Robert Moor, CEO of
Robert Moor, CEO of Protavic International, a chemicals manufacturer based in Levallois-Perret, France Source: Protex International Interview with Robert Moor, CEO of Protavic International “We see ourselves as the French alternative” French industrial group Protex International develops and manufactures specialty chemical additives for a range of sectors. Its subsidiary Protavic applies its solutions to electronics. Group CEO Robert Moor reveals how the company keeps up with the dynamic requirements of the global industry while retaining l‘esprit français. 10 EPP Europe » 04 | 2023
Interview « NEWS & HIGHLIGHTS EPP Europe: Perhaps you could start off by providing some background on Protavic and its products? Robert Moor: Protavic specializes in the development and manufacturing of resins, glues and inks for electronics. Headquartered in France, we operate business entities in Europe, the US, South Korea and China, and have three production sites and three laboratories for product design and development. Protavic products are used in the automotive electronics market, in smart card modules, and in sensors and passive components such as MLCC capacitors. Can you go into more detail about which products are used during which of the various stages of electronics production and assembly? Our products are employed in many different ways. Besides standard applications such as conductive and non-conductive die attach, underfill, dam and fill, glob-top, and potting, we are also developing tailor-made solutions to help our clients differentiate their offerings from those of their competitors. For instance, we developed an underfill resin with extremely low coefficient of thermal expansion (CTE) and fine granulometry for narrow gap filling which has now become the standard for demanding underfill applications. How do your potting compounds differ from those of your competitors? We are investing a great deal of research and development into the area of potting. Our view is that it is important to develop high value resin formulations when there are very specific or niche requirements or components. For instance, the latest generation of semiconductor dies for power module requires an encapsulation resin with a unique set of performance characteristics including: high ionic purity, low CTE, medium to low modulus and short curing time. This is an area in which we are developing new products to replace conventional silicon gels which are no longer adapted to the requirements of the new generation of power modules. Universal Soldering Platform | SB²-USP Compact & Flexible Alternative to Wave Soldering Multiple Process Capabilities • Chip & Component Assembly • Laser & Pin Soldering • Solder Jetting • Flux or Fluxless Processing System Features • Pick & Place Robot • Soldering Robot • Solder Ball Size: 1-2mm • UPH: >1000 (2-Pin product) Various Applications LED | LiDAR | PDC ENDOSCOPE | PACEMAKER WHITE GOODS | CONNECTORS SPECTROSCOPE | OPTICS pactech.com EPP Europe » 04 | 2023 11
