PCB + ASSEMBLY PRODUCT UPDATES System developments and optimizations for soldering Source: Rehm Thermal Systems Rehm product portfolio. Every year SMTconnect in Nuremberg (formerly SMT Hybrid Packaging) highlights current topics in the field of electronics manufacturing. Rehm Thermal Systems will be attending this year as well. “Look further, go beyond” is the motto that the company is using for its trade fair appearance this year. Their developers and designers are looking to the future and are paving the way in the development of electronics manufacturing with their additional developments and optimizations in system and process engineering. The company will be introducing the following systems: • VisionXP+: The system for reflow convection soldering with or without a vacuum is now even more efficient. The company will present its highlights, for example, the use of new EC fan motors, which are not only quieter and more sustainable, but also enable comprehensive production data collec- tion, a more effective cooling zone and design optimization. • CondensoXC: It has a compact structure thanks to the innovative processing chamber and is a high-performance device. Thanks to the patented injection principle, exactly the right quantity of Galden is supplied for optimal profiling. Thanks to the closed-loop filter system, the medium can be recovered and filtered at virtually 100 %. The system is fully suitable for vacuums and has an integrated process recorder for optimal traceability. • CondensoXS smart: These smart systems are based on the chamber design of the CondensoXC and thus ensure high process stability. An enlarged process chamber, boasting a significantly reduced footprint, enables higher throughput and thus shorter process times. • Nexus: The vacuum soldering system is ideal for pore-free and flux-free soldering at up to 450 °C with a variety of process gases. The wet-chemical activation with formic acid is available as an option. It is possible to use lead-free or lead-containing preforms and pastes. Contact soldering is used in advanced packaging and power electronics. • Securo Minus: The Securo range has developed to analyze the reliability of sensitive electronics under extreme temperatures. Securo Minus is deployed in the context of the cold function test to check the winter performance of electronic assembly groups for example. The electronic components are exposed to cold air or nitrogen at low temperatures of up to –55 °C in the system and thereby brought to the optimal temperature for checking. • ProtectoXP: This selective conformal coating system protects sensitive electronic assembly groups from damage by corrosion or other environmental influences such as humidity, chemicals or dust. The company will be presenting a variety of application methods for different deployment areas and materials at the trade fair. • ProtectoXC: Even with minimal throughput, the system guarantees reliable coating processes and can be integrated as a batch or line variation. It will present with ViCON system software at the trade fair for the first time. The new operating concept simplifies image creation for coating and includes numerous features for an easy-tocreate, reproducible coating result. SMTconnect, Booth 4A-100 www.rehm-group.com Adhesives cure with UV light and moisture Panacol developed a variety of adhesive products with low ion content which cure with UV light and moisture. These products were specially formulated for applications in the electronics and consumer electronics industry, where heat sensitive parts must be assembled. Vitralit UD 8050 is a one-component acrylic adhesive, which can be used as an encapsulant to protect electronic components on PCBs. It can be cured with UV or visible light. Moisture post-curing ensures full cure in shadowed areas or deeper layers of the adhesive, which cannot be reached by light. For specific requirements several versions of the adhesive are available. The Vitralit UD 8050 MV F allows enhanced flow con- trol and focused dispensing on each component thanks to its shear-thinning behavior. Its low ion content prevents corrosion on electronic components. For superior process control, it contains a fluorescent marker. For jetting, the low viscosity version Vitrali UD 8050 LV is the perfect solution. Thanks to its easy dispensing and fast curing, it is very convenient for applications in the production of consumer electronics where a high throughput is needed. By default, the adhesive is transparent, but it is also available in blue or fluorescing versions. Other colors are available on request. www.panacol.de The adhesive products from Panacol cures with UV or visible light. Source: Panacol 66 EPP EUROPE April 2019
Visual virtual factories with the CFX standard Aegis Software, a provider of Manufacturing Execution Software (MES) announced that FactoryLogix is the first MES solution to natively leverage the power of the IPC Connected Factory Exchange (CFX) standard. The platform leverages CFX from data acquisition to analytics and process control automation. As a result, any manufacturer on this platform that purchases a CFX-compliant device, machine or system will instantly interpret, and leverage the critical information from those devices without the need for middleware or custom integration. The emergence of CFX combined with an MES that understands the data streams ushers in the era of true IIoT, which is an enterprise that is free of the need for custom middleware to get data from the factory floor. Now manufacturers of will be able to fast-track the actual realization and transformative benefits of Industry 4.0. “Until now, for manufacturers to truly capitalize on the promise of IIoT and Industry 4.0, middleware was required to reside between the device layer and the upper system layer. The use of middleware always meant additional costs and complexity. Additionally, as soon as a factory introduced a new machine or upgraded existing machines, more development resources and time would be needed to update existing adapters to leverage the machine information,” stated Jason Spera, CEO. “By updating the entire architecture of the FactoryLogix platform to fundamentally ‘understand’ CFX data from acquisition up to analytics and process control automation, we have enabled it to natively support any CFX-enabled machine, device or system instantly and without the need for middleware or custom programming.” Driving factories forward FactoryLogix is a holistic and modular platform which delivers leading-edge technology with easily configurable modules to support and execute a discrete manufacturer’s strategy towards Industry 4.0. It manages the entire manufacturing lifecycle: from product launch to material logistics, through manufacturing execution and quality management, CFX standard was demonstrated at Apex this year with the help of Aegis’ FactoryLogix software. to powerful analytics and real-time dashboards. This end-to-end platform is helping companies accelerate product introductions, streamline processes, improve quality and traceability, reduce costs and gain greater visibility for competitive advantage and profitability. SMTconnect, Booth 4-150 www.aiscorp.com Source: Aegis Software 7-9 May 2019, Nuremberg Hall 4, Stand 339 Invent & Research Advise Formulate & Test Partnership Tailored solutions Comply Collaborate Our winning formula for superior electro-chemicals With a 77-year pedigree, a growing presence in 55 countries and production in 3 global locations, we have the products, research facilities, resources and personal expertise to engineer solutions to your manufacturing challenges. Make contact and discover what makes Electrolube the solutions people for leading manufacturers worldwide. Manufacture Global support +44 (0)1530 419600 | www.electrolube.com Electronic & General Purpose Cleaning Conformal Coatings Encapsulation Resins Thermal Management Solutions Contact Lubricants Maintenance & Service Aids EPP EUROPE April 2019 67
