GDSI An Akoustis Company
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"Consider us an<br />
extension of your<br />
fab or lab"<br />
WWW.DIEPREPSERVICES.COM
<strong>GDSI</strong> is the premier back-end<br />
supplier, offering advanced<br />
wafer processing techniques to<br />
commercial enterprise and the<br />
defense industrial base<br />
WWW.DIEPREPSERVICES.COM
CORE<br />
CAPABILITIES<br />
Ultra Thin Wafer Grinding<br />
Wafer Polishing<br />
Stealth Laser Dicing Process<br />
Mechanical Saw<br />
Wafer Coring<br />
Scribe & Break<br />
Pick & Place<br />
MIL STD Inspection + AOI<br />
Same Day Turns
WHY CHOOSE A<br />
STEALTH DICING<br />
PROCESS?<br />
Up to 300 mm capability<br />
Completely DRY process<br />
Frontside or backside<br />
processing is possible<br />
Can process wafer thicknesses<br />
from 75 um to 800 um<br />
Material types: Si<br />
Bumped wafers<br />
Stealth Dicing before Grinding<br />
process<br />
Geared for MEMS, Silicon<br />
Photonics, Photonic integrated<br />
circuits, Si Bio-MEMS, Fragile<br />
membrane devices, and water<br />
sensitive cantilevers<br />
Multiproject wafers with no<br />
remounting and sub-dicing<br />
required. Similar to Disco’s<br />
“Hasen cut” technique.<br />
Creation of non-traditional<br />
shapes is possible<br />
Fully automated equipment<br />
Dry, Clean, High Yielding!
INDUSTRIES<br />
SERVED<br />
Defense & Aerospace<br />
Academia<br />
Semiconductor<br />
MEMS<br />
Communications<br />
Automotive<br />
Life Sciences<br />
Industrial<br />
Medical<br />
Consumer Electronics
CONTACT US<br />
For sales consultation,<br />
please contact:<br />
Jeremy Favia<br />
jfavia@dieprepservices.com<br />
925 Berryessa Road<br />
San Jose, California 95133<br />
Customer Service:<br />
408.451.2000<br />
WWW.DIEPREPSERVICES.COM
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