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PACKAGING » Product UpdatesAccelerating decarbonization and promoting transparency in semiconductor sustainabilitySemiconductor Climate Consortium announces 2025 initiativesSource: Critical ManufacturingPlessey has selected Critical Manufacturing MES to support its manufacturing workflowsThe Semiconductor Climate Consortium (SCC) hasunveiled its four key initiatives for this year, markinga significant step forward in advancing the industry’scommitment to decarbonization and transparency.These initiatives are designed to sharpen the focuson decarbonization and resource optimization, acceleratingindustry-wide progress and continuing tofoster collaboration across the segment. The SCC’s2025 strategic initiatives include:• Aligning data collection and analysis to promotetransparency – The SCC will standardizeand streamline data collection, analysis, and reportingthrough dashboards and guidelines. These applicationswill increase transparency into sectoremissions. Providing a single source of truth andsynergized methodologies will help in quickly identifyinghot spots for emissions reduction action.• Abatement strategies – Focused on advancingeffective greenhouse gas (GHG) abatement technologies,the SCC will drive efforts to significantlyreduce emissions associated with semiconductormanufacturing processes.• Renewable energy procurement and adoption –The consortium will intensify efforts to acceleratethe transition to renewable energy, with the goalof ensuring that more member companies are ableto procure and adopt clean, renewable energysources for production.• Sharing energy efficiency best practices – Byfacilitating knowledge-sharing among members,the SCC will promote energy-efficient solutionsacross the industry, enabling companies to rapidlyscale impactful changes.“We recognize that the path to sustainability is notjust about individual company efforts, but about creatinga unified industry approach to decarbonization,”commented John Golightly, Chair of the SCCGoverning Council. He added: “These initiatives,which will be spearheaded by our existing workinggroups, will sharpen our focus on decarbonizationand transparency, key tenets of the SCC, while ensuringwe leverage our collective resources and knowledgeto accelerate progress.”The SCC announced the 2025 Governing Council composition.Members re-elected for 2-year terms include:• John Golightly, ASM, who will continue to serveas SCC Chair;• Natasha Hodas, Intel, who will continue to serveas SCC Vice-Chair;• Chris Librie, Applied Materials;• Dr. Seokho Kang, DuPont;• Bruce Gall, Google; and• Henri Berthe, Schneider Electric.Pasquel Roquet, STMicroelectronics, was named as anewly elected member of the council. The currentmembers elected to 2-year terms in 2024 are: MissyBindseil, JSR; Shawn Covell, Lam Research; KatharinaWestrich, Siemens AG; and Yuji Ogino, Tokyo ElectronLtd. (TEL).In addition to its strategic initiatives, the SCC hasalso released two new public reports from SCCWorking Groups:• Toward a Shared View on the Climate Impactof Digital Technology: This report explores thebroader positive climate impact of digital technology,underscoring the role of the semiconductorindustry in shaping a more sustainable future andhow to account for that in emissions calculations.• Overview of F-GHG and Nitrous Oxide SemiconductorAbatement Technologies: This reportoffers valuable insights into the latest advancementsin abatement technologies for semiconductormanufacturing, focusing on Flourinated-GHG(F-GHG) and nitrous oxide emissions.“These reports mark significant progress toward ourcommitment to transparency and collaboration,”commented Peilun Sun, manager of the SCC. “Theyprovide actionable insights and set a new benchmarkfor emissions reduction strategies in our sector.”The Semiconductor Climate Consortium continues toserve as the premier organization fostering collaborationamong semiconductor industry leaders to acceleratethe sector’s transition to net-zero emissions.The 2025 initiatives and new leadership appointmentsare set to deliver results faster, engage moremembers, and enhance the collective ability to meetsustainability goals.www.semi.org/en/industry-groups/semiconductor-climate-consortium40 EPP Europe » 05 | 2025
A biodegradable, nonhazardous solution for WaferGrip adhesive removalSeamless and efficient cleaning processesCumberland Electronics Strategic Supply Solutions(CE3S) has introduced the Millice StripAid X Series, abiodegradable, nonhazardous solvent designed to effectivelyremove WaferGrip and TrueGrip adhesives.Offering an environmentally responsible alternativefor laboratories and semiconductor manufacturers,StripAid X provides a seamless and efficient cleaningprocess while ensuring surface integrity.StripAid X is formulated to work at both ambient andelevated temperatures, making it versatile for variousapplications, including ultrasonic agitation. It is particularlyeffective in debonding diced and wholewafers, such as after the wafer thinning process.The process is simple: wafers are soaked in StripAidat 110°C for 5 to 20 minutes, followed by sequentialrinses with acetone, IPA, and DI water. The solvent’slow vapor pressure and negligible solubility in watermake it easy to handle without requiring specialsafety precautions.Unlike conventional solvents, StripAid X aligns withsustainable manufacturing goals, offering a biode-Source: CE3Sgradable solution without compromising efficiency.Its nonhazardous formulation simplifies storagerequirements—only protection from direct sunlight isneeded, with an optimal temperature range of 20°Cto 25°C.CE3S is proud to offer innovative and environmentallyresponsible solutions for semiconductor andelectronics manufacturing. With the Millice StripAidX Series, wafer debonding is now safer, cleaner, andmore efficient than ever before.www.ce3s.comUnlike conventionalsolvents, StripAid Xaligns with sustainablemanufacturing goalsSOLDER BALL PLACEMENT & LASER SOLDERING3D-Soldering Solder Stacking Wire Soldering BGA SolderingWE MANUFACTUREEQUIPMENTFOR YOUR NEEDSPre-Soldering ofSMD ConnectorElementsLid Sealing forConnectors &IR-SensorsFlex to ChipSolderingThrough HoleSolderingLASER ASSISTED BONDING (LAB, LCB, LAR)3D Multi LayerStacked PackagingOptoelectronicDevice AssemblyCPU on InterposerAssemblySMD CapacitorAssemblySOLDER REWORK & CHIP REPAIRBGAReworkInterconnects ofCamera ModuleBGA Package Assemblyonto SubstrateFlex to FlexSeperationEPP www.pactech.comEurope » 05 | 2025 41sales@pactech.de
