» TEST & QUALITY
» TEST & QUALITY ASSURANCEvAI Hub – a dynamic AI Testing & Development platform: Detailed Verification Hub: Top Import OverviewSource: ViscomDr. Maren Awiszus, Head of Viscom’s AI Team, explains:“With AI-assisted segmentation, tasks previouslyconsidered unfeasible can now be automated.Even under changing lighting or noisy conditions,our models maintain their reliability. Sometimeseven eliminating the need for 3D imaging entirely.”To address demanding inspection requirements,the company leverages AI for automated detectionof Voids in 2D X-ray images. This AI-based methodhas shown highly promising results though itrequires an initial training phase. During this stage,the system is trained on image data to reliably identifyvoids and differentiate them from other structuralfeatures.After successful validation using test data, the AIis ready for deployment and delivers results in realtime. The company’s technology is already integratedinto numerous production lines, playing a key role inreducing cycle times.NPI: Automatic inspection plan creationwith vAICreating inspection programs is typically straightforwardwhen complete CAD and BOM data are available.However, when information is missing or incomplete,AI steps in.Viscom’s AI solution autonomously identifies components,assigns inspection patterns, and configurestests, making it ideal for prototype development orhigh-mix production environments where manualplanning would be labor-intensive.Today, an optical inspection plan can be generatedin under 15 minutes using traditional methods. WithAI, even partial datasets are no longer a hurdle. Thesystem intelligently detects and classifies componentshapes and solder pads, accelerating setup and minimizingthe need for operator intervention.Centralized intelligence with vAl hubTo manage the entire AI workflow, the companyoffers the vAl Hub—a unified, cloud-based platformaccessible via vConnect interface.Dr. Maren Awiszus, who developed the vAI Hub togetherwith her team, explains: “Through the vAlHub, customers can upload and manage their owninspection data, label and organize datasets, trainand refine AI models. Download and then deploymodels to their inspection systems.”This centralized approach ensures fast adaptationand seamless integration into existing productionprocesses. From void detection in X-ray images toverification of potential defects, the vAl Hub keeps AIimplementation efficient and user-friendly.Inspection: ReimaginedThe company’s vAl solutions go beyond simply addingAI to existing processes, they redefine the potentialof electronics inspection. With AI modelstrained on extensive real-world data, transparentperformance reporting, and seamless integration intodaily operations, vAl delivers measurable results.By enhancing inspection accuracy, reducing manuallabor, and increasing First Pass Yield, vAl does notjust improve production, it transforms the approachto quality assurance in modern electronics manufacturing.As challenges in electronics production continueto evolve, Viscom remains at the forefront, deliveringinnovative AI solutions tailored for the industry’snext generations.www.viscom.com46 EPP Europe » 05 | 2025
Product Updates « TEST & QUALITY ASSURANCEMeeting demand for high-throughput electro-optical testing of silicon photonic wafersTeradyne announces double-sided wafer probe testTeradyne, a leading provider of automated testequipment, has partnered with ficonTEC, a globalleader in production solutions for photonics assemblyand test, to announce the availability of thefirst high-volume, double-sided wafer probe test cellfor silicon photonics. The solution is designed tomeet the growing demand for high-throughput electro-opticaltesting of silicon photonic wafers drivenby co-packaged optics (CPO) applications.The new test cell integrates Teradyne‘s UltraFLEXplusautomated test equipment (ATE) and programmingenvironment, IG-XL, with ficonTEC‘s advanced opticalalignment, probing, and wafer handling technologies.This collaboration enables the testing ofhybrid bonded PIC/EIC wafers in a production environment.The partnership with ficonTEC enables Teradyne tobring a production-ready system to market today,and Teradyne is committed to fostering an open ecosystemfor silicon photonics and CPO testing. By ensuringthat the UltraFLEXplus is compatible with industry-leadingoptical instrumentation, probers,alignment systems, and probe cards, Teradyne is deliveringa seamless and flexible testing environmentfor its customers.Regan Mills, President, Product Test at Teradyne,commented: “Our partnership with ficonTEC enablesus to deliver the first high-volume double-sided testcell for silicon photonics wafer test to meet thequickly evolving needs of the industry.Our commitment to anopen ecosystem ensures our customerscan choose the solutionthat is right for them.”The introduction of the doublesidedwafer probe test cell is expectedto have a significant impact onthe silicon photonics and CPO market. By enablinghigh-throughput electro-optical testing of siliconphotonic wafers, this solution addresses the criticalneed for known good die testing before wafers arediced and packaged into CPO devices or pluggabletransceivers.The integration of Teradyne‘s UltraFLEXplus and ficonTEC‘soptical alignment and probing technologiesensures that the test cell operates efficiently withinthe existing fab and OSAT test floor infrastructure,providing a comprehensive and cost-effective solution.“FiconTEC is proud to partner with Teradyne to pioneerthis innovative solution for the rapidly developingmarket. Our joint effort uniquely combines theclass-leading capability of both companies, deliveringa high-throughput, cost-effective test solutionfor silicon photonics and CPO manufacturing workflows,”added Stefano Concezzi, Corporate VicePresident at ficonTEC.https://www.teradyne.comThe new test cellintegrates Teradyne‘sUltraFLEXplus(pictured) andprogramming environmentwith ficonTEC‘sprobing, and waferhandling technologies.Source: TeradyneEnhancing electronics inspection processesAI-powered microscopy platform introducedRenowned Danish manufacturer Tagarnohas unveiled its latest AI-powered platformdesigned to enhance inspection processesin the electronics industry. Thenew platform, showcased at the 2025 IPCAPEX, integrates artificial intelligence toautomate defect detection, improve accuracyand streamline quality controlworkflows.In a recent interview, Jake Kurth, VicePresident of Technical Sales at Tagarno,revealed how the company is harnessingAI to tackle common challenges in electronicsmanufacturing. The AI-driven systemleverages advanced vision-based algorithmsto detect anomalies, such asmissing components, and allows operatorsto accept or reject AI-generatedsuggestions. With each interaction, thesystem continuously learns and refines itsaccuracy, making inspections more reliableand efficient over time.Traditional microscopy inspection reliesheavily on manual oversight, which can betime-consuming and prone to humanerror. Tagarno’s AI-powered platform introducesan innovative approach, enablingreal-time, intelligent decision-making thatoptimizes production efficiency and ensuresconsistent quality control.“We’re offering electronics manufacturersan AI-based solution that not only ident-ifies issues more accurately but alsoevolves through continuous learning,”commented Kurth, who added: “By integratingAI with digital microscopy, we aresetting a new standard for precision andefficiency in quality assurance.”Tagarno is actively seeking companiesfacing routine inspection challenges thatcould benefit from vision-based AI solutions.Whether manufacturers are lookingto optimize defect detection or developtheir own AI-powered workflows, thecompany’s platform provides the foundationfor smarter, more adaptive qualitycontrol processes.www.tagarno.comEPP Europe » 05 | 2025 47
