5 years ago

EPP Europe P1.2019

  • Text
  • Qualitaetssicherung
  • Schablonendruck
  • Loetprozess
  • Leiterplattenfertigung
  • Baugruppenfertigung
  • Zukunftstechnologien

Contents 04 2019

Contents 04 2019 European Magazine for Production and Test in the Electronics Industry Cover Industry 4.0 for inspection Challenges with PCBA manufacturing include component warpage and HoP defects. AOI and AXI inspection solutions are used for these challenges, however this does not completely eliminate false failure calls. Which is why smart verification strategies should be implemented by using an at-line X-ray system that connects to a 3D AOI and AXI inspection in-line, becoming a smart verification tool. Added value of smart factory Source: ACC Electronix Source: Charlene Hesse 06 Making a strong educational push into the European market to bring support in new areas. 48 Control with dual pot selective soldering machines allow for robust design and process repeatability. News + Highlights 6 Removing siloed environments with IPC standards Increasing opportunities for Europe 10 Adapting towards the speed and trends of technology Interview with Managing Director of IPTE 12 Industry 4.0 strategy for the Glass Factory All Circuits’ plan to a digital transformation 14 Bringing a competent sales professional on board Koenen expands sales and customer divisions 14 Expanding into the Irish market with partnership Super Dry Totech broadens reach for dry cabinets 14 Central Europe distributor for global growth Speedprint enhances localized infrastructures 15 25 years connected to air treatments Extraction. Filtration. Persistence 16 Two reference guides for engineers Industry tips from experienced professionals 17 Partnership for more control of reflow process Integration for connectivity and automation 17 Manager for research and development Rehm appoints department head Source: F&S Bontec 84 Testing for quality assurance and simpler process optimization for thick wire bonds. Trade Shows + Events 18 Undertaking challenges in microelectronics Creating lasting connections at SMTconnect 20 The future of technology coming together Getting a first look at IPC Apex Expo 2019 22 25 years of expertise in automation From engineers to one global partner (IPTE) 24 The future of electronics is certain electronica 2018 exceeded all expectations 26 LEDs in the electronic industry 1. LED meets SMT forum 27 Fast Forward 2019 platform for start-ups Bringing prototypes together at productronica 27 2019 Innovation Awards at Apex Pushing boundaries of technology 28 Shaping the future of stencil printing Christian Koenen Technology Day 32 Hotbed for AIoT & IoT integration The future of electronics in Taiwan (Taitronics) 4 EPP EUROPE April 2019

38 Foto: Yxlon 34 The digital age on all levels Fuji Innovation Days – All about Smart Factory PCB + Assembly Features 44 EMS provider with innovative line concept Producing top quality with high precision (ASM) 46 Product-Updates PCB + Assembly 48 Quality with robust design and process repeatability Helping with continual path to improvement (Ersa) 50 Solder paste attributes for SiP assembly Advantages of small form factor approach (Indium) 55 Four steps to successfully clean PCBAs Tools and techniques for circuit drying (MicroCare) 58 Product-Updates PCB + Assembly 60 Process tracking and traceability across all lines Quality reflow and cost improvements (KIC) 62 Product-Updates PCB + Assembly 64 Providing turnkey sensors to increase market share Sensing the world’s needs (Essemtec) 66 Product-Updates PCB + Assembly 68 Offering flexible and versatile types of dryers Reliable protection for electronics (Rehm) 72 Surface-mount line to fulfil emerging market demands Pick and place at the heart of production (Europlacer) 74 Product-Updates PCB + Assembly 76 Outlook on transparent resin choices and applications Encapsulation optimised for LEDs (Electrolube) 79 Product-Updates PCB + Assembly IPTE is exhibiting at SMTconnect 7 - 9 May 2019 Hall 5 Booth 434B Test + Quality Assurance Features 82 Inspection system for THT component testing Timely fault detection in tight spaces (Göpel) 84 Accelerated mechanical fatigue interconnect test Test for reliability of heavy wire bonds (F&S) 87 Product-Updates Test + Quality Assurance Columns 3 Editorial 4 Contents 90 Imprint/List of advertisers EPP EUROPE April 2019 5