatile compounds from the process
tunnel during reflow. In thermal oxidation, or-
ganic vapors are converted
to hydrocarbons,
which are captured
by a filter. The
design also ensures
that when maintenance
is required, users
have easy access and
can do the maintenance job with few tools required.
“We designed the Centurion+ with considerable
input from our customers to make sure we were addressing
all of their needs,” said Coco Zhang, ITW
EAE Reflow Business Manager. “We have a strong relationship
with the world’s leading manufacturers
and work directly with them to identify areas that
need further innovation.”
With the best heat transfer in the industry, the Centurion
is able to run any profile at the lowest set
point possible, which minimizes the thermal differences
over the product and uses less energy.
www.itweae.com
The company says the
new oven offers easily
removable blow boxes
with removable side
plates make cleaning
easier in the cooling
area
Source: ITW EAE
Quick-turn soldering processes
Mechnano develops ESD high-temp 3D-printable resin
Arizona-based manufacturer of parts
with discrete carbon nanotubes using vat
photopolymerization system Mechnano,
has announced it has developed a new
high-temperature, rigid ESD material in
partnership with Tethon3D.
The resin can be processed on a variety of
vat photopolymerization systems (SLA,
DLP, LCD). The vat photopolymerization
process allows for Quick-Turn part fabrication
with ultra-high accuracy, Nano-
Uniform ESD and exceptional surface finish,
while taking advantage of custom
3D-printable design freedom.
The electronics industry can be more agile
when handling bespoke customer requests
by using additive manufacturing
(AM), commonly known as 3D printing, to
fabricate ESD parts to support the reflow
process. Arizona-based Mechnano uses
AM to help electronic manufacturing service
(EMS) providers reduce cycle time,
increase throughput, and ensure Nano-
Uniform ESD protection.
The resin can be processed on a variety of vat
photopolymerization systems (SLA, DLP, LCD)
Agility is essential for customer-specific
applications that require a variety of nonstandard
components for low-volume
production runs. Customers often request
custom carriers/pallets to hold printed
wiring assemblies during the reflow process.
These carriers must protect today’s
micro-electronic components from electrostatic
discharge and withstand
multiple cycles of a high-temperature
wave soldering process (245°C).
Source: Mechnano
Using traditional manufacturing technologies
for fabrication of these components
can slow down production and increase
cost, while using the traditional carbon
fiber filled materials in these components
does not protect today’s electronics. The
challenge is quickly fabricating custom
Nano-Uniform ESD components that
would withstand numerous thermal
cycles.
Mechnano, in partnership with Tethon3D,
has developed a new high-temperature,
rigid ESD material to meet this challenge.
The resin can be processed on a variety of
vat photopolymerization systems (SLA,
DLP, LCD). The vat photopolymerization
process allows for Quick-Turn part fabrication
with ultra-high accuracy, Nano-
Uniform ESD and exceptional surface finish,
while taking advantage of custom
3D-printable design freedom.
mechnano.com
EPP Europe » 04 | 2023 31

» PCB & ASSEMBLY
White paper: ‘flying’ SMD components
Investigating the ‘flying’ SMD
components phenomenon
Advancing miniaturization of SMD components not only results in advantages such as
a more compact product design and low weight, it also poses a number of challenges
for process technology. This white paper, which will be published in two parts, investigates
the issue of so-called ‘flying’ components in which some components are being
blown away during convection soldering processes.
Dr. Paul Wild, Carsten Giersberg, Rehm Thermal Systems GmbH
In recent years, much has been said about adapting
solder paste printing, placement and inspection
processes to the new challenges posed by the advancing
miniaturization of SMD components. During
this time, there has also been an increase in the frequency
at which components are blown away during
convection soldering of electronic PCBs. In particular,
the SOD323 design (small outline diode) is frequently
affected by this problem. The mechanisms that lead
to this defect, their interactions and possible remedies
are explained in this article on the basis of CFD
simulations (computational fluid dynamics), analytical
models and experiments.
Fundamentals of heat transfer
In convection soldering systems, heat transfer is
based on the principle of forced convection. Ambient
air or nitrogen is used as the heat transfer medium.
After the medium has been heated up it is directed,
About Rehm
Rehm Thermal Systems is a specialist in the area of thermal
system solutions for the electronics and photovoltaic industries
and is among the leaders in technology and innovation
in the modern, cost-effective production of electronic
assemblies. As a global manufacturer of reflow soldering
systems with convection, condensation or a vacuum, drying
and coating systems, functional testing systems, equipment
for metallisation of solar cells and numerous customised
special systems, we have a presence in all the relevant
growth markets and, as a partner with over 30 years of
industry experience, we arrive at innovative production
solutions that set new standards.
Flow field of a jet stream striking a surface
for example, through a nozzle array onto a PCB and
heat transfer takes place. Heat transfer depends on
the temperatures of the PCB and the medium, and on
the heat transfer coefficient. Jet streams from a
nozzle array which strike a product beneath it are
very often used in thermal systems for cooling, heating
or drying. The image above shows the flow field
of a jet stream striking a surface along with its typical
open jet, stagnation flow and wall jet zones.
The heat transfer coefficient depends on the geometry
of the nozzle, its distance from the impact
surface, temperature difference and flow velocity. See
the image overleaf for an example of simulated velocity
distribution for an arrangement consisting of
nozzle array and PCB with electrolytic capacitors. The
flow zones described above are visualized here by
means of flow lines. Maximum heat transfer occurs
at the end of the open jet at the point of flow stagnation
[Schabel & Martin, ‘Wärmeübertragung bei
erzwungener Konvektion: Prallströmungen’, 2019].
Next to this is an example of simulated distribution
of the heat transfer coefficient for an arrangement
of several nozzles and a PCB with electrolytic
capacitors. This visualization represents only a mo-
Source: Rehm Thermal Systems
32 EPP Europe » 04 | 2023

Simulated velocity distribution for an arrangement of multiple nozzles and a PCB with electrolytic
capacitors
Source: Rehm Thermal Systems
Simulated distribution of the heat transfer
coefficient for an arrangement of multiple nozzles
and a PCB with electrolytic capacitors
Source: Rehm Thermal Systems
mentary snapshot from a transient calculation. In
the actual process, the PCB moves so that it’s alternately
subjected to lower and higher heat transfer
coefficients in the direction of transport.
When designing the nozzle arrays, particular attention
is focused on longitudinal and transverse
profile requirements and the difference in temperature
between small and large thermal masses. Optimum
heat transfer and lowest possible wind forces
are required as well, which interact with each other
in a contrary manner. Nozzle arrays are static system
components and they have to perform well with a
broad range of PCBs and components. Borderline
cases also exist, especially at high frequencies or fan
power levels, as is the case for SOD323 components.
Experimental investigations:
flow velocity measurements
During the first step of the investigation, wind
forces to which the respective component is subjected
relative to fan power need to be determined
Zusammenfassung
Die fortschreitende Miniaturisierung von SMT-Bauteilen
stellt eine Reihe von Herausforderungen an
die Prozesstechnik. In diesem zweiteiligen White
Paper wird das Problem der so genannten „fliegenden“
Bauteile untersucht, bei denen einige Bauteile
inzwischen so klein sind, dass sie während des
Konvektionslötprozesses weggeblasen werden.
Résumé
La miniaturisation croissante des composants CMS
pose un certain nombre de défis à la technologie
des processus. Ce livre blanc en deux parties examine
le problème des composants dits « volants »,
dont certains sont désormais si petits qu’ils sont
soufflés pendant le processus de brasage par convection.
Results of temperature and velocity measurement in transport
direction on the surface of a PCB
Source: Rehm Thermal Systems
Резюме
Продолжающаяся миниатюризация
компонентов поверхностного монтажа
предъявляет ряд требований к
технологическому оборудованию. В этом
аналитическом докладе из двух частей
рассматривается проблема так называемых
„летающих“ компонентов, т.е. когда некоторые
компоненты настолько малы, что их буквально
сдувает во время процессов конвекционной
пайки.
EPP Europe » 04 | 2023 33

» PCB & ASSEMBLY
Representation and dimensions of an SOD323 [Infineon Technologies AG, Silicon PIN Diodes BAR63..., München, 2009] and the model derived therefrom
Source: Rehm Thermal Systems
experimentally. Whereas temperature measurement
in an oven belongs to the state of the art and a variety
of profilers etc. are available for this purpose,
the measurement of flow velocities in the vicinity of
the PCB poses a challenge. In particular, this is due to
very high process temperatures and complicated
flow conditions. As part of an internal research project,
a measuring system was developed at Rehm
Thermal Systems on the basis of a vane anemometer,
which is capable of recording flow in all 3 spatial directions,
as well as directional changes, at typical
soldering temperatures.
The graph on the previous page shows the results
Process settings for blow-off tests
Process settings
1. Without solder paste
2. With solder paste and 23°C
3. With solder paste and 180°C
Fan power (%)
45
100
91
Effect
Blown away
Not blown away
Blown away
of a series of measurements performed with this system.
The flow velocity curve shows a number of direction
reversals in proximity to the nozzle arrays.
This is due to the paths of the individual nozzle jet
streams: if the vane wheel is moving towards a jet
stream, it rotates in one direction. After passing the
stagnation point, flow is reversed. This explanation
also correlates with the temperature curve, which
shows small temperature fluctuations when passing
individual nozzles (red marking). Velocities lie within
a range of ± 0.75 m/s. Due to the size of the vane
wheel (approximately 15 mm), measurement results
tend to have a coarse resolution and can’t be extrapolated
to significantly smaller components.
Experimental investigations:
Blow-off test
In order to investigate the influence of flow and
temperature on SOD323 components being blown
away, testing was conducted with the settings listed
Calculation space of the model (left) and 6 gas jets with impact on 36 components
Source: Rehm Thermal Systems
34 EPP Europe » 04 | 2023

in the table. In each case, fan power at which the
components were blown away was determined. Tests
conducted at 23°C and 180°C served the purpose of
determining the influence of temperature on the
properties of the solder paste.
Displacement or rotation of components near the
pads was most frequently observed without solder
paste (1) and with solder paste at 180°C (3). This is
due to the geometry of the component: the connections
can be no more than 0.05 mm longer than the
height of the component, so that the component
nearly rests on the PCB. For this reason, it’s assumed
that the printed solder paste is stressed to the point
of shearing when subjected to wind.
Many components outside the pad area had been
knocked over. This is due to unevenness (conductor
paths etc.) on the circuit board, against which the
connections come into contact, causing the component
to tip over. The components blown off of the
PCB were located exclusively in zone 2. No components
were blown off with standard temperature and
the fan set at 73% power.
Numerical investigations: Model
description
Simulations for determining flow velocities were
carried out concurrent to the experimental investigations.
The Solidworks Flow Simulation tool was
used for this purpose. The diagram on the left shows
the dimensions of an SOD323 taken from a data
sheet, as well as the geometry derived therefrom.
In the simulation model, the components are
firmly connected to the PCB. In order to take the influence
of orientation into account, the components
are aligned in the direction of transport, as well as
transversely. Loads to which the PCB is subjected are
determined in the stationary state, i.e. without moving
the PCB through the oven. The left-hand image
at the bottom of the previous page shows the calculation
space with periodic boundary condition. Ambient
pressure was defined as an external boundary
condition. The blowing force of a total of 6 gas jets is
simulated, which act on 36 components with orientation
parallel and at a right angle to the direction of
transport (see the image on the right).
This static arrangement of components and
boundary conditions is intended to approximate the
forces acting on a moving PCB. Spatial directions are
defined as follows: X – in transport direction,
negative, Y – vertically upward, positive, Z – at a
right angle to the direction of transport, positive, to
the left. Flow velocities and resulting forces were
simulated for experimentally determined fan powers
of 100%, 91%, and 45%.
Simulation results
As the second part of this paper will detail, the results
of the simulation demonstrated that the maximum
forces act upon different components and that
there is no component for which a force resulting
from all three directions of action must be considered
the greatest force.
www.rehm-group.com
To be continued...
The second part of this white paper,
set to be published in our October
2023 issue, will evaluate the results
of the simulations for determining
flow velocities, discuss the role of
solder paste, and summarise the
results of the investigation overall.
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EPP Europe » 04 | 2023 35
smt.yamaha-motor-robotics.eu

» PCB & ASSEMBLY
Automated solutions on show at Apex 2023
Leveraging automation to
improve efficiency
Drawing the largest and most well qualified electronics manufacturing
crowd in North America, Apex Expo 2023 saw PCB fabricators, designers,
OEMs, and EMS companies from around the world unveil their newest
products. Regular exhibitor Panasonic Connect used the opportunity to
present automated solutions designed to boost productivity on the factory
floor. Process Automation Business Head at the company,
Gustavo Sepulveda, tells us more.
Source: Panasonic Connect
The company says its
NPM-GP/L screenprinting
machine helps
manufacturers run
production lines more
efficiently, while using
fewer resources
This year’s Apex event occurred amidst a revival
of North American manufacturing, as companies
begin moving their operations out of China.
Many are taking advantage of this renewed interest
and investment by innovating more than ever before.
In the United States, the USD 39 billion (EUR )
investment in manufacturing incentives from the
CHIPS Act is providing companies with the support
needed to boost progress in the space. As demand
for goods increases around the world – in the US,
the Producer Price Index for final demand increased
0.7 percent in January – companies in the electronics
manufacturing sector are turning to digital
transformation to keep up. By integrating software
and new applications into the SMT line, they are
finding ways to run processes more smoothly and
efficiently.
Software solutions
At Apex 2023, we saw companies focusing on advanced
technologies to help them navigate the future
of manufacturing. We at Panasonic Connect
demonstrated how software can help companies expand.
Our manufacturing execution system PanaCIM,
which can be integrated in both our existing and
partner technology equipment, delivers a featurerich
manufacturing software suite that grows with
the manufacturer. We also showcased our new software
capability, APC-5M, which monitors machine
performance to ensure it remains optimized.
When machines break down, the added downtime
increases stress and costs for manufacturers. With
our software solutions, manufacturers can make
changes directly on the production line. This ensures
that these lines can continue to run efficiently and
produce goods on time.
Integrating tech into SMT lines
The company also emphasized the importance of
integrating technology and software into SMT lines
to speed up production. Our NPM-GP/L screen printing
machine and Auto-Setting Feeder solutions were
highlights of the event.
The NPM-GP/L is a screen-printing machine that
can automatically implement production line
changes with precise accuracy of ±3.8 µm. In addition
to precision, the machine improves efficiency on
production lines. The system shaves off nearly six
minutes of time that it takes to change over the machine
– approximately four minutes compared to the
industry standard of ten minutes. With this automation,
production line changes can happen within a
cycle time of approximately 12 seconds.
The Auto-Setting Feeder is an automated compo-
36 EPP Europe » 04 | 2023

Source: Panasonic Connect
Gustavo Sepulveda,
Process Automation Business Head,
Panasonic Connect
nent supply system which offers the flexibility of
easily fitting tape reels from 8mm up to 104mm in
width. It can automatically peel the cover on surface
mount component tape between 4 mm and 104 mm
wide – an industry first. The system auto-loads all
feeder sizes in 15s, which maximizes line uptime and
throughput.
Future-proofing production lines
Both technology and software solutions allow
manufacturers to keep up with demand and futureproof
their production lines by fixing issues in realtime.
Our screen printer can immediately respond to
customer supply and demand changes through autonomous
updates, making autonomous factories a
reality. The automation used in both this and the
Auto-Setting Feeder machines also mean streamlined
training for employees.
In today’s environment, companies can spend
months training their workers. However, with worker
retention proving to be a large industry challenge,
the time spent training them may become wasted.
By leveraging automation found in these new offerings,
companies can focus on giving workers highvalue
tasks, and starting them immediately once
they’re hired.
Automation not only makes manufacturing more
efficient with improved business outcomes, but also
has huge potential in enhancing the employee experience.
This will be critical as manufacturers work
to shape the next generation of its workforce.
From hardware and software to smart component
and autonomous systems, solutions like these allow
manufacturers to future-proof their production
lines.
connect.panasonic.com
Zusammenfassung
Die diesjährige APEX EXPO fand inmitten einer Wiederbelebung
der nordamerikanischen Fertigung statt,
da Unternehmen angefangen haben, ihre Betriebe aus
China zu verlagern. Durch die Integration von Software
und neuen Anwendungen in die SMT-Linie
finden sie Wege, um Prozesse reibungsloser zu gestalten.
Die Nutzung der Automatisierung sorgt zudem
für Effizienzsteigerung.
Résumé
L’APEX EXPO de cette année s’est déroulée au milieu
d’un renouveau de la fabrication nord-américaine, les
entreprises ayant commencé à délocaliser leurs opérations
hors de Chine. Grâce à l’intégration de logiciels
et de nouvelles applications dans la ligne de
CMS, elles trouvent des moyens de rendre les processus
plus fluides. Le recours à l’automatisation permet
en outre d’accroître l’efficacité.
Резюме
Выставка APEX EXPO в этом году проходила на
фоне возрождения североамериканского
производства, потому что предприятия начали
переносить свою деятельность из Китая. За счет
интеграции программного обеспечения и новых
приложений в линии поверхностного монтажа
они находят способы более плавной организации
технологических процессов. Применение
автоматизации к тому же способствует
повышению эффективности.
EPP Europe » 04 | 2023 37

PCB & ASSEMBLY » Product Updates
Reducing transport and head standby loss, improving per-unit-area productivity
Yamaha Motor launches high-efficiency dual-lane modular surface mounter
Yamaha Motor Europe Robotics SMT Section
presented its new YRM20DL surface
mounter. The system is a high-efficiency
modular that the company says achieves
improved actual and per-unit-area productivity
with a newly developed highrigidity
dual-lane conveyor by further reducing
transport losses. It is built on the
basic performance of the company’s flagship
high-speed, high-accuracy, high-versatility,
universal mounter YRM20.
Main features
Source: Yamaha Motor Europe
The new unit is built on the basic performance of
the company’s flagship high-speed, high-accuracy,
high-versatility, universal mounter YRM20
1. Higher speed and higher accuracy
By revising the dynamic layout, the unit
has achieved a level of 120,000 CPH
(under company optimum conditions).
This has been achieved by way of minimizing
the movement distance by bringing
the pickup and mounting areas closer to
each of the two heads, and further optimizing
the overall spindle motion control.
High-accuracy mounting of ±15 μm
(Cpk≥1.0) is achieved by increasing the
rigidity with the developed conveyor and
improving the correction function. The
RM head/HM head supports 0201 (0.25 x
0.125 mm) sized chip component mounting
and narrow adjacent mounting.
2. Adoption of a newly developed duallane
conveyor
The high-rigidity dual-lane conveyor supports
a maximum PCB width of up to
330 mm where the same width PCB is
being conveyed at the front and rear while
in dual-lane production mode. An ultrahigh-speed
rotary RM head that employs
overdrive motion allows the front and rear
heads to operate without any interference
up to a maximum PCB length of 380 mm,
enabling highly efficient mounting without
head standby loss.
In single-lane production, which uses
only one of the two lanes, it is possible to
transport PCBs up to a maximum length
of 810 mm, a maximum width of 610 mm,
a transportable weight of 3 kg, and a
maximum PCB thickness of up to 6.5 mm.
This new model is also compatible with a
wide range of extra-large-sized PCB‘s, jig
conveyance, etc.
3. Other key features
Head can be selected from 3 types
• Ultra-high-speed rotary RM head with
overdrive motion
• In-line HM head that combines high
speed and high versatility with „1 head
solution“ that can handle ultra-small
chip components to larger components
with one type of head
• In-line type FM head capable of handling
tall and odd-shaped components
Supports various labor-saving functions
• Auto-loading feeder that can easily replenish
tape components at any time
without the need to stop production
• eATS30, a non-stop tray supply device
that can supply tray components in
units of pallets/magazines without the
need to stop production
• Non-stop loading/unloading feeder carriages
that enables setup work for
feeder carriages replacement without
the need to stop production on one lane
• Automatic exchange of push-up pins,
greatly reducing workloads when
changing products
Integrity and ease of maintenance
• Nozzle ID management that enables
maintenance optimization according
to the number of accumulated shots
• Self-diagnostic and self-recovery functions
maintain a clean state, allowing
continued high-quality production
nozzle health care/feeder maintenance
warnings
www.yamaha-motor-robotics.eu
smt.yamaha-motor-robotics.de/
Transporting two PCBs of the
same type by parallel mounting
Source: Yamaha Motor Europe
Transporting two PCBs of
different types
Source: Yamaha Motor Europe
Alternate mounting
Source: Yamaha Motor Europe
38 EPP Europe » 04 | 2023

Product Updates « PCB & ASSEMBLY
Factory automation made easier
Surface-mount edge-emitting laser diode with 110 µm aperture
ams Osram, a global leader in optical solutions, has extended its
edge-emiting laser diode portfolio by introducing a compact
surface-mount device with a small aperture size. The SPL
S1L90H_3 offers improved performance at long range and easier
optical integration in LiDAR and longdistance industrial
ranging applications.
The company says the laser is one of the first of its kind to have
an aperture as small as 110 µm. The small aperture enables the
application to produce a narrow beam. The 905 nm infrared
technology is optimized for short-pulsed LiDAR applications.
The single-channel laser features multi-junction technology,
consisting of three vertically stacked emitters in a single laser
die which is mounted inside the device’s 2.3 mm x 2.0 mm x
0.69 mm package. This technology enables it to produce peak
output power of 65 W. These features result in better illumination
of the target area at long range in distance measurement,
3D optical sensing and simultaneous localization and
mapping (SLAM) applications. This is valuable in products such
as drones and robots, as well as in building and factory automation
equipment.
“High volume consumer and industrial products need the convenience
of a laser in a small surface-mount package that can
be assembled by automated production equipment. Now the SPL
The company says the laser’s narrow emission width produces better
performance and eases optical integration in long-distance LiDAR applications
S1L90H_3 extends our portfolio to include a lower-power surface-mount
device for industrial markets, and with an aperture
half the size of previous devices,” said Jouni Riihimaeki, Product
Marketing Manager for industrial lasers at ams Osram.
Source: ams OSRAM
It is optimized for
short-pulsed LiDAR
applications such as
drones, robots as well as
in building and factory
automation equipment
Source: ams OSRAM
Optimized package design
The optimized, power-efficient pulsed laser SPL S1L90H_3 enables
a maximum pulse width of 50 ns. Beam divergence is just
10° (parallel) x 25° (perpendicular), enabling efficient beam
shaping with its small aperture. Its inductance-optimized package
is suitable for pulses shorter than 2 ns. The robust surfacemount
package is ideal for use in industrial environments as
well as in consumer applications and home and building automation.
It is specified for corrosion robustness to class 3B, and
offers low thermal resistance for easier system thermal design.
ams-osram.com
The answer to avoid voiding
Setting up a profile with our
vapour phase solder machines is like a short flight.
Enter the data, „take off“ and you‘ve reached the destination.
Trust the world market leader. Come with us on board.
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IBL-Löttechnik GmbH Messerschmittring 61-63, D-86343 Königsbrunn Tel.: +49(0)8231/95889-0 www.ibl-tech.com
EPP Europe » 04 | 2023 39

PACKAGING » Product Updates
US company to cooperate with German auto supplier ZF on chip factory
Wolfspeed to build multi-billion euro semiconductor plant in Germany
Source: Pexels/Mike B
US maker of power chips Wolfspeed Inc. will invest over EUR 2
billion to build the world‘s largest factory for silicon carbide
(SiC) semiconductors in Saarland, Germany, Handelsblatt has reported,
citing sources close to the project. German automotive
supplier ZF will take a minority stake in the project.
According to sources, the company wants to begin construction
work on the site - a former coal power station in Ensdorf - as
soon as possible, with production scheduled to begin in four
years. There will also be a joint research centre built on the site.
Handelsblatt says confirmation of German state subsidies for
the project is still outstanding. As with other semiconductor
manufacturers, these are expected to cover around 40 per cent
of total costs. More expensive than conventional silicon, silicon
carbide is in demand worldwide because of its useful properties
as semiconductor material in EV applications. Smaller, lighter
and more energy-efficient than their silicon counterparts, SiC
chips are able to signficantly increase the range and performance
of electric vehicles.
The news of the mega fab sets ZF in direct competition with
Bosch, thus far the only automotive supplier to manufacture its
own SiC chips.
www.wolfspeed.com
Automotive demand for chips likely to increase threefold by 2030
Automotive suppliers urge EU to prioritise adoption of Chips Act
The European Association of Automotive
Suppliers (CLEPA), which represents over
3,000 companies supplying components
and technologies for mobility, has released
a statement calling upon the European
Commission, Parliament and Council
to prioritise the adoption of the EU Chips
Act and ensure trilogue negotiations can
start as quickly as possible. It added that
the European Commission and Member
States should coordinate to ensure sufficient
funds are mobilised, as it has been
done in regions such as the US and Asia.
E-mobility, automated, and connected
driving solutions are leading to more
automotive demand for chips. Automotive
will be good for 14% of global demand
for chips, up from 8% now, according
to a recent study commissioned by
VDA.
The association pointed out that:
• Shortage of nodes particularly used in
automotive can continue beyond 2025
• Automotive demand for chips likely to
increase threefold until 2030
• Continued uncertainty about the commitment
of public authorities and framework
conditions for investment is a concern
As a response to the global semiconductor
shortage, one year ago the European
Commission published a legislative proposal
for a Chips Act, with the aim of
boosting EU production of semiconductors
and addressing future supply chain
crises. Since it was published on 8 February
2022, the proposal has been moving
through the EU legislative process. On 24
January 2023, members of the European
Parliament (MEPs) adopted two draft
bills: one on the “Chips Act” that aims to
bolster technological capacity and innovation
in the EU Chips ecosystem and a
second one on the Chips Joint Undertaking
to increase investments for developing
this type of European ecosystem. This
means negotiations with EU governments
regarding how to finance the proposals
can begin.
“A late adoption of the Chips Act could
become a true bottleneck. Industry is investing
heavily in electrification and digitalisation
of vehicles. Without a framework
that provides certainty for investment
in the supply chain of semiconductors,
supply constraints will continue
slowing down the transformation”, says
CLEPA’s Secretary General Benjamin
Krieger.
“Continued uncertainty about the commitment
of public authorities and framework
conditions for investment is a significant
disadvantage for EU industry,”
CLEPA‘s statement said. “Despite significant
investment announcements over the
previous months, investment in the EU
semiconductor industry remains up to
four times lower than in the US for the
period until 2025 . Policymakers should
focus the inter-institutional negotiations
on improving the EU Chips Act proposal
in a way that secures private investment
and reflects the close interdependence of
the EU’s automotive and semiconductor
supply chains. A broad approach to innovation
requirements for public investment
and lesslegal uncertainty about potential
supply chain interventions will
make the EU Chips Act a tool to
strengthen the competitiveness of EU industry.”
clepa.eu
40 EPP Europe » 04 | 2023

IPC report: IC substrate manufacturing in U.S needs to be established
Success of U.S. Chips Act depends on pilot facility for IC substrates
The success of the CHIPS for America program
depends on establishing a U.S. pilot
facility for manufacturing integrated circuit
(IC) substrates; and getting it done
sooner, is better than doing it perfectly, according
to a new industry report.
The IPC Chief Technologist Council,
composed of nearly 20 technologists at
leading companies and organizations, says
the emerging CHIPS for America program
While IPC believes IC substrate projects
are eligible for CHIPS Act funding, they
are not being clearly prioritized
Source:Public Domain
must be leveraged to stimulate IC substrate
fabrication, assembly, and test capabilities.
Over the longer term the program
must help the U.S. “leapfrog into state-ofthe-art
capabilities,” the tech leaders say.
IC substrates
IC substrates are base layers used in the
packaging of integrated circuit chips,
called semiconductors. Substrate layers
connect chips with each other and with
other items on a printed circuit board, in
addition to protecting, reinforcing, and
supporting the IC chip. Semiconductors
cannot function without IC substrates and
PCBs, and more advanced chips require
more advanced substrates and PCBs.
However, according to a prior IPC study,
the United States has almost no capability
to produce the most advanced IC substrates,
called Flip Chip Ball Grid Array or
Flip Chip Chip Scale Package. The U.S. also
has very limited capability and capacity
to produce lower-end wire bonded substrates.
The U.S. Government has established
processes to determine how CHIPS
Act funding will be allocated, but the resulting
“feeding frenzy” is eating up
funding while failing to address related
needs, the technologists say. While IPC
believes IC substrate projects are eligible
for CHIPS Act funding, they are not being
clearly prioritized.
Thus, the group calls on industry and government
to collaborate on building an IC
Substrate Manufacturing Center of Excellence,
a fabrication pilot line, that could
be incrementally improved over time. The
facility should be located and designed to
address other weaknesses in the semiconductor
packaging ecosystem, including
education, training, R&D, and related
manufacturing centers such as outsourced
semiconductor assembly and test
facilities.
www.IPC.org
GaN power semiconductors increase energy efficiency
Fraunhofer IMWS research contributes to GaN device process optimisation
Fraunhofer Institute for Microstructure of Materials and Systems
(IMWS) says it has contributed to process and reliability optimisation
of gallium nitride (GaN) devices by discovering a new defect
signature in GaN components, as part of its work in the EUfunded
project known as Ultimate GaN. In the recently completed
research project, which ran for 3.5 years from 2019 to 2022, a
consortium of 26 European partners from science and industry,
under the leadership of Infineon Austria, set themselves the task
of harnessing the advantages of GaN technology along the entire
value chain to integrated
system solutions.
While GaN-based power semiconductors
offer higher performance
in a smaller space, and thus
save energy and resources, the
special chemical-physical material
properties and the structure
of high-electron mobility
transistors raises questions. With
high-resolution analysis procedures
and innovative fault diagnosis
methods the Fraunhofer In-
stitute for Microstructure of Materials and Systems IMWS contributed
to process optimisation and increasing the reliability of
the GaN devices. Leakage current paths, for example, were localised
after reliability testing and investigated microstructurally to
determine their cause. As such, a new defect signature was identified
that led to the premature electrical breakdown of special
semi-vertical GaN transistors. On the basis of these findings, the
manufacturing process could be systematically optimised.
/www.imws.fraunhofer.de/en
Fault analysis of a gate defect of a semi-vertical GaN transistor.
Left: TEM analysis of the defect with steps in the gate sidewall caused by
conventional processing. Right: TEM analysis of the transistor after
optimising the etching process to create the edge structures
Source: Fraunhofer IMWS
SEM image of the detected
crack initiation on test substrates
with passivation layers
Source: Fraunhofer IMWS
EPP Europe » 04 | 2023 41

» TEST & QUALITY ASSURANCE
Potential for the use of AI-based methods in the domain
of automatic inspection systems
Source: Goepel electronic
AI advisor
Source: Goepel electronic
The evolution of AI from
assistant to decision-maker
Artificial intelligence (AI) can increase production efficiency, save time and money,
elevate quality and improve the robustness of industrial processes. But how exactly
can AI be applied usefully in the area of automated inspection? Here, Goepel electronic
introduces us to its newly-developed AI software module which can not only advise
operators on defect classification but make decisions independently.
Dr. Jörg Schambach & Philipp Drechsler, Goepel electronic
With costs rising, the call for flexible and
autonomous automation solutions will only
get louder. This is especially true for inspection systems
that are standard in modern production lines.
AI is certainly an important element in this shift towards
automation. AI innovation in the area of inspection
systems is often focused on automating
manual processes such as the creation of inspection
programmes or the classification of defects at the
verification station. With this in mind, the software
used in Goepel electronic’s AOI systems was
expanded at an early stage to include an AI-based
expert system for automated test programme generation.
With the software module ‘MagicClick’, test
programmes can be created and optimised automatically.
Without any library entry, a production-ready
test programme, including component library, is
generated in just a few minutes. The parameters are
also automatically adjusted, taking into account real
process fluctuations. Having succeeded in creating
an AI solution in this area, Goepel electronic has now
developed an AI-based solution to the classification
of defects at the verification station.
From assistant to decision-maker
Automated optical inspection (AOI) or automated
X-ray inspection (AXI) are an essential part of standard
quality assurance processes in production lines
for both SMD (Surface Mounted Devices) and THT
(Through Hole Technology) assemblies. The systems
42 EPP Europe » 04 | 2023

AI advisor and the AI backend in the context
of Goepel software applications
Source: Goepel electronic
inspect PCBs for correct component placement and
soldering, and any defective assemblies are rejected.
When an assembly is rejected, the defects detected
by the inspection system are usually assessed and
classified by human operators at a verification
station. This visual evaluation is a monotonous task
and is subject to human error because, for instance,
the operator is tired. The risk of incorrect classification
is increased when complex defect patterns
need to be assessed with changing process
parameters. These wrong decisions can be fatal when
an AOI or AXI system has detected an actual defect,
but this defect is subsequently classified by a human
operator as a ‘pass’. In this case, we speak of a ‘falsepositive
classification’, which can, in turn, lead to an
escape. The defective PCB is processed further and, in
the worst case scenario (if the subsequent electrical
tests also do not detect a failure), ultimately
delivered to the customer.
This is where the AI advisor software module, newly
developed by Goepel electronic and integrated into
the PILOT Verify verification software, comes in. For
each error detected by the AOI or AXI, the AI-based
function forms its own opinion. In the first stage
(level 1), the software provides the user with this additional
information. This means that, analogous to
the four-eye principle, there are two independent
opinions for each error found: that of the operator
and that of the AI. If the AI comes to a different conclusion
than the operator, a message is displayed and
the user is asked to review their decision again.
Zusammenfassung
Der Einsatz KI-basierter Methoden in der Inspektion ermöglicht
die vollautomatische Erstellung und Optimierung
von Prüfprogrammen. Auch geht es darum, die permanent
gesammelten Daten der Inspektionssysteme mit Hilfe der
KI effektiv zu nutzen, um Prozesse zu bewerten und Prozessanomalien
frühzeitig zu erkennen.
Résumé
L’utilisation de méthodes basées sur l’IA dans l’inspection
permet la création et l’optimisation entièrement automatisées
de programmes de contrôle. Il s’agit également d’utiliser
efficacement les données collectées en permanence
par les systèmes d’inspection à l’aide de l’IA afin d’évaluer
les processus et de détecter suffisamment tôt les anomalies
de processus.
Резюме
Применение методов на основе искусственного
интеллекта в области инспектирования дает
возможность в полностью автоматическом режиме
создавать и оптимизировать программы проверки.
Речь также идет о том, чтобы эффективно
использовать постоянно собираемые данные систем
инспектирования при помощи искусственного
интеллекта для оценки процессов и своевременного
выявления технологических отклонений.
EPP Europe » 04 | 2023 43

» TEST & QUALITY ASSURANCE
Source: Goepel electronic
Integration of the AI advisor into a single production line
The AI advisor assistance function utilised in the
first stage (level 1) ultimately ensures that incorrect
decisions are prevented during defect verification and
that no detected defects are subsequently classified
as ‘pass’. By constantly adding further data during operation
and other training processes, the AI advisor
becomes better and better at making classification
decisions. At level 2, it has been trained to such an
extent that all possible defects are reliably recognised,
and verification can take place automatically.
Integration of the AI advisor into several production lines
Source: Goepel electronic
The AI advisor makes decisions and classifies defects
independently. Verification by the operator is then
only necessary in exceptional situations, namely
when the AI cannot make a safe classification decision.
By enabling automated classification of almost
all faults at level 2, the AI advisor significantly reduces
an operator’s workload at a verification station.
Good training as a basis
Deep Learning (DL) can also be applied in other
areas. In industrial applications of DL methods, it is
essential to create a balanced and valid training
database. This training database should also be constantly
expanding during the system’s life cycle with
new examples from ongoing production processes.
As such, the AI advisor concept is flexible. Users
can, on the one hand, start with a predefined database
after installation, which is retrained during
operation as it is supplemented with additional
image data from the subsequent user decisions. The
second option, however, is to develop a model without
the use of a predefined database, and using only
the classification decisions stored in the inspection
system’s database. In this instance too, after initial
training, image data attained from the relevant user
decisions made throughout productive operation, are
used to retrain the advisor.
During operation, the AI software receives data
from the inspection system, assigns it to the respective
AI models, performs the inference and transmits
its decisions to the verification software.
44 EPP Europe » 04 | 2023

Goepel’s AI software has been designed in such a
way that models are created using failure images in
a rule-based and thus completely autonomous
manner. To ensure that a valid training basis is
generated in this autonomous process and that it
remains valid throughout the life cycle, various
mechanisms have been integrated. These range from
the monitoring or exclusion of image data too
similar to that already present in the training set, to
additional expert interviews (active learning) to train
the system in individual new image data.
The AI software ecosystem also includes an AI
framework for the distributed training and delivery
of Deep Learning models and their instances. This
tool, which has a web-based, system-independent
interface and can be accessed via a web browser,
makes it possible to manage defect instances with
the error images (samples) and their assignment (labels)
or, if necessary, to delete samples from the
training set.
Integration into production
AI solutions that are to be integrated into industrial
production processes must fit seamlessly into
the corresponding IT infrastructure. In many cases,
production processes are completely sealed off from
the outside world for security reasons, as a loss of
sensitive data or manipulation of the production systems
could cause enormous damage. Cloud solutions
are often not possible and edge-based AI solutions
are the only option.
For this reason, the backend architecture of the AI
advisor software covers all possible use cases. For
electronics manufacturers who have only one production
line, all AI software modules can be installed
on the same PC as the verification station software.
If, meanwhile, production consists of several lines,
the AI can run on the company network on a
separate AI PC. For users who do not want to install
additional computing power, however, a cloud-based
solution can also be provided.
In the area of automated optical and X-ray inspection,
AI can enable inspection systems to make
better decisions or to simplify manual processes. It
can also optimise production processes based on the
data collected.
Goepel electronic’s newly-developed AI advisor
software module provides an AI-based assistance
function for its PILOT Verify verification software,
which ensures that incorrect decisions are prevented
during failure verification and that no detected defects
are subsequently classified as ‘pass’. Via the interaction
of humans with AI, the classification process
is optimised and the human workload lightened.
As the AI model further develops, it becomes the
decision maker, able to classify defects independently.
Verification by the operator is only necessary
in exceptional situations when the AI cannot provide
a clear result. This automatic classification of almost
all defects further reduces the operators’ workload.
www.goepel.com
Dr. Jörg Schambach
is Product Manager
Industrial Vision
Solutions at Goepel
electronic
Philipp Drechsler
is Senior Engineer
Inspection Systems
at Goepel electronic
EPP Europe » 04 | 2023 45

» TEST & QUALITY ASSURANCE
Managing electrostatic discharge (ESD)
Defending against the invisible
enemy in PCB reliability
One of the most common causes of PCB failure is electrostatic discharge (ESD).
This invisible threat can have catastrophic effects for manufacturers. In this
article, MicroCare’s Elizabeth Norwood explains how manufacturers can control
ESD to increase both production efficiency and product quality.
Source: MicroCare
As PCBs get more
sophisticated, their
sensitivity to ESD
spikes increases
ESD can damage electronic components and result
in significant losses for electronics manufacturing
companies in the form of warranty returns,
rework, scrapped boards, wasted time and missed
deadlines. This is not only costly, but may also
negatively affect the company’s reputation.
Experts estimate that up to one third of PCB failures
are from ESD. Today’s electronic assemblies are
smaller, more complex and incorporate increasingly
more expensive parts, so it makes sense to reduce
and control ESD and protect PCBs during assembly.
What is ESD?
Electrostatic discharge is caused by two surfaces or
objects at different levels of electrostatic charge
coming into close contact with each other. When one
is positively charged, and the other negatively charged,
the protons and electrons that carry these charges attempt
to balance each other out by rapidly exchanging
at the point of contact. The sudden release or discharge
of the built-up charge causes an ESD ‘spike’.
Although ESD is invisible, it is a severe threat in
many electronics manufacturing facilities. Static
charges of all proportions can cause irreversible damage
to delicate electronic components including
resistors, capacitors, inductors, diodes, integrated
circuits, MOSFETs, transformers, transistors, integrated
circuits, sensors, switches and relays.
There are two common types of ESD damage:
catastrophic and latent. Catastrophic failure causes
permanent damage so that the PCB will never function
again. Although easier to detect during the inspection,
catastrophic damage requires a complete
PCB replacement.
Latent ESD damage may not be immediately apparent.
The PCB can be partially degraded and continue
to function. However, the component may lose
overall function or have intermittent faults during its
lifetime, resulting in an unreliable electronic device.
Although latent damage accounts for the biggest
cause of ESD failure, it is also harder to detect. A PCB
with latent damage can still be undetected during
rigorous testing. This makes failure from latent damage
extremely costly to the manufacturer.
Where does ESD come from?
There are several ways in which ESD occurs, but
the most common is through human touch. During
everyday activities, the human body and some clothing
store anywhere from just a few volts of static
electricity to many thousands during a typical working
day. When hand contact is made with the PCB, it
often results in ESD.
An electronic manufacturing facility has many
other circumstances where ESD could damage PCB
assembly. For example, using ungrounded electrical
equipment such as an oscilloscope when troubleshooting
electronic circuitry is a major cause. However,
it’s not just electronic equipment that causes ESD.
Trolleys and conveyors can also build up friction or
machinery or materials rubbing against each other to
generate a charge. Even simple items like plastic cups
placed near electronic circuitry can generate a charge.
Creating a rapid movement of air near an electronic
assembly can be another source of ESD. For
46 EPP Europe » 04 | 2023

example, using compressed air to clean a PCB assembly,
or placing a fan nearby on a hot day can be
problematic.
Preventing ESD damage
In an ideal world, PCBs would be designed using
components that are not sensitive to ESD. However,
as electronic assemblies become smaller incorporating
delicate components on compact, densely-packed
boards, this is not an easy task. The more complex
and sensitive a PCB becomes, the more challenging it
is to prevent ESD.
Although it is impossible to prevent all ESD
charges completely, there are several ways ESD can
be reduced during SMT (surface mount technology)
production.
Eliminating ESD from work area
The area where the PCB is made can significantly
affect ESD. Some work spaces are more vulnerable to
electrostatic discharge than others. For example, receiving,
assembly, repair, cleaning, inspection and
packaging are the most susceptible production areas.
fortunately, practical procedures and measures can be
implemented to reduce ESD in the work environment.
• Wear anti-static wrist straps or heel straps. ESD
anti-static straps are a simple and effective way of
dissipating static from workers. Wrist straps can be
connected to a grounded line, keeping the person
continuously grounded while they work on sensitive
PCBs.
• Place conductive floor mats where technicians
stand to help discharge static build-up from
shoes.
• Establish protocols to ensure all workers wear
anti-static clothing and shoe coverings.
• Ensure all work tables, equipment racks, floor
mats and wrist straps are grounded.
• Prevent static build-up by maintaining the
temperature to 22–18 °C. Also, keep air humidity
between 40–70% in the production area. Humid
air helps to dissipate static charge.
• Remove any unnecessary items from the work
area. For example, plastic or polystyrene cups or
even notepads and pens that can create an ESD
charge.
• Ship all assembly parts and PCBs in staticcontrolled
containers and packing materials.
Wipe away static
Static can easily build up within electronic manufacturing
facilities. Work surfaces, where devices are
assembled, to the tools used to clean and test PCBs
can hold a static charge. Nearly everything in or
around the production line can
be affected, from wooden
workbenches and vinyl
chair cushions to computer
monitors and
plastic trays. Even electric
soldering irons and
reflow and wave soldering
ovens are conductive.
When manufacturing
PCBs, it is vital to remove
any built-up static by dissipating
the charge. This can be
done by regularly wiping all items,
including work surfaces and tools, with
pre-saturated, ESD-reducing cleaning wipes.
By using a high-quality ESD cleaning wipe, contamination
like fingerprints, grease and oil are cleaned
off without leaving behind lint, debris or static
charge. ESD cleaning wipes are excellent at removing
contamination, but look for one with a low level of
alcohol. Alcohol is an ideal non-conductive workplace
cleaner, although it tends to dry out mats,
cause fissures or leave surfaces brittle.
Source: MicroCare
Zusammenfassung
Eine häufige Ursache für das Versagen von Baugruppen
bzw. Elektronik ist die elektrostatische Entladung (ESD).
Im Artikel wird ein sachgemäßer ESD-Schutz diskutiert,
der die Beschädigung oder gar Zerstörung elektronischer
Bauteile und Geräte verhindert.
Résumé
Les décharges électrostatiques (ESD) sont une cause fréquente
de défaillance des modules ou de l’électronique.
L’article traite d’une protection ESD appropriée, laquelle
empêche la détérioration ou même la destruction des
composants et appareils électroniques.
Резюме
A static dissipating
tool prevents ESD
damage by reducing
static charges
Частой причиной отказа модулей и электроники
является электростатический разряд. В статье
рассматривается надлежащая защита от
электростатического разряда, позволяющая
избежать повреждения или даже разрушения
электронных компонентов и устройств.
EPP Europe » 04 | 2023 47

» TEST & QUALITY ASSURANCE
Source: MicroCare
An ESD-safe flux remover dispensing system improves cleaning results,
limits fluid waste and increases ESD safety
Static dissipating PCB cleaning
tools
Some flux removers and other cleaning fluids used
within PCB production can generate as much as
12,000 volts of ESD, which is more than enough to
damage or destroy electronic components. This
build-up of ESD comes from the friction of the static
molecules as they move down the plastic spray tube,
which is commonly used to dispense these cleaning
products. There are, however, alternative tools that
can be used with cleaning aerosols to dissipate any
static charge.
By removing the plastic straw and using a static
zapping dispensing tool that attaches to the top of
the aerosol can, ESD can be reduced. Made from durable
aluminium and stainless steel, this static dissipating
tool makes the user part of the grounding circuit
by maintaining contact with it. This reduces
static charges to just 50 volts to prevent ESD damage.
Compressed air may cause
damage
Cleaning and drying PCB assemblies with compressed
air may increase ESD. Fast moving air can
cause charge separation, resulting in a build-up of
static. To reduce the risk of ESD, use alternative
cleaning tools and fluids specifically developed to
dissipate the static and remove any contamination
quickly.
Static-safe flux remover dispenser
An ESD-safe controlled flux remover dispensing
system is another tool that helps to eliminate static
when cleaning PCBs. It not only improves the outcome
of benchtop cleaning but improves ESD safety.
The dispensing system usually includes brush and
syringe attachments. These help to clean under low
surface mounted components for thorough cleaning.
The scrubbing action of the brushes increases the effectiveness
of the fluid, which loosens and rinses away
contaminants with little effort and minimal cleaner.
Using a controlled dispensing system keeps the flux
remover clean for each use delivering the correct
amount of fluid to wet the PCB completely but without
overspray or waste. It reduces fluid use by up to
60% to help cut cleaning costs and ensure every drop
inside the aerosol can is used. This in turn makes it
easier to dispose of as non-hazardous waste.
Cleaning with this tool also helps to control ESD by
carrying down any charges to the ground, cutting
the static going to the PCB, its microchips and other
sensitive electronic components.
Removing ESD to enhance PCB
reliability
ESD has no place in modern electronics manufacturing
facilities. This invisible threat can have catastrophic
effects on PCBs. As PCB assemblies become
miniaturised and multi-functionalised, with highlysensitive
components, the capacity to withstand applicable
voltage is reduced, making them vulnerable
to in-the-field failure. It is, therefore, important to
ensure any ESD is removed.
By controlling ESD, production efficiency can be
improved, product quality and reliability can be increased
and costs reduced.
Implementing effective measures to prevent ESD
in the workplace is fundamental. With the correct
static-dissipating cleaning tools and fluids, electronic
assemblies can be protected.
www.microcare.com
About the author
Elizabeth Norwood is a Senior
Chemist at MicroCare, provider
of precision cleaning solutions.
She has been in the industry for
more than 25 years and has a
BS in Chemistry from the University
of St. Joseph, Connecticut.
Norwood researches, develops
and tests cleaning-related
products. She currently has one
patent issued and two pending
for her work.
48 EPP Europe » 04 | 2023

Product Updates « TEST & QUALITY ASSURANCE
In-circuit bed of nails and functional test solutions
Seica launches new leading-edge test solution
Seica has announced the premiere of the Compact LR, the latest
addition to its in-circuit bed of nails and functional line of test
solutions, the Compact Next line.
“The Compact LR provides additional legacy replacement capabilities
for customers looking to replace test systems which are
no longer supported by the original manufacturers,” the company
said. The configuration joins the existing legacy replacement
solutions for in-circuit testers such as Aeroflex/Marconi as
well as for functional testers including Computer Automation,
Schlumberger/Factron, GR179X, and GR275X series, and Teradyne’s
L2XX, and L3XX.
The new system addresses the challenge of allowing redeployment
of Teradyne Spectrum 8851 and 8852 fixtures onto a modern
platform which includes all of the technologically advanced
performances required by new applications, while at the same
time allowing developers to continue to use their traditional
standard fixture design.
All the systems in the series are compatible with the ACL synthesized
drive and sense instruments and the VIVA management
software; but if required the Compact Line systems may be controlled
also by alternative software packages such as LabviewTM,
LabWindowsTM/CVI and TestStandTM by National Instruments.
The manufacture‘s VIVA software platform also includes a fast,
“The Compact LR provides additional
legacy replacement capabilities for customers
looking to replace test systems which are no
longer supported by the original manufacturers,”
the company said
streamlined process to automatically generate and debug a
complete test program starting from the board CAD data, enabling
the immediate test of the prototype board to detect any
manufacturing errors. Functional tests can be created easily, on
the fly, with the powerful QuickTest software, with only the
knowledge of the circuit to be tested.
www.seica.com
Source: Seica
New AXI doubles cycle-time speed
Saki adds ultra high-speed 3D AXI solution in-line x-ray inspection range
Saki Corporation has added new 3D X-ray
Automated Inspection System (3D-AXI) to
its 3Xi-M110 range. The company says
the new system, known as the 3Xi-M110
V3, further improves cycle time and inspection
accuracy. “The newly-developed
3Xi-M110 V3 delivers an impressive 50%
cycle-time reduction and the highest accuracy
volumetric inspection results on
the market today.”
“At the core of the machine’s upgrades is
the exclusive Planar CT technology and a
The ultra-high-speed 3D-AXI
machine delivers industry‘s fastest
cycle-time speeds, highest inspection
accuracy and 40% less power
consumption per board
Source: Saki Corporation
suite of tools that are custom developed
in-house to optimize the inspection of
PCBs of every type. The [new] model delivers
cycle times of more than twice as
fast as previously possible and the accuracy
provided is unparalleled, ensuring
cleaner results untarnished by shadows or
noise.”
The company‘s Planar CT technology used
in the system detects solder joint defects
and microstructure abnormalities in highdensity
PCBs. The automated X-ray in-
spection system utilizes Real 3D volumetric
inspection to clearly identify voids in
multi-layer solder, THT assembly and BGA
head-in-pillow issues, and defective component
parts based on fillet position and
other factors.
The machine maintains the same light
weight and footprint as the original
3Xi-M110 while consuming 40% less
power per board which, the company
says, underlines its commitment to sustainable
manufacturing.
“The 3Xi-M110 V3 model has merged
hardware and software optimization to
achieve speeds that are twice as fast as
the previous model and to help improve
manufacturing quality thanks to Saki‘s
proprietary planar CT technology for
X-ray inspection,” Norihiro Koike, President
and CEO said.
www.sakicorp.com/en/
EPP Europe » 04 | 2023 49

TEST & QUALITY ASSURANCE » Product Updates
Inspection in confined environments
Release of compact X-Y stands for large area inspection
Inspectis AB has made available a range of compact X-Y stands
that provide large area inspection possibilities in confined environments.
The new, space-saving configuration has been
popular with mobile phone base station manufacturers who
need to inspect very large area boards, the company says.
“Inspectis new HD-370 and HD-380 compact X-Y stands provide
large area inspection capabilities in confined environments,”
said Alistair Gooch, Marketing Manager at the company. “Being
able to place a digital microscope camera with effective as a key
advantage, exemplified by the range of stand and mounting solutions
available. Our HD-170 and HD-180 X-Y stands have been
widely used by manufacturers to solve optical inspection needs
in often difficult locations such as over a production conveyor,
or after AOI inspection.
“The HD-370 and HD-380 design is a more compact X-Y stand
that has evolved recently, driven by customer demand for a
more compact solution for inspecting very large boards. Normally
the X-Y stands have a Y- boom. That requires a space behind
the setup as deep as the boom length when it is pushed right
back. In a tightly packed space, in a compact production line,
this might not be possible.”
Source: Inspectis
The new stands offer similar features as their conventional
HD-170 and HD-180 boom counterparts, but the camera is
mounted on a traveling beam instead of a travelling boom.
Therefore, all movement is contained within the space defined
by the X-Y dimensions. Stands may be configured for mounting
on a bench top or fitted into a rack. Either provides the same
stability and easy movement of the camera over the entire
working area. All Inspectis cameras feature crucial on-board
controls ideal for X-Y mounting so that single-handed operation
of positioning and zooming is possible. The company offers custom
designs based on the customer’s needs and can even discuss
motorized options.
www.inspect-is.com
The new large area X-Y
camera mounting stands
Reducing test development time using simulation tools
Pickering Interfaces launches hardware and software simulation tools
Source: Pickering Interfaces
Pickering Interfaces has announced the release
of new hardware and software simulation
tools which simulate its PXI and LXI
switching products and most of its PXI
simulation products, allowing for fast code
development independent of application
hardware. The company says the tools enable
test engineers to begin writing and
verifying test program code without being
hindered by supply chain constraints. This
strategy is part of the 3-pronged approach
to obsolescence. With these tools,
The PXI Simulation
Software is now part of
the company‘s standard
PXI driver installation,
while the LXI Simulation
Software is a standalone
windows application that
can emulate its switching
and simulation products
in virtual environment
test engineers can:
• Mitigate supply chain risks: Applications
can be designed and developed
without the presence of physical hardware,
allowing engineers to begin
working on a test system immediately
– while waiting for hardware to ship.
• Accelerate development time: Engineers
can speed up the waterfall development
process and complete multiple
development steps at once.
• Debug code without physical hardware:
Engineers can pre-qualify equipment
and test software code early in
the development process – switch
routes that could once only be verified
and later debugged when hardware
was available can now be verified before
the hardware has arrived. By
simulating switching and simulation
modules before using physical components,
engineers also minimize the risk
of damaging costly test system hardware
during verification.
The LXI Simulation tool (model 60–901) is
a plug-and-play device, and engineers
typically have it up and running within
minutes. By simply connecting power and
ethernet cords, downloading and installing
free Pickering drivers and selecting
the appropriate Pickering modules to test,
engineers can run a simulation, and then
easily re-program the tool to simulate
different modules. These capabilities
allow engineers to access thousands of
modules within just a few clicks.
www.pickeringtest.com/products/software/pxilxi-simulation-tools
50 EPP Europe » 04 | 2023

ADVERTISERS «
ams Osram 39
ASMPT GmbH & Co. KG 1, 6, 17, 22
CLEPA 40
cts 17
ERSA GmbH 3
Fraunhofer Institute for Microstructure of Materials and Systems 41
FUJI EUROPE CORPORATION GmbH 13
GaN Systems 16
Göpel electronic 42
IBL-Löttechnik GmbH 39
Infineon Technologies 16
Inspectis AB 50
IPC 16, 18
Koh Young Europe GmbH 7, 19
Mechnano 31
Microcare 46
Pac Tech – Packaging Packaging Technologies GmbH 11
Panasonic Connect 36
Pickering Interfaces 50
PIEK International Education Centre (I.E.C.) GmbH 17
Protavic 6, 10
RAFI 15
Rehm Thermal Systems GmbH 9
Saki Corporation 49
Seica 49
SEMI 14
SMT Maschinen- und Vertriebs GmbH & Co. KG 45
Ventec International Group 28
VISCOM AG 15
Vitronics Soltec 31
Wolfspeed Inc 40
Yamaha Motor Europe N.V. Niederlassung Deutschland 35
Yamaha Motor Europe 38
ZVEI 14
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EPP Europe 11/2023 will be published 30. October 2023
EPP Europe » 04 | 2023 51

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high customer satisfaction through a flexible smt rework
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52 EPP Europe » 04 | 2023