TEST + QUALITY ASSURANCE and functions. A touchscreen and a few physical buttons are all that is needed to operate the system, start tests, and define failure codes. The user interface never shows more than two sub-menus to make it easy to navigate the system, and all essential information is displayed on screen to make the workflow as economical as possible. The user is not forced to switch display modes or skip from tabs to tabs to use the system. The substantial amounts of data produced by concurrent tests is easy to manage and process with the Corporate Standard Report (CSR) analytical software which can also access the lab tester database via Ethernet. The user selects the production lots for the test series for inclusion in the reports – optionally with custom adjustments for each clients. The display immediately shows any unusual results and helps track any trends. The system is a powerful tool for all users that need to check the test data immediately on the device e.g. to change bonding parameters on the go. The tools and indicators included in the system apply potent analytical resources. In addition to tracking means, standard deviations, minimum and maximum results, the system can determine important procedural indicators like Cp and CpK capability scores. Visualization is a great way to monitor and record complex processes. The CSR analytical software offers versatile resources for this, which are constantly updated and expanded by the company, including: • Histograms with failure code allocation • Force-Time charts •Charts • SPC with quality control charts • Individual value plots for trend and deviation analysis Compact Labtester with maximum Z-traversing range optional. The consolidated data can be shared as screenshots, via the data interface, or with the automatic report generator for the most userfriendly option. All selected data is included in the report, alongside additional important information (e.g. production lot, bonding program, user) and visual elements (e.g. client logos). The data tables are visualized with charts perfectly scaled to match the format. The reports can be exported in all common formats (including PDF) to share all of the information immediately with the right recipients. The raw data is an excellent resource for customer specific evaluation and can be accessed easily via the available interfaces for later analysis with external SPC software. www.fsbondtec.at Zusammenfassung F&S Bondtec Semiconductor bricht mit der Tradition in der Branche und nimmt einen völlig neuen Weg in ihrem Produktportfolio und ihrem Vertriebskonzept ein. Der hochwertige Drahtbond-Pulltester ist die Antwort des Unternehmens auf die Forderungen des Marktes nach wirtschaftlichen Prüfgeräten. Résumé F & S Bondtec Semiconductor rompt avec la tradition dans la branche et s‘engage sur une voie entièrement nouvelle dans son portefeuille de produits et son concept de vente. De toute première qualité, le dynamomètre pour fils (Pull-Tester) est la réponse de l‘entreprise aux exigences du marché en matière de testeurs économiques. Резюме F & S Bondtec Semiconductor нарушает традиции отрасли, выбирая абсолютно новый путь в спектре предлагаемой продукции и концепции сбыта. Высококачественный измеритель усилия для испытания проволочных выводов на отрыв — это ответ предприятия на запрос рынка об экономически эффективных измерительных приборах. Source: F&S Bondtec 90 EPPEUROPE May 2017
TEST + QUALITY ASSURANCE PRODUCT UPDATES Scanning acoustic microscope 3D AOI and SPI inspection systems Microtronic GmbH, a leading sales specialist of microelectronics, today announced plans to show the Sonix Echo scanning acoustic microscope at SMT Hybrid Packaging, scheduled to take place May 16–18, 2017 in Nuremburg, Germany. The Echo enables package inspection of stacked dies, complex flip chips and more traditional plastic packages. The Echo VS adds industry-leading features for the clearest imaging of Cu pillars, molded flip chip (MUF), CSP, MCM, stacked die, hybrids, and other advanced package inspection applications. The Echo Pro adds fully automated handling for 100 percent package inspection in high-volume production environments. Ernst J. M. Eggelaar, President of the company commented, “We are excited to present the latest developments and features of the Sonix Echo to our customers. The system offers many new and cutting-edge features.” SMT Hybrid Packaging, Booth 5–221 www.microtronic.de Source: Microtronic GmbH Sonix Echo will be shown at the SMT show. Mirtec announced they will display their 3D AOI and SPI inspection systems in pb tec’s booth at the upcoming SMT Hybrid Packaging show, scheduled to take place May 16–18 in Nuremberg, Germany. The company is a strong presence at the show each year, and 2017 is no exception. They are planning to display several systems, including the MV-6E Omni, MV-7Omni, MS-11, and the Intelli-Sys Inc. Intelli-Track. The company’s MV-6E Omni, is unquestionably the inspection industry’s most technologically advanced AOI system in consideration. This all new MV-6E Omni 3D in-line AOI system is configured with the company’s Omni-Vision 3D inspection technology which combines their award winning 15 Megapixel ISIS vision system with the digital multi-frequency eight projection 3D system to provide precision inspection of SMT devices on finished PCB assemblies. The company’s 15 megapixel ISIS vision system is a proprietary camera system designed and manufactured for use with our complete product range of inspection equipment. The digital multi-frequency eight-projection technology provides true 3D inspection using a total of four (4) programmable digital moiré projectors. This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects, as well as, solder volume post reflow. Fully configured the new MV-6e Omni machines feature four (4) 10 megapixel side-view cameras in addition to the 15 megapixel top-down camera. The MV-7 Omni-QHD 3D AOI machine features the next generation of the Omni-Vision The MV-6E AOI system. 3D inspection technology in a high-performance AC Servo Drive Platform. This technology combines the proprietary 15 MP CoaX- Press Vision System with the Quantum High Definition (2048 x 1536) digital multi-frequency 3D projection technology to provide unprecedented image quality, accuracy and repeatability necessary for precision inspection of SMT devices on finished PCB assemblies. The MS-11 3D in-line SPI Machine is configured with the 15 MP ISIS vision system, providing enhanced image quality, superior accuracy and incredibly fast inspection rates. The machine uses dual projection shadow free moiré phase shift imaging technology to inspect solder paste depositions on PCBs post screen print for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. SMT Hybrid Packaging, Booth 4–140 www.mirtec.com or www.pbtecsolutions.com Source: MIRTEC Europe Advanced in-line dual-sided optical inspection system Nordson Yestech, a subsidiary of Nordson Corporation and supplier of automated optical and conformal coat inspection systems for the electronics industry launched their latest innovation, the FX-942 dual-sided optical inspection system. The FX-942 incorporates 12 MP / 5 axis inspection technology for top and bottom side applications, including solder ball inspection, solder fillet quality inspection, lead and pin inspection and foreign material inspection. The 100 mm clearance allows for final assem The system can also be configured with proprietary UV lighting for automated conformal coating inspections. Advanced Fusion Light- ing and newly available image processing technology integrate several techniques, including 3D inspection, color inspection, normalized correlation and rule-based algorithms, to provide complete inspection coverage with an unmatched low false failure rate. The system has a Picture in Picture (PinP) feature and is MES / Industry 4.0 compatible. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution. SMT Hybrid Packaging, Booth 4A-214 www.nordsonyestech.com Source: Nordson Yestech FX-942 AOI in-line dual sided optical inspection. EPPEUROPE May 2017 91
