2011 Annual Report - MIT Lincoln Laboratory
2011 Annual Report - MIT Lincoln Laboratory
2011 Annual Report - MIT Lincoln Laboratory
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■ Two new cleanroom facilities were<br />
constructed to support a growing<br />
number of satellite payload system<br />
developments. Both cleanrooms are in<br />
heavy use for the assembly of spacebased<br />
optical systems.<br />
■ To further modernize the <strong>Laboratory</strong>’s<br />
fabrication and assembly equipment, a<br />
custom-designed system for washing<br />
and cleaning printed circuit board<br />
assemblies, thermal cycling ovens, new<br />
thermal vacuum chambers, and a Nikon<br />
desktop scanning electron microscope<br />
were purchased.<br />
LEADERSHIP<br />
FUTURE OUTLOOK<br />
Dr. Eliahu H. Niewood<br />
Dr. William R. Davis<br />
Dr. Michael T. Languirand<br />
Cutting-edge high-speed<br />
five-axis machining<br />
technology enables rapid<br />
fabrication of complex<br />
mechanical components<br />
with extreme precision<br />
with a single setup<br />
process. This technology<br />
has many benefits,<br />
including simultaneous<br />
five-axis milling of<br />
complex surfaces, laser<br />
tool and part inspection,<br />
and reduction of errors<br />
in fabricating multiple<br />
copies of a single part<br />
type. Edison Arana is<br />
shown operating the<br />
<strong>Laboratory</strong>’s recently<br />
purchased five-axis mill.<br />
■ A number of new space payload efforts are under way or recently begun. The<br />
<strong>Laboratory</strong> has significantly expanded its ability to develop these systems, with multiple<br />
teams working in parallel on different programs. Increasingly efficient execution of these<br />
efforts is attributed to the rapid dissemination of lessons learned from each program.<br />
■ A variety of efforts to further the underlying technology for mechanical and materials<br />
engineering are under way at the <strong>Laboratory</strong>. These include efforts to better understand<br />
the structural analysis and properties of bolted connections, to model solder and<br />
adhesive materials, and to develop a catalog of materials for electronics components,<br />
boards, and chassis with different coefficients of thermal expansion.<br />
■ The <strong>Laboratory</strong> is expanding the modernization of its fabrication and assembly<br />
equipment to include new infrastructure for environmental testing of mechanical<br />
systems as well as for assembly and testing of complex optical systems.<br />
■ Construction of a new rapid prototyping facility was completed. The co-location of<br />
engineering personnel, fabrication equipment, and integration and test areas enables<br />
the rapid development of new systems. The facility includes conventional machining<br />
equipment, an electronic assembly area, and a rapid fabrication equipment laboratory.<br />
The facility will support multiple <strong>Laboratory</strong> programs simultaneously.<br />
<strong>MIT</strong> <strong>Lincoln</strong> <strong>Laboratory</strong> 45