TEST + QUALITY ASSURANCE PRODUCT UPDATES Software featuring live image overlay Inspectis AB’s new Pro and Pro-X software editions feature a live image overlay comparison function with auto image alignment, making inspection clearer and easier to use. This function is additional to the existing comparison functions that includes overlay of two saved images. In addition to other inspection and measurement functions, Live Overlay function can be used as a simple image comparator to assist in detecting differences between a live image and a saved reference image. The company’s software makes it easy to spot faults, such as incorrectly placed, badly placed and missing parts. A video demonstration of this powerful feature can be seen on the company‘s Youtube channel. The Pro and Pro-X Windows PC software is compatible with all of the company’s camera models, from the C12 to U30 Series, and all editions are built upon the same carefully-designed and developed user interface with clear and intuitive controls and tools. www.inspect-is.com The Live Overlay function can assist in detecting differences between a live image and saved reference. Source: Inspectis AB High multi-site automotive and industrial device testing Automotive power electronics ICs are complex and have stringent test requirements. This limits how many IC’s can be tested in parallel, and inhibits the cost-effectiveness of modern parallel manufacturing test strat- Source: Cohu Inc. The VI1x offers a solution for CAN and LIN bus testing, including specialized loads, detailed timing measurements, and high voltage leakage testing. egies. The Diamondx platform, with a range of power and automotive instrumentation featuring SmartMux, enables maximum efficiency. The VI1x from Xcerra, a Cohu company, has uncompromising measurement quality and high parallel test efficiency. Leveraging a discrete channel design, the VI1x delivers up to 100 mA in the ± 60V range and up to 300 mA in the ± 20V range, while offering force and measure current accuracy as low as 1.2 nA. With a 64 channel Smart- Mux topology, the platform dramatically reduces loadboard PCB complexity, speeding time to market and reducing cost and risk associated with leading-edge automotive and industrial power management devices. Christopher Lemoine, Product Marketing Director, notes: “The Diamondx already offers an impressive range of automotive and industrial instrumentation products, and the VI1x is the latest member of this family. Coupled with the AT1x instrument, it offers a complete solution for CAN and LIN bus testing, including specialized loads, detailed timing measurements, and high voltage leakage testing. The HPVIx and FPVIx handle high power devices up to ± 100V and up to 5A, respectively, with the ability to combine instruments for higher current or voltage. All of these instruments feature SmartMux technology, to enable higher multi-site and uptime, and faster time to market. The benefits are higher yield, lower cost, and better responsiveness to a fast-changing market.” www.cohu.com Expansion of product portfolio for the semicon industry Yxlon International, a division of the Swiss Comet Group, has launched a range of X-ray inspection systems dedicated to the semicon industry. They offer advanced automated 2D and 3D inspection of bumps and filled vias to locate, identify and measure failures, including non-wetted bumps, voiding and misalignments. In terms of resolution, these systems are among the best in the market. The FF70 CL and FF65 CL series are fully automated analysis systems offering ultrahigh resolution and magnification for the smallest semiconductor defect detection. These systems provide automated analysis of TSVs, C4 bumps, 3D packages and MEMS at wafer, strip or component level. Lastlyk, the The FF70 CL has a computed laminography for ultra-high volume resolution and has defect inspection capability at a micron level. FF65 IL with its integrated loader is designed to meet the needs of volume manufacturing whilst maintaining market leading features and benefits. They were developed under collaboration with Nagoya Electric Works. “Our customers in the semicon industry require analyzing continuously smaller features at higher speed. Classical electrical Source: Yxlon International testing and optical inspection are coming to their limits, especially in complex 3D packaging”, states Eike Frühbrodt, Vice President Product and Project Management. “The FF70 CL with its computed laminography for ultra-high volume resolution can handle this challenge easily. An air-suspended high precision manipulator, anti-vibration mechanics and 7 tons of machine weight make it an ideal choice for defect inspection at micron level. And when speed is more an issue than ultra-high resolution, the FF65 CL and FF65 IL will deliver. All three systems are an excellent complimentary range to our existing product portfolio for the electronics market with Cougar and Cheetah EVO, as well as FF20 CT and FF35 CT.” www.yxlon.com 88 EPP EUROPE April 2019
Latest range of AOI technology A challenge when programming AOI systems is the detection of all non-conforming placements, especially those related to solder joints, without creating ‘’false calls’’. This commonly results in long debugging time and complex programming. Implementing a new AOI system can take several months and the ongoing creation of new programmes to increase its reliability is labour intensive. A programmer can override programs and instruct a machine to accept all boards or reject all components and solder joints, depending on the settings. Mek offers a line of inspection equipment for maximized defects coverage, with minimum human interaction. The benefits of ISO-Spector M1A include: • Engineer independent, exceptionally fast, automatic programming • Self-learning algorithms for solder-joint inspection using Artificial Intelligence • Dramatically reduced programming time • Less ‘’false calls’’ and debugging time • More reliable inspection results The full 3D ISO-Spector M1A delivers a self-learning algorithm for solder joint inspection that will detect deviation outside the expected standard appearance of a solder joint. A proprietary solution with Artificial Intelligence monitors production and adjusts hundreds of tolerance values where needed to maximize detection. The programmer does not have to specify inspection locations, light settings or acceptance criteria. This reduces programming time and removes human variable to ensure reliable inspection results. Overruling settings is still doable, but experience has proven that it is rarely needed. Typically programming a new part number requires 1-2 minutes and part numbers can be stored in the library to reduce programming time for future NPI’s. Also the desktop PowerSpector GTAz 520 is designed for maximum defect coverage with short programming times. It is equipped with 9 cameras: 1 top and 8 side cameras. Mek offers a line of inspection equipment for maximized defects coverage, with minimum human interaction. Source: Mek The optical unit is configurable to fit all needs of today. The SpectorBOX GTAz 550 “Bottom Up/Top Down” system is engineered to accommodate solder frames on return and/or feed conveyors. The system offers bottom top, or dual side inspection, deploying up to 18 cameras, Z axis positioning and auto-focus. The design is for the inspection of THT components to identify defects such as presence/absence, wrong polarity, type, and bent pins. Integration alternatives are enhanced by its slim, compact mechanical design. www.marantz-electronics.com Smart Manufacturing capabilities for inspection As ‘Your Partner for Smart Factory Realization,’ Koh Young Technology has true 3D solutions with expanded capabilities that improve production throughput and yield. Leveraging its core strengths in robotics and true 3D measurement, the company brought the next generation of accuracy to the pin inspection, machined parts, and semiconductor inspection markets. The KY-P3 delivers true 3D inspection data for single array, forked, press-fit, and other pin configurations for Final Optical Inspection (FOI) with applications like engine control units. The system also measures pin height, solder height, and pin tip separation with the highest accuracy and repeatability. The latest Machining Optical Inspection (MOI) system was also appealing for visitors. Developed around its core 3D measurement technologies, the MOI system inspects metal case surfaces for scratches, cracks, and stains, along with height, diameter, vol- ume, and more. Committed to bringing about “Smart Manufacturing” innovations, the system delivers both visual and process inspection simultaneously, which improves process yield and reduces false calls. Beyond pin and machined part inspection capabilities, the latest Meister D solution focuses on the SiP (System-in-Package) assembly process. This machine improves production yields on high density modules comprised of bare die and passives by integrating defect analysis and metrology software. With small sized component inspection down to 008004 inch, the system overcomes challenges in semiconductor packaging, which are compounded by chip stacking and wafer thinning. What’s more, the system also allows machine learning-based crack inspection. SMTconnect, Booth 4A-233, 4A-231 www.kohyoung.com EPP EUROPE April 2019 89
