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2011 Annual Report - MIT Lincoln Laboratory

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■ Two new cleanroom facilities were<br />

constructed to support a growing<br />

number of satellite payload system<br />

developments. Both cleanrooms are in<br />

heavy use for the assembly of spacebased<br />

optical systems.<br />

■ To further modernize the <strong>Laboratory</strong>’s<br />

fabrication and assembly equipment, a<br />

custom-designed system for washing<br />

and cleaning printed circuit board<br />

assemblies, thermal cycling ovens, new<br />

thermal vacuum chambers, and a Nikon<br />

desktop scanning electron microscope<br />

were purchased.<br />

LEADERSHIP<br />

FUTURE OUTLOOK<br />

Dr. Eliahu H. Niewood<br />

Dr. William R. Davis<br />

Dr. Michael T. Languirand<br />

Cutting-edge high-speed<br />

five-axis machining<br />

technology enables rapid<br />

fabrication of complex<br />

mechanical components<br />

with extreme precision<br />

with a single setup<br />

process. This technology<br />

has many benefits,<br />

including simultaneous<br />

five-axis milling of<br />

complex surfaces, laser<br />

tool and part inspection,<br />

and reduction of errors<br />

in fabricating multiple<br />

copies of a single part<br />

type. Edison Arana is<br />

shown operating the<br />

<strong>Laboratory</strong>’s recently<br />

purchased five-axis mill.<br />

■ A number of new space payload efforts are under way or recently begun. The<br />

<strong>Laboratory</strong> has significantly expanded its ability to develop these systems, with multiple<br />

teams working in parallel on different programs. Increasingly efficient execution of these<br />

efforts is attributed to the rapid dissemination of lessons learned from each program.<br />

■ A variety of efforts to further the underlying technology for mechanical and materials<br />

engineering are under way at the <strong>Laboratory</strong>. These include efforts to better understand<br />

the structural analysis and properties of bolted connections, to model solder and<br />

adhesive materials, and to develop a catalog of materials for electronics components,<br />

boards, and chassis with different coefficients of thermal expansion.<br />

■ The <strong>Laboratory</strong> is expanding the modernization of its fabrication and assembly<br />

equipment to include new infrastructure for environmental testing of mechanical<br />

systems as well as for assembly and testing of complex optical systems.<br />

■ Construction of a new rapid prototyping facility was completed. The co-location of<br />

engineering personnel, fabrication equipment, and integration and test areas enables<br />

the rapid development of new systems. The facility includes conventional machining<br />

equipment, an electronic assembly area, and a rapid fabrication equipment laboratory.<br />

The facility will support multiple <strong>Laboratory</strong> programs simultaneously.<br />

<strong>MIT</strong> <strong>Lincoln</strong> <strong>Laboratory</strong> 45

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