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PCB + ASSEMBLY Cleaning conversion plan What’s the best way to migrate to a new cleaning solvent? There are four steps in solving this puzzle. First, do your internal research. Conduct an internal cleaning audit to determine which products in their warehouses and tool cribs contain HCFC-225, nPB, TCE or the other cleaning fluids scheduled to be eliminated in the next few years. For example, HCFC-225 can be found in drums, pails, glass bottles and even in aerosol cleaners. Determine who in your facility is using these products. Collecting the details about each cleaning application will help narrow the search for a proper replacement. Companies also should take the time to consider the effectiveness of their current cleaning process. Is the current cleaner doing everything it should? Is it fast enough, reliable enough and is the cost-perpart cleaned affordable? What’s the future of this project – will we still be making this module in five years? This is also a good time to review the cleanliness specification – how clean is clean enough? Once you have your house in order, it’s time to start reviewing the candidates. Read and understand the SDS and the product specifications available online. Contact the main vendors to get samples of prospective new cleaners that meet the cleaning criteria. Vendors should be willing to send small samples at no charge, such as liters and gallons. With samples of this size the effectiveness of the cleaner can be evaluated, and materials compatibility can be tested as well. Having pruned the list of choices, it’s now time to prepare product samples and send them to the vendors’ labs for cleaning evaluations. Bundle up a significant quantity of soiled parts and package them in clean, airtight packages for shipment to the cleaner vendors. Be as generous as you can with samples for testing, as a lack of test parts can affect the accuracy of the lab work. Usually, one cleaning fluid will prove to be the optimal answer. Based on the results from the lab, clients might want to fine-tune their expectations with more in-depth cleaning tests, conduct largescale cleaning tests in their own systems, or to vary the cleaning hardware to see if the results might shift. Once that’s done, work with top management to fund and schedule the transition. SMT Hybrid Packaging, Booth 4-301 Ed Lamm of Branson Ultrasonics in Danbury/CT loads a medium-sized degreaser with a test basket of PCBs. References 1) 2) e_225_6.html 3) position-paper-on-f-gases/ 4) Howard Sidebottom and James Franklin, “The Atmospheric Fate and Impact of HCFCs and Chlorinated Solvents”, Pure and Applied Chemistry, Vol. 68, No. 9, Pp 1757–1769, 1996. At publications/pac/pdf/1996/pdf/6809x1757.pdf. They also noted “HCFCs and chlorinated solvents make a small or insignificant contribution to stratospheric ozone depletion (with the exception of 1,1,1,-trichloroethane), global warming, photochemical smog, acid rain, or chloride and fluoride levels in precipitation.” 5) Plant Engineering Magazine, 6/12/2003, 6) 7) List provided by the State of Massachusetts; download/7249/132886/file/ý for a fairly comprehensive list of brand names Source: Microcare Zusammenfassung Die Ablösung des Fluorkohlenwasserstoffs HCFC-225 steht unmittelbar bevor. Es handelt sich um eine spezielle Formulierung innerhalb dieser chemischen Stoffklasse HCFC. Bei diffizilen Reinigungsaufgaben keine leichte Aufgabe. Immerhin gibt es eine ganze Reihe von Alternativen bekannter Hersteller, die bezogen auf die Applikation und die Nebeneffekte gezielt ausgesucht werden müssen. Denn ein typisches Produkt, das einfach das bisher verwendete HCFC-225 ersetzt, ist nicht darunter. Wir geben hier eine Anleitung, wie dieser wichtige Prozess erfolgreich absolviert werden kann. Résumé Le remplacement de l’hydrochlorofluorocarbure HCFC-225 est pour très bientôt. Il s‘agit d‘une formulation spéciale dans cette catégorie de substances chimiques HCFC. Pas si simple quand il est question de nettoyages difficiles. Quoiqu‘il en soit, des fabricants de fabricants connus proposent un grand nombre de solutions alternatives qui doivent être recherchées de manière ciblée sous l’angle de l‘application et des effets secondaires Car aucun produit typique remplaçant le HCFC-225 ne figure au tableau. Nous proposons ici des instructions pour mener à bonnes fins ce processus important. Резюме Переход от фторопроизводного углеводорода HCFC-225 представляется неизбежным. Речь идет о специальной формуле внутри этого класса химических веществ HCFC. Это не так-то легко при выполнении сложных задач по очистке. Тем не менее, существует целый ряд альтернатив от известных производителей, которые требуют направленного изучения в зависимости от вариантов применения и побочных эффектов. Ведь среди них нет типового продукта, который мог бы просто заменить использовавшийся ранее HCFC-225. Здесь приводится инструкция по успешному выполнению этого важного процесса. 48 EPP EUROPE May 2017

PCB + ASSEMBLY PRODUCT UPDATES Pick-and-place systems and features Hanwha Techwin Automation Americas, Inc., formerly Samsung C&T Automation, announced new PLUS features on its next-generation SM Series pick-and-place systems. Features include higher resolution drive motors that increase chip placement accuracy by 20 percent, flying vision verification for pre- and post-placement process enhancements, and compatibility with optional electrical test verification and progressive build capability to increase efficiency and versatility within prototyping, new product introduction, and volume production environments. SMT Hybrid Automation, Booth 4A-318 SM series specifications. Simplify the production The patented PCB support system MBU (Memory BackUp Unit), since 2008, sold by Hoang-PVM, has a modular design and works with a completely new concept, whether in the screen printer or the SMD placement machine. The aim is to optimize the set-up time during the mid-stage support process and to ensure the topography of the component bottom of the double PCB´s. It has been used worldwide and adapted for E-production in Europe for around eight years. MBU systems are available for various PCB-support heights, e.g. for stencil printers from DEK, Ekra, Ersa, MPM, Speedprint or pick & place machine like Siplace, Juki, Samsung, Yamaha, Essemtech and relatives dispensing-systems. The special feature of these patented modules consists of two important features: No electrical power and no compressed air is required. Here, the topic of mechanical sensitivity of SMD device destruction and ESD suitability is given. Source: Hanwha Techwin Automation Americas, Inc Increase your reliability, not your customer complaints. Indium8.9HF Solder Paste Halogen-Free, No-Clean Solder Paste 1 year 30 days 60 hours Typical Voiding >40% Void Area Indium8.9HF