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4 years ago

EPP Europe P1.2020

  • Text
  • Assuraance
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  • Automation
  • Manufacturing

COVER Trends in the

COVER Trends in the market: The role of automated X-ray inspection 3D AXI provides fast volumetric inspection Current market trends show that the role of 3D X-ray inspection is getting more important and becoming more vital. With the increasing complexity of electronic products, a total inspection solution of 3D solder paste inspection (SPI), automated optical inspection (AOI), and automated X-ray inspection (AXI) is required. X-ray inspection, in particular, plays a key role in assuring the quality of critical devices, especially for applications in the medical, automotive, and aerospace industries where human lives are directly connected to the quality of the products. In addition, today’s innovation cannot take place without considering environmental factors and improvements. Equipment designed today must adhere to strict environmental standards. Ikumi Sugawara, Saki Europe 20 EPP EUROPE April 2020

COVER 3D X-ray provides inspection where classical automated optical inspection has limitations. Previously, most X-ray inspection was done off-line, but the inclusion of many more electronic parts in too-critical-to-fail products that require high-volume assembly with high throughput and yield, necessitates inline inspection. AXI equipment needs to be faster, ever more accurate, and adopt innovative technological and machine-to-machine (M2M) capabilities to keep pace and deliver products that ensure quality and reliability. To meet these requirements, Saki has developed the 3Xi-M110 automated X-ray system. Planar computed tomography provides accurate volumetric data To meet the demands for high-quality inspection, the company invented its unique planar computed tomography (PCT) technology, which provides volumetric and shape inspection of solder joints. PCT is an extension of the CT (computed tomography) technology used in the medical field for many years. PCT completely separates the images of the top and bottom sides of the printed circuit board assembly (PCBA), so images are not affected by back-side mounting. Many X-ray systems use a process of subtraction to remove the substrate images, whereas the company’s true 3D system uses an additive process. High-resolution 3D images are made by capturing more than 200 slices (con- AXI needs to be faster, ever more accurate, and adopt machine-to-machine (M2M) capabilities to deliver products that ensure quality and reliability. Saki’s systems meet these requirements. Source: Saki Corporation EPP EUROPE April 2020 21