» PCB & ASSEMBLYThe automatic ultrasonic cleaning system developedby SEHO Systems causes the liquid solder to vibrate,cleaning the surface of the solder nozzle in theabsence of atmospheric oxygen and immediately rewettingit.As the ultrasonic process is non-contact andrequires no chemicals or acids for the cleaning process,there are further advantages in terms of handling,and potential cost savings. There are no specialstorage requirements, no need for staff to be speciallytrained in the use of chemicals or acids and, of course,no harmful vapours are produced during the cleaningprocess to which staff are exposed. In addition,chemical and acid-based systems always requiresome form of dosing device to clean the soldernozzles, which in turn is susceptible to maintenanceand failure.ZusammenfassungDie automatische Ultraschallreinigung der Lötdüsenim Selektivlötprozess verbessert die Produktionsqualitätund Effizienz, reduziert Lötfehler und Stillstandszeiten,verlängert die Düsenlebensdauer, senkt denWartungsaufwand und spart Kosten.RésuméLe nettoyage automatique à ultrasons des buses dansle processus de soudage sélectif améliore la qualité etl’efficacité de la production, limite les erreurs de soudureet les temps d’arrêt, allonge la durée de vie dumatériel, réduit les coûts d’entretien et permet deséconomies.РезюмеАвтоматическая ультразвуковая очисткапаяльных насадок в процессе селективной пайкиповышает качество и эффективностьпроизводства, снижает количество ошибок пайкии время простоев, продлевает срок службынасадок, уменьшает затраты на обслуживание иснижает расходы.Another benefit of this automated cleaning is reduceddowntime. Ultrasonic cleaning is faster andmore efficient than manual cleaning, minimizing productioninterruptions. Because cleaning can be integratedinto the production process, there is little disruptionto production, which increases production capacity.Maintenance costs are also significantly reducedby eliminating the need for manual intervention.In addition, ultrasonic cleaning reduces the risk ofdamage to the nozzles because the nozzles virtuallynever come into contact with the cleaning system.The system works with defined parameters, whichoptimizes the handling of the nozzles and minimizesthe risk of errors or damage. This not only extendsthe life of the nozzles but also reduces the cost ofspare and wear parts, resulting in greater cost effectiveness.Another key benefit is the elimination of humanerror. Since the cleaning process is independent ofthe operator‘s level of fatigue or diligence, the likelihoodof errors is significantly reduced. Ultrasonictechnology ensures precise and repeatable cleaning,which increases the quality and reliability of the entiresoldering process. This precision also affects thequality of the solder joints, as consistent and thoroughcleaning of the nozzles significantly reducesthe risk of soldering defects.Documentation and traceability of the cleaningprocess is also greatly improved by the automatedsystem. The cleaning cycles can be programmed viathe software and are archived via the productiondata acquisition system, providing a complete recordof the cleaning process. These records are an absoluteplus for quality management and audits.ConclusionSwitching to automatic ultrasonic cleaning of selectivesoldering nozzles offers numerous benefits thatimprove both production quality and efficiency. Theconsistency and precision of automated cleaning reducessoldering defects, minimizes downtime, andextends nozzle life. It also reduces maintenance andsaves money.In an increasingly competitive industry, the automationof cleaning can be a critical factor in improvingproduction processes and a company‘s long-termcompetitiveness.Automatic ultrasonic cleaning for mini wave soldernozzles is available for many SEHO selective solderingsystems.www.seho.de26 EPP Europe » 05 | 2025
PCB & ASSEMBLY «Source: ASYS GroupThe company‘s stand included technologies that are optimally tailored to the requirements of power electronics30 years of industry experience, first time at PCIMGerman manufacturercelebrates debutThis year’s PCIM Europe, held from May 6–8 in Nuremberg, Germany, marked adebut for ASYS Group. The provider of manufacturing solutions in power electronicsexhibited numerous production lines in energy and power electronics.For the company, it was important todemonstrate how sophisticated processes,modular technologies, and over 30years of industry experience can work togetherto provide solutions in today’smanufacturing environments. The groupsupports customers throughout the entiredevelopment process, from initial prototypesto scalable high-volume production,and places emphasis on partnershipbasedcooperation. In doing so, processesare not just mapped, but defined,adapted, and perfected.In its debut, the group brought what theindustry expected, namely: expert knowledge,proven system solutions, and technologicalinnovations for power electronicsmanufacturing. Thorsten Frenzel,Senior Vice President of Sales at the company,commented: “Our technologies arealready an integral part of numerous productionlines in energy and power electronics,so we were in exactly the rightplace here in Nuremberg,”Exhibition highlightsSource: ASYS GroupThorsten Frenzel, Senior Vice President of SalesThe company‘s stand included technologiesthat are optimally tailored to therequirements of power electronics andaim to strengthen the connection betweenmanufacturing solutions and thefinished products. This included:The Serio 4000 Optilign, which is designedfor precise printing of singulatedsubstrates; the Polyphos CT series machineplatform, which enables preciselaser cutting of IMS and DBC substrates;the Inventus platform, which demonstratesflexible process integration basedon a modular principle; and the AOI systemAispecture, which uses 3D laserscanning and high-resolution imaging toprecisely inspect components.Having 30 years of expertise in electronicsmanufacturing and over 100,000systems installed worldwide, the manufacturerwelcomed customers fromaround the world to its stand.www.asys-group.com/en/EPP Europe » 05 | 2025 27
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