Advancing probe card
Advancing probe card testing technologyIC manufacturing requiresspecialized precisionIn semiconductor manufacturing, fully automated test systems are employed toensure efficiency, precision, and cost-effectiveness. Given the high costs associatedwith each stage of integrated circuit (IC) production, early-stage defect detectionis critical for yield optimization and achieving economies of scale.About Seica S.p.A.Founded in 1986, Seica S.p.A. is an innovative, hightechnology company that develops and manufacturesleading-edge solutions for the test and selective solderingof electronic boards and modules. Moreover, thecompany provides battery test solutions, automotiveelectronic board test solutions, infotainment test, aswell as electric vehicle inverter and battery chargingstation test systems. The company has fully embracedthe concept of Industry 4.0, developing solutions tomonitor and collect information from machines and industrialplants to enable the optimization of manufacturingprocesses, maintenance and energy management.Headquarters are located in Italy, with direct officesin Germany, France, China, the USA, Mexico andIsrael.www.seica.comWafer fabrication is a highly intricate, multistepprocess where electronic circuits areprogressively constructed on a semiconductor substrate.A single wafer can host hundreds to thousandsof ICs, which are subsequently prepared for integrationthrough bumping (for flip-chip soldering)or wire bonding, followed by die singulation and encapsulationvia molding.Due to the wafers‘ fragility, micron-level dimensions,and contamination risks, manual handling isimpractical. Therefore, automation is leveraged atevery stage of semiconductor manufacturing andtesting, ensuring repeatability, high throughput, andminimal human intervention.Automated Wafer TestingWafer testing, a crucial step in semiconductor production,employs a combination of electrical and opticalinspection methodologies to assess device performanceand identify defects. Automatic TestEquipment (ATE) interfaces with the wafer through aprobe card, performing parametric and functionaltests across analog, digital, and mixed-signal domains.48 EPP Europe » 05 | 2025
Source: SeicaTEST & QUALITY ASSURANCE «Pilot VX redefines thebenchmarks of efficiencyand accuracy in the realmof flying probe testingSource: SeicaThe manufacturingof integrated circuitsdepends on highlyspecialized andprecision-drivenfacilitiesZusammenfassungEach die undergoes electrical characterization tovalidate operational integrity. Defective dies aremapped out, while functional dies—classified asKnown Good Die (KGD)—proceed to subsequent packagingand assembly stages. This testing phase generateswafer maps with detailed pass/fail status foreach die, facilitating downstream process optimization.Precision and Challenges in WaferTestingWafer-level testing requires handling silicon substrateswith extreme care. Modern silicon wafershave diameters ranging from 100 mm (4“) to 300 mm(12“) and thicknesses of approximately 400–500 µm.The individual circuit features on each die aremeasured at sub-micron levels, demanding preciseprobe alignment, controlled contact force, and advancedsignal integrity considerations during testing.Given these constraints, test engineers rely onsophisticated probing technologies, includingMEMS-based probe cards and advanced probing systems,to achieve high pin-count, fine-pitch probingwithout damaging the delicate wafer structures.By leveraging automation and precision testingmethodologies, semiconductor manufacturers canoptimize yields, reduce production costs, and enhanceIC reliability before devices enter final packagingand system-level integration.In der Halbleiterfertigung werden vollautomatische Testsystemeeingesetzt, um Effizienz, Präzision und Kostenersparnissezu gewährleisten. Da jeder Schritt der Produktionintegrierter Schaltkreise (IC) mit hohen Kosten verbundenist, ist die frühzeitige Erkennung von Defektenentscheidend für die Optimierung des Ertrags.RésuméL’utilisation d’un système de test entièrement automatiquedans la fabrication d’un semiconducteur garantit l’efficacitéet la précision et réduit les coûts. La reconnaissanceprécoce des défauts joue un rôle essentiel dans l’optimisationdu rendement, car la production d’un circuit intégré(IC) implique des coûts élevés à chacune de sesétapes.РезюмеВ производстве полупроводников используютсяполностью автоматизированные тестовые системыдля обеспечения эффективности, высокой точностии снижения расходов. Поскольку каждый этаппроизводства интегральных схем (ИC) связан свысокими затратами, раннее обнаружение дефектовимеет решающее значение для оптимизации выходагодной продукции.EPP Europe » 05 | 2025 49
