PCB + ASSEMBLY PRODUCT UPDATES PCB and packaging for drives and assistance systems Source: AT&S AT&S expects growth in electromobility applications in the near future and is focusing on embedded power technologies. Electromobility and automated driving are the two defining trends in the automotive industry with high growth potential, but also technological challenges. For example, hybrid and/or electric powertrains require, among other things, efficient power electronics for the major subsystems such as inverters, onboard chargers or DC/DC converters. Finally, the implementation of electromobility also requires efficient, space-saving and reliable connection and packaging solutions. On the other hand, new high-performance sensor systems with sensor fusion and high-speed communication are required along the way to autonomous driving, all whilst maintaining functional safety and security. AT&S address- es all of these key automotive trends with innovative connection and packaging solutions. Efficient power Electromobility continues to make headway, driven by legal requirements in all key regions – led by China. To date in the EU, the target of 95 g CO 2 /km has been the fleet average for 2021. According to a recent EU compromise, new cars in the EU are to emit another 37.5 % less carbon dioxide by 2030 than in the comparable year 2021. The company expects above-average growth in electromobility applications over the next few years and is focusing here amongst other things on embedded power technologies – in other words, the embedding of power semiconductors such as Mosfets in PCBs. Key benefits of ECP (embedded component packaging) over conventional PCB assembly include significant miniaturization thanks to higher integration, improved reliability and superior thermal performance. In addition, ECP facilitates integrated EMI shielding and supports the adaptation of different coefficients of thermal expansion (CTE) for rapid and easy system integration. As silicon-based solutions slowly reach their limits, the use of wide-band gap materials such as GaN promises more efficient power conversion, with higher efficiency and higher power density. The second megatrend in the automotive industry is automated driving. With the increasing degree of automation and thus more sophisticated advanced driver assistance systems (ADAS), the need for sensors and different sensor technologies is also increasing in cars. Whilst a combination of camera and radar systems is sufficient up to level 2, from level 3 lidar also plays a crucial role. Due to the ever-higher frequencies such as for the radar, the traces on the circuit boards must also be regarded as RF components and designed accordingly. The company is a specialist in this field and has developed PCBs that deliver the necessary and also cost-efficient performance in the frequency range up to 80 GHz. The company addresses all these aspects. By way of example, they are working on new materials to further reduce the dielectric constant and the loss factor. www.ats.net Smart manufacturing for electronics processes Siemens announced the introduction of Camstar Electronics Suite software, an innovative manufacturing execution system (MES) for electronics. Building on the successful enterprise-level platform for integrated circuit (IC) manufacturing, this powerful, configurable and scalable MES solution enables PCB and box assemblers to meet traceability requirements, improve efficiency levels and control manufacturing operations through direct IoT connectivity with machines and production lines. Expanding on their digital innovation platform, the MES system creates a true digital thread to empower electronics companies to further their digitalization strategy in line with Industry 4.0. By closing the loop between engineering and the shop floor, and enabling quick reactions to design modifications, manufacturers can shorten product lifecycles, increase production complexities and improve quality across the entire manufacturing lifecycle. “Siemens made an important step towards helping electronics manufacturers improve operations performance when they acquired Camstar, but by adding capabilities from Mentor’s Valor Electronics Manufacturing Solutions software they can now drive a new level of productivity, throughput, and quality for both PCB, mechanical and box-build manufacturing,” said Greg Gorbach, Vice President, digitization and IoT, ARC Advisory Group. “With the Valor edge data acquisition technology and tight integration with Teamcenter to support a robust digital twin and digital thread, Source: Siemens the Camstar Electronics Suite now enables customers in the electronics industry to rapidly adapt to design changes and to speed production by directly connecting with specialized machines and production lines.” Siemens PLM Software continues to grow its digital innovation platform and look for new ways to expand on the most robust digital twin. The Suite activates the seamless flow of product and business data between product lifecycle management (PLM), enterprise resource planning (ERP) and shop floor execution through an integrated digital thread, enabling faster and streamlined change cycles. Using this single data source, closed-loop feedbacks from production to design and engineering departments can result in improved quality levels and shorter new product introduction (NPI) processes and goto-market times. SMTconnect, Booth 5-434B www.siemens.com 58 EPP EUROPE April 2019
Fume extraction devices for manual workstations “Efficient capturing of airborne pollutants” is the central subject of ULT’s trade show appearance at SMTconnect 2019. The vendor of fume extraction solutions will demonstrate the influence of high-degree capturing of emissions, such as soldering fume, laser fume, vapors or gases, on the entire filtration process and, consequently, air cleaning procedure. At a specially designed experimental setup, visitors may experience an efficient air cleaning process from extraction to outlet. Moreover, the company will exhibit mobile fume extraction devices for small and medi- Source: ULT AG Mobile, solid soldering fume extraction unit LRA 160.1. um pollutant amounts – ideally configured for manual workstations (manual prototype placement, small batches, repair etc.) and integration into either production lines or processing plants, e.g. laser marking systems or automated soldering systems. The first-time introduction of the new LRA 160.1 device series for soldering fume removal rounds off their trade show presence. In addition to the new, visually appealing design and improved device handling, users benefit in the system series by means of high filtration rates, extremely low-noise operation and an optimized price-performanceratio. Special module combinations within the LRA 160.1 system increase filter lives, resulting in significant cost savings for users. Visitors to the company’s exhibition stand get first-hand information on the air purification systems‘ high flexibility and variability, receiving concrete conclusions on potential applications as well as purchasing and maintenance cost savings. The fume extraction systems provide for clean air within the production processes. They protect employees, manufacturing plants and products from hazardous airborne contaminants, occurring during the utilization of laser systems, soldering equipment as well as in gluing, laminating and coating applications. SMTconnect, Booth 5–214 www.ult.de Bond Tester by F&S BONDTEC >> Fully automatic pull- & sheartesting by using most modern Pattern-Recognition-Software >> Reproducible test results and precision within a few μm >> Automatically rotating and positioning of pull hooks and shear tools NEW & UNIQUE: Our BAMFIT BONDTEC Accelerated Mechanical Fatigue Interconnection Testing Revolutionary quick test for lifetime of heavy wire bonds Adds power cycling tests of power semiconductors, but in minutes instead of months Low residue fluxes for tabbing and stringing applications Source: MacDermid Alpha Electronics Solutions The Assembly division of MacDermid Alpha Electronics Solutions, a producer of electronic soldering and bonding materials, has recently introduced the Alpha 7 series low residue fluxes to meet the demanding requirements of the photovoltaic industry when higher peel strength is deemed necessary. There is minimum flux deposits that accumulates inside tabbing and stringing equipment and spray nozzles when using the Alpha 7 series. “With the use of the latest flux chemistry and technology, Alpha 7 Series Low Residue Fluxes are designed so that minimum flux deposits accumulate inside tabbing and stringing equipment and spray nozzles, thus eliminating corrosion and clogging issues,“ said Eric Poh, Global Portfolio Manager for Non-PCB Assembly. “The unique chemistry provides excellent soldering with fast wetting in standard module assembly processes and methods that are used widely, such as preheat and soldering, for both spray or dipping application methods.“ These low solid fluxes also allow for an extended shelf life compared to many competitive fluxes in the industry. www.alphaassembly.com Visit us at SMTconnect 07. – 09.05.2019 in Nürnberg; Hall 4A, Stand 430 F&S BONDTEC Semiconductor GmbH Industriezeile 49a 5280 Braunau am Inn Austria Phone: +43-7722-67052-8270 Fax: +43-7722-67052-8272 E-Mail: info@fsbondtec.at www.fsbondtec.at EPP EUROPE April 2019 59
