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» PCB & ASSEMBLYAutomatic cleaning of solder nozzles in the selective soldering processAdvantages for efficiency and qualityof electronics productionIn electronics manufacturing, the quality of the soldering process is critical to the functionalityand reliability of the finished assemblies. The solder nozzles play a particularly important rolein the selective soldering process, as they are the key element between the solder and theproduct. “Precision” is the key word here. However, dirty or poorly maintained nozzles can havea serious impact on the quality of the solder joints and the entire production process.Dirty nozzles in selective solderingcan lead to uneven or insufficientsolder application, causingincomplete or poorly wetted jointsthat impact product functionalityDirty nozzles in selective soldering processes cancause the solder to not reach the solder jointsevenly or in the correct amount. This can result in incompleteor poorly wetted solder joints that affectthe functionality of the final product.Effects of dirty solder nozzlesResidues in the nozzle can also lead to an unevenflow of solder. As a result, the solder flow is no longercontrolled, increasing the risk of short circuits orbridging between neighboring solder joints.Defective solder joints must be laboriously reworked.This not only increases production costs, butalso the time required for quality assurance andtroubleshooting.Another serious drawback of residue on the nozzleis that it can interfere with heat transfer and temperaturecontrol during the soldering process. Thiscan lead to inhomogeneous solder joints, resulting ineither cold solder joints or overheating of the components.In the long term, the build-up of residues on thesolder nozzle can also have a negative effect on itsmaterial properties, which can significantly reducethe life of the solder nozzle. Higher maintenance andspare parts costs are then inevitable, often combinedwith unplanned downtime that affects overall productionefficiency and slows down production.Continuous care and maintenance of the soldernozzles is therefore essential. Although manualcleaning is a common method, it can be associatedwith various disadvantages that impair the productionprocess in electronics manufacturing.Disadvantages of manual cleaningManual cleaning of nozzles in the selective solderingprocess presents several risks and challenges. Onemajor drawback can be the quality of the cleaning.The success of the cleaning process depends heavilyon the experience and diligence of the operator,which can lead to inconsistent results. For example,residues on the nozzles are not always completelyremoved, which affects the quality of solder jointsand leads to defects such as uneven solder joints orbridging.Another disadvantage is the time required formanual cleaning. This results in downtime and a reductionin production capacity. Repeated manualcleaning also increases the risk of nozzle damage.Improper handling or mechanical cleaning processescan damage nozzle materials, resulting in higher replacementcosts in the long term.Source: SEHO24 EPP Europe » 05 | 2025
Manual cleaning processes also typically involvethe use of chemicals, some of which are aggressive.Personnel are exposed to fumes during the cleaningprocess.Finally, manual cleaning can pose a traceabilityproblem because it is difficult to fully document thecleaning process. This is a risk, especially in demandingproduction environments where precise qualitycontrol is required.Overall, manual cleaning of solder nozzles can leadto efficiency losses, increased costs and decreases inquality. As a result, automated solutions are increasinglypreferred in electronics manufacturing.Advantages of automatic cleaningCompared to manual cleaning processes, automaticcleaning of solder nozzles offers numerous advantagesthat affect both the quality and efficiency ofthe selective soldering process. The most importantadvantage is the consistency and precision of thecleaning process. Automated systems operate accordingto set parameters that ensure consistentlyhigh cleaning quality. Because the process runs inde-The automatic ultrasonic cleaning system vibrates the liquid solder, cleaningand rewetting the nozzle surface without atmospheric oxygenpendently of the operator’s experience, residues arereliably removed, and the nozzles are optimally preparedfor the next use. This results in more stableand consistent soldering quality.Source: SEHOBy far the best3D AOI solution‹ 3D measurement capability atthe highest state of the art‹ Side-View camera solutionsfor expanded inspectioncapabilities‹ Auto programming based onartificial intelligenceKoh Young Europe GmbHIndustriegebiet Süd E463755 AlzenauTel. +49 (0)6188 9935663E-mail: europe@kohyoung.comwww.kohyoung.comEPP Europe » 05 | 2025 25
