EPP Europe P2.2025

Issue 11 | 2025

www.epp-europe.eu

Electronics

Production &

Test

productronica 2025

Shaping the future - Innovations

on show in Munich

» Page 18

PCB & Assembly

Rethinking process verification

» Page 24

Special Packaging

Next Gen X-Ray Inspection for

Advanced Packaging

» Page 38

Test & Quality

Assurance

Redefining the sensing ecosystem

» Page 46

COVER STORY

Optical inspection

of 20 µm placement

gaps in SiP

packaging

» Page 14

SMT at its best

Act now to avoid disruptions,

learn more at MicroCare.com

REPLACE YOUR

3M NOVEC FLUIDS

with

CLEANING POWER and CONFIDENCE

GET A CLEAN START *

Up to 20% of Your First

Fluid Fill is on Us!

YOU CAN RELY

on MICROCARE

• Designed for superior cleaning

performance, compliance and safety

• Expertise to help you quickly switch

from outdated cleaning fluids to

modern solutions

• Product availability reduces costly

production downtime

Contact Us Today, We Have

Replacements for 3M Novec

71DA · 71DE · 71IPA · 7200

72DA · 72DE · 72FL · 73DE

Also Replacements for:

Methylene Chloride,

TCE and PERC.

MicroCare U.K. Ltd

Leeds, United Kingdom

Tel: +44 (0) 113 3609019

MicroCare, LLC

New Britain, CT, USA

Toll Free: 1-800-638-0125

MicroCare Asia Pte Ltd

Singapore

Tel: +65 6271 0182

Schedule your FREE consultation:

Visit: MicroCare.com/CleanStart

ISO 9001:2015 Registered

© 2025 MicroCare. All Rights Reserved.

“MicroCare”, "Tergo" and the MicroCare logo are trademarks or registered trademarks of MicroCare, LLC.

* New clients converting to MicroCare Engineered Fluids or Tergo Performance

Fluids receive up to 20% in free product when committing to their first fill.

Order must ship by Dec. 31, 2025. Does not apply to previous purchases.

» EDITORIAL

A showcase of

progress

Event highlight:

productronica 2025

This November, the international electronics

manufacturing community will

gather in Munich for productronica

2025, the world’s leading trade fair for

electronics development and production.

Held every two years, the event serves as a

milestone in the industry’s continuous cycle of

innovation, presenting the very latest developments

in automation, inspection, sustainable production, and next-generation assembly

technologies. In our detailed coverage, we examine the key industry

trends driving the exhibition (from page 10) and present exhibitor highlights

(from page 18).

Beyond the show floor, broader forces are shaping the industry’s direction.

Shifts in global politics are increasingly influencing the flow of semiconductor

investment and reshaping supply chains worldwide. Our feature on

page 40 explores how companies are adapting strategies to remain resilient

in this new landscape.

Measuring the Gap: SiP Inspection Reimagined

As smartphones grow more powerful, their internal components move closer

together — sometimes just 20 µm apart. This poses a major challenge for optical

inspection. In this issue, Koh Young shows how its Meister D+ system

uses coaxial lighting and high-resolution optics to measure these ultranarrow

gaps reliably, even in reflective, high-density SiP assemblies (from

page 14).

Automatic,

economical &

sustainable.

Assembly repair with the new Ersa

HR 600 P is doubly worthwhile:

Economically, because you maintain

added value and do not have to dispose

of incorrectly assembled boards, and

because you save resources and produce

sustainably. With the highest degree of

automation. Safe. Reproducible.

With these perspectives, the issue provides an in-depth look at the forces

driving change across the electronics manufacturing industry.

Stay informed:

https://epp-europe-news.com

Frederick Rindle

Editor-in-chief EPP and EPP Europe

frederick.rindle@konradin.de

The HR 600 P is the first automatic

Ersa bench-top rework system with

contactless residual solder removal.

Meet us at

Further

Information:

Hall A4 Booth 171

GLOBAL. AHEAD.

EPP Europe

SUSTAINABLE.

» 11 | 2025 3

» CONTENTS 11 | 2025 30. YEAR OF PUBLICATION

COVER STORY

Koh Young relies on

a combination of Optical inspection

several projectors, of 20 µm placement

gaps in

which are arranged

in terms of angle, SiP packaging

position and number » Page 14

in such a way that even

the smallest gaps are reliably

illuminated.

Source: Koh Young

NEWS & HIGHLIGHTS

Global electronics association rebrands

Elevating 70-year legacy as voice of global industry 6

Industry news and highlights 7

TRADE SHOWS & EVENTS

50 years of productronica

Leading trade fair spotlights key topics 10

Tech Days event engages with live demos

Exploring the latest in electronics manufacturing 13

COVER STORY

Exploring the Gorge

Optical inspection of 20 µm placement gaps

in SiP packaging 14

PRODUCTRONICA 2025

Shaping the future

Leading innovations on show in Munich 18

Zero Defects, zero Operators, zero Downtime

Intelligent and efficient SMT production 19

AXI, AOI and In-System Programming

New Impulses for Quality Assurance 20

Boost flexibility, speed, and efficiency

New ways to improve surface-mount performance 21

The next generation of selective and wave soldering

Upgrades across the entire soldering portfolio 22

Product launch in Munich

New Smart Reel Tower extends component management 23

PCB & ASSEMBLY


Reliable visibility into process performance 24

Cradle-to-cradle concept gains pace

A new industrial mindset 26

Expanded presence for SMT specialist

New, larger demonstration laboratory in Burlington 28

Product updates PCB & assembly 30

Sustainable stencil underside cleaning

Shaping the future of stencil printing technology 32

AI manufacturing trends in 2025

Practical implementation and sustainable solutions 34

SPECIAL PACKAGING

Next Gen X-Ray Inspection for Advanced Packaging

Next generation strategies

for semiconductor manufacturing 38

How geopolitics is redirecting chip investment

The de-globalization of semiconductor production 40

GENESIS project to advance chip sustainability

European semiconductor manufacturing 42

Compact packaging system integrates quality control

Closing semiconductor automation gaps 44

TEST & QUALITY ASSURANCE

Partnership to accelerate metasurface optics

Redefining the sensing ecosystem 46

Empowering test engineers in development lifecycle

Unified, scalable approach to debugging 49

COLUMNS

Editorial 3

Imprint 50

4 EPP Europe » 11 | 2025

A closer look at the innovations on show in Munich.

» Page 18

Source: Messe München

ELECTR FYING

T

H

E

productronica 2025

At the world‘s largest trade fair for electronics

manufacturing, taking place from

18 to 21 November 2025, innovations from

across the industry‘s value chain will be

presented and current topics discussed.

Topics of high relevance to electronics

manufacturing are becoming key themes for

the industry – and thus focal points for productronica.

In collaboration with the VDMA and the productronica

advisory board, the productronica

team has identified these key topics that

are currently occupying the industry:

power electronics, advanced packaging and

trustworthy microelectronics.

www.productronica. com

DBC-Attach

Top-Side Die

Interconnect

Die-Attach

Package-Attach

FOLLOW US:

LinkedIn:

bit.ly/36aMJh1

Visit us at Productronica, A4. 309

indium.com

©2025 Indium Corporation

EPP Europe » 11 | 2025 5

» NEWS & HIGHLIGHTS

Elevating 70-year legacy as voice of $6 trillion industry

Global electronics association

rebrands

IPC has officially become the Global Electronics Association, reflecting its changing role as

the voice of the electronics industry. Guided by the vision of “Better electronics for a better

world,” the association is dedicated to enhancing supply chain resilience and promoting accelerated

growth through engagement with more than 3,000 member companies, thousands of

partners, and dozens of governments across the globe.

Source: Global Electronics Association

“Better electronics for a better world.”

The transformation and rebranding

shows a collective recognition that the

electronics industry has fundamentally

changed, and that the association has expanded

beyond its beginnings in PCBs. Tom

Edman, Board Chair of the association and

President and CEO of TTM Technologies,

commented: “As we chart our path forward

with our new name, we will continue and

elevate our efforts to build partnerships between

governments and industries, foster

new investment, drive innovation across the

industry, and minimize disruptions in the

electronics supply chain.”

As part of its new mission, the association

is increasing resources to strengthen

advocacy, deepen industry insights, and enhance

stakeholder communications—all

aimed at advancing and elevating the electronics

industry. To champion a resilient

and growing supply chain, the association

represents the entire ecosystem of diverse

subsectors that contribute to this complex

industry.

“Electronics today are the backbone of

all industries, which makes its supply chain

crucial to economies, governments, and

everyday life,” said Dr John W. Mitchell, the

association’s President and CEO. “Our new

mission and vision position us to work

more deeply with industry and our

members globally to advocate for the importance

of electronics in our continuously

changing world.”

The association will retain the IPC brand

for the industry’s standards and certification

programs, which are vital to ensure

product reliability and consistency. The IPC

Education Foundation is now known as the

Electronics Foundation, continuing to focus

on solving the talent challenges facing the

electronics industry.

The Global Electronics Association also

released an in-depth trade flows study of

the global electronics industry, which currently

represents more than $1 in every $5

of global merchandise trade. The main

findings of the trade flows study include:

• Electronics supply chains are more globally

integrated than any other industry,

surpassing even the automotive sector

in cross-border complexity.

• Trade inputs like semiconductors and

connectors now exceed trade in finished

products such as smartphones and laptops,

with global electronics trade totaling

$4.5 trillion in 2023, including $2.5

trillion in components alone.

• Top exporters such as China, Vietnam,

and India are among the fastest-growing

importers of electronic inputs,

underscoring the deep interdependence

embedded in global electronics production.

• This mutual reliance challenges the viability

of reshoring and decoupling

strategies, as rising export powers depend

on components from across the

world.

Mitchell commented: “Our trade flows

analysis reinforces that resilience, not selfsufficiency,

is the foundation of competitiveness

in the electronics age. No single

company or country can stand alone. The

complexities of the electronics ecosystem

require collaboration and partnership with

others. The Global Electronics Association is

here to help create a vital and thriving global

electronics supply chain through industry,

government, and stakeholder collaboration.”

The association has operations in Belgium,

China, Germany, India, Japan, Korea,

Malaysia, Mexico, Taiwan, and the US, and

maintains a presence in dozens more countries

to support its members.

www.electronics.org

6 EPP Europe » 11 | 2025

NEWS & HIGHLIGHTS «

Electronics industry acquisitions

Configurable manufacturing specialist acquires expert in AI image processing

Critical Manufacturing has announced its

acquisition of Convanit, the developer

and supplier of the innovative c-Alice.

This image-based processing technology

for high-tech manufacturing improves

quality, traceability and operational performance.

The company’s customers will be able to

use its manufacturing data platform to

incorporate visual AI into their workflows

and combine it with real-time process

data, deepening the integration of MES

and advanced analytics.

“By integrating Convanit‘s advanced AIpowered

image analytics into our platform,

we are transforming how customers

convert unstructured image data into actionable,

contextualized intelligence. This

acquisition is a key milestone in our vision

for truly data driven, Industry 4.0

manufacturing,” the company commented.

Through the integration of c-Alice, manufacturers

using the Critical Manufacturing

Data Platform will be able to:

• Seamlessly ingest, classify and analyze

image data in conjunction with realtime

process data;

• automate defect detection and trigger

real-time anomaly alerts across production

stages;

• connect image insights directly to MES

workflows, traceability records, and

quality reporting; and

• deploy scalable AI models with low

latency for continuous in-line operations.

An intuitive interface supports a wide

range of users including quality engineers

and process specialists with no need for

advanced coding skills. This accessibility

helps scale AI adoption across production

teams, enabling “citizen data scientists”

to take ownership of model development

and refinement.

“We created c-Alice to make visual AI

simple, flexible, and effective for manufacturers,”

said Michael Meinel, cofounder

of Convanit. He commented that

the acquisition “brings our vision to a

Francisco Almada Lobo,

CEO of Critical Manufacturing.

global stage, embedding it into one of the

most powerful MES ecosystems on the

market.” The acquisition reinforces Critical

Manufacturing’s commitment to innovation

in high-precision sectors including

semiconductors, electronics, medical

devices, and industrial equipment industries

where traceability, quality, and responsiveness

are business critical.

www.criticalmanufacturing.com

Source: Critical Manufacturing

3D measurement-based inspection solutions

Inspection leader appoints new president for Japan

True 3D measurement-based inspection

solutions specialist Koh Young Technology

has named Tom Hattori as President

of its Japanese business. Hattori brings to

the position more than 20 years of

leadership experience within the electronics

manufacturing sector, having held

key roles in strategic planning, market

development, and operations for prominent

global technology firms in Japan and

the Asia-Pacific region.

Commenting on his appointment, Hattori

stated that the company’s commitment

to innovation and customer-focused solutions

aligns with his own professional

values. “The company’s pioneering role in

3D inspection technologies, combined

with its vision to shape industry standards,

presents an exceptional opportun-

ity. I look forward to working closely with

the global Koh Young team to drive

meaningful growth in Japan,” he said.

Analyzing the Japanese market, Hattori

added, “Our industry here is undergoing

Tom Hattori will lead operations in Japan.

Source: Koh Young Technology

rapid transformation, marked by increasing

demands for greater precision, productivity,

and digitization. These trends

highlight significant opportunities for advanced

metrology solutions. My goal is to

align our local strategies closely with

these evolving customer needs to support

their journey toward smarter manufacturing.”

Hattori outlined clear strategic priorities:

enhancing customer engagement, customizing

solutions to fit Japan’s unique

market conditions, and ensuring operational

excellence. He emphasized: “To

lead in the Japanese market, our approach

must be proactive and responsive,

leveraging our global strengths while

adapting to local requirements.”

www.kohyoung.com

EPP Europe » 11 | 2025 7

» NEWS & HIGHLIGHTS

Production control, predictive maintenance and safety

Thermal imaging specialist expands into global instrumentation market

HIKMICRO has entered the global instrumentation

market with the introduction of

high-precision Coriolis and Ultrasonic flow

meters. This strategic expansion marks a

significant step towards the company’s

ambition to deliver a comprehensive industrial

platform that unites production

control, predictive maintenance and safety

within a single, affordable solution.

As one of the few manufacturers that integrates

chip design and manufacturing,

core algorithm development and complete

testing and production, the company has

earned a reputation for making advanced

thermal imaging technology accessible

across industries. Stefan Li, Overseas Market

Director, commented: “Factories increasingly

need affordable solutions for

production control and digital transformation.

Our expansion into instrumentation

naturally extends from our thermal

imaging expertise.”

The solutions build on the company’s core

competencies in sensor development, sig-

Bringing reliable, high-accuracy technology to a wider market.

nal processing, and calibration. The FC00

Coriolis Mass Flow Meter delivers ±0.1%

liquid and ±0.5% gas measurement accuracy,

making it ideal for food and beverage

industries where precision is critical. Its AIenhanced

temperature compensation ensures

≤±0.001 g/cm³ density accuracy

while built-in diagnostics monitor system

integrity. The product features ultra-fast

8000 samples/sec digital processing that

significantly enhances measurement reliability

and response times for demanding

environments. The FU00 Ultrasonic Flow

Meter achieves ±0.5% accuracy in water

applications with its non-invasive design

that eliminates pressure loss and downtime.

Its smart AI diagnostics continuously

evaluate signal quality and probe performance

to maintain optimal operation.

www.hikmicrotech.com

Source: HIKMICRO

Enhancing Europe’s resilience

AI-driven robotics in the supply of critical raw materials

A new project is harnessing AI-powered,

self-learning robots for urban mining, aiming

to complement primary sources of

critical raw materials and strengthen their

supply resilience and competitiveness in

Europe. IBot4CRMs has shared that it is

developing integrated AI-powered robotic

systems designed to maximize the recovery

and recycling of critical raw materials

like neodymium magnets, copper, gold,

and silver from urban waste. The project

will demonstrate how integrating AI, data

The project brings together 18 partner organizations, and the multidisciplinary nature of the consortium

is one of its strengths.

Source: Reinhard Jahn/CC BY-SA 2.0

analytics, and robotics can enhance recycling

processes for urban waste, incineration

slag, metal scraps, waste electrical

and electronic equipment, and electric vehicles.

It will do so through seven validation

scenarios carried out at four largescale

pilot sites in Turkey, Greece, Spain,

and Portugal. This approach not only enables

real-world validation but also paves

the way for a cost-effective business strategy

for large-scale deployment.

Critical raw materials are especially important

as they enable many modern and

future sustainable technologies that drive

the decarbonization of value chains. By

strengthening Europe‘s resilience and

competitiveness in the supply of CRMs, the

project aims to address the challenges

outlined in the Critical Raw Materials Act

and the European Green Deal. It is set to

run for a period of four years.

https://ibot4crms.com

8 EPP Europe » 11 | 2025

We are your specialist for:

Technical expertise and operational leadership

New appointment in South American protective solutions

Rafael Penteado has joined the sales team at Kurtz Ersa, working

in the area of protective solutions for the South American market.

Based in Brazil, Penteado is covering the region, from Colombia

to Chile, and reporting directly to the company‘s regional

Vice President Marcelino Espelosin.

With a background that blends technical expertise and operational

leadership with customer-centric sales, Penteado brings

more than 15 years of experience in the EPS (expanded polystyrene)

industry. His career began in 2009 as an engineering intern

at BASF in Guaratinguetá, São Paulo, where he quickly rose

through the ranks to become a process engineer and later took Rafael Penteado will be responsible

for sales across South America.

over responsibilities in quality management and plant leadership

following the site’s acquisition by Styropek, part of the Alpek group.

In 2020, Penteado made a pivotal move into sales, where his knowledge of EPS production and

client needs positioned him as a trusted partner throughout Brazil and across South America.

“Joining Kurtz Ersa is both a professional milestone and a personal source of pride,” Penteado

commented. “I’m excited to bring my experience to the Protective Solutions team and contribute

to a company that blends tradition, innovation, and a deep commitment to sustainability.”

www.kurtzersa.com

Source: Kurtz Ersa

• Soldering Irons and Solder Bits

• Solder Pots and Solder Baths

• Rotating Baths LBX + Vortex

• Repair stations

• Table Soldering Machines HTT

• Soldering Rotary Table LRTT

• Roboter and Handlingsystems

• Solder Flux

• Systems for re-tinning of

electronical components

www.zevatron.de

Rotating Bath VORTEX 800

with self-cleaning solder surface

Mini Rotating Bath Vortex 50

for stranded and enamelled wires

Key industry appointments

Cleaning chemistries expert names new CFO, VP

Source: KYZEN

In his new role,

Rhett Emerson will work to enhance systems,

structure, and strategy.

KYZEN, a leader in environmentally responsible

cleaning chemistries, has announced the promotion

of Rhett Emerson to Chief Financial Officer

and Vice President. This leadership appointment

reflects Emerson’s significant contributions

to the company’s financial strategy, global

operations, and people-centered culture since

2012.

Emerson’s first role at the company was European

Operations Assistant Controller, in which

he quickly became instrumental in developing

the financial and information systems that

power the company’s international business.

Over the years, he helped to streamline operations,

enable global growth, and build frameworks

that simplify complexity, all while staying

grounded in the company’s values and collaborative

culture.

Kyle Doyel, the company’s CEO and co-founder,

said: “Rhett has a rare combination of financial

acumen and heart. His ability to lead with both

precision and humility makes him the kind of

leader people trust and want to follow. We are

excited for what this next chapter holds.”

Emerson holds a Bachelor of Science in Information

Systems Management from Lipscomb

University and passed the CPA exam shortly

after graduation. Prior to his finance career, he

spent a decade in church ministry, an experience

that shaped his belief in service and the power

of authentic relationships.

In his new role, Emerson will lead KYZEN’s global

financial operations and continue to enhance

the systems, structure, and strategy that support

the company’s mission and long-term vision.

www.kyzen.com

Soldering Rotary Table with

5 stations and automatic assembly

Customized Tinning Station

for BGAs and QFPs

Automatic Tinning System

for cables and coils

Ihr Partner für professionelle Löttechnik seit 1991

EPP Europe » 11 | 2025 9


Productronica 2025 is taking place from November 18 to 21 in Munich, Germany.

Leading trade fair spotlights key topics

50 years of productronica

Productronica 2025 marks the significant milestone of half a century of engagement and

support for the international electronics manufacturing industry. Under the motto “the pulse

of innovation,” the 50th anniversary edition of the biennial trade show will take place from

November 18 to 21 in Munich, Germany, with a focus on three key themes: advanced packaging,

power electronics, and securing the value chain through reliable microelectronics.

Productronica 2023

hosted 1,400 exhibitors

from 45 countries.

Originally launched as part of the electronica

trade show, productronica has since evolved

into a leading international platform for electronics

development and production. Over the decades, it

has grown into a central meeting point for the European

electronics manufacturing community. Dr. Reinhard

Pfeiffer, CEO of Messe München, emphasized


its importance, stating: “Productronica plays an indispensable

role by setting the pace for the entire industry.”

At the last edition in 2023, productronica hosted

1,400 exhibitors from 45 countries and welcomed

42,000 industry professionals. Germany, the United

States, and China were the top three exhibiting

countries, with China accounting for 80 exhibitors.

For 2025, organizers expect a similar or even larger

turnout, with around 1,400 companies presenting

solutions across the fields of PCB and EMS; SMT;

semiconductors; inspection and quality; future production

and smart factory; as well as cables, coils,

and hybrids.

Running alongside productronica, SEMICON Europa

will once again occupy Halls B1, C1, and C2 of the

Munich trade fair grounds, creating one of the largest

combined platforms for electronics manufacturing

and semiconductor innovation in Europe.

10 EPP Europe » 11 | 2025

TRADE SHOWS & EVENTS «

Advanced packaging

The event will delve deeply into advanced packaging,

a cornerstone for next-generation electronics. Unlike

traditional chip encapsulation, advanced packaging

leverages methods such as 2.5D and 3D integration,

chiplet technologies, and wafer-level packaging to

maximize performance and efficiency. These approaches

are key enablers for high-performance

computing, AI accelerators, 5G and IoT devices, automotive

systems, and medical technologies.

As semiconductor scaling approaches physical limits,

advanced packaging has emerged as the critical

pathway for higher performance. Technologies such

as heterogeneous integration, system-in-package

designs, and multi-chip modules allow multiple processing

units to be integrated on a single substrate,

significantly improving power density and bandwidth.

However, these innovations come with new challenges:

• Increasingly complex supply chains require tight

coordination and digitalization.

• Testing and inspection processes must adapt to

ultra-fine structures, raising costs and risks.


• Process capabilities and cost efficiency are essential

to scaling production effectively.

At productronica, the VDMA Special Exhibit (Hall B2,

Stand 461) will highlight collaborative research efforts

in this area. Visitors will encounter contributions

from Silicon Austria Labs, PhoenixD, and

Schweizer Electronic, showcasing applications such

as micro-optical systems for tap-proof telecommunications

and embedding technology for power electronics.

Over four days,

Munich will be the

place to discover

breakthrough

technologies.

Visit us in Munich!

SEMICON: B1.213

productronica: A2.377

EPP Europe » 11 | 2025 11

» TRADE SHOWS & EVENTS

Source: Messe München GmbH

Productronica consistently

focuses on the

most important topics

in electronics manufacturing.

Market analysts from Yole predict the advanced

packaging market will grow to $69.5 billion by 2029,

underscoring its strategic importance.

Focus on power electronics

Power electronics underpin critical applications in

e-mobility, renewable energy, industrial automation,

and high-frequency/high-voltage systems. By utilizing

wide-bandgap materials such as gallium nitride

(GaN) and silicon carbide (SiC), manufacturers are

able to reduce power losses, shrink component sizes,

and improve thermal management—all while ensuring

high reliability.

Although GaN and SiC devices remain more costly

than conventional silicon-based IGBTs or MOSFETs,

their superior switching performance and efficiency

advantages are driving rapid adoption. Their wider

bandgaps (3.4 eV for GaN and 3.2 eV for SiC, compared

to 1.1 eV for silicon) provide: Higher switching

frequencies; better heat dissipation; stronger breakdown

resistance; and lower power consumption. At

the VDMA Special Exhibit, visitors will see real-world

applications of these technologies:

• Schweizer Elektronik will demonstrate how

Si-MOSFETs can optimize inverters for starter

generators.

• Silicon Austria Labs will showcase energy converter

control panels for wind turbines, made

more efficient through modern power components.

• Elektra Solar will present an electrically powered

aircraft, illustrating the potential of power electronics

in aviation.

conductor technologies that are safe, dependable,

and tamper-proof, ensuring integrity and trust

across the value chain.

Secure microelectronics are especially vital in

safety-critical industries such as automotive, medical

technology, industrial automation, and defense,

where data authenticity, cybersecurity, and resilience

against attacks are non-negotiable.

Current trends shaping secure microelectronics include:

• Hardware-based security: Growing use of secure

enclaves, physically unclonable functions (PUFs),

and trusted platform modules (TPMs) to provide

root-of-trust protection at the chip level.

• Supply chain integrity: Efforts to trace component

origins through digital twins, blockchain, and serialization,

ensuring that counterfeit or tampered

parts are identified and excluded.

• Post-quantum security: Research into encryption

methods resilient to quantum computing, which

threatens to undermine today’s cryptographic

standards.

• AI-driven threat detection: Integration of machine

learning into microelectronics to enable real-time

monitoring and anomaly detection at the hardware

level.

• Sustainability and regulation: EU initiatives such

as the European Chips Act emphasize both local

semiconductor production and security-by-design

principles to safeguard critical infrastructures.

At productronica 2025, exhibitors will present solutions

that address these challenges, from chip-level

hardware root of trust to secure manufacturing processes

and tamper-resistant packaging techniques.

This area of the show will highlight not only the

technological advances but also the cross-industry

collaborations necessary to strengthen resilience in

the electronics ecosystem.

productronica.com/en/

Secure microelectronics

The third focal point of the trade fair is secure microelectronics—a

theme that has gained urgency as

supply chains globalize and connected devices proliferate.

The objective is to develop and produce semi-


12 EPP Europe » 11 | 2025

noffz.com

Tech Days 2025 was held in Brighton, Michigan.

Source: Horizon Sales

YOUR TEST &

AUTOMATION

EXPERT

TEST SOLUTIONS

FROM BLT TO EOL

Exploring the latest in electronics manufacturing

Tech Days event engages

with live demos

Horizon Sales, a manufacturers’ representative

and distributor for the electronics assembly

industry, successfully concluded its

2025 Tech Days event, having welcomed over

60 customers and 21 supplier partners over

two days. The annual event was held at the

company’s Brighton, Michigan facility and

provided attendees with hands-on demonstrations,

expert insights, and an invaluable

opportunity to explore the latest in electronics

manufacturing technology.

This year’s event featured live equipment

demonstrations from industry-leading manufacturers,

and participating suppliers brought

samples and products for hands-on presentations,

sparking conversations and solution-focused

engagement with attendees.

“We love being able to give our customers a

chance to explore real equipment up close,

talk to factory experts, and ask questions in a

more relaxed, personalized environment,”

commented Dave Trail, President of the company,

adding that the event “continues to be a

highlight of our year, bringing the best of the

industry to our doorstep.”

Attendees enjoyed lunch and refreshments

throughout the event, as well as raffle prizes

and Horizon’s trademark hospitality.

It began with the Supplier Appreciation Golf

Outing, which was won by the foursome: Andrew

Coleman (of AIM Solder), John Martinez

(of RFID), Ken DeVries (of Horizon), and Ben

Smith (of StaticStop).

Trail expressed the representative and distributor’s

gratitude to its supplier partners

and customers, commenting: “The energy, engagement,

and enthusiasm at Tech Days 2025

proved again why we are proud to represent

the best in the business.”

www.horizonsales.com

UTP 9010 Board Level Tester

with UTP 5085 Adapter

UTP 6010 End of Line

with UTP 5070 Adapter

CHIP

TESTING

AUTOMATION

RF TEST

IOT

MIXED SIGNAL TEST

The event featured live equipment demonstrations

from leading manufacturers.


A show of hospitality at the Supplier Appreciation

Golf Outing.


productronica

Munich

November 18 – 21,

Booth: A1.454

EPP Europe » 11 | 2025 13

TITEL » Test & Quality Assurance

Source: Koh Young

Optical inspection of 20 µm placement gaps in SiP packaging

Exploring the

Gorge

14 EPP Europe » 11 | 2025

In recent years, smartphones have undergone rapid development. We

still remember the first devices with large displays that not only enabled

phone calls but also, for the first time, provided access to internet

services such as e-mail, browsing, and video playback. Today, the

smartphone is far more than just a communication tool: it is a pocket

computer, multimedia platform, game console, and personal manager

for lifestyle, finance, and health. A highly integrated device that must

meet the highest demands.

While desktop PCs offer ample space for processors,

graphics cards and memory, smartphones

must meet the same expectations within

strict limits of size and weight. They must be fast,

last an entire day on a single battery charge, reliably

receive cellular, Wi-Fi, and Bluetooth signals, and

provide a secure environment for banking and sensitive

data. At the same time, they must deliver entertainment

— from gaming to streaming. For many

users, smartphones have already largely replaced

laptops.

This development has only been possible because

manufacturers managed to integrate ever more

functionality into limited space, while increasing

performance with each new generation. But miniaturization

at the wafer level has reached physical

and economic limits: below 10 nanometres, production

costs rise steeply, making the break-even point

increasingly difficult to reach.

The answer is a paradigm shift. Instead of squeezing

all functions into a single monolithic chip, functionality

is increasingly shifted into the packaging.

Specialized chips take over individual tasks and are

combined in a common housing. From the outside it

looks like a single processor, but several functional

blocks work closely together. This concept is called

heterogeneous packaging. Different approaches such

as 2D, 2.5D, or 3D packages exist — depending on

whether chips are integrated side by side or stacked

vertically. One variant is the System-in-Package

(SiP), where multiple components are placed side by

side like on a miniature printed circuit board. Integration

can go even further when SiPs themselves

become part of a larger heterogeneous package. The

result is a high-density assembly that enables short

signal paths, efficient thermal management, and

maximum functional integration (Multi-Chip Modules,

MCMs, or Chiplet Packages).

This article focuses on optical measurement of

dense SiP placement within heterogeneous packages,

with placement gaps as small as 20 µm. Inspection

of these extremely tight component-tocomponent

distances presents a major challenge for

measurement system suppliers, who must ensure reliable

measurement capability at such minimal gaps.

The optical challenge

of 20 µm gaps

Measuring gaps between SiP modules in the range of

only 20 µm is particularly challenging. The main reason

is the unfavorable aspect ratio: module heights

of around 200–300 µm combined with lateral spacings

of only 20 µm create narrow “gorges” that are

difficult to access optically — comparable to deep

mountain valleys where sunlight never reaches the

ground because the angle of incidence is too steep.

Even under ideal illumination, parts of component

edges and substrate surfaces remain in shadow. To

measure reliably nonetheless, both illumination and

optics must be specially adapted. Koh Young relies on

a combination of several projectors, which are arranged

in terms of angle, position and number in

such a way that even the smallest gaps are reliably

illuminated. on a combination of multiple projectors,

arranged by angle, position, and number in such a

way that even the narrowest gaps are reliably illuminated.

The Meister D+ operates with eight conventional

Moiré phase-shift projectors and one additional

vertical coaxial projector. This combination

makes it possible to detect and measure extremely

narrow gaps with high reliability. The coaxial light

plays a decisive role when measuring reflective surfaces

in packaging.

Since dies are cut directly from the wafer, they reflect

nearly 100% of the light, behaving like mirrors.

Under conventional illumination, the law of reflec-

Resolution vs. number of data points.

Source: Koh Young

EPP Europe » 11 | 2025 15

TITEL » Test & Quality Assurance

5 µm vs. 3.5 µm resolution.

and repeatable measurements. Each pixel represents

a dataset of measurement values. Current resolutions

of 5 µm and 3.5 µm per pixel are sufficient.

For future requirements, optics with 1 µm resolution

are already being prepared to ensure accurate capture

even for denser structures. Resolution is always

a trade-off between measurement quality and inspection

speed. As pixel size decreases, the camera’s

field of view also decreases, requiring more measurement

fields to cover the entire substrate. The Meister

D+ balances this with a 25-megapixel camera at 3.5

µm resolution, compensating for the smaller pixel

size. If resolution is too coarse, individual pixels are

more prone to fluctuation and may distort results.

The more data points available, the more reliable and

repeatable the measurement becomes. At 3.5 µm

resolution, noise effects decrease dramatically, resulting

in clean and dependable measurements.

Besides illumination and resolution, selecting the

correct reference height is critical when measuring

20 µm gaps. Precise distance or height values require

a reliable baseline, which can only be established

when enough information about the substrate surface

is available. In packaging, substrate quality is

generally high. Nevertheless, surfaces can be challenging

due to three-dimensional layer structures or

semi-transparent layers. In such cases, local fiducials

can be used directly on a silicon substrate or interposer.

The fiducial surface offers excellent flatness,

providing a stable foundation for precise reference

heights. Even warpage can be compensated. Fiducial

marks therefore provide a robust reference line.

What may seem like the future of high-density

placement is already reality. The latest generation of

mobile devices already uses this type of dense astion

applies (angle of incidence equals angle of reflection),

so the light is reflected away from the

camera. The result is that the camera perceives only

surface noise instead of a usable signal. Coaxial illumination

solves this problem: by projecting light

vertically onto the reflective surface, the camera can

capture accurate surface information. Meanwhile,

the eight conventional projectors provide sufficient

illumination of component edges and sidewalls, and

down to the substrate level, ensuring correct height

measurements.

Resolution and reference heights

In addition to illumination, optical resolution is critical.

With a 20 µm gap, enough pixels must be captured

from edge to edge to achieve statistically valid

Bild: Koh Young

Bild: Koh Young

Placement of SiP modules on a substrate (top view under coaxial white light): Distances between the SiP modules vary between

approximately 20 and 30 µm.

16 EPP Europe » 11 | 2025

Bild: Koh Young

Placement of SiP modules on a substrate (3D reconstruction at

3.5 µm resolution): The lateral dimensions are captured and

measured using the standard Moiré phase-shift projectors. The

reflective surface, and thus the module height, is captured and

measured with the coaxial projector. For reconstructing the

gaps between the modules, the Moiré phase-shift method is

primarily used.

sembly in practice. And yes — it is being inspected

during manufacturing. Our customers are already

measuring these component-to-component distances

in live production — with the Meister D+ platform

at the package level and with the ZenStar platform

at the wafer-level packaging stage.

Summary

The miniaturization of smartphone technology has

reached the limits of wafer-level scaling, making advanced

packaging the key to further integration and

performance. Instead of fitting all functions into a

single chip, heterogeneous packaging combines

specialized chips in one housing, with System-in-

Package as one important variant. This approach enables

high-density assemblies with very small gaps

between components, sometimes only 20 µm.

Such narrow distances create optical inspection

challenges because the high aspect ratio forms deep

gorges that are difficult to illuminate, and reflective

die surfaces prevent conventional systems from capturing

usable signals. To overcome this, the Meister

D+ system employs a combination of multiple phaseshift

projectors and coaxial illumination, enabling

accurate detection of sidewalls, gaps, and reflective

surfaces. High pixel resolutions further improve

measurement quality, while stable reference heights

are established through flat silicon or fiducial marks

on substrates.

The results show that distances of 20–30 µm between

SiP modules can already be measured reproducibly

and reliably in production. What may seem

like a future trend is, in fact, already established in

industrial practice, with systems such as the Meister

D+ and ZenStar platform ensuring precise inspection

at both package and wafer level.

Curious about Koh Young? –

Productronica: Booth A2.377

www.kohyoung.com

The answer to avoid voiding

Looking for the highest quality in soldering for your products?

From small to large, batch and in-line, with or without vacuum

We have it all -

keeping up with the pace of chip shooters

Now available with Automatic Gradient Control

and Advanced Process Monitoring

We are looking forward to your visit at the

Productronica Hall A4, Booth 218

and Hall B2, Booth 261 at Fraunhofer IZM

IBL-Löttechnik GmbH

EPP Europe » 11 | 2025 17

Breitweidig 13, D-91301 Forchheim - Messerschmittring 61-63, D-86343 Königsbrunn - www.ibl-tech.com - infoline@ibl-tech.com

» SPECIAL PRODUCTRONICA

Productronica has grown

over five decades, becoming

a global meeting point and

pace-setter for global

electronics production.

On-site information

Dates: November 18 – 21, 2025

Location: Am Messesee 2, 81829

Munich, Germany

Shaping the future

Leading innovations

on show in Munich


Organizer: Messe München GmbH

Exhibitor services: Atrium in front

of Halls B2 and B5, and north end

of Hall C4

Visitor hotline: +49 89 949–11438

E-mail: info@productronica.com

Website: www.productronica.com

Opening hours

Tue, Nov 18 – Thu, Nov 20

• Visitors: 9:00 – 18:00

• Exhibitors: 8:00 – 19:00

Fri, Nov 21

• Visitors: 9:00 – 16:00

• Exhibitors: 8:00 – 19:00

Celebrating its 50th anniversary, productronica 2025 will once again transform Munich into

the epicenter of electronics manufacturing. From November 18–21, under the guiding theme

“the pulse of innovation”, the trade fair will spotlight pioneering technologies set to define

the next era of the industry.

Since the last edition in 2023, the industry has

made significant strides in areas such as heterogeneous

integration for advanced packaging, commercial

adoption of wide-bandgap semiconductors,

and hardware-based approaches to microelectronics

security. These breakthroughs are now moving

beyond laboratory testing and pilot projects into

scalable industrial applications—making productronica

2025 the ideal stage to assess their transformative

impact.

More than just an exhibition, the event provides a

platform where manufacturers, research institutions,

and solution providers demonstrate progress in performance,

efficiency, and resilience. Visitors can expect

insights not only into current technologies but

also into the strategies that will shape electronics

manufacturing in the years ahead.

As the industry’s pace-setter, productronica has

grown over five decades into a global meeting point

for electronics production, attracting thousands of

professionals and leading suppliers from around the

world. Alongside its core exhibition, the 2025 edition

will again feature the Productronica Innovation

Awards and the VDMA Innovation Forum, providing a

stage for pioneering ideas and cross-industry dialogue.

Running concurrently with SEMICON Europa,

the event creates one of the largest platforms in Europe

for knowledge exchange and networking across

the semiconductor and electronics value chains.

The fair experience is rounded out with services

and amenities designed to support global visitors:

from a multi-faith prayer room and accessible facilities

across the site, to extensive dining options

ranging from international specialties to Bavarian

fine dining. A strong focus on sustainability underpins

all catering services, including reusable tableware,

avoidance of single-use plastics, and depositreturn

systems for beverages.

With its combination of cutting-edge innovation,

industry dialogue, and visitor-friendly infrastructure,

the event is set to reaffirm its position as a key

meeting point for the global electronics manufacturing

community.

Looking beyond 2025, productronica 2027 is already

on the calendar (November 16–19, in Munich).

18 EPP Europe » 11 | 2025

SPECIAL PRODUCTRONICA «

Zero Defects, zero Operators, zero Downtime

Intelligent and efficient SMT production

Bild: Fuji

The vision of “zero defects, zero operators,

zero downtime, zero limits” is no

longer a distant goal. From November 18

to 21, 2025, Fuji Europe Corporation will

showcase its approach at productronica

in Munich. At the center: the “Fuji Smart

Factory 2.0” – a modular system designed

to enable data-driven, automated processes

for modern electronics assembly.

“Just like in Japanese archery, electronics

manufacturing is about precision, clarity

and absolute focus. Every move, every

process step must be spot-on – no waste,

no detours. At productronica, under the

motto ‘No waste, just results. Target Zero.’

we’ll show how smart and efficient SMT

production can be implemented,” says

Stefan Janssen, Managing Director of Fuji

Europe Corporation GmbH.

At the show, Fuji will present key elements

of a Smart Factory solution for

both SMT and THT assembly.

These are integrated into a

production line following Industry

4.0 principles, using

M2M communication with

equipment from different suppliers.

In the “Fuji Smart Factory

2.0” (FSF 2.0), all production-relevant

processes –

starting with material preparation

and extending beyond printing

and placement – are interconnected. The

result: production times can be reduced

by up to 22 %.

Fuji Smart Factory 2.0 is designed as a

highly intelligent, self-optimizing production

environment built around networked,

autonomous machines. It aims to

eliminate defects, downtimes and system

limitations. The core concept is seamless

machine-to-machine communication and

Wie smart eine Fabrik der Elektronikfertigung in heutiger Zeit

sein kann, zeigt Fuji auf der productronica.

integration into flexible manufacturing

environments that can handle mass customization

and variant diversity with

ease.

The company’s Target Zero strategy spans

multiple placement platforms, such as the

NXTR A model. The goals: no placement

errors, no machine operators, no unplanned

stops, and no placement limitations.

productronica: Booth A3.317

EPP Europe » 11 | 2025 19


AXI, AOI and In-System Programming

New Impulses for Quality Assurance

At productronica, Göpel electronic will

showcase fresh technological impulses

for quality assurance in electronics

manufacturing. The company will present

high-performance innovations in automated

optical inspection (AOI) and X-ray

inspection (AXI), advanced in-system programming,

and versatile JTAG/boundary

scan systems. Future users benefit from

precision, efficiency and adaptability

across all manufacturing levels – from reliable

defect detection to flexible programming

capabilities. In the field of inspection

solutions, four new products are

taking centre stage.

Göpel electronic introduces the Multi

Line AXI – a completely new generation

of automated X-ray inspection systems.

For the first time worldwide, this system

combines area and line detectors in a hybrid

X-ray imaging solution. This allows

the generation of extremely high-resolution

images as well as fast computed tomography

(CT) scans. Thanks to a novel

system design and resulting flexibility,

both large and heavy assemblies, such as

Image: Göpel electronic

those used in power electronics,

and very small PCBAs down to

postage-stamp size can be transported

and inspected with ease.

The enhanced Multi Line Assist

system integrates a new lighting

technology for optimal illumination

at THT assembly stations.

MagicLight uses specially encoded

light, enabling reliable detection of

even the smallest or previously reflective

features, while effectively

suppressing ambient light interference.

The new Multi Line CCI system now

introduces 3D-based coating thickness

measurement – a key step forward in

conformal coating inspection. For the AOI

systems Vario Line and Basic Line, Göpel

electronic now offers the new X250

camera module for SMD inspection. This

module integrates a new camera technology

that achieves a resolution of 9.8 µm

without compromising inspection speed.

As a leading provider in the field of JTAG/

boundary scan, Göpel electronic will also

unveil several innovations in this seg-

Göpel electronic showcases new developments in AXI,

AOI, and in-system programming solutions for assemblies

and components at productronica.

ment: The FlashFOX in-system programmer

is now available in a dual-channel

version. This universal programmer

features two asynchronous parallel channels

and four independently integrated

voltage supplies for target devices. It

complements the existing 4– and

8-channel models and is particularly

suited for small-batch production, manual

assembly stations, and development

environments.


Live in Action at productronica

Laser Depaneling System Maximizes Production Efficiency

The highly automated CuttingMaster

2240 Cx laser depaneling system

maximizes efficiency in high-volume

rigid PCB production.

Image: LPKF Laser & Electronics SE

With the highly automated Cutting-

Master 2240 Cx, LPKF Laser & Electronics

has developed a laser depaneling system

designed to maximize the efficiency of

high-volume production of rigid PCBs.

The system features an advanced, integrated

material handling solution that

eliminates the need for rotating

workpiece carriers. This significantly

reduces operating costs

while maintaining the precision and

reliability LPKF is known for. The system

will be demonstrated live at productronica

2025 at the Fraunhofer IZM booth.

“The CuttingMaster 2240 Cx represents a

major advancement in automated laser

depaneling technology,” says Patrick

Stockbrügger, Product Manager at LPKF.

“By eliminating rotating workpiece car-

riers and offering flexible integration of

intelligent automation functions, we provide

a solution that not only lowers operating

costs, but can also be tailored to

specific customer requirements.”

Efficient automation for

PCB depaneling

The CuttingMaster 2240 Cx provides a

cost-efficient automation solution for

depaneling rigid printed circuit boards –

fully aligned with current industry demands.

With its integrated, product-specific

clamping device and unloading unit,

the system simplifies production processes

while reducing the complexity,

footprint, and costs associated with additional

automation equipment.

productronica: Booth B2.261

20 EPP Europe » 11 | 2025

Exhibition to boost flexibility, speed, and efficiency

New ways to improve

surface-mount performance

At productronica 2025, Yamaha Robotics SMT Section is highlighting

productivity-boosting software, a new entry-level printer, and

flexible new head and feeders for mounting large and odd-form

parts.

At the event, the company’s stand (Hall A3, Booth 323) is presenting

innovations that boost flexibility, speed, and efficiency in surfacemount

assembly. The main display areas present the latest machines

in the 1 Stop Smart Solution, the power of Yamaha Intelligent Factory

software, and new solutions for mounting large components.

The solutions interact seamlessly to optimize productivity and share

data with Yamaha Intelligent Factory software. Two display areas

dedicated to the software will highlight powerful new tools that enhance

assistance for process engineers, focusing on planning and

preparation, quality assurance and production support.

For the first time in Europe, visitors will be presented with the company’s

new YRP10e entry-level printer. Delivering disruptive value,

the printer brings speed, accuracy, and high-value features from the

premium market, including print-pressure control, one-touch stencil

change, high-performance inspection, and remaining solder quantity

detection.

A special focus on end-of-line activities will showcase the new LM

mounter head that can place components up to 90 mm x 139 mm,

and new off-the-shelf feeders that handle odd-form parts. The LM

head has interchangeable grippers and vacuum nozzles for standard

packages, reducing reliance on specially adapted components, and

the new feeders can be deployed quickly and easily without customization.

Visitors will also see a novel presentation combining a new prototype

mounter with autonomous mobile robots to enhance support

for manufacturing. When connected to smart factory systems, the

robots can work efficiently with the highly automated mounter to

bring components and materials to the right places just in time,

every time, for maximum efficiency.

Shuichi Imai, the company’s general sales manager for Europe, commented:

“Our booth showcases innovations that support skilled staff

and advanced automation, working together to elevate quality and

productivity. We are looking forward to showing how the latest cutting-edge

technology from Yamaha can deliver greater value for all

electronic manufacturing businesses.”

smt.yamaha-motor-robotics.eu

Zero limits.

Zero compromises.

Zero waste.

For smarter, more

efficient production.

Meet us at productronica

in Munich, Nov 18–21.

Hall A3 | Booth 317

1 Stop Smart Solution

Source: Yamaha Robotics

FUJI EUROPE CORPORATION GmbH

+49 (0) 6107 68 42 0

fec_info@fuji-euro.de

www.fuji-euro.de/en

EPP Europe » 11 | 2025 21


Upgrades across the entire soldering portfolio

The next generation of selective

and wave soldering

Seho Systems, one of the world‘s leading suppliers of complete solutions for soldering processes

and automated production lines, will present new system technologies and targeted

upgrades to its high-end soldering systems across all product segments at productronica

2025. According to the company, the innovations are tailored for demanding applications in

e-mobility and power electronics, offering a sophisticated process architecture, high flexibility

and a consistent focus on efficiency.

With the new PowerSelective-HD,

Seho introduces a next-generation

selective soldering system that aims

to raise flexibility, throughput and process

reliability in electronics manufacturing

to a new level. A newly integrated fiducial

camera in the fluxer section improves

positioning accuracy – a clear advantage

for complex layouts and highdensity

assemblies, the company states.

The system features a cluster-based

preheating concept that selectively heats

only those areas of the assembly that are

relevant for the soldering process. Unnecessary

thermal stress is avoided, and

energy consumption is significantly reduced.

Each preheat station can be equipped

with up to 30 shortwave, gold-coated

emitters, which are individually controllable

and capable of precisely heating

even very small areas. Their focused heat

emission combined with high energy efficiency

sets new standards in thermal process

control. This approach is also used in

multiwave soldering, enabling the preheating

process to be perfectly tailored to

the specific PCB layout – for maximum

energy savings and localized thermal load

where needed.

A scalable IR cluster top heater with 4

or 16 zones complements the preheating

system, ensuring uniform heat distribution

for large and high-mass assemblies.

All heating modules are implemented in

maintenance-friendly drawer format.

Bild: Seho Systems

Larger soldering area

Mit der neuen PowerSelective-HD

präsentiert SEHO zur productronica

eine Selektivlötanlage der nächsten

Generation, die Elektronikfertigungen

in puncto Flexibilität, Produktions -

volumen und Prozesssicherheit auf

ein neues Niveau hebt.

The newly developed soldering unit offers

a significantly increased soldering area

and can be flexibly adapted to different

production requirements.

For maximum versatility, two different

multiwave tools – each up to 250 ×

400 mm in size – can be installed simultaneously,

making the system ideal for

high-mix production or frequent product

changeovers. Alternatively, two identical

tools can be combined to achieve a total

soldering area of up to 500 × 500 mm.

This increases throughput considerably –

for example, in multi-panel applications,

where a single dip process is sufficient to

solder several assemblies at once.

An integrated eco-mode minimizes nitrogen

consumption, supporting sustainable

and resource-efficient operation.

To meet the highest quality standards, the

system can be equipped with both a selective

brushing unit for solder ball removal

and the PowerVision THT-AOI system

for solder joint inspection.

Both functions operate on separate

axes and run in parallel to

the soldering process, with no

impact on cycle time. The result:

maximum process reliability at consistently

high throughput.

The PowerSelective-HD is engineered

for advanced electronic applications such

as e-mobility, battery management systems,

and power inverters. It handles assemblies

weighing up to 25 kg, with full

clearance above and below the PCB – enabling

highly flexible and robust processing.

Efficiency and intelligent process control

are also the focus in Seho’s wave soldering

segment. Following the introduction

of energy-efficient Pulsar emitters in

the preheat area – reducing energy consumption

by up to 30 % – and innovations

such as automatic nozzle height

adjustment and wave height measurement,

the fluxer section has now been

specifically enhanced.


22 EPP Europe » 11 | 2025

SPECIAL PRODUCTRONICA «

Product launch in Munich

New Smart Reel Tower extends component management

necting to ERP and MES systems, ensuring

seamless machine-to-machine communication

and reliable process control.

The Smart Reel Tower combines high capacity

and throughput with a compact

footprint, making it suitable for both SMT

line-side and warehouse environments.

Its dual-deck storage design accommodates

up to 2,000 reels, while the dualchannel

entry and exit system processes a

minimum of 600 reels per hour with sixsecond

cycle times. The unit is also AGV

compatible, making it fully Industry 4.0

ready.

The new Smart Reel Tower will be unveiled

at productronica 2025, and demonstrations

are also planned in the UK

and Europe.

Together, the companies are providing

manufacturers with advanced component

management solutions designed to im-

The next stage

of automation.

Altus Group is showcasing the latest development

from Scienscope as the company

extends its component management

portfolio with a new Smart Reel Tower.

The solution can be configured with or

without humidity control and complements

Scienscope’s widely adopted smart

racking solutions. With several OEMs

stepping away from this market in recent

years, the company brings proven expertise

and a strong track record to storage

tower technology.

Adding to a portfolio that already includes

goods-in scanning and smart racking

for reels, stencils and feeders, the new

system completes an offering that gives

manufacturers access to a comprehensive

component management ecosystem.

Here, integration is a core strength. With

thousands of global installations, the

company has extensive experience conprove

efficiency, safeguard quality and

prepare operations for the next stage of

automation.

www.altusgroup.co.uk

Source: Altus Group

CREATE YOUR

Connections

Reliable solder joints, ultimate precision and maximum flexibility – our vapor phase

soldering systems offer state-of-the-art technology for efficient and stable production.

Discover more and achieve the perfect connection!

www.rehm-group.com

EPP Europe » 11 | 2025 23

» PCB & ASSEMBLY

Reliable visibility into process performance


Modern electronics assemblies are placing increasing demands on process control.

As boards become more densely populated and components more thermally diverse,

maintaining consistent soldering performance is more complex than ever.

» Chris Williams, Solderstar Head of European Sales

Miniaturization in modern assemblies makes achieving consistent reflow profiles more

challenging, highlighting the need for verification beyond temperature alone.

Traditional profiling methods, which focus solely

on temperature, are struggling to keep pace. To

maintain reliability and efficiency, manufacturers are

turning to broader verification strategies that monitor

more than just temperature.

Miniaturization has dramatically changed the

thermal dynamics of PCBs. Modern assemblies often

include tightly packed components, with small passives

placed adjacent to high-mass parts such as connectors

or shields. This variation in thermal mass

makes achieving a consistent reflow profile across

the entire board increasingly difficult.

Whereas legacy profiling techniques might have

sufficed in low-density or high-volume environments,

today’s engineers are expected to deliver precise

thermal conditions for complex, mixed-technology

boards often within tight timeframes that leave

little room for trial and error. Simply put, profiling

can no longer be a time-consuming, manual task; it

must be fast, accurate, and easily repeatable.

Time-efficient solutions

Source: Soldestar

In high-mix environments, the need to switch between

product types quickly without excessive

downtime is critical. Thermal profiling solutions have

evolved to address this requirement, offering tools

that enable engineers to input solder paste specifications

and automatically adjust temperature profiles

to align with the desired process window. This

automation significantly reduces process setup time

from hours to minutes, allowing thermal profiling to

facilitate, rather than impede, production throughput.

More importantly, profiling is now considered an

integral and continuous element of process control,

rather than a one-time setup step. Instead of re-profiling

after every oven adjustment, many manufacturers

are adopting daily verification protocols based

on established benchmarks. This approach minimizes

unnecessary downtime while ensuring baseline process

parameters consistently remain within specification.

A multivariable approach

Modern reflow ovens are more sophisticated than

ever, with many incorporating vacuum chambers, nitrogen

atmospheres, and high-speed conveyor systems.

As such, temperature is no longer the only

variable that matters. To ensure process stability and

solder joint integrity, manufacturers must now monitor

a range of environmental and mechanical conditions:

• Oxygen (O 2 ) levels: Operating in an inert atmosphere

requires strict control of O 2 concentrations.

Excessive oxygen can lead to oxidation and poor

solder joints; insufficient oxygen can result in excessive

nitrogen use and issues such as tombstoning.

Rather than relying on single-point sensors,

full-profile oxygen monitoring across the length

of the oven provides clearer insight into atmospheric

consistency and leak detection.

• Vacuum profiling: In vacuum reflow, the goal is to

evacuate trapped gases that can cause voids in

solder joints. However, incorrect pull-down, hold,

or release rates can lead to component shifting or

insufficient void removal. Measuring the vacuum

cycle in real process conditions enables engineers

to optimize timing and vacuum strength for both

quality and throughput.

• Vibration: Mechanical disturbances from conveyor

systems or vacuum modules can cause compo-

24 EPP Europe » 11 | 2025

nents to shift during reflow, especially on densely

populated boards. By measuring vibration in three

axes (X, Y, and Z), manufacturers can identify

mechanical faults, such as misaligned conveyors,

before they lead to defects.

• Conveyor speed: Even subtle variations in conveyor

speed can impact thermal consistency, especially

when combined with other variables.

Complete monitoring ensures that recipe compliance

is maintained and deviations are identified

and corrected before they affect product quality.

From reactive to predictive

While profiling is essential for setup, verification is

becoming the mainstay of ongoing process control.

By establishing a ‘base point’ and monitoring deviations

across temperature, oxygen, vibration, and

other parameters, manufacturers can proactively address

emerging issues before they escalate into failures.

For example, if contact time in a wave soldering

process begins to shift by even a fraction of a second,

it may indicate a mechanical or thermal drift.

Similarly, a gradual increase in vibration levels could

signal conveyor wear. These indicators enable maintenance

to be scheduled based on the actual condition

of the equipment, rather than fixed intervals,

thereby reducing downtime and extending the lifespan

of machinery.

Supporting compliance and sustainability

Source: Soldestar

In addition to quality and efficiency, evolving industry

regulations are pushing manufacturers to document

and control environmental conditions. Standards

such as ISO 14001 require continuous improvement

and environmental accountability. Realtime

monitoring of nitrogen usage, leak detection,

and gas management not only helps meet these

standards but can also reduce unnecessary consumption

and operational costs. For instance, undetected

leaks in nitrogen lines or broken seals can lead

to thousands of euros, pounds, or dollars in excess

gas usage per year. By capturing complete oxygen

profiles manufacturers can detect and correct these

issues early, contributing to both cost savings and

sustainability goals.

ROI in efficiency

For manufacturers assessing the return on investment

in modern thermal profiling systems, the value

lies in improved process visibility and reduced operational

overhead. Simplified verification tools allow

routine checks to be carried out by non-engineering

staff, freeing up skilled engineers to focus on process

optimization and problem-solving.

At the same time, access to detailed process data

enables engineers to quickly identify issues within

the oven, supporting faster decision-making and

more effective troubleshooting.

Modern profiling is not about collecting more data

for the sake of it, it is about gaining the insight

needed to reduce defects, improve yields, minimize

downtime, and stay aligned with evolving quality

and sustainability requirements. In a production setting

where change is constant, reliable visibility into

process performance is critical.

www.solderstar.com

Today, process verification

considers

multiple factors, including

oxygen levels,

vacuum, vibration, and

conveyor speed, to

maintain stability and

solder joint integrity.

Oven temperature and oxygen (ppm) profile provides a fuller picture

of the process.

Source: Soldestar

Measuring conveyor vibration profile by oven zone highlights mechanical

disturbances that could cause component shift during reflow.

Source: Soldestar

EPP Europe » 11 | 2025 25

» PCB & ASSEMBLY

A new industrial mindset

Cradle-to-cradle concept in

mechanical engineering

Sustainability is a hot topic for many mechanical engineering companies. At EUTECT,

however, it has been an integral part of the company and product strategy for years.

The cradle-to-cradle concept (C2C), developed by Michael Braungart and William

McDonough in the 1990s, goes far beyond a simple environmental seal.

Source: EUTECT

A manufacturing approach that represents a new industrial mindset.

The Swabian special machine manufacturer

has been pursuing a consistently

unconventional approach to the development

of its selective soldering systems for

many years: “Our approach does not start

within the traditional framework, but deliberately

beyond it,” emphasized Managing

Director Matthias Fehrenbach. This philosophy

is based on the idea that selective soldering

systems should not be regarded as

scrap metal at the end of their service life,

but as a valuable resource for new applications.

Thanks to the modular design of its

systems, the company can take back used

systems, refurbish them, and put them back

into operation, in line with the principle of

functional reuse. Instead of quality-reducing

recycling, the value of intellectual and

material achievements, including complex

soldering processes, is retained. “What used

to end up at the recycling depot is now the

basis for new solutions,” said Fehrenbach.

Fehrenbach and his team have been pursuing

this approach for around five years.

He said: “At the beginning, we had to frequently

explain what we were doing. The

concept was and still is relatively unknown

in mechanical engineering and among customers,

but they quickly understood the

added value it could offer.”

Refurbished in parts

Existing customers offered us their decommissioned

EUTECT systems, in many cases

for a small contribution to their Christmas

fund. Some systems thus found their way

back to Dusslingen, where they were dismantled

and refurbished in parts before

being delivered to new customers for new

tasks.

“One machine has now completed this

journey for the second time. After its return,

it was sent to a customer for a limited period,

who returned it to us after completing

the order,” Fehrenbach said.

For customers, this approach means a

significant boost in cost-effectiveness and

flexibility. They no longer have to purchase

machines, instead, they can be rented or

leased for prototyping, pre-series production,

or as test systems in the company‘s

own technical center. This reduces investment

risks, accelerates project start-ups,

and shortens delivery times, both for complete

systems and for individual soldering

modules that are available directly from

stock. If a module needs to be serviced, a refurbished

replacement module can be provided

at short notice.

The concept also makes economic sense.

“People often assume that C2C solutions

are more expensive. In fact, they are around

20% cheaper on average,” explained

Fehrenbach. The targeted use of durable

materials and components reduces procurement

costs while increasing the service life

of the systems. In the long term, the company

is pursuing a larger vision: to build a

closed ecosystem in which machines, modules,

data, and services interact intelligently

over many years.

Returned systems serve as material and

knowledge pools and valuable resources. Internal

know-how that has already been invested

is thus retained. “We lose nothing,

neither materials nor the potential and

knowledge of our employees that has already

been invested,” said Fehrenbach. He

summarized: “C2C will play a central role in

the mechanical engineering of the future.

It‘s about securing long-term value creation

and redefining responsible behavior.”

https://eutect.de/

26 EPP Europe » 11 | 2025

COMPLETE AND FLEXIBLE SMT SOLUTIONS

Soft, flexible ultraviolet adhesive bonding

New UV/moisture potting

material for electronics

and sensor assembly

Panacol is expanding its portfolio of dual-curing acrylate adhesives

with another high-performance, one-component adhesive system.

Vitralit UD 8060 F offers high elongation at break, making it an ideal

potting material for electronics and sensor assembly.

You‘ll find highly

functional machines for

precise and flexible

SMD production at

productronica

Hall A3, Booth 244

The product is formulated with a

modified isocyanate acrylate and

can be cured by irradiating with broad

spectrum UV-A or by using LED wavelengths

of 365 or 405 nm.

The initial curing of the adhesive using

UV/visible light secures it to the component

in only a few seconds. The adhesive

will then utilize atmospheric humidity

and surface moisture to complete its curing

in areas that were shadowed from UV/

visible light exposure. This second phase

of curing occurs without imparting thermal

stress on sensitive electronic components.

The adhesive system relies on both

UV/visible light exposure and reactivity to

atmospheric humidity for proper curing

and cross-linking.

The rapid build-up of mechanical

strength prevents warping of the bonded

substrates and enables the components

to be processed or transported quickly.

This makes the adhesive ideal for applications

with shadow zones or complex

component geometry. These challenges

are often found in consumer electronics

when securing components on PCBs, or in

sensor assembly.

Vitralit UD 8060 F is characterized by a

high elongation at break of up to 130%

and very good adhesion to various substrates

such as PC, PMMA, FR4, copper

and aluminum. Its temperature resistance

ranges from –40 °C to +130 °C. The adhesive

also demonstrates high resistance

to humid conditions. Bond strength values

remain consistent after 85/85 tests (85

°C / 85% RH, 120 h).

Compared to other products in the Vitralit

80 series, Vitralit UD 8060 F offers a particularly

soft, flexible bond that can absorb

mechanical stresses well.

This property makes the adhesive ideal

for bonding materials with varying thermal

expansion coefficients, and for applications

in which vibration loads can

occur. It is a transparent UV adhesive that

contains a fluorescent tracer that is only

seen when exposed to UV light. This permits

fast visual inspection for enhanced

quality control.

Like all Panacol adhesives, the product

is RoHS-compliant and free from heavy

metals and phthalates.

www.panacol.com

Curing without imparting thermal stress

on sensitive electronic components.

Source: Panacol

printALL210

placeALL ® 520

IRO850

Fritsch GmbH

Kastnerstraße 8

D-92224 Amberg

Tel. +49 9621 78800-0

info@fritsch-smt.com

EPP Europe » 11 | 2025 27

www. fritsch-smt.de

PCB & ASSEMBLY » Product Updates

New, larger demonstration laboratory in Burlington

Expanded presence for

SMT specialist

A specialist in adaptive and highly flexible SMT, Essemtec has opened a new

demonstration center in Burlington, Massachusetts. Less than 18 months after

opening its facility in Newton, the company has moved to a larger and more

modern space to meet the demand from customers for demonstrations,

training, and collaboration.

The facility is located within Nano Dimension’s cutting-edge campus.

The expansion is indicative of a strong

market response. Don Jeka, Business

Development Manager, commented: “The

response to our Newton lab was fantastic—so

much so that we quickly outgrew

the space. Our move to Burlington enables

us to better support customer demand

and expand our capabilities with a

more advanced setup.”

Source: Essemtec

The Burlington facility is designed to

showcase the entire SMT process, from

jetting and placement to reflow and inspection.

The center also features a dedicated

off-line station, where visitors can

explore Smart Material Management,

recipe preparation, job planning, and the

full digital workflow for modern, efficient

electronics production.

The facility is located within Nano Dimension’s

cutting-edge campus, giving

customers a unique opportunity to also

experience innovations in additively

manufactured electronics and advanced

digital manufacturing technologies offered

by Nano Dimension. This environment

fosters cross-technology collaboration

and represents the future of agile,

high-mix manufacturing.

As well as customer demonstrations,

the facility supports customer engagement,

collaboration, and training

sessions. “We have created a space that is

not just about machines—it is about

building relationships, offering technical

expertise, and helping customers solve

their specific challenges,” added Jeka.

The development is a testament to the

company’s commitment to providing cutting-edge

solutions that are tailored to

contemporary manufacturing challenges.

The company has also relocated its US offices

to the Burlington facility from Waltham.

www.essemtec.com

Source: Essemtec

The new facility aims to enhance engagement, efficiency, and collaboration.

28 EPP Europe » 11 | 2025

Product Updates « PCB & ASSEMBLY

Deliver complex assemblies faster and more accurately

Selective soldering system supports production growth

Leading US-based electronics contract

manufacturer, Distron corporation, has

expanded its selective soldering capacity

with the acquisition of a Juki Cube Inline

Selective Soldering System. The company’s

second Juki soldering platform, it

compliments a Cube 460 installation that

has already demonstrated reliable performance

in a high-reliability production

environment.

The newly deployed system delivers improved

precision, flexibility, and productivity.

With two independent soldering

heads and inline integration, it streamlines

throughput and supports conveyor

board sizes up to 460 × 460 mm (~18 ×

18 in)—key for high-mix, high-reliability

production across medical, defense, aerospace,

and industrial markets. It builds on

core Juki capabilities such as servo-driven

XY and flux axes, ActiveFlow solder circu-

lation, and multiple nozzle support for

board and component variability.

“Our first Juki Cube 460 has proven itself

to be workhorse, so adding the inline

model was a natural step forward,” commented

Robert H. Donovan, CEO of DIS-

TRON. “The Cube Inline gives us twice the

headroom, tighter process control, and

faster changeovers—essential as we continue

to grow in sectors demanding zerodefect

soldering.”

The platform offers advanced features including

offline programming, high-precision

servo motion, fiducial recognition,

and full nitrogen support to reduce oxidation

and improve joint consistency. Its

modular architecture supports ActiveFlow

modules, quick-change solder pots, and

nozzle configurations to enable efficient

transitions between different paint profiles

and alloy types.

Twice the headroom, with

tighter process control.

The upgrade reinforces the company’s

commitment to lean, high-quality electronics

manufacturing using trusted

automation technologies. With selective

soldering now fully automated and scalable,

it can deliver complex assemblies

faster, more accurately, and with leading

consistency.

www.distron.com

Source: DISTRON CORPORATION

FOR 60 YEARS, THE FAMILY-OWNED COMPANY PIEK

HAS BEEN YOUR STRATEGIC TRAINING PARTNER IN THE

TECHNICAL INTERCONNECTION INDUSTRY.

PB

DESIGN

PB

FABRICATION

PB

ASSEMBLY

PB REPAIR

AND

REWORK

CABLE

AND WIRING

TECHNIQUES

SPECIAL

TRAINING

PROGRAMS

QUALITY

EPP Europe » 11 | 2025 29


Modular design, nitrogen-based processing

Investment in wave soldering system expands capabilities

Contract electronics manufacturing services

specialist PRIDE Industries has

added a Kurtz Ersa POWERFLOW wave

soldering system to its production floor.

The company said in a press release that

the strategic equipment upgrade has expanded

its capacity to deliver high-relia-

Source: PRIDE Industries

Robust electronics

manufacturing

services.

bility through-hole and mixed-technology

assemblies for customers in the aerospace,

medical, industrial, and defense

sectors.

The installed system is known for its

modular design, nitrogen-based processing,

and control systems that ensure opti-

mal solder joint quality and consistent

performance. With high-volume throughput

and advanced energy-saving features,

it is engineered to support the demands

of modern, complex PCB assembly.

“The solution allows us to take on more

technically demanding builds and maintain

the high standards our customers expect,”

commented Andrew Williams, Director

of Product Engagement at PRIDE

Industries. “It also supports our goal of

growing advanced manufacturing capabilities

while creating meaningful career

pathways for people with disabilities,” he

added. This new line enhances the company’s

robust electronics manufacturing

service, which includes SMT, box build,

product testing, and turnkey assembly.

www.prideindustries.com

High-efficiency heat sinks

Power electronics require efficient cooling

Electric vehicles, renewable energies,

digitalization, automation: the trend toward

electrification is growing in applications

where reliability and durability

are crucial. This also increases the demand

for high-performance cooling solutions.

According to CTX, three factors

are important for high-efficiency heat

sinks.

A vital requirement for effective cooling

solutions is a sufficiently large surface.

This enables fast heat dissipation in

power electronics, and is why classic heat

sinks are equipped with fins—the narrower

and more numerous, the better.

Typical manufacturing processes are extrusion

and die-casting. In these processes,

a forming tool is used to create

the structures necessary for heat dissipation,

in large quantities.

The second efficiency factor is low thermal

resistance. This can be achieved at

the location where the fins are connected

to the base plate. CTX adapts productionrelated

transitions by means of CNC machining.

Alternatively, the skived fin pro-

cess can be used to pare the fins from a

metal block. This produces very fine fins

that remain connected to the heat sink

base with no transitions.

The choice of material is also crucial. Although

copper offers the highest thermal

conductivity (up to 400 W/mK), it is used

only rarely due to its high price and heavy

weight. Aluminum is less expensive, lighter,

and has a thermal conductivity of 180

to 235 W/mK, which is optimal with the

right engineering and manufacturing pro-

cess. One example is cold forging. This

process produces an extremely homogeneous

and dense material structure.

The thermal conductivity of the heat sink

is thereby higher than that of the feedstock.

As well as offering a leading range of

heat sinks in Europe, CTX Thermal Solutions

also manufactures applicationspecific

cooling solutions.

www.ctx.eu/en/

High fin density

grants the heat

sinks a large

heat-dissipating

surface.

Source: CTX Thermal Solutions

30 EPP Europe » 11 | 2025


Accelerating development for OEMs

A smarter approach for PCB assemblies

A leading provider of manufacturing

solutions has launched what it calls a

smarter approach to prototyping that

reduces cost and accelerates development

for OEMs across high-mix, highcomplexity

sectors. Amtech Electrocircuits’

cost-optimized prototyping model

goes beyond traditional “quick-turn”

builds by prioritizing design for manufacturability

(DFM), cost-efficiency, and

long-term scalability from the very first

build. Rather than relying on disposable,

one-off boards or makeshift solutions,

the company partners directly with engineering

teams to build production-intent

prototypes, resulting in fewer redesigns,

faster NPI transitions, and better

alignment between prototype and final

product.

Jay Patel, CEO at the company, commented

that prototyping should be a

launchpad, not a roadblock. “We help customers take

the smarter path by building boards that are not only

functional but optimized for quality, supply chain reliability,

and production scale from day one,” he explained.

The company’s in-house team actively engages with

customers during early design stages to improve component

selection, identify sourcing risks, and reduce labor

complexity, all while ensuring that prototypes are representative

of the production environment.

The benefits of the model include:

• Reduced costs through better material utilization and

fewer respins;

• accelerated time-to-market via design feedback and

scalable production planning; and

• improved reliability with functional builds that reflect

true end-use conditions.

The company’s vertically integrated systems, AI-enhanced

AmtechOS platform, and real-time process control

tools further support a smooth transition from

prototype to full production, ultimately helping customers

avoid delays, surprises, and unnecessary expense.

www.buildamtech.com

&

VISIT US

Source: Amtech Electrocircuits

Scalable production

planning across highmix,

high-complexity

sectors.

EPP Europe » 11 | 2025 31


Shaping the future of stencil printing technology

Sustainable stencil underside

cleaning

As part of comparative testing, Panasonic and Indium Corporation explored opportunities

for reducing cleaning materials, specifically paper and liquid cleaner. The demands in

manufacturing are rising, and addressing topics such as sustainability, cost savings, and

automation requires creative thinking.

» Siegfried Lorenz, Indium Corporation, and Andreas Prusak, Panasonic Factory Solutions Europe

The collaboration underscores the importance of effective stencil underside cleaning

during operation.

Source: Indium Corporation/Panasonic

Panasonic’s Paper-free Wiping Unit, developed

for the company’s stencil printers, innovatively

uses multi aligned blades instead of traditional

cleaning paper. New possibilities emerge when the

unit is combined with Indium Corporation’s Indium8.9HFRV

high-performance solder paste.

The miniaturization of components and electronics

continues to progress. To ensure optimal and reproducible

printing results, a clean stencil during operation

is crucial. To meet these challenges on the materials

side, solder paste is becoming increasingly

fine. The solder paste used for the DoE (Design of Experiments)

was type 5, with a powder size between

15 and 25 µm. Indium Corporation also produces

powders up to type 8.

The Paper-free Wiping Unit integrates seamlessly

into manufacturing environments, allowing customers

to meet the growing demands of miniaturized

electronics. The unit features a patented cleaning

mechanism that effectively removes residual solder

paste and debris from the stencil underside without

the use of consumable paper. By combining a vacuum-assisted

cleaning head and a solvent application

system, the unit achieves reliable cleanliness

even for challenging stencils, such as those with

fine-pitch apertures or step-down designs. This solution

not only supports sustainability goals but also

reduces maintenance requirements, enhancing operational

efficiency. Stencil printers equipped with this

unit are designed for easy integration into Smart

Factory setups, ensuring compatibility with Industry

4.0 standards.

During the DoE, the companies’ engineers used a

demo board with various pads at Panasonic’s facility

in Ottobrunn to reflect the components and apertures

typically used by customers. The 100 µm stencil,

which included a step-down to 80 µm, posed no

challenges. Additionally, apertures with an area ratio

of 0.58 were implemented in the stencil and successfully

printed, demonstrating the excellent transfer

efficiency of Indium8.9HFRV.

Superior printing performance

Engineered for advanced applications, the solder

paste offers superior printing performance and reliability.

It features an enhanced flux system that ensures

excellent wetting properties and consistent

transfer efficiency, even for apertures with area ratios

below 0.66. It delivers stable performance across

a wide range of printing conditions, reducing the

need for frequent process adjustments. The paste’s

low voiding characteristics and high oxidation resistance

make it an ideal choice for modern electronic

assemblies.

Following the setup of the stencil printer, all relevant

parameters were measured using a Koh Young

SPI, both for cleaning with paper and liquid cleaner

and with the Paper-free Wiping Unit. Cleaning was

performed at the start and after every third board.

Transfer efficiency, which indicates the volume of

solder paste transferred as a percentage, was used as

32 EPP Europe » 11 | 2025


an indicator of stencil underside cleanliness. The only

variable during the DoE was the cleaning unit. The

data shows minimal differences in printing performance,

which can be attributed to the proven performance

of Indium8.9HFRV. As a result, costs for

cleaning paper and liquid cleaner are reduced. In a

24-hour operation, the consumption amounts to 13

km/year if the cycle time per PCB is 30 seconds and

cleaning occurs after every three cycles.

Additionally, time savings were observed. While a

paper cleaning cycle takes around 25 seconds, paperless

cleaning is approximately 10 seconds faster

per cycle, increasing output by approximately 9%.

This calculation does not account for the time saved

by avoiding paper roll changes, which also eliminates

potential sources of error.

Panasonic’s engineers also note that the unit contributes

to a cleaner working environment by eliminating

the need to handle used cleaning paper rolls,

which often contain solder paste residues. This innovation

not only minimizes waste but also enhances

operator safety by reducing direct exposure to cleaning

solvents. Furthermore, the company has integrated

advanced monitoring capabilities into its

stencil printers, enabling real-time tracking of cleaning

performance and system diagnostics. These features

ensure consistent quality and provide valuable

insights for process optimization.

The solder paste further complements these advancements

with its environmental credentials.

Being formulated with halogen-free flux, it meets

stringent environmental regulations without

compromising performance. Its compatibility

with various cleaning methods underscores its

versatility and adaptability to evolving manufacturing

needs.

The test results highlight the importance of

effective stencil underside cleaning during operation.

The combination of Indium Corporation’s

Indium8.9HFRV solder paste with Panasonic‘s

Paper-free Wiping Unit is not only sustainable

but also facilitates further automation, eliminating

error-prone aspects of paper-based cleaning

systems and setting a new standard for stencil printing

processes.

www.indium.com

Indium8.9HFRV

solder paste.

Source: Indium Corporation

Visit us in Munich!

SEMICON: B1.213

productronica: A2.377

EPP Europe » 11 | 2025 33

Source: Mitsubishi Electric Europe

AI implementation in sustainable strategies.

A year of practical implementation and sustainable solutions

AI manufacturing trends in 2025

Despite the ongoing artificial intelligence (AI) revolution and widespread publications

of AI advancements, experts emphasize that implementation in manufacturing remains

remarkably limited. Jacek Smoluch, automation expert at Mitsubishi Electric, commented:

“When we look at the global manufacturing landscape, only about one in a

thousand facilities have successfully implemented advanced AI solutions.” This stark

reality highlights the significant gap between AI’s potential and its current practical

adoption in manufacturing.

Last year marked a turning point in manufacturing

automation, though experts emphasize that

digital transformation remains a marathon rather

than a sprint. “People often overestimate what can

be achieved in one year and underestimate what can

be achieved in a decade,” noted Smoluch. This perspective

is particularly relevant given the limited

penetration of AI technologies in global manufacturing

operations.

Expensive electricity helps

practical sustainability

Rising energy costs is one of the main reasons for

transforming sustainability from a marketing initiative

into a business imperative. “Energy efficiency is

no longer just about green marketing,” explained

Smoluch. “With electricity prices reaching unprecedented

levels, optimization of energy consumption

has become crucial for maintaining profitability.”

34 EPP Europe » 11 | 2025


This led to increased implementation of AI-driven

energy management systems, focusing on actual

cost savings rather than greenwashing campaigns.

Supply chain disruptions boost

local sourcing

Global supply chain disruptions, particularly affecting

deliveries from Asian countries, drove a significant

trend towards local sourcing. This shift not only

improved supply chain reliability but also resulted in

reduced environmental impact through shorter

transportation routes and decreased reliance on

long-haul shipping. The trend represents a practical

approach to sustainability, where environmental

benefits align naturally with business needs.

Real-time vs. scheduled

maintenance

2024 saw significant advancement in AI-driven

maintenance systems. These solutions now analyze

real-time equipment data to predict failures and optimize

performance. “We can now use AI to recommend

specific actions, like reducing a robot‘s speed

to 70%, extending its operational life while maintaining

production efficiency,” Smoluch pointed out.

This trend marks a shift from scheduled to predictive

maintenance, reducing downtime and extending

equipment lifespan.

Shifting from scheduled to on-demand maintenance

eliminates the removal and replacment of perfect

parts just to mitigate downtime risks. Predictive

maintenance not only allows the prolonged life of

perfectly good parts but also indicates maintenance

of parts that wore off sooner than expected.

Fear of AI replacing people

continues

The integration of AI systems sparked a notable trend

in workforce development. Rather than wholesale replacement

of human workers, successful implementations

focused on task reallocation and upskilling.

However, this trend revealed challenges, as not all

workers embraced retraining opportunities, highlighting

the need for careful change management in

digital transformation.

We must admit that implementing AI can lead to

human work replacement, yet this is an ongoing feature

of any industrial revolution. After all, engines,

electricity and computers have had the same effect

historically, yet no one can imagine life without

them anymore.

Digital transformation remains a marathon rather than a sprint.

Progress through real-time data

While still limited to a small percentage of facilities,

AI-driven real-time optimization emerged as a significant

trend. These systems can adjust production

parameters instantly, improving efficiency and reducing

waste. This represents a shift from traditional

data collection and analysis to immediate, automated

data-driven response systems.

2025: a year of AI?

The manufacturing sector is responding to these

trends, though implementation rates vary significantly

across regions and industries. “Success in AI

implementation comes from taking measured steps

and building solid foundations,” Smoluch said, adding:

“The key is understanding that this is a journey,

not a destination.”

The convergence of AI trends—practical sustainability,

supply chain localization, AI-driven optimization,

and workforce transformation—is reshaping

manufacturing operations. While only a fraction of

facilities currently leverages advanced AI solutions,

the practical benefits demonstrated in 2024 will

likely accelerate adoption rates in the coming years,

particularly as energy costs and supply chain reliability

remain critical business concerns.

www.mitsubishielectric.com/

Source: Mikhail Nilov/Pexels

EPP Europe » 11 | 2025 35

» PCB & ASSEMBLY

Cutting-edge cyclic nucleation technology

Elevating high-purity cleaning

A milestone in high-purity cleaning has been reached with the addition of a

state-of-the-art Vacuum Cyclic Nucleation System at KYZEN’s North American

Application Lab, in partnership with LPW.

Source: KYZEN

Jason Schwartz of KYZEN (left), and Gerhard Koblenzer, CEO of LPW.

High-purity cleaning demands stringent control

over particulates, organic residues, and surface

finishes. It is critical in industries such as semiconductors,

high-end optics, aerospace, and medical

manufacturing. While most associate “high purity”

with alcohol or filtered water, the advanced cleaning

solutions specialist takes it far beyond everyday

standards, achieving microscopic precision.

“As one of the few facilities worldwide—and the

only one in North America—with a production-scale

cyclic nucleation system, we are uniquely positioned

to solve high-stakes cleaning challenges,” commented

Jason Schwartz, the company‘s Global Product

Line Manager of Evolving and Growing Technologies.

“Our chemists and technicians now have an

unparalleled platform to innovate, experiment, and

deliver results that meet the most rigorous requirements.”

“For the LPW team, KYZEN is an important and

trusted partner for manufacturing companies,”

added Gerhard Koblenzer, CEO of LPW Reinigungssysteme.

“We have intensively exchanged ideas with

[the company’s] technicians over the past few years

and successfully implemented projects using the

cyclic nucleation process.”

System advantages and market impact:

• Breakthrough capability: Tackles cleaning tasks

considered impossible by traditional methods, especially

for parts with complex geometries and

trapped contaminants.

• Versatile applications: Supports key sectors including

medical, aerospace, additive manufacturing,

and remanufacturing.

• Dual functionality: Doubles as a rotary basket

washer, expanding in-lab flexibility.

The company’s leadership in high-purity cleaning is

reinforced by its Global Application Labs, which are

equipped with some of the most versatile and advanced

cleaning systems in the world. The integration

of the cyclic nucleation system exemplifies

how the company turns innovation into real-world

solutions for demanding cleaning challenges.

www.kyzen.com

36 EPP Europe » 11 | 2025

SPECIAL

» PACKAGING

As semiconductor devices shrink and integrate more functions,

packaging becomes increasingly complex. 3D integration,

multilayer interconnects, and fragile structures require

precise in-line control.

Next Gen X-Ray

Inspection for

Advanced Packaging

» Page 38

How geopolitics is

redirecting chip

investment

» Page 40

GENESIS project to

advance chip

sustainability

» Page 42

Compact packaging

system integrates quality

control

» Page 44

Source: Comet Yxlon

EPP Europe » 11 | 2025 37

» ADVANCED PACKAGING

SPECIAL PRODUCTRONICA

Next generation strategies for semiconductor manufacturing

Next Gen X-Ray Inspection for

Advanced Packaging

Semiconductor manufacturers are facing escalating demand, rising costs, and mounting

complexity in a competitive landscape where even marginal yield improvements can

have significant impact on profitability and time-to-market. The intricate designs of

modern chips present challenges not only in their manufacture but also in managing

the elevated material expenses associated with these layered structures.

» Jeannine Memminger-Adamski, and Kristof Hormann, Comet Yxlon

To stay ahead, manufacturers must implement

comprehensive inspection strategies that enhance

yield, reduce costly defects and expedite timeto-market.

A crucial element of these strategies is

the early detection of defects throughout critical

production phases, such as wafer processing or chip

level packaging. Swift identification and resolution

of issues enable manufacturers to ramp up production,

and advanced inspection technologies, notably

3D and 2.5D X-ray inspection, play a vital role in

achieving these objectives.

3D X-ray, from lab to fab

Source: Comet Yxlon

A reconstructed 3D image taken from a

wafer sample designed for Comet Yxlon by

Fraunhofer IZM-ASSID with TSVs manufactured

to contain clear voids for illustrative

purposes. TSVs shown are 10 µm in diameter.

Visualized with Dragonfly 3D World.

The introduction of the CA20 by Comet in 2023

marked a significant leap forward in demonstrating

the viability of 3D X-ray technology for semiconductor

inspection. Bridging the gap between the speed

of optical inspection and the detailed analysis provided

by traditional FIB SEM, high-resolution 3D volumes

can be captured in minutes, enabling manufacturers

to measure and view bumps from all angles

and identify critical defects such as voids, non-wet,

head-in-pillow, or bump shift, and determining

stand-off height to monitor die tilt or warping. In

2024, the launch of the next-generation CA20

brought this progressive technology to the production

line. Featuring an EFEM loader and Automatic

Defect Recognition (ADR) software powered by

Dragonfly, the next-generation CA20 offers seamless

integration (complaint to SECS/GEM standards) and

insights that can be fed directly back into the production

process.

This year, the CA20 has been further enhanced to

cater to wafer inspection applications, featuring crucial

design adaptations to ensure the system can

safely handle delicate wafers and comply with strict

cleanroom standards of up to ISO Class 1 (within the

interior cabinet). With this latest release, the company

has expanded its inspection portfolio to cover

the entire manufacturing chain, from wafer processing

to packaged chips.

3D to 2.5D –TSV inspection

As packaging design moves into a three-dimensional

space, the silicon interposer serves as an important

pathway connecting functional layers. Through-Silicon

Vias (TSVs) are tiny channels drilled in the interposer

and typically filled with copper to establish

electrical connections between bump layers. They

can develop voids during the filling process, reducing

electrical and thermal efficiency and potentially

leading to defective connections. A single wafer can

contain thousands or even millions of TSVs, tightly

packed together and nearly identical in size and

38 EPP Europe » 11 | 2025

Source: Comet Yxlon

Screenshot showing a

wafer sample using TSV

Insights X software

showcasing the 2.5D scan

before segmentation has

been performed.

shape. Segmenting the individual elements and determining

their position on the wafer in a consistent,

reliable and efficient manner presents a significant

challenge. While 3D X-ray inspection offers a full

360 ° view, perfect for the inspection of overlapping

structures, for simpler TSV structures a 2.5D method

can be beneficial. In this method, a 2D image is captured

in several positions at a specific angle that retains

sufficient depth information. This helps to determine

positioning, requires less contrast to visualize

any voids, and significantly reduces scan time

while still presenting a statistically relevant picture

of the entire wafer.

Example workflow: TSV Insights

X 2.5D

This breakthrough in wafer inspection was driven by

developments in the company’s AI-powered software,

DirectInspect, and TSV Insights X 2.5D. This

software package automatically segments the individual

TSVs within the acquired X-ray images, captures

critical metrological data, identifies voids and

provides a classification based on pre-defined limits,

all in machine-readable form for rapid process optimization.

Users can choose a pre-trained neural network to

automatically segment TSVs and voids. For unusual

cases, the model can be optimized further to a specific

wafer design to achieve the desired accuracy.

Whether the system uses a generic or specialized

model, the overall analysis is fast and ready for inline

production use.

During inspection, the wafer is scanned across

multiple key positions, and segmentation is performed

on the acquired images to separate the TSVs and

any identifiable voids. The software automatically

gathers several measurements, such as length, width,

diameter and quantity. Finally, based on these

measurements and given limits, failure rates are calculated.

This information is compiled in a report and

shared directly with the host system, before the next

wafer is automatically inspected.

Key takeaways:

Steady advancements in 3D and 2D X-ray technology

have the potential to revolutionize semiconductor

manufacturing inspection strategies. With a focus on

automation and software-powered insights, X-ray

can now be applied across the complete manufacturing

chain, from wafer to finished chip. The latest

systems, such as the CA20, are fully compliant with

modern industry standards for cleanrooms and production-line

integration. This ensures a seamless setup,

and AI-powered software plays a pivotal role in

enhancing visual quality and automating classification

and even decision-making.

Comet Yxlon will be exhibiting its X-ray inspection

solutions for advanced packaging at SEMICON Europa

2025. The event is taking place from November

18–21, alongside productronica 2025, in Munich,

Germany. The company is exhibiting in Hall C2, at

Booth 513.

yxlon.comet.tech/de

Screenshot from TSV

Insights X software

after segmentation,

with TSVs (yellow) and

voids (red).

Source: Comet Yxlon

EPP Europe » 11 | 2025 39

» PACKAGING

The de-globalization of semiconductor production

How geopolitics is redirecting

chip investment

Geopolitical tensions are redirecting global investments in advanced semiconductor

technologies, reshaping the semiconductor supply chain in pursuit of technological sovereignty.

Source: Jimmy Liao/Pexels

The vast majority of the world’s most advanced

silicon chips are manufactured in Taiwan by a

single company, Taiwan Semiconductor Manufacturing

Company (TSMC). These chips power everything

from data centers to smartphones; however, Taiwan’s

central role has become a geopolitical vulnerability.

In response, governments and corporations have

launched a sweeping wave of reshoring efforts. In

the US alone, over $480 billion in semiconductor-re-

The majority of advanced silicon chips are manufactured in Taiwan and the country

is seeking to reinforce its position through strategic regulation.

lated investments were announced between 2024

and 2025. These investments are strategically positioned

to develop capabilities across advanced silicon

nodes, high-bandwidth memory (HBM), advanced

semiconductor packaging, and silicon

photonics, all critical to the AI era. Across Europe,

the EU Chips Act is catalyzing local semiconductor

ecosystems. In Japan, TSMC’s Kumamoto fab (via

JASM) has begun production, and a second, more advanced

fab is under construction. South Korea continues

expanding its HBM and logic production with

strong state backing.

Meanwhile, Taiwan is reinforcing its leadership in

advanced semiconductor technologies through strategic

regulation. In March 2025, the National Development

Council confirmed that TSMC’s overseas fabs

are subject to the “N-1” rule, which prohibits companies

from transferring their most advanced process

nodes abroad. TSMC continues to invest heavily at

home, building seven new facilities in 2025, including

six fabs and one advanced packaging plant in

Taiwan. 2 nm production will increase in the second

half of 2025, and 3 nm output is set to grow by 60%.

The company projects AI-related wafer shipments

will be 12 times higher than in 2021.

Rethinking supply chains

While these investments may enhance national capabilities,

they also fundamentally reconfigure the

global semiconductor supply chain. Today’s semiconductor

ecosystem, particularly for AI chips, is deeply

rooted in East Asia, with Taiwan at the center, not

only for wafer fabrication but also for advanced

packaging, testing, and final assembly. Manufacturing

a chip with an advanced node is only the first

step; without co-locating downstream processes, it

makes little economic sense to fabricate in the US

only to ship wafers back to Taiwan for packaging.

Building a fab that manufactures advanced nodes

already costs a fortune, and replicating the entire

supporting ecosystem costs substantially more.

TSMC’s Arizona project illustrates this complexity: to

make it operate effectively, TSMC had to rebuild

much of its supply chain from Taiwan to the US.

This kind of transition inevitably drives up the cost of

advanced chips, and only wealthy nations with

strong political and financial backing can afford to

play.

Meanwhile, the once-global semiconductor ecosystem

is fracturing into regionally anchored supply

networks, where national security instead of cost-efficiency

increasingly shapes location strategy. The

de-globalization of chip production isn’t just a reaction

to geopolitical risk; it reflects a deeper structural

realignment. In this new era, semiconductors

are no longer defined solely by performance; they

have become instruments of sovereignty, security,

and strategic leverage.

www.IDTechEx.com

40 EPP Europe » 11 | 2025

MEET THE WORLD’S

SMARTEST PLATFORM.

SMART. MODULAR. POWERFUL.

Electronics

manufacturing in the AI

era requires a smarter

platform. One that

responds faster, readily

adapts, and maximizes

productivity.

Introducing EPIQx:

the next-generation

high-speed SMT platform

poised to revolutionize

electronics manufacturing

by fusing data-driven

intelligence and breakthrough modularity in a compact,

high-performance package.

• Intelligence: With a network of sensors integrated within its

subsystems, EPIQx leverages data at the device level to deliver

intelligence at the machine, line and factory level.

• Modularity: Dual carriage arrays hold 20 MicroModules with

two independently controlled spindles each. Quick-swap modules

configure in less than five minutes; self-calibrating, self-ID.

• Performance: Places 008004 to 8mm square components at >90K cph;

<25μm accuracy with no derate; Highest feeder density, 128 inputs.

GLOBAL DEBUT

11.18.25

HALL A1

B522

uic.com

EPIQx is more than a platform. It’s the high-IQ foundation for the lights-out factory

of the future, leveraging data to learn, adapt and drive improvement.

Bold and transformative… EPIQx is intelligently designed for the future.

©2025 Universal Instruments Corporation. All rights reserved. All specifications are subject to change.

EPP Europe » 11 | 2025 41

PACKAGING » Product Updates

European semiconductor manufacturing

GENESIS project to advance

chip sustainability

A pan-European consortium has announced the launch of ‘GENerate in Europe a Sustainable

Industry for Semiconductor’ (GENESIS). This integrated, large-scale initiative aims to

enable Europe’s chip industry to meet its sustainability goals, which include reducing

emissions and minimizing waste.

The three-year project brings together 58 partners from the European semiconductor value chain.

Coordinated by CEA-Leti, the threeyear

project brings together 58

partners spanning the entire European

semiconductor value chain, from large

enterprises and subject matter experts

(SMEs) to research institutes, universities,

and industry associations. GENESIS will

drive innovative solutions in emission

control, eco-friendly materials such as alternatives

to per- and polyfluoroalkyl

substances (PFAS), waste minimization,

and raw material reuse, directly aligned

with the European Green Deal and European

Chips Act.

Laurent Pain, Sustainable Electronics

Program Director at CEA-LETI, and Coordinator

of the GENESIS project, commented:

“GENESIS partners are committed

to fruitful and constructive collaboration

throughout the duration of the

project to deliver lasting impact on the

European semiconductor ecosystem.”

SEMI Europe will oversee the dissemination

of communication and promotion

of activities to raise awareness and

understanding of the importance of sustainable

semiconductor manufacturing

technologies across both industry and

academia.

“The European semiconductor industry

recognizes the urgency of seeking alternatives

to substances of high concern,

and reducing greenhouse gas emissions,”

said Laith Altimime, President of SEMI

Europe. “With demand rising, the European

Commission’s funding of crucial initiatives

such as GENESIS drives sustainable

innovative solutions,” Altimime

added. The GENESIS consortium will

focus on scientific research to facilitate

Source: GENESIS

the industry’s transition toward sustainable

manufacturing. Additionally, the

initiative will deliver added value through

knowledge sharing, job creation, and

positive socioeconomic impacts across

the European regions represented by project

partners.

Pain noted that the GENESIS project

team expects to deliver approximately 45

sustainability-driven innovations covering

the semiconductor lifecycle, guided

by the following four strategic pillars:

• Monitoring and Sensing: Real-time

emissions tracking, traceability, and

process feedback systems;

• New Materials: PFAS-free chemistries

and low-GWP alternatives for advanced

semiconductor processes;

• Waste Minimization: Innovations in recycling

(solvent, gas, slurries), reuse,

and sustainable replacements: and

• Critical Raw Materials Mitigation:

Strategies to reduce dependency on

CRM and strengthen resource security.

Complimenting these pillars, the project’s

objectives establish an overall framework

that includes deploying sensor-integrated

abatement systems to reduce PFAS and

greenhouse gas emissions. It also aims to

position Europe as a leader in green semiconductor

innovation by aligning supplychain

practices with environmental regulations.

With a budget of close to €55 million,

the project is co-funded through the

Chips Joint Undertaking by the European

Commission, participating EU member

states, and the Swiss State Secretariat for

Education, Research and Innovation.

www.genesiseu.eu

42 EPP Europe » 11 | 2025

Product Updates « PACKAGING

Next-generation software

Enhanced efficiency and control

RECIF Technologies has announced the

launch of R.PACK, a next-generation software

suite designed for RECIF sorters.

With an emphasis on usability, efficiency,

and innovation, R.PACK introduces a suite

of advanced features aimed at simplifying

the management of wafer sorting equipment.

The suite enhances operational efficiency

for users of the company’s COMPACT and

SMART sorters, featuring advanced capabilities

and a modern interface designed

to streamline wafer sorting processes.

The key features include:

• Refined user interface, its design making

it easier to create recipes and

monitor jobs, ensuring smoother operations

and increased productivity;

• seamless transition, providing current

users with minimal disruption when

transitioning to the new suite, owing

to an intuitive interface that simplifies

adoption; and

• ongoing software enhancements: built

on a forward-compatible framework,

the suite will have updates released

annually to deliver new features and

performance improvements. The first

major update was rolled out in early

2025 and the next release is scheduled

for the first quarter of 2026.

Commitment to innovation

and user experience

The release of the software reinforces the

company’s commitment to providing highperformance

solutions for the semiconductor

industry. By focusing on a more intuitive

and efficient wafer sorting process,

the software is the first in a series of improvements

designed to elevate both the

user experience and operational efficiency.

Source: RECIF Technologies

Delivering advanced solutions for wafer sorting

and related technologies.

“We believe R.PACK will significantly enhance

our customers’ workflows and

performance,” said Thomas Brillouet,

R&D Manager at the company. He

added: “By providing enhanced features

and a modernized interface, we empower

our customers with tools that

maximize safety, enhance efficiency, and

optimize equipment performance with

minimal effort.”

www.reciftech.com

SOLDER BALL PLACEMENT & LASER SOLDERING

3D-Soldering Solder Stacking Wire Soldering BGA Soldering

WE MANUFACTURE

EQUIPMENT

FOR YOUR NEEDS

Pre-Soldering of

SMD Connector

Elements

Lid Sealing for

Connectors &

IR-Sensors

Flex to Chip

Soldering

Through Hole

Soldering

LASER ASSISTED BONDING (LAB, LCB, LAR)

3D Multi Layer

Stacked Packaging

Optoelectronic

Device Assembly

CPU on Interposer

Assembly

SMD Capacitor

Assembly

SOLDER REWORK & CHIP REPAIR

BGA

Rework

Interconnects of

Camera Module

BGA Package Assembly

onto Substrate

Flex to Flex

Seperation

EPP www.pactech.com

Europe » 11 | 2025 43

sales@pactech.de

» PACKAGING

Closing automation gaps in semiconductor manufacturing

Compact packaging system

integrates quality controls

Semiconductors are essential for electronic components and increasing digitalization,

expanding data centers and the evolution of AI are just some of the factors accelerating

demand. Due to their importance for many industries, they are also at the center of

geopolitical changes. If European manufacturers want to keep up with global competition,

they need to make production processes more efficient and minimize sources of

error. Automation is a key factor here.

Source: cts Group

A compact bagging tool with integrated inspection and labeling technology for FOSBs and FOUPs.

Currently, semi-automated systems

that require manual support are still

widely used in semiconductor factories,

and this has consequences: Gaps in automation

lead to efficiency losses and increase

the error rate, in an industry that

has little tolerance for either due to high

quality requirements, sensitive materials

and tight schedules. A central and particularly

critical step in this respect is the

packaging of wafers for transportation, as

it is crucial for the integrity of the products.

With the ABT (Auto Bagging Tool),

the German expert for process automation

and production automation cts

offers a compact and flexible solution

that fully automates packaging and combines

it with precise inspection and labeling

technology: from identification and

leak testing to documented labeling.

Adaptable to different

carriers

“The ABT system is highly adaptable and

therefore suitable for FOSBs, FOUPs or

other carriers such as wafer boxes, SFS or

HWS,” explained Alfred Pammer, VP

Sales/Marketing/Product Management at

the company. “Up to 570 FOSBs per day

can be packaged thanks to minimal cycle

times.” The result is safe, quality-tested

and reproducible packaging in accord-

ance with individual production standards.

Errors that potentially occur during

manual packaging and lead to rework, rejects

or production downtime and cause

considerable additional costs can be

avoided by using the ABT. The safe packaging

also minimizes the risk of damage

or contamination during transport. “The

ABT system can be seamlessly synchronized

with existing host systems without

major adjustments. Using SECS/GEM, it

communicates directly with the respective

system and automatically transfers all

inspection results, labeling data and container

IDs,“ explained Pammer. “Remote

image and video monitoring also take the

strain off the operators and enable 100%

traceability,” he added.

Four steps to the fully

packaged FOSB or FOUP

With the ABT, the packaging process consists

of four steps: The first step includes

identification and slot verification. FOSBs

or FOUPs are individually identified via

RFID. Using integrated cross-slot checks,

the system automatically detects incorrect

assignments or slot overlaps. This

prevents misplacements and protects

process stability.

The next step is the automated, 100%

leak testing and inspection. Here, each

packaging unit is checked on a productspecific

basis. Leaks are detected and

automatically sorted out, including digital

documentation. This ensures that only securely

sealed FOSBs or FOUPS are dis-

44 EPP Europe » 11 | 2025

PACKAGING «

Source: cts Group

patched. Next comes the labeling and setting

up traceability. In this third step, all

packaging units automatically receive a

tamper-proof label with a serial number,

time stamp and test result in compliance

with cleanroom requirements. Container

movements can be tracked via SECS/GEM.

All information is stored digitally and is

available for MES, ERP or auditing.

After passing the test, the unit is packaged

in a standardized, cleanroom-compatible

and automated manner in a final

step. The transfer to downstream processes

can be carried out manually, but

also via AMR or fully integrated into an

existing line. All required information can

be passed on to downstream systems by

means of the handshake principle.

A compact, flexible and

modular system

“The ABT is a proven tool that offers

wafer fabs a fully closed, digitally integrated

process for packaging FOSBs and

FOUPs,” said Pammer. “At 6 x 5 meters, it

is the most compact bagging tool with

integrated quality controls for FOSBs and

FOUPs in the market and the only one

that combines leak testing and label inspection

in this form.” By reducing errors

and thus complaints as well as increasing

efficiency, it allows companies to stay

competitive in a challenging market and

reduce their costs in the long term. The

ABT is flexible and can be quickly adapted

The packaging system is suitable for FOSBs, FOUPs or other carriers.

to changing market conditions in semiconductor

production without the need

for fundamental new investments. The

modular design enables individual scalability

as required: for example, the system

can also be used solely for the fully

automated packaging process without a

quality check. If, on the other hand, more

automation is desired, the ABT can be

connected directly to one of the smart

warehouse solutions from the cts portfolio,

eliminating the need for manual intervention

when handling FOSBs or

FOUPs.

Smart Warehouse

The Smart Warehouse family features two

scalable solutions developed for semiconductor

manufacturing:

The Smart Warehouse / Mini is a compact,

cleanroom-compatible system for

automated storage and retrieval of sensitive

materials such as FOSBs, FOUPs and

wafer boxes. It supports real-time tracking,

fast storage and retrieval and helps

to optimize the limited space in the

cleanroom near the process equipment.

The Smart Warehouse / Big supports

upstream and downstream logistics: for

example, the storage of packaging materials,

carriers, process containers and

even packaged FOSBs/FOUPs after they

leave the cleanroom. Additionally, it

offers high capacity and enables fully

automated storage outside the cleanroom

Source: cts Group

Integrated inspection and labeling technology

for FOSBs and FOUPs.

as well as a seamless material flow between

the factory, backend and logistics

zones.

“The Smart Warehouses require up to

40% less space than other solutions and

create more storage capacity without additional

storage areas,” Pammer explained.

“In addition, the high degree of

automation in storage and delivery translates

to process stability and precise, fast

material supply. The seamless integration

with AMRs from Omron, Agilox, MiR and

other manufacturers also contributes to

this efficient material transfer.” The

Smart Warehouses are also fully scalable

in terms of capacity and functionality.

Consequently, the initial investment can

be kept low with a “small” system that

can easily be expanded as needed to meet

fluctuations in demand and higher production

requirements.

The combination of ABT and Smart

Warehouse in wafer fabs aims to provide

a fully automated logistics process from

packaging to delivery.

www.group-cts.com

EPP Europe » 11 | 2025 45

» TEST & QUALITY ASSURANCE

Source: STMicroelectronics

300 mm wafers ensure high precision and performance in optical applications.

Redefining the sensing ecosystem

Partnership to accelerate

metasurface optics adoption

A new license agreement is set to enable the proliferation of metasurface optics across

high-volume consumer, automotive and industrial markets: from smartphone applications like

biometrics, LIDAR and camera assist, to robotics, gesture recognition, or object detection.

The agreement, signed between STMicroelectronics

and Metalenz, broadens the former’s capability

to use Metalenz’s intellectual property to

produce advanced metasurface optics while leveraging

its own unique technology and manufacturing

platform combining 300 mm semiconductor and optics

production, test and qualification.

“Since 2022, we have shipped well over 140 million

metasurface optics and FlightSense modules

using Metalenz IP. The new license agreement

bolsters our technology leadership in consumer, industrial

and automotive segments, and will enable

new opportunities,” commented Alexandre Balmefrezol,

Executive Vice President and General Manager

of STMicroelectronics’s Imaging Sub-Group. He

added: “Our unique model, processing optical technology

in our 300 mm semiconductor fab, ensures

high precision, cost-effectiveness, and scalability to

meet the requests of our customers for high-volume,

complex applications.”

Rob Devlin, co-founder and CEO of Metalenz, commented:

“Our agreement has the potential to further

fast-track the adoption of metasurfaces from their

origins at Harvard to adoption by market leading

consumer electronics companies.” He added: “By enabling

the shift of optics production into semiconductor

manufacturing, this agreement has the possibility

to further redefine the sensing ecosystem.”

The new license agreement aims to address the

growing market opportunity for metasurface optics,

which is projected to experience significant growth

to reach $2B by 2029; largely driven by the industry’s

role in emerging display and imaging applications. In

2022, metasurface technology from Metalenz, which

spun out of Harvard and holds the exclusive license

rights to the foundational Harvard metasurface patent

portfolio, debuted with ST’s market leading direct

Time-of-Flight (dToF) FlightSense modules.

Replacing the traditional lens stacks and shifting

to metasurface optics has improved the optical performance

and temperature stability of the Flight-

Sense modules while reducing their size and complexity.

The use of 300 mm wafers ensures high precision

and performance in optical applications, as well as

the inherent scalability and robustness advantage of

semiconductor manufacturing process.

www.st.com/content

46 EPP Europe » 11 | 2025

TEST & QUALITY ASSURANCE «

When ultra-high resolution is needed

New kit available for fast-moving inspection

Famous chefs the world over maintain that an entrée

doesn’t make a great meal without side dishes. IN-

SPECTIS, a digital optical microscopes specialist, calls

those ‘sides’ an Advanced Kit. The company’s new

U50s Advanced Kit, paired with its Digital Microscope

U50s, presents a comprehensive solution. It includes

the U50s with a superior lens with 50x motorized

zoom, fast auto focus, and is powered by the

company’s Pro Utility and Metrology Software for

image capture, measurement, analysis and reporting.

Featuring a robust industrial design with long lasting

all-aluminum housing, the solution is the first Advanced

Kit to feature the newly improved and upgraded

version of the popular HD-128 XY floating

table.

The U50s Advanced Kit (HD-116) features:

• Inspectis U50s, Ultra HD 2160p 60fps Modular

Digital Inspection Microscope, x50 Zoom;

• Inspectis Track stand, Large Base with focusing

WD 35–410mm, ESD-Protected base;

• Inspectis XY Floating Board;

• Inspectis Magnetic pegs (4x kit);

• Inspectis RingLight White LED with detachable

diffuser; and

• Inspectis 4K USB3.2 Gen 2x2 Capture Pro with

INSPECTIS Pro software.

The company’s U50s digital camera microscope is a 4K

inspection system offering 60 FPS. It is designed for

applications where ultra-high resolution is needed for

fast-moving inspection or live working tasks.

www.inspect-is.com

The U50s digital

camera microscope is a

4K inspection system

offering 60 FPS.

Source: Inspectis AB

Higher levels of process control and reliability

Enhanced PCB cleaning capabilities

Source: Medco West Electronics

Medco West Electronics, a specialist in

electronic assemblies, has announced the

installation of a Typhoon T9 Aqueous Inline

Cleaning System at its facility. Made by

Aqua Klean Systems, the system enhances

the company’s PCB cleaning process, sup-

porting higher levels of quality, process

control and reliability for its customers

across medical, industrial, aerospace, and

other high-performance sectors.

The system is engineered for high-speed,

high-efficiency inline cleaning, having a

Peter Sowinski says that greater control over board cleanliness directly impacts reliability and

long-term performance.

compact footprint and powerful wash capability.

It is designed to remove flux residues

and other contaminants from complex

PCBs, ensuring compliance with IPC

standards and improving product reliability

for OEM customers.

Peter Sowinski, President of the company,

commented that the addition “gives us

even greater control over board cleanliness,

which directly impacts reliability

and long-term performance. It’s an important

part of our continuous improvement

strategy.”

With this investment, the company enhances

its ability to meet IPC and customer-specific

cleanliness standards,

while reducing water and energy consumption

thanks to the cleaner’s efficient

design. The system also supports traceability

and process monitoring to meet

today’s documentation and compliance

requirements.

www.medcowest.com

EPP Europe » 11 | 2025 47


Advanced inspection technology

New multi-camera automated solution

A leading test and inspection systems

provider for the electronics manufacturing

industry has introduced a new multicamera

AOI solution. Test Research, Inc.’s

AOI TR7500 SIII Ultra features advanced

inspection technology and delivers high

speed and precision for electronics manufacturing.

The solution features Multi-Angle Side

View inspection with four side-angled

cameras and one top camera for full

coverage defect detection. The side view

cameras allow the platform to inspect

inner layer bridges, hidden lifted leads,

and

other out-of-sight defects. The solution

also supports optional capabilities such

as AI-powered inspection, metrologygrade

measurements, and 3D laser imaging

to enhance accuracy and coverage.

Furthermore, it enhances mechanical performance

with Ballscrew Z-axis control

and an AC Servo Motion Controller. The

structural design has also been significantly

upgraded. Compared to its predecessor’s

welded steel frame, the new solution

is built on a vibration-resistant cast

iron base that provides superior rigidity

and inspection stability. The system supports

PCB weights up to 3 kg, with optional

configurations for 5 kg and 12 kg,

and supports current Smart Factory and

communication standards.

www.tri.com.tw/en/

A cost-effective, Industry 4.0-compliant

solution for comprehensive defect detection.

Source: Test Research, Inc.

Innovations in inline AOI and thickness measurement technology

Enhanced conformal coating quality

Axxon-Mycronic has announced a breakthrough

in automated optical inspection

(AOI) technology for conformal coating

with the introduction of its

Modus inline conformal coating

AOI system—CCAOI.

The CCAOI system, developed

by modus high-tech electronics,

delivers 100% inline

conformal coating inspection,

including precise coating

thickness measurement. This

powerful capability enables

electronics manufacturers to

monitor and control coating

coverage, keep-out zones,

thickness uniformity, and data

traceability with accuracy and

repeatability. Thanks to parallax-free

imaging and a fully

linearized and rectified image, the system

ensures reliable measurement results

even on complex geometries.

Source: Axxon-Mycronic

Combining accurate

fluid dispensing

with comprehensive

inline inspection

The CCAOI is available with two scanner

configurations, offering fields of view of

either 11.8 x 15.8 inches (300 x 400 mm)

or 16.5 x 20.8 inches (420 x 530 mm). It

supports full-surface coating thickness

measurement for coated areas starting

at 2 µm. Inspection cycle times are remarkably

short- with full-surface image

capture completed in just 25 seconds for

the maximum scan area of 16.5 x 20.8

inches.

Christian Vega, Product Manager at the

company, commented: “Customers are

under pressure to deliver higher quality

and traceability in demanding sectors

such as automotive, aerospace, and defense.

With CCAOI, we offer a true endto-end

conformal coating solution, combining

accurate fluid dispensing with

comprehensive inline inspection, including

3D coating thickness verification.“

One of the most advanced features of the

system is its ability to perform simultaneous

double-sided inspection (top and

bottom), enhancing throughput and inspection

completeness.

www.axxonauto.com

48 EPP Europe » 11 | 2025

TEST & QUALITY ASSURANCE «

Unified, scalable bench environment for debug and validation

Empowering test engineers across

the development lifecycle

Advantest Corporation has unveiled a new addition to its SiConic family. The SiConic TE offers

test engineers the ability to bring up and validate structural and functional tests over highspeed

I/O (HSIO) interfaces in a scalable bench environment, enabling earlier validation and

debug without occupying valuable ATE systems.

SiConic Link connects to standard

evaluation boards through functional

interfaces like USB, PCIe, control

interfaces, and GPIOs. This enables test

engineers to rapidly validate and debug

design verification (DV) and design for

test (DFT) content in SiConic’s unified environment

on the bench.

Building on the V93000 test system’s

leadership in scan over USB or PCIe, the

solution’s unified environment brings

native DV test content to test engineering

without the error-prone and lengthy conversion

and debug cycles typical for

bring-up of advanced functional tests on

ATE. Required for high-quality coverage

in verification and test, functional testing

enables a productivity boost for the

bench collaboration of DV, DFT and test

engineering.

Integrating seamlessly with SiConic

Link hardware and the SmarTest 8 software

platform, the solution provides users

with comprehensive access to functional

HSIO links for enhanced throughput and

rich trace capabilities during test execution.

By enabling smoother handoffs between

silicon validation (SV), DV and TE

teams, SiConic TE fosters tighter crossdomain

collaboration.

Test environment and

shared ecosystem

Through its unified test environment and

shared ecosystem, SiConic TE improves

the correlation between bench, ATE and

SLT systems. The tool’s optimized engineering

resources allow bring-up and

debug to be offloaded from ATE to the

bench, freeing up valuable tester capacity

and enabling more effective scaling. In

The growing complexity and scale of chips calls for new verification approaches.

addition, tight integration with leading

EDA partners enables cross-functional

collaboration with DV and DFT teams, improving

test content development and

speeding first-silicon success.

“[We are] expanding the SiConic vision

to empower test engineers in a unified

environment on the bench,” commented

Juergen Serrer, Chief Technology Officer

and Executive Vice President at the company.

“By moving bring-up and validation

to scalable bench environments—and

keeping DV, DFT, SV, and TE aligned

through a scalable ecosystem—we are

helping customers validate faster, collaborate

smarter, and maximize their engineering

resources.”

Advantest developed SiConic TE in

close collaboration with leading customers

and EDA partners to ensure seamless

integration into existing design and validation

flows.

“Siemens EDA and Advantest have a

long history of joint development on

many DFT technologies, including Tessent

Streaming Scan Network (SSN) and

IJTAG,” stated Ankur Gupta, Senior Vice

President and General Manager, Digital

Design Creation Platform, Siemens EDA,

Siemens Digital Industries Software. “Collaborating

on Advantest SiConic and Tessent

In-System Test strengthens this

long-running collaboration and helps to

provide our users with time-to-market

improvements and higher productivity.”

“As the scale and complexity of chips

continue to increase, new verification approaches

are needed to shift verification

cycles earlier and deliver silicon with

higher quality,” added Tom De Schutter,

Senior Vice President of Product Management

at Synopsys.

www.advantest.com

Source: Advantest Corporation

EPP Europe » 11 | 2025 49


ISO 13855:2024 and protective devices on machines

New guidelines

for sensor positioning

At the end of 2024, a revised ISO 13855 on positioning protective

devices was published. It reflects recent developments

and the current state of the art. Markus Erdorf, Senior Safety

Consultant at Leuze, outlines its impact on sensor positioning

and machine safety planning.

ISO 13855 has been a proven reference

for the design of protective devices for

more than a decade. Why was the revision

necessary?

Markus Erdorf: The last valid version

was published in 2010. That‘s a long time

in industrial automation, and a lot has

changed in the meantime. Today, we are

dealing with more flexible production systems,

more mobile robots and new operating

concepts. The previous standard could

only reflect this to a limited extent. We

also looked at the incidence of accidents

at work and derived normative consequences

from this. ISO 13855:2024 is

better suited to current technologies because

it provides more precise specifications

for the calculation of safety distances

and, accordingly, for the positioning

of protective devices. It also addresses

topics that were missing from the previous

standard and adjusts existing values.

What are the most important new features

of the new standard?

The calculation of the safety distance,

previously referred to as the minimum

distance, has been revised and extended

for the orthogonal, i.e. right-angled, approach

of a person. This allows the safety

distance to be determined more precisely.

Specifically, the range DDS, previously referred

to as safety distance C, is now determined

based on three criteria: reaching

over, reaching through and reaching

under the protective field. The DDU

Markus Erdorf,

Senior Safety

Consultant at

Leuze

Source: Leuze

(reaching under the detection zone) has

been added and the DDT (reaching

through the detection zone) has been extended

by a formula. For the parallel approach

of a person, the calculation has

been simplified by the use of flat-rate

values. The Z supplements, which result,

for example, from the measurement inaccuracy

of safety laser scanners or brake

wear on vehicles, have also now been included.

Another very interesting topic is

„distances to safety-related manual control

devices,“ referred to as SRMCDs in

the standards. The distances must now be

calculated to enable installation in a safe

position. The introduction of the dynamic

safety distance is intended for the future.

This makes it possible, for example, to dynamically

adjust the safety distance during

robot movements depending on external

conditions such as speed, braking

distance and direction of movement. It

has therefore become somewhat more

complex to calculate the safety distance.

On the one hand, this means more accuracy,

but on the other hand it also means

more responsibility for the users of the

standard.

You can read the entire interview at

https://epp-europe-news.com

ISSN 1618–5587

Trade journal for all fields of production in the

electronics industry, manufacturing equipment,

test and messurement, materials

Publisher:

Katja Kohlhammer

Publishing House:

Konradin-Verlag Robert Kohlhammer GmbH,

Ernst-Mey-Straße 8,

70771 Leinfelden-Echterdingen, Germany

General Manager:

Peter Dilger

Editor-in-Chief:

Frederick Rindle

Ernst-Mey-Straße 8

70771 Leinfelden-Echterdingen, Germany

Phone +49 711 7594–539

E-Mail: Frederick.Rindle@konradin.de

Editorial Assistant: Carmelina Weber,

Phone +49 711 7594 -257, Fax -1257,

E-Mail: carmelina.weber@konradin.de

Layout:

Helga Nass,

Phone +49 711 7594 -278

Advertising Manager:

Andreas Hugel,

Phone +49 711 7594 - 472,

E-Mail: andreas.hugel@konradin.de

Order processing:

Angelika Rottlaender,

Phone +49 711 7594 -316

E-Mail: angelika.rottlaender@konradin.de

Reader Service:

EPP und EPP Europe

Phone +49 711 7252–209,

E-Mail: konradinversand@zenit-presse.de

EPP and EPP Europe are published nine times a year, and

will only be supplied free of charge to qualified subscribers.

Non-qualifying individuals place subscriptions via bookshops

or the publish ing house. Annual subscription price Germany

€ 85,40, abroad € 85,40/98,00 CHF incl. post age.

Single copy: € 12,50 + post age. Unless ordered for a specific

period, a subscription continues until cancelled. You can

cancel your subscription for the first time by giving notice of

termination four weeks prior to the end of the subscription

year. After one year, the termination period is four weeks

prior to the end of each quarter. Prepaid subscription fees

will not be reimbursed for non-publication due to technical

reasons or force majeure. Reprint requires express previous

approval by the editor. Signed articles represent the views of

the author, not necessarily those of the editors. No responsibility

is accepted for unsolicited manuscripts and industry

reports.

Articles published in this magazine are protected by copyright.

All rights are expressly re served, in particular the right

of translation into foreign languages, and also of reproduction

in any form whatsoever, for example by photo copying,

microfilming or other processes, input to data proc essing

systems or dissemination by public speaking, radio or tel -

evision transmis sion, with the sole excep tion of the special

circum stances provided for in § 53 and 54 of the German

Copy right Act (UrhG).

All legal settlements in Stuttgart.

Print:

Konradin Druck GmbH

Kohlhammerstr. 1-15

70771 Leinfelden-Echterdingen

Printed in Germany

© 2025 by Konradin-Verlag Robert Kohlhammer GmbH,

Leinfelden-Echterdingen

50 EPP Europe » 11 | 2025

SAVE THE DATE

EMS Leadership Summit at APEX EXPO

Empower Your Team. Elevate Your Strategy.

Join EMS executives and emerging leaders for a full

day of powerful conversations, expert insights, and

peer-led discussions tailored to the challenges and

opportunities facing EMS businesses today.

• Engage in roundtables and expert panels

• Explore strategies for growth, technology

adoption & market navigation

• Participate in live market research and get

real-time insights

• Enjoy built-in networking over breakfast, lunch

& dinner

Don’t miss it — exclusively at APEX EXPO!

APEXEXPO.ORG | #APEXEXPO

EPP Europe » 11 | 2025 51

AI-Native. Future-proof by design.

Welcome to a new AOI & SPI world.

Delvitech systems are engineered with AI at their core, powered by neural

networks crafted to overcome the real-world challenges of electronics

manufacturing. Unlike traditional solutions, our machines dynamically

adapt to production variations, detecting defects with unmatched

precision, even on complex materials, from reflective metals to shadowed

zones, tall connectors, and fine-pitch elements.

One scalable platform, one brain. Ready for both AOI and SPI.

Swiss by design, intelligent by nature.

It’s not just innovation.

It’s a new species of machine.

Come visit us at

productronica 2025

November 18-21

Hall A2 Booth 329 & 227

Ж

↕

»

NN ●

tt

[

&

¤

*

&

{

52 EPP Europe » 11 | 2025

Swiss Precision Thinking.

Powered by AI.

Perfected by Design.

Contact us

delvi.tech

EPP Europe P2.2025

Transform your PDFs into Flipbooks and boost your revenue!

Delete template?

Save as template ?