Complete Program Book [PDF]

Sunday
Monday
Tuesday
Wednesday
Thursday
Friday
07:00-08:00 – Workshop and Short Course Breakfast
07:00-08:00 – Workshop and Short Course Breakfast
07:00-09:00 Attendee Continental Breakfast
07:00-09:00 Attendee Continental Breakfast
07:00-09:00 Attendee Continental Breakfast
07:00-08:00 – Workshop
and Short Course Breakfast
Saturday
Registration 4:00- 8:00
08:00 Full-Day and Morning Workshops and Short Courses 13:00 Afternoon Workshops
WSA: High Data Rate 60GHz Radio Link Applications & Design
WSB: Advances in Circuit Design for Wideband Millimeter Wave Applications
WSD: RF SoC interaction with peripherals and the demand for attention to coupling effects in early design phases
WSE: Advanced PLL architectures for embedded SoC applications
WSF: Medical Applications of RF and Microwaves WSC: Recent Advances in GaN HEMT Performance, Modeling, Linearity and Design Techniques
WSH: Measurements for Wireless System-Level Evaluation WSG: Analog-Digital Co-Design Techniques for Nanometer CMOS Transceiver SoC Integration
WSI: Adaptive Low-Power Front-Ends for Wireless Communication Systems WSJ: Advancements in Power Amplifiers and Transmitters for Mobile Wireless Products
WSK: Advances in High Power Devices and PA Architectures for Wireless Infrastructure
WSL: On-Chip Calibration, Compensation, and Filtering Techniques for Wireless SoC
WSM: Advanced CMOS based systems for biomedical applications
WSN: Low-Voltage RF Design in 45nm and Beyond
WSO: Getting Accurate Results with Nonlinear Circuit Analysis TSB: Noise In Linear Circuits
TSC: Advances in CAD Techniques for EM Modeling and Design Optimization
Registration 07:00- 8:00 • RFIC Plenary Session 7:30- 9:00 (GWCC Room A4 ab)
08:00 Full-Day and Morning Workshops and Short Courses 12:15-13:15 Panel 13:00 Afternoon Workshops
WMA: Highly Efficient Linear Power Transmitters for Wireless Applications based on Switching Mode Amplifiers
WMB: Enabling Technologies for Wireless Transceivers Beyond-3G
WMC: Challenges in Model-based HPA Design
WMD: Millimeter-Wave Power Amplifier Technology: Power, Linearity and Efficiency
WME: CMOS/SiGe-based Systems for mm-Wave Commercial Applications
WMF: Design and implementation techniques for multiband filters WMG: Miniaturization Techniques of RF and Microwave Filters
WMH: Advances in Reconfigurable Microwave Technologies for Wireless Communication and Radar Sensing
WMI: High Speed Signal Integrity Workshop with Emphasis on Jitter
WMJ: 3D Metamaterials: Theory, Structures, Techniques, and Devices Millimeter-wave IC: Is
WMK: High-speed electronic technologies for > 100-G communications
WML: Progress in Microwave Ferrite Materials and Applications
WMM: Printed RF Electronics, RFID’s and Wireless Sensors: State and Challenges
WMN: Applications and misapplications of measurement uncertainty
silicon wining? Is GaAS
still Alive?
(GWCC Room A412ab)
TMA: RF Design Components of Magnetic Resonance Imaging TMB: Demystifying Microwave Signal Integrity - High Speed Design & Measurement
Registration: 07:00- 700 • RFIC Symposium 08:00- 7: 0
10:10-11:50 Plenary Session 12:15-13:15 Panel 13:20-15:00 TU3 Oral Sessions 15:30-17:10 TU4 Oral Sessions
Cognitive Radio for Open
Access and White Space
(GWCC A305)
TU3A: Wireless Communication Front-end
Technologies (A311)
TU3B: RF MEMS Device Technologies (A312)
TU4A: UWB Techniques and Radar Systems
(A311)
TU4B: RF MEMS Tunable and Reconfigurable
MEMS Circuits (A312)
Plenary Session
TU3C: Hybrid and Optimized Time-Domain TU4C: Grand Challenges in Time-Domain
Sydney Marcus Auditorium
Methods (A313)
Modeling (A313)
TU3D: Advances in HF, VHF and UHF Power TU4D: Advanced Applications of Transmission
Amplifiers (A314)
Line Elements (A314)
TU3E: Microwave Packaging and Materials TU4E: Circuits and Techniques for GHz
(A402/403)
Transmission (A402/403)
Registration 07:00- 7:00 • IMS Exhibition 09:00- 7:00 • Micro Apps 09: 0- 7:00 • RFIC Symposium 08:00- 7: 0 • RFIC Interactive Forum 4:00- 7:00
08:00-09:40 WE1 Oral Sessions 10:10-11:50 WE2 Oral Sessions 12:15-13:15 Panel 13:20-15:00 WE3 Oral Sessions 15:30-17:10 WE4 Oral Sessions
WE1A: Electromagnetic Analysis of Complex WE2A: Theory and Applications of
WE3A: Planar Filters I (A311) WE4A: Planar Filters II (A311)
Structures (A311)
Metamaterials (A311) Wireless Medical
WE1B: Novel Low Phase-Noise Techniques for WE2B: Advances in High Frequency Signal Technology (GWCC A305) WE3B: Low Noise Devices and Circuits (A312) WE4B: High-Performance Frequency Conver-
VCO’s and Synthesizers (A312)
Sources (A312)
sion and Control Integrated Circuits (A312)
WE1C: Nonlinear Measurement Techniques
Using CW, Pulsed and Modulated Excitations
WE2C: Linear Network Measurement (A313)
WE3C: Nonlinear Device Modeling (A313) WE4C: Tags and Sensors (A313)
(A313)
The Rise of System and
WE1D: Advances in Solid-State Millimeter-
Wave Technology (A314)
WE2D: Advanced Techniques for Sub-mm
Wave Generation, Amplification and
Frequency Conversion (A314)
Service Engineering (GWCC WE3D: RF-over-Fiber Links and Components
A302)
(A314)
WE4D: Microwave Photonic Technologies and
Systems (A314)
WE1E: New Benchmarks in Power Amplifiers WE2E: Advancements in the Linearity of
WE3E: Frequency-Domain Techniques WE4E: Linear Device Modeling (A315/316)
(A315/316)
Power Amplifiers (A315/316)
(A315/316)
Registration 07:00- 7:00 • IMS Exhibition 09:00- 7:00 • Micro Apps 09: 0- 7:00 • IMS Interactive Forum 09:30- :30, 4:00- 6:00
08:00-09:40 TH1 Oral Sessions 10:10-11:50 TH2 Oral Sessions 12:15-13:15 Panel 13:20-15:00 TH3 Oral Sessions 15:30-17:10 TH4 Oral Sessions
TH1A: Filter Theory and New Concepts (A311) TH2A: Filter Realization Techniques (A311)
TH3A: Microacoustic Front-end Technologies
(Special) (A311)
TH4A: Ferrites and Ferroelectrics (A311)
TH1B: High Power Amplifiers for Infrastructure TH2B: Advanced High-Efficiency Power
Automotive Radar (A305) TH3B: Power Amplifier Design Techniques for TH4B: Advanced Techniques for CAD (A312)
Applications (A312)
Amplifier Concepts (A312)
Millimeter-wave and Multi-band Applications
(A312)
TH1C: Dual-Band Passive Components (A313) TH2C: Passive Semiconductor Microwave
TH3C: Innovative Substrate Techniques for TH4C: Novel Passive Components (A313)
Components (A313)
Passive Integration (A313)
TH1D: Microwave & Millimeter Wave Phased TH2D: Retrodirective Phased Arrays & Smart
TH3D: Biological Effects and Medical
TH4D: Tunable and Active Filters (A314)
Array & Applications (A314)
Antennas (A314)
Applications (A314)
TH1E: History of MIC/MMIC Inventions - I TH2E: History of MIC/MMIC Inventions - II
TH3E: Nonlinear Circuit Analysis and System TH4E: Novel Monolithic Circuit Elements and IC
(Special) (A315/316)
(Special) (A315/316)
Simulation (A315/316)
Technology (A315/316)
TRANSITION: MOVING YOUR CAREER TO THE
CREATIVITY IN MICROWAVE RESEARCH AND
NEXT FRONTIER (GWCC A402)
DEVELOPEMENT (GWCC A402)
Registration 07:00- 7:00 • IMS Exhibition 09:00- 7:00 • Micro Apps 09: 0- 5:00 • IMS Interactive Forum 09:30- :30, 4:00- 6:00
08:00 Full-Day and Morning Workshops and Short Courses
WFA: Unification of Time Domain Methods in Computational Electromagnetics
WFB: System in Package Technologies and Trends
WFC: Progress in Local and Global Positioning in Europe
12:15-13:15 Panel 13:00 Afternoon Workshops
WFD: Computational Multi-Physics Techniques for the Analysis & Design of Electromagnetic Micro/Nano-Devices
TFA: Spectrum Policy for the Microwave Engineer: Getting Technology from the Lab to the Marketplace
ARFTG Conference and Exhibition 07:00- 7:00 • ARFTG Late Registration

Social Events Guest Program
RFIC Reception
19:00-21:00
GWCC Room A412ab
IMS 2008 Reception
18:00-20:00
Omni Hotel, Grand Ballroom
Atlanta’s Firsts
09:00-12:00
Wild Atlanta
10:00-15:00
15 June 2008
16 June 2008
Women in Microwaves Reception A Taste of the Peach 13:00-17:00
18:00-20:00
Omni Hotel, International Ballroom A
Student Reception
Covington’s Mansions and Magnolias
19:00-21:00
09:30-15:30
Omni Hotel, International Ballroom D
2008
Joe Taylor Rump Session Reception
18:30-19:10
Georgia World Congress Center, A412ab
June
Ham Radio Social
20:00-22:00
Georgia World Congress Center, A402/403 17
Industry Hosted Cocktail Reception
18:00-20:00
Omni Hotel, International Ballroom
MTT-S Awards Banquet
19:30-22:00
Omni Hotel, Grand Ballroom
MTT-S Student Awards Luncheon
12:00-14:00
Omni Hotel, International Ballroom F
MTT-S Graduates of the Last Decade
(GOLD) Reception
17:30-19:00
STATS Food Play Sports Bar
Atlanta’s Famous Firsts
09:00-13:00
Mommy and Me
10:00-15:00
The Good Life In Historic Buckead
09:30-16:00
Cultural Midtown
13:00-17:00
Shop Till You Drop
09:00-14:00
Outlet Shopping
14:30-18:30
18 June 2008
19 June 2008
20 June 2008
MICROWAvE WEEK
IMS Chair’s Message 4
What’s New for 2008 5–6
IEEE and MTT-S Membership 7
Advance and On-site Registration 8–10
US Visa Advisory 11
Accommodations 12–13
About Atlanta and Transportation 14–15
IMS TECHNICAL PROGRAM
TAblE oF ConTEnTS
Technical Program Chair’s Message 16
Plenary Session 17
Tuesday 18–23
Technical Sessions
Panel, Special, and Focused Sessions
Student Paper Competition
Wednesday 24–37
Technical Sessions
Interactive Forum
Panel, Special, and Focused Sessions
Thursday 38–51
Technical Sessions
Interactive Forum
Panel, Special, and Focused Sessions
Steering Committee 54–57
Technical Program Committee 58
MTT-S Technical Coordinating and Administrative Committees 59
Future IMS Locations 59
MTT-S Awards and IEEE Fellows 60–61
RFIC TECHNICAL PROGRAM
Chair’s Message 62
Plenary and Panel Sessions 63
Technical Program 64–68
Committees 69
ARFTG TECHNICAL PROGRAM
Chair’s Message 70
Technical Program and Committees 71
WORKSHOPS AND SHORT COURSES
Sunday 72–78
Monday 79–86
Friday 87–89
ExHIBITION
Commercial Exhibit 90–91
MicroApps 92–93
SOCIAL EvENTS AND GUEST PROGRAM
Social Events 94
Hospitality Suite and Recreational Activities 95-99
3

4
On behalf of the 2008 International Microwave Symposium (IMS 2008) steering committee, it is my honor
and privilege to welcome you to Atlanta, Georgia for Microwave Week from the15th to the 20th of June.
Drawing more than 10,000 participants and more than 400 exhibiting companies, Atlanta will become
the industry epicenter for the latest in microwave, antenna and wireless technologies during this week.
The excellent technical program of IMS is held as the premier event of Microwave Week 2008, and is complemented
by exceptional programs within the Radio-Frequency Integrated Circuit Symposium (www.rfic2008.org) and the
Automatic Radio-Frequency Techniques Group Conference (www.arftg.org). IMS also includes the world’s largest
microwave industry exhibition, with over 800 exhibitor booths, IMS will provide many opportunities for networking
and interacting with leading researchers and professionals in a variety of specific fields.
As you come through the world’s busiest airport to one of the fastest growing metropolitan areas in the United
States, including the third-largest concentration of Fortune 500 companies, you will find a multitude of activities
for you and your family throughout the week. Whether it is visiting the world’s largest aquarium, tasting beverages
from around the globe at the World of Coke, seeing behind the scenes action at the CNN headquarters, or cheering
at an Atlanta Braves baseball game, our guest program is packed with urban exploration and I hope you will take
advantage of all that Georgia has to offer.
So, please, enjoy the local hospitality and activity while participating in our industry’s highlight of 2008.
I look forward to meeting you in Atlanta.
WElCoME FRoM THE IMS CHAIR
Joy Laskar
General Chair
IMS 2008 International Microwave Symposium

Exhibit Hall A-3
This year IMS 2008 will be co-locating many events with the IMS 2008
exhibition. The third section of the exhibit floor, Hall A3 will be used
for a variety of activities and will provide an increased opportunity for
IMS attendees and exhibitors to interact. This includes the Historical
Exhibit, University Pavilion, MTT GOLD Pavilion, and the International
Pavilion.
All pavilions and the Historical Exhibit will be open the same hours as
the IMS 2008 Exhibition:
Tuesday, 17 June 2008 09:00-17:00
Wednesday, 18 June 2008 09:00-17:00
Thursday, 19 June 2008 09:00-15:00
WHAT’S nEW AT IMS 2008?
HISTORICAL ExHIBIT:
This year’s Historical Exhibit will feature the development and growth
of technology in the State of Georgia.
MTT GOLD PAvILION:
The IEEE MTT GOLD Committee announces the creation of a dedicated
space for MTT GOLD members to relax, network, and also receive GOLD
related information during your IMS stay in Atlanta. Located in Hall A3
of the exhibit hall, the pavilion will contain several table-top booths
with IEEE benefit materials crucial in enhancing young engineers
careers such as IEEE Mentoring Connection, IEEE.tv, IEEE Job Site, etc.
In addition, a lounge area will also be available for members to take a
break and relax as well. So, take a quick break from IMS and come join
your fellow GOLDies at the MTT GOLD Pavilion!
5

6
The following events will also be
taking place in Hall A3:
WORKSHOP AND ATTENDEE BREAKFAST:
The Workshop and Attendee breakfasts will be available in Hall A3 at
07:00 beginning on Sunday 15 June 2008 and ending on Thursday 19
June 2008. PLEASE NOTE: The Workshop breakfast on Friday 20 June
2008 will be held on the Third Floor of the Georgia World Congress
Center.
BOxED LUNCH DISTRIBUTION:
The Boxed Lunch distribution will be available in Hall A3 from 11:30
to 13:00 beginning on Sunday 15 June 2008 and ending on Thursday
19 June 2008. PLEASE NOTE: The Boxed Lunch Distribution on Friday
20 June 2008 will be held on the Third Floor of the Georgia World
Congress Center.
INTERACTIvE FORUM/STUDENT PAPER COMPETITION:
The Interactive Forum and Student Paper Competition will be located
in Hall A3. The schedule is as follows:
Tuesday, 17 June 2008:
IMS 2008 Student Paper Competition 14:00-16:00
RFIC Interactive Forum 14:00-17:00
Wednesday, 18 June 2008:
IMS 2008 Interactive Forum 09:30-11:30, 14:00-16:00
Thursday, 19 June 2008:
IMS 2008 Interactive Forum 09:30-11:30, 14:00-16:00
WHAT’S nEW AT IMS 2008?
STUDENT COMPETITIONS:
Tuesday, 17 June 2008:
Student High Efficiency Power Amplifier Design Competition
13:00-17:00
This competition is open to all students and graduate students
registered at an educational establishment. The competitors are
required to design, construct, and measure a high efficiency power
amplifier, at a frequency of their choice above 1 GHz but less than 20
GHz, and having an output power level of at least 5 watts, but less
than 100 watts.
Student Low Power Consumption FM Radio Receiver Design
Competition
13:30-16:00
A Low Power Consumption RF Radio Receiver Design Competition
is open to all students registered at an educational institution.
Competitors are required to design, contruct, measure, and
demonstrate an FM radio receiver with low DC (battery) power
consumption driving simple earphones/earbuds.
Wednesday, 18 June 2008:
Student Packaged x-Band Filter Competition
13:00-17:00
This contest is open to all IEEE MTT Student members enrolled at a
university as a student or PhD student. Competitors are required to
design and fabricate an X-band filter with optimum packaging and
interconnects, using a predefined package. Contest participants are
required to present a piece of hardware at the 2008 International
Microwave Symposium in Atlanta where all packaged filters will be
characterized by an MTT-12 and an MTT-8 team.
For more information on the Student Competitions, please visit the
IMS 2008 website at www.ims2008.org.

IEEE
The IEEE is a nonprofit, professional association with more than
367,000 members (including 73,000 students) in over 150 countries.
This global organization helps support the development and application
of technology and science around the world for the benefit of humanity,
the individual, and the profession.
MTT-S
The IEEE Microwave Theory and Techniques
Society (MTT-S) is a transnational society
with more than 9,000 members and 80
chapters worldwide. Our society promotes
the advancement of microwave theory and its
applications, at frequencies from 200 MHz to 1
THz and beyond. As we enter into an exciting
future, our mission is to continue to understand
and influence microwave technology.
benefits of Membership
The benefits of IEEE membership include:
• Discounted conference registration rates
• Subscriptions to the award-winning IEEE Spectrum and
online access to IEEE Potentials magazines
• Online access to the tables of contents and expanded abstract
from over one million IEEE documents with full text-searching
capability
IEEE and MTT-S MEMbERSHIP
Join the IEEE
now and
save on your
conference
registration!
• Free IEEE e-mail alias including virus scanning
and optional spam filtering
• IEEE Financial Advantage- negotiated exclusively for IEEE
members
Join the IEEE and MTT-S
To join the IEEE or renew your membership, please visit, email, or call:
WEB:
http://www.ieee.org/web/
membership/join/join.htm
EMAIL: new.membership@ieee.org
PHONE (US and CANADA):
+ 1-800-678-4333
PHONE (WORLDWIDE):
+ 1-732-981-0060
Attendees who join the IEEE for $80.50 and MTT-S for $7.00 before
the Symposium will save $185 on their registration fee. The price of an
IEEE/MTT-S membership more than pays for itself!
Half-year rates apply to new members only. New applications received
between 1 March 2008 and 15 August 2008 will automatically be
processed for half-year membership. If the applications specifically
request, their application will be processed for the full year.
IEEE and MTT-S MEMbERSHIP DUES
IEEE Half-Year Dues MTT-S Half-Year Dues
Residence Member Student Member Student
United States $82.50 $15.00 $7.00 $4.00
Canada (Including GST) $76.28 $15.90 $7.00 $4.00
Canada (Including HST) $81.32 $17.10 $7.00 $4.00
Africa, Europe, Middle East $68.50 $12.50 $7.00 $4.00
Latin America $65.00 $12.50 $7.00 $4.00
Asia, Pacific $65.50 $12.50 $7.00 $4.00
The optional MTT-S dues include a subscription to IEEE Microwave Magazine. MTT-S members can also purchase electronic and print subscriptions
to the IEEE Transactions on Microwave Theory and Techniques, IEEE Microwave and Wireless Components Letter, IEEE/OSA Journal of Lightwave
Technology, and IEEE MTT CD-ROM Collection. See IEEE Membership website for pricing.
7

8
Advance Registration
Please follow these instructions for completing the Advance
Registration Form on the facing page. Advance Registration
rates are valid until the deadlines shown on the form and are
approximately 30% lower than the on-site fees shown on Page 10.
Registration is required for all attendees, including SESSION CHAIRS
and PRESENTERS. Only paid attendees will be admitted to the
breakfasts, workshops, technical sessions, and Exhibition Hall. This
form is not used for the guest tour registration, which is described
elsewhere in this Program Book. Each registrant must submit a
separate form with payment. Registration by telephone is available
for the handicapped, special needs, or information; please call
1-781-769-9750.
Methods of Registration
1
Individuals can register online, by FAX, or by mail. Those registering by
mail should send their form in early enough to ensure the application
is received by the deadline; otherwise on-site fees will be charged. If
the registration is sent by FAX, do not send it by mail. Additional items
can be added on-site after advance registration.
Personal Information
12
For phone numbers outside the U.S., please include a country code.
If you would like to receive information by email from the IEEE, MTT-S,
or microwave companies, mark the appropriate boxes. An optional
complimentary badge for one guest allows access to the Hospitality
Suite, Plenary Session, and Exhibition Hall but does not allow access
to Technical Sessions and Workshops.
Membership
13
Check the boxes of all organizations of which you are a member. To
receive IEEE member rates, enter your member number and present
your IEEE card upon check-in at the conference. Registrants who
do not have a current IEEE membership card at check-in will be
charged the nonmember rates. If you are not a member and wish
to take advantage of the member rates, call 1-800-678-IEEE or visit
www.ieee.org/services/join prior to registering.
Symposia
14
Microwave Week hosts three symposia: the International Microwave
Symposium (IMS), the RFIC Symposium, and the ARFTG Conference.
Select the conferences you wish to attend. Students, retirees, and IEEE
Life Members receive a discount on registration fees. To qualify as a
student, a registrant must be either an IEEE Student Member or a fulltime
student carrying a course load of at least nine credit hours.
• IMS Technical sessions are held on Tuesday, Wednesday, and
Thursday. Registration includes continental breakfast, admission
to the exhibits, abstract books, and a CD-ROM.
ADVAnCE REGISTRATIon
• RFIC technical sessions are held on Monday and Tuesday.
Registration includes continental breakfast, admission to the RFIC,
Reception and exhibits, a digest, and a CD-ROM.
• ARFTG technical sessions are held on Friday. Registration includes
breakfast, lunch, a CD-ROM, and admission to the ARFTG
exhibition. ARFTG Conference member rates are available to both
ARFTG and IEEE members.
• Microwave Week hosts the largest exhibition of its kind with over
400 companies. Exhibit-only registration is available on-site for $20.
Extra CD-RoMs and Digests
15
Additional CD-ROMs (IMS, RFIC and ARFTG) and digests (RFIC only)
are available for purchase and pickup at the conference. After the
Symposium, digests (RFIC only) and CD-ROMs (IMS, RFIC and ARFTG)
will be available for purchase from IEEE.
Awards banquet
16
The MTT-S Awards Banquet will be held on Wednesday from 19:30
to 22:00 at the Omni Hotel in the Grand Ballroom. The evening will
include fine dining, an awards presentation, and entertainment.
Major Society awards will be presented.
boxed lunches
17
Optional boxed lunches are available for purchase by all attendees but
are especially convenient for those attending the Panel Sessions or
Exhibition Hall during lunchtime. It is encouraged to purchase boxed
lunches in advance, as on-site pricing will be higher. Refunds are NOT
available since these lunches are ordered in advance.
Workshops
18
The workshop fee includes a CD-ROM and speaker’s notes for that
workshop. Full day workshops and morning workshops include
a continental breakfast, boxed lunch and a morning refreshment
break. Afternoon workshops include a boxed lunch and an afternoon
refreshment break. The All-Workshop CD-ROM fee includes material
for all workshops on one CD-ROM but does not include admission to
any workshops.
Remittance
19
Individual remittance must accompany the registration form and
is payable in U.S. dollars only, using a personal check drawn on a
U.S. bank, traveler’s check, international money order, or credit
card (VISA, MasterCard or American Express only). Personal checks
must be encoded at the bottom with the bank, account, and check
number. Bank drafts, wire transfers, cash, and purchase orders are
UNACCEPTABLE and will be returned. Please make checks and money
orders payable to “IEEE/MTT-S”. Written requests for refunds will be
honored if received by 9 May 2008. See Page 10 for full refund policy.

1
Use the numbered instructions on the left as a guide to help you fill
out the form below. Advance registration rates are available by FAX
and mail until 9 May 2008 and online until 16 May 2008.
2
NAME
AFFILIATION
ADDRESS
EMAIL
TELEPHONE
GUEST NAME
MICRoWAVE WEEK ADVAnCE REGISTRATIon
8
ADvANCED REGISTRATION PRICING WORKSHOPS
IMS IEEE Nonmember Cost
All IMS sessions $395 $585 $
All IMS Sessions (No CD-ROM) $340 $525 $
Single Day Registration $200 $290 $
Student, Retiree, Life Member $65 $130 $
RFIC SYMPOSIUM IEEE Nonmember Cost
All RFIC Sessions $210 $310 $
RFIC Reception Only $55 $75 $
ARFTG CONFERENCE IEEE or ARFTG
Member
Nonmember Cost
All ARFTG Sessions $210 $330 $
5
Student, Retiree, Life Member $135 $135 $
ExTRA CDS AND DIGESTS IEEE Nonmember Cost
IMS and ARFTG CD-ROM # x $55 # x $105 $
RFIC Digest # x $55 # x $105 $
RFIC CD-ROM # x $55 # x $105 $
AWARDS BANqUET Cost per Ticket Cost
Awards Banquet # x $80 $
LUNCH Monday Tuesday Wednesday Thursday Cost
Boxed Lunches $20 $20 $20 $20 $
9
Atlanta, GA • 15-20 June 2008
WWW
www.mtt-sregistration.com
FAx
1-781-769-5037
First Last
SUNDAY MONDAY FRIDAY
WSA Full Day WMA Full Day WFA Full Day
WSB Full Day WMB Full Day WFB Full Day
WSC Half Day WMC Full Day WFC Full Day
WSD Full Day WMD Full Day WFD Full Day
WSE Half Day WME Full Day TFA Half Day
WSF Full Day WMF Half Day
WSG Half Day WMG Half Day
WSH Full Day WMH Full Day
WSI Half Day WMI Half Day
WSJ Half Day WMJ Half Day
WSK Half Day WMK Full Day
WSL Full Day WML Half Day
WSM Half Day WMM Half Day
WSN Half Day WMN Full Day
WSO Half Day TMA Half Day
TSB Half Day TMB Half Day
TSC Full Day
IEEE or ARFTG
Member Nonmember
MAIL
MTT-S Registration
685 Canton St., Norwood, MA 02062-2608
Company Mail Stop
Street
City State Postal Code Country
First Last
3
Member of MTTS ARFTG IEEE IEEE Membership Number
4
6
7
Emails from IEEE and MTT-S? Industry?
Student, Retiree,
Life Member Cost
Full Day # x $155 # x $225 # x $105 $
Half Day # x $105 # x $175 # x $80 $
All Workshop CD # x $185 # x $275 # x $120 $
See workshop section for a complete list of workshop descriptions
Mastercard Visa American Express Expiration Date / TOTAL REMITTANCE $
Month Year
CARD NUMBER SIGNATURE
By submitting this form you acknowledge that you have read and understand the policies regarding methods of payment, registration, refunds and requirements for proof of membership.
9

0
on-site Registration
On-site registration for all Microwave Week events will be available at
the Georgia World Congress Center.
Registration hours are:
Day Time
Saturday, 14 June 2008 14:00-18:00
Sunday, 15 June 2008 07:00-18:00
Monday, 16 June 2008 07:00-17:00
Tuesday, 17 June 2008 07:00-17:00
Wednesday, 18 June 2008 07:00-17:00
Thursday, 19 June 2008 07:00-15:00
Friday, 20 June 2008 07:00-09:00
Exhibit only Registration
Exhibit-only registration is available on-site for $20.
Guest Tour Registration
Registration for guest tours will be available in the Georgia World
Congress Center lobby. Please refer to the Guest Tour Program section
of this Program Book for further details and tour descriptions.
Press Registration
Credentialed press representatives are welcome to register without
cost, receiving access to technical sessions and exhibits. Digests are
not included. The Press Room is located in GWCC Building A, Room
411, on Tuesday through Thursday.
ARFTG Registration
Late on-site ARFTG registration will be available at the Omni Hotel on
Friday from 07:00 to 11:00. If at all possible, please pre-register earlier
in the week to reduce the on-site workload.
onSITE REGISTRATIon
Registration Fees
On-site registration fees are as follows:
Event Member NonMember
IMS Sessions $515 ($80) $770 ($160)
IMS Sessions (no CD-ROM) $440 $650
Single-day Registration $270 $375
RFIC Sessions $260 $390
RFIC Reception Only $65 $85
ARFTG Sessions $270 ($175) $420 ($175)
IMS and ARFTG CD-ROM $75 $145
RFIC Digest $75 $145
RFIC CD-ROM $75 $145
Boxed Lunches (per day) $25 $25
Awards Banquet $95 $95
Workshops (Full Day) $200 ($135) $300 ($135)
Workshops (Half Day) $150 ($100) $225 ($100)
All Workshop CD-ROM $240 ($150) $350 ($150)
ARFTG Conference
Compendium CD-ROM
$105 $140
ARFTG Workshop
Compendium CD-ROM
$70 $105
Exhibition Only Pass $20 $20
*Student, retiree, and IEEE Life Members prices are shown in
parentheses.
Refund Policy
Written requests received by 9 May 2008 will be honored. Refund
requests postmarked after this date and on-site refunds will be granted
only if an event is cancelled. This policy applies to registration for the
symposium sessions, workshops, digests, extra CD-ROMs, awards
banquet, and boxed lunches. Please state the preregistrant’s name
and provide a mailing address for the refund check. If registration was
paid by credit card, the refund will be made through an account credit.
An account number must be provided if the initial registration was
done on-line. Address your requests to:
MTT-S Registration
685 Canton Street
Norwood, MA USA 02062-2608

UnITED STATES VISA ADVISoRY
United States Visa Advisory
The United States has updated its visa policy for increased security.
As a result, it now takes longer to obtain a visa. Advance planning by
travelers is essential to avoid frustration and disappointment.
• Review your visa status to find out if you need a U.S. visa or a
visa renewal.
• Plan to submit your visa application well in advance of your
intended departure date.
• Contact your nearest U.S. embassy or consulate for current time
estimates and recommendations.
• Visit the embassy or consular section website to find important
information on how to schedule an interview appointment and
pay fees. An interview is required as a standard part of processing
for most visa applicants.
• Plan on having finger scans as part of the visa application process.
Two index-finger scans are normally collected by the consular
officer at the visa interview window; however, in some countries,
they may be collected prior to the actual visa interview.
Visa Waiver Program (VWP)
Citizens of the following countries can travel to the U.S. without a
visa for tourism or business for 90 days or less under the Visa Waiver
Program (VWP) if they meet other travel requirements. As of June 26,
2005, visa waiver program travelers must have a machine-readable
passport to enter the United States without a visa.
Andorra Australia Austria
Belgium Brunei Denmark
Finland France Germany
Iceland Ireland Italy
Japan Liechtenstein Luxembourg
Monaco The Netherlands New Zealand
Norway Portugal San Marino
Singapore Slovenia Spain
Sweden Switzerland United Kingdom
Canada and Bermuda are not participants in the Visa Waiver Program;
however, the Immigration and Nationality Act includes other
provisions for visa-free travel for nationals of Canada and Bermuda
under certain circumstances. See: http://www.travel.state.gov/
visa/temp/without/without_1260.html for details.
Passports
A passport with a validity date of at least six months beyond the
applicant’s intended period of stay in the U.S. is required. If more
than one person is included in the passport, each person desiring a
visa must make a separate application. Temporary passports will likely
merit special scrutiny. Check with your local U.S. consular offices, well
ahead of your intended departure dates, to avoid complications.
Visa letters
A visa support letter can be provided for authors and registered
attendees upon request. Contact Dr. Zaher Bardai, at zb@ieee.org,
for visa assistance to attend IMS 2008. Please submit your requests
for letters of support well in advance of your interview dates to allow
sufficient time for processing. Spouses requiring visa assistance must
be registered for an IMS Guest Program Event. Check the IMS 2008
website (www.ims2008.org) for Guest Program details.
Disclaimer
This information is provided in good faith but travel regulations do
change. The only authoritative sources of information are the U.S.
Government websites at www.unitedstatesvisas.gov and
http://travel.state.gov/visa/visa_1750.html.

ATTEnDEE ACCoMMoDATIonS
Number Hotel Room Type Rate
1 Atlanta Marriott Marquis Single/Double $195.00
2 Embassy Suites Hotel @ Centennial Olympic Park Single/Double $199.00
3 Hilton Atlanta Single/Double $173.00
4 Hilton Garden Inn Single/Double $175.00
5 Holiday Inn Atlanta Downtown Single/Double $152.00
6 Hyatt Regency Single/Double $169.00
7 Omni Hotel at CNN Center (HQ Hotel) Single/Double $185.00
8 Westin Peachtree Plaza Single/Double $189.00
9 Georgia World Congress Center Building A
See www.ims2008.org/hotelinfo.php for triple and quad occupancy rates as well as additional information.

Reservations, modifications and cancellations will be accepted
by the Housing Bureau until 2 May 2008. Listed convention rates
available until 2 May 2008 based on availability.
NAME
AFFILIATION
ADDRESS
EMAIL
TELEPHONE
GUEST NAME
GUEST EMAIL
MICRoWAVE WEEK
ATTEnDEE ACCoMMoDATIonS
IMS-RFIC-ARFTG
Atlanta, GA • 15-20 June 2008
WWW
www.ims2008.org
FAx
1-732-981-3427
First Last
Housing bureau Policies
MAIL
IMS 2008 Housing Bureau
IEEE Meetings & Conference Management
445 Hoes Lane, Piscataway, NJ 08854
Company Mail Stop
Street
City State Postal Code Country
First Last
Mastercard Visa American Express Discover Diner’s Club
CARD NUMBER Expiration Date /
SIGNATURE
• Reservations guaranteed by credit card may be cancelled without
penalty until 2 May 2008. After 2 May 2008, a $15 fee will be charged
for cancellations. After 16 May 2008, changes must be made directly
with the hotel.
• A confirmation will be sent after each reservation booking,
modification, or cancellation within 14 days of receipt. If you do not
receive a confirmation via e-mail, fax, or mail within 14 days of any
transaction, contact the Housing Bureau by phone or e-mail.
Confirmations will not be sent by the hotel. For questions about room
blocks call 1-800-810-4333 or e-mail mtt-s08reservations@ieee.org.
Hotel Preference
Month Year
• A deposit equal to the room rate for one night is required for each
reservation. All rates are per room per night and subject to and
additional 14% tax. Credit cards must be valid through June 2008
to be used for deposits.
• Specific room type will be assigned at check-in. Note that the room
requests are not guaranteed. A valid government ID will be required
at check-in for government rate rooms.
• If more than one room is required, attach a list providing the occupants
names and above information for each additional room. Requests for
blocks of rooms without named occupants will not be accepted.
Using the list of hotels on the facing page, please choose your top four choices:
First Choice
Second Choice
Third Choice Fourth Choice
If your hotel choices are unavailable, which is more important to you? Location Rate
Room Requests
Arrival Date / Departure Date / Government Rate? Yes No
Month Day Month Day
Room Size Single or Double Triple Quadruple
Special Requests Nonsmoking Smoking King-Size Bed Wheelchair Accessible
3

4
AboUT ATlAnTA
Did You Know...
Atlanta is rapidly becoming known as the “Wireless Capital of the U.S.”
Atlanta’s top 25 technology employers generated more than $622 billion in annual revenue.
Georgia Research Alliance invested $400+M in capital investments and leverages over $2B.
Metro Atlanta is considered to be first in the world in internet security.
Ranked third in Telecom employment.
More than 123,000 employed in high-tech industry, accounting for 5.2 percent of total employment.
Ranked fourth fastest in growing computer software city.
Ranked sixth in software industry employment.
Metro Atlanta is the “most saturated wireless large city in America.”
Atlanta, home of the Georgia Institute of Technology, produces more RF/Analog/EM and Signal Processing Engineers
than any other U.S. program.
Ranked 1st place for Top Cities for Corporate Headquarters by Business Facilities magazine, April 2003.
Ranked 1st place by Inc Magazine for Best Places for Entrepreneurs/Businesses.
Ranked 2nd place for America’s Hottest Cities for Business Expansion & Relocation Management magazine.
Ranked 2nd for Regional Producers of Engineering Degrees Atlanta Regional Consortium for Higher Education.
Ranked third in the nation among cities with the most FORTUNE 500 headquarters.
Fourth largest research center in the U.S., with over $731 million in higher education research.
For more information please visit:
Atlanta Convention visitors Bureau
www.atlanta.net
Atlanta Development Authority
www.atlantaada.com
Georgia Department of Economic Development
www.georgia.org

official Airlines
The Airport Information and Ground Transportation Center
conveniently located in the arrival lobby adjacent to Hertz Car Rental
provides information on all forms of ground transportation.
Delta: AirTran Airways:
Group Sales Department 1-866-683-8368
1-800-532-4777 Event Code: ATL061508
www.delta.com Travel Period- June 12-23, 2008
Transportation from the Airport
For on-site assistance, Hartsfield-Jackson has now implemented a new
Airport Information and Ground Transportation Center conveniently
located in the arrivals lobby next door to Hertz Car Rental.
Please see Hartsfield-Jackson website for detailed information:
http://www.atlanta-airport.com/Default.asp
MARTA (Metropolitan Atlanta
Rapid Transit Authority)
$1.75 plus $0.50. One Breeze card buys you one way on the city’s public
transit train. The train docks right inside the airport terminals.
For train times and stops please see: http://www.itsmarta.com/
Taxi
Taxi service is available to and from the Georgia World Congress Center
downtown and the airport for a standard fare of $30.00. Other flat
rates from the airport as are as follows:
Midtown $ 32.00
Buckhead $ 38.00
*$2.00 charge for ea. additional person
Atlanta link
The exclusive shuttle service to and from Hartsfield-Jackson Atlanta
International Airport, and Downtown, Midtown and Buckhead. They
offer group and charter services.
www.theatlantalink.com, 404-524-3400; 1-866-545-9633
One Way Round Trip
Downtown $16.50 per person $29 per person
Midtown $18.50 per person $33 per person
Buckhead $20.50 per person $37 per person
Shuttle:
Complimentary shuttle service to and from the GWCC will be provided
for those reserving their hotel room through the IMS 20008 Housing
Bureau. The pick-up and drop-off routes are located at:
TRAnSPoRTATIon
Route 1: Route 2:
Westin Peachtree Plaza Marriott Marquis
Hyatt Regency Atlanta
Route 3:
Hilton Atlanta
Holiday Inn
Rental Cars: Located in the arrival lobby
Alamo, Avis, National, Hertz, Budget, Dollar Rent-A-Car, Thrifty,
Enterprise
Driving Directions from the
Airport to GWCC
Take I-75/85 north to the Andrew Young International Blvd (Exit
248C). Turn left onto Andrew Young International Blvd. Turn left onto
Centennial Olympic Park Drive. Turn right onto Marietta Blvd. The
Green Lot is located on your left just past the Omni Hotel.
Parking - GWCC
Parking rates are $10 or less for all-day parking and never increase due
to event day activity in downtown. All lots are gated and attendants
are on duty during all show/event hours. Our small Green Lot located
on Marietta Street is an hourly parking lot with rates at $3.00 per hour,
capped at $15.00. Drivers will receive a time-stamped ticket that they
will give to the parking attendant along with their payment upon their
departure. Additionally, our own public safety force patrols the lots
and decks ensuring the safety of you and your automobile. Emergency
vehicle assistance is available for motorists in distress
The GWCC offers a Campus Courtesy Shuttle that provides free shuttle
service to attendees from parking lots to your event and vice versa.
The shuttle stops at all parking lots and decks as well as the main
entrances to the building. It makes continuous loops around the
campus during show days, making your commute an easy one. Look
for the Campus Courtesy Shuttle sign nearest you for a ride on the fast
and free shuttle.
PARKING INFORMATION
• International (Red) Deck 2,000 spaces on 7 levels (MAIN DECK)
• Orange Lot 580 spaces
• Silver Lot 82 spaces
• Blue Lot 722 spaces
• Gold Deck 300 spaces
• Yellow Lot 693 spaces
• Green Lots 200 spaces
For more information: http://www.gwcc.com/maps/parking.html
5

6
MESSAGE FRoM THE IMS TECHnICAl PRoGRAM CHAIR
On behalf of the Technical Program Committee, I extend my welcome to the 2008 International Microwave
Symposium, held in Atlanta for the first time in the 21st century. The Technical Program Committee,
consisting of 241 reviewers in 31 subcommittees, worked very hard to provide you with the best possible
technical program. Out of 762 submitted papers, 279 were selected for oral presentation, and 132 for
the Interactive Forum (IF). This year we closely coordinated with the RFIC Conference and we have rearranged the
regular sessions in five to six parallel sessions so that the IMS attendees have more flexibility to attend them. There
is one Focused Session organized by Gerald DeJean and his team, focusing on the history of MICs and MMICs. Panel
sessions organized by Chang-Ho Lee and his team occur during lunchtime (as usual) and focus on automotive radar,
multi-gigabit wireless, wireless medical, system/service engineering and cognitive radio. We have clarified the rules
for the Student Paper Competition and expect it to run smoothly thanks to Luca Rosseli’s efforts.
Our Workshop Chair, Edward Gebara, and his committee organized 38 workshops of which four are jointly organized
by IMS/RFIC and one is jointly organized by IMS/ARFTG. They are distributed on Sunday, Monday and Friday.
I would like to thank many individuals for making this event possible. First are the three TPC Vice-Chairs, Kuytae Lim,
John Papapolymerou and Stephane Pinel. Thanks to Jeff Pond, Jonathan Hacker, John Cressler and Roger Pollard for
Electronic Paper Management. A tremendous amount of guidance was provided by Roger Pollard, Tatsuo Itoh and
Joy Laskar. I am indebted to the dedicated effort of a number of volunteers from Georgia Tech, GEDC and GTRI.
Finally, I should note that this symposium would not have been possible without the dedicated efforts of the authors
of the technical papers submitted for the symposium and workshops. It is my hope that you will enjoy the technical
depth and breadth of the program during Microwave Week in Atlanta.
Manos Tentzeris
Chair, IMS 2008 Technical Program Committee

TUESDAY PlEnARY SESSIon 10:10-11:50
“SYMBIOTIC RELATIONSHIPS IN TECHNOLOGY AND
BASIC SCIENCE”
Joseph H. Taylor, James S. McDonnell Distinguished
University Professor of Physics, Emeritus Princeton
University, 2003 Nobel Laureate
Discoveries made in the pursuit of basic knowledge of
Nature’s laws can sometimes evolve
into practical new machines or
devices. These new technologies,
in turn, can enable new laboratory
techniques for the basic scientist.
I will describe a few examples,
with particular emphasis on RF/
microwave engineering and my own
field of astrophysics and radio astronomy.
Dr. Taylor taught at the University of Massachusetts,
Amherst, from 1968 to 1980, and since then in the Physics
Department, Princeton University. From 1997 to 2003 he
served as Dean of the Faculty at Princeton. He earned a BA
in physics, with honors, from Haverford College in 1963,
and a PhD in Astronomy from Harvard University in 1968.
His research is in radio astronomy, especially the study of
pulsars and their applications to experimental gravitation.
Dr. Taylor is a member of the National Academy of Sciences,
the American Academy of Arts and Sciences, and the
American Philosophical Society. He has served on many
Boards and advisory committees, such as the recent
Committee on Assessment of Options for Extending the
Life of the Hubble Space Telescope. He is the recipient of
numerous prizes and awards, including the MacArthur
Foundation Prize Fellowship, the Henry Draper Medal of
the National Academy of Sciences, the Einstein Prize of the
Albert Einstein Society, Bern, the Wolf Prize in Physics, and
the 1993 Nobel Prize in Physics.
SYDnEY MARCUS AUDIToRIUM
WHAT SHOULD “OPEN ACCESS” WIRELESS REALLY
MEAN? - A MODEST PROPOSAL
Mike Farmwald, Director, Skymoon Ventures, Santa Clara,
California
Google (and others) have proposed “open access” concepts
and rules for wireless broadband. We feel that the open
access proposals don’t go nearly
far enough in solving the real
underlying technical, competitive,
and regulatory issues. We will make
a proposal that might solve some
of these issues, and allow a much
more open and innovative wireless
broadband infrastructure (as well
as creating significant new opportunities for wireless chip
vendors.)
Dr. Farmwald is a serial entrepreneur who founded six
companies to date, five of which were financed in part by
Benchmark Capital, where he is a Venture Partner. Most
recently, Mike co-founded Matrix, which was acquired
by SanDisk. Mike is probably best known for co-founding
Rambus. Prior to Rambus, Mike founded FTL in 1986. FTL,
an ECL supercomputing company, merged with MIPS in
the same year. At MIPS, Mike served as Chief Scientist for
High End Systems. Following his experience at MIPS, Mike
was an Associate Professor of Electrical and Computer
Engineering at the University of Illinois. Mike holds a BS
degree in Mathematics from Purdue University and a Ph.D.
in Computer Science from Stanford University.
TUESDAY
7

8
13:20
13:30 13:40
13:50 14:00
14:10 14:20
14:30 14:40
14:50
TUESDAY TECHnICAl SESSIonS 13:20-15:00
TU3A: Wireless Communication
Front-end Technologies
Chair: Yuanxun Ethan Wang, UCLA
Co-chair: Johann F. Luy, Daimler-Chrysler
Research & Development
Room: A311
TU3A-01: Design of a Cell-Phone
Sized, Reconfigurable, Fault-Tolerant
Extravehicular Activity (EvA)
Communication System for Lunar Surface
Operations
A. L. Benjamin1 , R. Zenick2 , P. J. Stephanou3 ,
J. P. Black3 1NASA Johnson Space Center, Houston, United
States, 2AeroAstro, Ashburn, United States,
3Harmonic Devices Inc., Berkeley, United
States
TU3A-02: An Ultra-Miniaturized
Transceiver Module for Bluetooth
Applications using 3-D LTCC System-On-
Package Technology
Y. Cho, J. Kim, Y. Park
Samsung Electro-Mechanics, Suwon, Republic
of Korea
TU3A-03: Design of a Simultaneous Multi-
Band RF Sub-Sampling Receiver
N. Behjou 1,2 , M. Høgdal 1 , T. Larsen 2
1 Radiocomp Aps, Hillerød, Denmark, 2 Aalborg
University, Aalborg East, Denmark
TU3A-04: Ultra-Low Power High
Bandwidth qPSK Modulator
T. S. Pochiraju, V. F. Fusco
Queen’s University of Belfast, Belfast, United
Kingdom
TU3A-05: Highly-Integrated Dual-Band
Front-End Module for WLAN and WiMAx
Applications based on LTCC Technology
A. Yatsenko, J. Heyen, S. Sakhnenko, B.
Vorotnikov, P. Heide
EPCOS AG, Munich, Germany
TU3A-06: Multiband Wireless Transmitter
using Nonlinear Characteristics of
Power Amplifier and Harmonic-Tuning
Predistorter
K. Oh, Y. Lee, H. Ku
Konkuk University, Seoul, Republic of Korea
TU3B: RF MEMS Device Technologies
Chair: Dan Hyman, XCom Wireless
Co-chair: J. Robert Reid, Air Force Research
Lab
Room: A312
TU3B-01: A SP2T and a SP4T Switch using
Low Loss Piezoelectric MEMS
D. J. Chung 1 , R. G. Polcawich 2 , D. Judy 2 , J.
Pulskamp 2 , J. Papapolymerou 1
1 Georgia Institute of Technology, 2 US Army
Research Laboratory
TU3B-02: Stable Multi-Step Capacitance
Control with Binary voltage Operation
at +/-3v in Integrated Piezoelectric RF
MEMS Tunable Capacitors
T. Nagano 1 , M. Nishigaki 1 , T. Kawakubo 2 ,
K. Itaya 1
1 Toshiba Corporation, 2 Toshiba Research
Consulting Corporation
TU3B-03: Microwave Intermodulation
Technique for Monitoring the Mechanical
Stress in RF MEMS Capacitive Switches
C. Palego1 , S. Hadler1 , B. Baloglu1 , Z. Peng1 , J.
C. Hwang1 , H. F. Nied1 , D. I. Forehand2 ,
C. L. Goldsmith2 1 2 Lehigh University, MEMtronics Corporation
TU3B-04: Study of Residual Charging in
Dielectric Less Capacitive MEMS Switches
D. Mardivirin, D. Bouyge, A. Crunteanu, A.
Pothier, P. Blondy
Université de Limoges, Limoges, France
TU3B-05: A 2-Pole Digitally Tunable Filter
Using Local One Bit varactors
M. Houssini, A. Pothier, A. Crunteanu, P.
Blondy
Université de Limoges, Limoges, France
TU3B-06: MEMS Liquid Metal Throughwafer
Microstrip to Microstrip Transition
X. Liu 1 , L. P. B.Katehi 2 , D. Peroulis 1
1 Purdue University, 2 University of Illinois at
Urbana-Champaign
TU3C: Hybrid and Optimized Time-
Domain Methods
Chair: Nathan Bushyager, Northrop Grumman
Co-chair: Samir El-Ghazaly, University of
Arkansas, Dept of Electrical Engineering
Room: A313
TU3C-01: An Efficient Unconditionally
Stable Three-Dimensional LOD-FDTD
Method
Q. Liu1 , Z. D. Chen2 , W. Yin1 1Shanghai Jiao Tong University, Shanghai,
China, 2Dalhousie University, Halifax, Canada
TU3C-02: An Efficient Method for the
Coupling of a Fully-Explicit Time-Domain
Solid-State Hydrodynamic Simulator with
FDTD EM Solvers
B. S. McGarvey, M. M. Tentzeris
Georgia Institute of Technology
TU3C-03: Efficient TLM Sensitivity
Analysis Exploiting Rubber Cells
P. A. Basl, M. H. Bakr, N. K. Nikolova
McMaster University, Hamilton, Canada
TU3C-04: Interfacing the TLM and the
TWF Method using a Diakoptics Approach
N. Fichtner 1 , S. Wane 2 , D. Bajon 3 , P. Russer 1
1 Technische Universität München, München,
Germany, 2 Philips Semiconductors, Caen,
France, 3 École nationale supérieure de
l’aéronautique et de l’espace, Toulouse
TU3C-05: The Meshless Radial Point
Interpolation Method for Time-Domain
Electromagnetics
T. Kaufmann, C. Fumeaux, R. Vahldieck
ETH Zurich, Zurich, Switzerland

TUESDAY TECHnICAl SESSIonS 13:20-15:00
TU3D: Advances in HF, vHF and UHF
Power Amplifiers
Chair: Alina Moussessian , Jet Propulsion
Laboratory
Co-chair: Rick Campbell, Portland State
University
Room: A314
TU3D-01: A 65-W High-Efficiency UHF GaN
Power Amplifier
N. D. López1 , J. Hoversten1 , M. Poulton2 , Z.
Popovic1 1 2 University of Colorado, RF Micro Devices
TU3D-02: 800W UHF SiC SIT Transistor for
Radar Applications
T. Shi, M. Mallinger, L. Leverich, J. Chang, C.
Leader, M. Caballero
Microsemi Corp.
TU3D-03: Series-Tuned High Efficiency
RF-Power Amplifiers
J. Vidkjaer
Technical University of Denmark
TU3D-04: Design and Computer
Simulation of High Efficiency Broadband
Parallel-Circuit Class-E RF Power Amplifier
with Reactance Compensation Technique
K. Narendra1 , C. Prakash1 , A. Grebennikov2 ,
A. Mediano3 , C. Paoloni4 1Motorola Technology, Penang, Malaysia,
2 3 DICE GmbH & Co KG, Linz, Austria, University
of Zaragoza, Zaragoza, Spain, 4Università degli Studi di Roma - Tor Vergata, Roma, Italy
TU3D-05: Switching-Mode Linear RF
Power Amplifier System
B. Shi, M. Chia
A*STAR, Singapore, Singapore
TU3D-06: An AlGaN/GaN Class-S Amplifier
for RF-Communication Signals
R. Leberer, M. Oppermann, R. Reber
EADS Deutschland GmbH, Ulm, Germany
TU3E: Microwave Packaging and
Materials
Chair: Wolfgang Heinrich, Ferdinand-Braun-
Institut (FBH)
Co-chair: Kenichi Maruhashi, NEC
Room: A402/403
TU3E-01: A Compact Dual Band 802.11n
Front-end Module for MIMO Applications
Using Multi-layer Organic Technology
S. Dalmia, L. Carastro, R. Fathima, V. Govind,
J. Dekosky, S. Lapushin, R. Wu, B. Bayruns,
G. White
Jacket Micro Devices, Atlanta, United States
TU3E-02: Development of LCP Surface
Mount Package with a Bandpass
Feedthrough at K-band
M. P. McGrath1 , K. Aihara1 , A. Pham1 , S. R.
Nelson2 1 2 University of California at Davis, REMEC
Defense and Space
TU3E-03: Novel Enhanced-Thickness
Magnetic Nanoparticle Thin-Films
for System-On-Chip (SOC) Wireless
Applications
Y. Li, H. Doo, B. Pan, M. M. Tentzeris, Z. J.
Zhang, J. Papapolymerou
Georgia Institute of Technology
TU3E-04: Carbon Nanotube-Based
Polymer Composites for Microwave
Applications
S. Pacchini1 , T. Idda1 , D. Dubuc1 , E. Flahaut2 ,
K. Grenier1 1 2 LAAS-CNRS/UPS, Toulouse, France, LAAS-
CNRS/UPS/INPT, Toulouse, France
TU3E-05: Filtering Land Pattern for
Miniature Mechanical Switch Connector
D. Lo Hine Tong, P. Minard, J. Le Bras
Thomson R&D France, Cesson Sévigné, France
13:20 13:30
13:40 13:50
14:00 14:10
14:20 14:30
14:40
14:50
TUESDAY
9

0
TUESDAY 12:00-13:15 A305
COGNITIvE RADIO FOR OPEN ACCESS AND WHITE SPACE
Chair/Moderator: Kyutae Lim, Georgia Institute of Technology
Panelists:
• Dr. Fred Martin, Motorola Inc.
• Dr. Kursat Kimyacioglu, Philips USA
• Dr. Stewart S. Taylor, Intel
• Dr. Kihong Kim, Samsung Electro-Mechanics
• Dr. Mathew Sherman, General Vice Chair of IEEE Standard
Association, BAE Systems
Sponsors: IMS and RFIC
TUESDAY PAnEl AnD RUMP SESSIonS
Abstract: The UHF band, which is recognized as the best spectrum for
mobile communication, has been used for broadcasting service for
over 50 years. From early 2009, Analog TV services will be completely
replaced by Digital TV service in many countries including North
America, Europe, Asia and Australia. In the USA, the FCC is aggressively
moving forward to maximize the usage of the last greatest spectrum
for wireless communication.
As a first step, the FCC is auctioning 100 MHz band in 700MHz, which will
become available after the transition to DTV spectrum. Especially, one
chunk of spectrum is designated as “Open Access,” which means that
the user can access this frequency by any device and software, which
has not been allowed since most of the carriers controlled the device
and accessibility of the frequency band. After the spectrum auction,
FCC is making another important decision of granting for a secondary
user to access locally unused DTV spectrum, the so called “White
Space.” Together with “Open Access” and “White Space,” consumers
will enjoy uncharted wireless communication services, which has
improved connectivity and data throughput at a fraction of cost. This
panel session will explore the scenario of new wireless communication
services in the future and discuss the technical challenges to enable
such communication services. Panelists includes experts in network
architecture, MAC, PHY layer, Policy and RF/Analog.
TUESDAY 18:30-20:00 A412ab
THE DISCOvERY OF GRAvITY WAvES AMIDST THE NOISE
Our symposium this year will include an evening Rump Session
featuring a talk by Nobel Laureate and Princeton professor, Dr. Joe
Taylor, entitled “The Discovery of Gravity Waves Amidst the Noise”. This
event will be hosted by Sonnet Software.
Nobel Laureate and Princeton professor, Dr. Joe Taylor, K1JT, will
describe his work as a radio astronomer culminating in his discovery
of gravity waves. Long predicted by the General Theory of Relativity,
gravity waves have not yet been directly detected. Dr. Taylor provided
the first experimental evidence that gravity waves do actually exist
by measuring the energy lost in binary pulsar systems. The measured
rate of energy lost in these truly bizarre astrophysical systems can be
explained only by gravity wave radiation. There is no Nobel Prize for
microwave engineering, but Dr. Taylor’s skill as a microwave engineer,
and as an experienced amateur radio operator were essential in
achieving his Nobel success. In this presentation, Dr. Taylor describes
his astronomical discoveries and how his work critically depends on
receiving weak signals. These same skills are directly applicable to
weak signal communications work. In fact, the algorithms developed
by Dr. Taylor are now in wide use by radio amateurs world wide for
weak signal VHF and UHF communications. Dr. Taylor will detail this
fascinating synergism between his Nobel Prize winning work in radio
astronomy and the everyday life of the typical VHF/UHF ham radio
operator. The amateur radio social immediately follows, to which all
are invited.
Complimentary food and beverage will be served from 18:30-19:10
with the presentation beginning promptly at 19:10. Everyone is
welcome to attend.

STUDEnT PAPER CoMPETITIon
TUESDAY 14:00-16:00 HALL A3
The student paper competition had become one of the largest technical events
at IMS. The purpose of the competition is to determine and acknowledge the
best student work of the year in the MTT-S. This year we received 225 student
papers approximately 29% of all submitted papers. Each student paper went
through the regular review process by the Technical Program Committee.
Approximately 49% of the submitted papers were accepted for presentations.
Based on the review scores, only 31 of the accepted student papers were
selected as finalists. The finalists are given complimentary registration for IMS
Dispersion Engineered Metamaterial-Based Transmission Line for Conformal Surface
Application
M. R. Hashemi, T. Itoh
University of California at Los Angeles, Los Angeles, United States
A Derived Circuit Model for Spiral Inductors on Lossy Silicon Substrate
K. Yang 1 , H. Hu 2 , K. L. Wu 1 , W. Y. Yin 2 , J. F. Mao 2
1 The Chinese University of Hong Kong, Hong Kong, Hong Kong, 2 Shanghai Jiao Tong University, Shanghai,
China
An Efficient Methodology for the Modeling of Electromagnetic Wave Phenomena in Domains
with Moving Boundaries
J. A. Russer, A. C. Cangellaris
University of Illinois at Urbana-Champaign, Urbana, United States
RF Large-Signal Model for SiO2/AlGaN/GaN MOSHFETs
J. Deng 1 , W. Wang 1 , S. Halder 1 , W. R. Curtice 1 , J. C. Hwang 1 , V. Adivarahan 2 , A. Khan 2
1 Lehigh University, Bethlehem, United States, 2 University of South Carolina, Columbia, United States
Harmonic Balance Simulation of a New Physics Based Model of the AlGaN/GaN HFET
H. Yin, D. Hou, G. L. Bilbro, R. J. Trew
North Carolina State University, Raleigh, United States
Mismatch Detection and Compensation Algorithm with the Closed Form Solution for the LINC
System Implementation
S. Myoung 1,3 , I. Lee 2 , K. Lim 3 , J. Yook 1 , J. Laskar 3
1 Yonsei University, Seoul, Republic of Korea, 2 Kongju National University, Kongju, Republic of Korea,
3 Georgia Institude of Technology, Atlanta, United States
A Ka-band Waveguide Water-Based Absorptive Switch with an Integrated Micropump
C. Chen, D. Peroulis
Purdue University, West Lafayette, United States
Ultra Slow-Wave Periodic Transmission Line Using 3D Substrate Metallization
Y. Zhang, H. Yang
University of Illinois at Chicago, Chicago, United States
A Multi-Resolution Channel-Select Filter with Ultra-Wide Frequency Coverage
M. Koochakzadeh, A. Abbaspour-Tamijani
Arizona State University, Tempe, United States
Novel Waveguide Pseudo-Elliptic Filters using Slant Ridge Resonators
S. Bastioli 1 , L. Marcaccioli 2 , R. Sorrentino 1
1 University of Perugia, Perugia, Italy, 2 RF Microtech s.r.l., Perugia, Italy
Multilayer Folded-Waveguide Dual-Band Filter
S. K. Alotaibi, J. Hong, Z. Hao
Heriot-Watt University , Edinburgh, United Kingdom
A 3.7-mW Zero-dB Fully Integrated Active Bandpass Filter at Ka-band in 0.18-μm CMOS
M. Chiang, H. Wu, C. C. Tzuang
National Taiwan University, Taipei, Taiwan
A Novel Flexible Magnetic Composite Material for RFID, Wearable RF and Bio-monitoring
Applications
L. Yang 1 , L. Martin 2 , D. Staiculescu 1 , C.P. Wong 1 , M. M. Tentzeris 1
1 Georgia Institute of Technology, Atlanta, United States, 2 Motorola, Plantation, United States
A 2 GHz Oscillator using a Monolithically Integrated AlN TFBAR
M. Norling1 , J. Enlund2 , I. Katardjiev2 , S. Gevorgian1 , 3
1 2 3 Chalmers University of Technology, Göteborg, Sweden, Uppsala University, Uppsala, Sweden, Ericsson
AB, Mölndal, Sweden
Monolithic Crossbar MEMS Switch Matrix
K. Chan1 , 2 , M. Daneshmand2 , R. R. Mansour2 , R. Ramer1 1 2 University of New South Wales, Sydney, Australia, University of Waterloo, Waterloo, Canada
Low Loss Switchable Coupled Resonator Bandpass Filter
C. Y. Ong, M. Okoniewski
University of Calgary, Calgary, Canada
2008, complimentary tickets to the MTT-S awards banquet and travel subsidies.
The student finalists will present their papers at their appropriate regular sessions
and make special presentations at the Interactive Forum on Tuesday from 14:00-
16:00. All symposium participants are welcome and encouraged to visit the student
papers during the Interactive Forum, at which time they will also be evaluated by
a group of judges. Six top papers and four honorable mentions will be selected to
receive cash awards, certificates, and gifts. These will be announced and presented
during the Students Awards Luncheon on Thursday. We are very pleased to announce
the finalists for the IMS 2008 Student Paper Competition:
High quality-Factor and Inductance of Symmetric Differential-Pair Structure Active Inductor
using a Feedback Resistance Design
K. Hwang 1 , C. Cho 1 , J. Lee 1 , J. Kim 2
1 Korea Aerospace University, Goyang, Republic of Korea, 2 Information and Communications University,
Yusong, Republic of Korea
Dual-Band vCO using Composite Right/Left-Handed Transmission Line and Tunable Negative
Resistance Based on Pin Diode
J. Choi, C. Seo
Soongsil University, Seoul, Republic of Korea
A 60dB Harmonic Mixing Reduction Mixer for Wideband Applications
C. Li, P. Huang
National Tsing Hua University, Hsinchu, Taiwan
A q-band Low Loss Reduced-Size Filter-Integrated SPDT Switch using
0.15-um MHEMT Technology
J. Lee 1 , R. Lai 1 , K. Lin 1 , C. Chiong 1 , H. Wang 1
1 National Taiwan University, Taipei, Taiwan, 2 Academia Sinica, Taipei, Taiwan
q-, v-, and W-Band Power Amplifiers Utilizing Coupled Lines for Impedance Matching
M. Abbasi, H. Zirath, I. Angelov
Chalmers University of Technology, Göteborg, Sweden
A Doherty Power Amplifier with Extended Resonance Power Divider for Linearity Improvement
M. Nick, A. Mortazawi
University of Michigan, Ann Arbor, United States
Experimental Cryogenic Modeling and Noise of SiGe HBTs
J. C. Bardin, S. Weinreb
California Institute of Technology, Pasadena, United States
High-Power Tunable THz Generation Based on Photoconductive Antenna Arrays
M. Jarrahi, T. H. Lee
Stanford University, Stanford, United States
A 4.5 GHz to 5.8 GHz Tunable ΔΣ Digital Receiver with q Enhancement
T. Chalvatzis 1,2 , S. P. Voinigescu 1
1 University of Toronto, Toronto, Canada, 2 Broadcom Corporation, Athens, Greece
Design, Integration and Characterization of a Novel Paper-based Wireless Sensor Module
R. Vyas, A. Rida, L. Yang, M.M. Tentzeris
Georgia Institute of Technology, Atlanta, United States
Mixed Analog-Digital Instrumentation for Software Defined Radio Characterization
P. M. Cruz 1 , N. B. Carvalho 1 , K. A. Remley 2 , K. G. Gard 3
1 IT-Universidade de Aveiro, Aveiro, Portugal, 2 NIST, Boulder, United States, 3 North Carolina State
University, Raleigh, United States
Electrical Properties of Nude Rat Skin and Design of Implantable Antennas for Wireless Data
Telemetry
T. Karacolak, E. Topsakal
Mississippi State University, Mississippi State, United States
A Feedback-Based Distributed Phased Array Technique and its Application to 60-GHz Wireless
Sensor Network
M. Seo, M. Rodwell, U. Madhow
University of California-Santa Barbara, Santa Barbara, United States
Method for High Precision Local Positioning Radar using an Ultra Wideband Technique
B. Waldmann 1 , R. Weigel 1 , P. Gulden 2
1 University of Erlangen-Nuremberg, Erlangen, Germany, 2 Symeo GmbH, Neubiberg/Munich, Germany
Complex Signal Demodulation and Random Body Movement Cancellation Techniques for Noncontact
vital Sign Detection
C. Li, J. Lin
University of Florida, Gainesville, United States
TUESDAY

15:30
15:40 15:50
16:00 16:10
16:20 16:30
16:40 16:50
17:00 17:10
TUESDAY TECHnICAl SESSIonS 15:30-17:10
TU4A: UWB Techniques and Radar
Systems
Chair: Ramesh K. Gupta, Mobile Satellite
Ventures
Co-chair: Hiroshi Okazaki, NTT DoCoMo, Inc.
Room: A311
TU4A-01: A W-band Wavelet Generator
using 0.13-um InP HEMTs for Multigigabit
Communications Based on Ultra-
Wideband Impulse Radio
Y. Nakasha1 , Y. Kawano1 , T. Suzuki1 , T. Ohki2 ,
T. Takahashi1 , K. Makiyama1 , T. Hirose2 , N.
Hara1 1 2 Fujitsu Limited, Atsugi, Japan, Fujitsu
Laboratories Ltd., Atsugi, Japan
TU4A-02: Dielectric Waveguide Slot
Antenna with Integrated Filter for
Automotive UWB Radar Applications
K. Sano, K. Ito
TOKO, Inc., Tsurugashima, Japan
TU4A-03: Method for High Precision
Local Positioning Radar using an Ultra
Wideband Technique
B. Waldmann1 , R. Weigel1 , P. Gulden2 1University of Erlangen-Nuremberg, Erlangen,
Germany, 2Symeo GmbH, Neubiberg/Munich,
Germany
TU4A-04: Performance Analysis of
Cooperative FMCW Radar Distance
Measurement Systems
S. Scheiblhofer, S. Schuster, M. Jahn, R.
Feger, A. Stelzer
Johannes Kepler University, Linz, Austria
TU4A-05: A Four Channel 24-GHz FMCW
Radar Sensor with Two-Dimensional
Target Localization Capabilities
R. Feger, A. Haderer, S. Schuster, S.
Scheiblhofer, A. Stelzer,
Johannes Kepler University, Linz, Austria
TU4B: RF MEMS Tunable and
Reconfigurable MEMS Circuits
Chair: Dimitrios Peroulis, Purdue University
Co-chair: Harvey Newman, Naval Research
Laboratory
Room: A312
TU4B-01: Monolithic Crossbar MEMS
Switch Matrix
K. Chan1 , 2 , M. Daneshmand2 , R. R. Mansour2 ,
R. Ramer1 1University of New South Wales, Sydney,
Australia, 2University of Waterloo, Waterloo,
Canada
TU4B-02: 1.6-2.4 GHz RF MEMS Tunable
3-Pole Suspended Combline Filter
I. C. Reines 1 , A. Brown 2 , G. Rebeiz 1
1 University of California-San Diego, 2 A. Brown
Design, Northville, United States
TU4B-03: Low Loss Switchable Coupled
Resonator Bandpass Filter
C. Y. Ong, M. Okoniewski
University of Calgary, Calgary, Canada
TU4B-04: Thin-Film LCP Amplitude
Compensated Long Time Delay Circuit
M. J. Chen 1 , E. Zhang 1 , A. V. Pham 1 , D.
Hyman 2
1 Microwave Microsystems Laboratory,
University of California at Davis, 2 XCOM
Wireless, Inc.
TU4B-05: A Novel Reconfigurable
Impedance Matching Network Using DGS
and MEMS Switches for Millimeter-Wave
Applications
S. Fouladi, A. Akhavan Fomani, R.R. Mansour
University of Waterloo, Waterloo, Canada
TU4C: Grand Challenges in Time-
Domain Modeling
Chair: Zhizhang (David) Chen, Dalhousie
University
Co-chair: Atef Elsherbeni, The University of
Mississippi
Room: A313
TU4C-01: Optimization and Parameter
Exploration Using GPU Based FDTD
Solvers
M. J. Inman, A. Z. Elsherbeni
The University of Mississippi, University,
United States
TU4C-02: Massively Parallel Two-
Dimensional TLM Algorithm on Graphics
Processing Units
F. V. Rossi1 , P. So1 , N. Fichtner2 , P. Russer2 1University of Victoria, Victoria, Canada,
2Technische Universität München, München,
Germany
TU4C-03: An Efficient Methodology for
the Modeling of Electromagnetic Wave
Phenomena in Domains with Moving
Boundaries
J. A. Russer, A. C. Cangellaris
University of Illinois at Urbana-Champaign
TU4C-04: The Optimized Weakly
Conditionally Stable (WCS) FDTD Method
I. Ahmed 1 , E. Li 1 , Z. D. Chen 2
1 A*STAR, Singapore, Singapore, 2 Dalhousie
University, Halifax, Canada
TU4C-05: Accelerated Time-Domain
Modeling of Microstrip Based Microwave
Circuit Geometries on Periodic Substrates
D. Li, C. D. Sarris
University of Toronto, Toronto, Canada
TU4C-06: A Fast-Marching Time-Domain
Layered Finite-Element Reduction-
Recovery Method for High-Frequency
vLSI Design
H. Gan, D. Jiao
Purdue University, West Lafayette, United
States

TUESDAY TECHnICAl SESSIonS 15:30-17:10
TU4D: Advanced Applications of
Transmission Line Elements
Chair: George E. Ponchak, NASA Glenn
Research Center
Co-chair: Barry E. Spielman, Washington
University
Room: A314
TU4D-01: Fully Printed volumetric
Negative-Refractive-Index Transmission-
Line Slabs Using A Stacked Shunt-Node
Topology
J. Zhu, G. V. Eleftheriades
University of Toronto, Toronto, Canada
TU4D-02: Performance Evaluation of Left-
Handed Delay Lines for RFID Backscatter
Applications
M. Schüßler, C. Damm, M. Maasch, R. Jakoby
TU Darmstadt, Darmstadt, Germany
TU4D-03: Millimeter-Wave CMOS
Digital Controlled Artificial Dielectric
Differential Mode Transmission Lines for
Reconfigurable ICs
T. R. LaRocca, S. Tam, D. Huang, Q. Gu, E.
Socher, W. Hant, F. Chang
University of California-Los Angeles
TU4D-04: A Ka-band Waveguide
Water-Based Absorptive Switch with an
Integrated Micropump
C. Chen, D. Peroulis
Purdue University, West Lafayette, United
States
TU4D-05: Harmonics Suppression of a
Wilkinson Power Divider Using Spurlines
with Adjustable Rejection Bands
H. Liu1 , R. Cao2 , W. Hu2 , M. Wu2 ,
1Chinese Academy of Sciences, Chengdu,
China, 2Institute of Electronic Engineering in
Eastern China
TU4E: Circuits and Techniques for GHz
Transmission
Chair: Edward Gebara, Quellan Inc.
Co-chair: Hermann Boss, Rohde & Schwarz
Room: A402/403
TU4E-01: A 4.5 GHz to 5.8 GHz Tunable
Digital Receiver with q Enhancement
T. Chalvatzis 1 , 2 , S. P. Voinigescu 1 , 1 University
of Toronto, Toronto, Canada, 2 Broadcom
Corporation, Athens, Greece
TU4E-02: 39.4 Gb/s Data Transmission
over 24.4 Meters of Coaxial Cable using
Duobinary Signaling
J. H. Sinsky 1 , A. Konczykowska 2 , A.
Adamiecki 1 , F. Jorge 2 , M. Duelk 1
1 Bell Laboratories, 2 Alcatel-Thales III-V Lab,
Marcoussis, France
TU4E-03: Active Silicon-Based Shockwave
Formation
J. F. Buckwalter
University of California - San Diego
15:30 15:40
15:50 16:00
16:10 16:20
16:30 16:40
16:50 17:00
TUESDAY
3

4
08:00
08:10 08:20
08:30 08:40
08:50 09:00
09:10 09:20
09:30
WEDnESDAY TECHnICAl SESSIonS 08:00-09:40
WE1A: Electromagnetic Analysis of
Complex Structures
Chair: Natalia K. Nikolova, McMaster
University
Co-chair: Ingo Wolff, IMST GmbH
Room: A311
WE1A-01: Electromagnetic Wave
Propagation in Dispersive Negative Group
S. M. Mikki, A. A. Kishk
University of Mississippi, University, United
States, Velocity Media
WE1A-02: Near-Field Focusing Plates
A. Grbic, L. Jiang, R. Merlin
University of Michigan, Ann Arbor, United
States
WE1A-03: Equivalent Circuit Model to
Explain Extraordinary Transmission
F. Medina, F. Mesa, R. Marqués
University of Seville, Seville, Spain
WE1A-04: Propagation and Band
Broadening Effect of Planar Integrated
Ridged Waveguide in Multilayer Dielectric
Substrates
W. Che 1 , 2 , C. Li 1 , P. Russer 2 , Y. L. Chow 3
1 Nanjing University of Science & Technology,
Nanjing, China, 2 Technische Universität
München, München, Germany, 3 University of
Waterloo, Waterloo, Canada
WE1A-05: Modeling of an Industrial
Microwave Furnace for Metal Casting
Applications
M. H. Awida1 , N. Shah1 , B. Warren2 , A. E.
Fathy1 1University of Tennessee at Knoxville,
Knoxville, United States, 2BWXT-Y12 National
Security Complex, Oak Ridge, United States
WE1A-06: Investigation of Fields and
Currents for Broadband over Power Line
(BPL) Communications
A. Lau1 , D. R. Jackson1 , J. T. Williams1 , F.
Mesa2 , J. Bernal2 1University of Houston, Houston, United
States, 2University of Seville, Seville, Spain
WE1B: Novel Low Phase-Noise
Techniques for vCO’s and
Synthesizers.
Chair: Danny Elad, IBM
Co-chair: Yi-Jan Emery Chen, National
Taiwan University
Room: A312
WE1B-01: A 1.5-v 3-10 GHz 0.18-um
CMOS Frequency Synthesizer for MB-
OFDM UWB Applications
Z. Huang, F. Kuo, W. Wang, M. Chen, C. Wu,
National Chiao Tung University, Hsinchu,
Taiwan
WE1B-02: STPCR Offers Integrable
Alternatives of DRO
U. L. Rohde, A. K. Poddar
Synergy Microwave Corp., Paterson, United
States
WE1B-03: A Low-voltage Low-Phase-
Noise Bottom-Series LC qvCO using
Capacitor Tapping Technique
Y. Zhang1 , P. Liu1 , T. Luo2 , Y. E. Chen2 , D. Heo1 1Washington State University, Pullman,
United States, 1National Taiwan University,
Taipei, Taiwan
WE1B-04: Dual-Band vCO using
Composite Right/Left-Handed
Transmission Line and Tunable Negative
Resistance based on Pin Diode
J. Choi, C. Seo
Soongsil University, Seoul, Republic of Korea
WE1B-05: A High Sensitivity, Low Power
Phase Controlled Current Source for
GSamples/s Phase-Locked Loops
T. Chien, C. Lin, D. Chang, Y. Juang, C. Huang,
National Applied Research Laboratories,
Hsinchu, Taiwan
WE1B-06: Low-Phase-Noise SiGe HBT
vCOs using Trifilar-Transformer Feedback
C. Meng 1 , J. Syu 1 , S. Tseng 1 , Y. Chang 1 , G.
Huang 2
1 National Chiao Tung University , Hsinchu,
Taiwan, 2 National Nano Device Laboratories,
Hsinchu, Taiwan
WE1C: Nonlinear Measurement
Techniques Using CW, Pulsed and
Modulated Excitations
Chair: Dominique Schreurs, Catholic
University of Leuven
Co-chair: Jon Martens, Anritsu Company
Room: A313
WE1C-01: Mixed Analog-Digital
Instrumentation for Software Defined
Radio Characterization
P. M. Cruz1 , N. B. Carvalho1 , K. A. Remley2 ,
K. G. Gard3 ,
1IT-Universidade de Aveiro, Aveiro, Portugal,
2 3 NIST, Boulder, United States, North Carolina
State University, Raleigh, United States
WE1C-02: A Robust Approach for
Comparison and validation of Large
Signal Measurement Systems
T. V. Williams1 , O. Mojón2 , S. Woodington1 , J.
Lees1 , M. Barciela2 , J. Benedikt1 , P. J. Tasker1 1Cardiff University, Cardiff, United Kingdom,
2University of Vigo, Vigo, Spain
WE1C-03: vector and Harmonic
Amplitude/Phase Corrected Multi-
Envelope Stimulus Response
Measurements of Nonlinear Devices
L. C. Betts
Agilent Technologies, Santa Rosa, United
States
WE1C-04: A New Method for the Design of
Multi-Sine Excitations for the Assessment
of Non-linear Devices
J. Su, J. Benedikt, P. Tasker
Cardiff University, Cardiff, United Kingdom
WE1C-05: Time-Frequency
Characterization of Long-Term Memory in
Nonlinear Power Amplifiers
J. Hu1 , K. G. Gard1 , N. B. Carvalho2 , M. B.
Steer1 1North Carolina State University, Raleigh,
United States, 2Instituto de Telecomunicações,
Aveiro, Portugal
WE1C-06: Measurement of ACLR with
High Dynamic Range
O. Andersen1 , D. Wisell2 , N. Keskitalo2 1 2 Ericsson AB, Gävle, Sweden, Ericsson AB,
Stockholm, Sweden

WEDnESDAY TECHnICAl SESSIonS 08:00-09:40
WE1D: Advances in Solid-State
Millimeter-Wave Technology
Robert Weikle, University of Virginia
Edward Niehenke, Niehenke Consulting
Room: A314
WE1D-01: A q-Band MHEMT 100-mW
MMIC Power Amplifier with 46% Power-
Added Efficiency
E. C. Niehenke1 , J. Whelehan1 , D. Xu2 , D.
Meharry2 , K. Duh2 , P. M. Smith2 1JJW Consulting, Inc., Greeley, United States,
2BAE Systems, Nashua, United States
WE1D-02: A Ruggedly Packaged
D-Band GaAs Gunn Diode with Hot
Electron Injection Suitable for volume
Manufacture
N. Farrington1 , P. Norton2 , M. Carr2 , J. Sly1 ,
M. Missous1 1University of Manchester, Manchester, United
Kingdom, 2e2v Technologies (UK) Ltd., Lincoln,
United Kingdom
WE1D-03: A 70-GHz Transformer-Peaking
Broadband Amplifier in 0.13-um CMOS
Technology
J. Jin, S. S. Hsu
National Tsing Hua University, Hsinchu,
Taiwan
WE1D-04: W-Band SiGe LNA using an
Enhanced Unilateral Gain Peaking
J. Alvarado Jr. 1 , 2 , 3 , K. T. Kornegay1 , 3 , B. P.
Welch1 , Y. W. Wang1 1Cornell University, Ithaca, United States,
2Raytheon Company, Tucson, United States,
3Georgia Institute of Technology, Atlanta,
United States
WE1D-06: Low Cost Modular Integrated
Horn Antenna Array Using Heterojunction
Barrier Diode Detectors
H. Kazemi1 , C. N. Nguyen1 , B. Brar1 , G.
Rebeiz2 , G. Nagy1 , L. K. Tran1 , A. C. Young3 1Teledyne Scientific and Imaging LLC,
Thousand Oaks, United States, 2University of California-San Diego (UCSD), San Diego,
United States, 3University WE1E: New Benchmarks in Power
Amplifiers
James Schellenberg, Trex
James Komiak, BAE Systems
Rooms: A315/316
WE1E-01: Wideband 400 W Pulsed Power
GaN HEMT Amplifiers
K. Krishnamurthy, J. Martin, B. Landberg, R.
Vetury, M. J. Poulton
RF Micro Devices, Inc., Charlotte, United States
WE1E-02: A High Efficiency Broadband
Monolithic Gallium Nitride Distributed
Power Amplifier
C. Xie 1 , J. Pavio 1 , D. A. Griffey 2 , A. Hanson 3 ,
S. Singhal 3
1 Rockwell Collins, Inc., Scottsdale, United
States, 2 Rockwell Collins, Inc., Cedar Rapids,
United States, 3 Nitronex Corporation, Durham,
United States
WE1E-03: Over 57% Efficiency C-band GaN
HEMT High Power Amplifier with Internal
Harmonic Manipulation Circuits
H. Otsuka 1 , K. Yamanaka 1 , H. Noto 1 , Y.
Tsuyama 2 , S. Chaki 3 , A. Inoue 1 , M. Miyazaki 1
1 Mitsubishi Electric Corporation, Kamakura,
Japan, 2 Mitsubishi Electric Corporation,
Amagasaki, Japan, 3 Mitsubishi Electric
Corporation, Itami, Japan
WE1E-04: x-Band 14W High Efficiency
Internally-Matched HFET
K. Mori, J. Nishihara, H. Utsumi, H. Takeda, A.
Inoue, M. Miyazaki
Mitsubishi Electric Corporation, Kamakura,
Japan
WE1E-05: High Power and Efficiency
Space Traveling Wave Tube Amplifiers
with Reduced Size and Mass for NASA
Missions
R. N. Simons, J. D. Wilson, D. A. Force
NASA Glenn Research Center, Cleveland,
United States
08:00 08:10
08:20 08:30
08:40 08:50
09:00 09:10
09:20 09:30
WEDnESDAY
5

6
WEDnESDAY InTERACTIVE FoRUM 09:30-11:30
WEP1A
Transmission Line Elements
WEP1A-01: Inkjet Printing of Passive
Microwave Circuitry
O. A. Azucena1 , J. Kubby1 , D. Scarbrough2 , C.
L. Goldsmith2 1University of California-Santa Cruz, Santa
Cruz, United States, 2MEMtronics Corporation,
Plano, United States
WEP1A-02: An Ultra-Wideband Microstrip-to-
CPW Transition
Y. Kim, K. W. Kim, Y. Cho
Kyungpook National University, Daegu, Republic
of Korea
WEP1B
Planar Passive Filters and
Multiplexers
WEP1B-01: A Parameter Extraction
Method for Microwave Direct-Coupled-
Resonator Filters with the Consideration
of Component Losses
H. Lee, C. Tsai
National Cheng Kung University, Tainan,
Taiwan
WEP1C
Non-Planar Passive Filters and
Multiplexers
WEP1C-01: Spurious Suppression of
Dielectric Filters in Practical Wireless
Systems
H. Salehi, R. K. Reddy, T. Lukkarila
S. Amir, Radio Frequency Systems, Meriden,
United States
WEP1C-02: Highly Integrated Triplexers
for WiMAx Applications
D. Kim, D. Kim, J. Ryu, J. Kim
Korea Electronics Technology Institute,
Seongnam-si, Republic of Korea
WEP1C-03: Enhanced Prediction of
Multipaction Breakdown in Passive
Waveguide Components including Space
Charge Effects
S. Anza 1 , C. Vicente 2 , D. Raboso 3 , J. Gil 1 , B.
Gimeno 4 , V. E. Boria 2
1 AURORA Software and Testing S.L., Paterna
(València), Spain, 2 Universidad Politécnica de
Valencia, Valencia, Spain, 3 European Space
Agency, Noordwijk, The Netherlands
WEP1D
Active and Integrated Filters
WEP1D-01: Frequency Agile Bandstop
Filter (FABSF)
A. Roussel 1 , C. W. Nicholls 2 , J. S. Wight 1
1 Carleton University, Ottawa, Canada, 2 Nortel
Networks, Ottawa, Canada
WEP1D-02: Tunable Band Stop Filters
based on Metal-Insulator Transition in
vanadium Dioxide Thin Films
J. Givernaud, C. Champeaux, A. Catherinot,
A. Pothier, P. Blondy
A. Crunteanu, University of Limoges, Limoges,
France
WEP1D-03: Left-Handed Band Pass Filter
Realized by Coupled Negative Order
Resonators
T. Ishizaki1 , M. Tamura1 , C. A. Allen2 , T. Itoh2 1Panasonic Electronic Devices Co., Ltd., Osaka,
Japan, 2University of California at Los Angeles,
Los Angeles, United States
WEP1D-04: Low Profile LTCC Balanced
Filter Based on a Lumped Elements Balun
for WiMAx Applications
S. Sakhnenko, D. Orlenko, K. Markov, A.
Yatsenko, B. Vorotnikov, G. Sevskiy, P. Heide
EPCOS AG, Munich, Germany
WEP1D-05: BST varactor Tuned Bandstop
Filter with Slotted Ground Structure
Y. Chun1 , J. Hong1 , P. Bao2 , T. J. Jackson2 , M.
J. Lancaster2 1Heriot-Watt University, Edinburgh, United
Kingdom, 2University of Birmingham,
Birmingham, United Kingdom
WEP1D-06: Ultra Compact Band
Pass Filters Implemented Through
Complementary Spiral Resonators (CSRs)
M. Gil, J. Bonache, F.Martín
Universitat Autònoma de Barcelona,
Bellaterra (Barcelona), Spain

WEDnESDAY WEP1 — HAll A3 09:30-11:30
WEP1E
PA Devices and ICs
WEP1E-01: A Novel 2–12GHz 14 dBm High
Efficiency Power Distributed Amplifier
for Ultra-Wideband-Applications Using a
Low-Cost SiGe BiCMOS Technology
B. Sewiolo, R. Weigel
University of Erlangen-Nuremberg, Erlangen,
Germany
WEP1E-02: A High Power and High
Efficiency 20 GHz InP HBT Monolithic
Power Amplifier for Phased Array
Applications
M. V. Aust, A. K. Sharma, A. L. Gutierrez-
Aitken
Northrop Grumman, Redondo Beach, United
States
WEP1E-03: Broadband Hybrid Flip-Chip
6-18 GHz AlGaN/GaN HEMT Amplifiers
S. Piotrowicz1 , R. Aubry1 , E. Chartier1 ,
O. Jardel1 , J. C. Jacquet1 , E. Morvan1 , B.
Grimbert2 , G. Lecoustre1 , S.L. Delage1 , J.
Obregon3 , D. Floriot4 1Alcatel-Thales, Marcoussis, France,
2Université de Lille, Villeneuve d’Ascq, F
WEP1E-04: Directional Dual Band
Distributed Power Amplifier with
Composite Left/Right-handed
Transmission Lines
C. Xie
Rockwell Collins, Inc., Scottsdale, United
States
WEP1E-05: A Low-Loss, Wideband
Combiner for Power Amplification at
Ka-Band Frequencies
H. Grubinger, H. Barth, R. Vahldieck
ETH Zurich, Zurich, Switzerland
WEP1E-06: Systematic Waveform
Engineering Enabling High Efficiency
Modes of Operation in Si LDMOS at both
L-band and S-band Frequencies
A. Sheikh1 , C. Roff1 , J. Benedikt1 , P. J. Tasker1 ,
B. Noori1 , 2 , P. Aaen2 , J. Wood2 1Cardiff University, Cardiff, United Kingdom,
2Freescale Semiconductor Inc., Tempe, United
States
WEP1E-07: Highly Efficient Operation
Modes in GaN Power Transistors
Delivering Upwards of 81% Efficiency and
12W Output Power
P. Wright, A. Sheikh, C. Roff, P. J. Tasker, J.
Benedikt
Cardiff University, Cardiff, United Kingdom
WEP1E-08: A Tunable Matching
Network for Power Amplifier Efficiency
Enhancement and Distortion Reduction
J. Fu, A. Mortazawi
University of Michigan, Ann Arbor, United
States
WEP1F
Radars and Broadband
Communication Systems
WEP1F-01: Antenna and Flip-Chip Circuit
Board Design for a 24 GHz Short-Range
Radar Transceiver
M. Notten1 , H. Veenstra1 , E. van der Heijden2 ,
G. Dolmans3 , F. Jansen4 1Philips Research Laboratories, Eindhoven, The
Netherlands, 2NXP Semiconductors Research,
Eindhoven, The Netherlands, 3Holst Centre/
IMEC-NL, Eindhoven, The Netherlands
WEP1F-02: 3-Dimensional Ultra-
Wideband Monopulse Based Direction
Finding
M. D. Blech1 , M. O. Benzinger2 , T. F. Eibert1 1Universität Stuttgart, Stuttgart, Germany,
2Agilent Technologies, Böblingen, Germany
WEP1F-03: Resolution Improvement for
UWB Wallscanning Radar Applications
S. Hantscher, C. G. Diskus, Johannes Kepler
University at Linz, Linz, Austria
WEP1F-04: 60 GHz Single-Chip 90nm
CMOS Radio with Integrated Signal
Processor
S. Sarkar, P. Sen, B. G. Perumana, D. Yeh, D.
Dawn, S. Pinel, J. Laskar
Georgia Institute of Technology, Atlanta,
United States
WEP1F-05: Cancellation of Unwanted
Motion in a Handheld Doppler Radar used
for Non-Contact Life Sign Monitoring
I. Mostafanezhad, O. Boric-Lubecke, V.
Lubecke, A. Host-Madsen
University of Hawaii at Manoa, Honolulu,
United States
WEP1G
Wireless and Cellular Communication
Systems
WEP1G-01: Half-Mode Substrate
Integrated Waveguide Six-Port Front-End
Circuits for Direct-Conversion Transceiver
Design
Y. Ding, K. Wu
École Polytechnique de Montréal, Montréal,
Canada
WEP1G-02: Design and Performance of a
Single Band 1x2 RF Front End Module for
Mobile WiMAx Applications
C. K. Mmasi, R. Wu, V. Govind, S. Dalmia, G.
White
Jacket Micro Devices, Atlanta, United States
WEP1G-03: Novel Double Pole Double
Throw Switchplexer that Simplifies Dual-
Band WLAN and MIMO Front-End Module
Designs
C. P. Huang, W. Vaillancourt, A. Bruce, L.
Thavone, C. Masse, M. Doherty
SiGe Semiconductor, Methuen, United States
WEP1G-04: Experimental Study of the
Effects of RF Front-end Imperfection on the
MIMO Transmitter Performance
S. Bassam 1 , M. Helaoui 1 , S. Boumaiza 2 , F. M.
Ghannouchi 1
1 University of Calgary, Calgary, Canada,
2 University of Waterloo, Waterloo, Canada
WEP1G-05: Cancellation Techniques
for LO Leakage and DC Offset in Direct
Conversion Systems
S. Yamada 1 ,O. Boric-Lubecke 2 , V. M. Lubecke 2
1 Kai Sensors, Inc., Honolulu, United States,
2 University of Hawaii at Manoa, Honolulu,
United States
WEP1H
Sensors and Sensor Systems
WEP1H-01: Microwave Mass Flow Sensor
for Process Monitoring Applications
A. Penirschke 1 , A. Rijiranuwat 2 , R. Jakoby 1
1 TU Darmstadt, Darmstadt, Germany,
2 EUMETSAT, Darmstadt, Germany
WEP1H-02: A Micromachined Airflow
Sensor Based on RF Evanescent-Mode
Cavity Resonator
Y. Zhao, S. Kim, Y. Li, B. Pan, X. Wu, M. M.
Tentzeris, J. Papapolymerou, M. G. Allen
Georgia Institute of Technology, Atlanta,
United States
WEP1H-03: Pressure Micro-Sensor based
on Radio-Frequency Transducer
M. M. Jatlaoui 1 , 2 , P. Pons 1 , H. Aubert 1 , 2
1 LAAS-CNRS, Toulouse, France, 2 Université de
Toulouse, Toulouse, France
WEDnESDAY
7

8
10:10
10:20 10:30
10:40 10:50
11:00 11:10
11:20 11:30
11:40
WEDnESDAY TECHnICAl SESSIonS 10:10-11:50
WE2A: Theory and Applications of
Metamaterials
Jan Machac, Czech Technical University
David R. Jackson, University of Houston
Room: A311
WE2A-01: Revising the Equivalent Circuit
Models of Resonant-Type Metamaterial
Transmission Lines
F. Aznar, M. Gil, J. Bonache, F. Martín,
Universitat Autònoma de Barcelona,
Bellaterra, Spain
WE2A-02: Coupling of Split Ring
Resonators in a Mu-negative volumetric
Metamaterial
J. Machac, J. Zehentner, M. Blaha
Czech Technical University in Prague, Prague
6, Czech Republic
WE2A-03: Dispersion Engineered
Metamaterial-Based Transmission Line
for Conformal Surface Application
M. R. Hashemi, T. Itoh
University of California at Los Angeles, Los
Angeles, United States
WE2A-04: 2.5-D Stacked Composite Right/
Left-Handed Metamaterial Structures
Using Dielectric Resonators and Parallel
Mesh Plates
T. Ueda 1 , N. Michishita 2 , A. Lai 3 , M. Akiyama 1 ,
T. Itoh 3
1 Kyoto Institute of Technology, Kyoto, Japan,
2 National Defense Academy of Japan,
Yokosuka-shi, Japan, 3 University of California
at Los Angeles, Los Angeles, United States
WE2A-05: A 3D Isotropic Left-Handed
Metamaterial Composed of Wired
Metallic Spheres
A. Sanada
Yamaguchi University, Ube, Japan
WE2A-06: A Correlator Sensor Chip Based
on the Integration of Meta-Materials and
Photonic Crystals
C. Lin, I. Mirza, S. Shi, D. W. Prather
University of Delaware, Newark, United States
WE2B Advances in High Frequency
Signal Sources
H. J. Kuno, QuinStar Technology
Prasad Shastry, Bradley University
Room: A312
WE2B-01: A Novel Ring-Based Triple-Push
0.2-to-34 GHz vCO in 0.13-Μμm CMOS
Technology
C. C. Li, C. C. Chen, B. J. Huang, P. C. Huang,
K. Y. Lin, H. Wang
National Taiwan University, Taipei, Taiwan
WE2B-02: A 77-GHz FMCW Radar using a
Digital Phase-Locked Synthesizer
C. Wagner1 , R. Feger1 , A. Haderer1 , A.
Fischer2 , A. Stelzer1 , H. Jäger2 1Johannes Kepler University at Linz,
Linz, Austria, 2Danube Integrated Circuit
Engineering, Linz, Austria
WE2B-03: A Single SiGe Chip Fractional-N
275 MHz…20 GHz PLL with Integrated
20 GHz vCO
R. Follmann1 , D. Köther1 , T. Kohl1 , M. Engels1 ,
T. Podrebersek1 , V. Heyer2 , K. Schmalz3 ,
F. Herzel3 , W. Winkler3 , S. Osmany3 , U.
Jagdhold3 1IMST GmbH, Kamp-Lintfort, Germany,
2Kayser-Threde GmbH, München, Germany,
3IHP, Frankfurt/Oder, Germany
WE2B-04: vertically Integrated voltage-
Controlled Oscillator in LTCC at K-Band
T. Baras, A. F. Jacob
TU Hamburg-Harburg, Hamburg, Germany
WE2B-05: A K-Band quadrature
vCO based on Asymmetric Coupled
Transmission Lines
C. Kim1 , J. Yang1 , D. W. Kim2 , S. Hong1 1Korea Advanced Institute of Science and
Technology (KAIST), Daejeon, Republic of
Korea, 2Chungnam National University,
Daejeon, Republic of Korea
WE2B-06: 27-GHz Low Phase-Noise CMOS
Standing-Wave Oscillator for Millimeter
Wave Applications
T. Huang, P. You
National Cheng Kung University, Tainan,
Taiwan
WE2C: Linear Network Measurement
Andrea Ferrero, Politecnico di Torino
Leonard Hayden, Cascade Microtech Inc.
Room: A313
WE2C-01: On-Wafer Single Contact
quadrature Accuracy Measurement
Using Receiver Mode in Four-Port vector
Network Analyzer
Y. Chang1 , Y. Hsu1 , 2 , S. Lin1 , Y. Juang1 , H.
Chiou2 1National Applied Research Laboratories,
Hsinchu, Taiwan, 2National Central University,
Jhongli, Taiwan
WE2C-02: Low-cost High-resolution
Handheld vNA Using RF Interferometry
K. Will, T. Meyer, A. Omar
Otto-von-Guericke-University of Magdeburg,
Magdeburg, Germany
WE2C-03: Ultra Wide-Band Four-Port
Reflectometer Using Only Two quadratic
Detectors
K. Haddadi, M. Wang, D. Glay, T. Lasri
IEMN, Villeneuve d’Ascq, France
WE2C-04: A Simple Through-Only
De-Embedding Method for On-Wafer S-
Parameter Measurements up to 110 GHz
H. Ito 1 , K. Masu 2
1 Precision and Intelligence Laboratory,
Yokohama, Japan, 2 Integrated Research
Institute, Yokohama, Japan
WE2C-05: A Low Cost Method for Testing
Integrated RF Substrates
A. Goyal, M. Swaminathan
Georgia Institute of Technology, Atlanta,
United States

WEDnESDAY TECHnICAl SESSIonS 10:10-11:50
WE2D: Advanced Techniques for Submm
Wave Generation, Amplification
and Frequency Conversion
Debabani Choudhury, Intel Corporation
John Cunningham, University of Leeds
Room: A314
WE2D-01: High-Power Tunable THz
Generation Based on Photoconductive
Antenna Arrays
M. Jarrahi, T. H. Lee
Stanford University, Stanford, United States
WE2D-02: A 330-GHz MMIC Oscillator
Module
V. Radisic1 , L. Samoska2 , W. Deal1 , X. Mei1 ,
W. Yoshida1 , P. Liu1 , J. Uyeda1 , A. Fung2 , T.
Gaier2 , R. Lai1 1Northrop Grumman Corporation, Redondo
Beach, United States, 2Jet Propulsion
Laboratory, Pasadena, United States
WE2D-03: A Balanced Sub-Millimeter
Wave Power Amplifier
W. R. Deal1 , X. Mei1 , V. Radisic1 , B. Bayuk1 ,
A. Fung2 , W. Yoshida1 , P. Liu1 , J. Uyeda1 , L.
Samoska2 , T. Gaier2 , R. Lai1 1Northrop Grumman Corporation, Redondo
Beach, United States, 2Jet Proopulsion
Laboratory, Pasadena, United
WE2D-04: 250 nm InP DHBT Monolithic
Amplifiers with 4.8 dB Gain at 324 GHz
J. Hacker1 , M. Urteaga1 , D. Mensa1 , R.
Pierson1 , M. Jones2 , Z. Griffith2 , M. Rodwell2 1Teledyne Scientific Company, Thousand Oaks,
United States, 2University of California-Santa
Barbara, Santa Barbara, United States
WE2D-05: A G-band (140 – 220 GHz)
Microstrip MMIC Mixer Operating in both
Resistive and Drain-Pumped Mode
S. E. Gunnarsson1 , N. Wadefalk1 , I. Angelov1 ,
H. Zirath1 , 2 , I. Kallfass3 , A. Leuther3 1Chalmers University of Technology, Göteborg,
Sweden, 2Ericsson AB, Mölndal, Sweden,
3Fraunhofer Institute for Applied Solid State
Physics (IAF), Freiburg, Germany
WE2E: Advancements in the Linearity
of Power Amplifiers
Prof. Paul J. Tasker, Cardiff University
Bumman Kim, POSTECH
Room: A315/316
WE2E-01: Envelope Injection
Consideration of High Power Hybrid EER
Transmitter for IEEE 802.16e Mobile
WiMAx Application
I. Kim1 , J. Moon1 , J. Kim1 , J. Kim1 , C. Seo2 , K.
Sun2 , C. Ahn2 , B. Kim1 1Pohang University of Science and Technology,
Gyeongbuk, Republic of Korea, 2Samsung Electronics Co., Ltd., Suwon, Republic of Korea
WE2E-02: Reduction of Electrical
Baseband Memory Effect in High-
Power LDMOS Devices using Optimum
Termination for IMD3 and IMD5 using
Active Load-Pull
A. Alghanim, J. Lees, T. Williams, J. Benedikt,
P. Tasker
Cardiff University, Cardiff, United Kingdom
WE2E-03: Complexity Reduced Odd-Order
Memory Polynomial Pre-distorter for
400 W Multi-Carrier Doherty Amplifier
Linearization
N. Messaoudi1 , M. C. Fares1 , S. Boumaiza1 ,
J. Wood2 1University of Waterloo, Waterloo, Canada,
2Freescale Semiconductor, Inc. , Tempe, United
States
WE2E-04: A Doherty Power Amplifier with
Extended Resonance Power Divider for
Linearity Improvement
M. Nick, A. Mortazawi
University of Michigan, Ann Arbor, United
States
WE2E-05: Linearity-Optimized Power
Tracking GaN HEMT Doherty Amplifier
Using Derivative Superposition Technique
for Repeater Systems
Y. Lee, M. Lee, Y. Jeong
Pohang University of Science and Technology
(POSTECH), Pohang, Republic of Korea
10:10 10:20
10:30 10:40
10:50 11:00
11:10 11:20
11:30
WEDnESDAY
9

30
WEDNESDAY 12:00-13:15 A305
WIRELESS MEDICAL TECHNOLOGY
Organizer/Moderator: Mark J. Phelps, Ph.D.
Panelists:
• Dr. Mark Allen, Georgia Tech & CTO, CardioMems
• Dr. Leonardo Estevez, Texas Instruments
• Shelley Hartman, LifeSync Corporation
• William Pierce, Foresight Medical
• M.D. Marshall Stanton, Remote Disease Management
• Max Stachura, MD, Georgia Research Alliance, Telemedicine
• Robert Schmidt, Cleveland Medical Devices
Sponsor: IMS 2008
WEDnESDAY PAnEl SESSIonS
Abstract: The convergence of data and its conversion into valuable
information in the commercial world is also being applied to the health
care industry. Today, many hospitals are still hard wired and paperbased
because systems do not share data. Remote locations (e.g., first
responders) are often unable to capture and transmit critical patient
care information. Improved acquisition, data integrity, convenience, and
safety are improved through these emerging wireless systems. However,
justification for the technology in terms of cost versus clinical benefit is
often a barrier to acceptance. It is often unclear who pays for and owns the
data, integration, and synthesis to result in optimized patient care? Who is
liable? Can third parties do it effectively? Wireless feedback systems could
enable the movement of health care from a symptom and procedure based
model to a preventative data-driven disease progression inhibitor and/or
health preservation model. To do this, the medical industry will need to
learn to utilize these tools effectively, efficiently, and in concert to result
in optimum patient outcomes. This panel will discuss the barriers to entry,
value proposition, and path to future acceptance and utilization of this key
wireless technology.
WEDNESDAY 12:00-13:15 A302
THE RISE OF SYSTEM AND SERvICE ENGINEERING
Chairs/Moderators:
• Dr. Barry Spielman, Washington University
• Dr. Michael Steer, North Carolina State University
• Dr. Rolf Jansen, Aachen University
Panelists:
• Dr. Gerald M. Borsuk, Naval Research Laboratory
• Dr. Robert Jackson, University of Massachusetts Amherst
• Dr. Linda Katehi, University of Illinois Urbana Champaign
• Dr. Charles F. Krumm, Cosemi Technologies, Inc
• Dr. Rick Martin, Boeing
• Dr. David M. McQuiddy, TriQuint
• Dr. Christopher Snowden, University of Surrey
Sponsor: MTT-6 Microwave
Abstract: During the past several years there has been a trend in industry
to shift from innovation, design, and fabrication of electronic devices
and components to innovation, design, and assembly of systems and
subsystems that employ electronic devices/components, either already
available within a company or available commercially. The emphasis has
shifted to use of existing technologies to achieve new system solutions and
innovations instead of continued development of base technologies. This
type of system engineering has become known as “service engineering” in
many corporate circles. Many companies also provide services to facilitate
those who implement actual systems and this is an alternative definition
of “service engineering.” Whichever definition is taken, the clear trend is
that realizing new systems and focusing on innovative system solutions
is a higher return on investment than investing in advanced technologies.
Companies are not abandoning core technologies but believe it is key to
exploit them in multiple, innovative, system and subsystem products.
The trend described has led to the restructuring of many companies and,
correspondingly, to the education and training of engineers to meet
the needs of technology-based companies. Industry, Governments and
Universities are attempting to revise the approach to educating engineers
to meet the demand for engineers who can thrive in the service engineering
environment. Members of the microwave community must understand
these trends and adapt to and thrive within this changing environment.

3
13:20
13:30 13:40
13:50 14:00
WE3A: Planar Filters I
Chi Wang, Orbital Sciences Corporation
Kawthar Zaki, University of Maryland
WE3A-03: Planar quintuple-Mode
Resonator Bandpass Filters with Sharp
Transition and Wide Stopband
Y. Chiou, Y. Lee, J. Kuo, C. Chen
National Chiao Tung University, Hsinchu,
Taiwan
WE3A-04: Rectangular Stubs in Microstrip
or Stripline Using v-lines
R. Levy
R. Levy Associates, La Jolla, United States
WE3B; Low Noise Devices and Circuits
Phil Smith, BAE Systems
Marian Pospieszalski, NRAO
WE3C: Nonlinear Device Modeling
Wayne Struble, Triquint Semiconductor
Matthias Rudolph, Ferdinand-Braun-Institut
(FBH)
Room: A313
WE3C-01: Modeling Fast Switching
Speed PIN Diodes for RF and Microwave
Applications
R. H. Caverly, A. M. Reif
Villanova University, Villanova, United States
Room: A311
Room: A312
WE3A-01: A Multi-Resolution Channel- WE3B-01: Low Noise Amplifier for 180
Select Filter with Ultra-Wide Frequency GHz Frequency Band
Coverage
P. Kangaslahti
M. Koochakzadeh, A. Abbaspour-Tamijani
Arizona State University, Tempe, United States
1 , D. Pukala1 , T. Gaier1 , W. Deal2 ,
X. Mei2 , R. Lai2 1Jet Propulsion Laboratory, Pasadena, United
States, 1Northrop Grumman Corporation,
Redondo Beach, United States
WE3A-02: A Novel Compact Ultra-
Wideband Bandpass Filter using
Microstrip Stub-Loaded Dual-Mode
Resonator Couples
Z. Ma1 , W. He2 , C. Chen3 , Y. Kobayashi1 , T.
Anada3 WE3B-02: q-band Low Noise Amplifiers
Using a 0.15-_m MHEMT Process for
Broadband Communication and Radio
Astronomy Applications
S. Weng
1Saitama University, Saitama, Japan,
2Shanghai University, Shanghai, China,
3Kanagawa University, Yokohama, Japan
1 , C. Lin1 , H. Chang1 , C. Chiong2 WE3C-02: A Nonlinear Electro-Thermal
Model for High Power RF LDMOS
Transistors
D. Bridges, J. Wood, M. Guyonnet, P. H. Aaen
Freescale Semiconductor Inc., Tempe, United
1National Central University, Jhongli, Taiwan, States
2Academia Sinica, Taipei, Taiwan
WE3B-03: Experimental Cryogenic
WE3C-03: A Scalable Compact Model for
Modeling and Noise of SiGe HBTs
III-v Heterojunction Bipolar Transistors
J. C. Bardin, S. Weinreb
S. R. Nedeljkovic, J. R. McMacken, J. M.
California Institute of Technology, Pasadena, Gering, D. Halchin
United States
RFMD, Greensboro, United States
14:10 14:20
14:30 14:40
WEDnESDAY TECHnICAl SESSIonS 13:20-15:00
WE3A-05: New Differential PSL Coupled
Resonator Filters
S. F. Peik, F. Langner
Bremen University of Applied Sciences,
Bremen, Germany
WE3B-04: Thermal Characterization
of the Intrinsic Noise Parameters for
AlGaN/GaN HEMTs
M. Thorsell, K. Andersson, M. Fagerlind, M.
Südow, P. Nilsson, N. Rorsman
Chalmers University of Technology, Göteborg,
Sweden
WE3B-05: DC-to-40GHz MMIC Traveling
Wave Power Splitter for Airborne Systems
R. S. N’Gongo1 , 2 , K. Y. Varma2 , P. Ratna2 , V.
Kirty2 1J&R Microwave Solutions Ltd., Toulouse,
France, 2Astra Microelectronics Tech. Ltd.,
Hyderabad, India
WE3C-04: Large-Signal Hybrid
Compact/Behavioral HBT Model for III-v
Technology Power Amplifiers
T. S. Nielsen, S. Nedeljkovic, D. Halchin,
RFMD Inc., Greensboro, United States
WE3C-05: Limitations of Current Compact
Transit-Time Models for III-v-Based HBTs
M. Rudolph
Ferdinand-Braun-Institut (FBH), Berlin,
Germany

WEDnESDAY TECHnICAl SESSIonS 13:20-15:00
WE3D: RF-over-Fiber Links and
Components
Ronald Reano, Ohio State University
Chris Scholz, LeCroy
Room: A314
WE3D-01: Performance Evaluation of
Multiband Radio-over-Fiber for WLAN,
Gigabit Ethernet and UWB
M. Yee, Y. Guo, V. Pham, L. Ong
A-STAR, Singapore, Singapore
WE3D-02: MultiGbit/s Transmission over a
Fiber Optic mm-wave Link
I. Gonzalez Insua, K. Kojucharow, C. G.
Schäffer
TU Dresden, Dresden, Germany
WE3D-03: High-Power Modified Uni-
Traveling Carrier Photodiode with > 50
dBm Third Order Intercept Point
A. Beling, H. Pan, H. Chen, J. C. Campbell
University of Virginia, Charlottesville, United
States
WE3D-04: Radio-Over-Fiber Systems for
WLAN Based on CMOS-Compatible Si
Avalanche Photodetectors
H. Kang, M. Lee, W. Choi
Yonsei University, Seoul, Republic of Korea
WE3D-05: A Broadband High Dynamic
Range Analog Photonic Link using Push-
Pull Directly-Modulated Semiconductor
Lasers
D. A. Marpaung, C. G. Roeloffzen, W. C. van
Etten
University of Twente, Enschede, the
Netherlands
WE3E: Frequency-Domain Techniques
Luca Perregrini, University of Pavia
Adalbert Beyer, University of Duisburg-Essen
Room: A315/316
WE3E-01: A Derived Circuit Model
for Spiral Inductors on Lossy Silicon
Substrate
K. Yang1 , H. Hu1 , K. L. Wu1 , W. Y. Yin2 , J. F.
Mao2 1The Chinese University of Hong Kong, Hong
Kong, Hong Kong, 2Shanghai Jiao Tong
University, Shanghai, China
WE3E-02: Modeling of Losses in Substrate
Integrated Waveguide by Boundary
Integral-Resonant Mode Expansion
Method
M. Bozzi1 , L. Perregrini1 , K. Wu2 1 2 University of Pavia, Pavia, Italy, École
Polytechnique de Montréal, Montréal, Canada
WE3E-03: Electromagnetic Macro-
Modeling of 3D High Density Trenched
Silicon Capacitors for Wafer-Level-
Packaging
S. Wane1 , V. Mühlhaus2 , J. Rautio2 1 2 NXP-Semiconductors, Caen, France, Sonnet
Software, Witten, Germany
WE3E-04: A Novel Boundary Element
Method with Surface Conductive
Absorbers for 3-D Analysis of
Nanophotonics
L. Zhang, J. Lee, A. Farjadpour, J. K. White, S.
G. Johnson
Massachusetts Institute of Technology,
Cambridge, United States
WE3E-05: Sensitivity Analysis of
S-parameters Including Port variations
Using the Transfinite Element Method
L. Vardapetyan, J. Manges, Z. Cendes
Ansoft Corporation, Pittsburgh, United States
13:20 13:30
13:40 13:50
14:00 14:10
14:20 14:30
14:40
WEDnESDAY
33

34
WEDnESDAY InTERACTIVE FoRUM 14:00-16:00
WEP2A
Passive Circuit Elements
WEP2A-01: Notes on Bandpass Filters Whose
Inter-Resonator Coupling Coefficients are
Linear Functions of Frequency
S. Amari 1 , M. Bekheit 2 , F. Seyfert 3
1 Royal Military College of Canada, Kingston,
Canada, 2 Queen’s University, Kingston, Canada,
3 INRIA, Sophia-Antipolis, France
WEP2A-02: Miniaturized Ultra-Wideband
Self-Complementary Antennas Using
Shunted Spiral Inductors
A. Saitou 1 , Y. Ohhashi 1 , K. Honjo 2 , K. Takahashi 1
1 YKC Corporation, Musashi-Murayama, Japan,
2 The University of Electro-Communications,
Chofu, Japan
WEP2A-03: A Miniature Lumped Element
LTCC Bandpass Filter with High Stopband
Attenuation for GPS Applications
G. M. Brzezina, L. Roy
Carleton University, Ottawa, Canada
WEP2A-04: A New Ultra Wideband
Directional Coupler Based on a Combination
between CB-CPW and Microstrip
Technologies
M. Nedil, T. A. Denidni
Université de Québec, Montréal, Canada
WEP2A-05: Designs of Dual-Band Wilkinson
Power Dividers with Flexible Frequency
Ratios
H. Zhang, H. Xin
University of Arizona, Tucson, United States
WEP2A-06: A Novel Planar Dual-Band
Branch Line Coupler Using Defect Ground
Structure
C. You, X. Zhu
Southeast University, Nanjing, China
WEP2A-07: Accurate and Efficient Design
Approach of Substrate Integrated
Waveguide Filter Using Numerical TRL
Calibration Technique
X. Chen, K. Wu
École Polytechnique de Montréal, Montréal, Canada
WEP2A-08: A Ka-Band Multilayer LTCC
4-pole Bandpass Filter using Dual-Mode
Cavity Resonators
K. Ahn, I. Yom
Electronics and Telecommunications Research
Institute, Daejeon, Republic of Korea
WEP2A-09: Small Form-Factor Integrated
Balun with Complex Impedance Matching
K. Liu1 , R. Emigh1 , R. Frye2 1 2 STATS ChipPAC, Inc., Tempe, United States, RF Design
Consulting, LLC, Berkeley Heights, United States
WEP2A-10: A Planar Ultra-Wideband
Balanced Doubler
Y. Kim1 , K. W. Kim1 , 2 , Y. Cho1 1 Kyungpook National University, Daegu,
Republic of Korea, 2 EM-wise Communications
Co., Daegu, Republic of Korea
WEP2A-11: High Performance Bandstop
Filter Design and Investigation using
Physical Model for WiMAx Measurement
Equipment
K. Ma 1 , R. M. Jayasuriya 1 , K. Chan 2
1 ST Electronics, Singapore, Singapore, 2 MEDs
Technologies Pte Ltd, Singapore, Singapore
WEP2B
Ferroelectric, Ferrite and Acoustic
Wave Components
WEP2B-01: A Circuit Model for Nonlinear
Simulation of Radio-Frequency Filters
Employing Bulk Acoustic Wave Resonators
M. Ueda 1 , 2 , M. Iwaki 1 , T. Nishihara 1 , Y. Satoh 1 , K.
Hashimoto 2
1 Fujitsu Labs. LTD., Akashi, Japan, 2 Chiba
University, Chiba, Japan
WEP2B-02: Surface Acoustic Wave Filter in
High Frequency with Narrow Bandwidth
and Excellent Temperature Characteristic
T. Murata, M. Kadota, T. Nakao, K. Matsuda
Murata MFG. Co. Ltd., Kyoto, Japan
WEP2B-03: Third Order Intermodulation
Distortion in Film Bulk Acoustic Resonators
at Resonance and Antiresonance
E. Rocas 1 , C. Collado 1 , J. Mateu 1 , 2 , H.
Campanella 3 , J. M. O’Callaghan 1
1 UPC, Barcelona, Spain, 2 CTTC, Castelldefels,
Spain, 3 CNM-CSIC, Bellaterra, Spain
WEP2B-04: Strontium Titanate DC Electric
Field Switchable and Tunable Bulk Acoustic
Wave Solidly Mounted Resonator
G. N. Saddik, D. S. Boesch, S. Stemmer, R. A. York
University of California Santa Barbara, Santa
Barbara, United States
WEP2C
MEMS Components and Technologies WEP2D
Semiconductor Devices and
Monolithic IC Technologies
WEP2C-01: Continuously Tunable RF-MEMS
varactor for High Power Applications
S. Leidich 1 , S. Kurth 2 , T. Gessner 1 , 2
1 Chemnitz University of Technology, Chemnitz,
Germany, 2 Fraunhofer IZM, Chemnitz, Germany
WEP2C-02: A 40/50 GHz Diplexer
Realized with Three Dimensional Copper
Micromachining
J. R. Reid, D. Hanna, R. T. Webster
Air Force Research Laboratory, Hanscom AFB,
United States
WEP2C-03: Effect of Dielectric Film
Thickness on Dielectric Charging of RF MEMS
Capacitive Switches
R. A. Daigler 1 , G. Papaioannou 2 , E. Papandreou 2 ,
J. Papapolymerou 1
1 Georgia Institute of Technology, Atlanta, United
States, 2 University of Athens, Athens, Greece
WEP2C-04: Improved Distributed MEMS
Matching Network for Low Frequency
Applications Using a Slow-Wave Structure
F. Domingue 1 , 2 , A. B. Kouki 1 , R. R. Mansour 2
1 École de technologie supérieure, Montréal,
Canada, 2 University of Waterloo, Waterloo,
Canada
WEP2C-05: High-q RF MEMS Capacitor with
Digital/Analog Tuning Capabilities
A. Grichener, B. Lakshminarayanan, G. M.
Rebeiz
University of California-San Diego, La Jolla,
United States
WEP2D-01: Intergate-Channel-Connected
Multi-Gate PHEMT Devices for Antenna
Switch Applications
S. Koya 1 , T. Ogawa 1 , H. Takazawa 1 , A. Nakajima 2 ,
S. Osakabe 2 , Y. Shigeno 2 , S. Takatani 1
1 Hitachi, Ltd., Kokubunji-shi, Japan, 2 Renesas
Technology Corp., Takasaki-shi, Japan
WEP2D-02: An Efficient Technique for
Designing Balanced vector Modulators with
Low Insertion Loss
Y. Hou, X. Sun, L. Li
Chinese Academy of Science, Shanghai, China
WEP2D-03: A Monolithic, 1000 Watt SPDT
Switch
T. E. Boles, J. Brogle, A. Rozbicki
M/A-COM, Inc., Lowell, United States
WEP2D-04: A Low Phase-Shift Temperature
Compensation Attenuator with variable-q
FET Resonators
M. Hangai 1 , H. Asao 2 , M. Hieda 1 , H. Takeda 2 , M.
Yamaguchi 3 , M. Miyazaki 1
1 Mitsubishi Electric Corporation, Kamakura,
Japan, 2 Mitsubishi Electric Corporation,
Amagasaki, Japan, 3 Mitsubishi Electric
Corporation, Itami, Japan
WEP2D-05: A K-band AlGaN/GaN-based
MMIC Amplifier with Microstrip Lines on
Sapphire
T. Murata 1 , M. Kuroda 1 , S. Nagai 2 , M. Nishijima 1 ,
H. Ishida 1 , M. Yanagihara 1 , T. Ueda 1 , H. Sakai 1 , T.
Tanaka 1 , M. Li 2
1 Matsushita Electric Industrial Co., Ltd.,
Nagaokakyo-shi, Japan, 2 Panasonic Technologies
Company, Cambridge, United States

WEDnESDAY WEP2 — HAll A3 14:00-16:00
WEP2E
Packaging, Interconnects, MCMs and
Hybrid Manufacturing
WEP2E-01: Wideband Electrical Modeling
of Large Three-Dimensional Interconnects
using Accelerated Generation of Partial
Impedances with Cylindrical Conduction
Mode Basis Functions
K. Han, M. Swaminathan, E. Engin
Georgia Institute of Technology, Atlanta,
United States
WEP2E-02: Utilizing Infrared for
Improved Channel Temperature
Prediction
A. Darwish1 , A. Bayba2 , H.A. Hung2 1 2 GTS, Little Rock, United States, ARL, Adelphi,
United States
WEP2E-03: Design, Integration and
Characterization of a Novel Paper-based
Wireless Sensor Module
R. Vyas, A. Rida, L. Yang, M.M. Tentzeris
Georgia Institute of Technology, Atlanta,
United States
WEP2F
Biological Effects and Medical
Applications
WEP2F-01: Miniature Antenna for RF
Telemetry through Ocular Tissue
E. Y. Chow, C. Yang, A. Chlebowski, W. J.
Chappell, P. P. Irazoqui
Purdue University, West Lafayette, United
States
WEP2F-02: A Tapered Microstrip Patch
Antenna Array for Microwave Breast
Imaging
J. P. Stang, W. T. Joines
Duke University, Durham, United States
WEP2G
Smart Antennas, Spatial Power
Combining and Phased Arrays
WEP2G-01: Integrated Mixer based on
Composite Right/Left-Handed Leakywave
Antenna
Y. Kim1 , E. Kim1 , A. Lai2 , D. S. Goshi2 , T. Itoh2 1Kumoh National Institute of Technology,
Gyungbuk, Republic of Korea, 2University of
California-Los Angeles, United States
WEP2G-02: Blind Source Separation
of Human Body Motion using Direct
Conversion Doppler Radar
A. Vergara, N. Petrochilos, O. Boric-Lubecke,
V. Lubecke
University of Hawaii at Manoa, Honolulu,
United States
WEP2G-03: A Self-Steering Array Using
Power Detection and Phase Shifting
J. M. Akagi, A. Zamora, M. K. Watanabe, W.
A. Shiroma
University of Hawaii at Manoa, Honolulu,
United States
WEDnESDAY
35

36
15:30
15:40 15:50
16:00 16:10
16:20 16:30
16:40 16:50
WEDnESDAY TECHnICAl SESSIonS 15:30-17:10
WE4A: Planar Filters II
Jeff Pond, Naval Research Lab
Raafat Mansour, University of Waterloo
Room: A311
WE4A-01: Parallel-Coupled Microstrip
Filters with Periodic Floating-Conductors
on Coupled-Edges for Spurious
Suppression
T. Yamaguchi1 , T. Fujii2 , T. Kawai1 , I. Ohta1 1 2 University of Hyogo, Himeji, Japan, Fujitsu
Limited, Kawasaki, Japan
WE4A-02: A Miniaturized Microstrip Ring
Resonator Lowpass Filter with Sharp
Attenuation
T. Wuren, I. Sakagami, M. Fujii, M. Tahara
University of Toyama, Toyama-shi, Japan
WE4A-03: Design of Dual- and
Triple-Passband Bandpass Filters with
Interdigital Resonators
C. Tang, L. Lu, C. Shen, J. Wu
National Chung Cheng University, Chia-Yi,
Taiwan
WE4A-04: Design Procedure of Low Cost
Substrate Microstrip Filters based on
Nonresonating Nodes
S. Cogollos 1 , V. Boria 1 , R. J. Cameron 2 , R. R.
Mansour 3
1 Universidad Politécnica de Valencia, Valencia,
Spain, 2 COMDEV, Cambridge, Canada,
3 University of Waterloo, Waterloo, Canada
WE4A-05: Improvement of Stopband
Performance in Parallel-Coupled
Bandpass Filters using quasi-Lumped
Elements
V. Zhurbenko, V. Krozer, P. Meincke
Technical University of Denmark, Kgs. Lyngby,
Denmark
WE4B: High-Performance Frequency
Conversion and Control Integrated
Circuits
Deuk Hyoun Heo, Washington State University
Jae-Sung Rieh, Korea University
Room: A312
WE4B-01: A q-band Low Loss Reduced-
Size Filter-Integrated SPDT Switch using
0.15-um MHEMT Technology
J. Lee1 , R. Lai1 , K. Lin1 , C. Chiong2 , H. Wang1 1National Taiwan University, Taipei, Taiwan,
2Academia Sinica, Taipei, Taiwan
WE4B-02: 3W SPDT Antenna Switch
Design Using Standard 0.18 um CMOS
Process
M. Ahn1 , C. Lee2 , B. Kim3 , J. Laskar1 1Georgia Institute of Technology, Atlanta,
United States, 2Samsung RFIC Design Center,
Atlanta, United States, 3Sungkyunkwan University, Suwon, Republic of Korea
WE4B-03: A 60dB Harmonic Mixing
Reduction Mixer for Wideband
Applications
C. Li, P. Huang
National Tsing Hua University, Hsinchu,
Taiwan
WE4B-04: A v-band Wide Locking Range
CMOS Frequency Divider
T. Luo1 , Y. E. Chen1 , D. Heo2 1National Taiwan University, Taipei, Taiwan,
2Washington State University, Pullman,
United States
WE4C: Tags and Sensors
Alan Jenkins, Tyco Electronics
Hiroshi Kondoh, Hitachi
Room: A313
WE4C-01: Complex Signal Demodulation
and Random Body Movement
Cancellation Techniques for Non-Contact
vital Sign Detection
C. Li, J. Lin
University of Florida, Gainesville, United
States
WE4C-02: Regenerative Backscatter
Transponder using the Switched
Injection-Locked Oscillator Concept
M. Vossiek1 , T. Schäfer1 , D. Becker2 1Clausthal University of Technology,
Clausthal-Zellerfeld, Germany, 2Symeo GmbH,
Neubiberg / Munich, Germany
WE4C-03: A Smart Beam Steering RFID
Interrogator For Passive Tags in Item
Level Tagging Applications
M. Y. Chia, K. C. Ang, K. Chee, S. Leong
A-STAR, Singapore, Singapore
WE4C-04: A Dual-Resonant Microstrip-
Based UHF RFID “Cargo” Tag
S. R. Aroor, D. D. Deavours
University of Kansas, Lawrence , United States
WE4C-05: Miniaturized Patch Antenna
for the Radio Frequency Identification of
Metallic Objects
A. Ghiotto 1 , S. F. Cantalice 1 , 2 , T. Vuong 1 , A.
Pouzin 1 , G. Fontgalland 2 , S. Tedjini 1
1 Grenoble Polytechnic Institute, Valence,
France, 2 Federal University of Campina
Grande, Campina Grande, Brazil

WEDnESDAY TECHnICAl SESSIonS 15:30-17:10
WE4D: Microwave Photonic
Technologies and Systems
Dieter Jaeger, University of Duisburg-Essen
Edward Rezek, Northrop Grumman
Room: A314
WE4D-01: Fiber-Fed 60-GHz Self-
Heterodyne Systems using Self-
Oscillating Harmonic Optoelectronic
Mixers Based on CMOS-Compatible APDs
M. Lee, H. Kang, K. Lee, W. Choi
Yonsei University, Seoul, Republic of Korea
WE4D-02: New Label Processing for
Routing Optical Packets
G. Kovács1 , T. Berceli1 , J. Capmany2 , B.
Ortega2 , D. Pastor2 , A. Martinez2 , G. Puerto2 ,
T. Bánky1 , M. Csörnyei1 , M. D. Manzanedo2 1Budapest University of Technology and
Economics, Budapest, Hungary, 2Universidad Politécnica de Valencia, Valencia, Spain
WE4D-03: Pure 2.5 Gb/s 16-qAM Signal
Generation with Photonic vector
Modulator
J. L. Corral1 , R. Sambaraju1 , M. A. Piqueras2 ,
V. Polo1 1Universidad Politécnica de Valencia, Valencia,
Spain, 2DAS Photonics, S.L, Valencia, Spain
WE4D-04: Photonic Instantaneous
Frequency Measurement using Non-
Linear Optical Mixing
N. Sarkhosh, H. Emami, L. A. Bui, A. Mitchell
Royal Melbourne Institute of Technology
(RMIT), Melbourne , Australia
WE4D-05: Microwave Signal Generation
using Self-Heterodyning of a Fast
Wavelength Switching SG-DBR Laser
M. A. Bernacil, S. O’Connor, B. Maher, A.
Dekelaita, D. Derickson
California Polytechnic State University, San
Luis Obispo, United States
WE4E: Linear Device Modeling
Peter H. Aaen, Freescale Semiconductor, Inc.
Mohamed Megahed, Intel Corporation
Room: A315/316
WE4E-01: An Extrinsic Component
Parameter Extraction Method for High
Power RF LDMOS Transistors
J. Wood1 , D. Lamey1 , M. Guyonnet1 , D. Chan1 ,
D. Bridges1 , N. Monsauret2 , P. H. Aaen1 1 Freescale Semiconductor, Tempe, United
States, 2 Freescale Semiconductor, Toulouse,
France
WE4E-02: A Novel Passivity verification
and Enforcement Algorithm for
Macromodels of Microwave Devices
C. Walkey1 , D. W. Paul1 , M. S. Nakhla1 , R.
Achar1 , A. Weisshaar2 1 2 Carleton University, Ottawa, Canada, Oregon
State University, Corvallis, United States
WE4E-03: Support-vector-Regression-
Based Output Space-Mapping for
Microwave Device Modeling
S. Koziel, J. W. Bandler
McMaster University, Hamilton, Canada
15:30 15:40
15:50 16:00
16:10 16:20
16:30 16:40
16:50
WEDnESDAY
37

38
08:00
08:10 08:20
08:30 08:40
08:50
09:00
09:10 09:20
09:30
THURSDAY TECHnICAl SESSIonS 08:00-09:40
TH1A: Filter Theory and New
Concepts
Giuseppe Macchiarella, Politecnico di Milano
Huiwen Yao, Orbital Sciences Corp.
Room: A311
TH1A-01: Novel Waveguide Pseudo-
Elliptic Filters using Slant Ridge
Resonators
S. Bastioli1 , L. Marcaccioli2 , R. Sorrentino1 1 2 University of Perugia, Perugia, Italy, RF
Microtech s.r.l., Perugia, Italy
TH1A-02: Design of a Coaxial Resonator
Filter with Nonuniform Dissipation
Z. Zakaria, I. C. Hunter, A. C. Guyette
University of Leeds, Leeds, United Kingdom
TH1A-03: Generalized Lossy Microwave
Filter Coupling Matrix Synthesis and
Design
V. Miraftab, M. Yu
COM DEV Ltd.,Cambridge, Canada
TH1A-04: Longitudinal Dual-Mode Filters
in Rectangular Waveguide
J. A. Ruiz-Cruz1 , Y. Zhang2 , J. R. Montejo-
Garai3 , J. M. Rebollar3 , K. A. Zaki4 1Universidad Autónoma de Madrid, Madrid,
Spain, 2RFS-Radio Frequency Systems,
Meriden, United States, 3Universidad Politécnica de Madrid, Madrid, Spain,
4University of Maryland, College Park, United
States
TH1A-05: Enhanced Topology for the
Design of Bandpass Elliptic Filters
Employing Inductive Windows and
Dielectric Objects
M. Martínez-Mendoza1 , F. J. Pérez-Soler1 ,
J. S. Gómez-Díaz1 , F. Quesada-Pereira1 , A.
Alvarez-Melcon1, R. Cameron2 1Technical University Cartagena, Cartagena,
Spain, 2COM DEV International Ltd, Aylesbury,
United Kingdom
TH1A-06: A Novel Low-loss Integrated
60 GHz Cavity Filter with Source-Load
Coupling using Surface Micromachining
Technology
B. Pan, Y. Li, M. M. Tentzeris, J.
Papapolymerou
Georgia Institute of Technology, Atlanta,
United States
TH1B: High Power Amplifiers for
Infrastructure Applications
Aryeh Platzker, Raytheon
John Heaton, BAE Systems
Room: A312
TH1B-01: 10W Ultra-Broadband Power
Amplifier
A. K. Ezzeddine, H. C. Huang
AMCOM Communications, Inc., Gaithersburg,
United States
TH1B-02: High Linearity 40 Watt, 28v
InGaP/GaAs HBT
W. Ma 1 , X. Sun 1 , P. Hu 1 , J. Yao 1 , B. Lin 1 , H.
Chau 1 , L. Liu 1 , C. Lee 1 , 2
1 WJ Communications, Inc., San Jose, United
States, 2 National Chiao Tung University,
Hsinchu, Taiwan
TH1B-03: Characterization and Thermal
Analysis of a 48 v GaN HFET Device
Technology for Wireless Infrastructure
Applications
B. Green, H. Henry, J. Selbee, F. Clayton,
K. Moore, M. CdeBaca, J. Abdou, C. Liu, O.
Hartin, D. Hill, M. Miller
Freescale Semiconductor, Inc.,Tempe, United
States
TH1B-04: A 2-stage 150W 2.2GHz Dual
Path LDMOS RF Power Amplifier for High
Efficiency Applications
C. Cassan 1 , J. Jones 2 , O. Lembeye 1
1 Freescale Semiconducteurs SAS, Toulouse,
France, 2 Freescale Semiconductors Inc., Tempe,
United States
TH1C: Dual-Band Passive
Components
Magdalena Salazar - Palma, Universidad
Carlos III de Madrid
Mohamed Abouzahra, MIT Lincoln
Laboratory
Room: A313
TH1C-01: Compact Single and Dual Band
Zero-degree Metamaterial N-way Radial
Power Combiner/Divider
A. Dupuy, A. Gummalla, M. Achour, G.
Poilasne
Rayspan Corporation, San Diego, United
States
TH1C-02: Dual-Band Y-Junction Power
Dividers Implemented Through Artificial
Lines Based on Complementary
Resonators
G. Sisó, J. Bonache, F. Martín
Universitat Autònoma de Barcelona,
Bellaterra (Barcelona), Spain
TH1C-03: A Compact Dual-Band
Metamaterial-Based Rat-Race Coupler for
a MIMO System Application
P. Chi1 , C. Lee2 , T. Itoh1 1University of California- Los Angeles, Los
Angeles, United States, 2Rayspan Corporation,
San Diego, United States
TH1C-04: Miniaturized DBR Filter:
Formulation and Performances
Improvement
H. Issa, J. Duchamp, P. Ferrari
IMEP-LAHC, Minatec-Grenoble, France
TH1C-05: Dual-Band Bandpass Filter and
Diplexer Based on Double-Sided Parallel-
Strip Line
J. Chen, Q. Xue
City University of Hong Kong, Hong Kong,
China
TH1C-06: Dual-Band Marchand Baluns
W. M. Fathelbab
South Dakota School of Mines and
Technology, Rapid City, United States

THURSDAY TECHnICAl SESSIonS 08:00-09:40
TH1D: Microwave & Millimeter Wave
Phased Array & Applications
Nicholas Buris, Motorola-Schaumburg
Constantine A. Balanis, Arizona State
University
Room: A314
TH1D-01: A Feedback-Based Distributed
Phased Array Technique and its
Application to 60-GHz Wireless Sensor
Network
M. Seo, M. Rodwell, U. Madhow
University of California-Santa Barbara, Santa
Barbara, United States
TH1D-02: A Tunable Concurrent 6-to-18
GHz Phased-Array System in CMOS
H. Wang1 , S. Jeon1 , Y. Wang1 , F. Bohn1 , A.
Natarajan2 , A. Babakhani1 , A. Hajimiri1 1California Institute of Technology, Pasadena,
United States, 2IBM T.J. Watson Research
Center, Yorktown Heights, United States
TH1D-03: A Novel Modularized Folded
Highly Compact LTCC Butler Matrix
G. Tudosie1 , R. Vahldieck1 , A. C. Lu2 1 2 ETH Zurich, Zurich, Switzerland, Singapore
Institute of Manufacturing Technology,
Singapore, Singapore
TH1D-04: Architecture for Low Cost
Electronically Steered Phased Arrays
M. Sanchez-Barbetty, R. W. Jackson
University of Massachusetts at Amherst,
Amherst, United States
TH1D-05: An Electronically Scanned Array
with 180° Scanning Range Using Coupled
Phase-Locked Loops
S. Yan, T. Chu
National Taiwan University, Taipei, Taiwan
TH1D-06: Millimeter-Wave Substrate
Integrated Waveguide Multi-Beam
Antenna Based on the Modified R-KR
Lens
Y. Cheng, W. Hong
Southeast University, Nanjing, China
TH1E: History of MIC/MMIC
Inventions - I (Special)
George D. Vendelin, National Central University
Ray Pengelly, Cree Wireless Devices
Room: A315/316
TH1E-01: Five Years at Texas Instruments:
1963 – 1968
G. D. Vendelin
National Central University, JhongLi City,
Taiwan
TH1E-02: COMPACT—Microwave Circuit
Optimization through Commercial
Timesharing
L. Besser
Besser Associates, Mountain View, United
States
TH1E-03: Applied High Frequency
Electromagnetic Analysis - A Historical
Perspective
J. Rautio
Sonnet Software, North Syracuse, United
States
TH1E-04: The MERA Program, an MMIC
Pioneer
T. Hyltin
United States
TH1E-05: Microwave Power Generation
at 9 GHz in Hybrid Microwave Integrated
Circuits
B. T. Vincent, Jr.
United States
08:00 08:10
08:20 08:30
08:40 08:50
09:00 09:10
09:20
09:30
THURSDAY
39

40
THURSDAY InTERACTIVE FoRUM 09:30-11:30
THP1A
Field Analysis and Guided Waves
THP1A-01: Source Stirring Technology for
Automotive Antenna Measurement
M. Albrecht 1 , J. Luy 1 , P. Russer 2
1 Daimler AG, Ulm, Germany, 2 Technische
Universität München, München, Germany
THP1A-02: On The Slow Wave Behaviour
of the Shielded Mushroom Structure
F. Elek, G. V. Eleftheriades
University of Toronto, Toronto, Canada
THP1A-03: Far Field Measurement on a
Ka-band Substrate-integrated Waveguide
Antenna Array with Polarization
Multiplexing
K. Kuhlmann, K. Rezer, A. F. Jacob
Technische Universität Hamburg-Harburg,
Hamburg, Germany
THP1A-04: Dielectric Resonance in
Composites Filled with Metal-coated
Microspheres
J. Liu, N. Bowler
Iowa State University, Ames, United States
THP1B
Frequency-Domain Techniques
THP1B-01: Complex-Domain Mapping for
Evaluating Troublesome Integrals in Fast
Full-Wave Integral Equation Solvers
J. Lee, J. White
Massachusetts Institute of Technology,
Cambridge, United States
THP1B-02: Evaluation of Electrical
Properties for Complex Mixtures with a
Periodic Technique
H. Wu, D. Wu, J. Chen, R. Liu
University of Houston, Houston, United States
THP1C
Time-Domain Techniques
THP1C-01: Analyzing Broad-Band
Electromagnetics Problems with
Commercial Software—Time Domain
versus Frequency Domain
E. L. Holzman1 , W. S. Nelson1 , B. C. Swift1 , J.
R. Willhite2 , S. Hegde2 1Northrop Grumman Corporation, Baltimore,
United States, 2Sonnet Software, Syracuse,
United States
THP1C-02: An FDTD-Based Tool for
Simulation of Nonlinear Interactions of
Guided Waves
A. Marandi, P. P. So, T. E. Darcie
University of Victoria, Victoria, Canada
THP1C-03: Optimisation of the
Homogenization of Tissues using the
Adjoint Method and the FDTD
J. Silly-Carette 1 , D. Lautru 2 , A. Gati 1 , M.
Wong 1 , J. Wiart 1 , V. Fouad Hanna 2
1 Orange Labs, Issy Les Moulineaux Cedex
9, France, 2 Université Pierre et Marie Curie
– Paris 6, Paris, France
THP1C-04: A General Method for
Introducing Subgrids into High-Order
FDTD: Formulation and Microwave
Applications
R. B. Armenta, C. D. Sarris
University of Toronto, Toronto, Canada
THP1C-05: An Accurate and Stable Fourth
Order Finite Difference Time Domain
Method
J. L. Wilson 1 , C. Wang 1 , S. Yang 1 , A. E. Fathy 1 ,
Y. W. Kang 2
1 University of Tennessee, Knoxville, United
States, 2 Spallation Neutron Source, Oak Ridge,
United States
THP1D
CAD Algorithms and Techniques
THP1D-01: Perfectly Calibrated Internal
Ports in EM Analysis of Planar Circuits
J. C. Rautio, Sonnet Software
North Syracuse, United States
THP1D-02: Space Mapping with
Distributed Fine Model Evaluation for
Optimization of Microwave Structures
and Devices
S. Koziel, J. W. Bandler
McMaster University, Hamilton, Canada
THP1D-03: Topology Optimization
Applied to the Design of a Dual-mode
Filter Including a Dielectric Resonator
H. Khalil1 , N. Delhote1 , S. Bila1 , M. Aubourg1 ,
S. Verdeyme1 , J. Puech2 , L. Lapierre2 , C.
Delage3 , T. Chartier4 1 2 XLIM, Limoges, France, CNES, Toulouse,
France, 3CTTC, Limoges, France, 4 SPCTS,
Limoges, France
THP1D-04: Modeling Device
Manufacturing Uncertainty in
Electromagnetic Simulations
L. R. de Menezes, A. O. Paredes, H. Abdalla
Jr., G. A. Borges
Universidade de Brasília, Brasília, Brazil
THP1D-05: Modeling of Arbitrary-Order
Mutual Coupling
L. Han, K. Wu
École Polytechnique de Montréal, Montréal,
Canada
THP1D-06: Time Domain Sensitivity of
Non Linear Circuits via Wavelet Transform
S. Barmada, A. Musolino, M. Raugi, M. Tucci
University of Pisa, Pisa, Italy
THP1D-07: RF Design Methodology for
Design-Cycle-Time Reduction using
Parameterization of Embedded Passives
on Multilayer Organic Substrates
S. Min1 , C. Seo1 , A. M. Yepes1 , C. Ward1 , S.
Dalmia1 , G. White1 , M. Swaminathan1 , 1
1Jacket Micro Devices, Atlanta, United States,
2Georgia Institute of Technology, Atlanta,
United States
THP1D-08: Scalable Parallel Matrix
Solver for Steady State Analysis of Large
Nonlinear Circuits
N. Soveiko1 , M. Nakhla1 , R. Achar1 , E. Gad2 1Carleton University, Ottawa, Canada,
2University of Ottawa, Ottawa, Canada

THURSDAY THP1 — HAll A3 09:30-11:30
THP1E
Linear Device Modeling
THP1E-01: Extraction of an Extrinsic
Parasitic Network for Accurate mm-Wave
FET Scalable Modeling on the Basis of
Full-Wave EM Simulation
D. Resca1 , A. Raffo2 , A. Santarelli1 , G.
Vannini2 , F. Filicori1 1University of Bologna, Bologna, Italy,
2University of Ferrara, Ferrara, Italy
THP1E-02: A New Method for
Determining the Gate Resistance and
Inductance of GaN HEMTs Based on the
Extrema Points of Z11 Curves
J. A. Reynoso-Hernández, J. E. Zúñiga-
Juárez, A. Zárate-de Landa
CICESE, Ensenada, México
THP1F
Nonlinear Device Modeling
THP1F-01: A Scalable High Power
Nonlinear HBT Model for a 28v HvHBT
X. Zhang 1 , F. Chau 1 , B. Lin 1 , X. Sun 1 , W. Ma 1 , P.
Hu 1 , J. Yao 1 , C. Lee 1 , 2
1 WJ Communications, San Jose, United States,
2 National Chiao Tung University, Hsinchu,
Taiwan
THP1F-02: RF Large-Signal Model for
SiO2/AlGaN/GaN MOSHFETs
J. Deng1 , W. Wang1 , S. Halder1 , W. R. Curtice1 ,
J. C. Hwang1 , V. Adivarahan2 , A. Khan2 1Lehigh University, Bethlehem, United States,
2University of South Carolina, Columbia,
United States
THP1F-03: A New Empirical Model for
the Characterization of Low-Frequency
Dispersive Effects in FET Electron Devices
Accounting for Thermal Influence on the
Trapping State
A. Raffo1 , V. Vadalà1 , G. Vannini1 , A.
Santarelli2 1University of Ferrara, Ferrara, Italy,
2University of Bologna, Bologna, Italy
THP1F-04: Harmonic Balance Simulation
of a New Physics Based Model of the
AlGaN/GaN HFET
H. Yin, D. Hou, G. L. Bilbro, R. J. Trew
North Carolina State University, Raleigh,
United States
THP1G
Nonlinear Circuit Analysis and System
Simulation
THP1G-01: A Piecewise Transistor-Level
Simulation Technique for the Steady
State and Phase Noise Analysis of Integer
N PLLs
B. Wang, E. Ngoya
University of Limoges, Limoges, France
THP1G-02: Evaluation of Nonlinear
Distortion in ADCs Using Multisines
P. M. Cruz 1 , N. B. Carvalho 1 , K. A. Remley 2
1 IT-Universidade de Aveiro, Aveiro, Portugal,
2 NIST , Boulder, United States
THP1G-03: An Orthogonal Lookuptable
Decomposition for Accurate IMD
Prediction in Power Amplifier with
Memory
C. Quindroit, E. Ngoya, A. Bennadji, J. Nébus
University of Limoges, Limoges, France
THP1G-04: Comparison of Evaluation
Criteria for Power Amplifier Behavioral
Modeling
P. N. Landin 1 , 2 , M. Isaksson 1 , P. Händel 2 , 3
1 University of Gävle, Gävle, Sweden, 2 Royal
Institute of Technology, Stockholm, Sweden,
3 Royal Institute of Technology, Stockholm,
Sweden
THP1G-05: Low-Pass Equivalent Feedback
Topology for Power Amplifier Modeling
T. R. Cunha1 , J. C. Pedro1 , E. G. Lima2 1Universidade de Aveiro, Aveiro, Portugal,
2Politecnico di Torino, Torino, Italy
THP1G-06: Analysis and Reduction of the
Oscillator Phase Noise from the variance
of the Phase Deviations, Determined with
Harmonic Balance
S. Sancho, F. Ramírez, A. Suárez
University of Cantabria, Santander, Spain
THP1G-07: A Novel Measurement Based
Method Enabling Rapid Extraction of
an RF Waveform Look-up Table Based
Behavioral Model
S. P. Woodington1 , T. Williams1 , H. Qi1 , D.
Williams2 , L. Pattison2 , A. Patterson2 , J. Lees1 ,
J. Benedikt1 , P. Tasker1 1Cardiff University, Cardiff, United Kingdom,
2Mimix Europe, Belfast, United Kingdom
THP1H
Microwave Photonics
THP1H-01: Phase Modulated Fiber-optic
Link with High Dynamic Range
Y. Li 1 , P. Herczfeld 2 , A. Rosen 2
1 University of Massachusetts at Dartmouth,
Dartmouth, United States, 2 Drexel University,
Philadelphia, United States
THURSDAY
4

4
10:10
10:20 10:30
10:40 10:50
11:00 11:10
11:20 11:30
11:40
THURSDAY TECHnICAl SESSIonS 10:10-11:50
TH2A: Filter Realization Techniques
Ming Yu, COM DEV
Vicente E. Boria, Universidad Politécnica de
Valencia
TH2B: Advanced High-Efficiency
Power Amplifier Concepts
Anh-Vu Pham, UC Davis
Leo de Vreede, TU Delft
TH2C: Passive Semiconductor
Microwave Components
Peter Russer, Technical University of Munich
Magdalena Salazar - Palma, Universidad
Carlos III de Madrid
Room: A311
Room: A312
Room: A313
TH2A-01: New Concepts for Dielectric TH2B-01: Switch-Mode Amplifier ICs with TH2C-01: A CMOS 3-dB Directional
Multi-Mode Resonators with Branches over 90% Efficiency for Class-S PAs using Coupler Using Edge-Coupled Meandered
M. Höft
GaAs-HBTs and GaN-HEMTs
Synthetic Transmission Lines
Panasonic Electronic Devices Europe GmbH, C. Meliani, J. Flucke, A. Wentzel, J. Würfl, W. M. Chiang, H. Wu, C. C. Tzuang
Lueneburg, Germany
Heinrich, G. Tränkle
Ferdinand-Braun-Institut für
Höchstfrequenztechnik, Berlin, Germany
National Taiwan University, Taipei, Taiwan
TH2A-02: Multilayer Folded-Waveguide TH2B-02: An All-Digital CMOS 915
TH2C-02: A 60 GHz High-q Tapered
Dual-Band Filter.
MHz ISM Band 802.15.4 / ZigBee
Transmission Line Resonator in 90nm
S. K. Alotaibi, J. Hong, Z. Hao
Transmitter with a Noise Spreading Direct CMOS
Heriot-Watt University , Edinburgh, United quantization Algorithm
C. Marcu, A. M. Niknejad
Kingdom
J. Rode, T. Hung, P. Asbeck
University of California at Berkeley, Berkeley,
University of California-San Diego, La Jolla,
United States
United States
TH2A-03: Theoretical Investigation
of Microwave Breakdown Ignition in
OMUx Filters. A 3D Numerical Modeling
Approach
K. Frigui1 , D. Baillargeat1 , S. Verdeyme1 , S.
Bila1 , A. Catherinot2 , J. Puech3 , D. Pacaud4 ,
J.J. Herren4 1 2 XLIM, Limoges, France, SPCTS, Limoges,
France, 3CNES, Toulouse, France, 4 TH2B-03: A Highly Efficient Chireix
Amplifier Using Adaptive Power
Combining
J. Qureshi
Thales Alenia
Space, Toulouse, France
1 , R. Lui1 , A.J.M. de Graaw2 , M. P.
van der Heijden2 , J. Gajadharsing3 , L. C. de
Vreede1 , A. J. de Graauw2 1Delft University of Technology, Delft, The
Netherlands, 2NXP Semiconductor Research,
Eindhoven, The Netherlands, 3 TH2C-03: A Reconfigurable MEMS-less
CMOS Tuner for Software Defined Radio
L. Rabieirad, S. Mohammadi
Purdue University, West Lafayette, United
States
NX
TH2A-04: Sequential Tuning of Coupled TH2B-04: A Novel Doherty Amplifier for TH2C-04: Three-Stage Bandpass Filters
Resonator Filters Using Hilbert Transform Enhanced Load Modulation and Higher Implemented in Silicon IPD Technology
Derived Relative Group Delay
Bandwidth
using Magnetic Coupling between
N. Zahirovic, R. R. Mansour
M. Sarkeshi, O. B. Leong
Resonators
University of Waterloo, Waterloo, Canada National University of Singapore, Singapore, R. C. Frye
Singapore
1 , K. Liu2 , Y. Lin3 1RF Design Consulting, LLC, Berkeley Heights,
United States, 2STATS ChipPAC, Inc., Tempe,
United States, 3STATS ChipPAC, Ltd., Singapore,
Singapore
TH2A-05: Innovative Manufacturing
Technology for RF Passive Devices
Combining Electroforming and CFRP
Application
S. Liberatoscioli1 , M. Mattes2 , M. Guglielmi3 ,
D. Schmitt3 , C. Ernst3 TH2B-05: Design and Performance Of TH2C-05: Dummy Fill Insertion
Sequential Power Amplifiers
Considering the Effect on High-Frequency
T. Lehmann, R. Knoechel
Characteristics of Spiral Inductors
University of Kiel, Kiel, Germany
A. Tsuchiya, H. Onodera
1APCO Technologies, Vevey, Switzerland,
2 3 LEMA/EPFL, Lausanne, Switzerland, ESA-
ESTEC, Noordwijk, The Netherlands
TH2A-06: Size-Reduced Tunable Hairpin
Bandpass Filter using Aperture Coupling
with Enhanced Selectivity and Constant
Bandwidth
H. Moon, S. Choi, Y. Cho, S. Yun
Sogang University, Seoul, Republic of Korea
Kyoto University, Kyoto, Japan

THURSDAY TECHnICAl SESSIonS 10:10-11:50
TH2D: Retrodirective Phased Arrays &
Smart Antennas
Chris Rodenbeck, Sandia National
Laboratories
Kiyo Tomiyasu, IEEE Life Fellow
Room: A314
TH2D-01: quadrant Switching PLL Phase
Conjugator for Retrodirective Antenna
Applications
N. B. Buchanan, V. F. Fusco
Queen’s University of Belfast, Belfast, United
Kingdom
TH2D-02: A Sparse Conformal
Retrodirective Array for UAv Application
J. S. Sun, D. S. Goshi, T. Itoh
University of California-Los Angeles, Los
Angeles, United States
TH2D-03: A Planar Circular Phase
Conjugated Array with Full Scanning
Range
L. Chiu, Q. Xue, C. Chan
City University of Hong Kong, Hong Kong,
Hong Kong
TH2D-04: A 2.4 GHz 1-Dimensional Array
Antenna Driven by vector Modulators
N. Tohmé1 , J. Paillot1 , D. Cordeau1 , S. Cauet1 ,
Y. Mahé2 , P. Ribardière1 1University of Poitiers, Poitiers, France,
2University of Nantes, Nantes, France
TH2D-05: CRLH Leaky-Wave Real-
Time Spectrum Analyzer (RTSA) with
Unrestricted Time-Frequency Resolution
S. Gupta, C. Caloz, S. Abielmona
École Polytechnique de Montréal, Montréal,
Canada
TH2D-06: Self-Phasing Receive Array for
RF-Sensing and Tracking Applications
R. N. Pang, M. K. Watanabe, W. A. Shiroma
University of Hawaii at Manoa, Honolulu,
United States
TH2E: History of MIC/MMIC
Inventions - II (Special)
George D. Vendelin, National Central
University
Ray Pengelly, Cree Wireless Devices
Rooms: A315/316
TH2E-01: The Development of a Solid
State Transceiver for an Active Element
Ground Based L-Band Phased Array Radar
R. W. Sudbury
MIT Lincoln Laboratory, Lexington, United
States
TH2E-02: Development of Silicon-based
Millimeter-Wave Monolithic Integrated
Circuits at National Taiwan University
H. Wang
National Taiwan University, Taipei, Taiwan
TH2E-03: Early MMIC Developments at
Texas Instruments
G. Brehm
TriQuint Semiconductor, Richardson, United
States
TH2E-04: Early GaAs FET Monolithic
Microwave Integrated Circuit
Developments for Radar Applications at
Plessey, UK
R. Pengelly
Cree, Inc., Durham, United States
10:10 10:20
10:30 10:40
10:50 11:00
11:10 11:20
11:10
11:30
THURSDAY
43

44
THURSDAY PAnEl, FoCUSED AnD SPECIAl SESSIonS
TH1E 8:00-9:40 GWCC A315/316
HISTORY OF MIC/MMIC INvENTIONS - I
Chair: George D. Vendelin, Department of Electrical Engineering,
National Central University
Co-Chair: Dr. Ray Pengelly, Cree Wireless Devices
Abstract:
This session will review the history of the development of MIC/MMIC
circuits that occurred at Texas Instruments 1964-1970 due to the
MERA (Microwave Electronic Radar Applications) Program, which was
a contract between TI and Wright Patterson Air Force Base to develop
an X-Band solid-state radar. Many of the people who performed this
work will give their recollections of the design of this benchmark
system, including Tom Hyltin, the program manager.
TH2E 10:10-11:50 GWCC A315/316
HISTORY OF MIC/MMIC INvENTIONS - II
Chair: George D. Vendelin, Department of Electrical Engineering,
National Central University
Co-Chair: Dr. Ray Pengelly, Cree Wireless Devices
Abstract:
This session will review the history of the development of MIC/MMIC
circuits that occurred at Texas Instruments 1964-1970 due to the
MERA (Microwave Electronic Radar Applications) Program, which was
a contract between TI and Wright Patterson Air Force Base to develop
an X-Band solid-state radar. Many of the people who performed this
work will give their recollections of the design of this benchmark
system, including Tom Hyltin, the program manager.
TH3A 13:20-15:00 GWCC A311
MICROACOUSTIC FRONTEND TECHNOLOGIES
Chair: Clemens Ruppel, EPCOS AG
Co-Chair: Robert Weigel, University of Erlangen-Nuremberg
Abstract:
This session addresses novel developments and future trends in the
design of microwave acoustic components. The session starts with
novel WCDMA duplexers; proceeds with ultra miniature ISM filters,
FBAR oscillators, and highly stable SAW filters; and concludes with a
new measurement technique for both SAW and BAW devices.
THURSDAY 12:00-13:15 ROOM: A305
AUTOMOTIvE RADAR: AN OPPORTUNITY AND A
CHALLENGE FOR RF AND MICROWAvE ENGINEERS (IMS
PANEL)
Chair/Moderators: Ashok Bindra, Penton Media
Panelists:
• John Irza, The MathWorks
• Jean-Pierre Lanteri, Tyco M/A-COM
• Dr. Johann-Friedrich Luy, Daimler
• Dr. Colin Warwick, Agilent Technologies
Sponsors: MTT-9 and MTT-16
Abstract:
The World Health Organization estimates deaths due to automotive
accidents numbered over 1,200,000 in 2004 worldwide. These
fatalities, plus injuries (20-50 million) and staggering economic costs
(half a trillion dollars), are motivating automotive manufacturers to
go beyond passive safety systems such as airbags, and to develop
active safety systems such as collision avoidance radar. In common
risk situations, an alert that improves driver reaction time by as little
as two seconds can reduce collision probability from almost 100%
down to below 5%. Direct braking intervention has the potential to
reduce this even further. This panel will highlight the opportunities
and challenges (technical, societal, and economic) for you, the RF
and microwave engineering community, to help meet this need by
repurposing radar techniques.

10:10-11:50 GWCC A402
TRANSITION: MOvING YOUR CAREER TO THE NExT
FRONTIER
Chair: R. Henderson, University of Texas at Dallas
Co-Chair: P. Molina Gaudó, University of Zaragoza, Spain
Sponsor: IEEE MTT-S GOLD Committee
THURSDAY GolD PAnEl SESSIonS
Are you contemplating a career move in which you’re not very
certain? Is it a transition from industry to academia or vice versa?
Or have you become interested in opportunities at funding agencies
(e.g. NSF, European Funding Agency) or research appointments? Our
distinguished panel will speak about moving your microwave career
in an undefined path. The opportunities available to microwave
engineers are very broad and this session will speak to the methods and
actions that put one in the position to transition his or her career. The
IEEE MTT-S GOLD Committee is glad to invite all of its GOLD members
as well as anyone who is interested in learning and discussing plans
for transitioning your career!
Panel: The panel of speakers will include MTT-S members who have
transitioned from industry to academia in the US, Europe and Asia.
In addition, we will hear from those who have left academia to start
profitable companies that service the MTT community and those who
work as program directors at national funding agencies.
13:20-15:00 GWCC A402
CREATIvITY IN MICROWAvE RESEARCH AND
DEvELOPEMENT
Chair: P. Molina Gaudó, University of Zaragoza, Spain
Co-Chair: R. Henderson, University of Texas at Dallas
Sponsor: IEEE MTT-S GOLD Committee
Do you consider your work as being creative? Do you consider yourself
a creative person? Do you really think it is important to be creative in
microwave engineering? Why is creativity so highly appreciated? Are
research and creativity two sides of the same coin? This panel intends
to address the issue of creativity and technology particularly focusing
on research and development in MTT areas of interest. At the final
part of the panel session discussion between attendees and speakers
will be strongly supported and a sufficient time-slot secured from
organizers to allow for fruitful discussion on the floor.
Panel: The panel of speakers will include highly creative MTT-S
members who are senior in the industry and hold a number of patents
or have started their own company. In addition, representatives who
have been program directors at NSF with innovative projects in the
MTT-S field will be sharing their ideas.
THURSDAY
45

46
13:20
13:30
13:40
13:50
14:00
14:10
14:20
14:30
14:40
14:50
THURSDAY TECHnICAl SESSIonS 13:20-15:00
TH3A: Microacoustic Front-end
Technologies (Special)
Clemens Ruppel, EPCOS AG
Robert Weigel, University of Erlangen-
Nuremberg
Room: A311
TH3A-01: BAW/SAW/IPD Hybrid Type
Duplexer with Rx Balanced Output for
WCDMA Band I
T. Nishihara 1 , M. Iwaki 1 , G. Endo 2 , X. Mi 1 , S.
Taniguchi 1 , M. Ueda 1 , Y. Satoh 1
1 Fujitsu Laboratories Ltd., Akashi, Japan, 2 Fujitsu
Media Devices Limited, Yokohama, Japan
TH3A-02: Selection of Micro-Acoustic
Technologies for the Realization of Singleended
/ Balanced WCDMA Duplexers
T. Metzger, M. Maier, H. Klamm, Z. Kovats, D.
Ritter, G. Maurer, P. Selmeier
EPCOS AG, Munich, Germany
TH3A-03: An Ultra-Miniature, Low Cost
Single Ended to Differential Filter for ISM
Band Applications
S. R. Gilbert, R. Parker, M. K. Small, U. B. Koelle,
J. D. Larson III, R. C. Ruby
Avago Technologies, San Jose, United States
TH3A-04: A 2 GHz Oscillator using a
Monolithically Integrated AlN TFBAR
M. Norling 1 , J. Enlund 2 , I. Katardjiev 2 , S.
Gevorgian 1 , 3
1 Chalmers University of Technology, Göteborg,
Sweden, 2 Uppsala University, Uppsala, Sweden,
3 Ericsson AB, Mölndal, Sweden
TH3A-05: Miniature Surface Acoustic Wave
Devices with Excellent Temperature Stability
using High Density Metal Electrodes and
SiO2 film
M. Kadota, T. Nakao, K. Nishiyama, S. Kido,
M.Kato, R.Omote, H.Yonekura, N.Takada, R.Kita,
Y.Nakai, D.Yamamoto
Murata MFG. Co. Ltd., Kyoto, Japan
TH3A-06: A Fast Scanning Laser Probe Based
on Sagnac Interferometer for RF Surface
and Bulk Acoustic Wave Devices
K. Hashimoto 1 , K. Kashiwa 1 , T. Omori 1 , M.
Yamaguchi 1 , O. Takano 2 , S. Meguro 2 , K.
Akahane 2
1 Chiba University, Chiba, Japan, 2 Neoark Co. Ltd,
Hachi-Ohji, Japan
TH3B: Power Amplifier Design
Techniques for Millimeter-Wave and
Multi-Band Applications
Chang-Ho Lee, Samsung
Debasis Dawn, Georgia Institute of
Technology
Room: A312
TH3B-01: 35 dBm, 35 GHz Power Amplifier
MMICs using 6-inch GaAs pHEMT
Commercial Technology
S. J. Mahon, A. Dadello, A. P. Fattorini, A.
Bessemoulin, J. T. Harvey
Mimix Asia, North Sydney, Australia
TH3B-02: 17-dB-Gain CMOS Power Amplifier
at 60GHz
D. Dawn, S. Sarkar, P. Sen, B. Perumana, D. Yeh,
S. Pinel, J. Laskar
Georgia Institute of Technology, Atlanta, United
States
TH3B-03: q-, v-, and W-Band Power
Amplifiers Utilizing Coupled Lines for
Impedance Matching
M. Abbasi, H. Zirath, I. Angelov
Chalmers University of Technology, Göteborg,
Sweden
TH3B-04: A Novel Reconfigurable quadband
Power Amplifier with Reconfigurable
Biasing Network and LTCC Substrates
A. Fukuda, H. Okazaki, S. Narahashi
NTT DoCoMo, Inc., Yokosuka-City, Japan
TH3B-05: A variable Supply, (2.3-2.7)GHz
Linear Power Amplifier Module for IEEE
802.16e and LTE Applications using E-mode
pHEMT Technology
Y. H. Chow, C. K. Yong, J. Lee, H. K. Lee, J.
Rajendran, S. H. Khoo, M. L. Soo, C. F. Chan
Avago Technologies Malaysia, Bayan Lepas,
Malaysia
TH3B-06: A 2.4-GHz HBT Power Amplifier
Using an On-Chip Transformer as an Output
Matching Network
H. Seol 1 , C. Park 2 , D. Lee 3 , M. Park 4 , S. Hong 1
1 Korea Advanced Institute of Science and
Technology, Daejeon, Republic of Korea, 2 Hynix
Semiconductor Inc., Icheon, Republic of Korea,
3 Georgia Institute of Technology, Atlanta, United
State
TH3C: Innovative Substrate
Techniques for Passive Integration
Nickolas Kingsley, Auriga Measurement
Systems
Jesse Taub, Consultant
Room: A313
TH3C-01: Broadband Half-Mode Substrate
Integrated Waveguide (HMSIW) Wilkinson
Power Divider
Z. Zhang, K. Wu
École Polytechnique Montréal, Montréal, Canada
TH3C-02: Substrate Integrated Waveguide
Power Divider Based on Multimode
Interference Imaging
N. Yang, C. Caloz, K. Wu
École Polytechnique Montréal, Montréal, Canada
TH3C-03: A Compact Multilayered Magic-T
in Microstrip Form and its Application to
Microwave Sampler
T. Ma, C. Chou
National Taiwan University of Science and
Technology, Taipei, Taiwan
TH3C-04: Ultra Slow-Wave Periodic
Transmission Line Using 3D Substrate
Metallization
Y. Zhang, H. Yang
University of Illinois at Chicago, Chicago, United
States
TH3C-05: A Compact Highly-Selective Filter
Inspired by Negative-Refractive-Index
Transmission Lines
R. Islam, G. V. Eleftheriades
University of Toronto, Toronto, Canada
TH3C-06: Compact H-Plane Waveguide
Corners with very Wide Bandwidth
S. Matsumoto 1 , M. Ohshima 2 , K. Fukata 2 ,
T. Kawai 2 , I. Ohta 2 , M. Kishihara 3 , K. Iio 1 , T.
Kashiwa 1
1 Furuno Electric Co., Ltd., Nishinomiya, Japan,
2 University of Hyogo, Himeji, Japan, 3 Okayama
Prefectural University, Soja, Japan

THURSDAY TECHnICAl SESSIonS 13:20-15:00
TH3D: Biological Effects and Medical
Applications
Mohammad-Reza Tofighi, Penn State
University Harrisburg
Arye Rosen, Drexel University
Room: A314
TH3D-01: On Design of a Low Power
Wireless Hearing Aid Communication
System
G. S. Shaker1 , M. Nezhad-Ahmadi2 , S. Safavi-
Naeini1 , G. Weale2 1University of Waterloo, Waterloo, Canada,
2AMI Semiconductor Canada Co., Waterloo,
Canada
TH3D-02: Electrical Properties of Nude
Rat Skin and Design of Implantable
Antennas for Wireless Data Telemetry
T. Karacolak, E. Topsakal
Mississippi State University, Mississippi State,
United States
TH3D-03: Label Free Biosensors for
Human Cell Characterization using Radio
and Microwave Frequencies
C. Dalmay, A. Pothier, P.Blondy, F.Lalloue,
M.Jauberteau
Limoges University, Limoges, France
TH3D-04: High Frequency Wideband
Permittivity Measurements of Biological
Substances Using Coplanar Waveguides
and Application to Cell Suspensions
S. Seo 1 , T. Stintzing 1 , I. Block 2 , D. Pavlidis 1 , M.
Rieke 1 , P. G. Layer 1
1 Darmstadt University of Technology,
Darmstadt, Germany, 2 University of Illinois at
Urbana-Champaign, Urbana, United States
TH3D-05: Two frequency Radar Sensor for
Non-contact vital Signal Monitor
J. Oum1 , D. Kim2 , S. Hong1 1Korea Advanced Institute of Science and
Technology (KAIST), Daejeon, Republic of
Korea, 2Chungnam National University,
Daejeon , Republic of Korea
TH3D-06: A Novel Liquid Antenna for
Wearable Bio-monitoring Applications
A. Traille, L. Yang, A. Rida, M. M. Tentzeris
Georgia Institute of Technology, Atlanta,
United States
TH3E: Nonlinear Circuit Analysis and
System Simulation
José Carlos Pedro, University of Aveiro
Vittorio Rizzoli, University of Bologna
Room: A315/316
TH3E-01: A CAD Procedure for MIMO
Link Estimation by the Combination
of Nonlinear, Electromagnetic and
Propagation Analysis Techniques
V. Rizzoli, A. Costanzo, P. Spadoni, F. Donzelli,
D. Masotti, E. M. Vitucci
University of Bologna, Bologna, Italy
TH3E-02: quantifying Distortion of
RF Power Amplifiers for Estimation of
Predistorter Performance
P. J. Draxler1 , 2 , A. Zhu3 , J. J. Yan2 , P. Kolinko2 ,
D. F. Kimball2 , P. M. Asbeck2 1Qualcomm Inc, San Diego, United States,
2University of California, San Diego, La Jolla,
United States, 3University College Dublin,
Dublin, Ireland
TH3E-03: A Linearized Polar Transmitter
for Wireless Applications
P. M. Cabral1 , J. C. Pedro1 , J. A. Garcia2 , L.
Cabria2 1Universidade de Aveiro, Aveiro, Portugal,
2Universidad de Cantabria, Santander, Spain
TH3E-04: Mismatch Detection and
Compensation Algorithm with the
Closed Form Solution for the LINC System
Implementation
S. Myoung1 , I. Lee2 , K. Lim3 , J. Yook1 , J.
Laskar3 1Yonsei University, Seoul, Republic of Korea,
2Kongju National University, Kongju, Republic
of Korea, 3Georgia Institude of Technology,
Atlanta, United States
TH3E-05: Implementation of a volterra
Behavioral Model for System Simulation
S. A. Maas1 , J. C. Pedro2 1Applied Wave Research, El Segundo, United
States, 2Institute of Telecommunications,
University of Aveiro, Aveiro, Portugal
TH3E-06: Nonlinear Analysis and Design
of Frequency Selective Limiters Based on
Parametric Circuits
F. Ramírez1 , R. Melville2 , A. Suárez1 , J. S.
Kenney3 1University of Cantabria, Santander,
Spain, 2New Jersey Institute of Technology,
Newark, United States, 3Georgia Institute of
Technology, Atlanta, United States
13:20 13:30
13:40 13:50
14:00 14:10
14:20
14:30
14:40
14:50
THURSDAY
47

48
THURSDAY InTERACTIVE FoRUM 14:00-16:00
THP2A
Signal Generation
THP2A-01: Microwave Pulse Generation
using the Bragg Cutoff of a Nonlinear
Transmission Line
K. G. Lyon, E. C. Kan
Cornell University, Ithaca, United States
THP2A-02: An Eight-Phase voltage
Controlled Oscillator with Reflection-
Type Modulators in 0.18-Μμm CMOS
Technology
C. Lin, H. Chang
National Central University, Jhongli, Taiwan
THP2A-03: Low Phase Noise vCO using
Microstrip Square Open Loop Multiple
Split Ring Resonator
J. Choi, C. Seo
Soongsil University, Seoul, Republic of Korea
THP2B
Frequency Conversion and Control
THP2B-01: High Power AlGaN/GaN
Ku-Band MMIC SPDT Switch and Design
Consideration
B. Y. Ma, K. S. Boutros, J. B. Hacker, G. Nagy
Teledyne Scientific Company, Thousand Oaks,
United States
THP2B-02: A 14~23 GHz CMOS MMIC
Distributed Doubler with a 22-dB
Fundamental Rejection
K. Lin, J. Huang, J. Kuo, C. Lin, H. Wang
National Taiwan University, Taipei, Taiwan
THP2B-03: A 60-GHz Single-Balance Gate-
Pumped Down-Conversion Mixer with
Reduced-Size Rat-Race Hybrid on 130-nm
CMOS Process
C. Lien1 , P. Wu2 , K. Lin1 , H. Wang1 1National Taiwan University, Taipei, Taiwan,
2Realtek Semiconductor Corporation, Hsinchu,
Taiwan
THP2B-04: An Even Harmonic Image
Rejection Mixer using an Eight-Phase
Polyphase Filter
M. Shimozawa, K. Nakajima, H. Ueda, T.
Tadokoro, N. Suematsu
Mitsubishi Electric Corporation, Kamakura,
Japan
THP2B-05: An Ultra Low Power Analog
Frequency Divider
P. Sun1 , J. Jung1 , Y. Kim2 , D. Heo1 1Washington State University, Pullman,
United States, 2Handong Global University,
Pohang, Republic of Korea
THP2C
HF/vHF/UHF Technologies and
Applications
THP2C-01: A Novel Adaptive LDMOS
Power Amplifier with Constant Efficiency
for Wide Dynamic Power Levels Control
K. Narendra1 , A. Mediano2 , C. Paoloni3 , E.
Limiti3 1Motorola Technology, Penang, Malaysia,
2University of Zaragoza, Zaragoza, Spain,
3University of Roma Tor Vergata, Roma, Italy
THP2C-02: Long Life Microwave
Electrodeless Lamps for Projection
Display and General Lighting Applications
M. DeVincentis, G. Hollingsworth, R. Gilliard
Luxim Corporation, Sunnyvale, United States
THP2C-03: Underwater Motion and
Physiological Sensing using UHF Doppler
Radar
N. Hafner, W. Massagram, V. M. Lubecke, O.
Boric-Lubecke
University of Hawaii at Manoa, Honolulu,
United States
THP2D
High-Power Amplifiers
THP2D-01: Characterization of Switch
Mode LDMOS and GaN Power Amplifiers
for Optimal Use in Polar Transmitter
Architectures
H. M. Nemati1 , C. Fager1 , U. Gustavsson2 , R.
Jos3 , H. Zirath1 1Chalmers University of Technology,
Gothenburg, Sweden, 2Ericsson AB,
Stockholm, Sweden, 3NXP Semiconductors,
Nijmegen , The Netherlands
THP2D-02: A 120 Watt, Two-Stage,
LDMOS Power Amplifier IC at 1.8 GHz for
GSM/EDGE Applications
L. Zhao, G. Bigny, J. Jones
Freescale Semiconductor, Tempe, United
States
THP2D-03: Digital Baseband Injection
Techniques to Reduce Spectral Regrowth
in Power Amplifier
M. Xiao, P. Gardner
University of Birmingham, Birmingham,
United Kingdom
THP2D-04: Wide Bandwidth Adaptive
Digital Predistortion of Power Amplifiers
using Reduced Order Memory Correction
R. N. Braithwaite
Powerwave Technologies, Santa Ana, United
States
THP2D-05: Novel Approach for Static
Nonlinear Behavior Identification in RF
Power Amplifiers Exhibiting Memory
Effects
O. Hammi 1 , S. Carichner 2 , B. Vassilakis 2 , F. M.
Ghannouchi 1
1 University of Calgary, Calgary, Canada,
2 Powerwave Technologies, Inc., Santa Ana,
United States

THURSDAY THP2 — HAll A3 14:00-16:00
THP2E THP2F THP2G THP2H
THP2E-01: A Miniature LNA-Filter GPS
Receiver Front-end Module Combining FBAR
and E-mode pHEMT Technology
Y. H. Chow 1 , H. T. Tan 1 , S. C. Low 1 , M.
Mutanizam 1 , T. W. Lee 1 , C. C. Lim 1 , S. H. Khoo 1 , Y.
Y. Liew 1 , W. K. Kim 2
1 Avago Technologies Malaysia, Penang, Malaysia,
2 Avago Technologies Korea Ltd., Seoul, Republic of Korea
THP2F-01: Gunn Oscillator Modeling
and Second Harmonic Output Power
Optimization at 76 GHz
T. Kiuru 1 , A. M. Safwat 2 , J. Mallat 1 , A. V.
Räisänen 1
1 TKK Helsinki University of Technology, Espoo,
Finland, 2 Ain Shams University, Cairo, Egypt
THP2F-02: Application of Terahertz Imaging
to Osteoarthritis
E. Pickwell-MacPherson 1 , WC Kan1 , W. Lee1 , V. P.
Wallace 2 , W.H. Cheung 1
1Chinese University of Hong Kong, Hong Kong,
Hong Kong, 2University of Western Australia,
Perth, Australia
THP2F-03: Full Coverage Millimeter Wave
Primary Noise Standards for 18-170 GHz
D. R. Vizard 1 , P. Foster 2 , B. Lunn3 , S. Cherry1 1 2 VivaTech LLC, United States, Maas Ltd, Malvern,
United Kingdom, 3Amideon Systems, Limerick,
Ireland
THP2F-04: A 60GHz High Isolation SPDT
MMIC Switch Using Shunt pHEMT Resonator
Y. Tsukahara, H. Amasuga, S. Goto, T. Oku, T.
Ishikawa
Mitsubishi Electric Corporation, Itami, Japan
THP2F-05: A Heterostructure Barrier Charge
Swing Device for Frequency Multiplication
at 306 GHz
B. I. Nicolae 1 , M. Ruf2 , J. Schür2 , L. Schmidt 2 , H.
L. Hartnagel 1
1Technical University of Darmstadt, Darmstadt,
Germany, 2University of Erlangen-Nuremberg,
Erlangen, Germany
THP2F-06: Ka-Band Surface-Mount
Directional Coupler Fabricated using Micro-
Rectangular Coaxial Transmission Lines
K. J. Vanhille 1 , J. Rollin 1 , S. Rondineau 2 , J. W.
O’Brien 2 , J. L. Wood 3 , Z. Popovic 2
1Rohm and Haas Electronic Materials LLC,
Blacksburg, United States, 2University of
Colorado, Boulder, United States, 3Virginia Tech,
Blacksburg, United
THP2F-07: A W-band quasi-optical Doppler
Radar for Detection of very Slow-Moving
Targets
J. Y. Suen, R. S. Singh, Z. D. Taylor, E. R. Brown
University of California-Santa Barbara, Santa
Barbara, United States
THP2F-08: A CMOS-Compatible Schottky-
Barrier Diode Detector for 60-GHz
Amplitude-Shift Keying (ASK) Systems
M. Ko, H. Kang, W. Choi
Yonsei University, Seoul, Republic of Korea
THP2F-09: Average Capacity of Wireless
Optical Communication Systems over
Gamma Gamma Atmospheric Turbulence
Channels
H. E. Nistazakis 1 , G. S. Tombras 1 , A. D.
Tsigopoulos 2 , E. A. Karagianni 2 , M. E. Fafalios 2
1 2 University of Athens, Athens, Greece, Hellenic
Naval Academy, Piraeus, Greece
THP2G-01: Signal Integrity in Reflection-
Limited Channels
J. F. Buckwalter
University of California - San Diego, La Jolla,
United States
THP2H-01: On the Cyclostationary
Properties of the 1/f Noise of Microwave
Semiconductor Devices
A. A. Lisboa de Souza, J. Nallatamby, M. Prigent,
J. Obregon
Université de Limoges, Brive, France
THP2H-02: Mapping of Passive
Intermodulation Products on Microstrip
Lines
A. P. Shitvov, D. Zelenchuk, A. G. Schuchinsky,
V. F. Fusco
Queen’s University of Belfast, Belfast, United
Kingdom
THP2H-03: Measurement of Polarized Nano-
Material (PNM) for Microwave Application
W. Chen1 , Z. Zhang1 , Z. Feng1 , Y. Chen1 , K. Jiang2 ,
S. Fan2 , M. Iskander 3
1 2 Tsinghua University, Beijing, China, Tsinghua-
Foxconn Nanotechnology Center, Beijing, China,
3University of Hawaii at Manoa, Honolulu, United States
THP2H-04: Characterization of Galileo
Signal Correlation Losses Caused by Non
Linear Power Amplification with Memory
G. Nanfack Nkondem 1 , J. Santiago 2 , G. Neveux 1 ,
D. Barataud 1 , J. Collantes 2 , J. Portilla 2 , J. Nebus1 ,
A. Mallet 3
1 2 University of Limoges, Limoges, France, Basque
Country university, Bilbao, Spain, 3CNES, Toulouse, France
THP2H-05: Microwave Properties of
Platinum Nanoparticle Films
A. Sulaimalebbe, A. Porch, G. Attard, Cardiff
University, Cardiff, United Kingdom
THP2H-06: vector Near-Field Measurement
System Using an Electro-Optic Microcavity
and Electrical Downconversion
D. Lee 1 , J. Kang 2 , C. Chen 1 , J. F. Whitaker 1
1 University of Michigan, Ann Arbor, United
States, 2 Dong Seoul College, Seongnam, Republic
of Korea
THURSDAY
49

50
15:30
15:40 15:50
16:00 16:10
16:20
16:30
16:40
16:50
17:00
THURSDAY TECHnICAl SESSIonS 15:30-17:10
TH4A: Ferrites and Ferroelectrics
Spartak Gevorgian, Chalmers University
Steven Stitzer, Northrop Grumman
Room: A311
TH4A-01: Broadband Tunable Filters
Using High q Passive Tunable ICs
M. Nguyen, W. D. Yan, E. P. Horne
Paratek Microwave Inc., Columbia, United
States
TH4A-02: A Ferroelectric-Based
Impedance Tuner for Adaptive Matching
Applications
J. Fu, X. A. Zhu, J. D. Phillips, A. Mortazawi
University of Michigan, Ann Arbor, United
States
TH4A-03: Suppression on Harmonic
Radiation of Tunable PIFA by Ferroelectric
varactor Loading
Y. Zheng, A. Hristov, A. Giere, R. Jakoby
TU Darmstadt, Darmstadt, Germany
TH4A-04: A Novel Flexible Magnetic
Composite Material for RFID, Wearable RF
and Bio-monitoring Applications
L. Yang1 , L. Martin2 , D. Staiculescu1 , C.P.
Wong1 , M. M. Tentzeris1 1Georgia Institute of Technology, Atlanta,
United States, 1Motorola, Plantation, United
States
TH4A-05: A Tunable and Reduced Size
Power Divider using Ferroelectric Thin-
Film varactors
E. Lourandakis1 , M. Schmidt2 , A. Leidl2 , S.
Seitz2 , R. Weigel1 1University of Erlangen-Nuremberg, Erlangen,
Germany, 2EPCOS AG, Munich, Germany
TH4A-06: Intermodulation Distortion
Evaluation of Ferrite Element by Twotone
Method
T. Miura, L. E. Davis
The University of Manchester, Manchester,
United Kingdom
TH4B: Advanced Techniques for CAD
Arvind Sharma, Northrop Grumman
Andreas Cangellaris, University of Illinois at
Urbana-Champaign
Room: A312
TH4B-01: Rigorous Computer-Aided
Design of Coaxial/Circular Antennas with
Semi–Spherical Dielectric Layers
C. Tomassoni1 , M. Mongiardo1 , P. Russer2 , R.
Sorrentino1 1University of Perugia, Perugia, Italy,
2Technische Universität München, Munich,
Germany
TH4B-02: Efficient Electromagnetic
Optimization Using Self-adjoint Jacobian
Computation Based on a Central-node
FDFD Method
X. Zhu, A. Hasib, N. K. Nikolova, M. H. Bakr
McMaster University, Hamilton, Canada
TH4B-03: A General EM-Based Design
Procedure for Single-Layer Substrate
Integrated Waveguide Interconnects with
Microstrip Transitions
J. E. Rayas-Sánchez 1 , V. Gutiérrez-Ayala 2
1 ITESO, Tlaquepaque, México, 2 Intel
- Guadalajara Design Center, Tlaquepaque,
México
TH4B-04: Adaptive Space Mapping
with Convergence Enhancement for
Optimization of Microwave Structures
and Devices
S. Koziel, J. W. Bandler, Q. S. Cheng
McMaster University, Hamilton, Canada
TH4B-05: Tuning Space Mapping: A
Novel Technique for Engineering Design
Optimization
J. Meng, S. Koziel, J. W. Bandler, M. H. Bakr,
Q. S. Cheng
McMaster University, Hamilton, Canada
TH4B-06: Robust Training of Microwave
Neural Network Models Using Combined
Global/Local Optimization Techniques
H. Ninomiya, S. Wan, H. Kabir, X. Zhang, Q.
Zhang
Carleton University, Ottawa, Canada
TH4C: Novel Passive Components
Inder Bahl, Tyco Electronics
John Owens, Boise State University
Room: A313
TH4C-01: A New Switching Structure
using Branch-Line Hybrid Couplers for
Time Division Duplex System
K. Kim, D. Ahn
Soonchunhyang University, Asan, Republic
of Korea
TH4C-02: A Waveguide-based Power
Divider using H-plane Probes Shortcircuited
with Substrate Metallization
Patterns
M. Abe, Y. Tahara, N. Yoneda, H. Oh-hashi
Mitsubishi Electric Corporation, Kamakura,
Japan
TH4C-03: Complex Compensation
of Coupled Line Structures in
Inhomogeneous Media
J. Müller, A. F. Jacob
Technical University Hamburg-Harburg,
Hamburg, Germany
TH4C-04: Dual Function of a Dielectric
Resonator: a High-q Resonator and a
Low-q Radiator
L. K. Hady, D. Kajfez, A. A. Kishk
The University of Mississippi, University,
United States
TH4C-05: The Compound Resonator
Approach : Parity Control and Selectivity
Enhancement in N-Resonator Planar
Systems
T. Caillet 1 , D. Bajon 1 , S. Wane 2 , R. Plana 3
1 Université de Toulouse, Toulouse, France,
2 NXP-Semiconductor , Caen, France,
3 Université de Toulouse CNRS-L.A.A.S.,
Toulouse, France
TH4C-06: A High-q Electronically Tunable
Evanescent-Mode Double-Ridged
Rectangular Waveguide Resonator
A. L. Amadjikpè, J. Papapolymerou
Georgia Institute of Technology, Atlanta,
United States

THURSDAY TECHnICAl SESSIonS 15:30-17:10
TH4D: Tunable and Active Filters
Youji Kotsuka, Tokai University
Pierre Blondy, Université de Limoges
Room: A314
TH4D-01: Multi-Scale Tunable Filter
Covering a Frequency Range of 6.5:1
M. Koochakzadeh, A. Abbaspour-Tamijani
Arizona State University, Tempe, United States
TH4D-02: Manifold-Coupled Switched
Filter Bank Implementing Filters with
Embedded Switches
P. D. Laforge1 , R. R. Mansour1 , M. Yu2 1University of Waterloo, Waterloo, Canada,
2CON DEV, Cambridge, Canada
TH4D-03: Miniaturized Reconfigurable
Filter Using PIN Diode for UWB
Applications
M. Karim, Y. Guo, Z. N. Chen, L. C. Ong
Agency for Science, Technology and Research
(A*STAR), Singapore, Singapore
TH4D-04: Tunable RF Bandpass Filter with
variable Resonator Coupling
J. C. Estes
Rockwell Collins, Scottsdale, United States
TH4D-05: Novel Tunable Hexaferrite
Bandpass Filter Based on Rectangular
Waveguide Coupled Shielded Coplanar
Transmission Lines
M. Sterns, D. Schneiderbanger, R. Rehner, S.
Martius, L. Schmidt
University of Erlangen-Nuremberg, Erlangen,
Germany
TH4D-06: A 3.7-mW Zero-dB Fully
Integrated Active Bandpass Filter at Kaband
in 0.18-_m CMOS
M. Chiang, H. Wu, C. C. Tzuang
National Taiwan University, Taipei, Taiwan
TH4D-07: Low Power Complementary-
Colpitts Self-quenched Superregenerative
Ultra-Wideband (UWB)
Bandpass Filter in CMOS Technology
M. Anis, R. Tielert, N. Wehn
University of Technology in Kaiserslautern,
Kaiserslautern, Germany
TH4E: Novel Monolithic Circuit
Elements and IC Technology
Zaher Bardai, imn.epiphany
Tsuneo Tokumitsu, Eudyna Devices
Room: A315/316
TH4E-01: A Novel Nanoionics-based
Switch for Microwave Applications
J. A. Nessel1 , R. Q. Lee1 , C. H. Mueller2 , M. N.
Kozicki3 1NASA Glenn Research Center, Cleveland,
United States, 2Analex Corporation, Cleveland,
United States, 3Arizona State University,
Tempe, United States
TH4E-02: Low Temperature variable
Inductor Using Porous Anodic Alumina
T. B. Oogarah, M. Daneshmand, R. R.
Mansour, S. Chang
University of Waterloo, Waterloo, Canada
TH4E-03: High quality-Factor and
Inductance of Symmetric Differential-
Pair Structure Active Inductor using a
Feedback Resistance Design
K. Hwang1 , C. Cho1 , J. Lee1 , J. Kim2 1Korea Aerospace University, Goyang, Republic
of Korea, 2Information and Communications
University, Yusong, Republic of Korea
TH4E-04: Monolithic Millimeter-wave
Distributed Amplifiers using AlGaN/GaN
HEMTs
R. Santhakumar, Y. Pei, U. K. Mishra, R. A.
York
University of California at Santa Barbara,
Santa Barbara, United States
TH4E-05: A Mixed HEMT-HBT MMIC
Technology using MBE Regrowth
E. T. Kunkee 1 , S. Consolazio 2 , J. Barner 2 ,
T. Retelny 2 , G. Dietz 2 , E. Bogus 2 , A.
Cavus 1 , J. Chen 1 , J. Uyeda 1 , R. Hsing 1 , P.
Chin 1 , A. Ahkiyat 2 , D. Chua 2 , R. Clark 2 , R.
Haubenstricker 2 , M. Johnson 2 , T. Nguyen 2 , P.
Sahm 2 ,
TH4E-06: ASK and Pi/4-qPSK Dual Mode
SiGe-MMIC Transceiver for 5.8GHz DSRC
Terminals having Stabilized Amplifier
Chain
S. Shinjo 1 , K. Tsutsumi 1 , K. Mori 1 , H. Okada 2 ,
M. Inoue 3 , N. Suematsu 1
1 Mitsubishi Electric Corporation, Kamakura,
Japan, 2 Mitsubishi Electric Corporation,
Himeji, Japan, 3 Mitsubishi Electric Engineering
Corporation, Himeji, Japan
15:30
15:40
15:50
16:00
16:10
16:20
16:30 16:40
16:50
THURSDAY
5

54
Joy Laskar
Georgia Institute of Technology
General Chair
Technical Activites
Manos Tentzeris
Georgia Institute of Technology
Technical Program Chair
Jon Hacker
Teledyne Scientific Co.
Electronic Paper Management
Anya Traille
Georgia Tech Research Institute
Workshops and Tutorials
IMS STEERInG CoMMITTEE
Mike Harris
Georgia Tech Research Institute
Vice Chair
Kyutae Lim
Georgia Electronic Design Center
Vice Chair
Jeff Pond
NRL
Electronic Paper Management
Debasis Dawn
Georgia Electronic Design Center
Workshops and Tutorials
Stephane Pinel
Georgia Electronic Design Center
Vice Chair
Edward Gebara
Quellan
Workshops and Tutorials Chair
Chang Ho Lee
Samsung
Panel Sessions Chair
John Papapolymerou
Georgia Institute of Technology
Vice Chair
vincent Hietala
Sandia National Laboratories
Workshops and Tutorials
Vice Chair
Farrokh Ayazi
Georgia Institute of Technology
Panel Sessions
Roger Pollard
University of Leeds
Electronic Paper Management
Shyh-Chiang Shen
Georgia Institute of Technology
Workshops and Tutorials
Bhaskar Banjeree
University of Texas-Dallas
Panel Sessions

Gerald DeJean
Microsoft
Focused/Special Sessions
Chair
Kevin Kornegay
Georgia Institute of Technology
Historical Exhibit Chair
Chris Ward
JMD
ARFTG Liaison
Daniela Staiculescu
Georgia Institute of Technology
Interactive Forum Chair
Chris Scholz
LeCroy
University Exhibits
Coordinator
Zaher Bardai
VISAS
local Arrangements
Steve Kenney
Georgia Institute of Technology
Local Arrangements Chair
Mononita Ghosal
Agilent
Vice Chair-Hotel Events
Ronglin Li
Georgia Institute of Technology
Interactive Forum
Samir El-Ghazaly
University of Arkansas
Publications Chair
Kirk Laursen
Epicom
Vice Chair-GWCC
Sanjay Raman
Virginia Tech
Plenary Session Chair
Debabani Choudhury
Intel Corporation
Publications Vice Chair
Bruce Schmuckler
VT Silicon
Signage Chair
Luca Roselli
University of Perugia
Student Paper Competition
Chair
Brent Wagner
Georgia Tech Research Institute
Abstract Books/Digest CD
Keefe Bohannan
Agilent
AV Chair
55

56
Charlie Coulter
Tektronix
Photography Chair
operations
Chris Evans
Georgia Electronic Design Center
Operations and Registration
Chair
Ryan Tyson
Georgia Electronic Design Center
Webmaster
Jeff Waggoner
Rohde & Schwarz
Exhibition Support Chair
Jim Wiltse
Awards Banquet
Herb Lehman
Georgia Electronic Design Center
Finance Chair
Timothy Lee
Boeing
Website Support
Devi Laskar
Guest Program Chair
Cathy Beam
Georgia Electronic Design Center
Finance
Barry Perlman
RDECOM CERDEC
Hall A3 Support Chair
Catherine Gholson
Georgia Institute of Technology
Finance
DeeDee Bennett
Georgia Electronic Design Center
Student Activities/
Volunteers Chair
Daniel Leatherwood
Georgia Tech Research Institute
Publicity Chair
Angelika Braig
Georgia Electronic Design Center
Student Activities/
Volunteers Vice Chair

Senior Advisors/Protocol Committee
Charlie Jackson
Northrup Gruman
Emeritus Chair (IMS 2005)
Support Services
Elsie Cabrera
IEEE Conference Management
Services
Conference Manager
John Barr
Agilent
Emeritus Chair (IMS 2006)
Larry Wicker
LRW Associates
Conference Services
Wayne Shiroma
University of Hawaii
Emeritus Chair (IMS 2007)
Howard Ellowitz
Horizon House
Exhibition Manager
Kristen Anderson
Microwave Journal
Exhibition Coordinator
Photos for the following Steering Committee members were not available at the time of printing:
Technical Activities: Andrew Peterson (Senior Advisor), John Cressler (Electronic Paper Management), Jonghoon Lee (Focused/Special Sessions),
Per Iversen (Focused/Special Sessions), Jeff Kemp (Focused/Special Sessions), Jack Vickers (MicroApps Co-Chair), Jim Stratigos (MicroApps Co-
Chair), Frank Nestion (MicroApps)
Operations: Luis Resta (Registration), Bo Pan (Translation-Japanese), Emery Chen (Translation-Taiwanese), Carlos Donado (Translation-
Spanish)
Members at Large: Charlie Rucker (Protocol), Gordon Harrison, Pete Rodrigue
Support Services: Amanda Scacchitti, Rachael Zellner, Keisha Hersey (Conference Management)
57

58
Peter Aaen
Mohamed Abouzahra
Peter Asbeck
John Atherton
Inder Bahl
Constantine Balanis
John Bandler
Bhaskar Banerjee
Zaher Bardai
Scott Barker
John Barr
H. Clark Bell
Tibor Berceli
Adalbert Beyer
David Blackham
Pierre Blondy
Vicente Boria
Jens Bornemann
Hermann Boss
Thomas Brazil
Gailon Brehm
Eric Bryerton
Nicholas Buris
Nathan Bushyager
Edmar Camargo
Richard Campbell
Andreas Cangellaris
Robert Caverly
Malgorzata Celuch
Zoltan Cendes
Kai Chang
Zhizhang (David) Chen
Yi-Jan Emery Chen
Young-Kai Chen
J.C. Chiao
Debabani Choudhury
Terry Cisco
Steve Cripps
John Cunningham
Francois Daneville
Lionel Davis
Debasis Dawn
Har Dayal
Leo de Vreede
William Deal
Gerald DeJean
Guglielmo D’Inzeo
Paul Draxler
2008 TECHnICAl PRoGRAM CoMMITTEE
John Ebel
Danny Elad
George Eleftherides
Samir El-Ghazaly
Atef Elsherbeni
Andrea Ferrero
Victor Fouad Hanna
Kevin Gard
Edward Gebara
Bernard Geller
Spartak Gevorgian
Chuck Goldsmith
Mike Golio
Anand Gopinath
Mark Gouker
Kavita Goverdhanam
Ian Gresham
Ramesh Gupta
Dave Halchin
Leonard Hayden
John Heaton
Patric Heide
Wolfgang Heinrich
George Heiter
Rashaunda Henderson
Deuk Hyoun Heo
Peter Herczfeld
Tatsuya Hirose
Wolfgang J. R. Hoefer
Glenn Hopkins
John Horton
Ho Huang
H. Alfred Hung
Ian Hunter
Kiki Ikossi
Tatsuo Itoh
Kenji Itoh
David Jackson
Robert Jackson
Arne Jacob
Dieter Jaeger
Michael Janezic
Bill Jemison
Alan Jenkins
Branka Jokanovic
Reynold Kagiwada
Sridhar Kanamaluru
Linda Katehi
Allen Katz
Roger Kaul
Wayne Kennan
Amarpal (Paul) Khanna
Bumman Kim
Nickolas Kingsley
Reinhard Knoechel
James (Jim) Komiak
Agnieszka Konczykowska
Hiroshi Kondoh
Bruce Kopp
Youji Kotsuka
H. John Kuno
Youngwoo Kwon
Paolo Lampariello
Jong Hoon Lee
Timothy Lee
Chang-Ho Lee
Ronglin Lee
Kyutae Lim
Johann Luy
Gregory Lyons
Stephen Maas
Giuseppe Macchiarella
Jan Machac
Mohammad Madihian
Asher Madjar
Raghu Mallavarpu
Raafat Mansour
Jon Martens
Kenichi Maruhashi
Mohamed Megahed
David Meharry
Francisco Mesa
Ryan Miyamoto
Koji Mizuno
Jozef Modelski
Mauro Mongiardo
Amir Mortazawi
Alina Moussessian
Koichi Murata
Vijay Nair
Michel Nakhla
Shoichi Narahashi
Julio Navarro
Brad Nelson
Cam Nguyen
Edward Niehenke
Natalia Nikolova
Kenjiro Nishikawa
Dalma Novak
Hiroshi Okazaki
Arthur Oliner
Abbas Omar
John Owens
Jose Pedro
Luca Perregrini
Anh-Vu Pham
Stephane Pinel
Aryeh Platzker
Roger Pollard
George Ponchak
Jeff Pond
Marian Pospieszalski
Reinhold Pregla
Joseph Pribetich
Frederick Raab
Vesna Radisic
Richard Ranson
James Rautio
Jose E. Rayas-Sanchez
Ronald Reano
Gabriel Rebeiz
Kate Remley
Edward Rezek
Alfred Riddle
Jae-Sung Rieh
Vittorio Rizzoli
David Root
Luca Roselli
Arye Rosen
Matthias Rudolph
Clemens Ruppel
Peter Russer
Magdalena Salazar-Palma
Atsushi Sanada
Tapan Sarkar
James Schellenberg
Chris Scholz
Dominique Schreurs
Arvind Sharma
Prasad Shastry
Sanghoon Shin
Wayne Shiroma
Peter Siegel
Phillip Smith
Chris Snowden
Richard Snyder
Roberto Sorrentino
Dick Sparks
Barry Spielman
Peter Staecker
Daniela Staiculescu
Michael Steer
Steve Stitzer
Eric Strid
Wayne Struble
Almudena Suarez
Roger Sudbury
Yusuke Tajima
Paul Tasker
Jesse Taub
Mohammad-Reza Tofighi
Tsuneo Tokumitsu
Kiyo Tomiyasu
Robert Trew
Clive Tzuang
Ruediger Vahldieck
Andre Vander Vorst
Chi Wang
Huei Wang
Keh-Chung Wang
Yuanxun Wang
Paul Watson
Robert Weigel
Robert Weikle
Claude Weil
Andreas Weisshaar
Charles Weitzel
Tom Weller
Cheng (CP) Wen
Bob Wenzel
Scott Wetenkamp
James Whelehan
James Wiltse
Ingo Wolff
Ken Wong
Ke Wu
H.Y. David Yang
Huiwen Yao
Robert York
Ming Yu
Kawthar Zaki
Q.J. Zhang

MTT-1 Computer Aided Design MTT-13 Microwave Ferrites and Ferroelectrics
MTT-2 Microwave Acoustics MTT-14 Microwave Low-Noise Techniques
MTT-3 Microwave Photonics MTT-15 Microwave Field Theory
MTT-4 Terahertz Technology and Applications MTT-16 Microwave Systems
MTT-5 Microwave High-Power Techniques MTT-17 HF-VHF-UHF Technology
MTT-6 Microwave and Millimeter-Wave Integrated Circuits MTT-18 Microwave Superconductivity
MTT-7 Microwave and Millimeter-Wave Solid-State Devices MTT-19 Microwave Technology Business Issues
MTT-8 Filters and Passive Components MTT-20 Wireless Communications
MTT-9 Digital Signal Processing MTT-21 RF MEMS
MTT-10 Biological Effects and Medical Applications MTT-22 Signal Generation and Frequency Conversion
MTT-11 Microwave Measurements MTT-23 RFIC
MTT-12 Microwave and Millimeter-Wave Packaging and Manufacturing
IEEE MTT-S Administrative Committee
2008 Officers Past Presidents Honorary Life Members
President J. Modelski 2007 J. Stevenson Kenney T. Itoh P. Staecker
Pres.-Elect B. Pearlman 2006 K.R. Varian A. Oliner K. Tomiyasu
Treasurer N. Kolias 2005 K.C. Gupta T. Saad L. Young
Secretary B. Szendrenyi 2004 R.J. Trew
Elected AdCom Member
2008 2009 2010
K. Itoh L. Boglione J. Hacker
L. Katehi S.M. El-Ghazaly T. Lee
J. Lin H.M. Harris V. Nair
J. Modelski J. Hausner B. Perlman
A. Mortazawi B. Kim W. Shiroma
A. Rosen N. Kolias R. Synder
K. Wu R.Weigel
R. York
Future IMS locations
IMS 2009, Boston, MA
IMS 2010, Anaheim, CA
J.K. McKinney
Dura Sales of Southern California
J.McKinney@ieee.org
IMS 2013, Seattle, WA
Tom Rashko
Sea-Port Technical Sales
Tom.Raschko@ieee.org
IEEE MTT-S Technical Coordinating Committees
General Chairman
Fred Schindler
RFMD
fschindler@rfmd.com
IMS 2011, Baltimore, MD
Jeffery Pond
Naval Research Laboratory
J.M.Pond@ieee.org
IMS 2014, Tampa, FL
Larry Dunleavy
University of South Florida
dunleavy@eng.usf.edu
Technical Program Chair
Mark Gouker
MIT Lincoln Labs
gouker@ll.mit.edu
IMS 2012, Montreal, CAN
Ke Wu
Ecole Polytechnique
Ke.Wu@ieee.org
IMS 2015, Phoenix, AZ
Vijay Nair
Intel Corporation
v.nair@ieee.org
59

60
Microwave Career Award
This award recognizes an individual for a career of meritorious
achievement and outstanding technical contribution in the field of
microwave theory and techniques. This year’s recipient is Rudolf
Henning.
“For a career of leadership, meritorious achievement, creativity,
and outstanding contributions in the field of microwave theory
and techniques.”
Distinguished Service Award
This award recognizes significant contributions and outstanding
service to the MTT-S and the microwave profession over a sustained
period of time. This year’s recipient is George Heiter.
“For his outstanding and dedicated service to the society.”
Distinguished Educator Award
This award was inspired by the untimely death of Prof. F.J. Rosenbaum
(1937-1992), an outstanding teacher of microwave science and a
dedicated AdCom Member and contributor. The award recognizes a
distinguished educator in the field of microwave engineering and
science who best exemplifies the special human qualities of Fred
Rosenbaum who considered teaching a high calling and demonstrated
his dedication to the Society through tireless service. This year’s recipient
is Madhu S. Gupta.
“For outstanding achievements as an educator, mentor and role
model of microwave engineers and engineering students.”
Microwave Pioneer Award
This award recognizes an individual or a team not exceeding three
persons having made outstanding pioneering technical contributions
that advance microwave theory and techniques, described in an
archival paper published at least 20 years prior to the year of the
award. This year’s recipient is James W. Mink.
“For establishing the theoretical basis for the development of the
practical quasi-optical power combining structures and networks.”
Microwave Application Award
This award recognizes an individual or team for outstanding application
of microwave theory and techniques. This year’s recipient is Steve C.
Cripps.
“For the creation of an industry standard for design of broadband
solid state power amplifiers.”
IEEE MTT-S AWARDS
outstanding Young Engineer
Award
This award recognizes MTT-S members, who have distinguished
themselves through technical achievements, service to the MTT-S, or
a combination of both. Nominees must not have reached their 39th
birthday and must be an MTT-S member at the time of nomination.
This year’s recipients are Michael P. DeLisio, Katherine Juliet Herrick,
Anh-vu Pham, and Andreas Stelzer.
Michael P. DeLisio: “For contributions to the development and
commercialization of microwave and millimeter-wave spatial
power combining techniques as well as service to the MTT society.”
Katherine Juliet Herrick: “For leadership and technical
contributions in the development of compact, high performance
active and passive components for millimeter-wave arrays.”
Anh-vu Pham: “For contributions to the development of
microwave and millimeter-wave organic packages, components,
and modules.”
Andreas Stelzer: “For contributions made in the field of microwave
sensor and local positioning systems and their signal processing.”
n. Walter Cox Award
This award was established in recognition of the qualities of N. Walter
Cox and his service to the MTT-S prior to his untimely death in 1988. It
is given to a Society volunteer whose efforts on behalf of MTT-S best
exemplify Walter’s spirit and dedication. This year’s recipient is Charles
M. Jackson.
“For exemplary service, given in the spirit of selfless dedication and
cooperation.”
Microwave Prize
This award recognizes on an annual basis the most significant
contribution by a published paper within the MTT-S’s field of interest.
Papers under consideration are those published during the calendar
year preceding the Fall meeting of the AdCom. This years recipients are
Marco Spirito, Marco J. Pelk, Fred van Rijs, Steven J.C.H. Theeuwen,
Dave Hartskerl, and Leo C.N. de vreede.
“For a significant contribution to the field of endeavor of the IEEE
MTT Society in the paper entitled “Active Harmonic Load-Pull for
On-Wafer Out-of-Band Device Linearity Optimization”, which has
been published in IEEE Transactions on Microwave Theory and
Techniques, Vol. 54, No 12, December 2006, pp. 4225-4236.”

The member grade of Fellow is conferred in recognition of unusual
and outstanding professional distinction. It is awarded at the initiative
of the IEEE Board of Directors following a rigorous nomination
and evaluation process. Individuals receiving this distinction have
demonstrated extraordinary contributions to one or more fields of
IEEE FElloWS
Ikuo Awai For contributions to microwave passive components
electrical engineering, or related sciences. This grade is not conferred
automatically on nomination, only a fraction of those nominated are
elected. Twelve MTT-S members who were evaluated by our Society
were elected to the grade of Fellow, effective 1 January 2008.
Pane Chao For contributions to microwave and millimeter-wave high electron mobility transistors and monolithic
integrated circuits
Spartak Gevorgian For contributions to ferroelectric microwave devices
Jerry Hausner For applications of microwave technology for remote sensing
William Joines For contributions to frequency-selective structures in microwave circuits, biology, and medicine
James Stevenson Kenney For contributions to microwave power amplifier design, characterization, and linearization
Amarpal Khanna For contributions to the design and measurement techniques of microwave oscillators
Reinhard Knoechel For contributions to microwave systems and sensors for industrial process control
Michael Mrozowski For contributions to the theory of guided waves and computational electromagnetics
George Ponchak For contributions to the thin film transmission lines for microwave integrated circuits
Charles Wilker For contributions to microwave measurements of cryogenic and high power component
Shanjia Xu For contributions to dielectric waveguiding structures
Zhi Ning Chen (AP) For contributions to small and broadband antennas for wireless applications
Cynthia Furse (AP) For leadership in electromagentics education
Gianluca Lazzi (AP) For contributions to biolelectromagnetics and implantable devices
Peter deMaagt (AP) For development and application of electromagnetic band gap materials and terahertz components and
systems
Sergei Tretyakov (AP) For contributions to distributed system software architectures and programming frameworks
Jeffery Young (AP) For contributions to electromagnetic wave propagation in complex media
Daniel Amey (CPMT) For contributions to electronic packaging and high frequency characterization of ceramic system package
materials
Kit Lau Paul Yu (ED) For contributions to semiconductor waveguide modulators and detectors
Erping Li (EMC) For contributions to electromagnetic modeling and simulation in high speed electronics
Waymond Scott (GRS) For contributions to the detection of buried objects using ground penetrating radar
6

6
The 2008 RFIC Symposium maintains its reputation as one of the foremost IEEE technical conferences dedicated
to the latest innovations in RFIC development for wireless and wireline communication ICs and emerging
applications. Running in conjunction with the International Microwave Symposium and Exhibition, the
RFIC Symposium adds to the excitement of Microwave Week with three days focused exclusively on RFIC
technology and innovation. The RFIC symposium will be held at the Georgia World Congress Center from 15-17 June
2008. The symposium begins on Sunday, 15 June, with workshops targeted at RF technology, design, and system
issues. Sunday evening activities continue at 17:30 with the Plenary Session where two speakers will share their
views on the direction and challenges that the RF IC industry will be facing. The first speaker, Robert Van Buskirk,
President of Multi-market Products Group at RFMD Inc., will discuss “Best of Both Worlds: Multi-market Diversity
Embedded in a Scale RF Semiconductor Business.” The second speaker, Zoltan J. Cendes, Ph.D., Founder, Chairman,
and CTO of Ansoft Corporation, will discuss “First Pass System Success - When First Pass Silicon Success is Not Enough.”
Following the Plenary Session, the RFIC Reception will be hosted in A412ab of the Georgia World Congress Center.
This social event is a key component of the conference with the opportunity to connect with old friends and new
acquaintances and catch up on the wireless industry. The technical program includes 26 oral presentation sessions,
an Interactive Forum (poster session), and two lunchtime panel sessions. The oral presentation sessions start on
Monday, 16 June, and will continue on Tuesday, 17 June. The poster session will be held on Tuesday afternoon.
The poster session is the perfect place to have an opportunity to have more detailed technical discussions with
the authors. In the tradition of the RFIC conference, the Tuesday morning activity will be paused during the IMS
Plenary Session, from 10:10-11:50. Panel Sessions are also planned at lunchtime on Monday and Tuesday. The RFIC
Symposium concludes on Tuesday allowing participants to attend the IMS and ARFTG as well as plenty of time to
visit the exhibit hall. The RFIC Committee is thankful to the Microwave Week team, without whom we could not
make this conference happen. Most of all, we are particularly thankful to all the technical contributors to the RFIC.
We look forward to your participation. Please continue to make this conference vibrant within the RFIC industry!
Enjoy the conference!
Jenshan Lin
General Chairman
2008 RFIC Symposium
WElCoME To THE 2008 RFIC SYMPoSIUM
Tina quach Yann Deval
Technical Program Committee Chairs
2008 RFIC Symposium

SUnDAY- 17:30-19:00 • RFIC PlEnARY SESSIon • RooM A411
Best of Both Worlds: Multi-market Diversity Embedded
in a Scale RF Semiconductor Business
Robert Van Buskirk – President, Multi-market Products Group (MPG),
RFMD Inc.
Many RF semiconductor companies seek a balance between scale-driven,
high volume business demands and more diverse, lower volume business
requirements. Successful RF companies can
manage these potentially conflicting business
goals and realize significant advantages
through the balance of scale and multi-market
diversity. Using the acquisition of Sirenza
Microdevices by RFMD, in November 2007, as a
platform to discuss this balance, the significant
competitive advantages for a multi-market
business embedded in a scale RF business will be
addressed. This talk will explore the benefits of
these unique competitive advantages and give concrete examples of how
growth can be accelerated by leveraging the “Best of Both Worlds.”
Robert Van Buskirk has served as the President of RFMD’s Multi-market
Products Group (MPG) since the successful completion of the Sirenza
Microdevices acquisition in November 2007. Prior to joining RFMD he was
Sirenza’s President and Chief Executive Officer and a member of the Board
of Directors from May 1999 through November 2007. Before joining Sirenza,
Mr. Van Buskirk held the position of Executive Vice President of Business
Development and Operations from August 1998 to May 1999 at Multilink
Technology Corporation, a company specializing in the design, development,
and marketing of high bit-rate electronic products for advanced fiber-optic
transmission systems. Prior to his position at Multilink, Mr. Van Buskirk held
various management positions at TRW, a semiconductor wafer manufacturer,
including Executive Director of the TRW GaAs Telecom Products business
from 1993 to August 1998. Mr. Van Buskirk holds a B.A. from California State
University at Long Beach.
Monday
12:00-13:15
Room number A412ab
Millimeter-wave IC: Is silicon winning? Is GaAs still alive?
(RFIC Panel)
Organizer: Chinchun Meng, National Chiao Tung University
Moderator: Huei Wang, National Taiwan University
Panelists:
• Young-Kai Chen, Bell Labs Alcatel-Lucent
• Bryan Floyd, IBM
• Ali Hajimiri, California Institute of Technology
• Joy Laskar, Georgia Institute of Technology
RFIC PAnEl SESSIonS
First Pass System Success - When First Pass Silicon Success is
Not Enough
Dr. Zoltan J. Cendes – Founder, Chairman and CTO, Ansoft Corporation
Advances in the performance and accuracy of design automation software and
electromagnetic modeling have enabled RFIC designers to apply their skills
to achieve first pass silicon success for complex mixed-signal radio circuits.
Now, coupling between circuit simulation and
parameterized electromagnetics allows them to
include detailed analysis of packaging and printed
circuit board parasitic coupling to analyze system
performance. A silicon vendor may produce a
wireless SoC that performs flawlessly at the
packaged part level. Once that part is placed on
a system PCB, the complex interactions among
traces on the board, the coupled impedances
between package pins and the PCB, and nonlinear
effects in the circuit itself can combine to generate spurious radiation and corrupt
signal/power integrity. These undesired effects can be predicted by applying full
electromagnetic simulation of the package and board in concert with a top-level
transient or harmonic balance simulation at the circuit level. We present here an
overview of key simulation technologies and discuss how they can be applied to
achieve first pass system success for complex electronic products.
Dr. Zoltan Cendes is Founder, Chairman and CTO of Ansoft Corporation, Pittsburgh,
PA, and is an Adjunct Professor at Carnegie Mellon University, Pittsburgh. As
Ansoft’s chief technology officer he is responsible for managing the company’s
research and development. He has served as Professor of Electrical and Computer
Engineering at Carnegie Mellon University, as an Associate Professor of Electrical
Engineering at McGill University, Montreal, Canada, and as an Engineer in the
Corporate Research and Development Center of the General Electric Company
in Schenectady, NY. Cendes received his MS and doctoral degrees in electrical
engineering from McGill University. Dr. Cendes is a Fellow of the IEEE, has served
on the Editorial Board of IEEE Spectrum, on the International Steering Committee
of the COMPUMAG Conference and as an IEEE Antennas and Propagation Society
(IEEE AP-S) Distinguished Lecturer.
• Chinchun Meng, National Chiao Tung University
• Sorin Voinigescu, University of Toronto
• Herbert Zirath, Chalmers University of Technology
Sponsor: RFIC
Abstract: Fully integrated 60 GHz MMICs were successfully built by PHEMT/
MHEMT technologies while advanced CMOS and SiGe HBT technologies
have also shown good promise on 60 GHz MMICs. GaAs technology was
not fairly invested at the beginning of RFIC revolution even though it is
known to have better intrinsic properties. Thus, the panel will examine
which technology will be the winner at the millimeter-wave regime and
whether GaAs can come back at the microwave regime.
63

64
08:00
08:20
08:40
09:00
09:20
10:10
10:30
10:50
11:10
11:30
MonDAY TECHnICAl SESSIonS 08:00-11:50
RMO1A: Cellular Transceiver
Chair: Jyoti P.Mondal, Freescale
Semiconductor
Co-Chair: Didier Belot, ST Microelectronics
Room: A411
RMO1A-1: (INvITED) Self-shielded EGPRS Transceiver
A.W.Hietala, S.R.Humphreys, R. Arkizewski, S. Morris
RFMD, USA
RMO1A-2: A digital delta-sigma RF signal generator
for mobile communication transmitters in 90nm
CMOS
A. Frappé, B. Stefanelli, A. Flament, A. Kaiser, A. Cathelin*
IEMN - ISEN, Lille, France, *STMicroelectronics, Grenoble,
France
RMO1A-3: Active Mitigation of Induced Phase
Distortion in a GSM SoC
O. Eliezer, B. Staszewski, S. Bhatara, I. Bashir, , P. Balsara*
Texas Instruments, *The University of Texas at Dallas
RMO1A-4: A L1-Band Dual-Mode RF Receiver for GPS
and Galileo in 0.18µm CMOS
J.-G. Jo, J.-H. Lee, D. J. Park*, Y. G. Pu*, S.-C. Shin, K.-Y.
Lee*, S.-E. Park**, S.-J. Lee**, C. Yoo
Dept. of Electronics and Comp. Eng. Hanyang Univ. Seoul,
Korea, * Dept. of Electronics Eng. Konkuk Univ. Seoul, Korea,
** CoreLogic Inc. Seoul, Korea
RMO1A-5: An Adaptive Multi-Mode RF Front-End for
Cellular Terminals
G. Hueber, J. Zipper, R. Stuhlberger, A. Holm*
DICE, Austria
*Infineon Technologies, Germany
RMO2A: WLAN and WiMAx
Transceivers
Chair: Srenik Mehta, Atheros
Communications
Co-Chair: Bill Redman-White, NXP
Room: A411
RMO2A-1: A 65nm Low-power CMOS Transceiver for
802.11n Portable Application
Y.M. Chiu, T.M. Chen, P.Y. Chen, R. Kuan, Y.C. Shih, Y.J.
Lin, C.L. Li
Realtek Semiconductor Corp., Hsinchu, Taiwan
RMO2A-2: A MISO CMOS Transceiver For WLAN
802.11b/g/n Applications
C.J. Chang, P.C. Wang, W.M. Chiu, P.J. Chiu, C.C. Wang,
Y.M.Chang, C.Y. Chen, K.T. Chen, C.H. Lu, S.M. Lin, C.P. Lin,
K.U. Chan, Y.H.Lin and C.C.Lee
Realtek Semiconductor Corp., Hsinchu, 300, Taiwan
RMO2A-3: A 0.13 μm CMOS Transmitter with
72-dB RF Gain Control for Mobile WiMAx/WiBro
Applications
H.-H. Kuo, Y.-H. Li, and Y.-H. Pang
SoC Technology Center, Industrial Technology Research
Institute, HsinChu 310, Taiwan
RMO2A-4: 2.5-GHz Fully-Integrated WiMAx
Transceiver IC for a Compact, Low-Power
Consumption RF Module
D. Yamazaki, N. Kobayashi, K. Oishi*, M. Kudo*, T. Arai, N.
Hasegawa, K. Kobayashi
Fujitsu Laboratories Ltd., Fujitsu Ltd., Japan
RMO2A-5: A Fully Integrated Tri-Band, MIMO
Transceiver RFIC for 802.16e
F. Beaudoin*, T. Zortea**, G. Deliyannides, M. Hiebert,
M. McAdam, M. Venditti*, V. Choudary, B. Guay, H.
Djahanshahi, T. McKeen, A. Hafez
PMC-Sierra, Inc., Burnaby, BC, Canada, *PMC-Sierra, Inc.,
Montreal, QC, Canada, **PMC-Sierra, Inc., Allentown, USA
RMO1B: Broad Band Circuit
Techniques
Chair: Ranjit Gharpurey, University of Texas,
Austin
Co-Chair: Madhukar Reddy, Maxlinear, Inc
Room: A405
RMO1B-1: A 3.1-9.5 GHz Agile UWB Pulse Radio
Receiver with Discrete-Time Wideband-IF Correlation
in 90nm CMOS
F. Zhang, R. Gharpury*, P. Kinget
Columbia University, *University of Texas, USA
RMO1B-2: A 3 to 5-GHz UWB Pulse Radio Transmitter
in 90nm CMOS
Anuranjan Jha*, Ranjit Gharpurey**, Peter Kinget*
*Columbia University, NY
**University of Texas, Austin
RMO1B-3: A 6-9GHz WiMedia UWB RF Transmitter in
90nm CMOS
Z. Zhang, K. Mertens, M. Tiebout, S. Ek,S. Marsili, D.
Matveev, C. Sandner
Infineon Technologies Austria AG, Austria
RMO1B-4: An Ultra-Wideband Transmitter Based on a
New Pulse Generator
M. Cavallaro, E. Ragonese, G. Palmisano
University of Catania, DIEES, viale A. Doria 6, Catania,
95126, Italy
RMO1B-5: A 19pJ/pulse UWB Transmitter with Dual
Capacitively-Coupled Digital Power Amplifiers
P.P. Mercier, D.C. Daly, A.P. Chandrakasan
Massachusetts Institute of Technology
RMO2B: High Frequency vCOs
Chair: Stephen Dow, ON Semiconductor
Co-Chair: Timothy Hancock, MIT Lincoln
Laboratory
Room: A405
RMO2B-1: 60GHz vCOs with transmission line
resonator in a 0.25µm SiGe BiCMOS technology
H. Veenstra, M.G.M. Notten
Philips Research, Eindhoven, The Netherlands
RMO2B-2: A Low Phase Noise LC-vCO with a
High-q Inductor Fabricated by Wafer Level Package
Technology
K.Ohashi, Y.Kobayashi, H.Ito 1 , K.Okada, H.Hatakeyama 2 ,
T.Aizawa 2 , T.Ito 2 , R.Yamauchi 3 , K. Masu
Integrated Research Institute, 1 Precision and Intelligence
Laboratory,Tokyo Institute of Technology, 2 Electron Device
Laboratory,Fujikura Ltd., 3 Fujikura Ltd.
RMO2B-3: The Process variability of a v-band LC-vCO
in 65nm SOI CMOS
Daeik D. Kim, Choongyeun Cho, Jonghae Kim
IBM Semiconductor Research and Development Center, USA
RMO2B-4: Simultaneous Sub-harmonic Injection-
Locked mm-Wave Frequency Generators for Multiband
Communications in CMOS
S-W. Tam, E. Socher, A.Wong, Y. Wang, L. D. Vu and M.
F. Chang
University of California, Los Angeles
RMO2B-5: vCO design for 60 GHz applications using
differential shielded inductors in 0.13 µm CMOS
J. Borremans*, M. Dehan, K. Scheir*, M. Kuijk,
P.Wambacq*
IMEC, Leuven, Belgium, *also Vrije Universiteit Brussel,
Brussels, Belgium
RMO1C: CMOS Millimeter-wave
Amplifiers
Chair: Patrick Yue, UC Santa Barbara
Co-Chair: Luciano Boglione, University of
Massachusetts Lowell
Room: A406-7
RMO1C-1: (INvITED) Deep-Submicron Digital CMOS
Potentialities for Millimeter-wave Applications
Andreia Cathelin 1 , Baudouin Martineau 1,2 , Nicolas
Seller 1,3 , Frederic Gianesello 1 , Christine Raynaud 1,4 ,
Didier Belot 1
1 STMicroelectronics, France, 2 IEMN, France, 3 IMS
Laboratory, France, 4 CEA-LETI, France
RMO1C-2: A Tapered Cascaded Multi-Stage
Distributed Amplifier with 370GHz GBW in 90nm
CMOS
A. Arbabian, A. M. Niknejad
University of California at Berkeley, USA
RMO1C-3: An ultra low power LNA with 15dB gain
and 4.4db NF in 90nm CMOS process for 60 GHz phase
array radio
Emanuel Cohen*, Shmuel Ravid*, Dan Ritter**
* Mobile Wireless Group, Intel Haifa, Israel, ** Electrical
Engineering Technion, Haifa, Israel
RMO1C-4: 60GHz CMOS Differential and Transformer-
Coupled Power Amplifier for Compact Design
Tim LaRocca, Mau-Chung Frank Chang
University of California at Los Angeles
RMO1C-5: A 60-GHz Fully-Integrated Doherty Power
Amplifier Based on 0.13-µm CMOS Process
Byron Wicks*, Efstratios Skafidas*, Rob Evans*
* National ICT Australia
RMO2C: Advanced Handset Power
Amplifiers
Chair: Nick Cheng, Skyworks
Co-Chair: Bruce Thompson, Motorola, Inc
Room: A406-7
RMO2C-1: A 65nm CMOS 30dBm Class-E RF Power
Amplifier with 60% Power Added Efficiency
M. Apostolidou 1 , M.P. van der Heijden 1 , D.M.W.
Leenaerts 1 , J. Sonsky 2 , A. Heringa 2 and I. Volokhine 2
1 NXP Semiconductors Research, Eindhoven (the
Netherlands), 2 NXP-TSMC Research Center, Eindhoven (the
Netherlands) - Leuven (Belgium)
RMO2C-2: Design and Linearization of Class-E Power
Amplifier for Non-constant Envelope Modulation
C.-T. Chen, C.-J. Li, T.-S. Horng, J.-K. Jau*, and J.-Y. Li*
National Sun Yat-Sen University, Taiwan, *Industrial
Technology Research Institute, Taiwan
RMO2C-3: Efficient Three-State WCDMA PA Integrated
with High-Performance BiHEMT HBT / E-D pHEMT
Process
T. Apel, T. Henderson, Y. Tang, O. Berger
TriQuint Semiconductor, USA
RMO2C-4: Switch-Mode Power Amplifier Linearization
D.E. Kelly, K. Mekechuk, and T. Miller
PulseWave RF, USA
RMO2C-5: A 0.18 µm CMOS Fully Integrated RF DAC
and vGA for WCDMA Transmitters
S. Mehdizad Taleie*, Y. Han**, T. Copani**, B.
Bakkaloglu**, S. Kiaei**
*Qualcomm, Inc., USA, **Arizona State University
RMO1D: RF Front-end Design
Techniques
Chair: Donald Y.C.Lie, Texas Tech University
Co-Chair: Jean-Baptiste Begueret, IMS Lab
Room: A404
RMO1D-1: Perspective of RF design in future planar
and FinFET CMOS
J. Borremans*, B. Parvais, M. Dehan, S. Thijs, P.
Wambacq*, A. Mercha, M. Kuijk*, G. Carchon, S.
Decoutere
IMEC, Leuven, Belgium, *also Vrije Universiteit Brussel,
Brussels, Belgium
RMO1D-2: A Broadband Low-Noise Singel-Ended
Input Differential-Output Amplifier with IM2
Cancelling
D. Manstretta
Dipartimento di Elettronica, Università degli Studi di Pavia,
Pavia, Italy
RMO1D-3: Linearization of Differential CMOS Low
Noise Amplifier Using Cross-Coupled Post Distortion
Canceller
Tae-Sung Kim, Byung-Sung Kim
Sungkyunkwan University, South Korea
RMO1D-4: A New Method of Tx Leakage Cancelation
in W/CDMA and GPS Receivers
V. Aparin
QUALCOMM Inc., San Diego, USA
RMO1D-5: A 2.5mW Inductorless Wideband vGA with
Dual Feedback DC-Offset Correction in 90nm CMOS
Technology
Y. Wang, B. Afshar, T. Cheng, V. Gaudet*, A. M. Niknejad
Berkeley Wireless Research Center, University of California
at Berkeley, *Univeristy of Alberta, Canada
RMO2D: Advanced passive circuits
and components
Chair: Chang-Ho Lee, Samsung
Co-Chair: Gary Zhang, Skyworks
Room: A404
RMO2D-1: (INvITED) High-Performance RF passives
Using Post-CMOS MEMS Techniques for RF SoC
Xinxin Li, Lei Gu and Zhengzheng Wu
State Key Lab of Transducer Technology, Shanghai Institute
of Microsystem and Information Technology, Chinese
Academy of Sciences
RMO2D-2: An Area Efficient High Turn Ratio
Monolithic Transformer For Silicon RFIC
Chee Chong Lim**, Qiu-ping**, Kiat Seng Yeo, Kok Wai
Chew*, Suh Fei Lim*, Chirn Chye Boon and Manh Anh Do
Nanyang Technological University at Singapore (NTU),
*Chartered Semiconductor Manufacturing (Chrt), **NTU
& Chrt
RMO2D-3: Miniaturized Multi-Band Filter Banks for
Extravehicular Radio (EvA) Applications
Philip J. Stephanou, Justin P. Black, and Andrew L.
Benjamin*
Harmonic Devices Inc., USA, *NASA Johnson Space Center,
USA
RMO2D-4: A Low-Distortion, Low-Loss varactor
Phase-Shifter Based on a Silicon-on-Glass Technology
S. Kim, J.H. Qureshi, K. Buisman, L.E. Larson and L.C.N.
de Vreede
Center for Wireless Communication, University of California
San Diego, La Jolla, CA, USA, DIMES, Delft Institute
of Microsystems and Nanoelectronics, TUDelft, The
Netherlands

MonDAY TECHnICAl SESSIonS 13:20-17:10
RMO3A: High-Frequency CMOS Mixers
and Data-Converters
Chair: Frank Henkel, IMST GmbH
Co-Chair: Jaber Khoja, Microtune Inc.
Room: A411
RMO3A-1: A 1GHz Bandwidth Low-Pass ∆∑ ADC with
20GHz to 50GHz Adjustable Sampling Rate
A. Hart and S. P. Voinigescu
University of Toronto, Canada
RMO3A-2: A Resistively Degenerated Wide-Band
Passive Mixer with Low Noise Figure and +60dBm
IIP2 in 0.18µm CMOS
N. Kim, *V. Aparin, L.E. Larson
University of California at San Diego, *Qualcomm, Inc.,USA
RMO3A-3: High Linearity SiGe-MMIC q-MOD Having
Self Mixer Current Control Circuit with Output Power
Detector for 0.4-5.8GHz Cognitive Radio
S.Shinjo, K.Tsutsumi, F.Onoma, N.Suematsu, H.Harada*
Mitsubishi Electric Corp, *National Institute of Information and
Communications Technology
RMO3A-4: A High IIP2 Multi-Standard CMOS Mixer
for GSM, UMTS and IEEE802.11b-g-a Applications
Mohammad B. Vahidfar, Omid Shoaei *, Francesco Svelto
Unieversita degli studi di Pavia, 27100 Pavia, Italy, *University of
Tehran, Iran
RMO3A-5: Low-Power 1v 5.8GHz Bulk-Driven Mixer
with On-Chip Balun in 0.18 µm CMOS
D. Van Vorst, S. Mirabbasi
University of British Columbia, Department of Electrical and
Computer Engineering, Canada
RMO4A: Wireless Systems
Chair: Glenn Chang, MaxLinear
Co-Chair: Natalino Camilleri, Alien Technology
Room: A411
RMO4A-1: A 5.8GHz Low-IF Mult-Data Rate GFSK
Transceiver with Carrier Recovery and Integrated
21dBm Power Amplifier
C. Quek, S. Farahvash, W. Roberts, M. Romney, D. Walker,
C. Otten, R. Wei, D. Schwan, M. Mostafa 1 , D. Haab, J. Liu 2 ,
H. Liem 3 , R. Koupal 4
RFMD, 1 Beceem Communications, 2 Marvell Semiconductor
Inc., 3 Sigma Designs Inc., 4 Scintera Networks Inc., USA
RMO4A-2: An Ultra Low Power 130nm CMOS Direct
Conversion Transceiver for IEEE802.15.4
C. Bernier, F. Hameau, G. Billiot, E. de Foucauld, S.
Robinet, J. Durupt, F. Dehmas, E. Mercier, P. Vincent, L.
Ouvry, D. Lattard, M. Gary, C. Bour, J. Prouvée, S. Dumas
CEA-LETI, MINATEC, Grenoble, France
RMO4A-3: A Compact and Power Efficient Local
Oscillator Generation and Distribution System for
Complex Multi Radio Systems
Rozi Roufoogaran*, Tom (Qiang) Li*, Adedayo Ojo**,
Shelley Cheng***, C. Paul Lee**, Sajeevan Mahadeva*,
Prashant Shetter***, Arya Behzad**
*Broadcom Corporation, Irvine, CA, **Broadcom Corporation,
San Diego, CA, ***Broadcom Corporation, Sunnyvale, CA
RMO4A-4: A 900-MHz RFID System with TAG-Antenna
Magnetically-Coupled to the Die
A. Finocchiaro*, G. Ferla*, G. Girlando*, F. Carrara**, G.
Palmisano**
*STMicroelectronics, Catania, Italy, **University of Catania,
Catania, Italy
RMO4A-5: A 2mW 400MHz RF Transceiver SoC in 0.18um
CMOS Technology for Wireless Medical Applications
M.R. Nezhad-Ahmadi*, G. Weale*, A. El-Agha*,
D. Griesdorf*, G. Tumbush**, A.Hollinger***,M.
Matthey***,H.Meiners***, S. Asgaran*
*AMI Semiconductor, Waterloo, ON, Canada, **AMI Semiconductor,
Colorado, USA, ***AMI Semiconductor, Marin, Switzerland
RMO3B: UWB Front-end ICs
Chair: Albert Wang, Dept. of Electrical
Engineering, University of California, Riverside
Co-Chair: Stefan Heinen, Infineon
Technologies AG
Room: A405
RMO3B-1: (INvITED) 10GBASE-T for 10Gb/s Full
Duplex Ethernet LAN Transmission over Structured
Copper Cabling
S. K. Gupta, J. Tellado, S. Begur, F. Yang, M. A. Inerfield,
D. Dabiri, J. Dring, S. Goel, K. Muthukumaraswamy, F.
McCarthy, G. Golden, J. Wu, S. Arno and S. Kasturia
Teranetics Inc., Santa Clara, CA, USA
RMO3B-2: A 38-Gb/s 2-tap Transversal Equalizer in
0.13-um CMOS using a Microstrip Delay Element
G. Ng, A. C. Carusone
University of Toronto
RMO3B-3: A 35-GHz Differential Distributed Loss-
Compensation Amplifier
James F. Buckwalter
University of California - San Diego
RMO3B-4: Wide-band CMOS Loop-Through Amplifier
for Cable Tv Tuner
S. Jin, T. Oh, K. Hong, H. Kim, B. Kim*
System IC Team, LG Electronics, Inc., Seoul, Korea, *Pohang University
of Science and Technology, Pohang, Korea
RMO3B-5: A Novel Wide-Band Envelope Detector
Yan-Ping Zhou, Guochi Huang, Byung-Sung Kim
Sungkyunkwan University
RMO4B: Advanced Frequency Synthesizer
Design
Chair: Bertan Bakkaloglu, Arizona State University
Co-Chair: Sanjay Raman, Virginia Tech/DARPA
Room: A405
RMO4B-1: (INvITED) Analysis and Modeling of
Noise Folding and Spurious Emission in Wideband
ΣΔ Fractional-N Synthesizers
Waleed Khalil1*, Hiva Hedayati**, Bertan Bakkaloglu**
and Sayfe Kiaei**
Intel Corporation*, Arizona State University**
RMO4B-2: A 40GHz Fractional-N Frequency
Synthesizer in 0.13 µm CMOS
Chao-Ching Hung, Ding-Shiuan Shen and Shen-Iuan Liu
Graduate Institute of Electronics Engineering and
Department of Electrical Engineering, National Taiwan
University, Taiwan, R. O. C.
RMO4B-3: A 0.13 µm CMOS ∆∑ Frequency Synthesizer
with an Area Optimizing LPF, Fast AFC Time, and a
Wideband vCO for WCDMA/GSM/GPRS Applications
Kun-Seok Lee, Hwayeal Yu, Hyung Ki Ahn, Hyoung-Seok
Oh, Dongjin Keum, and Byeong-Ha Park
Samsung Electronics
RMO4B-4: A Fully Integrated 1.175-to-2GHz
Frequency Synthesizer with Constant Bandwidth for
DvB-T application
L. Lu, L. Yuan, H. Min and Z. Tang
ASIC & System State Key laboratory, Fudan University, China
RMO4B-5: A Digitally Calibrated 64.3-66.2GHz Phase-
Locked Loop
Kun-Hung Tsai, Jia-Hao Wu, and Shen-Iuan Liu
Graduate Institute of Electronics Engineering and
Department of Electrical Engineering, National Taiwan
University, Taiwan, R. O. C.
RMO3C: Silicon Millimeter-Wave
Chair: Kevin Kobayashi, RFMD
Co-Chair: Paul Blount, Custom MMIC
Design Services
Room: A406-407
RMO3C-1: A q-Band (40-45 GHz) 16-Element Phased-
Array Transmitter in 0.18-µm SiGe BiCMOS Technology
K.-J. Koh, J. W. May, G. M. Rebeiz
University of California at San Diego, USA
RMO3C-2: A 1.2v, 140GHz Receiver with On-Die
Antenna in 65nm CMOS
S. T. Nicolson*, A. Tomkins*, K. W. Tang*, A. Cathelin**, D.
Belot**, and S. P. Voinigescu*
*Edward S. Rogers, Sr. Dept. of Electrical & Computer
Engineering, University of Toronto, Toronto, Canada,
**STMicroelectronics, Crolles, France
RMO3C-3: A 77GHz 4-Channel Automotive Radar
Transceiver in SiGe
H. P. Forstner, H. Knapp, H. Jäger*, E. Kolmhofer*
Infineon Technologies AG, Germany, *DICE GmbH, Austria
RMO3C-4: A 91 GHz Receiver Front-End in Silicon-
Germanium Technology
Jihwan Kim*, Javier Alvarado Jr.* **, and Kevin T. Kornegay*
*Electronic Design Center, Georgia Institute of Technology Atlanta,
**Raytheon Company, RF Electronics, Tucson, Arizona
RMO3C-5: A W-Band SiGe 1.5v LNA for Imaging
Applications
J. W. May, G. M. Rebeiz
University of California at San Diego
RMO4C: RF Switches and Switchable
Components
Chair: Joe Staudinger, Freescale, Inc
Co-Chair: Noriharu Suematsu, Mitsubishi Electrics
Room: A406-7
RMO4C-1: (INvITED) An Ultra-Low insertion loss T/R
switch fully integrated with 802.11b/g/n transceiver
in 90nm CMOS
A.A.Kidwai, *C.T.Fu, R.Sadhwani, Chu Chi D, J.C.Jensen,
S.Taylor
Intel Corporation, Hillsboro, OR, *National Chiao-Tung
University, Hsinchu, Taiwan
RMO4C-2: A 5-GHz, 30-dBm, 0.9-dB Insertion Loss
Single-Pole Double-Throw T/R Switch in 90nm CMOS
C.-T. Fu* **, S. S. Taylor*, C.-N. Kuo**
* Intel Corporation, Hillsboro, ** National Chiao-Tung
University
RMO4C-3: 5-6 GHz SPDT Switchable Balun Using CMOS
Transistors
B-W. Min, G. M. Rebeiz*
University of Michigan at Ann Arbor, *University of
California at San Diego
RMO4C-4: A Stage-Bypass SOI-CMOS Switch for Multi-
Mode Multi-Band Applications
A. Scuderi, C.D. Presti*, F. Carrara*, B. Rauber**, G.
Palmisano*
STMicroelectronics, Catania, Italy, *University of Catania, Italy,
**STMicroelectronics, Crolles, France
RMO4C-5: High power GaN HEMT Microwave Switches
for x-Band and Wideband Applications
A. Bettidi, A. Cetronio, M. De Dominicis*, G. Giolo*, C.
Lanzieri, A. Manna*, M. Peroni, C. Proietti, P. Romanini
SELEX Sistemi Integrati SpA, *Elettronica SpA, Italy
RMO3D: Next Generation RF Models and
Devices
Chair: Kevin McCarthy, University College Cork
Co-Chair: Bumman Kim, Pohang University of
Science and Technology
Room: A404
RMO3D-1: (INvITED) The new CMC standard compact
MOS model PSP: advantages for RF applications
A.J. Scholten, G.D.J. Smit, B.A. De Vries, L.F. Tiemeijer, J.A.
Croon, D.B.M. Klaassen, X. Li*, W. Wu*, and G. Gildenblat*
NXP-TSMC Research Center, Eindhoven, The Netherlands,
*Department of Electrical Engineering, Arizona State
University, Tempe, USA
RMO3D-2: Experimental Characterization and
Simulation of RF Intermodulation Linearity in a 90
nm RF CMOS Technology
Xiaoyun Wei, Guofu Niu, Ying Li, Ming-Ta Yang*, Stewart
S. Taylor**
Electrical and Computer Engineering Department, Auburn University,
USA, *Spice Modeling Dept., TSMC, Taiwan, **Communications
Circuits Lab, Intel Corporation, USA.
RMO3D-3: Statistical variations in vCO Phase Noise
due to Upconverted MOSFET 1/f Noise
M. Erturk+*, T. Xia+, R. L. Wolf*, D. P. Scagnelli*, W. F.
Clark+*
+School of Engineering, University of Vermont, *IBM Systems and
Technology Group
RMO3D-4: Novel Pseudo-Drain (PD) RF Power Cell in
0.13 µm CMOS Technology
S.Y. Huang, C.C. Hung, T.L. Lee, V. Liang
UMC, Inc., Taiwan
RMO3D-5: Characterization and Modeling of Asymmetric
LDD MOSFET for 65nm CMOS RF Power Amplifier Design
Kai-Yi Huang, Po-Chih Wang, Yuh-Sheng Jean, Ta-Hsun
Yeh, Ying-Hsi Lin
Realtek Semiconductor Corp., Hsin-Chu, Taiwan, 300, ROC
RMO4D: CMOS Transceiver Front-ends
Chair: Georg Boeck, University of Technology, Berlin
Co-Chair: Walid Ali-Ahmad, Mediatek
Singapore Pte Ltd
Room: A404
RMO4D-1: A CMOS Code-Modulated Path-Sharing
Multi-Antenna Receiver Front-End for Spatial
Multiplexing, Spatial Diversity and Beamforming
F. Tzeng, A. Jahanaian, P. Heydari
University of California, Irvine
RMO4D-2: A High Performance 2-GHz Direct-
Conversion Front End with Single-Ended RF input in
0.13µm CMOS
Y.Feng*, G.Takemura**, S.Kawaguchi**, P.Kinget*
*Columbia University, **Toshiba Corporation
Semiconductor Company
RMO4D-3: A 6-to-18 GHz Tunable Concurrent Dual-
Band Receiver Front End for Scalable Phased-Arrays
in 0.13µm CMOS
Y. Wang, S. Jeon, A. Babakhani, and A. Hajimiri
California Institute of Technology
RMO4D-4: A rapid interference detector for ultra
wideband radio systems in 0.13µm CMOS
Tien-Ling Hsieh, Peter Kinget*, Ranjit Gharpurey
University of Texas at Austin, *Columbia University
RMO4D-5: Integrated Time Division Multiplexing
Front-End Circuit for Multi-Antenna RF Receivers
G. Krishnamurthy, K. G. Gard
North Carolina State University, USA
13:20
13:40
14:00
14:20
14:40
15:30
15:50
16:10
16:30
16:50
MonDAY
65

66
08:00
08:20
08:40
09:00
09:20
10:10
10:30
10:50
11:10
11:30
TUESDAY TECHnICAl SESSIonS 08:00-11:50
RTU1A: Silicon Millimeter-Wave 2
Chair: Carlos E. Saavedra, Queen’s University,
Canada
Co-Chair: Brian Floyd, IBM
Room: A311
RTU1A-1: (INvITED) mm-Wave Silicon ICs: an
Opportunities for Holistic Design
Ali Hajimiri
California Institute of Technology
RTU1A-2: A 24 GHz 4-Channel Phased-Array Receiver
in 0.13 µm CMOS
Tiku Yu, Gabriel M. Rebeiz
University of California, San Diego
RTU1A-3: A 24-GHz Full-360 degrees CMOS Reflection-
Type Phase Shifter MMIC with Low Loss-variation
Jen-Chieh Wu, Chia-Chan Chang, Sheng-Fuh Chang, and
Ting-Yueh Chin
Department of Electrical Engineering, Department
of Communications Engineering, Center for
Telecommunication Research, National Chung Cheng
University, Chia-Yi, 621, Taiwan
RTU1A-4: A High-Linearity, LC-Tuned, 24-GHz T/R
Switch in 90-nm CMOS
Piljae Park, Dong Hun Shin, John J. Pekarik*, Mark
Rodwell and C. Patrick Yue
High-Speed Silicon Lab, University of California, Santa
Barbara, *IBM Microelectronics
RTU1A-5: A 24 GHz 3.3 dB NF Low Noise Amplifier
based upon Slow Wave Transmission Lines and the
0.18 µm CMOS Technology
A. Sayag*, S. Levin**, D. Regev**, D. Zfira**, S.
Shapira**, D. Goren*** and D. Ritter*
*Department of Electrical Engineering, Technion, Haifa,
Israel, **Tower Semiconductors Inc., Migdal Haemek, Israel,
***IBM Haifa Research Laboratories, Haifa, Israel
RTU1E: On-chip Microwave Passive
Components
Chair: Bob Stengel, Motorola Labs
Co-Chair: Louis Liu, Northrop Grumman
Room: A313
RTU1E-1: Broadband variable Passive Delay Elements
Based on an Inductance Multiplication Technique
E. Adabi, A. M. Niknejad
University of California at Berkeley, USA
RTU1E-2: wideband mixed lumped-distributedelement
90° and 180° power splitters on silicon
substrate for millimeter-wave applications
A. Chen 1,2 , H.-B. Liang 3 , Y. Baeyens 1 , J. Lin 2 , Y.-K. Chen 1 .
Y.-S. Lin 3
1 Alcatel-Lucent/Bell Laboratories, 2 University of Florida,
3 National Chi Nan Univeristy, Puli, Taiwan
RTU1E-3: A Compact 5GHz q-enhanced Standing-
Wave Resonator-based Filter in 0.13µm CMOS
Dan Shi, Michael P. Flynn
University of Michigan
RTU1E-4: 3D Group-Cross Symmetrical Inductor: A
New Inductor Architecture improving Self-Resonance
Frequency and q Factor
F. Gianesello 1 , D. Gloria 2 , C. Raynaud 1,2 , P. Touret 1,2 and
B. Rauber 1
1 STMicroelectronics, FTM, TPS Lab, 850 avenue Jean
Monnet, 38926 Crolles, 2 CEA Leti, avenue des martyrs,
38000 Grenoble
RTU1E-5: A Derived Physically Expressive Circuit
Model for Integrated Passives in RFIC
K. Yang*, H. Hu*, K. L. Wu*, and W. Y. Yin**
* Department of Electronic Engineering, The Chinese
University of Hong Kong, Hong Kong , ** Center for
Microwave and RF Technologies, Shanghai Jiao Tong
University, Shanghai, China
RTU1B: Digital Enabled vCOs
Chair: Tian-Wei Huang, National Taiwan
University
Co-Chair: Adrian Maxim, Silicon Labs
Room: A312
RTU1B-1: A Self-Calibrated LC quadrature vCO in a
Current-Limited Region
S. Byun, K.-W. Kim*, D.-H. Lee*, J. Laskar*, C. S. Kim
ETRI, South Korea, *Georgia Institute of Technology, USA
RTU1B-2: vCO Gain Calibration Technique for GSM/
EDGE Polar Modulated Transmitter
H. K. Ahn, K.-S. Lee, H. Yu, H.-S. Oh, D. Keum, B.-H. Park
Samsung Electronics, Korea
RTU1B-3: A Low-Noise vCO with a Constant Kvco for
GSM/GPRS/EDGE Applications
T. Y. Lin, T. Y. Yu, L. W. Ke, G. K. Deng
MediaTek Inc. No. 1, Dusing Rd. 1, Hsinchu Science Park,
Hsinchu, Taiwan 300, R.O.C.
RTU1B-4: A Transfer-Curve-Folded DCO in 0.13µm
CMOS
Jing-Hong Conan Zhan
RF Division, MediaTek, HsinChu, Taiwan
RTU1B-5: A Ring vCO with Wide and Linear Tuning
Characteristics for a Cognitive Radio System
J.Choi, K.Lim, J.Laskar
Georgia Electronic Design Center, Georgia Institute of
Technology
RTU1C: Supply Modulators for Power
Amplifiers
Chair: Noriharu Suematsu, Misubishi Electrics
Co-Chair: Freek van Straten, NXP
Room: A315-316
RTU1C-1: A 50MHz Bandwidth Multi-Mode PA Supply
Modulator for GSM, EDGE and UMTS Application
P.G. Blanken*, R. Karadi**, H.J. Bergveld**
*Philips Research Laboratories, **NXP Semiconductors
(Research), Netherlands
RTU1C-2: An Envelope Tracking Power Amplifier using
an Adaptive Biased Envelope Amplifier for WCDMA
Handsets
K. Takahashi, S. Yamanouchi, T. Hirayama, and K. Kunihiro
NEC Corporation
RTU1C-3: A 3x3mm 2 Embedded-Wafer-Level
Packaged WCDMA GaAs HBT Power Amplifier Module
with Integrated Si DC Power Management IC
Gary Hau, Shih Hsu, Yutaka Aoki*, Takeshi Wakabayashi*,
Naoki Furuhata**, Yukinobu Mikado**
ANADIGICS, Inc., USA., CASIO COMPUTER CO., LTD., Japan.*,
IBIDEN Co., Ltd., Japan. **
RTU1C-4: Integration of a Cellular Handset Power
Amplifier and a DC/DC Converter in a Silicon-On-
Insulator (SOI) Technology
A. Tombak, R. J. Baeten, J. D. Jorgenson, D. C. Dening
RFMD Inc., Corporate R&D
RTU1C-5: Supply Modulators for RF Polar Transmitters
J. N. Kitchen, C. Chu*, S. Kiaei*, B. Bakkaloglu*
Ubidyne, Inc., *Arizona State University, USA
RTU1D: Advanced Frequency
Generation Techniques
Chair: Domine Leenaerts, NXP
Co-Chair: Ting-Ping Liu, Winbond Electronics
(Shanghai)
Room: A314
RTU1D-1: A Low Noise Programmable Clock Multiplier
based on a Pulse Injection-Locked Oscillator with a
Highly-Digital Tuning Loop
B. M. Helal, C.-M. Hsu, K. Johnson, and M. H. Perrott
Massachusetts Institute of Technology, USA
RTU1D-2: A 1.6-to-3.2/4.8 GHz Dual-Modulus
Injection-Locked Frequency Multiplier in 0.18um
Digital CMOS
L. Zhang, D. Karasiewicz, B. Cifctioglu and H. Wu
Laboratory for Advanced Integrated Circuits and Systems,,
Department of Electrical and Computer Engineering,,
University of Rochester, Rochester, NY
RTU1D-3: Sub-mW Multi-GHz CMOS Dual-Modulus
Prescalers Based on Programmable Injection-Locked
Frequency Dividers
X. P. Yu, J. Zhou*, X. L. Yan, W. M. Lim**, M. A. Do**
Zhejiang University, *Shanghai Jiao Tong University,
**Nanyan Technological University, China and Singapore
RTU1D-4: A 50-to-62GHz Wide-Locking-Range CMOS
Injection-Locked Frequency Divider with Transformer
Feedback
Y.-H. Wong, W.-H. Lin, J.-H. Tsai, T.-W. Huang
Dept. of Electrical Engineering and Graduate Institute of
Communication Engineering, National Taiwan University,
Taipei, Taiwan, 106, R.O.C.
RTU1D-5: Fully Integrated Frequency and Phase
Generation for a 6-18GHz Wideband Phased-Array
Receiver in CMOS
F. Bohn, H. Wang, A. Natarajan, S. Jeon, A. Hajimiri
California Institute of Technology

TUESDAY TECHnICAl SESSIonS 13:20-17:10
RTU3A: Complex Integration
Challenges: Characterization and
Modeling
Chair: Francis Rotella, Peregrine Semiconductor
Co-Chair: Yuhua Cheng, Peking University
Room: A407
RTU3A-1: (INvITED) ESD-RFIC Co-Design Methodology
*Xiaokang Guan, *Xin Wang, *Lin Lin, *Guang Chen,
*Albert Wang, **Hainan Liu, **Yumei Zhou, ***Hongyi
Chen and ****Lee Yang
*University of California, Riverside, USA, **Institute of
Microelectronics, CAS, **Tsinghua Univ, **** SMIC
RTU3A-2: Electromagnetic and Thermal Co-Analysis
for Distributed Co-design and Co-simulation of Chip,
Package and Board
S.Wane* and A. Kuo**
*:NXP-Semiconductors, Campus EffiScience, Caen,
14000,France , **:Apache-Optimal Design Solutions, 2645
Zanker Road San Jose (CA), USA
RTU3A-3: Study of the different coupling mechanisms
between a 4 GHz PPA and a 5-7 GHz LC-vCO
S. Bronckers 1,2 , G. Vandersteen 1,2 , L. De Locht 2 , G. Van
der Plas 1 , Y. Rolain 2
1 IMEC, Belgium - 2 ELEC, Vrije Universiteit Brussel, Belgium
RTU3A-4: A Simple and Complete Circuit Model for
the Coupling Between Symmetrical Spiral Inductors
in Silicon RF-ICs
F. Vecchi*, M. Repossi**, A. Mazzanti***, P. Arcioni*,
F. Svelto*
*Università degli Studi di Pavia, Italy, **STMicroelectronics,
Italy, *** Università di Modena e Reggio Emilia, Italy
RTU3A-5: Isolation Enhancement in Integrated
Circuits Using Dummy Metal Fill
Steven G. Gaskill, Vikas S. Shilimkar, Andreas Weisshaar
Oregon State University
RTU4B: voltage Controlled Oscillators
Chair: Jing-Hong Chen, jinghong@ieee.org
Co-Chair: Stephen Dow, ON Semiconductor
Room: A406
RTU4B-1: A Temperature-Compensated Low-Noise
Digitally-Controlled Crystal Oscillator for Multi-
Standard Applications
Ming-Da Tsai, Chih-Wei Yeh, Yi-Hsien Cho, Ling-Wei Ke,
Pei-Wei Chen, Guang-Kaai Dehng
MediaTek Inc. No. 1, Dusing Rd. 1, Hsinchu Science Park,
Hsinchu, Taiwan 300, R.O.C.
RTU4B-2: A BiCMOS voltage Controlled Oscillator and
Frequency Doubler for K-Band Applications
Tino Copani, Bertan Bakkaloglu, Sayfe Kiaei
Connection One, Department of Electrical Engineering,
Arizona State University, USA
RTU4B-3: A Novel Compact Complementary Colpitts
Differential CMOS vCO with Low Phase-Noise
Performance
Chien-Cheng Wei, Yi-Tzu Yang, and Hsien-Chin Chiu
Department of Electronic Engineering, Chang Gung
University, Taoyuan, Taiwan, Republic of China
RTU4B-4:A Low-voltage High-Frequency CMOS LC-vCO
Chih-Hsiang Chang and Ching-Yuan Yang
Department of Electrical Engineering, National Chung
Hsing University, 250, Kuo-Kuang Road, Taichung, Taiwan
40254
RTU4B-5: Current Reuse Cross-Coupling CMOS vCO
Using the Center-tapped Transformer in LC Tank for
Digitally Controlled Oscillator
Youngjae Lee,Seokbong Hyun,Cheonsoo Kim
RF/Analog SoC Design Team, ETRI, Korea
RTU3B: UWB LNA’s
Chair: Danilo Manstretta, Universita degli
Studi di Pavia
Co-Chair: Kirk Ashby, Microtune, Inc.
Room: A406
RTU3B-1: A 90-nm CMOS Two-Stage Low-Noise
Amplifier for 3-5-GHz Ultra-Wideband Radio
Giuseppina Sapone and Giuseppe Palmisano
Università di Catania, Facoltà di Ingegneria, DIEES,
Catania, Italy
RTU3B-2: A 1.0 v, 2.5 mW, Transformer Noise-
Canceling UWB CMOS LNA
T. Kihara, T. Matsuoka, and K. Taniguchi
Graduate School of Engineering, Osaka University, Osaka,
Japan
RTU3B-3: A 90-nm CMOS LNA for MB-OFDM UWB in
qFN package
W.K.Wong, M.A.Arasu, W.K.Chan*
Institute of Microelectronics, *Wipro techno centre,
Singapore
RTU3B-4: A 2.5-dB NF 3.1-10.6-GHz CMOS UWB LNA
with Small Group-Delay-variation
H. Y. Hang, Y. S. Ln, and C. C. Chen
Department of EE, National Chi Nan Unversity, Taiwan
RTU3B-5: A RF CMOS Amplifier with Optimized
Gain, Noise, Linearity and Return Losses for UWB
Applications
G. D. Nguyen, K. Cimino, M. Feng
University of Illinois at Urbana-Champaign, USA
RTU4C: Advances in silicon RFIC
devices
Chair: Eli Reese, TriQuint
Co-Chair: Waleed Khalil, Intel
Room: A315-316
RTU4C-1: Effect of Technology Scaling on RF
performance of the Transistors Fabricated by
Standard CMOS Technology
Han-Su Kim, Chulho Chung, Joohyun Jeong, Seung-Jae
Jung, Jinsung Lim, JinHyoun Joe, Jaehoon Park, HyunWoo
Lee, Gwangdoo Jo, Kangwook Park, Jedon Kim, Hansu
Oh, and Jong Shik Yoon
Samsung Electronics, System LSI Division
RTU4C-2: Process dependence of 0.11 mm RF CMOS
on High resistivity substrate for System on Chip (SOC)
Application
T. Ohguro, K. Kojima, N. Momo, H. S. Momose, Y.
Toyoshima
Toshiba Corporation, Semiconductor Company, Center for
Semiconductor Research and Development, Japan
RTU4C-3: Improved RF-Performance of Sub-Micron
CMOS Transistors by Asymmetrically Fingered Device
Layout
C. Weyers, D. Kehrer*, J. Kunze, P. Mayr, D. Siprak**, M.
Tiebout**, J. Hausner** and U. Langmann
Ruhr-Universität Bochum, *Qimonda AG, **Infineon
Technologies AG, Germany
RTU4C-4: Effects of Forward Body Biasing on the High
frequency Noise in Deep Submicron NMOSFETs
Hao Su, Hong Wang, Tao Xu, Rong Zeng
Microelectronic Centre, School of Electrical and Electronic
Engineering, Nanyang Technological University, Singapore
639798, Republic of Singapore
RTU4C-5: On-chip Calibration of RF Detectors by DC
Stimuli
R.Ramzan, J.Dabrowski
Linkoping Univetsity, Sweden
RTU3C: WLAN and Broadband Power
Amplfiers
Chair: Freek van Straten, NXP
Co-Chair: David Ngo, RFMD
Room: A315-316
RTU3C-1: A 27dBm, SiGe-BiCMOS Transmitter with
62% PAE and Operation Class Control for Large-
Bandwidth Polar Modulation
M.A.T. Sanduleanu, R.P. Aditham*
Philips Research Einhoven, *NXP Semiconductors, The
Netherlands
RTU3C-2: A Fully Integrated 2x2 Power Amplifier for
Dual Band MIMO 802.11n WLAN Application using
SiGe HBT Technology
H.H.Liao, H.Jiang*, P.Shanjani, A.Behzad
Broadcom Corporation, *San Francisco State University
RTU3C-3: A Decade Bandwidth, Low voltage, Medium
Power Class B Push-Pull Si/SiGe HBT Power Amplifier
Employing Through-Wafer vias
T. S. Wooten, L. E. Larson
University of California at San Diego, Center for Wireless
Communications, USA
RTU3C-4: A x-Band CMOS Power Amplifier with On-Chip
Transmission Line Transformers
B.-H. Ku, S.-H. Baek and S. Hong
School of Electrical Engineering and Computer Science, KAIST,
Daejeon, 305-701, Korea
RTU3C-5: A Broadband Low Cost GaN-on-Silicon MMIC
Amplifier
Bernard Geller, Allen Hanson, Apurva Chaudhari, Andrew
Edwards and Isik C. Kizilyalli
Nitronex Corporation, Durham, NC, 27703, USA
13:20
13:40
14:00
14:20
14:40
15:30
15:50
16:10
16:30
16:50
TUESDAY
67

68
TUESDAY InTERACTIVE FoRUM 14:00-17:00
RTUIF: Interactive Forum
Chair: Yann Deval, University of Bordeaux,
France IMS Lab
Co-Chair: Tina Quach, Freescale Inc.
Room: A3
RTUIF-01: An RFIC within a Direct Open-
Loop Polar Multimode Transmitter for
UMTS/EDGE/GSM
S. Osman, W. Lee, E. McCune, S. Hirano*, M.
Maeda*, K. Ishida*
Panasonic Emerging Advanced RF Laboratory
(PEARL), USA, *Network Development Center
(NDC), Matsushita Electric Industrial Co.,Ltd., Japan
RTUIF-05: A 12-mW 500-Mb/s 1.8-µm
CMOS Pulsed UWB Transceiver Suitable
for Sub-meter Short-range Wireless
Communication
Mamoru Sasaki
Hiroshima University, Hiroshima, Japan
RTUIF-09: A Tunable Bandpass BAW-Filter
Architecture Using Negative Capacitance
Circuitry
C. Tilhac, S. Razafimandimby, A. Cathelin, S.
Bila*, V. Madrangeas*, D. Belot
STMicroelectronics, Crolles, France, *XLIM
Laboratory, University of Limoges
RTUIF-13: A 1.2-v Low LO-Power 3-5 GHz
Broadband CMOS Folded-Switching Mixer
for UWB Receiver
H.Y. Wang, K.F. Wei, J.S. Lin and H.R. Chuang
Institute of Computer and Communication
Engineering, Department of Electrical Engineering,
National Cheng Kung University, Tainan, Taiwan
RTUIF-17: 170-GHz Transceiver with On-
Chip Antennas in SiGe Technology
E. Laskin, K.W. Tang, K.H.K Yau, P. Chevalier*,
A. Chantre*, B. Sautreuil*, S.P. Voinigescu
Edward S. Rogers Sr.
Dept. of ECE, University of Toronto, Toronto, OM M5S
3G4, Canada, * STMicroelectronics, 850 rue Jean
Monnet, F-38926, Crolles, France
RTUIF-21: Colpitts vCOs for Low-Phase
Noise and Low-Power Applications with
Transformer-Coupled Tank
E. van der Heijden, A. Farrugia**, R.
Breunisse*, C.S. Vaucher, R. Pijper
NXP Semiconductors Research, Eindhoven, The
Netherlands , *NXP Semiconductors, Nijmegen, The
Netherlands, **Philips Research, Eindhoven, The
Netherlands
RTUIF-25: A 5GHz CMOS PLL with Low
KvCO and Extended Fine-Tuning Range
Stephen P. Bruss and Richard R. Spencer
University of California - Davis
RTUIF-29: A New Highly-Scalable
Equivalent Circuit Model for On-Chip
Symmetrical Transformer with Accurate
Substrate Modeling
Chuan Wang, Huailin Liao, Chen Li, Xiong
Yongzhong*, Ru Huang
Institute of Microelectronics, Peking
University, Beijing 100871, China, *Institute of
Microelectronics, Singapore
RTUIF-02: A GSM/EDGE Transmitter in
0.13-µm CMOS Using Offset Phase Locked
Loop and Direct Conversion Architecture
S. F. Chen, Y. B. Lee, Bosen Tzeng, C. C. Tang,
Charles Chiu, Rickey Yu, Ovid Lin, L. W. Ke, C.
P. Wu, C. W. Yeh, P. Y. Chen, G. K. Dehng
MediaTek Inc.
RTUIF-06: UWB Antenna Diplexer with
Mode Conversion using High quality
Passive and Active Technology
M. Gamal El Din*, Koen Mertens**, Bernd
Geck* and H. Eul*
*Institute of Radiofrequency and Microwave
Engineering Hanover University, Appelstraße 9A,
30167 Hanover, Germany, **Infineon Technologies
Austria AG, Siemensstrasse 2, 9500 Villach, Austria.
RTUIF-10: A 71-76 GHz CMOS variable
Gain Amplifier Using Current Steering
Technique
Che-Chung Kuo, Zuo-Min Tsai, Jeng-Han Tsai,
Huei Wang
The Graduate Institute of Communication
Engineering of National Taiwan University
RTUIF-14: Scalable Statistical
Measurement and Estimation of a mm-
Wave CML Static Divider Sensitivity in
65nm SOI CMOS
Daeik D. Kim, Choongyeun Cho, Jonghae Kim
IBM Semiconductor Research and Development
Center
RTUIF-18: 60 GHz Transmitter Circuits in
65nm CMOS
Alberto Valdes-Garcia, Scott Reynolds, and
Jean-Oliver Plouchart
IBM T. J. Watson Research Center
RTUIF-22: An 11.5% Frequency Tuning,
-184 dBc/Hz Noise FOM 54 GHz vCO
S. Bozzola*, D. Guermandi**, A.
Mazzanti***, F. Svelto*
*Università degli Studi di Pavia,
**STMicroelectronics, ***Università di Modena e
Reggio Emilia, Italy
RTUIF-26: A 0.13 µm CMOS 90 dB variable
Gain Pre-power Amplifier using Robust
Linear-in-dB Attenuator
Y. Araki, T. Hashimoto, S. Otaka
Corporate R&D Center, Toshiba Corporation, Japan
RTUIF-30: Nonlinear Behavioral
Modelling of Oscillators in vHDL-AMS
using Artificial Neural Networks
M. Kraemer, D. Dragomirescu, R. Plana
LAAS-CNRS, University of Toulouse, 7 Avenue de
Colonel Roche, 31077 Toulouse cedex 4, France
RTUIF-03: A Low Spurious 400M-6GHz
SiGe-MMIC Direct Conversion Transceiver
using 2fLO LO Switching Configuration for
Cognitive Radio
K. Tsutsumi, F. Onoma, J. Koide, M. Uesugi,
N. Suematsu, H. Harada*
Mitsubishi Electric Corp., *National Institute of
Information and Communications Technology, Japan
RTUIF-07: A 10-Gb/s 200-mW Distributed
MZI Driver Implemented in Silicon-
Photonics-Enabled 0.13µm SOI CMOS
Technology
D. Kucharski, B. Welch, V. Sadagopan, and
T. Pinguet
Luxtera Inc.
RTUIF-11: Design and Analysis of a High-
Performance Cascode Bipolar Low Noise
Amplifier with Shunt feedback Capacitor
Byoungjoong Kang, Sung-Gi Yang, Jinhyuck
Yu, Wooseung Choo, Byeong-Ha Park
SAMSUNG ELECTRONICS Co., Ltd, Korea
RTUIF-15: An On-Chip Dipole Antenna for
Millimeter-Wave Transmitters
P. H. Park, S. S. Wong
Stanford University, USA
RTUIF-19: A 40 GHz, Broadband, Highly
Linear Amplifier, Employing T-coil
Bandwidth Extension Technique
Hammad M. Cheema, Reza Mahmoudi,
M.A.T. Sanduleanu*, Arthur van Roermund
Department of Electrical Engineering, Mixed-signal
Microelectronics group, Eindhoven University of
Technology, The Netherlands, *Philips Research
Eindhoven, The Netherlands
RTUIF-23: Frequency Dividers with
Enhanced Locking Range
Kun-Hung Tsai, Jia-Hao Wu, and Shen-Iuan Liu
Graduate Institute of Electronics Engineering and
Department of Electrical Engineering, National
Taiwan University, Taiwan, R. O. C.
RTUIF-27 :A 600MHz CMOS OFDM LINC
Transmitter with a 7 Bit Digital Phase
Modulator
K. Kim, S. Byun*, K. Lim, C-H. Lee**, J. Laskar
Georgia Institute of Technology, *ETRI, Daejeon,
305-350, South Korea, **Samsung RFIC Design
Center at Georgia Tech
RTUIF-31: Uncovering the Physical
Processes that Underlie AM/PM
Conversion in Nonlinear Amplifiers
S. Moloudi, A. A. Abidi
University of California at Los Angeles
RTUIF-04: A Direct Conversion 4.9GHz to
5.925GHz OFDM Receiver with Matched
Non-Integer quadrature LO
Nitin Madan, Amit Burstein, Joshua Park*,
Kerry Phillips, Jeffrey Feigin
Skyworks Solutions Inc., USA, *Sitrix Inc., USA
RTUIF-08: A 0.13 µm CMOS 4-Channel
UWB Timed Array Transmitter Chipset
with sub-200ps Switches and All-Digital
Timing Circuitry
Z. Safarian, T-S.Chu, H. Hashemi
University of Southern California
RTUIF-12: A 2.2dB NF, 5-6GHz Direct
Conversion Multi-Standard RF Receiver
Front-End in 90nm CMOS
Brent R. Carlton, Jon S. Duster, Stewart S.
Taylor, and Jing-Hong Conan Zhan*
Communication Circuits Lab, Intel, Hillsboro, Oregon,
USA; *RF Division, MediaTek, HsinChu, Taiwan
RTUIF-16: A 24-GHz CMOS Butler Matrix
MMIC for Multi-Beam Smart Antenna
Systems
T.-Y. Chin, S.-F. Chang, C.-C. Chang, J.-C. Wu
Department of Electrical Engineering, Department
of Communications Engineering, Center for
Telecommunication Research, National Chung
Cheng University, Chia-Yi, 621, Taiwan
RTUIF-20: A 44.5 GHz Differentially Tuned
vCO in 65nm Bulk CMOS with 8% Tuning
Range
H.M. Cheema, R. Mahmoudi, A.H.M.van
Roermund, M.A.T. Sanduleanu*
Department of Electrical Engineering, Eindhoven
University of Technology, *Philips Research,
Eindhoven, The Netherlands
RTUIF-24: A 3 µW, 400 MHz Divide-by-5
Injection-Locked Frequency Divider with
56% Lock Range in 90nm CMOS
Julie R. Hu, Brian P. Otis
University of Washington.edu
RTUIF-28: A Low Insertion Loss, High
Linearity, T/R Switch in 65 nm Bulk CMOS
for WLAN 802.11g Applications
Yiping Han,Keith Carter*, Lawrence E.
Larson, Arya Behzad*
University of California at San Diego, *Broadcom, USA

General Chair Jenshan Lin
TPC Co-Chair Tina Quach
TPC Co-Chair Yann Deval
Finance Chair David Ngo
Workshops Chair Jacques C. Rudell
Digest & CD-ROM chair Bertan Bakkaloglu
Transactions / Guest Editor Albert Jerng
RFIC STEERInG CoMMITTEE
Invited Papers Chair Derek Schaeffer
Panel Sessions Chair Kevin Kobayashi
Publicity Chair Noriharu Suematsu
Student Papers Yuhua Cheng
Secretary Kevin McCarthy
Conference Coordinator Larry Whicker
Webmaster Takao Inoue
EXECUTIVE CoMMITTEE and ADVISoRY boARD
Executive Committee Advisory Board
Natalino Camilleri, RFIC Chair of the Year 2003 Fazal Ali Mahesh Kumar David Lovelace
Joseph Staudinger, RFIC Chair of the Year 2005 Eliot Cohen Louis Liu Vijay Nair
Stefan Heinen, RFIC Chair of the Year 2006 Reynold Kagiwada Steve Lloyd Kenneth Oh
Luciano Boglione, RFIC Chair of the Year 2007 Sayfe Kiaei
Jenshan Lin, RFIC Chair of the Year 2008
F. Ali
W. Ali-Ahmad
K. Ashby
B. Bakkaloglu
J. Begueret
D. Belot
P. Blount
G. Boeck
L. Boglione
N. Camilleri
S. Chakraborty
G. Chang
J. Chen
N. Cheng
Y. Cheng
S. Dow
B. Floyd
TECHnICAl PRoGRAM CoMMITTEE
R. Gharpurey
A. Gupta
T. Hancock
A. Hanke
S. Heinen
F. Henkel
T. Huang
S. Iezekiel
L. Jansson
A. Jerng
W. Khalil
J. Khoja
S. Kiaei
B. Kim
K. Kobayashi
L. Kushner
C. Lee
D. Leenaerts
D. Lie
L. Liu
T. Liu
D. Lovelace
D. Manstretta
A. Maxim
K. McCarthy
S. Mehta
J. Mondal
D. Ngo
S. Pellerano
A. Podell
S. Raman
M. Reddy
B. Redman-White
E. Reese
F. Rotella
J. Rudell
C. Saavedra
D. Schaeffer
J. Staudinger
B. Stengel
N. Suematsu
J. Tham
B. Thompson
F. van Straten
A. Wang
P. Yue
G. Zhang
69

70
MESSAGE FRoM THE ARFTG CHAIRS
T
he 71st Automatic RF Techniques Group (ARFTG) Microwave Measurement Conference will be held at the
Omni Hotel at CNN Center in Atlanta, Georgia, on Friday, 20 June 2008. This year’s conference theme is
“Network Analysis – 50 years on”. The conference will provide an opportunity to celebrate the role of the
network analyzer in our industry during the past, present, and into the future. Doug Rytting, formerly of
Hewlett Packard and Agilent Technologies, will start the conference and set the scene with a keynote address.
Regular papers will also be focusing on network analysis and related topics.
The conference will be preceded on Thursday afternoon by the Nonlinear Vector Network Analyzer (NVNA) Users’
Forum - an informal discussion group devoted to sharing information and issues related to instrumentation utilized
in vector large-signal analysis of microwave circuits and systems that contain nonlinear elements. All interested
people are welcome to attend. Also, be sure to check out the joint ARFTG/IMS sponsored workshops. ARFTG is cosponsoring
and co-organizing two workshops: “High Speed Signal Integrity Workshop – Emphasis on Jitter” and
“Applications and Misapplications of Measurement Uncertainty”.
An important part of all ARFTG conferences is the opportunity to interact one-on-one with colleagues, experts and
vendors in the RF and microwave test and measurement community. Starting with the continental breakfast in the
exhibition area, continuing through the two exhibition/interactive forum sessions and the luncheon, there will be
ample opportunity for discussion with others facing similar challenges. So, come and join us. You’ll find that the
atmosphere is informal, open, and friendly.
Finally, we would like to thank all those that have contributed to making this event possible. In particular: Chris
Ward, who, as local host, has undertaken all local planning arrangements; Elsie Cabrera, for providing liaison with
all the other activities that are taking place; and, Joe Tauritz, for making arrangements for the companies that
have chosen to exhibit at the conference. We also thank the authors who have contributed their technical papers,
the members of the Technical Program Committee who reviewed the submissions and the exhibitors who will be
bringing some of their latest products to show at the conference.
Nick M Ridler
Conference Chair
71st ARFTG Conference
Roger D Pollard
Technical Program Chair
71st ARFTG Conference

Session 1 - 50 years of vNAs
08:00–09:40
Network Analyzers – 50 Years On
(Keynote – invited)
D K Rytting
Rytting Consulting, Santa Rosa, CA, USA
Network Analyzer Calibrations –
Yesterday, Today and Tomorrow
K Wong
Agilent Technologies, Santa Rosa, CA, USA
Using Uncertain Complex Numbers
with vNA Measurements
B D Hall
Measurement Standards Laboratory of New
Zealand, New Zealand
An advanced Full Path Loop-Back
Testing Technique for Embedded RF
Indentification (RFID) System-on-a-
Chip (SoC) Applications
B Kim, I-C Park, D Yoo, J Koo, I Kim, B W
Choi, Y Bae and B Y Kim
Samsung Electronics Co Ltd, Gyeonggi-Do,
South Korea
Measurement Uncertainty of Direct
Power Measurement Using the
Pulse Sensor MA2411B
Y S (B) Lee
Anritsu Corporation, Morgan Hill, CA, USA
ARFTG TECHnICAl SESSIonS
Session 2 - vNA calibration
10:20–12:00
Monte-Carlo Analysis of
Measurement Uncertainties for On-
Wafer Thru-Reflect-Line Calibrations
J Leinhos 1,2 and U Arz 2
1 Leibniz Universität Hannover, Germany;
2 Physikalisch-Technischen Bundesanstalt
(PTB), Germany
A Mixed-Mode TRL Algorithm
Based on Symmetrical Reflection
Standards
W Liang 1 and L Quanli 2
1 Beijing University of Aeronautics and
Astronautics, Beijing, China;
2 Agilent Technologies, Beijing, China
Accurate Broadband RLCG
Parameter Extraction with TRL
Calibration
M Wojnowski1 , M Engl1 , V Issakov1 ,
G Sommer1 and R Weigel2 1Infineon Technologies AG, Neubiberg,
Germany;
2University of Erlangen-Nuremberg, Germany
Over-Determined Offset Short
Calibration of a vNA
J P Hoffmann, P Leuchtmann and R
Vahldieck
ETH Zurich, Zurich, Switzerland
Session 3 - Passive components
13:30–14:45
A New Method for Determining the
Characteristic Impedance Zc of
Transmission Lines Embedded in
Symmetrical Transitions
J E Zúñiga-Juárez, J A Reynoso-
Hernández and A Zárate-de Landa
CICESE, Ensenada, B C México
Analysis and Design of Coupled
Coplanar Stripline Balun Probe for
Differential Circuit Measurements
J S Kim 1 , W R Eisenstadt 1 , M Andrew 2
and P Hanaway 2
1 University of Florida, FL, USA;
2 Cascade Microtech Inc, Beaverton, OR, USA
Comparison of a Single Channel and
a Dual Channel Microwave
Attenuation Measurement System
T Y Wu and S W Chua
National Metrology Centre, Singapore
ARFTG InTERACTIVE FoRUM
09:40–10:20 and 14:45–15:15
High-Power On-Wafer Capabilities
of a Time Domain Load-pull Setup
F De Groote 1 , J P Teyssier 1,2 , J Verspecht
1 and J Faraj 2
1 Verspecht-Teyssier-DeGroote SAS, Brive,
France; 2 Limoges University, Brive, France
verification of Wafer-Level
Calibration Accuracy at High
Temperatures
A Rumiantsev 1 and R Doerner 2
1 SUSS MicroTec Test Systems GmbH, Sacka,
Germany; 2 Ferdinand-Braun-Institut fuer
Hoechstfrequenztechnik (FBH), Berlin,
Germany
A Load-Pull Wafer-Mapper
F Vanaverbeke, K Vaesen, D Xiao, L
Pauwels, W De Raedt, M Germain,
S Degroote, J Das, J Derluyn and D
Schreurs
IMEC vzw, Kapeldreef, Belgium
quantitative Understanding of the
Mated Interface Characteristics of
Precision Coaxial Connectors at
Microwave and Millimeter-Wave
Frequencies
M Horibe, M Shida and K Komiyama
National Metrology Institute of Japan, Japan
Session 4 - Active devices
15:15–16:40
Phase Shift De-Skew of Oscilloscope
Current and voltage Sensing Probes
by Means of Energy Balance
P Molina Gaudó and C Bernal
University of Zaragoza, Zaragoza, Spain
Active Harmonic Phase Standard
with Low Sensitivity to Input Power
Levels and Fundamental Drive
Frequency
D Gunyan and Y P Teoh
Agilent Technologies, Santa Rosa, CA, USA
An Extension of Existing Real-Time
On-wafer Load Pull Systems to Perform
Time Domain voltage/Current
Waveform Reconstruction
I Volokhine
NXP-TSMC Research Center, Eindhoven, The
Netherlands
On-Chip Cancellation of Parasitic
Effects for Dielectric Permittivity
Measurement
C Song and P Wang
Clemson University, SC, USA
A Method for Automatic Tuner
verification
E M Johnson
Freescale Semiconductor, Tempe, AZ, USA
FRIDAY
7

7
WoRKSHoPS
Workshops and Tutorials are offered on Sunday, Monday, and Friday of Microwave Week. They are distinguished by the following features:
• Advanced Level Workshops (designated as WSA, WSB, etc.) present the state of the art to specialists who are already experienced
in the topic area
• Tutorial Level Workshops (designated as TSA, TSB, etc.) are targeted towards educating attendees in new areas of microwave
technology, reviewing material that is primarily a revision of previously published information.
All Workshops and Tutorials will be held at the Georgia World Congress Center. Specific room assignments will be announced at check-in.
WSA — 08:00-17:00
High Data Rate 60GHz Radio Link Applications & Design
Topics and Speakers:
1- Millimeter Wave Terrestrial Gigabit Class Radio Technology,
Lockie Douglas, Gigabeam
2- Design and Layout of Single-Chip 77-96GHz Receivers and
Transceivers, Sean Nicolson PhD, University of Toronto
3- A Transceiver for 60GHz High Data Rate Wireless Transmission,
Prof. Joy Laskar, Georgia Tech
4- A CMOS mmW approach for 60GHz Transceiver - Francesco Svelto,
Pavia
5- 60 GHz RF Transceiver Circuits and System Integration Based on
Commercial pHEMT and mHEMT Technologies, Prof. Herbert Zirath,
Chalmers University
6- SiGe Power Amplifiers for 60 GHz Communication Systems, Prof.
Georg Boeck, Berlin University of Technology
7- Broadband Millimeter Wave Communication, System Design
Concepts and Trials, Wilhelm Keusgen PhD, Heinrich-Hertz-Institut
Berlin
Organizers: Mr. Didier BELOT, ST Microelectronics; Prof. Jean-Baptiste
BEGUERET, University of Bordeaux; Prof. Georg Boeck, TU, Berlin; Eric
Kerherve from Bordeaux
Sponsor: RFIC
Workshop Abstract: The presentations in this workshop will cover
different aspects of 60GHz radio links. The morning session will open
with a discussion of the applications of 60GHz radios followed by an
overview of the main challenges of mmW integration. Then, several
speakers will present example solutions in both CMOS and SiGe
technologies.
SUnDAY WoRKSHoPS
WSB — 08:00-17:00
Advances in Circuit Design for Wideband Millimeter
Wave Applications
Topics and Speakers:
1- Millimetrer Wave Systems: Existing and Up-coming Applications,
Dr. Dietmar Köther, IMST, RF Test Center
2- System Level Aspects, Baseband Architectures, Modulation
and Standardization of 60 GHz Wireless Communication, Dr. André
Bourdoux, IMEC
3- Millimeter Wave Design in Bulk-CMOS and CMOS-SOI, Dr. Andreia
Cathelin, STMicroelectronics, FTM/Central CAD & Design Solutions
4- S-Parameters Measurements and Small Signal Modeling of sub-
65nm Silicon MOSFETs up to 220 GHz, Nicolas Waldhoff, IEMN
5- Circuit Design Challenges for High-Power mmWave and THz
Applications, Prof. Ullrich Pfeiffer, University of Siegen, Institute of
High-Frequency and Quantum Electronics
6- 80-160 GHz CMOS and SiGe BiCMOS Building Block Design, Prof.
Sorin Voinigescu, University of Toronto
7- Nonlinear Millimeter-Wave Modeling of Electron Devices in the
Presence of Low-Frequency Dispersive Effects, Dr. Antonio Raffo,
University of Ferrara
8- Highly Integrated MMICs Based on III-V Technologies for
Milimeterwave/THz Applications, Prof. Herbert Zirath, Chalmers
University of Technology, Department of Microtechnology and
Nanoscience
Organizers: Prof. Dominique Schreurs, K.U.Leuven, Div. ESAT-TELEMIC;
Prof. Patrick Reynaert, K.U.Leuven, Div. ESAT-MICAS
Sponsors: MTT-1, MTT-6, MTT-20, MTT-23, RFIC
Workshop Abstract: Wireless and mobile telecommunication
applications in the lower microwave frequency range have become
commonplace. To be able to offer higher data rates to the demanding

market, research is gradually focusing towards millimeter wave
frequencies. The advantage of millimeter waves is that they are capable
of providing wide (in the absolute sense) bandwidth for very highspeed
wireless access. Next, millimeter wave networks are becoming
viable due to cost reduction in semiconductor devices. This workshop
aims at informing the attendees about the recent developments in this
area. The workshop includes overview talks on emerging wideband
millimeter wave applications. Recent advances in circuit design using
various device technologies will be covered in great detail. As these
progresses are intrinsically connected with developments in modeling
and measurement techniques, those aspects are addressed as well.
Ample time will be foreseen to allow interactions between attendees
and speakers.
WSC — 13:00-17:00
Recent Advances in GaN HEMT Performance, Modeling,
Linearity and Design Techniques
Topics and Speakers:
1- GaN Power Amplifiers for Mobile Communication Systems, Dr.
Ruediger Quay, Fraunhofer Institute
2- Advanced Modeling Techniques for GaN Wideband Gap HEMT
Devices, Dr. Rolf Jansen, Aachen University
3- Physical Phenomena Affecting the Linearity of AlGaN/GaN HFET
Amplifiers, Dr. Robert J. Trew, No. Carolina State,EE
4- Impact of Access Regions on GaN HFETs, Dr. M. Uren, QinetiQ, Micro
Nanotechnology Labs
5- GaN-HEMT Switch-Mode Microwave Power Amplifiers for Class-S
Concept, Dr. Chafik Meliani, Ferdinand Braun Institute
6- Recent Progress of GaN-HEMT Performance, Dr. Toshihide Kikkawa,
Fujitsu Laboratories Ltd.
Organizers: Mr. Frank Sullivan, Raytheon Company; Dr. Rolf Jansen,
Aachen University; Dr. Ruediger Quay, Fraunhofer Institute
Sponsors: MTT-1, MTT-6, MTT-7
Workshop Abstract: In the last 2-3 years, GaN wideband gap
HEMT technology has resulted in high power transistors with record
breaking performance. Commercialization of devices has started in
the U.S. and Japan and key groups in Europe are engaged in bringing
power HEMT technology into products. Reliability issues have been
addressed with very promising results. A key to the design of future
high performance products is GaN HEMT modeling and the challenge
is increasing accuracy to meet the linearity needs of future systems.
The high power applications need modeling that includes thermal
and memory effects. Improvements with respect to current collapse
and knee-walkout modeling have been achieved. New developments
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include switch mode power amplifiers that come along with the need
of high model accuracy. The new circuit architectures for efficient
linear applications call for more elaborate circuit design strategies and
pose additional requirements on model accuracy and verification.
WSD — 08:00-17:00
RF SoC Interaction with Peripherals and the Demand for
Attention to Coupling Effects in Early Design Phases
Topics and Speakers:
1- Cross Coupling in Baseband-Radio SoCs, Dr. Dietolf Seippel,
Infineon Technologies
2- Parasitic-aware Design Methodology for Wireless SoC, Dr. Robert
A. Mullen, Cadence
3- Post-Silicon and Pre-Silicon Techniques for Mitigating the Effects
of Interference in Wireless SoCs, Oren Eliezer, Texas Instruments
4- Advanced EM Simulation Technology for RF SoC Modeling, Dr. Jan
Vanhese, Agilent
5- Noise Coupling in RF and Mixed-signal Circuits: Modeling and
Experimental Validation, Dr. Geert van der Plas, IMEC
6- Electrical Signal Integrity Analysis in Mixed-Signal and RF ICs, Dr.
Francois Clement, S.A. CWS
7- RF SoC Coupling Effects and Interaction with Peripherals: Needs
to be Dealt with in the Early Design Phases, Dr. Jan Niehof, NXP
Semiconductors
8- Isolation Issues in Multi-Chip Radio Modules for Cellular
Applications: On Chip, Module-Chip and In Module, Jyoti Mondal,
Freescale Semiconductor
Organizers: Dr. Jan Niehof, NXP Semiconductors; Oren Eytan Eliezer,
Texas Instruments
Sponsor: RFIC
Workshop Abstract: This workshop will focus on the key requirements
to address physical design issues in the early design phases of complex
RF SoC design. The workshop will be divided into two sessions. The
morning session will focus on the required specifications related
to the SoC physical design, including tool and flow requirements.
Recognized companies and partnerships active in the semiconductor
industry will give these presentations and explain their needs through
actual examples. In the afternoon session, EDA vendors will give
presentations to react on the customer requirements. They will present
the future direction and CAD/EDA roadmaps to address these issues.
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WSE — 08:00-12:00
Advanced PLL Architectures for Embedded SoC
Applications
Topics and Speakers:
1- Digital Clock and Data Recovery for Software-Programmable Links,
Jafar Savoj, Rambus Inc
2- Why Moore’s law and scaling work for mm-wave CMOS
Synthesizers:, Dr. Sorin Voinigescu, Univrsity of Toronto
3- Understanding Digital Quantization in Delta-Sigma and Related
Fractional-N PLLs, Dr. Sudhakar Pamarti, UCLA
4- Digital Implementation Techniques for Fractional-N Frequency
Synthesizers, Dr. Michael Perott, MIT
5- All-digital PLL Architectures for Fully-integrated Receiver SoCs, Dr.
Francesco Svelto, University of Pavia
Organizers: Dr. Bertan Bakkaloglu, Arizona State University; Dr. Sayfe
Kiaei, Arizona State University
Sponsor: RFIC
Workshop Abstract: The ongoing migration of RF systems towards
single-chip mixed-signal receiver/transceiver SoCs pushed towards
a more digital-friendly implementation of the RF frequency
synthesizers. The speed of modern CMOS technologies and advances
in digital signal processing have enabled the evolution of PLL clock
synthesis and clock and data recovery (CDR) circuits from analog to
digital architectures. Digital solutions benefit from reduction of area
and power consumption with device scaling, and facilitate porting of
circuits across process nodes. Such designs achieve much lower power
consumption, higher levels of integration, and improved immunity to
supply and substrate noise compared to their analog counterparts.
This workshop discusses state of the art approaches to digital intensive
PLLs for SoC applications.
WSF — 08:00-17:00
Medical Applications of RF and Microwaves
Topics and Speakers:
1- Status and Future of Medical Applications of RF and Microwave
Power, Dr. Eiji Tanabe, AET Inc.
2- Medical Applications for Radiometric Sensing, Dr. Kenneth L. Carr,
Meridian Medical Systems
3- Electromagnetic and Thermal Simulations in Bio-medical
Applications, Dr. Martin H. Vogel, Ansoft Corporation
4- Non-Contact Assessment of Patient Cardiopulmonary Activity,
Prof. Victor Lubecke, University of Hawaii at Manoa, Department
of Electrical Engineering
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5- Creation of Biological Stents and Occlusions with Microwave
Catheters, Dr. Fred Sterzer, MMTC, Inc.
6- Recent Advanced in RF and Microwave Applicators for Cancer
Therapy, Dr. Paul Stauffer, Duke University Medical Center
7- R&D and Standard of Wireless Body Area Network (WBAN), Prof.
Ryuji Kohno, Yokohama National University, Division of Physics,
Electrical and Computer Engineering
8- Tissue Ablation using RF and Microwaves - Application to Treatment
of Cancer and Cardiac Arrhythmia, Dr. Dieter Haemmerich, Medical
Univ. South Carolina, Div. Pediatric Cardiology
9- Microwave Imaging for Breast Cancer Detection, Dr. Elsie Fear,
University of Calgary
Organizers: Dr. Edward C. Niehenke, Niehenke Consulting, Engineering;
Prof. Ayre Rosen, Drexel University, ECE Department; Dr. Roger Kaul,
Army Research Laboratory, Engineering
Sponsors: MTT-10, MTT-16, MTT-20
Workshop Abstract: RF and Microwave technologies play a key role
today in medical applications. This full-day workshop presents a
broad range of the latest applications of this technology in this rapidly
developing field with emphasis on newer emerging diagnostic and
therapeutic techniques. Focused areas include imaging, diagnostics,
therapy, and healthcare management. Key technology to be reported
in the area of include: Cancer treatment with indirect RF/microwaves;
Multi-megawatts of microwave power converted to high energy
electrons, ions, plasma, and X-rays for cancer treatment; State-ofthe-art
thermal tumor ablation; Catheter-based systems for biological
stents; Microwave balloon systems; Electromagnetic and thermal
simulation; Thermal limitations of MRI; Cardiac arrhythmia treatment;
Microwave imaging; Radiometric sensing of vital sign sensing utilizing
radar principle; and Microwave-communications in the management
of healthcare. The workshop will conclude with an hour long panel
session in which all the speakers will address and discuss specific
written questions from the workshop attendees.
WSG — 13:00-17:00
Analog-Digital Co-Design Techniques for Nanometer
CMOS Transceiver SoC Integration
Submission Number: 130
Workshop Classification:
Advances
Half Day
Topics and Speakers:
1 - Correcting Nanometer CMOS RF Circuit Impairments – Prof. Bram

Nauta (University of Twente)
2 - Circuit Design Techniques for Ultra-low Voltage RF Receiver - Prof.
Peter Kinget (Columbia University)
3 - Analog-assisted digital and digitally-enhanced analog techniques
for mixed signal SoC transceivers - Prof. John Long (University of
Delft)
4 - Digital signal processing techniques for linearity and efficiency
enhancement of Envelope Tracking, EER, and Doherty amplifiers.
- Prof. Larry Larson (UC San Diego)
5 - Designing CMOS wireless system-on-a-chip for WLAN - Dr. David
Su (Atheros)
6 - Advantages of SoC for cellular RF transceiver design - Dr. Andre
Hanke (Infineon)
Workshop Abstract: The nanometer CMOS processes bring
devices with high fT, enabling the SoC integration of multi-GHz RF
communication systems. This gave a tremendous cost, area and power
saving when compared with traditional bipolar or BiCMOS solutions.
However, the higher noise, larger mismatches and wider process
variations of nanometer FETs require extensive digital calibration to
compete with traditional analog solutions. This workshop addresses
advanced analog-digital co-design techniques which trade the higher
speed and larger digital gate density of nanometer CMOS processes
for relaxed analog front-end specifications. First, the ways to correct
the nanometer CMOS device impairments and the very low-voltage
circuit design challenges are presented. Then, new mixed-signal and
all-digital approaches to implement traditional analog functions
are investigated. Final presentations show how the analog-digital
co-design techniques are applied to the major wireless applications:
cellular, WLAN and broadcast.
WSH — 08:00-17:00
Measurements for Wireless System-Level Evaluation
Topics and Speakers:
1- Measurements for Behavioral Model Evaluation of I/Q Modulators
and Transmitters, Prof. Kevin G. Gard, North Carolina State
University, Dept. of ECE
2- Measurements for Local Oscillator Phase Noise, Prof. Michael B.
Steer, North Carolina State University, Dept. of ECE
3- Poly-Harmonic Distortion Measurements: A Maturing Amplifier
Measurement Technology, Dr. Jan Verspecht, Jan Verspecht, B.V.B.A.
4- Large-Signal Measurements for Power Amplifier Characterization,
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Dr. Joseph Gering, RF Micro Devices
5- Characterizing FET-based Active Radiating Structures, Prof. Jose Angel
Garcia, University of Cantabria, Dept. Communication Engineering
6- The Receiver Front End: From RF Field to RF Signal, Dr. Kate A.
Remley, NIST, Electromagnetics Division
7- Characterization of Mixed Domain Components for SDR
Applications, Prof. Nuno Borges Carvalho, IT-Universidade de Aveiro
8- Measurements of wireless standards using Multisines, Dr.
Dominique Schreurs, Catholic University Leuven
Organizers: Dr. Kate A. Remley, NIST, Electromagnetics Division; Prof.
Kevin G Gard, North Carolina State University, ECE; Prof. Nuno Borges
Carvalho, IT-Universidade de Aveiro
Organizers: Dr. Bogdan Staszewski (Texas Instruments), Prof. Yann Sponsors: MTT-11, MTT-20
Deval (IMS, University of Bordeaux); Dr. Adrian Maxim, Silicon Laboratories
Workshop Abstract: The demand of industry and society for an all-
Sponsors: RFIC
wireless world is pushing wireless device design towards higher levels
of integration and complexity. As a result, characterization of each
component becomes more and more complicated by its dependence
on the system environment. This motivates the need for further
innovation and development of new and refined measurement and
modeling techniques to evaluate each component of the system,
keeping in mind overall system performance evaluation.
WSI — 08:00-12:00
Adaptive Low-Power Front-Ends for Wireless
Communication Systems
Topics and Speakers:
1- Low-power Reconfigurable Transmitter Architectures, Prof.
Lawrence Larson, UC San Diego
2- CMOS power amplifiers for mobile terminals, Prof. Patrick Reynaert,
KU Leuven
3- Leveraging VCO-based Quantization to Achieve Low Power,
Wideband A/D Conversion for Multi-Standard RF Front-ends, Prof.
Mike Perrott, MIT
4- Low-power Receivers Concepts: An Industrial Example, Dr. Robert
B. Staszewski, Texas Instruments
5- Integrated Power Management Circuits for Wireless Applications,
Prof. Hoi Lee, University of Texas
Organizers: Dr. Gernot Hueber, DICE GmbH; Dr. Robert Bogdan
Staszewski, Texas Instruments; Prof. Stefan Heinen, Infineon
Technologies
Sponsor: RFIC
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Workshop Abstract: Current and future mobile terminals are
becoming increasingly complex because they have to deal with a
variety of frequency bands and communication standards. Achieving
multi-band/multi-mode functionality poses a unique challenge on the
RF-transceiver design due to limitations in terms of frequency agile RF
components that meet the demanding cellular performance criteria, at
costs that are attractive for mass market applications. The focus of this
workshop will be on novel transceiver concepts for low power multimode/multi-band
cellular systems from the antenna to baseband.
Approaches include novel architectures, highly-configurable analog
circuitry, digitally-assisted analog modules and the integration of
digital signal processing into the traditionally purely analog frontend.
However, the utilization of digital signal processing capabilities
is in line with the ongoing trend towards SoCs in minimum-featuresized
CMOS.
WSJ — 13:00-17:00
Advancements in Power Amplifiers and Transmitters for
Mobile Wireless Products
Topics and Speakers:
1- Market Trends and Key Design Challenges for Mobile Cellular &
WiMax Transmitters, Dr. Ken Weller, Skyworks Solutions
2- Overview, Transmitter Linearization and Efficiency Enhancement
Techniques, Gord Rabjohn, SiGe Semiconductor
3- Application of Adaptive Digital Predistortion for EDGE, W
CDMA, and LTE Mobile Transmitters, Dr. George Norris, Freescale
Semiconductor
4- Advancements in Power Amplifiers for Polar Modulation
Architectures, Wayne Kennan, RFMD
5- Power Amplifier Architectures for 3G Handsets: Balanced vs.
Single-ended Structure, Dr. Gary Zhang, Skyworks Solutions
6- Switched Doherty PAs for 3G, Thomas Apel, Triquint Semiconductor
7- Improvements in Power Amplifier Performance via Adaptive
Antenna Matching Techniques, Andre Van Bezooijen, NXP
Semiconductor
Organizers: Joseph Staudinger, Freescale Semiconductor; Dr. Natalino
Camilleri, Alien Technology
Sponsors: RFIC, IMS08
Workshop Abstract: Advancements in wireless transmitters continue
to focus on improving efficiency while maintaining acceptable levels
of linearity. Emerging high speed data centric services result in RF
signals which are particularly challenging to amplify in a handset
environment. The large dynamic range and high instantaneous
bandwidths are difficult to linearly amplify, especially in very low cost
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small footprint packaging. Additionally, multi-mode and multi-band
operation further extends the operational performance space of the
underlying power amplifier. Current efforts focus on both the overall
transmitter architecture as well as the underlying power amplifier
circuit. Several presentations focus on the application of adaptive
digital pre-distortion linearization techniques supporting 2.5G, 3G,
and LTE signal formats. Subsequent presentations examine innovative
circuit techniques employed to improve the underlying amplifier.
WSK — 08:00-12:00
Advances in High Power Devices and PA Architectures for
Wireless Infrastructure
Topics and Speakers:
1- Trends in High Power and Efficiency Amplifiers for Infrastructure,
Dr. John Wood, Freescale Semiconductors Inc., Phoenix AZ, USA
2- Recent Advances in LDMOS Technology, Dr. Wayne Burger, Freescale
Semiconductors Inc., Phoenix AZ, USA
3- Improvement of GaN HEMT for High Efficiency PA Technique, Dr.
Toshi Kikkawa, Fujitsu Laboratories Ltd, Japan
4- Applying GaN HEMT Amplifiers to High Efficiency Techniques, Dr.
David Runton, RF Micro Devices, Phoenix AZ, USA
5- Recent Advances on Doherty Amplifiers, Dr. J. Gajadharsing, NXP
Semiconductors Inc., Nijmegen, The Netherlands
6- Digital Envelope Tracking and Load Modulation Technique for
Efficiency and Linearity, Dr. Yuanxun Ethan Wang, UCLA, Electrical
Engineering Department, LA, USA
Organizers: Dr. Edmar Camargo, RF Micro Devices, Scotts Valley,
CA, USA; Dr. Carlo Poledrelli, NXP Semiconductors, Nijmegen, The
Netherlands
Sponsors: MTT-5, MTT-7, MTT-20, RFIC
Workshop Abstract: The market requirements on PA technology,
has been increasingly demanding in terms of power, efficiency and
linearity. This workshop will address these issues on the status of
device technology, including LDMOS and GaN in the first part. In
the second their application on PA, targeting high efficiency or high
linearity will be discussed. The amplifier techniques such as Envelope
Tracking and Switched Mode will be covered and a special emphasis
will be dedicated to the Doherty configuration combined with Digital
Pre-distortion. The workshop subjects will be covered by academic
and international industry specialists detailing their developments
and solutions.

WSL — 08:00-17:00
On-Chip Calibration, Compensation, and Filtering
Techniques for Wireless SoC
Topics and Speakers:
1- IIP2 and DC offset calibration techniques in 3G transceivers, Dr.
Krzysztof Dufrene, DICE Danube Integrated Circuit Engineering
GmbH
2- Accurate tuning and calibration of Fractional-N frequency
synthesizers, Waleed Khalil, Robert Santucci, and Dmitry Petrov,
Intel Corp.
3- Calibration Techniques for Wireless SoCs, Arya Behzad, Broadcom
Corp.
4- Digital Hardware and Software Based Mechanisms for Calibration
and Compensation in Wireless SoCs, Oren Eliezer, Texas
Instruments
5- Compensation of radio impairments for low cost wireless
transceiver design, Steve Cicarrelli, Qualcomm
6- Calibration, Compensation, and On-chip Filtering techniques used
in 3G transceivers, Jonathan Strange, Mediatek Wireless, UK
7- Digital Calibration Techniques for Cellular Receivers, Abdellatif
Bellaouar, Sherif Embabi, and Hamid Safiri, Sirific Wireless
8- Digital Calibration Techniques for Cellular Transmitters, Abdellatif
Bellaouar, Sherif Embabi, and Hamid Safiri, Sirific Wireless
Organizers: Dr. Walid Ali-Ahmad, MediaTek, Singapore
Sponsor: RFIC
Workshop Abstract: As wireless SoCs are being targeted for multistandard
and multi-band applications, the demand is still for excellent
radio performance and minimum number of off-chip components. In
addition, higher quality modulation techniques are being used in these
systems to deliver higher data rates in a cellular environment. Hence,
there is more weight being put on developing RF front-ends which are
as good as ideal! Furthermore, there is currently a big emphasis on
eliminating the undesirable large number of external RF SAW filters in
multi-band operation. In order to achieve all these new requirements,
on-chip correction techniques are needed that complement the onchip
radio circuitry and benefit from state-of-the-art CMOS processes
currently available for wireless SoCs. This workshop will review on-chip
calibration techniques for RF and BB impairments compensation, plus
on-chip filtering circuitry to relax front-end linearity requirements
and minimize the need for off-chip filters.
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WSM — 08:00-12:00
Advanced CMOS Based Systems for Biomedical
Applications
Topics and Speakers:
1- Ultra Low Power Wireless for Body Sensor Networks, Mr. Alan
Wong, Toumaz Technologies
2- Clinical Prosthetic Devices for Glaucoma, Epilepsy, and Traumatic
Brain Injury Repair, Dr. Pedro Irazoqui, Purdue University
3- Mixed-signal Data Mining on Microphone Array Hearing Aids, Dr.
Shantanu Chakrabartty, Michigan State University
4- CMOS ICs for Biomedical Spectroscopy, Dr. Arjang Hassibi,
University of Texas at Austin
Organizers: Dr. Sudipto Chakraborty, Texas Instruments; Dr. Shekar
Rao, Texas Instruments
Sponsor: RFIC
Workshop Abstract: CMOS integration has impacted numerous diverse
disciplines in the recent years. Biomedical technology is a rapidly
emerging area and low power, miniaturized solutions have attracted
great deal of interest. Such systems are usually perceived by integration
of diverse building blocks such as sensors, power management,
telemetry and analog processing, to name a few. In this workshop, we
will explore the applications of Silicon based technologies in various
areas of biomedical technology developments.
WSN — 13:00-17:00
Low-voltage RF Design in 45nm and Beyond
Topics and Speakers:
1- Radio-Frequency Receiver Design in 45nm Digital CMOS
Technology, Dr. Christopher D. Hull, Intel Corp.
2- Transmitters in 45nm and Beyond: Whither Linear, Dr. Earl
McCune, Panasonic
3- Challenges in Low Voltage Frequency Synthesizer Design, Prof.
Sudhakar Pamarti, UCLA
4- A/D Converter Design in 45nm and Beyond, Prof. Boris Murmann,
Stanford University
Organizers: Dr. Stewart S. Taylor, Intel Corp.; Dr. Jacques C. Rudell,
Intel Corp.
Sponsor: RFIC
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Workshop Abstract: Architecture and circuit refinements/evolution
have postponed the pain of low-voltage design. With most 45nm
processes using a 1V supply, radical new thinking is required to realize
high performance front-end transceivers in current and future silicon
CMOS technologies. Although the intrinsic speed of the device (ft) has
now reached well into the 100GHz region, new challenges with respect
to low gain (gm*Ro), higher 1/f noise, extreme mismatch conditions,
and low supply voltages will require a new design paradigm. This half
day workshop will focus on some of the key challenges associated
with realizing robust circuits in 45nm processes and beyond. The first
speaker will focus on receiver architectures and circuits for nanometer
technologies while the second speaker will give a similar presentation
on transmitter design. The third presentation will focus on synthesizers
and finally, the fourth presentation will focus on data converters.
WSO — 08:00-12:00
Getting Accurate Results with Nonlinear Circuit Analysis
Topics and Speakers:
1- Welcome and Introduction, Prof. Dominique Schreurs, K.U. Leuven,
Div. ESAT-TELEMIC
2- Network Design with Advanced Harmonic-Balance Tools, Dr.
Ruediger Follmann, IMST
3- Accuracy of Nonlinear Circuit Analysis, Prof. Stephen A. Maas,
Nonlinear Technologies, Inc
4- What Can Time-Domain Modeling do for RF Nonlinear Circuit
Analysis, Dr. Kriplani, North-Carolina State University, Electronics
Research Laboratory
5- Nonlinear Model-Simulator Interface, Prof. Tom Brazil, University
College Dublin, Department of Electronic Engineering
Organizers: Prof. Dominique Schreurs, K.U.Leuven, Div. ESAT-TELEMIC;
Prof. Adalbert Beyer, Duisburg-Essen University, Electrical Engineering;
Dr. Stephen Maas, Nonlinear Technologies, Inc.
Sponsors: MTT-1, MTT-20, MTT-22
Workshop Abstract: Even though nonlinear circuit-analysis software
has been in use for many years, users still have difficulty obtaining
valid results with existing methods. Recognized problems include
poor accuracy, convergence difficulties, long simulation times, and
unstable results (i.e., results that vary greatly with minor changes
in parameters). These problems are encountered in both harmonicbalance
and time-domain simulations. In this workshop, we examine
the reasons for these phenomena and describe ways to overcome
them and make good, efficient use of existing methods. We also show
where more research could provide deeper understanding of such
phenomena and better simulator performance.
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TSB — 13:00-17:00
Noise In Linear Circuits
Topics and Speakers:
1- Physical Sources of Noise, Marian Pospieszalski, NRAO.
2- Noise Analysis of Linear Networks, Luciano Boglione, UMass-
Lowell.
3- Noise Measurement, Luciano Boglione, UMass-Lowell.
4- Noise Models of Solid State Devices”, Marian Pospieszalski, NRAO
5- Low Noise Amplifiers, Luciano Boglione, UMass-Lowell.
6- Miscellaneous Topics, Marian Pospieszalski, NRAO.
Organizers: Luciano Boglione, University of Massachusetts-Lowell,
Engineering Technology; Marian Pospieszalski, NRAO
Sponsors: MTT-14, MTT-23, RFIC
Workshop Abstract: The workshop will address both theoretical and
specific technical concepts encountered in the analysis, measurement
and design of linear noisy circuits. Although the material to be
presented can be found in many published books and papers, it is
usually broadly scattered and not necessarily presented in orderly
sequence. This workshop will focus on tutorial exposition of some key
physical and network theoretic ideas as applied to practical models,
circuits and measurement methods. It is therefore addressed to those
interested in developing a good understanding of noise in microwave
devices and circuits, especially to those practitioners entering the field.
The subjects to be covered are as follows: Physical sources of noise,
Noise analysis of linear networks, Noise measurement, Noise models
of solid-state devices, Low-noise amplifiers, and miscellaneous topics
associated with noise in linear circuits.
TSC — 08:00-17:00
Advances in CAD Techniques for EM Modeling and Design
Optimization
Topics and Speakers:
1- Rapid Design with Electromagnetic Accuracy: Space Mapping
and Beyond, Dr. John W. Bandler, Bandler Corporation; Q.S. Cheng,
S. Koziel, McMaster University and K. Madsen, Technical University
of Denmark
2- Manifold Mapping: A Two-Level Optimization Technique, Dr.
David Echeverria Ciaurri, Stanford University, Energy Resources
Engineering
3- Fast Parametric Models for EM Design Using Neural Networks and
Space Mapping, Prof. Q.J. Zhang, Carleton University, and Prof.
José Rayas-Sánchez, ITESO
4- EM Modeling of Three Dimensional Microwave Circuits and

Systems in LTCC Technology, Prof. Ingo Wolff, IMST GmbH
5- Electromagnetic Simulation for the Design and Modeling
of High-Power Microwave Transistors, Dr. Peter Aaen, Freescale
Semiconductor
6- Macromodeling of High Speed VLSI Interconnects and Packages,
Prof. Michel S. Nakhla, Carleton University
7- Multi-Level Modeling and Co-Simulation for Microwave CAD,
Prof. Wolfgang J.R. Hoefer, University of Victoria, Electrical and
Computer Engineering
8- Speeding Up Design Optimization through Direct Sensitivity
Computation, Dr. Zoltan J. Cendes, Ansoft Corporation
9- Complete Technology for 3D Electromagnetic Simulations, Dr.
Peter Thoma, CST GmbH
10- Application of Perfectly Calibrated Ports in EM Analysis to
Advanced Design Methodologies, Dr. James Rautio, Sonnet
Software
Organizers: Prof. Q.J. Zhang, Carleton University, Canada; Prof. Jose E.
Rayas-Sanchez, ITESO, Mexico
Sponsors: MTT-1, MTT-15
Workshop Abstract: Microwave engineers require CAD techniques
and tools to assist their design. However, conventional CAD
approaches may not work well with EM. For example, iterative
design and optimization using full-wave EM is still too expensive
WMA — 08:00-17:00
Highly Efficient Linear Power Transmitters for Wireless
Applications based on Switching Mode Amplifiers
Topics and Speakers:
1- Recent advances in switching-mode amplifier design, Dr. Renato
Negra, University of Calgary, iRadio Lab
2- Design and linearization techniques for high-efficiency UHF
through X-band class-E power amplifiers, Prof. Zorana Popovic,
University of Colorado, Electrical and Computer Engineering
3- Highest PA efficiency Options for LINC and Polar PA Systems, Dr.
Steve Cripps, Hywave Associates
4- Recent Advances in LINC Amplification Systems, Prof. Fadhel
Ghannouchi, University of Calgary, Electrical and Computer
Engineering
5- Sigma-Delta Modulator based Polar Transmitter, Prof. Bumman
Kim, Postech Electrical Engineering
6- Envelope Elimination and Restoration and Envelope Tracking
Amplifiers, Prof. Peter Asbeck, Univ. of California, San Diego,
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MonDAY WoRKSHoPS
for the majority of practical microwave problems. A new generation
of CAD techniques addressing EM-oriented design is needed. This
workshop describes recent major advances in CAD methodologies
for intelligent multi-level co-simulated EM-based modeling and
design optimization. These methodologies help microwave engineers
to dramatically accelerate their design task without sacrificing
accuracy. The workshop presents a tutorial review of the state-ofthe-art
in CAD techniques for EM-based modeling and design. We
describe neural network modeling and space mapping optimization,
operating concurrently and interactively with full-wave EM tools
for efficient EM modeling and design. We present design methods
based on calibrated ports in EM analysis, model-order reduction,
macromodeling, mixed linear/nonlinear simulation, accelerated direct
EM sensitivities, multilevel EM field/circuit co-simulation, knowledgebased
neural networks, input/output/implicit-space mapping and
manifold mappings. The workshop covers fundamental concepts
and methodologies, industrial applications, and future trends in
CAD R&D. These methodologies will be illustrated using microwave
design examples, considering microstrip circuits, waveguide circuits,
power semiconductor packaging, high-speed VLSI interconnects and
packages, multilayer LTCC circuits, antennas and more. These CAD
techniques efficiently exploit commercially available EM tools, based
on a variety of computational electromagnetic methods, such as the
Method of Moments, the Finite Element method, the Finite-Difference
Time-Domain method, the Transmission Line Matrix method, and the
Multilevel Fast Multipole Method.
Electrical and Computer Engineering
7- Linearization of Polar Transmitter Architectures, Prof. Steve Kenney,
Georgia Institute of Technology, Electrical and Computer Engineering
8- Adaptive Digital Predistortion of Nonlinear Power Amplifiers
Using Signal Dependent Reduced Order Memory Correction, Dr.
Neil Braithwaite, Powerwave Technologies
Organizers: Prof. Bumman Kim, Pohang University of Science and
Technology, Electrical Engineering; Prof. Fadhel Ghannouchi, University
of Calgary, Electrical and Computer Engineering
Sponsors: MTT-5, MTT-17
Workshop Abstract: The wireless and satellite communications
communities have always been looking for efficient linear amplification
systems. Recent advances in device technologies are making the highly
efficient switching mode RF power amplifiers a feasible solution
for such applications. For that, the design of the power amplifiers
has to be considered closely together with the transmitter system
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architecture in order to ensure optimal system level performances.
This implies the use of adequate system architectures that convert
the nonlinear amplification of the switching amplifier to the linear
amplification of the analog baseband information with the help of
the digital predistortion techniques. This full day workshop consists
in two parts. In the first one, the principles and design techniques of
switching mode amplifiers along with practical realizations will be
presented. The second part will be devoted to the highly efficient and
linear transmitters based on the switching mode amplifiers and their
digital linearization.
WMB — 08:00-17:00
Enabling Technologies for Wireless Transceivers Beyond-3G
Topics and Speakers:
1- Beyond 3G needs for power amplifier, Prof. E. Bertran, Catalunia
Polithecnic University, Telecommunication Systems
2- The Impact of Signal Peak to Average Power Ratio on new Wireless
Transmission Chains, Prof. N. B. Carvalho, University of Aveiro,
Institute of Telecomunications
3- Digital Linearization and Signal Shaping for Wideband Wireless
Power Amplifiers, Dr. A. Zhu, Prof. T. Brazil, University College
Dublin, School of Electrical, Electronic and Mechanical
Engineering
4- Digital Techniques in RF Wireless Transmitters, Prof. J. C. Pedro, P.
M. Cabral, University of Aveiro, Institute of Telecommunications; J.
A. Garcia, University of Cantabria
5- Multipath Polyphase Circuits for Cognitive Radio Transmitters,
Prof. E. Klumperink, University of Twente, CTIT, IC Design Group
6- Digital transmitter architecture using BAW filters, Dr. A. Kaiser,
IEMN-ISEN, Lille, France
7- Efficiency enhancement in multi-mode SiGe-HBT PA, Dr. A.
Cidronali, Dr. I. Magrini, R. Fagotti, Prof. G. Manes, University of
Florence, Electronics and Telecommunications
8- MIMO radios for next generation wireless networks, Dr. Y. Palaskas,
Intel, Inc., Communications Circuits Laboratory
9- Flexible analog circuits for SDR transceivers, Dr. V. Giannini, J.
Craninckx IMEC, Belgium; A. Baschirotto, University of Salento, Italy
Organizers: Mr. Vijay K. Nair, Intel Corporation, Communication
Technology Lab; Dr. Alessandro Cidronali, University of Florence,
Electronics and Telecommunications; Prof. Gianfranco Manes,
University of Florence, Electronics and Telecommunications
Sponsors: MTT-20, MTT-23
Workshop Abstract: This workshop focuses on recent research
achievements in the field of wireless transceiver technologies for
MonDAY WoRKSHoPS
Beyond-3G (B3G) systems, which is the integration of a multitude of
wireless technologies in the same platforms. It can be logically divided
in two sections. The first is devoted to the techniques based on the
exploitation of power DSPs tightly integrated with PAs, which allow
the signal integrity by proper base-band signal treatments; the second
deals with the system\circuit design approaches capable to increase the
data rate, the cooperation and the complementary use of the different
available radio access technologies. Several innovative concepts will
be discussed namely, the design of all-digital transmitters, which
don’t involve dedicated frequency selective filters, the all-digital RF
signal generation suitable for B3G systems requirements, the enabling
PA technologies for multi-mode operation and finally, two complete
RFIC solutions for SDR and MIMO systems.
WMC — 08:00-17:00
Challenges in Model-based HPA Design
Topics and Speakers:
1- An overview of transistor/amplifier modeling methods and their
use in design, Dr. Lawrence Dunleavy, Modelithics Inc.
2- Bias voltage and temperature-dependent modeling and its
application to amplifier design, Dr. Yusuke Tajima, Auriga
Measurement Systems, LLC
3- Modeling of GaN HEMT Devices using classic Nonlinear FET
Techniques, Faramarz Kharabi, RF Micro Devices
4- GaN HEMT Device Characterization and Modeling for RF Power
Amplifier Applications, Raymond S. Pengelly, Cree Inc.
5- High-Power Microwave Transistor Modeling for Amplifier Design,
Peter Aaen, Freescale Semiconductor Inc.
6- Addressing Linearity Issues in HPA Design at the Semiconductor
Level, Angel Mediavilla, University of Cantabria
7- Modeling requirements for modern HPA design, Dr. Walter Curtice,
W.R. Curtice Consulting
Organizers: Dr. Lawrence Dunleavy, Modelithics, Inc.; Dr. Yusuke
Tajima, Auriga Measurement Systems, LLC
Sponsor: MTT-5
Workshop Abstract: This workshop will bring microwave amplifier
designers and device modelers together to discuss their experiences
in large signal model applications. We will hear about what works well
now and also where significant challenges remain and where currently
available models are falling short in providing the simulations required
to create a successful design and to meet their needs of the future.

WMD — 08:00-17:00
Millimeter-Wave Power Amplifier Technology: Power,
Linearity and Efficiency
Topics and Speakers:
1- MMIC Devices for Millimeter-Wave Power Amplifiers, Dr. Elias
Reese, TriQuint Semiconductor
2- MHEMT and PHEMT Devices for Millimeter-Wave Power Amplifiers,
Dr. Phillip Smith, BAE Systems
3- Developments in the Application of GaN Power Devices at
Millimeter-Wave, Dr. Miroslav Micovic, Hughes Research Labs
4- Millimeter-Wave Spatial/quasi-optical power-combining techniques,
Dr. Michael DeLisio, Wavestream
5- Overview of Latest High Power Millimeter-Wave Helix-TWTs, Dr.
Chae K. Chong, L-3 ETI
6- New Developments in Millimeter-Wave Power Modules for Digital
Communication, Tom Schoemehl, L-3 EDD
7- Millimeter-Wave Coupled-Cavity TWTs, Jim Legarra, CPI Satcom
Division
8- Millimeter-Wave Extended Interaction Klystrons (EIK), Dr. Brian
Steers, CPI Satcom Division
9- Advances in Millimeter-Wave Power Amplifier Linearization, Dr.
Allen Katz, LTI/TCNJ,ECE
Organizers: Dr. Joe Qiu, Naval Research Laboratory, Vacuum Electronics
Branch; Dr. Allen Katz, Linearizer Technology Inc./The College of New
Jersey
Sponsors: MTT-5, MTT-16, MTT-20
Workshop Abstract: Today’s millimeter-wave (MMW) power
amplifiers operate at higher frequency and wider bandwidth and can
provide greater power levels with increased efficiency and linearity
in a smaller space. Solid state power amplifiers (SSPAs) now offer a
viable alternative to vacuum devices, while vacuum technology (VT)
has also made great strides. More than 1 kW of MMW linear power can
now be produced with high efficiency in a relatively small package.
Power amplification from a few watts to hundreds of watts over
the frequencies range from 26.5 to above 100 GHz will be the focus
of this workshop. Advances in SSPA technology will be presented
including the latest developments in GaAs power MMICs, GaN and
MHEMT devices. VT devices to be covered will include traveling wave
tube amplifiers (TWTAs – helix and coupled cavity), Klystrons, and
hybrid millimeter-wave power modules (MMPMs). Techniques such
as Spatial/quasi-optical power-combining and linearization will also
be included.
MonDAY WoRKSHoPS
WME — 08:00-17:00
CMOS/SiGe-based Systems for mm-Wave Commercial
Applications
Topics and Speakers:
1- 60 GHz WPAN Standardization within IEEE 802.15.3c, Dr. Reed
Fisher, Oki Electric & Chair TG3c
2- 60GHz Channel Modeling, Dr. Peter Smulders, Technical Univ. of
Eidhoven
3- Millimeter-wave CMOS Radio Design for Gigabit Wireless
Applications, Dr. James Gilb, SiBEAM, Director Standards and
Advanced Technology
4- On the Development of a Fully Integrated 60 GHz Digital Radio:
Antenna, CMOS and Signal Processing, Prof. Joy Laskar, Georgia
Tech., Georgia Electronic Design Center
5- 60-GHz low-power gigabit wireless RF-CMOS transceiver, Prof.
Tian-Wei Huang, National Taiwan University, Dept. of EE
6- 24 GHz UWB Radars in Production, Dr. Andy Street, Tyco
Electronics, Wireless Systems Segment
7- 77GHz Automotive Radar Transceivers in SiGe, Dr. Herbert Knapp,
Infineon
8- Si-Based mm-Wave Systems, Prof. Ali Hajimiri, Cal. Tech, Electrical
Engineering
9- 65nm CMOS and SiGe HBT Transceivers and Receivers for
Automotive Radar and mm-Wave Imaging in the 75GHz to 175GHz
Range, Prof. Sorin P. Voinigescu, Univ. of Toronto, ECE Department
10- Silicon-based Phased-Array Transceivers for 6 to 60 GHz
Applications, Prof. Gabriel M. Rebeiz, UC at San Diego, Electrical &
Computer Engineering
Organizers: Dr. Hiroshi Kondoh, Hitachi Ltd., Central Research Lab; Dr.
Debabani Choudhury, Intel
Sponsors: MTT-6, MTT-16, MTT-20
Workshop Abstract: With the recent progress and maturity of
Si processes down to 45nm CMOS scale close to production and
SiGe BiCMOS with fT beyond 200GHz, extended R&D efforts have
been reported in literature with ever-increasing enhancements of
performance, operation frequencies beyond 100GHz and integration
levels towards practical mm-wave applications. This workshop reviews
the latest progress and technical trends as well as regulatory issues
toward practical mm-wave commercial applications at system levels.
The workshop will consist of two parts. Part 1 is dedicated to the
application to 60GHz wireless communications, including discussion
on IEEE802.15.3c and channel modeling. Part 2 covers systems and
subsystems for other applications up to 175GHz including 77GHz/
24GHz automotive radars. The covered technical areas include system
MonDAY
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designs with mm-wave functions, antenna, packaging/assembly, IF/
baseband integration, manufacturability and testing.
WMF — 08:00-12:00
Design and Implementation Techniques for Multiband
Filters
Topics and Speakers:
1- Computation of optimal multi-band filtering characteristics, Dr.
Fabien Seyfert, INRIA
2- Design of Dual-Mode Dual-Band Filters With Reduced Sensitivity,
Prof. Smain Amari, Royal Military College of Canada
3- Analytical synthesis of dual-band filters through frequency
transformation and implementation by means of microstrip Split-
Ring Resonators, Dr. Alejandro Garcia, Lamperez, Universidad
Carlos III de Madrid
4- Multiband Approximation Using Transformed Variables, Dr. Clark
H. Bell, HF Plus
5- N-Band planar filter, Prof. Cedric Quendo, University of Brest, LEST
Laboratory
6- Implementation of dualband filters in base stations for mobile
communications, Dr. Stefano Tamiazzo, Andrew Telecommunication
Products
7- Design of Multiband Filters in Waveguide Technology for Space
Applications, Dr. Stephane Bila, University of Limoges, XLIM
Organizers: Prof. Giuseppe Macchiarella, Politecnico di Milano,
Elettronica e Informazione; Dr. Fabien Seyfert, Institut National de
Recherche en Informatique et Automatique, INRIA
Sponsor: MTT-8
Workshop Abstract: In recent years communication systems capable
to process simultaneously signals belonging to different frequency
bands are more and more requested. In mobile communications
multiband operation is a common requirement for enhancing reliability
and offering more and more services. In space communication the
use of multi-spot antennas and dynamic channel assignment call
for signals having a not contiguous spectrum. Further examples of
multiband signals can be found in WiFi system, where modern devices
must operate both on 2.4 and 5 GHz (802.11a/g). There is then in the
microwave engineers community an increasing interest on specific
design techniques for multiband filters; also the practical issues
associated to the realization of this kind of filters call for answers which
are not easily found today. The proposed workshop tries to fill this lack
of information on multiband filters design from both theoretical and
practical points of view.
MonDAY WoRKSHoPS
WMG — 13:00-17:00
Miniaturization Techniques of RF and Microwave Filters
Topics and Speakers:
1- Miniaturization using adaptive Pre-distortion and Lossy Circuit
Techniques, Dr. Ming Yu, Com Dev Ltd, R&D
2- Artificial Dielectric Resonators for miniaturized filters, Prof. Ikuo
Awai, Ryukoku University
3- LTCC LC RF filters, Dr. Toshio Ishizaki, Panasonic Electronic Devices
Co., Ltd.
4- LTCC Technology For Microwave Filter Applications, Prof. Kawthar
Zaki, University of Maryland, ECE
5- A Systematic Design Methodology for Miniaturized Mutlilayer
Filters, Mr. Lap K. Yeung and Ke-Li Wu, The Chinese University of
Hong Kong, Electronic Engineering
6- Miniaturized RF Bandpass Filter Based on Thin-Film Bulk Acoustic-
Wave Resonator, Dr. Bradley P. Barber and Dr. Frank Bi, Skyworks
Solutions Inc.
Organizers: Prof. Ke-Li Wu, The Chinese University of Hong Kong,
Electronic Engineering; Dr. Ming Yu, Com Dev Ltd, R&D
Sponsors: MTT-8
Workshop Abstract: This workshop will review some of advanced
miniaturization techniques of RF/microwave filters for mobile
terminals, wireless access and satellite payload. Technologies include
LTCC LC and waveguide filters, artificial high K dielectric resonators,
pre-distortion techniques and Bulk Acoustic Wave (BAW) filters. The
basic implementations, design methodologies, and future trend
of various LTCC filters will be addressed. Methods for the design of
band pass filters and multiplexers using LTCC waveguide filters will
be presented. The application of pre-distorted filters for C band Input
Multiplexer that achieves a significant volume and mass saving with
an effective Q of 20,000 will be demonstrated. An overview of BAW
technology and a discussion of how RF applications benefit from BAW
filter solutions will be covered in this workshop. The speakers come
from both industry and academia. The workshop will be based on the
advanced technologies in an educational approach.
WMH — 08:00-17:00
Advances in Reconfigurable Microwave Technologies for
Wireless Communication and Radar Sensing
Topics and Speakers:
1- The Development of RF Spectrum Signal Processing for Cognitive
Radio, Dr. Kyutae Lim, Georgia Tech, School of Electrical and
Computer Engineering

2- Tunable technologies for agile microwave systems, Prof. Spartak
Gevorgian, Chalmers University of Technology, Department of
Microtechnology and Nanoscience MC2
3- Frequency synthesizers and phase shifters for use in satellite
applications, Dr. Ruediger Follmann, IMST GmbH
4- Ferroelectric Thick Film Components for Future Wireless
Communication, Mr. Yuliang Zheng, Darmstadt University of
Technology, Institute of Microwave Engineering
5- Tunable BST-Varactor-Based Matching Networks for Mobile
Radio Applications, Mr. Errikos Lourandakis, University of Erlangen-
Nuremberg, Institute for Electronics Engineering
6- Liquid Crystal Phase Shifters for Electronically Steerable Antenna
Systems, Dr. Stefan Mueller, Darmstadt University of Technology,
Institute of Microwave Engineering
7- Low complexity RF-MEMS switch technology for tunable
microwave components, Dr. Volker Ziegler, EADS Innovation Works,
Sensors, Electronics and System Integration
8- Innovative reconfigurable circuits for advanced communication
systems, Prof. Roberto Sorrentino, University of Perugia,
Department of Electronic and Information Engineering
Organizers: Dr. Stefan Mueller, TU Darmstadt, Institute of Microwave
Engineering; Prof. Robert Weigel, University of Erlangen-Nuremberg,
Institute for Electronics Engineering; Prof. Ingo Wolff, IMST GmbH;
Prof. Rolf Jakoby, TU Darmstadt, Institute of Microwave Engineering
Sponsors: MTT-8, MTT-11, MTT-13, MTT-20, MTT-21
Workshop Abstract: The objective of this workshop is to highlight
current research and development efforts to create reconfigurable
RF-circuits for future wireless systems, in particular for mobile
communication, but also for RFID and radar-sensor systems by
using new design approaches, novel tunable non-linear dielectrics,
semi-conductors, RF-MEMS, and other emerging technologies. This
workshop will address: (1) Tunable components like phase shifters,
filters, Matching-networks Si(Ge), and integrated synthesizer based
on non-linear dielectrics, semi-conductors, or MEM switches (2)
Reconfigurable (adaptive) antennas: phase-scanning antennas with
passive phase shifters, reflector antennas, reflect arrays, and others.
(3) (Hybrid) integration into LTCC-Technology (4) Spectrum sensing
technologies based on analog signal processing (5) System integration
strategies and (6) Reliability issues and radiation hardness.
WMI — 08:00-12:00
High Speed Signal Integrity Workshop with Emphasis on
Jitter
Topics and Speakers:
MonDAY WoRKSHoPS
1- Jitter effects, constraints, and mitigation in multi-gigabit links for
Terascale computing, Mr. Randy Mooney, Intel Corp.,
2- Managing Jitter in High-speed Digital Communications Systems,
Mr. Greg LeCheminant, Agilent Technologies
3- Time Domain Jitter Measurement Distortion, Mr. Larry Jacobs,
LeCroy
4- Modeling Jitter and Crosstalk Due To Backplanes Using Modified
Rational Functions, Dr. Robert Zeng, The MathWorks, Inc.
5- Signal Integrity Panel Session, Dr. Marc Vanden Bossche, NMDG
Engineering
Organizers: Mr. Thomas G. Ruttan, Intel Corp, ATTD; Mr. Mike Resso,
Agilent Technologies, Component Test Division
Sponsors: MTT-11, MTT-12, ARFTG
Workshop Abstract: Signal integrity is a topic that has generated
a significant amount of interest with microwave as well as high
speed digital system designers with the emphasis on faster data
bus performance that is required for the latest computer and
communications systems and products. As the system is analyzed and
separated into the key contributors to degradation of the high speed
data through the bus structure, jitter stands out as a major factor that
drives system performance and design focus. It is important that the
designer understand where jitter comes from, how it impacts the
system performance, how to model jitter and become familiar with
methodologies for measuring jitter. This workshop will focus on these
key areas in a full-day workshop that will end with a panel discussion
on signal integrity topics (jitter and others) of interest to the workshop
attendees.
WMJ — 08:00-12:00
3D Metamaterials: Theory, Structures, Techniques, and
Devices
Topics and Speakers:
1- A 3D Isotrophic Left-Handed Metamaterial Composed of Wired
Metallic Spheres, Dr. Atsushi Sanada, Yamaguchi University
2- 3D Plasmonic Metamaterials in Microwave and Optics, Prof.
Nader Engheta, University of Pennsylvania, Electrical and Systems
Engineering
3- The development of realizable 3D metamaterials from
computational transmission line models (TLM), Prof. J.R. Wolfgang
Hoefer, Faustus Scientific Corporation
4- 3D Metamaterials: Experiments and Analysis Prof. Anthony Grbic,
University of Michigan, Electrical Engineering and Computer Science
5- Design and electromagnetic modeling of 3D planarized composite
right-left-handed metamaterials, Prof. Peter Russer, Technische
Universität München, Electrical Engineering
MonDAY
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Organizers: Prof. Christophe Caloz, Ecole Polytechnique de Montreal,
Electrical Engineering; Prof. Poman So, University of Victoria, Electrical
and Computer Engineering
Sponsor: MTT-15
Workshop Abstract: Recently, metamaterials, which are defined as
electromagnetically continuous structures made of subwavelength
molecules with tailorable permittivity and permeability, have
emerged as a novel paradigm in modern science and technology.
While the first generation of practical metamaterial structures and
applications have been mostly 1D and 2D, the development of bulk 3D
metamaterials with well-controlled constitutive parameters (values
and dispersion) and engineered by efficient processes will be key for
the future of this field. Recently, there has been significant progress in
this direction. It is the purpose of this workshop to report this progress,
including the demonstration of isotropic 3D negative refractive index
metamaterials, the discovery of graded-index metamaterials (based
on transformational electromagnetics) providing invisibility cloaking
but also practical quasi-optical devices, and novel plasmonic metastructures.
WMK — 08:00-17:00
High-speed Electronic Technologies for > 100-G
Communications
Topics and Speakers:
1- Introduction, A. Konczykowska III-V Lab, K. Murata, NTT
2- 100G serial transport - System Considerations and Design
Challenges, J. Sinsky, P. Winzer, Bell Labs-Crawford Hill
3- MMIC and Packaging Technologies for 120-GHz 10-Gbit/s Wireless
Link Systems, T. Kosugi, A. Hirata, NTT
4- Millimeter-wave and high-speed MMIC design, interconnects and
packaging, V. Krozer, DT University
5- Co-modeling (EM-Circuit) design of microwave and optoelectronic
wideband modules, D. Baillargeat, University of Limoges
6- InP HBT Technology for 100 Gbps ICs, M. Sokolich, HRL Laboratories,
LLC
7- InP D-HBT circuits operating up to sub-mmwave frequencies for
next generation data transmission systems, Y. Baeyens, N.
Weimann, V. Houtsma, Bell Labs-Murray Hill
8- Circuit technologies for 100 Gbps wired communications, T. Swahn,
Chalmers University
9- Electronic and Electro-optic Components for 100G Networks
– Design and Packaging Methodologies, J. Sinsky, Bell Labs-
Crawford Hill
10- CMOS and SiGe BiCMOS 40 Gb/s to 100 Gb/s ICs for high speed
serial IOs, M. Meghelli, IBM Watson Research Center
MonDAY WoRKSHoPS
Organizers: Dr. Agnieszka Konczykowska, Alcatel-Thales III-V Lab; Dr.
Koichi Murata, NTT
Sponsors: MTT-2, MTT-9, MTT-11
Workshop Abstract: With the progress of semiconductor technology
and the continuous pressure to increase the efficiency of high speed
transmission, 100GbE as well as E-band or higher wireless systems
start to emerge as a near future applications. Wireless systems with
over 100 GHz carriers as well as first over 100-G fibre systems were
reported. These two applications present new challenges for circuit
designers. This workshop will be devoted to technologies and various
aspects of circuit design for wireless communications at millimeterwave
frequency and over 100-Gb data transmission. Two overview
presentations on wired and wireless systems will show the context of
this research including design challenges, relevant trade-offs and the
present bottle-necks. Different system architectures will be presented
with their impact on component requirements. Similarities and
differences of wired and wireless applications will be pointed out. Design
methodologies, necessary tools and circuit performances obtained in
various technologies (Si, SiGe, GaAs and InP) will be presented and
discussed. Finally, modeling, measurements and packaging problems
at such high frequencies/speeds will be also addressed.
WML — 13:00-17:00
Progress in Microwave Ferrite Materials and
Applications
Topics and Speakers:
1- An Overview: The New Paradigm for Designers of Ferrite Devices
in the USA, Dr. Charles R. Boyd, Jr., Microwave Applications Group.
2- Current State of Ferrite Materials Art, Dr. David Cruickshank,
Trans-Tech, Inc.
3- High Power Circulators and Isolators, Dr. William Alton, The
Ferrite Company, Inc.
4- Novel Processing for New Ferrite Devices, Dr. Chek Pin Yang,
University of Birmingham, Electrical Engineering
5- Magnetic Biasing Techniques for Circulators, Analysis and Design
Considerations, Dr. Thomas Lingel, Anaren, Inc.
6- Design and Application of Very High Performance Quasi-Optical
Circulators and Isolators, Dr. Duncan Robertson, University of St.
Andrews
7- Advanced Lumped Element Nonreciprocal Devices for Portable
Phones (Theory and Applications), Dr. Shigeru Takeda, Magnontech
Organizers: Dr. Charles R. Boyd, Jr., Microwave Applications Group; Dr.
William Alton, The Ferrite Company Inc.; Dr. Thomas Lingel, Anaren, Inc.
Sponsor: IMS08

Workshop Abstract: The most recent MTT-S workshop broadly
defining the current state-of-the-art for microwave ferrite materials
and microwave ferrite devices took place at IMS 2000 in Boston, MA.
Much has changed since then. A significant objective of this proposed
workshop will be to provide an updated working knowledge of current
activities in microwave ferrite materials and devices for use by both
creators and users of these configurations. This proposed half-day
workshop session has the goal of broadly defining the current stateof-the-art
for microwave ferrite materials and microwave ferrite
devices. It is intended to be comprehensive, ranging from essential
background information through recent typical practice up to current
advances in materials and component designs that are expanding the
envelope of technology. Materials topics will include comparison of
material composition types and methods of preparation, as well as
special properties and shapes, such as single-crystals and thin films.
Application topics will focus mainly on those uniquely suited for ferrite
materials, e.g. nonreciprocal and/or high-power microwave circuit uses
at all frequencies and in both conventional and novel configurations.
WMM — 13:00-17:00
Printed RF Electronics, RFID’s and Wireless Sensors:
State and Challenges
Topics and Speakers:
1- Printable RFID-Enabled Wireless Sensors: Is it the Ultimate Low-
cost Solution for Ubiquitous Sensing?, Manos M. Tentzeris, Amin
Rida, Georgia Tech, GEDC/ECE
2- Novel Flexible Magnetic Composites: Development and Effect
of Material Properties on RF Design for RFID and Wearable Wireless
Applications, Lara Martin, Motorola
3- Printable RFID’s and Other Security/Authenticity-enhancement
Devices”, Gerald DeJean, Microsoft Research Labs
4- Ink-Jet Technology for Printed Electronics, Jan Sumerel, FUJIFILM
Dimatix
5- Evaluation Techniques of Common Problems in RFID, Bob Sainati,
3M
6- Inkjet-printed RFID’s and Electronics for Automotive Applications,
Li Yang, Georgia Tech, GEDC/ECE
Organizer: Prof. Manos M. Tentzeris, Georgia Tech, GEDC/ECE
Sponsor: IMS08, MTT-12
Workshop Abstract: This workshop will introduce microwave
society to the fundamental printed electronics technologies for
communications, RFID and sensing applications. In addition, it will
familiarize MTT members with a large variety of applications and will
MonDAY WoRKSHoPS
introduce them to major challenges of the future “convergent” wireless
sensing/cognition/multimedia modules: the integration of printed
power sources and power scavenging devices, the miniaturization
of antennas for harsh environments and the development of inkjetprinted
circuits on flexible organic and paper-based ultra-low cost
materials for HF, UHF and microwave frequencies. This workshop will
review and explore challenges in printed high-frequency electronics
including RFID and wireless sensors for both traditional and emerging
applications. It will also cover ultra-low-cost paper-based electronics,
inkjet-printed circuits and batteries, energy scavenging approaches,
RFID IC approaches and matching, as well as RF performance under
various challenging sensor topologies.
WMN — 08:00-17:00
Applications and Misapplications of Measurement
Uncertainty
Topics and Speakers:
1- A Review of Current Recommended Practices for Evaluating
Uncertainty, Including Revisions of the ISO GUM, Nick Ridler, NPL
2- Use and Misuse of Uncertainties in Statistical Process Control, Ken
Wong, Agilent Technologies
3- Common Mistakes and Pitfalls When Analyzing Microwave
Measurement Uncertainties, Brian Lee, Anritsu.
4- Calibration Uncertainty Estimation for the S-parameter
Measurements at the Wafer Level, Andrej Rumiantsev, SUSS
MicroTec Test Systems GmbH.
5- The Importance of Measurement Verification for Accurate
Uncertainty Analysis of Network Analyzer PCB TRL Calibration
Standards, Heidi Barnes, Verigy.
6- Uncertainty for Digital Modulation Measurement, Brian Lee,
Anritsu
7- Uncertainty and Modulated-signal Measurements, Kate Remley,
National Institute of Standards and Technology (NIST), RF Field
Group
Organizers: Nick. Ridler, National Physical Laboratory (NPL); Daniel
Pasquet, ENSEA; Andrej Rumiantsev, SUSS MicroTec Test Systems GmbH.
Sponsors: MTT-11, ARFTG
Workshop Abstract: Following recent successful workshops during
Microwave Week 2006 (titled, “Practical methods for determining the
accuracy of measurements; a review of techniques both old and new”)
and European Microwave Week 2007 (titled, “Determining accuracy
of measurements at high frequencies – from error to uncertainty”),
this workshop will build on this success by presenting more practical
information on evaluating accuracy (and, more generally, uncertainty)
MonDAY
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of measurements made at RF and microwave frequencies. This
workshop will review the current status of methods that are
recommended for evaluating uncertainty and present an update on
the latest developments in this field. Specific presentations will then
identify areas where common mistakes can occur when applying
uncertainty in different circumstances, i.e. Statistical Process Control
(SPC) and the analysis of microwave measurement data. Finally,
applications of uncertainty to particular measurement environments,
i.e. planar circuit measurements and digital modulation measurement,
will be presented.
TMA — 08:00-12:00
RF Design Components of Magnetic Resonance Imaging
Topics and Speakers:
1- Introduction to MRI Concepts, Eddy Boskamp, GE-Healthcare, USA
2- MRI System Hardware Overview/Transceiver Technology, Ronald
Watkins, Stanford University School of Medicine, Department of
Radiology
3- RF Coil Design for MRI Applications, Eddy Boskamp, GE-
Healthcare
4- High Power MRI RF Amplifiers, Richard Frey, Microsemi PPG
5- High Power PIN Diodes for Switching RF Coils in High Field MR
Scanners, William Doherty, Microsemi-Lowell
6- PIN Diode SPICE Modeling for MRI Applications, Robert Caverly,
Villanova University, ECE
Organizers: Dr. Robert Caverly, Villanova University, Electrical and
Computer Engineering; Mr. William Doherty, Microsemi Corp-Lowell
Division
Sponsor: MTT-17
Workshop Abstract: The tutorial will present material covering the
theory underlying Magnetic Resonance Imaging with presentations
on hardware component design for MRI systems. The workshop will
be geared for RF and microwave engineers wishing to gain insight into
MR technology as a means to move this important medical imaging
technology forward. The tutorial topics range from an introduction of
the basic concepts of magnetic resonance and the imaging process to
discussions of MRI transceiver technology, RF coil design, high power RF
amplifier design and high power, high speed switching in MRI systems.
MonDAY WoRKSHoPS
TMB — 13:00-17:00
Demystifying Microwave Signal Integrity - High Speed
Design & Measurement
Topics and Speakers:
1- Signal Integrity: From Signal Path Analysis to Application
Performance Prediction, Prof. Klaus Helmreich, University of
Erlangen
2- Fundamentals and Emerging Concepts in Signal Integrity Analysis
in High-Speed Designs, Prof. Ramachandra Achar, University of
Charleton
3- Datamining 12 port S-parameters for Backplane Analysis, Dr.
Eric Bogatin, Bogatin Enterprises, LLC and Mr. Mike Resso, Agilent
Technologies
Organizers: Mr. Hermann F. Boss, Rohde & Schwarz, R&D; Dr. K.C.
Wang, UMC, R&D
Sponsors: MTT-2, MTT-9, MTT-11 MTT-16
Workshop Abstract: The tutorial starts with explaining mechanisms
and parameters that are relevant for signal integrity, illustrates their
individual impact, and introduces typical measurement methods
for signal integrity parameters in frequency and time domain. The
following talk presents an overview of high-frequency/high-speed
design issues and interconnect modeling and simulation strategies. It
covers high-speed design issues, models and basic principles of circuit
simulation. Furthermore, emerging concepts in signal integrity area,
such as differential lines, MGTs, FPGAs with low voltages but high
currents, strong transients in designs and pre/de-emphasis techniques
will be discussed. The last part explains the use of 12-port differential
S-parameters to describe the behavior of differential channels in a
high-speed serial interconnect. It shows the most important terms
and valuable information that can be extracted about interconnect
performance from these measurements.

WFA — 08:00-17:00
Unification of Time Domain Methods in Computational
Electromagnetics
Topics and Speakers:
1- Overview of Computational Electromagnetics, Prof. Peter Russer,
Technische Universität Muenchen, Institute for High Frequency
Engineering
2- Unifying Concepts in Computational Electromagnetics, Prof.
Wolfgang Hoefer, University of Victoria, Department of Electrical
and Computer Engineering
3- General Mathematical Derivations of Frequency- and Time-
domain Numerical Methods with Method of Moments, Prof.
Zhizhang Chen, Dalhousie University, Department of Electrical and
Computer Engineering
4- MOM vs. FDTD vs. FIT vs. FEM vs. TLM and Frequency Domain vs.
Time Domain, Dr. Holm Krueger, CST, GmbH
5- Embedded Features in TLM, Prof. Christos Christopoulos, University
of Nottingham, Department of Electrical and Computer Engineering
6- Construction of Optimal Grids for Efficient EM Wave Simulation
Using Finite Methods, Prof. Andreas Cangellaris, University of
Illinois at Urbana-Champaign, Department of Electrical and
Computer Engineering
7- Higher-Order Time-Domain Methods and Applications, Prof. Costas
Sarris, University of Toronto, Department of Electrical and Computer
Engineering
8- Pros and Cons of a Unified Implementation, Mr. Daniel Swanson,
Tyco electronics, Strategic R&D Group
9- Object-Oriented Paradigm for Computational Electromagnetics,
Prof. Poman P.M. So, University of Victoria, Department of Electrical
and Computer Engineering
Organizers: Prof. Poman So, University of Victoria, Department of Electrical
and Computer Engineering; Prof. Christos Christopoulos, University of
Nottingham, George Green Institute of Electromagnetics Research
Sponsors: MTT-1, MTT-15
Workshop Abstract: Recent theoretical studies in computational
electromagnetics have confirmed that the generalized method of
moments can be used to derive most time and frequency domain
modeling methods. Such a fundamental modeling subject is of
fundamental important to the microwave field theory committee as
well as to the software industry. An in-depth review of the method of
moments, which focuses on its capability to unify various modeling
methods, will be presented by leading experts in the method.
Challenges and implementation arising in the realization of a unified
modeling framework will be discussed. Experts in the CEM software
FRIDAY WoRKSHoPS
industry and experienced users in the microwave industry will be
invited to present their visions on the subject.
WFB — 08:00-17:00
System in Package Technologies and Trends
Topics and Speakers:
1- SiP Current and Future Trends/Needs, Mr. Ross Lahlum, Motorola
2- State-of-the-art SiP Fabrication Capabilities and Limitations,
Mr. Stuart Watson, Modular Components National, Inc, Sales and
Marketing
3- A new compact filter design approach using interdigitally-coupled
line resonators with EM simulations, Mr. Hee-Soo Lee, Agilent
4- LTCC-Based SiPs and FEMs for ultra-small size Wireless Solutions,
Mr. Neal Mellen, TDK
5- Wireless Packaging Technologies for Converged Mobile Platforms,
Mr. Marc Mangrum, Freescale
6- GaAs Integrated Passive Devices for Size Reduction in SiP modules,
Mr. Kevin Gallagher, Triquint
7- Multilayer RF MEMS Phased Array Antenna Integrated Within
a Liquid Crystal Polymer (LCP) SiP, Dr. Nickolas Kingsley, Auriga
Measurement Systems, Modeling and Design
8- RF SiP Technology and Capability Overview, Mr. Mike Gaynor,
Antenova research
Organizers: Mr. Michael P. Gaynor, Antneova, research; Dr. Nickolas
Kingsley, Auriga Measurement Systems, Modeling and Design; Prof.
John Papapolymerou, Georgia Tech, School of ECE
Sponsors: MTT-16, MTT-20
Workshop Abstract: This workshop will cover in detail the three
most commonly used System in Package approaches: Laminate, LTCC,
and Silicon Integrated Passives Devices. The opening presentations
will cover the current needs, limitations, and future trends for
SiP technologies. Industry experts will discuss the latest wireless
advancements made possible using SiP approaches. Future capabilities,
such as ink-jet passives and actives for RFID and 3-D integration, will
also be presented.
WFC — 08:00-17:00
Progress in Local and Global Positioning in Europe
Topics and Speakers:
1- Wireless Local Positioning Based on Modulated Reflection, Prof.
Martin Vossiek, University of Clausthal, Germany
2- Multi-sensor Data Fusion in Local Positioning, Prof. Andreas Stelzer,
University of Linz, Austria
MonDAY
FRIDAY
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88
3- Advances in Precise Vehicle Positioning, Dr. Peter Gulden, Symeo,
Munich, Germany
4- Highly Integrated A-GPS/Galileo Chipset for Consumer Applications,
Anna Miskiewicz, Infineon Technologies, Neubiberg, Germany
5- Reconfigurable Systems for Mobile Local Communication and
Positioning, Thomas Ussmueller, University of Erlangen-
Nuremberg, Germany
6- Time Series Modeling of Multipath Propagation for Pedestrian
GNSS Applications, Dr. Andreas Lehner, German Aerospace Center,
Institute of Communications and Navigation, Oberpfaffenhofen,
Germany
7- Positioning of Low-cost IEEE 802.15.4 (ZigBee) Devices by Means
of Phase Difference Measurements, Stefan Schwarzer, Siemens
Corporate Research, Munich, Germany
8- Implementing Heading Detection for an Optical Positioning
System, Oliver Maye, IHP Microelectronics, Frankfurt/Oder,
Germany
9- Localization with Impulse UWB Radio, Gunter Fischer, IHP
Microelectronics, Frankfurt/Oder, Germany
Organizers: Prof. Robert Weigel, University of Erlangen-Nuremberg,
Institute for Electronics Engineering, Germany; Prof. Andreas Stelzer,
University of Linz, Institute for Communications & Information
Engineering, Austria; Prof. Martin Vossiek, University of Clausthal,
Germany
Sponsors: MTT-2, MTT-8, MTT-12, MTT-13, MTT-16
Workshop Abstract: This workshop deals with various solutions
for localization and positioning. It will focus on the advancements
achieved by current research work in European projects. Both local and
global positioning systems will be addressed. Great efforts are made
in Europe in the field of local positioning. Newest ultra-wideband
positioning technologies will be shown in this workshop. Furthermore
results concerning the enhancement of positioning accuracy through
additional motion sensors will be presented. Advancements achieved
for the European satellite navigation system GALILEO will be addressed.
A system analysis of a fully integrated multi-standard GPS/GALILEO
chipset will be given.
WFD — 08:00-17:00
Computational Multi-Physics Techniques for the Analysis
& Design of Electromagnetic Micro/Nano-Devices
Topics and Speakers:
1- The Role of Model-order Reduction in Electro-thermal Analysis
of Integrated Electronics for Multi-scale Modeling of MEMS &
NEMS, Prof. Andreas Cangellaris, University of Illinois, Urbana-
FRIDAY WoRKSHoPS
Champaign, Department of Electrical and Computer Engineering
2- Detailed Analysis of Electro-thermal Effects in Nanoscale
MOSFETs, Prof. Umberto Ravaioli, University of Illinois, Urbana-
Champaign, Department of Electrical and Computer Engineering
3- Electromagnetic Modeling of Carbon Nanotubes, Prof. Peter
Russer, Munich University of Technology, Institute of High-
Frequency Engineering
4- Electromagnetic Probing of Nanostructures, Prof. Paolo Lugli,
Munich University of Technology, Institute of Nano-Electronics
5- Multi-physics Simulation Using Compact Models: EM, Circuit,
Thermal, Molecular Electronics, Prof. Michael Steer, North Carolina
State University, Electrical and Computer Engineering
6- A New Full-wave Transmission-Line-Matrix/Finite-Difference
Scheme for the Combined Maxwell-Schrödinger Problem in the
Electronic/Electromagnetic Characterization of Nanodevices, Dr.
Luca Pierantoni, Università Politecnica delle Marche, Dipartimento
di Elettromagnetismo e Bioingegneria.
7- Analysis of Carbon Nanoribbons Devices by Joint Use of
Electromagnetic Solvers and Multi-channel Transport Models,
Dr. Davide Mencarelli, Università Politecnica delle Marche,
Dipartimento di Elettromagnetismo e Bioingegneria
8- Methodologies for the Modeling of MEMS and NEMS, Prof.
Marco Farina, Università Politecnica delle Marche, Dipartimento di
Elettromagnetismo e Bioingegneria,
Organizers: Dr. Luca Pierantoni, University of Politecnica delle Marche,
Dipartimento di Elettromagnetismo e Bioingegneria; Prof. Andreas
Cangellaris, University of Illinois at Urbana-Champaign, Department
of Electrical and Computer Engineering
Sponsor: MTT-15
Workshop Abstract: The continuing scaling of semiconductor
devices down to the nanometer region, combined with advances in
the understanding of the physics of nanostructures, points to unique
opportunities for the “three-dimensional” integration of sensing,
computing and communication functions. However, the complexity
of such micro/nano systems can not be handled by today’s computeraided
design tools. Furthermore, their exploration cannot rely solely on
experiment-based trial and error. What is needed is the advancement
of a multi-physics, computational framework, capable of covering the
various energy domains governing the desired operation of the device
with the rigor and accuracy needed for reliable predictive analysis. In
addition to describing correctly the non-linear coupling between the
different physical domains, the computational framework must be
able to support the multi-scale nature of the coupled domains, from
atomistic models at the nanoscale to the microscale. Furthermore,
the development of methods for the physically-consistent and

computationally-efficient interfacing of models at different scales is
critical for the advancement of a versatile computational framework.
This workshop reviews recent research activities on modeling
methodologies and numerical techniques aimed at tackling the
aforementioned challenges. The common theoretical platform of
the presentations in this workshop is provided by the mathematical
description of the self-consistent coupling of Maxwell’s equations
with the mathematical models that govern the additional physics
that impacts the operation of these devices, e.g. quantum transport/
diffusion, thermal effects, mechanical strain, charge scattering. The
resulting advanced models and numerical tools are necessary for
the design exploration of new devices that exploit the opportunities
provided by new emerging materials and multi-functional integration
at the nanoscale.
TFA — 08:00-12:00
Spectrum Policy for the Microwave Engineer: Getting
Technology from the Lab to the Marketplace
Topics and Speakers:
1- Legal Issues in Spectrum Policy, Ms. Anne Linton, Patton Boggs LLP
2- Technical Issues in Spectrum Policy, Dr. Michael J. Marcus, Marcus
Spectrum Solutions LLC
Organizers: Dr. Michael J. Marcus, Marcus Spectrum Solutions LLC;
Ms. Anne E. Linton, Patton Boggs LLP
Sponsors: MTT-16, MTT-18
Workshop Abstract: Spectrum policy and regulatory issues are just
as real for the designer of innovative wireless systems as Maxwell’s
Equations, although they sometimes can be changed given early
recognition of problems and adequate lead time. This course will be
taught by an engineer and a lawyer who both have long experience
in spectrum policy issues. The course will show how to see if a new
wireless technology raises significant issues under current regulations
or not, estimating the complexity of possible regulatory issues that
might impact practical use of the technology, and evaluating options
for addressing policy issues in parallel with development. It will also
address the importance of designing compliance into new technology
just as one would design reliability into a product and not waiting
until the eve of production. Finally, it will review the final step of how
to get a new wireless system that complies with regulations approved
for sale in various markets.
FRIDAY WoRKSHoPS
FRIDAY
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CoMMERCIAl EXHIbIT
The MTT-S Exhibition has been held annually since 1970 and is comprised of more than 400 microwave, subassembly, component, device,
material, instrument, and design software suppliers, and draws approximately 10,000 engineers involved in the design of microwave systems,
subsystems, components, and devices. The 2008 Exhibition will occupy Halls A1 and A2 of the Georgia World Congress Center, and will be open
from 09:00 to 17:00 on Tuesday and Wednesday, and from 09:00 to 15:00 on Thursday. Our apologies, but children under the age of 14 will not
be admitted to the Exhibition Hall at any time.
3G Metalworx Inc.
A-Alpha Waveguide Co.
Acceleware Corp.
Accumet Engineering Corp.
Actipass Co. Ltd.
Advanced Control Components Inc.
Advanced Switch Technology
Aeroflex Inc.
Aethercomm Inc.
Agilent Technologies
AKON Inc.
Allrizon-TG Communications Equipment
Altair Technologies Inc.
AMCAD Engineering
American Microwave Corp.
American Standard Circuits Inc.
American Technical Ceramics
Ametek HCC Industries
AML Communications Inc.
Amplifier Solutions
AmpliTech Inc.
Analog Devices Inc.
AnaPico AG
Anaren Inc.
Anatech Electronics Inc.
Anoison Electronics
Anritsu Co.
Ansoft Corp.
Antenna Research Associates-ARA
Antenna Systems & Technology Mag.
Apollo Microwaves Ltd.
Applied Radar Inc.
Applied Thin-Film Products
Applied Wave Research Inc.
AR Amplifier Research
ARC Technologies Inc.
Arlon Technology Enabling Innovation
Artech House
ASB Inc.
Assemblies Inc.
Astrolab Inc.
Avago Technologies
Avnet Electronics Marketing
AWT Co. Ltd.
B&Z Technologies
Barry Industries Inc.
Beckelec Inc.
Berlin Microwave Technologies AG
Besser Associates Inc.
Bliley Technologies Inc.
Bonding Source
Boonton Electronics
Brush Ceramic Products
C-Tech Co. Ltd.
California Eastern Labs
Cambridge University Press
CAP Wireless Inc.
Carleton University
Cascade Microtech
Centellax Inc.
Century Seals Inc.
Ceramic Products Group
Cernex Inc.
Channel Microwave Corp.
Charter Engineering Inc.
Chengdu AINFO Inc.
Ciao Wireless Inc.
ClearComm Technologies Inc.
Cobham DES
Coilcraft Inc.
Coining Inc.
Coleman Microwave Co.
Colorado Microcircuits
COM DEV/CodeOne
Commercial Microwave Technology
Communications & Power Industries
Compex Corp.
Component Distributors Inc.
COMSOL Inc.
Comtech PST
Connectronics Inc.
CoorsTek
Corning Gilbert Inc.
Corry Micronics
Crane Aerospace & Electronics
CRC Press-Taylor & Francis Grp LLC
Cree Inc.
Cristek Interconnects Inc.
CST of America Inc.
CTT Inc.
Cuming Microwave Corp.
Custom Cable Assemblies Inc.
Custom Interconnects
Custom Microwave Components Inc.
Daa Sheen Technology Co. Ltd.
dBm
Delta Electronics Mfg Corp.
DeWeyl Tool Company Inc.
Diablo Industries Thin Film
Diamond Antenna
Dielectric Laboratories Inc.
DiTom Microwave Inc.
Dorado International Corp.
Dow Key Microwave
Ducommun Technologies Inc.
DuPont
Dyconex AG
Dynawave Inc.
e2v
EADS North America Defense
Eagle Comtronics
Eclipse Microwave Inc.
EE-Evaluation Engineering
Egide
Elcom Technologies Inc.
Electro Rent Corp.
Electromagnetic Technologies Ind.
ElectromagneticWorks Inc.
EM Research Inc.
EM Software & Systems (USA) (FEKO)
EMAG Technologies Inc.
EMC Technology Inc.
EMCO Elektronik GmbH
Emcore (formerly Ortel)
Emerson & Cuming
Emerson & Cuming Microwave Products
Emerson Network Power Connectivity
Empower RF Systems
Endwave Corp.
ETS-Lindgren
Eudyna Devices Inc.
European Microwave Week
Excelics Semiconductor Inc.
EZ Form Cable Corp.
F&K Delvotec Inc.
Farran Technology Ltd.
FCT Electronics LP
The Ferrite Company Inc.
Filtel Microwave Inc.
Filtran Microcircuits Inc.
Filtronic Compound Semiconductors
Filtronic Sage Laboratories Inc.
Firan Technology Group
Flann Microwave Ltd.
Flexco Microwave Inc.
Florida RF Labs Inc.
Focus Microwaves Inc.
Fotofab
Freescale Semiconductor
FujiFilm Dimatix Inc.
General Dynamics Satcom Technology
Gerotron Communication GmbH
GGB Industries Inc.
Giga-tronics Inc.
GigaLane Co. Ltd.
Global Communication Semiconductors
Good Will Instrument Co. Ltd.
WL Gore & Associates Inc.
Gowanda Electronics
Gryphics Prod Grp/Cascade Microtech
GT Microwave Inc.
Hantechnic Inc.
Harbour Industries
Helic SA
Herley Industries Inc.
Herotek Inc.
Hesse & Knipps Inc.
High Frequency Electronics
Hittite Microwave Corp.
Holzworth Instrumentation
HTMicrowave Co. Ltd.
HUBER+SUHNER Inc.
IEEE Communications Magazine
IEEE Microwave Magazine
IHP GmbH
IKE Micro
IMST GmbH
Infineon Technologies
Innertron Inc.
Instruments For Industry (IFI)
Integra Technologies Inc.
International Manufacturing Svcs.
Ion Beam Milling Inc.
Isotec Corp.
ITF Co. Ltd.
ITT Corp. - Microwave Systems
IW Inc.
J MicroTechnology Inc.
Jacket Micro Devices Inc.
Jazz Semiconductor
Jersey Microwave
JFW Industries Inc.
Johanson Manufacturing Corp.
Johanson Technology Inc.
Jointcom Communication Technology
JQL Electronics Inc.
JyeBao Co. Ltd.
K&L Microwave Inc.
Kabem Wireless Silicon Inc.
Keithley Instruments Inc.
Kemac Technology Inc.
KMIC Technology Inc.
KOR Electronics
Krytar Inc.
Kyocera America Inc.
L-3 Communications - Narda
Labtech Ltd.
LadyBug Technologies
Lake Shore Cryotronics Inc.
Lambda Americas
Lark Engineering Co./Baier & Baier
Laser Process Mfg. Inc.
Laser Services Inc.
Linear Photonics
Linearizer Technology
Litron Inc.
LNX Corp.
Locus Microwave
Logus Microwave Corp.
Lorch Microwave

LPKF Laser & Electronics
M2 Global Technology Ltd.
Maury Microwave Corp.
Maxtek Components Corp.
McGraw-Hill
MECA Electronics Inc.
Mega Circuit Inc.
MegaPhase
Meggitt Safety Systems Inc.
Merix Corp.
Merrimac Industries Inc.
MESL Microwave Ltd.
Metropole Products Inc.
MICA Microwave
Mician GmbH
Micreo Limited
Micro Lambda Wireless Inc.
Micro-Coax Inc.
Micro-Mode Products Inc.
MicroFab Inc.
Microlab/FXR
Micronetics Inc.
Microphase Corp.
Microsemi Corp.
Microsorb Technologies Inc.
Microtech Inc.
Microwave Applications Group
Microwave Communications Labs Inc.
Microwave Concepts Inc.
Microwave Development Labs Inc.
Microwave Dynamics
Microwave Engineering Corp.
Microwave Engineering Europe
Microwave Filter Co. Inc.
Microwave Innovation Group
Microwave Journal
Microwave Product Digest
Microwave Technology Inc.
Microwaves & RF
Military & Aerospace Electronics
Millitech Inc.
Mimix Broadband Inc.
Mini-Circuits
Mini-Systems Inc.
Mission Technology Co. (MTC)
MITEQ Inc.
Mitsubishi Electric & Electronics
Modelithics Inc.
Modular Components National Inc.
Molex RF/Microwave Div.
Momentive Performance Materials
MPDevice Co. Ltd.
MtronPTI
Murata Electronics-SILVER SPONSOR
NaF Technology Corp.
Nanjing Jiexi Technologies Co. Ltd.
Nanjing LOPU Co. Ltd.
Natel Engineering Co. Inc.
National Instruments
NDK-GOLD SPONSOR
Netcom Inc.
CoMMERCIAl EXHIbIT
Networks International Corp. (NIC)
New Continents Technology
Nitronex Corp.
Noise Com
NoiseWave
Northeast Electronics Corp.
Northrop Grumman-Velocium
NSI
NTK Technologies Inc.
Nuhertz Technologies LLC
NXP Semiconductors
Octagon Communications
OPHIR RF Inc.
Orient Microwave Corp.
P/M Industries Inc.
P1dB
Paratek Microwave Inc.
Park Electrochemical/Neltec
Partron Co. Ltd.
Pascall Electronics Ltd.
Passive Microwave Technology
Penn Engineering Components
Peregrine Semiconductor Corp.
Phase Matrix Inc.
The Phoenix Company of Chicago
Piconics Inc.
Picosecond Pulse Labs
Planar Electronics Technology
Planar Monolithics Industries Inc.
Plextek Ltd.
Pole/Zero Corp.
Polyfet RF Devices
Polyflon, a Crane Co. company
Precision Connector Inc.
Precision Photo-Fab Inc.
Presidio Components Inc.
Prewell Corp.
Pulsar Microwave Corp.
Q Microwave Inc.
Q3 Laboratory
Quantum Leap Packaging Inc.
QUEST Microwave Inc.
Questech Services Corp.
QuinStar Technology Inc.
R&D Microwaves LLC
R&K Company Ltd.
R-Theta Thermal Solutions Inc.
Radant MEMS Inc.
Radiall-AEP
Reactel Inc.
Reinhardt Microtech AG
RelComm Technologies Inc.
Remtec Inc.
Renaissance Electronics Corp.
Resin Systems Corp.
RF Depot.Com Inc.
RF Design Magazine
RF Globalnet
RF Industries’ RF Connectors Div.
RF Morecom
RFHIC Corp.
RFMD
RFMD-GOLD SPONSOR
RFMW Ltd.
RH Laboratories Inc.
Richardson Electronics
RJR Polymers Inc.
RLC Electronics Inc.
Rogers Corp.
Rohde & Schwarz Inc.
Rohm and Haas Electronic Materials
Rosenberger North America LLC
Roswin Inc.
Roth & Rau AG
RTx Technology Co. Ltd.
Samsung Electro-Mechanics Corporation
Samtec Inc.
Sangshin Elecom Co. Ltd.
Santron Inc.
Sawcom Tech Inc.
Sawnics Inc.
Schleifring und Apparatebau GmbH
Schmid & Partner Engineering AG
Scientific Microwave Corp.
Semi Dice Inc.
SET Tech Co. Ltd.
Shadow Technologies Inc.
Shenzhen Kingsignal Cable Tech Co.
Shenzhen Shennan Circuits Co. Ltd.
Shenzhen Sinte Technology Co. Ltd.
Shoulder Electronics Co. Ltd.
Sigma Systems Corp.
Signatone (Lucas/Signatone)
Silicon Cert Ltd.
Simulation Technology & Applied Res
Sinclair Manufacturing Co.
Skyworks Solutions Inc.
Sonnet Software Inc.
Soshin Electric Co. Ltd.
Sources East Inc.
Southwest Microwave Inc.
Spectrum Control
Spectrum Elektrotechnik GmbH
Spectrum Microwave Inc.
Spectrum Power Management Systems
Spectrum Sensors & Controls
Sprague-Goodman Electronics Inc.
SRI Hermetics Inc.
SSI Cable Corp.
State of the Art Inc.
Stealth Microwave
Stellar Industries Corp.
Storm Products Co.
StratEdge Corp.
Summitek Instruments Inc.
SUSS Microtec Inc.
SV Microwave Inc.
CW Swift & Associates Inc.
Synergy Microwave Corp.-SILVER SPONSOR
T-Tech Inc.
Taconic
Talley Communications Corp.
Tecdia Inc.
Technical Research & Manufacturing
Technical Services Laboratory Inc.
Tegam Inc.
Tektronix Inc.
Teledyne Technologies
Telegartner Inc.
TeleMobile Electronics
Tensolite
Terabeam/HXI
TeraVicta Technologies Inc.
Test & Measurement World
Test Equipment Solutions Today
Thales Components Corp.
Times Microwave Systems
Toshiba America Electronic Comp.
TRAK Microwave Corp.
Trans-Tech Inc.
Transcom Inc.
Trilithic Inc.
TriQuint Semiconductor
Tronser Inc.
TRS-RenTelco
TRU Corporation Inc.
TT Electronics
TTE Europe
TTE Inc.
AJ Tuck Co.
Tyco Electronics: Aerosp & Def Prod
Tyco Electronics: CC&CE Products
Tyco Electronics: GIC Products
Tyco Electronics: M/A-COM Products
UltraSource Inc.
United Monolithic Semiconductors
Universal Microwave Corp.
UTE Microwave Inc.
Valpey Fisher Corp.
Vector Fields Inc.
Vectron International
Verspecht-Teyssier Corp.
VIDA Products Inc.
Virginia Diodes Inc.
Vishay Intertechnology Inc.
Voltronics Corp.
VTI Microwave
Vubiq Inc.
Weinschel Associates
Wenzel Associates Inc.
Werlatone Inc.
West Bond Inc.
Wiley
WIN Semiconductor Corp.
WIPL-D d.o.o.
Wireless Design & Development
Yantel Corp.
Yixin Microwave Electronics Co. Ltd
Z-Communications Inc.
Zeland Software Inc.
ZIFOR Enterprise Co. Ltd.
9

9
Gold Sponsors:
Ansoft Corp.
RFMD
CST of America Inc.
Agilent Technologies
NDK
EXHIbIT GolD and SIlVER SPonSoRS
The Microwave Applications Seminars (MicroApps),
inaugurated in 1996, serves as a forum for IMS
Exhibitors to present the technology behind their
commercial products and their special capabilities. This
year, MicroApps is being hosted by Agilent Technologies
and will feature a variety of measurement specific
presentations by Agilent’s measurement experts as
well a variety of other presentations from companies
MICRoAPPS
Silver Sponsors:
Mimix Broadband Inc.
Murata Electronics
Tyco Electronics: M/A-COM Products
Keithley Instruments Inc.
Synergy Microwave Corp.
Anritsu Co.
exhibiting at IMS. Everyone who attends MicroApps will
receive a free CD-ROM that includes informative details
from every presentation. This year’s MicroApps will be
located in the Exhibition Hall near Aisle 200. For more
information on the Agilent presentations please visit
www.agilent.com/find/IMS2008 where you can see
how Agilent is Helping You Pioneer a Connected World.

09:20
09:40
10:00
10:40
11:20
11:40
12:00
12:20
12:40
13:00
13:20
13:40
TUESDAY
17 June 2008
Title: Advanced Measurement Techniques of
Characterizing Signal Transition Behaviors of Phas-
Locked-Loop
Author: Akihiko Oginuma, Agilent Techologies
Title: Achieve Greater Wireless Mobile Device Runtime
and Accelerate Design Validation by Automating
Battery Drain Characterization Under Simulated Real
Network Use
Author: Dave Allen, Agilent Technologies
Title: Advances in EM Modeling for Circuit Designers
Authors: Erwin Debaetselier and Mounir Adada,
Agilent Technologies
Title: Isolation Enhancement Using Noise Cancellation
Techniques
Author: Sam Mendolia, Edward Gebara, and Jon
Mitchell, Quellan, Inc.
Title: Design of a Digital Broadcast TV Module for
Mobile Phone
Author: Akira Kato, Yasushi Okumura, Mitsuhiro
Hoshii, and Toshio Hata, Murata Manufacturing
Company, Limited.
Title: Design and Usage of Ultra-small, High Power
Density, SMT Package GaAs MMICs for 2 & 4-Watt
Ku/Ka Band V-sat
Author: Kohei Fujii and Henrik Morkner, Avago
Technologies, Inc
Title: Leadless Ceramic SMT Substrates and Packages
From DC to 30GHz
Author: Nahum Rapoport, President, Remtec Inc.
Title: A Bias Circuit for High Efficient Mosfet Designed
into GaAs Chip
Author: Dr. Yuepeng Yan, Yantel Corporation
Title: GaAs pHEMT MMIC Constant Phase Digital
Attenuators
Authors: Diana Zha and Christopher Weigand, M/A-COM
Title: Simulation and Design of Software Defined
Radios (SDR)
Author: Frank Ditore, Agilent Technologies
Title: Peak Power Measurement Techniques for WiMAX
Author: Richard Theiss, Boonton Electronics
WEDnESDAY
18 June 2008
Title: Practical Verification and Design for Yield
Anlaysis of a Full Transceiver
Author: Andy Howard, Agilent Technologies
Title: Wideband Measurements—Tools, Techniques
& Accuracy
Author: Kay Gheen, Agilent Technologies
Title: Front-to-Back MMIC Design Flow with ADS 2008
Author: Jack Sifri, Agilent Technologies
Title: Testing High Speed Wireless Systems Using AWGN
Author: Bob Muro, Noisecom
Title: State of the Art Cross-Correlation Noise
Measurement System
Author: Guillaume De Giovanni, Phase Noise Products,
Aeroflex, Inc.
Title: EMPIRE XCcel 5.2- 3D FDTD Field Simulation
with 1 GCells/s
Author: A. Lauer, W.Simon, and A. Wien, IMST GmbH
Title: Agilent and Auriga
Authors: David Menzer, Auriga Measurement Systems,
LLC and Loren Betts, Agilent Technologies, Inc.
Title: Kingsignal
Author: Kristen Wang
Title: GaN MCM and Hybrid for 3G and 4G Applications
Author: Dr. Samuel CHO, RFHIC Corporation
Title: Advances in Millimeter Wave Measurements
Author: Suren Singh, Agilent Technologie
14:00 Title: Nonlinear Vector Network Analyzer (NVNA)
14:20
15:20
15:40
16:00
16:20
16:40
Title: Breakthrough in Noise Figure Measurement
Technique Greatly Reduces Systematic Error While
Simplifying Measurement Setup
Author: Dave Ballo
Title: WiMAXTM Wave 2 Testing – MIMO & STC
Author: Ben Zarlingo, Agilent Technologies
Title: Analysis of Baseband IQ Signals
Authors: Hiromi Matsuoka and Ben Zarlingo, Agilent
Technologies
Title: Design of a Highly Integrated Multi Chip FEM for
WiMAX Application
Author: Conrad Mmasi, Sr., Jacket Micro Devices
Measures New Nonlinear X-Parameters
Authors: Loren Betts and How Siang Yap, Agilent
Technologies
Title: A New Test System for Military Radios
Author: John Swanstrom, Agilent Technologies
Title: Application and Design Principles for Circulators
and Isolators
Authors: Anthony Edridge and Mr. Rene Quintanilla,
M2 Global Technology Ltd.
Title: Accurate Phase Noise Measurements made Cost
Effective
Author: Jason Breitbarth, Holzworth Instrumentation
THURSDAY
19 June 2008
Title: SiGe BiCMOS Technologies in RF and mmWave
Applications
Author: David Cheskis, Jazz Semiconductor
Title: High Dynamic Range Hybrid Integrated Fiber
Transmitters
Authors: John A. MacDonald and Allen Katz, Linear
Photonics, LLC
Title: Implementing the Split Cylinder Resonator
Method for Measuring Complex Permittivity of Low
Loss Materials
Author: Shelley Begley, Agilent Technologies
Title: Optimization of Vector Waveforms
Author: John Hansen, Agilent Technologies
Title: Ribbon Bonding for High Frequency Applications
Author: Joseph S. Bubel, Hesse & Knipps, Inc.
Title: 802.11n Front-end Modules (Both Single and
Dual Band) for MIMO applications
Author: Rabia Fathima, Jacket Micro Devices
Title: Millimeter Wave Development System using 60
GHz ICs with Integrated Antennas
Author: Michael Pettus, Vubiq, Inc.
Title: Thermal Pyrolytic Graphite Packaging Solutions
for Advanced Thermal Management
Author: Xiang Liu, Matthijs Suijlen, and Robert
Marchiando; Momentive Performance Materials, Inc.
Title: Partron
Author: Jason Park, Partron Co. Ltd.
Title: Fast and Accurate CAD Solutions for Passive
Waveguide Components with the µWave Wizard
Author: Thomas Sieverding, Mician
Title: Microstrip-Launched Filters
Author: Craig Higginson and Sunita Shah, Q
Microwave Inc.
Title: New Continents Technology Corp.
Author: J. Zhu and C. Xie, New Continents Technology Corp.
Title: Vida Products
Authors: Ron Parrott, Al Sweet and John Dunseth,
VIDA Products
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Sunday, 15 June 2008
RFIC Reception — 19:00-21:00
Georgia World Congress Center, Room A412ab
Immediately following the RFIC Plenary Session is the RFIC Reception
to be held in adjacent room 412ab at the Georgia World Congress
Center. This social event is a key component of the RFIC Symposium,
providing an opportunity to connect with old friends, make new
acquaintances, and catch up on the wireless industry. Admittance is
included with RFIC Symposium registration. Additional tickets can
also be purchased separately at registration.
Monday, 16 June 2008
IMS 2008 Reception — 18:00-20:00
Omni Hotel, Grand Ballroom
All Microwave Week attendees and exhibitors are invited to attend
a reception hosted by IMS 2008 in the Grand Ballroom of the Omni
Hotel.
Tuesday, 17 June 2008
Women in Microwaves Reception — 18:00-20:00
Omni Hotel, International Ballroom A
Student Reception — 19:00-21:00
Omni Hotel, International Ballroom D
Joe Taylor Rump Session Reception — 18:30-20:00
Georgia World Congress Center, A412ab
A reception will be held for all attendees of the Joe Taylor Rump
Session prior to the presentation.
Ham Radio Social — 20:00-22:00
Georgia World Congress Center, A402/403
Radio amateurs attending the IEEE MTT-S International Microwave
Symposium (IMS 2008) in Atlanta are invited to the Ham Radio Social.
It follows the talk by Joe Taylor K1JT on “The Discovery of Gravity Waves
Amidst the Noise,” which leads into the WSJT software for weak-signal
amateur communication. The organizers are Fritz Raab W1FR and Al
Katz K2UYH.
SoCIAl EVEnTS
Wednesday, 18 June 2008
Industry Hosted Cocktail Reception — 18:00-20:00
Omni Hotel, International Ballroom
Symposium Exhibitors will host a cocktail reception. Complimentary
beverage tickets will be included in the registration packages.
MTT-S Awards Banquet — 19:30-22:00
Omni Hotel, Grand Ballroom
The MTT-S Awards Banquet includes a fine dinner, awards presentation,
and entertainment. Major society awards will be presented. Tickets
can be purchased at the time of registration.
Thursday, 19 June 2008
MTT-S Student Awards Luncheon — 12:00-14:00
Omni Hotel, International Ballroom F
All students are invited to attend the luncheon, which recognizes
recipients of the IMS 2008 Student Paper Awards, MTT-S Graduate
Fellowships, MTT-S Undergraduate Scholarships, the Student High-
Efficiency Power Amplifier Competition Prize, and the Student Low
Power Consumption FM Radio Receiver Design Competition.
MTT-S Graduates of the Last Decade (GOLD) Reception
— 17:30-19:00
STATS Food Play Sports Bar
The IEEE MTT GOLD Committee invites all MTT GOLD members to a
reception at the STATS Food Play Sports Bar which is conveniently
located in downtown Atlanta across from the Georgia World Congress
Center. This will be an excellent opportunity not only to relax and
entertain, but also to interact and network with other GOLD members.
If you require more information regarding GOLD or the reception,
please feel free to stop by the GOLD Pavillion located in Hall A3 of the
exhibition hall.

HoSPITAlITY SUITE and RECREATIonAl ACTIVITIES
Hospitality Suite:
Omni Hotel - Pecan Room (Level M3)
We are pleased to offer a hospitality suite in the Omni Hotel for the
families of our technical attendees to relax and enjoy in between
experiencing everything that Atlanta, Georgia has to offer. The suite
will be open Sunday, 15 June, through Friday, 20 June from 07:00 to
12:00 and will offer a light breakfast, grab-and-go snacks, and guest
tour information.
Please note that guest badges are required for entry into the hospitality
suite.
Recreational Activities:
While you are in Atlanta we hope that you can enjoy the all that the
city has to offer. From the sleek modern sky scrapers, to the quaint
southern charm, we have a variety of activities planned for you and
your guests to enjoy all aspects of life in and around Atlanta.
We have partnered with Atlanta Arrangements, Inc, the premier destination
management company in Atlanta. They will handle all aspects of the activity
registration and on-site logistics of each event. Please visit their website,
http://www.atlantaarrange.com/ims/, to preregister for each activity
and to see the most up-to-date information regarding the tours.
Atlanta Arrangements may also be reached at 1-800-883-3866 or
aai@atlantaarrange.com.
We strongly recommend that you secure your space on your favorite
tours as soon as possible! However, there will be an on-site sign-up
desk available in the Georgia World Congress Center, Building A, Level
4 Lobby near the IMS 2008 main registration area. Come enjoy Southern
hospitality at its best.
Sunday, 15 June 2008
HALF DAY TOUR OPTION - ATLANTA’S FAMOUS FIRSTS
Introducing the world’s favorite soft
drink and the first cable television
network on earth, both of whom
proudly call Atlanta home.
As part of the Cable News Network,
CNN and Headline News have
their home in the heart of
downtown Atlanta. Today, you will
catch a glimpse of the fast-paced
excitement of a 24-hour news broadcast in the making with a tour
of Inside CNN Atlanta. You’ll view the newsroom, the cameras and
lights, and all the other behind-the-scenes places and things the
viewing public never sees.
The World of Coke is a new and expanded attraction where you can
explore the complete story - past, present and future - of the world’s
best-known brand.
There’s something for visitors of all ages to enjoy, from a thrilling 4D
cinematic experience, to the largest collection of Coke memorabilia
ever assembled, to the World of CocaCola favorite, the tasting
experience with over 70 different products to sample. And that’s just a
glimpse of what the NEW World of CocaCola has to offer!
TIME: 13:00-18:00
ADULT COST: $36.00 per person.
CHILD COST (5-12 yrs): $32.00 per person. Price includes guides, tour
of CNN and Coke, and entrance fee.
PLEASE NOTE:
Children under the age of 6 are not allowed to tour CNN. Handicap
accessibility is limited. This is a walking tour that descends eight
flights of stairs. Comfortable walking shoes are recommended.
Monday, 16 June 2008
HALF DAY TOUR OPTION - GEORGIA’S STONE MOUNTAIN
Come explore Stone Mountain Park, a 3,200 acre world where
excitement’s carved in stone.
Georgia’s Stone Mountain, known as the eighth wonder of the world,
amazes millions of people and was formed approximately 300 million
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HoSPITAlITY SUITE and RECREATIonAl ACTIVITIES
years ago. The giant granite rock rises 1,683 feet above sea level and
covers 583 acres of rolling plateau. The largest bas-relief sculpture in
the world, the Confederate Memorial Carving, depicts three heroes
of the Civil War-Confederate President Jefferson Davis and Generals
Robert E. Lee and Thomas J. “Stonewall” Jackson. The three-acre
carved surface is larger than a soccer field!
Enjoy your choice of the Park’s attractions, including an authentic 19building
antebellum Plantation complex, Swiss Cablecar Skylift and
Crossroads, an 1870’s Southern town. You will receive a lunch voucher
to be used in the park.
TIME: 09:00-12:00
COST: $40.00 per person. Price includes luxury motorcoach
transportation, guides, choice of two attractions, parking, and
entrance fees.
Monday, 16 June 2008
FULL DAY TOUR OPTION - WILD ATLANTA!
Begin your day on an
urban safari to the magical
land of Zoo Atlanta. From
the zebras and giraffes of
the Ketambe bush to the
gorillas and orangutans of
the Ford African Rain Forest,
the zoo’s exotic residents
will provide the perfect backdrop for this wild day.
Zoo Atlanta is committed to studying giant pandas, to help them
to survive and avoid extinction. You may experience rare up-close
viewing opportunities in the Asian Forest Exhibit and Conservation
Center. Everybody seems to love giant pandas!
Following their visit to the zoo, guests will get to visit the Georgia
Aquarium. Guests can explore all of the Aquarium’s fascinating exhibits
where they will be amazed at every turn!
This worldc
l a s s
entertainment
attraction features more than 100,000 animals from over 500 species.
The Aquarium itself holds over eight million gallons of fresh and
marine water! The exterior of the Georgia Aquarium building has been
designed to look like a giant ship breaking through a wave. As guests
enter the huge atrium inside the building, they will be led into the
facility by “a wall of fish” guiding them inside.
Located in the heart of downtown, your guests will be treated to
an afternoon filled with underwater wonder and excitement! The
Georgia Aquarium promises to be entertaining … intriguing …
and educational for guests of all ages. While promoting a fun and
entertaining learning experience, the Aquarium will instill in your
guests a new appreciation for the world’s aquatic biodiversity. At the
aquarium, guests will also be able to enjoy lunch on their own at the
food court.
TIME: 10:00-15:00
ADULT COST: $70.00 per person.
CHILD COST (3 – 11 yrs): $62.00 per person. Price includes luxury
motorcoach transportation, guides, and admission fees.
Tuesday, 17 June 2008
HALF DAY TOUR OPTION - A TASTE OF THE PEACH
Prepare yourself for an exciting taste of Atlanta. This city tour will
introduce you to the sprawling metropolis locals fondly call “The Big
Peach”.
Relax as your experienced guide acquaints you
with the city’s history--from its fiery past to its
exciting future.
Catch a glimpse of Peachtree Center, Georgia’s
gold-domed State Capitol, the Georgia World Congress Center, the
Georgia Dome, Philips Arena, Centennial Olympic Park, CNN Center,
Martin Luther King, Jr. Historic District and much, much more.
Then it’s off toward revitalized Midtown, home of the world
headquarters of the Coca-Cola Company, the ever-expanding campus
of the Georgia Institute of Technology and the newly constructed

HoSPITAlITY SUITE and RECREATIonAl ACTIVITIES
Atlantic Station, with a live, work, and play environment.
You will receive a “Taste of the Peach” Recipe Brochure so you can
create mouth-watering Southern meals when you return home.
TIME: 13:00-17:00
COST: $31.00 per person. Price includes luxury motorcoach
transportation, guides, self guided tour of MLK Center, tour of
Cyclorama and entrance fees.
Tuesday, 17 June 2008
FULL DAY TOUR OPTION - COvINGTON’S MANSIONS AND
MAGNOLIAS
Be carried away to ages past; back to the time of mansions and magnolias.
Go east to the town of Covington, where you will tour beautiful historic
homes. These fine homes have been beautifully maintained and are
decorated in keeping with the styles of their era. All are private homes,
with the owners serving as your guide at each.
Lunch will be served at the Blue Willow Inn, a charming restaurant
house in a turn of the century Greek Revival mansion. Here you can
help yourself to the all-you-can-eat Southern buffet. You won’t want
to miss trying fried green tomatoes.
TIME: 09:30-15:30
COST: $72.00 per person. Price includes luxury motocoach
Transportation, guides, tour of three homes, lunch at the Blue Willow
Inn, and entrance fees.
Wednesday, 18 June 2008
HALF DAY TOUR OPTION - ATLANTA’S FAMOUS FIRSTS
TIME: 09:00-13:00
ADULT COST: $36.00 per person
CHILD COST (5-12 yrs): $32.00 per person. Price includes guides, tour
of CNN and Coke and entrance fees.
Wednesday, 18 June 2008
HALF DAY TOUR OPTION - MOMMY AND ME
This tour is the perfect way to explore
the city of Atlanta with your kids!
Bond with other parents and their
children as you experience two of
Atlanta’s most popular attractions for
children, Imagine It! and the Georgia
Aquarium.
Begin your day with face painting at the hotel! A face painter will be
on-site to draw your kids’ favorite pictures on their faces to get them
ready for their day of fun! Then your guests will walk from the hotel
to Imagine It!, the Children’s Museum that is just across Centennial
Olympic Park.
The mission of Imagine It! The Children’s Museum of Atlanta is to
create environments and activities where young children experience
the power of imagination and the pure delight of learning with each
other and with grown-ups. As a group, your kids are sure to make
new friends and interact with one another during this fun learning
experience!
Following Imagine It! your guests will head to the Georgia Aquarium.
Here at the Aquarium your guests can enjoy lunch on their own at the
food court!
On the way back to the hotel, be sure to stop by the fountains in
Centennial Olympic Park to cool off before heading back to the hotel!
This fun-filled day is sure to be a great bonding experience for the
children and their parents.
TIME: 10:00-15:00
ADULT COST: $60.00 per person
CHILD COST (3 – 11 yrs): $55.00 per person. Price includes guides,
face painter, and admission fees.
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HoSPITAlITY SUITE and RECREATIonAl ACTIVITIES
Wednesday, 18 June 2008
FULL DAY TOUR OPTION - THE GOOD LIFE IN HISTORIC
BUCKHEAD
Buckhead is Atlanta’s premier residential and shopping district. Tour
Georgia’s elegant Governor’s Mansion, a stunning example of Classical
Revival architecture. This 1968 mansion, the home of Georgia’s Chief
Executive and his family, is filled with an extensive collection of
Federal period furniture and Aubusson carpets.
Afterward, visit the Atlanta History Center with its regal Swan House,
quaint Tullie Smith House, and the Atlanta History Museum with the
recently opened Centennial Olympic Games Exhibit.
Enjoy a truly Southern lunch at the Swan Coach House, the former
garage and servant quarters for the Swan House.
Following their visit to the Atlanta History Center, guests will continue
with a visit to the Carter Presidential Library.
TIME: 09:30-16:00
COST: $94.00 per person. Price includes luxury motorcoach
transportation, tour of Governor’s Mansion, Tour of the History Center,
Tullie Smith and The Swan House, lunch, and entrance fees.
Thursday, 19 June 2008
HALF DAY TOUR OPTION - CULTURAL MIDTOWN
Start your day with a visit to the glorious Atlanta Botanical Gardens,
a showcase of the most beautiful and unusual flora in our region,
located on a 60-acre site in Midtown’s Piedmont Park. Take a quiet
stroll through the massive hardwood forest or the lovely vegetable,
rose, or Japanese gardens.
Then feast your senses at the magnificent Dorothy Fuqua Conservatory.
Under the glittering glass dome live some of the world’s most exotic
and glorious plants.
Next, enjoy a spectacular visit to one of Atlanta’s favorite attractions,
Margaret Mitchell’s “Dump”. This is the home she lived in with her
husband while writing the world famous book Gone With the Wind in
1926.
You will also have the opportunity to visit a museum at the Margaret
Mitchell House. The museum exhibits Herb Bridges collection of Gone
With The Wind movie memorabilia and opened on December 15,
1999, the 60 th anniversary of Gone With The Wind’s premiere. Bridges
is considered the world’s foremost authority on Gone With The Wind
and this is the largest memorabilia collection.
TIME: 13:00-17:00
COST: $52.00 per person. Price includes luxury motorcoach, guides,
self guided tours of High Museum and the Margaret Mitchell House,
and entrance fees.
Thursday, 19 June 2008
HALF DAY TOUR OPTION - SHOP TILL YOU DROP
Enjoy a day full of shopping as your motorcoach takes you to elegant
Buckhead. Phipps Plaza - named a “Southern Best” in “Southern
Living” magazine’s Readers’ Choice Awards - is anchored by Nordstrom,
Parisian, and Sak’s Fifth Avenue. Atlanta’s premier upscale shopping
center, Phipps Plaza is home to more than 100 specialty stores, four
restaurants, including the newly opened Twist serving creative satays,
tapas, and wraps, and a 14-screen AMC theatre.
Across the way from Phipps Plaza is Lenox Square. Lenox Square is
anchored by Neiman Marcus, Macy’s and Bloomingdale’s. Guests are
treated to unique specialty retailers such as BCBG, Burberry, Brooks
Brothers, Cartier, Louis Vuitton, Hermes, Ferragamo, Ralph Lauren,
St. John’s Knits and Versace Jeans Couture. Experience fine dining at
the new Clubhouse, Brasserie Le Coze or Prime. You are also invited to

HoSPITAlITY SUITE and RECREATIonAl ACTIVITIES
enjoy a meal at one of five casual eateries, or even a quick bite at one
of a wide selection of specialty food shops at the Market Food Court.
TIME: 09:00-14:00
COST: $24.00 per person. Price includes luxury motorcoach
transportation.
Thursday, 19 June 2008
HALF DAY TOUR OPTION - OUTLET SHOPPING
Spend a great afternoon shopping at the North Georgia Premium
Outlets, located in Dawsonville, north of Atlanta. Discover 140 outlet
stores offering the area’s finest collection of designer fashions and
leading brand names, all at everyday savings of 25% to 65%. You will
find a wide assortment of specialty shops such as Anne Klein, BCBG
Max Azria, Donna Karan, Gap Outlet, Polo Ralph Lauren, Crate & Barrel
Outlet, Royal Doulton, Williams - Sonoma Furniture and Outlet and
many more.
Your motorcoach/minibus will bring you to the outlets where you can
spend a whole afternoon finding great deals. If you need a break, you
can enjoy lunch on your own at the Main Street Eatery.
TIME: 14:30-18:30
COST: $28.00 per person. Price includes luxury motorcoach
transportation.
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